201245705 六、發明說明： 【發明所屬之技術領域】 本發明係有關於藉由以迄至為了生產元件組裝 所實施之複數個製程中之迴焊製程已結束的基板為 的外觀檢查，判別組裝於基板之各種元件之焊接狀 否適當的方法、及應用該方法之焊接檢查機及檢查秀 【先前技術】 元件組裝基板一般是利用膏狀焊料印刷製程、 組裝製程、及迴焊製程的各製程而產生。在近年來 產線’有引入作成按此等各製程配備檢查機，並將 查機的檢查結果收集至資訊處理裝置後，可對每一 對象比對後加以確認之基板檢查系統的生產線（例如 照專利文獻1 )。 關於迴焊製程後之焊接部位的檢查，廣泛使用 檢查機，該檢查機係利用焊料的鏡面反射性，一面 上方照明檢查對象的基板一面從大致正上拍攝該 後，分析所產生之影像中之反射光像的圖案。例如 專利文獻2，記載藉由將紅、綠、藍之各顏色光分 入射角之範圍相異的方向照射至基板，而利用與這 明光對應之顏色的分布圖案產生表示焊料之傾斜狀 衫像，再根據該顏色的分布圖案判別焊料之圓角的 是否適合。 進而，在專利文獻3，記載著眼於在該專利文 所记載的焊接檢查機中難以將來自影像中之在元件 基板 對象 態是 i統。 元件 的生 各檢 同一 ，參 一種 從斜 基板 ，在 別從 些照 態的 形狀 獻2 的附 -4- 201245705 近傾斜陡峭之處或接近平坦之處的反射光引導至相機之 點的改良發明。具體而言’在專利文獻3所記载的發明 中’除了各顏色的照明光以外’還從沿著相機之光轴的 方向向基板照射紅外光，而產生包含對該紅外光之反射 光像的影像。在影像中之對應於焊接部位的檢查區域， 抽出對應於各顏色光的色區域與對應於紅外光的區域 (紅外光區域），而且抽出因在元件之附近位置對任一種 照明光都未產生反射光像而成為暗區域之處。然後，沿 著各區域所排列之方向抽出區域間的交界位置，再對這 些交界位置套用對應於各照明光的區域所表示之傾斜角 度的範圍之交界的角度’藉此，特定表示圓角之傾斜狀 態的近似曲線。進而，藉由對該近似曲線積分而求得 焊料的潤濕爬昇高度後，判定該高度是否適當。 在焊料印刷製程後的檢查，亦一樣使用一種檢查 機，該檢查機係藉由從大致正上拍攝基板後進行二維影 像處理’而測量在基板上的各接端面之焊料的面積或印 席J位置等。又，亦有利用移相法求得檢查對象部位之三 維形狀或體積的檢查機（例如參照專利文獻4)。 專利文獻 專利文獻1 專利文獻2 專利文獻3 專利文獻4 曰本特許第3966336號公報 曰本特許第3599023號公報 曰本特開20 1 0 — 7 1 844號公報 曰本特開2010-91569號公報 201245705 【發明内容】 [發明所欲解決之課題] 迴焊製程後之以往的檢查係以在迴焊製程之前的各 製程實施適當的處理為前提而實施。可是’實際上，在 焊料印刷製程之焊料的印刷量或印刷位置、元件的組裝 位置等會有不均或隨時間經過的變化’ ®角的傾斜狀態 會因該不均或變化而變動。 / μ「，：用弟圖〜第13圖，說明上述的問題。各 圖係表示對晶片元件301之一側的電極進行迴焊 之焊料之圓角的形狀因迴焊製程前之狀態而不均的模式 圖。在各圖中，300是接端面，3〇1是元件的本體，3〇2 係對應於接端面300的元件電極(未對應 側的元件電極並未圖示）。又，3〇3是迴 之 疋玛知刖的膏狀焊料， ，在利用迴焊製程熔化後所固化的焊料(以下稱為 迴焊後焊料」）。 第1〇圖表示以對比方式表+ — 印刷於姓山 ’、在烊料印刷製程中被 的_ 與迴焊後焊料之圓角 的關係。如該第10圖所示，一般 量婵Λ 、 隨考膏狀焊料303的 篁增加，迴焊後焊料304之圓角 暮灿卜曰^ 幻頂斜變陡峭，而隨著 用狀烊料303的量減少，迴焊後焊 變緩和。 谇枓304之圓角的傾斜 其次，第11圖表示元件301的έΒ壯/ ^ 料304 + , 。，、且4位置對迴焊後焊 十斗304之形狀的影響。在該第u 缺客妝卜圖所不的3個例子，雖 ”，、《狀蛘料3〇3的印刷量是相同 斜蛀—ζ 但疋因為元件301相 對接鸲面30〇的位置相異，所以 处兀件301之電極3〇2 201245705 至接端面300之外側的端邊為止之部分（以下將該部分稱 為「接端面突出部」）的寬度會發生不均。如各二二;， 一般’接端面突出部的寬度愈窄，迴焊後焊料3〇4之圓 角的傾斜愈陡峭，而接端面突出部的寬度愈寬，迴焊後 焊料3 0 4之圓角的傾斜愈緩和。 其次，第12圖及第13圖表示膏狀焊料3〇3相對於 接端面300之印刷範圍的差異對圓角之形狀的影響。在 第1 2圖所示的例子，雖然膏狀焊料3〇3的體積係一樣， 但是在上段的例子，膏狀焊料3〇3被印刷成擴大至接端 面300的約整體，因為對應於接端面突出部之膏狀焊料 3〇3的量相對比較少，所以形成比較緩和的圓角。相對 地^因為下段之例子的膏狀焊料3〇3被印刷於偏向成為 接端面突出部之處，故所形成之圓角的傾斜比上段的例 子陡峭。 装在第1 3圖的例子亦同樣地，膏狀焊料3 0 3的體積一 ^ 但疋因為在上段之例子中膏狀焊料3 0 3被印刷成擴 j至接端面300的約整體，所以與第12圖之上段的例子 樣，形成比較緩和的圓角。相對地，下段之例子的膏 焊料303被印刷成偏向接端面300的中央部，因為 ，端面突出部之焊料與元件電極3。2之下方之焊^ 1不太變化之狀態，所以元件3 0 1亦配置於比上段之例 與向的位置。結果’在迴焊製程，發生焊料向元件3 〇 1 2端面3 0 〇之間的空間流動的現象，在接端面突出部 所+化之焊料的一部分被拉引至元件電極302的下方。 殘留在捿端面突出部的焊料亦被拉往晶片元件30 1 之側，而形成短、傾斜陡峭的圓角。 201245705 如上述之各例所示’迴焊後焊料3 0 4之圓角的形 係因a ί^焊料3 〇 3之印刷狀態或元件3 〇丨之狀態而大 變動。可是，在一般的外觀檢查中，因為利用一面從 上方"，、明焊接部位，一面拍攝進入以正視基板之面的 式所設置的相機之來自焊接部位的反射光的方法產生 —用的知像，所以要得到位於元件的附近之陡峭傾斜 焊料的反射光像是困難的，因此，有無法正確地識別 接部位之圓角的形狀之虞。 又，如第1 1圖之下段的例子或第13圖之下段的 子所不，即使在70件電極302與接端面300之經由迴 後焊料304的接無特別之問題的情；兄，亦在圓角之 度短、陡峭的情況’因為該圓角之大部分作為未產生 射光像的暗區域而出現於影像，戶斤以根據以往的檢查 準’具有判定不良的可能性。. 本發明係著眼於上述的問題，其課題在於高精度 推測在迴焊製程後之某柘的旦彡彳金 ^ 丞板的衫像難以判別狀態之處的 徵後，反映該推測社罢，也丨中卜目, j果判疋焊接狀態，藉此，提高 接狀態的檢查精度。 [解決課題之手段] 本發明係應用於一種焊接檢查方法，該方法係 迄至為了生產元件組裝基板所實施之複數個製程中 焊製程已結束的基板的面配置相機，並使用藉該相 產生之基板的影像，❺查該基板上之元件的焊接狀 在本發明的檢查方法’以在迴焊製程之前所實 複數個製程中之至少一個製程，在下一製程開始之 狀 幅 斜 方 檢 之 焊 例 焊 寬 反 基 地 特 焊 向 迫 所 〇 之 測 -8 - 201245705 量附加於基板的構成為前提，關 關於檢查對象的焊拯 中在相機的影像難以判別狀能* ★ 坪接。P位 %之處的特徵，預先特定命 在迴焊製程之前的測量處理中料 ’尺-、 對與該焊接部位對瘅 所得之測量值的因果關係，龙a ^ τ應之處 ’且錄表示該關係的 係資訊。而且，對迴焊後之成 的因果關 行以下的第1〜第4步驟。 *丨彳立執 在第1步驟，處理影像 位的範圍，而取得表示焊料 在第2步驟，取得在對 焊製程之前的測量處理所得 在第3步驟，係使用關 關係資訊與在第2步驟所取 位中在影像難以判別狀態之 在第4步驟，對在第1 在第3步驟的推測結果後， 若依據該方法，以檢查 產生對照明光之反射光像而 或被元件遮住而無法識別之 資訊，並對這些部位應用第 徵。因此，在第4步驟，藉 徵資料補足該推測處理的結 狀的識別精度，檢查精度亦 此外，因果關係資訊係 統計處理，特定迴焊製程之 狀態與檢查對象之焊接部 中 之包含 檢 查 對 象 之 焊 接 部 之 形狀的 特 徵 資 料 〇 與 該焊接 部 位 對 應 之 處 之 迴 之 測量值 0 於 該焊接 部 位 所 登 錄 之 因 果 得 之測量 值 > 推 測 該 焊 接 部 處 的特徵 〇 步 驟所取 得 之 特 徵 資 料 補 足 判 定焊接 部 位 的 良 不 良 〇 對 象的焊 接 部 位 中 因 無 法 在 影像中 成 為 暗 區 域 之 處 、 處 專為對 象 ， 登 錄 因 果 關 係 3 步驟， 藉 此 J 可 推 測 該 特 由 對藉影 像 處 理 所 取 得 之 特 果 ，而可 提 焊 接 部 位 之 形 提 馬。 利 用使用 相 田 個 數 之 樣 品 的 前 的測量 處 理 之 對 象 部 位 的 包之狀態！ 的 關 係 > 藉 此 可 製 -9- 201245705 作。樣品數愈多，因果關係f訊的可靠产愈古 高在第3步驟的推測精度。因果關係為；：二而可提 迴焊製程之前的測量處理所得之測量值與表八作為將藉 3步驟之推測處理的對象之部位的特徵之Z成為在第 的表’或作為表示兩者之關係的函數而登錄二：予對應 用複數個參數之測量值的情況，亦可登 ，在使 量值的組合導出特徵資料之法則的程式，、作=這些測 資訊。 飞作為因果關係 在該檢查方法之較佳實施形態，作為在迴 前的製程的測量處理，實施對在焊料印刷製程 在基板的各接糙面之烊料的測量。若依據本實施妒離， 即使在因膏狀焊料的印刷量或印刷位置等*焊^焊 料之形狀發生差異的情況，亦以高的正確二: 難以判別狀態之處的料料 ^ ^ ... ^ ^ 、』在知像 处的待徵，而可判定焊接部位的良、 良。 + 在：檢查方法之其他的較佳實施形態，作為在迴焊 製红之刖的製程的測量處 中被印刷在基板的各印刷製程 的各接糕面之膏狀焊料的測量處理、盥 對在70件組裝製程中钽 、，裝在基板之70件的測量處理為前 k ’豆錄表示這些測量處理之測量值的組合、與 象的焊接部位中在相機的影像難以判別狀態之處的特徵 之因果關係的因果關係資訊。 若依據本實施形態，除了膏狀谭料之印刷狀態以外 ，還可根據元件之组驻也.$ ^ ^ ^ . 、、裝狀態，南精度推測在影像難以判 別狀態之處的特撤。_ , 例如’即使貧狀焊料之體積的測量 -10- 201245705 值相同也一樣，在元件之位置、大小、高度等相 況’可使推測結果相異。 作為對被印刷在基板的接端面之膏狀焊料的 理，例如可測量膏狀焊料的體積、面積、高度、 置及印刷範圍中之至少一者。又，作為對組裝在 兀件的測量處理，例如可測量元件之位置、大小 端面之位置關係、高度中之至少一者（測量元件之 由於即使是同一功能的元件亦因廠商不同而有大 的可能性）。 在该檢查方法之其他的較佳實施形態，在第 ，在影像中的焊接部位之元件的附近位置，抽出 特徵s料卻無法取得之處後，在第3步驟推測該 特徵。 若依據本實施形態，推測位於元件的附近並 陡峭而在影像未出現檢查所需之特徵之處的特徵 該推測結果，藉此’可高精度地識別焊料之圓角 〇 其次’本發明之焊接檢查機係以迄至為了生 組裝基板所實施之複數個製程中之迴焊製程已結 板為對象，利用朝向該基板之面而配置的相機拍 板’並檢查所產生的影像中之元件的焊接狀態， 以下的記憶手段、影像處理手段、測量值輸入手 測手段及判定手段。 在5己憶手段，以在迴焊製程之前之製程中之 個製程中，在下一製程開始之前測量附加於基板 異的情 測量處 印刷位 基板之 、與接 大小係 小不均 1步驟 應取得 區域的 因傾斜 ，補足 的形狀 產元件 束的基 攝該基 並具備 段、推 至少一 的構成 201245705 為前提，關於檢查對象的焊接部位中在相 判別狀態之處的特徵，登錄因 〜 係資訊係根據進行特定與在迴焊製=的而該因 w衣枉 < 則的測景. 與該焊接部位對應之處所得之測量值的因果關係之 的結果而設定。 丨荆货、之 影像處理手段係處理影像中之包含檢查對象之 部位的範圍’而取得表示焊料之形狀的特徵資料。 值輸入手段係輸人在對與檢查對象的焊接部位對應 之迴焊製程之前的測量處理所得之測量值。 推測手段係針對檢查對象的焊接部位，使用關 部位登錄在記憶手段之因果關係資訊與測量值輸入 所輸入之測量值’推測該焊接部位中在影像難以判 態之處的特徵。 判定手段係對影像處理手段所取得之特徵資料 推測手段的推測結果後，判定焊接部位的良、不良 若依據上述的構成，執行上述的檢查方法，可 高精度的檢查。此外’迴焊製程之前之測量處理的 值係例如可利用與在迴焊製程之前的製程所設置之 機或保持彳丈该檢查機所輸出之檢查結果資訊的資訊 裝置的通信取得。 本發明之一實施形態的焊接檢查機係更具備： 裝置’係對檢查對象的基板，從入射角度各自相異 數個方向照射光；及攝像控制手段，係藉由在該照 置的照明下使該相機動[產生檢查用的影像。 難以 果關 理對 處理 焊接 測量 之處 於該 手段 別狀 補足 〇 進行 測量 檢查 處理 照明 的複 明裝 -12- 201245705 該實施形態， 果關係資訊係 附近位置且在 的反射光像而 焊料印刷製程 測量值的因果 ，從影像中之 於照明光之反 像中之元件附 象之焊接部位 輸入手段所輸 傾斜角度。判 測之傾斜角度 射光像應用從 料的傾斜角度 角的潤濕爬昇 明裝置係構成 數種顏色光。 自各方向的光 實施形態，在 的照明下拍攝 的反射光像應 的傾斜角度， 影像中之元件 處，亦可高精 進而，在 資訊，而該因 中位於元件之 置之光所產生 、與利用對在 量處理所得之 明光之各方向 範圍抽出對應 抽出產生在影 用關於檢查對 資sfl與測量值 域對應之處的 推測手段所推 明光對應的反 度所算出之焊 焊接部位之圓 此外，昭 1 *、、、 向同時照射複 的方式照射來 若依據該 數個方向之光 接部位所產生 射角度所算出 情況，即使在 成為暗區域之 在記憶手段， 表示該檢查對 影像因無法得 成為暗區域之 中印刷於接端 關係。影像處 包含檢查對象 射光像所出現 近的暗區域。 登錄在記憶手 入之測量值， 定手段係對暗 ’而且對與來 各自對應之照 後’使用這些 是否適當。 為從入射角度 或’亦可構成 0 來自入射角度 ’並在所產生 用從各自.對應 而識別焊料之 的附近有未發 度地推測該處 登錄因果關係 象的焊接部位 到來自照明裝 處的傾斜角度 面之焊料的測 理手段係按照 之焊接部位的 的區域，而且 推測手段係使 段的因果關係 推測與該暗區 區域補足利用 自各方向之照 明光的入射角 傾斜角度判定 各自相異的方 為以依序切換 各自相異之複 之影像中的焊 之照明光的入 圓角的形狀的 生反射光像而 的傾斜角度。 201245705 因此’藉由補足該推測 角之大致整體的形狀， 度。 的傾斜角度，識別焊接部位之圓 而可高精度地判定其潤濕爬昇高 備.η八 |施形態的焊料印刷檢查機係更具 對象二：： 以將條紋狀的圖案影像投影於檢查 :象的基板’及攝像控制手段，係藉由使投 使圖案沿著條紋的排列 κ 期移動一面將該圖案影像投 "而且配合母次投影的時序使相機動作。 進而在本實施形態，在記億手段，登錄因果關係資 況而5亥因果關係資訊係砉千絡氺似& 係表不檢查對象的焊接部位中位 二之附近位置且無法得到圖案影像之反射光像之處 =沾與利用對在焊料印刷製程中印刷於接端面之膏 測量處理所得之測量值的因果關係。影像處理 手段係使用藉在進行圖牵 圖案和像之一個週期份量的投影之 Γ攝像所產生之複數個影像，按包含檢查對象之焊接 七：的範圍内的每個像素’根據在-個週期份量的投影 應杏產生於該像素之党度之變化的相位，測量對應於該 ::的高度。進而’根據該測量結果，抽出表示焊料之 角β之雨度的像素群，而且抽出在元件的附近位置因無 付到党度的變化而無法測量高度的像素群。推測手段 係使用關於檢杳對象$ .埋垃：却> # s—耵象之烊接部位登錄在記憶手段的因果 “訊與測量值輸入手段所輸入之測量值，推測無法 測量高度之像素群的高度。 判定手段係補足利用推測手段對無法測量高度之像 素群所推測的高度後，使用該像素群與表示焊料之圓角 -14- 值，判定焊接部位之圓角的潤 刷檢查機係根據移相法的手法 面將條紋狀之圖案影像投影於 合每次的投影來拍攝，而從按 相位求得在圓角之各點的高度 近的傾斜陡峭之處，雖然因為 案影像的反射光像，所以可能 據本實施形態’可推測使用利 所得的測量值，可推測無法測 ’藉由補足該推測結果，得到 度資料’而可高精度地判定圓 :檢查機，係配備於為了生產 數個製程中的迴焊製程，並檢 檢查機，係配備於迴焊製裎之 查該製程之後的基板；及資訊 各檢查機取入檢查結果資訊， 資訊以可按基板別及檢查對象 理。 具備：相機，係朝向檢查對象 像處理手段，係處理藉該相機 查對象之焊接部位的範圍，而 徵資料。 201245705 的高度之像素群的各高度 濕爬昇是否適當。 該貫施形態的焊料印 ，每次一面使圖案移動一 焊接部位的表面，而且配 照像素單位之亮度變化的 資料。關於圓角中元件附 難以產生投影至該處之圖 無法測量高度，但是若依 用迴焊製程前之測量處理 量高度之處的高度。因此 焊接部位之圓角整體的高 角的潤濕爬昇狀態。 本發明的系統係具備 元件組裝基板所實施之複 查迴焊製程之後的基板； 前的至少一個製程，並檢 官理裝置’係利用通信從 並將各檢查機的檢查結果 部位別讀出的方式進行營 迴焊製程的檢查機係 之基板的面而配置；及影 所產生的影像中之包含檢 取得表示焊料之形狀的特 -15- 裝置係具備以下的各 資訊，該因果關係資 查機之檢查對象的焊 狀態之處的特徵、與 設定，該測量值係藉 檢查機對與該焊接部 得；測量值輸入手段 位對應之處之迴焊製 所得之測量值；推測 ，使用關於該部位登 量值輸入手段所輸入 像難以判別狀態之處 的推測結果傳輸至迴 的檢查機係更具備判 手段所取得之特徵資 測結果後’判定焊接 構成的系統，因為資 檢查機對檢查對象之 檢查對象的焊接部位 的處理’所以可減少 精度的檢查。又，因 實施在資訊管理裝置 的時間。 201245705 資訊管理 登錄因果關係 迴焊製程的檢 影像難以判別 處理的結果而 之前的製程之 測量處理而獲 對象的焊接部 機的測量處理 象的焊接部位 關係資訊與測 接部位中在影 ’將推測手段 迴焊製程 係對影像處理 置所傳輸的推 若依據該 迴焊製程前的 測結果，推測 態之處的特徵 擔’而實施高 始檢查之前， 、缩短焊接檢查 手段：記憶手段，係 訊係根據進行特定該 接部位中在該相機的 測量值的因果關係之 由與利用該迴焊製裎 位對應之處所進行的 ，係輸入在對與檢查 程之前的製程之檢查 手段’係針對檢查對 錄在記憶手段之因果 之測量值，推測該焊 的特徵；及傳輸手段 焊製程的檢查機。 定手段，該判定手段 料補足從資訊管理裝 部位的良、不良。 訊管理裝置分擔根據 焊接部位所進行的推 中從影像難以判別狀 焊接檢查機的計算負 為可在焊接檢查機開 的推測處理，所以可 -16- 201245705 [發明之效果;] 若依據本發明，因為根 狀態或元件的狀態，推測檢 難以判別狀態之處的特徵， 徵資料補足利用該推測處理 焊接部位的良、不良，所以 度。 【實施方式】 據迴焊製程前之膏狀焊料的 查對象的焊接部位中在影像 並對藉影像處理所取得之特 所推測的特徵資料後，判定 可提高對焊接部位的檢查精 第1圖係將基板檢查系統之—實施形態的構成與元 件組裝基板之生產線之整體構成對應地顯示。 在所圖示的生產線，包含悍料印刷製程、元件組 製程及迴焊製程。在焊料印刷製程，設置對基板上之： 接端面（land)塗布膏狀焊料的焊料印刷裝置u或檢查該 裝置11之處理結果的焊料印刷檢查機1〇。在元件組裝 製程，設置將元件組裝於印刷焊料後之基板的組裝機二 或檢查元件之組裝狀態的元件檢查機2〇。在迴焊製程’ 設置使元件組裝後之基板的焊料熔化之迴焊爐檢 查迴焊後之基板的焊接檢查機3〇。基板係沿著圖中之粗 箭號所示之流程依序被送入各裝置，進行處理，藉此， 完成因應於既定規格的元件組裝基板。 3 各製程的檢查機10、20及30係分別經由LAN線路 100相連接。在LAN線路100 ’進一步連接有檢查程式 管理裝置101及檢查資料管理裝置1〇2。在檢查程 理裝置101 ’按各檢查機10、20及30，登錄有將用^執 行根據所預先決定之檢查基準之檢查的檢查程式作為各 種元件的程式庫資料而整理的資料庫。 -17- 201245705 在檢查資料管理裝置102，保存從各檢查機 及30所傳輸的檢查結果資訊。在該檢查結果資訊 各檢查對象部位之好壞的判定結果或為了該判定 之測量結果。檢查結果資訊係構成為可按照各 10、20及30、基板種類及基板上之各個元件種類 例如，可將檢查機之識別碼作為最上階，並按照 識別瑪 '組裝元件之識別碼、檢查區域之識別碼的 組立成階層化之構成的資訊。 此外，檢查程式管理裝置1〇1與檢查資料管 1 02未必要分開，亦可使—台電腦具有各管理裝】 102的功能。相反地，亦可利用複數台電腦構成 裝置 101、102。 在各檢查機10、20及30’在檢查之前，輸 檢查對象基板之構成的資料(例如CAD資料）後， 程式管理裝置101取入適合該輪入資料所示之各 元件種類資訊的程式庫資料，再實施將各元件之 訊與程式庫資料賦予對應的處理。因此，對各檢查 及30設定檢查對象基板之檢查所需的環境。 根據程式庫資料之程式的内容係可因應於使用者 操作而適當地變更。 第2圖表示焊接檢查機30之構成。 本實施例之焊接檢查機30具有控制處理部i 2照明裝置3及基板工作台4等。基板工作台4 水平姿勢支撐檢查對象的基板S，一面使該基板 著各邊的方向移動。相機2係產生彩色影像，並 !〇 ' 2〇 ’包含 所實施 檢查機 讀出。 基板之 順序， 理裝置 L 101 > 各管理 入表示 從檢查 元件的 位置資 機10、 此外， 的設定 、相機 一面以 S在沿 在使光 -18- 201245705 軸朝向大致垂直方向之狀態（正視工作台4上之基板 狀態）配備於基板工作台4的上方。照明裝置3配備 機2與基板工作台4之間。 在照明裝置3 ’包含分別發出紅色光、綠色光 色光的環形光源3R、3G、3B。各光源3R、3G、3B 其各自的中心部對準相機2之光軸的狀態下配置。 各光源3R、3G、3B具有大小彼此相異的直徑，而 最小的紅色光源3R配置於最上面，直徑最大的藍色 3 B配置於最下面’綠色光源3 〇配置於其間。利用 置’對基板S的入射角度範圍因各顏色而異，利用 2,可產生利用與各顏色光對應之三種顏色的分布圖 不迴焊後焊料之傾斜面之傾斜狀態的影像。具體而 由在一色中入射角度範圍最小的紅色光所產生之紅 域表不緩和的傾斜，由在三色令入射角度範圍最大 色光所產生之藍色區域表示陡峭的傾斜。又，由從 光與藍色光之間的範圍所照射之綠色光產生的綠色 表示紅色區域及藍色區域所示之角度範圍之間的角 在控制處理1，包含利用電腦的控制部1 1 〇 輸入部111、攝像控制部112、照明控制部113、, 控制部1 1 4、記憶體i i 5、 硬碟裝置11 6、通信用介3 輸入部U 8及顯示部丨丨9 ^ . t $丨 荨。控制部110係經由； 制口P 1 1 2、照明控制部1 y, y ^ 她 1 3及工作台控制部1 1 4，4 機2、照明裝置3 >5其& 所“ 〇 板工作台4的動作。利用 所產生之影像係在影傻— 入控制部110。、象輪入部1"進行數位㈣ s的 於相 、藍 係在 又， 直徑 光源 該配 相機 案表 言， 色區 的藍 紅色 區域 度範 影像 作台 117、 像控 制相 機2 ，輸 -19- 201245705 在兄憶體1】5，除了伴在胡 外，還暫捭你" 述之控制的程式以201245705 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to an appearance inspection by a substrate which has been completed by a reflow process in a plurality of processes performed up to the assembly of a production component, and is discriminated and assembled. Method for soldering various components of the substrate, and welding inspection machine and inspection show using the same method [Prior Art] The component assembly substrate is generally processed by a paste solder printing process, an assembly process, and a reflow process. produce. In recent years, the production line of the substrate inspection system that has been inspected and equipped with inspection machines according to these processes, and the inspection results of the inspection machines are collected to the information processing device, can be confirmed after each object is compared (for example, According to patent document 1). Regarding the inspection of the welded portion after the reflow process, an inspection machine is widely used. The inspection machine uses the specular reflectivity of the solder, and the substrate on the upper side of the inspection object is imaged from the substantially positive side, and then analyzed in the generated image. A pattern that reflects the light image. For example, Patent Document 2 discloses that a slanted shirt image indicating a solder is generated by a distribution pattern of colors corresponding to the bright light by irradiating the substrate in a direction in which the respective ranges of the incident angles of the respective colors of red, green, and blue are different. Then, based on the distribution pattern of the color, it is discriminated whether or not the fillet of the solder is suitable. Further, Patent Document 3 discloses that it is difficult to apply the object state of the component substrate from the image to the welding inspection machine described in the patent document. The raw materials of