KR20090121254A - Pressure-sensitive adhesive film, dicing die bonding film and semiconductor wafer - Google Patents

Abstract

PURPOSE: A pressure-sensitive adhesive film, a dicing die bonding film and a semiconductor wafer are provided to make the thickness of an adhesive layer in which an oligomer for photocuring is used, and to optimize elastic modulus of the adhesive film by forming a crosslinking structure. CONSTITUTION: A pressure-sensitive adhesive film comprises: a base film(1); a first adhesive layer(2) with a crosslinking structure formed on the base film; and a second adhesive layer(3) with thickness of 0.5 μm - 5 μm. The base film is a polyolefin film, polytetrafluoroethylene film, polyester film, polyurethane film, polycarbonate film, ethylene-vinylacetate copolymer film, ethylenepropylene copolymer film, and ethylene-alkyl acrylate copolymer film or polyvinyl chloride film.

Description

Adhesive film, dicing die bonding film and semiconductor wafer {Pressure-sensitive adhesive film, dicing die bonding film and semiconductor wafer}

The present invention relates to an adhesive film, a dicing die bonding film, and a semiconductor wafer.

In recent years, as the integration and the high functionalization of semiconductor memory have been accelerated, starting with flash memory mounted in a mobile phone or a mobile terminal, MCP (Multi Chip Package) method for stacking a plurality of semiconductor chips on a semiconductor substrate has been adopted. In addition, in the MCP method, a film adhesive is often used in place of a conventional liquid epoxy paste for bonding chips and substrates (ex. JP 03-192178 and 04-234472).

In general, the manufacturing process of a semiconductor chip includes a process of forming a fine pattern on the wafer and a process of polishing and packaging the wafer to meet the specifications of the final device.

The packaging process includes a wafer inspection process for inspecting a defect of a semiconductor chip; A dicing step of cutting the wafer into separate chips; A die bonding step of attaching the separated chip to a circuit film or a mounting plate of a lead frame; A wire bonding process of connecting the chip pad provided on the semiconductor chip and the circuit pattern of the circuit film or the lead frame with electrical connection means such as wire; A molding process of wrapping the outside with an encapsulant to protect the internal circuit and other components of the semiconductor chip; Trim process for cutting the dam bar connecting the lead and the lead; Forming process of bending the lead into a desired shape; And a finished product inspection process for inspecting defects of the finished package.

In the dicing process, the wafer is cut using a diamond wheel or the like. In most dicing processes using an adhesive on a film, (1) laminating a film adhesive on the back surface of the wafer and (2) an adhesive on a film A process of laminating the dicing film is performed.

On the other hand, in recent years, by combining the functions of the dicing film and the adhesive film, it is possible to simplify the (1) and (2) process in one process, the wafer transferability, the application to chips of various thicknesses and sizes Advantageous integral dicing diebonding films are often used.

By the way, in the case of the integrated film, the adhesive is attached to the wafer to perform a dicing process, there is a problem that the adhesive force of the adhesive is separated from the dicing tape, the chip is scattered.

On the other hand, as an adhesive of a dicing die-bonding film, the adhesive which disperse | distributed the radiation-curable oligomer is used normally. However, in this case, as the temperature rises due to the heat generated during the dicing process, the low molecular weight radiation curable oligomer sharply lowers the adhesive elastic modulus, causing generation of burrs that may contaminate the circuit pattern.

In particular, in recent years, as the size of the packaging becomes smaller, the thickness of the wafer becomes thinner, and the dicing conditions become more severe to increase production efficiency, and thus the frequency of problems due to the scattering or burrs of the chips is increasing. In addition, as the thickness of the wafer becomes thinner, burrs of a length level, which were not a problem in the past, are frequently raised onto the die, which causes defects.

The present invention is to solve the above problems, by optimizing the structure of the adhesive layer of the dicing die-bonding film, to minimize the scattering or burr of the chip generated during the process, and to enable a reliable semiconductor packaging process An object of the present invention is to provide an adhesive film, a dicing die bonding film including the above, and a semiconductor wafer.

The present invention is a means for solving the above problems, a base film; A first adhesive layer formed on the base film and having a crosslinked structure; And

Provided is an adhesive film formed on the first adhesive layer and including a second adhesive layer having a thickness of 0.5 μm to 5 μm.

The present invention is another means for solving the above problems, the adhesive film according to the present invention; And

It provides a dicing die-bonding film comprising an adhesive portion formed on the adhesive film.

As another means for solving the above problems, the present invention provides a semiconductor wafer in which an adhesive portion of a dicing die-bonding film according to the present invention is attached to one surface of a wafer, and the adhesive film is fixed to a wafer ring frame. .

In the present invention, it is possible to optimize the elastic modulus of the pressure-sensitive adhesive film by providing a cross-linking structure while increasing the thickness of the pressure-sensitive adhesive layer in which the photocuring oligomer is used in the pressure-sensitive adhesive film, and increasing the thickness of the pressure-sensitive adhesive layer formed thereon. Accordingly, the present invention can provide a dicing die-bonding film capable of a reliable process while minimizing defects such as chip scattering and burrs generated during the semiconductor packaging process.

The present invention, a base film; A first adhesive layer formed on the base film and having a crosslinked structure; And

It is related with the adhesive film formed on the said 1st adhesion layer and containing the 2nd adhesion layer whose thickness is 0.5 micrometer-5 micrometers.

Hereinafter, with reference to the accompanying drawings will be described in detail with respect to the adhesive film of the present invention. 1 is a cross-sectional view of an adhesive film according to an aspect of the present invention.

The kind of base film 1 used for the adhesive film of this invention is not restrict | limited in particular. In the present invention, for example, polyolefin film (ex. Polypropylene film or polyethylene film), polytetrafluoroethylene film, polyester film (ex. Polyethylene terephthalate film), polyurethane film, polycarbonate film, ethylene A vinyl acetate copolymer film, an ethylene-propylene copolymer film, an ethylene-alkyl (meth) acrylate (ex. Ethyl acrylate) copolymer film or a polyvinyl chloride film, a plastic film in which two or more of the above are mixed or Two or more of the above laminated | multilayer film can be used. In the present invention, in addition to the above, other polymer films or metal foils may be used as the base film, and, if necessary, surface treatment such as primer treatment, corona treatment, etching treatment or radiation treatment may be performed on the surface of the film. In addition, in consideration of the fact that the adhesive layer is cured through irradiation of ultraviolet rays or the like in the packaging process, it is preferable that the base film is made of a material having excellent light transmittance. In the present invention, the base film has a thickness of 10 μm to 200 μm, preferably 50 μm to 180 μm, more preferably 80 μm to 150 μm. If the thickness is less than 10 μm, there is a possibility that control of the cut depth becomes difficult during the dicing process, and if it exceeds 200 μm, the base film becomes too thick and the probability of burr generation during the process is increased. It may become high or the elongation of a film may fall and the expansion process efficiency may fall.

