TW201233554A - Laminating apparatus and laminating method - Google Patents

Laminating apparatus and laminating method Download PDF

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Publication number
TW201233554A
TW201233554A TW100131321A TW100131321A TW201233554A TW 201233554 A TW201233554 A TW 201233554A TW 100131321 A TW100131321 A TW 100131321A TW 100131321 A TW100131321 A TW 100131321A TW 201233554 A TW201233554 A TW 201233554A
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Taiwan
Prior art keywords
workpiece
sheet
hot plate
laminating
lifting
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TW100131321A
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Chinese (zh)
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Atsushi Yufu
Takashi Shinoda
Katsuyuki Sakakibara
Yasushi Takagi
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Nisshinbo Mechatronics Inc
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Publication of TW201233554A publication Critical patent/TW201233554A/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • B32B37/0015Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid warp or curl
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/02Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1009Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using vacuum and fluid pressure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • H01L21/67109Apparatus for thermal treatment mainly by convection
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042PV modules or arrays of single PV cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042PV modules or arrays of single PV cells
    • H01L31/048Encapsulation of modules
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/12Photovoltaic modules
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

Abstract

The laminating apparatus 100 includes: an upper chamber 113 separated by a diaphragm 112; and a lower chamber 121 where a heating plate 122 is disposed. The object 10 to be processed is transferred into the apparatus by a transfer sheet 130 moving on the heating plate and performing the laminating process, and a lift part 400 is disposed on the heating plate of the laminating apparatus. The laminating apparatus operates as below: the lift part 400 is raised while transferring the object to be processed in a laminating portion 101; the transfer sheet 130 moves in a condition that the transfer sheet 130 is raised from the heating plate, and the lift part 400 moves down at a timing that the object to be processed is transferred to a predetermined position on the heating plate so that the object to be processed is disposed on the heating plate for performing the laminating process.

Description

201233554 jyuipif 六、發明說明: 【發明所屬之技術領域】 本發明疋,關於_為了對作為被力口工物的太陽電池 模組等進打層壓加工而使用的層壓裝置及使用該裝置的層 壓方法。 θ 【先前技術】 先前,此種層壓裝置例如專利文獻】所揭示般,包括 具有朝向下方向膨脹自如的膜片(仙和肿)的上殼體、 及具有熱板的下殼體。而且,在對太陽電池模組進行層壓 時、1先’將重合著構成構件的太陽電賴組的構成構件 ,运至使上殼體與下殼體為上下開放的狀g的下殼體的熱 2。然後’層壓|置將上殼體與下殼體閉合,而使由上 殼體形成的空間成為真空狀態,且在對配置於孰 和體構件進行加熱的狀態下,將錢斜入至上 從而獲得太陽電…以此方式進行層 [先前技術文獻] [專利文獻] 利文獻1]日本專利特開平u_2()481l號公報 I專利文獻2]日本登實3〇17231號公報 [專利文獻3]日本專利3759257號公報 文獻4]曰本專利特開2〇〇8_126407號公報 "前的層壓裝置中,太陽電池模組等的被加工物 4 201233554. oy id ipif 藉由前處理步驟的搬入輸送機等而被搬送至層壓裝置的正 前方為止,然後被移載至在層壓裝置的熱板上循環而移行 的搬送片材上,且被搬送至層壓裝置的熱㈣規定位置為 止。此時,熱板因要對被加讀進行層壓加工而處於被加 熱的狀態。 ,搬送片材在此種熱板上移行,若將被加讀搭载於該 搬送片材上並進行搬送’職為被加工物的構成構件的透 明基板(例如玻璃基板)經由搬送片材而自熱板受熱,钟 果’於進行層壓加工之前產线曲。此種透明基板的麵曲 ,產生在 1台層壓裝置來對多片被加讀同時進行層 壓加工的情況下會成為更大的問題。 θ 亦即,取初的第1片被加工物會自熱板受熱而直至多 片的最後-片被加I物搬人結束為止,從而會產生大的趣 :。而且’先前已知曉:若被加工物上產生麵曲則會產生 層壓加工時的被加工物内的溫度分布容易變得不均一等 問題’從騎對已龍k的製品的品質造衫良影響。 作為解決此種透明基板的翹曲的問題的手段,已於 利文獻2至專利文獻4中提出有以下技術。 專利文獻2至專利文獻4中,構成為如下:設置 個支持構件,4支持構件於將被加卫物搬人至層壓參置 ΓI?行升降動細使得被加工物能夠與熱板隔開而载 置。層壓加工以如下方式來進行。於上殼體與下殼體 =放的狀態下使被加工物在使升降手段作㈣上升 構件上與熱板隔開從而载置該被加讀。_, = 201233554 39131pif 2下殼咖合的狀將其㈣㈣抽成衫。在抽成 二工後^吏升降手段作動而使支持構件下降,當將被力σ工 載置於熱板上時’開始被加卫 。將大 至上殼體的膜片的上部,膜片朝下方膨t從而在 膜片與熱板之間夾壓被加工物而進行賴加工。 專利=獻2至專利文獻4中,在抽真空結束之前,被 、物均藉由支持構件而與熱板隔開。因此,就被加工物 的加熱而s,是在抽真空結束後被加工物與熱板接觸而開 始加熱畴在難以驗層壓加工賴的問題。 然而’專利文獻2以及專利文獻3中存在以下的問題。 =將被加工物搬人至層壓裝置_情況下,由於熱板上支 、銷上升因此搬入被加工物時將被加工物載置於叉形狀 的卫作台上,使該卫作台移動至|置内而將被加 工物载置於支持銷上’因而在藉由】台層壓裝置對多片被 加工物同時精層壓加卫的情況下構造變得複雜。 v 寻扪文獻4存在如下的問題。將被加工物搬乂 ,層壓裝置㈣方法使用了搬送片材。構成為於熱板上信 =個矩形狀的板上升而與熱板關從而將被加卫物搬入互 對L内二結束而將被加工物載置於熱板上卷 了视加工物進仃加熱時的熱板的接觸的面積減少 多又個矩形狀板的面積的量。因此,僅利用熱板則加熱1 從而要自膜片的上部吹熱風。因此層㈣ 成' 雜且價格高。 佴成滅付不 【發明内容】 201233554. Jvuipif 本發明鑒於上述情況而完成,其目的在於獲得一種層 壓裝置及層壓方法’即便在將1片以上的被加工物同時搬 入至1台層壓裝置而進行層壓加工的情況下,亦可減少作 為被加工物的構成構件的透明基板的翹曲等,可縮短層壓 加工時間並可將製品品質維持為規定基準以上。 用以達成上述目的的第1發明的層壓裝置包括藉由膜 片而分隔的上腔室與下腔室,下腔室中設置著熱板,藉由 在忒熱板上移行的搬送片材來搬入被加工物並進行層壓加 工,該層壓裝置的特徵在於:包括升降構件,該升降構件 用於在將上述被加工物載置於搬送片材上且向層壓裝置搬 入時自上述熱板提昇該搬送片材而進行搬送;上述升降構 件構成為如下:於將上述被加工物向上述層壓裝置内搬入 日寺上升,而將載置著該被加讀的搬送片材在自熱板提昇 的狀態下移行,於上述被加工物搬送至熱板上的規定的位 置為止的時間點下降,從而將上述被加工物經由搬送片材 而載置於熱板上。 ^發明的層魏置的特徵在於:於第ι發明的層廢 :上述升降構件包含藉*驅動手段使提昇銷(lift pin)進行升降動作的銷提昇機構。 =3發明的層壓襄置的特徵在於:於第2發明的層壓 二,上述升降構件的銷提昇機構包括多根提昇 ^该些提昇銷設置為··自下表面平衡喊㈣置被加工 才’藉此可將該被力,寺為水平狀201233554 jyuipif VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a laminating apparatus for use in laminating a solar cell module or the like as a force-injected object, and a device using the same Lamination method. θ [Prior Art] As described above, such a laminating apparatus includes, for example, an upper casing having a diaphragm (swell and swollen) that expands in a downward direction, and a lower casing having a hot plate. Further, when laminating the solar cell module, the first component of the solar cell group in which the constituent members are superimposed is transported to the lower casing in which the upper casing and the lower casing are opened up and down. Hot 2. Then, the 'lamination|closes the upper case and the lower case, and the space formed by the upper case becomes a vacuum state, and