201247353 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明係為一種活性軟録填料_ ’其可在大氣環境下 直接進行接合，且可對潤濕性低之靶材與金屬進行接合 【先前技術】 [0002] 濺鍍主要是在真空中利用輝光放電（glow dis charge) 的原理 ，將等離子體高速撞擊靶材表面’ 靶材的 原子受到衝擊後彈出’沈積在基板表面，形成了薄膜， 該方法可用於塑膠、金屬、玻璃、布或複合材料的刻银 與鍍膜，具有高品質，附著力佳，製程穩定性優良等優 在一般典型的藏鍵操作過程中，把材侧會通入電流 形成負電極，在濺鍍真空腔體中，被激發而帶有正電荷 的惰性氣體離子，會跟靶材碰撞，而將靶材轟擊成原子 粒子’飛濺沈積於基材上。由於這過程會使靶材產生大 量的熱，為了冷卻靶材，通常利用水冷的方式，冷卻與 靶材接合的背板為之。若是靶材跟背板的接合強度不佳 ，或是界面之導熱性能不良時，於濺鍍操作過程中靶材 溫度會迅速升高，而產生脫銲、熔化或設備過熱等問題 100118555 把材與背板的接合上，不僅要兼顧強度、導熱性及 耐恤性等，還必須考$到背板回收之重工性接合的操作 便利性，以及成本。考慮接合溫度跟操作溫度及導熱性 的需求時，通常以銦作為乾材跟背板的接合材料。在大 把材的接用上，因姻能在炼化時跟金屬乾 表單蝙號A〇l01 第3頁/共17頁 ^ ^ 1002031260-0 201247353 材產生& i 、又子的潤濕性，得以順利完成接合。 陶究Γ2Γ，喊錢屬_合為w目，由於 的優:屬所製成之複合構件，能充分發揮各自性能上 合實為^能關自身材龜能上的R，故將兩者接 式不同研究方向，但由於陶竟與金屬本身的鏈結方 在接、使得兩者的物理錢學性f差異大，造成兩者 ，通的困難°由於m材為潤濕性低之材料 須在待拉使陶:絲面能產生與金屬反應鍵結的能力，常 屬化的Φ W陶究表面預先施以金屬化的處理。陶竟金 氣相仏要枝有練、顧等之真”翁式、化學 金屬=、離子注人法或化學料11膜工藝，或以燒結 化亦或披覆活性硬銲填料之厚敎藝等。待金屬 以及具^鋼來接合但如此之程序需要花費高成本， 、有繁瑣的製程。 料合=台灣發明專利公開案第1321159號中提供一焊 特徵為，“接合把材與銅或銅合金製背板的接合，其 .由句冬舌曰π \ 錫與不可、 I为比3〜9%的鋅，以及剩餘部份為 於易、避免之^組成。惟該技術特徵中，僅能使用 質等，、Ί之易縣材，對於潤紐低之乾材如陶究材 |沒有述及解決方法。 了 C::發明專利公開 案第201036741號中，揭露 而形戍錄材的表面’進行純鉻或絡合金鑛膜處理 層進面層接著將背板的射4層與減上的界面 Τ Α銲接，最後將界面層進行退火處理 ，使該界面 曰鲜料層之間能易於接合。該發明提供了接合潤濕 性低之乾材接合方式’惟該技術特徵中，需要絲材表 100118555 〇 ❹ 1002031260-0 表單編號A0101 第4頁/共17頁 201247353 面鍍上界面層以便於軟銲，如此方式不僅在鍍膜的製程 而要花費高成本，亦使得接合的程序繁複，多出了退火 處理等程序，且多層金屬的接合界面也會影響接合性能 Ο [0003] 如此，有必要研發新技術，克服上述缺失。本發明 人將目標放在潤濕性低之乾材上，如陶瓷、鋁、鋁合金 荨材質，有鐘於前案之方式有增加成本與製程繁瑣等問 故、.左過研究與實驗之後，終於產生此製作活性軟錄 填料以及使用該填料接合靶材跟背板的方法。 【發明内容】 發明之主要目的，在於提供一種活性軟銲填料， 其藉由-雜軟銲填料，可以直接將_顧性低之乾材 、 接口而不需要對把材表面作鍍膜處理。 本發明之次要目的，在於提供-種活性軟銲填料， 工作人員不需要任何防護設備，就可以直接進行該㈣ 與背板的接合操作。 ❹ 本發明之另一目的，在於提供一種活性軟銲填料， 的潤濕性，適用於咖生低之乾材與背板接 〇 加工步驟可省下加工時間與成本。 本發明之另—目的，在㈣供—種活性軟鲜填料， ，、在於錄倾㈣板接糾，錢純 ，除了操作起來輕^入L 卿恤度 問題，增加接合=尚可以解決界面熱應力的 月之另一目的，在於提供—種活 其金屬基材材^填料’ 接合溫度純，在h延展性較—般細蟬料佳， 100118555 表軍編號_ ^與背板接合上，亦可減少執應力 第5頁/共17頁 、. 1002031260-0 201247353 的問題，讓接合強度較為堅固。 本發明係m續軟銲填料，其可於大氣環境 下直接接合_性低之_射板，係包括—活性物， 成份為欽加上稀土元素或鎂；-金屬基材，係為錫鋅合 金’另包含特以之叔’銦，銀，銅。該活性軟鲜填料 之主要接合溫度介於15代至20代，介於低溫輝料衫 溫厚料之間，如此之操作溫度在無料料之中屬於低溫 ，故可以減少接合界面熱應力的產生，其巾接合操作溫 度需要在15(rc以上，不然在賤鑛操作時乾材會與背板分 離。而製造該活性軟銲填料時，溫度為2〇代以下，比起 一般商用減焊料所需溫度來的低，製料更加方便快 速，也更安全。 本發明所開發出之活性軟銲填料，對於難以澄濁以 致接合不易之濁濕性低之_的接合操作上，有著技術 上的突破，由於_射含有之活性元素，藉此可以直 接接合潤濕性低之減與背板，節省了成本與時間，還 可增進接合效果，並且，該活性軟銲填射，其金屬基 ;、、錫鋅口金為主，其延展性佳能減少熱應力的問題 〇 【實施方式】 [0004] 兹為使責審查委員對本發明之結構特徵及所達成 更有進一步之瞭解與認識，謹佐以較佳之實施例 圖及配合詳細之說明，說明如後： 100118555 本發明係為-種『活性軟銲填料之組成物』，其係 利用β亥讀軟銲填料於大氣環境下直接接相濕性低之 乾材與背板，而不需要防護設備。 表單編號Α〇1〇ι 第6頁/共17頁 1002031260-0 201247353 請同時參閱第1圖及表1，其係為本發明之一較佳第 一實施例之結構示意圖及合金成分表；如圖所示，本發 明之一活性軟銲填料1 〇係包括：一活性物與一金屬基材 ;其中該活性物’係為鈦及稀土元素，該稀土元素係選 自於鑭（La)、鈽（Ce)、鎮（Pr)、鈥（Nd)、鉅（Pm)、釤 (Sm)、銪（Eu)、亂（Gd)、試（Tb)、鋼（Dy)、鈥（Ho)、 斜（Er)、链（Tm)、镱（Yb)、鑛（Lu)、紀（y)、銃（Sc)及 上述任意組合之其中之一者。，且該金屬基材，係以錫 鋅合金為主要成份。 Ο 再者’該活性軟銲填料10之主要接合溫度介於15〇 C至200°C ’且更進一步包含了一添加物，其係選自於叙 、銦、銀及銅之其中之一者或上述之任意組合，至少具 有下列表1之數種比例組合： 表1第一實施例合金成份 填料合食 Sn Zn Bi In Ag Cu Ti Re R-SZB 餘量 5-15 0.1-10 0 0 0 2-10 0.01-1 R-SZ1 餘董 5-15 0 0.1-10 0 0 2-10 0.01-1 R-SZA 餘鲞 5-15 0 0 o.i-io 0 2-10 0. 