TW201035230A - Resin composition for forming protective film and protective film of color filter - Google Patents

Abstract

The present invention provides a resin composition for forming protective film. The protective film has high surface smoothness on the substrate and various excellent properties, such as transparent, heat-resistant and so on based on the non-smooth the surface, even though the coating method is a slit coating method. The solution of the present invention is to provide a resin composition for forming protective film comprising: (A) a polymer having a repeating unit from epoxy group-comprising polymerized unsaturated compound (B) at least one of compound selected from the group consisting polyvalence carboxylic anhydride polyvalence carboxylic acid, (C) a specific polymer having a polysiloxane chain, (D) a compound having more than two cations polymeric group, and (E) a alkoxysilane compound having a epoxy group.

Description

[Technical Field] The present invention relates to a resin composition for forming a protective film and a protective film for a color filter. [Prior Art] In a display element such as a liquid crystal display element, immersion treatment by a solvent, an acid or an alkali solution or the like is performed in the production step, and when a wiring electrode layer is formed by sputtering, The surface of the component is partially exposed to high temperatures. In order to prevent deterioration or damage of the element by such treatment, the needle is provided with a protective film made of a film having a resistance on the surface of the element. In such a protective film, it is required to have the following properties: for the substrate or the lower layer for forming the protective film, and further the layer formed on the protective film, the adhesion is high; the film itself is smooth and strong; Transparency; High heat resistance and light resistance. It does not cause deterioration of coloring, yellowing, whitening, etc. over a long period of time; it has excellent water resistance, solvent resistance, acid resistance and alkali resistance. In order to form a protective film material which satisfies such various characteristics, a resin composition for forming a protective film containing a polymer having a glycidyl group is known (see Patent Document 1 and Patent Document 2). In the resin composition for forming a protective film, the resin composition for forming a protective film is applied to the surface of the substrate for forming a protective film, and the protective film can be formed by heat-treating the coating film and then curing. However, in comparison with the twisted nematic (TN) type color liquid crystal display element, the uniformity of the cell gap in the super-twisted nematic (STN) type color liquid crystal display element is extremely important. Therefore, the substrate which can be used for the STN type color liquid crystal display element is required to have a high flatness of the surface. When a substrate having a low surface flatness is used, display unevenness occurs in the obtained liquid crystal display element. For example, on the substrate (the substrate to which the color filter is formed) formed on the color filter, irregularities due to the color filter are formed on the surface. In addition, when a protective film is formed by using a conventional resin composition for forming a protective film on a substrate to which the color filter is attached, even if a resin composition for forming a protective film having superior planarization properties is used, It is also impossible to sufficiently eliminate irregularities caused by the color filter, and some slight irregularities remain on the surface of the protective film. So far, even this degree of flatness is still allowed. However, due to the high image quality and high definition requirements in recent years, the occurrence of some micro-color unevenness is not allowed, and the comparison has been demanded. Therefore, higher flatness has been demanded on the substrate used for the liquid crystal display element, and the conventional resin composition for forming a protective film cannot meet such a requirement, and it is still remarkable. In addition, in recent years, with the trend of large-screen televisions and the reduction in manufacturing cost, the size of the substrate glass used for the manufacture of color filters has been increasing. Therefore, in the coating step of the resin composition for forming a protective film which is formed when the protective film is formed on the substrate, the conventional spin coating method which has been widely used has become difficult, and the coating method has been changed from the slit shape. The so-called slit coating method in which the nozzle ejects the composition and is applied. Compared with the spin coating method, the slit coating method has an amount capable of reducing the amount of the composition required for coating, and contributes to a reduction in the cost of manufacturing the liquid crystal display device. However, in such a slit coating method, since the microfilm 201035230 is used to support the number of dots of the substrate while forming a coating film, the film is formed by the micro unevenness of the supporting needle on the coating film. The situation that will occur will become an obstacle to achieving the above-mentioned high degree of flatness. Patent Document 1: Japanese Laid-Open Patent Publication No. Hei No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. The object of the present invention is to provide a protective film for a resin composition for forming a protective film, which can be applied to a substrate having a non-flat surface even in the case of a slit coating method. A protective film that forms a highly flat surface and has various properties such as superior transparency and heat resistance; and provides a protective film of a color filter having a high surface flatness and superior transparency. Various properties such as heat resistance. Means for Solving the Problems The above objects and advantages of the present invention are as follows: (1) having a repeating unit derived from a polymerizable unsaturated compound containing an epoxy group, by a resin composition for forming a protective film. The polymer (hereinafter referred to as "(A) polymer"); (B) at least one compound selected from the group consisting of a polyvalent carboxylic acid anhydride and a polyvalent carboxylic acid (hereinafter, referred to as "(B) (C) a copolymer of the following composition having a weight average molecular weight of 5,000 to 25,000 (hereinafter referred to as "(C) polymer)": (cl) Formula (1) The compound (hereinafter referred to as "(cl) 201035230 compound") is 25 to 35 mass%, and (c2) is a compound represented by the following formula (2) (hereinafter referred to as "(C2) compound"). 20 to 30% by mass, (c 3 ) a polymerizable unsaturated compound having a group represented by the following formula (3) (hereinafter referred to as "(c3) compound") 15 to 20% by mass, (c4) having A polymerizable unsaturated compound having an alkyl group having 1 to 8 carbon atoms (hereinafter referred to as "(c4) (2) 5 to 35 mass%, and (c5) - a polymerizable unsaturated compound having two or more unsaturated bonds in the molecule (hereinafter referred to as "(C5) compound"). (D) a compound having two or more cationically polymerizable groups (however, in addition to the (A) polymer): and (E) an alkoxydecane compound containing an epoxy group: CH2=CR1COOCH2CH2C8Fi7 (1) (In the formula (1), R1 is a hydrogen atom or a methyl group); CH2=CR2COO (C2H4O) aR3 (2) 〇 (in the formula (2), R2 is a hydrogen atom or a methyl group, and R3 is a methyl group, Ethyl, propyl or butyl, a repeating unit number, the average number of 値 is 4~12); / R5 \ R5 R7 R4_j_Sj-〇--〇j-〇-si (3) \ R6 /b R6 R8 (In the formula (3), R4, R5, R6, R7 and R8 are each independently carbon 201035230, an alkyl group having 1 to 20 atoms, a phenyl group or a group represented by the following formula (4), and b is 0 to 3; Integer);