the components are the same, and a modified invention is introduced from the oblique substrate to the point where the reflected light of the near-tilt or near-flat point is guided to the camera. . Specifically, in the invention described in Patent Document 3, 'in addition to the illumination light of each color, 'the infrared light is irradiated to the substrate from the direction along the optical axis of the camera, and the reflected light image including the infrared light is generated. Image. In the inspection area corresponding to the welded portion in the image, the color region corresponding to each color light and the region corresponding to the infrared light (infrared light region) are extracted, and the extraction is not generated for any kind of illumination light due to the position near the element. Reflecting the light image and becoming a dark area. Then, the boundary positions between the regions are extracted along the direction in which the regions are arranged, and the angles of the intersections of the ranges of the inclination angles indicated by the regions corresponding to the respective illumination lights are applied to the boundary positions, thereby specifically indicating the rounded corners. Approximate curve of the tilted state. Further, by integrating the approximation curve to determine the wettability of the solder, it is determined whether or not the height is appropriate. In the inspection after the solder printing process, an inspection machine is also used which measures the area or the solder of the solder joints on the respective substrates on the substrate by performing two-dimensional image processing from substantially the front substrate. J position and so on. Further, an inspection machine for obtaining a three-dimensional shape or volume of an inspection target portion by a phase shift method is also known (for example, see Patent Document 4). Patent Document Patent Document 1 Patent Document 2 Patent Document 3 Patent Document 4 Japanese Patent No. 3966336, Japanese Patent No. 3,590, 032, Japanese Patent Laid-Open Publication No. PCT-A No. 2010-91569 201245705 [Description of the Invention] [Problems to be Solved by the Invention] The conventional inspection after the reflow process is carried out on the premise that appropriate processing is performed for each process before the reflow process. However, in fact, the amount of soldering of the solder in the solder printing process, the position of the printing, the position at which the components are assembled, or the like, may vary depending on the unevenness or change. / μ ",: The above problem is explained by the use of the figure - Figure 13. Each figure shows that the shape of the round corner of the solder for reflowing the electrode on one side of the wafer element 301 is not due to the state before the reflow process. In each of the figures, 300 is the end face, 3〇1 is the body of the component, and 3〇2 corresponds to the component electrode of the terminal 300 (the component electrode on the uncorresponding side is not shown). 3〇3 is a cream solder that is returned to the knower, and is soldered after being melted by a reflow process (hereinafter referred to as solder after reflow). The first diagram shows the relationship between the _ and the rounded solder fillet in the contrast printing table + - printed on the surname mountain ', in the printing process. As shown in Fig. 10, the general amount 、 and the 篁 of the solder 303 are increased, and the rounded corners of the solder 304 after the reflowing are sharp and steep, and the 303 is steep with the use of the material 303. The amount is reduced, and the weld is relieved after reflow. Tilt of the fillet of 谇枓304 Next, Fig. 11 shows the entanglement of element 301. , and the effect of the 4 position on the shape of the weld 10 after reflow soldering. In the three examples of the "u" lack of makeup, although "," the amount of printing of 3蛘3 is the same as that of the 蛀-蛀, but because the position of the element 301 is opposite to the contact surface 30〇 The width of the electrode 3〇2 201245705 of the edge member 301 to the end side of the outer surface of the end surface 300 (hereinafter referred to as "the end surface projecting portion") may be uneven. For example, the width of the protrusion of the end face is generally narrower, and the inclination of the round corner of the solder 3〇4 after reflow is steeper, and the width of the protrusion of the end face is wider, and the solder after reflowing is 3 0 4 The slope of the fillet is slower. Next, Fig. 12 and Fig. 13 show the influence of the difference in the printing range of the cream solder 3〇3 with respect to the end face 300 on the shape of the rounded corner. In the example shown in Fig. 2, although the volume of the cream solder 3〇3 is the same, in the example of the upper stage, the cream solder 3〇3 is printed to be enlarged to about the entire end face 300 because it corresponds to the connection. The amount of the cream solder 3〇3 of the end surface projecting portion is relatively small, so that a relatively gentle rounded corner is formed. In contrast, since the cream solder 3〇3 of the example of the lower stage is printed at the position where the deflection is the junction end surface, the inclination of the formed round corner is steeper than the example of the upper stage. Similarly, in the example of Fig. 3, the volume of the cream solder 303 is one. However, in the example of the upper stage, the cream solder 305 is printed to expand to about the entire end face 300. As with the example in the upper section of Figure 12, a relatively gentle fillet is formed. In contrast, the paste solder 303 of the example of the lower stage is printed in the central portion of the offset end face 300 because the solder of the end face projecting portion and the solder electrode 1 below the element electrode 3. 2 are not changed, so the component 3 0 1 is also arranged at a position other than the example of the upper section. As a result, in the reflow process, a phenomenon occurs in which the solder flows into the space between the end faces 3 0 of the element 3 〇 1 2 , and a part of the solder which is + formed at the end face projecting portion is drawn below the element electrode 302. The solder remaining on the projection of the end face of the crucible is also pulled to the side of the wafer member 30 1 to form a short, steeply inclined fillet. 201245705 The shape of the rounded corners of the solder 306 after reflowing as shown in the above examples varies greatly depending on the printing state of the solder 3 〇 3 or the state of the component 3 〇丨. However, in the general visual inspection, it is known that the reflected light from the welded portion of the camera provided in the form of the front surface of the substrate is photographed from the upper side and the welded portion. For example, it is difficult to obtain a reflected light image of a steeply inclined solder located in the vicinity of the element, and therefore, there is a possibility that the shape of the rounded corner of the joint portion cannot be accurately recognized. Further, as in the example of the lower part of FIG. 1 or the sub-section of the third drawing, even if the connection between the 70 electrodes 302 and the end face 300 via the back solder 304 is not particularly problematic; In the case where the degree of the rounded corner is short and steep, the majority of the rounded corner appears in the image as a dark area where the image is not generated, and the household is likely to have a poor judgment according to the conventional inspection. The present invention has been made in view of the above problems, and the object of the present invention is to accurately estimate the fact that the shirt image of a certain 后 彡彳 ^ ^ 后 难以 难以 难以 难以 难以 , , , , , , , 反映In the middle of the eye, the j is judged by the welding state, thereby improving the inspection accuracy of the connection state. [Means for Solving the Problems] The present invention is applied to a welding inspection method which is configured such that a surface of a substrate on which a soldering process has been completed in a plurality of processes for manufacturing a component-mounted substrate is configured with a camera, and the phase is generated by using the phase The image of the substrate is inspected for the soldered shape of the component on the substrate. In the inspection method of the present invention, at least one of the plurality of processes before the reflow process is performed, and the slope of the sample is detected at the beginning of the next process.焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊The feature of the P-bit % is pre-specified in the measurement process before the reflow process, the causal relationship between the measured value of the material and the measured value of the weld, and the dragon a ^ τ should be recorded A departmental information indicating the relationship. Further, the following first to fourth steps are performed for the cause and effect after the reflow. *In the first step, the process proceeds to the range of the image bit, and the obtained solder is obtained in the second step, and the measurement process before the butt welding process is obtained. In the third step, the relationship information is used and the second step is used. In the fourth step of the image in which the image is difficult to discriminate, after the estimation result in the first step and the third step, according to the method, the reflected light image of the illumination light is generated by the inspection or is blocked by the element. Identify the information and apply the levy to these parts. Therefore, in the fourth step, the borrowing data complements the identification accuracy of the knot shape of the speculative processing, and the inspection accuracy is also caused by the causal relationship information system meter processing, the state of the specific reflow soldering process, and the inspection target in the welded portion of the inspection object. The characteristic data of the shape of the welded portion, the measured value of the back of the portion corresponding to the welded portion, the measured value of the cause and effect of the registered portion of the welded portion, and the characteristic data obtained by the feature at the welded portion. In addition, it is determined that the weld site of the welded part is not a dark area in the image, and the cause and effect relationship is registered as a target, so that J can be presumed to be obtained by the image processing. Special fruit, but the shape of the welded part can be lifted. We use the state of the object of the object of the previous measurement of the sample of the number of the fields! The relationship > can be made -9- 201245705. The more the number of samples, the more reliable the causal relationship, the higher the accuracy of the third step. The causal relationship is: 2, the measurement value obtained by the measurement process before the reflow process and the characteristic of the part of the object which is to be treated by the speculation of the 3 steps are taken as the table ' or the Registered as a function of the relationship: In the case of applying a measured value of a plurality of parameters, it is also possible to use a program for deriving the rule of the feature data in a combination of magnitudes, and to make such measurement information. Flying as a causal relationship In a preferred embodiment of the inspection method, as a measurement process of the process before returning, measurement of the contamination of each rough surface of the substrate in the solder printing process is performed. According to the present embodiment, even if the shape of the solder is changed due to the amount of the solder or