The adhesive film of this invention contains the 1st adhesion layer 2 formed on the base film 1. The material which comprises the said 1st adhesion layer is not specifically limited, For example, a radiation curable adhesive or a thermosetting adhesive can be used, In some cases, the said 2 types of adhesives can also be mixed and used. The term "radiation" used above is an energy ray which can influence a polymeric group or an initiator contained in an adhesive composition, and can advance hardening reaction, and is a concept containing an electron beam, an ultraviolet-ray, etc.

The type of radiation-curable or thermosetting pressure-sensitive adhesive is not particularly limited, and any component known in the art that may have a crosslinked structure can be used without limitation. For example, in the present invention, the radiation curable pressure sensitive adhesive may include an acrylic base resin, a photocuring agent, and a photoinitiator; The thermosetting adhesive may include an acrylic base resin and a multifunctional crosslinking agent.

The acrylic base resin included in the radiation curable or thermosetting pressure sensitive adhesive is not particularly limited as long as it can be used as an adhesive in the technical field. For example, in this invention, the polymer of the monomer mixture containing a (meth) acrylic acid ester monomer and a polar group containing monomer can be used as said acrylic base resin.

The kind of (meth) acrylic acid ester monomer contained in a monomer mixture is not specifically limited, For example, an alkyl (meth) acrylate can be used. In this case, when the alkyl group contained in the monomer is too long, the cohesive force of the pressure-sensitive adhesive may be lowered, and the glass transition temperature and the adhesion may become difficult to control. Therefore, an alkyl (meth) acrylate having an alkyl group having 1 to 12 carbon atoms is used. It is desirable to. Examples of such monomers include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) acrylate, t-butyl ( Meta) acrylate, sec-butyl (meth) acrylate, pentyl (meth) acrylate, hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, 2-ethylbutyl (meth) acrylate, n- And at least one selected from the group consisting of octyl (meth) acrylate, isooctyl (meth) acrylate, isononyl (meth) acrylate, lauryl (meth) acrylate and tetradecyl (meth) acrylate.

The polar group-containing monomer included in the monomer mixture provides a cohesive force to the pressure-sensitive adhesive, improves adhesion, and in some cases, provides a site capable of reacting with a multifunctional crosslinking agent or a photocuring agent, thereby providing a crosslinking structure to the pressure-sensitive adhesive. do. The specific kind of such a polar monomer is not specifically limited, For example, the kind of carboxyl group containing monomer, a nitrogen containing monomer, and a hydroxyl group containing monomer, or a mixture of 2 or more types can be used. Examples of the carboxyl group-containing monomers include (meth) acrylic acid, acrylic acid duplex, fumaric acid, itaconic acid, maleic acid and maleic anhydride; Examples of nitrogen-containing monomers include (meth) acrylonitrile, (meth) acrylamide, N-methyl (meth) acrylamide, N-methylol (meth) acrylamide, N-vinyl pyrrolidone and N-vinyl caprolactam And the like; Examples of the hydroxy group-containing monomer include glycerol (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxy Hydroxyhexyl (meth) acrylate, 8-hydroxyoctyl (meth) acrylate, 2-hydroxyethylene glycol (meth) acrylate, or 2-hydroxypropylene glycol (meth) acrylate, and the like. It doesn't happen.

The polar group-containing monomer is preferably included in the monomer mixture in an amount of 1 to 20 parts by weight based on 100 parts by weight of the (meth) acrylic acid ester monomer. If the content of the polar functional group is less than 1 part by weight, the adhesive performance may be lowered. If the content of the polar functional group is more than 20 parts by weight, the workability and / or storage stability may be lowered.

In the present invention, the monomer mixture may further include a co-monomer represented by the following Chemical Formula 1 as necessary. Such comonomers may be added for the purpose of controlling the glass transition temperature of the pressure-sensitive adhesive and providing other functionalities.

[Formula 1]

Wherein R ₁ to R ₃ each independently represent hydrogen or alkyl, and R ₄ represents cyano; Phenyl unsubstituted or substituted with alkyl; Acetyloxy; Or COR ₅ , wherein R ₅ represents amino or glycidyloxy unsubstituted or substituted with alkyl or alkoxyalkyl.

Alkyl or alkoxy in the definition of R ₁ to R _{5 in} the above formula means alkyl or alkoxy having 1 to 8 carbon atoms, preferably methyl, ethyl, methoxy, ethoxy, propoxy or butoxy.

Specific examples of the monomer of Formula 1 include nitrogen-containing monomers such as (meth) acrylonitrile, (meth) acrylamide, N-methyl (meth) acrylamide or N-butoxy methyl (meth) acrylamide; Styrene-based monomers such as styrene or methyl styrene; Glycidyl (meth) acrylate; Or a carboxylic acid vinyl ester such as vinyl acetate, or the like, or a heterogeneous compound, but is not limited thereto. When such a comonomer is included in the monomer mixture of the present invention, the content is preferably 20 parts by weight or less. When the content exceeds 20 parts by weight, there is a fear that the flexibility and / or peeling force of the pressure-sensitive adhesive composition is lowered.

Acrylic copolymers containing the above components can be prepared by conventional methods in the art. For example, the copolymer may be prepared by a method such as radical polymerization, for example, solution polymerization, photo polymerization, bulk polymerization, suspension polymerization or emulsion polymerization. The acrylic copolymer is preferably prepared by the solution polymerization in the above, wherein the polymerization temperature is 50 ℃ to 140 ℃, it is preferable to perform the reaction by adding an initiator in a state where the monomers are uniformly mixed.

On the other hand, in the present invention, when the first pressure-sensitive adhesive layer includes a radiation curable pressure sensitive adhesive, the above-described acrylic base resin may be used by itself, and in some cases, may be used in a state where a radiation polymerizable group is introduced into the side chain thereof. In this case, the method of introducing the radiation polymerizable group into the side chain of the acrylic base resin is not particularly limited. For example, the functional group and the radiation polymerizable group (ex.carbon-carbon double) that can react with the polar group introduced into the acrylic base resin Can be introduced using a radiation polymerizable compound having the same bond). Specific kinds of such compounds include, as long as they contain 1 to 5, preferably 1 to 2, radiation-polymerizable groups per molecule, and have functional groups capable of reacting with the polar groups contained in the acrylic base resin. It is not particularly limited. Examples of the functional group capable of reacting with the functional group of the base resin include, but are not limited to, an isocyanate group, an epoxy group, a silane group, or a carboxyl group. For example, when a hydroxyl group or a carboxyl group is introduced into the main chain, the functional group included in the compound may be an isocyanate group, an epoxy group or a chlorosilane group.

Specific examples of the radiation polymerizable compound which can be used in the present invention include 2-isocyanatoethyl (meth) acrylate, 1,1-bis (acryloyloxymethyl) ethyl isocyanate, and (meth) acryloyloxy Ethyl isocyanate, meta-isopropenyl-α, α-dimethylbenzyl isocyanate, methacryloyl isocyanate or allyl isocyanate; Acryloyl monoisocyanate compounds obtained by reacting a diisocyanate compound or a polyisocyanate compound with 2-hydroxyethyl (meth) acrylate; Acryloyl monoisocyanate compounds obtained by reacting a diisocyanate compound or a polyisocyanate compound, a polyol compound, and 2-hydroxyethyl (meth) acrylate; Glycidyl (meth) acrylate; (Meth) acrylic acid; Or 3-methacryloxypropyldimethylchlorosilane, or the like, or a heterogeneous compound, but is not limited thereto.