in the state where the dam and the body member are heated, the money is tilted upward. The solar cell is obtained in the form of a solar cell. [PRIOR ART DOCUMENT] [Patent Document] [Patent Document 3] Japanese Patent Laid-Open Publication No. Hei No. Hei. In the laminating apparatus of the Japanese Patent No. 3,759,257, the above-mentioned laminating apparatus, the workpiece 4 such as a solar cell module is 201233554. oy id ipif is carried in by the pre-processing step The conveyor or the like is transported to the front side of the laminating apparatus, and then transferred to the transport sheet that circulates on the hot plate of the laminating apparatus and transported to the predetermined position of the heat (4) of the laminating apparatus. . At this time, the hot plate is heated in order to be subjected to lamination processing. The transport sheet is transported on the hot plate, and the transparent substrate (for example, a glass substrate) that is mounted on the transport sheet and transported as a constituent member of the workpiece is transported through the sheet. The hot plate is heated, and the clock is produced before the lamination process. The surface curvature of such a transparent substrate is caused to be a greater problem in the case where one laminating apparatus is used to perform lamination processing while a plurality of sheets are being read. θ, that is, the first piece of the workpiece to be processed is heated from the hot plate until the last piece of the plurality of pieces is finished by the addition of the object, and thus a big interest is generated. In addition, it has been known that if the surface is curved on the workpiece, the temperature distribution in the workpiece during the lamination process tends to become uneven, and the quality of the product from the ride on the dragon k is good. influences. As means for solving the problem of warpage of such a transparent substrate, the following techniques have been proposed in Patent Document 2 to Patent Document 4. Patent Document 2 to Patent Document 4 are configured as follows: a support member is provided, and the support member is moved to the laminating material by the lifting member so that the workpiece can be separated from the hot plate. And placed. The lamination process is carried out in the following manner. In the state in which the upper casing and the lower casing are placed, the workpiece is placed on the rising member (4) as the lifting member is separated from the hot plate, and the reading is placed. _, = 201233554 39131pif 2 The shape of the lower shell is made into (4) (four) into a shirt. After the second work is completed, the lifting means is actuated to lower the supporting member, and when it is placed on the hot plate by the force σ, the 'starting to be reinforced.' The upper portion of the diaphragm of the upper casing is swollen downward, and the workpiece is pressed between the diaphragm and the hot plate to perform processing. In Patent No. 2 to Patent Document 4, before the end of the vacuuming, the objects and the objects are separated from the hot plate by the supporting members. Therefore, the heating of the workpiece is a problem in which the workpiece is brought into contact with the hot plate after the vacuuming is completed, and the heating domain is started to be difficult to laminate. However, Patent Document 2 and Patent Document 3 have the following problems. = When the workpiece is moved to the laminating device, the workpiece is placed on the fork-shaped table when the workpiece is loaded, and the table is moved. When the workpiece is placed on the support pin, the structure is complicated in the case where the plurality of workpieces are simultaneously finely laminated and reinforced by the stage laminating apparatus. v Looking for document 4 has the following problems. The workpiece is moved, and the laminating apparatus (4) method uses a conveying sheet. The structure is such that the rectangular plate is raised on the hot plate and is closed with the hot plate, so that the object to be loaded is carried into the opposite pair L, and the workpiece is placed on the hot plate and rolled into the workpiece. The area of contact of the hot plate during heating is reduced by the amount of area of the rectangular plate. Therefore, only 1 is heated by the hot plate to blow hot air from the upper portion of the diaphragm. Therefore, the layer (4) is 'mixed' and the price is high. The present invention has been made in view of the above circumstances, and an object thereof is to obtain a laminating apparatus and a laminating method 'even when one or more workpieces are simultaneously loaded into one lamination When the apparatus is subjected to the lamination process, the warpage of the transparent substrate as the constituent member of the workpiece can be reduced, and the lamination processing time can be shortened, and the product quality can be maintained at a predetermined standard or more. A laminating apparatus according to a first aspect of the invention for achieving the above object includes an upper chamber and a lower chamber partitioned by a diaphragm, and a hot plate is disposed in the lower chamber, and the conveying sheet is moved by the hot plate. The laminating apparatus is characterized in that it includes a lifting member for loading the workpiece onto the conveying sheet and loading it into the laminating apparatus from the above The hot plate lifts the transport sheet to carry it, and the elevating member is configured to move the workpiece to the cultivating device in the laminating device, and to place the transported sheet on the self-reading sheet. When the hot plate is lifted, the workpiece is moved to a predetermined position until the predetermined position is transferred to the hot plate, and the workpiece is placed on the hot plate via the transfer sheet. The layer of the invention is characterized in that the layer of the first invention is waste: the lifting member includes a pin lifting mechanism that causes the lifting pin to perform a lifting operation by means of a driving means. The laminated device of the invention is characterized in that, in the laminate 2 of the second invention, the pin lifting mechanism of the lifting member includes a plurality of lifting members, and the lifting pins are provided as: · are processed from the lower surface balance (four) Only 'this can be the force, the temple is horizontal