(In the formula (4), R9, R1G and R11 are each independently an alkyl group having 1 to 20 carbon atoms or a phenyl group, and C is an integer of 0 to 3). The above objects and advantages of the present invention are attained by the protective film of the color filter formed by the resin composition for forming a protective film. [Effects of the Invention] According to the present invention, a resin composition for forming a protective film is provided, and even if a coating method is employed, a high flatness can be formed on the substrate with respect to a substrate having a non-flat surface. Protective film with excellent surface properties and excellent transparency, heat resistance, etc.; and provides a protective film for color filters, high flatness surface, and superior transparency, heat resistance, etc. Various properties. [Embodiment of the Invention] Hereinafter, the present invention will be specifically described. <Resin composition for forming a protective film> The resin composition for forming a protective film of the present invention contains the above (A) polymer, (B) compound, (C) copolymer, (D) compound and (E) compound. . In addition to the above-mentioned respective components, the protective film forming tree 201035230 may be optionally contained in the fat composition of the present invention. (F) The component of the resin for forming a protective film of the present invention is dissolved in a solvent and contains (A) a polymer. And (C) a copolymer and a solvent, and if necessary, (F) a second liquid of the (B) compound and the solvent, and then used as a liquid. It is used as a two-component protective film. 〇 [(A) polymer] (A) polymer in the present invention is a repeating unit (A) of a polymerizable unsaturated compound. The polymer may be a polymer containing only a ring or may be a compound. In combination with other polymerizable unsaturated groups, the above epoxy group may be mentioned, for example, (meth)acrylic acid propylene acrylate, α-n-propyl propylene acrylate, α (meth) acrylate- 3,4-epoxybutyl ester, ester, (meth)acrylic acid-6,7-epoxyheptyl heptyl ester, o-vinylbenzyl epoxypropyl ether, p-vinylbenzyl epoxypropyl ether, 3_ Among the compounds such as methyl butylene oxide and 3-ethyl-3-(methyl)propyl, (meth)acrylic acid-6,7-epoxyheptyl ester, hardening accelerator is preferably exemplified. Preferably, the composition is prepared by the above-mentioned materials, more preferably into a first liquid which is divided into (D) compound and an accelerator, and is mixed with the resin composition for storage and use. Further, a polymer derived from an epoxy group-containing polymer is used. A total of polymerizable unsaturated compounds of a polymerizable unsaturated epoxy group of an oxy group. I. Unsaturated compound, lecan ester, α-ethyl acrylate, propylene-n-butyl acrylate, α-ethyl acrylate, 3,4-epoxybutyl acrylate, α-ethyl acrylate -6,7-cyclovinylvinyl epoxide propyl ether, -3-(methyl)propyl decanoyloxymethyl olefin oxymethyl butylene oxide, etc. : methyl acrylate propyl acrylate, O-vinylbenzylepoxypropyl ether, 201035230 ethylene benzyl epoxy propyl ether, p-vinylbenzyl epoxy propyl ether, 3-methyl-3-(methyl) propylene oxime methyl epoxide Alkane and 3-ethyl-3-(meth)acryloyloxymethyl butylene oxide. Since the copolymerization reactivity of these compounds is high, it is preferably used to improve the heat resistance or surface hardness of the formed protective film. These epoxy group-containing polymerizable unsaturated compounds can be used singly or in combination of two or more kinds. The other polymerizable unsaturated compound may be exemplified by 〇, for example, an ester of (meth)acrylic acid or a vinyl aromatic compound. Examples of the (meth)acrylic acid ester include methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, and 2-ethylhexyl (meth)acrylate. Phenyl (meth) acrylate, cyclohexyl (meth) acrylate, (5) 1.02 1.02' decane-8-yl ester, (meth) acrylate [5.2.1.02'6] decane -8-yloxyethyl ester, isodecyl (meth)acrylate, etc.; the above-mentioned vinyl aromatic compound may, for example, be phenyl phenyl maleic anhydride imide, N-cyclohexyl maleic anhydride imide, Styrene, p-methoxy styrene, α-methyl styrene, p-methyl styrene, vinyl naphthalene, and the like. Among these compounds, preferred are methyl methacrylate, methacrylic acid [5.2.1.02,6]nonane-8-yl ester, >^-phenylmaleic anhydride imide, hydrazine- Cyclohexyl maleic anhydride imide, styrene and p-methoxyphene. These preferred other polymerizable unsaturated compounds have high copolymerization reactivity. These other polymerizable unsaturated compounds can be used singly or in combination of two or more. -10- 201035230 The content of the repeating unit derived from the polymerizable unsaturated compound having an epoxy group in the (A) polymer is preferably from 10 to 70% by mass, particularly preferably from 20 to 10,200% by weight. ~60% by mass. If the enthalpy exceeds 70% by mass, the storage stability of the obtained first liquid may be impaired; on the other hand, if the enthalpy is less than 1% by mass, the heat resistance of the formed protective film is obtained. Or the surface hardness will be insufficient. The weight average molecular weight (hereinafter, simply referred to as "heavy" amount average molecular weight" or "Mw" measured by a gel permeation chromatography (GPC) for (A) polymer. It is preferably in the range of 2.000 to 20,000. When the (A) polymer having a Mw of less than 2,000 is used, the coating property of the obtained resin composition for forming a protective film is impaired. On the other hand, the Mw of the (A) polymer exceeds 20,000. At the time, there is a case where the preservation stability of the obtained first liquid is insufficient. The Mw of the (A) polymer is more preferably 2,000 or more and less than 10,000 from the viewpoint of obtaining a protective film having extremely high surface flatness. (A) Molecular weight distribution of the polymer (Mw/Mn: However, the number average molecular weight in terms of polystyrene by GPC measured by GPC. The same applies hereinafter.) It is preferably 1 to 4, more preferably 1 to 1. 