The content of the radiation polymerizable group-containing compound as described above is not particularly limited to be selected according to the intended use, and may be included, for example, in a ratio of 5 to 100 equivalents per 100 equivalents of the polar group-containing monomer included in the acrylic base resin. Can be.

In the present invention, the method of introducing the radiation polymerizable group into the side chain of the base resin is not particularly limited, and for example, the base resin and the above-described radiation polymerizable group-containing compound may be used for 4 hours to 48 hours at normal pressure of room temperature to 40 ° C. It can be prepared by reacting for a time. At this time, the reaction may be carried out using a catalyst such as organic tin in a solvent such as ethyl acetate.

When the first pressure-sensitive adhesive layer is composed of a radiation-curable pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer may include a photocuring agent and a photoinitiator together with the acrylic base resin described above.

The photocuring agent may adjust the adhesive properties of the pressure-sensitive adhesive according to the amount used, and in some cases may play a role of providing a crosslinked structure to the pressure-sensitive adhesive layer. The photocuring agent that can be used is not particularly limited, and examples thereof include a crosslinkable monomer such as polyfunctional acrylate, and specifically 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (Meth) acrylate, neopentyl glycol di (meth) acrylate, 1,2-ethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, 1,12-dodecanediol di (meth) acrylic Latex, neopentylglycol adipate di (meth) acrylate, hydroxypivalic acid neopentylglycol di (meth) acrylate, dicyclopentanyl di (meth) acrylate, caprolactone modified dicyclopentenyl di (meth) acrylic Ethylene oxide modified di (meth) acrylate, di (meth) acryloxy ethyl isocyanurate, allylated cyclohexyl di (meth) acrylate, tricyclodecane dimethanol (meth) acrylate , Dimethylol dicyclopentane di (meth) acrylate, ethylene oxide modified hexahydrophthalic acid di (meth) acrylate, tricyclodecane dimethanol (meth) acrylate, neopentyl glycol modified trimethylpropane di (meth) acrylate , Adamantane di (meth) acrylate, 9,9-bis [4- (2-acryloyloxyethoxy) phenyl] fluorene, trimethylolpropane tri (meth) acrylate, dipentaerythritol tree (Meth) acrylate, propionic acid modified dipentaerythritol tri (meth) acrylate, pentaerythritol tri (meth) acrylate, propylene oxide modified trimethylolpropane tri (meth) acrylate, tris (meth) acrylic Oxyethyl isocyanurate, diglycerin tetra (meth) acrylate, pentaerythritol tetra (meth) acrylate, propionic acid modified dipentaerythritol penta (meth) acrylate Urethane (meth) acrylate, which is a reactant of pentane, dipentaerythritol hexa (meth) acrylate, caprolactone-modified dipentaerythritol hexa (meth) acrylate, and isocyanate monomer and trimethylolpropane tri (meth) acrylate It may be one or more selected from the group consisting of.

Such a photocuring agent is preferably contained in an amount of 0.05 parts by weight to 2 parts by weight based on 100 parts by weight of the acrylic base resin in the radiation curable pressure sensitive adhesive. If the content is less than 0.05 parts by weight, durability may deteriorate due to a decrease in cohesion, and if it exceeds 2 parts by weight, the peeling force of the pressure-sensitive adhesive may be excessively lowered, or durability may be lowered at high temperature or high humidity conditions.

The photoinitiator included in the radiation curable pressure sensitive adhesive serves to adjust the degree of polymerization of the pressure sensitive adhesive according to the amount of use. The kind of photoinitiator that can be used in the present invention is not particularly limited, and for example, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin n-butyl ether, benzoin isobutyl ether , Acetophenone, dimethylanino acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 2-hydroxy-2-methyl-1-phenylpropane- 1-one, 1-hydroxycyclohexylphenyl ketone, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholino-propane-1-one, 4- (2-hydroxyethoxy) phenyl 2- (hydroxy-2-propyl) ketone, benzophenone, p-phenylbenzophenone, 4,4'-diethylaminobenzophenone, dichlorobenzophenone, 2-methylanthraquinone, 2-ethylanthraquinone, 2 t-butyl anthraquinone, 2-aminoanthraquinone, 2-methylthioxanthone, 2-ethylthioxanthone, 2-chlorothioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone Benzyldimethyl Dea, acetophenone dimethyl ketal, p-dimethylamino benzoic acid ester, oligo [2-hydroxy-2-methyl-1- [4- (1-methylvinyl) phenyl] propanone], 2,4,6-trimethylbenzoyl Diphenyl phosphine oxide, bis (2,4,6-trimethylbenzoyl) phenyl phosphine oxide, α, α-methoxy-α-hydroxy acetophenone, 2-benzoyl-2- (dimethylamino) -1- [ 4- (4-morphonyl) phenyl] -1-butanone, 2,2-dimethoxy-2-phenyl acetophenone, etc. are mentioned. In the present invention, one or more kinds of the above can be used.

The photoinitiator is preferably included in an amount of 0.01 parts by weight to 2 parts by weight based on 100 parts by weight of the acrylic base resin. When the content of the photoinitiator is out of the above-described range, the crosslinking and curing reaction of the pressure sensitive adhesive may not be performed smoothly, or the physical properties of the pressure sensitive adhesive may deteriorate due to the remaining components after the reaction.

In addition, the radiation-curable pressure-sensitive adhesive, at least one additive selected from the group consisting of pigments, antioxidants, ultraviolet stabilizers, dispersants, antifoaming agents, thickeners, plasticizers, tackifying resins and silane coupling agents in a range that does not affect the effect of the invention. It may include as appropriate.

The method of forming the 1st adhesion layer of this invention using the above-mentioned component is not specifically limited, If one aspect is demonstrated, it is as follows. First, the (meth) acrylic acid ester monomer and the polar monomer described above are partially polymerized, preferably partially polymerized by heat. Thereafter, a photocuring agent, a photoinitiator and / or other additives are added to the above, followed by stirring and mixing so as to be uniformly dispersed in the resin. Subsequently, the pressure-sensitive adhesive layer of the present invention can be prepared by subjecting the mixture to polymerization, preferably photopolymerization and crosslinking reaction by ultraviolet irradiation.

The pressure-sensitive adhesive of the present invention can also be prepared by sheeting, and one aspect of the method will be described below. That is, after adjusting the viscosity of the mixture of the above-mentioned partial polymer and photocuring agent such as about 100 cps to 10,000 cps, it is applied to the substrate. Subsequently, the pressure-sensitive adhesive sheet may be prepared by photopolymerization and crosslinking of the coating material through ultraviolet irradiation.

