201238752 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種附銅載體之銅箔、該銅箔之製造方 法、電子電路用銅箔、該銅箔之製造方法及電子電路之形 成方法’該附銅載體之銅箔係適於藉由蝕刻來進行電路形 成之電子電路形成且由壓延銅箔或電解銅箔構成。 【先前技術】 於電子、電氣設備中廣泛使用有電子電路用銅箔，但 由於近年來之電子、電氣設備存在輕薄短小之傾向，故而 對電子電路用銅箔而言亦要求更薄之銅箔。由於較薄之電 子電路用㈣難以進行操作，故而逐漸使㈣有支持銅笛 之載體銅箔的附銅載體之鋼箔。 上：載體之銅绪係於由電解鋼箱或壓延銅落構成之銅 載體自電子電…二:但由於最後將銅 必需容易與4Π截S 牙、而使用’故而電子電路用銅箔 乂窩夺易與銅載體剝離。因此， 與銅載體之間設置剝離層之技術。#於電子電路用㈣ 提出有於剥離層設置有機皮 獻D或金屬層（例如，專利文獻膜;技術（例如，專利文 作為金屬層之括、老 ）於專利文獻2中， 々贫屬層之候補，可列舉N Τ 落時，由於電子電路用鋼落之4進而，於除去載體 具有變色或腐敍之危險性。 露出新生成之面，故而 因此’提出有如下禮土、士 用銅落之表面設置防錄㈣體之H於電子電路 層，即，於載體落上設置剝離層、 201238752 防銹層、電子電路用銅箔（例 、例如，專利文獻3、專利文獻4)。 專利文獻3、專利文獻4中之狀接 甲之防銹層均以Ni為代表而進行 列舉。另一方面，關於剝離 增於專利文獻3中列舉有有 機皮膜、或者金屬層，於專利文獻4中列舉有。。層。 另方面為了於電子電路用銅绪形成目標電路，而 藉由塗佈抗钮劑及曝光步總办〜^ ^ 】、亢，驟來印刷電路，進而，實施除去 銅落之不必要之部分的姓刻處理，但於進行钮刻而形成電 路時，存在產生壓陷（sag)而導致該電路無法成為預期之寬 度的問題。 因此’於專利文獻5中提出有藉由將較薄之鎳或者錄 合金附著於電子電路用銅箱之表面而防止壓陷之技術。 專利文獻1 .日本特開平丨丨—3丨7 5 7 4號 專利文獻2 .日本特開2005 — 254673號 專利支獻3 :日本專利第369〇962號 專利文獻4 :日本專利第4〇7243 1號 專利文獻5 .日本特開2002 — 176242號 【發明内容】 如上所述，於在電子電路用銅羯設置較薄之鎳或者鎳 。金之情形時，考慮到剝離性而使用與鎳不同之層。然而， 若可以鎳形成剝離層，則於設備、成本方面較為有效。 進而，若於經剝離之載體箔上存在鎳，則鎳可防止電 =組成之蝕刻時產生壓陷，因此，亦可利用附有鎳之載體 箔作為電子電路用銅箔。 因此，本發明之課題在於獲得在由壓延銅羯或電解鋼 4 201238752 治構成之附銅載體之銅荡，具有形成於銅載體上之由錄或 者鎮合金構成之剝離層、與具有更薄之錄層之銅層的附銅 載體之銅羯、該銅箱之製造方法及電子電路之形成方法。 π本發明人等得到如下見解：為了於由壓延銅箱或電解 銅箔構成之附銅載體夕你！ ％ α „ 町％戰體之銅治，且具有「於蝕刻面形成鎳層 而可形成無壓陷之電路寬度均句之電路」#電子電路用銅 箱的銅載體銅落中，即便於剝離層使_，亦可容易地 剝離’故而於銅載體上形成錄層，並將其暫時曝露於空氣 中之後於鎳層上形成鎳層，藉此，可同時解決若干個問題。 獲得如下見解.經剝離而獲得之電子電路用銅 羯於敍刻面具有鎳層’且調節銅落之厚度方向之钮刻速 度，可形成無壓陷之電路寬度均句之電路，進而，藉由將 銅表面上之被覆層設為適當之薄度，而可藉由軟姓刻來容 易地除去。進而’亦獲得如下見解：經剝離之載體銅荡亦 可用作能夠形成無壓陷之電路寬度均勻之電路之銅羯。 根據上述見解，本發明提供 1) -種附銅載體之銅猪，其係由銅載體、鎳層、銅層 之構造構成’且該銅載體由壓延銅箱或電解鋼箱構成；苴 特徵在於：可以未達〇.5kg/cm之強度剝離，且藉由剝離而 於銅載體上具有鎳層’同時於銅層側亦具有鎳層。 又’本發明提供 2卜種附銅載體之銅猪，其係由下述部分構成：銅載 體⑷，其由壓延銅揭或電解鋼落構成；錦層（B)，直位 於該銅载體（A)上，且厚度為〇.〇3〜^;鎳層⑹， 201238752 其形成於該錄層（B)Ji’且厚度為〇 〇〇1〜〇 〇3"m;及銅 層（D)，其進一步形成於該鎳層（c)上。 又，本發明提供 3) 如上述2)之附銅載體之鋼笔，辻士 ， l j冶，其中，上述鎳層（B ) 為剝離時之銅載體（A )上之鎳層，上+ w 上述鎳層（C)為剝離 時之銅層（D)上之鎳層。 又，本發明提供 4) 一種附銅載體之銅之製造方法，其係：於由壓延 銅羯或電解銅落構成之銅載體（A)上進行無電鍍錄或電鍍 鎳’而形成厚度為〇.〇3〜2”之鎳層（B)，並將其暫時曝 露於工氣中之後’於該鎳層（B)上進而藉由無電鍍鎳或電 鍍錦形成厚度為0.00卜0.03…錦層（c)，且於該錄層 (C)上藉由電鑛銅而形成銅層（〇)。 又’本發明提供 5) 種電子電路用銅箔’其係將上述1)至3)中任 -項之附銅載體之銅箔於上述鎳層（B)與鎳層（c)之間 釗離而獲得，且由鎳層（c)與銅層（D)構成。 又’本發明提供 6 )種載體鋼箔，其係將上述1 )至3)中任一項之 附鋼載體之銅箔於上述鎳層（B)與鎳層（C)之間剝離而 獲侍’且由鎳層（B)與銅載體（A)構成。 又，本發明提供 ,7) 一種由鎳層（B)與銅載體（A)構成之載體銅箔， 於上述6)之载體銅箔中，鎳層（B)為0.03〜0.1// m，且 6 201238752 用於電子電路用。 又，本發明提供 之製㈣之製造方法，其係將以上述4) 之袈坆方法製造之附銅載 之間剝離，而獲得由鋅=:於錄層⑻與鎖層(C) 路用銅t各。 ” 與鋼層（D)構成之電子電 又’本發明提供 ”1);種載體銅落之製造方法，其係將以上述4)之製 = 之附銅載體之銅笛於錦層⑻與錄層⑻之 ^。，㈣得由_⑻與鋼載體（A)構成之載體銅 又’本發明提供 1〇) 一種電子電路之形成方法，其係、於上述5)之電子 電路用鋼泊（D )之銅層表面貼附樹脂基板，於其相反面之 鎳層（C)上形成電路形成用抗蝕劑圖案，進一步使用由氣 化銅冷液或氣化鐵溶液構成之#刻液，將附有上述抗儀劑 圖案部分以外的鎳層（c)及銅層（D)之不必要之部分除 去’其次，除去抗蝕劑’進一步藉由軟蝕刻將剩餘部分之 鎳層（C)除去，從而形成具有特定寬度之電路。 又’本發明提供 U) 一種電子電路之形成方法，其係於上述5)之載體 銅箔之銅載體（A)表面貼附樹脂基板，於其相反面之鎳層 (B)上形成電路形成用抗蝕劑圖案，進一步使用由氣化銅 溶液或氣化鐵溶液構成之蝕刻液，將附有上述抗蝕劑圖案 201238752 部分以外的鎳層（B )及銅載體（A)之不必要之部分除去， 其次，除去抗蝕劑，進一步藉由軟蝕刻將剩餘部分之鎳層 (B)除去’從而形成具有特定寬度之電路。 由於本發明具有預先使用銅箔之載體、進而於其上具 有剝離層、且形成銅之電子電路用銅箔的構造，故而操作 容易’而且必要時可容易地將載體箔剝離。由於可用作「將 載體銅珀剝離而獲得之包含鎮層的極薄之銅箔，即單純構 造的銅馆」，故而可任意使用於各種電子電路之設計，從而 具有富有通用性之較大效果。 而且，於藉由對本發明之由鎳層（c)與銅層（D)構 成之電子電路用銅箔進行蝕刻而形成電路時，具有可形成 電路寬度更均勻之目標電路之效果，且具有下述之效果： 防止因蝕刻所致之壓陷之產生，進而藉由將銅表面上之鎳 層設為適當之薄度，而可藉由軟蝕刻來容易地除去，進而 可防止蝕刻後之鎳層出現溶解殘留物。 又，經剝離而獲得之由鎳層（B)與銅載體（A)構成 之載體銅箔亦可用作電子電路用銅箔，且可獲得相同之效 果。但是，作為電子電路用銅箔較佳之鎳層（B)之厚度為 〇· 03〜0.1/zn^根據上文所述，具有如下之效果：可提供一 種可提尚圖案蝕刻中之蝕刻&、防止短路或產生電路寬度 不良的優異之電子電路之形成方法。 進而，由於2種銅箔之間所使用之層為相同之鎳，故 而於设備及成本方面均有效。 【實施方式】 8 201238752 本發明係一種使用由壓延銅箔或電解鋼箔構成之銅載 體（A)的電子電路及該電路用銅箔、製造其之方法以及使 用其等之電子電路用銅箔.、該銅箔之製造方法及電子電路 之形成方法。 為達成本案發明之目的，於由壓延銅箔或電解銅箔構 成之銅載體（A)上進行無電鍍鎳或電鍍鎳而形成厚度為 〇·〇3〜2/zm之鎳層（B)。 於使用電解銅箔之情形時，可使用光澤面或粗面任一 者。只要能夠進行後續之步驟即鍍鎳便可。於鍍鎳時，可 使用無電鍍鎳或電鍍鎳任一者。 又，鑛敷層之厚度亦無特別限定，但自剝離之情形時 所需之強度方面來看，0.03〜2 可謂是適當之厚度。即， 5亥鏡錄層（B)成為剝離面。 又，於厚度為（h〇3〜O.lem之情形時，若銅載體（A) 之厚度為9〜35Am，則具有如下之功能：可有效地抑制於 對剝離後之由鎳層（B)與銅載體（A)構成之載體箔進行 钱刻而形成電路之情形時容易產生的「壓陷」。進而，可於 電路形成後藉由軟蝕刻而容易地除去剩餘部分之B層。 其次，於將已實施該鍍鎳（B )之載體銅箔暫時曝露於 空氣中後，於該鎳層（B)上進而藉由無電鍍鎳或電鍵錦而 形成厚度為0.001〜〇.〇3//m之極薄之鎳層（C)。 於此情形時’若曝露於空氣中，則由於鎳為容易氧化 之金屬’故而於鎳層（B)形成氧化膜之可能性非常高。作 是，由於認為其係非常薄之氧化膜，故而難以進行測定。 201238752 如上所述’於該鎳層（C)上藉由電鍍銅而形成銅層（D) 從而製造附銅載體之銅箔，但可於鎳層（B)與鎳層（C) 之間將雙方剝離。 儘管為相同之鎳，但剝離容易，且可以未達〇.5kg/cm 之強度剝離。該剝離之容易性可視為於鎳層（B )形成了氧 化膜之結果。利用此現象為本案發明之較大特徵之一。 於在上述鎳層（B )與鎳層（C )之間進行剝離後，雙 方之銅箔可用於電子電路。 即，可用作將附載體之銅箔於上述鎳層（B)與鎳層（c) 之間剝離而獲得的由鎳層（c )與銅層（D )構成之電子電 :用mi、或於上述鎳層⑻與鎳層（c)之間剝離而獲 得的由錄層（B)與銅載體（a)構成之載體銅箔。 由於該電子電路用銅箔於表面形成有鎳層（c)，故而 具有可有效地抑制於對銅層（D)進行_㈣成電路之情 形時容易產生的「壓陷」之功能。 月 但是，於載體ms之情形日寺，可較佳地用於電子 之鎳層（B)之厚度為〇 〇3〜〇 iym。 再者，銅層⑼不僅可應用導電性較高之純銅， 根據目的而應用銅合金％ (Cu_Cr合金、Cu_z一金 合金、_合金、Si合金等)。其等：有可 任意調整導電性、物生、鑛敷性、焊接性、 設計中所必需之特性的功能。 電路 其進而亦可具有「 之功能。可容易理解， 可於形成電路階段調節蝕刻速度」 就該添加成分之摻合比例及厚度= 10 201238752 言，只要變更鍍敷之條件便可任意地調節。 最近之傾向係傾向於形成微小電路，故而厚度亦㈣ 於減小。通常設為1〜5//m左右之厚度。 其次，於上述錄層⑻與録層（c)之間剝 其中之附錦層（C)之鋼層⑻用於電子電路中。該電： 電路用銅箔例如可積層於樹脂基板上而使用。 於使用該附錦層（C)之電子電路用鋼荡而形成微細電 日使用由氯化銅溶液或氯化鐵溶液構成之蝕刻液，將 附有上述抗㈣|圖案部分以外的不必要之部分除去。 其次，除去抗飯劑，進而藉由軟敍刻除去剩餘部分之 錦層（C)。由於利用形成抗敍劑圖案而除去不必要之銅羯 為通常進行之方法’故而無需多加說明。 〜:般情況下’較佳為使用敍刻速度較快之由氣化鐵水 /谷液形成之敍刻液。其®囡.於 . 具原因在於，存在因電路之微細化而 致敍刻速度降低之問題。由氣化鐵水溶液形成之敍刻液 糸防止上述問題之有效手段。但是，並不妨礙其他姓刻液 之使用。可視需要替換蝕刻液。 藉此τ间精度地形成為「形成於銅之電路間且例如 ^旨基板上之空間具有銅之厚度之2倍以上之寬度」的電 亦可視需要形成具有銅之厚度之2倍以下、進而15倍 以下之寬度的電路。 杳八對#刻進行具體說明，則位於靠近銅$上之抗触劑 邛刀之位置、且為抗蝕劑側之銅箔的蝕刻速度受到該鎳層 p制相S p现著遠離錄，鋼之触刻以通常之速度進行。 201238752 藉此，蝕刻自銅電路側面之抗蝕劑側起向樹脂基板側大致 垂直地進行’從而形成矩形之銅箔電路。 由於附鎳層（B )之載體箔亦可獲得與能形成壓陷較少 之電路相同的效果，故而可用作電子電路用銅箔。 錄層係主要抑制壓陷之產生而形成電路寬度均勻之目 標電路。