TW201241412A - Device and method for measuring height of protrusions - Google Patents

Abstract

Provided is a device and a method capable of rapidly and highly accurately measuring not only the variation in relative heights of peak sections of a plurality of protrusions distributed on a flat substrate surface, but the height of each of the peak sections. Specifically, a device for measuring the height of protrusions whereby the height of a plurality of protrusions distributed on a flat substrate surface is measured, wherein the device and method for measuring the height of protrusions are characterized in being provided with: first and second illumination units for emitting illumination light towards the flat substrate surface from first and second directions; first and second imaging units for imaging reflected first and second reflected light; a relative height computation unit for calculating the relative heights of peaks of the protrusions on the basis of positional information of the reflected light imaged by the first and second imaging units; a third illumination unit for emitting, from a third direction, a linear illumination light having a length greater than the diameter of the protrusions; a third imaging unit for imaging the reflected third reflected light; and a unit for computing the height of protrusions on the basis of positional information of the reflected light imaged by the third imaging unit and the results of the calculation performed by the relative height computation unit.

Description

201241412 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to measuring the height of a projection protruding from a plurality of projections on a substrate plane, and in particular measuring the formation of a BGA (including a BGA) Ball Grid Array: a projection height measuring device and method for a bump on a semiconductor device of a ball grid array. [Prior Art] 0 [_ Recent electronic devices, particularly portable electronic devices, etc. With the miniaturization and high performance, electronic components mounted inside are increasingly being worn by women. The package of the IC is also miniaturized. For example, BGA (Ba11 Grid Array) or CSP (Chip)

Size Package: Wafer size package) The bump bonding type of package is rapidly spreading. Further as c〇c(chip 〇n a

Chip: wafer stacking) The method of stacking and mounting chips with bumps is also available. ^ 〇 & bump type K-type case, by soldering solder balls on the terminals on the back of the package (s 〇lder bau) forming a bump so that the back surface of the package is butted against the substrate of the female object, and the bump (ball solder) is heated by reflow or the like, and the wiring pad aP on the mounting target substrate (wiring land) Part) welding (such as 敝 进行 襞 、 、 〇 封装 封装 ' ' ' ' ' ' ' ' ' 惟 惟 惟 惟 惟 惟 惟 惟 惟 惟 惟 惟 惟 惟 惟 惟 惟 惟 惟 惟 惟 惟 惟 惟 凸 凸 凸 凸 凸 凸 凸 凸 凸The case where different bumps are each formed. Under this 1013155733-0 is a single number ☆ Measure the height by bump-part bump sampling, estimate 1011075# single number Α _ 帛 5 pages / total 4 pages 201241412 other convex The south degree of the block will produce an inappropriate case. In order to solve this kind of inappropriateness, it is required to determine the height of the full bump. Moreover, the bump of each wafer and wafer is made due to the densification of the bump. Increase in number, applied to the bump measurement of the wafer Time is required to be as short as possible. Therefore, it is required to measure the height of the full bump in a shorter time. Moreover, the flatness (coplanarity: COpianarity) of the relative height of the top of each of the full bumps is very high. Importantly, not only that, but also the height of the base surface of the package is required. This is due to the wafer and substrate during installation in the Anon using wafers with small diameters and dense bumps. The gap amount (gap am〇unt) is small relative to the allowable range of the individual difference of the bumps. The height of the bumps is uniform even if the relative heights of the tops of the entire bumps are uniform. In the case of unequalness (that is, the case where the face formed by the top of the full bump is not parallel to the base of the package), or in the case of being parallel but different from the required distance, it is easy to cause mounting failure. However, since the size of the solder ball is different from the pre-specified A, the case of a large bump is extended to the side due to excessive crushing of the bump so that adjacent bumps are easily short-circuited with each other. The solder cannot easily pass between the bump and the electrode to be joined, and the bonding defect is likely to occur, and the desired conduction cannot be obtained. In the case of the defective bump having a low bump height, the bump and the electrode to be joined are required. In the case where the bonding is poor and the conduction cannot be obtained] and [the bumps are not good, the bumps that are close to each other are in contact with each other and become short-circuited]. The phenomenon is flatness (coplanarity) at the height of the bumps. It cannot be found in the measurement. Therefore, 'there is a need to use a small-diameter and dense bump wafer before the installation of the 075# single number deletion 1 page 6 / a total of 40 pages 1013155733-0 201241412 manage the height of the bump from the base surface, on the contrary If the ground is measured at a height from the base surface, it can be determined whether it can be installed with the gap amount specified in the process before installation. The wafer with poor bumps can be discarded before installation or reworked (rework) ) Countermeasures such as. Further, in order to measure the height of a plurality of projections distributed on the plane of the substrate, the conventional technique discloses an autofocus method 'stereo camera method, a light cut method (iight_secti〇 Jl method), or the like. technology. β 1), autofocus method 〇 Autofocus method measures the height of the bump by focusing on the bump by the principle of autofocus. The focus and bump height measurement is performed one by one for the bumps. That is, each bump repeatedly performs a series of operations: loading a wafer or wafer having bumps to be measured on an XY table, moving the XY stage by a small amount and making a bump on the package. The focus is directly under the optical axis of the optical system, and the height of the bump is measured (for example, Patent Document 1). 〇 However, in this method, the measurement time increases as the number of bumps increases. For example, a WLP (Wafer Uvel Package) ic bump of a CSP package has more than 20 million cases on a wafer having a diameter of 300 n]m, and it is assumed in the measurement that ^^ The movement of the platform takes 0.2 seconds, and for one focus, the measurement of the full bump on a wafer takes more than 462 hours. This measurement time is impractical in the actual production site. 2) Stereo camera method In the stereo camera method, the bump is irradiated with light, and the reflected light from the top of the bump head is taken by a plurality of cameras and their positions are extracted, respectively, by 10110759^single number A0101, page 7 / total 40 pages 1013155733 -0 201241412 The difference between these coordinate positions is the coordinate at the top of the bump head. In the stereo camera method, when a two-dimensional camera (photographing unit) such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor) is used, it is possible to simultaneously capture the presence of the camera. A plurality of bumps in the range are obtained, and each height is obtained (for example, Patent Documents 2 to 5). On the other hand, there is a trade-off relationship between the measurement resolution and the measurement range, and if the measurement resolution is to be improved, the measurement range is narrowed. Therefore, the top of the bump is placed in the measurement range, and even if the individual difference in the height of the top of each bump can be determined, the height of the top of the bump to the top of the bump is not known. Further, when there are many bumps to be measured, and it is impossible to take a single shot, it is necessary to divide into a plurality of regions and perform measurement. In the stereo camera method, only the difference in the relative height of the bumps in the photographing region can be obtained. Compare the height of the bump with the first shot. When you want to compare anyway, you need to make the first shot to be included in the field of view that is shot next. However, this requires repeated shooting and it is not possible to complete the shooting in a short time. Furthermore, since the height is received by receiving the previous information, the height information obtained by the previous measurement is used as the information of the next height measurement. If the error is included, the error is chained, and finally the accuracy is not obtained. The result of the South. 3) The light-cutting method is to project the laser slit light through the laser slit projection device at an angle which is oblique to the measurement object (for example, 45° when the vertical direction of the measurement object is 0°). A method of capturing reflected light caused by laser slit light generated by a portion to be inspected by a photographing unit such as a CCD camera (Patent Document No. #单编号纤01第8页/共40页1013155733-0 201241412 6). The light tangent generated on the measurement target has a characteristic that the position is displaced in the horizontal direction in accordance with the height of the measurement target. Therefore, the height distribution of the line on which the laser slit light is projected can be calculated from the displacement of the light tangent in the captured image, and the height distribution of the line can be repeatedly measured while moving the measurement target little by little. The in-plane height distribution of the measurement target is obtained.

