CN203401218U - Sucking disc fixation device for LED wafer laser cutting - Google Patents
Sucking disc fixation device for LED wafer laser cutting Download PDFInfo
- Publication number
- CN203401218U CN203401218U CN201320363077.6U CN201320363077U CN203401218U CN 203401218 U CN203401218 U CN 203401218U CN 201320363077 U CN201320363077 U CN 201320363077U CN 203401218 U CN203401218 U CN 203401218U
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- CN
- China
- Prior art keywords
- disc
- sucking disc
- sucker
- shaped block
- buckle
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility module provides a sucking disc fixation device for LED wafer laser cutting. The sucking disc fixation device comprises a sucking disc which is driven to rotate by a motor. A disc sheet is arranged on the sucking disc. The circumference of the sucking disc is connected with fixation mechanisms which are for fixing the disc sheet and are in close connection with the sucking disc. Each of the fixation mechanisms comprises a T-shaped block which is connected to the edge of the sucking disc. The T-shaped end of the T-shaped block is connected with a clamping buckle which is in pivot connection with the T-shaped block through a straight pin. The straight pin and the T-shaped block are fixed through snap rings. The snap rings are arranged at the two ends of the straight pin respectively. The included angle between the clamping buckle and the T-shaped block is an acute angle. A stop block for limiting the disc sheet protrudes on the T-shaped block. The beneficial effects of the sucking disc fixation device are mainly reflected in that: when the sucking disc is rotating, the clamping buckle falls automatically due to the centrifugal force, so that a clamping disc is buckled, the clamping disc is enabled to be attached to the sucking disc more tightly; and when the sucking disc stops rotating, the clamping buckle bounces up automatically, so that operation personnel can take out the clamping disc conveniently, and the whole process is done quickly and conveniently.
Description
Technical field
The utility model relates to a kind of LED wafer sheet laser cutting sucker fixing.
Background technology
The structural principle of the absorption LED fixed disc of the wafer cutting machine of generally using in current LED wafer cutting industry is all roughly the same, be mainly take LED sucker do the airtight space of air-flow as basis, and then make to produce negative pressure in its airtight space with vaccum-pumping equipment, thereby play the fixing effect of absorption.This structure is comparison reasonable manner when cutting old LED wafer sheet; but at present new LED wafer sheet must be coated with on LED surface last layer protection glue before cutting; then the rotation of surperficial protection glue is got rid of evenly, make surperficial uniform film thickness, finally just can carry out laser cutting.
On market, the sucker structure of LED wafer cutting machine has just added sucker rotating mechanism in the novel wafer sheet of cutting now, after sucker highly rotates, only the negative pressure by chuck surface can not guarantee that LED fixed disc can not thrown away sucker by integral body at rotary course, although there is the wafer cutting machine of individual brand to add disc fixed structure except absorption and spinfunction, but this structure is all the modes such as the clinching of very rigidity or spring extruding hold out against, in practical operation, switching meeting between disc and disc is cumbersome and lose time, thereby operating efficiency is affected.
Utility model content
The purpose of this utility model is to solve above-mentioned technical problem, and a kind of LED wafer sheet laser cutting sucker fixing is provided.
The purpose of this utility model is achieved through the following technical solutions:
LED wafer sheet laser cutting sucker fixing, comprise the sucker by its rotation of driven by motor, described disc is placed on sucker, described sucker border is connected with for fixed disc and the close-connected fixed mechanism of sucker, described fixed mechanism comprises that one is connected in the T shape piece at sucker edge, on the T shape end of described T shape piece, be connected with a buckle, described buckle is pivotally connected by selling directly to households with T shape piece, described direct selling and T shape piece are fixed by snap ring, described snap ring is stuck in the two ends of direct selling, between described buckle and T shape piece, angle is acute angle, on described T shape piece, protrude and be provided with one for the spacing block of disc.
Preferably, have a permeable-gas ceramics piece on described sucker, described disc is arranged on permeable-gas ceramics top, described disc is a ring-type, in the middle of described disc, be provided with for placing the film of wafer sheet, described buckle can be connected in interior ring edge, the periphery of described disc and the block butt of disc.
Preferably, described fixed mechanism is provided with four, is distributed in the border of sucker.
The beneficial effects of the utility model are mainly reflected in: when sucker when rotated, buckle, because centrifugal force can automatically fall, fastens chuck.Chuck can be adsorbed on sucker more closely, and when stopping operating, buckle can be upspring automatically, the taking-up of handled easily personnel to chuck, and whole process is convenient and swift.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, technical solutions of the utility model are described further:
Fig. 1: the structural representation of laser cutting sucker whirligig of the present utility model.
Fig. 2: the fixed mechanism schematic diagram of the utility model disc.
The specific embodiment
The utility model has disclosed a kind of LED wafer sheet laser cutting sucker fixing, as shown in Figure 1, comprise the sucker 22 that is driven its rotation by motor 1, described disc 21 is placed on sucker 22, and described sucker 22 borders are connected with for fixed disc and the close-connected fixed mechanism 3 of sucker.The border that described fixed mechanism 3 is distributed in sucker 22 is provided with four.
