TW201237098A - Thermal curing resin, cured film, color filter, liquid crystal display device, solid photographic device and LED luminous body - Google Patents

Thermal curing resin, cured film, color filter, liquid crystal display device, solid photographic device and LED luminous body Download PDF

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TW201237098A
TW201237098A TW101106634A TW101106634A TW201237098A TW 201237098 A TW201237098 A TW 201237098A TW 101106634 A TW101106634 A TW 101106634A TW 101106634 A TW101106634 A TW 101106634A TW 201237098 A TW201237098 A TW 201237098A
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acid
resin composition
weight
epoxy resin
thermosetting resin
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TWI500699B (en
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Toshiyuki Takahashi
Yuki Okamoto
Tomohiro Etou
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Jnc Corp
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    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
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    • C08L25/00Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02Homopolymers or copolymers of hydrocarbons
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509Filters, e.g. light shielding masks
    • G02F1/133514Colour filters
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
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    • H01L27/146Imager structures
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    • H01ELECTRIC ELEMENTS
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    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having a potential-jump barrier or a surface barrier
    • H10K10/40Organic transistors
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    • HELECTRICITY
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    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
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  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
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Abstract

A cured film especially excellent in light resistance, evenness and also excellent in heat resistance, chemical resistance such as solvent resistance, acid resistance, base resistance, etc., water resistance, adhesive property for substrate such as glass, etc., penetrability, damage resistance and coating ability is provided, and also a resin composition for the cured film is provided. A thermal curing resin composition includes: a polyester amide acid, an epoxy resin and an epoxy curing agent, characterized in that the polyester amide acid is obtained by performing a reaction using a tetracarboxylic dianhydride, a diamine and polyprotic hydroxy compound as necessary materials, and the epoxy resin is obtained by performing a reaction using a glycidyl (meth)acrylate and 2 functional (meth)acrylate as necessary materials.

Description

201237098 41171pif 六、發明說明: 【發明所屬之技術領域】 ^明是有關於一種熱硬化性樹 進灯加熱、硬化而獲得之硬化膜。 猎由對其 【先前技術】 於液晶顯示元件等元件之製造步驟巾 劑、酸、鹼溶液等各種化學處理, 進仃有機洛 線電極時,存在表面被局部地加孰為而成膜配 存在以防止各種元件之表面劣化、、損Γ ’ 之製造步财彻 性、耐溶劑性、耐酸性、耐驗性等耐化學熱 :玻璃等基底基板之密接性、透明性、耐劃;二 =坦性、耐光性等。而且’於液晶顯示元件 布生、 南速響應化、高精細化等高性能化之發展巾 光片保護膜而使尽之情形時,期望平坦化 到提3 關於耐光性’迄今為止重要的是為了保護膜^面 >月洗而進行紫外線臭氧處理。然而,特別是 表 橫電場模·彩色濾'光片保護财,為 ^ $ 件之塗佈性’必需更高能量之紫外線臭氧處理=間= 合物安絲向(polym⑽stained alignment,p / 之光聚合步驟或配向膜之光配向步驟等紫外線曝光步^ 加’耐光性變為非常重要之特性。 3 作為具有該些優異特性之保護臈材料,存在有含有石夕 201237098 41171pif 酸組成物(參照專利文件υ、聚 (參照專敎獻2、3)。含抑之練麟 = 平坦㈣言為非f «讀料,但存在_性衫$於 耐驗性產之缺點。專歡獻2之㈣醯舰組成物 坦性糾触並不充分之_。專敝獻3 酿 組成物是平坦性、耐熱性及魏學品性非常優異之材Γ 但存树光性並不充分,且於紫外線臭氧處理或紫外線曝 光步驟中透雜降狀缺點。因此,任意材料均不是作為 保護膜材料而充分滿足耐光性、平坦性、耐熱性、耐化 品性、及其他諸特性者。 [先前技術文獻] [專利文獻] 專利文件1 :曰本專利特開平9_29115〇號公報 專利文獻2 :日本專利特開2〇〇5·1〇5264號公報 專利文獻3 :日本專利特開2〇〇8_156546號公報 於上述狀況下,需求例如耐熱性、耐溶劑性、耐酸性、 耐鹼性等耐化學品性、耐水性、對玻璃等基底基板之密接 性、透明性、耐劃傷性、塗佈性優異之樹脂組成物。另外, 特別是需求平坦性、耐光性優異之硬化膜及賦予該硬化膜 之樹脂組成物。 【發明内容】 本發明者%·人為了解決上述問題點而進行各種研究, 結果發現藉由包含聚酯醯胺酸(所述聚酯醯胺酸是藉由包 含四羧酸二酐、二胺及多元羥基化合物之化合物反^而獲 201237098 41171pif 得之聚酯醯胺酸)、環氧樹脂(所述環氧樹脂是藉由以(甲 基)丙烯酸縮水甘油酯與2官能(曱基)丙烯酸酯為必需原料 成分進行反應而獲得的環氧樹脂)、及環氧硬化劑之樹脂組 成物、及該樹脂組成物硬化而獲得之硬化膜,可遠成上述 目的,從而完成本發明。 本發明具有以下之構成。 [1] 一種熱硬化性樹脂組成物,其是包含聚酯醯胺 酸、環氧樹脂、及環氧硬化劑之樹脂組成物,其特徵在於: 聚酯醯胺酸是藉由以四羧酸二酐、二胺、及多元羥基化合 物為必需之原料成分進行反應而獲得,藉由使X莫耳之四 竣酸二酐、Y莫耳之二胺及z莫耳之多元羥基化合物以下 述式(1)及式(2)之關係成立之比率進行反應而獲得之 聚酯醯胺酸, 0.2SZ/YS8.0 …… ⑴ 0.2^ (Y + Z) /X^1.5 …… (2) 每氧樹脂是藉由以(曱基)丙烯酸縮水甘油酯與2官能 (曱基)丙烯酸酯為必需之原料成分進行反應而獲得之重量 平均分子量為1,000〜50,000之環氧樹脂,相對於聚酯醯 胺酸100重量份而言,環氧樹脂為20重量份〜400重量 份’相對於環氧樹脂1〇〇重量份而言,環氧硬化劑為〇重 量份〜60重量份。 [2] 如[1]所述之熱硬化性樹脂組成物,其中,所述聚 酯醯胺酸是藉由以四羧酸二酐、二胺、多元羥基化合物及 1兀醇為必需之原料成分進行反應而獲得之反應生成物。 6 201237098 41171pif 丨地心热哎化性樹脂組成 兀醇是選自異丙醇、丙歸醇、苯甲醇、曱美丙 其〔1 ^丙二醇單乙騎3-乙基-3-祕甲基環 [4] 如[1]〜[3] t任一項所述之熱硬化性樹脂組成 物,其中,所述聚酯醯胺酸是進一步添加笨乙烯馬來酸酐 共聚物作為原料成分進行反應而獲得之聚酯醯胺酸。 [5] 如[1]〜[4]中任一項所述之熱硬化性樹脂組成 物,其中,所述聚酯醯胺酸具有下述通式(3)及通式(4) 所表示之結構單元; 〇 II cv 〇201237098 41171pif VI. Description of the invention: [Technical field to which the invention pertains] It is a cured film obtained by heating and hardening a thermosetting tree. Hunting is carried out by various chemical treatments such as the steps of manufacturing liquid crystal display elements, such as liquid crystal display elements, acid, alkali solution, etc., when the organic Luo wire electrode is introduced, the surface is locally twisted to form a film. To prevent deterioration of the surface of various components, damage to the manufacturing process, solvent resistance, solvent resistance, acid resistance, and resistance to chemical heat: adhesion, transparency, and scratch resistance of a base substrate such as glass; Betty, lightfast, etc. In addition, when the development of the solar cell display element, the south-speed response, and the high-definition, and the development of the towel protective film, it is desirable to flatten it to mention that 3 is related to light resistance. Ultraviolet ozone treatment was carried out in order to protect the film surface & month wash. However, especially the cross-field electric field mode and color filter 'light film protection wealth, for the coating property of the 'pieces', higher energy UV ozone treatment = inter = symmetry (polym (10) stained alignment, p / light The ultraviolet light exposure step such as the polymerization step or the photo-alignment step of the alignment film is added, and the light resistance becomes a very important characteristic. 3 As a protective ruthenium material having such excellent characteristics, there is a composition containing Shi Xi 201237098 41171 pif acid (refer to the patent) Documents υ, poly (refer to the special offer 2, 3). Containing inhibition of training Lin = flat (four) words for non-f «reading materials, but there are _ sexual shirts in the shortcomings of the test of production. Special offer 2 (4) The composition of the stern ship is not enough to be quite entangled. The special composition is a material with excellent flatness, heat resistance and Wei Xue character. However, the tree is not sufficient, and it is treated with UV ozone or There is a disadvantage that the ultraviolet light is exposed in the ultraviolet exposure step. Therefore, any material is not used as a protective film material to sufficiently satisfy light resistance, flatness, heat resistance, chemical resistance, and other characteristics. [Prior Art Document] [Patent Literature] patent In the above-mentioned situation, the demand is disclosed in Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. For example, a resin composition excellent in chemical resistance such as heat resistance, solvent resistance, acid resistance, and alkali resistance, water resistance, adhesion to a base substrate such as glass, transparency, scratch resistance, and coating property. In particular, the present inventors have conducted various studies in order to solve the above problems, and have found that polyester is contained in the cured resin film, which is excellent in light resistance and light resistance. a proline (the polyester proline is obtained by a compound comprising a tetracarboxylic dianhydride, a diamine and a polyvalent hydroxy compound, and a polyester phthalic acid obtained from 201237098 41171pif), an epoxy resin The epoxy resin is an epoxy resin obtained by reacting glycidyl (meth)acrylate with a bifunctional (fluorenyl) acrylate as an essential raw material component, and a resin composition of an epoxy curing agent, and The cured film obtained by curing the resin composition can be far from the above object, and the present invention has been completed. The present invention has the following constitution. [1] A thermosetting resin composition comprising a polyester proline, an epoxy A resin composition of a resin and an epoxy hardener, wherein the polyester phthalic acid is obtained by reacting a tetracarboxylic dianhydride, a diamine, and a polyvalent hydroxy compound as essential raw materials. A polyester decylamine obtained by reacting X-molar tetraphthalic acid dianhydride, Y-mole diamine, and z-mole polyhydroxy compound at a ratio in which the relationship of the following formula (1) and formula (2) is established. Acid, 0.2SZ/YS8.0 ...... (1) 0.2^ (Y + Z) /X^1.5 ...... (2) Each oxy resin is obtained by glycidyl acrylate and difunctional (fluorenyl) acrylate An epoxy resin having a weight average molecular weight of 1,000 to 50,000 obtained by reacting an ester as an essential raw material component, and an epoxy resin is 20 parts by weight to 400 parts by weight based on 100 parts by weight of the polyester phthalic acid. Compared with 1 part by weight of the epoxy resin, the epoxy hardener is ~ 60 parts by weight parts by weight. [2] The thermosetting resin composition according to [1], wherein the polyester phthalic acid is an essential raw material by using a tetracarboxylic dianhydride, a diamine, a polyvalent hydroxy compound, and a decyl alcohol. A reaction product obtained by reacting a component. 6 201237098 41171pif 丨 心 哎 哎 哎 树脂 是 是 是 是 是 是 是 是 是 是 是 是 是 是 是 是 是 是 是 是 是 是 是 是 是 是 是 是 是 是 是 是 是 是 是 是 是 是 是 是[4] The thermosetting resin composition according to any one of [1] to [3] wherein the polyester phthalic acid is further reacted by adding a stupid ethylene maleic anhydride copolymer as a raw material component. The polyester proline obtained. [5] The thermosetting resin composition according to any one of [1] to [4] wherein the polyester phthalic acid has the following formula (3) and formula (4) Structural unit; 〇II cv 〇

