201243990 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種取放裝置，且特別是有關於一種 發光二極體晶片的取放裝置。 【先前技術】 發光二極體被譽為21世紀的綠色照明產品，其以工 作電壓低、耗電量小、發光效率高、壽命長等優點備受關 注。發光二極體結構中的一個重要的構件是晶片。正是因 為有了晶片，發光二極體才會發亮。在製作發光二極體時， 將晶片切割為單個晶片’採用固晶技術將晶片固定在發光 一極體的支架上。由於晶片體積較小且易破碎，在固晶過 程中，人工移動晶片是較困難的。 為了解決上述問題，一般會採用專門的晶片取放裝 置，把晶月吸取後放置到預定的位置。請參考圖丨，一種 習知晶片取放裝置100,主要包括晶片存儲區101、晶片放 置區105、吸嘴102、轉動軸103以及連接吸嘴1〇2=轉動 軸1〇3的伸縮桿104。晶片存儲區101用來存放待吸取的 晶片。晶片放置區105用來放置欲安放晶片的裝置，例如 發光二極體中用於放置晶片的金屬支架。吸嘴在轉動 軸103的驅動下旋轉。伸縮桿1〇4驅動吸嘴1〇2接近和遠 離晶片存儲區101和晶片放置區。 晶片取放裝置的作動過程如下：吸嘴1〇2在初始靜止 時面對晶片存儲區1()1所在的位置。裝置啟動後，吸嘴搬 4 201243990 在伸縮桿104的驅動下接近晶片存儲區1〇1。吸嘴1〇2在 外力比如壓力的作用下吸取晶片。然後在伸縮桿1〇4的驅 動下遠離晶片存儲區101。離開晶片存儲區1〇1後在轉動 軸103的驅動下旋轉面向晶片放置區1〇5所在的位置。在 伸縮桿104的驅動下接近晶片放置區1〇5。在外力比如壓 力的作用下放置晶片。在伸縮桿1〇4的驅動下遠離晶片放 ，區105。最後在轉動轴1〇3的驅動下回到面對晶片存儲 ，101所在的位置的狀態，完成晶片從吸取到放置的過 ^。如此循環反覆，將晶片從晶片存儲區1〇1持續放置到 晶片放置區1G5。但是，這樣的晶牌放裝置操作效率較 低，限制了整體的生產效率。 【發明内容】 鑒於上述晶片取放裝置存在的缺點，本發明的目的在 於提供一種效率較高的晶片取放裝置。 為達到上述目的’本發明提出一種晶片取放裝置，包 括晶片存儲區、晶片放置區、轉動軸以及設置於轉動轴上 的第-吸嘴與第二吸嘴。轉動軸旋轉驅動第—吸嘴與第二 =嘴將晶片從⑼存儲區放到晶片放。其中，第一吸 =與第二吸嘴在垂直於轉動轴的軸㈣同—平面上圍繞轉 軸的軸叫㈣稱相應於晶片存儲區與晶片放置區分 第及嘴與第一吸嘴的連線穿過轉動軸的軸心。 —晶1取放置裝置更包括第一伸縮桿與第二伸縮桿。第 伸縮才干連接第-吸嘴和轉動軸，驅動第―吸嘴接近和遠 201243990 離晶片存儲區與晶片放置區。第二伸縮桿連接第二吸嘴與 轉動轴，驅動第二吸嘴接近和遠離晶片存_與晶片放置 區。 、 日曰片存儲區具有第一工作平面。晶片存 一平移驅動裝置，祕晶片存儲區在第—工^㈣= 圍平移。晶片放置區具有第二工作平面。晶 有第二平移驅動裝置，驅動晶片放置區在第二工^ ^ 的範圍平移。 — 區的第 180度 片存儲區的第-工作平面的第—法線與晶片放置 二工作平面的第二法線呈-定夹角。夹角為。度至 當夾角為180度時，晶片存儲區的第一工作平面與晶 片放置區的第二工作平面平行相對設置。 ^阳 當夾角為90度時，晶片存儲區的第—工作平面與晶 片放置區的第二工作平面垂直設置。 .晶片取放裝置取放晶片的具體作動流程如下述步 (1) 在晶片取放裝置初始靜止狀態時，待吸取的晶」 位於晶片存儲區，第-吸嘴面向晶片存儲區，並盘晶心 儲區的待吸取晶片對應。待放置晶片的裝置位於晶片放】 ^第二吸嘴面向晶片放置區’並與晶片放置區的待放: 曰用曰2裝置對應。待放置晶片崎置例如為㈣二極體: 用於放置晶片的金屬支架。 服 (2) 在第一伸縮桿的驅動下第—吸嘴向晶片存儲區; 6 201243990 動，在外力比如壓力的控制下第—吸嘴吸取晶片。 (3)在第一伸縮桿的驅動下，吸附有晶片的第一吸 遠離晶片存儲區。 (4)吸附有晶片的第一吸嘴與沒有吸附晶片的第二吸 嘴在轉動刊繞轉動_如轉 儲 與晶，置區分別在第-功平面與第二卫作平面子= 移’使”靜止時’晶片存儲區的待吸取晶片對應沒有吸 附晶片的第二吸嘴。晶片放置區的待放置晶片的裝置對應 吸附有晶片的第一吸嘴。 (5)在第二伸縮桿的驅動下，沒有吸附晶片的第二吸 嘴向晶片存舰移動，同時在第—伸轉的._下，吸附 有晶片的第-吸嘴向晶片放置區移動。同時到達後，兩吸 嘴在外力比如壓力的作用下分別吸取和放置晶片 。亦即， 沒有吸附日sa片的第二吸嘴吸取日日日片存儲區上的晶片 ，而吸 附有晶片的第-吸嘴將晶片放置於晶片放置區。 (6) 在第二伸縮桿的驅動下，吸附有晶片的第二吸嘴 離開日日=存儲區’同時在第—伸縮桿的驅動下，沒有吸附 晶片的第一吸嘴離開晶片放置區。 (7) 在轉動軸的驅動下，吸嘴圍繞轉動轴的軸心旋 轉。晶片存儲區與晶片放置區分別在第-X作平面與第二 工作=面平移’使得當靜止時，沒有吸附晶片的第一吸嘴 面對晶片存舰’吸财晶片的第二吸嘴面對^放置區。 伸縮桿的驅動下，沒有吸附晶片的第-吸 口曰曰+儲區移動，同時在第二伸縮桿的驅動下，吸附 201243990 有晶片的第二吸嘴向晶片放置區移動，同時到達後，兩吸 嘴在外力比如壓力的作用下同時分別吸取和放置晶片。亦 即’沒有吸附晶片的第一吸嘴吸取晶片存儲區上的晶片’ 而吸附有晶片的第二吸嘴將晶片放置於晶片放置區。 (9)在第一伸縮椁的驅動下，吸附有晶片的第一吸嘴 離開晶片存儲區，同時在第二伸縮桿的驅動下，沒有吸附 晶片的第二吸嘴離開晶片放置區。如此，恢復到步驟(3) 中的狀態。 如此循環反覆(4)〜(9)的步驟，將晶片持續地從晶片存 儲區放置到晶片放置區。 晶片取放裝置亦可包括第一驅動桿與第二驅動桿。第 一驅動桿與晶片存儲區連接，驅動晶片存儲區接近和遠離 第一吸嘴或第二吸嘴。第二驅動桿與晶片放置區連接，驅 動晶片放置區接近和遠離第一吸嘴或第二吸嘴。 晶片取放裝置亦可包括第三吸嘴與第四吸嘴。第三吸 嘴與第四吸嘴在垂直於轉動軸的軸心的平面内圍繞轉動輪 的軸心均勻對稱分佈。 本發明的晶片取放裝置，藉由晶片存儲區、晶片放置 區、吸嘴、轉動軸、伸縮桿等結構的共同作用，使得—個 吸嘴在晶片存儲區吸取晶片的同時另一個吸嘴在晶片敌 區放置晶片，實現了吸取晶片和放置晶片同時進行，提言 了晶片取放的效率，也提高了整體的生產效率。 n 為讓本發明之上述特徵和優點能更明顯易懂，下文 舉實施例，並配合所附圖式作詳細說明如下。 、 8 201243990 【實施例】 下面結合附圖對本發明的具體實施例進行說明，關於 針對具體實施例的說明僅為闡述本發明，並非用以限制本 發明。 圖2為本發明晶片取放裝置之第一實施例的結構示意 圖。請參考圖2 ’晶片取放裝置200主要包括：晶片存儲 區201、晶片放置區209、第一吸嘴204和第二吸嘴2〇5、 轉動軸206以及連接第一吸嘴204與第二吸嘴2〇5與轉動 軸206的第一伸縮桿208a和第二伸縮桿208b。晶片存儲 區201具有第一工作平面203。第一工作平面2〇3為晶片 存儲區201的工作平面，用來存放待吸取晶片的晶片存儲 盤202。晶片放置區2〇9具有第二工作平面211。第二工作 平面211為晶片放置區209的工作平面，用來放置欲安放 晶片的晶片放置盤21〇。晶片存儲區2〇1的第一工作平面 203的第一法線(圖2未繪示)與晶片放置區2〇9的第二工作 平面211的第二法線(圖2未繪示)的夾角為18〇度。亦即， 晶片存儲區201的第一工作平面203與晶片放置區2〇9的 第二工作平面21丨平行相對設置。轉動軸206設置於第一 工作平面203與第二工作平面211之間且均分夾角。亦即， 如圖2所示轉動軸206的軸心2〇7平行於第一工作平面2〇3 與第二工作平面211。第一吸嘴204與第二吸嘴205位於 垂直於轉動軸206的軸心207的同一平面内，並且圍繞轉 動軸206的軸心207均勻對稱分佈，兩者的連線穿過轉動 201243990 軸206的軸心、207，可在轉動軸寫的驅動下圍繞轉動軸 206的軸心207旋轉，靜止時第一吸嘴2〇4盥 分存儲請與晶片放㈣2Q9 = 一伸縮桿208a位於第一吸嘴2〇4與轉動轴2〇6 ^應f 第一吸嘴2〇4接近和遠離晶片存舰观 iL 〇9。第二伸縮桿鳩位於第二吸嘴205與 轉動轴206之間。第二伸縮桿2_驅動第 和遠離晶片存儲區201或晶片放置區·。 ％ 〇5接近 詈區產中’晶片存儲區2〇1存放的晶片和晶片放 、品θ个置日曰片的裝置往往是多個整齊排列放置著， 以批置生產’提高效率^這時為了使第一吸嘴綱二 吸嘴205能夠準確吸取和放置不同的晶片，可以採用第一 平移驅動襄置(圖2未繪示)驅動晶片儲存區201在第一工 作平面203内小範圍平移，且第二平移驅動裝置（圖2未繪 不)驅動，片放置區2。9在第二讀平面211内小範圍平 ，，使得靜止時，在晶片存儲區201總是有一個待吸取的 =片與吸嘴對應，且在晶片放置區209總是有 一個待放置 的裝置與另一個吸嘴對應。這樣與第一吸嘴204與第 一吸嘴205的運動相結合，實現晶片吸取和放置同時進行。 在本貫施例中，晶片取放裝置取放晶片的具體動作過 程如下列步驟： 離（1)請參考圖3Α所示，在晶片取放裝置初始靜止狀 :晶片存儲區2〇1放有待吸取的晶片212(實際上晶片 疋放置在晶片存儲盤202上的，為了簡化描述，之後 201243990 均稱晶片m是放置晶片存儲區2⑴上，下面不再 述）。第-吸嘴204面向晶片存儲㊄2〇卜並與晶 观的待吸取晶片212對應，待放置晶片的裝置位於晶片 放置區209上(實際上待放置晶片的裝置是位於晶片放置 盤210上的，為了簡化描述，之後均稱待放置晶片的裝置 是位於晶片放置區2G9 ±，下面不再贅述）。第二吸嘴^ 面向晶片放置區2G9’並與晶片放置區2()9的待放置晶片 的裝置對應。待放置晶》的裝置例如為發光二極體中用 放置晶片212的金屬支架。 、 (2) 請參考® 3B所示，在第一伸縮桿聽的驅動下 第一吸嘴遍向晶片存儲區2〇1移動，在外力（圖3B未綠 不）比如壓力的控制下第一吸嘴2〇4吸取晶片212。 曰 (3) 請參考H3C所示，在第一伸縮桿驗的驅動下， 吸附有晶片212的第一吸嘴2〇4遠離晶片存儲區2〇ι。 (4) 請參考圖3D所示，吸附有晶片212的第一吸嘴 204和沒有吸附晶片❾第二吸嘴2〇5在轉動軸施的驅動 下圍繞轉動轴206的軸心2〇7旋轉。晶片存儲區2〇1與晶 片放置區2〇9分別在第—工作平面2〇3與第二工作平面 211内平移，使得當靜止時，曰曰曰片存儲區2〇1 ±的待吸取 晶片對應沒有吸附晶片的第二吸嘴2G5，且晶片放置區期 的待放置晶片的裝置對應吸附有晶片212的第一吸嘴2〇4。 (5) 請參考ffl 3E戶斤示，在第二伸縮桿鳩的驅動下， 沒有吸附晶片的第二吸嘴2〇5向晶片存儲區2〇1移動同 時在第一伸縮桿208a的驅動下，吸附有晶片212的第一吸 11 201243990 嘴204向晶片放置區209移動。同時到達後，第一吸嘴2〇4 與第一吸嘴205在外力比如壓力的作用下同時吸取和放置 晶片。亦即，沒有吸附晶片的第二吸嘴2〇5吸取晶片存儲 區201上的晶片212，而吸附有晶片212的第一吸嘴2〇4 將晶片212放置於晶片放置區209。 (6) 請參考圖3F所示’在第二伸縮桿2〇8b的驅動下， 吸附有晶片212的第二吸嘴205離開晶片存儲區201 ,同 時在第一伸縮桿208a的驅動下，沒有吸附晶片的第一吸嘴 204離開晶片放置區209。 (7) 請參考圖3G所示，在轉動軸206的驅動下，沒 有吸附晶片的第一吸嘴204與吸附有晶片212的第二吸嘴 205圍繞轉動軸206的軸心207旋轉。晶片存儲區201與 晶片放置區209分別在第一工作平面203與第二工作平面 211内平移’使得當靜止時，沒有吸附晶片的第一吸嘴2〇4 面對晶片存儲區201，且吸附有晶片212的第二吸嘴205 面對晶片放置區209。 (8) 請參考圖3H所示，在第一伸縮桿208a的驅動下， 沒有吸附晶片的第一吸嘴204向晶片存儲區201移動，同 時在第二伸縮桿208b的驅動下，吸附有晶片212的第二吸 嘴205向晶片放置區209移動。同時到達後，第一吸嘴204 與第二吸嘴205在外力比如壓力的作用下分別吸取和放置 晶片。亦即’沒有吸附晶片的第一吸嘴204吸取晶片存儲 區201上的晶片212，而吸有晶片212的第二吸嘴205將 晶片212放置於晶片放置區209。 12 201243990 (9)在第一伸縮桿208a的驅動下，吸附有晶片212的 第一吸嘴204離開晶片存儲區201，同時在第二伸縮桿2〇8b 的驅動下，沒有吸附晶片的第二吸嘴205離開晶片放置區 209。如此，恢復到步驟(3)中圖3C所示的狀態。 如此循環反覆(4)〜(9)的步驟，將晶片212持續地從晶 片存儲區201放置到晶片放置區209。 晶片取放裝置按照上述晶片取放作動過程，在晶片存 儲區、晶片放置區、轉動軸、第一伸縮桿、第二伸縮桿與 兩個吸嘴的共同作用下，吸取晶片和放置晶片同時進行， 使得取放晶片的效率大大提高，提高裝置的操作效率，提 高了整體的生產效率。 在本發明之上述第一實施例中，僅在吸嘴與轉動軸之 間設有伸縮桿，用以驅動吸嘴接近和遠離晶片存儲區或晶 片放置區。當然，也可以僅在晶片存儲區與晶片放置區分 別設置驅動桿’用以驅動晶片存儲區與晶片放置區接近和 遠離吸嘴。當然，更可以在吸嘴與轉動轴之間設置伸縮桿 的同時在晶片存儲區與晶片放置區分別設置驅動桿，用以 驅動吸嘴與晶片存儲區和晶片放置區的相互接近和遠離。 