01-1 R-SZBI 餘童 5-15 0.1-10 0.1-10 0 0 HO 0.01-1 R-SZBA 餘量 5-15 0. H O 0 0.1-10 0 2-10 o. di-i R-SZ0C 餘童 5-15 0.1-10 0 0 0.1-5 2-10 0.01-1 R-SZIA 餘量 5-15 0 0.1-10 0.1-10 Q 2-10 0.01-1 R-SZLC 5-15 0 ¢).1-10 0 0.1-5 2-10 o. Oi-i201247353 VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention is an active soft recording filler _ 'which can be directly bonded in an atmospheric environment, and can be used for targets and metals having low wettability Bonding [Prior Art] [0002] Sputtering is mainly based on the principle of glow discharge in vacuum, which causes the plasma to hit the surface of the target at a high speed. The atoms of the target are impacted and popped out on the surface of the substrate. The film can be used for engraving silver and coating of plastic, metal, glass, cloth or composite material, with high quality, good adhesion, excellent process stability, etc. in the typical typical Tibetan key operation process, the material side A current is formed to form a negative electrode. In the sputtering vacuum chamber, an inert gas ion excited with a positive charge collides with the target, and the target is bombarded into atomic particles 'splash deposited on the substrate. Since this process causes the target to generate a large amount of heat, in order to cool the target, the backing plate that is bonded to the target is usually cooled by water cooling. If the bonding strength between the target and the backing plate is not good, or the thermal conductivity of the interface is poor, the target temperature will rise rapidly during the sputtering operation, and the problem of desoldering, melting or overheating of the device may occur. The joining of the backboard requires not only strength, thermal conductivity, and durability, but also the operational convenience and cost of the heavy-duty joint that is recovered from the backsheet. In consideration of the bonding temperature and the requirements of the operating temperature and thermal conductivity, indium is usually used as a bonding material for the dry material and the back sheet. In the use of large materials, because of the marriage in the refining and metal drying form bat No. A〇l01 Page 3 of 17 ^ ^ 1002031260-0 201247353 Material production & i, and the wettability of the child , to successfully complete the joint.陶ΓΓ2Γ, 叫钱 belongs to _合为w目, because of the superiority: the composite components made by the genus, can fully exert their respective performances on the ability to Different research directions, but because of the connection between the ceramic and the metal itself, the difference in physical physics between the two is large, resulting in difficulties in both. Because the m material is a material with low wettability In the pottery to be pulled: the silk surface can produce the ability to react with the metal, and the often-formed Φ W ceramic surface is pre-applied with metallization. Tao Jingjin gas-phased 仏 有 有 有 有 有 有 翁 翁 翁 翁 翁 翁 翁 翁 翁 翁 翁 翁 翁 翁 翁 翁 翁 翁 翁 翁 翁 翁 翁 翁 翁 翁 翁 翁 翁 翁 翁 翁 翁 翁 翁 翁 翁 翁 翁Etc. To be metal and steel to join but such a procedure requires high cost, and has a cumbersome process. The combination of the invention = Taiwan Patent Publication No. 1321159 provides a welding feature, "joining the material with copper or The joint of the copper alloy backing plate, which consists of the tongue 曰 π \ tin and not, I is 3 to 9% zinc, and the rest is easy to avoid. However, in