覆銅積層板係必需於形成電子電路之樹脂貼附等 步驟中進行高溫處理，但於此情形時，鎳層會被氧化，而 容易產生抗蝕劑之塗佈性（均勻性、密合性）之不良，又， 於蝕刻時，加熱時形成之界面氧化物容易使蝕刻產生不 均，從而成為招致短路或電路寬度之不均勻性的原因。 於此情形時，較理想的是，較厚地形成鎳層。但是， 作為覆銅積層板，於未較大地受到加熱之影響之情形時， 可較薄地形成錄層。 如此，可藉由較厚地形成鎳層’而防止熱氧化造成之 影響，但較厚地形成其本身未必較佳。其係意味著，於電 路形成後，必需藉由軟蝕刻進行除去，故而該除去步驟需 要花費時間。 又，就適當厚度之鎳層而言，所謂耐熱（耐變色）性 係指具有可抑制保管時之變色、焊錫構裝時之熱時變色、 因CCL基板製作時之熱所致之變色的功能。但是，於過多 之情形時，當軟蝕刻時，鎳層除去之步驟之負載變大，2 根據情況會產生處理殘留物，而於銅電路之設計方面成為 障礙。因此，鎳層之厚度必需較佳為設為上述範圍。 於下述中表示具有代表性且較佳之鍍敷條件之例。 12 201238752 (鍍鎳A)201238752 VI. Description of the Invention: [Technical Field] The present invention relates to a copper foil with a copper carrier, a method for producing the copper foil, a copper foil for an electronic circuit, a method for producing the copper foil, and a method for forming an electronic circuit The copper foil with the copper carrier is formed of an electronic circuit formed by etching to form a circuit and is composed of a rolled copper foil or an electrolytic copper foil. [Prior Art] Copper foil for electronic circuits is widely used in electronic and electrical equipment. However, in recent years, electronic and electrical equipment tend to be light and thin, so copper foil for electronic circuits is required to be thinner. . Since the thin electronic circuit is difficult to operate with (4), (4) a steel foil with a copper carrier supporting the copper foil carrier copper foil is gradually obtained. Top: The copper of the carrier is from the copper carrier consisting of an electrolytic steel box or a rolled copper drop. From the electronic power... 2: But because the copper must be easily cut with the 4 S S teeth, the copper foil is used for the electronic circuit. The easy to peel off with the copper carrier. Therefore, a technique of providing a peeling layer with the copper carrier is provided. #于电子电路(四) It is proposed to provide an organic skin D or a metal layer in the peeling layer (for example, a patent document film; technology (for example, patent text as a metal layer, old) in Patent Document 2, a poor layer In the case of N Τ 可 , , , , , 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子The surface of the falling surface is provided with an anti-recording (four) body in the electronic circuit layer, that is, a peeling layer, a 201238752 rust-preventing layer, and a copper foil for electronic circuits are provided on the carrier (for example, Patent Document 3 and Patent Document 4). In the third embodiment, the rust-preventing layer of the gutta-percha is described as a representative of Ni. In the patent document 4, the organic film or the metal layer is listed in Patent Document 3. In addition, in order to form the target circuit for the electronic circuit, the coating circuit is applied by applying the anti-buckling agent and the exposure step, and the circuit is printed, and then the copper is removed. No need The part of the last name is processed, but when the circuit is formed to form a circuit, there is a problem that a sag is generated and the circuit cannot be a desired width. Therefore, it is proposed in Patent Document 5 that the film will be thinner. Nickel or a technique in which an alloy is attached to a surface of a copper box for an electronic circuit to prevent indentation. Patent Document 1. Japanese Patent Laid-Open Publication No. Hei No. Hei No. 2005-254673 Patent No. 2005-254673 Japanese Patent Laid-Open No. 369-962, Patent Document 4: Japanese Patent No. 4,724, 301, Patent Document 5, Japanese Patent Application Laid-Open No. Hei No. 2002-176242, the disclosure of which is incorporated herein by reference. Thinner nickel or nickel. In the case of gold, a layer different from nickel is used in consideration of the releasability. However, if the nickel can be formed into a release layer, it is effective in terms of equipment and cost. Further, if it is a peeled carrier When nickel is present on the foil, nickel can prevent the formation of depression during etching of the electric composition. Therefore, a carrier foil with nickel can be used as the copper foil for electronic circuits. Therefore, the object of the present invention is to obtain copper by rolling.羯 or electrolytic steel 4 201238752 The copper yoke of the copper-bearing carrier formed by the treatment, having a peeling layer composed of a recorded or sinter alloy formed on the copper carrier, and a copper ytterbium with a copper layer having a thinner recording layer The method of manufacturing the copper box and the method of forming the electronic circuit. π The present inventors have obtained the following observations: In order to form a copper carrier composed of a rolled copper box or an electrolytic copper foil, you are cherished! % α „ In addition, it has a circuit for forming a nickel layer on the etched surface to form a circuit width without a depression. #The copper carrier of the copper case for an electronic circuit can be easily peeled off even if the release layer is _ Therefore, a recording layer is formed on the copper carrier and temporarily exposed to the air to form a nickel layer on the nickel layer, whereby several problems can be solved simultaneously. Obtaining the following insights. The electronic circuit obtained by stripping has a copper layer on the surface of the engraved surface