When the first adhesive layer includes a thermosetting adhesive, it may include a multifunctional crosslinking agent together with the acrylic base resin described above. Such a crosslinking agent improves the cohesion of the pressure-sensitive adhesive through the reaction with the polar functional group included in the acrylic base resin, gives a crosslinking structure, and serves to adjust the adhesive properties of the pressure-sensitive adhesive according to the amount used.

The kind of specific crosslinking agent that can be used is not particularly limited, and for example, a general crosslinking agent such as an isocyanate crosslinking agent, an epoxy crosslinking agent, an aziridine crosslinking agent and a metal chelate compound can be used, and it is preferable to use a double isocyanate crosslinking agent. However, it is not limited thereto. Examples of the isocyanate-based crosslinking agent include tolylene diisocyanate, xylene diisocyanate, diphenylmethane diisocyanate, hexamethylene diisocyanate, isoform diisocyanate, tetramethylxylene diisocyanate, naphthalene diisocyanate and any one of the above polyols ( ex. trimethylol propane); Examples of epoxy crosslinkers include ethylene glycol diglycidyl ether, triglycidyl ether, trimethylolpropane triglycidyl ether, N, N, N ', N'-tetraglycidyl ethylenediamine and glycerin diglycidyl ether. One or more selected from the group consisting of; Examples of the aziridine crosslinking agent include N, N'-toluene-2,4-bis (1-aziridinecarboxide), N, N'-diphenylmethane-4,4'-bis (1-aziridinecarbox Id), triethylene melamine, bisisoprotaloyl-1- (2-methylaziridine), and one or more selected from the group consisting of tri-1-aziridinylphosphine oxide. In addition, examples of the metal chelate-based compound may be a compound in which a polyvalent metal such as aluminum, iron, zinc, tin, titanium, antimony, magnesium, and / or vanadium is coordinated with acetyl acetone, ethyl acetoacetate, or the like. It is not limited.

As described above, the multifunctional crosslinking agent is preferably included in an amount of 0.01 parts by weight to 10 parts by weight based on 100 parts by weight of the acrylic base resin. When the content is less than 0.01 part by weight, the cohesive force of the pressure-sensitive adhesive may be lowered. When the content is more than 10 parts by weight, the crosslinking reaction may proceed excessively, and there may be a possibility that interlayer peeling or lifting occurs in the pressure-sensitive adhesive film.

In addition, the thermosetting pressure-sensitive adhesive, acrylic low molecular weight, epoxy resin, curing agent, pigment, antioxidant, UV stabilizer, dispersant, colorant, reinforcing agent, filler, surfactant, plasticizer, foaming agent within a range that does not affect the effect of the invention And an antifoaming agent, a thickener, a plasticizer, a tackifying resin, and a silane coupling agent.

The method of forming the 1st adhesion layer of this invention using the above-mentioned component is not specifically limited, For example, what is necessary is just to manufacture by the method similar to the case of the radiation-curable adhesive mentioned above. However, in the case of a thermosetting adhesive, it is preferable to advance superposition | polymerization and crosslinking reaction of a composition by means, such as hot air irradiation, ie, heat.

In addition, it is preferable that the crosslinking agent contained in the thermosetting adhesive is controlled so that the crosslinking reaction of a functional group hardly progresses in the compounding process for formation of an adhesion layer from a viewpoint of uniform coating performance. That is, the crosslinking agent is preferred to form a crosslinked structure in the drying and aging process after the coating operation is completed, thereby improving the cohesive force, adhesive properties and cutting properties of the pressure-sensitive adhesive.

It is preferable that it is 1 micrometer-100 micrometers, and, as for the 1st adhesion layer containing the above-mentioned radiation hardening type and / or thermosetting adhesive, it is more preferable that it is 5 micrometers-30 micrometers. When thickness is out of the said range, manufacture of a uniform adhesion layer becomes difficult and there exists a possibility that the physical property of an adhesion film may fall.

The pressure-sensitive adhesive film of the present invention includes a second pressure-sensitive adhesive layer 3 formed on the first pressure-sensitive adhesive layer described above, wherein the second pressure-sensitive adhesive layer in the pressure-sensitive adhesive film of the present invention is a thin film, specifically, a thickness of 0.5 μm to 5 μm. It is preferable to have. As such, by forming the second adhesive layer of the thin film on the first adhesive layer having a crosslinked structure, the amount of the radiation curable compound is reduced during the production of the adhesive film, and thus burrs are generated when applied to the dicing process. By minimizing, it is possible to increase the reliability of the packaging process.

The component which comprises the said 2nd adhesion layer in this invention is not specifically limited, As a base resin, a rubber-type adhesive or an acrylic adhesive can be used as a well-known thermosetting adhesive, for example. Specifically, the second pressure-sensitive adhesive layer of the present invention is preferably composed of a radiation-curable pressure-sensitive adhesive containing the base resin, for example, may include a thermosetting adhesive resin, a thermosetting agent, a photopolymerizable compound and a photoinitiator.

The specific kind of thermosetting adhesive resin is not specifically limited in the above, For example, the same acrylic base resin as what is contained in the above-mentioned 1st adhesion layer can be used, and also contains a radical reactive unsaturated group in a side chain, or in a molecule | numerator The polymer resin which has an epoxy group can also be used.

In addition, the type of the thermosetting agent is also not particularly limited, and for example, various crosslinking agents described in the first adhesive layer item, preferably isocyanate crosslinking agents may be used. Such a thermosetting agent is preferably included in an amount of 0.01 parts by weight to 10 parts by weight with respect to 100 parts by weight of the thermosetting adhesive resin. When the content is less than 0.01 part by weight, the cohesive force of the pressure-sensitive adhesive may be lowered. When the content is more than 10 parts by weight, the crosslinking reaction may proceed excessively, and there may be a possibility that interlayer peeling or lifting occurs in the pressure-sensitive adhesive film.

In addition, the specific kind of the photopolymerizable compound (ex. Radiation curable oligomer) is also not particularly limited, and components known in the art may be used without limitation. In the present invention, for example, an addition polymerizable compound or an epoxy group-containing alkoxysilane containing two or more unsaturated groups in the molecule, and examples of the addition polymerizable compound include polyhydric alcohol esters of (meth) acrylic acid or Oligoesters; Epoxy type compounds (ex. Epoxy acrylate oligomer) or urethane type compounds (ex. Urethane acrylate oligomer) etc. are mentioned. It is preferable that the said photopolymerizable compound has a molecular weight of 100-50 million, for example. The photopolymerizable compound is preferably included in an amount of 3 parts by weight to 500 parts by weight based on 100 parts by weight of the above-mentioned thermosetting adhesive resin. If the content is less than 3 parts by weight, the curing efficiency of the pressure-sensitive adhesive layer is lowered during the process, the peelability may be lowered. If the content exceeds 500 parts by weight, the elastic modulus of the pressure-sensitive adhesive layer is excessively increased due to heat generated during dicing. There is a risk of burr occurrence.

