201235121 六、發明說明： 【發明所屬之技術領域】 本發明係提供一種可全面性導引元件旋轉甩出之清洗流體 依導引氣流流動路徑排出，而使元件迅速乾燥，以提升乾燥效能 及縮短作業時間之元件清洗機。 【先前技術】 在現今’半導體晶圓、鏡片、玻璃、印刷電路板、面板或醫 療，器等元件，於製作過程或使用一段時間後，元件之表面均會 附著有雜質、污垢等，而影響元件之潔淨度及品質，為避免影響 元件，製作良率及品質，業者係以清洗機清洗附著於元件表面之 雜^等，以晶圓為例，係必須歷經多道製程，導致晶圓之表面合 附著=質、微粒或化合物等，因此，晶圓於不同製程之前後，二 j執行α洗表面作業’例如晶®在進人熱爐^(furnaee)以進行 ίΐίίΐίΪ前、進行薄膜沈積前_刻程序後，均需以晶圓 除濕乾燥’使得晶圓之表面具有高潔淨度’以提升 有-1 ?二係為一種晶圓清洗機，其係於機台11上設 係設有排公二L J之清洗槽12，該清洗槽12之底面-側 以排出清洗流體，—裝配於機台11上之 凸伸於清洗槽1 2内之轉軸1 4 1，並 於清洗槽1 2上洗晶圓之旋轉台1 4 2，-位 或氣體等），另於m5，ί用以魏清洗流體（如離子水 7置放於旋轉台t 乍業時，可將待清洗之晶圓1 晶圓1 7定位，接著H 台Η 2即真空吸附待清洗之 4 2及待清洗之晶4 1係帶動旋轉台工 灑於待清洗之晶圓工7疋轉作動’而噴管1 5則將清洗流體喷 質、微粒或化合鱗，並利;著於晶® 1 7表面之雜 寺並利用旋轉台142旋轉之離心力將晶圓 201235121 土 7表面之清洗流體向外甩出，此時，抽風裝置i 6可利用排放 官1 3而抽取清洗槽1 2内部之空氣，以使晶圓丄7旋轉甩出之 >月洗流體可流入於排放管i 3排出，於清洗完畢後，該喷管工5 係停止噴灑清洗流體而改以噴灑氣體，由於旋轉台i 4 2仍帶動 晶圓1 7旋轉，而可持續利用旋轉台i 4 2旋轉之離心力將晶圓 ^表面乾燥，達到清洗及乾燥晶圓丄7之目的；惟，該排放管 j係位於清洗槽1 2之-側，導致減裝置丨6僅可於清洗槽 絲田山側近排放管/ 3之區域產生較大之吸力，而使晶圓1 7旋 、到近排放官1 3區域的清洗流體迅速流入於排放管1 始二Τ先槽1 2另一側之區域則會因吸力變小’以致晶圓1 7 至該區域的清洗流體會撞擊到清洗槽12之内壁面，而 旋m 触晶圓1 7之表面，致使晶® 1 7無法迅速 之=乾燥效率不佳，亦增加麟作鱗間，造成降低 短作件财麟，而提聽舰能及縮 機，即為業者研發之標的。 之清ί:月ί:及旋清洗機’包含有具排放口 盤於近轉Ξϋ 洗槽之畴健配有導流盤，該導流 導流ίϊ，絲續之排_間設有第二 於抽風裝·動;爾置；藉此， =全置：sr旋= 流入於第二導流依導引氣流流動路徑而 逮乾燥，達到提升乾燥效能^^放口排出，進而使元件迅 二 可利用第一導流通 201235121 道導引旋轉台四周之空氣向中間位置之匯流孔流動，而於旋轉台 全罩式的導引氣流’以全面性導引旋轉甩出之清洗流 ，依導引範流流動路徑而流人於第二導流通道，再由清洗槽之排 放口排出使元件迅速乾燥，財效驗乾燥 到提升清洗產能之實用效益。 咬 【實施方式】 1 為使貴審查委員對本發明作更進一步之瞭解，茲舉一較佳 實施例並配合圖式，詳述如后： 請參閱第2、3圖’該元件清洗機係於機台2 〇上配置有清 洗槽30、承載裝置4 0、噴灑吹乾裝置5 0、導流盤6 0及抽 _ 風裝置，該清洗槽3 〇係為一内部具容置空間之容器，於本實施 例中，該清洗槽3 〇之頂面係設有一具通風口 3丄i之上蓋3 1 ’以供外部空氣由通風口 3 ]L i流入於清洗槽3 〇内，又清洗 槽3 0可^側面或底面開設有用以排放清洗流體之排放口 3 2，於本實施例中，係於清洗槽3 〇之側面近底部開設有排放口 3 2，用以排出清洗流體，該承載装置4 〇係於機台2 〇上設有 驅動源’狀鶴-轉㈣動，於本實施财，該驅動源係為馬 達4 1 ’馬達41則驅動一為皮帶輪組4 2之傳動組，使皮帶輪 組4 2帶動轉轴4 3旋轉，該轉軸4 3之頂端則凸伸於清洗槽3 〇内，以供裝配一可承置待清洗元件（如晶圓）之旋轉台44， 於本實施例中，該旋轉台4 4可真空吸附待清洗之元件定位，並 於頂面之周側設有複數個定位件，用以定位待清洗之元件，於本 實施例中，該旋轉台4 4之周圍係設有複數個為扣具4 4 i之定 位件’用以扣掣待清洗之元件定位，該喷灑吹乾裝置5 〇係 -可喷灑清洗流體之喷管51，用以清洗及吹乾元件，一裝配於 清洗槽3 0内部之導流盤6 0 ’該導流盤6 〇於近轉軸4 3之中 間位置係開設有匯流孔6 1 ’並與旋轉台4 4之外側緣間形成有 第-導流通道6 2，另㈣流孔6 1與清洗槽3 Q之排放口 3 2 間設有第二導流通道’該第二導流通道係可為於導流盤6 下方直接成财通道件’絲導流盤6 (3之下方裝配—為排水盤 201235121 ^ I 水◦下方裝配一排水 3與匯流孔6 ：L 而使得排水盤6 片7 ] π芦7 _Λ成第一導抓通道64’該抽風裝置係可為風 ϋ /有套接部711，用以套置連結於承載裝 f 4 0之轉轴4 3上，並位於第二導流通道6 4内，使得風扇7 1可，轉軸4 3驅動而與旋轉台44同步旋轉。 ’、 =閱第4圖’該元件清洗機可應用於清洗半導體晶圓、鏡 片^玻璃、P刷·板、面板或醫療儀器等元件，於本實施例 於清洗晶圓8 〇 ’於執行清洗作業時，係可將待 /η = 圓8〇扣擎定位；請參閱第5圖，該承 f裝 =Q之馬達4 1係皮帶輪組4 2驅動轉軸4 3轉 加二:疋轉風扇7 1即_清洗槽3 〇之通風口 3 1 1抽取外 由於導流盤6 〇係於底面近轉軸4 3之中間位置開設有 ，WL6 1 ’而可使自通風口 3工工流入至旋轉台4 4四周之空 一導流通道6 2匯流至中間位置之匯流孔61，以於旋轉 ^ 罩式向下吸人流動之導引氣流；請參閱第 裝署e π動待清洗之晶圓8 ◦旋轉時，該喷灑吹乾 ί 可職射之待清洗晶® 8 Q倾清洗流 、土、去湯必J » 圓b υ利用疑轉之離心力將雜質等由清 此時’可利用風扇7 1於旋轉台4 4四周 ΐ，Γ及入流動之導引氣流，以全面性導引晶圓8〇旋 入;;二導流通道6 4，又部份被【出之清洗益 體穿過導引飯而&擊至導流盤6 Q之内 與導流盤6 ◦之間，此時，亦可利用導引氣流直接 導引反㈣激之清洗流體向下流動，並 清洗流體喷_晶圓8。