在本發明之第二實施例中，即採用僅在晶片存儲區與晶片 放置區分別設置驅動桿的方式驅動晶片存儲區與晶片放置 區接近和遠離吸嘴。下文將詳細說明。 圖4為本發明晶片取放裝置之第二實施例的結構示意 圖。請參考圖4所示，一個晶片取放裝置400主要包括： 晶片存儲區401、晶片放置區409、第一吸嘴404和第二吸 13 201243990 嘴405 '轉動軸406、與晶片存儲區4〇 —與晶片放置區409連接的第二二二 貫施例相同，晶片存儲區4〇1與晶片放置區彻可以 = ’在其4平面内小制平 =不晶片存儲區彻與晶片放置區的工作平 4〇1的第一工作平面的第-法線(圖4未繪示声曰 ，角為⑽度。亦即，等同於晶片存儲=的第Π) 置區209的第二工作平面211平行相 對叹置。轉動軸406設置於第—工作平面與第二工作平面 =邱分夹角，即如圖所示轉動軸撕的細術平行 ^工作平面與第二工作平面。第—吸嘴彻盘第二吸 鳴405位於垂直於轉動軸4〇6的軸心4〇7的同一平面内， 轴406的轴心407均勻對稱分佈，兩者的連 l 6的轴心術，可在轉動軸406的驅動下 ^堯轉動軸406的軸心407旋轉，靜止時第一吸嘴物與 一吸嘴405为別與晶月存儲區4〇1與晶片放置區彻的 ^置對應。第一驅動桿條位於晶片存儲區401且第-驅 4〇9 ^ ’、日日片放置Q 409接近和遠離吸嘴。 在本發明之第-實施例中，僅第―吸嘴2G4和第二吸 =205與轉動軸206之間設有第一伸縮桿驗和第二伸縮 以驅動第一吸嘴綱和第二吸嘴2〇5接近和遠 日日片儲存區201與晶片放置區2〇9。而在本發明之第二 201243990 實施例中，採用僅在晶片儲存區401與晶片放置區4〇9分 別設置第一驅動桿408a和第二驅動桿4〇牝的這樣方式。 這樣使得晶片存儲區401與晶片放置區4〇9可以分別在第 -驅動桿4〇8a和第二驅動桿4〇8b的作用下執行接近和遠 離第-吸嘴撕和第二吸嘴4G5的移動。除上述内容外， 第二實施例中晶 取放裝置_的作動過程與第—實施例 中晶片取放裝12GG的作動過程基本相同，完成晶片的吸 取和放置過程。如此循環反覆，將晶片從；存儲區持續 放置到晶片放置區。 在第-實施例中’在晶片存儲區與晶片放置區與吸嘴 的共同作訂’實現了晶片吸取和晶片放置同時進行，提 高了整體的工作效率。 以本發明之第二實施例為基礎，在本發明之第三實施 =裝=”外一種方式分佈。…本發明晶片 取放裝置之第二貫施例的結構示意圖。圖5B為圖5A所示 晶片取放裝置之吸嘴部分的俯視示意圖。請結合參考圖认 與圖诏所示’晶片取放裝置的轉動軸是垂直紙 面放置的。第一吸嘴504與第二吸嘴505位於垂直於轉^ 5〇1的同一平面内’並且圍繞轉動軸506的 、、〜’二對稱分佈’兩者的連線穿過轉動轴506的轴 二5〇7 ’可在轉動轴5〇6 _動下圍繞 =旋轉’靜止時第一吸嘴5〇4與第二吸嘴5 片存儲區則與晶片放置區509的位置對應。 、曰曰 本發明中晶片存储區的第—工作平面的第—法線與 201243990 晶片放置區的第二工作平面的第二法線呈一定角。夾角為 〇度至180度。在上述各實施例中，夾角為180度，即晶 片存儲區的第一工作平面與晶片放置區的第二工作平面平 行相對設置。當然，夾角也可為其他角度。如下面的一個 實施例，夾角為90度，請參考圖6所示。 圖6為本發明晶片取放裝置之第四實施例的結構示意 圖。請參考圖6所示，晶片取放裝置600的晶片存儲區6〇1 的第一工作平面的第一法線與晶片放置區609的第二工作 平面的第二法線的夾角為90度。亦即，晶片存儲區6〇1 的第一工作平面與晶片放置區6〇9的第二工作平面垂直設 置。轉動軸606設置於夾角内。轉動轴606的轴心607如 圖6所示均分夾角。第一吸嘴604與第二吸嘴6〇5在垂肩 於轉動軸606的軸心607的同一平面内圍繞轉動軸6〇6试 軸心607均勻對稱分佈，且第一吸嘴6〇4與第二吸嘴 到軸心607的垂線之間的角度等於晶片存儲區^丨的第」 工作平面的法線與晶片放置區609的第二工作平面的法 之間的夾角’即90度。在轉動軸606的驅 一:: 604與第二吸嘴605可以圍繞轉動軸6〇6的軸心 本實施例巾，⑼取放裝置_錄晶^ 疋^ 述實施例中的作動過程相同，實現了吸取 助匕耘/、月, 進行，提高了工作效率。 置晶片同扣 在上述各實施例中，吸嘴的數量為兩 ， 發明的目的出發，吸嘴的數量不侷限於兩:。當然，從本 個、比如三個、四個、五個、六個等，口 "T以為更多 只要在垂直於轉動 16 201243990 二繞轉動軸的轴心均句對稱並相應 區即可。典型地，以本發明之第 =施^基礎上’在本發明之第五實施例中，吸嘴的數 除第一吸嘴、第二吸嘴外，更包括第三吸嘴、 四〇 ，在垂直於轉動轴的輪心的同一平面内四個 圍=，軸的軸心均句對稱分佈，且任意相鄰的兩個吸; 到轉動轴的軸心的垂線呈90度夹角。請參考圖7所示，晶 片取=裂置700包括晶片存儲區7〇卜晶片放置區、第 第二吸嘴705、第三吸嘴713、第四吸嘴714。 ° ° +直於轉動軸的軸心(請參閱圖SB的轉動軸规盘 軸心5(^)的同—平面内圍繞轉動㈣軸心、均勻對稱分佈Ϊ 如下歹财’ ^取放裝置取放^的具體作動過程 Η二I請參考圖7Α所示，在晶片取放裴置700初始靜 止狀㈣’晶片存儲區701放有待吸取的晶# 712 — 吸嘴704面向晶片存儲區期，並與晶片存館區則的待 吸取晶片712對應。待放置晶#的裝置位於晶片放置區· 上，第二吸嘴705面向晶片放置區7〇9 ,並與 IS的:工片的裝置對應。待放置晶片的裝置例“ 赉先一極體中用於放置晶片的金屬支架。 曰參考圖7Β戶斤示，在第一驅動桿7〇8a的驅動下 曰曰月存取區701向第一吸嘴704移動，在外力（圖π未絡 不）比如壓力的控制下第一吸嘴綱吸取晶片712。 7 在第-驅動桿7〇8a的驅動下，晶片存儲區γ〇1遠離=附有 17 201243990 晶片712的第一吸嘴704。 (3) 請參考圖7c所示，吸附有晶片712的第—吸嘴 704和沒有吸附晶片的第二吸嘴7〇5、第三吸嘴713、第四 吸嘴714在轉動軸的驅動下圍繞轉動軸的軸心旋轉，同時 晶片存儲區7 01與晶片放置區709分別在第一工作平面（圖 7C未繪示)與第二工作平面（圖7C未繪示）内平移，使得當 靜止時，晶片存儲區701上的待吸取晶片712對應沒有吸 附晶片712的第三吸嘴713，且晶片放置區709的待放置 晶片的裝置對應沒有吸附晶片712的第四吸嘴714。 (4) δ月參考圖7D所不’在第一驅動桿708a的驅動下 晶片存儲區701向沒有吸附晶片712的第三吸嘴713移 動，在外力（圖7D未繪示）比如壓力的控制下第三吸嘴713 吸取晶片712。隨後，在第一驅動桿708a的驅動下，晶片 存儲區701離開吸附有晶片712的第三吸嘴713。亦即， 沒有吸附晶片712的第三吸嘴713從晶片存儲區7〇1吸取 晶片712。 (5) 請參考圖7E所示，吸附有晶片712的第三吸嘴 弟吸°高704與沒有吸附晶片的第四吸嘴714、第二 705，在轉動軸的驅動下圍繞轉動軸的軸心旋轉，同 2片存儲區7〇1與晶片放置區7〇9分別在第一工作平面 j二工作平面内平移，使得當靜止時，；存儲區701 =的待吸取晶片712對應設有吸附晶片712的第二吸嘴 aa片放置區7〇9的待放置晶片的裝置對應吸附有晶 乃/12的第一吸嘴7〇4。 201243990 (6)請參考圖7f所示，在第一驅動桿708a的驅動下 晶片存儲區701向沒有吸附晶片712的第二吸嘴705移 動，且在第二驅動桿7〇8b的驅動下晶片放置區709向吸附 有晶片的第一吸嘴704移動。在外力（圖7未繪示）比如壤 力的控制下第二吸嘴705吸取晶片712，第一吸嘴704玫 置晶片712。隨後，在第一驅動桿7〇8a的驅動下，晶片存 儲區701離開吸附有晶片712的第二吸嘴705。在第二馬區 動桿7〇8b的驅動下，晶片放置區709離開沒有吸附晶片 712的第一吸嘴704。亦即，沒有吸附晶片的第二吸嘴7〇5 從晶片存儲區701吸取晶片712，且吸附有晶片712的第 一吸嘴704向晶片放置區709放置晶片712。 如此’依照上述(5)〜⑹的步驟循環進行，第一吸嘴 704、第二吸嘴、第三吸嘴713、第四吸嘴714依序麵 過晶片存儲區701或晶片放置區709。在第一驅動桿7〇8a 與第二驅動桿7〇8b、平移驅動裝置、轉動軸的共同配合 下，一個吸嘴吸取晶片的同時，另一個吸嘴放置晶片，實 現了吸取和放置晶片同時進行。包含四個以上吸嘴的情況 的作動過程與上述作動過程基本相同，總是能同時吸取和 放置晶片。當然，如同上述具有兩個以上的吸嘴的第五實 施例，亦可結合實施於上述任一實施例中。 在本發明中，藉由晶片存儲區、晶片放置區、吸嘴、 轉動軸、伸縮桿、驅動桿等的共同作用，使得在一個吸嘴 吸取晶片的同時另-個吸嘴在放置晶片，實現了吸取晶片 和放置晶片同時進行’提高了晶片取放的效率，提高整體 201243990 的生產效率。 本領域的技術人員可以對本發明進行各種更動與變 化而不脫離本發明的精神與範圍。這樣，倘若本發明/的這 些修改與變化屬於本發明的申請專利範圍及其等同技術的 範圍之内’則本發明也意圖包含這些更動與變化在内。 【圖式簡單說明】 圖1為習知晶片取放裝置的結構示意圖。 圖2為本發明晶片取放裝置之第一實施例的結構示意 圖。 圖3A〜圖3H為圖2所示晶片取放裝置的作動過程系 意圖。 ° 圖4為本發明晶片取放裝置之第二實施例的結構示意 圖。 圖5A為本發明晶片取放裝置之第三實施例的結構禾 意圖。 圖5B為圖5A所示晶片取放裝置之吸嘴部分的俯視示 意圖。 圖6為本發明晶片取放裝置之第四實施例的結構示意 圖。 圖7A〜圖7F為本發明晶片取放裝置之第五實施例的 作動過程示意圖。 【主要元件符號說明】 201243990 100 :晶片取放裝置 101 :晶片存儲區 102 :吸嘴 103 :轉動軸 104 :伸縮桿 105 :晶片放置區 200、400、500、600、700 :晶片取放裝置 2(H、4(U、5(H、601、701 :晶片存儲區 202 :晶片存儲盤 203 :第一工作平面 2〇4、404、504、604、704 :第一吸嘴 205、 405、505、605、705 :第二吸嘴 206、 406、506、606 :轉動轴 207、 407、507、607 :軸心 208a :第一伸縮桿 208b :第二伸縮桿 209、409、509、609、709 :晶片放置區 210 :晶片放置盤 211 :第二工作平面 212、712 :晶片 408a、708a :第一驅動桿 408b、708b :第二驅動桿 713:第三吸嘴 714 :第四吸嘴 21201243990 VI. Description of the Invention: [Technical Field] The present invention relates to a pick-and-place device, and more particularly to a pick-and-place device for a light-emitting diode wafer. [Prior Art] Light-emitting diodes are known as green lighting products in the 21st century, and they are highly concerned with low operating voltage, low power consumption, high luminous efficiency, and long life. An important component in the structure of a light emitting diode is a wafer. It is because of the wafer that the light-emitting diodes will illuminate. In the fabrication of the light-emitting diode, the wafer is diced into a single wafer. The wafer is fixed to the holder of the light-emitting diode by a die bonding technique. Since the wafer is small in size and fragile, it is difficult to manually move the wafer during the die bonding process. In order to solve the above problems, a special wafer pick-and-place device is generally used to take the crystal moon and take it to a predetermined position. Referring to the drawings, a conventional wafer pick-and-place device 100 mainly includes a wafer storage area 101, a wafer placement area 105, a nozzle 102, a rotating