and adjusts the button-cutting speed of the thickness direction of the copper drop, thereby forming a circuit having a circuit width without a depression, and further, borrowing By setting the coating layer on the copper surface to a suitable thinness, it can be easily removed by soft surname. Further, the following findings have been obtained: the peeled carrier copper yoke can also be used as a copper ruthenium capable of forming a circuit having a uniform circuit width without sag. According to the above findings, the present invention provides 1) a copper pig with a copper carrier, which is composed of a copper carrier, a nickel layer, and a copper layer, and the copper carrier is composed of a rolled copper box or an electrolytic steel box; : It may be peeled off at a strength of less than 5 kg/cm, and has a nickel layer on the copper carrier by peeling, and also has a nickel layer on the copper layer side. Further, the present invention provides a copper pig with a copper carrier, which is composed of a copper carrier (4) composed of rolled copper or electrolytic steel; a layer (B) located directly on the copper carrier. (A), and the thickness is 〇.〇3~^; nickel layer (6), 201238752 which is formed in the recording layer (B) Ji' and has a thickness of 〇〇〇1~〇〇3"m; and a copper layer (D ), which is further formed on the nickel layer (c). Further, the present invention provides 3) a pen, a gentleman, a metallizer of the copper carrier as in the above 2), wherein the nickel layer (B) is a nickel layer on the copper carrier (A) at the time of peeling, on + w The nickel layer (C) is a nickel layer on the copper layer (D) at the time of peeling. Further, the present invention provides a method for producing copper with a copper carrier, which is formed by electroless plating or electroplating of nickel on a copper carrier (A) composed of rolled copper or electrolytic copper. .〇3~2” nickel layer (B), and temporarily exposed to the working gas, then on the nickel layer (B) and then formed by electroless nickel or electroplating brocade to a thickness of 0.00 0.03... (c), and a copper layer (〇) is formed on the recording layer (C) by electro-mineralized copper. Further, the present invention provides a copper foil for electronic circuit of the above-mentioned 1) to 3) The copper foil of the copper-bearing carrier of any one is obtained by separating between the nickel layer (B) and the nickel layer (c), and is composed of a nickel layer (c) and a copper layer (D). 6) a carrier steel foil obtained by peeling off a copper foil of the steel carrier of any one of the above 1) to 3) between the nickel layer (B) and the nickel layer (C) to obtain a nickel The layer (B) is composed of a copper carrier (A). Further, the present invention provides, 7) a carrier copper foil composed of a nickel layer (B) and a copper carrier (A), in the carrier copper foil of the above 6), The nickel layer (B) is 0.03 to 0.1//m, and 6 20 1238752 is used for electronic circuits. Further, the manufacturing method of the method (4) of the present invention is characterized in that the copper-clad load produced by the method of the above 4) is peeled off, and obtained by zinc =: recording layer (8) and The lock layer (C) is made of copper t. Each of the electronic wires composed of the steel layer (D) is provided by the present invention. 1) The method for manufacturing the carrier copper is to use the above method 4). The copper flute with the copper carrier is in the layer (8) and the recording layer (8), (4) the carrier copper composed of the _(8) and the steel carrier (A), and the invention provides a method for forming an electronic circuit. The resin substrate is attached to the surface of the copper layer of the steel circuit (D) for the electronic circuit of the above 5), and a resist pattern for circuit formation is formed on the nickel layer (C) on the opposite side, and further cooled by vaporized copper is used. The liquid or the vaporized iron solution constitutes an engraving liquid, and the unnecessary portions of the nickel layer (c) and the copper layer (D) other than the pattern portion of the above-mentioned anti-instrument pattern are removed, and then the resist is removed. The remaining portion of the nickel layer (C) is removed by soft etching to form a circuit having a specific width. Further, the present invention provides U. A method of forming an electronic circuit by attaching a resin substrate to a surface of a copper carrier (A) of a carrier copper foil of the above 5), forming a resist pattern for circuit formation on a nickel layer (B) opposite thereto, and further An unnecessary portion of the nickel layer (B) and the copper carrier (A) other than the portion of the resist pattern 201238752 is removed by using an etching solution composed of a vaporized copper solution or a vaporized iron solution, and then the anti-resistance is removed. The etchant further removes the remaining portion of the nickel layer (B) by soft etching to form a circuit having a specific width. Since the present invention has a carrier in which a copper foil is used in advance, and further has a peeling layer thereon, and forms a copper Since the structure of the copper foil for