In addition, the photoinitiator is used to cure the photopolymerizable compound described above, and examples thereof may be a general component in the art such as a carbonyl compound, an organic sulfur compound, a peroxide, an amine or an onium salt-based compound. The photoinitiator is preferably included in an amount of 0.1 to 20 parts by weight based on 100 parts by weight of the photopolymerizable compound described above. If the content of the photoinitiator is out of the above-mentioned range, curing of the second adhesive layer by ultraviolet irradiation or the like may not be sufficiently performed, which may cause a problem in the pick-up process.

From the viewpoint of improving the crosslinking efficiency, an epoxy crosslinking agent (ex. Ethylene glycol diglycidyl ether) having one or two or more epoxy groups in the molecule can be appropriately added to the second adhesive layer of the present invention. In addition, known additives such as those included in the above-mentioned first pressure-sensitive adhesive may be appropriately added in a range that does not affect the effects of the invention.

The second pressure-sensitive adhesive of the present invention may be prepared by mixing the above-described components and coating the first pressure-sensitive adhesive layer on the first pressure-sensitive adhesive layer by means of a bar coater or the like, and in this case, the photopolymerizable compound in the second pressure-sensitive adhesive May be included in a cured state.

In addition, the second adhesive layer may have a thickness of 0.5 μm to 5 μm, preferably 0.5 μm to 4 μm, and more preferably 0.5 μm to 3 μm. When the thickness is less than 0.5 μm, the peeling force reduction efficiency due to radiation may be deteriorated. When the thickness is more than 5 μm, the content of the radiation curable compound included in the adhesive layer is increased to increase the burr during the dicing process. There is a fear that the occurrence of.

The present invention also, the adhesive film according to the present invention described above;

And it relates to a dicing die-bonding film comprising an adhesive portion formed on the adhesive film.

2 is a cross-sectional view of a dicing die bonding film according to an aspect of the present invention. Examples of the adhesive part 4 used in the above may include a general adhesive including a polyfunctional epoxy resin, a curing agent, and a thermoplastic resin, but is not limited thereto. In addition, the adhesive portion may be included in the film alone of the adhesive layer, and in some cases may be included in the film of the present invention in a state laminated on a suitable base film.

In the above, the epoxy resin is not particularly limited as long as it contains two or more epoxy groups in the main chain and the glass transition temperature is 50 ° C or higher. In this invention, the epoxy resin which has 3 or more functional group especially and whose average epoxy equivalent is 180-1,000 is preferable. When the said epoxy equivalent is less than 180, a crosslinking density becomes too high and it is easy to show a hard property, and when it exceeds 1,000, there exists a possibility that glass transition temperature may fall too much and heat resistance may fall.

Specific examples of such epoxy resins include cresol novolac epoxy resins, bisphenol A novolac epoxy resins, phenol novolac epoxy resins, tetrafunctional epoxy resins, biphenyl type epoxy resins, triphenolmethane type epoxy resins, and alkyl modified trees. A phenol methane epoxy resin, a naphthalene type epoxy resin, a dicyclopentadiene type epoxy resin, a dicyclo pentadiene modified phenol type epoxy resin, etc. are mentioned, One type or a mixture of two or more of these can be used.

The kind of hardening | curing agent which can be used by this invention will not be specifically limited if it can form a crosslinked structure with the above-mentioned epoxy resin and the thermoplastic resin mentioned later. Specifically, a polyfunctional phenolic resin may be used as the curing agent. In the present invention, it is preferable to use a polyfunctional phenolic resin having three or more functional phenolic hydroxyl groups, and a phenolic resin having an average hydroxyl equivalent of 100 to 500. It is preferable to use. If the hydroxyl equivalent is less than 100, the hardness and the adhesive strength of the cured product may be lowered. If the hydroxyl equivalent is more than 500, the glass transition temperature may be lowered and the heat resistance may be lowered.

As a specific example of such a polyfunctional phenol resin, a phenol resin represented by the following Chemical Formula 2 may be used.

[Formula 2]

In the formula, h represents an integer of 0 to 50.

Specific examples of the phenol resin represented by Chemical Formula 2 include resins sold under a brand name such as DPP-6085, DPP-6095, or DPP-6115 (Kolon Emulsifier).

The phenolic resin also has a moisture absorption of 4.0% or less in a PCT (Pressure Cooker Test) 48-hour treatment in view of high temperature and moisture resistance, and preferably 2.0% or less in a film produced using the same. In addition, in terms of flowability, the viscosity of the phenol resin is preferably 200 cps or less when measured at 150 ° C. By using a phenolic resin having such a moisture absorption rate and viscosity, it is possible to manufacture an adhesive layer having excellent adhesion and embedding properties in a semi-cured state, and excellent in flowability, embedding and high temperature moisture resistance in the process, and packaging The reliability of the process can be improved.

Preferably, the polyfunctional phenol resin is included in the adhesive layer in an amount of 0.5 to 1.2 equivalents relative to the epoxy resin in an equivalent ratio, and the weight ratio is included in an amount of 60 to 150 parts by weight based on 100 parts by weight of the epoxy resin. desirable. If the content is less than 60 parts by weight, a large amount of unreacted epoxy groups remain, which may reduce packaging reliability. If the content is more than 150 parts by weight, the moisture absorption rate and / or storage stability due to unreacted OH groups deteriorate. There may be a problem.

The adhesive layer of the present invention may further include a thermoplastic resin together with the aforementioned components. The thermoplastic resin preferably has a weight average molecular weight of 10,000 to 2 million, but is not limited thereto. Including such a thermoplastic resin, it is possible to control the flow during molding, and to reduce the elastic modulus of the adhesive layer to secure the flexibility of the film. The kind of thermoplastic resin used is not specifically limited, For example, a glass transition temperature is -60 degreeC-30 degreeC, More preferably, it is -40 degreeC-20 degreeC, and a weight average molecular weight is 100,000-1 million, and Preferably 30 to 800,000 resin can be used. If the glass transition temperature is less than -60 ℃, there is a fear that the handleability and workability is lowered due to excessive increase in the adhesive force, if the glass transition temperature exceeds 30 ℃, there is a fear that the low temperature adhesive strength. In addition, when the weight average molecular weight is less than 100,000, the flexibility, strength, and handleability of the film may be lowered, or flow control may be difficult during circuit filling of the semiconductor substrate. In addition, when the weight average molecular weight is 1 million or more, the effect of suppressing flowability during die bonding is increased, and the embedding property to the base material having irregularities on the surface is lowered, and there is a fear that the reliability and the circuit filling property of the adhesive film are deteriorated.

Examples of such thermoplastic resins include polyimide, polyetherimide, polyesterimide, polyamide, polyethersulfone, polyetherketone, polyolefin, polyvinyl chloride, phenoxy resin, reactive butadiene acrylonitrile copolymer rubber or functional group One kind or two types or more of containing acrylic resin are mentioned, A functional group containing acrylic resin is somewhat preferable among them.

In the above, the acrylic resin means a resin containing (meth) acrylic acid and / or a derivative thereof, and specifically, (meth) acrylic acid; (Meth) acrylic acid esters (such as methyl (meth) acrylate or ethyl (meth) acrylate); And polymers containing at least one monomer selected from the group consisting of (meth) acrylonitrile and (meth) acrylamide. In addition, the acrylic resin preferably includes a functional group such as glycidyl group, hydroxy group, carboxyl group and / or nitrile group, which may be included by copolymerizing monomers containing the respective functional groups described above.