HOOC COOH NH-HOOC COOH NH-

-N- H (3) Ο (4) ——cx β—O—R3一〇一 R1-N- H (3) Ο (4) ——cx β—O—R3 〇 〇 R1

HOO(/、COOH 此處,R1是四叛酸二釺殘基’ R2是一胺殘基’ R3是多 元羥基化合物殘基。 [6] 如[1]〜[5]中任一項所述之熱硬化丨生樹知組成 物,其中,所述聚_胺酸之重量夺均分子量為I000〜 200,000 〇 [7] 如[1]〜[6]中任一項所述之熱硬化性樹脂組成 201237098 41171pif 物,其中,所述四羧酸二酐是選自3,3',4,4'-二苯基砜四曱 酸二酐、3,3’,4,4’-二苯基醚四曱酸二酐、2,2-[雙(3,4-二羧基 苯基)]六氟丙烷二酐及乙二醇雙(脫水偏苯三酸酯)之1種 以上。 [8] 如[1]〜[7]中任一項所述之熱硬化性樹脂組成 物,其中,所述二胺是選自3,3’-二胺基二笨基砜及雙[4-(3-胺基苯氧基)苯基]砜之1種以上。 [9] 如[1]〜[8]中任一項所述之熱硬化性樹脂組成 物,其中,所述多元經基化合物是選自乙二醇、丙二醇、 1,4-丁二醇、1,5-戊二醇、1,6-己二醇、1,7-庚二醇及 1,8· 辛二醇之1種以上。 [10] 如[1]〜[9]中任一項所述之熱硬化性樹脂組成 物’其中,所述2官能(曱基)丙烯酸酯是選自乙二醇二(曱 基)丙烯酸酯、二乙二醇二(曱基)丙烯酸酯、1,4-丁二醇二(曱 基)丙烯酸酯、1,3_丁二醇二(曱基)丙烯酸酯、新戊二醇二(曱 基)丙稀酸酯、三環癸烧二曱醇二(曱基)丙烯酸酯之1種以 上0 [11] 如[1]〜[1〇]中任一項所述之熱硬化性樹脂組成 物’其中’所述環氧硬化劑是選自偏笨三酸酐及六氫偏笨 三酸軒之1種以上。 [12] 如[1]所述之熱硬化性樹脂組成物,其中,所述四 幾酉夂一軒是3,3,4,4 -一本基四甲酸二肝,所述二胺是 3,3'·二胺基二苯基颯’所述多元羥基化合物是1,4-丁二 醇’所述環氧樹脂是甲基丙烯酸縮水甘油酯與丨,4_丁二醇 201237098 4ll71pif 二甲基丙烯酸脂或1,3-丁二醇二曱基丙烯酸脂之重量平均 分子量為1,〇〇〇〜50,000之共聚物,所述環氧硬化= 苯三麟,進-步含有3·甲氧基丙酸作為溶劑。 [13]如[2]所述之熱硬化性樹脂組成物,其中,所述四 羧酸二酐是3,3’,4,4·-二苯基醚四曱酸二酐,所述二胺是 3,3'-二胺基二苯基砜,所述多元羥基化合物是^ 4-丁二 醇,所述1元醇是苯曱醇,所述環氧樹脂是甲基丙稀酸^ 水甘油酯與1,4-丁二醇二曱基丙烯酸脂或-丁二醇二甲 基丙烯酸脂之重量平均分子量為!,〇〇〇〜5〇,〇〇〇-*:^聚 物’所述環氧硬化劑是偏苯三酸酐,進—步含有 丙酸曱酯作為溶劑。 & [14] -種硬化膜,其是由如⑴〜[13]中任—項所述之 熱硬化性樹脂組成物而獲得。 種彩色遽光片,其使用如[14]所述之硬化膜作 為保護膜。 [16] —種液晶顯示元件, 光片。 其使用如[15]所述之彩色濾 [17] —種固體攝影元件 光片。 其使用如[15]所述之彩色濾 [=-種液晶顯示元件,其使用 化膜明電極間所形成之透明絕^ 、之日曰顯示元件,其使用如上述[14]所述之硬 3 己向膜間所形成之透明絕緣膜。 网-種咖發光體,其使用如上述⑽所述之硬化 201237098 41171pif 膜作為保護膜。 [發明的效果] 本發明之較佳態樣之熱硬化性樹脂組成物是於平坦性 及耐光性㈣缝異之材料,於作為彩色液晶顯示元件之 彩色遽光片保護膜而使用之情形時,可使顯示品質及可靠 性提高。而且,藉由對本發明讀佳祕之熱硬化性樹脂 組成物進行加熱而獲得之硬化膜是於透明性、耐化學品 性、密接性及耐濺鍍性中亦獲得平衡者,是實用 者。特別是可用作藉由染色法、顏料分散法貫=二 刷法而製造之彩色濾光片之保護膜。而且,亦可用作各種 光學材料之保護膜及透明絕緣膜。 【實施方式】 1.熱硬化性樹脂組成物 一本發明之熱硬化性樹脂組成物是包含聚酯醯胺酸、環 =樹知、及J辰氧硬化劑的樹脂組成物,所述聚酯醯胺酸是 2以四賊二酐、二胺、及多元麟化合物為必需之原 由、'刀進行反應而獲得之聚酯醯胺酸,所述環氧樹脂是藉 必曱基)輯酸縮水甘油_與2官能(甲基)丙稀酸酷為 之原料成分進行反應而獲得之環氧_旨,該熱硬化性 成物之特徵在於:相對於聚祕胺酸⑽重量份而 ° %氧樹脂為20重量份〜4〇〇重量份,相對於環氧樹脂 重量份而言,環氧硬化劑為0重量份〜60重量份。 1-1.聚酯醯胺酸 该聚酷醯胺酸藉由以四緩酸二針、二胺、及多元經基 201237098 41171pif 化合物為必需之原料成分進行反應而獲得。更詳細而言, 藉由使X莫耳之四叛酸二酐、Y莫耳之二胺及Z莫耳之多 元羥基化合物以下述式(1)及式(2)之關係成立之比率 進行反應而獲得。 (1) (2) 0.2^Z/Y^8.0 0.2^ (Y + Z) /X^1.5 於聚醋酿胺酸之合成中至少必需使用溶劑,可使該溶 劑保持殘留而製成考慮了操作性等之液狀或凝膠狀之熱硬 化性樹脂組成物,亦可將該溶劑除去而製成考慮了搬運性 等之固形狀之組成物。而且,於聚酯醯胺酸之合成中,亦 叮視需要而包含選自丨元醇、及笨乙烯_馬來酸酐共聚物之 1種以上原料作為原料,其中較佳的是包含1元醇。而且, 於聚醜«之合成巾,亦可於不損及本發明之目的之範 ,内視需要包含上述料之其㈣料作為補。作為此種 >、他原料之例,可列舉含有矽之單胺。 i-l-l.四羧酸二酐 2明中所使用之四紐二軒之具體例可列舉以下 方香族四魏二奸,例如3,3,,4,4,-二苯曱_四甲酸二 ;二醉2,,3,3’_二苯曱酉同四曱酸二肝、2,3,3,,4,-二苯曱酮西曱 & _ 3,3,4,4··二笨基砜四f酸二酐、2,2',3,3,-二苯基砜 酐2,3,3,4'-二苯基石風四甲酸二酐、3 3',4,4'-二苯 t ^ 甲酸:酐、2,2’,3,3,·二笨基 _ 甲酸讀、’ 2,3,3,,4·-二=⑽四曱酸二酐、2,2_[雙(3,4_二絲苯基)]六氣丙烧 -及乙二醇雙(脫水偏苯三酸酯商品名為 201237098 41171pif TMEG-100、新日本理化股份有限公司);脂環族四缓酸二 酐’例如環丁烷四曱酸二酐、曱基環丁烷四曱酸二針、環 戊烧四甲酸二酐、及環己烧四曱酸二針等;脂肪族四叛酸 二酐,例如乙烧四甲酸二酐、及丁烧四曱酸二野。 該些化合物中較佳的是可賦予透明性良好之樹脂的 3,3’,4,4'-二苯基颯四曱酸二酐、3,3',4,4'-二苯基鍵四甲酸二 酐、2,2-[雙(3,4_二叛基苯基)]六氟丙炫二酐、乙二醇雙(脫 水偏苯三酸酯)(商品名為TMEG-100、新日本理化股份有 限公司)’特佳的是3,3’,4,4’-二苯基喊四曱酸二酐、3,3,,4,4,- 一本基礙四曱酸二野·。 M-2.二胺 本發明中所使用之二胺之具體例可列舉4,4,_二胺基二 笨基颯、3,3’-二胺基二苯基砜、3,4f-二胺基二苯基艰、雙 [4-(4-胺基笨氧基)苯基]砜、雙[4_(3_胺基笨氧基)苯基]砜、 雙[3-(4_胺基苯氧基)苯基]硬、[4-(4·胺基苯氧基)苯基][3_(4_ 胺基苯氧基)苯基]砜、[4-(3-胺基苯氧基)苯基][3_(4_胺基苯 氧基)苯基]砜、及2,2-雙[4-(4-胺基笨氧基)苯基]六氟丙烷。 ,該些化合物中較佳的是可賦予透明性良好之樹脂的 3,3-—胺基二苯基砜、及雙[4-(3-胺基笨氧基)苯基]砜,特 佳的是3,3’-二胺基二苯基砜。 1-1-3.多元經基化合物 本發明中所使用之多元經基化合物之具體例可列舉: 乙一醇、一乙一醇、二乙二醇、四乙二醇、重量平均分子 量為1,000以下之聚乙二醇、丙二醇、二 = 12 201237098 41171pif 醇丙&重罝平均分子量為 1,2-丁二醇、13_丁-畴7 ^ 卜之聚丙二醇、 予,J 丁一知、1,4-丁二醇、以-戊_醆 二酵、2,4-戍二醇、u,5_戊三醇、口·戊Tt :此醇、U,6·己三叫庚二醇、心4己二醇、 庚三醇、1,2_辛二醇 ,庚—醇、1,2,7· ^ ^ 肀—醇、3,6-辛二醇、】0 0含一 醇、1,2-壬二醇、认壬二醇、口,9_壬三醇、^二:二 广癸二醇' U,1G•癸三醇、12十二炫二醇,、、 一醇、丙三醇、三羥甲基 六:- 雙齡μ商品名)、雙叫商品名)、雙 二乙醇胺、及三乙醇胺。 又分Μ商。。名)、 =些=合物中較佳的是於溶劑中之溶解性良好之乙二 Μ_丁二醇、Μ·戍二醇 ' 1,6_己二醇、1 7 庚一知、及1,8-辛二醇,特佳的 酿 及1,6-己二醇。 羿i,5-戊一醇、 1-1-4. 1 元醇 ^發明中所使用之!元醇之具體例 醇、1-丙醇、異丙g|、_ 』平1^乙 乙酯、丙-殖靈二 本甲醇、甲基丙烯酸羥基 田·、、丙二醇單甲酸、二丙二醇單乙驗、 二=樓、乙二醇單乙峻、乙二醇單甲趟、二乙_ Ϊ 醇單乙_、苯紛、冰片、麥芽醇、芳i 燒。A月曰醇、一甲基辛基甲醇、3_乙基趣基甲基環氧丙 化合物中較佳的是異丙醇、丙鱗、苯 基丙稀_基乙醋、丙二醇單乙趟、3_乙基玲基甲基環 13 201237098 41171pif 氧丙烷。若考慮將使用該些化合物而成之聚酯醯胺酸與产 氧樹脂及環氧硬化劑混合之情形時之相溶性、或者作為$ 終產品之熱硬化性樹脂組成物於彩色濾光片上之塗佈性, 則更佳的是1元醇使用苯甲醇。 1元醇較佳的是相對於四叛酸二酐、二胺、及多元經 基化合物之合計量100重量份而言含有2重量份〜3〇〇 ^ 量份。更佳的是5重量份〜2〇〇重量份。 1-1-5.苯乙烯-馬來酸酐共聚物 而且,本發明中所使用之聚酯醯胺酸亦可添加具有3 個以上酸酐基之化合物而進行合成反應。作為具有3個以 上酸酐基之化合物之具體例,可列舉苯乙烯-馬來酸酐共聚 物。關於構成笨乙烯-馬來酸酐共聚物之各成分之比率,苯 乙烯/馬來酸酐之莫耳比為0.5〜4,較佳的是1〜3,具體 而言更佳的是約1、約2或約3,進一步更佳的是約1或約 2,特佳的是約1。HOO (/, COOH where R1 is a tetrahydro acid diterpene residue 'R2 is an amine residue' R3 is a residue of a polyvalent hydroxy compound. [6] As described in any one of [1] to [5] The thermosetting resin according to any one of [1] to [6], wherein the poly-amino acid has a weight average molecular weight of from 1 000 to 200,000 〇 [7]. Composition 201237098 41171pif, wherein the tetracarboxylic dianhydride is selected from 3,3',4,4'-diphenylsulfone tetraphthalic acid dianhydride, 3,3',4,4'-diphenyl One or more of ether tetradecanoic acid dianhydride, 2,2-[bis(3,4-dicarboxyphenyl)]hexafluoropropane dianhydride, and ethylene glycol bis(hydrogen trimellitate). [8] The thermosetting resin composition according to any one of [1], wherein the diamine is selected from the group consisting of 3,3'-diaminodiphenylsulfone and bis[4-(3) The thermosetting resin composition according to any one of [1] to [8] wherein the polybasic compound is One selected from the group consisting of ethylene glycol, propylene glycol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, 1,7-heptanediol, and 1,8-octanediol Above. [10] The thermosetting resin composition according to any one of [1] to [9] wherein the bifunctional (fluorenyl) acrylate is selected from the group consisting of ethylene glycol di(decyl) acrylate, diethyl Diol bis(indenyl) acrylate, 1,4-butanediol bis(indenyl) acrylate, 1,3-butanediol bis(indenyl) acrylate, neopentyl glycol di(indenyl) propyl The thermosetting resin composition of any one of [1] to [1], wherein the thermosetting resin composition of any one of the above-mentioned [1] to [1] The above-mentioned epoxy hardener is one or more selected from the group consisting of a sulphuric acid anhydride and a hexahydro sulphuric acid.酉夂一轩 is 3,3,4,4-a-based tetracarboxylic acid di-hepatic, the diamine is 3,3'-diaminodiphenyl fluorene. The polyhydroxy compound is 1,4-butyl The diol 'the epoxy resin is glycidyl methacrylate and hydrazine, 4 - butanediol 201237098 4ll71pif dimethacrylate or 1,3-butanediol dimercapto acrylate has a weight average molecular weight of 1, 〇〇〇~50,000 copolymer, The epoxy hardening = benzotrilin, which is a thermosetting resin composition according to the above [2], wherein the tetracarboxylic dianhydride is 3 , 3', 4, 4 ·-diphenyl ether tetraphthalic acid dianhydride, the diamine is 3,3'-diaminodiphenyl sulfone, and the polyvalent hydroxy compound is 4-butanediol. The monohydric alcohol is phenyl decyl alcohol, and the epoxy resin is the weight of methacrylic acid glycerin and 1,4-butanediol dimercapto acrylate or butane diol dimethacrylate. The average molecular weight is! , 〇〇〇~5〇, 〇〇〇-*: ^Polymer The epoxy hardener is trimellitic anhydride, and further contains decyl propionate as a solvent. [14] A cured film obtained by the thermosetting resin composition according to any one of (1) to [13]. A color calender sheet using the cured film as described in [14] as a protective film. [16] A liquid crystal display element, a light sheet. It uses a color filter [17] as described in [15] as a solid-state photographic element light sheet. It uses the color filter [=- liquid crystal display element according to [15], which uses a transparent display formed between the bright electrodes of the film, and uses the hard device as described in [14] above. 3 A transparent insulating film formed between the films. A net-growing illuminant using the hardened 201237098 41171 pif film as described in (10) above as a protective film. [Effects of the Invention] The thermosetting resin composition of the preferred embodiment of the present invention is a material which is used for a flat color and a light resistance (4) slit material, and is used as a color filter sheet as a color liquid crystal display element. Can improve display quality and reliability. Further, the cured film obtained by heating the thermosetting resin composition of the present invention is also a practical one in that it is balanced in transparency, chemical resistance, adhesion, and sputter resistance. In particular, it can be used as a protective film for a color filter produced by a dyeing method or a pigment dispersion method. Moreover, it can also be used as a protective film and a transparent insulating film for various optical materials. [Embodiment] 1. Thermosetting resin composition - The thermosetting resin composition of the present invention is a resin composition comprising polyester glutamic acid, ring = tree, and J hen oxygen curing agent, said polyester Proline is a polyester lysine obtained by reacting four thief dianhydrides, diamines, and polybasic compounds, which is obtained by a knife reaction. The epoxy resin is a sulphuric acid. Glycerol_ an epoxy obtained by reacting a bifunctional (meth)acrylic acid as a raw material component, which is characterized in that it is characterized by a percentage by weight of the polyamic acid (10) by weight The resin is 20 parts by weight to 4 parts by weight, and the epoxy curing agent is 0 parts by weight to 60 parts by weight based on the parts by weight of the epoxy resin. 1-1. Polyester phthalic acid The polyglycolic acid is obtained by reacting a compound of a tetrabasic acid, a diamine, and a polybasic 201237098 41171pif compound as essential raw materials. More specifically, the reaction is carried out by the ratio of the relationship of the following formula (1) and formula (2) by using X mole 4 tetrahydro acid dianhydride, Y mole diamine and Z mole polyhydroxy compound. And get. (1) (2) 0.2^Z/Y^8.0 0.2^ (Y + Z) /X^1.5 At least the solvent must be used in the synthesis of polyacetic acid, so that the solvent can remain in the residue and be considered for operation. The composition of the liquid or gel-like thermosetting resin such as a liquid or the like may be removed by the solvent to obtain a solid shape composition in consideration of handling properties and the like. Further, in the synthesis of the polyester phthalic acid, one or more kinds of raw materials selected from the group consisting of a hydrazine alcohol and a stupid ethylene-maleic anhydride copolymer are preferably used as a raw material, and among them, a monohydric alcohol is preferable. . Moreover, the synthetic smear of the ugly smear can also be used as a supplement to the object of the present invention without damaging the purpose of the present invention. As such an example of the raw material, a monoamine containing hydrazine can be mentioned. Specific examples of the four-n-two-nixuan used in the tetracarboxylic dianhydride 2 can be exemplified by the following fragrant four-week, such as 3,3,,4,4,-diphenylfluorene-tetracarboxylic acid; 2 drunk 2,3,3'_diphenyl hydrazine with tetradecanoic acid di-hepatic, 2,3,3,,4,-diphenyl fluorenone oxime & _ 3,3,4,4·· Styrenone sulfone tetra-f acid dianhydride, 2,2',3,3,-diphenyl sulfone anhydride 2,3,3,4'-diphenyl stone wind tetracarboxylic dianhydride, 3 3 ', 4, 4' - diphenyl t ^ formic acid: anhydride, 2, 2', 3, 3, · diphenyl _ formic acid read, ' 2,3,3,,4 ·- two = (10) tetradecanoic dianhydride, 2, 2_[ Bis(3,4-di-phenylphenyl)]hexafluoropropanone- and ethylene glycol bis (dehydrated trimellitic acid trade name 201237098 41171pif TMEG-100, New Japan Physical and Chemical Co., Ltd.); alicyclic four Acidic dianhydrides such as cyclobutane tetraphthalic acid dianhydride, fluorenylcyclobutane tetradecanoic acid two needles, cyclopentane tetracarboxylic acid dianhydride, and cyclohexene tetracarboxylic acid two needles; aliphatic tetrazoic acid A dianhydride such as acetylated tetracarboxylic dianhydride and dibutyl succinic acid bismuth. Preferred among these compounds are 3,3',4,4'-diphenylphosphonium tetraphthalic acid dianhydride and 3,3',4,4'-diphenyl bond which can impart a resin having good transparency. Tetracarboxylic acid dianhydride, 2,2-[bis(3,4-di-t-phenylene)]hexafluoropropane dianhydride, ethylene glycol bis(hydrogen trimellitate) (trade name TMEG-100, New Japan Physical and Chemical Co., Ltd.) 'Specially good is 3,3',4,4'-diphenyl shunt tetradecanoic dianhydride, 3,3,,4,4,- a basal tetradecanoic acid wild·. M-2. Diamine Specific examples of the diamine used in the present invention include 4,4,-diaminodiphenyl, 3,3'-diaminodiphenylsulfone, and 3,4f-di Aminodiphenyl, bis[4-(4-aminophenyloxy)phenyl]sulfone, bis[4-(3-aminophenyloxy)phenyl]sulfone, bis[3-(4-amine) Phenyloxy)phenyl]hard, [4-(4.aminophenoxy)phenyl][3_(4-aminophenoxy)phenyl]sulfone, [4-(3-aminophenoxy) Phenyl][3_(4-aminophenoxy)phenyl]sulfone, and 2,2-bis[4-(4-aminophenyloxy)phenyl]hexafluoropropane. Preferred among these compounds are 3,3-aminodiphenylsulfone and bis[4-(3-aminophenyloxy)phenyl]sulfone which can impart a resin having good transparency. It is 3,3'-diaminodiphenyl sulfone. 1-1-3. Polybasic compound Specific examples of the polybasic compound used in the present invention include: ethyl alcohol, monoethyl alcohol, diethylene glycol, tetraethylene glycol, and a weight average molecular weight of 1,000. The following polyethylene glycol, propylene glycol, bis = 12 201237098 41171pif alcohol C & heavy 罝 average molecular weight of 1,2-butanediol, 13_丁-domain 7 ^ Bu of polypropylene glycol, 予,J 丁一知, 1,4-butanediol, pentane-ruthenium, 2,4-decanediol, u,5-pentanetriol, pentyl Tt: this alcohol, U, 6 · hexamethyl heptanediol , heart 4 hexanediol, heptanediol, 1,2-octanediol, heptyl-alcohol, 1,2,7·^^ 肀-alcohol, 3,6-octanediol, 0 0 containing monool, 1,2-decanediol, acetamethylene glycol, sulphate, 9- decyl alcohol, bis: diterpenediol 'U, 1G• decyl alcohol, 12 dioxin, monool, Glycerol, trimethylol-6:- double-age μ product name), double-named product name), bisdiethanolamine, and triethanolamine. Also divided into business. . Preferred), = = some of the compounds are preferably soluble in the solvent of ethylene di-butanediol, ruthenium phthalate ' 1,6-hexanediol, 17 G-I, and 1,8-octanediol, particularly good brewing and 1,6-hexanediol.羿i, 5-pentalol, 1-1-4. 1 alcohol ^ used in the invention! Specific alcohols of the alcohol, 1-propanol, isopropyl g|, _ _ ping 1 ^ ethyl ethyl ester, propyl - chlorin two methanol, methacrylic acid hydroxy field ·, propylene glycol monocarboxylic acid, dipropylene glycol single B Test, two = floor, ethylene glycol single sulphur, ethylene glycol monomethyl hydrazine, diethyl _ Ϊ alcohol single ethyl _, benzene, borneol, maltol, aromatic i burning. Preferred among A farinol, monomethyl octyl methanol, and 3-ethylhexylmethyl propylene oxide compound are isopropyl alcohol, propyl scale, phenyl propylene acetonate, propylene glycol monoethyl hydrazine, 3_ethyl merylmethyl ring 13 201237098 41171pif oxypropane. Consider the compatibility in the case where the polyester phthalic acid obtained by using these compounds is mixed with an oxygen generating resin and an epoxy curing agent, or the thermosetting resin composition as a final product on a color filter. More preferably, the benzyl alcohol is benzyl alcohol. The monohydric alcohol is preferably contained in an amount of 2 parts by weight to 3 parts by weight based on 100 parts by weight of the total of four tetrahydrous dianhydrides, diamines, and polybasic compounds. More preferably, it is 5 parts by weight to 2 parts by weight. 1-1-5. Styrene-maleic anhydride copolymer Further, the polyester phthalic acid used in the present invention may be subjected to a synthesis reaction by adding a compound having three or more acid anhydride groups. Specific examples of the compound having three or more acid anhydride groups include a styrene-maleic anhydride copolymer. With respect to the ratio of the components constituting the stupid ethylene-maleic anhydride copolymer, the molar ratio of styrene/maleic anhydride is from 0.5 to 4, preferably from 1 to 3, and more preferably from about 1, to about 1, 2 or about 3, still more preferably about 1 or about 2, and particularly preferably about 1.