electronic circuits is easy to handle, and the carrier foil can be easily peeled off as necessary. Since it can be used as a "baked copper foil containing a town layer obtained by peeling off the carrier copper, which is a copper structure of a simple structure", it can be used arbitrarily in the design of various electronic circuits, and has a large versatility. effect. Further, when the circuit is formed by etching the copper foil for electronic circuit composed of the nickel layer (c) and the copper layer (D) of the present invention, it has the effect of forming a target circuit having a more uniform circuit width, and has the effect Effect: Prevents the occurrence of indentation due to etching, and can be easily removed by soft etching by setting the nickel layer on the copper surface to a suitable thinness, thereby preventing nickel after etching. A layer of dissolved residue appears. Further, the carrier copper foil composed of the nickel layer (B) and the copper carrier (A) obtained by peeling can also be used as a copper foil for electronic circuits, and the same effect can be obtained. However, the thickness of the nickel layer (B) which is preferably used as the copper foil for electronic circuits is 〇·03 to 0.1/zn. According to the above, it has the effect of providing etching which can be improved in pattern etching. An excellent electronic circuit that prevents short circuits or poor circuit width. Further, since the layers used between the two kinds of copper foils are the same nickel, they are effective in terms of equipment and cost. [Embodiment] 8 201238752 The present invention relates to an electronic circuit using a copper carrier (A) composed of a rolled copper foil or an electrolytic steel foil, a copper foil for the same, a method for producing the same, and a copper foil for electronic circuit using the same The method for producing the copper foil and the method for forming the electronic circuit. For the purpose of the present invention, nickel plating or nickel plating is performed on a copper carrier (A) composed of a rolled copper foil or an electrolytic copper foil to form a nickel layer (B) having a thickness of 〇·〇3 to 2/zm. In the case of using an electrolytic copper foil, either a glossy surface or a rough surface can be used. As long as the subsequent steps can be carried out, nickel plating can be performed. For nickel plating, either electroless nickel or electroplated nickel can be used. Further, the thickness of the mineral deposit layer is not particularly limited, but 0.03 to 2 is an appropriate thickness in terms of the strength required in the case of peeling. That is, the 5th mirror layer (B) becomes a peeling surface. Further, in the case where the thickness is (h〇3 to O.lem), if the thickness of the copper carrier (A) is 9 to 35 Am, it has a function of effectively suppressing the nickel layer (B) after peeling off. The "indentation" which is likely to occur when the carrier foil formed of the copper carrier (A) is formed into a circuit, and the remaining layer B layer can be easily removed by soft etching after the circuit is formed. After temporarily exposing the carrier copper foil on which the nickel plating (B) has been applied to the air, the nickel layer (B) is further formed by electroless nickel plating or electric bonding to form a thickness of 0.001 to 〇.〇3/ The ultra-thin nickel layer (C) of /m. In this case, if exposed to air, nickel is an easily oxidizable metal, so the possibility of forming an oxide film on the nickel layer (B) is very high. Since it is considered to be a very thin oxide film, it is difficult to perform measurement. 201238752 As described above, a copper layer (D) is formed by electroplating copper on the nickel layer (C) to produce a copper foil with a copper carrier, but Both sides can be peeled off between the nickel layer (B) and the nickel layer (C). Although it is the same nickel, the peeling capacity It is easy and can be peeled off at a strength of less than 5 kg/cm. The ease of peeling can be regarded as a result of the formation of an oxide film on the nickel layer (B). Using this phenomenon is one of the great features of the invention. After the nickel layer (B) and the nickel layer (C) are peeled off, the copper foil of both sides can be used for an electronic circuit. That is, it can be used as a copper foil with a carrier on the nickel layer (B) and the nickel layer (c). Electron electricity composed of the nickel layer (c) and the copper layer (D) obtained by peeling off: a recording layer obtained by peeling off with mi or between the nickel layer (8) and the nickel layer (c) a carrier copper foil formed of a copper carrier (a). Since the copper foil for electronic circuit has a nickel layer (c) formed on the surface, it is effective in suppressing the _(four) circuit formation of the copper layer (D). The function of "indentation" which is easy to occur at the time. However, in the case of the carrier ms, the thickness of the nickel layer (B) which can be preferably used for electrons is 〇〇3 to 〇iym. (9) It is possible to apply not only pure copper with high conductivity but also copper alloy % according to the purpose (Cu_Cr alloy, Cu_z-gold alloy, _ alloy, Si