However, in the photo-cutting method, in order to move the measurement object little by little, the measurement of the height distribution of the line is repeated, and the measurement time is required. Further, in recent years, although the bump is reduced in diameter, if the small-diameter projection on the flat surface of the small-diameter bump is to be measured, the reflected light of the top of the bump and the flat surface are greatly different, so the brightness of the light tangent is measured. As a result, there is a problem that the position of at least one of the light tangent lines of the top of the bump and the flat surface cannot be accurately detected, and the problem of the height of the bump cannot be accurately measured.

[Patent Document 2] [Patent Document 3] [Patent Document 4] [Patent Document 5] [Patent Document 6] [Patent Document 1] Japanese Patent Laid-Open No. Hei 5-21318, Japanese Patent Publication No. 9-304030 Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. Each of the advantages and disadvantages of the technique is that it is difficult to measure the individual differences of the relative heights of the tops of the heads in a short time and with high precision for the distribution of the plurality of protrusions on the plane of the substrate, and it is difficult to measure the self-substrate plane in a short time and with high precision. The height of the top of each head is highlighted. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a projection for distributing a plurality of planes on a substrate surface, which can be measured not only in a short time but also with high precision. 1〇11〇759#单单〇1 1013155733-0 Page 9 / Total 40 pages 201241412 The individual differences in the relative heights of the top of the head can also be used to measure the height of each of the heads protruding from the plane of the substrate in a short time and with high precision. In order to solve the above problems, the invention of the first aspect of the invention is a projection height measuring device that measures a height of a protruding portion of a plurality of projections on a plane of the substrate protruding from the plane of the substrate, and the feature includes: a first illumination portion that illuminates the illumination light by the first direction of the substrate plane of the protruding portion to be measured; and photographing the first illumination of the first reflected light that is irradiated by the first illumination portion and reflected at the top of the protruding portion a second illumination portion that illuminates the illumination light in the second direction toward the substrate plane including the protrusion portion to be measured; and photographs the second reflection light that is irradiated by the second illumination portion and is reflected on the top of the protrusion portion a second imaging unit; the positional information of the reflected light from the top of the protruding portion captured by the first imaging unit, and the reflected light from the top of the protruding portion captured by the second imaging unit Position information, a relative height calculation unit for calculating the relative heights of the head portions of the protruding portions; a third illumination portion that irradiates the substrate plane with linear illumination light longer than the diameter of the protruding portion; and a third imaging portion that captures the third reflected light that is irradiated by the third illumination portion and is reflected on the substrate plane And according to the position information of the reflected light from the plane of the substrate taken by the third photographing unit, and by the relative height calculation unit, 1011075# single number should be 01, 10th page, total 40 pages, 1013155733-0 201241412 As a result of the above, the projection height calculating unit that calculates the height of each of the protruding portions on the substrate plane that protrudes from the substrate plane is used to solve the above problems, and the invention described in the fifth aspect of the patent application is a prominent a height measuring method for measuring a height of a protruding portion of the plurality of projections on a plane of the substrate protruding from the plane of the substrate, the feature comprising: a first illumination illumination program for illuminating the illumination light from the first direction toward the substrate plane; The first illumination illumination program is irradiated with the first reflected light reflected at the top of the protrusion a second illumination illumination program for illuminating the illumination light from the second direction toward the substrate plane; capturing a second illumination of the second reflected light reflected by the second illumination illumination program at the top of the protrusion a program; calculating the position information of the reflected light from the top of the head portion of the protruding portion captured by the first imaging program and the position information of the reflected light from the top of the protruding portion of the protruding portion captured by the second imaging program a relative height calculation program of the relative heights of the tops of the protrusions; a third illumination illumination program for illuminating the substrate plane by a third direction longer than the diameter of the protrusions; and photographing the third illumination a third photographing program of the third reflected light reflected by the illumination program on the plane of the substrate; and positional information of the reflected light from the plane of the substrate photographed in the third photographing program, and the relative height at the foregoing The calculation program counts 1013155733-0 101HT759#单号A〇1〇l Page 11 of 40 201241412 As a result, a projection height calculation procedure for distributing the height of each of the projections on the plane of the substrate to the height of the substrate plane is calculated. By using the above-described protrusion height measuring apparatus and method, it is possible to accurately perform imaging with respect to a predetermined imaging area by simply shifting the imaging sequence slightly, and to accurately calculate the substrate by distributing a plurality of protruding portions on the substrate plane. The height of the top of each head that protrudes in a plane. Further, even in the case where the measurement target is divided into a plurality of imaging regions, each of the divided imaging regions can be photographed substantially simultaneously. The invention of claim 2, wherein the projection height measuring device according to the first aspect of the invention