this technical feature, only the quality can be used, and the Yixian County material is not mentioned in the dry material of the Runxin low. In C:: Inventive Patent Publication No. 201036741, it is disclosed that the surface of the shape-recording material is subjected to a pure chromium or a complex alloy ore film treatment layer, and then the surface layer of the backing plate and the reduced interface are Τ After welding, the interface layer is finally annealed so that the interface between the fresh layers can be easily joined. The invention provides a dry material joining method with low joint wettability'. However, in the technical feature, a wire material table 100118555 〇❹ 1002031260-0 is required. Form No. A0101 Page 4 / 17 pages 201247353 The surface layer is plated to facilitate softness. Welding, in this way, not only costs a high cost in the coating process, but also complicates the bonding process, and more procedures such as annealing treatment, and the bonding interface of the multilayer metal also affects the bonding performance. [0003] Therefore, it is necessary to develop New technology to overcome the above shortcomings. The present inventors aim at dry materials with low wettability, such as ceramics, aluminum, and aluminum alloys, and there are cases in which the method in the previous case has an increase in cost and a complicated process, and after the left research and experiment. Finally, the production of the active soft recording filler and the method of joining the target and the back sheet using the filler are produced. SUMMARY OF THE INVENTION The main object of the invention is to provide an active soldering filler which can directly directly dry the dry material and the interface without the need for coating the surface of the material by using a miscellaneous solder filler. A secondary object of the present invention is to provide an active solder filler, and the worker can directly perform the bonding operation of the (4) and the backboard without any protective equipment.另一 Another object of the present invention is to provide an active solderable filler, which is suitable for use in dry cooking and backsheet processing, which can save processing time and cost. Another object of the present invention is to provide an active soft fresh filler in (4), and to record the tilting (four) board to connect and correct, Qian Chun, in addition to the operation, light into the L degree, increase the joint = can still solve the interface heat Another purpose of the stress month is to provide a kind of metal substrate material ^ filler ' joint temperature pure, better in the ductility than the fine-grained material, 100118555 table army number _ ^ with the back plate joint, also It can reduce the problem of stress on page 5 / 17 pages, . 