alloy) ): It has the function of arbitrarily adjusting the properties of conductivity, material, mineralization, weldability, and design. The circuit can also have the function of “can be easily understood and can be formed in the circuit stage. Adjusting the etching rate" The blending ratio and thickness of the additive component are 10 201238752. The plating conditions can be arbitrarily adjusted. The recent tendency is to form a microcircuit, so the thickness is also reduced (4). The thickness is set to about 1 to 5 / / m. Next, the steel layer (8) of the additional layer (C) stripped between the recording layer (8) and the recording layer (c) is used in an electronic circuit. A copper foil can be used, for example, on a resin substrate. An etchant made of a copper chloride solution or a ferric chloride solution is used to form an etchant composed of a copper chloride solution or a ferric chloride solution, and an unnecessary circuit other than the above-mentioned anti-(4)| pattern portion is attached to the electronic circuit using the aluminum alloy layer (C). Partially removed. Next, the anti-rice agent is removed, and the remaining layer (C) is removed by soft scribing. Since the use of the anti-synthesis agent pattern to remove unnecessary copper ruthenium is a commonly performed method, there is no need to explain it. ~: In the general case, it is preferable to use a clarified liquid formed by vaporized molten iron/cold liquid with a faster scribe speed. The reason for this is that there is a problem that the speed of the etch is reduced due to the miniaturization of the circuit. An effective means of preventing the above problems by the engraving liquid formed by the aqueous solution of vaporized iron. However, it does not prevent the use of other surnames. Replace the etchant as needed. Therefore, it is possible to form "having a width of twice or more the thickness of the copper in the space formed between the copper circuits and, for example, the space on the substrate", and it is necessary to form the thickness of the copper twice or less, and further 15 A circuit that is less than the width of the line. Specifically, the octagonal etching of the copper foil on the resist side is carried out away from the position of the copper layer on the resist side. The contact of steel is carried out at the usual speed. In this way, etching is performed from the resist side on the side of the copper circuit to the resin substrate side substantially perpendicularly to form a rectangular copper foil circuit. Since the carrier foil with the nickel layer (B) can also obtain the same effect as a circuit capable of forming a less indentation, it can be used as a copper foil for electronic circuits. The recording layer mainly suppresses the occurrence of indentation and forms a target circuit with a uniform circuit width. The copper clad laminate is required to be subjected to high temperature treatment in the step of attaching a resin to an electronic circuit, but in this case, the nickel layer is oxidized, and the coating property (uniformity, adhesion) of the resist is liable to occur. In addition, during the etching, the interface oxide formed during heating tends to cause uneven etching, which causes a short circuit or unevenness in circuit width. In this case, it is desirable to form the nickel layer thickly. However, as a copper clad laminate, when the heating is not greatly affected, the recording layer can be formed thin. Thus, the influence of thermal oxidation can be prevented by forming the nickel layer ' thickly, but it is not necessarily preferable to form it thickly. This means that after the circuit is formed, it must be removed by soft etching, so the removal step takes time. In addition, the heat resistance (discoloration resistance) of the nickel layer of a suitable thickness means a function of suppressing discoloration during storage, discoloration during heat at the time of solder mounting, and discoloration due to heat during production of a CCL substrate. . However, in the case of excessive etching, the load of the step of removing the nickel layer becomes large at the time of soft etching, and 2 processing residues are generated depending on the situation, which becomes an obstacle in the design of the copper circuit. Therefore, the thickness of the nickel layer must preferably be set to the above range. Representative and preferred plating conditions are shown below. 12 201238752 (nickel plating A)
Ni ： 10 〜40g/ L pH : 2.5 〜3.5 溫度：常溫〜60°C 電流密度Dk : 2〜50A/dm2 時間：1〜4秒 (鍍鎳B ) 硫酸鎳：250〜300g/L 氯化鎳：35〜45g/L 乙酸鎳：10〜20g/L 檸檬酸三鈉：15〜30g/L 光亮劑：糖精、丁炔二醇等 十二基硫酸鈉：30〜lOOppm pH : 4〜6 浴溫：50〜70°C (鍍銅）Ni : 10 ~ 40g / L pH : 2.5 ~ 3.5 Temperature : room temperature ~ 60 ° C Current density Dk : 2 ~ 50A / dm2 Time : 1 ~ 4 seconds (nickel plating B ) Nickel sulfate : 250 ~ 300g / L nickel chloride : 35~45g / L Nickel acetate: 10~20g / L Trisodium citrate: 15~30g / L Brightener: Sodium saccharate such as saccharin, butynediol, etc.: 30~100ppm pH: 4~6 Bath temperature :50~70°C (copper plating)