上，使得清洗流 201235121 控，而由第一導流通道6 2及匯流孔61流入至第二導流通道6 4，第二導流通道6 4内之清洗流體則可由清洗槽3 〇之排放口 3 2排出，凊參閱第7圖，於清洗晶圓8 〇完畢後，可控制喷灌 人乾裝置5 0之喷管5 1停止喷灑清洗流體，而改以噴灑另一'種 ^洗流體（如乾燥用之氣體），由於承載裝置4〇之轉軸4 3仍 τ動旋轉台4 4及風扇7 1同步轉動’旋轉台4 4可帶動晶圓g 〇旋轉，並利用離心力將表面之清洗流體向外甩出，此M相同 =利用風扇71於旋轉台44四周形成全罩式向下吸入流動 路導ii圓8 ◦旋轉甩出之清洗流體依導引氣流流動 i ΐ —導流通道6 2及匯流孔61流人至第二導流通道 1 3 通I6 4内之清洗流體則可由清洗槽3 〇之排放 作達流體甩乾，以縮短乾燥 台2 己ΐ二二本明元件清洗機之另-實施例，係於機 〇、tie 承健置4 0、喷灑吹乾裝置5 Ιί 7，槽3 0之頂面係設有-具通 0之側面近底部開設有排放口 3 2，用以1 i i: V 该承載裝置4 0係於機台2 〇上，右丄巧1乂排出“流體’ 輪組4 2帶動轉軸4 3 0軸有=4 1 ’馬達4 χ經皮帶 ’ 〇内，以供裝配-可承置彳i3之7_化伸於清洗槽3 位，該噴灑吹乾裝置5 用以扣掣待清洗之元件定 ，青洗元件’一裝配乂清清洗流體之喷管5 1， 盤6 〇於近轉軸4 3之 U 0内。P之導流盤6 0，該導流 台4 4之外侧緣間形成右二一開設有匯流孔6 1 ’並與旋轉 下方係裝配有排水盤^第:^L通道6 2，又該導流盤6 〇之 内’而使得排水盤6 3與°=水盤6 3係固設於清洗槽3 〇 另該抽風裝置係為抽風機61間形成第二導流通道6 4 ’ 之内部或外部，並連通 ’由風機7 2可敦配於清洗槽3 〇 弟-導道64,於本實施例中，該抽 201235121 之排放口32外部，並連通導流盤 請參閱第9圖，於執行清洗晶圓作業時夺 於旋轉台4 4上，並賤柄4 4==;:ί= iΐ 8 ◦扣’定位，該承载裝置4 ◦之馬達4 1 ί ^ 4日2驅動轉軸4 3轉動’使轉軸4 3帶動旋轉台4 “月洗之晶圓8 0同步旋轉’此時’抽風機7 2 ^及匯流孔61而由通風口 31 li二卜 i=疋 4四周之空氣沿第—導流通道6 2 ϊϋΓ流動之導引氣流;請參閱第10圖，當旋轉二“ 1%%Ϊ1ΤΤ 〇4；5 1 並使晶圓8。二二，她 之雜*、微粒或化合物等， 甩出，此時 流入至第二導流通道6 4 t姑2及匯流孔61 流而撞擊至導流盤6 ^内又壁二被:二：;體穿過導引氣 與導流盤6 0之間，此時，亦可‘ 於晶圓8 0 之清洗流體向下流動，並會 二^ 2引反彈喷滅 回晶圓8 0上，使得清、盤6 0之清洗流體喷滅 =道62及匯==2=^=^，而由第一導 3 0之排放口 3 2排出；諳如^「5通道6 4 ’再由清洗槽 後，可控㈣灑吹乾裝g 3 ^清洗晶圓8 0完畢 j以噴灑另-種清洗流體芍清洗流體，而 〇之轉軸4 3仍帶動旋轉台:於承载裝置4 =力將表面之清洗流體 g 8 Q =m，並糊離 2於旋轉“4順彡成全 201235121 晶圓8 0旋轉甩出之清洗流體依導 流通道6 2及匯流孔6 ]产入5 動路僅’而由第一導 3 0之排放口 1第二導流通道6 4 ’再由清洗槽 ===、:進;使晶圓8 0迅速將清洗流體甩乾， Λ時間，達到提升乾燥效能之實用效益。 • a L ^明可有效導引元件於旋轉清洗乾燥中甩出之、青洗 >^下^_出’使元件迅速清洗乾燥 g二 短作業時間，實為-深具實用性及進步性之設計，=== ^產品及刊物公開’從而允符發明專利中請要件，爰依法提“ 5青0 【圖式簡單說明】201235121 VI. Description of the Invention: [Technical Field] The present invention provides a cleaning fluid that can be rotated by a comprehensive guiding element to be discharged according to a guiding air flow path, so that the components are quickly dried to improve drying efficiency and shorten Component cleaning machine for working hours. [Prior Art] In today's semiconductor wafers, lenses, glass, printed circuit boards, panels, medical devices, etc., after the manufacturing process or after a period of use, the surface of the components will be attached with impurities, dirt, etc. The cleanliness and quality of the components, in order to avoid affecting the components, production yield and quality, the manufacturer uses a cleaning machine to clean the impurities attached to the surface of the device, etc., in the case of wafers, it is necessary to go through multiple processes, resulting in wafers Surface adhesion = quality, particles or compounds, etc. Therefore, after the wafer is processed before the different processes, the α-washing surface operation is performed, for example, before the crystal is introduced into the furnace to perform ίΐίίίί, before film deposition. After the _ inscription process, the wafer must be dehumidified and dried to make the surface of the wafer have high cleanliness to enhance the -1 - 2 series as a wafer cleaning machine, which is provided with a row on the machine 11 The cleaning tank 12 of the second