201240010 六、發明說明： 相關申請案的交叉引用 本申請案主張於2011年3月9日提出申請的韓國專利 申請案第10-2011-0〇21132號之優先權，該申請案之所 有内容以引用之方式全部併入本文。 【發明所屬之技術領域】 本發明提供一種用於貼附基板的黏合模組與設備以及 一種用於生產黏合墊的方法，且更特定言之，本發明係 關於一種用於貼附基板的黏合模組與設備以及一種用於 生產黏合墊的方法，在該方法中，可使用分子之間的吸 引力黏合基板或基板之類似物。 【先前技铜"】 隨著工業技術之發展，已廣泛使用各種用於處理基板 或基板之類似部件的技術。舉例而言，已使用過各種基 板處理技術，諸如’沈積或塗敷預定材料於基板之一側 上、用設定圖案將基板圖案化或钱刻基板、貼附兩個基 板等。 特定言之’已研發各種平板顯示器，諸如，液晶顯示 器（liquid crystal display; LCD)、電漿顯示面板（piasma display panel; PDP)、電致發光顯示器（electr〇luminescent 4 201240010 display，ELD)、真空螢光顯示器（vacuurn fiu〇rescent display; VFD)等，且已進—步開發一種用於半導體基板 之處理方法。因此，亦正在多樣化開發用於此種基板之 製程。 通常在將一基板或複數個基板固定於基板處理設備内 部之狀態下執行用於處理此種基板之製程。因此，在基 板處理設備内部提供一種用於固定基板之夾盤，且近來 最廣泛使用一種用於固定基板之使用靜電力的靜電夾盤 (electrostatic chuck; ESC)。 該靜電夾盤通常由燒結氧化鋁陶瓷或喷塗氧化鋁陶瓷 製得。該靜電夾盤内部嵌入有電極板，該電極板連接至 直流（direct current; DC)電源，且該靜電夾盤用靜電力黏 合基板至該靜電夾盤，該靜電力藉由自DC電源施加之 高壓產生。 然而’使用該靜電夾盤時會出現許多問題。首先’因 為在貼附基板時，必須向該靜電夾盤連續供應DC電 源，所以會消耗許多電源。此外，在藉由靜電黏合基板 時，歸因於靜電夾盤之電極圖案而剩餘的靜電可引起基 板上之污染。 又，由於该靜電夾盤具有精密的機械結構及電氣結 構，故該靜電夾盤之生產成本很高，此外，在該靜電夹 盤塗佈有聚醯亞胺膜之情況下，當基板在製程期間破裂 時’这聚驢亞胺膜很可能被基板之粒子損壞。 5 201240010 【發明内容】 因此，設想本發明以解決上述問題，且本發明之態樣 係提供-種用於貼附基板的黏合模組與設備以及一種用 於生產黏合墊的方法，在該方法中，可使用分子之間的 吸引力（亦即，凡得瓦力（vanderWaalsf〇rce))黏合基 板。 在上述態樣中’ Μ明提供—種黏合模μ、一種包括 該黏合模組之基板貼附設備，以及一種用於生產黏合墊 的方法，在本發明中，該黏合模組包括：框架該框架 形成有複數個固定部分；以及黏合墊，該等黏合墊用於 使用分子之間的吸引力貼附基板，該等黏合塾包括複數201240010 VI. STATEMENT OF CLAIM: CROSS-REFERENCE TO RELATED APPLICATIONS This application claims priority to the entire disclosure of the entire disclosure of the entire disclosure of the entire disclosure of The manner of reference is incorporated herein in its entirety. TECHNICAL FIELD OF THE INVENTION The present invention provides a bonding module and apparatus for attaching a substrate, and a method for producing an adhesive pad, and more particularly, to a bonding for attaching a substrate Modules and apparatus and a method for producing an adhesive mat in which an attractive force between molecules or a substrate can be bonded using an attractive force between molecules. [Previous Copper "] With the development of industrial technology, various techniques for processing similar components of a substrate or a substrate have been widely used. For example, various substrate processing techniques have been used, such as 'depositing or coating a predetermined material on one side of a substrate, patterning a substrate with a set pattern or engraving a substrate, attaching two substrates, and the like. Specifically, various flat panel displays have been developed, such as liquid crystal display (LCD), piasma display panel (PDP), electroluminescent display (electr〇 luminescent 4 201240010 display, ELD), vacuum A fluorescent display (VFD) or the like has been developed, and a processing method for a semiconductor substrate has been developed. Therefore, processes for such substrates are also being diversified. The process for processing such a substrate is usually performed in a state where a substrate or a plurality of substrates are fixed to the inside of the substrate processing apparatus. Therefore, a chuck for fixing a substrate is provided inside the substrate processing apparatus, and an electrostatic chuck (ESC) for electrostatically fixing the substrate has been widely used recently. The electrostatic chuck is typically made of sintered alumina ceramic or sprayed alumina ceramic. An electrostatic plate is embedded in the electrostatic chuck, and the electrode plate is connected to a direct current (DC) power source, and the electrostatic chuck is electrostatically bonded to the electrostatic chuck, and the electrostatic force is applied by a DC power source. High pressure is produced. However, many problems arise when using this electrostatic chuck. First, because the DC power must be continuously supplied to the electrostatic chuck when the substrate is attached, a large amount of power is consumed. Further, when the substrate is electrostatically bonded, static electricity remaining due to the electrode pattern of the electrostatic chuck can cause contamination on the substrate. Moreover, since the electrostatic chuck has a precise mechanical structure and an electrical structure, the production cost of the electrostatic chuck is high, and in addition, when the electrostatic chuck is coated with a polyimide film, when the substrate is in the process During the rupture period, this polyimide film is likely to be damaged by the particles of the substrate. 5 201240010 SUMMARY OF THE INVENTION Therefore, the present invention has been conceived to solve the above problems, and the aspect of the present invention provides a bonding module and device for attaching a substrate and a method for producing an adhesive pad, in which the method In this case, the attraction between the molecules (i.e., vanderWaalsf〇rce) can be used to bond the substrate. In the above aspect, the invention provides a bonding mold, a substrate attaching device including the bonding module, and a method for producing an adhesive pad. In the present invention, the bonding module comprises: a frame. The frame is formed with a plurality of fixed portions; and an adhesive pad for attaching the substrate with an attractive force between molecules, the plurality of adhesives including plural