shaft 103, and a telescopic rod 104 that connects the nozzle 1〇2=the rotating shaft 1〇3. . The wafer storage area 101 is used to store the wafer to be taken. The wafer placement area 105 is used to place a device for placing a wafer, such as a metal holder for placing a wafer in a light-emitting diode. The nozzle is rotated by the rotation shaft 103. The telescopic rod 1〇4 drives the suction nozzle 1〇2 to approach and away from the wafer storage area 101 and the wafer placement area. The operation of the wafer pick-and-place device is as follows: the nozzle 1 面对 2 faces the position where the wafer storage area 1 () 1 is located at the initial standstill. After the device is started, the nozzle moves 4 201243990, which is driven by the telescopic rod 104 to approach the wafer storage area 1〇1. The nozzle 1 〇 2 sucks the wafer under the action of an external force such as pressure. It is then moved away from the wafer storage area 101 by the extension of the telescopic rod 1〇4. After leaving the wafer storage area 〇1, the surface facing the wafer placement area 1〇5 is rotated by the rotation shaft 103. The wafer placement area 1〇5 is driven by the extension of the telescopic rod 104. The wafer is placed under the action of an external force such as pressure. Driven away from the wafer, zone 105 is driven by telescoping rods 1〇4. Finally, under the driving of the rotating shaft 1〇3, returning to the position facing the wafer storage 101, the wafer is removed from the suction to the placement. In this cycle, the wafer is continuously placed from the wafer storage area 1〇1 to the wafer placement area 1G5. However, such a card release device is less efficient and limits overall production efficiency. SUMMARY OF THE INVENTION In view of the above disadvantages of the wafer pick-and-place device, it is an object of the present invention to provide a highly efficient wafer pick-and-place device. To achieve the above object, the present invention provides a wafer pick-and-place apparatus comprising a wafer storage area, a wafer placement area, a rotating shaft, and a first nozzle and a second nozzle disposed on the rotating shaft. The rotating shaft rotates to drive the first nozzle and the second nozzle to place the wafer from the (9) storage area to the wafer. Wherein, the first suction = the axis of the second nozzle in a plane perpendicular to the axis of rotation (four) on the same plane as the axis of the shaft (4) is said to correspond to the wafer storage area and the wafer placement to distinguish the mouth and the mouth from the first nozzle Pass through the axis of the rotating shaft. The crystal 1 picking and placing device further comprises a first telescopic rod and a second telescopic rod. The first telescopic joint connects the first nozzle and the rotating shaft, driving the first nozzle to approach and far 201243990 from the wafer storage area and the wafer placement area. The second telescopic rod connects the second nozzle with the rotating shaft to drive the second nozzle to approach and away from the wafer storage area and the wafer placement area. The sundial storage area has a first working plane. The wafer stores a translational driving device, and the storage area of the secret chip is translated in the first step (4). The wafer placement area has a second work plane. The crystal has a second translating drive that drives the wafer placement zone to translate in the second range. – The first normal of the first working plane of the 180th slice of the zone is placed at an angle to the second normal of the wafer. The angle is . When the angle is 180 degrees, the first working plane of the wafer storage area is disposed in parallel with the second working plane of the wafer placement area. ^ When the angle is 90 degrees, the first working plane of the wafer storage area is perpendicular to the second working plane of the wafer placement area. The specific operation flow of the wafer pick-and-place device for picking and placing the wafer is as follows: (1) When the wafer pick-and-place device is initially in a stationary state, the crystal to be sucked is located in the wafer storage area, the first nozzle is facing the wafer storage area, and the disk is crystallized. The core storage area corresponds to the wafer to be sucked. The device to be placed on the wafer is placed on the wafer. The second nozzle faces the wafer placement area and is placed in the wafer placement area: 曰 corresponds to the 曰2 device. The wafer to be placed is, for example, a (four) diode: a metal holder for placing a wafer. Service (2) The first nozzle is driven by the first telescopic rod to the wafer storage area; 6 201243990, under the control of external force such as pressure, the nozzle sucks the wafer. (3) The first suction of the wafer is driven away from the wafer storage area by the driving of the first telescopic rod. (4) The first nozzle that adsorbs the wafer and the second nozzle that does not adsorb the wafer rotate in the rotation direction, such as dumping and crystallizing, and the zones are respectively in the first-working plane and the second-guard plane = shifting The wafer to be sucked in the "stationary" wafer storage area corresponds to the second nozzle which does not adsorb the wafer. The device to be placed in the wafer placement area corresponds to the first nozzle to which the wafer is adsorbed. (5) In the second telescopic rod Under the driving, the second nozzle that does not adsorb the wafer moves to the wafer storage ship, and at the same time, the first nozzle that adsorbs the wafer moves to the wafer placement area under the first extension, and after the arrival, the two