1002031260-0 201247353, so that the joint strength is stronger. The invention is a continuous soldering filler, which can be directly bonded to the low-permeability plate in an atmospheric environment, and includes an active material, the composition is a rare earth element or a magnesium; and the metal substrate is a tin zinc. The alloy 'also contains the special uncle' indium, silver, copper. The main bonding temperature of the active soft fresh filler is between 15 and 20 generations, which is between the low temperature and the thick material of the low-gloss shirt. The operating temperature is low in the non-material, so the thermal stress at the joint interface can be reduced. The towel joining operation temperature needs to be above 15 (rc or more, otherwise the dry material will be separated from the backing plate during the operation of the antimony ore. When the active soldering filler is manufactured, the temperature is below 2 generations, which is required for the general commercial solder reduction. The temperature is low, the material is more convenient, faster and safer. The active soldering filler developed by the invention has a technical breakthrough in the joint operation which is difficult to turbid and the joint is not easy to be wet. Because the active element contained in the _ shot, the low wettability reduction and the backing plate can be directly bonded, the cost and time are saved, the bonding effect can be improved, and the active solder fill is formed, and the metal base thereof; , tin-zinc mouth gold-based, its ductility Canon to reduce the problem of thermal stress 实施 [Embodiment] [0004] For the review of the structure of the invention and the understanding and recognition of the invention The following is a description of the preferred embodiment and the detailed description, as follows: 100118555 The present invention is a "composition of active solder filler" which utilizes β-read soft solder filler in an atmospheric environment. Directly connected to dry and back plates with low wetness, without the need for protective equipment. Form No. 〇1〇ι Page 6 of 17 1002031260-0 201247353 Please also refer to Figure 1 and Table 1, which are A schematic diagram of a preferred first embodiment of the present invention and an alloy composition table; as shown in the drawing, an active solder filler 1 of the present invention comprises: an active material and a metal substrate; wherein the active material It is made of titanium and rare earth elements selected from the group consisting of La, C, Pr, Nd, Pm, Sm (Gd), test (Tb), steel (Dy), bismuth (Ho), oblique (Er), chain (Tm), yttrium (Yb), ore (Lu), y (y), sputum (Sc) and the above Any one of the combinations, and the metal substrate is mainly composed of a tin-zinc alloy. Ο Furthermore, the main bonding temperature of the active solder filler 10 is 15 〇C. 200 ° C ' and further comprising an additive selected from one of sina, indium, silver, and copper, or any combination thereof, having at least a plurality of ratio combinations of the following Table 1: Table 1 In one embodiment, the alloy component filler is used to feed Sn Zn Bi In Ag Cu Ti Re R-SZB balance 5-15 0.1-10 0 0 0 2-10 0.01-1 R-SZ1 Yu Dong 5-15 0 0.1-10 0 0 2-10 0.01-1 R-SZA Ember 5-15 0 0 oi-io 0 2-10 0. 01-1 R-SZBI Yu Tong 5-15 0.1-10 0.1-10 0 0 HO 0.01-1 R- SZBA balance 5-15 0. HO 0 0.1-10 0 2-10 o. di-i R-SZ0C Yu Tong 5-15 0.1-10 0 0 0.1-5 2-10 0.01-1 R-SZIA Balance 5 -15 0 0.1-10 0.1-10 Q 2-10 0.01-1 R-SZLC 5-15 0 ¢).1-10 0 0.1-5 2-10 o. Oi-i