個黏&。卩刀，在該複數個黏合部分處，分組且佈置複數 個黏合凸起部分Q 根據本發明之示例性實施例，將用於牢固定位基板之 外部原動力及電力的額外使用最小化，目&，相較於習 知的靜電夾盤，可改良使用效率及安全性。 又，在使用靜電夾盤之情況下之剩餘靜電，可因此能 防止基板上產生污染，且生產成本較靜電夾盤之生產成 本低。 【實施方式】 201240010 在下文中’參照所附圖式詳細描述本發明之示例性實 施例之黏合模組。在以下示例性實施例中，將針對實例 描述佈置於基板貼附設備内的黏合模組，但未註記出該 黏合模組。或者’本發明之示例性實施例可應用於基板 蚀刻没備、基板沈積設備或其他各種基板處理設備。 第1圖為圖示基板貼附設備之橫截面圖，該基板貼附 設備包括根據本發明之第一示例性實施例之黏合模組。 如第1圖中所示，基板貼附設備包括底座1〇,該底座1〇 形成外觀。又，下部腔室200提供於底座10内部，且上 部腔室100提供於該下部腔室200上方。此外，貼附基 板P的處理空間係形成於上部腔室100與下部腔室200 之間。貼附基板P的空間具有獨立的真空泵（未圖示）， 以便在貼附基板時’可對該處理空間抽真空。 上部腔室100藉由升降螺桿210及升降馬達230來支 樓’該升降螺桿210及該升降馬達230佈置於下部腔室 200中，且上部腔室1〇〇佈置成向上及向下升降。當上 部腔室100向上及向下升降時，將該處理空間密封且向 外開放’以便可將基板P載運至該處理空間中或取出該 處理空間。在此示例性實施例中，僅將上部腔室i 〇 〇配 置成向上及向下升降，但並不局限於此狀況。或者，可 僅將s亥下部腔室配置成向上及向下升降，或可將該等上 部及下部腔室兩者皆配置成向上及向下升降。 同時’上部腔室100及下部腔室2〇〇内部具有第一黏 合炎盤120及第一黏合夾盤220，載運自外部的基板p 201240010 分別黏合至該第一黏合夾盤12〇及該第二黏合夾盤 220。第一黏合夾盤120佈置於上部腔室1〇〇中，以形成 第一基板P1貼附的空間，且第二黏合夾盤22〇佈置於 下部腔至200中，以形成第二基板p2貼附的空間。隨 後將更詳細地描述第一黏合夾盤丨2〇及第二黏合夾盤 220之配置。 用於監控第一基板P1及第二基板卩之之對準的複數個 攝影機130佈置於上部腔室ι〇〇上方。上部腔室1〇〇形 成有攝景^孔101，該攝影孔1〇1垂直穿透第一黏合夾盤 12〇且允許攝影機13〇之攝影。又，線性致動器11〇佈 置於上。(5腔至1 〇 〇之外圍邊緣部分上。線性致動器1 1 〇 微調上部腔室100與下部腔室之間的空間，從而在貼附 基板時，控制第一基板！^與第二基板p2之間的間隙。 同時，在下部腔室200下方提供複數個升降銷241及 升降銷驅動器240，該複數個升降銷241垂直穿透下部 腔至2〇〇及第二黏合夾盤220。因此，雖然升降銷241 藉由升降銷驅動器240驅動而向上及向下升降，但該等 升降銷24!在載運進基板p時，自叉形臂（未圖示）接 收基板P，以貼附第一黏合夹盤120或第二黏合夹盤 22〇 ’或在取出基板p時，該等升降銷241將基板p給 予該又形臂。 又’在下部腔室200下方提供獨立的照明裝置250。 、、月裝置250在攝影機13〇為第一基板ρι及第二基 板P2之對準標記攝影時提供光線。 201240010 在下部腔室200之第二黏合夾盤22〇周圍，可提供有 線性量規260及UVW平台27〇，該線.性量規26〇用於量 測上部腔室100與下部腔室200之間的間隙，該uvw 平cr 270此夠調整第二基板P2之水平位置。 在以上;fe述中’以舉例方式詳細闡釋了該基板貼附設 備之主要配置。或者，可省略一些元件或可在適當的位 置改變一些元件。 以下參照第2圖至第5圖詳細描述第一黏合夹盤及第 二黏合夾盤。此處，第一黏合夹盤12〇與第二黏合夾盤 220之配置彼此相似，且因此為避免重複描述，將代表 性地描述第二黏合夾盤22〇。 第2圖為圖示第1圖之基板貼附設備之第二黏合夾盤 的透視圖。如第2圖中所示，第二黏合夾盤包括支撐板 及黏合模組。 支撐板221固定至下部腔室2〇〇。此外，支撐板22 J 之上側如此平坦，以致於可使第二基板P2安裝於該支 撐板221之上側上且得以支撐。在支撐板221之上側上 可形成支座溝槽（未圊示）及用於黏合基板p之黏合溝 槽221a ’複數個黏合模組3〇〇可插入且佈置於該支座溝 槽中》 此處’黏合溝槽22 u有助於藉由在第二基板p2第一 次安裝之時間點時黏合第二基板p2，來將第二基板p2 黏合至第二黏合夾盤220。此外，在貼附基板時，黏合 溝槽221 a用以噴射壓縮氣體穿過該黏合溝槽221 a，以 9 201240010 便可按壓且貼附第一基板p 1及第二基板P2。 同時’插入且佈置黏合模組300，以便黏合模組300 之一側可曝露於支撐板221之上側。因此，當安裝第二 基板P2時’第二基板P2之一側與黏合模組3〇〇之一侧 接觸且藉由分子之間的吸引力黏合至黏合模組300之該 側°以下將參照第3圖至第5圖更詳細地描述黏合模組 300 〇 第3圖為第2圖之黏合模組之透視圖，且第4圖為沿 第3圖之線A-A’截取的橫截面圖。如第3圖及第4圖中 所示，黏合模組300包括框架3 10及黏合墊320，該框 架310形成外觀，該黏合墊32〇用於黏合基板p。 框架310具有環形結構，且框架31〇插入且佈置於支 樓板221中。或者’可取決於基板之形狀及尺寸而多樣 化設計該框架之形狀。 同時，參照第3圖，框架3 10之底側及外側插入且佈 置於支撐板221中，且框架31〇之上側曝露於支撐板221 之上側。此時，曝露於支撐板221之上側的框架31〇之 上側形成有外圓周部分3 11及内圓周部分3丨2。 沿框架3 10之外圓周形成外圓周部分3丨丨。此外，在 外圓周部分311之上側佈置於支撐板221中之狀態下， 外圓周部分311之上側可具有與支撐板221之上側的高 度相同的南度。外圓周部分3 11具有至少一個沿圓周方 向的固定孔3 11 a。 在固定孔311a形成之位置處，黏合模組3〇〇耦接至支 10 201240010 撐板221，且黏合模組3〇〇佈置於支撐板221中。固定 孔3 11 a可具有各種固定結構。舉例而言，在此示例性實 施例中，經螺紋化以接收螺栓部件之通孔用作固定孔 3 11 a在此情況下，當需要替換或修理黏合模組3 〇 〇時’ 易於獨立地分離及佈置黏合模組3〇〇。 沿框架310之内圓周形成内圓周部分312。如第5圖 中所示，内圓周部分312形成平臺，該平臺具有比外圓 周。卩刀311之尚度更低的高度。此時，黏合墊安裝 於且佈置於内圓周部分312上方。 黏合墊320包括底部部分321及黏合部分322。底部 部分321形成黏合墊32〇之底側，且底部部分321安裝 於框架3U)之内圓周部分31"。黏合部分322係形成 於底部部分321上’且黏合部分322形成具群組的複數 個黏合凸起部分之結構。 第5圖圖示第4圖之黏合突起部分之電子顯微照片。 如第5圖中所示’黏合部分322之黏合凸起部分咖 具有柱狀結構，該柱狀結構具有圓形戴面。此處，黏合 凸起部分322a可具有約0.5叫至5〇_之長度及〇.〇5 μπι至2〇μιη之直徑β χ，該等黏合凸起部分咖可分 別佈置成與相鄰黏合凸起部分間^〇帥或5〇哗以下。 若黏合凸起料322a與基板p接冑，則基於凡得瓦原 理之分子之間的吸引力施加於黏合凸起部分咖與基 板P之間。此時，對一 μΝ之吸引力。因此， 黏合凸起部分322a施加至少2〇〇 此等黏合凸起部分322a佈置得如 201240010 此密集，以致於基板p可藉由各個黏合凸起部分322a 之合力而黏合。 如上所述，黏合凸起部分322a在預定位置處組成群 組，以構成黏合部分322。黏合墊32〇包括底部部分 上之複數個黏合部分322。此外，各個黏合部分322在 環形底部部分321上沿圓周方向以預定間隔彼此間隔 開。在此示例性實施例中，黏合凸起部分322a以預定間 隔分組情況下的黏合部分形成於底部部分32丨之一此位 置處’但並不局限於此狀況。或者’該等黏合凸起部分 可形成於整個底部部分。 黏合模組300基於分子之間的吸引力來黏合基板p， 該分子之間的吸引力施加於該複數個黏合凸起部分 322a與該基板之間。因此，不僅黏合模組3〇〇之生產成 本相較於靜電夾盤之生產成本而較低，而且黏合模組 300之使用效率及敎性得以改良。此外，該黏合模組 300可藉由單-壓實模組來實現，因此該黏合模組扇 在修理或替換時較易更換。 同時，用以下方式生產該黏合模.組之黏合墊：形成有 對應於該黏合模組之圖案的模板用以將該圖案轉移至模 製液體。以下將參照第6圖至第丨丨圖詳細描述一種用於 生產根據示例性實施例之黏合模組的方法。 第6圖為圖示生產第3圖之黏合模組之方法的流程 圖，且第7圖至第u圖為圖示第6圖中之生產黏合模組 之方法中主要步驟的示意圖。 12 201240010 首先使用模製法形成黏合墊320，且生產模板τ， "、板一有對應於該黏合墊之黏合凸起部分的圖案。 此時’鈍態臈圖案形成於模板Τ之上側上，以便可選擇 性地蝕刻該模板Τ。此鈍態膜圖案藉由微影製程形成。 具體而言，將鈍態膜塗敷至模板7之上側上，該模板 上側形成小塊表面（S 11 〇)。此時，光阻抗钱劑PR用 作鈍態臈。 奴後用光照射該光阻抗蝕劑。此時，圖案化遮罩μ 位於路徑上’該路徑受到來自光源之光照射，以便可發 出”有預疋圖案之光（參照帛7圖）。由於光阻抗蝕劑 叹在曝S於光時特性發生改變，故該光阻隸劑叹根 據光之圖案選擇性地發生特性之改變。隨後，僅移除特 性發生改變的（或特性未改變的）光阻抗#劑，以形成 光阻抗蝕劑PR之圖案（sm，見第8圖）。 當光阻抗钱劑PR完全圖案化時’對於模板τ之上側 繼續執行银刻製程（sl30)o此處，該飯刻製程可為乾式 蝕刻製程或濕式蝕刻製程’該乾式蝕刻製程或該濕式蝕 刻製程藉由考慮光阻抗钱劑PR之種類及触刻再現性來 選擇。未形成光阻抗蝕劑之部分經由蝕刻製程來蝕刻， 且可對應於預定圖案形成溝槽Ta。隨後，移除剩餘的光 阻抗蝕劑’以完成生產該模板τ (參照第9圖）。 此處，形成於模板τ之上側上的溝槽Ta對應於黏合 凸起部分322a而經圖案化，該等黏合凸起部分3仏提 供於黏合墊320上。因此’溝槽Ta可具有〇 〇5 _至 13 201240010 20 μηι之直徑，且溝槽Ta與相鄰溝槽Ta以5〇 μιη或5〇 μιη以下之距離間隔開。又，由於溝槽Ta之深度對應於 黏合凸起部分322a之長度，故控制蝕刻處理時間或蝕刻 源濃度，以使得蝕刻深度可自0.5 μιη至50 μηι之範圍變 化。 如另一方法，該模板之圖案化溝槽有可能經由壓印製 程形成。 若經由上述階段完成模板Τ，則使用模板τ繼續進行 模製（S 140)。在此示例性實施例中，液化矽樹脂用作模 製液體S。此外，液化纖維、樹脂物質或液化碳族材料 等可用作模製液體。藉由將模板τ之一侧壓縮至模製液 體S之表面上，來實現該模製，該模製液體s容納於獨 立框架中（參照第1 〇圖）。因此’模板T之溝槽圖案轉 移至模製液體S。 隨後’使該模製液體硬化（S 150)。為了使該模製液體 s硬化，可提供熱量或紫外線。若該模製液體s硬化， 則藉由移除模板T完成黏合墊320 ( S160，參照第u 圖）。因此’黏合墊320包括複數個黏合凸起部分322& , 該複數個黏合凸起部分322a係對應於模板τ之溝槽& 形成。 此外’黏合墊320貼附至框架3 1〇之内圓周部分3 12， 藉此生產黏合模組300(S170)。 此處’反復再使用藉由上述方法生產的模板，以藉此 降低黏合模組之生產成本。此外，若生產形成有對應於 201240010 複數個黏合墊之溝槽圖案之大尺寸模板，則一次製程足 以生產複數個黏合墊，藉此改良生產良率。 以下將描述根據本發明之第二示例性實施例之黏合模 組。為避免重複描述，將省略關於與本發明之上述示例 性貫施例之元件及技術特徵相同的元件及技術特徵的描 述0 第12圖為圖示根據本發明之第二示例性實施例之黏 合模組的透視圖，且第13圖圖示第12圖之黏合部分之 電子顯微照片。 雖然在上述示例性實施例中，黏合模組之黏合部分僅 配置有複數個黏合凸起部分，但此示例性實施例中之黏 合部分進一步包括複數個黏合凸起部分322a及複數個 分隔壁322b，該複數個分隔壁322b佈置於該等黏合凸 起部分322a之間。 此處’該複數個分隔壁322b自底部部分321之上側線 性伸出。此時，該複數個分隔壁3 2 2 b經呈長方形佈置以 將黏合部A 322 1區域分隔成複數個分隔區。此外，複 數個黏合凸起部分322a分別地佈置於分隔區内部，該等 分隔區藉由分隔壁322b來分隔。 分隔壁322b形成具有比黏合凸起部分322&更低之高 度。此外，分隔壁322b佈置於複數個黏合凸起部分32 = 之間，藉此減少形成於該等黏合凸起部分之間的孔。 在於真空中提供複數個黏合凸起部分以黏合基板之情 況下’空氣可不自該等黏合凸起部分之間的空間排出， 15 201240010 因此在對應位置處之基板可能發生微小變形。因此，在 此示例性實施例中，佈置於複數個黏合凸起部分322a 之間的分隔壁322b減少黏合部分322之間的孔，以便可 最小化由剩餘在該等黏合部分中的空氣而造成的變形。 在此示例性實施例中，該複數個分隔壁用於填充黏合 部分中之複數個黏合凸起部分之間的空間，但並不局限 於此狀況。除此分隔壁結構之外，各個突起部分可佈置 於該等黏合凸起部分之間的空間中，且該等突起部分減 少黏合部分之孔。 