nozzles are The external force, such as pressure, respectively sucks and places the wafer. That is, the second nozzle that does not adsorb the sa-slice absorbs the wafer on the daily storage area, and the first nozzle that adsorbs the wafer places the wafer on the wafer. (6) Under the driving of the second telescopic rod, the second nozzle with the wafer adsorbed leaves the day = storage area' while the first nozzle that does not adsorb the wafer leaves the wafer under the driving of the first telescopic rod Placement area (7) Driven by the rotating shaft The nozzle rotates around the axis of the rotating shaft. The wafer storage area and the wafer placement area are respectively shifted in the -X plane and the second work = surface so that when stationary, the first nozzle that does not adsorb the wafer faces the wafer storage The second nozzle of the absorbing chip faces the placement area. Under the driving of the telescopic rod, the first suction port 曰曰+ storage area of the adsorption wafer is not moved, and under the driving of the second extension rod, the 201243990 wafer is adsorbed. The second nozzle moves toward the wafer placement area. At the same time, the two nozzles simultaneously suck and place the wafer under the action of external force such as pressure. That is, the first nozzle without adsorbing the wafer sucks the wafer on the wafer storage area. The second nozzle that adsorbs the wafer places the wafer in the wafer placement area. (9) The first nozzle that adsorbs the wafer leaves the wafer storage area and is driven by the second telescopic rod under the driving of the first telescopic cassette. Next, the second nozzle that does not adsorb the wafer leaves the wafer placement area. Thus, the state in step (3) is restored. Thus, the steps of repeating (4) to (9) are repeated, and the wafer is continuously placed from the wafer storage area. The wafer pick-and-place device may further include a first driving rod and a second driving rod. The first driving rod is connected to the wafer storage area to drive the wafer storage area to be close to and away from the first nozzle or the second nozzle. The driving rod is connected to the wafer placement area to drive the wafer placement area to be close to and away from the first nozzle or the second nozzle. The wafer pick-and-place device may also include a third nozzle and a fourth nozzle. The third nozzle and the fourth nozzle The nozzle is uniformly symmetrically distributed around the axis of the rotating wheel in a plane perpendicular to the axis of the rotating shaft. The wafer pick-and-place device of the present invention has a structure of a wafer storage area, a wafer placement area, a nozzle, a rotating shaft, a telescopic rod, and the like. The synergy is that one nozzle sucks the wafer in the wafer storage area while the other nozzle places the wafer in the enemy area of the wafer, which realizes the simultaneous extraction of the wafer and the placement of the wafer, and the efficiency of the wafer pick-and-place is also improved, and the whole is improved. Production efficiency. The above described features and advantages of the present invention will become more apparent from the following description. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described with reference to the accompanying drawings, and the description of the specific embodiments is merely illustrative of the invention and is not intended to limit the invention. Fig. 2 is a schematic view showing the configuration of a first embodiment of the wafer pick-and-place device of the present invention. Referring to FIG. 2, the wafer pick-and-place device 200 mainly includes a wafer storage area 201, a wafer placement area 209, first and second nozzles 204 and 205, a rotating shaft 206, and a first nozzle 204 and a second. The nozzle 2〇5 and the first telescopic rod 208a and the second telescopic rod 208b of the rotating shaft 206. The wafer storage area 201 has a first work plane 203. The first working plane 2〇3 is the working plane of the wafer storage area 201 for storing the wafer storage tray 202 of the wafer to be sucked. The wafer placement area 2〇9 has a second work plane 211. The second working plane 211 is the working plane of the wafer placement area 209 for placing the wafer placement tray 21 to which the wafer is to be placed. The first normal line of the first working plane 203 of the wafer storage area 2〇1 (not shown in FIG. 2) and the second normal line of the second working plane 211 of the wafer placement area 2〇9 (not shown in FIG. 2) The angle is 18 degrees. That is, the first working plane 203 of the wafer storage area 201 is disposed in parallel with the second working plane 21 of the wafer placement area 2〇9. The rotating shaft 206 is disposed between the first working plane 203 and the second working plane 211 and is equally divided. That is, the axis 2〇7 of the rotating shaft 206 shown in FIG. 2 is parallel to the first working plane 2〇3 and the second working plane 211. The first nozzle 204 and the second nozzle 205 are located in the same plane perpendicular to the axis 207 of the rotating shaft 206, and are uniformly symmetrically distributed around the axis 207 of the rotating shaft 206, and the connection between the two passes through the rotating 201243990 shaft 206. The axis, 207, can be rotated around the axis 207 of the rotating shaft 206 under the driving of the rotating shaft writing. When the stationary nozzle is stationary, the first nozzle 2〇4 is stored and placed with the wafer (4) 2Q9 = a telescopic rod 208a is located at the first suction The mouth 2〇4 and the rotating shaft 2〇6^ should f approach the first