3. Such a (Α) polymer is a polymerizable unsaturated compound having an epoxy group or a polymerizable unsaturated compound having an epoxy group and the like in the presence of a polymerization initiator in a preferred suitable solvent. The polymerizable unsaturated compound can be produced by polymerization or copolymerization. The solvent which can be used herein is preferably, for example, diethylene glycol, propylene glycol alkyl acetate, ethylene glycol alkyl ether acetate, diethylene glycol dialkyl ether, -11-201035230, particularly preferably diethyl 2 Alcohol ethyl methyl ether, propylene glycol methyl ether propylene glycol ethyl ether acetate, diethylene glycol dimethyl ether, ethylene glycol ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol dimerization As the initiator, a conventionally known radical agent can be used. Examples thereof include an azo compound and an organic hydrogen peroxide. Specific examples of these 'individually, the above azo: for example, 2,2'-azobisisobutyronitrile, 2,2,-azobis(2,4-nitrile), 2,2'- Azobis(4-methoxy-2,4-dimethylvaleronitrile)' The above organic peroxides may, for example, be benzoyl peroxide, lauric acid peroxybutyric acid, or tertiary butyl peroxybutyrate, 1 1'_double (peroxane tricyclohexane, etc.) In the case of using an organic peroxide or hydrogen peroxide as a radical polymerization, these radical polymerization initiators may be combined as a redox polymerization initiator. [(B) compound] The compound (B) in the present invention is at least one compound selected from the group consisting of a polyvalent carboxylic anhydride and a polyfluorene. This (Β) acts as a hardener pair (A) polymer. In the above, examples of the polyvalent carboxylic acid anhydride include a group of a dicarboxylic acid anhydride, an alicyclic polyvalent carboxylic acid dianhydride, an aromatic polyvalent acid anhydride ester group, and the like. For example, the family dicarboxylic acid anhydride may, for example, be itaconic anhydride, succinic anhydride, lanolinate, succinic anhydride, tricarbonyl anhydride, maleic anhydride , hexaic anhydride, tetrahydrophthalic anhydride, norbornene diacid acetate, alcohol monobutyl ethyl ether. Polymerization initiators and copolymers can be listed as dimethyl pentane; acid, peroxygen The butyl) initiator is a compound of a carboxylic acid with a reducing agent, for example, a fatty carboxylic acid anhydride, the above fatty acid anhydride, hydrogenated o-benzene: (Himic -12-201035230 anhydride), and the like; and the alicyclic polyvalent carboxylic acid anhydride is exemplified by: For example, 1,2,3,4-butanetetracarboxylic dianhydride, cyclopentane tetracarboxylic dianhydride, etc.; the aromatic polyvalent carboxylic acid anhydride, for example, phthalic anhydride, pyromellitic anhydride, trimellitic anhydride, Examples of the acid anhydride-containing acid anhydride include, for example, ethylene glycol trimellitic anhydride ester and glycerol trimellitic anhydride ester. Among these polyvalent carboxylic anhydrides, aromatic polyvalent carboxylic acid anhydrides are particularly preferable from the viewpoint of further excellent heat resistance C) of the formed protective film. Examples of the polyvalent carboxylic acid include, for example, an aliphatic polyvalent carboxylic acid, an alicyclic polyvalent carboxylic acid, an aromatic polyvalent carboxylic acid, and the like, and specific examples of the polyvalent carboxylic acid, individually, the above Examples of the aliphatic polyvalent carboxylic acid include succinic acid, glutaric acid, adipic acid, butane tetracarboxylic acid, maleic acid, itaconic acid and the like; and the above alicyclic polyvalent carboxylic acid may, for example, be exemplified by Hexahydrophthalic acid, 1,2-cyclohexanedicarboxylic acid, 1,2,4-cyclohexanetricarboxylic acid, cyclopentanetetracarboxylic acid, etc.; Ο The above aromatic polyvalent carboxylic acid can be exemplified by: For example, phthalic acid, isophthalic acid, terephthalic acid, trimellitic acid, pyromellitic acid, 1,2,5, 8-naphthalenetetracarboxylic acid and the like. Among these polyvalent carboxylic acids, an aromatic polyvalent carboxylic acid is preferable from the viewpoint of the reactivity of the obtained resin composition for forming a protective film, the heat resistance of the formed protective film, and the like. These polyvalent carboxylic anhydrides or polyvalent carboxylic acids can be used singly or in combination of two or more. The use ratio of the compound (B) in the resin composition for forming a protective film of the present invention-13-201035230 is preferably from 1 to 100 parts by mass, more preferably from 3 to 100 parts by mass based on 100 parts by mass of the (A) polymer. 50 parts by mass. When the ratio of use of the compound (B) is less than 1 part by mass, the formed protective film fails to have a sufficient crosslinking density, and the various kinds of the protective film are insufficient. On the other hand, when the ratio of use of the compound (B) exceeds 100 parts by mass, a large amount of unreacted compound (B) remains in the formed protective film, and as a result, the property of the protective film becomes unstable. The object, or the adhesion of the protective film, will reduce the substrate. 〇 [(C) copolymer] The (C) copolymer in the present invention is a copolymer of the above (cl) compound, (C2) compound, (c3) compound, (C4) compound and (c5) compound, in the present invention In the resin composition for forming a protective film, the function as a surfactant having a high surface tension reduction performance is exhibited, and even when the copolymer is used in a small ratio, the surface flatness of the formed protective film can be remarkably improved. The compound of the above (c 1 ) may, for example, be a compound represented by the following formulas (c 1 · 1 ) ^ and (cl-2), and the like. Ch2 = chcooch2ch2 (cf2) 7CF3 (c 1 - 1) ch2 = c (ch3) cooch2ch2 (cf2) 7CF3 (c 1-2) The above compound (c2) is a compound different from a) in the above formula (2) For the mixture, the average number of a is 4 to 12. The a-lanthanum is a polystyrene-converted number average molecular weight measured by a gel permeation chromatography for the (c2) compound, and can be obtained by calculation. Such a (c2) compound can be suitably used as a commercial product, and an example thereof can be described in the following -14-201035230. For example, NK-esters M-40G, M-90G, AM-90G, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.; BLENMER pME 2〇〇, PME-400, PME-5 5 0, etc. In the above formula (3), when there are a plurality of R6 and R6, each R5 may be the same or different, and each R6 may be the same or different. Further, in the above formula (4), R1〇 When there are a plurality of Rii, each Rie may be the same or different; each Rl! may be the same or different. D The above (C3) compound is in the above formula (3), and R4, R5 and r6 are preferably respectively The alkyl group having 1 to 20 carbon atoms or a phenyl group, and each of R7 and R8 is preferably a polymerizable unsaturated compound having a group represented by the above formula (4). The compound (c3) is preferably the following formula (c3). -1 ) Compounds shown:

Rsi 2)d H (c Rc I CM o 2 π2 c c3 (in the formula (c3-l), Rsi is a group represented by the above formula (3), R12 is a hydrogen atom or a methyl group, and d is a group 1 to 3 More specific examples of the compound (c3) include the compounds of the following formula (C3-1-1) to (C3-1-3): -15- 201035230

·〇

Me

Me I — C C—CH〇II 〇 (C3-1-1 )

Si—O I Me MeI Si——O——Si——(CH2)3

Me

O HI c—c=ch2II o (C3-1-2) 16- 201035230

(In the above formula, Me is a methyl group, Ph is a phenyl group, and r, s and t are each an integer of 〇3). The (e4) compound may, for example, be methyl (meth)acrylate having an alkyl group having 1 to 8 carbon atoms; specific examples thereof include methyl methacrylate and 2-ethylcyclohexane acrylate. Ester and the like. Specific examples of the compound (c 5 ) include, for example, a compound obtained by methacrylizing both ends of a tetrabutylene glycol, a polyethylene glycol having a polymerization degree of 1 to 20, and a polymerization degree of 1 to 20; Polypropylene glycol and the like. A commercially available product can be suitably used as the compound (C5), and specific examples thereof include NK-ester 1G, 2G, 3G, 4G, 9Q, 14G, and 3G manufactured by Shin-Nakamura Chemical Industry Co., Ltd. Wait. The individual (c 1 ), (c 2 ), (c 3 ), (c 4 ) and (C5 ) compounds derived from the (C) copolymer are combined with respect to the total of all repeating units. The ratio of repeating units is 25 to 35 wt% for (c 1 ) -17 to 201035230, 20 to 30 wt% for (c2) compound, and 15 to 20 wt% for (c3) compound, for (C4) The compound is 25 to 35 wt%, and is 1 to 5 wt% based on the compound (c5). The weight average molecular weight (Mw) of the (C) copolymer is from 5,000 to 25,000, preferably from 10,000 to 25,000, particularly from 15,000 to 25,000. The molecular weight distribution (Mw/Mn) of the (C) copolymer is preferably 1~ 10, more preferably 2 to 4. Ο The method for producing the (c) copolymer is not particularly limited, and a polymerization mechanism such as a radical polymerization method, a cationic polymerization method, or an anionic polymerization method can be carried out by a solution polymerization method according to a conventional method. It is produced by a bulk polymerization method, an emulsion polymerization method, or the like, and is preferably industrially preferable because the radical polymerization method in the solution is simple. Examples of the polymerization initiator to be used in the production of the (C) copolymer include peroxides such as benzamidine peroxide and ruthenium peroxide; azobisisobutyronitrile, phenylazotriphenylmethane, and the like. An azo compound or the like. ο The production of the (C) copolymer can be carried out in any of the presence or absence of a solvent, and is preferably carried out in the presence of a solvent from the viewpoint of workability. The solvent may, for example, be an alcohol, a ketone, an ester, an alkyl ester of a monocarboxylic acid, a polar solvent, an ether, a propylene glycol and an ester thereof, a halogenated hydrocarbon, an aromatic hydrocarbon, a fluorinated inert liquid or the like. In some cases, the above-mentioned alcohol may, for example, be ethanol, isopropanol, n-butanol, isobutanol, tertiary butanol or the like; and the above ketone may, for example, be acetone, methyl ethyl ketone or methyl isobutyl ketone. , methylamino ketone, etc.; -18- 201035230 The above esters may, for example, be methyl acetate, ethyl acetate, butyl acetate, methyl lactate, ethyl lactate, butyl lactate, etc.; For example, methyl 2-oxopropionate, ethyl 2-oxopropionate, propyl 2-oxopropionate, butyl 2-oxopropionate, methyl 2-methoxypropionate, 2-methoxy Propylene acrylate, propyl 2-methoxypropionate, butyl 2-methoxypropionate, etc.; the above polar solvent may, for example, be dimethylformamide, dimethyl hydrazine, N-methyl Pyrrolidone or the like; 〇 the above ether may, for example, be methyl cellosolve, cellosolve, butyl cellosolve, butyl carbitol, ethyl cellosolve acetate, tetrahydrofuran, dioxane, etc.; the above propylene glycol and its ester may Listed: for example, propylene glycol, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monobutyl Examples of the halogenated hydrocarbons include, for example, 1,1,1-trichloroethane 'chloroform; and the aromatic hydrocarbons include, for example, benzene, toluene, xylene, and the like; and the fluorinated inert liquid may, for example, be exemplified by Perfluorooctane, perfluorotri-n-butylamine hydrazine, etc.; any of these solvents can be used. Further, when (c) the copolymer is produced, a chain transfer agent such as lauryl mercaptan, 2-mercaptoethanol, ethylthioglycolic acid or octylthioglycolic acid may be used. The use ratio of the (C) copolymer in the resin composition for forming a protective film of the present invention is preferably 0.01 to 3 parts by mass, more preferably 〇.〇5, based on 100 parts by weight of the polymer (A). ~ 2 parts by mass. Here, when the ratio of use of the (C) copolymer exceeds 3 parts by mass, the film having a coating film of -19-201035230 tends to be easily formed, and the surface flatness of the formed protective film is impaired. The situation. [(D) compound] The compound (D) in the invention is a compound having two or more cationically polymerizable groups (however, the compound corresponding to the (A) polymer is removed). Here, examples of the cationically polymerizable group include an epoxy group and the like. Examples of the compound (D) include a diglycidyl ether of a diol, a polyepoxypropyl ether of a polyhydric alcohol, a polyepoxypropyl ether of a polyether polyol, and a bisphenol A oxime epoxy resin. Bisphenol F type epoxy resin, phenol ho vo lak type epoxy resin, cresol novolac type epoxy resin, polyphenol type epoxy resin, cyclic aliphatic epoxy resin, aliphatic poly ring Oxypropyl propyl ether, diglycidyl ester of aliphatic long-chain dibasic acid, glycidyl ester of higher fatty acid, epoxy compound of natural oil, and the like. In particular, the di-epoxypropyl ether of the above diol may, for example, be bisphenol A diglycidyl ether, bisphenol F diglycidyl ether 'bisphenol S diglycidyl ether, hydrogenated double Phenol A diglycidyl ether, hydrogenated bisphenol F diglycidyl ether, hydrogenated bisphenol AD diglycidyl oxime ether, etc.; polyepoxypropyl ether of the above polyol may, for example, I, 4 - Butanediol diepoxypropyl ether, 1,6-hexanediol diepoxypropyl ether, glycerol triepoxypropyl ether trimethylolpropane triepoxypropyl ether, polyethylene glycol II Epoxy propyl ether, polypropylene glycol diglycidyl ether, and the like. The polyether polyol in the polyepoxy propyl ether of the polyether polyol is added to an aliphatic polyol such as ethylene glycol, propylene glycol, glycerin or the like by, for example, one or two or more kinds of alkylene oxides. And can get. -20- 201035230 The epoxy compound of the above natural oil may, for example, be epoxidized soybean oil or epoxidized linseed oil. As a commercially available product which can be used as such a compound (D), the bisphenol A type epoxy resin may be, for example, EPIKOTE 1001, the same as 0 0 2 '1003, the same 1004, the same 1007, the same 1009. And 1010, the same as 828 (above, Japan Epoxy Resin (manufactured by the company)); bisphenol F-type epoxy resin, for example, EPIKOTE 807 (above, Japan Epoxy Resin (stock)); phenolic novolac type Examples of the epoxy resin include, for example, EPIKOTE 152, 154, and 157,865 (above, 1 & 311 £? (^丫1163111 (share)), EPPN 201, and 202 (above, Nippon Chemical Co., Ltd.) Etc.; cresol novolac type epoxy resin, for example, EOCN 102, same 103S, same 104S, same 1020, same 1025, same 1027 (above, 曰本化药(股份)), EPIKOTE 180S75 (Japan Epoxy Resin) (Production), etc.; the polyphenol type epoxy resin may, for example, be EPIKOTE 1 032H60 'with XY-4000 (above, Japan Epoxy Resin (manufactured by KK)); and the cyclic aliphatic epoxy resin may, for example, be exemplified by CY-175, same as 177, same as 179, Araldite CY-182 192, 184 (above, Ciba Specialty Chemicals (share)), ERL-4234, 4299, 4221, 4206 (above, UCC), Shodain509 (Showa Denko (share)), Epicron 200, 400 (above, DIC (share) system), EPIKOTE 87, 872 (Japan Epoxy Resin (stock) system), ED-5661, and 5662 (above, Celanese Coating - 21-201035230 (share) system); For example, Epolie 100MF (manufactured by Kyoeisha Chemical Co., Ltd.), EPIOL TMP (manufactured by Nippon Oil Co., Ltd.), etc., with respect to 100 parts by mass of (A) polymer, The use ratio of the compound (D) in the resin composition for forming a protective film of the invention is preferably from 3 to 2 parts by mass, more preferably from 5 to 100 parts by mass, particularly preferably from 10 to 50 parts by mass. When the ratio of use of the compound is more than 200 parts by mass, the coating property of the resin composition for forming a protective film may be impaired. On