以下將參照第14圖至第20圖詳細描述一種用於生產 根據本發明之示例性實施例之黏合模組的方法。 第14圖為圖示生產第12圖之黏合模組之方法的流程 圖，且第15圖至第20圖為圖示第14圖中之生產黏合模 組之方法中主要步驟的示意圖。 如第一示例性實施例，生產用於模製黏合墊之具有圖 案之模板T。模板τ在模板T之上側上具有待進行選擇 性蝕刻之鈍態膜圖案。此時，可藉由微影製程將鈍態膜 圖案圖案化。 具體而言’將光阻抗蝕劑PR塗敷至模板T之上側上， 該模板T之上側形成小塊表面。此外，預定圖案化遮罩 Μ經佈置’以便可發出具有預定圖案之光。 在第一示例性實施例之曝光製程中，使用僅具有對應 於該等黏合凸起部分之圖案的遮罩。然而，在此示例性 實施例中，使用具有對應於黏合凸起部分322a與分隔壁 16 201240010 3 22b兩者之圖案的遮罩μ (參照第圖）。 若如上發出光線，則光阻抗蝕劑Pr根據光之圖案發 生特性之改變，且僅移除特性發生改變的（或特性未發 生改變的）光阻抗蝕劑，以形成圖案（S21〇 ,見第16 圖）。隨後，對於圖案化光阻抗蝕劑pR之上側繼續執行 蝕刻製程，以便對應於黏合凸起部分322a之溝槽以及 對應於为隔壁322b之溝槽Tb可形成於模板τ上（S22〇, 見第17圖）。 此處，由於在相同環境下執行該蝕刻製程長達相同時 段，故對應於該分隔壁之溝槽Tb的深度等於對應於該 黏合凸起部分之溝槽Ta的深度。因此，在此示例性實施 例中，僅將對應於黏合凸起部分322a之溝槽^額外钱 刻L以便該黏合凸起部分322a可形成具有比分隔壁32孔 之高度更高的高度。 因此’再次將光阻抗蝕劑pR塗敷至所有區域，但 應於黏合凸起部分322a之溝槽Ta除外（s23〇，見第 圖）。可藉由類似於圖案化該光阻抗㈣叹的方法繼 此製程。亦即，將光阻抗钮劑塗敷至模板之整個表面 且經由遮軍使光照射，該遮罩僅形成有對應於該黏合 刀之圖案。因& ’由於光僅照射至對應於黏合凸; P刀之溝槽，故移除對應位置之光阻抗㈣，且隨後< 續進仃該蝕刻製程（S240，見第19圖）。如此，在模4 僅將對應於黏合凸起部分之溝槽Ta進行兩次¥ 刻’以便與對應於分隔壁之溝槽TM目比’溝槽Ta可每 17 201240010 更深的蝕刻。 若經由上述階段完成模板，則藉由壓縮模板τ將溝槽 之圖案轉移至模製液體之表面上（S 250)。隨後，使該模 製液體硬化，且移除模板’以藉此完成黏合墊，該黏合 墊具有黏合凸起部分及分隔壁（S260與S270，見第2〇 圖）。 此外，該黏合墊貼附至框架之内圓周部分且佈置於框 架之内圓周部分中’藉此生產黏合模組（s280)。 以下將描述根據本發明之第三示例性實施例之黏合模 組。為避免重複描述，將省略關於與本發明之上述示例 性實施例之元件及技術特徵相同的元件及技術特徵的描 述0 第21圖為圖示根據本發明之第三示例性實施例之黏 合模組的透視圖’且第22圖為圖示第21圖之黏合部分 之橫戴面的橫截面圖。 如第21圖及第22圖中所示，根據本發明之示例性實 施例之黏合模組包括如上述第二示例性實施例的複數個 黏合凸起部分322a及複數個分隔壁322b ^雖然在第二 示例性實施例中，該分隔壁形成具有比黏合凸起部分之 尚度更低的高度，但在此示例性實施例中，分隔壁322b 與黏合凸起部分322a形成具有彼此相同的高度。 因此，在黏合基板P時，在此示例性實施例中之黏合 模組300之黏合凸起部分322a與分隔壁322b兩者皆與 基板P接觸。此外，不僅黏合凸起部分322a而且分隔壁 18 201240010 322b施加分子之間的吸引力於基板p上，因此該黏合凸 起部分322a及該分隔壁322b黏合該基板P，藉此相比 於上述示例性實施例之黏合模組而改良黏合模組3〇〇之 黏合。 此外’複數個黏合凸起部分322a之間的空間填充有分 隔壁322b，因此減少了該黏合部分之孔隙率。因此，在 真空下黏合基板之階段中，可最小化由剩餘在黏合部分 322中的空氣而造成的變形。 儘管由一些剩餘空氣引起壓力差，但由於分隔壁322b 呈輕射狀地支撐/黏合基板P，故有可能抵抗由壓力差引 起的力’藉此有利地防止該基板p變形。 基於根據第一及第二示例性實施例之用於生產黏合模 組的方法’可較易理解一種用於生產此示例性實施例中 之黏合模組的方法。為避免重複描述，將省略該方法之 坪細描述。 如上所述’根據三個示例性實施例描述了黏合模組、 具有該黏合模組之基板貼附設備，以及用於生產該等黏 合模組之方法。然而’除上述示例性實施例之外，顯然 應可由熟習此項技術者對該等元件中之一些或該等方法 中之一些進行改變及不同的實施。 替代的示例性實施例可應用於半導體生產設備、基板 触刻設備、基板沈積設備或類似的各種基板處理設備， 該等基板處理設備在黏合基板時處理該基板。此外，替 代的示例性實施例可應用於載運基板之基板載運設備， 19 201240010 諸如’機益手臂等。 雖然本案已參照本發明之示例性實施例特定圖示且描 述了本發明’但熟習此項技術者應理解可在不脫離如所 附申請專利範圍所定義的本發明之精神及範相情況 下，對本發明進行形式及細節上的各種改變。該等示例 性實施例應僅視為描述性意義上的，而非出於限制之目 的。因此，本發明之範疇由所附申請專利範圍界定而並 非由本發明之詳細描述界定，且該範疇内的所有差異將 解釋為包含於本發明中。 【圖式簡單說明】 第1圖為圖示基板貼附設備之橫截面圖，該基板貼附 SX·備包括根據本發明之第一示例性實施例之點合模組。 第2圖為圖示第1圖之基板貼附設備之第二黏合夾盤 的透視圖。 第3圖為第2圖之黏合模組之透視圖。 第4圖為沿第3圖之線a_A，截取的橫截面圖。 第5圖圖示第4圖之黏合突起部分之電子顯微照片。 第6圖為圖示生產第3圖之黏合模組之方法的流程圖。 第7圖至第11圖為圖示第6圖中之生產黏合模組之方 法中主要步驟的示意圖。 第12圖為圖示根據本發明之第二示例性實施例之黏 20 201240010 合模組的透視圊。 第13圖圖示第12圖之霉占 第14圖為圖示生產第 圖。 合部分之電子顯微照片。 圖之黏合模組之方法的流 裎 第15圖至第20圖為圖示第14圖中之生產黏合模組之 方法中主要步驟的示意圖。 第21圖為圖不根據本發明之第三示例性實施例之黏 合模組的透視圖。 第22圖為圖示第21圖之黏合部分之橫截面的橫截面 圖。 1〇 1〇1 12〇 2〇〇 220 22la 24〇 25〇 27〇 3 1〇 3Ua 【主要元件符號說明】 底座 攝影孔 第一黏合爽盤 下部腔室 第二黏合失盤 黏合溝槽 升降銷驅動器 照明裝置 Uvw平台 樞架 固定孔 100 上部腔室 110 線性致動器 130 攝影機 210 升降螺桿 221 支撐板 230 升降馬達 241 升降銷 260 線性量規 300 黏合模組 311 外圓周部分 312 内圓周部分 21 201240010 320 黏合墊 321 底部部分 322 黏合部分 322a 黏合凸起部分 322b 分隔壁 Μ 遮罩 P 基板 PI 第一基板 P2 第二基板 PR 光阻抗蝕劑 S 模製液體 S110 步驟 S120 步驟 S130 步驟 S140 步驟 S150 步驟 S160 步驟 S170 步驟 S210 步驟 S220 步驟 S230 步驟 S240 步驟 S250 步驟 S260 步驟 S270 步驟 S280 步驟 T 模板 Ta 溝槽 Tb 溝槽 22Sticky & A file, at a plurality of bonding portions, grouping and arranging a plurality of adhesive projections Q. According to an exemplary embodiment of the present invention, additional use of external motive power and power for securely positioning the substrate is minimized. Compared with the conventional electrostatic chuck, the efficiency and safety can be improved. Further, the residual static electricity in the case of using the electrostatic chuck can prevent contamination on the substrate, and the production cost is lower than that of the electrostatic chuck. [Embodiment] 201240010 Hereinafter, an adhesive module of an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the following exemplary embodiments, the bonding module disposed in the substrate attaching device will be described for the example, but the bonding module is not noted. Alternatively, the exemplary embodiments of the present invention are applicable to substrate etching, substrate deposition equipment, or other various substrate processing apparatuses. Fig. 1 is a cross-sectional view showing a substrate attaching apparatus including a bonding module according to a first exemplary embodiment of the present invention. As shown in Fig. 1, the substrate attaching apparatus includes a base 1 which forms an appearance. Further, the lower chamber 200 is provided inside the base 10, and the upper chamber 100 is provided above the lower chamber 200. Further, a processing space to which the substrate P is attached is formed between the upper chamber 100 and the lower chamber 200. The space to which the substrate P is attached has an independent vacuum pump (not shown) so that the processing space can be evacuated when the substrate is attached. The upper chamber 100 is branched by the elevating screw 210 and the elevating motor 230. The elevating screw 210 and the elevating motor 230 are disposed in the lower chamber 200, and the upper chamber 1 is arranged to be raised and lowered upward and downward. When the upper chamber 100 is raised and lowered upward and downward, the processing space is sealed and opened outwardly so that the substrate P can be carried into the processing space or taken out of the processing space. In this exemplary embodiment, only the upper chamber i 〇 〇 is configured to move up and down, but is not limited to