is characterized in that the illumination by the first illumination unit and the illumination by the second illumination unit Irradiation is performed by staggering the time. The invention of claim 6 is the method for measuring the height of the protruding portion according to the fifth aspect of the patent application, wherein the first illumination irradiation program and the second illumination irradiation program are shifted in time. According to the above-described protrusion height measuring device and method, even if the dominant wavelengths of the illuminations used in the first and second imaging units are the same, it is possible to capture the respective images only by shifting the timing of the irradiation. Shooting the dominant wavelength component illuminated by the other illumination does not affect the measurement accuracy. The invention of claim 3, wherein the main beam of the light irradiated by the first illumination unit and the light irradiated by the second illumination unit are the protrusion height measuring device according to the first aspect of the invention. The first imaging unit and the second imaging unit simultaneously perform imaging at different principal wavelengths. 10110759Product No. A〇101 Page 12/Total 40 Page 1013155733-0 201241412 The invention described in claim 7 is the method for measuring the height of the protrusion according to item 5 of the patent application, wherein the first illumination is The main wavelength of the light to be irradiated by the irradiation program is different from the main wavelength of the light to be irradiated by the second illumination irradiation program, and the first imaging program and the second imaging program are simultaneously performed. According to the above-described protrusion height measuring device and method, even if the irradiation timings of the first and second illumination lights are turned on at the same time, the wavelengths used in the other imaging units among the images observed by the respective imaging units are used. The light is not taken. Therefore, the time required for photographing the projections by the first and second photographing sections can be shortened without affecting the measurement accuracy. The invention of claim 4, wherein the main beam of the light irradiated by the third illumination unit has a dominant wavelength of the light emitted from the third illumination unit. The first illuminating unit and/or the second illuminating unit emits light of the main imaging wavelength, and simultaneously captures the third imaging unit and the first imaging unit that captures light of a dominant wavelength different from the third imaging unit. And/or photography of the aforementioned second photographing unit. The invention of claim 8 is the method for measuring the height of the protrusion according to any one of the items 5 to 7, wherein the main wavelength of the light irradiated by the third illumination illumination program is The main wavelength of the light irradiated by the first illumination illumination program and/or the second illumination illumination program is different by 5, and the third imaging program is simultaneously photographed, and the main wavelength of light different from the third imaging program is captured. Photography of the aforementioned first imaging program and/or the aforementioned second imaging program. If the above-described protrusion height measuring device and method are used, each of the 10110759 can be numbered A_13/40 pages 1013155733-0 201241412 while the first to third illuminations are simultaneously illuminated and photographed, even by the first and second The third illumination is irradiated in the area observed by the photographing unit, and among the images observed by the respective photographing units, the light of the wavelength used in the other photographing unit is not photographed. Therefore, since it is not necessary to shift the irradiation timing of the illumination light, the time for measuring the height of the projections can be sufficiently shortened. Further, since the height of the flat portion of the portion photographed by the first and second photographing portions can be measured, even the peripheral portion of the substrate can prevent the third illumination light from being exposed from the surface of the substrate. [0004] [Effect of the Invention] For the distribution of a plurality of protrusions on the plane of the substrate, it is possible to measure not only individual differences in the relative heights of the tops of the heads in a short time but also with high precision, and also in a short time and high The height of each of the heads protruding from the plane of the substrate is accurately measured. Therefore, if the present invention is applied to the measurement of solder bumps, it is possible to prevent the occurrence of solder failure (short-circuit or poor conduction between adjacent electrodes). [Embodiment] The embodiment for carrying out the invention will be described with reference to the drawings. Fig. 1 is a perspective view showing an example of a mode embodying the present invention. In each of the figures, the three axes of the orthogonal coordinates are X, Y, and Z, and the XY plane is the horizontal plane, and the Z direction is the vertical direction. In particular, the Z direction is in the direction of the arrow and in the opposite direction. The protruding portion height measuring device 1 embodying the present invention includes a substrate moving portion 2, a first observation portion 3, a second observation portion 4, and a third observation portion 5. [Substrate moving part] 10110759^^'^^ A0101 Page 14 of 40 1013155733-0 201241412

The substrate moving unit 2 includes a Y-axis stage 21 carried on a device base (not shown) of the protrusion height measuring device 1 and an X-axis platform 22 mounted on the Y-axis stage 21; A table 23 on the X-axis platform 22. The Y-axis stage 21 can move the X-axis stage 22 mounted thereon in the Y direction at a predetermined speed, and can be positioned and moved to be at a predetermined position, and the X-axis stage 22 can be mounted thereon at a predetermined speed. The table 23 is moved in the X direction to be positioned and moved to a predetermined position, and the table 23 is formed with a groove or a hole on the surface thereof, and the groove or hole is connected to the vacuum source through the switch control. The substrate 10 to be measured can be carried on the table 23. Since the substrate moving portion 2 has the above configuration, the substrate 10 placed on the table 23 can be moved in the XY direction at a predetermined speed, and positioned and moved to a predetermined position. [Substrate observation unit]