the printing position of the cream solder, the second is high: the material at the position where it is difficult to discriminate is ^ ^ .. ^ ^ , "At the image of the image, the weld is good and good. In the other preferred embodiment of the inspection method, the measurement processing of the cream solder on each of the cake surfaces of each printing process printed on the substrate in the measurement section of the process of reflow soldering is performed. In the 70-piece assembly process, the measurement processing of 70 pieces mounted on the substrate is the combination of the measurement values of these measurement processes and the position of the image in the soldering portion of the image where the image of the camera is difficult to discriminate. Causal relationship information on the causal relationship of features. According to the present embodiment, in addition to the printing state of the paste-like material, it is also possible to estimate the special withdrawal in the case where the image is difficult to judge according to the group of the component, .., ^, ^, and the state of the device. _ , for example, 'Even if the measurement of the volume of the poor solder -10- 201245705 is the same, the position, size, height, etc. of the component can make the speculation result different. As the paste solder to be printed on the end face of the substrate, for example, at least one of the volume, the area, the height, and the printing range of the cream solder can be measured. Further, as a measurement process for assembling the component, for example, at least one of the position of the measurable element, the positional relationship of the end face, and the height (the component of the measuring element is large due to the difference in the manufacturer due to the same function) possibility). In another preferred embodiment of the inspection method, the feature is estimated in the third step after the feature s material is not extracted in the vicinity of the component of the welded portion in the image. According to the present embodiment, the estimation result of the feature located in the vicinity of the element and steep and the feature required for the inspection does not appear in the image is presumed, whereby the rounded corner of the solder can be accurately identified, and the welding of the present invention is followed. The inspection machine is aimed at the reflow process of the plurality of processes performed for the assembly of the substrate, and the camera clapper is disposed with the face facing the substrate and the welding of the components in the generated image is checked. State, the following memory means, image processing means, measurement value input hand test means and judgment means. In the process of the prior art, in the process of the process before the reflow process, the step of measuring the substrate of the printing substrate attached to the substrate at the measurement level before the start of the next process is determined to be small unevenness 1 In the case of the slanting of the area, the base of the component beam is formed by the base of the component, and the structure of the portion of the welded portion of the inspection object is determined by the 201245705. It is set based on the result of the causal relationship between the measurement value obtained at the corresponding point of the welded portion and the specific position and the re-welding system. In the image processing means, the image processing means processes the range of the portion including the inspection target in the image, and acquires the feature data indicating the shape of the solder. The value input means is a measurement value obtained by the measurement process before the reflow process corresponding to the welded portion of the inspection object. The speculative means estimates the characteristic of the welded portion where the image is difficult to judge in the welded portion of the object to be inspected, using the measured value entered in the memory means and the measured value input by the measured value input. The determination means determines the good or bad of the welded portion after the estimation result of the characteristic data estimation means obtained by the image processing means. According to the above configuration, the above-described inspection method is executed, and the inspection can be performed with high precision. Further, the value of the measurement process before the reflow process can be obtained, for example, by communication with an apparatus set up in a process prior to the reflow process or an information device that maintains inspection information output by the inspection machine. Further, the welding inspection machine according to the embodiment of the present invention further includes: the device is configured to irradiate light to the substrate to be inspected in different directions from the incident angle; and the imaging control means is under the illumination of the illumination Move the camera [to generate an image for inspection. It is difficult to deal with the processing of the welding measurement, and the inspection and processing of the illumination is carried out in this way. -12- 201245705 This embodiment, the relationship information is near the position and the reflected light image and the solder printing process measurement value The causality is obtained from the angle of inclination of the welding part input means of the component attachment in the image in the inverse of the illumination light. The angle of inclination of the illuminating light is applied to the wetting and climbing device using the angle of inclination of the material to form several colors of light. The form of light from all directions, the angle of reflection of the reflected light image under illumination, and the components in the image can be high and fine, in the information, and the light located in the component is generated by By extracting the corresponding extraction in each direction range of the light processed by the amount processing, a circle of the welded portion calculated by the inverse of the light estimated by the speculative means corresponding to the inspection target sfl and the measurement value domain is used. , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , It has to be printed in the dark area and printed in the end relationship. The image contains the dark areas near the image of the inspection object. It is appropriate to use these to register the measured values in the memory, and to determine whether the means is dark and the corresponding photos are used. In order to estimate the welding position of the registered causal image from the angle of incidence or 'may also constitute 0 from the incident angle' and to identify the solder from the respective corresponding to the corresponding one, to the lighting fixture The measuring method of the solder on the inclined angle surface is based on the area of the welded portion, and the speculative means is to make the causal relationship between the segment and the dark region to complement each other by using the angle of inclination of the incident light of the illumination light from each direction. The angle is an inclination angle of the raw reflection light image of the shape of the rounded shape of the illumination light of the welding in the respective different images. 201245705 Therefore, by complementing the shape and degree of the overall shape of the speculative angle. The angle of inclination, the circle of the welded part is identified, and the wetting and climbing of the welding part can be determined with high precision. The solder printing inspection machine of the form of the η8|Shen is more object 2:: to project the striped pattern image into the inspection: The substrate of the image and the imaging control means operate the camera by shifting the pattern of the pattern along the arrangement of the stripes κ, and matching the timing of the parental projection. Further, in the present embodiment, in the case of the signing of the cause and effect relationship, the information of the causal relationship is recorded, and the information relationship between the information and the position of the second part of the welded portion of the object is not checked and the image image cannot be obtained. Where the reflected light image is = the causal relationship between the measured values obtained by the measurement processing of the paste printed on the end face in the solder printing process. The image processing means uses a plurality of images generated by the image capture of the projection pattern and the image of one cycle of the image, and each pixel in the range including the welding object of the inspection object is 'according to the cycle. The projection of the portion of the apricot is generated by the phase of the change in the party's degree of the pixel, and the height corresponding to the :: is measured. Further, based on the measurement result, the pixel group indicating the rain degree of the solder angle ? is extracted, and the pixel group in which the height cannot be measured due to the change in the degree of the party in the vicinity of the element is extracted. The speculative means is to use the measurement value input by the signal and the measured value input means of the memory device's cause and effect. The height of the group is determined by the method of estimating the height of the pixel group that cannot measure the height by using the speculative means, and using the pixel group and the fillet-14-value indicating the solder to determine the fillet of the welded portion. According to the method of the phase shifting method, the stripe-shaped pattern image is projected and projected for each time, and the inclination is steep from the height of each point of the rounded corner by the phase, although the image is According to the present embodiment, it is possible to estimate the measurement result by using the profit, and it is possible to estimate that the circle can be accurately determined by complementing the estimation result and obtaining the degree data: the inspection machine is equipped with In order to produce the reflow process in several processes, and inspect the inspection machine, it is equipped with the substrate after the reflow process to check the process; and the information inspection machine takes in the inspection result The information can be used for the substrate and the inspection object. It is equipped with a camera that is oriented toward the inspection object image processing means, and is used to process the range of the welding site by which the camera is to be inspected, and the data is collected. The height of the pixel group of the height of 201245705 Whether the wet climb is appropriate. The solder print of the form of the pattern moves the pattern on the surface of a welded portion each time, and the data of the brightness change of the pixel unit is matched. It is difficult to produce a projection to the part of the fillet. The height cannot be measured, but if the height of the measurement processing height before the reflow process is used, the high-angle wetting and climbing state of the rounded corner of the welded portion is overall. The system of the present invention is equipped with a component assembly substrate. The substrate after the reflow process; at least one of the preceding processes, and the inspection device's surface of the substrate of the inspection machine system for performing the reflow process by means of communication and reading out the inspection result portions of the inspection machines And the configuration; and the image generated by the image includes a special -15-device having a shape indicating the shape of the solder. Each of the following information, the characteristics and setting of the welding state of the inspection object of the causality checking machine, the measured value is obtained by the inspection machine pair and the welding part; the reflow of the corresponding position of the measured value input means The measured value obtained by the system is estimated to be transmitted to the inspection machine using the estimation result of the position where the image is difficult to discriminate, and the inspection system obtained by the judgment means is used to determine the welding result. Since the system is configured to check the welding position of the inspection object to be inspected, the inspection of the accuracy can be reduced. Also, the time for implementing the information management device is performed. 