S 7 201233554 39131pif 第4發明的層麵置的特徵在於: 3發明的層壓裝置中,上述提昇銷的、發第 第5發明的繼置的特徵在於:於=开二狀+坦。 發明中的任一發明的層壓裝置中,、弟2兔明至第4 昇銷的前端設置著低摩擦部,該低】升降構件的提 物的搬送片材之間的滑動接觸^力小^與載置著被加工 J6發明的層壓裝置的特徵在於:於第 =的任-發明的層壓㈣,上述被加工‘“電 用以達成上述目的的第7發明的 置’該層壓裝置包括藉由膜片而分隔的上腔室=裝 板層Γ在該熱板上移行的搬送繼 於將被加工物搬人至層壓|置時,使升降構件=,节 將^被加工物載置於搬送片材上而向:壓 裝置搬人時自上職板提昇物w材㈣行搬送 載置著被加工物的搬送片材自熱板提昇的狀態下使搬送片 丁而將被加工物搬入至層壓裝置内;於將該被加工物 1、、、板上的規定的位置的搬人結束的時間點使升降構件下 n而將被加工物經由搬送片材而載置於熱板上 進行層壓加工。 [發明的效果] 如以上所說明般,根據第1發明的層壓裝置或者第7 lx月的層壓方法’因構成為如下’即,設置著升降構件, 8 201233554 3yi^lpif 二:'降?將被加工物向該裝置搬入時將搬送被加工物 材提昇,使該升降構件上升而搬人載置於該搬送 Μ被加工物且在被加工物位於熱板上的規定部位 =吏升降構件下降,將該被加工物經由搬送片材而載置於 異=果從而進行層壓加工,故可實現如下所述的各種優 蔣if即’於為了對1片以上的被加讀進行層壓加工而 入至層職置的情況下,於利用升降構件將搬送片 的狀S下進雜人,且於搬人結賴使升降構件下 1=由搬送諸載置於熱板上,因而祕加工前被加工 =會自熱板受到多餘的熱。因此,作為被加功的構成 2的透明基板不會產生翹曲,從而被加工物内的溫度分 滞均一且經層壓加工的製品的品質提高。 而且’利用層壓裝置同時進行層壓加工的多片製品的 口口質的差異消除。 此外,經層壓加工的製品的品質不僅穩定,且不 ^壓加工時的透明基板的勉曲,因而比起有翹曲的先前的 月况’被加工物的各部提前達到目標溫度因而可縮 加工時間。 根據第2發明的層壓裳置,將升降構件設為提昇銷, 因而升降機構簡單’進而相對於熱板的整體面積,銷提昇 ^的面積非常小,不會對被加卫物的加熱造成影響,從而 無需因加熱不足而設置熱板以外的其他加熱手段。 根據第3發㈣的層壓紫置’將作為升降構件的提昇銷 201233554 39131pif 配置成自下表面平衡地支撐搬送片材,因而即便使搬送片 材在提昇銷上移行,亦可使搬送片材順利地移行從而將被 加工物搬送至層壓裝置。 二根據第4發明的層壓裝置,作為升降構件的提昇銷的 前端部為平坦面,因此不會產生搬送片材破損這樣的問題 而可將被加工物搬送至層壓裝置。 、根據第5發明的層壓裝置,於在搬入被加工物時使作 為升降構件的提㈣上升的狀態下,即便使搬送片材在提 昇銷上移行,因提昇銷上形成著低摩擦部,故不會產生搬 送片材破損等的問題而可將被加工物搬送至層壓裝置。 根據第6發明的層壓裝置,可提高作為被加工物的太 陽電池模_品質,並且可縮短太陽電池模組的加 【實施方式】 圖1 f圖12⑷、圖12⑴用於說明本發明的層壓 裝置的-實施形態,以下藉由該些圖來對本發明的 置及使用該裝置的層壓方法進行說明。 曰&quot; &lt; 1 &gt;太1¼電池模組。 首先,對本發_㈣裝置以及制該裝置的#壓方 法所處理的對象即被加工物1〇的例子進行說明。 圖1是表示作為被加工物10的太陽電池模組的構造的 太陽電池模組(10)如圖示般,具有如下構 置於下側的透明的蓋玻璃n與配置於上 ^ 13 .14 (sandw 201233554 jipif 池串(string ) 15。 此處,背面材料12例如使用《乙稀樹脂等的不透明的 材料。填充㈣13、14中例如使用乙烯醋酸乙_ (ethyiene vinyl acetate ’ EVA )樹料。多列電池串 15 構 成為在電極16、17之間經由導線19而連接太陽電池單元 18° 作為被加卫物10,—般而言亦可將稱作細式太陽電 池作為對象。於該薄職太陽電池的代表構造财,是在 配置於下側的it明的I玻璃上預先蒸鑛包含透明電極 導體、背面電極的發電元件而成。此種薄膜型太陽電池模 ’、且為如下構k ’即’將玻璃朝下配置’且將填充材料覆 於玻璃上的太陽電池元件之上,進而在填充㈣上覆蓋 面材料,從而藉由進行真空加熱層壓而製成。 如此’作為被加工物10的薄膜式太陽電池模組中 將結晶轉元較為蒸㈣成的發電元件, 造與上述結晶系單元的情況相同。 封構 此處,作為本發明的層壓裳置中所使用的被加工物10 即太陽電池’呈現出-邊的尺寸為1 m〜2 m左右的 矩形板狀,且重量為4〇 Kg左右。 &lt;2&gt;整體的構成。 圖2是適用本發明的層壓裝置100的正視圖。 在圖2所示的層職置⑽的左側,有搬入輸送機 200 ’在右側有搬出輸送機3〇〇。搬入輸送機200將作為自 此進仃層壓加卫的被加卫物1G的太陽電池池供給至層S 7 201233554 39131pif The layered device according to the fourth aspect of the invention is characterized in that, in the laminating apparatus of the invention, the lift pin and the relay of the fifth invention are characterized in that: In the laminating apparatus according to any one of the inventions, the front end of the second to fourth lifting pins is provided with a low friction portion, and the sliding contact between the conveying sheets of the low lifting member is small. And a laminating apparatus according to the invention of J6, characterized in that in the lamination (four) of the invention of the invention, the above-mentioned processing of the seventh invention which is processed to achieve the above object The apparatus includes an upper chamber separated by a diaphragm, a loading layer, and a transfer on the hot plate. Following the transfer of the workpiece to the laminate, the lifting member is replaced, and the section is processed. When the object is placed on the transporting sheet, the sheet is conveyed from the upper plate lifter w material (four), and the transport sheet on which the workpiece is placed is lifted from the hot plate to transport the sheet. The workpiece is carried into the laminating apparatus, and the elevating member is lowered by n at the time when the loading of the predetermined position on the workpiece 1 and the sheet is completed, and the workpiece is placed on the sheet by transporting the sheet. Lamination processing is performed on a hot plate. [Effects of the Invention] As described above, the laminate according to the first invention Or the 7th lx month lamination method 'supplemented as follows', that is, the elevating member is provided, 8 201233554 3yi^lpif 2: 'Down? When the workpiece is carried into the device, the material to be processed is lifted, so that When the elevating member is lifted up and placed on the conveyed crucible workpiece, and the predetermined portion of the workpiece on the hot plate is lowered, the elevating member is lowered, and the workpiece is placed on the sheet by the conveyance sheet. Therefore, the laminating process is carried out, so that it is possible to realize the transfer of the sheet by using the elevating member in order to perform lamination processing for one or more sheets to be placed in the layer position. In the shape of S, the person is in the middle of the person, and the person who is attached to the lifting member is placed on the hot plate under the lifting member, so that it is processed before the secret processing = the excess heat is received from the hot plate. The transparent substrate of the energized composition 2 does not warp, and the temperature in the workpiece is uniform and the quality of the laminated product is improved. Moreover, the