this. Alternatively, only the lower chamber of the shai may be configured to move up and down, or both the upper and lower chambers may be configured to move up and down. At the same time, the upper chamber 100 and the lower chamber 2 have a first adhesive disc 120 and a first adhesive chuck 220, and the substrate p 201240010 carried from the outside is bonded to the first adhesive chuck 12 and the first Two adhesive chucks 220. The first adhesive chuck 120 is disposed in the upper chamber 1〇〇 to form a space to which the first substrate P1 is attached, and the second adhesive chuck 22 is disposed in the lower chamber to 200 to form a second substrate p2 Attached space. The configuration of the first adhesive chuck 丨2〇 and the second adhesive chuck 220 will be described in more detail later. A plurality of cameras 130 for monitoring the alignment of the first substrate P1 and the second substrate are disposed above the upper chamber ι. The upper chamber 1 is formed with a viewing aperture 101 which vertically penetrates the first adhesive chuck 12 and allows photography of the camera 13 to be photographed. Further, the linear actuator 11 is placed on top. (5 cavity to 1 〇〇 on the peripheral edge portion. The linear actuator 1 1 〇 fine-tunes the space between the upper chamber 100 and the lower chamber, thereby controlling the first substrate when attaching the substrate! ^ and the second A gap between the substrates p2 is provided. Meanwhile, a plurality of lift pins 241 and lift pin drivers 240 are provided below the lower chamber 200, and the plurality of lift pins 241 vertically penetrate the lower chamber to the second and second adhesive chucks 220. Therefore, although the lift pins 241 are driven up and down by the lift pin driver 240, the lift pins 24! receive the substrate P from the fork arms (not shown) when being carried into the substrate p for attachment. The first adhesive chuck 120 or the second adhesive chuck 22A' or the lift pins 241 give the substrate p to the conformal arm when the substrate p is taken out. Further, an independent illumination device 250 is provided below the lower chamber 200. The month device 250 provides light when the camera 13 is photographed by the alignment marks of the first substrate ρι and the second substrate P2. 201240010 A linear amount is provided around the second adhesive chuck 22 of the lower chamber 200. Regulation 260 and UVW platform 27〇, the line. Sex gauge 26 For measuring the gap between the upper chamber 100 and the lower chamber 200, the uvw flat cr 270 is sufficient to adjust the horizontal position of the second substrate P2. In the above description, the substrate is exemplified in detail by way of example The main configuration of the device is attached. Alternatively, some components may be omitted or some components may be changed at appropriate positions. The first adhesive chuck and the second adhesive chuck are described in detail below with reference to Figures 2 to 5. Here, the first The configurations of the adhesive chuck 12A and the second adhesive chuck 220 are similar to each other, and thus the second adhesive chuck 22A will be representatively described in order to avoid repeated description. FIG. 2 is a diagram showing the substrate attachment of FIG. A perspective view of the second adhesive chuck of the apparatus. As shown in Fig. 2, the second adhesive chuck includes a support plate and a bonding module. The support plate 221 is fixed to the lower chamber 2〇〇. Further, the support plate 22 J The upper side is so flat that the second substrate P2 can be mounted on the upper side of the support plate 221 and supported. On the upper side of the support plate 221, a support groove (not shown) can be formed and used for bonding the substrate p. Adhesive groove 221a 'multiple bonding modes The group 3 can be inserted and disposed in the holder groove. Here, the bonding groove 22 u helps to bond the second substrate p2 by bonding the second substrate p2 at the time of the first mounting. The second substrate p2 is bonded to the second bonding chuck 220. In addition, when the substrate is attached, the bonding groove 221a is used to spray compressed gas through the bonding groove 221a, and can be pressed and attached by 9 201240010. a substrate p 1 and a second substrate P2. At the same time, the bonding module 300 is inserted and arranged so that one side of the bonding module 300 can be exposed on the upper side of the supporting plate 221. Therefore, when the second substrate P2 is mounted, the second substrate One side of P2 is in contact with one side of the bonding module 3〇〇 and is bonded to the side of the bonding module 300 by the attraction between the molecules. The bonding mold will be described in more detail below with reference to FIGS. 3 to 5. Group 300 〇 Figure 3 is a perspective view of the bonding module of Figure 2, and Figure 4 is a cross-sectional view taken along line A-A' of Figure 3. As shown in Figures 3 and 4, the bonding module 300 includes a frame 3 10 and an adhesive pad 320. The frame 310 forms an appearance, and the bonding pad 32 is used to bond the substrate p. The frame 310 has an annular structure, and the frame 31 is inserted and disposed in the floor panel 221. Alternatively, the shape of the frame may be diversely designed depending on the shape and size of the substrate. Meanwhile, referring to Fig. 3, the bottom side and the outer side