201243369 六、發明說明： 【發明所屬之技術領域】 本發明係有關於—種光電零組件之檢測方法，特別是 指-種將待檢測之光電零組件遞送至一積分球内部以進行 特性檢測之檢測方法。本發明亦同時涉及一種實施前述檢 測方法之檢測設備。 【先前技術】 身又而w诸如發光一極體(light emitting diode，LED) 單晶粒封裝或封裝模組等光電零組件，在出廠前大都需經 j特性檢測’以藉由諸如發光強度等參數作為判斷標準對 月'J述光電零組件進行分級。前述光電零組件進行檢測時， 通常係藉由治具或點測器(prober)與該光電零組件電性接 觸並供給檢測電力使其發光，財m性檢測之進行。其次， 由於藉助積分球(integrating sphere)來進行檢測可獲得更為 準確之檢測結果，對於檢測結果精準度要求較為嚴格之廠 商而言，使用積分球進行檢測之方式已是不可避免之趨勢。 就現行之配合積分球運作之自動化檢測機械而言由 於點測器或治具本身之結構特性，或者因為待檢測料件之 遞送機構設計之關係，或者考量到單位時間之檢測量，大 都採取將待檢測之光電零組件輸送至位於該積分球外部靠 近積分球光線入口處之方式，來進行檢測，然而以此種 模式進行檢測，光電零組件所發出之光線容易受周圍環境 因素干擾，而影響其量測準確度。 义 其次，由於載板上晶片（Chip on Board，c〇B)封裝技 201243369 術具備高成本效益以及高彈性設計等特性，目前有廣被業 者採用之趨勢。然而，就申請人目前所知，針對CQB封裝 LED模組，目前並無一種檢測結果準確度較高且/或檢測速 度較快之檢測方法或者檢測設備。 【發明内容】 有鑑於此，本發明之目的之一在於提供一種光電零組 件之檢測方法，係藉助積分球進行檢測，且可獲得更準確 的檢測結果者。 為達成上述目的，本發明所提供之一種光電零組件之 檢測方法，包含有以下步驟：a)將一位於一進料位置之光 電=組件位移至-對應-積分球之開口之待檢測位置；b) 將刚述光電零組件位移至該積分球内部，使該光電零組件 與一位於該積分球内部之點測器(prober)電性接觸，以進行 該光電零組件之特性制；e)將制完成之光電零組件位 移出該積分球；以及d)將前述檢測完成之光電零組件位 移至一出料位置。由於在本發明所提供之檢測方法中光 電零組件係被位移至該積分球⑽，而與設於該積分球内 =之點測器紐接觸，因此該找零組件可於該積分球内 部發光以進行特性檢測，故可獲得更準確的量測值。 在本發明所提供之檢測方法中，光電零組件以具有位 於同一面之複數個電性接點與一發光區為較佳。如此，在 步驟b)中’光電零組件可以以該發光區面向積分球内部之 气位移至積分球内部，使位於同一面之電性接點可直 接與點測器電性接觸。 201243369 在士發明所提供之檢測方法中，設置於該積分球内部 之點測器可包含有一探針座以及複數個固定於該探針座 探針，且在步驟b>中，該光電零組件係位移至該點測器之 下方，使該複數個電性接點與該複數個探 性接觸，並使該發光區可於該積分球内部朝上 在本發明所提&之檢測方法巾，可轉性地包含 清針用品位移域積分球㈣，使該清制品與各該— 針接觸之步驟。至於料針用品，可錢（但不限於 紙或有機溶劑。 / 、一在本發明所提供之檢測方法中，在步驟&卜廿)中可 二糟由（但不限於使用）一旋轉分度機構將該光電零組件 7平地自該進料位置位移至該待檢測位置以及該出料位 置。 在本發明所提供之檢測方法中，前述旋轉分度機構可 二枯、用以承置5玄光電零組件之料件載盤，該料件載盤可 ^進料位置、該待檢測位置與該出料位置之間水平位移 目對忒點測器垂直活動且該料件載盤承載該光電零 =該㈣位置水平位移至該待檢測位置後，該料件載 盤係被垂直頂升以進行步驟b)。 在本發明所提供之檢測方法的步驟种在該光電零 移至:待檢測位置之前’可包含有一對該光電零組 显T點亮該光電零組件，以判斷該光電零組件 疋否功忐異常之步驟。 /、人在本發明所提供之檢測方法中，當判斷該光電 5 201243369 零組件為舰異常時可包含㈣光電雜件直接位移至 該出料位置之步驟。 此外，本發明之另一目的在於提供一種光電零組件檢 測設備，其可快速地實施上述制方法之各個步驟者。 為^成上述目的’本發明所提供之光電零組件檢測設 備’包含有-具有—朝下方之開口的積分球、—對應該開 也叹於該積分球内部之_器，以及一位於該積分球下 方之旋轉分度機構。其中，職轉分度機構包含有一可受 τ外力作用而旋轉-預定角度之旋轉中軸，以及至少一用 以承載-光f零崎之料件鋪。該料件賴係可垂直活 動地連接於該旋轉中軸，使該料件載盤可受職轉中轴之 驅動而於—裝賴光f零崎之㈣位置、-對應該點測 器且位於該積分球開σ下方之待檢測位置以及—卸載該光 電零組件之出料位置之間水平位移。 Μ為了提高每單位時間的檢測量，該旋轉分度機構可以 设置複數個繞著該旋轉中轴等角度分佈的料件載盤，例如 在本發明所提供之實施财，係設置有四個分 提升檢測效率。 最好，該光電零組件具有位於其頂面之複數個電性 點與一發光區。 口 2本發明所提供之光電零組件檢測設備中該點測器 :包含有複數_时別接顧述複㈣紐接點^ 探針，以及-續賴數赌針之騎座，且該探針座具 有一可供該發光區所發出之光通過的開口。 201243369 本發明所提供之光電零組件檢測設備中’該料 =該f轉中軸之間可設置有一平行該旋轉中輛軸向之滑執 組，藉此，該料件載盤可相對該旋轉_軸垂直活動。 本發明所提供之光電零組件檢測設備中，該旋轉分度 機構可以包含有-線性致動n，用以將位於該待檢測= 之料件載盤頂升至_位於該積分球内部之檢測位置，使承 載於4料件載盤上之光電零組件可與該點測_電性接觸。 其中，該線性致動器可以為（但不限於）油壓虹、氣壓缸、 線性導螺桿、凸輪機構及其類似之機構。 本發明所提供之光電零組件檢測設備中，該旋轉分度 機構:以包含有—升降組件，係與該旋轉中轴連接用以帶 動該旋轉巾财同該至少-料件賴垂直升降。 本發明所提供之光電零組件檢測設備中，可以包含有 出料機構’其具有—對應該出料位置之承載板，以及一 可往復位移之料件作動件，用以將位於該出料位置之光電 零組件推移至該承載板上。 本I明所提供之光電零組件檢測設備中，該出料機構 可以包含有-可活動地設於承載板上之治具，該治具與該 承載板之間定A出—料件通道，用以容錄移至該承載板 上之光電零組件。 本發明所提供之光電零組件檢測設備中，該出料機構 可以包含有—升降氣壓缸，係與該治具連接，使該治具可 相對該承載板垂直位移。 本毛明所提供之光電零組件檢測設備中該出料機構 201243369 可以包含有一平移氣壓缸，係與該升降氣壓缸連接，使該 治具可相對該承載板水平位移。 有關本發明所提供之光電零組件之檢測方法以及實施 前述方法之光電零組件檢測設備之詳細内容及特點，將於 後續的實施方式詳細說明中予以描述。然而，在技術領域 中具有通常知識者應能瞭解，該等詳細說明以及實施本發 明所列舉的特定實施例，僅係用於說明本發明，並非用以 限制本發明之專利申請範圍。 【實施方式】 以下將藉由所列舉之實施例配合隨附之圖式，詳細說 明本發明之技術内容及特徵，其中： 第一圖係為實施本發明一較佳實施例所提供之檢測方 法的檢測設備的立體圖； 第一圖係為實施本發明一較佳實施例所提供之檢測方 法的檢測設備的立體分解圖； 第二圖係為第一圖所示之檢測設備之另一立體圖，其 中為便於說明步驟b)，積分球以及積分球支樓架已經被移 除； 第四圖係為第三圖所示之檢測設備之另一角度的立體 圖， 第五圖係為第四圖之頂視圖； 第'、圖係為旋轉分度機構之立體圖，顯示其中-料件 載盤頂升之態樣； 第七圖係為第六圖之側視圖； 8 201243369 件：圖係為一示意圖，顯示點測器電性接物 第九至十二圖’係為示意圖，說明旋轉 個料件載盤於該檢測方法各個步驟之對應關係。機構之各 首先’必須說明的是，適用於本發 法的光電零組件，可以是(但不限於)發光二：7 :^_^_裝元件_模組，例如以載板= 日曰片（Chlp on Board ’ C0B)封裝形式之led模組， 在整篇朗書中，包含町所介紹之實關 奢= 範圍請求項中，當述及-元件「連接」於另— ==「直接」固接於另一元件’或者係透過其他： 件而間接」地與該另一元件連接。 本發明所提供之光電零組件之檢測方法，主要係將一 待檢測之光電零組件送域分_部，與設於該積分球内 部之點測器(prober)直接電性接觸，因此，光電零也件可於 該積分球内部發光以進行特性檢測，以獲得更準確的檢測 …果。本發明所提供之檢測方法，特別適用於（但不限 電性接點與發光區位於同一面上之光電零組件的檢測，如 此’待檢測之光f零組件可以該發光_上之方式進入 f分球内部’使位於同一面之電性接點可直接與點測器中 、月下叹置之探針針尖直接接觸而完成電性導通，並使該發 ^區可於該積分球内部朝上發光，以獲得更為準確的檢測 結果。 為此’本發明所提供之光電零組件之檢測方法，包含 201243369 2步驟：a)將—位於-進料位置之光電零組件位移至 一對應-積分球之開σ之待檢測位置；b)將前述光電零租 件位移至該積分球内部，使該光電零組件與—位於該積分 球内部之點測器電性接觸，以進行該光電零組件之特 測，0將檢啦狀光電零組件位移出該積分球；以 將前述檢測完成之光電零組件位移至—出料位置。 以下將詳細說明用以實施本發明所提供之光電零組件 之檢測方法之制設備的_，藉此同時制前述檢測方 法各步驟之内容及特徵。 請先參閱第-至八圖，本發明一較佳實施例所提供之 -種光電零組件之檢測設備1G，主要包含有—積分球η、 -點測器14、-旋轉分度機構16，以及—出料機構18。 該積分球12係架設於一可沿著χ、γ、z三軸方向調 整位移之齡球支卿2G ±，㈣支料2G仙定於檢 測設備ίο之機架（圖中未示），藉此，該積分球12可懸置 於空中’並調整其位置’例如，如第—圖所示，該支樓架 2〇具有平行Z軸方向之滑軌組2〇a，使該積分球12可快速 地垂直位移。此外，如第八圖所示，該積分球12具有一面 向下方之開口 12a，經由該開口 i2a，可以進入該積分球 12内部。 該點測器14係架設於一可沿著χ、γ、z三軸方向調 整位移且自s玄開口 12a深入該積分球12内部之點測器支樓 架22上，該支撐架22具有一水平橫向延伸且中央具有一 開口 22a之平台22b。該點測器14具有一探針座14a以及 201243369 固定在該探針座之複數個探針14b，其中該探針座14a係 固定於前述平台22b上，並具有一與該平台開口 22a對應 相通之開口 14c。此外，請特別參閱第三、四或八圖，各 該探針14b係垂直地穿置固定於該探針座i4a周緣，並具 有突露於該探針座14a下方用以與光電零組件24電性接觸 之探針針尖。 請特別參照第六及七圖，該旋轉分度機構16主要包含 有一概呈L型之金屬基座20、一旋轉組件28、一升降組 件30、四組料件承載組件32以及一頂升線性致動器34(請 參閱第七圖）。其中’該旋轉組件28主要包括有一呈水平 。又置且中空之減速機固定板28a、一呈直立狀且可轉動地 穿置於該減速機固定板28a中之旋轉中軸28b、一固定於 该減速機固定板28a並與該旋轉中軸28b銜接以轉動該旋 轉中軸28b之減速機28c，以及一與該減速機28c銜接用 以驅動該旋轉中軸28b旋轉之伺服馬達28d。如此，藉由 该伺服馬達28d，可控制該旋轉中軸28b以每次旋轉一預 定角度(例如90度)之方式間歇性地轉動。 其次，該升降組件30主要包括有二個鎖固於該基座 26之垂直立板26a之一侧面的導柱固定座30a、二分別透 過線性軸套而呈直立狀地穿過各該導柱固定座30a以致可 分別相對各該導柱固定座30a垂直滑移的導柱3%、一懸 置於該減速機固定板28a下方且與各該導桎3〇b之底端鎖 固連接的底板30c’以及二分別固定於各該導柱固定座3〇& 之升降氣壓虹30d。其中，各該導柱30b之頂端係分別鎖 201243369 固於該減速機固定板28a之底面，且各該升降氣壓紅· 係可伸縮地頂持於該減速機固定板28a之底面如此，藉 由各該升降氣壓虹3〇d ’可控制各該導柱3Gb相對各該導 柱固定座30a垂直升降線性滑移，相對帶動該旋轉中軸 作垂直線性升降之動作。 該四組料件承載組件32係彼此間隔-預定角度(9〇度） 地環設於該旋轉中轴28b周緣，而可受該旋轉中轴挪: 帶動’以每次旋轉90度之方式間歇性地同步轉動。該四組 料件承載組件32之結構相同’為節省篇幅，以下將僅介紹 一組料件承載組件之構成元件。 