Cu ： 90g/L H2S04 · 80g/L Cl : 60ppm 液溫：55〜57°C 二鈉 公司製 添加劑.聚·— 硫二丙烧續酸 (Bis-(3-sulfopropyl)-disulfide disodium) ( RASCHIG 造 CPS ) 5 Oppm 添加劑：二苄胺改質物5 0 p p m 13 201238752 (鎮附著量分析方法） 為了分析鎳處理面，以FR_ 4樹脂壓製製作相反面， 並進行遮蔽。利用濃度3〇%之硝酸將該樣品溶解，直至表 面處理被膜溶解，將燒杯中之溶解液稀釋為10倍，藉由原 子吸光分析進行鎳之定量分析。 實施例 其次’對本發明之實施例及比較例進行說明。再者， 本實施例僅為一例，並不限定於該例。即，實施例以外之 所有態樣或者變形係包含於本發明之技術思想之範圍内。 (實施例1 ) 使用箔厚1 8 V m之電解銅箔。將該電解銅箔作為銅載 體（A )，而且’以上述鍍鎳條件，如下述表丨所示般藉由 電鍍鎳形成〇·〇3μηι之鍍鎳層（b)。 其次，於該鍍鎳後’暫時曝露於空氣中，再次以相同 之鍍敷條件形成第二層之鍍敷層（C )。第二層之鍍鎳層之 厚度為0_01// m。將該組合同樣地示於表1中。 於該鍍鎳層上’以上述鍍鋼條件進而形成厚之鍍 銅層（D )。 14 201238752 【1硌】 電子電路用銅箔 傾斜角 00 00 (Ν 00 表面 |附有Ni | |附有Ni I |附有Ni I 附有Ni 傾斜角 1 1 jo 表面 1附有Ni 1 |附有Ni 1 I附有Ni 1 1 附有Ni | 剝離性 〇 〇 〇 X 〇 〇 評價 暫時曝露於空氣中 暫時曝露於空氣中 暫時曝露於空氣中 未曝露於空氣中 暫時曝露於空氣中 暫時曝露於空氣中 |銅箔（D) 厚度 (j^m) IT) in κη Ni 層（C) 厚度 (um) 0.01 0.03 0.02 0.01 〇 0.02 CQ S-✓ 厚度 (βτη) 0.03 ο 00 | 0.03 I 0.003 ΜΆ m 種類 2 ζ Z Ζ Ζ 有機物| 載體箔（A) 厚度 ("m) 〇〇 in m Os 00 00 00 種類 電解銅箔 1壓延銅箔1 壓延銅箔 電解銅箔 壓延銅箔 壓延銅箔 實施例1 1實施例2 1 |實施例3 1 |比較例1| |比較例2 I 比較例3 ^茛丧难：— 201238752 進行剝離試驗，確認剝離之狀況。剝離試驗之方法係 於極薄銅箱側以15(rc以上積層於基材，測定剝離強度’，且 將未達0.5kg/ cm之情形設為剝離性良好且記為「〇」，於 〇.5kg/ cm以上之情形時，設為剝離性不足且記為「X」。 實施例1中，未達〇.5kg/cm，剝離性良好，剝離係於 錦層（B)與鎳層（c)之間產生。 其次，關於將載體銅箔與電子電路用銅箔剝離而獲得 之j個銅箱，於在與剝離之面相反側之面貼附樹脂而製成 銅箔積層板後’藉由抗蝕劑塗佈及曝光步驟而印刷1〇條電 路’進而’實施將錄層與銅之不必要部分除去的触刻處 理。 於藉由蝕刻形成電路後，除去抗蝕劑，藉由fib—sim (觀察電路之傾斜角。蝕刻條件、電路形成條件、電路之 傾斜角之觀察係如下所述。 (蝕刻條件） 氣化鐵水溶液：（37wt%、波美度：4〇。） 液溫：50°C 喷壓：0.15MPa (電路形成條件） 以下述條件形成電路。 (5/zm及9"m銅:形成3〇βΓη間距電路） 抗蝕劑L/S=25ym/5ym、最終電路頂部（上部） 寬度：10 // m、蝕刻時間：48秒左右 (18/zm銅箔：形成50"m間距電路） 16 201238752 (上部） 抗蝕劑L/ S=33 /z m/ 1 7 # m、最終電路頂邻 寬度：1 5 " m、蝕刻時間：105秒左右 (35ym銅箔：形成ΙΟΟμηι間距電路） 抗蝕劑L/ S : 73 " m/ 27 y m、最終電路頂部（上部） 寬度：1 5 # m、蝕刻時間：2 1 0秒左右 (電路之傾斜角之觀察：電路之壓陷之觀察） 藉由FIB — SIM觀察電路剖面。傾斜角為63。以上，為 良好之結果，尤其理想之傾斜角為8〇〜95度之範圍。 以上述條件進行蝕刻而形成電路，進而，於除去抗蝕 劑後進行軟蝕刻。 & 將其結果示於表1中。其係^條電路之評價結果。如 該表！所示，電子電路用銅落之傾斜角為81。，未產生壓陷， 評價為（〇），載體銅落側之傾斜角亦良好，為”、電路 寬度與銅層之厚度處於本中請發明之範圍内。 (實施例2) ； 轭例中，使用箔厚3 5以m之壓延銅箔作為銅索 體（A)’且以上述鍍鎳條件形成0.5 "m之鍍鎳層（B)。| 人於。亥鍍鎳後’暫時曝露於空氣中’且以上述電鍍條 形成鍍鎳層（C)。铲锃® +广 又鎳層之厚度為0.03 g m。將該組合同相 地示於表1中。 以上述鍍銅條件進而形成 於該鍍鎳層上 銅層（D )。 其後，將其接著於基板， 狀況。附有基&之載體鋼箔係 進行剝離試驗，破認剝離之 於鎳層（B)與錄層（C)之 17 201238752 間剝離’其強度未達〇.5kg/em。 對絰剝離之電子電路用銅箔實施蝕刻處 路。钮刻條件及電料成條件與實施例i相同 斜角之觀察（電路之壓陷之觀察）亦與實施例 施。 理 1 ，形成電 電路之傾 同樣地實 於除去抗钱 以上述條件進行钱刻而形成電路，進而 劑之後進行軟钮刻。 。其係1 0條電路之評價結 ’壓陷較少，評價為（〇）。 ’故而無法利用蚀刻來形 將其結果同樣地示於表1中 果。如該表1所示’傾斜角為83。 再者’由於載體銅猪之鎳層較厚 成電路。 (實施例3) 於本實施例巾’使㈣厚9/Zm之壓延銅發為銅載體 (A)，以上述鍵錦條件形成18”之鍍錦層（B)。其次， 於該鑛錄後’暫時曝露於空氣中，且以上述義條件形成 鍍鎳層（C )。鍍鎳層之厚度為〇.〇2 “ m。將該組合同樣地示 於表1中。 於該鍍鎳層（C)上，以上述鍍銅條件進而形成5“m 厚之鍍銅層（D)。 其後，將其接著於基板，進行剝離試驗，確認剝離之 狀況。附有基板之載體銅箔係於錄層（B)與鎳層（c )之 間剝離’其強度未達0.5kg/ cm。 對經剝離之附有基板之電子電路用銅箔實施蝕刻處 理’形成電路。蝕刻條件及電路形成條件與實施例1相同， 201238752 電路之傾斜角之觀察（電路之壓陷之觀察）亦與實施例1 同樣地實施。 以上述條件進行轴刻而形成電路，進而，於除去抗钱 劑之後進行軟蝕刻。 將其結果同樣地示於表1中。其係i 〇條電路之評價結 果。如該表1所示，傾斜角為82。，壓陷較少’評價為（〇）。 再者，由於載體猪側之鎳層較厚，故而無法利用蝕刻來形 成電路。 (比較例1 ) 將厚度為18ym之電解銅箔作為銅載體（A)，且以上 述鍍鎳條件形纟〇·〇3" m之鎳層，且連續地以上述鍍鎳條 件形成鑛錄層（c)。鑛鎳層之厚度為G QlAm。於該鍛錄層 上，以上述鍍銅條件進而形成厚度為5"m之鍍銅層（d)。 其後，將其接著於基板，進行剝離触，確認剝離之 狀況。附有基板之載體鋼箱無法徹底地剥離。結果，無法 使用此後之銅箔來形成電路。 (比較例2 ) 將厚度為心m之壓延銅落作為銅載體⑷，且於其 ^面以^錢鎳條件形成U心之制⑻後，暫時曝 路於空氣中，其後，形成銅層（〇)。 進行韌離試驗，確認剝離之 強度未達〇.5kg/cm時容易 (D)之間剝離，於銅層（D ) 其後’將其接著於基板， 狀況。附有基板之载體銅箔於該 剝離，但係於鎳層（Β)與銅層 表面不具有錦層。 19 201238752 對經剝離之附有基板之電子電路用銅羯實施蝕刻處 理’形成電路。於電路形成中，電子電路用銅落之傾斜角 為52°，產生壓陷。 (比較例3) 將厚度為18"爪之壓延銅落作為銅載體⑷，且於其 表面形成0.003 _之有機皮膜後，形成〇〇^m之錄層 (C)，之後，立刻形成厚度為5wm之銅層（D)。 其後’將其接著於基板，進行剝離試驗，確認剝離之 狀況。附Μ板之載體㈣係於銅載體與鑛㈣（c)之間 剝離’於載體鋼馆表面無鎳層，路形成中，電子電路 用銅羯之傾斜角為83。’未產生壓陷，故良好。 載體銅係將基板接著於與經剝離之面相反側之面， 實施蝕刻處理，形成電路。其結果，為45。，產生壓陷。 [產業上之可利用性] 由於本發明之「預先使用鋼落之載體、進而於其上形 成銅之塊狀箱」之構造，故而可容易地將塊狀箱剝離，可 使製造步驟簡&。進而’由於可用作具備錄層之極薄銅荡 ::單純構造之銅箔」，故而可任意使用於各種電子電路之 設計中，從而具有富有通用性之較大之效果。 又，於藉由銅箔之蝕刻而形成電路時，具有可形成電 :寬度更均句之目標電路之效果，且具有如下之效果：無 蝕;I:致之處理殘留物’可防止壓陷之產纟，可縮短利用 J形成電路之時間’而且可使錄層之厚度極薄。藉此， 叔阿圖案蝕刻中之蝕刻性，防止短路或產生電路寬 20 201238752 度不良，故而可作為覆銅積層板（硬質及軟質用）而利用 且可用於形成印刷基板之電子電路。 【圖式簡單說明】 無 【主要元件符號說明】 無 21Cu : 90g/L H2S04 · 80g/L Cl : 60ppm Liquid temperature: 55~57°C Additives made by disodium. Bis-(3-sulfopropyl)-disulfide disodium ( RASCHIG CPS) 5 Oppm Additive: Dibenzylamine modified material 50 ppm 13 201238752 (Method for analyzing the amount of adhesion of the town) In order to analyze the nickel-treated surface, the opposite side was pressed with FR 4 resin and masked. The sample was dissolved by nitric acid having a concentration of 3% by weight until the surface treatment film was dissolved, and the solution in the beaker was diluted to 10 times, and quantitative analysis of nickel was performed by atomic absorption analysis. EXAMPLES Next, examples and comparative examples of the present invention will be described. Furthermore, this embodiment is merely an example and is not limited to this example. That is, all the aspects or modifications other than the embodiment are included in the scope of the technical idea of the present invention. (Example 1) An electrolytic copper foil having a foil thickness of 18 V was used. This electrolytic copper foil was used as the copper carrier (A), and the nickel plating layer (b) of 〇·〇3μηι was formed by electroplating nickel as shown in the following table under the above-described nickel plating conditions. Next, after the nickel plating, it was temporarily exposed to the air, and the plating layer (C) of the second layer was formed again under the same plating conditions. The thickness of the second layer of nickel plating is 0_01//m. This combination is also shown in Table 1. On the nickel plating layer, a thick copper plating layer (D) is further formed under the above-described steel plating conditions. 