Examples of the monomer that can be used at this time include glycidyl group-containing monomers such as glycidyl (meth) acrylate or 3,4-epoxycyclohexylmethyl (meth) acrylate; Glycerol (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate Hydroxy group-containing monomers such as 8-hydroxyoctyl (meth) acrylate, 2-hydroxyethylene glycol (meth) acrylate or 2-hydroxypropylene glycol (meth) acrylate; (Meth) acrylic acid, 2- (meth) acryloyloxy acetic acid, 3- (meth) acryloyloxy propyl acid, 4- (meth) acryloyloxy butyl acid, acrylic acid duplex, itaconic acid, maleic acid and Carboxyl group-containing monomers such as maleic anhydride; Or nitrogen-containing monomers such as (meth) acrylonitrile, (meth) acrylamide, N-methyl (meth) acrylamide, or N-methylol (meth) acrylamide, or two or more kinds thereof, but are not limited thereto. It is not.

The content of the crosslinkable functional group included through the above components is not particularly limited, and may be included, for example, in an amount of 0.5 parts by weight to 10 parts by weight based on 100 parts by weight of the total resin. If the content is less than 0.5 parts by weight, there is a fear that the adhesive properties are lowered, if it exceeds 10 parts by weight, workability and / or storage stability may be lowered.

Such thermoplastic resins can be produced by known polymerization methods such as solution polymerization, emulsion polymerization or suspension polymerization, for example.

The above-mentioned thermoplastic resin is preferably included in an amount of 100 parts by weight to 400 parts by weight with respect to 100 parts by weight of the multifunctional epoxy resin. If the content is less than 100 parts by weight, it is difficult to form the film form due to the increase in the elastic modulus of the adhesive layer, there is a fear that the flowability at the time of molding is increased, if the content exceeds 400 parts by weight, the flow inhibiting effect is too large to be embedded or high temperature The handleability may deteriorate.

The adhesive layer may also comprise a coupling agent with the aforementioned components. For this reason, resins and wafers; And adhesiveness with resin and a filler interface can be improved. In addition, the coupling agent may improve the adhesiveness, adhesiveness, and moist heat resistance characteristics without damaging the heat resistance by the organic functional group reacts with the resin component during the curing reaction. The coupling agent that can be used in the present invention is not particularly limited. For example, a silane-based, titanium-based or aluminum-based coupling agent can be used, and a silane-based coupling agent is preferable in terms of cost-effectiveness.

Examples of the silane coupling agent may include amino silane, epoxy silane, mercapto silane, ureido silane, (meth) acryloxy silane, vinyl silane, or sulfide silane, or two or more thereof, but is not limited thereto. no.

The coupling agent may be included in an amount of 0.01 to 10 parts by weight, preferably 0.1 to 10 parts by weight, based on 100 parts by weight of the aforementioned resin component. If the content is less than 0.01 part by weight, the adhesive improvement effect may be lowered. If the content is more than 10 parts by weight, voids may occur or heat resistance may decrease.

The adhesive layer of the present invention may further include a curing accelerator in view of promoting the curing reaction. Examples of curing accelerators that can be used include imidazole compounds, triphenylphosphine or tertiary amines, and examples of the imidazole compounds include 2-methyl imidazole and 2-ethyl-4-methyl imidazole. , 2-phenyl imidazole, 1-cyanoethyl-2-phenyl imidazole, 2-undecyl imidazole, 2-heptadecyl imidazole, or 1-cyanoethyl-2-phenylimidazole trimetalate, etc. These can be mentioned and can use together one or more types of the above.

The curing accelerator may be included in an amount of 0.1 parts by weight to 10 parts by weight, preferably 0.5 parts by weight to 5 parts by weight, based on 100 parts by weight of the epoxy resin described above. If the content is less than 0.1 part by weight, the crosslinking of the epoxy resin may be insufficient and the heat resistance may be lowered. If the content is more than 10 parts by weight, the curing reaction may occur rapidly or the storage stability may be lowered.

The adhesive layer may further include a filler from the viewpoint of improving handleability and heat resistance and controlling melt viscosity. As the filler, known organic and / or inorganic fillers can be used. Specifically, silica, talc, aluminum hydroxide, calcium carbonate, magnesium hydroxide, alumina or aluminum nitride may be used, and spherical silica is somewhat preferred in terms of good dispersibility and uniform adhesion in the film, but It is not limited.

The filler used in the present invention preferably has an average particle diameter of 10 nm to 1,000 nm. If the average particle diameter is less than 10 nm, there is a fear that aggregation of the filler in the film may occur. If the average particle diameter is larger than 1,000 nm, the filler protrudes to the surface of the film, damaging the chip during wafer and compression, or adhesiveness. There is a risk of deterioration.

Although content of the said filler is not specifically limited, 5 weight part-100 weight part are preferable with respect to 100 weight part of solid content resin except a filler. When the content is less than 5 parts by weight, there is a fear that the heat resistance and handleability improvement effect is inferior, and when it exceeds 100 parts by weight, the workability and adhesion improvement effect may be lowered.

The method of forming an adhesive layer using the above components is not specifically limited. For example, a resin varnish is prepared by dissolving or dispersing a resin composition comprising the above-mentioned components in a solvent, and applying the same to the above-described second adhesive layer and heating, or manufacturing the resin varnish, or applying the resin varnish to a suitable substrate. It can manufacture by apply | coating and heating to a film, manufacturing an adhesive film, and laminating | stacking the above to the adhesive film of this invention mentioned above. The heating conditions for drying the resin varnish in the above is preferably 5 to 20 minutes at 70 ℃ to 250 ℃.

The method of applying the resin varnish is not particularly limited. For example, a knife coating method, a roll coating method, a spray coating method, a gravure coating method, a curtain coating method, a comma coating method, or a lip coating method can be used. .

In addition, the solvent for varnishing is methyl ethyl ketone (MEK), acetone, toluene, dimethyl formamide (DMF), methyl cellosolve (MCS), tetrahydrofuran (THF) or N-methylpyro Conventional solvents such as redone (NMP) and the like can be used. In the present invention, it is preferable to use a low boiling point solvent in consideration of the heat resistance of the base film, but a high boiling point solvent may be used in order to improve coating properties, and two or more kinds of these solvents may be used in combination.

In the case of using a filler in the preparation of the adhesive layer, from the viewpoint of improving the dispersibility into the film, a ball mill, bead mill, three rolls or a high speed disperser may be used alone, It can also be used in combination. In this case, glass, alumina, or zirconium may be used as the material of the balls and beads. In terms of particle dispersibility, it is preferable to use balls or beads of zirconium material.