如第六至八圖所示’該料件承載組件32主要包含有一 呈水平狀延伸之料件載盤32a、-鎖固在該料件載盤32a 之底面且呈垂直狀延伸之軌道座32b、一平行該旋轉中軸 28b軸向地鎖固在該軌道座32b之一側面且屬於一執道組 之軌道32c、-與該軌道32c配合而可沿該軌道也滑移 且屬於前述軌道組的滑塊32d、—同時顧於該滑塊似 與該旋轉中軸28b柱身外周面之滑塊轉接座32e、-頂、 底二端分別固接於該料件載盤32a底面與該滑塊轉接座 32e之拉伸彈簧32f’以及一鎖固於該軌道座汹另一側面 上的頂接塊32g。如此，藉由該料件載盤瓜與該旋轉中 袖鳥之間所設置之滑轨組，該料件載盤32a可相對該旋 轉中軸28b垂直活動。 而該頂升線性致動器34,在本實施例中係以一頂升氣 壓缸來體現。升氣Μ係藉由支架34a固定於該減速s 201243369 機固定板28a之側邊，當其中一組料件承載組件&旋轉至 该頂升氣壓缸之上方時，藉由該頂升氣壓缸之活塞桿地 頂接該料件承載組件的頂接塊32g並伸縮作動，可控制該 _件載板32a相對該旋轉中軸28b垂直位移。 " .該出料機構18主要包括有一對應其中之-料件載盤 32a之承載板18a、—受一往復運動裝置咖之驅動銷收 所驅動而可於該料件載盤32a與該承載板…之間往復運 動位移以將承載於該料件載盤32a上已經檢測完成之光電 零組件24推移至該承載板18a上的料件作動件⑻、一可 活動地設於承載板18b上妓義出—㈣容置並規範前述 光電零組件24遞移路徑之料件通道的治具收、—與該治 具收連接之升降氣壓缸18f，以及一與該升降氣壓缸: 連接之平移氣壓缸l8ge如此，藉由該升降氣壓缸版與 該平移氣壓缸18g之作動配合，可控制該治具…今 承載板收垂直及水平位移，以利該治具收置放於該^ 載板18a頂面以形成該料件通道，或者離開該承載板收 頂面，以糧測完成之光t零組件取出並分類儲放。 此外’請特別參閱第二圖，本實施例中所採用之光電 零組件24係以C0B封裝形式之咖模組為例，其具有位 於其頂面中央之-發光區24a，以及同樣位於該頂面上且 圍繞該發光區24a周緣之複數個電性接點2仆。前述光電 零組件24係可藉由人卫或類似該出料機構之—進料機構 (圖中未示），以該發絲24a朝上之方式置放在該料件載 盤32a上。 201243369 以下將配合第九至十二圖說明本發明所提供之光電零 組件之檢測方法的各個步驟。而為便於說明，第九至十二 圖中之四個料件載盤，將分別以第一料件載盤伽: =件載盤遍、第三_軸32a3从第吨件載盤咖 標示。 請先參閱第九圖，圖中之第一料件載盤伽係位於一 裝載該光電零組件24之進料位置ρι，第二料件載盤遍 係位於一對應該點測器14且位於該積分球開口 12a下方之 待檢測位置P2，第三料件載盤3如係位於一對應該出料 機構之承脑⑽辑備卸載已驗戦畢之光電零組件 24之出料位置P3，而第四料件載盤32&4係位一介於 料位置Η與該出料位置P3之間的預備位置p4。其中了位 於該進料位置pi之第—料件載盤32al上已經裝載有一發 光區24a朝上之待檢測的光電零組件24。 其次’请參閱第十圖’藉由該旋轉分度機構16之伺服 馬達28d㈣該旋轉中轴挪逆時針旋轉9〇度可使位於 該第-料件載盤32al之光電零組件24由原本第九圖所示 之進料位置P1水平地位移至該待檢測位置p2，而完成將 位於-進料位置P1之光電零組件24位移至―對應—積 /刀球之開口 12a之待檢測位置p2之步驟a)。同時如圖所 不’ 5玄第四料件載盤32a4可由該預備位置P4平移至該進 料位置pi ’以裝載另一待檢測之光電零組件24。此外，在 該词服馬達28d控制該旋轉中轴挪旋轉之前，該旋轉分201243369 VI. Description of the Invention: [Technical Field] The present invention relates to a method for detecting an optoelectronic component, in particular, to deliver an optoelectronic component to be inspected to an inside of an integrating sphere for characteristic detection. Detection method. The invention also relates to a detection apparatus for carrying out the aforementioned detection method. [Prior Art] Optical components such as single-die packages or package modules such as light-emitting diodes (LEDs) are mostly required to be tested by j characteristics before leaving the factory. The parameters are used as a criterion to classify the moon's photoelectric components. When the photoelectric component is detected, it is usually electrically contacted with the photoelectric component by a jig or a probe, and the detection power is supplied to emit light, and the detection is performed. Secondly, since the detection result can be obtained by means of an integrating sphere, it is inevitable for the manufacturer to use the integrating sphere for the detection of the precision of the inspection result. In the case of the existing automated inspection machinery that cooperates with the operation of the integrating sphere, due to the structural characteristics of the spot detector or the fixture itself, or because of the relationship between the design of the delivery mechanism of the material to be inspected, or the amount of detection per unit time, most of them will be adopted. The photoelectric component to be detected is sent to the outside of the integrating sphere near the entrance of the integrating sphere light for detection. However, in this mode, the light emitted by the photoelectric component is easily interfered by surrounding environmental factors, and the influence is affected. Its measurement accuracy. Secondly, due to the high cost-effectiveness and high flexibility of the chip on board (c〇B) packaging technology 201243369, there is a trend that is widely used by the industry. However, as far as the applicant is aware, there is currently no detection method or detection device for CQB packaged LED modules with high accuracy and/or fast detection speed. SUMMARY OF THE INVENTION In view of the above, an object of the present invention is to provide a method for detecting a photoelectric component, which is detected by means of an integrating sphere, and a more accurate detection result can be obtained. In order to achieve the above object, a method for detecting an optoelectronic component provided by the present invention comprises the following steps: a) disposing a photoelectric=component located at a feeding position to a position to be detected of an opening of the corresponding-integral sphere; b) displacing the photoelectric component just inside the integrating sphere, electrically contacting the optoelectronic component with a probe located inside the integrating sphere to perform the characteristic of the optoelectronic component; e) Disposing the completed optoelectronic component out of the integrating sphere; and d) displacing the previously detected optoelectronic component to a discharge position. Since the photoelectric component is displaced to the integrating sphere (10) in the detecting method provided by the present invention, and the spot detector is disposed in the integrating sphere, the change component can emit light inside the integrating sphere. For characteristic detection, a more accurate measurement can be obtained. In the detection method provided by the present invention, the optoelectronic component preferably has a plurality of electrical contacts and a light-emitting region on the same side. Thus, in step b), the optoelectronic component can be displaced to the inside of the integrating sphere with the gas facing the inside of the integrating sphere, so that the electrical contacts on the same side can be directly in electrical contact with the spot detector. 