The first observation unit 3 includes a coaxial epi-illumination 31 as a first illumination unit, a lens barrel 34 as a first imaging unit, and a camera 35. The coaxial epi-illumination illumination 31 can illuminate the substrate 10 with the first illumination light 32 illuminated by the first direction. The first reflected light 33 reflected by the coaxial epi-illumination illumination 31 and transmitted through the plane of the substrate 10 and the top portion of the projection on the substrate 10 is received by the imaging unit of the camera 35 through the lens barrel 34. An optical element such as a lens is incorporated in the lens barrel 34, and the head top of the protruding portion on the substrate 10 is placed in a depth of focus and formed on the imaging portion of the camera 35. The second observation unit 4 includes an illumination 41 as a second illumination unit, a lens barrel 44 as a second imaging unit, and a camera 45. The illumination 41 can illuminate the substrate 10 with the second illumination light 42 illuminated by the second direction. The second reflected light 43 reflected by the plane of the substrate 10 and the top of the protrusion on the substrate 10 is passed through the lens barrel 44 by the illumination 41, according to the illumination of the camera 110, 10110759, unit number A_, page 15 of 40, 1013155733-0, 201241412. The photography department of 45 receives. The lens barrel 44 is assembled with an optical element such as a lens, and the head top of the protruding portion on the substrate 10 is placed in the depth of focus and imaged on the imaging portion of the camera 45. The third observation unit 5 includes a line illumination 51 as a third illumination unit, a lens barrel 54 as a third imaging unit, and a camera 55. The line illumination 51 can illuminate the linear third illumination light 52 with a predetermined length from the third direction toward the substrate 10. As the line illumination 51 is irradiated, the third reflected light 53 reflected on the plane of the substrate 10 and the top of the protruding portion on the substrate 10 is received by the imaging unit of the camera 55 through the lens barrel 54. The lens barrel 54 is assembled with an optical element such as a lens, and the plane of the substrate 10 is placed in the depth of focus and formed on the imaging unit of the camera 55. The camera 35, the illumination 41, the camera 45, the line illumination 51, and the camera 55 are attached to a frame (not shown) of the device base attached to the protrusion height measuring device 1. The above-described coaxial epi-illumination illumination 31 is used by being attached to the lens barrel 34, and can exemplify a form in which light is irradiated in a range in which light reflected by a half mirror (ha 1 f mirror) that passes through the inside of the lens barrel is photographed by the camera 35. The scope. The above-described illumination 41 can exemplify a combination of a point light source, a line light source or a surface light source, a mirror or a lens, and the light can be irradiated to a range including a range photographed by the camera 45. The above-described line illumination 51 can exemplify a light source that uses line illumination, point light source, or surface illumination to form a line that is illuminated, or to pass a beam of light emitted by a laser or a laser diode. Cylindrical surface 10110759# Single job cliff 01 Page 16 / Total 40 pages 1013155733-0 201241412 Mirror (cylindrical lens), or through the cylindrical lens to reflect, extending in one direction, forming a line. The cameras 35, 45, and 55 can exemplify a form in which a photographic element represented by a CCD or a CMOS called an image area sensor is two-dimensionally arranged, and can follow the brightness of the captured image. The image signal is output to the outside. Fig. 2 is a system configuration diagram showing an example of a mode embodying the present invention. As shown in FIG. 2, the protrusion height measuring apparatus 1 embodying the present invention is each of the above-described substrate moving unit 2, the first observation unit 3, the second observation unit 4, and the third observation unit 5, and each of the control unit 9. Machine connection. The control unit 9 is connected to include a control computer 90, an information input unit 91, an information output unit 92, a warning unit 93, an information recording unit 94, a machine control unit 95, and an image processing unit 96. The control computer 90 can be exemplified by a numerical calculation unit equipped with a microcomputer, a personal computer, a work station, or the like. The information input unit 91 can exemplify a keyboard or a mouse or a switch. The information output unit 92 can exemplify an image display display, a lamp, or the like. The issuing warning unit 93 can exemplify a buzzer or a speaker, a lamp, or the like to alert the operator. The information recording unit 94 can exemplify a semiconductor recording medium such as a memory card or a data disk, a magnetic recording medium, a magneto-optical recording medium, or the like. The machine control unit 95 can exemplify a programmable controller or a machine called a motion controller. The video signals output by the cameras 35, 45, and 55 are processed by the image processing. Single-numbered cliffs 1 Page 17 of 40 1013155733-0 201241412 The unit 96 is input to the control computer 90. The image processing unit 96 is generally equipped with a device for digitizing a video signal, such as a frame grabber, and takes in image signals output by the cameras 35, 45, and 5 5 . Based on the brightness information in the field of view taken by each camera, the observation point of the brightness exceeding the preset reference value is grasped as a bright spot, and the top of the protrusion can be detected. Further, if the calibration corresponds to the size of the actual observation surface of the observation field of view, it is also possible to calculate which position of the bright point is in the field of view, and to convert the position of the bright spot on the substrate into the actual size. Calculated. The image processing unit 96 can exemplify a form of the outside of the control computer 90, a form of the image processing unit connected to the control computer 90, and a form of the image processing unit using the control computer 90. Further, as will be described later in detail, the image processing unit 96 or the control computer 90 grasps the observation point of the brightness exceeding the preset reference value as a bright spot, and can measure the number of the projections distributed on the substrate plane. The height at which the substrate plane protrudes constitutes a relative height calculation unit that calculates the relative heights of the head portions of the protruding portions. A Y-axis stage 21 and an X-axis stage 22 are connected to the machine control unit 95. The table 23 is moved and stopped in an arbitrary area on the substrate 10 so that the images can be acquired by the cameras 35 and 45 to obtain an image. Or, while moving the table 23 at a predetermined speed, and simultaneously illuminating a light lamp (xenon 1 amp) or a halogen lamp and instantaneously emitting a large amount of light, or using a camera having a high-speed shutter function to obtain a Still images are also available. Moreover, the amount of light of the amount of light of the coaxial epi-illumination 31, the illumination 41, and the line illumination 51 is separately connected to the machine control unit 95 for individually adjusting the H) blue 5# single number A0101 page 18 / total 40 page 1013155733-0 201241412 section. Adjustment unit 30, 40, 50. The manner in which the amount of illumination of the illumination in the light amount adjusting units 3, 40, 50 is adjusted may exemplify a method of adjusting the applied voltage or current, or adjusting the application time of the voltage or current. The machine control unit 95 is connected to another control device (not shown), and each of the control devices can be given a control signal to operate or stop each of the machines. [Stereoscopic observation] 个别 The measurement of the individual differences in the heights of the tops of the projections 1b is performed using two cameras 35 and 45 according to a method called stereoscopic observation. Fig. 3 is a partial enlarged perspective view showing an embodiment of the present invention. The observation area of the substrate 1A which is observed by the first illumination light 32 irradiated in the first direction and the second illumination light 42 irradiated in the second direction toward the camera 35 and the camera 45 is irradiated. In Fig. 3, for the sake of simplification of the description, it is shown that nine projections 10b are included in the observation region 10f. Focusing on one of the three protruding ridges WbWObS' for the aforementioned illumination lights 32, 42, one point of the top of each of the protrusions 10匕1 to 10匕3 is 〇"(:1~1〇^: 3 and the reflected light 33a1 to 33a3 and 43al to 43a3 will be described. The first illumination light 32a 32a and the second illumination light 42a 42a3 each point toward the top of each of the protrusions 10b and 10b3. i〇ti~i〇t3 Further, the light reflected at a point 10U to 10t3 at the top of each of the protrusions l〇b1 to lb3 is respectively the first reflected light 333, 33 & 3 and the second reflected light 43al to 43a3 by the camera 35, 45. At this time, the first illumination light 32al~32a3 and the first reflected light 1013155733-0 33al~33a3 are light reflected at the top of the protrusion, so there is a positive 1〇11〇759# single number A0101 19th Pages/Total 40 pages 201241412 Relationship of reflections Similarly, the second illumination light 42a 42a3 and the second reflected light 43al~43a3 also have a regular reflection relationship. Fig. 4 is a first observation of an embodiment embodying the present invention. An example of the shooting of the image shows that the image viewed by the camera 35 of the first photographing unit is displayed. In the example, the image is an image in which the X direction and the γ direction of the observation area 1〇f are observed by the camera 35 in a direction orthogonal to the substrate 1 (Y direction). In the image observed by the first imaging unit, The point 1 at the top of the head of the protrusion 1 Ob 1 to 1 0b3 is 1 〇 11 to 1 〇 13 is photographed at a bright spot, and since the protruding portion is slightly spherical, the portion other than the top of the head 1 〇 rl 1 1 〇 r3 is photographed in a dark portion. Further, since the first illumination light 3231 to 3233 and the first reflected light 33al to 33a3 are both perpendicular to the surface of the substrate, the top of the display portion of the projection is observed at the center of the dark portion of the display portion. In this case, the distance from the reference point 10t0 of the point l〇tb 10t3 observed in the imaging area of the camera 35 is defined as Fig. 5 is an example of a form embodying the present invention. The second observation unit captures and displays the positive direction of the second reflected light 43a, 43b in FIG. 3 by the camera 45 of the second imaging unit, and indicates an example image observed by the second imaging unit. An example of the image that is sent. The image is defined as Y, the X direction of the region l〇f, and the image of the γ direction. The point is captured, but the dark portion of the other part 1 〇!> extends from γ in the above image. The point m at the top of the head of the protrusion 1〇b is bright, so the top of the protrusion is displayed.