LJ, the bottom surface of the cleaning tank 12 is for discharging the cleaning fluid, and the rotating shaft 141 which is mounted on the machine table 11 and protrudes in the cleaning tank 12 is mounted on the cleaning tank 1 2 Washing wafer rotating table 1 4 2, - position or gas, etc., and m5, ί for Wei cleaning fluid (if ion water 7 is placed on the rotary table t, the wafer 1 wafer to be cleaned can be positioned, then H Taiwan 2 is vacuum suctioned to be cleaned 4 2 and the crystal to be cleaned 4 1 system drives the rotary table to be sprayed on the wafer to be cleaned 7 疋 turn to act 'and the nozzle 1 5 will wash the fluid spray, particles or Combining the scales and benefiting; on the surface of the crystal tower 1 7 and using the centrifugal force of the rotating table 142 to rotate the cleaning fluid of the surface of the wafer 201235121 soil 7 outward, at this time, the exhaust device i 6 can utilize the emission officer 1 3, the air inside the cleaning tank 1 2 is extracted to rotate the wafer crucible 7 and the monthly washing fluid can flow into the discharge pipe i 3 to discharge, and after the cleaning is completed, the nozzle 5 stops spraying and cleaning. The fluid is changed to spray gas. Since the rotating table i 4 2 still drives the wafer 17 to rotate, the centrifugal force of the rotating table i 4 2 can be continuously used to dry the surface of the wafer to achieve the purpose of cleaning and drying the wafer 丄7. However, the discharge pipe j is located on the side of the cleaning tank 12, so that the reduction device 6 can only be used in the cleaning tank wire field. The area near the discharge pipe / 3 on the mountain side generates a large suction force, and the cleaning fluid that rotates the wafer 17 to the area near the discharge officer 1 3 quickly flows into the area on the other side of the discharge pipe 1 As a result, the suction force becomes smaller, so that the cleaning fluid of the wafer 17 to the region will hit the inner wall surface of the cleaning tank 12, and the surface of the wafer 17 will be touched, so that the crystal® 1 7 cannot be quickly = drying efficiency. Poor, it also increases the size of the lining, resulting in the reduction of the short-selling treasury, and the ability to raise the ship and reduce the machine, which is the target for the development of the industry. The Qing: month ί: and rotary washing machine 'contains emissions The mouth plate is close to the Ξϋ 洗 之 健 健 健 健 健 健 健 健 健 健 健 洗 洗 洗 洗 洗 洗 洗 洗 洗 洗 洗 洗 洗 洗 洗 洗 洗 洗 洗 洗 洗 洗 洗 洗 洗 洗 洗 洗 洗 洗 洗 洗Sr 旋 = inflow into the second diversion flow according to the guiding air flow path to catch dry, to improve the drying efficiency ^ ^ discharge discharge, so that the component can quickly use the first guide circulation 201235121 guide the air around the rotating table The confluence hole