multi-piece product which is simultaneously laminated by the laminating device The difference in mouth quality is eliminated. The quality of the laminated product is not only stable, but also the distortion of the transparent substrate during the processing, so that the parts of the workpiece reach the target temperature in advance and thus the processing time can be shortened compared to the previous month with warpage. According to the laminated skirt of the second aspect of the invention, the elevating member is used as the lift pin, so that the elevating mechanism is simple, and the area of the pin lift is extremely small with respect to the entire area of the hot plate, and the heated object is not heated. In addition, it is not necessary to provide a heating means other than the hot plate due to insufficient heating. According to the third aspect (four), the laminated purple set 'is a lifting pin 201233554 39131pif as a lifting member to support the conveying sheet in a balanced manner from the lower surface, Therefore, even if the conveyance sheet is moved on the lift pin, the conveyance sheet can be smoothly moved to convey the workpiece to the laminating apparatus. According to the laminating apparatus of the fourth aspect of the invention, since the front end portion of the lift pin as the elevating member is a flat surface, the workpiece can be conveyed to the laminating apparatus without causing a problem that the transport sheet is broken. According to the laminating apparatus of the fifth aspect of the invention, when the workpiece (4) as the elevating member is raised while the workpiece is being loaded, even if the conveying sheet is moved over the lifting pin, a low friction portion is formed on the lifting pin. Therefore, the workpiece can be conveyed to the laminating apparatus without causing problems such as breakage of the conveying sheet. According to the laminating apparatus of the sixth aspect of the invention, the solar cell module-quality as the workpiece can be improved, and the solar cell module can be shortened. [Embodiment] FIG. 1f, FIG. 12(4), and FIG. 12(1) are used to explain the layer of the present invention. The embodiment of the pressure device will be described below with reference to the drawings and the lamination method using the device.曰&quot;&lt; 1 &gt; too 11⁄4 battery module. First, an example of the object to be processed which is the object to be processed by the present invention and the #pressure method for manufacturing the device will be described. 1 is a solar battery module (10) showing a structure of a solar battery module as a workpiece 10, as shown in the figure, having a transparent cover glass n disposed on the lower side and disposed on the upper surface. (sandw 201233554 jipif pool string (string) 15. Here, as the back material 12, for example, an opaque material such as an ethylene resin is used. For filling (4) 13, 14 for example, ethyiene vinyl acetate 'EVA tree material is used. The multi-column battery string 15 is configured such that the solar cell unit 18 is connected between the electrodes 16 and 17 via the wires 19 as the object to be affixed 10. In general, a thin solar cell can be used as the object. It is a representative structure of the solar cell, and the photovoltaic element including the transparent electrode conductor and the back electrode is preliminarily distilled on the I glass disposed on the lower side of the solar cell. k 'that 'configures the glass face down' and coats the filler material on the solar cell elements on the glass, and then covers the surface material on the filling (4), thereby making it by vacuum heating lamination. In the thin film type solar cell module of the work object 10, the power generating element in which the crystal transfer element is steamed (four) is formed in the same manner as in the case of the above crystal system unit. The seal is used herein as the laminated skirt of the present invention. The workpiece 10, that is, the solar cell' has a rectangular plate shape having a size of about 1 m to 2 m, and has a weight of about 4 〇Kg. <2> Overall configuration. Fig. 2 is a layer to which the present invention is applied. Front view of the press device 100. On the left side of the floor position (10) shown in Fig. 2, there is a carry-in conveyor 200' on the right side with a carry-out conveyor 3〇〇. The carry-in conveyor 200 will be laminated as a self-propelled stacker. The 1G solar cell pool is supplied to the layer

S 11 201233554 jyuipif 壓部,搬出輸送機300將經層壓加工的被加工物i〇搬出。 而且 …亥些搬入輸送機200、層壓裝置1〇〇及搬 出輸送機的順序進行交接,—面朝向圖2的右讎送 被加工物10,且進行向層壓部的搬入、搬出。 而且’層壓裝置100巾設置著搬送片材130,該搬送 片材130用於自搬入輸送機2〇〇接收被加工物1〇,並移交 至搬出輸送機3〇〇。 &lt;3&gt;層壓部。 然後’藉由圖3來對本發明的層壓裝置的層壓部進行 說明。利用本發明的層壓裝置100進行層壓加工的被加工 物10即太陽電池模組是丨片或者多片同時進行層壓加工, 但此處為了間化說明’而圖示1片的狀態。 圖3是表示層壓部101的剖面圖。 以將上设體110的内部水平分隔的方式安裝著膜片 112,由該膜片112與上殼體110的内壁面包圍的空間成為 上腔至113。膜片112使用的是氟系的橡膠等的具有时熱 性的橡膠等。 而且,上殼體110的上表面設置著與上腔室113連通 的吸氣/排氣口 114,可將該吸氣/排氣口 114與未圖示的真 空泵連接而將上腔室113内抽成真空,或者與外部氣體連 接而向上腔室113内導入大氣壓。 在作為下殼體120的内部空間的下腔室121内配置著 熱板(板狀加熱器)122。熱板122如圖3或圖4所示,自 下腔室121的底部由支持體等支持。 12 201233554 乃丄:npif 在下殼體120的下表面以與下腔室121連通的方式設 置著吸氣/排氣口 123。下腔室121構成為:上方藉由上殼 體110而密封,可自吸氣/排氣口 123將下腔室121内抽成 真空’或可自該吸氣/排氣口 123而向下腔室121内導入大 氣壓。 &lt;4&gt;層壓加工的步驟。 被加工物10的層壓加工按照如下方式來進行。 首先’ 一面使搬送片材130移行驅動一面搬送被加工 物10,當到達層壓位置時停止。 關閉上殼體110且重疊於下殼體120上,將吸氣/排氣 口 114、123與真空泵連接,從而將上腔室113與下腔室 121内的空間減壓。 而且,熱板122受到加熱,被加工物1〇通過搬送片材 130而自熱板122受到加熱。 上腔室113與下腔室121内的空間達到規定的真空度 後,向上腔室113内導入大氣。 藉此,如圖4所示’膜片112朝下方膨脹,從而將被 加工物10強有力地按壓至熱板122。 被加工物10藉由熱板122而加熱,被加工物1〇内的 填充材料13、14炼融,從而填充材料發生交聯反應且受到 層壓加工。 層壓加工結束後,向下腔室121内導入大氣,打開上 殼體110。搬送片材130移行驅動而被加工物1〇向圖2的 左方前進並到達搬出位置’交接給搬出輸送機3〇〇後被搬 13 201233554 39131pif 出。