作為苯乙烯·馬來酸酐共聚物之具體例,可列舉川原油 化股份有限公司之 SMA3000P、SMA2000P、SMA1000P 等市售品。該些中特佳的是耐熱性及耐鹼性良好之 SMA1000P。 苯乙稀-馬來酸酐共聚物相對於四緩酸二酐、二胺、及 多元羥基化合物之合計量100重量份而言較佳的是含有〇 重量份〜500重量份。更佳的是10重量份〜300重量份。 1-1-6.含有石夕之單胺 於聚酯醯胺酸之合成中,亦可於不損及本發明之目的 14 201237098 41171pif 之範圍内視需要包含上述以外之其他原料作為原料,作為 此種其他原料之例’可列舉含有石夕之單胺。 本發明中所使用之含有矽之單胺之具體例可列舉:3_ 胺基丙基三甲氧基矽烷、3-胺基丙基三乙氧基矽烷、3_胺 基丙基甲基一甲氧基妙烧、3-胺基丙基甲基二乙氧基石夕 烷、4-胺基丁基三甲氧基矽烷、4-胺基丁基三乙氧基矽烷、 4-胺基丁基曱基二乙氧基矽烷、對胺基苯基三曱氧基矽 烷、對胺基苯基三乙氧基矽烷、對胺基苯基甲基二甲氧基 矽烷、對胺基苯基曱基二乙氧基矽烷、間胺基苯基三甲氧 基石夕烧、及間胺基苯基甲基二乙氧基石夕烧。 該些化合物中較佳的是塗膜之耐酸性良好之3 _胺基丙 基二乙氧基碎烧、及對胺基苯基三曱氧基石夕烧,自耐酸性、 相溶性之觀點考慮特佳的是3_胺基丙基三乙氧基矽烷。 含有矽之單胺相對於四羧酸二酐、二胺、及多元羥基 化合物之合計量100重量份而言較佳的是含有〇重量份〜 300重量份。更佳的是5重量份〜200重量份。 1-1-7.聚酯醯胺酸之合成反應中所使用之溶劑 用以獲得聚酯醯胺酸之合成反應中所使用之溶劑之具 體例可列舉:二乙二醇二曱醚、二乙二醇甲基乙基醚、二 乙二酵二乙醚、二乙二醇單乙醚乙酸酯、乙二醇單乙醚乙 酸醋、丙二醇單甲醚乙酸酯、3-甲氧基丙酸甲酯、3-乙氧 基丙酸乙酯、乳酸乙酯、環己酮、N-甲基-2-吡咯啶酮、及 Ν,Ν-二曱基乙醯胺。 §亥些溶劑中較佳的是丙二酵單曱醚乙酸酯、3-甲氧基 15 201237098 41171pif 丙酸曱酯、及二乙二醇曱基乙基醚。 該些溶劑可單獨使用或者製成2種以上之混合溶劑而 使用。而且,若為30 Wt°/o以下之比例’則亦可混合上述溶 劑以外之其他溶劑而使用。 1-1-8.聚酯醯胺酸之合成方法 本發明中所使用之聚酯醯胺酸之合成方法可使四羧酸 二酐X莫耳、二胺Y莫耳、及多元羥基化合物z莫耳於 上述溶劑中反應。此時,X、Y及Z較佳的是定為於該些 之間使下述式(1)及式(2)之關係成立之比例。若為該 範圍,則聚酯醯胺酸於溶劑中之溶解性高,因此組成物之 塗佈性提高,結果可獲得平坦性優異之硬化膜。 0.2^Z/Y^8.0 …… (1) 0.2^ (Υ+Ζ) /Χ^1.5 …… (2) (1 )式之關係較佳的是0.7SZ/YS7.0,更佳的是 1.3SZ/YS7.0。而且,(2)式之關係較佳的是0.5S ( γ + Z) /Χ$〇·9,更佳的是 〇.7$ ( Υ+Ζ) /Χ$〇·8。 於本發明中所使用之聚酯醯胺酸於分子末端具有酸酐 基之情开>時,可視需要添加上述1元醇而進行反應。藉由 添加1元醇進行反應而獲得之聚酯醯胺酸可改善與環氧樹 脂及環氧硬化劑之相溶性,且可改善包含該些化合物之^ 發明之熱硬化性樹脂組成物之塗佈性。 而且,於使上述之含有石夕之單胺與分子末端具有酸軒 基之聚賴胺酸反應之情料,所得之塗膜之耐酸性得 改善。另外,亦可使1元醇與含㈣之單胺同時與聚_ 201237098 41171pif 胺酸反應。 反應溶劑若相對於四羧酸二酐、二胺及多元羥基化合 物之合計100重量份而使用100重量份以上,則反應順利 地進行’因此較佳。反應較佳的是於40°C〜200。(:下反應 0.2小時〜20小時。於使含有矽之單胺反應之情形時,於 四羧酸二酐與二胺及多元羥基化合物之反應結束後,將反 應液冷卻至40°C以下後,添加含有;ε夕之單胺,於1〇。〇〜 40°C下進行0.1小時〜6小時之反應即可。而且,1元醇可 於反應之任意時間點添加。 作為反應原料於反應系中之添加順序,並無特別限 定。亦即’可使用將四羧酸二酐與二胺及多元羥基化合物 同時添加於反應溶劑中;使二胺及多元羥基化合物溶解於 反應溶劑中之後’添加四羧酸二酐;使四羧酸二酐與多元 羥基化合物預先反應後,於其反應生成物中添加二胺;或 者使四羧酸二酐與二胺預先反應後,於其反應生成物中添 加多元羥基化合物等任意方法。 較佳的是如此而合成之聚醋酸胺酸包含由所述通式 (3)及通式(4)所構成之結構單元’其末端是源自作為 原料之四羧酸二酐、二胺或多元羥基化合物之酸酐基、胺 基或羥基基’或者該些化合物以外之添加物構成其末端。 於通式(3)及通式(4)中,R1是四羧酸二酐殘基,較佳 的是碳數為2〜30之有機基。R2是二胺殘基,較佳的是碳 放為2〜30之有機基。R3是多元經基化合物殘基,較佳的 是碳數為2〜20之有機基。 17 201237098 41171pif 所得之聚酯醯胺酸之重量平均分子量較佳的是l,〇〇〇 〜200,000,更佳的是3,000〜50,000。若為該些範圍内, 則平坦性及耐熱性變良好。 本說明書中之重量平均分子量是藉由凝膠滲透層析 (gel permeation chromatography,GPC)法(管柱溫度為 35°C、流速為1 ml/min)而求出之聚苯乙烯換算之值。標 準聚笨乙烯使用分子量為645〜132900之聚笨乙婦(例如 VARIAN公司之聚苯乙烯校準套組pL2〇1〇_〇1〇2),管柱使 用PLgel MIXED-D (VARIAN公司),流動相使用四氫呋 喃(THF )而進行測定。另外,本說明書中之市售品之重 量平均分子量是目錄刊登值。 1-2.環氧樹脂 本發明中所使用之環氧樹脂可藉由以(曱基)丙婦酸縮 水甘相與2官能(曱基)丙稀旨為必需之原料成分進行 反應而獲得。魏顧若_成本發明之熱硬紐樹脂組 成物之其他成分之相雜良好則並無制限定。而且,斑 (甲基)丙賴縮水甘_反紅2官能(曱基)⑽酸料 為1種亦可為2種以上。 ,用藉由使(甲基)丙埽酸縮水甘油醋與其他自由基聚 ^早體絲而麟之環氧樹脂,錄硬化性難組成物 驟上膜之透明性變高’可抑制於紫外線臭氧處理步 m步驟中之透雜降低,因此較佳。自平坦 稀酸^性' 雜學品性錢點考慮,較佳的是(曱基)丙 ^水甘油自旨於構成環氧樹脂之所有單體中含有5〇 201237098 4:ll71pif wt〇/〇〜99 Wt%。 =為其他自由絲合性單體,若使用單官能(甲基)丙 烯酸醋’則由熱硬化性樹脂組成物獲得之硬化膜之耐熱 性、耐化學品性不足,若使用3官能以上之多官能岬基) 夺烯心目曰,則平坦性不足,與聚酯酿胺酸之相溶性變差, 因此較佳的是2官能(甲基)丙烯酸酯。 2吕成(f基)丙烯酸酯之較佳例可列舉:乙二醇二 基)丙婦酸醋、二乙二醇二(曱基)丙稀_、M_ 丁二醇二 丙稀@夂酉日、1,3_丁二醇二(曱基)丙稀酸醋、新戍二醇 、二糸癸烷二甲醇二(甲基)丙烯酸酯。該些化 =物人藉由與(甲基)丙烯酸縮水甘油醋反應而獲得之變 機之聚㈣胺_相雜變良好,因此較佳。自平坦性、 耐熱性、耐化學品性之觀點考慮,較佳的是2官能; 2酸酿於構成環氧樹脂之所有單體中含有t w伙〜% 官处Γ甲^氧樹脂亦可包含(甲基)丙婦酸縮水甘油®旨盘2 分自不卜之自由基聚合性單體作為原料成 單體之特性的觀點考慮,較佳的是此種其== 性單體含有0 wt%〜2G wt%。 蚊自由基聚合 藉由以(曱基)丙稀酸縮水甘油醋 =二,分進行反應而獲得之環二= 里車父佳的是1,000〜5〇,〇〇〇,更佳曰 20,_。若分子量處於該些範圍内,則獲得充‘平坦二 201237098 41171pif 而十熱性、耐化學品性。 i'2'1.環氧樹脂之合成反應中所使用之溶劑 於環氧樹脂之合成中至少必需使用溶劑。 用以獲得環氧樹脂之聚合反應中所使用之溶劑之具體 例^列舉:二乙m二乙二醇曱基乙基醚、二乙 -享乙喊、一乙二醇單乙鱗乙酸S旨、乙二醇單乙崎乙酸 酯:丙二醇單甲醚乙酸酯、3-曱氧基丙酸曱酯、3-乙氧基 丙酸乙酯、乳酸乙酯、環己酮、N-曱基-2-吡咯啶酮、及 N,N-二曱基乙醯胺。 "亥些溶劑中較佳的是丙二醇單甲酸乙酸酯、3-甲氧基 丙酸甲自旨、及二乙二醇甲基乙基峻。 »亥些溶劑可單獨使用,或者製成2種以上之混合溶劑 而使用。而且,若為3〇wt%以下之比例,則可混合上述溶 劑以外之其他溶劑而使用。 1-2-2.環氧樹脂之合成方法 本發明中所使用之環氧樹脂之合成方法並無特別限 制,較佳的是於使用溶劑之溶液中之自由基聚合。如果反 應溶劑相對於(曱基)丙烯酸縮水甘油酯、2官能(曱基)丙烯 酸酯、及其他自由基聚合性單體之合計1〇〇重量份而言使 用100重置伤以上,則反應順利地進行,因此較佳。聚合 溫度若為由所使狀聚合起始劑充分產生自由基之溫度則 並無特別限定,通常為 無特別限定,通常為:1小時〜24小時之範圍。而且,該聚 合可於加壓、減壓或大氣壓之任意壓力下進行。 201237098 41.171pif 衣、9之合成t可使用公知之聚合起始劑。所述聚 :起始,可列舉:由於熱而產生自由基之化合物、偶氮雙 異丁猜等偶氮系起始劑、及過氧化苯f醯等過氧化物系起 述自由基聚合反應中’為了調節所生成之共聚 物之为子量,亦可適宜添加硫代乙醇酸等鏈轉移劑。 減t财所使用之環氧触可使合射所使用之溶劑 ㈣殘留而製成考慮了操作性等之環氧樹脂溶液,亦可將 心谷劑除t而製成考慮了搬運性等之固形狀之環氧樹脂。 1-3·環氧硬化劑 於本發明之熱硬化性樹脂組成物中,為了使 =學品性提高,亦可添加環氧硬化劑。環氧硬化劑存在 魏酐級化劑、_硬铺、 化劑等,自著色及耐敎性之方面去卢^及觸媒型硬 化劑。 了」生之方面考慮’較佳的是酸酐系硬 酸酐=化劑之具體例可列舉以下者:脂肪族 ^基六氯鄰苯二曱酸酐、六LL酸:鄰 元舰針’例如鄰笨二甲酸酐、偏苯三酸酐苯乙方稀香2 酸酐共聚物。自耐熱性與對溶劑之溶解性之=來 言’該些化合物中特佳的是偏苯三 面而 於本發明之熱硬化性樹脂組成物中,产 聚麵胺酸⑽重量份之比例為 相對於 若環氧樹脂之_為_,雜、:重ίς 21 201237098 4H71pif 更佳的是環氧樹脂為50重量份 品性、密接性之平衡良好 〜300重量份之範圍。 化劑性、耐化學品性之提高為目的而添加環氧硬 m二二\5倍虽置之方式進行添加。此日寺,駿酸針 土 《進彳了計算。若峨酸酐基或絲成為Qi5倍當量 〜〇·8倍當量之方式進行添加,刺化學品性進—步提高, 因此更佳。 熱硬化性樹脂組成物之其他構成材料 作為本發明之樹脂組成物中所使用之溶劑,可直接使 用=合成聚賴胺酸、及環氧樹脂時之聚合反應中所使用 之/合劑。上述熱硬化性樹脂組成物之固形物濃度可根據塗 膜之膜厚而選擇,一般情況下於該樹脂組成物1〇〇重量份 中包含5重量份〜50重量份之範圍。另外,溶劑之量可與 樹脂組成物之操作等問題相關聯地適宜決定。亦可視情況 例如為自樹脂組成物中除去溶劑而成為固形狀態之樹脂組 成物。 本發明之熱硬化性樹脂組成物可於不損及本發明之目 的之範圍内視需要含有上述以外之其他成分。此種其他成 分可列舉:偶合劑、界面活性劑、抗氧化劑、硬化促進劑、 熱敏性酸產生劑等。而且,於聚酯醯胺酸並不含有苯乙烯- 22 201237098 4ll71pif = = = = ?情形時,亦可添加笨乙烯馬來 偶合劑是用以使與基板之密接性提高者,相對於上述 熱硬化性樹脂組成物之固形物重量份(自_脂 物中除去溶劑之剩餘成分)而言添加1()重 用。 偶合劑可使用矽烷系、鋁系及鈦酸酯系之化合物。 具體而吕可列舉:乙烯基三氯石夕⑥、乙稀基三甲氧基 妙烧、乙烯基三乙氧基魏、2_(3,4_環氧基環己基)乙基三 甲氧基魏、3·縮水甘油氧基丙基二曱基乙氧基魏、3_ 縮水甘油氧基丙基?基二乙氧基魏、3•縮水甘油氧基丙 基三乙氧基矽烷、3_縮水甘油氧基丙基三曱氧基矽烷、 胺基丙基三曱氧基矽烷、3_胺基丙基三乙氧基矽烷、3_甲 基丙稀f氧基丙基三丨氧基魏、及3_曱基㈣醯氧基兩 基三乙氧基矽烷等矽烷系,乙醯基烷氧基二異丙醇鋁等鋁 系以及四異丙基雙(一辛基亞麟酸醋)鈦酸醋等鈦酸酉旨 系。於該些偶合劑中,3-縮水甘油氧基丙基三甲氧基矽烷 之使密接性提高之效果大,因此較佳。 界面活性劑是用以使對基底基板之濕潤性、勻化性、 或塗佈性提高者,相對於上述熱硬化性樹脂組成物100重 量份而言’添加0.01重量份重量份而使用。 此種界面活性劑可列舉:p〇lyfl〇W No.45、Polyflow KL_245、Polyflow Νο·75、Polyflow Νο·90、Polyfl〇w N〇.95 (以上均為商品名、共榮社化學股份有限公司)、Disperbyk 23 201237098 41171pif 161、Disperbyk 162、Disperbyk 163、Disperbyk 164、 Disperbyk 166、Disperbyk 170、Disperbyk 180、Disperbyk 181、Disperbyk 182、BYK-300、BYK-306、BYK-310、 BYK-320、BYK-330、BYK-344、BYK-346、BYK-UV3500、 BYK-UV3570 (以上均為商品名、BYK-CHEMIE JAPAN K.K· )、KP-341、KP-358、KP-368、KF-96-50CS、 KF-50-100CS (以上均為商品名、信越化學工業股份有限 公司)、Surflon SC-101、Surflon KH-40 (以上均為商品名、 AGC清美化學股份有限公司)、Ftergent 222F、Ftergent 251、FTX-218 (以上均為商品名、Neos股份有限公司)、 EFTOP EF-351 ' EFTOP EF-352 ' EFTOP EF-601 ' EFTOP EF-801、EFTOPEF-802 (以上均為商品名、三菱綜合材料 股份有限公司)、Megafac F-410、Megafac F-430、Megafac F-444、Megafac F-472SF、Megafac F-475、Megafac F-477、 Megafac F-552、Megafac F-553、Megafac F-554、Megafac F-555 > Megafac F-556 ' Megafac F-558 > Megafac R-94 ' Megafac RS-75、Megafac RS-72-K (以上均為商品名、DIC 股份有限公司)、TEGO Rad 2200N、TEGO Rad 2250N (以 上均為商品名、Evonik Degussa Japan Co·,Ltd.) 〇 本發明中所使用之界面活性劑可為1種化合物,亦可 為2種以上化合物之混合物。 抗氧化劑是用以使透明性提高,防止硬化膜暴露於高 溫下之情形時之黃化者,相對於上述熱硬化性樹脂組成物 之固形物100重量份(自該樹脂組成物中除去溶劑後之殘 24 201237098 留成刀)而g,添加〇. 1重量份〜5重量份而使用。 作為抗氧化劑,可使用受阻胺系、受阻酚系等。具體 而言可列舉:IRGAFOS XP40、IRGAFOS XP60、IRGANOX 1010、IRGANOX 1035、IRGANOX 1076、IRGANOX 1135、 1RGANOX 1520L (商品名;BASF Japan股份有限公司) 等。 硬化促進劑是用以促進環氧樹脂與環氧硬化劑之反 應,提高硬化膜之耐熱性、耐化學品性者,相對於上述熱 硬化性樹脂組成物之固形物1〇〇重量份(自該樹脂組成物 中除去溶劑後之殘留成分)而言,添加〇〇1重量份〜5重 量份而使用。 作為硬化促進劑,若為具有促進環氧樹脂與環氧硬化 劑之反應的功能之硬化促進劑,則可使用任意種,可列舉 咪唑系硬化促進劑、膦系硬化促進劑、銨系硬化促進劑、 路易士酸系硬化促進劑等作為其例。 熱敏性酸產生劑是即使於不足2〇〇t>c之低溫硬化條件 下使用本發明之熱硬紐樹敝成物之情斜,亦可賦 硬化膜充分之硬度與耐化學品性者,相對赴述熱硬 樹脂組成物之_物100重4份(自該麵喊物中 溶劑後之殘留成分)而言,添加GGG1重量份〜3重量伤 而使用。 熱敏性酸產生劑可列舉鎮鹽、苯并嗟唾琳鹽 、 鱗鹽等作為其例。 孤 2.由熱硬化性樹脂組成物獲得之硬化膜 25 201237098 41171pif 魏月之熱Γ性樹脂組成物可藉由將聚《胺酸及 辰氧树月曰加以混合,根據目標特性 加溶劑、環氧硬化劑、偶合劑、界面活性劑== 劑,使該些化合物均句地混合溶解而獲得/ L、他添加 將如上所述而調製之熱硬化性樹脂組 情形時使其溶解於溶劑中之後 如加熱等而將溶劑除去,則可形成塗臈。 於基板表面之熱魏性樹驗成物之塗佈可藉 ,塗法、浸鍍法、及狹縫_法等自先前公知之方^而形 成塗膜。其次’藉由加熱板或烘箱等對該塗膜進行加熱(預 二。烤)。加絲件因各成分之麵及概比例而異,通常於 7〇C〜15(TC下,若為烘箱則進行5分鐘〜15分鐘若為 加熱板則進行i分鐘〜5分鐘。其後,為了使塗膜硬化, 於⑽C〜25(TC、較佳的是2〇〇t〜2贼下,若為洪箱則 進打30分鐘〜9〇分鐘之加熱處iS,若為加熱板,則進行5 分鐘〜30分鐘之加熱處理,藉此可獲得硬化膜。 ^如此而獲得之硬化膜於加熱時,1)聚酯醯胺酸之聚醯 胺酸部分脫水環化而形成醯亞胺鍵,2)聚酯醯胺酸之羧酸 ,環,樹脂反應而高分子量化、及3)環氧樹脂硬化而高 分子量化,因此非常強韌,且透明性、耐熱性、耐化學品 f生、平坦性、密接性、耐光性、及财濺鍍性優異。因此, 本發明之硬化膜可有效地用作彩色濾光片用保護膜,可使 用該彩色濾光片而製造液晶顯示元件或固體攝影元件。而 且’本發明之硬化膜除了彩色濾光片用保護膜以外,可有 26 201237098 41171pif 效地用作TF T與透明電極間所 極與配向朗所形成之透日聽緣H/緣膜或透明電 膜亦有效地用作LED發光體之保護膜另外,本發明之硬化 [實例] ' -詞其:匕t合成例、實例及比較例對本發明加以師 說明,但本發明亚不受該些實齡何限定。 /、體 首先,以如下所示之方式合成包含四紐二野、 多兀^基化合物之域生祕㈣軸賊溶Specific examples of the styrene-maleic anhydride copolymer include commercially available products such as SMA3000P, SMA2000P, and SMA1000P of Chuan Petrochemical Co., Ltd. Among these, the SMA1000P is excellent in heat resistance and alkali resistance. The styrene-maleic anhydride copolymer preferably contains 〇 parts by weight to 500 parts by weight based on 100 parts by weight of the total of the tetrabasic acid dianhydride, the diamine, and the polyvalent hydroxy compound. More preferably, it is 10 parts by weight to 300 parts by weight. 1-1-6. The synthesis of the monoamine containing Shixi in the synthesis of the polyester phthalic acid may also be carried out as a raw material as needed in the range of 201237098 41171pif, which does not impair the object of the present invention. Examples of such other raw materials include a monoamine containing Shi Xi. Specific examples of the monoamine containing ruthenium used in the present invention include 3-aminopropyltrimethoxydecane, 3-aminopropyltriethoxydecane, and 3-aminopropylmethyl-methoxyl. Base, 3-aminopropylmethyldiethoxy oxacyclohexane, 4-aminobutyltrimethoxydecane, 4-aminobutyltriethoxydecane, 4-aminobutylphosphonium Diethoxy decane, p-aminophenyl trimethoxy decane, p-aminophenyl triethoxy decane, p-aminophenyl methyl dimethoxy decane, p-aminophenyl fluorenyl di Oxydecane, m-aminophenyltrimethoxy-zetan-sinter, and m-aminophenylmethyldiethoxylate. Preferred among these compounds are 3 - aminopropyl diethoxy calcination of a coating film which is excellent in acid resistance, and an aminophenyl bisphosphonate calcination, from the viewpoints of acid resistance and compatibility. Particularly preferred is 3-aminopropyltriethoxydecane. The monoamine containing hydrazine is preferably contained in an amount of from 300 parts by weight to 100 parts by weight based on 100 parts by weight of the total of the tetracarboxylic dianhydride, the diamine, and the polyvalent hydroxy compound. More preferably, it is 5 parts by weight to 200 parts by weight. 1-1-7. A solvent used in the synthesis reaction of the polyester phthalic acid to obtain a solvent used in the synthesis reaction of the polyester phthalic acid: diethylene glycol dioxime, two Ethylene glycol methyl ethyl ether, diethyldiethanol diethyl ether, diethylene glycol monoethyl ether acetate, ethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate, 3-methoxypropionic acid Ester, ethyl 3-ethoxypropionate, ethyl lactate, cyclohexanone, N-methyl-2-pyrrolidone, and hydrazine, hydrazine-dimercaptoacetamide. Preferred among the solvents are propylene glycol monoacetate acetate, 3-methoxy 15 201237098 41171pif decyl propionate, and diethylene glycol decyl ethyl ether. These solvents may be used singly or in combination of two or more kinds. Further, in the case of a ratio of 30 Wt ° /o or less, it is also possible to use a solvent other than the above solvent. 