in the middle position flows, and the full-cover type guide air flow in the rotary table is guided by the comprehensive rotation. The cleaning flow flows through the second flow guiding channel according to the guiding flow path, and then is discharged from the discharging port of the cleaning tank to quickly dry the components, and the utility model is dried to improve the practical efficiency of the cleaning production capacity. Bite [Embodiment] 1 In order to make the reviewer further understand the present invention, a preferred embodiment and a diagram are described in detail as follows: Please refer to Figures 2 and 3 for the component cleaning machine. The washing machine 3 is equipped with a washing tank 30, a carrying device 40, a spray drying device 50, a deflector 60 and a pumping device, and the washing tank 3 is a container having an internal accommodation space. In the embodiment, the top surface of the cleaning tank 3 is provided with a vent 3 丄i upper cover 3 1 ′ for external air to flow into the cleaning tank 3 由 through the vent 3 ]L i, and the cleaning tank In the embodiment, a discharge port 32 is provided on the side of the cleaning tank 3 近 at the bottom of the cleaning tank 3 to discharge the cleaning fluid, and the bearing is provided. The device 4 is connected to the machine 2, and is provided with a driving source 'shoulder-turning (four) movement. In the present embodiment, the driving source is a motor 4 1 'the motor 41 drives a transmission group of the pulley set 42. The pulley set 4 2 rotates the rotating shaft 4 3 , and the top end of the rotating shaft 43 protrudes into the cleaning tank 3 ,. For the assembly of a rotating table 44 capable of holding an element to be cleaned (such as a wafer), in the embodiment, the rotating table 44 can vacuum-adsorb the positioning of the component to be cleaned, and is provided on the peripheral side of the top surface. a positioning member for positioning the component to be cleaned. In this embodiment, a plurality of positioning members for the fastener 4 4 i are disposed around the rotating table 44 for fastening the component to be cleaned. Spray drying device 5 - a spray nozzle 51 capable of spraying a cleaning fluid for cleaning and blowing the component, and a deflector 6 0 ' inside the cleaning tank 30. 'The guide disc 6 is close to The intermediate position of the rotating shaft 4 3 is provided with a collecting hole 6 1 ' and a first guiding channel 6 2 is formed between the outer side edge of the rotating table 4 4 , and the other (four) flow hole 6 1 and the discharge port 3 2 of the cleaning tank 3 Q Between the second flow guiding channel, the second guiding channel can be directly under the deflector 6 into the channel part of the wire guide wire 6 (the assembly below the 3 - for the drainage plate 201235121 ^ I below the water Assembling a drain 3 and a manifold 6 : L so that the drain pan 6 pieces 7 ] π 芦 7 _ Λ into the first guide channel 64 ′ The ϋ / has a socket 711 for arranging and connecting to the rotating shaft 43 of the carrying device f 4 0 and located in the second guiding channel 64, so that the fan 71 can be driven and rotated by the rotating shaft 43 The table 44 rotates synchronously. ', = see Fig. 4' The component cleaning machine can be applied to cleaning semiconductor wafers, lenses, glass, P-brush boards, panels or medical instruments, etc. In this embodiment, the wafers are cleaned 8 〇 'When performing cleaning operations, you can position the /n = round 8〇 buckle; see Figure 5, the motor of the load = Q motor 4 1 series pulley set 4 2 drive shaft 4 3 transfer plus two疋 风扇 风扇 风扇 风扇 清洗 清洗 清洗 清洗 清洗 清洗 清洗 清洗 清洗 清洗 清洗 清洗 清洗 清洗 清洗 清洗 清洗 清洗 清洗 清洗 清洗 清洗 由于 清洗 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 清洗 清洗 清洗 清洗 风扇 清洗 风扇The flow into the confluence opening 61 of the intermediate position of the rotating table 4 4 is merged into the confluence hole 61 of the intermediate position to guide the flow of the downwardly absorbing flow; When cleaning the wafer 8 ◦, the spray is blown dry ί can be washed to clean the crystal® 8 Q to clean the flow, soil, go to the soup J » round b υ use doubt The centrifugal force causes the impurities and the like to be circulated around the rotating table 44 by the fan 7 1 , and is guided into the flow guiding airflow to guide the wafer 8 全面 in a comprehensive manner; the second guiding channel 6 4 And some of them are passed through the guide rice and are hit between the guide disc 6 Q and the guide disc 6 ,. At this time, the guide airflow can also be used to directly guide the reverse (4) The cleaning fluid flows downward and the fluid spray_wafer 8 is cleaned. The cleaning flow 201235121 is controlled, and the first flow guiding channel 62 and the collecting hole 61 flow into the second guiding channel 64, and the cleaning fluid in the second guiding channel 64 can be discharged by the cleaning tank 3. The port 3 2 is discharged, and referring to Fig. 7, after the cleaning of the wafer 8 is completed, the nozzle 5 1 of the sprinkler irrigation device 50 can be controlled to stop spraying the cleaning fluid, and instead to spray another 'washing fluid (For example, the gas for drying), since the rotating shaft 4 of the carrying device 4 is still rotating, the rotating table 4 4 and the fan 7 1 are synchronously rotated. The rotating table 4 4 can drive the wafer g 〇 to rotate, and the surface is cleaned by centrifugal force. The fluid is thrown outwards, and the M is the same = the fan 71 is used to form a full-cover type downward suction flow path around the rotary table 44. The round cleaning is performed. The cleaning fluid is rotated and