In the present invention, in particular, the filler and the coupling agent are mixed with a solvent, and then mixed with a ball mill or a bead mill for a predetermined time, and then the above-described epoxy resin and phenol resin are added and mixed, and finally, the thermoplastic resin and the curing accelerator are mixed to form an adhesive resin. The preparation of the composition is preferred from the standpoint of shortening the manufacturing time and improving dispersibility, but is not limited now.

In addition, as the base film that can be used in the preparation of the adhesive on the film, for example, polyester film (ex. Polyethylene terephthalate film), polytetrafluoroethylene film, polyethylene film, polypropylene film, polybutene film, Plastic films such as polybutadiene film, vinyl chloride copolymer film or polyimide film may be used, and the release treatment using an alkylide, silicone, fluorine, unsaturated ester, polyolefin or wax release agent may be performed on the surface of the film. May be performed. In addition, the thickness of the base film is also not particularly limited, and is usually 10 µm to 500 µm, preferably 20 µm to 200 µm.

Adhesion of the prepared adhesive film and the adhesive film may be performed by a method such as a hot roll laminate or a lamination press, but in terms of efficiency, it is preferable to use a hot roll laminate technique, but is not limited thereto. At this time, the conditions of the hot roll laminate is preferably a temperature of 10 ℃ to 100 ℃ and 0.1 Kgf / cm ² to 10 Kgf / cm ² .

The thickness of the adhesive layer formed through the above process is not specifically limited, For example, what is necessary is just to form about 5 micrometers-200 micrometers, Preferably it is about 10 micrometers-100 micrometers.

The dicing die-bonding film of the present invention may further include a release film formed on the adhesive layer described above. Materials of the release film that can be used include polypropylene film, polyethylene film, polyester film, polycarbonate film, ethylene-vinyl acetate copolymer film, ethylene-propylene copolymer film, ethylene-alkyl (meth) acrylate copolymer film And various polymer films including a polyvinyl chloride film, and one surface of the film may be used by performing a releasing treatment with an alkyd, silicone, fluorine, unsaturated ester, polyolefin or wax release agent. In the present invention, it is particularly preferable to use a silicone-based, alkyd-based or fluorine-based releasing agent in terms of heat resistance. The thickness of the release film as described above is not particularly limited, and may be, for example, formed to a thickness of 10 μm to 100 μm, preferably 20 μm to 50 μm.

The present invention also relates to a semiconductor wafer in which the above-described adhesive layer of the dicing die-bonding film according to the present invention is attached to one side of the wafer, and the adhesive film is fixed to the wafer ring frame.

Such a semiconductor wafer can be produced by laminating the adhesive layer of the dicing die-bonding film of the present invention at a temperature of 0 ° C to 180 ° C on the back surface of the semiconductor wafer, and fixing the adhesive film to a ring frame.

The manufacturing process of the semiconductor device using the semiconductor wafer as described above is as follows.

First, the semiconductor wafer with the dicing die-bonding film mentioned above is cut | disconnected completely using a dicing apparatus, and it divides into individual chips. Thereafter, ultraviolet rays are irradiated to cure the adhesive layer. The adhesive hardened | cured by the ultraviolet-ray as mentioned above falls in the adhesive force with an adhesive agent, and it becomes easy to pick up a chip in a post process. In the present invention, in particular, the first adhesive layer of the thin film formed on the first adhesive layer having a crosslinked structure can be prevented, and the occurrence of burrs in the dicing process as described above can be prevented, and the pick-up process is easy. This has the advantage of being made possible.

In a pick-up process, a dicing die bonding film can be stretched as needed (expanding process). When such an expanding process is performed, the interval between chips is determined to facilitate pick-up, and a shift occurs between the adhesive layer and the adhesive layer, thereby improving pickup performance. Then, chip pick-up is performed. At this time, the pressure-sensitive adhesive layers of the semiconductor wafer and the dicing die-bonding film are peeled from each other to obtain a chip having only the adhesive layer. The obtained chip with the adhesive layer is attached to a semiconductor substrate. The adhesion temperature of the chip is usually 100 ° C to 180 ° C, the adhesion time is 0.5 seconds to 3 seconds, and the adhesion pressure is 0.5 kg _f / cm ² to 2 kg _f / cm ² .

After the above process, a semiconductor device is obtained through a wire bonding and molding process.

The manufacturing method of a semiconductor device is not limited to the said process, Arbitrary process may be included and the order of a process may be changed. For example, it may progress to adhesion layer curing → dicing → expansion process, or may proceed to dicing → expansion → adhesion layer curing process. The chip attach process may further include a heating or cooling process.

Hereinafter, the present invention will be described in more detail through examples according to the present invention and comparative examples not according to the present invention, but the scope of the present invention is not limited to the following examples.

Example 1

A resin varnish was prepared by mixing an epoxy resin, an acrylic base resin, a phenol resin, a curing accelerator, and silica commonly used in an adhesive resin composition for a semiconductor. Subsequently, the varnish was applied to a base film (release polyester film, RS-21G, SKC) having a thickness of 38 μm, dried at 160 ° C. for 3 minutes to prepare an adhesive film having a coating thickness of 20 μm. Meanwhile, a pressure-sensitive adhesive composition was prepared by mixing a polymer resin in which ethylhexyl acrylate and acrylic acid were partially polymerized with hexanediol diacrylate (photocuring agent) and Igacure 651 (photoinitiator). After apply | coating the produced adhesive composition to the polyolefin-type base film of thickness 100micrometer, it irradiated in a nitrogen atmosphere by radiation, bridge | crosslinking and hardening reaction, and the adhesive layer (1st adhesion layer) of thickness 5micrometer was obtained. In addition, a radiation curable pressure-sensitive adhesive composition was prepared by mixing an isocyanate-based thermosetting agent, an epoxy acrylate photocuring resin, and a photoinitiator with a thermosetting resin including a copolymer of ethylhexyl acrylate, butyl acrylate, and hydroxyethyl acrylate. Subsequently, the composition was applied to a polyester film having a thickness of 38 μm and dried at a thickness of 1 μm, and then transferred onto the first adhesive layer. Then, the adhesive film was laminated using a laminator (manufactured by Fujishoko Co., Ltd.) at 5 ° C./kg ² at 30 ° C. with a pressure-sensitive adhesive layer to prepare a dicing die bonding film.

Example 2.

Hot air oven having a temperature of 110 ° C. by mixing an acrylic base resin copolymerized with ethylhexyl acrylate, butyl acrylate and hydroxyethyl acrylate, and an isocyanate curing agent, and applying the above to a polyolefin base film having a thickness of 100 μm. A dicing die-bonding film was prepared in the same manner as in Example 1, except that the first pressure-sensitive adhesive layer having a thickness of 5 μm was prepared by drying for 3 minutes.

Comparative Example 1 .

Isocyanate type thermosetting agent, epoxy acrylate photocuring resin, and photoinitiator were mixed with the thermosetting resin which is a copolymer of ethylhexyl acrylate, butyl acrylate, and hydroxyethyl acrylate, and the radiation curable adhesive composition was obtained. The composition was applied to a polyester film having a thickness of 38 μm and dried to a thickness of 10 μm to prepare an adhesive layer, and then the same adhesive layer as in Example 1 was transferred to prepare a dicing die bonding film.