1-1-8. Method for synthesizing polyester proline acid The method for synthesizing polyester proline in the present invention can be used to make tetracarboxylic dianhydride X-mole, diamine Y-mole, and polyvalent hydroxy compound z. The moles are reacted in the above solvent. In this case, X, Y and Z are preferably determined such that the relationship between the following formulas (1) and (2) is established. When the content is in this range, the solubility of the polyester valine acid in the solvent is high, so that the coating property of the composition is improved, and as a result, a cured film excellent in flatness can be obtained. 0.2^Z/Y^8.0 ...... (1) 0.2^ (Υ+Ζ) /Χ^1.5 ...... (2) The relationship of (1) is preferably 0.7SZ/YS7.0, more preferably 1.3. SZ/YS7.0. Further, the relationship of the formula (2) is preferably 0.5S ( γ + Z) / Χ $ 〇 · 9, and more preferably 〇.7$ ( Υ + Ζ ) / Χ $ 〇 · 8. When the polyester glutamic acid used in the present invention has an acid anhydride group at the molecular terminal, the above-mentioned monohydric alcohol may be added as needed to carry out the reaction. The polyester phthalic acid obtained by the reaction of adding a monohydric alcohol can improve the compatibility with the epoxy resin and the epoxy hardener, and can improve the coating of the thermosetting resin composition of the invention containing the compounds. Cloth. Further, in the case where the above-mentioned monoamine containing Shixi and the polylysine having an acid group at the molecular end are reacted, the acid resistance of the obtained coating film is improved. Alternatively, the monohydric alcohol and the monoamine containing (iv) may be simultaneously reacted with poly_201237098 41171pif aminic acid. When the reaction solvent is used in an amount of 100 parts by weight or more based on 100 parts by weight of the total of the tetracarboxylic dianhydride, the diamine and the polyhydric hydroxy compound, the reaction proceeds smoothly. The reaction is preferably from 40 ° C to 200 ° C. (The reaction is carried out for 0.2 hours to 20 hours. When the reaction of the monoamine containing ruthenium is carried out, after the reaction of the tetracarboxylic dianhydride with the diamine and the polyvalent hydroxy compound is completed, the reaction solution is cooled to 40 ° C or lower. The reaction may be carried out at a temperature of 0.1 Torr to 40 ° C for 0.1 hour to 6 hours, and the monohydric alcohol may be added at any time point of the reaction. The order of addition in the system is not particularly limited. That is, 'the tetracarboxylic dianhydride and the diamine and the polyvalent hydroxy compound may be simultaneously added to the reaction solvent; after the diamine and the polyvalent hydroxy compound are dissolved in the reaction solvent' a tetracarboxylic dianhydride is added; after the tetracarboxylic dianhydride and the polyvalent hydroxy compound are reacted in advance, a diamine is added to the reaction product; or the tetracarboxylic dianhydride and the diamine are reacted in advance, and the reaction product is formed. Any method such as a polyvalent hydroxy compound is added. Preferably, the polyacetic acid which is synthesized in this manner comprises a structural unit composed of the general formula (3) and the general formula (4) whose end is derived from a raw material. Tetracarboxylic acid An acid anhydride group, an amine group or a hydroxyl group of a diamine or a polyvalent hydroxy compound or an additive other than the compound constitutes a terminal. In the formula (3) and the formula (4), R1 is a tetracarboxylic dianhydride. The residue is preferably an organic group having a carbon number of 2 to 30. R2 is a diamine residue, preferably an organic group having a carbon of 2 to 30. R3 is a residue of a polybasic compound, preferably It is an organic group having a carbon number of 2 to 20. 17 201237098 41171pif The weight average molecular weight of the obtained polyester glutamic acid is preferably 1, 〇〇〇 200,000, more preferably 3,000 50,000 to 50,000. In the present specification, the flatness and heat resistance are improved. The weight average molecular weight in the present specification is by gel permeation chromatography (GPC) method (column temperature is 35 ° C, flow rate is 1 ml/min) And the value of the polystyrene conversion is obtained. The standard polystyrene uses a polystyrene with a molecular weight of 645 to 132,900 (for example, VARIAN polystyrene calibration kit pL2〇1〇_〇1〇2), the column Using PLgel MIXED-D (VARIAN), the mobile phase was measured using tetrahydrofuran (THF). In addition, the weight average molecular weight of the commercially available product in the present specification is a catalogue value. 1-2. Epoxy Resin The epoxy resin used in the present invention can be obtained by shrinking with (mercapto) propylene glycolate The bifunctional (fluorenyl) acrylate is obtained by reacting the essential raw material components. Wei Guruo is not limited to the other components of the thermosetting resin composition of the invention.丙 缩 缩 甘 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ It is preferable that the epoxy resin of the silk and the lining has a high transparency of the film which is hardened by the hardening of the composition, and can suppress the decrease in the permeability in the step of the ultraviolet ozone treatment step m. In view of the flat dilute acidity, it is preferred that (mercapto) propyl hydrazine is contained in all monomers constituting the epoxy resin. 5〇201237098 4:ll71pif wt〇/〇 ~99 Wt%. = other free-filament-forming monomer, if a monofunctional (meth)acrylic acid vinegar is used, the heat-resistant and chemical-resistance of the cured film obtained from the thermosetting resin composition is insufficient, and if more than three functional groups are used, The functional thiol group is a bifunctional (meth) acrylate, since the flatness is insufficient and the compatibility with the polyester tyrosine is deteriorated. 2 preferred examples of the lyophilized (f-based) acrylate include: ethylene glycol diyl) acetoacetate, diethylene glycol bis(indenyl) propylene _, M_butanediol dipropylene @夂酉Day, 1,3 - butanediol di(indenyl) acrylate vinegar, neodecyl diol, dioxane dimethanol di(meth) acrylate. It is preferred that the poly(tetra)amine-phase of the transformer obtained by the reaction with the (meth)acrylic acid glycidol vinegar is good. From the viewpoints of flatness, heat resistance, and chemical resistance, it is preferably bifunctional; 2 acid is contained in all the monomers constituting the epoxy resin, and tw group is contained in the monomer. From the viewpoint of the characteristics of the radically polymerizable monomer as a raw material to form a monomer, it is preferred that such a == a monomer contains 0 wt. %~2G wt%. The mosquito free radical polymerization is obtained by reacting with (mercapto) acrylic acid glycidol vinegar = two, and the ring is obtained. The car is preferably 1,000 to 5 〇, 〇〇〇, more preferably 曰 20 , _. If the molecular weight is within these ranges, a charge of 'flat two 201237098 41171pif is obtained, and ten heat and chemical resistance are obtained. I'2'1. Solvent used in the synthesis of epoxy resin At least a solvent must be used in the synthesis of the epoxy resin. Specific examples of the solvent used in the polymerization reaction for obtaining an epoxy resin include: diethyl methylene glycol decyl ethyl ether, di-ethyl-ethyl ketone, and ethylene glycol mono-glycolic acid Ethylene glycol monoacetate acetate: propylene glycol monomethyl ether acetate, decyl 3-methoxypropionate, ethyl 3-ethoxypropionate, ethyl lactate, cyclohexanone, N-fluorenyl 2-pyrrolidone, and N,N-dimercaptoacetamide. Preferred among the solvents are propylene glycol monocarboxylic acid acetate, 3-methoxypropionic acid methylation, and diethylene glycol methyl ethyl sulphate. » Some solvents may be used alone or in combination of two or more. Further, in the case of a ratio of 3 Å by weight or less, other solvents than the above solvents may be used in combination. 1-2-2. Method for synthesizing epoxy resin The method for synthesizing the epoxy resin used in the present invention is not particularly limited, and is preferably a radical polymerization in a solution using a solvent. If the reaction solvent is used in an amount of 100 parts or more based on 1 part by weight of the total of (glycosyl) acrylate, difunctional (fluorenyl) acrylate, and other radical polymerizable monomers, the reaction is smooth. It is better to carry out the ground. The polymerization temperature is not particularly limited as long as it is a radical which sufficiently generates a radical by the polymerization initiator, and is usually not particularly limited, and is usually in the range of from 1 hour to 24 hours. Further, the polymerization can be carried out under any pressure of pressure, reduced pressure or atmospheric pressure. 201237098 41.171pif The synthesis of the coating 9 can be carried out using a known polymerization initiator. The poly: starting, a compound which generates a radical due to heat, an azo initiator such as azobisisodin, and a peroxide such as benzophenone benzoate are described as radical polymerization. In order to adjust the amount of the copolymer to be produced, a chain transfer agent such as thioglycolic acid may be suitably added. The epoxy resin used in the reduction of the money can be used to make the solvent (4) remaining in the shot, and the epoxy resin solution in consideration of operability and the like can be prepared. Solid shape epoxy resin. 