201243369 In the detection method provided by the invention, the spot detector disposed inside the integrating sphere may include a probe holder and a plurality of probes fixed to the probe holder, and in step b>, the photoelectric component Displaced below the detector, the plurality of electrical contacts are in contact with the plurality of probes, and the illumination zone is permeable to the inside of the integrating sphere in the detection method of the present invention. And rotatably comprising a cleaning needle assembly range integrating sphere (4), the step of contacting the cleaning product with each of the needles. As for the needle supply, it can be money (but not limited to paper or organic solvent. /, in the detection method provided by the present invention, in the step & The mechanism displaces the optoelectronic component 7 from the feed position to the position to be detected and the discharge position. In the detecting method provided by the present invention, the rotary indexing mechanism can be used for receiving a material carrier of the 5th optical component, the material carrier can be fed, the position to be detected and The horizontal displacement between the discharge positions is perpendicular to the point detector and the material carrier carries the photoelectric zero. After the (four) position is horizontally displaced to the position to be detected, the material carrier is vertically raised to Go to step b). In the step of the detecting method provided by the present invention, before the photoelectric zero is moved to: the position to be detected, the optical component may be illuminated to the photoelectric group to determine whether the photoelectric component is defective. The steps of the exception. In the detection method provided by the present invention, when it is judged that the photoelectric component 5 201243369 is a ship abnormality, the step of directly shifting the photoelectric miscellaneous component to the discharge position may be included. Further, another object of the present invention is to provide an optoelectronic component detecting apparatus which can quickly implement various steps of the above-described manufacturing method. For the above purpose, the photoelectric component detecting apparatus provided by the present invention includes an integrating sphere having an opening facing downward, a singer corresponding to the inside of the integrating sphere, and a point located at the point. Rotary indexing mechanism below the ball. Wherein, the job indexing mechanism comprises a rotating central axis that can be rotated by a τ external force and a predetermined angle, and at least one material for carrying the light-light f. The material member is vertically movably connected to the rotating central axis, so that the material carrier can be driven by the middle shaft, and the position of the device is located at the (four) position, corresponding to the point detector and located The integrating sphere opens a position to be detected below the σ and a horizontal displacement between the discharge positions of the unloading the optoelectronic component. Μ In order to increase the detection amount per unit time, the rotary indexing mechanism may be provided with a plurality of material carriers distributed at an equal angle around the central axis of rotation, for example, in the implementation of the present invention, four points are provided. Improve detection efficiency. Preferably, the optoelectronic component has a plurality of electrical points and a illuminating region on its top surface. In the photoelectric component detecting device provided by the invention, the spot detector includes: a plurality of _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ There is an opening through which light emitted by the light-emitting area passes. 201243369 In the photoelectric component detecting apparatus provided by the present invention, the material can be disposed between the shafts of the f-turning shaft and the sliding group of the axial direction of the rotating medium, whereby the material carrier can be rotated relative to the _ The axis is vertically active. In the photoelectric component detecting device provided by the present invention, the rotary indexing mechanism may include a linear actuation n for raising the component carrier located at the to-be-detected to the detection of the inside of the integrating sphere. The position is such that the optoelectronic components carried on the four-piece carrier can be electrically contacted with the spot. Wherein, the linear actuator may be, but not limited to, an oil pressure rainbow, a pneumatic cylinder, a linear lead screw, a cam mechanism, and the like. In the photoelectric component detecting device provided by the present invention, the rotary indexing mechanism comprises: a lifting assembly connected to the rotating central shaft for driving the rotating towel to vertically ascend and descend with the at least one