the other hand, when it is less than 3 parts by mass, the hardness of the formed protective film is formed. There will be insufficient circumstances. [(E) compound] The compound (E) in the invention is an alkoxy decane compound having an epoxy group. Specific examples thereof include γ-glycidoxypropyltrimethoxydecane, β-(3,4-epoxycyclohexyl)ethyltrimethoxydecane, and γ·glycidoxypropyldiethoxylate. Decane and so on. These compounds can be used singly or in combination of two or more. The use ratio of the (Ε) compound in the resin composition for forming a protective film of the present invention is preferably from 0.1 to 50 parts by mass, more preferably from 5 to 30% by mass, based on 100 parts by mass of the (Α) polymer. In the case where the use ratio of the compound (低于) is less than 0.1 part by mass, the effect of imparting adhesion to the formed protective film substrate is not sufficiently obtained; on the other hand, if the ratio of the (Ε) compound is used When it exceeds 200 parts by mass, the case where the alkali resistance and solvent resistance of the formed protective film will be insufficient will be -22-201035230. [(F) hardening accelerator] In the present invention, in order to accelerate the reaction between the (A) polymer and the (B) compound, the (F) hardening accelerator can be used arbitrarily. As the (F) hardening accelerator, a compound having a heterocyclic structure of a secondary nitrogen atom or a tertiary nitrogen atom can be suitably used. Specific examples of such a compound include pyrrole, imidazole, pyrazole, pyridine, pyrimidine, hydrazine 'benzimidazole or isocyanic acid or a derivative C thereof. Among these compounds, preferred are imidazole derivatives. Suitable imidazole derivatives are: 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-heptadecylimidazole, 4-methyl-2-phenylimidazole, 1-benzyl-2-methyl Imidazole, 2-ethyl-4-methyl-1-(2'-cyanoethyl)imidazole, 2-ethyl-4-methyl-1-[ 2'-( 3",5"-diamine Base trimethan) ethyl imidazole, benzimidazole, etc., most preferably from 2-ethyl-4-methylimidazole, 4-methyl-2-phenylimidazole and 1-benzyl-2-methyl The compound selected by imidazole. These compounds can be used singly or in combination of two or more. The use ratio of the (F) hardening accelerator in the resin composition for forming a protective film of the present invention is preferably 30 parts by mass or less, and particularly preferably 〇. 1 to 10 parts by mass ratio. Here, when the use ratio of the (F) hardening accelerator exceeds 30 parts by mass, the storage stability of the obtained first liquid may be impaired. [Solvent] The solvent which can be used in the resin composition for forming a protective film of the present invention is capable of dissolving or dispersing the above-mentioned respective components, and is selected from the solvent which is not opposite to each component. Examples of such a solvent include ether, ethylene glycol alkyl ether acetate, diethylene glycol dialkyl ether, propylene glycol alkyl ether acetate, propylene glycol alkyl ether propionate, and ketone. Specific examples of such solvents 'Individually, the ether may, for example, be tetrahydrofuran or the like; and the ethylene glycol alkyl ether acetate may, for example, be methyl cellosolve acetate, ethyl cellosolve acetate or ethylene glycol. Monobutyl ether acetate, diethylene di C) alcohol monoethyl ether acetate, etc.; diethylene glycol dialkyl ether can be exemplified by, for example, diethylene glycol dimethyl ether, diethylene glycol diethyl ether , diethylene glycol ethyl methyl ether, etc.; propylene glycol alkyl ether acetate can be exemplified by, for example, propylene glycol methyl ether acetate, propanol ethyl ether acetate, propanol propyl acetate acetate, propylene glycol butyl Examples of the propylene glycol alkyl ether propionate include propylene glycol methyl ether propionate, propylene glycol ethyl ether propionate, propylene glycol propyl ether propionate, propylene glycol butyl butyl ether propionate, and the like; Examples of the ketone include methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, and methyl isoamyl ketone. Among these solvents, preferred are diethylene glycol, propylene glycol alkyl acetate, diethylene glycol dialkyl ether, more preferably diethylene glycol ethyl methyl ether, propylene glycol methyl ether acetate, propylene glycol. Ethyl ether acetate, diethylene glycol dimethyl ether, diethylene glycol monoethyl ether acetate, diethylene glycol diethyl ether, especially diethylene glycol ethyl methyl ether, diethylene Alcohol dimethyl ether is particularly desirable. -24-201035230 [Resin composition for forming a protective film] The resin composition for forming a protective film of the present invention is preferably used as a two-liquid resin composition for forming a protective film as described above. A) a polymer, (C) copolymer, (D) compound, (E) compound and solvent, and if necessary, (F) a first solution of a hardening accelerator, and a second liquid containing (B) a compound and a solvent For storage, use two liquids at the time of use. The solid content concentration of the first liquid (the ratio of the total weight of the constituents other than the solvent in the first liquid to the total weight of the first liquid) is preferably from 3 to 40% by mass, more preferably from 5 to 30% by mass. . The solid content concentration of the second liquid (the ratio of the weight of the compound (B) in the second liquid to the total weight of the second liquid) is preferably from 10 to 40% by mass, more preferably from 15 to 30% by mass. <Method of Forming Protective Film> Using the resin composition for forming a protective film of the present invention, for example, a protective film can be formed as follows. The resin composition for forming a protective film of the present invention is preferably a two-component resin composition for forming a protective film. When used, the first liquid and the second liquid are mixed and used. Here, the amount of the compound (B) in the second liquid is mixed with respect to the ratio of the (A) polymer in the first liquid to the above preferred use ratio. The resin composition for forming a protective film of the present invention is preferably used in a mixture of the first liquid and the second liquid, preferably within 24 hours, more preferably within 18 hours. For the formation of the protective film, the composition of the resin for forming a protective film after mixing - 25 - 201035230 is first applied to the surface of the substrate for forming a protective film. Next, prebaking is preferably carried out to remove the solvent to form a coating film, and further, the coating film is cured by post-baking to form a protective film. The type of the substrate to be used for the formation of the protective film may, for example, be a glass substrate, a germanium wafer, or a substrate on which various metals such as IT0 (indium tin oxide) are formed. The coating method of the resin composition solution is not particularly limited, and for example, a suitable method such as a spray method, a roll coating method, a spin coating method, a slit coating method, a mast coating method, or an inkjet method may be employed, and it is preferred to rotate. Coating method, slit coating method. In particular, in the case of the slit coating method, it is preferable because the advantageous effects of the present invention can be exhibited to the utmost extent. The conditions of prebaking and postbaking are appropriately set in accordance with the types of the respective components, the ratio of use, and the like. The prebaking can be carried out, for example, at 70 to 90 ° C, for example, for about 1 to 15 minutes. The post-baking can be carried out by means of a suitable heating device such as a hot plate or a clean oven. The post-baking temperature is preferably 150 to 25 °C. In some cases, when the hot plate is used as a heating device, the post-baking time is 5 to 30 minutes; when the clean oven is used as a heating device, the post-baking time is performed 30. ~ 90 minutes. The film thickness of the protective film formed in this manner is preferably from 0.1 to 8 μm, more preferably from 0.1 to 6 μm, still more preferably from 0.1 to 4 μm. Further, in the case where a protective film is formed on a substrate having a protective film having a height difference, the above-mentioned film thickness means the thickness of the uppermost portion of the difference in height. The protection formed by the resin composition for forming a protective film of the present invention -26- 201035230 The film system is clarified by the following examples, and even in the case of having a high-plate formation, the surface is superior due to the high flattening property. Various physical properties are very suitable as a photonic film such as a color filter. [Examples]