被加工物的搬出結束後自搬送輸送機2〇〇接收下一個 被加工物1〇,並重複上述步驟。 &lt;5&gt;透明基板的翹(曲的問題。 具有上述構造的層壓裝置1〇〇中,還有在向層壓部1〇1 内搬入被加工物10時採用以下方法的裝置。亦即,當向層 壓裝置内搬入被加工物10時,使搬送片材130在熱板上移 行而搬送被加工物,且在到達熱板丨22上的規定的位置 後’藉由圖5(a)、圖5(b)所示的構造的多個提昇銷6〇〇 將被加工物10提昇而與熱板122隔開’經過固定時間後使 提幵銷600再次下降,從而被加工物經由搬送片材 而載置於熱板上,且利用&lt;4&gt;中所說明的方法進行層壓加 工。 然而,在採用此種方法的情況下,於在熱板122上使 搬送片材130移行而搬送被加工物1〇且搬送至熱板上的規 定位置的期間内,被加工物1〇自熱板受熱,從而透明基板 上產生翹曲。因該透明基板的翹曲,被加工物1〇的面方向 上的溫度分布產生不均一,從而會對層壓加工後的製品的 品質造成不良影響。 ,此外’若採用上述方法,則在搬入多片被加工物1〇 並同時進行層壓加OL的情況下’線人的被加讀會產生 更大的翹曲。藉此,存在搬入的多片被加工物之間產生製 品品質的差異的問題。 &lt;6&gt;提昇銷的構成(實例υ 根據本發明’在上述構成的層壓裝置100中,如圖6 201233554, (a)、圖6(b)所示’設置著多個構成作為升降構件的銷 提昇機構的提昇銷400,該提昇銷400於向層壓部1〇1内 搬入被加工物10時’使載置著該被加工物1〇的搬送片材 13 0在自熱板122 k幵的狀態下移行。 另外’此種提昇銷400只要利用設置在例如熱板122 的下方的升降式的氣缸等進行升降動作即可。該些提昇銷 400的個數或配置、氣缸等的驅動手段的個數或配置等只 要適當設定即可。 設置多個此種提昇銷400,使提昇銷4〇〇上升,從而 在1亥提昇銷上使搬送片材移行而將被加工物1〇向層壓部 101搬入。然後,於被加工物10到達層壓部1〇1内的熱板 122上的規定位置的時間點使提昇銷4〇〇下降,從而將被 加工物10載置於熱板上。藉此,不再如先前般,將被加工 物搬入至層壓裝置時蓋玻璃11會接觸到熱板m,從而可 ^制該蓋玻璃11的_。同時,可使該被加讀H)的面 向上的溫度分布變得均―,可實現層壓加 且可提高製品品質。 如FI1 ^據本發明’構成為將提昇銷_的前端形狀 圖6 (〇、圖6 (b)等所示變更為平 對於搬送片材m装、隹&quot;又更马十坦面开/狀從而相 5(aN m —進仃面接觸,且銷直徑亦比先前的圖 〜12 · 所不的銷直徑粗。例如將銷直徑設為0 mm 物10 όΓ苗:^设為8 mm〜10 mm。此處,可根據被加工 直徑或個;。璃11等的重量或搬送片材的对久性來選定銷 15 1 201233554 為如送片材13G接觸的前端部形成 為如圖5 (a)、圖5⑴所示的尖狀, 加工物的搬送方法,則會產生以下㈣月的被 送片材於該提昇銷_上移行來搬送被加工 傷箄600的前端形狀,搬送片材容易產生損 昜專或者其哥中縮紐的問題。例如亦有如下資料:在 續運,的情況下,經1週左右搬送&gt;1材發生斷裂。 若如此將提昇銷的形狀設為圖6 (a)、圖6 (b 的形狀’則使搭載著被加讀1G職送片材⑽在上升的 =:=而能夠儘可能地防止搬送片材的損傷, &lt;7&gt;被加工物的搬送方法。 ,顧7(a)、圖7(b)、圖8(a)、圖8(b)以及圖 U)〜圖9 (e)來說_上述構成的層壓裝置⑽搬送 被加工物1G的方法。該些圖是說明利们台層壓裝置來對 3片被加工物進行層壓加工的狀況的圖。表示了在提昇銷 上升的狀態下使搬送片材移行而自第i片被加工物開 始依序搬入至層壓裝置内的狀況。 另外圖中表示了提昇銷400的配設位置針對各被加 工物10而示意性地設為9個的情況。圖中,〇標記、X桿 記的位置為提㈣位置“標記位置表示提昇銷位於被: =物=了側。。標記位置表示提昇銷未由被加卫物遮住。 當然提昇銷的個數並不限於此,可設定為適當的個數。 圖7 (a)、圖7 (b)表示將第1片被加工物搬入至層 201233554. u ipif 壓裝置的狀態,圖8 (a)、圖8 (b)表示將第2片被加工 物搬入至層壓裝置的狀態,圖9(a)〜圖9(e)表示將第 3片被加工物搬入至層壓裝置的狀態。圖7 (&amp;)、圖8 (&amp;) 以及圖9(a)是已搬入被加工物的狀態的平面圖。圖7(b)、 圖8(b)以及圖9(b)是已搬入被加工物的狀態的側面圖。 圖9 (c)表示提昇銷4〇〇下降,所有的被加工物1〇經由 搬送片材130而載置於熱板122上的狀態。 亦即,根據本發明’當被加工物1〇按照第1片、第2 片、第3片的順序載置於搬送片材13〇上且搬入至層霍部 101内時,提昇銷400全部上升,且維持提昇的狀態。因 此,所有的被加工物10在熱板122上以規定間隔而隔開的 狀態下搬入’且搬送至該熱板122的規定位置為止。 5亥狀下,提昇銷400下降,被加工物10載置於熱板 122上。藉此’在各被加工物10載置於熱板122上之前, 太陽電池模組内的蓋玻璃11 (透明基板)不會產生翹曲, It由熱板122以所需要的狀態加熱,並進行層壓加工。 另外’於圖7(a)、圖7(b)、圖8(a)、圖8(b)、 圖9 (a)〜圖9 (c)的例子中,表示在層壓裝置1〇〇中, 向層壓部101内搬入3片被加工物10,同時進行層壓加工 的情況。當然不限定於此,關於被加工物10的片數,可設 定適當的片數。 &lt;8&gt;包括熱板保護片材的熱板的實施形態(實例2)。 圖1〇表示在熱板122上設置著熱板保護片材500的情 況。 s 17 201233554 jyuipif 該情況下’因在熱板122上設置著熱板保護片材5〇〇, 故在適用本發明時’若作為升降構件的提昇銷4〇〇上升, 則熱板保護片材500亦被提昇相當於提昇銷4〇〇上升的部 分。因此,當將被加工物10搬入至層廢裂置1〇〇 (層壓部 101 )内時,搬送片材130在熱板保護片材5〇〇上載置著被 加工物10而進行移行。該熱板保護片材被載置於熱板122 上且僅由螺栓等固定4角,從而若提昇銷4〇〇上升,則可 簡單地提昇。 在為此種構成的情況下,若載置著被加工物而使搬送 片材移行,則熱板保護片材5〇〇與搬送片材13〇之間產生 摩擦而搬送ϋ材受損從㈣致斷裂。@崎於熱板保護片 材500而言:要設法減少與搬送片材13〇之間的摩擦。 例=使氧樹脂含浸於作為熱板保護片材的这材的玻璃 中。藉此熱板保護片材5〇〇與搬送片材13〇之間的摩擦 ’使提幵銷上升而搬送被加工物的情況下的兩片材的 才貝傷減少,從而其壽命延長。 &lt;9&gt;设置著低雜部的提昇躺實施形態 (實例3)。 ί成上述升降構件的提昇銷彻的前端以平坦面形 执置‘麽,進行面接觸,但亦可構成為在提昇銷的前端部 料,該低摩擦材料即便在載置著被加工物10 阻力亦小。I30於提昇銷400的前端部移行,其滑動接觸 圖 11 (a) 产| 樹脂構件提昇銷401的前端設置著低摩擦的 、乂心、剖面圖。作為低摩擦的樹脂,可使用氟 201233554 , xpit 樹脂等。包含該㈣脂的圓检狀的構件4〇6以可更換的形 式安裝在提昇銷401的前端部。而且,圖u (b)是在提 昇銷402 &amp;前端部設置著低摩擦材料層4〇7的實例。作為 ,摩擦材料層407 ’可採用钼的騎層或氟樹脂的塗敷層 等。 而且,圖UU)、圖12(b)中,構成為:為了減小 提幵銷與搬送片材之間的滑動接觸阻力,*在提昇銷的前 端設置著鮮的轉動體。圖12(a)是自搬送片材的移行 移動的方向觀察本實例的提昇_圖式。_ 12⑴是圖 12 ( a )的側面圖。如圖开^ 曰处』 移行移:方二矩:: 错由銷而旋轉支持的圓筒狀的輥408。作 為轉Ϊ體亦可使㈣筒狀_核球雜的軸承。 構成’即便载置著被加工物的搬送片材 轉從而與搬制材之間的摩擦減少:送片 材的扣傷減少,從而其壽命延長。 造二實施形態中所說明的構 行適當變形、2 0的各部的形狀、構造等進 例如,在上述實施形態中,關於作為被Λ工物Μ女 陽電池模組’例示了使用一邊為匕== ===組的情況,但本發明並不限定於此亦可 為/、有適s尺寸的所需形狀的被加工物10。 201233554 39131pif 進而,此種層壓裝置1〇1並不限定於適用於上述太陽 電池模組等,只要是類似於此的被加工物10當然皆可適 用’且可發揮效果。 而且,關於構成作為升降構件的銷提昇機構的銷提昇 彻的升_祕,可使恥知的驅動手段。例如可使用 空壓、油壓等的流體壓氣缸袋置,但並不限定於此,可考 慮採用藉助各種構造的轉手段,例如使職珠螺桿、齒 條齒輪(rack and _οη)等的機械式驅動裝置,或者將 動馬達等組合於該機械式驅動X置中㈣成的裝置等。 【圖式簡單說明】 圖1是將作為本發明的層壓裝置的被加 β 池模組分解表示的剖面圖。 町太刼θ 概略=用以說明適用本發明的纖置的整體構成* 圖3是表示圖2的層壓裴置的層壓部的剖面圖。 工的轉圖2的層壓裝㈣層壓部中進行層壓力 圖5 ?)、圖5 (b)是例示在圖2的層壓裝 “ 使用的提昇銷的動作說明圖。 &amp;罝中先則 銷機構# 圖6 (a)圖6 (b)是表示本發明的層壓裝 施?態,料^雜的升轉料㈣的4的一貫 提昇銷的動作說明圖。 圖7 (b)是表示本發明的層壓裝置的-負 &amp;〜 ^藉由作為要部的提㈣方式將被加工物 20 201233554 jyuipif 搬入至層壓部的情況的動作說明圖。 ,,8(a)、圖8(b)是表示本發明的層一恭 把形恶’且是表不藉由作為要部的提昇銷二 搬入至部的情況的動作說明圖。 式將破加工物 圖 9 (a)、圖 9 (b)、圖 9 () :置&quot;施形態,且是表示藉 將=?:至層壓部的情況的動作:Γ 提昇發明的層壓裝置中的其他實施形態的 圖11 (a)、圖u (b)是在本發 提昇銷的前端部設置著低座坡 a裝置中,在 明圖。 低摩擦相其他例的實施形態的說 圖 12 (a)、 =銷的前端部設置著低‘==:的: 【主要元件符號說明】 10:被加工物(太陽電池 11 :蓋玻璃(透明基板) 12 :背面材料 13 ' 14 :填充材料 15 :電池串 16、17 :電極 18 :太陽電池單元 19 :導線 21 201233554 ^yi^ipif 100 :層壓裝置 101 :層壓部 110 :上殼體 112 :膜片 113 :上腔室 114、123 :吸氣/排氣口 120 :下殼體 121 :下腔室 122 :熱板(板狀的加熱器) 130 :搬送片材 200 :搬入輸送機 300 :搬出輸送機 400、401、402、403 :提昇銷(升降構件) 406 :圓柱狀的構件 407 :低摩擦材料層 408 :圓筒狀的輥 500 :熱板保護片材 600 :先前的提昇銷 22S 11 201233554 jyuipif Pressing section, the unloading conveyor 300 carries out the processed workpiece i. In addition, the loading conveyor 200, the laminating apparatus 1 and the unloading conveyor are sequentially transferred, and the workpiece 10 is conveyed toward the right side of Fig. 2, and the laminating portion is carried in and out. Further, the "lamination apparatus 100" is provided with a transport sheet 130 for receiving the workpiece 1 from the transport conveyor 2, and transferring it to the carry-out conveyor 3A. &lt;3&gt; Laminated portion. Then, the laminated portion of the laminating apparatus of the present invention will be described with reference to Fig. 3. The workpiece 10 to be processed by the laminating apparatus 100 of the present invention, that is, the solar cell module, is a laminate or a plurality of sheets, and the sheet is processed at the same time. FIG. 3 is a cross-sectional view showing the laminated portion 101. The diaphragm 112 is attached so as to horizontally partition the inside of the upper body 110, and the space surrounded by the diaphragm 112 and the inner wall surface of the upper casing 110 becomes the upper chamber 113. As the diaphragm 112, a rubber having a heat such as a fluorine-based rubber or the like is used. Further, the upper surface of the upper casing 110 is provided with an intake/exhaust port 114 that communicates with the upper chamber 113, and the intake/exhaust port 114 can be connected to a vacuum pump (not shown) to be placed in the upper chamber 113. The vacuum is drawn or connected to the outside air to introduce atmospheric pressure into the upper chamber 113. A hot plate (plate heater) 122 is disposed in the lower chamber 121 which is an internal space of the lower casing 120. The hot plate 122 is supported by a support or the like from the bottom of the lower chamber 121 as shown in Fig. 3 or Fig. 4 . 