material. The photoelectric component detecting device provided by the invention may comprise a discharging mechanism having a carrier plate corresponding to the discharging position and a reciprocating displacement member actuating member for being located at the discharging position The optoelectronic components are pushed onto the carrier plate. In the photoelectric component detecting device provided by the present invention, the discharging mechanism may include a jig that is movably disposed on the carrying plate, and the tool member and the carrier plate define an A-material passage. It is used to record the optoelectronic components that are moved to the carrier board. In the photoelectric component detecting device provided by the present invention, the discharging mechanism may comprise a lifting pneumatic cylinder connected to the fixture so that the fixture can be vertically displaced relative to the carrier plate. The discharge mechanism 201243369 of the photoelectric component detecting device provided by the present invention may include a translational pneumatic cylinder connected to the lifting pneumatic cylinder to horizontally displace the jig relative to the carrier plate. The details and characteristics of the method for detecting the optoelectronic component provided by the present invention and the optoelectronic component detecting device for carrying out the above method will be described in the detailed description of the subsequent embodiments. However, it should be understood by those of ordinary skill in the art that the present invention is not limited to the scope of the invention. The embodiments of the present invention will be described in detail with reference to the accompanying drawings, in which: FIG. A perspective view of a detecting device for performing a detecting method provided by a preferred embodiment of the present invention; the second drawing is another perspective view of the detecting device shown in the first figure, In order to facilitate the description of step b), the integrating sphere and the integrating sphere support frame have been removed; the fourth figure is a perspective view of another angle of the detecting device shown in the third figure, and the fifth figure is the fourth figure. The top view; the ', the figure is a perspective view of the rotary indexing mechanism, showing the state in which the material carrier is lifted up; the seventh figure is the side view of the sixth figure; 8 201243369 pieces: the figure is a schematic view The display of the ninth to twelfth diagrams of the electrical connector of the measuring device is a schematic diagram illustrating the correspondence between the rotating components of the carrier in each step of the detecting method. The first thing that must be stated is that the optoelectronic components that are suitable for this method can be (but not limited to) illuminating two: 7: ^ _ ^ _ component_module, for example, carrier board = 曰片(Chlp on Board 'C0B) packaged version of the LED module, in the entire book, including the real customs introduced in the town of the scope = scope request, when the - component "connected" to another - == "directly "It is fixed to another element' or is indirectly connected to the other element through another: member. The method for detecting the photoelectric component provided by the invention mainly comprises transmitting a photoelectric component to be detected to a portion of the optical component, and directly contacting the probe connected to the inside of the integrating sphere, thereby photoelectrically A zero piece can be illuminated inside the integrating sphere for characteristic detection to obtain a more accurate detection. The detection method provided by the invention is particularly suitable for (but not limited to the detection of photoelectric components on the same side of the electrical contact and the light-emitting area, such that the light component to be detected can enter the light-emitting manner) The inner part of the f-ball enables the electrical contact on the same side to directly contact the tip of the probe in the point detector and the sigh of the moon to complete the electrical conduction, and the area can be inside the integrating sphere. Illuminating upwards to obtain more accurate detection results. For this reason, the method for detecting optoelectronic components provided by the present invention comprises 201243369. 2 steps: a) Displacement of the photoelectric components located at the -feed position to a corresponding - the position of the opening of the integrating sphere σ to be detected; b) displacement of the aforementioned photoelectric zero-seat into the interior of the integrating sphere, such that the photoelectric component is in electrical contact with a spot detector located inside the integrating sphere to perform the photoelectric Special measurement of the component, 0 shifts the detected photoelectric component out of the integrating sphere; to displace the previously completed photoelectric component to the discharge position. The apparatus for carrying out the method for detecting the photoelectric component provided by the present invention will be described in detail below, thereby