Hereinafter, the present invention will be described in more detail by way of examples, but not limited by these examples. Further, the following polymer average molecular weight (Mw) and number average molecular weight (?n) are measured by a gel permeation chromatography (GPC) obtained by the conditions of hydrazine, and the measurement apparatus is: TOSOH (share) system, " HLC8220 Separation column: TOSOH (share) system, 4 series GMHhr-N in series and use column temperature: 40 °C Solvent solvent: tetrahydrofuran (Waguang Pure Chemical Industry Co., Ltd. (stock flow rate: 1.0 mL/min sample concentration: 1.0 mass) % ◎ Sample injection amount: ΙΟΟμηι Detector: Differential refractometer Standard material: Monodisperse polystyrene In addition, the solution viscosity of the resin composition for forming a protective film is measured by a 黏-type viscometer manufactured by Kyoritsu Co., Ltd. at 30 ° C <(A) Manufacture of Polymer> Synthesis Example 1 In a flask equipped with a cooling tube and a stirrer, the feed 2, 2' low-difference base is also used for the weight of the present invention. In the following, "System" TSK gel) was used in an amount of 5 parts by mass of east-azo diiso-27-201035230 butyronitrile and 200 parts by mass of diethylene glycol methyl ethyl ether. Next, 70 parts by mass of glycidyl methacrylate was fed and 30 parts by mass of styrene, and after stirring with nitrogen, stirring was slowly started. The polymer solution containing the copolymer (A-1) was obtained by raising the temperature of the solution to 70 ° C to maintain this temperature for 5 hours. The solid content of the obtained polymer solution (the ratio of the weight of the polymer in the polymer solution to the total weight of the solution. The same applies hereinafter) was 33.1% by mass. The obtained polymer had a weight average molecular weight Mw of 10,000 and a molecular weight distribution (Mw/Mn) of 2. 〇 Synthesis Example 2 In a flask equipped with a cooling tube and a stirrer, 5 parts by mass of 2,2'-azobisisobutyronitrile and 200 parts by mass of diethylene glycol methyl ethyl ether were fed. Next, 50 parts by mass of glycidyl methacrylate and 50 parts by mass of styrene were fed, and after nitrogen substitution, stirring was started slowly. This temperature was maintained for 5 hours by raising the temperature of the solution to 70 ° C to obtain a polymer solution containing the copolymer (A-2). The solid solution concentration of the obtained polymer solution was 32.6% by mass. The obtained polymer had a weight average molecular weight Mw of 11, and a mass distribution (Mw/Mn) of 2. <(C) Manufacture of Copolymer> Synthesis Example 3 In a glass flask equipped with a stirring device, a condenser and a thermometer, 28.4 parts by mass of a compound represented by the formula (cl-1) was fed as a compound of (cl). NK-ester M-90G (trade name, manufactured by Shin-Nakamura Chemical Co., Ltd.) as (c2) compound, 20.7 parts by mass, and (c3) compound (C3-1-1-1) -28- 201035230