The physical properties of the dicing die-bonding films prepared in Examples and Comparative Examples were measured in the following manner, and the results are summarized in Table 1 below.

1. Peel Strength Before and After Irradiation

An 8 inch silicon wafer was laminated for 10 seconds with a dicing diebonding film in a tape mounter (Hongle Electronics) set at 60 ° C. Next, the peeling force of the dicing die bonding film was measured on the peeling speed of 5 mm / sec and 180 degree Peel conditions using TA.XT Plus test machine (made by Stable Micro System company). On the other hand, after irradiating an ultraviolet-ray to the said film on condition of 200mJ / cm <^2> , peeling force was measured on the same conditions as the above.

2. Measurement of burr length and number of occurrences

An 8 inch silicon wafer was laminated for 10 seconds with a pre-cut dicing diebonding film in a tape mounter (Hongle Electronics) set at 60 ° C. Subsequently, after cutting to a size of 10 mm × 10 mm (horizontal × length) under a condition of 14,000 rpm in a dicing machine, and lifting all 100 dies by ultraviolet irradiation, the lengths of the burrs and the remaining burrs raised above the dies were optically measured. Measured under a microscope.

TABLE 1

Example 1 Example 2 Comparative Example 1 Peel force before irradiation (g / in) 450 800 680 Peel force after irradiation (g / in) 5 7 12 Average Burr Length (μm) 0.2 to 0.5 0.4 to 0.7 1.5 to 4.0 Burr occurrence count 3/100 5/100 35/100

As shown in Table 1, in the dicing die-bonding film according to the present invention, while the peeling force decreases due to ultraviolet irradiation is made efficiently, the generated burr length is short, and the number of occurrences is significantly reduced. Could.

1 is a cross-sectional view of an adhesive film according to one embodiment of the present invention.

2 is a cross-sectional view of a dicing die bonding film according to one aspect of the present invention.

<Description of Drawing>

1: base film

2: first adhesive layer

3: second adhesive layer

4: adhesive

Claims (24)

Base film; A first adhesive layer formed on the base film and having a crosslinked structure; And The adhesive film formed on the said 1st adhesion layer and containing the 2nd adhesion layer whose thickness is 0.5 micrometer-5 micrometers. The method of claim 1, wherein the base film is a polyolefin film, polytetrafluoroethylene film, polyester film, polyurethane film, polycarbonate film, ethylene-vinyl acetate copolymer film, ethylene-propylene copolymer film, ethylene-alkyl ( It is a meth) acrylate copolymer film or a polyvinyl chloride film, The adhesive film characterized by the above-mentioned. The pressure-sensitive adhesive film of claim 1, wherein the base film has a thickness of 10 μm to 200 μm. The pressure-sensitive adhesive film of claim 1, wherein the first pressure-sensitive adhesive layer comprises a radiation curable pressure sensitive adhesive or a thermosetting pressure sensitive adhesive. 5. The radiation curable pressure sensitive adhesive according to claim 4, wherein the radiation curable pressure sensitive adhesive comprises an acrylic base resin, a photocuring agent and a photoinitiator; The thermosetting adhesive is an adhesive film comprising an acrylic base resin and a multifunctional crosslinking agent. 6. The pressure-sensitive adhesive film of claim 5, wherein the acrylic base resin is a polymer of a monomer mixture containing a (meth) acrylic acid ester monomer and a polar group-containing monomer. 7. The (meth) acrylic acid ester monomer is methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth). ) Acrylate, t-butyl (meth) acrylate, sec-butyl (meth) acrylate, pentyl (meth) acrylate, hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, 2-ethylbutyl From the group consisting of (meth) acrylate, n-octyl (meth) acrylate, isooctyl (meth) acrylate, isononyl (meth) acrylate, lauryl (meth) acrylate and tetradecyl (meth) acrylate Adhesive film, characterized in that at least one selected. 7. The pressure-sensitive adhesive film of claim 6, wherein the polar group-containing monomer is at least one selected from the group consisting of a carboxyl group-containing monomer, a nitrogen-containing monomer and a hydroxy group-containing monomer. The pressure-sensitive adhesive film of claim 6, wherein the monomer mixture further comprises a monomer represented by Formula 1 below: [Formula 1]

Wherein R ₁ to R ₃ each independently represent hydrogen or alkyl, and R ₄ represents cyano; Phenyl unsubstituted or substituted with alkyl; Acetyloxy; Or COR ₅ , wherein R ₅ represents amino or glycidyloxy unsubstituted or substituted with alkyl or alkoxyalkyl. 6. The pressure-sensitive adhesive film of claim 5, wherein the photocuring agent is a polyfunctional acrylate. The pressure-sensitive adhesive film of claim 5, wherein the multifunctional crosslinking agent is at least one selected from the group consisting of an isocyanate crosslinking agent, an epoxy crosslinking agent, an aziridine crosslinking agent, and a metal chelate compound. The pressure-sensitive adhesive film of claim 1, wherein the first pressure-sensitive adhesive layer has a thickness of 1 μm to 100 μm. The pressure-sensitive adhesive film of claim 1, wherein the second pressure-sensitive adhesive layer comprises a thermosetting adhesive resin, a thermosetting agent, a photopolymerizable compound, and a photoinitiator. The pressure-sensitive adhesive film according to claim 13, wherein the thermosetting agent is an isocyanate-based crosslinking agent. The pressure-sensitive adhesive film according to claim 13, wherein the photopolymerizable compound is an addition polymerizable compound containing two or more unsaturated groups in a molecule or an epoxy group-containing alkoxysilane. The pressure-sensitive adhesive film according to claim 15, wherein the addition polymerizable compound is a polyhydric alcohol ester, a (meth) acrylic acid oligoester, an epoxy compound or a urethane compound of (meth) acrylic acid. The pressure-sensitive adhesive film of claim 13, wherein the photopolymerizable compound is included in an amount of 3 parts by weight to 500 parts by weight based on 100 parts by weight of the thermosetting pressure-sensitive adhesive resin. The pressure-sensitive adhesive film according to claim 13, wherein the photoinitiator is a carbonyl compound, an organic sulfur compound, a peroxide, an amine or an onium salt compound. The pressure-sensitive adhesive film of claim 1, wherein the second pressure-sensitive adhesive layer has a thickness of 0.5 μm to 3 μm. An adhesive film according to any one of claims 1 to 19; And Dicing die-bonding film comprising an adhesive portion formed on the adhesive film. 21. The dicing die-bonding film of claim 20, wherein the adhesive portion comprises a polyfunctional epoxy resin, a curing agent, and a thermoplastic resin. The dicing die-bonding film of claim 20, wherein the adhesive portion has a thickness of 5 μm to 200 μm. The dicing die-bonding film according to claim 20, further comprising a release film formed on the adhesive portion. A semiconductor wafer, wherein an adhesive portion of the dicing die-bonding film according to claim 20 is attached to one surface of the wafer, and the adhesive film is fixed to the wafer ring frame.

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