14 201238752 [1硌] Copper foil tilt angle for electronic circuits 00 00 (Ν 00 surface | with Ni | | with Ni I | with Ni I with Ni tilt angle 1 1 jo Surface 1 with Ni 1 | Ni 1 I with Ni 1 1 with Ni | stripping 〇〇〇X 〇〇 evaluation temporarily exposed to air temporarily exposed to air temporarily exposed to air not exposed to air temporarily exposed to air temporarily exposed to In the air|copper foil (D) thickness (j^m) IT) in κη Ni layer (C) thickness (um) 0.01 0.03 0.02 0.01 〇0.02 CQ S-✓ thickness (βτη) 0.03 ο 00 | 0.03 I 0.003 ΜΆ m Type 2 ζ Z Ζ Ζ Organics | Carrier foil (A) Thickness ("m) 〇〇in m Os 00 00 00 Type electrolytic copper foil 1 rolled copper foil 1 rolled copper foil electrolytic copper foil rolled copper foil rolled copper foil Example 1 1 Example 2 1 | Example 3 1 | Comparative Example 1 | | Comparative Example 2 I Comparative Example 3 ^ 茛 茛 : : - 201238752 A peeling test was performed to confirm the peeling condition. The peeling test method was performed on the side of the ultra-thin copper box by 15 (the above-mentioned layer of rc or more was laminated on the substrate, and the peel strength was measured), and when the amount was less than 0.5 kg/cm, the peeling property was good and it was described as "〇". In the case of .5 kg/cm or more, the peeling property is insufficient and is referred to as "X". In Example 1, the peeling property was not reached to 5 kg/cm, and the peeling property was good, and the peeling was performed on the layer (B) and the nickel layer ( (c) The following is a case where the copper foil obtained by peeling the carrier copper foil and the copper foil for electronic circuits is attached to the surface opposite to the surface to be peeled off to form a copper foil laminate. The resist circuit is printed by the resist coating and exposure steps to perform a etch process for removing unnecessary portions of the recording layer and copper. After the circuit is formed by etching, the resist is removed. Fib—sim (observing the tilt angle of the circuit. The etching conditions, circuit formation conditions, and tilt angle of the circuit are as follows. (etching conditions) Aqueous solution of iron oxide: (37 wt%, Baume: 4 〇.) Temperature: 50 ° C Spray pressure: 0.15 MPa (circuit formation conditions) The circuit was formed under the following conditions: (5/zm 9"m copper: forming a 3〇βΓη pitch circuit) Resist L/S=25ym/5ym, final circuit top (upper) Width: 10 // m, etching time: 48 seconds or so (18/zm copper foil: formation 50"m pitch circuit] 16 201238752 (top) Resist L/ S=33 /zm/ 1 7 # m, final circuit top adjacent width: 1 5 " m, etching time: about 105 seconds (35ym copper foil: Form ΙΟΟμηι spacing circuit) Resist L / S: 73 " m / 27 ym, the top of the final circuit (upper) Width: 1 5 # m, etching time: 2 10 seconds or so (observation of the tilt angle of the circuit: circuit Observing the indentation) Observing the circuit profile by FIB-SIM. The tilt angle is 63. Above, it is a good result, especially the ideal tilt angle is in the range of 8〇95-95 degrees. The circuit is formed by etching under the above conditions. Further, after the resist was removed, soft etching was performed. The results are shown in Table 1. The evaluation results of the circuit were as shown in Table !, and the inclination angle of the copper drop for the electronic circuit was 81. There is no indentation, and the evaluation is (〇), and the inclination angle of the carrier copper side is also good, as The circuit width and the thickness of the copper layer are within the scope of the invention. (Example 2); In the yoke example, a rolled copper foil having a foil thickness of 3 5 m is used as the copper wire body (A)' and nickel plating is performed as described above. The condition is to form a nickel plating layer (B) of 0.5 "m. | People. After the nickel plating, 'temporarily exposed to air' and form a nickel plating layer (C) with the above-mentioned electroplated strip. Shovel® + wide nickel layer The thickness was 0.03 gm. The combination is shown in Table 1 in phase. Further, the copper layer (D) is formed on the nickel plating layer by the above copper plating conditions. Thereafter, it is attached to the substrate, condition. The carrier steel foil with the base & was subjected to a peeling test, and the peeling was performed between the nickel layer (B) and the recording layer (C) 17 201238752, and the strength was less than 55 kg/em. The etching process is performed on the copper foil for the electronic circuit for peeling off. The condition of the button and the condition of the electric material are the same as those of the embodiment i. The observation of the oblique angle (the observation of the depression of the circuit) is also the same as the embodiment. 