12 201233554: npif The intake/exhaust port 123 is provided in the lower surface of the lower casing 120 so as to communicate with the lower chamber 121. The lower chamber 121 is configured such that the upper portion is sealed by the upper casing 110, and the inside of the lower chamber 121 can be evacuated from the intake/exhaust port 123 or can be pulled downward from the intake/exhaust port 123. Atmospheric pressure is introduced into the chamber 121. &lt;4&gt; Step of lamination processing. The lamination processing of the workpiece 10 is carried out as follows. First, the workpiece 10 is conveyed while the transport sheet 130 is being driven, and is stopped when it reaches the lamination position. The upper casing 110 is closed and overlapped with the lower casing 120, and the intake/exhaust ports 114, 123 are connected to the vacuum pump, thereby decompressing the space in the upper chamber 113 and the lower chamber 121. Further, the hot plate 122 is heated, and the workpiece 1 is heated by the sheet 130 by the sheet 130. After the space in the upper chamber 113 and the lower chamber 121 reaches a predetermined degree of vacuum, the atmosphere is introduced into the upper chamber 113. Thereby, the diaphragm 112 is expanded downward as shown in Fig. 4, and the workpiece 10 is strongly pressed to the hot plate 122. The workpiece 10 is heated by the hot plate 122, and the fillers 13 and 14 in the workpiece 1 are fused, whereby the filler material undergoes a crosslinking reaction and is subjected to lamination processing. After the lamination process is completed, the atmosphere is introduced into the lower chamber 121, and the upper casing 110 is opened. The conveyance sheet 130 is moved and driven, and the workpiece 1 is advanced to the left in Fig. 2 and reaches the carry-out position. The delivery is carried out to the carry-out conveyor 3, and then moved 13 201233554 39131pif. After the conveyance of the workpiece is completed, the next workpiece 1 is received from the conveyance conveyor 2, and the above steps are repeated. &lt;5&gt; The problem of the warp of the transparent substrate (the problem of the curvature). In the laminating apparatus 1 having the above-described structure, the following method is employed in the case where the workpiece 10 is carried into the laminating portion 1A. When the workpiece 10 is carried into the laminating apparatus, the conveyance sheet 130 is moved on the hot plate to convey the workpiece, and after reaching a predetermined position on the hot plate 22, "by FIG. 5 (a The plurality of lift pins 6 of the structure shown in FIG. 5(b) lifts the workpiece 10 and is separated from the hot plate 122. After a fixed period of time, the pick-up pin 600 is lowered again, so that the workpiece is processed. The sheet is conveyed and placed on a hot plate, and subjected to lamination processing by the method described in <4>. However, in the case of adopting such a method, the conveyance sheet 130 is moved on the hot plate 122. In the period in which the workpiece is transported to the predetermined position on the hot plate, the workpiece 1 is heated by the hot plate, and warpage occurs on the transparent substrate. The warpage of the transparent substrate causes the workpiece 1 to be processed. The temperature distribution in the direction of the surface of the crucible is not uniform, and thus the laminate processed product In addition, if the above method is used, in the case where a plurality of workpieces are loaded and OL is laminated at the same time, the addition of the lineman will cause greater warpage. There is a problem that a difference in product quality occurs between a plurality of workpieces that are carried in. <6> The configuration of the lift pin (Example υ According to the present invention, in the above-described laminating apparatus 100, as shown in Fig. 6 201233554, a), as shown in Fig. 6(b), a plurality of lift pins 400 constituting a pin lifting mechanism as a lifting member, which is loaded when the workpiece 10 is carried into the laminating portion 1? The conveyance sheet 130 in which the workpiece 1 is placed is moved in a state of being heated from the hot plate 122 k. Further, the lift pin 400 is simply used by a lift type cylinder or the like provided below the hot plate 122. The number of the lifting pins 400, the number of the lifting pins 400, the number of the driving means such as the cylinders, the arrangement, and the like may be appropriately set. A plurality of such lifting pins 400 are provided to raise the lifting pins 4, Therefore, the transport sheet is moved on the 1 liter lift pin and will be The workpiece 1 is carried into the lamination unit 101. Then, when the workpiece 10 reaches a predetermined position on the hot plate 122 in the lamination unit 1〇1, the lift pin 4〇〇 is lowered to thereby process the workpiece. 