活性軟銲填料10能夠在大氣環境中，直接將一第一 接合物20及第二接合物30接合，是因為在該活性軟銲填 料10中，具有活性元素鈦及稀土元素，分別與第一接合 物20及第二接合物30之表面起反應，產生了鍵結，第一 100118555 表單編號A0101 第7頁/共17頁 1002031260-0 201247353 第一接合面21，第二 第二接合面31。 結合物20與活性軟銲填料ίο產生了 結合物30與活性軟銲填料1 0產生了 該第-接合物20係iT自於金屬、喊其中一種； 該第二接合物30係選自於金屬、陶究其中一種。 i在第1_中’該活性軟輝填料難夠直接接合 第接。物2G及第二接合物3〇是因為活性金屬法的應用 ’雜金屬法係在-般金屬焊料巾添加活性元素 ，促使 金屬=與料等潤濕性低之㈣發生反應及湖濕，以便 於接合操作。陳使用該蹄金屬法得到的焊料合金，The active solder filler 10 can directly bond a first bonding material 20 and a second bonding material 30 in an atmospheric environment because the active solder filler 10 has an active element titanium and a rare earth element, respectively, and the first The surfaces of the bond 20 and the second bond 30 react to create a bond, first 100118555 Form No. A0101 Page 7 / Total 17 pages 1002031260-0 201247353 First joint surface 21, second second joint surface 31. The conjugate 20 and the active solder filler ίο produce the conjugate 30 and the active solder filler 10 to produce the first conjugate 20 is iT from the metal, calling one of them; the second conjugate 30 is selected from the metal One of them. i is in the 1st_the active soft filler is difficult to directly join the first. 2G and the second conjugate 3〇 are due to the application of the active metal method. The hybrid metal method adds an active element to the metal-like solder towel, which promotes the reaction of the metal=the material with low wettability (4) and the lake wetness. For the joining operation. Chen uses the solder alloy obtained by the hoof metal method,
Ϊ操T接合溫度高達8GrC至刚代，存有熱應力及高 ，1題’本發明開發出以添加活性元素鈦及微量 稀土疋素之活性軟鮮填料1〇，可於至綱t直接進 行接合操作’該溫度範財最佳之表現，操作者可根據 作業上的需要自行調整。 其中1^於稀土元素具有相當高的親和力在大氣 之下能使活性軟銲填料潤濕喊等職性低之乾材，可 在不1用助銲_情形下直接結合減與背板，且根據 實驗、Ή果顯5^，接合操作溫度最低需高於i5(rc，如此溫 度之上才可讓乾材與背板接合而濺錄操作時不會分 離0 如第2圖所不，本發明之活性軟銲填料之第一實施例 ’於大fL環境下接合潤紐低之祕射板之方法：係 如下列步驟： 步驟S40 ··預先將填料合金及活性元素，以預定之重量百 刀比準備好以真空電派炫煉爐來融製，抽真空至 1〇 〇rrj^上’通入氣氣做為保護氡氛，之後得到 100118555 表單編號腦η 第8_17頁 Η Λ 11 η 1002031260-0 201247353 活性軟銲填料10 ; 步驟S42 :接人 紙研磨，再⑴第―、第二接合物2G與30之表面以砂 潰。㈣Μ咐叫音波«清洗叫除表面油 ==#：Τ她⑽㈣糊塗佈於接Chastity T joint temperature up to 8GrC to the new generation, there is thermal stress and high, 1 question 'The invention developed active soft fresh filler 1添加 with active element titanium and trace rare earth lanthanum, can be directly carried out Engagement operation 'The best performance of this temperature, the operator can adjust according to the needs of the work. Among them, the rare earth element has a relatively high affinity under the atmosphere to make the active soldering filler wet and dry, and the dry material can be directly combined with the backing plate without using the welding. According to the experiment, the result is 5^, the minimum joint operation temperature needs to be higher than i5 (rc, so that the dry material can be combined with the back plate and the spattering operation will not be separated when the temperature is above. 0, as shown in Fig. 2, this The first embodiment of the active solder filler of the invention 'method of joining the low-focal secret plate in a large fL environment is as follows: Step S40 · Pre-filling the filler alloy and the active element by a predetermined weight The knife is ready to be melted in a vacuum electric smelting furnace, and the vacuum is drawn to 1 〇〇rrj^ on the air to protect the atmosphere, then get 100118555 Form number brain η 8_17 Η 11 η 1002031260 -0 201247353 Active soldering filler 10; Step S42: Pick up the paper, and then (1) the surface of the second and second joints 2G and 30 will be sanded. (4) Howling sound «Cleaning surface oil ==#:Τ She (10) (four) paste coating