Me-

Me

e

Si——O IMe Me ISi—O-Si—(CH2)3-O

Me

Me

Me I c—c==ch2II o (Me is a methyl group in the above formula.) The compound shown as 18.1 parts by mass, 5.9 parts by mass of methyl methacrylate as the compound (c4) and acrylic acid-2- 23.5 parts by mass of ethylhexyl ester, 3.4 parts by mass of a methacrylated compound at both ends of the tetrabutylene glycol of the compound (c5), and 414 parts by mass of isopropyl alcohol as a solvent, and a nitrogen gas stream After adding 0.7 parts by mass of 2,2'-azobisisobutyronitrile as a polymerization initiator and 4 parts by mass of lauryl mercaptan as a chain transfer agent under reflux, by reflux at 8 5 ° C for 8 hours The copolymerization was carried out to obtain a solution containing the copolymer (C-1). Thereafter, the copolymer (C -1 ) was isolated by removing the solvent using a rotary evaporator under heating at 70 ° C or lower. The obtained copolymer (C-1) had a number average molecular weight Μη of 2,800, a weight average molecular weight Mw of 5,300, and a molecular weight distribution (Mw/Mn) of 1.9. -29-201035230 Synthesis Example 4 In the above Synthesis Example 3, a copolymer (C was obtained in the same manner as in Synthesis Example 3 except that the amount of the lauryl mercaptan added as the chain transfer agent was 1 part by mass. -2). The obtained copolymer (C-2) had a number average molecular weight Μη of 4,700, a weight average molecular weight Mw of 11, and a molecular weight distribution (Mw/Mn) of 2.3. Synthesis Example 5 In the above Synthesis Example 3, the same procedure as in Synthesis Example 3 was carried out except that the lauryl mercaptan as a chain transfer agent was not used, and the copolymerization temperature and time were respectively set to 7 3 ° C and 10 hours. The copolymer (C-3) was obtained in the same manner. The obtained copolymer (C-3) had a number average molecular weight Μη of 5,600, a weight average molecular weight Mw of 21,000, and a molecular weight distribution (Mw/Mn) of 3.8. Example 1 &lt;Preparation of Resin Composition for Forming Protective Film&gt; Ο [Preparation of First Liquid] 0.5 part by weight of the copolymer (C-1) obtained in the above Synthesis Example 3 as the (C) copolymer was added. (A) a solution of the copolymer (A-1) obtained in the above Synthesis Example 1 (amount equivalent to 1 part by mass in terms of the copolymer (A-1)), and added thereto as ( D) phenolic epoxy resin of the compound (trade name "EPIKOTE 152" (made by Japan Epoxy Resin Co., Ltd.) 40.0 parts by mass and γ-glycidoxypropyl propylene trimethoxy decane 20.0 as the compound (E) After the addition of the ethylene glycol methyl ethyl ether as a solvent -30-201035230, the first liquid having a solid concentration of 18% by mass was prepared by filtration using a Millipore filter having a pore diameter of 0.5 μm. (Preparation) 40 parts by weight of trimellitic anhydride as the compound (B) is dissolved in diethylene glycol methyl ethyl ether to prepare a second liquid having a solid content of 25% by mass. [Resin composition for protective film formation] Modulation] by modulating the above The total amount of the second liquid is added to the total amount of the second liquid, and the resin composition for forming a protective film is prepared by mixing the resin composition for forming a protective film. The resin composition for forming a protective film has a solution viscosity of 4.5 cP. The evaluation was carried out as follows. The evaluation results are shown in Table 1. <Evaluation of Resin Composition for Protective Film Formation> (Appearance evaluation of enamel coating film by using a slit die coater (Tokyo Chemical Industry Co., Ltd. ( The resin composition for forming a protective film prepared as described above was applied to a 550 x 650 mm chromium film-forming glass, and the arrival pressure was set to 100 Pa, by vacuum. The solvent was removed by drying, and further baked at 80 ° C for 2 minutes to form a coating film having a film thickness of 1.0 μm. The appearance of the coating film was visually observed under a sodium lamp. The unevenness is set as the smoke unevenness'. The unevenness of the proximity pin originating from the pre-baking furnace is set as the needle unevenness, and the occurrence of such unevenness is evaluated - 31- 201035230. There is almost no unevenness observed. Situation set The appearance of the film was "excellent"; the appearance was unevenly observed as "good"; the appearance of unevenness was clearly observed as "poor" appearance. (2) Evaluation of transparency by coating with a slit die The resin composition for forming a protective film prepared as described above was applied onto an 550 x 650 mm alkali-free glass substrate, and the pressure was set to 10 ÅPa, and the solvent was removed by vacuum drying. Then, it was prebaked at 80 ° C for 2 minutes, further baked in a baking box at 230 ° C, and then baked for 60 minutes to form a cured film (protective film) having a film thickness of 1.0 μm. For the substrate having the above protective film, a spectrophotometer (manufactured by Seiko Seisakusho Co., Ltd., model "150-20 type double beam") is used. The alkali-free glass substrate without a protective film is used as a reference side, and the wavelength range is measured. Transmittance of ~8 OOnm. The minimum 値 of the transmittance in this wavelength range is shown as transparency and is shown in Table 1. When the enthalpy is 95% or more, the transparency of the protective film is good. 0 (3) Evaluation of heat-resistant discoloration The substrate having the protective film formed in the above "(2) transparency evaluation" was further heated in an oven at 250 ° C for 1 hour, and then again subjected to the same as above ( 2) The method of measuring transparency. At this time, the heat discoloration resistance calculated according to the following formula is shown in Table 1. When the enthalpy is 5 % or less, the heat discoloration property is good. Heat discoloration (%) = transparency before heating (% - transparency after heating (%) -32 - 201035230 (4) Evaluation of flattening performance On a SiO 2 impregnated substrate, a pigment-based color resist (trade name) was used. "JCR RED 6 8 9", "JCRG RE ΕΝ 7 0 6" and "CR 82 00Β", above, JSR (share) system, forming red, green and blue three-color striped color filters. Applying one color of the color resist by a spin coater, forming a coating film on a hot plate at 90 ° C for 15 seconds, and then placing the fixed pattern mask in the middle. Using the exposure machine CanonPLA501F (manufactured by Canon), the 2,000 J/m2 exposure amount converted by i-line is used to illuminate the §1^ line (intensity ratio of wavelengths 43611111, 40511«1, and 36511111 = 2.7: 2.5:4.8), and then The image was developed by using a 0.05 mass% potassium hydroxide aqueous solution, rinsed with ultrapure water for 60 seconds, and further heat-treated in an oven at 230 ° C for 30 minutes to form a monochromatic striated color filter. Red, green and blue three-color striated color filters are formed by repeating this operation for three colors (the stripe width is 200 μm). The surface roughness of the substrate on which the color filter is formed is measured by the surface roughness meter "α-Step" (trade name: KLATencor Co., Ltd.). 2,000 μm, a square of 2,000 μm each side of the measurement range, and the number of measurement points η = 5, that is, the measurement direction is set to the short-axis direction of the stripe line in red, green, and blue directions, and red/red, green/green, In the two directions of the long-axis direction of the stripe line of the blue/blue color, the measurement is performed with η = 5 for each direction (the total number of η is 10). The protective film is formed by the spin coater. After the resin composition is pre-baked on a hot plate at 90 ° C for 5 minutes to form a coating film, further by means of '23 〇t in the oven, post-baking 60-33-201035230 minutes from the color filter A protective film having a film thickness of 2.0 μm is formed on the surface of the light sheet. The surface of the protective film is measured by the contact type film thickness measuring device "a-step" on the substrate having the protective film on the color filter formed as described above. Bump. But, to The length is 2,000 μm, the square of 2,000 μm on each side of the measurement range, and the number of measurement points η=5 are measured. That is, the measurement direction is set to the short-axis direction of the stripe line in the red, green, and blue directions and red/red, green/ The two directions of the long-axis direction of the stripe line of green, blue, and blue are measured by η = 5 for each direction (the total number of η is 10). The highest part and the bottom part of each measurement are used. The 10th average 値 of the height difference (nm) is shown in Table 1. When the 値 is 300 Å or less, the planarization performance is good. (5) Evaluation of film thickness uniformity A protective film was formed on the alkali-free glass substrate in the same manner as in the above (2) transparency evaluation. The coating film thickness in the same substrate at 20 points was measured for the protective film on the substrate, and the film thickness uniformity of the coating film was calculated by the following formula: Q film thickness uniformity (%) = [(film thickness) The largest one is the smallest 値) + { (the average thickness of the film thickness of 20 points) x2}] xlOO. Further, the measurement points of the above 20 points are determined as follows. In other words, an inner region (450 X 550 mm) in a range of 5 cm from each end of the long side and the short side of the substrate (550×240 mm) is used as a measurement region, and in the region, in the longitudinal direction On the straight line with the short side direction, each 1 point (20 points in total) is determined every 4 cm, and these points are set as measurement points. When the film thickness uniformity of the coating film calculated in this manner is 1% or less -34 to 201035230, the film thickness uniformity of the coating film is good. Examples 2 to 7 and Comparative Examples 1 to 3 The resin compositions for forming a protective film were prepared and evaluated in the same manner as in Example 1 except that the types and amounts of the respective components disclosed in Table 1 were used. The evaluation results are shown in Table 1. In each of Examples 5 to 7, in addition to the components (A) to (E), 1 - 苄 benzyl-2-methylimidazole as a (F) hardening accelerator was further used in an amount of 1 Å by mass. In each of Examples 6 and 7, two (C) copolymers were used. In Comparative Examples 1 and 2, a commercially available surfactant was used instead of the (C) copolymer; in Comparative Example 3, either (C) a copolymer and a commercially available surfactant were not used. The "-" in Table 1 indicates that the ingredients that match the column are not used. The abbreviations of the respective components shown in Table 1 indicate the following: &lt; (A) Polymer&gt; A-1: Copolymer (A-1) produced in the above Synthesis Example 1 Ο A-2: Synthesis as described above The copolymer produced in Example 2 (Α·2) Further, the (Α) polymer was prepared by preparing a solution containing the polymer and supplying the first liquid. The amount of the polymer (A) in Table 1 is converted to the amount of each (A) polymer contained in the polymer solution to be used. &lt;(C) Copolymer> C-1: Copolymer (cl) produced by the above Synthesis Example 3 C-2: Copolymer (C_2) produced by the above Synthesis Example 4 C-3: Synthesis Example 5 Copolymer produced (c-3) -35- 201035230 &lt;Interactivator&gt; cl: siloxane-based surfactant (TORAY DOW CORNING (trade name: SH-193) c-2: Fluorine Surfactant (NEOS (trade name: Ftergent 222F)) &lt; (E) Compound &gt; E-1 : γ-glycidoxypropyltrimethoxydecane &lt; (F) hardening accelerator &gt; 〇F -1 : 1 -benzyl-2-methylimidazole