simultaneously making the contents and characteristics of the respective steps of the above detection method. Referring to FIG. 8 to FIG. 8 , a detecting device 1G for an optoelectronic component according to a preferred embodiment of the present invention mainly includes an integrating sphere η, a point detector 14 and a rotary indexing mechanism 16 . And a discharge mechanism 18. The integrating sphere 12 is erected in a frame that can adjust the displacement along the three axes of χ, γ, and z. 2G ±, and (4) the material 2G is fixed in the rack of the detecting device ίο (not shown). Thus, the integrating sphere 12 can be suspended in the air 'and adjust its position'. For example, as shown in the first figure, the branch frame 2 has a slide group 2〇a parallel to the Z-axis direction, so that the integrating sphere 12 Can be vertically displaced vertically. Further, as shown in the eighth figure, the integrating sphere 12 has a downward opening 12a through which the inside of the integrating sphere 12 can be entered. The finder 14 is mounted on a finder frame 22 that can be adjusted in three directions along the χ, γ, and z directions and penetrates the inside of the integrating sphere 12 from the s-shaped opening 12a. The support frame 22 has a A platform 22b extending horizontally and having an opening 22a in the center. The probe 14 has a probe holder 14a and a plurality of probes 14b fixed to the probe holder. The probe holder 14a is fixed to the platform 22b and has a corresponding communication with the platform opening 22a. The opening 14c. In addition, please refer to the third, fourth or eighth figure. Each of the probes 14b is vertically affixed and fixed to the periphery of the probe holder i4a, and has a protrusion under the probe holder 14a for use with the optoelectronic component 24 . Probe tip for electrical contact. Referring specifically to Figures 6 and 7, the rotary indexing mechanism 16 mainly includes a generally L-shaped metal base 20, a rotating assembly 28, a lifting assembly 30, four sets of material carrying assemblies 32, and a jacking linear Actuator 34 (see Figure 7). Wherein the rotating assembly 28 is primarily comprised of a horizontal one. And a hollow speed reducer fixing plate 28a, a rotating middle shaft 28b which is erected and rotatably inserted into the speed reducer fixing plate 28a, is fixed to the speed reducer fixing plate 28a and is engaged with the rotating middle shaft 28b. A speed reducer 28c for rotating the rotating center shaft 28b, and a servo motor 28d for engaging the speed reducer 28c for driving the rotation of the rotating shaft 28b. Thus, by the servo motor 28d, the rotating center shaft 28b can be controlled to intermittently rotate every predetermined rotation angle (e.g., 90 degrees). Next, the lifting assembly 30 mainly includes two guide post fixing bases 30a locked to one side of the vertical vertical plate 26a of the base 26, and two through the linear guide sleeves and vertically passing through the respective guiding columns. The fixing base 30a is 3% of the guide post slidable vertically relative to each of the guide post fixing bases 30a, and is suspended from the lower side of the speed reducer fixing plate 28a and is fixedly connected to the bottom end of each of the guide pins 3〇b. The bottom plate 30c' and the two are respectively fixed to the lifting and lowering pressure rainbow 30d of each of the guide post fixing seats 3〇&. The top end of each of the guide posts 30b is respectively fixed to the bottom surface of the reducer fixing plate 28a by the lock 201243369, and each of the lifting air pressures is telescopically supported on the bottom surface of the reducer fixing plate 28a. Each of the lifting and lowering pressures can control the linear sliding of each of the guiding columns 3Gb relative to each of the guiding column fixing seats 30a, and relatively move the rotating central axis to perform a vertical linear lifting operation. The four sets of material carrying members 32 are spaced apart from each other by a predetermined angle (9 degrees) and are disposed around the circumference of the rotating central shaft 28b, and can be moved by the rotating central axis: driving 'intermittently by 90 degrees per rotation Synchronously rotate. The four-piece material carrying assembly 32 has the same structure. To save space, only the constituent elements of a set of material carrying components will be described below. As shown in the sixth to eighth figures, the material carrying member 32 mainly includes a horizontally extending material carrier 32a, a rail seat 32b which is fixed to the bottom surface of the material carrier 32a and extends vertically. a track 32c that is axially locked to one side of the track seat 32b and that belongs to a side of the track base 32b, cooperates with the track 32c and can also slide along the track and belongs to the track group. The slider 32d, at the same time, the slider adapter 32e, the top end and the bottom end of the slider-like outer peripheral surface of the rotating shaft 28b are respectively fixed to the bottom surface of the material carrier 32a and the slider. The tension spring 32f' of the adapter 32e and a top block 32g fixed to the other side