利_…將“丄 化物破裂，提升接合效果達到《接合。表面氧 第實施例係以稀土元素作為 素，稀土元素產量少,價格高昂，:= 性： ’f取得上較難掌握，故本發明同時開發了添加=Lee _... will "cracking rupture, improve the joint effect to achieve the joint. Surface oxygen in the first embodiment of the rare earth element as a prime, rare earth element production is low, the price is high, := sex: 'f is difficult to master, so this The invention also developed the addition =
兀素鎮之雜料㈣，如第二實施例。請同 圖及表2 ,其係為本發明之另—㈣實_之結構示意第圖 及合金成料；本發明H雜軟銲填侧係包括一 活性物與-金屬基材；其中該活性物，係__合金 ，且該金屬基材，係以錫鋅合金為主要成份。 該活性軟銲填料10之主要接合溫度介於15代至_ °C ’且更進-步包含了-添加物，其係選自於纽、鋼、 銀及銅之其中之一者或上述之任意組合，至少具有下列 表2數種比例組合： 表2第二實施例合金成份 100118555 表單编號A0101 第9頁/共17頁 1002031260-0 201247353 填料合金 ---- Sa __ Ζα "ii 1 In Ag Cu Mg或鴒 ϊϋβ 餘量 合金 5-15 0.1-10 0 0 0 0. 1-5 W oil ^-θΖΒΑ 餘量 5-15 0 0.1-10 0 0 0.1-5 餘量 — . 5-15 0 0 0.1-10 0 0. 1-5 餘量 -------- 5-15 0.1-10 o.i-io 0 0 0.1-5 5-15 0.1-10 0 0.1-10 0 0.1-5 餘董 5-15 0.1-10 0 0 0.1-5 0.1-5 iizlc 餘量 —— 5-15 0 o.i-io 0.1-10 0 0.1-5 餘量 5-15 0 0.1-10 0 0.1-5 0.1-5 活性軟銲填料ίο能夠在大氣環境中，直接將一第一 接5物20及第二接合物3〇接合，是因為在該活性軟銲填 料10中，具有活性元素鎂，分別與第一接合物20及第二 接5物30之表面起反應，產生了鍵結，第一結合物20與 活性軟銲填料1〇產生了第一接合面21，第二結合物30與 '舌性軟銲填料10產生了第 二接合面31。 该第一接合物20係選自於金屬、陶究其中一種； °亥第二接合物30係選自於金屬、陶兗其中一種。 在第—實施例中’該活性軟銲填料1〇能夠直接接合 第一接合物20及第二接合物30是因為活性金屬法的應用 ，活性金屬法係在一般金屬焊料中添加活性元素’促使 金屬能與陶瓷等潤濕性低之靶材發生反應及潤濕，以便 於接合操作。而往使用該活性金屬法得到的焊料合金， 其操作之接合溫度高達8〇〇。〇至i 000°c ,存有熱應力及高 溫製程等問題，本發明開發出添加活性元素鎂之活性軟 銲填料，不僅可大幅降低成本支出，且亦能促進潤濕性 低之靶材表面的潤濕性，在接合操作上相當優良，可媲 100118555 表單編號A0101 第10頁/共17頁 1002031260-0 201247353 美添力 、〜D了活性元素鈦及微量稀土元素之活性軟銲填料。 如第2圖所示，本發明之活性軟銲填料之第二實施例 於大氣環境下接合潤濕性低之靶材與背板之方法：係 如下列步驟： 乂驟84〇:預先將填料合金及活性元素，以預定之重量百 刀比準備好，以真空電弧熔煉爐來融製，抽真空至 10 1〇"3 torr以上，通入氬氣做為保護氣氛，之後得到 活性軟銲填料10 ;The miscellaneous material (4) of Yusu Town, as in the second embodiment. Please refer to the same figure and Table 2, which is a schematic diagram of the structure of the invention and the alloy composition; the H-hybrid weld side of the invention comprises an active material and a metal substrate; wherein the activity The material is a __ alloy, and the metal substrate is mainly composed of a tin-zinc alloy. The active bonding filler 10 has a primary bonding temperature of 15 generations to _ ° C ′ and further includes an additive selected from one of the group consisting of New Zealand, Steel, Silver, and Copper or the above. Any combination, at least with the following list 2 ratio combination: Table 2 second embodiment alloy composition 100118555 Form No. A0101 Page 9 / Total 17 page 1002031260-0 201247353 Filler alloy ---- Sa __ Ζα "ii 1 In Ag Cu Mg or 鸰ϊϋβ residual alloy 5-15 0.1-10 0 0 0 0. 1-5 W oil ^-θΖΒΑ balance 5-15 0 0.1-10 0 0 0.1-5 balance — . 5-15 0 0 0.1-10 0 0. 