of the frame 3 10 are inserted and placed in the support plate 221, and the upper side of the frame 31 is exposed on the upper side of the support plate 221. At this time, the upper side of the frame 31 which is exposed on the upper side of the support plate 221 is formed with an outer circumferential portion 3 11 and an inner circumferential portion 3丨2. An outer circumferential portion 3丨丨 is formed along the outer circumference of the frame 3 10. Further, in a state where the upper side of the outer circumferential portion 311 is disposed in the support plate 221, the upper side of the outer circumferential portion 311 may have the same southness as the height of the upper side of the support plate 221. The outer circumferential portion 3 11 has at least one fixing hole 3 11 a in the circumferential direction. At a position where the fixing hole 311a is formed, the bonding module 3 is coupled to the support 10 201240010 gusset 221, and the bonding module 3 is disposed in the support plate 221. The fixing holes 3 11 a can have various fixing structures. For example, in this exemplary embodiment, a through hole that is threaded to receive a bolt member serves as a fixing hole 3 11 a. In this case, when it is necessary to replace or repair the bonding module 3 ' 'easy to independently Separate and arrange the bonding module 3〇〇. An inner circumferential portion 312 is formed along the inner circumference of the frame 310. As shown in Fig. 5, the inner circumferential portion 312 forms a platform having a peripheral circumference. The height of the sickle 311 is lower. At this time, the adhesive pad is mounted to and disposed above the inner circumferential portion 312. The adhesive pad 320 includes a bottom portion 321 and an adhesive portion 322. The bottom portion 321 forms the bottom side of the bonding pad 32, and the bottom portion 321 is mounted to the inner circumferential portion 31" of the frame 3U). The adhesive portion 322 is formed on the bottom portion 321' and the adhesive portion 322 forms a structure of a plurality of adhesive convex portions having a group. Fig. 5 is an electron micrograph showing the portion of the adhesive projection of Fig. 4. As shown in Fig. 5, the adhesive convex portion of the adhesive portion 322 has a columnar structure having a circular wearing surface. Here, the adhesive convex portion 322a may have a length of about 0.5 to 5 〇 and a diameter β χ of 5 π 5 μπι to 2 〇 μηη, and the adhesive convex portions may be respectively arranged to be adjacent to the adjacent convex convex Part of the room is handsome or less than 5 inches. If the bonding projection 322a is in contact with the substrate p, the attraction between the molecules based on the van der Waals principle is applied between the bonding projection portion and the substrate P. At this time, it is attractive to one μΝ. Therefore, the adhesive projection portion 322a is applied with at least 2 turns. The adhesive projection portions 322a are arranged so densely as 201240010, so that the substrate p can be bonded by the resultant force of the respective adhesive projection portions 322a. As described above, the adhesive projection portions 322a form a group at predetermined positions to constitute the adhesive portion 322. The adhesive pad 32 includes a plurality of adhesive portions 322 on the bottom portion. Further, the respective adhesive portions 322 are spaced apart from each other at a predetermined interval in the circumferential direction on the annular bottom portion 321. In this exemplary embodiment, the adhesive portion of the adhesive projection portion 322a in the case where the predetermined interval is grouped is formed at one of the positions of the bottom portion 32', but is not limited to this. Alternatively, the adhesive projection portions may be formed throughout the bottom portion. The bonding module 300 bonds the substrate p based on the attraction between the molecules, and the attraction between the molecules is applied between the plurality of bonding convex portions 322a and the substrate. Therefore, not only the production cost of the bonding module 3 is lower than that of the electrostatic chuck, but also the efficiency and flexibility of the bonding module 300 are improved. In addition, the bonding module 300 can be realized by a single-compacting module, so that the bonding module fan can be easily replaced during repair or replacement. At the same time, the bonding pad of the bonding mold is produced in such a manner that a template corresponding to the pattern of the bonding module is formed to transfer the pattern to the molding liquid. A method for producing a bonding module according to an exemplary embodiment will be described in detail below with reference to Figs. 6 through 丨丨. Fig. 6 is a flow chart showing a method of producing the bonding module of Fig. 3, and Figs. 7 to u are schematic views showing main steps in the method of producing the bonding module in Fig. 6. 