of the rail seat. Thus, the stock carrier 32a is vertically movable relative to the rotating central axis 28b by the set of rails disposed between the member carrier and the rotating mid-sleeve bird. The jack-up linear actuator 34, in this embodiment, is embodied by a jack-up cylinder. The lift raft is fixed to the side of the deceleration s 201243369 machine fixing plate 28a by the bracket 34a, and when the set of material carrying components & rotates above the jacking cylinder, by the jacking cylinder The piston rod is connected to the top block 32g of the material carrying assembly and is telescopically operated to control the vertical displacement of the carrier 32a relative to the rotating central shaft 28b. < The discharge mechanism 18 mainly comprises a carrier plate 18a corresponding to the material carrier 32a, driven by a reciprocating device drive pin, and the carrier carrier 32a and the carrier The reciprocating displacement between the plates is to move the optoelectronic components 24 that have been detected on the material carrier 32a to the material moving member (8) on the carrier plate 18a, and is movably disposed on the carrier plate 18b.妓义出—(4) Locating and regulating the fixture of the material passage of the above-mentioned photoelectric component 24, the lifting pneumatic cylinder 18f connected to the fixture, and a lifting cylinder connected to the lifting cylinder: The pneumatic cylinder l8ge is such that, by the action of the lifting pneumatic cylinder plate and the translational pneumatic cylinder 18g, the fixture can be controlled... the carrier plate is vertically and horizontally displaced, so that the fixture is placed on the carrier plate. The top surface of the 18a is formed to form the material passage, or the top surface of the carrier board is removed, and the light component is taken out and classified and stored. In addition, please refer to the second figure. The optoelectronic component 24 used in this embodiment is exemplified by a coffee module in the form of a C0B package, which has a light-emitting area 24a located at the center of the top surface thereof, and is also located at the top. A plurality of electrical contacts 2 on the surface and surrounding the periphery of the light-emitting region 24a serve. The aforementioned optoelectronic component 24 can be placed on the component carrier 32a with the hairline 24a facing upwards by means of a feeding mechanism (not shown) similar to the dispensing mechanism. 201243369 The various steps of the method of detecting the optoelectronic component provided by the present invention will be described below in conjunction with Figures 9 through 12. For ease of explanation, the four material carriers in the ninth to twelfth drawings will be labeled with the first material carrier: = the carrier is loaded, and the third shaft 32a3 is marked from the first ton. . Please refer to the ninth figure. The first material carrier is located at a feeding position ρι of the photoelectric component 24, and the second material carrier is located at a pair of point detectors 14 and located. The position of the to-be-detected position P2 under the integrating sphere opening 12a, the third material-carrying tray 3 is located at a discharge position P3 of the photoelectric component 24 of the pair of discharge-receiving mechanisms. The fourth material carrier 32 & 4 is a preliminary position p4 between the material position Η and the discharge position P3. The photo-carrying tray 32a1 of the feed position pi has been loaded with an optoelectronic component 24 to be detected with the light-emitting area 24a facing upward. Next, please refer to the tenth figure. The servo motor 28d (4) of the rotary indexing mechanism 16 rotates the central axis by 9 degrees, and the photoelectric component 24 located on the first material carrier 32a can be made of the original The feeding position P1 shown in FIG. 9 is horizontally displaced to the position to be detected p2, and the photoelectric component 24 at the feeding position P1 is displaced to the position to be detected p2 of the opening 12a of the corresponding-product/knife ball. Step a). At the same time, the fourth material carrier 32a4 can be translated from the preliminary position P4 to the feeding position pi' to load another photoelectric component 24 to be detected. Further, before the word service motor 28d controls the rotation of the rotation axis, the rotation point
度機構16之升降組件3〇可先作動，使該旋轉中轴挪Z % 201243369 =個料件載盤32al至32a4之水平高度上升或下降俾 件載盤跡遍與該承載板18a上下錯開不位 硐一水平面上，以避免料件載盤32al〜32a4沿著 =位移時’與該承載板1Sa發生干涉。當然，實際上設計 並益2個料件餘遍〜32a4水平位料若與其他構件 並.，，、干v之問題，則可省略該升降組件3〇之設置。 =後，請參閱第七及八圖，藉由該頂升線性致動器34 之作動’可將位於該待檢測位置P2之料件載盤仏向上頂 升至該積分球12内部，使位於該料件載盤仏上之光電零 =4之電性接點24b與該點測器14之探針_接觸通 =使《光區24a可朝㈣積分球12内部發光，以進 零組件之雜檢測，進妓成本發_提供之檢 測方法之步驟b)。 哭J^上述制作f完成之後可再藉由該頂升線性致動 器34使該料件载盤32a下降位移出該積分球η而再次回 ^該待檢翁置P2，以完縣發明職供讀測方法之步 驟C) 〇 而t π參閱第十一及十二圖，再次藉由該旋轉中 ^逆時針旋轉90度’可使位於該第一料件載盤咖之 先電零組件24由原本第十圖所示之待檢測位置ρ2水平地 位移至該出料位置Ρ3,以便進一步卸載，而完成本發明所 =之檢^則方法之步驟d)。在此同時，原本位於該預備位 置P4之第三料件載盤伽將平移至該進料位置ρι，以便 進行另-待檢測光電零組件24之裝載，而該第四料件載盤 201243369 32a4則可由該進料位置pl平移至該待檢測位置打，以便 進行步驟b)與步驟c)。此外，如圖所^於該第一料件載 盤32al上進行料件卸載之動作，與於該第三料件载盤32a3 上進仃料件裝載動作，以及該第四料件載盤仏4進行步驟 b)與步驟e)之動作，可㈣步完成，以提升整體之檢測效 率。 而後，再次藉由該旋轉中軸28b逆時針旋轉9〇度，即 可周而復始地重複上述之步驟，因此，本發明所提:之光 電零組件檢測設備，可達成快速檢測光電零組件特性之目 的。