1-5 Balance --- 5-15 0.1-10 oi-io 0 0 0.1-5 5-15 0.1-10 0 0.1-10 0 0.1-5 Dong 5-15 0.1-10 0 0 0.1-5 0.1-5 iizlc balance - 5-15 0 oi-io 0.1-10 0 0.1-5 balance 5-15 0 0.1-10 0 0.1-5 0.1-5 The active solder filler ί can directly join a first material 20 and a second bond 3 in an atmospheric environment because the active solder filler 10 has active element magnesium and is respectively bonded to the first bond. The surface of the object 20 and the second substrate 30 reacts to form a bond, the first knot Was 20 and the active solder filler 1〇 produce a first joining surface 21, 30 and the second binding 'of soldering filler tongue 10 the second engagement surface 31 is generated. The first conjugate 20 is selected from the group consisting of metal and ceramics; and the second conjugate 30 is selected from one of metal and ceramic. In the first embodiment, the active solder fill filler 1 can directly bond the first bond 20 and the second bond 30 because of the application of the active metal method, and the active metal method adds active elements to the general metal solder. The metal reacts and wets with a target having low wettability such as ceramics to facilitate the bonding operation. The solder alloy obtained by the active metal method has a bonding temperature of up to 8 Å. 〇 to i 000 °c, there are problems such as thermal stress and high temperature process, the present invention develops an active solder filler with the addition of active element magnesium, which not only can greatly reduce the cost, but also promote the surface of the target with low wettability The wettability is quite excellent in the joining operation. 媲100118555 Form No. A0101 Page 10/Total 17 Page 1002031260-0 201247353 US Timing, ~D Active titanium and trace rare earth active soft solder filler. As shown in Fig. 2, the second embodiment of the active solder filler of the present invention joins a target having a low wettability to a backing plate in an atmospheric environment: as follows: Step 84: Pre-filling the filler The alloy and active elements are prepared at a predetermined weight of 100 knives, melted in a vacuum arc melting furnace, evacuated to 10 1 〇"3 torr or more, and argon gas is used as a protective atmosphere, followed by active soldering. Filler 10 ;
步驟S42 ··接合前，第一、第二接合物2〇與3〇之表面以砂 研磨’再置於丙_中以超音波震蘯清洗以去除表面油 潰。 步驟S44 :以機m方式促使雜軟銲填料㈣第一、 第二接合物20與30產生潤濕。Step S42 · Before joining, the surfaces of the first and second conjugates 2〇 and 3〇 are sand-polished and placed in the propylene to be ultrasonically cleaned to remove surface oil. Step S44: The weed solder filler (4) is caused to wet by the first and second joints 20 and 30 in the form of machine m.
:驟S46 :當活性軟銲填㈣能完全潤濕並均句塗佈於接 合材料表面，再將第…第二接合_⑽相互叠合， 利用摩擦的方式將氣㈣出並使活性軟銲填㈣表面氧 化物破裂，提升接合效果達到緊密接合。 综上所述，本發明為-種活性軟鲜填料以及利用該 ^性軟銲填料接合滅跟方法，其係於該活性軟 銲填料中添加活性元素，增進乾好 祀材表面之潤溼性，讓接 σ操作可以直接完成’而不需讓知从* ^.甘# 靶材表面鍍上金屬層後 為之，其優點及功效列舉如下： 1.本發明所研發之活性軟銲填料， 直接接合潤濕性低之乾材與背板， 裝置’在使用上相當的方便，也節省 程。 可於大氣環境中 而不需要特别的防護 了成本與簡化了流 100118555 表單編號Α0101 第11頁/共17頁 1002031260-0 201247353 —2.主要接合溫度在於15〇。(：至2〇〇。(：之間，此範 於-般低溫銲料溫度與高溫銲料溫度之間，可減少：介 力產生的問題，並且該溫度範圍沒有落於以往操作範園' 卜故加工時可直接以原設備進行操作 新的設備。 个而添構 3. 可對潤濕性低之把材與背板進行接合，本 ===其Γ技術特徵’係在金屬基材中添加特之 使欲接合之兩者的表面反應1產 有使㈣祕低之料««大氣環境中能 且不需使用助銲劑，省下了成本與步驟。 4. 本發明之雜軟銲翻，其巾的金屬基材為 D金，比起一般銲料f ^，、錫鋅 麟料加婦，如雜減少熱 題，讓接合強度更能提昇。 