12 201240010 First, the bonding pad 320 is formed by a molding method, and the template τ, ", the plate has a pattern corresponding to the bonding convex portion of the bonding pad. At this time, a passive pattern is formed on the upper side of the template to selectively etch the template. This passive film pattern is formed by a lithography process. Specifically, a passive film is applied to the upper side of the template 7, and the upper side of the template forms a small surface (S 11 〇). At this time, the optical impedance agent PR is used as a passive state. The photoresist is irradiated with light after the slave. At this time, the patterned mask μ is located on the path 'the path is irradiated with light from the light source so that the light having the pre-pattern can be emitted (refer to Figure 7). Since the photoresist resists sighs when exposed to light The characteristic changes, so the photoresist sing selectively changes in characteristics according to the pattern of light. Subsequently, only the light impedance # agent whose characteristic is changed (or whose characteristics are not changed) is removed to form a photoresist resist. PR pattern (sm, see Fig. 8). When the optical impedance agent PR is completely patterned, 'the silver engraving process (sl30) is continued for the upper side of the template τ. Here, the meal process may be a dry etching process or The wet etching process 'the dry etching process or the wet etching process is selected by considering the kind of the optical impedance agent PR and the etch reproducibility. The portion where the photoresist is not formed is etched by an etching process, and can be corresponding The trench Ta is formed in a predetermined pattern. Subsequently, the remaining photoresist resist ' is removed to complete the production of the template τ (refer to FIG. 9). Here, the trench Ta formed on the upper side of the template τ corresponds to the adhesive bump Starting part 322a After being patterned, the bonding convex portions 3 are provided on the bonding pad 320. Therefore, the 'groove Ta may have a diameter of 〇〇5 _ to 13 201240010 20 μηι, and the trench Ta and the adjacent trench Ta are 5 The distance between 〇μιη or 5〇μηη is spaced apart. Further, since the depth of the trench Ta corresponds to the length of the adhesion convex portion 322a, the etching processing time or the etching source concentration is controlled so that the etching depth can be from 0.5 μm to 50 The range of μηι varies. As another method, the patterned groove of the template may be formed via an imprint process. If the template is completed through the above stages, the molding is continued using the template τ (S 140). In the embodiment, a liquefied hydrazine resin is used as the molding liquid S. Further, a liquefied fiber, a resin substance or a liquefied carbon group material or the like can be used as the molding liquid by compressing one side of the template τ to the surface of the molding liquid S In order to achieve the molding, the molding liquid s is accommodated in a separate frame (refer to Fig. 1). Therefore, the groove pattern of the template T is transferred to the molding liquid S. Subsequently, the molding liquid is hardened ( S 150). For The molding liquid s is hardened to provide heat or ultraviolet rays. If the molding liquid s is hardened, the bonding pad 320 is completed by removing the template T (S160, see Fig. u). Therefore, the 'adhesive pad 320 includes a plurality of Adhesive convex portion 322&, the plurality of adhesive convex portions 322a are formed corresponding to the groove & of the template τ. Further, the 'adhesive pad 320 is attached to the inner circumferential portion 3 12 of the frame 3 1 , to thereby produce a bond Module 300 (S170). Here, the template produced by the above method is repeatedly used to reduce the production cost of the bonding module. Further, if a groove pattern corresponding to the 201240010 plurality of bonding pads is formed, the groove pattern is formed. Large size stencils are sufficient to produce multiple bond pads in a single process, thereby improving production yield. An adhesive mold set according to a second exemplary embodiment of the present invention will be described below. To avoid duplicating description, descriptions of the same elements and technical features as those of the above-described exemplary embodiments of the present invention will be omitted. FIG. 12 is a view illustrating bonding according to a second exemplary embodiment of the present invention. A perspective view of the module, and Fig. 13 illustrates an electron micrograph of the bonded portion of Fig. 12. In the above exemplary embodiment, the bonding portion of the bonding module is only configured with a plurality of bonding convex portions, the bonding portion in the exemplary embodiment further includes a plurality of bonding convex portions 322a and a plurality of dividing walls 322b. The plurality of partition walls 322b are disposed between the adhesive projection portions 322a. Here, the plurality of partition walls 322b linearly protrude from the upper side of the bottom portion 321. At this time, the plurality of partition walls 3 2 2 b are arranged in a rectangular shape to divide the region of the adhesive portion A 322 1 into a plurality of partition regions. Further, a plurality of adhesive projection portions 322a are respectively disposed inside the partition, and the partitions are partitioned by the partition wall 322b. The partition wall 322b is formed to have a lower height than the adhesive projection portion 322&; Further, the partition wall 322b is disposed between the plurality of adhesive projection portions 32 =, thereby reducing the holes formed between the adhesive projection portions. In the case where a plurality of bonding convex portions are provided in a vacuum to