nozzle 2〇4 and away from the wafer storage view iL 〇9. The second telescopic rod 鸠 is located between the second suction nozzle 205 and the rotating shaft 206. The second telescopic rod 2_ drives the first and the farthest from the wafer storage area 201 or the wafer placement area. % 〇5 is close to the production area of the wafer in the wafer storage area. The wafers and wafers stored in the wafer storage area are arbitrarily arranged in a number of neatly arranged to assemble the production to improve efficiency. The first nozzle driving nozzle 205 can accurately pick up and place different wafers, and the first translation driving device (not shown in FIG. 2) can be used to drive the wafer storage area 201 to perform a small range of translation in the first working plane 203. And the second translation driving device (not shown in FIG. 2) is driven, the sheet placement area 2. 9 is flat in the second reading plane 211, so that when stationary, there is always a waiting to be taken in the wafer storage area 201. The sheet corresponds to the nozzle, and there is always one device to be placed in the wafer placement area 209 corresponding to the other nozzle. This is combined with the movement of the first nozzle 204 and the first nozzle 205 to effect simultaneous wafer picking and placement. In the present embodiment, the specific operation process of the wafer pick-and-place device for picking and placing the wafer is as follows: (1) Please refer to FIG. 3A, in which the wafer pick-and-place device is initially stationary: the wafer storage area 2〇1 remains to be placed The sucked wafer 212 (actually the wafer cassette is placed on the wafer storage tray 202, for simplicity of description, then 201243990 is referred to as the wafer m is placed on the wafer storage area 2 (1), which will not be described below). The first nozzle 204 faces the wafer and is corresponding to the crystallized wafer 212 to be sucked. The device to be placed on the wafer is located on the wafer placement area 209 (actually, the device to be placed on the wafer is located on the wafer placement tray 210, In order to simplify the description, the device to be placed after the wafer is placed is located in the wafer placement area 2G9 ± , which will not be described below. The second nozzle ^ faces the wafer placement area 2G9' and corresponds to the device of the wafer placement area 2 () 9 on which the wafer is to be placed. The device to be placed is, for example, a metal holder for placing the wafer 212 in the light-emitting diode. (2) Please refer to ® 3B, the first nozzle moves to the wafer storage area 2〇1 under the driving of the first telescopic rod, and the first force is controlled by external force (Fig. 3B is not green), such as pressure control. The nozzle 2〇4 picks up the wafer 212.曰 (3) Referring to H3C, the first nozzle 2〇4, to which the wafer 212 is adsorbed, is driven away from the wafer storage area 2〇 by the first telescopic rod inspection. (4) Referring to FIG. 3D, the first nozzle 204 to which the wafer 212 is adsorbed and the second nozzle 2〇5 which is not adsorbed, the second nozzle 2〇5 is rotated about the axis 2〇7 of the rotating shaft 206 under the driving of the rotating shaft. . The wafer storage area 2〇1 and the wafer placement area 2〇9 are respectively translated in the first working plane 2〇3 and the second working plane 211, so that when the image is stationary, the wafer storage area is 2〇1±the wafer to be sucked Corresponding to the second nozzle 2G5 which does not adsorb the wafer, and the device in which the wafer is to be placed in the wafer placement period corresponds to the first nozzle 2〇4 to which the wafer 212 is adsorbed. (5) Please refer to the ffl 3E indicator, under the driving of the second telescopic rod ,, the second nozzle 2〇5 which does not adsorb the wafer moves to the wafer storage area 2〇1 while being driven by the first telescopic rod 208a. The first suction 11 201243990 to which the wafer 212 is adsorbed moves to the wafer placement area 209. At the same time, the first nozzle 2〇4 and the first nozzle 205 simultaneously suck and place the wafer under the action of an external force such as pressure. That is, the second nozzle 2〇5 which does not adsorb the wafer picks up the wafer 212 on the wafer storage area 201, and the first nozzle 2〇4 which adsorbs the wafer 212 places the wafer 212 in the wafer placement area 209. (6) Referring to FIG. 3F, under the driving of the second telescopic rods 2〇8b, the second nozzle 205 having the wafer 212 adsorbed thereon is separated from the wafer storage area 201 while being driven by the first telescopic rod 208a, The first nozzle 204 that adsorbs the wafer exits the wafer placement zone 209. (7) Referring to Fig. 3G, under the driving of the rotating shaft 206, the first suction nozzle 204 which does not adsorb the wafer and the second suction nozzle 205 which adsorbs the wafer 212 rotate around the axis 207 of the rotating shaft 206. The wafer storage area 201 and the wafer placement area 209 are respectively translated in the first working plane 203 and the second working plane 211 such that when stationary, the first nozzle 2〇4 which does not adsorb the wafer faces the wafer storage area 201, and is adsorbed. The second nozzle 205 having the wafer 212 faces the wafer placement area 209. (8) Referring to FIG. 3H, under the driving of the first telescopic rod 208a, the first nozzle 204 that does not adsorb the wafer moves toward the wafer storage area 201, while the wafer is adsorbed by the second telescopic rod 208b. The second nozzle 205 of 212 moves toward the wafer placement area 209. At the same time, the first nozzle 204 and the second nozzle 205 respectively suck and place the wafer under the action of an external force such as pressure. That is, the first nozzle 204 which does not adsorb the wafer picks up the wafer 212 on the wafer storage area 201, and the second nozzle 205 which sucks the wafer 212 places the wafer 212 in the wafer placement area 209. 