201245705 Information management registration image of the causal reflow process It is difficult to discriminate the result of the processing and the measurement process of the previous process is obtained, and the welding part relationship information of the measurement processing image of the welding machine of the object is obtained, and the image of the measurement part is transmitted by the image reprocessing process. According to the test results before the reflow process, the characteristics of the speculation state are implemented Before the initial inspection, the welding inspection means is shortened: the memory means is based on the cause of the causal relationship between the measurement values of the camera in the specific connection portion and the position corresponding to the use of the reflow control system. The inspection means of the process before the inspection and inspection process is based on the measurement of the cause and effect of the memory means, and the characteristics of the welding are presumed; and the inspection means of the welding process of the transmission means. By means of the means, the means of judgment is intended to complement the good and bad of the information management equipment. The communication management device shares the calculation of the welding inspection device based on the welding position, and the calculation of the welding inspection machine is an estimation process that can be opened in the welding inspection machine. Therefore, the invention can be used in the welding inspection machine. Because of the root state or the state of the component, it is estimated that it is difficult to discriminate the feature at the state, and the data is compensated for the goodness and the poorness of the welded portion by the estimation. [Embodiment] According to the characteristic data estimated by the image and processed by the image processing in the soldering portion of the cream solder before the reflow process, it is judged that the inspection of the welded portion can be improved. The configuration of the substrate inspection system as an embodiment is displayed in correspondence with the overall configuration of the production line of the component assembly substrate. In the illustrated production line, it includes a printing process, a component group process, and a reflow process. In the solder printing process, a solder printing apparatus u on which a paste-like solder is applied to a substrate, or a solder print inspection machine 1 which inspects the processing result of the apparatus 11 is provided. In the component assembling process, an assembly machine 2 for assembling the components to the substrate after printing the solder or a component inspection machine 2 for inspecting the assembled state of the components is provided. In the reflow process, a reflow oven for melting the substrate after assembly of the components is set to inspect the post-weld welding inspection machine 3〇 of the substrate. The substrate is sequentially fed into each device along the flow indicated by the thick arrow in the figure, and processed to complete the assembly of the substrate in accordance with the predetermined specifications. 3 The inspection machines 10, 20, and 30 of each process are connected via a LAN line 100, respectively. The inspection program management device 101 and the inspection data management device 1〇2 are further connected to the LAN line 100'. In the inspection program device 101', each of the inspection machines 10, 20, and 30 registers a database in which the inspection program for executing the inspection based on the predetermined inspection standard is stored as the library material of each component. -17- 201245705 The inspection data management device 102 stores the inspection result information transmitted from each inspection machine 30. In the result of the inspection, the result of the determination of the location of each inspection object or the measurement result for the determination. The inspection result information is configured such that each of the 10, 20, and 30, the type of the substrate, and the type of each component on the substrate can be used, for example, the identification code of the inspection machine can be regarded as the uppermost level, and the identification code and the inspection area of the component are assembled. The identification of the identification code constitutes a layered information. Further, the inspection program management device 101 and the inspection data pipe 102 are not necessarily separated, and the computer can have the functions of the respective management devices 102. Conversely, the devices 101, 102 can also be constructed using a plurality of computers. After the inspection machines 10, 20, and 30' are inspected and the data (for example, CAD data) of the inspection target substrate is transferred, the program management device 101 takes in a library suitable for each component type information indicated by the wheeled data. For the data, the processing of assigning the information of each component to the library data is implemented. Therefore, the environment required for the inspection of the inspection target substrate is set for each inspection and 30. The contents of the program based on the library data can be appropriately changed in response to user operations. Fig. 2 shows the configuration of the welding inspection machine 30. The welding inspection machine 30 of the present embodiment includes the control processing unit i 2, the illumination device 3, the substrate stage 4, and the like. The substrate stage 4 supports the substrate S of the inspection object in a horizontal posture, and moves the substrate in the direction of each side. Camera 2 produces a color image and !〇 ' 2〇 ' contains the check machine that is implemented. In the order of the substrates, the management device L 101 > each management indicates the position of the device 10 from the inspection device, and the setting of the camera is on the side of the camera with the S in the direction of the light -18-201245705. The substrate state on the stage 4 is provided above the substrate stage 4. The illuminating device 3 is provided between the machine 2 and the substrate table 4. The illumination device 3' includes ring light sources 3R, 3G, and 3B that respectively emit red light and green light color. Each of the light sources 3R, 3G, and 3B is disposed in a state in which its center portion is aligned with the optical axis of the camera 2. Each of the light sources 3R, 3G, and 3B has a diameter different from each other, and the smallest red light source 3R is disposed at the uppermost portion, and the blue 3B having the largest diameter is disposed at the lowermost position, and the green light source 3 〇 is disposed therebetween. The range of the incident angle with respect to the substrate S varies depending on the color, and by using 2, it is possible to generate an image in which the distribution pattern of the three colors corresponding to the respective color lights is not tilted after the solder is tilted. Specifically, the red field generated by the red light having the smallest incident angle range in one color exhibits a gentle tilt, and the blue region generated by the maximum color light in the three-color incident angle range indicates a steep tilt. Further, the green color generated by the green light irradiated from the range between the light and the blue light indicates the angle between the angular range indicated by the red region and the blue region. In the control process 1, the control unit 1 1 using the computer is included. The input unit 111, the imaging control unit 112, the illumination control unit 113, the control unit 141, the memory ii5, the hard disk device 117, the communication medium input unit U8, and the display unit 丨丨9 ^ . Hey. The control unit 110 is via the port P 1 1 2, the illumination control unit 1 y, y ^ 13 and the table control unit 1 1 4, 4 machine 2, the illumination device 3 > 5 & The operation of the workbench 4. The image generated by the use is in the shadow control unit 110. The image is inserted into the control unit 110. The digits of the (4) s phase, the blue system, and the diameter of the light source. The blue-red regional image of the district is used as a platform 117, like the control camera 2, the lost -19-201245705 in the brothers and minds 1] 5, in addition to accompanying Hu, also suspend you "
Lir 對象的影像資料或計算結果等。在 硬碟裝置11 6，保存招撼你认太 < 丄 供之"廑m 程式管理裝置101所提 供私式庫身科的檢查程式群、在檢查過程所得 資料及檢查結果、檢查所使用之影像等。 ' 通信用介面U7係用以經由上述的lan線路1〇〇虚 ”他裝置進行通信。輸人部118係使用在指定檢查之開 始或結束的操作或各種設定資料的輸入。顯示告" 用以顯示使用於檢查結果或檢查之影像。 ’、 其次’第3圖表示焊料印刷檢查機1〇之構成。此外， 在該第3圖，利用對與第2圖相同之符號附加a的 表示對應於第2圖的構成。 7 該焊料印刷檢查機10係根據移相法的原理測量被 印刷在基板S的接端面之焊料的高度，除了控制處 1A、相機2A、照明裝置3A及基板工作台4a以外，還 具有用以將條紋狀的圖案影像投影於基板的投影器 又，該檢查機10的照明裝置3A係由發出白色光的環形 光源3M所構成。在控制處理部1A，除了與焊接檢查機 30之控制處理部1相同的構成以外，還設置投影哭杵 部120。 ’、〆口口卫制 關於元件檢查機20，因為具有與焊接檢查機3〇 致相同的構成，所以省略圖示。但，在焊料印刷檢查 1 0 ’亦可將照明裝置3的光源設成白色光源。 — 的影像檢測 再根據其剛 在元件檢查機20’從檢查對象之基板s 出基板上的元件後’測量其位置或傾斜等， 量結果，判定元件之組裴狀態是否適當。 -20- 201245705 又’作為元件檢查機20’亦可使用與第3圖所示之 焊料印刷檢錢1〇為相同構成的農置。在此情況，除了 兀件之組裝位置或姿勢的檢查以外，還可檢查元件及元 件電極之高度或元件相對於垂直方向的傾斜等。 雖然該3種檢查機1G、2G、3G巾，焊料印刷檢查機 10與元件檢查機20係進行中間製程的檢查，但是即使 在每些檢查判定為不良，亦有利用以後之製程的處理改 善。口質的情況。因此’在很多現場，不用將在焊料印刷 檢查機1 0或元件檢查機20被判定為不良的基板從生產 線卸除’而可容許該等基板向後段流動。 另一方面，在設置於最後之迴焊製程的焊接檢查機 3〇，為了避免遺漏不良，需要進行嚴密的判定。可是， 若依據第2圖所示之焊接檢查機3〇之光學系的構成，因 為比根據入射角度最大的藍色光所表示的傾斜角度範圍 陡峭的傾斜面無法得到表示該傾斜角度的反射光像，而 成為暗區域，而難識別迴焊後焊料之圓角的全形狀。尤 其，在元件之附近位置的暗區域大的元件、或因為圓角 短而傾斜陡峭而在焊接部位幾乎不會發生色彩之分布的 元件，即使實際之悍接狀態良好，在僅根據影像處理之 結果的判定中，亦不得不判定為不良。 因此’在本實施例，作成在利用焊接檢查機3〇檢查 時’讀出其他的檢查機1〇、20對檢查對象之與焊接部位 對應的位置已實施之測量處理的結果後，根據該測量值 推測焊接部位之暗區域的傾斜角度，為了該推測處理， 字預先對各元件種類使用相當個數的樣品所導出的推測 -2 1- 201245705 用表登錄於焊接檢查機3〇的記憶體115或硬碟裝置 11 6。該推測用表係包含於上述之各元件種類的程式庫資 料’並由檢查程式管理裝置101所提供。 第4圖係以利用焊料印刷檢查機1 〇之測量結果進行 該推測處理的情況為例，將關於焊接檢查之裝置間的關 係與資訊的流程-起顯示。在本例，除了焊接檢查機3〇 及焊料印刷檢查機10以外，檢查程式管理裝置ι〇ι及檢 查資料管理裝置102參與焊接檢查。 攒笪程式管理裝 直1 W 1你蚵谷檢查機1 V；、π從伢囚 應於各機型的檢查程式。這些程式係對按S件種類，根 據屬於該元件種類之元件的檢查基準所製作，並登錄於 檢查程式管理裝晋！ 0丨於也# 4 + b 置1〇1作為程式庫資料。具體而言，在 本例’在焊料印刷檢查们〇,提供用以實施被印刷在接 端面之焊料的體積之檢查的檢查程式(第4 _ 接檢查機30,提供用以實施焊接部位之 濕爬昇高度之檢查的檢查程式(第 接檢查機％，提供㈣㈣㈣以 = 使用的推測用表（第4圖⑷）。 ^ ^ ^ 焊料印刷檢杳機丨 在檢查料之基板檢查程式，測量 後，判定測量值端面所印刷之焊料的體積 置則輸包含二端：良：然後，向檢查資料管理褒 接鸲甶之測量值的檢杳 圖⑷)。檢查資料管理裝置1〇2係 ：、，。果“(第4 以可按基板別及元件％ 的檢查結果資訊 件別續出的形式加以儲存。 -22- 201245705 焊接檢查機3 0亦根樯a 士 ^ ^ ^ 據所提供之檢查程式’測量在檢 一對象之基板S的各接端^ 、， ％面之迴焊後焊料的潤濕爬昇高 ::β疋測I值的良、不良，然後，向檢查資料管理 02傳輸包含測量值的檢查結果資訊(第4圖⑷)。 在焊接仏查機3 〇的剛量處理，除了從檢查對象的影 像檢測出紅、綠、輳之夂α _ 瓦 < 各色區域或元件以外，還檢測出 ;兀件附近的暗區域，並推測與該暗區域對應之處的 頁斜角度。然後’對暗區域補足該推測結果，同時對各 色區域應用從各自對應之彩色光的人射角度所算出的傾 斜角度，從包含暗區域之各區域的分布狀態與對應於各 區域之傾斜角度的關係’測量迴焊後焊料的潤濕爬昇高 度。 在對暗區域的推測處理中，對檢查資料管理裝置i 進仃存取’而讀人在焊料印刷檢錢1G檢查檢查對象之 與基板S之處理中的焊接部位對應的接端面時所求得之 焊料的體積（第4圖⑴）。χ，根據在本身裝置之元件或 接端面的檢測結果，求得接端面突出部的宽度（從元件之 =邊至接端面之外側的端邊的距離。以下稱為「接端面 :士寬度」）後，#由根據該接端面突出寬度與從檢查資 料管理裝置1 02所得之焊料的體積比對推測用表，而推 測與暗區域對應之處的傾斜角度。 第5圖（1)係表示被登錄於焊接檢查機3〇之推測用 表之構成的模式圖。該推測用表係藉由按各元件種類使 用相當個數之樣品的統計處理所製作，並鱼、 起儲存於程式庫資料。在第5圖⑴之例子的推測= -23- 201245705 係以元件附近的傾斜面比與藍色 陡惰的圓角為對象，將各個元 沾〜之角 5組gl〜g5,按各組gl〜g5，表示在屬於 角 料的體積與接端面突丨$ ； S" 'a ^ 丧而面犬出寬度之值之組合的八 之’根據焊料的體積與接端面突刀 參照該推測用表，藉此，可得知根Si:: 角之凡件附近的傾斜角度包含於組以〜㈡之 此外’如第5圖（2)所示，在各組g 、 既定寬度的角度範圍’屬於組§1的角度最大， 按照g2、g3、g4、g5的順序變小。 