bond the substrate, the air may not be discharged from the space between the bonding convex portions, and the substrate may be slightly deformed at the corresponding position. Therefore, in this exemplary embodiment, the partition wall 322b disposed between the plurality of adhesive convex portions 322a reduces the holes between the adhesive portions 322 so that the air remaining in the adhesive portions can be minimized. The deformation. In this exemplary embodiment, the plurality of partition walls are used to fill the space between the plurality of adhesive projection portions in the adhesive portion, but are not limited to this condition. In addition to the partition wall structure, each of the projecting portions may be disposed in a space between the adhesive projection portions, and the projection portions may reduce the holes of the adhesive portion. A method for producing a bonding module according to an exemplary embodiment of the present invention will be described in detail below with reference to Figs. 14 to 20. Fig. 14 is a flow chart showing a method of producing the bonding module of Fig. 12, and Figs. 15 to 20 are schematic views showing main steps in the method of producing the bonding mold group in Fig. 14. As with the first exemplary embodiment, a patterned template T for molding an adhesive pad is produced. The template τ has a passive film pattern to be selectively etched on the upper side of the template T. At this time, the passive film pattern can be patterned by a lithography process. Specifically, the photoresist resist PR is applied to the upper side of the template T, and the upper side of the template T forms a small surface. In addition, the predetermined patterned mask is arranged to be uttered so that light having a predetermined pattern can be emitted. In the exposure process of the first exemplary embodiment, a mask having only a pattern corresponding to the portions of the adhesive projections is used. However, in this exemplary embodiment, a mask μ having a pattern corresponding to both the adhesive convex portion 322a and the partition wall 1640040010 3 22b is used (refer to the figure). If the light is emitted as above, the photoresist resist Pr changes in characteristics according to the pattern of the light, and only the photoresist having the characteristic change (or the characteristic is not changed) is removed to form a pattern (S21〇, see 16 figure). Subsequently, the etching process is continued for the upper side of the patterned photoresist pR so that the groove corresponding to the bonding convex portion 322a and the groove Tb corresponding to the partition 322b can be formed on the template τ (S22〇, see 17 picture). Here, since the etching process is performed in the same environment for the same period of time, the depth of the trench Tb corresponding to the partition wall is equal to the depth of the trench Ta corresponding to the adhesive bump portion. Therefore, in this exemplary embodiment, only the groove corresponding to the adhesive projection portion 322a is additionally lubricated so that the adhesive projection portion 322a can be formed to have a height higher than the height of the partition wall 32. Therefore, the photoresist resist pR is applied again to all regions except for the trench Ta to which the bump portion 322a is bonded (s23, see the figure). This process can be followed by a method similar to patterning the optical impedance (four) sigh. That is, an optical impedance button is applied to the entire surface of the stencil and is irradiated with light by occlusion, and the mask is formed only with a pattern corresponding to the knives. Since &' is only irradiated to the groove corresponding to the bonding convex; P-knife, the optical impedance of the corresponding position is removed (4), and then the etching process is continued (S240, see Fig. 19). Thus, in the modulo 4, only the groove Ta corresponding to the bonded convex portion is twice etched so as to be deeper than the groove TM corresponding to the partition wall, the groove Ta can be deeper every 17 201240010. If the template is completed through the above stages, the pattern of the grooves is transferred to the surface of the molding liquid by compressing the template τ (S 250). Subsequently, the molding liquid is hardened, and the template ' is removed to thereby complete the bonding pad, which has the adhesive projection portion and the partition wall (S260 and S270, see Fig. 2). Further, the bonding pad is attached to the inner circumferential portion of the frame and disposed in the inner circumferential portion of the frame to thereby produce the bonding module (s280). An adhesive mold set according to a third exemplary embodiment of the present invention will be described below. In order to avoid duplicating description, descriptions of the same elements and technical features as those of the above-described exemplary embodiments of the present invention will be omitted. FIG. 21 is a view showing a bonding mold according to a third exemplary embodiment of the present invention. A perspective view of the set 'and Fig. 22 is a cross-sectional view showing the transverse wear surface of the adhesive portion of Fig. 21. As shown in FIGS. 21 and 22, the bonding module according to an exemplary embodiment of the present invention includes a plurality of bonding convex portions 322a and a plurality of dividing walls 