1-3. Epoxy curing agent In the thermosetting resin composition of the present invention, an epoxy curing agent may be added in order to improve the quality of the material. Epoxy hardeners are used in the form of phthalic anhydride graders, _hard layers, chemicals, etc., from the aspects of coloring and stagnation resistance. In the case of "born considerations", preferred examples of the acid anhydride-based hard acid anhydride = a chemical agent include the following: aliphatic hexachlorophthalic anhydride, hexa LL acid: a neighboring ship needle, for example, a stupid Dicarboxylic anhydride, trimellitic anhydride, styrene, 2, anhydride copolymer. From the heat resistance and the solubility in the solvent, it is particularly preferable that the compound is a benzotriene and in the thermosetting resin composition of the present invention, the ratio of the polyglycine (10) by weight is relative. It is more preferable that the epoxy resin has a balance of 50 parts by weight of the epoxy resin and a good balance of the adhesion to the range of 300 parts by weight. For the purpose of improving the chemical properties and chemical resistance, epoxy hard m 2 + 5 times is added, and the method is added. This day, the temple, the sour needle soil "into the calculation. It is more preferable if the phthalic anhydride group or the wire is added in such a manner that it is in the form of Qi 5 equivalents to 〇·8 times equivalent. Other constituent materials of the thermosetting resin composition As the solvent used in the resin composition of the present invention, the compound used in the polymerization reaction in the case of synthesizing polylysine and epoxy resin can be used as it is. The solid content of the thermosetting resin composition can be selected according to the film thickness of the coating film, and is usually in the range of 5 parts by weight to 50 parts by weight based on 1 part by weight of the resin composition. Further, the amount of the solvent can be appropriately determined in association with problems such as the operation of the resin composition. Further, for example, a resin composition which is in a solid state by removing a solvent from the resin composition. The thermosetting resin composition of the present invention may contain other components than those described above as needed within the range not impairing the object of the present invention. Examples of such other components include a coupling agent, a surfactant, an antioxidant, a curing accelerator, a heat-sensitive acid generator, and the like. Moreover, in the case where the polyester proline does not contain styrene - 22 201237098 4ll71pif = = = = ?, a stupid ethylene male coupler may be added to improve the adhesion to the substrate, relative to the above heat. The solid content of the curable resin composition (removing the remaining component of the solvent from the fat) is added in an amount of 1 (). As the coupling agent, a compound of a decane type, an aluminum type, and a titanate type can be used. Specifically, Lu can be cited as: vinyl triclosan eve 6, ethylene trimethoxy smoldering, vinyl triethoxy wei, 2 - (3, 4-epoxycyclohexyl) ethyl trimethoxy Wei, 3. Glycidoxypropyl dimethyl ethoxy group, 3 _ glycidoxy propyl group? Di-diethoxy Wei, 3 • glycidoxypropyl triethoxy decane, 3 — glycidoxypropyl trimethoxy decane, aminopropyl trimethoxy decane, 3-aminopropyl a decane-based, ethoxylated alkoxy group such as a triethoxy decane, a 3-methyl propyl methoxy propyl tri methoxy wei, and a 3 fluorenyl (tetra) decyloxy bis-triethoxy decane An aluminum system such as aluminum diisopropoxide or a barium titanate such as tetraisopropyl bis(monooctyl linoleic acid) titanate. Among these coupling agents, 3-glycidoxypropyltrimethoxydecane is preferred because it has a large effect of improving the adhesion. The surfactant is used to increase the wettability, the homogenization property, or the applicability to the base substrate, and is added in an amount of 0.01 part by weight based on 100 parts by weight of the thermosetting resin composition. Such a surfactant may be exemplified by p〇lyfl〇W No. 45, Polyflow KL_245, Polyflow Νο·75, Polyflow Νο·90, Polyfl〇w N〇.95 (all of which are trade names, Gongrongshe Chemical Co., Ltd.) Company), Disperbyk 23 201237098 41171pif 161, Disperbyk 162, Disperbyk 163, Disperbyk 164, Disperbyk 166, Disperbyk 170, Disperbyk 180, Disperbyk 181, Disperbyk 182, BYK-300, BYK-306, BYK-310, BYK-320, BYK -330, BYK-344, BYK-346, BYK-UV3500, BYK-UV3570 (all of which are trade names, BYK-CHEMIE JAPAN KK·), KP-341, KP-358, KP-368, KF-96-50CS , KF-50-100CS (all of which are trade names, Shin-Etsu Chemical Co., Ltd.), Surflon SC-101, Surflon KH-40 (all of which are trade names, AGC Qingmei Chemical Co., Ltd.), Ftergent 222F, Ftergent 251 , FTX-218 (all of which are trade names, Neos Co., Ltd.), EFTOP EF-351 ' EFTOP EF-352 ' EFTOP EF-601 ' EFTOP EF-801, EFTOPEF-802 (all of which are trade names, Mitsubishi Materials) Co., Ltd.), Megafac F-410, Megafac F-430, Megafac F-444, Megafac F-472SF, Megafac F-475, Megafac F-477, Megafac F-552, Megafac F-553, Megafac F-554, Megafac F-555 > Megafac F-556 ' Megafac F-558 &gt Megafac R-94 ' Megafac RS-75, Megafac RS-72-K (all of which are trade names, DIC Corporation), TEGO Rad 2200N, TEGO Rad 2250N (all of which are trade names, Evonik Degussa Japan Co·, Ltd.) The surfactant used in the present invention may be one type of compound or a mixture of two or more types of compounds. The antioxidant is used to improve the transparency and prevent yellowing of the cured film when exposed to a high temperature, and 100 parts by weight of the solid matter of the thermosetting resin composition (after removing the solvent from the resin composition) Residue 24 201237098 retained knife) and g, added 〇. 1 part by weight to 5 parts by weight and used. As the antioxidant, a hindered amine system, a hindered phenol system or the like can be used. Specific examples include IRGAFOS XP40, IRGAFOS XP60, IRGANOX 1010, IRGANOX 1035, IRGANOX 1076, IRGANOX 1135, 1RGANOX 1520L (trade name; BASF Japan Co., Ltd.) and the like. The hardening accelerator is used to promote the reaction between the epoxy resin and the epoxy curing agent, and to improve the heat resistance and chemical resistance of the cured film, and the solid content of the thermosetting resin composition is 1 part by weight. The residual component after removing the solvent in the resin composition is added in an amount of 1 part by weight to 5 parts by weight. Any curing agent which has a function of promoting the reaction between the epoxy resin and the epoxy curing agent can be used as the curing accelerator, and examples thereof include an imidazole curing accelerator, a phosphine curing accelerator, and an ammonium hardening accelerator. A reagent, a Lewis acid hardening accelerator, and the like are exemplified. The heat-sensitive acid generator is capable of imparting sufficient hardness and chemical resistance to the cured film even if the heat-hardened knot-tree composition of the present invention is used under low-temperature hardening conditions of less than 2〇〇t>c. The composition of the thermosetting resin composition was used in an amount of 100 parts by weight (remaining component from the solvent in the surface of the surface), and GGG1 parts by weight to 3 parts by weight was added and used. Examples of the heat-sensitive acid generator include a salt of a town, a benzopyrene salt, a scale salt, and the like. Solitary 2. Hardened film obtained from thermosetting resin composition 2012 20129898 41171pif Weiyue's hot resin composition can be prepared by mixing poly-amine acid and oxynium tree sulphate, adding solvent and epoxy hardening according to the target characteristics. The agent, the coupling agent, and the surfactant == the agent, and the compounds are uniformly mixed and dissolved to obtain /L, and the thermosetting resin group prepared as described above is added to the solvent, and then dissolved in a solvent, such as When the solvent is removed by heating or the like, coating can be formed. The coating of the hot-wet tree test on the surface of the substrate can be formed by a conventional method such as a coating method, a dip plating method, and a slit method. Next, the coating film is heated by a hot plate or an oven or the like (pre-baked). The wire feeder varies depending on the surface and the proportion of each component, and is usually 7 〇C to 15 (at TC, if it is an oven, it is 5 minutes to 15 minutes, and if it is a heating plate, i minutes to 5 minutes). Thereafter, In order to harden the coating film, it is (10) C~25 (TC, preferably 2〇〇t~2 thief, if it is a flood box, it will be heated for 30 minutes~9〇 minutes, if it is a heating plate, then The heat treatment is performed for 5 minutes to 30 minutes, whereby a cured film can be obtained. ^When the cured film obtained is heated, 1) the polyamic acid of the polyester proline is partially dehydrated and cyclized to form a quinone bond. 2) Polyester phthalic acid carboxylic acid, ring, resin reaction and high molecular weight, and 3) epoxy resin hardening and high molecular weight, so it is very strong, and transparency, heat resistance, chemical resistance Excellent in flatness, adhesion, light resistance, and sputter. Therefore, the cured film of the present invention can be effectively used as a protective film for a color filter, and a color filter can be used to manufacture a liquid crystal display element or a solid-state imaging element. Moreover, the cured film of the present invention may be used as a transparent film for the color filter, and may be used as a transparent film formed by the TF T and the transparent electrode. The electric film is also effectively used as a protective film for an LED illuminator. In addition, the hardening of the present invention [example] is described in the following, and the present invention is not limited to the present invention. What is the age limit? /, First, synthesize the domain containing the four-in-one, two-in-one, and the compound in the way shown below.