12 201243990 (9) Under the driving of the first telescopic rod 208a, the first nozzle 204 to which the wafer 212 is adsorbed is separated from the wafer storage area 201, and under the driving of the second telescopic rod 2〇8b, there is no second to adsorb the wafer. The nozzle 205 exits the wafer placement area 209. Thus, the state shown in Fig. 3C in the step (3) is restored. The steps of repeating (4) to (9) are thus repeated, and the wafer 212 is continuously placed from the wafer storage area 201 to the wafer placement area 209. The wafer pick-and-place device performs the wafer pick-and-place operation process, and simultaneously sucks the wafer and places the wafer under the action of the wafer storage area, the wafer placement area, the rotating shaft, the first telescopic rod, the second telescopic rod and the two suction nozzles. The efficiency of picking and placing the wafer is greatly improved, the operation efficiency of the device is improved, and the overall production efficiency is improved. In the above-described first embodiment of the present invention, a telescopic rod is provided only between the suction nozzle and the rotating shaft for driving the suction nozzle to approach and away from the wafer storage area or the wafer placement area. Of course, it is also possible to provide a drive rod ′ for separately driving the wafer storage area from the wafer placement area and away from the nozzle only in the wafer storage area and the wafer placement. Of course, it is more preferable to provide a driving rod in the wafer storage area and the wafer placement area while the telescopic rod is disposed between the nozzle and the rotating shaft for driving the nozzle to approach and away from the wafer storage area and the wafer placement area. In the second embodiment of the present invention, the wafer storage area and the wafer placement area are driven to approach and away from the nozzle by merely providing a drive rod in the wafer storage area and the wafer placement area, respectively. This will be explained in detail below. Fig. 4 is a view showing the configuration of a second embodiment of the wafer pick-and-place apparatus of the present invention. Referring to FIG. 4, a wafer pick-and-place device 400 mainly includes: a wafer storage area 401, a wafer placement area 409, a first suction nozzle 404, and a second suction 13 201243990 nozzle 405 'rotation shaft 406, and a wafer storage area 4 - the same as the second two-second embodiment of the wafer placement area 409, the wafer storage area 〇1 and the wafer placement area can be = 'small flat in its 4 planes = no wafer storage area and wafer placement area The first normal line of the first working plane of the working plane 4 (the sound is not shown in Fig. 4, the angle is (10) degrees. That is, the third working plane equivalent to the wafer storage = the second working plane 211 of the setting area 209) Parallel relative sigh. The rotating shaft 406 is disposed at an angle between the first working plane and the second working plane=Qiu, that is, the paralleling of the rotating shaft and the working plane and the second working plane. The first nozzle 215 is located in the same plane perpendicular to the axis 4〇7 of the rotation axis 4〇6, and the axis 407 of the shaft 406 is uniformly symmetrically distributed, and the axial center of the two is connected. The axis 407 of the rotating shaft 406 can be rotated by the rotation shaft 406. When the stationary nozzle is stationary, the first nozzle and the nozzle 405 are separated from the crystal storage area 4〇1 and the wafer placement area. correspond. The first drive bar is located in the wafer storage area 401 and the first drive 4 Q9 is placed near and away from the nozzle. In the first embodiment of the present invention, only the first suction nozzle 2G4 and the second suction pressure 205 and the rotation shaft 206 are provided with a first telescopic rod inspection and a second telescopic movement to drive the first nozzle and the second suction. The mouth 2〇5 approaches and the far day wafer storage area 201 and the wafer placement area 2〇9. In the second 201243990 embodiment of the present invention, the first driving lever 408a and the second driving lever 4 are disposed only in the wafer storage area 401 and the wafer placement area 4〇9, respectively. This allows the wafer storage area 401 and the wafer placement area 4〇9 to perform approach and away from the first-nozzle tear and the second nozzle 4G5 under the action of the first-drive rod 4〇8a and the second drive rod 4〇8b, respectively. mobile. In addition to the above, the operation of the wafer pick-and-place apparatus _ in the second embodiment is substantially the same as the operation of the wafer pick-and-place unit 12GG in the first embodiment, and the wafer picking and placing process is completed. This cycle is repeated to continuously place the wafer from the storage area to the wafer placement area. In the first embodiment, 'co-binding between the wafer storage area and the wafer placement area and the nozzle' enables wafer pickup and wafer placement to be performed simultaneously, improving the overall work efficiency. Based on the second embodiment of the present invention, in the third embodiment of the present invention, the distribution of the second embodiment of the present invention is a schematic diagram of the second embodiment of the wafer pick-and-place device of the present invention. FIG. 5B is a schematic diagram of FIG. 5A. A schematic plan view of the nozzle portion of the wafer pick-and-place device is shown. Referring to the reference figure, the rotating axis of the wafer pick-and-place device is placed perpendicular to the paper. The first nozzle 504 and the second nozzle 505 are vertically The line connecting the two and the two symmetrical distributions around the axis of rotation 506 in the same plane of the rotation axis 506 passes through the axis 2 of the rotation axis 506, which can be on the axis of rotation 5〇6 _ The first nozzle 5 〇 4 and the second nozzle 5 sheet storage area correspond to the position of the wafer placement area 509 when the motion is rotated. 