1 , the formation of the electric circuit is also the same as the removal of the anti-money in the above conditions to form a circuit, and then the soft button engraving. . The evaluation result of 10 circuits is less than the number of depressions, and the evaluation is (〇). Therefore, the results cannot be shown by etching in the same manner as shown in Table 1. As shown in Table 1, the inclination angle was 83. Furthermore, the nickel layer of the carrier copper pig is thicker into a circuit. (Example 3) In the present embodiment, the rolled copper of (4) thick 9/Zm was made into a copper carrier (A), and the gilt layer (B) of 18" was formed under the above-mentioned bond conditions. Secondly, in the mine record After the 'temporarily exposed to the air, and forming the nickel plating layer (C) under the above-mentioned conditions, the thickness of the nickel plating layer is 〇.〇2 "m. This combination is also shown in Table 1. On the nickel plating layer (C), a 5"m thick copper plating layer (D) was formed by the above copper plating conditions. Thereafter, the substrate was subjected to a peeling test to confirm the peeling state. The carrier copper foil is peeled between the recording layer (B) and the nickel layer (c), and its strength is less than 0.5 kg/cm. The copper foil for electronic circuit with the substrate with the peeled off is etched to form a circuit. The etching conditions and the circuit formation conditions were the same as those in the first embodiment, and the observation of the inclination angle of the circuit of 201238752 (the observation of the depression of the circuit) was also carried out in the same manner as in the first embodiment. The circuit was formed by axial engraving under the above conditions, and further, the circuit was removed. The anti-money agent was subjected to soft etching. The results are similarly shown in Table 1. The evaluation results of the i-clamp circuit are as shown in Table 1. The inclination angle is 82. The less indentation is evaluated as ( Further, since the nickel layer on the carrier pig side is thick, it is impossible to form an electric circuit by etching. (Comparative Example 1) An electrolytic copper foil having a thickness of 18 μm is used as a copper carrier (A), and the above nickel plating conditions are employed.纟〇·〇3" m nickel layer, and continuously The nickel plating condition forms a mineral recording layer (c). The thickness of the ore nickel layer is G QlAm. On the forging layer, a copper plating layer (d) having a thickness of 5 " m is formed by the above copper plating conditions. The peeling contact was carried out on the substrate, and the peeling was confirmed. The carrier steel case with the substrate could not be completely peeled off. As a result, the copper foil was not used to form the circuit. (Comparative Example 2) The thickness was m The rolled copper is used as the copper carrier (4), and after forming the U-heart (8) on the surface of the surface, it is temporarily exposed to the air, and then a copper layer (〇) is formed. The toughness test is performed to confirm When the strength of the peeling is less than 5 kg/cm, it is easy to peel off between (D), and then the copper layer (D) is followed by the substrate. The carrier copper foil with the substrate is peeled off. There is no gold layer on the surface of the nickel layer (Β) and the copper layer. 19 201238752 The etching process is performed on the peeled metal circuit with the substrate and the copper plate is formed to form a circuit. In the circuit formation, the inclination angle of the copper drop of the electronic circuit is formed. At 52°, an indentation occurred. (Comparative Example 3) The thickness was 18 " Copper is used as the copper carrier (4), and after forming an organic film of 0.003 Å on the surface thereof, a recording layer (C) of 〇〇m is formed, and then a copper layer (D) having a thickness of 5 wm is formed immediately. Then, a peeling test was performed on the substrate to confirm the peeling condition. The carrier (4) attached to the gusset was peeled off between the copper carrier and the ore (4) and (c) 'There was no nickel layer on the surface of the carrier steel, and the road was formed, copper for electronic circuit. The inclination angle of 羯 is 83. 'There is no depression, so it is good. The carrier copper is subjected to an etching treatment to form a circuit on the surface opposite to the surface on the opposite side to the peeled surface. As a result, it is 45. [Industrial Applicability] According to the structure of the "pre-use steel strand carrier and the copper block box formed thereon", the block box can be easily peeled off, and the manufacturing steps can be simplified. &. Further, since it can be used as a very thin copper plate with a recording layer: a copper foil of a simple structure, it can be used arbitrarily in the design of various electronic circuits, and has a large effect of versatility. Moreover, when a circuit is formed by etching of a copper foil, it has an effect of forming a target circuit of electric: a more uniform width, and has the following effects: no etching; I: treating the residue to prevent indentation The production time can shorten the time for forming the circuit by J' and the thickness of the recording layer can be extremely thin. Thereby, the etching property in the etching of the uncle pattern prevents short circuit or the circuit width is poor, so that it can be used as a copper clad laminate (hard and soft) and can be used for forming an electronic circuit of a printed circuit board. [Simple description of the diagram] None [Key component symbol description] None 21