].、合成例2,表1)。 风1 J]. Synthesis Example 2, Table 1). Wind 1 J

[合成例1]聚酯醯胺酸溶液(Al)之合成 於具有溫度計、攪拌機、原料投入口及氮氣導入口之 ].000 ml之四口燒瓶中裝入脫水純化之3_甲氧基丙酸甲酯 (以下簡稱為「MMP」)446.96 g、l,4-丁二醇 31.93 g、苯 f醇25.54 g、3,3',4,4’-二苯基越四甲酸二酐(以下簡稱為 「ODPA」)183.20 g ’於乾燥氮氣流下、13〇°c下攪拌3小 時。其後’將反應液冷卻至25°C ’投入3,3,-二胺基二苯基 颯(以下簡稱為「DDS」)29.33 g、MMP 183.04 g,K2(TC 〜3〇°C下攪拌2小時後,於115°C下攪拌1小時,冷卻至 30°C以下,藉此而獲得淡黃色透明之聚酯醯胺酸之30 wt% 溶液(A1)。 該溶液之旋轉黏度為28.5 mPa · s。而且,藉由GPC 而測定之重量平均分子量為4,200 (聚苯乙烯換算)。 此處,本說明書中之旋轉黏度是使用E型黏度計(商 品名為VISCONIC END、東京計器股份有限公司)而於 27 201237098 41171pif 25°C下測定之黏度。 [合成例2]聚酯醯胺酸溶液(A2)之合成 於具有溫度計、攪拌機、原料投入口及氮氣導入口之 1000 ml之四口燒瓶中依序裝入脫水純化之丙二醇單曱醚 乙酸酯(以下簡稱為「PGMEA」)504.00 g、ODPA 47.68 g、 SMA1000P (商品名;苯乙烯-馬來酸酐共聚物、川原油化 股份有限公司)144.97 g、苯曱醇55.40 g、1,4-丁二醇9.23 g、脫水純化之二乙二醇曱基乙基醚(以下簡稱為「EDM」) 96.32 g,於乾燥氮氣流下、130°C下攪拌3小時。其後, 將反應液冷卻至25°C,投入DDS 12.72 g、EDM 29.68 g, 於20°C〜30°C下攪拌2小時後,於115t下攪拌1小時, 冷卻至30°C以下,藉此獲得淡黃色透明之聚酯醯胺酸之30 wt%溶液(A2)。 該溶液之旋轉黏度為36.2 mPa · s,藉由GPC而測定 之重量平均分子量為21,000 (聚苯乙烯換算)。 [表1] A1 (g) A2 (g) 成分 材料 四羧酸二酐 ODPA 183.2 47.68 二胺 DDS 29.33 12.72 多元經基化合物 1,4-丁二醇 31.93 9.23 1元醇 笨曱醇 25.54 55.40 苯乙烯-馬來酸酐 共聚物 SMA1000P 0 144.97 溶劑 MMP 630.00 0 PGMEA 0 504.00 EDM 0 126.00 MMP : 3-曱氧基丙酸甲酯 ODPA : 3,3\4,4匕二苯基醚四曱酸二酐 DDS : 3,3'-二胺基二苯基颯 28 201237098 41171pif PGMEA :丙二醇單甲醚乙酸酯 SMA1000P:苯乙烯_馬來酸酐共聚物(川原油化股份 有限公司) EDM :二乙二醇曱基乙基醚 其次,以如下所示之方式而合成包含(甲基)丙烯酸縮 水甘油酯與2官能(甲基)丙烯酸酯之反應生成物的環氧樹 脂溶液(合成例3、合成例4、合成例5、合成例6、合成 例7,表2 )。 [合成例3]環氧樹脂溶液(B1)之合成 於具有溫度計、攪拌機、原料投入口及氮氣導入口之 000 ml之四口燒瓶中裝入脫水純化之MMP 300.00 g、曱 基丙烯酸縮水甘油酯(以下簡稱為「GMA」)18〇 〇〇 丨,4_ Γ二醇二曱基丙烯酸脂20.00 g、作為聚合起始劑之2,2,_ 偶氣雙(2,4-二曱基戊腈)20.00 g,於90°C之聚合溫度下進 /·丁 2小時之加熱而進行聚合。藉由將反應液冷卻至以 F而獲得環氧樹脂之4 〇 w t%溶液(B工)。該溶液之藉由Gp c 而測定之重量平均分子量為12,〇〇〇 (聚苯乙烯換算)。 [合成例4]環氧樹脂溶液(B2)之合成 於具有溫度計、攪拌機、原料投入口及氮氣導入口之 ],000 ml之四口燒瓶中裝入脫水純化之MMP 300.00 g、 〇MA 180.00 g、1>3•丁二醇二曱基丙烯酸脂2請g、作為 合起,,之2,2、偶氮雙(2,4-二曱基戊腈)20.00 g,於 90 C之聚合、溫度下進行2小時之加熱而進行&合。藉由將 29 201237098 41171pif 反應液冷卻至30°C以下而獲得環氧樹脂之4〇 wt%溶液 (B2)。該溶液之藉由Gpc而測定之重量平均分子量為 12.000 (聚苯乙烯換算)。 [合成例5]環氧樹脂溶液(B3)之合成 於具有溫度計、攪拌機、原料投入口及氮氣導入口之 1000 ml之四口燒瓶中裝入脫水純化之mmp 300.00 g、 GMA 180.00 g、新戊二醇二曱基丙烯酸脂2〇 〇〇 g、作為聚 合起始劑之2,2,-偶氮雙(2,4-二曱基戊腈)20.00 §,於90乞 之聚合溫度下進行2小時之加熱而進行聚合。藉由將反應 液冷卻至30°C以下而獲得環氧樹脂之4〇 wt%溶液(B3)。 5亥浴液之藉由GPC而測定之重量平均分子量為11,000(聚 苯乙烯換算)。 [合成例6]環氧樹脂溶液(B4)之合成 於具有溫度計、攪拌機、原料投入口及氮氣導入口之 1000 ml之四口燒瓶中裝入脫水純化之MMP 300.00 g、 GMA16d〇〇g、κ丁二醇二甲基丙烯酸脂4〇 〇〇g、作為 聚合起始劑之2,2,-偶氮雙(2,4-二曱基戊腈) 30.00 g,於 90 C之聚合溫度下進行2小時之加熱而進行聚合。藉由將 反應液冷卻至30〇CW下而獲得環氧樹脂之4〇 wt%溶液 (B4)°該溶液之藉由GPC而測定之重量平均分子量為 18.000 (聚苯乙烯換算)。 [合成例7]環氧樹脂溶液(B5)之合成 於具有溫度計、攪拌機、原料投入口及氮氣導入口之 1000 ml之四口燒瓶中農入脫水純化之MMP 300.00 g、 201237098 41171pif GMA 180,00 g、二乙-龄 合起始劑之2,2,_偶!^ = ?基_賴2_ g、作為聚 之聚合溫度下進行二曱基戊腈)2〇.〇〇g,於贼 .A 寻之加熱而進行聚合。藉由將反應 ‘^以下而獲得環氧樹脂之40 wt%溶液(Β5)。 GPC而測定之重量平均分子量為U,_(聚 苯乙烯換算)。[Synthesis Example 1] Synthesis of polyester glutamic acid solution (Al) was placed in a four-necked flask of a .000 ml having a thermometer, a stirrer, a raw material inlet, and a nitrogen inlet, and was charged with dehydrated purified 3-methoxypropane. Methyl ester (hereinafter referred to as "MMP") 446.96 g, l,4-butanediol 31.93 g, benzene f-alcohol 25.54 g, 3,3',4,4'-diphenyltetracarboxylic dianhydride (below Referred to as "ODPA") 183.20 g ', stirred under a dry nitrogen stream at 13 ° C for 3 hours. Then, 'cool the reaction solution to 25 ° C', put 3,3,-diaminodiphenyl hydrazine (hereinafter abbreviated as "DDS") 29.33 g, MMP 183.04 g, K2 (TC ~ 3 ° ° C stirring After 2 hours, the mixture was stirred at 115 ° C for 1 hour and cooled to 30 ° C or lower, thereby obtaining a 30 wt% solution (A1) of pale yellow transparent polyester lysine. The rotational viscosity of the solution was 28.5 mPa. · s. Moreover, the weight average molecular weight measured by GPC is 4,200 (in terms of polystyrene). Here, the rotational viscosity in this specification is an E-type viscosity meter (trade name: VISCONIC END, Tokyo Keiki Co., Ltd.) And the viscosity measured at 25 201237098 41171pif at 25 ° C. [Synthesis Example 2] Synthesis of polyester proline solution (A2) in a four-necked flask of 1000 ml with a thermometer, a stirrer, a raw material inlet and a nitrogen inlet. Dehydrated and purified propylene glycol monoterpene ether acetate (hereinafter referred to as "PGMEA") 504.00 g, ODPA 47.68 g, SMA1000P (trade name; styrene-maleic anhydride copolymer, Chuan crude oil chemical co., Ltd.) ) 144.97 g, phenyl decyl alcohol 55.40 g, 1,4-butanediol 9.23 g, dehydrated and purified diethylene glycol decyl ethyl ether (hereinafter referred to as "EDM") 96.32 g, and stirred under a dry nitrogen stream at 130 ° C for 3 hours. Thereafter, the reaction solution was cooled to 25 ° C. DDS 12.72 g and EDM 29.68 g were charged, and the mixture was stirred at 20 ° C to 30 ° C for 2 hours, and then stirred at 115 t for 1 hour, and cooled to 30 ° C or lower, thereby obtaining a pale yellow transparent polyester proline. 30 wt% solution (A2) The rotational viscosity of the solution was 36.2 mPa·s, and the weight average molecular weight measured by GPC was 21,000 (in terms of polystyrene) [Table 1] A1 (g) A2 (g Ingredient Material Tetracarboxylic Acid dianhydride ODPA 183.2 47.68 Diamine DDS 29.33 12.72 Polybasic compound 1,4-butanediol 31.93 9.23 1 hydroxyl octanol 25.54 55.40 Styrene-maleic anhydride copolymer SMA1000P 0 144.97 Solvent MMP 630.00 0 PGMEA 0 504.00 EDM 0 126.00 MMP : methyl 3-methoxypropionate ODPA : 3,3\4,4 匕diphenyl ether tetraphthalic acid dianhydride DDS : 3,3'-diaminodiphenyl基飒28 201237098 41171pif PGMEA : Propylene glycol monomethyl ether acetate SMA1000P: styrene_maleic anhydride copolymer Company) EDM: diethylene glycol decyl ethyl ether. Next, an epoxy resin solution containing a reaction product of glycidyl (meth)acrylate and a bifunctional (meth) acrylate is synthesized in the following manner. (Synthesis Example 3, Synthesis Example 4, Synthesis Example 5, Synthesis Example 6, Synthesis Example 7, Table 2). [Synthesis Example 3] Synthesis of epoxy resin solution (B1) In a four-necked flask of 000 ml having a thermometer, a stirrer, a raw material inlet, and a nitrogen inlet, a dehydrated and purified MMP 300.00 g, glycidyl methacrylate was charged. (hereinafter referred to as "GMA") 18〇〇〇丨, 4_ Γdiol dimercapto acrylate 20.00 g, 2,2, _ dioxin (2,4-dimercaptocarbonitrile) as polymerization initiator 20.00 g, polymerization was carried out by heating at a polymerization temperature of 90 ° C for 2 hours. The 4 〇 w t% solution of the epoxy resin (B work) was obtained by cooling the reaction liquid to F. The weight average molecular weight of the solution as measured by Gp c was 12, 〇〇〇 (in terms of polystyrene). [Synthesis Example 4] Synthesis of epoxy resin solution (B2) in a four-necked flask having a thermometer, a stirrer, a raw material inlet, and a nitrogen introduction port, and a dehydration-purified MMP 300.00 g, 〇MA 180.00 g , 1>3 • Butanediol dimercapto acrylate 2, g, as a combination, 2, 2, azobis(2,4-dimercapto valeronitrile) 20.00 g, polymerization at 90 C, Heating was carried out for 2 hours at a temperature to carry out & The 4 〇 wt% solution (B2) of the epoxy resin was obtained by cooling the 29 201237098 41171 pif reaction solution to below 30 °C. The weight average molecular weight of the solution as measured by Gpc was 12.000 (in terms of polystyrene). [Synthesis Example 5] Synthesis of epoxy resin solution (B3) was placed in a 1000 ml four-necked flask equipped with a thermometer, a stirrer, a raw material inlet, and a nitrogen inlet, and was subjected to dehydration purification of mmp 300.00 g, GMA 180.00 g, and neopentane. 2 〇〇〇g of diol dimercapto acrylate, 2,2,-azobis(2,4-dimercapto valeronitrile) 20.00 § as a polymerization initiator, carried out at a polymerization temperature of 90 2 2 The polymerization was carried out by heating for an hour. The 4 〇 wt% solution (B3) of the epoxy resin was obtained by cooling the reaction liquid to below 30 °C. The weight average molecular weight measured by GPC of 5 hai bath was 11,000 (in terms of polystyrene). [Synthesis Example 6] Synthesis of epoxy resin solution (B4) In a 1000 ml four-necked flask equipped with a thermometer, a stirrer, a raw material inlet, and a nitrogen inlet, a dehydrated and purified MMP 300.00 g, GMA16d〇〇g, κ 4〇〇〇g of butanediol dimethacrylate, 30.00 g of 2,2,-azobis(2,4-dimercaptophthalonitrile) as a polymerization initiator, at a polymerization temperature of 90 C The polymerization was carried out by heating for 2 hours. A 4 wt% solution of the epoxy resin (B4) was obtained by cooling the reaction solution to 30 ° CW. The weight average molecular weight of the solution as determined by GPC was 18.000 (in terms of polystyrene). [Synthesis Example 7] Synthesis of epoxy resin solution (B5) MMP 300.00 g, 201237098 41171 pif GMA 180, 00, which was dehydrated and purified in a 1000 ml four-necked flask equipped with a thermometer, a stirrer, a raw material inlet, and a nitrogen inlet. g, 2, 2, aging initiator 2, 2, _ even! ^ = ? 基_赖2_g, dimethyl valeronitrile) 2〇.〇〇g at the polymerization temperature of the polymerization, and polymerization was carried out by heating the thief .A. A 40 wt% solution of epoxy resin (Β5) was obtained by reacting the reaction below. The weight average molecular weight measured by GPC was U, _ (polystyrene conversion).

GMA:曱基丙烯酸縮水甘油酯 MMP : 3·曱氧基丙酸甲酯 [表2] B3 (g) Β4 (g) B5 (g) 180 160 180 0 40 0 0 0 0 20 0 0 ίγ\π 20 20 jUU 30 20 11,000 18,000 11,000 其次’藉由如下所示之方式而合成包含(曱基)丙烯酸 縮水甘油酯與單官能(曱基)丙烯酸酯之反應生成物的環氧 樹脂溶液(比較合成例1,表3)。 [比較合成例1]環氧樹脂溶液(C1)之合成 於具有溫度計、攪拌機、原料投入口及氮氣導入口之 】000 ml之四口燒瓶+裝入脫水純化之MMP 300.00 g、 GMA 180.00 g、甲基丙烯酸曱酯20.00 g、作為聚合起始劑 之2,2,-偶氮雙(2,4-二曱基戊腈)8.00 g,於90°C之聚合溫度 下進行2小時之加熱而進行聚合。藉由將反應液冷卻至 31 201237098 41171pif 30°c以下而獲得環氧樹脂之40wt%溶液(Cl)。該溶液之 藉由GPC而測定之重量平均分子量為15,000(聚苯乙烯換 算)。 其次’藉由如下所示之方式而合成包含(甲基)丙烯酸 縮水甘油酯與2官能(甲基)丙烯酸酯之反應生成物(重量 平均分子量為20,000以上)的環氧樹脂溶液(比較合成例 2,表 3)。 [比較合成例2]環氧樹脂溶液(C2)之合成 於具有溫度計、搜拌機、原料投入口及氮氣導入口之 1000 ml之四口燒航中裝入脫水純化之jyjMp 〇〇 g、 GMA 180.00 g、1,4-丁二醇二曱基丙稀酸脂2〇 〇〇 g、作為 聚合起始劑之2,2,-偶氮雙(2,4-二曱基戊腈)13〇〇 g,於 3„度下進行2小時之加熱而進行聚合。藉由將 =液冷魏机以下而獲得環氧樹辟之⑼祕溶液 (ci)。该溶液之藉由GPC而測定 58,000 (聚笨乙馳算)。 夏十灼刀十里是 [表3]GMA: glycidyl methacrylate MMP : 3 · methyl methoxypropionate [Table 2] B3 (g) Β 4 (g) B5 (g) 180 160 180 0 40 0 0 0 0 20 0 0 ίγ\π 20 20 jUU 30 20 11,000 18,000 11,000 Next, an epoxy resin solution containing a reaction product of glycidyl (meth) acrylate and monofunctional (fluorenyl) acrylate was synthesized by the following method (Comparative Synthesis Example) 1, Table 3). [Comparative Synthesis Example 1] Synthesis of epoxy resin solution (C1) in a four-necked flask of 000 ml having a thermometer, a stirrer, a raw material inlet, and a nitrogen introduction port + a dehydrated purified MMP 300.00 g, GMA 180.00 g, 20.00 g of decyl methacrylate, 8.00 g of 2,2,-azobis(2,4-dioxyl valeronitrile) as a polymerization initiator, heated at a polymerization temperature of 90 ° C for 2 hours. Perform polymerization. A 40 wt% solution (Cl) of an epoxy resin was obtained by cooling the reaction liquid to 31 201237098 41171 pif 30 ° C or less. The solution had a weight average molecular weight of 15,000 (polystyrene conversion) as determined by GPC. Next, an epoxy resin solution containing a reaction product of glycidyl (meth)acrylate and a bifunctional (meth) acrylate (weight average molecular weight: 20,000 or more) was synthesized by the following method (comparative synthesis example) 2, Table 3). [Comparative Synthesis Example 2] The synthesis of the epoxy resin solution (C2) was carried out in a four-point boiling of 1000 ml with a thermometer, a mixer, a raw material inlet, and a nitrogen inlet, and was loaded into a dehydrated and purified jyjMp 〇〇g, GMA. 180.00 g, 1,4-butanediol dimercapto acrylate, 2 〇〇〇g, 2,2,-azobis(2,4-dioxyl valeronitrile) 13 作为 as a polymerization initiator 〇g, polymerization was carried out by heating for 2 hours at 3 ° C. The epoxy solution (9) secret solution (ci) was obtained by cooling the liquid below the machine. The solution was determined by GPC to be 58,000 (聚聚乙驰算). Xia Shi knives ten miles is [Table 3]