雖然該推測用表之製作所使用的樣品是根 的基板所得之資料，但是未限定於此。例如， 模擬的手法，求得從各種體積之焊料所得的圓 並測量該圓角中在影像可成為暗區域之範圍 度，藉此，亦可得到多個樣品。 以下，說明利用第4圖所示的檢查程式在 10、30所實施之檢查的具體内容。 首先’雖然是焊料印刷檢查機1 〇的檢查， 料印刷檢查機1 0，利用以根據移相法之原理的 為基礎的處理，算出焊料的體積。在三維測量 數次的投影為一個循環，對線條狀的圖案影像 面將條紋逐次移動既定量，一面從投影器5投 S的處理，同時配合每次投影的時序，利用相機 —個循環份量的投影及攝像結束時，將利用各 所付之影像中之檢查區域（按各接端面設定）内 度範圍更 度分類成 樣品之焊 布。換言 的組合， 產生的圓 中一組。 各自包含 以下角度 據從實際 利用流體 角形狀， 的傾斜角 各檢查機 但是在焊 三維測量 中，以複 ，執行一 影至基板 2 A拍攝。 次的攝像 的各像素 -24- 201245705 逐一作為對象，檢測出每次攝像之亮度 化作為一個週期份量的正弦波，求得正 而’應用根據對處理對象的像素所算出 像的投影面及相機2A與所預先決定之 板對應之高度的面）的關係之三角測量， 與處理對象之像素對應的點之距離。該 理對象的像素對應之點的高度。 又’除了該處理以外，在焊料印刷 明部3的白色照明下拍攝後，從所產生 區域檢測出焊料的顏色。然後，藉由將 料之顏色的像素所算出之高度資料積分 體積。 利用上述的方法算出焊料的體積後 查機1〇’藉由比較該體積與按各檢查區 值，而分類成「適當」、「焊料過多」 之3組的其中一組。但，搭載被判定為 知料過少」之焊料的基板亦往後製程 其次’說明焊接檢查機30之檢查戶乃 在本實施例的焊接檢查機3〇，因為 相異的方向將紅、綠、藍之各顏色光照 以利用對迴焊後焊料的傾斜面所照射之 反射光中射入相機2的光，可產生利用 顏色的分布圖案表示迴焊後烊料之傾斜 像中之各色區域表示與各自對應之照明 致相同的傾斜角度。在本實施例，使用 的變化，將該變 弦波的相位。進 之相位或圖案影 基準面（例如與基 异出從基準面至 距離係表示與處 檢查機1 〇，在照 之影像中的檢查 對被檢測出該焊 ’而求得焊料的 ，在焊料印刷檢 域所登錄之標準 、「焊料過少」 「焊料過多」、 流動。 '需的測量處理。 分別從入射角度 射至基板S，所 光各顏色光的正 紅、綠、藍之各 狀態的影像。影 光的入射角度大 各色區域與傾斜 -25- 201245705 角度範圍的關係及對暗區域 ,m $所推測之傾斜角度，利用第 6圖所示的方法測量迴焊後 >丄— 便斗枓的潤濕爬昇高度。此外， 在本貫施例’將紅色區域 _ 4所表不的傾斜角度範圍設為 8〜15度，將綠色區域所表 ^表不的傾斜角度範圍設為15〜25 度’將藍色區域所表示的彳g奴 的傾斜角度範圍設為25〜38度。 在第6圖，以晶片分乂斗 ^ 件200為例，將連接該晶片元 件200之電極201與接竑而 面203之迴烊後焊料之圓角202 的模式圖、與拍攝該圓角2 L ^ ^ 月202所得之影像的模式圖上下 地賦予對應。在影像的模 ^ ± _ 镇式圖’利用各自相異的塗布圖 案表示各色區域。 在本實施例，對影傻中 _ —_ y像中包含兀*件200之整體的範圍Image data or calculation results of Lir objects. In the hard disk device 11 6, the inspection program group of the private library provided by the program management device 101, the data obtained during the inspection process, the inspection result, and the inspection are used. Image and so on. The communication interface U7 is used to communicate with the device via the above-described lan line 1. The input unit 118 uses an operation at the beginning or end of the designated inspection or input of various setting materials. The image used for the inspection result or the inspection is displayed. ', Next' Fig. 3 shows the configuration of the solder print inspection machine 1 . In addition, in the third figure, the same symbol as in the second figure is added to the corresponding expression of a. The configuration of Fig. 2 shows that the solder print inspection machine 10 measures the height of the solder printed on the end face of the substrate S in accordance with the principle of the phase shift method, except for the control unit 1A, the camera 2A, the illumination device 3A, and the substrate stage. In addition to 4a, there is a projector for projecting a stripe pattern image onto a substrate, and the illumination device 3A of the inspection machine 10 is constituted by a ring light source 3M that emits white light. In addition to welding with the control processing portion 1A In addition to the same configuration of the control processing unit 1 of the inspection machine 30, a projection crow portion 120 is provided. ', the mouthpiece manufacturing system is the same as the welding inspection machine 3 because it is identical to the welding inspection machine 3. Therefore, the illustration is omitted. However, in the solder print inspection 10', the light source of the illumination device 3 can also be set as a white light source. - The image detection is based on the substrate s of the inspection object immediately after the component inspection machine 20' After measuring the position or tilt of the component on the substrate, the result of the measurement determines whether the component is in the proper state. -20- 201245705 Also, as the component inspection machine 20, the solder print inspection shown in Fig. 3 can be used. In this case, in addition to the inspection of the assembly position or posture of the element, the height of the element and the element electrode or the inclination of the element with respect to the vertical direction can be checked, etc. Although the three types of inspections In the machine 1G, 2G, and 3G, the solder print inspection machine 10 and the component inspection machine 20 perform the intermediate process inspection. However, even if it is determined to be defective in each inspection, there is a case where the processing by the subsequent process is improved. Therefore, 'on many sites, it is not necessary to remove the substrate that is determined to be defective in the solder print inspection machine 10 or the component inspection machine 20 from the production line' and allow the substrates to flow to the rear stage. On the other hand, in the welding inspection machine 3 installed in the last reflow process, in order to avoid the omission of defects, it is necessary to make a strict judgment. However, according to the optical inspection system of the welding inspection machine 3 shown in Fig. 2 In the configuration, since the inclined surface having a steep inclination angle range indicated by the blue light having the largest incident angle cannot obtain the reflected light image indicating the oblique angle, it becomes a dark region, and it is difficult to recognize the full shape of the round corner of the solder after the reflow. In particular, a component having a large dark area at a position near the element, or an element having a sharp inclination due to a short rounded corner and having little color distribution at the welded portion, even if the actual splicing state is good, is based only on image processing. In the determination of the result, it is also determined to be defective. Therefore, in the present embodiment, when the inspection is performed by the welding inspection machine 3, the other inspection machines 1 and 20 are read and the inspection target corresponds to the welded portion. After the result of the measurement processing that has been performed at the position, the inclination angle of the dark portion of the welded portion is estimated based on the measured value, for the estimation process, the word pre- Predicted by using a considerable number of samples for each component type - 2 1- 201245705 The memory 115 or the hard disk device 11 6 of the welding inspection machine 3 is registered in the table. This estimation table is included in the library information of each of the above-described component types and is provided by the inspection program management device 101. Fig. 4 shows an example in which the estimation process is performed by using the measurement result of the solder print inspection machine 1 , and the relationship between the devices for welding inspection and the flow of information is displayed. In this example, in addition to the welding inspection machine 3 and the solder print inspection machine 10, the inspection program management device ι〇 and the inspection material management device 102 participate in the welding inspection.攒笪 Program management installation 1 W 1 Your Shibuya inspection machine 1 V;, π from the prisoner should be inspected in each model. These programs are created based on the type of S, based on the inspection standards of the components belonging to the component type, and are registered in the inspection program management package! 0丨于也# 4 + b Set 1〇1 as the library data. Specifically, in this example, in the solder printing inspection, an inspection program for performing inspection of the volume of the solder printed on the end face is provided (the fourth inspection machine 30 provides the wetness for performing the welding portion). The inspection program for the inspection of the climb height (the first inspection machine, the (4) (4) (4) is used to = the speculation table used (Fig. 4 (4)). ^ ^ ^ The solder printing inspection machine 基板 in the substrate inspection program of the inspection material, after the measurement, It is determined that the volume of the solder printed on the end face of the measured value includes two ends: good: then, the inspection data of the inspection data is connected to the inspection map (4)). The inspection data management device 1〇2 is:, "The 4th can be stored in the form of the substrate and component % inspection results. -22- 201245705 Welding inspection machine 30 is also based on a ^ ^ ^ ^ According to the inspection program provided 'Measure the wettability of the solder after the reflow of the % surface of the substrate S of the object to be inspected, and the weld of the % of the surface of the substrate is measured: β is measured as good or bad, and then transmitted to the inspection data management 02. Value inspection result information (Fig. 4 (4)) The welding process of the welding inspection machine 3 , detects the red, green, and 辏 α _ 瓦 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 Predict the page inclination angle corresponding to the dark area. Then 'fill the dark area to the estimation result, and apply the inclination angle calculated from the angle of the person's corresponding color light to each color area, from the dark area The relationship between the distribution state of the region and the inclination angle corresponding to each region 'measures the wetting creep height of the solder after reflow. In the speculative processing of the dark region, the inspection data management device i enters the access' while the person is reading The solder printing check 1G checks the volume of the solder obtained when the end face corresponding to the welded portion in the processing of the substrate S is inspected (Fig. 4 (1)). χ, according to the detection of the component or the end face of the device itself As a result, the width of the end face projecting portion (the distance from the edge of the element to the edge of the outer side of the joint end face. Hereinafter referred to as the "end face: the width of the groove") is obtained, and # is based on the end face. The width is compared with the volume of the solder obtained from the inspection data management device 102, and the estimation angle is estimated, and the inclination angle corresponding to the dark region is estimated. Fig. 5 (1) shows that the welding inspection machine 3 is registered. A pattern diagram of the composition of the table is estimated. The estimation table is created by statistical processing using a considerable number of samples for each component type, and is stored in the library data. In the example of Fig. 5 (1) Speculation = -23- 201245705 For the angle of the inclined surface near the component and the rounded corner of the blue, the five elements gl~g5 of each element are smeared to the corner, and each group is gl~g5, indicating that it belongs to the corner material. The volume and the end face are abruptly $; S" 'a ^ The combination of the value of the width of the face dog's width is based on the volume of the solder and the end face knives refer to the speculation table, thereby knowing the root Si:: The angle of inclination of the corners of the corners is included in the group by ~(2). As shown in Fig. 5 (2), the angle range of each group g, the predetermined width is the largest in the group §1. The order of g2, g3, g4, and g5 becomes small. Although the sample used in the production of the speculation table is the data obtained from the substrate of the root, it is not limited thereto. For example, in a simulation method, a circle obtained from various volume solders is obtained and a range in which the image can be a dark region in the fillet is measured, whereby a plurality of samples can be obtained. Hereinafter, the details of the inspection performed at 10 and 30 by the inspection program shown in Fig. 4 will be described. First, the inspection of the solder print inspection machine 1 is performed, and the material inspection machine 10 calculates the volume of the solder by a process based on the principle of the phase shift method. The projection of the three-dimensional measurement is a cycle, and the stripe