Page 20 of 4 Pages If the leg #单号 is 01 1013155733-0 201241412 is observed. At this time, the distances from the reference points 10t0 of the aforementioned points I 〇 t1 to l 〇 t3 observed in the imaging area of the camera 45 are defined as d, d, and d, respectively. Fig. 6 is a front view showing an example of a mode embodying the present invention, showing a state in which Fig. 3 is viewed from the side (i.e., the direction of the arrow in the X direction). The positions of the bright spots at the top of the heads of the projections 1〇1) 1 to 1〇] 33 taken by the camera 35 are displayed. dl to d3 are not changed even if the heights of the projections i 〇 b1 to 1 〇 b3 are different. On the other hand, the position d of the bright spot at the top of the head portion of the protruding portions 10b1 to 10b3 photographed by the camera 45 is displayed, and if the heights of the protruding portions 10b1 to 10b3 are individually different, they are proportional to the individual differences in height. And change. Here, it is assumed that the heights of the protrusions 1 Q bi 〜 1 〇 b3 are H1 to H3, and the individual differences of the heights of the protrusions i 〇 b1 to l 〇 b3 are Δ h 〗 〖Ah3, and the general formula is defined. The height of the n protrusions is η, and the individual differences of the heights of the protrusions are defined as η. η In Fig. 6, the height H^H^h of the protruding portion i〇bl~l〇b3, the height of the protruding portion 10b3 is H3, and the state of =h-Ah3 is shown. That is, the protruding portion 10b3 is like the protruding portion b3' indicated by a broken line. When the height is only low Δ, the light 43a3 reflected from the top of the protruding portion 10b3 is compared with the reflected light 43a3, and is shifted in the γ direction. Bit. 3 The angle 01 between the surface of the substrate and the first reflected light is 9 degrees. If the angle difference between the angle 02 formed by the surface of the substrate and the second reflected light and the angle 01 is β, then in the nth protrusion The individual difference in height is determined by the amount of shift Ad calculated from the image at the top of the head. [Formula 1] 10110759#单号Α0101 Page 21/Total 40 Page 1013155733-0 201241412 A dn=A hn, The relationship of s ί η 0 [0006] is established, and the gas can be calculated according to [Formula 2] Δ d η in Θ Δ h π = s _ just (the case where n = 3 is illustrated in Fig. 6 when it is suitable for invention) The protruding portion 10b of the thin 0 is appropriately divided into a predetermined shooting range. Each of the divided shooting ranges is simultaneously transmitted through the two viewing portions. Then, the highlights of the respective captured portions can be calculated from the respective highlight information included in the captured image. [Line light triangulation method] In the measurement method according to the stereoscopic method described above, although the individual differences in the heights of the head portions of the respective protruding portions can be obtained, the distance between the protrusions and the Ob can not be obtained. The height h of the surface of the substrate 10 is reflected by the substrate 1 The amount of light is too strong or too weak to be compared with the reflected light from the top of the head. It is difficult to specify a predetermined place on the plane of the substrate. Moreover, even when the amount of light reflected by the plane of the substrate is appropriate, when the same wiring pattern is arranged When the wiring pattern is completely absent, the same point that is captured by the two cameras cannot be specified. Therefore, the surface of the substrate 照射 is irradiated with the linear third illumination light 52 in the third direction, and the reflected light is taken by the third imaging unit. Using the principle of triangulation, the position of the protrusion 1 Ob at the correct position of the substrate 1 is measured. As will be described later, the above-described stereoscopic method and the following photo-cutting method are combined to calculate the distribution of the height of the protruding portion from the substrate plane. 1013155733-0 Page 22 of 40201241412 The figure shows an example of an image taken by the third observation unit as an example of the aspect of the present invention, 翱__丄雄_μ member is not hunting by the second scene> The example of the image that is observed by the camera 5 5 is defined as the direction orthogonal to the third reflected light 53 as the Υ direction 'the state of the third reflected pupil in the image i is not taken. in The line illumination illuminating by the third illumination unit is irradiated with linear illumination light longer than the diameter of the protruding portion, and the light 53a reflected at the top of the protruding portion 10b is spot-shaped light on the plane portion of the substrate 10. The reflected light 53b is imaged by linear light. At this time, the distance of the light-reflected portion 53a observed in the imaging pupil region of the camera π from the reference point l〇g in the Y direction is Li'. The distance from the reference point l〇g of the light 53b reflected on the plane portion of the substrate 1〇 is defined as the distance L2 from the reference point to the r-direction of the base surface. In the present embodiment, if the size of the protruding portion is small, the head is The amount of light of the light 53a reflected at the top is weaker than the light 53b reflected on the plane portion of the substrate 10. Therefore, the distance L1 is not measured, and the distance L2 from the reference point to the Y direction of the base surface is measured, and the present invention is applied. Fig. 8 is a front view showing an example of a mode embodying the present invention, and shows a state in which Fig. 1 is viewed from the side (i.e., the direction of the arrow in the X direction). The third illumination light 52 is irradiated toward the substrate 10 at a predetermined angle 03 from the surface of the substrate 10 in the third direction, and the angle of the light 53a reflected at the top of the protrusion and the light 53b reflected by the surface of the substrate 10 is formed. 'It is equal to a predetermined angle Θ3 formed by the surface of the substrate. At this time, the reference point is RP, and the position of the light 53z reflected by the portion at the angle 03 by the camera 55 is defined as Lz. The height h0 from the surface of the substrate 10 at the reference point RP, and the distance L2 between the light 53z reflected by the transmission reference point RP observed by the camera 55 and the light 53b reflected on the surface of the substrate 1 is 10U0759# single number A 〇1〇l Page 23 of 40 1013155733-0 201241412 If the distance from the reference point Rp to the surface of the substrate 10 is defined as L', the following relationship holds: L2 = L' . sin2 0 3 h〇=L' Sin03 is the amount of shift calculated from the observed image [2, according to [Formula 3] h〇=:L2 sin 2 θ 3