MMP · 3-曱氧基丙酸甲醋 32 201237098 41171pif 其次,使用合成例1、合成例2中所得之聚酯蟪胺 (、A1、A2)、合成例3、合成例4、合成例5、合成例/ 合成例7中所得之環氧樹脂(Bl、B2、B3、B4、By 較合成例1、比較合成例2中所得之環氧樹脂(C1、^ 及市售之多官能且重量平均分子量不足3 〇〇〇之環 脂,以如下所示之方式調製熱硬化性樹脂組成物,由該^ 硬化性樹脂組成物獲得硬化膜,進行該硬化膜之評價°^、、、 例1〜實例6、比較例1、比較例2、比較例3,表4、實 及表7)。 〜表6 [實例1] 對附有攪拌翼之500 ml之可分離式燒瓶進行氮氣置 換,於該燒瓶中裝入合成例1中所得之聚酯醯胺酸溶液 (A1) 1〇〇 g、合成例3中所得之環氧樹脂溶液(Βι)说 g、偏笨三酸酐6 g、3-縮水甘油氧基丙基三甲氧基矽燒4 8 g、IRGANOX 1010 (商品名;BASF Japan股份有限公司) 0.5〇 g、脫水純化之MMP 160.8 g,於室溫下進行5小時之 授拌’使其均勻地溶解。其次,投入BYK-344 (商品名、 BYK-CHEMIE JAPAN K.K.) 0.42 g,於室溫下進行 f 小時 之攪拌,藉由孔徑為0.2 μιη之薄膜過濾器進行過濾而調製 塗佈液。 〜° 其次,將該塗佈液以800 rpm而旋塗於玻璃基板上及 衫色濾光片基板上1〇秒之後,於加熱板上、8〇。匚下進行3 分鐘之預烘烤而形成塗膜。其後,於烘箱中、23(TC下進行 33 201237098 41171pif 3〇分鐘之加熱,藉此使塗膜硬化,獲得膜厚為1 5卿之 硬化膜。 卜〜 關於如此而獲得之硬化膜,對透明性、耐光性、平坦 ί"生耐熱性、及耐化學品性而進行特性評價。將該些 價結果示於表7中。 一 。 [透明性之評價方法] 於所得之附有硬化膜之玻璃基板甲,藉由紫外可見近 紅外分光光度計(商品名為V.㈣、日本分光股份有限公 司)而測定僅硬化膜之於光之波長為4〇〇nm下之透射率。 將透射率為97%以上之情形作為。,將不足97%之情 為X。 [耐光性之評價方法] 藉由紫外線臭氧清洗裝置(商品名為pL2003N_ i 2、光 源為低壓水銀燈、SEN LIGHTS CG.,Ltd ),對於所述[透明 性之評價方法]中評價了透雜之後_有魏膜之玻璃 基板進行3 I/em2⑵4 nm換算)之紫外線臭氧處理後, 藉由紫外可見近紅外分光光度計(商品名為v_67〇、曰本 分光股份有限公司)而測定僅硬化膜之於光之波長為4⑻ nm下之透射率。將透射率為96%以上之情形作為〇=將不 足96%之情形作為X。 [平坦性之評價方法] 使用階差、表面粗链度、微細形狀測定裝置(商。名 為P-15、KLA TENCOR股份有限公司)而測定所得之附 有硬化膜之彩色據光片基板之硬化膜表面之階差。將包人 34 201237098 41l71pif 黑色矩陣之R、G、B晝素間之階差之最大值(以下簡稱 為最大階差)不足〇·2 μιη之情形作為〇,將〇 2 μιη以上之 情形作為X。而且,所使用之彩色濾光片基板是使用最大 階差約為1.1 μπι之樹脂黑色矩陣之顏料分散彩色濾光片 (以下簡稱為CF)。 ^ [耐熱性之評價方法] 將所得之附有硬化膜之玻璃基板於25〇。(:下進行!小 時之再加熱後,測定加熱前之膜厚及加熱後之膜厚,藉由 下述計算式而算出殘膜率。將加熱後之殘膜率為95%以上 之情形作為〇,將加熱後之殘膜率不足95%之情形作為x。 殘膜率=(加熱後之膜厚/加熱前之膜厚)xl〇〇 [耐化學品性之評價方法] 將所得之附有硬化膜之玻璃基板,於5 wt%氳氧化鈉 水溶液中、60°C下實施10分鐘之浸潰處理(以下簡稱為MMP · 3-methoxypropionic acid methyl ketone 32 201237098 41171pif Next, using the polyester amide (S1, A2) obtained in Synthesis Example 1, Synthesis Example 2, Synthesis Example 3, Synthesis Example 4, Synthesis Example 5, Synthesis Example / Epoxy resin obtained in Synthesis Example 7 (Bl, B2, B3, B4, By, epoxy resin obtained in Synthesis Example 1 and Comparative Synthesis Example 2 (C1, ^ and commercially available polyfunctional and weight average) The cycloaliphatic resin having a molecular weight of less than 3 调制 is prepared as follows, and a thermosetting resin composition is prepared, and a cured film is obtained from the curable resin composition, and the cured film is evaluated. Example 6, Comparative Example 1, Comparative Example 2, Comparative Example 3, Table 4, and Table 7). ~ Table 6 [Example 1] A 500 ml separable flask equipped with a stirring blade was purged with nitrogen. The flask was charged with 1 〇〇g of the polyester phthalic acid solution (A1) obtained in Synthesis Example 1, and the epoxy resin solution (Βι) obtained in Synthesis Example 3, g, trimellitic anhydride 6 g, 3-shrinkage Glyceroxypropyltrimethoxysulfonium 4 8 g, IRGANOX 1010 (trade name; BASF Japan Co., Ltd.) 0.5〇g, dehydrated and purified MMP 160. 8 g, 5 hours at room temperature, 'mixed it' to dissolve evenly. Secondly, put BYK-344 (trade name, BYK-CHEMIE JAPAN KK) 0.42 g, stir at room temperature for f hours, borrow The coating liquid was prepared by filtration through a membrane filter having a pore size of 0.2 μm. 〜° Next, the coating liquid was spin-coated on a glass substrate and a shirt filter substrate at 800 rpm for 1 sec. On the hot plate, 8 Torr. The pre-baking was carried out for 3 minutes under the arm to form a coating film. Thereafter, heating was carried out in an oven at 23 (TC, 33, 2012, 098, 00, 41, 171, pif, for 3 minutes, thereby hardening the coating film. The film thickness is a cured film of 1 5%. 卜~ The cured film obtained in this way is evaluated for its transparency, light resistance, flatness, heat resistance, and chemical resistance. In Table 7. I. [Evaluation method of transparency] The obtained glass substrate A with a cured film was obtained by an ultraviolet visible near-infrared spectrophotometer (trade name: V. (4), Japan Optical Co., Ltd.) Determination of only the cured film at a wavelength of light of 4 〇〇 nm The transmittance is 97% or more. The less than 97% is X. [Evaluation method of light resistance] By ultraviolet ozone cleaning device (trade name: pL2003N_ i 2, the light source is a low-pressure mercury lamp) , SEN LIGHTS CG., Ltd., for the [Evaluation Method of Transparency], after the ultraviolet ray treatment of the glass substrate of the wei film with 3 I/em2 (2) 4 nm conversion, after UV penetration, it is visible by ultraviolet light. The near-infrared spectrophotometer (trade name: v_67〇, 曰本分光股份有限公司) was used to measure the transmittance of only the cured film at a wavelength of light of 4 (8) nm. A case where the transmittance is 96% or more is taken as X in the case where 〇 = 96% is less than. [Evaluation method of flatness] The obtained color film substrate with a cured film was measured using a step, a surface roughness, and a fine shape measuring device (trade name: P-15, KLA TENCOR Co., Ltd.). The step of the surface of the cured film. The maximum value of the step difference between the R, G, and B elements of the black matrix of the packaged person 34 201237098 41l71pif (hereinafter referred to as the maximum step difference) is less than 〇·2 μιη, and the case of 〇2 μηη or more is taken as X. . Further, the color filter substrate used is a pigment dispersion color filter (hereinafter abbreviated as CF) using a resin black matrix having a maximum step difference of about 1.1 μm. ^ [Evaluation method of heat resistance] The obtained glass substrate with a cured film was placed at 25 Å. (: Next: After reheating for an hour, the film thickness before heating and the film thickness after heating were measured, and the residual film ratio was calculated by the following calculation formula. The case where the residual film ratio after heating was 95% or more was taken as 〇, the case where the residual film rate after heating is less than 95% is taken as x. Residual film rate = (film thickness after heating/film thickness before heating) xl 〇〇 [evaluation method of chemical resistance] a glass substrate having a cured film, which is subjected to an impregnation treatment at 60 ° C for 10 minutes in a 5 wt% sodium hydroxide aqueous solution (hereinafter referred to as

NaOH處理)’於包含36%鹽酸/60%硝酸/水= 40/20/40之 混合液(重量比)中、50〇C下實施3分鐘之浸潰處理(以 卩間稱為酸處理),於N-曱基-2-°比D各。定嗣中、50°C下實施 3 〇分鐘之浸潰處理(以下簡稱為NMP處理;),然後於2 3 〇 T進行1小時之再加熱。測定再加熱後之殘膜率及再加熱 後之透射率。將再加熱後之殘膜率為95%以上且再加熱後 之於400 nm下之透射率為95%以上之情形作為〇。將再加 熱後之殘膜率不足95%或再加熱後之透射率不足95%之情 形作為X。 再加熱後之殘膜率==(再加熱後之膜厚/再加熱前之膜 35 201237098 41171pif 厚)ΧίΟΟ [實例2] 對附有攪拌翼之500 ml之可分離式燒瓶進行氮氣置 換,於該燒瓶中裝入合成例2中所得之聚酯醯胺酸溶液 (A2) 100 g、合成例3中所得之環氧樹脂溶液(B1) 150 g、偏苯三酸酐6 g、3-縮水甘油氧基丙基三甲氧基矽烷4.8 g、IRGANOX 1010 (商品名;BASF Japan股份有限公司) 〇·50 g、脫水純化之MMP 160.8 g,於室溫下進行5小時之 攪拌,使其均勻地溶解。其次,投入BYK-344 (商品名、 BYK-CHEMIE JAPAN K.K,)0.42 g,於室溫下進行}小時 之授拌,藉由孔徑為0.2卿之薄膜過遽器進行過渡而調製 塗佈液。 與實例1同樣崎透·、耐紐 :耐化學品健捕_價。賴私評 [實例3] 將環氧樹脂溶液(Bj) 除此以外藉由與實例1同樣 與實例1同樣地對透明 及耐化學品性進行特性坪價 中。 [實例4] 變更為環氧樹脂溶液(Β: 之方法而調製塗佈液。 性、耐光性、平±^ 。將該此之^/生、而才熱 〜<汗價結果示於 將環氧樹脂溶液(Β1)變 除此以外藉由與實例!同樣之方法衣氡樹脂溶液(Β3), ζ而調製塗佈液。 36 201237098 41171pif 興貝1夕,J丄H T水吧到处-k %性、平坦性、射轨性、 及耐化學品性進行特性評價。將該此 一 … 中。 Λ4之評價結果示於表7 [實例5] 將環氧樹脂溶液(B1)變更為環^ 除此以外藉由與實例i同樣之方法液(B4) ’ 與實例1同樣地對透明性、耐光托。、塗佈液。 及财化學品性進行躲評價。將該、平坦性、财熱性' 中。 Λ4之評價結果示於表7 [實例6] 將環氧樹脂溶液(Β1)變更為 除此以外藉由與實例丨同樣之方法⑻), 與實例1同樣地對透明性m隨塗佈液。 及对化學品性進行特性評價。_ L平域、耐熱性、 中。 a之3平價結果示於表7 [比較例1] 將環氧樹脂溶液⑻)變更為 . 除此以外藉由與實例i同樣之方 =冷液(C1), 與實例1同樣地對透明性、耐^塗佈液。 及财化學品性騎躲評價。將軌、耐熱性、 中。 砰知結果示於表7 [比較例2] 將環氧樹脂溶液(Bi)變更兔 除此以外藉㈣加吸妓(⑺, 37 7 201237098 41171pif » 同樣地對透明性、耐光性、平坦性、财熱性 而’匕子。aitit行特性評價。將該些之評價結果示於表 中。 [比較例3] 對,有赫翼之500 ml之可分離式燒瓶進行氮氣置 於錢瓶帽人合成例丨巾所得之聚祕胺酸溶液 Al) 100g、多官能且重量平均分子量不足3,麵之 樹脂TECHM〇RE VG31G1L (商品名;卩腿就,邮) 6〇g、偏苯三酸gf 6g'3·縮水甘油氧基丙基三甲氧基抑 4.8 g、IRGANOX 1〇1〇 (商品名;BASF坤⑽股份有限= 司)0.50 g、脫水純化之MMP 25〇 8 g,於室溫下進行5 = 時之攪拌’使其均勻溶解。其次,投入byK_344(商品名、 BYK-CHEMIE JAPAN K.K. ) 0.42 g,於室溫下進行 ^小時 之攪拌,藉由孔徑為0.2 μηι之薄膜過濾器進行過濾 制 塗佈液。 ·〜D〇 ^ 與實例1同樣地對透明性、耐光性、平坦性、耐熱性 及耐化學品性進行特性評價。將該些之評價結果示於表、 中。 、7NaOH treatment) 'In a mixture containing 36% hydrochloric acid / 60% nitric acid / water = 40 / 20 / 40 (weight ratio), 50 ° C for 3 minutes of impregnation treatment (called acid treatment in the daytime) , in N-mercapto-2-° ratio D each. The crucible treatment (hereinafter referred to as NMP treatment;) was carried out at 50 ° C for 3 minutes, and then reheated at 2 3 〇 T for 1 hour. The residual film ratio after reheating and the transmittance after reheating were measured. The residual film ratio after reheating was 95% or more, and the transmittance at 400 nm after reheating was 95% or more. The case where the residual film ratio after reheating is less than 95% or the transmittance after reheating is less than 95% is taken as X. Remaining film rate after reheating == (film thickness after reheating / film 35 before reheating 2012 20129898 41171pif thick) ΧίΟΟ [Example 2] 500 ml of separable flask with stirring wings was purged with nitrogen, The flask was charged with 100 g of the polyester phthalic acid solution (A2) obtained in Synthesis Example 2, 150 g of the epoxy resin solution (B1) obtained in Synthesis Example 3, 6 g of trimellitic anhydride, and 3-glycidoxypropyl c. 4.8 g of methoxymethoxy decane, IRGANOX 1010 (trade name; BASF Japan Co., Ltd.) 50·50 g, dehydrated and purified MMP 160.8 g, and stirred at room temperature for 5 hours to uniformly dissolve. Next, 0.42 g of BYK-344 (trade name, BYK-CHEMIE JAPAN K.K,) was placed, and the mixture was allowed to stand at room temperature for an hour, and the coating liquid was prepared by transitioning through a film filter having a pore size of 0.2 Å. The same as Example 1 is the same as Saki, Nana: Chemical resistance _ price. (Example 3) In the same manner as in Example 1, except that the epoxy resin solution (Bj) was used, the transparency and chemical resistance were evaluated in the properties of ping. [Example 4] Changed to an epoxy resin solution (Β: method to prepare a coating liquid. Properties, light resistance, flatness ± ^. This is the result of the heat, and the result of the sweat price is shown in In addition to the epoxy resin solution (Β1), the coating liquid was prepared by the same method as the example! The coating liquid was prepared by the coating of the resin solution (Β3). 36 201237098 41171pif Xingbei 1st, J丄HT water bar everywhere-k The properties of %, flatness, orbitality, and chemical resistance were evaluated. The evaluation results of Λ4 are shown in Table 7 [Example 5] The epoxy resin solution (B1) was changed to a ring ^ In the same manner as in Example 1, except for the method liquid (B4)', the transparency, the light resistance, the coating liquid, and the chemical property were evaluated in the same manner as in Example 1. The flatness and the finernity were evaluated. The results of the evaluation of Λ4 are shown in Table 7. [Example 6] The epoxy resin solution (Β1) was changed to the same method (8) as in Example ,, and the transparency m was applied in the same manner as in Example 1. Cloth liquid. And characterization of chemical properties. _ L flat domain, heat resistance, medium. The results of the 3rd parity of a are shown in Table 7 [Comparative Example 1] The epoxy resin solution (8) was changed to the same. The same as Example 1 except for the cold liquid (C1), the transparency was the same as in Example 1. , resistance to coating liquid. And financial chemical riding evaluation. Will rail, heat resistance, medium. The results are shown in Table 7. [Comparative Example 2] The epoxy resin solution (Bi) was changed to rabbits. (4) Adding and sucking ((7), 37 7 201237098 41171pif » Similarly, transparency, light resistance, flatness, The enthusiasm of the scorpion. Aitit line characteristic evaluation. The evaluation results of these are shown in the table. [Comparative Example 3] For the 500 ml separable flask with Heiyi, nitrogen was placed in the bottle cap For example, the polymyginic acid solution (Al) obtained by the towel is 100g, polyfunctional and the weight average molecular weight is less than 3. The resin TECHM〇RE VG31G1L (trade name; 卩 leg, post) 6〇g, trimellitic acid gf 6g '3·glycidoxypropyltrimethoxy 4.8 g, IRGANOX 1〇1〇 (trade name; BASF Kun (10) share limited = division) 0.50 g, dehydrated purified MMP 25〇8 g, at room temperature 5 = Stirring at the time to make it dissolve evenly. Next, 0.42 g of byK_344 (trade name, BYK-CHEMIE JAPAN K.K.) was placed, stirred at room temperature for ^ hours, and filtered to obtain a coating liquid by a membrane filter having a pore size of 0.2 μm. -D〇 ^ In the same manner as in Example 1, the properties of transparency, light resistance, flatness, heat resistance and chemical resistance were evaluated. The evaluation results of these are shown in the table. , 7