的問 雖,、、、本發明已以較佳實施例揭露如上，然 =定本發明，任何熟習此技藝者，在不脫離本發：用 =範圍内’當可作些許之更動與调飾，因此本二 …範圍“後附之申請專圍所界定者為準。 【圖式簡單說明】 [0005] [0006] Γ圖為本發明之接合物與活性軟銲填料接合之示意圖； 第2圓為本發明之活性軟銲填料之使用過程示意圖。 【主要元件符號說明】 10 活性軟銲填料 20 第一接合物 21 第一接合面 100118555 表單编號A0101 第12 頁/共17頁 1〇〇2〇3126〇~〇 201247353 30 第 二接合物 31 第 二接合面 Ο 100118555 表單編號Α0101 第13頁/共17頁 1002031260-0Step S46: When the active solder fill (4) can be completely wetted and coated on the surface of the joint material, the second joint_(10) is superposed on each other, and the gas (4) is extracted by friction and the active solder is welded. Fill (4) the surface oxide is broken, and the bonding effect is improved to achieve close joint. In summary, the present invention is an active soft fresh filler and a method for joining and extinguishing the same by using the soft solder filler, which is added to the active solder filler to add active elements to improve the wettability of the dried coffin surface. Let the sigma operation be completed directly without the need to let the surface of the target material be plated with a metal layer. The advantages and effects are listed as follows: 1. The active soldering filler developed by the present invention, Directly joining the dry material and the backing plate with low wettability, the device 'is quite convenient to use and saves the process. Can be used in the atmosphere without special protection. Cost and streamline flow. 100118555 Form No. 1010101 Page 11 of 17 1002031260-0 201247353 — 2. The main junction temperature is 15〇. (: to 2 〇〇. (: Between, this is between the low temperature solder temperature and the high temperature solder temperature, can reduce: the problem of the dielectric force, and the temperature range does not fall in the past operation Fan Park' When processing, the new equipment can be directly operated by the original equipment. Addition 3. The material with low wettability can be joined with the back sheet, and the technical characteristics of the product are added to the metal substrate. In particular, the surface reaction of the two to be joined is produced in such a way that (4) the low material «« can be used in the atmosphere without using flux, saving cost and steps. 4. The hybrid soldering of the present invention, The metal substrate of the towel is D gold, which is better than the general solder f ^, tin-zinc lining material, and the joint strength is improved, so that the joint strength is improved. The embodiment discloses the above, but the applicant is familiar with the art, and does not deviate from the present invention: within the scope of the use of 'when a slight change and adjustment can be made, therefore the scope of the second... The definition is final. [Simplified illustration] [0005] [0006] The drawing is the joint of the present invention. Schematic diagram of bonding with active solder filler; The second circle is a schematic diagram of the use process of the active solder filler of the present invention. [Main component symbol description] 10 Active solder filler 20 First joint 21 First joint surface 100118555 Form number A0101 Page 12 of 17 1〇〇2〇3126〇~〇201247353 30 Second joint 31 Second joint surfaceΟ100118555 Form numberΑ0101 Page 13 of 171002031260-0