[0008] The relational expression calculates the height of the top of each head of h〇e. If the direction of the arrow in the Z direction, γ, direction, and γ" direction is expressed as a positive component, the Δ hn of the formula 1 ' 2 and The height Ηη of the top surface of the n-th protrusion from the surface of the substrate 1 is calculated by the following equation: [Formula 4] [0009]

Hn = h 0+Δ h

—Adn s * n 203 ~7Τ7Γθ [Offset adjustment of the height of the top of the reference point and the protruding portion] _ difference Μ ' of the height calculated by the stereoscopic method described above and the line light by the above The height of the reference point Rp calculated by the triangulation method from the surface of the base n-plate 10 is adjusted as follows, and the offset adjustment is performed (see Figs. 6 and 8). First, 'calibration to 〇 〇 ) , , , , , , , 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 The pattern of the pattern. At this time, the chromium film 1 Op is a metal film having a known thickness and uniformity, and the light reflected from the surface is stereoscopically observed using the cameras 35 and 45. Further, the quartz surface of the calibration tool 100 (i.e., the bottom of the lattice pattern) uses the linear third illumination light 52 and the camera 55 to observe the reflected light from the quartz surface.

At this time, the reference point RP is present on the surface of the chrome film 10p, and the difference between the height of the reference point RP and the substrate surface is hO. Then, the individual difference η Δ h of the height Η of the n-th projection calculated by the stereoscopic method described above (refer to FIG. 6 ) is taken as the individual D n difference of the height hO of the height of the head to the reference point RP. And calculate. Then, the head portion of the actual protruding portion can be calculated from the shift amount Ad calculated from the image observed by the stereoscopic observation method and the shift amount L2 calculated from the image observed by the line light triangulation method η. The height of the Η. η [Observation and Measurement Flow] FIG. 9 is a flowchart showing an operation flow of an example of the embodiment of the present invention, in which a plurality of protruding portions 10b are formed on the substrate 10 into a plurality of regions, and the movement and observation are repeated one by one to calculate The height of each protrusion