pattern image surface is moved successively by the amount of the image, and the processing is performed from the projector 5, and the timing of each projection is used, and the camera is used as a cyclic component. At the end of projection and imaging, the inner range of the inspection area (set by each end face) in each of the images to be paid is more classified into the sample of the welding cloth. In other words, the combination of the resulting set of circles. Each includes the following angles from the actual use of the angular shape of the fluid, the angle of the inspection machine, but in the welding three-dimensional measurement, to perform a shadow to the substrate 2 A. Each of the sub-pixels-24-201245705 is detected as a target, and the sine wave of each cycle is detected as a periodic component, and the projection surface and the camera based on the image calculated by the pixel to be processed are applied. The triangulation of the relationship between 2A and the surface of the height corresponding to the predetermined plate, and the distance from the point corresponding to the pixel of the processing target. The height of the point corresponding to the pixel of the object. Further, in addition to this processing, after the image was taken under the white illumination of the solder printing portion 3, the color of the solder was detected from the generated region. Then, the height data calculated by the pixels of the color of the material is integrated into the volume. After the volume of the solder is calculated by the above method, the inspection machine 1' is classified into one of three groups of "appropriate" and "excessive solder" by comparing the volume with each inspection zone value. However, the substrate on which the solder which is judged to be too little is used is also processed in the subsequent process. Next, the inspection of the welding inspection machine 30 is described in the welding inspection machine of the present embodiment, because the different directions will be red, green, The illumination of each color of the blue light is generated by the light reflected into the camera 2 by the reflected light irradiated by the inclined surface of the solder after the reflow, and the distribution pattern of the color is used to indicate the representation of each color region in the oblique image of the post-reflow soldering material. The respective illuminations result in the same tilt angle. In this embodiment, the change is used to change the phase of the sine wave. The phase or pattern shadow reference plane (for example, the base is different from the reference plane to the distance indicating the inspection machine 1 〇, the inspection in the image is detected to detect the weld ', and the solder is obtained. The standard registered in the inspection area, "too little solder", "excessive solder", and flow. 'Required measurement processing. Images that are incident on the substrate S from the incident angle, respectively, in the positive red, green, and blue states of the light of each light. The angle of incidence of the shadow light is large, the relationship between the color regions and the tilt range -25, 201245705, and the tilt angle of the dark region, m $ , measured by the method shown in Fig. 6 after reflowing > 丄 - 便The wetting creep height of the crucible. In addition, in the present example, the range of the inclination angle indicated by the red area _ 4 is set to 8 to 15 degrees, and the range of the inclination angle of the green area is set to 15~ The angle of inclination of the 彳g slave represented by the blue area is set to 25 to 38 degrees. In Fig. 6, the wafer separation device 200 is taken as an example to connect the electrode 201 of the wafer component 200 with After the 203, the solder is returned The pattern diagram of the fillet 202 is correspondingly assigned to the pattern diagram of the image obtained by photographing the rounded corner 2 L ^ ^ 202. In the image of the image, the pattern of the image is represented by different coating patterns. In the present embodiment, the range of the entire 200* member 200 is included in the shadow ___y image.
s5i疋元件用的檢查區域丨夫P 匕场•（禾圖不）並檢測出晶片 Γ杳Λ且對各接端面203設定檢查區域f，並檢測出該 檢查區域F内的紅區域、綠區域、藍區域。在如第6圖 所示之形狀之圓角的与推 Α 木〇圖 两的〜像，一般沿著從接近影像 端面202的外側端邊夕_分-从％ ^接 味遺之處在兀件電極2〇1的方向， 按照紅、綠、藍的順庠八 顏色 友耵m序为布。又，在接近元件2〇〇 有時會產生表示超過能 (過此以藍區域表示的範圍之陡 斜面的暗區域。 1貝 利用上述之景’像的特徵，在本實施例在檢查 F内找到包含暗區域< 4個色區域所分布的方向，沿二 〇亥方向<•又定測量線L，並在該測量線L，抽出位於各色區 域之交界的點A2、A3、A4及與紅區域之外側的端邊的 交點A1。進而，根據元件的檢測結果抽出測量線乙與 元件電極201之端邊的交點A5(暗區域的端點）。 -26- 201245705 對所抽出之點中除了點 該點的傾斜角《。雖然在各色二外的各點，套用對應於 具有某程度之範圍，但是所示的傾斜角度各自 不各個色區域所示之傾斜自许 罝衣 由m 针角度範圍之交界值附近的角 度。因此，在本實施例，根攄前 根據則面之舉例所示的傾斜角 ，圍’分別對點^套用8度，對點a2套用15度角 對點A3套用25度，對點A4套用w度。 邊的在本實施例，求得從點A5至接端面之外側端 邊的距離，作為接端面突屮宮 ”官“然後’根據該接端面 大出寬度的測量值與預先從檢查資料管理裝置ι〇2 入之焊料的體積（利用焊料印刷檢查肖㈧對與現在處理 中之焊接部位對應的接端面所測量者）的組合，比對第$ 圖⑴所示的推測用表’而特定適合該組合的角度例 如’將與焊料的體積和接端面突出寬度之組合對應的电 所不之角度範圍中的中間值，或角度範圍的下限值作為 0 X)。然後，對點A5套用該角度θ X。The inspection area for the s5i疋 element is used to detect the wafer Γ杳Λ and the inspection area f is set for each of the joint end faces 203, and the red area and the green area in the inspection area F are detected. , blue area. In the shape of the rounded corner as shown in Fig. 6, the image of the two sides of the ruthenium is generally along the outer edge from the outer side of the image end surface 202. The direction of the electrode 2〇1 is in accordance with the order of red, green and blue. Further, in the proximity element 2, a dark region indicating a steep slope which exceeds the range indicated by the blue region may be generated. The feature of using the above-described scene image is in the inspection F in the present embodiment. Find the direction in which the dark areas < 4 color areas are distributed, and along the direction of the second sea, <• determine the measurement line L, and at the measurement line L, extract the points A2, A3, A4 at the boundary of the color areas and The intersection point A1 with the end side of the outer side of the red area. Further, the intersection point A5 (the end point of the dark area) of the measurement line B and the end side of the element electrode 201 is extracted based on the detection result of the element. -26- 201245705 In addition to the point of inclination of the point ". Although the points outside the two colors, the application corresponds to a certain extent, but the angles of inclination shown are not the respective color areas shown by the tilt of the self-propelled clothes by the m needle The angle in the vicinity of the boundary value of the angular range. Therefore, in the present embodiment, the inclination angle shown by the example of the surface of the front surface is 8 degrees for the point, and 15 degrees for the point a2. Apply 25 degrees and apply w degrees to point A4. In the present embodiment, the distance from the point A5 to the outer side edge of the end face is obtained, and the measured value of the width of the joint end face is then used as the front end from the inspection data management device. 2 The combination of the volume of the solder (measured by the solder print inspection (8) for the end face corresponding to the solder joint in the current process) is compared with the speculation table shown in Fig. (1) and is specifically suitable for the combination. The angle is, for example, 'the intermediate value in the range of the angle of the electric power corresponding to the combination of the volume of the solder and the protruding width of the end face, or the lower limit of the range of angles is 0 X). Then, the angle θ X is applied to the point A5.
然後，如第6圖之右邊的圖形所示，從各點Ai〜M 的f標與對各點A1〜A5所套用之角度的關係，導出表干 :者測量線L之傾斜角度的變化的近似曲線M。進而， =㈣近似曲線Μ之從點A1至點範圍所含的各Then, as shown in the graph on the right side of Fig. 6, the relationship between the f-marks of the respective points Ai to M and the angles applied to the respective points A1 to A5 is derived, and the change in the inclination angle of the measurement line L is derived. Approximate curve M. Furthermore, the =(iv) approximation curve Μ varies from point A1 to the range of points
Hi:算出與點A5對應之焊料的高度，將其作為壇 焊後焊料的潤濕爬昇高度。 雖然在各色區域所示的傾斜角度各自有既定大小之 :丄但是因為關於色區域之間的交界位置，可得到可 的傾斜角度，所以可認為從各點A1〜A4的座桿與 -27- 201245705 傾斜角度之關〆备 線之傾斜的變^所求得料似曲線適當地表達沿著測量 因為藉由根據垣：又’關於無法測量傾斜狀態的暗區域， 比對從樣品資:的體積及接端面突出寬度的實測資料 角度，所以蕤所製作之推測用表’可推測大致的傾斜 濕爬昇” 9由補足該推測結果，可求得圓角整體的潤 因此，βρ蚀+ 端面突出寬 在因為在迴焊製程前之焊料的體積或接 # 又有不均，而在同種基板之同一部位之圓自 的形狀發生不均的达 丨伍之圓角 比以往更d勾的情況’亦可使對各個圓角之測量誤差 陡峭此外、’根據元件，因為迴焊後焊料的圓角短，而且 但是g斤x有時在影像中幾乎未出現紅或綠的色區域， 與：二使在這種情況’亦可使用藍區域的傾斜角度範圍 虛挪9區域所推測之傾斜角度’實施與上述-樣的測量 值，=η攸推測用表所推測之傾斜角度未限定為特定 亦可在導出複數個角度後，按各角度形態 ^ ^ ίφ 面★处。例如，亦可分別使用與焊料的體積和接端 度邀寬度之組合對應的組所示之角度範圍之上限的角 下限的角纟’執行上述的測量，藉此，求得迴焊後 广的潤濕爬昇高度可取得之值的數值範圍。 的又，在上述的焊接檢查機3〇，分別從入射角度相異 向同時照射紅、綠、藍的各顏色光並拍攝後，從所 是之影像抽出各色區域，實施第6圖所示的計算，但 限疋於此，亦可使用依序將對應於各方向的光源點 -28- 201245705 燈，並每次點燈都進行攝像之 從藉每次的攝像所逢士 ^ ^ 一機在此情況， 攝像所產生之影像中的焊接部位 的區域，再根掳产广1 抽出儿度冋 理。再根據-些區域的關係實施與第6圖一樣的處 又，在上述，說明將利用焊料印刷檢查機10所求得 :烊枓的體積用於推測處理的例子，但是使用於推測之 削製程的測量參數係未限定於此。例如，可使用對接端 面之焊料的相對位置或印刷範圍、或焊料之高度的平均 值等，進行推測處理。 又，在上述的實施例，採用利用焊接檢查機3〇測量 接端面突出寬度，但是亦可使用元件檢查機2〇之測量處 理的結果，求得接端面突出寬度。例如，亦可對具有焊 料潤濕爬昇至元件電極之上部之可能性的元件，根據在 迴焊製程之刖之元件的狀態求得接端面突出寬度。 又，若使用具有三維測量之功能的檢查機作為元件 檢查機20，亦可使用元件或元件電極之高度，進行推測 處理。例如’根據焊料的體積與元件電極之高度，推測 迴焊製程中流入元件電極與接端面之間的焊料量，再根 據該推測結果’修正潤濕爬昇高度的測量值。 第7圖係表示關於上述之焊接檢查的示意步驟。此 外，在此，為了簡化說明，僅表示一片基板的處理而 且將對該基板的攝像次數設為一次，按各元件處理的焊 接部位是一處。又’雖然在焊接檢查，利用第6圖所示 的方法測量迴焊後焊料的潤濕爬昇高度，但是在推測對 應於暗區域之角度的處理所使用之其他製程的測量 -29- 201245705 參數係未 數。 首先 件實施以 在步 之檢查對 區域，再 係利用抽 利用抽出 接著 包含接端 域F，再 F檢測出. 在步 在該線上 區域的端 少的情況 在步 入在其他 進行之測 步驟S7， 於暗區域 在步 自對應的 藉由對其 限定為焊料的體積，而使用任意種類的測量參 ，拍攝檢查對象的基板S(步驟S1)，再按各元 :的玛路LP卜以下’說明迴路Lpi内的處理。 备S2 ’根據所登錄之設定資料，在包含影像中 々的兀件及對應之接端面之範圍設定檢測用的 從該區域檢測出接端面及元件。接端面的檢蜊 出亮度高之像素群的方法進行，元件的檢測係 疋件所登錄之顏色的方法進行。 ，在步驟S3，根據在步驟S2的檢測結果，在 面及元件電極之範圍設定第6圖所示的檢查區 測里接端面突出寬度。在步驟S4，從檢查區域 各色區域及暗區域。 驟S 5 ’根據各區域的檢測結果，設定測量線L， 娜量各區域間的端點（點A2、A3、A4)及兩側之 點（點Al、A5)的座標。此外，在檢測之色區域 ，配合之，調整測量對象的點。 驟S6 ’對檢查資料管理裝置1〇2進行存取，讀 的檢查機10、20對與處理中之元件對應之處所 量資料（使用於推測處理之參數的測量值）^在 使用在步驟S 6所讀入之測量資料，推測對應 的傾斜角度0 X。 驟S8，對在步驟S5所測量之各座標，應用各 傾斜角度’求得第6圖所示的曲線Μ後，進而 積分’而算出迴焊後焊料的潤濕爬昇高度。在 -30- 201245705 步驟S9，藉由將該高度與判 部位的良、不良。 土+值比對’而判定焊接 以下，按檢查對象的各元件 此外，實際上，因為大部分的元件且古上述的迴路LP1。 所以按焊接部位的數量程度:有複數料接部位， # ^ ^ 耒執行迴路 P之兀件的處理結走拄 ^ A 判定結果，判^基板整體的良、^統合對這些元件的 理裝置等輸出檢查結果資/丨，並向檢查資料管 除了整體的判定結果以外;^查結果資訊， 判定結果或測量結果。 母次在迴路LP1的 後焊Si二然在上述之實施例的檢查，為了判別迴焊 =的：濕爬昇狀態，求得潤濕爬昇高度，但是未限 疋於此，亦可根據既定之判定其唯 _ ^ 曲線Μ後，判斷圓-夕土準，/刀析第6圖所示的 便力斷圓角之傾斜的變化是否適當。 其次，焊接檢查機30的槿Λ'去阳—A L + 一 亦可使用與第3圖所示之焊料 < 疋’’’、V所不者’ 的檢杳嬙/ 之谇枓印刷檢查機1〇為同樣構成 ,r ^ 閒况之知接檢查，在根據移相法的原理， 求付迴焊後焊料之各點的 ^ 與高度資料賦予對康，抖後亭各像素的座標 __ ., ’心使迴烊後焊料的三維形狀復原， 而可判別是否適當。作，/ .α 仁在该構成的檢查機，亦因為從 基板的斜上方向將條纹圖安_ μ ^ ^ 肝條、、文0案投影，所以在迴焊後焊料之 圓角的傾斜陡峭夕_ ，& 1 ,i(Si 之處無法使對投影圖案的反射光射入 目2A所以具有無法算出高度資料的問題。 有鑑於該問顳里jt ,筮。_ " 第8圖所示的實施例中，作成在 焊接檢查使用根據移相法之檢查機的情沉，在元件的附 -31 - 201245705 近’以因無法得到投影圖案的反射光像而無法測量高度 之處為對象，根據在其他製程的檢查機所得之測量資 料，推測高度。 以下，參照第8圖，説明本實施例的檢查步驟。此 外，在本例’亦與前面之第7圖的例子〜樣，僅表示對 一片基板的處理步驟，各元件的焊接部位亦限定為一個。 首先’在步驟S21，藉由進行複數次條紋圖案的投 影處理及攝像，而產生三維測量用的影像。接著，在步 驟S22，藉由在照明裝置2A之白色照明下拍攝，而產生 外觀測量用影像。 然後，按檢查對象的各元件執行迴路LP2。 首先’在迴路LP2之最初的步驟S23，使用在步驟 S2所得之外觀測量用影像，檢測出接端面及元件。因為 檢測方法係與第7圖的步驟S2大致相同，所以省略詳細 說明。 接著’在步驟S24，在包含在步驟S23所檢測出之 接端面及元件之—部分的範圍設定檢查區域。因為相機 2A係共用’所以該檢查區域亦可應用於三維測量影像。 因此’在接著的步驟S25，將上述的檢查區域應用 在二維測量影像，按該區域内的各像素，實施根據移相 法的三維測量後，算出高度資料。因為該處理係與求得 焊料印刷檢查機1 〇之焊料之高度一樣，所以省略詳細說 明。 接著’在步驟S26，藉由比對在步驟S23所檢測出 之接端面或元件之範圍與三維測量結果，特定具有對應 -32- 201245705 於元件之高度資料的像素群與對應於迴焊後焊料 資料的像素群。 在步驟S27’抽出位於元件的附近，且因未檢測出 亮度的相位變化而無法算出高度資料的像素群 含這些像素群之範圍’作為未測量區域。然後，從檢告 資料管理裝置⑽讀人利用對檢查對象的元件之 檢查機之測量處理所得的測量資料（步驟⑵说，根 :入之測量資料比對推測用表’而推測未測 度資料（步驟S29)。藉此，可取得於_丛m 战的冋 面的高产件附近之陡们頃斜 2置之測量結果加入其他製程之檢查機的測量:Π 推測。例如，亦可使用具有與在步驟s 、 後焊料對應的高度資料的像素群 /之迴焊 群之焊料的體積或與圓角之傾斜近些像素 結果與其他製程之檢查機的測量資料，進：施使用這些 …在步驟，使用在具有與:：後:處：。 資料的像素群及未測量區域之像素群的各個像:之冋度 資料，將迴焊後焊料之圓角的三維形狀素的南度 S3。對所復原的三維形狀，實施各種測量處理。步驟 可异出體積' 圓角之傾斜面的角度變化列如， 寬度、迴焊後焊料的周圍長度等。 之長度或 不良在步驟S32，使用各測量值，判定禪接部位的良、 以下，一樣地，對檢查對象的元件 的處理。最後，在步驟S33,判定基板整：：：迴路m 並輸出判定結果。 的良、不良， -33- 201245705 若依據上述的處理，取得僅藉一般之三維測量無法 取得之傾斜陡峭之處的高度資料，因為可將圓角整體的 三維形狀高精度地復原’所以可大幅度提高檢查精度。 