38 201237098 41171pif [表5] 成分 材料 實例4 (g) 實例5 (g) 實例6 (g) 聚酯醯胺酸 A1 100 100 100 環氧樹脂 B3 150 B4 150 B5 150 環氧硬化劑 偏笨三酸酐 6 6 6 偶合劑 3-GPMS 4.8 4.8 4.8 抗氧化劑 IRGANOX1010 0.50 0.50 0.50 溶劑 MMP 160.8 160.8 160.8 界面活性劑 BYK-344 0.42 0.42 0.42 [表6] 成分 材料 比較例1 (g) 比較例2 (g) 比較例3 (g) 聚酯醯胺酸 A1 100 100 100 環氧樹脂 C1 150 C2 150 TECHMORE VG3101L 60 環氧硬化劑 偏苯三酸酐 6 6 6 偶合劑 3-GPMS 4.8 4.8 4.8 抗氧化劑 IRGANOX1010 0.50 0.50 0.50 溶劑 MMP 160.8 160.8 160.8 界面活性劑 BYK-344 0.42 0.42 0.42 TECHMORE VG3101L : PRINTEC, INC. 3-GPMS : 3-縮水甘油氧基丙基三曱氧基矽烷 IRGANOX1010 : BASF Japan 股份有限公司 MMP : 3-甲氧基丙酸曱酯 BYK-344 : BYK-CHEMIE JAPAN K.K. 39 201237098 41171pif [表7] 評價項目 1 2 實 例 比較例 、 透明性 〇 0 ό 〇 4 〇 5 〇 6 0 1 〇 2 3 对光性 平坦性 耐熱性 〇 0 〇 〇 〇 〇 〇 〇 X 〇 〇 〇 0 〇 0 〇 X 0 〇 〇 〇 〇 〇 X 〇 0 耐化學品性 〇 — 1一~~ 0 L" 一 0 〇 〇 〇 X 〇 〇 1 ""I — 根據表7中所示之結果可知:實例1〜實例ό之硬化 膜之耐光性、平坦性優異,進一步於透明性、耐熱性、及 耐化學,性之所有方面中獲得平衡。另一方面,比較例1 之使用藉由使曱基丙烯酸縮水甘油酯與單官能曱基丙烯酸 酯反應而獲得之環氧樹脂的硬化膜雖然耐光性、平坦性優 異’但耐熱性、耐化學品性差。比較例2之使用具有5〇,〇〇〇 以上子量之環氧樹脂(藉由使甲基丙烯酸縮水甘油酯 與2官能甲基丙烯酸酯反應而獲得之環氧樹脂)的硬化膜 之平坦性差。而且,比較例3之使用多官能且重量平均分 子量不足3,〇〇〇之環氧樹脂的硬化膜之耐光性差。如上所 述,僅僅於使用藉由使曱基丙烯酸縮水甘油酯與2官能甲 基丙烯酸酯反應而獲得之環氧樹脂(重量平均分子量為 1,000〜50,〇〇〇)之情形時滿足所有特性。 [產業上之可利用性] 藉由本發明之熱硬化樹脂組成物而獲得之硬化膜於透 明性、耐光性、及耐濺鍍性等作為光學材料之特性方面亦 優異,自此方面考慮,可用作彩色濾光片、LED發光元件 及光接收元件等各種光學材料等之保護膜、以及TFT與透 明電極間及透明電極與配向膜間所形成之透明絕緣膜二 201237098 41171pif 【圖式簡單說明】 無。 【主要元件符號說明】 〇 〇»>38 201237098 41171pif [Table 5] Ingredient Material Example 4 (g) Example 5 (g) Example 6 (g) Polyester phthalic acid A1 100 100 100 Epoxy resin B3 150 B4 150 B5 150 Epoxy hardener 6 6 6 Coupler 3-GPMS 4.8 4.8 4.8 Antioxidant IRGANOX1010 0.50 0.50 0.50 Solvent MMP 160.8 160.8 160.8 Surfactant BYK-344 0.42 0.42 0.42 [Table 6] Component Materials Comparative Example 1 (g) Comparative Example 2 (g) Comparison Example 3 (g) Polyester phthalic acid A1 100 100 100 Epoxy resin C1 150 C2 150 TECHMORE VG3101L 60 Epoxy hardener trimellitic anhydride 6 6 6 Coupler 3-GPMS 4.8 4.8 4.8 Antioxidant IRGANOX1010 0.50 0.50 0.50 Solvent MMP 160.8 160.8 160.8 Surfactant BYK-344 0.42 0.42 0.42 TECHMORE VG3101L : PRINTEC, INC. 3-GPMS : 3-glycidoxypropyl trimethoxy decane IRGANOX1010 : BASF Japan MMP : 3-methoxypropionic acid Oxime ester BYK-344 : BYK-CHEMIE JAPAN KK 39 201237098 41171pif [Table 7] Evaluation item 1 2 Example comparison example, transparency 〇0 ό 〇4 〇5 〇6 0 1 〇2 3 Pair of light flat Frank heat resistance 〇0 〇〇〇〇〇〇X 〇〇〇0 〇0 〇X 0 〇〇〇〇〇X 〇0 Chemical resistance 1—1~~~ 0 L" A 0 〇〇〇X 〇 〇1 ""I - According to the results shown in Table 7, the cured films of Examples 1 to ό are excellent in light resistance and flatness, and further in all aspects of transparency, heat resistance, and chemical resistance. Get balanced. On the other hand, in the comparative example 1, the cured film of the epoxy resin obtained by reacting glycidyl methacrylate with a monofunctional thiol acrylate has excellent light resistance and flatness, but heat resistance and chemical resistance. Poor sex. In Comparative Example 2, the cured film of the epoxy resin having an amount of 5 Å or more of 〇〇〇 (the epoxy resin obtained by reacting glycidyl methacrylate with a bifunctional methacrylate) was poor in flatness. . Further, in Comparative Example 3, the polyfunctional weight was used and the weight average molecular weight was less than 3, and the cured film of the epoxy resin of the ruthenium was inferior in light resistance. As described above, all of the cases are satisfied when the epoxy resin (weight average molecular weight is 1,000 to 50, 〇〇〇) obtained by reacting glycidyl methacrylate with a bifunctional methacrylate is used. characteristic. [Industrial Applicability] The cured film obtained by the thermosetting resin composition of the present invention is excellent in transparency, light resistance, sputtering resistance, and the like as an optical material, and is considered to be excellent in this respect. It is used as a protective film for various optical materials such as color filters, LED light-emitting elements, and light-receiving elements, and a transparent insulating film formed between a TFT and a transparent electrode and between a transparent electrode and an alignment film. 201237098 41171pif 】 No. [Main component symbol description] 〇 〇»>

Claims (1)

201237098 41171pif 七、申請專利範圍: 1· 一種熱硬化性樹脂組成物,其是包含聚酯醯胺酸、 環氧樹脂、及環氧硬化劑之樹脂組成物,其特徵在於:聚 酯醯胺酸是藉由以四羧酸二酐、二胺、及多元羥基化合物 為必需之原料成分進行反應而獲得,且藉由使X莫耳之四 敌酸二軒、γ莫耳之二胺及z莫耳之多元羥基化合物以下 述式(1)及式(2)之關係成立之比率進行反應而獲得之 聚酯醯胺酸, 0.2SZ/YS8.0 …… (1) 0.2^ (Y + Z) /X^1.5 ...... ⑵ 環氧樹脂是藉由以(曱基)丙烯酸縮水甘油酯與2官能 (甲基)丙烯酸酯為必需之原料成分進行反應而獲得之重量 平均分子量為1,〇〇〇〜5〇,〇〇〇之環氧樹脂,相對於聚酯醯 胺酸100重量份而言,環氧樹脂為20重量份〜400重量 份’相對於環氧樹脂1〇〇重量份而言,環氧硬化劑為〇重 量份〜60重量份。 2.如申請專利範圍第1項所述之熱硬化性樹脂組成 物,其中’所述聚酯醯胺酸是藉由以四羧酸二酐、二胺、 多元羥基化合物及1元醇為必需之廣料成分進行反應而獲 得之反應生成物。 3·如申請專利範圍第2項所述之熱硬化性樹脂組成 物,其中,所述1元醇是選自異丙醸、丙烯醇、苯曱醇、 曱基丙稀酸經基乙I旨、丙二醇單乙祕及3-乙基·3_經基甲基 環氧丙院之1種以上。 42 201237098 41171pif 4. 如申請專利範圍第1項至第3項中任一項所述之熱 硬化性樹脂組成物,其中,所述聚酯醯胺酸是進一步添加 苯乙烯-馬來酸酐共聚物作為原料成分進行反應而獲得之 聚酉旨酿胺酸。 5. 如申請專利範圍第1項至第3項中任一項所述之熱 硬化性樹脂組成物,其中,所述聚酯醯胺酸具有下述通式 (3)及通式(4)所表示之結構單元; 〇 II -C201237098 41171pif VII. Patent Application Range: 1. A thermosetting resin composition which is a resin composition comprising a polyester phthalic acid, an epoxy resin, and an epoxy hardener, characterized in that a polyester lysine It is obtained by reacting a tetracarboxylic dianhydride, a diamine, and a polyvalent hydroxy compound as essential raw material components, and by making X Moer's four diacids, dioxane, gamma molar diamine, and z mo Polyester phthalic acid obtained by reacting a polyvalent hydroxy compound of the ear with a ratio of the following formula (1) and formula (2), 0.2SZ/YS8.0 (1) 0.2^ (Y + Z) /X^1.5 (2) The epoxy resin is obtained by reacting glycidyl (meth) acrylate with a bifunctional (meth) acrylate as a necessary raw material component to obtain a weight average molecular weight of 1 , 〇〇〇~5〇, 环氧树脂 epoxy resin, relative to 100 parts by weight of polyester lysine, epoxy resin is 20 parts by weight to 400 parts by weight 'relative to epoxy resin 1 〇〇 weight The epoxy hardener is -60 parts by weight in parts by weight. 2. The thermosetting resin composition according to claim 1, wherein the polyester phthalic acid is required by using a tetracarboxylic dianhydride, a diamine, a polyvalent hydroxy compound, and a monohydric alcohol. The reaction product obtained by the reaction of the broad component is carried out. The thermosetting resin composition according to claim 2, wherein the monohydric alcohol is selected from the group consisting of isopropyl hydrazine, acryl alcohol, benzoquinone, and mercapto acrylate. One or more kinds of propylene glycol monoethyl amide and 3-ethyl·3_ mercaptomethyl epoxide. The thermosetting resin composition according to any one of claims 1 to 3, wherein the polyester phthalic acid is further added with a styrene-maleic anhydride copolymer. A polyglycolic acid obtained by a reaction as a raw material component. 5. The thermosetting resin composition according to any one of claims 1 to 3, wherein the polyester phthalic acid has the following general formula (3) and formula (4) The structural unit represented; 〇II -C 0 ϋ:—N: η—r (3) Η HOOC COOH Ο Ο (4) -0— II II , —c、 ^C—Ο—R3- HOOC COOH 此處,R1是四羧酸二酐殘基,R2是二胺殘基’ R3是多 元羥基化合物殘基。 6. 如申請專利範圍第1項至第3項中任一項所述之熱 硬化性樹脂組成物,其中,所述聚酯醯胺酸之重量平均分 子量為 1,000〜200,000。 7. 如申請專利範圍第1項至第3項中任一項所述之熱 硬化性樹脂組成物,其中,所述四缓酸二針是選自3,3',4,4,-二苯基砜四曱酸二酐、3,3,,4,4,-二苯基醚四曱酸二酐、 [雙(3,4-二羧基苯基)]六氟丙烷二酐及乙二醇雙(脫水偏 43 201237098 41171pif 本二酸酯)之1種以上。 麟!^申請專利·第1項至第3射任—項所述之熱 苯細及1組成物,其中’所述二胺是選自3,3,-二胺基二 本基風及雙[4_(3·胺基苯氧基)苯基]硬之1種以上。 9·如申請專利範圍第i項至第3項中=所述之敎 硬:性r組成物,其中,所述多元合:= 一醉内一醇、1,4-丁二醇、1 5-Λ -龄 1 < 1 庚二醇及W辛二醇之i種以上。—卜,·己二醇、H 婦lit巾請專利範圍第1項至第3項中任-項所述之 i選自乙:組成物,其中,所述2官能(曱基)丙稀酸酉旨 t —醇一(甲基)丙烯酸酯、二乙二醇二(曱基 酉曰、1,4-丁二醇二(甲基)酸 稀酸醋、新戊二醇甲編,絲狀,丁一醉一(曱基)丙 (甲基)丙稀_旨之=)丙她旨、三環癸院二曱醇二 ㈣專鄕圍第1項至第3射任-項所述之 :、==,’其中,所述環氧硬化劑是選自偏苯 一酸肝及/、氫偏本三酸酐之1種以上。 物,^ 1項㈣之侧_脂組成 酐,所述二胺是3 是j,3,,4,4,_二苯基驗四甲酸二 物是14_ ,〜胺基一本基砜,所述多元羥基化合 與14-V二2述環氧樹脂是甲基丙稀酸縮水甘油醋 脂之重量平均=烯酸脂或丁二醇二甲基内烯酸 t00ZT00 1 為溶劑。 —·讀’進—步含有3-甲氧基丙酸甲酉旨作 201237098 41171pif ^如申請專利範圍第2項所述之熱硬化性樹脂組成 物Ί ’所述四麟二gf是3,3,,4,4,_二笨基喊四甲酸二 肝:所述二胺是3,3,_二胺基二苯基石風,所述多元經基化合 物是1,4-丁二醇,所述丨元醇是苯甲醇,所述環 : f基丙烯酸縮水甘油醋與i,丁二醇二甲基丙烯酸脂或 ^3-丁二醇二甲基丙烯酸脂之重量平均分子量為丨,㈨〇二 M),000之共聚物,所述環氧硬化劑是偏苯三酸酐,進一步 含有3-曱氧基丙酸曱酯作為溶劑。 , 14. 一種硬化膜,其是由如申請專利範圍第丨項至第 13項中任一項所述之熱硬化性樹脂組成物而獲得。、 一種彩色濾光片,其使用如申請專利範圍第14項 所述之硬化膜作為保護膜。 —種液晶顯示元件,其使用如申請專利範 項所述之彩色濾光片。 17. 種固體攝影元件,其使用如申請專利範圍第μ 項所述之彩色濾光片。 18. 種液晶顯示元件,其使用如申請專利範圍第μ 項所述之硬化膜作為TFT肖透明電極間所%成之透明絕緣 膜0 19. 一種液晶顯示元件,其使用如申請專利範圍第14 項所述之硬化膜作為翻電極減向朗卿成之透明絕 緣膜。 、 20. 種LED發光體,其使用如申請專利範圍第 項所述之硬化膜作為保護膜。 45 201237098 41171pif 四、 指定代表圖: (一) 本案指定代表圖為:無。 (二) 本代表圖之元件符號簡單說明: 無。 五、 本案若有化學式時,請揭示最能顯示發明特徵 的化學式: 命〇0 ϋ:—N: η—r (3) Η HOOC COOH Ο Ο (4) -0—II II , —c, ^C—Ο—R3- HOOC COOH Here, R1 is a tetracarboxylic dianhydride residue R2 is a diamine residue 'R3 is a residue of a polyvalent hydroxy compound. 6. The thermosetting resin composition according to any one of claims 1 to 3, wherein the polyester glutamic acid has a weight average molecular weight of 1,000 to 200,000. 7. The thermosetting resin composition according to any one of claims 1 to 3, wherein the four acid-lowering needles are selected from the group consisting of 3, 3', 4, 4, - Phenyl sulfone tetraphthalic acid dianhydride, 3,3,,4,4,-diphenyl ether tetraphthalic acid dianhydride, [bis(3,4-dicarboxyphenyl)]hexafluoropropane dianhydride and ethylene One or more types of alcohol double (dehydration partiality 43 201237098 41171pif diester). Lin! ^Application for a patent, Item 1 to 3, and the composition of the hot benzene and 1 composition, wherein the diamine is selected from the group consisting of 3,3,-diaminodi-based wind and double One or more kinds of [4_(3·aminophenoxy)phenyl] are hard. 9. The scope of the patent application range i to 3 = the hard: r composition, wherein the multiple: = a drunk monol, 1,4-butanediol, 15 - Λ - Age 1 < 1 Hep or more of heptanediol and W octanediol. —b,···································酉 t t - alcohol mono (meth) acrylate, diethylene glycol bis (indenyl hydrazine, 1,4-butanediol di (meth) acid dilute vinegar, neopentyl glycol A, filament , Ding Yi drunk one (曱基), propyl (meth) propyl _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ In the above, the epoxy curing agent is one or more selected from the group consisting of heparan-acid liver and/or hydrogen-terminated tris. , the side of the item (4), the composition of the acid, the diamine is 3, the j, 3, 4, 4, _ diphenyl tetracarboxylic acid is 14_, ~ amine-based sulfone, The polyhydric hydroxyl group and the 14-V di-epoxy resin are the weight average of methyl methacrylate glycidyl acrylate = enoate or butanediol dimethyl endoic acid t00ZT00 1 as a solvent. -·Reading 'Step-in-containing 3-methoxypropionic acid formazan as 201237098 41171pif ^The thermosetting resin composition as described in claim 2 of the patent scope Ί 'The four lining gf is 3,3 , 4, 4, _ two stupid shouting tetracarboxylic acid liver: the diamine is 3,3,-diaminodiphenyl stone, the polybasic compound is 1,4-butanediol, The hydrazine alcohol is benzyl alcohol, and the ring: the weight average molecular weight of the f-based glycidic vinegar and the i, butanediol dimethacrylate or the 3-butanediol dimethacrylate is 丨, (9) 〇 A copolymer of two M),000, the epoxy hardener is trimellitic anhydride, and further contains decyl 3-methoxyoxypropionate as a solvent. A hardened film obtained by the thermosetting resin composition according to any one of the above claims. A color filter using the cured film as described in claim 14 of the patent application as a protective film. A liquid crystal display element using a color filter as described in the patent application. 17. A solid-state photographic element using a color filter as described in the scope of claim μ. 18. A liquid crystal display element using a cured film as described in the item [51] of the patent application as a transparent insulating film constituting a TFT between transparent electrodes. 19. A liquid crystal display element, which is used as in the patent application. The sclerosing film described in the item is used as a transparent insulating film for the reverse electrode. 20. An LED light-emitting body using the cured film as described in claim No. 1 as a protective film. 45 201237098 41171pif IV. Designated representative map: (1) The representative representative of the case is: None. (2) A brief description of the component symbols of this representative figure: None. 5. If there is a chemical formula in this case, please reveal the chemical formula that best shows the characteristics of the invention:
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TWI663187B (en) * 2014-05-15 2019-06-21 日商捷恩智股份有限公司 Thermosetting compositions, cured films, color filters, liquid crystal display elements, solid-state imaging elements and led luminous bodies
TWI746707B (en) * 2017-01-31 2021-11-21 日商日本化藥股份有限公司 Reactive polycarboxylic acid compound, active energy ray curable resin composition using the same, cured article of the composition and use of the cured article

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