-36- 201035230

Comparative Example 3 〇1 1 1 1 1 1 40.0 20.0 1 〇 Poor 〇〇Os 500 4.31 Comparative Example 2 〇1 1 1 1 1 CN 〇40.0 20.0 1 〇 Poor 〇〇 On m 350 2.23 Comparative Example 1 〇1 1 1 1 m ο 1 40.0 20.0 1 〇Good 00 ON 300 1.12 Example 7 1 ο τ-Η CN ο 1 1 1 40.0 20.0 〇〇 Excellent On Ο &lt;N 250 0.68 Example 6 I Ο 0.15 1 0.15 i 1 1 40.0 1 20.0 〇〇Excellent Os On &lt;N 250 0.72 Example 5 1 ο τ-Η νη ο 1 1 1 1 40.0 20.0 〇〇Excellent 〇\ON (N 200 0.73 Example 4 ο 1 rn Ο 1 1 1 1 '40.0 1_ 20.0 1_ 1 〇 Excellent OO On m 250 0.65 Example 3 Ο 1 1 1 vn ο 1 1 40.0 20.0 1_ [ 〇 Excellent 00 m 250 0.82 Example 2 ο 1 1 ο 1 1 1 40.0 20.0 1 〇 43⁄4 00 ON 250 0.81 Example 1 ο Η 1 ο 1 1 1 1 40.0 20.0 1 〇 Excellent 00 Os 200 0.72 Α-1 (parts by mass) Α-2 (parts by mass) C-1 (parts by mass) C-2 (parts by mass) C -3 (mass parts) C-1 (parts by mass) C-2 (parts by mass) (D) EPIKOTE 152 (parts by mass) (E) E-1 (parts by mass) (F) F-1 (parts by mass) ( B) trimellitic anhydride (parts by mass) (1) outside the coating film Evaluation (2) Transparency (%) (3) Heat discoloration (%) (4) Flattening performance (mn) (5) Film thickness uniformity of coating film (%) /^Ν &lt; 界面 Surfactant First liquid hair 11 濉 evaluation result 201035230 [Simple description of the diagram] Μ 〇 [Main component symbol description] fte 〇/\w

)

-38-

Claims (1)

201035230 VII. Patent application scope: 1. A resin composition for forming a protective film, comprising: (A) a polymer having a repeating unit derived from a polymerizable unsaturated compound containing an epoxy group; (B) At least one compound selected from the group consisting of a polyvalent carboxylic anhydride and a polyvalent carboxylic acid; (C) a copolymer of the following composition having a weight average molecular weight of 5,000 to 2 5,000: C) (cl) 25 to 35 mass% of the compound represented by the formula (1), (c2) 20 to 30% by mass of the compound represented by the following formula (2), and (C3) polymerizability of a group represented by the following formula (3) 15 to 20% by mass of the unsaturated compound, (c4) the polymerizable unsaturated compound having an alkyl group having 1 to 8 carbon atoms, 25 to 35% by mass, and (c5)-having two or more unsaturated bonds in the molecule. 1 to 5 mass% of the polymerizable unsaturated compound; 〇(D) a compound having two or more cationically polymerizable groups (however, in addition to the (A) polymer); and (E) an epoxy group-containing compound Alkoxydecane compound; CH2=CR1COOCH2CH2C8Fi7 (1) (formula 1), R1 is a hydrogen atom or a methyl group;; CH2=CR2COO(C2H4O) aR3 (2) (in the formula (2), R2 is a hydrogen atom or a methyl group, and R3 is a methyl group, an ethyl group, a propyl group or Butyl, a series repeating unit number, the average number of 値 is 4~12); -39- 201035230 / R5 \ R5 R7 J\ \\ I R4 Si 〇Si O——Si (3) \ R6 /b R6 R8 (In the formula (3), R4, R5, R6, R7 and R8 are each independently an alkyl group having 1 to 20 carbon atoms, a phenyl group or a group represented by the following formula (4), and b is 0 to 3; Integer); (4) (In the formula (4), R9, R1G and R11 are each independently an alkyl group having 1 to 20 carbon atoms or a phenyl group, and c is an integer of 0 to 3). 2. The resin composition for forming a protective film according to the first aspect of the patent application, wherein (F) a curing accelerator is further contained. 3. The resin composition for forming a protective film according to claim 1 or 2, which is used in a slit coating method. A protective film for a color filter, which is formed by a resin composition for forming a protective film according to any one of claims 1 to 3. -40 - 201035230 IV. Designated representative map: (1) The representative representative of the case is: None. (2) A brief description of the symbol of the representative figure: 〇 5. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: CHfCR^COOO^CHzQFn (1) CH2=CR2COO(C2H4〇)aR3 (2) R7 I Si- (3) R8 (4)