在該第7圖及第8圖的例子，都從檢查資料管理裝 置1 02讀入在其他製程之檢查機1 〇、20的測量資料，但 是未限定於此，亦可作成從實施測量的檢查機1 〇、2〇直 接接受測量資料的提供。 κ .「π仏小你彩1豕匙理热法直接測 量之處的特徵與在其他製程之測量資料的因果關係的資 訊，登錄表形式的資訊，但是未限定於此，亦可導出表 示兩者之因果關係的函數後，進行登錄。又，即使在登 錄推測用表的情況’亦未限定為直接導出元件附近之： 量困難之處的特徵者’亦可登錄導出圓角整體之特徵之 構成的推測用表。在此愔 况’在推測處理，例如亦可奸 據對與檢查對象的焊接 Χ ° 對應之處之其他製程的測量 處理的結果，從推測用 、里 料的候補，再從其中選 y狀貧 ^ ^ 释取接近表不在焊接檢查機3〇之 實測育枓所示的形狀者。 心 其次’進行推測處 ，例如亦可在檢杳資料二未限定為焊接檢查機 -2。所接收之測量；Π裝置Μ2,使用從檢查機 ,^ ^ 料’執行推測處理，再向焊接蛤 查機30提供該推測結 Π知接檢 查機3〇的計算負載。又，：依此方式’可減少在焊接檢 it，可提古> β ΛΑ 右在焊接檢查之前實施推測處 理“檢查的效率，而減少工作週期。 *34- 201245705 第9圖係以利用檢查資料管理裝置102實施推測處 理的情況為例，表示在各裝置間之資訊的流程。此外， 在本例，垾料印刷檢查機1 〇亦可應用第2圖及第3圖之 任一種構成’在未特定焊接檢查的内容或被使用於推測 處理之測量資料的情況下加以說明。 檢查程式管理裝置！ 〇丨係對各檢查機丨〇、2〇 ' 3〇， 因應於各個機型，提供檢查程式（第9圖的（a)、（b)、（c))。 这些程式係按各元件種類，根據屬於該元件種類之元件 :檢查基準而製作，作為程式庫資料，登錄於檢查程式 官理裝置101。各檢查機1〇、2〇、3〇係根據檢查對象之 基板的設計資料，從檢查程式管理裝置101讀入所需之 兀件種類的程式庫資料後，將這些程式庫資料編輯成與 元件之位置資訊對應的狀態後使用。 各自所 域，實 的良、 查結果 按照檢 儲存。 管理裝 的程式 表或程 之檢查 的基板 焊料印刷檢查機10及元件檢查機20係根據 k供之檢查程式，按各檢查對象部位設定檢查區 施以既疋參數為對象的測量處理後，判定測量值 不良’、、丨後，將包含各檢查區域之測量資料的檢 資机（第9圖（d))傳輸至檢查資料管理裝置1〇2。 檢查資料管理裝置1〇2以可將這些傳輸資訊 查機種類、基板種類及元件種類讀出的形式加以 又，在檢查資料管理裝置i〇2，預先從檢查程式 置1〇1提供各元件種類之推測用表或推測處理用 (第9圖（e))。檢查資料管理裝置1〇2係根據這些 式、與來自焊料印刷檢查機1〇及元件檢查機2〇 結果育訊，以在這些檢查機丨〇、2〇之檢查已結束 -35- 201245705 * 為對象董十肖基板上的各元彳，推測焊接檢查之 理所需的特徵資料（元件附近的傾斜角、高度資料等）。地 另一方面，焊接檢查機30係根據從檢查程式总 置ιοί所提供的檢查程式’處理檢查對象之焊接：位‘ 影像，而取得檢查所需的特徵資料，而且對檢查其 理裝置m進行存取，關於處理中的焊接部位接成: 查資料管理裝ϊ 102所推測之特徵資料的提供(第：圖 (f))。然後，根據該特徵資料與在本身裝置所取得之 資料’執行最後的測量處理，藉由比較該測量值盘計 基準值，來判定焊接部位的良、不良。然後，將綜合： 檢查結果或使用於判定之測量資料的檢查結果資訊（第^ 圖（g))傳輸至檢查資料管理裝置1〇2。 此外，在上述的各實施例，將焊接部位中位於元件 附近，t未出現測量所需之特徵之處作為推測處理的對 象’但是未限定於此，亦可亦包含特徵雖出現卻不明顯 之處在内來進行推測處理。又’亦可將元件與接端面之 間的焊料等在迴焊製程後之基板的影像完全無出現的可 能性之處作為推測對象。例如，可列舉根據利用焊料印 刷檢查機10所測量之烊料的體積與利用焊接檢查機π 所測量之迴焊後焊料之體積的關係，推測元件之迴焊 焊料的量。 【圖式簡單說明】 第1圖係將基板檢查系統的構成與元件組裝基板之 生產線之整體構成對應地顯示之構成圖。 第2圖係表示焊接檢查機之構成的方塊圖.。 -36- 201245705 第3圖係表示焊料印刷檢查機之構成 第4圖（a)~(f)係表示在關於焊接檢杳 訊的流程的圖。 第5圖（1)、（2)係模式地表示作為—例 構成圓、及表示表中之各組的關係圖。 第6圖係說明測量迴焊後焊料之潤濕 法的圖。 第7圖係表示在焊接檢查機之檢查步 第8圖係表示根據移相法使焊接部位 原的情況之檢查步驟的流程圖。 第9圖（a)〜（g)係表示在檢查資料管理 處理的情況之各裝置間之資訊的流程的圖 第1 〇圖係表示膏狀焊料量的差異對 影響的圖。 第11圖係表示元件的組裝位置所伴 突出部之寬度的差異對圓角之形狀的影響 第12圖係表示膏狀焊料之印刷的偏 狀的影響的圖。 第1 3圖係表示膏狀焊料之印刷的偏 狀的影響的圖。 【主要元件符號說明】 s 基板 1 控制處理部 2 相機 3 照明部 的方塊圖。 之裝置間之資 之推測用表的 攸昇高度之方 驟的流裎圖。 之三維形狀復 裝置進行推測 〇 圓角之形狀的 隨之接端面的 的圖。 位對圓角之形 位對圓角之形 -37- 201245705 4 基 板 工 作 台 10 焊 料 印 刷 檢 11 焊 料 印 刷 裝 20 元 件 檢 查 機 21 組 裝 機 30 焊 接 檢 查 機 31 迴 焊 爐 102 檢 查 資 料 管 查機 置 理裝置 -38Hi: The height of the solder corresponding to the point A5 is calculated and used as the wetting creep height of the solder after the solder. Although the inclination angles shown in the respective color regions each have a predetermined size: 丄, since the angle of inclination can be obtained with respect to the boundary position between the color regions, it can be considered that the seatposts from the respective points A1 to A4 and -27- 201245705 The tilt angle is determined by the inclination of the backup line. The curve is appropriately expressed along the measurement because by comparing the volume of the sample area with the dark area that cannot measure the tilt state. And the measured data angle of the end face protruding width, so the speculation table produced by 蕤 can be presumed to be roughly inclined wet climb. 9 By complementing the speculation result, the whole fillet can be obtained, so βρ ec In the case where the volume or the junction of the solder before the reflow process is uneven, the shape of the circle at the same portion of the same substrate is uneven. It can make the measurement error of each rounded corner steeper, in addition, according to the component, because the solder fillet is short after reflow, but g jin x sometimes has no red or green color area in the image, and: In this case, the inclination angle estimated by the slant angle range of the blue region can be used as the above-mentioned measurement value, and the inclination angle estimated by the η攸 estimation table is not limited to the specific After exporting a plurality of angles, the angles of the ^^ ίφ faces can be selected according to the angles. For example, the lower limit of the upper limit of the range of angles indicated by the group corresponding to the combination of the volume of the solder and the width of the joints can be used. The angle 纟' performs the above-mentioned measurement, thereby obtaining a numerical range of values that can be obtained by the wide wetting creep height after reflowing. Further, in the above-mentioned welding inspection machine 3, the difference from the incident angle is respectively Simultaneously illuminating the respective colors of red, green, and blue light, and then extracting the color regions from the image to be performed, and performing the calculation shown in Fig. 6, but limited thereto, it may be used in order to correspond to each direction. Light source point -28- 201245705 lights, and each time the lights are turned on, the camera is taken from each camera. ^ ^ In this case, the area of the welded part in the image produced by the camera is reproduced.广一出出儿冋Further, in the same manner as in the sixth embodiment, the same operation as in the sixth embodiment is performed. In the above, an example in which the volume of the crucible is used for the estimation processing by the solder print inspection machine 10 will be described, but it is used for speculative shaving. The measurement parameters of the process are not limited thereto. For example, the relative position of the solder on the butt end face, the printing range, or the average value of the height of the solder may be used for the estimation process. Further, in the above embodiment, the welding inspection is employed. The machine 3 〇 measures the protruding width of the end face, but the result of the measurement process of the component inspection machine 2 can also be used to obtain the protruding width of the end face. For example, it is also possible to have the possibility of solder wetting climbing to the upper part of the element electrode. The component is obtained from the state of the component after the reflow process, and the width of the junction is obtained. Further, if an inspection machine having a function of three-dimensional measurement is used as the component inspection machine 20, the height of the component or component electrode can be used for estimation. deal with. For example, the amount of solder flowing between the element electrode and the end face in the reflow process is estimated based on the volume of the solder and the height of the element electrode, and the measured value of the wet crawl height is corrected based on the estimation result. Figure 7 shows the schematic steps for the solder inspection described above. Here, in order to simplify the description, only one substrate is processed, and the number of times of imaging of the substrate is set to one time, and the welded portion to be processed for each element is one place. 'Although in the welding inspection, the wet-climbing height of the solder after reflow is measured by the method shown in Fig. 6, but the measurement of other processes used in the process of estimating the angle corresponding to the dark area -29-201245705 Not counted. The first piece is implemented to check the paired area in the step, and then the extraction is performed by the extraction and then the terminal domain F is included, and then the F is detected. In the case where the end of the line is small, the step is performed in the other step S7. In the dark region, the volume of the solder is limited to the corresponding one, and the substrate S of the inspection object is photographed using any kind of measurement parameters (step S1), and then the respective elements are: Describe the processing in the loop Lpi. The standby S2' sets the detection end face and the component from the area in the range including the frame of the image and the corresponding end face of the image based on the registered setting data. The method of detecting the color of the pixel group with the high brightness is performed by the method of detecting the color of the pixel. In step S3, based on the detection result in step S2, the inspection area of the inspection area shown in Fig. 6 is set in the range of the surface and the element electrode. In step S4, the color area and the dark area of the inspection area are examined. In the step S 5 ', the measurement line L is set, and the coordinates of the end points (points A2, A3, and A4) between the respective regions and the points (points A1 and A5) on both sides are set. In addition, in the detected color area, the point of the measurement object is adjusted. Step S6' accesses the inspection data management device 1〇2, and the read inspection machine 10, 20 pairs the data corresponding to the component being processed (measurement value used for the parameter of the speculation processing) ^ is used in step S The measured data read in 6 is estimated to be the corresponding tilt angle 0 X. In step S8, the curve shown in Fig. 6 is obtained by applying the respective inclination angles to the respective coordinates measured in step S5, and then the integral is performed to calculate the wetness climb height of the solder after the reflow. At -30-201245705, step S9, the height is judged to be good or bad. The soil + value is compared to 'and the welding is determined hereinafter. Each element to be inspected is in addition to the fact that most of the elements are the same as the above-mentioned circuit LP1. Therefore, according to the degree of the number of welded parts: there are multiple material joints, # ^ ^ 耒 the processing of the loops of the circuit P is performed, and the result of the judgment is judged, and the overall structure of the substrate is determined, and the device of these components is integrated. The inspection result is output/丨, and the inspection data is not included in the overall judgment result; the result information, the judgment result or the measurement result are checked. After the mother and the secondary welding of the circuit LP1, in the above-described embodiment, in order to determine the wet-up state of the reflow=weak climb, the wetting climb height is obtained, but it is not limited thereto, and may be determined according to the predetermined After the _ ^ curve is Μ, it is judged whether the change of the inclination of the fillet of the fillet shown in Fig. 6 is appropriate. Next, the soldering inspection machine 30 can also use the solder < 疋 '' 1〇 is the same composition, r ^ the condition of the contact check, in accordance with the principle of the phase shift method, the ^ and the height data of the solder after the reflow soldering are given to the coordinates of the pixels of the Kang, shaking back kiosk __ ., 'The heart restores the three-dimensional shape of the solder after the return, and it can be judged whether it is appropriate. In the inspection machine of this configuration, the tilt of the solder fillet after reflow is also caused by the fringe pattern _ μ ^ ^ liver strip and text 0 projecting from the obliquely upward direction of the substrate. Steep _ _ , & 1 , i (Si can't make the reflected light of the projected pattern into the target 2A, so there is a problem that the height data cannot be calculated. In view of the question, jt, 筮._ " Figure 8 In the illustrated embodiment, it is made to use the inspection machine according to the phase shift method in the welding inspection, and the height of the component is not able to be measured because the reflected light image of the projected pattern cannot be obtained in the vicinity of the component -31 - 201245705 The object is estimated based on the measurement data obtained by the inspection machine of another process. Hereinafter, the inspection procedure of this embodiment will be described with reference to Fig. 8. In addition, in this example, the example of Fig. 7 is also used. Only the processing steps for one substrate are