the flow is guided by the airflow. i 导 - the flow guiding channel 6 2 and the flow hole 61 to the second flow guiding channel 1 3 through the I6 4 cleaning fluid can be drained by the cleaning tank 3 作 to achieve a drying machine 2 to shorten the drying station 2 The other embodiment is attached to the casing, the tie bearing 40, the spray drying device 5 Ιί 7, the slot 3 The top surface of 0 is provided with a side with a through 0 and a discharge port 3 2 near the bottom for 1 ii: V. The carrying device 40 is attached to the machine 2, and the right side is discharged. The wheel set 4 2 drives the rotating shaft 4 3 0 axis has = 4 1 'the motor 4 passes through the belt ' ,, for assembly - can be placed 彳 i3 7_ is extended in the cleaning tank 3 position, the spray drying device 5 For the purpose of fastening the component to be cleaned, the cleaning component is a nozzle 5 1 for rinsing the cleaning fluid, and the disk 6 is immersed in the U 0 of the proximal shaft 43. The guiding disc 60 of the P, the diversion A right side of the outer side of the table 4 4 is formed with a flow hole 6 1 ' and a lower side of the rotating bottom is equipped with a drain pan ^: a passage 6 2, and the guide disc 6 is inside the '' 6 3 and ° = water tray 6 3 is fixed in the cleaning tank 3 〇 The exhaust device is formed between the exhaust fan 61 to form the inside or outside of the second flow guiding passage 6 4 ', and communicates with the fan 7 2 In the cleaning tank 3, the younger-channel 64, in the present embodiment, the outside of the discharge port 32 of the 201235121 is pumped, and the flow guiding plate is connected. Referring to FIG. 9, the rotating table is taken during the cleaning of the wafer. Up, and Handle 4 4==;: ί= iΐ 8 ◦ buckle 'positioning, the carrying device 4 ◦ motor 4 1 ί ^ 4 day 2 drive shaft 4 3 rotation 'to make the shaft 4 3 drive the rotary table 4 8 0 synchronously rotates 'at this time' the exhaust fan 7 2 ^ and the manifold 61 and the air flow around the first guide channel 6 2 由 by the air vents 31 li 2 i = 疋 4; see the Figure 10, when rotating two "1%% Ϊ1ΤΤ 〇4; 5 1 and make wafer 8. 22, her miscellaneous *, particles or compounds, etc., squirting, at this time flowing into the second diversion channel 6 4 t 2 and the confluence hole 61 flow and hit the guide plate 6 ^ and the wall two are: The body passes between the guiding gas and the deflector 60. At this time, the cleaning fluid of the wafer 80 can also flow downward, and the second rebound will be sprayed back to the wafer 80. , so that the cleaning fluid of the clearing plate 60 is extinguished = the channel 62 and the sink == 2 = ^ = ^, and is discharged by the discharge port 32 of the first guide 30; for example, "5 channel 6 4 ' After cleaning the tank, controllable (4) sprinkle dry g 3 ^ clean the wafer 80 complete j