322b as in the second exemplary embodiment described above. In the second exemplary embodiment, the partition wall is formed to have a lower height than the thickness of the adhesive projection portion, but in the exemplary embodiment, the partition wall 322b and the adhesive projection portion 322a are formed to have the same height as each other. . Therefore, when the substrate P is bonded, both the adhesive convex portion 322a and the partition wall 322b of the adhesive module 300 in this exemplary embodiment are in contact with the substrate P. In addition, not only the convex portion 322a but also the partition wall 18 201240010 322b is applied to the substrate p, so that the adhesive convex portion 322a and the partition wall 322b adhere to the substrate P, thereby comparing the above example. The bonding module of the embodiment improves the bonding of the bonding module 3 . Further, the space between the plurality of adhesive convex portions 322a is filled with the partition walls 322b, thereby reducing the porosity of the bonded portions. Therefore, in the stage of bonding the substrate under vacuum, the deformation caused by the air remaining in the bonding portion 322 can be minimized. Although the pressure difference is caused by some remaining air, since the partition wall 322b supports/bonds the substrate P in a light-like manner, it is possible to resist the force caused by the pressure difference, thereby advantageously preventing the substrate p from being deformed. A method for producing the bonding module in this exemplary embodiment can be more easily understood based on the method for producing an adhesive mold set according to the first and second exemplary embodiments. To avoid duplication of description, a detailed description of the method will be omitted. As described above, the bonding module, the substrate attaching device having the bonding module, and the method for producing the bonding module are described in accordance with three exemplary embodiments. However, it is apparent that some of these elements, or some of the methods, may be modified and implemented in addition to the above-described exemplary embodiments. Alternative exemplary embodiments are applicable to semiconductor manufacturing equipment, substrate etch equipment, substrate deposition equipment, or similar various substrate processing equipment that processes the substrate as it is bonded. Further, an alternative exemplary embodiment can be applied to a substrate carrying device that carries a substrate, 19 201240010 such as a 'sports arm. Although the present invention has been particularly shown and described with reference to the exemplary embodiments of the present invention, it is understood by those skilled in the art that the invention may be practiced without departing from the spirit and scope of the invention as defined by the appended claims. Various changes in form and detail of the invention are made. The exemplary embodiments should be considered in a descriptive sense only and not for the purpose of limitation. Therefore, the scope of the invention is defined by the scope of the appended claims and is not intended to BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing a substrate attaching apparatus including a spotting module according to a first exemplary embodiment of the present invention. Fig. 2 is a perspective view showing the second adhesive chuck of the substrate attaching apparatus of Fig. 1. Figure 3 is a perspective view of the bonding module of Figure 2. Fig. 4 is a cross-sectional view taken along line a_A of Fig. 3. Fig. 5 is an electron micrograph showing the portion of the adhesive projection of Fig. 4. Fig. 6 is a flow chart showing a method of producing the bonding module of Fig. 3. Fig. 7 through Fig. 11 are schematic views showing the main steps in the method of producing the bonded module in Fig. 6. Fig. 12 is a perspective view showing a viscous 20 201240010 integrated module according to a second exemplary embodiment of the present invention. Fig. 13 is a view showing the mold of Fig. 12. Fig. 14 is a diagram showing the production. Electron micrograph of the part. Flow of the method of bonding the module of the drawing Fig. 15 to Fig. 20 are schematic views showing the main steps in the method of producing the bonding module in Fig. 14. Figure 21 is a perspective view showing a bonding module not according to the third exemplary embodiment of the present invention. Fig. 22 is a cross-sectional view showing a cross section of the bonding portion of Fig. 21. 1〇1〇1 12〇2〇〇220 22la 24〇25〇27〇3 1〇3Ua [Main component symbol description] Base photography hole first bonding cool disk lower chamber second bonding loss plate bonding groove lifting pin driver Illumination device Uvw platform pivot fixing hole 100 Upper chamber 110 Linear actuator 130 Camera 210 Lifting screw 221 Support plate 230 Lifting motor 241 Lifting pin 260 Linear gauge 300 Bonding module 311 Outer circumferential portion 312 Inner circumferential portion 21 201240010 320 Adhesive pad 321 bottom portion 322 adhesive portion 322a adhesive convex portion 322b partition wall 遮 mask P substrate PI first substrate P2 second substrate PR photoresist S molding liquid S110 step S120 step S130 step S140 step S150 step S160 step S170 Step S210 Step S220 Step S230 Step S240 Step S250 Step S260 Step S270 Step S280 Step T Template Ta Trench Tb Trench 22