曰曰 The first working plane of the wafer storage area in the present invention - the normal is at an angle to the second normal of the second working plane of the 201243990 wafer placement zone. The included angle is from 180 degrees to 180 degrees. In the above embodiments, the angle is 180 degrees, ie the first work of the wafer storage area The plane is disposed in parallel with the second working plane of the wafer placement area Of course, the angle can also be other angles. As an embodiment below, the angle is 90 degrees, please refer to FIG. 6. Fig. 6 is a schematic structural view of the fourth embodiment of the wafer pick-and-place device of the present invention. As shown in FIG. 6, the angle between the first normal line of the first working plane of the wafer storage area 610 of the wafer pick-and-place device 600 and the second normal line of the second working plane of the wafer placement area 609 is 90 degrees. The first working plane of the wafer storage area 6〇1 is disposed perpendicular to the second working plane of the wafer placement area 6〇9. The rotating shaft 606 is disposed within the included angle. The axis 607 of the rotating shaft 606 is equally divided as shown in FIG. The first nozzle 604 and the second nozzle 6〇5 are uniformly symmetrically distributed around the rotation axis 6〇6 in the same plane of the axis 607 of the rotation axis 606, and the first nozzle 6〇4 The angle between the second nozzle and the perpendicular to the axis 607 is equal to the angle 'that is 90 degrees between the normal of the first working plane of the wafer storage area and the second working plane of the wafer placement area 609. The driving one:: 604 of the rotating shaft 606 and the second suction nozzle 605 can be around the axis of the rotating shaft 6〇6, and the operation process in the embodiment of the pick-and-place device_recording device is the same. Achieved the absorption of aid, / month, carried out, and improved work efficiency. In the above embodiments, the number of nozzles is two. For the purpose of the invention, the number of nozzles is not limited to two: Of course, from this, such as three, four, five, six, etc., the mouth " T thought more as long as the axis perpendicular to the rotation of the 16 201243990 two-axis axis is symmetrical and corresponding area. Typically, in the fifth embodiment of the present invention, the number of nozzles includes a third nozzle and a fourth nozzle in addition to the first nozzle and the second nozzle. In the same plane perpendicular to the center of the wheel of the rotating shaft, the four axes are symmetrically distributed, and any two adjacent suctions; the perpendicular to the axis of the rotating shaft is at an angle of 90 degrees. Referring to FIG. 7, the wafer take-up 700 includes a wafer storage area 7 and a wafer placement area, a second nozzle 705, a third nozzle 713, and a fourth nozzle 714. ° ° + Straight to the axis of the rotating shaft (please refer to Figure SB, the axis of the rotating shaft of the rotating shaft 5 (^) in the same plane around the rotation (four) axis, evenly symmetric distribution Ϊ as follows ^ ' ' ^ pick and place device The specific operation process of the discharge is as shown in FIG. 7A, in which the wafer pick-and-place device 700 is initially stationary (four) 'the wafer storage area 701 is placed with the crystal #712 to be sucked--the nozzle 704 faces the wafer storage area, and Corresponding to the wafer to be sucked by the wafer storage area 712. The device to be placed on the wafer # is located on the wafer placement area, and the second nozzle 705 faces the wafer placement area 7〇9 and corresponds to the apparatus of the IS: sheet. An example of a device to be placed on a wafer is a metal holder for placing a wafer in a first-pole body. Referring to FIG. 7 , the first access rod 7 〇 8a is driven by the first driving rod 7 〇 8a. The nozzle 704 moves, and the first nozzle sucks the wafer 712 under the control of an external force (Fig. π is not), such as pressure. 