to spray another cleaning fluid 芍 cleaning fluid, while the rotating shaft 4 3 still drives the rotary table: on the carrying device 4 = force will The surface cleaning fluid g 8 Q = m, and the paste 2 is rotated. "4 彡 彡 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 The second guiding channel 6 4 ' of the first guiding port 10 is further cleaned by the cleaning tank ===, :; the wafer 80 is quickly dried, and the drying time is improved. Practical benefits. • a L ^ can effectively guide the components in the spin cleaning and drying, the green washing> ^ ^ ^ out 'to make the components quickly clean dry g two short working time, in fact - practical and progressive The design, === ^Products and publications are open' so that the requirements of the invention patents are allowed, and the law is “5 Qing 0 [Simple description]
第1圖.習式晶圓清洗機之示意圖。 第2圖：本發明元件清洗機之示意圖。 第3圖：本發明元件清洗機之局部零件分解圖。 第4圖：本發明之使用示意圖（一）。 第5圖：本發明之使用示意圖（二）。 第6圖··本發明之使用示意圖（三）。 第7圖：本發明之使用示意圖（四）。 第8圖：本發明另一實施例之示意圖。 第9圖：本發明另一實施例之使用示意圖（一）。 第1 0圖：本發明另一實施例之使用示意圖（二）。 第11圖：本發明另一實施例之使用示意圖（三）。 【主要元件符號說明】 〔習式〕 清洗槽：12 排放管：13 轉軸：141 喷管：1 5 晶圓：1 7 機台：1 1 開口 ： 1 2 1 承載裝置：14 旋轉台：14 2 抽風裝置：16 〔本發明〕 機台：2 0 201235121 清洗槽：3 0 通風口：311 承載裝置：4 0 皮帶輪組：4 2 旋轉台：4 4 喷灑吹乾裝置：5 0 導流盤：6 0 第一導流通道：6 2 第二導流通道：64 風扇.7 1 φ 抽風機：7 2 晶圓.8 0 上蓋： 3 1 排放口 ： 3 2 馬達： 4 1 轉軸： 4 3 扣具： 4 4 1 喷管： 5 1 匯流孔 ： 6 1 排水盤 : 6 3 套接部 ： 7 11Figure 1. Schematic diagram of a conventional wafer washer. Figure 2: Schematic diagram of the component cleaning machine of the present invention. Figure 3 is an exploded view of a partial part of the component cleaning machine of the present invention. Figure 4: Schematic diagram of the use of the present invention (I). Figure 5: Schematic diagram of the use of the invention (2). Fig. 6 is a schematic view showing the use of the present invention (3). Figure 7: Schematic diagram of the use of the invention (4). Figure 8 is a schematic view of another embodiment of the present invention. Figure 9 is a schematic view (1) of use of another embodiment of the present invention. Fig. 10 is a schematic view showing the use of another embodiment of the present invention (2). Figure 11 is a schematic view showing the use of another embodiment of the present invention (3). [Main component symbol description] [Literary] Cleaning tank: 12 Discharge pipe: 13 Rotary shaft: 141 Nozzle: 1 5 Wafer: 1 7 Machine: 1 1 Opening: 1 2 1 Carrying device: 14 Rotary table: 14 2 Exhaust device: 16 [Invention] Machine: 2 0 201235121 Cleaning tank: 3 0 Vent: 311 Carrying device: 4 0 Pulley set: 4 2 Rotating table: 4 4 Spray drying device: 5 0 Guide plate: 6 0 First diversion channel: 6 2 Second diversion channel: 64 Fan.7 1 φ Exhaust fan: 7 2 Wafer.8 0 Upper cover: 3 1 Drain: 3 2 Motor: 4 1 Shaft: 4 3 Buckle With: 4 4 1 Nozzle: 5 1 Confluence hole: 6 1 Drainage pan: 6 3 Socket: 7 11