10 is placed on the hot plate. Thereby, the cover glass 11 is not in contact with the hot plate m when the workpiece is carried into the laminating apparatus as before, so that the cover glass 11 can be manufactured. The upward-facing temperature distribution of the read H) can be made uniform, and lamination can be achieved and the quality of the product can be improved. For example, according to the invention, the front end shape of the lifting pin _ is formed as shown in Fig. 6 (〇 Figure 6 (b) and the like are changed to flat for the transport sheet m, 隹 &quot; more horses open face / shape and phase 5 (aN m - face contact, and the pin diameter is also earlier than the previous Fig. ~12 · The pin diameter is not thick. For example, the pin diameter is set to 0 mm. 10 Seedlings: ^ is set to 8 mm to 10 mm. Here, it can be processed according to the diameter or the number; The weight of the glass 11 or the durability of the transport sheet is selected. The pin 15 1 201233554 is a tip end portion that is in contact with the sheet 13G, and is formed in a pointed shape as shown in Fig. 5 (a) and Fig. 5 (1). According to the method, the conveyed sheet of the following (fourth) month is transferred to the lift pin to move the front end shape of the processed scar 600, and the conveyed sheet is liable to cause damage or special problems. For example, in the case of the renewed shipment, the material is broken after about 1 week. When the shape of the lift pin is as shown in Fig. 6 (a) and Fig. 6 (the shape of b), it is possible to prevent the sheet from being conveyed as much as possible by the mounting of the read 1G sheet (10). Damage, &lt;7&gt; method of transporting the workpiece. , Gu 7 (a), Fig. 7 (b), Fig. 8 (a), Fig. 8 (b), and Fig. 9) to Fig. 9 (e) The method of transporting the workpiece 1G by the laminating apparatus (10) having the above configuration. These figures are diagrams for explaining a state in which a three-piece workpiece is subjected to lamination processing by a table laminating apparatus. In the state in which the lifted sheet is raised, the conveyance sheet is moved and the workpiece is sequentially loaded into the laminating apparatus from the i-th workpiece. Further, the figure shows a case where the arrangement position of the lift pins 400 is schematically set to nine for each workpiece 10. In the figure, the position of the 〇 mark and the X-position is the mentioning position (4). The marked position indicates that the lifting pin is located at: = object = side. The marked position indicates that the lifting pin is not covered by the garrison. Of course, the lifting pin The number is not limited to this, and can be set to an appropriate number. Fig. 7 (a) and Fig. 7 (b) show the state in which the first workpiece is carried into the layer 201233554. u ipif pressure device, Fig. 8 (a) (b) of FIG. 8 shows a state in which the second workpiece is carried into the laminating apparatus, and FIGS. 9(a) to 9(e) show a state in which the third workpiece is carried into the laminating apparatus. 7 (&), Fig. 8 (&), and Fig. 9(a) are plan views showing the state in which the workpiece is loaded. Fig. 7(b), Fig. 8(b), and Fig. 9(b) are loaded Fig. 9 (c) shows a state in which the lift pins 4 are lowered, and all of the workpieces 1 are placed on the hot plate 122 via the transport sheet 130. That is, according to the present invention. When the workpiece 1 is placed on the transport sheet 13 in the order of the first sheet, the second sheet, and the third sheet, and the sheet is placed in the layered portion 101, the lift pins 400 are all raised and maintained. status. In this way, all of the workpieces 10 are carried in a state where they are separated by a predetermined interval on the hot plate 122 and are transported to a predetermined position of the hot plate 122. 5, the lift pin 400 is lowered, and the workpiece 10 is processed. It is placed on the hot plate 122. Thus, before the workpiece 10 is placed on the hot plate 122, the cover glass 11 (transparent substrate) in the solar cell module does not warp, and it is replaced by the hot plate 122. Heating in a desired state and performing lamination processing. In addition, Fig. 7(a), Fig. 7(b), Fig. 8(a), Fig. 8(b), Fig. 9(a) to Fig. 9(c In the example of the workpiece 10, three sheets of the workpiece 10 are carried into the laminating unit 101, and the lamination process is performed. Of course, the sheet is not limited thereto, and the sheet of the workpiece 10 is not limited thereto. The number of sheets can be set as appropriate. <8> An embodiment of a hot plate including a hot plate protection sheet (Example 2) Fig. 1A shows a case where the hot plate protection sheet 500 is provided on the hot plate 122. s 17 201233554 jyuipif In this case, 'because the hot plate protection sheet 5 is placed on the hot plate 122, it is used as the lifting member when the present invention is applied. When the temperature rises, the hot plate protection sheet 500 is also lifted in a portion corresponding to the rise of the lift pin 4〇〇. Therefore, when the workpiece 10 is carried into the layer waste cracker 1 (the laminate portion 101) When the conveyance sheet 130 is placed on the hot plate protection sheet 5, the workpiece 10 is placed and moved. The hot plate protection sheet is placed on the hot plate 122 and fixed at only four corners by bolts or the like. When the lift pin 4 is raised, it can be easily raised. In the case of such a configuration, when the workpiece is placed and the transport sheet is moved, the hot plate protects the sheet 5 and the transport sheet. Friction between 13 turns and the conveyance of the coffin is damaged from (4). @崎 In the case of the hot plate protection sheet 