其次，由於光電零組件24係被頂升至該積分球12内 部，並於該積分?求12内部朝上發光，故可獲得更準確的檢 測結果。 在此必須說明的是，在上述實施例中採用四個相隔九 十度分佈的料件載盤32a，在空間運用以及檢測速度上係 為一較佳化之設計，然而，該料件載盤32a之設置數量並 不以此為限。實際上’該旋轉分度機構16可以僅設置一個 料件健32a’或者多個料件載盤仏，並藉由伺服控制使 各該料件載盤依序在該進料位置p卜該待檢測位置p2以 及該出料位置P3之間循環位移，同樣可以達成本發明之目 的，換言之，該料件載盤32a之數量可視實際需要或空間 配置而設置-個或多個，且不必然需使料件載盤位移至該 預備位置P4。 其次，在上述所揭露之實施例中，本發明所提供之檢 測方法的步驟a) ’係將位於該進料位置之光電零組件直接 201243369 雜檢測位置⑽進行下_步找零崎之特性檢 二”述揭露之步驟中，對於已經位於該進料位置但該 分或全部損壞或元件特性異常以致可淘汰的 ==、’可藉由後續的特性檢測步驟_判斷得知， '在步驟d)之奸關除。心 法二組件被送至該待檢測位== 步驟’來判斷該光電零組件之發光區是 否2或全部損壞或者元件特性是否異常，而且，若判斷 為該光電零組件之功能異常而需淘汰時可進一 献之光電零組件直接遞送至該出料 光電ΐ二2本發明所提供之檢測方法之_a)中，在 該光電零可包含有-對該將 常之步驟，而且電零組件是否功能異 =電零__:時 具有四個料件載盤的3分;^二以本發明所提供之 應之位置可以依序為一進料=構=:件載所對 後，可藉由旋轉二二電零 ^由外部的機構，例峨探針（财未示），提= ^該光轉轉__光轉組件，並彻架設^ 17 201243369 ^點聽置上方之光學辨識系統（圖中未示） =功=常，則該光電零組件將被位移至該待檢測位置以 可I接’惟若判斷該光電零組件功能為異常時， 理。W光電零組件遞送至該出料位置，以利進一步處 期使=4在本發明所提供之檢測設備巾，探針14b在長 抗升高亏或其他因素造成接觸阻 砂紙或有^ 刊用治具或直接將諸如 上，使料的清針置於其卜料件載盤 14b接觸，分球12㈣喊各個探針 的構=牛必;=說明，本發明於前揭實施例中所揭露 ^ _僮為舉例說明，並非用來限制本案之範圍， 所涵蓋1件的替代或變化，亦應為本案之中請專利範圍 201243369 【圖式簡單說明】 第一圖係為實施本發明一較佳實施例所提供之檢測方 法的檢測設備的立體圖； 第二圖係為實施本發明一較佳實施例所提供之檢測方 法的檢測設備的立體分解圖； 第二圖係為第一圖所示之檢測設備之另一立體圖，其 中為便於說明步驟b)，積分球以及積分球支撐架已經被移 除:； 第四圖係為第三圖所示之檢測設備之另一角度的立體 圖； 第五圖係為第四圖之頂視圖； 第六圖係為旋轉分度機構之立體圖，顯示其中一料件 載盤頂升之態樣； 第七圖係為第六圖之側視圖； 第八圖係為一示意圖，顯示點測器電性接觸光電零組 件之情形； 第九至十二圖，係為示意圖，說明旋轉分度機構之各 個料件載盤於該檢測方法各個步驟之對應關係。 【主要元件符號說明】 10檢測設備 12積分球 12a 開口 14點測器 14a探針座 14b探針 14c 開口 16旋轉分度機構 18出料機構 18a承載板 18b往復運動裝置 18d料件作動件 18f升降氣壓缸 20積分球支撐架 22點測器支撐架 22b平台 24a發光區 26基座 28旋轉組件 28b旋轉中軸 28d伺服馬達 30a導柱固定座 30c底板 32料件承載組件 32al第一料件載盤 32a3第三料件載盤 32b軌道座 32d滑塊 32f拉伸彈簧 34頂升線性致動器 34b活塞桿 P2待檢測位置 P4預備位置 18c驅動銷 18e治具 18g平移氣壓缸 20a滑軌組 22a 開口 24光電零組件 24b電性接點 26a垂直立板 28a減速機固定板 28c減速機 30升降組件 30b導柱 30d升降氣壓缸 32a料件載盤 32a2第二料件載盤 32a4第四料件載盤 32c執道 32e滑塊轉接座 32g頂接塊 34a支架 P1進料位置 P3出料位置The lifting assembly 3 of the degree mechanism 16 can be actuated first, so that the rotation of the shaft is shifted by Z% 201243369 = the level of the material carriers 32al to 32a4 is raised or lowered, and the carrier tape is staggered up and down with the carrier plate 18a. It is located on a horizontal surface to prevent the carrier carriers 32al~32a4 from interfering with the carrier plate 1Sa along the = displacement. Of course, in fact, the design and benefits of the two pieces of material over the ~32a4 level of material and other components and,,,,,,,,,,,,,,,,,,,,, After the operation of the jacking linear actuator 34, the workpiece carrier 仏 at the position to be detected P2 can be lifted up to the inside of the integrating sphere 12, so that it is located. The electrical contact 24b of the photoelectric zero=4 on the material carrier disk is in contact with the probe of the detector 14=the light zone 24a can be illuminated toward the interior of the (four) integrating sphere 12 to the component Miscellaneous detection, step b of the detection method provided. After the completion of the above-mentioned production f, the top carrier linear disk 34 can be further lowered and displaced out of the integrating sphere η by the jacking linear actuator 34, and the inspected article P2 is again returned to the county inventor. Steps C) for reading and reading methods 〇 and t π refer to the eleventh and twelfth drawings, and again by rotating the counterclockwise by 90 degrees, the first component can be placed in the first component. 24 is horizontally displaced from the position to be detected ρ2 shown in the tenth figure to the discharge position Ρ3 for further unloading, and the step d) of the method for detecting the invention is completed. At the same time, the third material carrier gamma originally located at the preparatory position P4 will be translated to the feeding position ρι for loading the other to-be-detected photovoltaic component 24, and the fourth component carrier 201243369 32a4 Then, the feeding position pl can be translated to the position to be detected to perform step b) and step c). In addition, as shown in the figure, the unloading operation of the material on the first material carrier 32a, the loading operation of the loading member on the third material carrier 32a3, and the loading of the fourth material carrier 4 Perform the actions of step b) and step e), which can be completed in steps (4) to improve the overall detection efficiency. Then, by repeating the rotation of the central shaft 28b counterclockwise by 9 degrees, the above steps can be repeated repeatedly. Therefore, the photovoltaic module detecting apparatus of the present invention can achieve the purpose of quickly detecting the characteristics of the photoelectric components. Secondly, since the photo-electric component 24 is lifted up to the inside of the integrating sphere 12, and the inside of the integrating sphere 12 is illuminated upward, a more accurate detection result can be obtained. It should be noted that, in the above embodiment, four material carriers 32a distributed 90 degrees apart are used, which is a better design in space utilization and detection speed. However, the material carrier The number of 32a settings is not limited to this. In fact, the rotary indexing mechanism 16 can be provided with only one piece of material 32a' or a plurality of material carriers, and each of the material carriers can be sequentially placed at the