shown, and the welding portion of each element is also limited to one. First, in step S21, the image for three-dimensional measurement is generated by performing projection processing and imaging of a plurality of stripe patterns. Then, in steps S22, borrow The image for appearance measurement is generated by shooting under the white illumination of the illumination device 2A. Then, the circuit LP2 is executed for each element to be inspected. First, in the first step S23 of the circuit LP2, the image for appearance measurement obtained in step S2 is used. The end face and the component are detected. Since the detection method is substantially the same as step S2 of Fig. 7, the detailed description is omitted. Next, in step S24, the portion including the end face and the component detected in step S23 is included. The range setting inspection area. Since the camera 2A is shared, the inspection area can also be applied to the three-dimensional measurement image. Therefore, in the next step S25, the above-described inspection area is applied to the two-dimensional measurement image, and each pixel in the area is pressed. After the three-dimensional measurement by the phase shift method is performed, the height data is calculated. Since the processing is the same as the height of the solder of the solder print inspection machine 1, the detailed description is omitted. Then, in step S26, the comparison is performed in step S26. The range of the end face or component detected by S23 and the three-dimensional measurement result have a specific correspondence -32- 201245705 a pixel group of the height data of the piece and a pixel group corresponding to the solder material after reflow. In step S27', the pixel group located in the vicinity of the element and unable to calculate the height data due to the phase change of the luminance is not detected, and the pixel group is included. The range of 'as the unmeasured area. Then, from the inspection data management device (10), the reading data obtained by the measurement processing of the inspection machine of the component to be inspected is used (step (2) says: root: the measurement data of the comparison data is used for comparison In the table ', the unmeasured data is estimated (step S29). Thereby, the measurement results of the steeper slopes near the high-production parts of the _ m battle can be added to the inspection machine of other processes: Π For example, it is also possible to use the volume of the solder of the pixel group/reflow group having the height data corresponding to the step s and the post solder, or the measurement results of the inspection results of the process of the other pixels. In: Apply these... in the step, use at: and after::::. The pixel group of the data and the image of the pixel group of the unmeasured area: the data of the radius, the south dimension S3 of the three-dimensional shape of the rounded corner of the solder after reflow. Various measurement processes are performed on the restored three-dimensional shape. Steps The volume of the inclined surface of the rounded corner can be varied, such as the width, the length of the solder around the reflow solder, and the like. The length or the defect is determined in step S32 using the respective measured values, and the processing of the components to be inspected is determined in the same manner as in the case of the splicing portion. Finally, in step S33, the substrate is determined to be :::: loop m and the determination result is output. Good or bad, -33- 201245705 According to the above processing, the height data of the steep slope that cannot be obtained by the general three-dimensional measurement is obtained, because the three-dimensional shape of the entire round corner can be restored with high precision. The amplitude increases the inspection accuracy. In the examples of the seventh and eighth drawings, the measurement data of the inspection machines 1 and 20 of the other processes are read from the inspection data management device 102, but the measurement data is not limited thereto, and the inspection may be performed from the measurement. Machines 1 and 2 are directly accepting the supply of measurement data. κ "" 仏 仏 你 彩 彩 彩 彩 彩 彩 彩 彩 理 理 理 理 理 理 理 理 理 理 理 理 直接 彩 彩 彩 彩 彩 彩 彩 彩 彩 彩 彩 彩 彩 彩 彩 彩 彩 彩 彩 彩 彩 彩 彩 彩After the function of causality is registered, the registration is performed. In addition, even when the speculative table is registered, it is not limited to the vicinity of the direct derivation element: the feature of the difficult part can be registered to derive the characteristics of the entire rounded corner. In the case of the estimation process, for example, the result of the measurement process of the other process in the place where the welding Χ ° corresponds to the inspection target, the candidate for the estimation and the lining, and then From the selection of y-shaped poor ^ ^ release close to the table is not in the shape shown in the actual inspection of the welding inspection machine. The heart is second to the speculation, for example, the inspection data is not limited to the welding inspection machine - 2. Received measurement; Π device Μ 2, using the inspection machine, ^ ^ material 'execution process, and then to the welding inspection machine 30 to provide the calculation load of the speculation junction checker 3 又. This side 'IT can be reduced in the welding inspection, mention may be ancient > β ΛΑ embodiment the right processing efficiency speculating "check before the welding inspection, the duty cycle is reduced. *34- 201245705 The ninth figure shows the flow of information between the devices by taking the case where the inspection data management device 102 performs the estimation process as an example. Further, in this example, the print printing inspection machine 1 can also be applied to any one of the second drawing and the third drawing, which is described in the case where the content of the welding inspection is not specified or the measurement data used for the estimation processing. Check the program management device! For each inspection machine, 2〇 ' 3〇, the inspection program is provided for each model (Fig. 9 (a), (b), (c)). These programs are created for each component type based on the component: inspection standard belonging to the component type, and are registered as the library data in the inspection program official device 101. Each of the inspection machines 1〇, 2〇, 3〇 reads the library data of the required type from the inspection program management device 101 based on the design data of the substrate to be inspected, and edits the library data into components. Use the status corresponding to the location information. In their respective fields, the results are good and the results are checked and stored. The substrate solder print inspection machine 10 and the component inspection machine 20 for the inspection of the program table or the inspection program are determined by the inspection program for the inspection target portion, and the measurement processing is performed for each of the inspection areas. After the measured value is defective, the calibrator (Fig. 9(d)) containing the measurement data of each inspection area is transmitted to the inspection data management device 1〇2. The inspection data management device 1〇2 is configured to read the type of the information, the type of the substrate, and the type of the component, and the inspection data management device i〇2 provides the component types in advance from the inspection program setting 1〇1. It is used for speculation or speculation (Fig. 9(e)). The inspection data management device 1〇2 is based on these formulas, and the results from the solder print inspection machine 1〇 and the component inspection machine 2, so that the inspections at these inspection machines have been completed -35-201245705 * On the substrate of the object, the characteristic data required for the welding inspection (inclination angle, height data, etc. in the vicinity of the component) is presumed. On the other hand, the welding inspection machine 30 obtains the characteristic data required for the inspection based on the inspection program 'processing the welding target position' of the inspection program provided by the inspection program, and performs inspection on the inspection device m. Access, regarding the welding of the processing part: The provision of the characteristic data estimated by the data management device 102 (Fig. (f)). Then, based on the feature data and the data acquired by the own device, the last measurement process is performed, and by comparing the measured value of the disk count reference value, it is determined that the welded portion is good or bad. Then, the integrated result: the inspection result or the inspection result information (Fig. 2(g)) used for the determined measurement data is transmitted to the inspection data management device 1〇2. Further, in each of the above-described embodiments, the portion of the welded portion located in the vicinity of the element, and the feature required for measurement does not appear as the object of the estimation process', but is not limited thereto, and the feature may be included but not obvious. In the speculation process. Further, it is also possible to estimate the possibility that the solder between the element and the end face is not present at all after the image of the substrate after the reflow process. For example, the relationship between the volume of the solder which is measured by the solder print inspection machine 10 and the volume of the solder after the reflow soldering measured by the soldering inspection machine π can be exemplified, and the amount of solder reflowed from the element can be estimated. [Brief Description of the Drawings] Fig. 1 is a configuration diagram showing the configuration of the substrate inspection system in accordance with the overall configuration of the production line of the component mounting substrate. Figure 2 is a block diagram showing the construction of a welding inspection machine. -36- 201245705 Fig. 3 shows the structure of the solder print inspection machine. Fig. 4 (a) to (f) show the flow of the welding inspection. Fig. 5 (1) and (2) schematically show a relationship diagram as a constituent circle and a group in the table. Fig. 6 is a view showing the measurement of the wetting method of the solder after reflow. Fig. 7 is a view showing a step of inspecting the welding inspection machine. Fig. 8 is a flow chart showing an inspection procedure for the case where the welding portion is originally formed by the phase shifting method. Fig. 9 (a) to (g) are diagrams showing the flow of information between the devices in the case of checking the data management processing. Fig. 1 is a view showing the influence of the difference in the amount of the cream solder. Fig. 11 is a view showing the influence of the difference in the width of the protruding portion on the shape of the rounded corner when the assembly position of the element is attached. Fig. 12 is a view showing the influence of the unevenness of the printing of the cream solder. Fig. 1 is a view showing the influence of the eccentricity of the printing of the cream solder. [Description of main component symbols] s Substrate 1 Control processing section 2 Block diagram of camera 3 illumination section. The flow chart of the 攸 攸 攸 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The three-dimensional shape complex device is estimated. 〇 The shape of the rounded corner is followed by the end face. Shape to rounded corners to fillet shape-37- 201245705 4 Substrate table 10 Solder printing inspection 11 Solder printing equipment 20 Component inspection machine 21 Assembly machine 30 Welding inspection machine 31 Reflow oven 102 Inspection data inspection machine Equipment-38