7 The wafer storage area γ〇1 is driven away by the driving of the first driving rod 7〇8a. There is a first nozzle 704 of the 17 201243990 wafer 712. (3) Referring to FIG. 7c, the first wafer 712 is adsorbed. The suction nozzle 704 and the second suction nozzle 7〇5, the third suction nozzle 713, and the fourth suction nozzle 714 without the adsorption wafer are rotated around the axis of the rotation shaft by the rotation shaft while the wafer storage area 71 and the wafer are placed. The area 709 is translated in the first working plane (not shown in FIG. 7C) and the second working plane (not shown in FIG. 7C), respectively, so that when stationary, the wafer 712 to be sucked on the wafer storage area 701 corresponds to no adsorbed wafer 712. The third nozzle 713, and the device of the wafer placement area 709 where the wafer is to be placed corresponds to the fourth nozzle 714 which does not adsorb the wafer 712. (4) The δ month is not driven by the first driving rod 708a with reference to FIG. 7D. The wafer storage area 701 moves to the third suction nozzle 713 which does not adsorb the wafer 712, and the third suction nozzle 713 sucks the wafer 712 under the control of an external force (not shown in FIG. 7D) such as pressure. Subsequently, the driving of the first driving rod 708a is performed. Next, the wafer storage area 701 leaves the third nozzle 713 to which the wafer 712 is adsorbed. That is, the third nozzle 713 which does not adsorb the wafer 712 sucks the wafer 712 from the wafer storage area 7〇1. (5) Please refer to FIG. 7E It is shown that the third nozzle that adsorbs the wafer 712 absorbs a high 7 The fourth nozzle 714 and the second 705, which are not absorbing the wafer, are rotated around the axis of the rotating shaft under the driving of the rotating shaft, and the same two storage areas 7〇1 and the wafer placing area 7〇9 are respectively in the first work. The plane j is shifted in the working plane so that when it is stationary, the wafer 712 to be sucked in the storage area 701 is correspondingly adsorbed by the device to be placed in the second nozzle aa sheet placement area 7〇9 of the adsorption wafer 712. The first nozzle 7〇4 of the crystal/12. 201243990 (6) Please refer to FIG. 7f, under the driving of the first driving rod 708a, the wafer storage area 701 moves to the second nozzle 705 which does not adsorb the wafer 712, And the wafer placement area 709 is moved to the first nozzle 704 to which the wafer is adsorbed by the driving of the second driving lever 7〇8b. The second nozzle 705 draws the wafer 712 under the control of an external force (not shown in Fig. 7) such as soil, and the first nozzle 704 embosses the wafer 712. Subsequently, the wafer storage area 701 is driven away from the second suction nozzle 705 to which the wafer 712 is adsorbed, driven by the first driving lever 7A8a. Driven by the second horse moving rod 7〇8b, the wafer placement area 709 exits the first nozzle 704 which does not adsorb the wafer 712. That is, the second nozzle 7〇5 which does not adsorb the wafer sucks the wafer 712 from the wafer storage area 701, and the first nozzle 704 to which the wafer 712 is adsorbed places the wafer 712 toward the wafer placement area 709. Thus, the first nozzle 704, the second nozzle, the third nozzle 713, and the fourth nozzle 714 are sequentially passed through the wafer storage area 701 or the wafer placement area 709 in accordance with the above steps (5) to (6). Under the cooperation of the first driving rod 7〇8a and the second driving rod 7〇8b, the translation driving device and the rotating shaft, one nozzle sucks the wafer while the other nozzle places the wafer, thereby realizing the simultaneous suction and placement of the wafer. get on. The operation of the case of containing more than four nozzles is basically the same as the above-described actuation process, and the wafer can always be sucked and placed at the same time. Of course, the fifth embodiment having two or more suction nozzles as described above may be combined with any of the above embodiments. In the present invention, by the cooperation of the wafer storage area, the wafer placement area, the suction nozzle, the rotating shaft, the telescopic rod, the driving rod, etc., the wafer is sucked by one nozzle while the other nozzle is placed on the wafer. The process of drawing and placing the wafer simultaneously improves the efficiency of wafer pick-and-place and improves the overall productivity of 201243990. A person skilled in the art can make various changes and modifications to the invention without departing from the spirit and scope of the invention. Thus, it is intended that the present invention cover the modifications and variations of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic structural view of a conventional wafer pick-and-place device. Fig. 2 is a schematic view showing the configuration of a first embodiment of the wafer pick-and-place device of the present invention. 3A to 3H are views showing the operation of the wafer pick and place device shown in Fig. 2. Figure 4 is a schematic view showing the structure of a second embodiment of the wafer pick-and-place device of the present invention. Fig. 5A is a view showing the structure of a third embodiment of the wafer pick-and-place device of the present invention. Figure 5B is a top plan view of the nozzle portion of the wafer pick-and-place device of Figure 5A. Fig. 6 is a view showing the configuration of a fourth embodiment of the wafer pick-and-place apparatus of the present invention. 7A to 7F are schematic views showing the operation of the fifth embodiment of the wafer pick-and-place device of the present invention. [Description of main component symbols] 201243990 100: wafer pick-and-place device 101: wafer storage area 102: suction nozzle 103: rotating shaft 104: telescopic rod 105: wafer placement area 200, 400, 500, 600, 700: wafer pick-and-place device 2 (H, 4 (U, 5 (H, 601, 701: wafer storage area 202: wafer storage disk 203: first working plane 2〇4, 404, 504, 604, 704: first nozzles 205, 405, 505 605, 705: second nozzles 206, 406, 506, 606: rotating shafts 207, 407, 507, 607: axis 208a: first telescopic rod 208b: second telescopic rods 209, 409, 509, 609, 709 : wafer placement area 210 : wafer placement tray 211 : second work plane 212 , 712 : wafer 408 a , 708 a : first drive lever 408 b , 708 b : second drive lever 713 : third suction nozzle 714 : fourth suction nozzle 21