feeding position by servo control. The cyclic displacement between the detection position p2 and the discharge position P3 can also achieve the object of the present invention. In other words, the number of the material carriers 32a can be set one or more depending on actual needs or spatial configurations, and is not necessarily required. The material carrier is displaced to the preparatory position P4. Next, in the above-disclosed embodiment, the step a) of the detecting method provided by the present invention is to perform the characteristic inspection of the photoelectric component located at the feeding position directly at the 201243369 impurity detecting position (10). In the step of the disclosure, the ==, 'can be determined by the subsequent characteristic detecting step_ for the part that has been located at the feeding position but the part or all of the damage or the characteristic of the element is abnormal so that it can be eliminated, 'in step d The offense is removed. The heartbeat two component is sent to the to-be-detected bit == step' to determine whether the light-emitting area of the optoelectronic component is 2 or all damaged or the component characteristics are abnormal, and if it is judged to be the optoelectronic component When the function is abnormal and needs to be eliminated, the photoelectric component that can be further supplied is directly delivered to the discharge photo-electricity device. In the method _a) provided by the invention, the photoelectric zero may be included - the Step, and whether the electrical component is functionally different = electric zero __: when there are four parts of the four-part carrier disk; ^ two to provide the position of the present invention can be a feed = structure =: After the match, you can rotate the second two Electric zero ^ by the external mechanism, the example probe (financial not shown), mention = ^ the light is turned __ light to the component, and erected ^ 17 201243369 ^ point above the optical identification system (not shown Show) = work = often, then the optoelectronic component will be displaced to the position to be detected to be connected to 'only if the optoelectronic component function is abnormal. W photoelectric components are delivered to the discharge position, In order to further facilitate the period of time to make =4 in the detection device towel provided by the present invention, the probe 14b is in contact with the rising loss or other factors causing the contact sandpaper or the fixture to be used or directly The needle is placed in contact with the material carrier 14b, and the ball 12 (4) shouts the structure of each probe. The description of the present invention is disclosed in the foregoing embodiment. The scope of this case, the substitution or change of one item covered, should also be the patent scope 201243369 in the present case. [Simplified description of the drawings] The first figure is a testing device for implementing the detection method provided by a preferred embodiment of the present invention. The second figure is a preferred embodiment of the present invention. An exploded perspective view of the detection device provided with the detection method; the second diagram is another perspective view of the detection device shown in the first figure, wherein for convenience of the description of step b), the integrating sphere and the integrating sphere support frame have been removed: The fourth figure is a perspective view of another angle of the detecting device shown in the third figure; the fifth figure is the top view of the fourth figure; the sixth figure is the perspective view of the rotary indexing mechanism, showing one of the pieces The seventh figure is a side view of the sixth figure; the eighth figure is a schematic view showing the situation that the point detector is electrically contacted with the photoelectric component; the ninth to twelfth figures are The schematic diagram illustrates the correspondence between the various component carriers of the rotary indexing mechanism in each step of the detection method. [Main component symbol description] 10 detection device 12 integrating sphere 12a opening 14 point detector 14a probe holder 14b probe 14c opening 16 rotary indexing mechanism 18 discharge mechanism 18a carrier plate 18b reciprocating device 18d material actuator 18f lifting pneumatic cylinder 20 integrating ball support frame 22 point detector support frame 22b platform 24a light-emitting area 26 base 28 rotation group 28b rotating central shaft 28d servo motor 30a guide post holder 30c bottom plate 32 material carrying assembly 32al first material carrier 32a3 third material carrier 32b rail seat 32d slider 32f tension spring 34 jacking linear actuator 34b Piston rod P2 to be detected position P4 preparatory position 18c drive pin 18e fixture 18g translation cylinder 20a rail group 22a opening 24 optoelectronic component 24b electrical contact 26a vertical vertical plate 28a reducer fixed plate 28c reducer 30 lifting assembly 30b Guide post 30d lifting cylinder 32a material carrier 32a2 second material carrier 32a4 fourth material carrier 32c way 32e slider adapter 32g top block 34a bracket P1 feeding position P3 discharging position