A series of processes in tJ is shown in each step. First, the substrate 10 is placed on the table 23 of the protruding height measuring device 1 (s101). Next, the stage 23 is moved to the observation position (s102), the first illumination light 32 is irradiated toward the observation area 10f by the first direction (sll3), and the reflected light is observed by the first imaging unit (s114). Then, the second illumination light 42 is irradiated toward the observation region 10f by the second direction (s23), and the reflected light is observed by the second imaging portion (s24). Then, the linear third illumination light 52 is irradiated toward the observation region 10f by the third direction (s33), and the reflected light is observed by the third imaging unit (s34). Then, the observation area 10110759# single-numbered surface 1 帛 25 pages / total 40 pages 1013155733-0 201241412 The height of each of the protruding portions 10b in the field i〇f from the base surface (si〇5). Next, it is judged whether or not the (four) field is observed for (4) observation (sl〇6), and if there is an observation target region to be observed next, the table is moved to the place, and the above-described steps S102 and sii3 to s134 are repeated. When it is judged that all the observations have been completed, the results of the different observations in the respective observation regions 2 are combined and calculated as the heights of all the projections (10) in the substrate 1 (s1 to 7). When the calculation of the height of all the projections 10b is completed, the table 23 is moved toward the substrate delivery position (s1 to 8), and the substrate (I) is taken out by the table (2). In the observation by the stereoscopic observation method described above, if the first illumination light and the second illumination light have the same dominant wavelength, the first illumination light and the second illumination light are not simultaneously emitted, but the frequency error development is better. In this case, if the respective illuminating times are between nucleus and neon, the measurement can be performed without increasing the time for taking an observation area. Further, since the first illumination light and the second illumination light can be made to have the same dominant wavelength, it is possible to make the illumination, the camera, the filter, and the like common to each other, and it is not necessary to separately prepare a dedicated component. Therefore, it is possible to achieve the effect of reducing the cost of the device or maintenance. Further, if the light-emitting time is extremely small, the present invention can be applied because the bright spots caused by the other illumination can be detected without being detected by the wrong development of the light time and the imaging timing. The present invention can be applied even if the linear third illumination light 52 is irradiated to the observation area 1〇f, but it is preferable to irradiate it in the observation area 1 Of. According to this, it is possible to prevent the second illumination light from being exposed from the surface of the substrate. At this time, if the third illumination light 52 has the same dominant wavelength as the first and second illumination lights 32 and 33, the light timing can be slightly wrong. 'When the first to third illumination lights are illuminated, and 1013155733-0 10110759 When the time of the photographing and the time until the next lighting is very small, it can be said that the above steps sll2 to sl34 can be performed substantially simultaneously. [var iat ion] On the other hand, when it is desired to shorten the photographing time, the first illumination light and the second illumination light have different main wavelength components, and the first photographing unit only photographs the main wavelength of the first illumination light. It is preferable that the second imaging unit captures only the dominant wavelength of the second illumination light. For example, red illumination is used as the first illumination light, and a bandpass filter Fr that transmits only the red wavelength region is used in the first imaging unit, and green illumination is used as the second illumination light in the second imaging unit. A band pass filter Fg that transmits only the green wavelength region is used. As a result, the green illumination light incident on the first imaging unit is absorbed by the filter Fr, and the red illumination light incident on the second imaging unit is absorbed by the filter Fg. Therefore, even if the first and second illumination lights are simultaneously illuminated, bright spots caused by other illumination are not detected. According to this, even if the first illumination light and the second illumination light are simultaneously irradiated and the two imaging units are simultaneously photographed, it is possible to prevent erroneous detection of the position of the bright spot to be observed. Therefore, even if there are many places to be observed, the effect of shortening the shooting time can be achieved. In this case, a specific example of the main wavelength component different from the first illumination light and the second illumination light i may be as follows: illumination using different colors (for example, red, green, and blue LED illumination, etc.) When the main wavelength component of the illumination light is changed, or illumination with a common wavelength characteristic (for example, white illumination or the like) is used, but a band pass filter having a specific wavelength component is used and the respective permeable main wavelength components are changed and used. The situation, etc. Further, the linear third illumination light 52 is also preferably a main wavelength component different from the first and second illumination lights. According to this, even if the first to 1013155733-0 10110759# single number A 〇 101 page 27 / total 40 pages 201241412 illumination light 32, 42, 52 is irradiated into the observation area i 〇 f, each of the Zhaoming light The dominant wavelength is also not affected by the failure of other observations. FIG. 10 is a flow chart showing an operation flow of an example of the embodiment of the present invention. The plurality of protrusions m on the base (four) are divided into several areas and the movements are successively moved, and the respective protrusions are displayed. The height of the other-formal-series process is shown in each step. In the embodiment described with reference to Fig. 9, the flow of steps sll3 to sl34 is sequentially performed in time series. However, in place of the program, in another embodiment described herein, the flow of steps sU3 to sl34 is performed in parallel. According to this, the time required for the steps si 13 to si 34 can be further shortened. [First direction] With respect to the above-described first camera, the first direction is displayed to illuminate the surface of the substrate 1A vertically, and the form of the light reflected vertically is observed. However, the first direction may be different from the second direction, and may be irradiated to the surface of the substrate 10 at an angle other than the vertical. At this time, the illumination light irradiated in the first direction may be the same as the illumination 41. [Tilt Correction of Second Photographing Unit] In the above, the second camera becomes photographing from an oblique direction. Therefore, when the area sensor is used, when the normal optical system is used, only the center of the field of view is focused within the image taken in accordance with the shooting condition, and the field of view is blurred from the depth of field. Since the information of the blurred part cannot be used in the subsequent processing, it is wasteful. Therefore, it is also possible to adopt a form in which the optical system is a shift optical conf iguration or a Scheimpf lug optical configuration (Scheimpflug 1〇1l〇759#single number A0101 optical conf iguration), which is largely taken on page 28/ A total of 40 pages 1013155733-0 201241412 depth of focus, so that the photographic image is fully focused and the effective image data of each unit of photography becomes larger. [Fourth Line Illumination and Observation Unit] The fourth observation unit 6 may be further provided in addition to the third observation unit 5 described above. The fourth observation unit 6 includes a line illumination 61 as a fourth illumination unit, and a lens barrel 64 as a fourth imaging unit and a camera 65. The line illumination 61 can illuminate the linear illumination light 62 with a predetermined length from the fourth direction toward the substrate 10. The fourth reflected light 63 reflected by the line illumination 61 and reflected on the plane of the substrate 10 and the top of the projection on the substrate 10 is received by the imaging unit of the camera 65 through the lens barrel 64. An optical element such as a lens is incorporated in the lens barrel 64, and the plane of the substrate 10 is placed in the depth of focus and formed on the imaging portion of the camera 65. The light irradiated by the fourth illumination portion is irradiated onto the substrate 10 at a portion different from the light irradiated by the third illumination portion and reflected. Therefore, the tilt of the substrate which is only in the direction orthogonal to the longitudinal direction of the third illumination which cannot be extracted by the third line illumination can be correctly captured by additionally measuring the fourth line illumination. [Illustration of the Drawing] [0010] Fig. 1 is a perspective view showing an example of a mode embodying the present invention. Fig. 2 is a system configuration diagram showing an example of a mode embodying the present invention. Fig. 3 is a partially enlarged perspective view showing an example of a mode embodying the present invention. Fig. 4 is a view showing an exemplary image taken by the first observation unit in an example of the embodiment of the present invention. Fig. 5 is a view showing an example of an image taken by the second observation unit by means of the second observation unit (Τ7^单号 A0101 page 29/40 pages 1013155733-0 201241412.) Fig. 7 is an exemplary image taken by a third observation unit in an example of an embodiment of the present invention. Fig. 8 is a front view showing an example of a mode embodying the present invention. Fig. 10 is a flow chart showing an operation flow of an example of another embodiment of the present invention. [Description of main component symbols] [0011] 1 : Projection height measuring device 2: substrate moving portion 3: first observation portion 4: second observation portion 5: third observation portion 6: fourth observation portion 10: substrate 10b, 10M to 10b3: protruding portion '10c·. calibration tool 10f: observation area L〇g: reference point 1 Op: chrome film 1 010: reference point 1 011 ~ 1013: point at the top of each head of the protrusion 21: Y-axis platform 22: X-axis platform 075# single number A_ page 30/total 40 Page 1013155733-0 201241412 23: Table 30, 40, 50, 60: Light amount adjusting unit 31: first illumination unit 32, 32al to 32a3: first illumination light 33, 33al to 33a3: first reflected light 34, 44, 54, 64: lens barrel 35, 45' 55, 65: camera 41: Second illumination portion 42, 42al~42a3: second illumination light