Shown in Fig. 2, described fixed mechanism 3 comprises that one is connected in the T shape piece 4 at sucker edge, on the T shape end of described T shape piece 4, be connected with a buckle, described buckle is pivotally connected with T shape piece 4 by selling 51 directly to households, described direct selling 51 is fixing by snap ring 52 with T shape piece 4, and described snap ring 52 is stuck in the two ends of selling 51 directly to households.Between described buckle and T shape piece, angle is acute angle, on described T shape piece 4, protrudes and is provided with one for the spacing block 41 of disc.
On described sucker 22, have a permeable-gas ceramics piece (meaning not shown in the figures), described disc 21 is arranged on permeable-gas ceramics top.Described disc 21 is a ring-type, in the middle of described disc, is provided with for placing the film of wafer sheet, and wafer sheet is arranged on the center 23 of film, and described buckle can be connected in interior ring edge, the periphery of described disc and the block butt of disc.Concrete between film and disc be connected and wafer sheet be fixed as prior art, do not repeat them here.
At grade, ceramic block integral body has gas permeability simultaneously for described permeable-gas ceramics piece surface and sucker, and during vacuum suction, absorption has covered integral body, and adsorption efficiency is high.
Concrete, the angle between buckle upper end 32 and T shape piece 4 is acute angle, and meanwhile, because buckle lower end 32 is compared with buckle upper end 32 weights, motor 1 drives sucker 22 to rotate, and when reaching certain speed, 32 times, buckle upper end button, pushes down disc 21.Owing to also having passed through vacuum suction between disc and sucker, when motor 1 initial rotation, disc 21 can't depart from sucker.When motor 1 stops operating, upspring automatically in buckle upper end 32.Whole process does not need operating personnel manually it to be fixed, and fixed effect is good.
The utility model still has multiple concrete embodiment, and all employings are equal to replacement or equivalent transformation and all technical schemes of forming, within all dropping on the claimed scope of the utility model.
Claims (3)
1.LED wafer sheet laser cutting sucker fixing, comprise the sucker by its rotation of driven by motor, disc is placed on sucker, it is characterized in that: described sucker border is connected with for fixed disc and the close-connected fixed mechanism of sucker, described fixed mechanism comprises that one is connected in the T shape piece at sucker edge, on the T shape end of described T shape piece, be connected with a buckle, described buckle is pivotally connected by selling directly to households with T shape piece, described direct selling and T shape piece are fixed by snap ring, described snap ring is stuck in the two ends of direct selling, between described buckle and T shape piece, angle is acute angle, on described T shape piece, protrude and be provided with one for the spacing block of disc.
2. LED wafer sheet laser cutting sucker fixing as claimed in claim 1, it is characterized in that: on described sucker, have a permeable-gas ceramics piece, described disc is arranged on permeable-gas ceramics top, described disc is a ring-type, in the middle of described disc, be provided with for placing the film of wafer sheet, described buckle can be connected in interior ring edge, the periphery of described disc and the block butt of disc.
3. LED wafer sheet laser cutting sucker fixing as claimed in claim 2, is characterized in that: described fixed mechanism is provided with four, is distributed in the border of sucker.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320363077.6U CN203401218U (en) | 2013-06-24 | 2013-06-24 | Sucking disc fixation device for LED wafer laser cutting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320363077.6U CN203401218U (en) | 2013-06-24 | 2013-06-24 | Sucking disc fixation device for LED wafer laser cutting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203401218U true CN203401218U (en) | 2014-01-22 |
Family
ID=49937161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320363077.6U Expired - Lifetime CN203401218U (en) | 2013-06-24 | 2013-06-24 | Sucking disc fixation device for LED wafer laser cutting |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203401218U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104227247A (en) * | 2013-06-24 | 2014-12-24 | 江苏香江科技股份有限公司 | Sucker fixing device for laser cutting of LED (light emitting diode) wafers |
| CN110936039A (en) * | 2019-12-19 | 2020-03-31 | 北京航天控制仪器研究所 | Automatic positioning and clamping tool device for laser processing |
-
2013
- 2013-06-24 CN CN201320363077.6U patent/CN203401218U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104227247A (en) * | 2013-06-24 | 2014-12-24 | 江苏香江科技股份有限公司 | Sucker fixing device for laser cutting of LED (light emitting diode) wafers |
| CN110936039A (en) * | 2019-12-19 | 2020-03-31 | 北京航天控制仪器研究所 | Automatic positioning and clamping tool device for laser processing |
| CN110936039B (en) * | 2019-12-19 | 2021-09-03 | 北京航天控制仪器研究所 | Automatic positioning and clamping tool device for laser processing |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 212200 Jiangsu city of Yangzhong Province spring Willow Road No. 666 Patentee after: XIANGJIANG TECHNOLOGY Co.,Ltd. Address before: 212200 Jiangsu Xiangjiang Polytron Technologies Inc, Yangzhong, Zhenjiang, Jiangsu Patentee before: Jiangsu Xiangjiang Science and Technology Co.,Ltd. |
|
| CP03 | Change of name, title or address | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140122 |
|
| CX01 | Expiry of patent term |