D 43, 43al~43a3: second reflected light 51: third illumination portion 52: third illumination light 53: third reflected light 5 3 a: light 61 reflected at the top of the head: fourth illumination portion 62: fourth illumination Light 0 63: Fourth reflected light 90: Control computer 91: Information input unit 92: Information output unit 93: Issue warning unit 94: Information recording unit 95: Machine control unit 96: Image processing unit H1 to H3: Projection unit Height RP: Reference point 1013155733-0 1()11()759# Single number A0101 Page 31/Total 40 page 201241412 △ : Individual difference in height of the protrusion 1 〇0 1 : Angle deletion 075#单编号 删除1 32 pages / total 40 pages 1013155733-0

Claims (1)

201241412 VII. The scope of the patent application: the height of the device, measuring the height of the dog's exit from the plane of the substrate on the plane of the substrate, the feature comprising: - the plane of the substrate containing the protrusion as the object of measurement Illuminating the first-illuminated portion of the illumination light by the first direction; capturing a first-viewing portion of the first reflected light reflected by the first illumination and looking at the top of the protruding material; The second illumination portion that illuminates the illumination light toward the substrate plane including the protrusion of the target object; the second reflected light that is illuminated by the second illumination portion and reflected at the top of the protrusion portion a second photographing unit; positional information of the reflected light from the top of the head portion captured by the first photographing unit, and a position of reflection from the top of the head portion of the protruding portion photographed by the second photographing portion Information, a relative height calculation unit that calculates the relative heights of the head portions of the protruding portions; a third illumination portion that emits linear illumination light longer than the diameter of the protruding portion toward the substrate plane in the third direction; a third photographic portion of the third reflected light that is irradiated on the plane of the substrate by the third illuminating portion; and position information from the reflected light on the plane of the substrate taken by the third photographic portion, and With respect to the result calculated by the height calculation unit, a projection height calculating unit that distributes a plurality of heights of the respective protruding portions on the plate (four) protruding from the substrate plane is calculated. • The projection height measurement of the item 1 of the patent application range, wherein the irradiation of the light irradiated by the first illumination unit and the irradiation of the second illumination unit are performed on the 33rd page. Single number _ 1013155733-0 201241412 The irradiation of β is performed with a staggered time. 3. The protrusion height measuring device according to the item i of the patent application, wherein the primary wavelength of the light irradiated by the first illumination unit is different from the dominant wavelength of the light irradiated by the second illumination unit, the first imaging unit Photography is performed simultaneously with the second photographing unit. The protrusion height measuring device of any one of items 1 to 3 of the invention, wherein the main wavelength of the light irradiated by the third illumination portion and the first illumination portion and/or the second illumination The main imaging wavelength of the light irradiated by the part is different, and the imaging of the third imaging unit is performed, and the imaging of the first imaging unit and/or the second imaging unit that captures light of a dominant wavelength different from the third imaging unit. The method for measuring the height of the protrusions is to measure the height of the large portion of the distribution on the plane of the substrate protruding from the plane of the substrate, and the feature includes: · illuminating the illumination light from the first direction toward the plane of the substrate a first imaging program for capturing first reflected light reflected by the first illumination illumination program at a top of the protrusion; a second illumination illumination program for illuminating the illumination light from the second direction toward the substrate plane ～ capturing a second photographic program of the second reflected light reflected by the light irradiated by the second illumination illumination program at the top of the protrusion; according to the top of the head from the protrusion photographed in the first photographing program The positional information of the reflected light and the positional information of the reflected light from the top of the protruding portion captured by the second imaging program, and a relative height calculation program for calculating the relative heights of the heads of the protruding portions; a third illumination illumination program for illuminating the substrate plane in a three-direction direction with a linear illumination light longer than the diameter of the protrusion; 10] $7595单单Α01(Π Page 34 of 40, 1013155733-0 201241412, a third photographing procedure for capturing a third reflected light reflected by the third illumination illumination program on the plane of the substrate; and photographing according to the third photographing program The position information of the reflected light from the plane of the substrate, and the result calculated by the relative height calculation program, calculate the height of the protrusion of the height of the protruding portion of the plurality of protruding portions on the substrate plane protruding from the substrate plane 6. The method for measuring the height of the protrusion according to item 5 of the patent application, wherein the first illumination illumination procedure and the second illumination illumination procedure are performed in a staggered time. 7 as highlighted in claim 5 a height measuring method, wherein a dominant wavelength of light irradiated by the first illumination irradiation program is different from a dominant wavelength of light irradiated by the second illumination illumination program, and the first photographing program and the second photographing program are simultaneously performed 8. The method for measuring the height of a protrusion according to any one of the items 5 to 7 of the patent application, wherein the third illumination period is The dominant wavelength of the light to be irradiated is different from the dominant wavelength of the light irradiated by the first illumination illumination program and/or the second illumination illumination program, and %J simultaneously performs photography of the third photography program, and photographing and The third photographic program has different first wavelengths of light of the dominant wavelength and/or photography of the second photographic program. 10110759#单号舰01第35页/共40页1013155733-0