500, it is necessary to try to reduce the friction with the conveying sheet 13〇. Example = The oxygen resin was impregnated into the glass of this material as a heat sheet protective sheet. Thereby, the friction between the hot plate protection sheet 5 and the conveyance sheet 13 is increased, and the life of the two sheets in the case where the workpiece is lifted and the workpiece is conveyed is reduced, and the life is prolonged. &lt;9&gt; An elevated lying embodiment in which a low-pitched portion is provided (Example 3). ί, the front end of the lifting pin of the lifting member is fixed in a flat shape, and is in surface contact, but may be configured to feed the front end portion of the lifting pin, and the low friction material is placed on the workpiece 10 even if it is placed thereon. The resistance is also small. I30 is moved at the front end portion of the lift pin 400, and its sliding contact is shown in Fig. 11 (a). The front end of the resin member lift pin 401 is provided with a low friction, a center, and a cross-sectional view. As the low friction resin, fluorine 201233554, xpit resin or the like can be used. The rounded member 4〇6 including the (iv) grease is attached to the front end portion of the lift pin 401 in a replaceable manner. Further, Fig. u(b) is an example in which the low friction material layer 4?7 is provided at the front end portion of the lift pin 402 & As the friction material layer 407 ', a riding layer of molybdenum or a coating layer of a fluororesin or the like can be used. Further, in Fig. UU) and Fig. 12(b), in order to reduce the sliding contact resistance between the lifting pin and the conveying sheet, * a fresh rotating body is provided at the front end of the lifting pin. Fig. 12 (a) is a view showing the lift_pattern of the present example from the direction in which the sheet is moved. _ 12(1) is a side view of Figure 12 (a). As shown in the figure, the movement is shifted: the square roller: 408 is supported by a cylindrical roller 408 which is supported by the pin. As a turning body, it is also possible to make (4) a cylindrical-core ball bearing. In the configuration, even if the conveyance sheet on which the workpiece is placed is rotated, the friction between the conveyance material and the conveyed material is reduced: the buckle of the feed sheet is reduced, and the life is prolonged. For example, in the above-described embodiment, the shape and structure of each part of the structure described in the second embodiment are appropriately exemplified. The case of ===== group, but the present invention is not limited thereto, and may be /, a workpiece 10 having a desired shape of an appropriate size. Further, the laminating apparatus 1〇1 is not limited to being applied to the solar cell module or the like, and it is of course applicable to the workpiece 10 similar thereto, and the effect can be exerted. Further, the pin that constitutes the pin lifting mechanism as the elevating member is lifted and lifted, and the driving means of the shame can be provided. For example, a fluid pressure cylinder bag such as a pneumatic pressure or a hydraulic pressure may be used. However, the present invention is not limited thereto, and it is conceivable to use a rotary means of various configurations, for example, a machine such as a bead screw or a rack gear (rack and _οη). A drive device or a device that combines a motor or the like in the mechanical drive X (four). BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing an exploded portion of a β-cell module as a laminating apparatus of the present invention.町太刼θ 概略 Overview = Overall configuration for explaining the fiber to which the present invention is applied * Fig. 3 is a cross-sectional view showing a laminated portion of the laminated device of Fig. 2 . FIG. 5(b) is a diagram illustrating the operation of the lift pin used in the laminated device of FIG. 2, and FIG. Fig. 6 (a) Fig. 6 (b) is a view showing the operation of the conventional lifting pin of 4 of the material of the laminating device of the present invention, and the material of the material (4). Fig. 7 (b) In the case of the laminating apparatus of the present invention, the operation of the workpiece 20 201233554 jyuipif is carried out to the laminating section as a main part (4), and 8(a) Fig. 8(b) is an operation explanatory view showing a state in which the layer of the present invention is carried out by the lift pin 2 as a main part. Fig. 9(b) and Fig. 9() are diagrams showing the operation of the laminating portion: 动作 Lifting the other embodiment of the laminating apparatus of the invention 11 (a), Fig. u (b) is a plan view showing a low seat slope a device provided at the front end portion of the present lift pin. Fig. 12 (a), = pin of the embodiment of the low friction phase The front end is set low '==: [Description of main component symbols] 10: Object to be processed (Solar cell 11: Cover glass (transparent substrate) 12: Back material 13 ' 14 : Filling material 15 : Battery string 16 , 17 : Electrode 18 : Sun Battery unit 19: Conductor 21 201233554 ^yi^ipif 100: Laminating device 101: Laminating portion 110: Upper casing 112: Diaphragm 113: Upper chamber 114, 123: Suction/exhaust port 120: Lower case 121: lower chamber 122: hot plate (plate heater) 130: transport sheet 200: carry-in conveyor 300: carry-out conveyors 400, 401, 402, 403: lift pins (lifting members) 406: cylindrical Member 407: Low friction material layer 408: Cylindrical roller 500: Hot plate protection sheet 600: Previous lift pin 22

Claims (1)

201233554 jyuipif 七、申請專利範園: 腔室I,置:包括藉由膜片而分隔的上腔室與下 片工材來搬二Ϊ二 由在W上移行的搬送 在於: ⑽工進仃層昼加工’該層塵裝置的特徵 置於工物載 送片材而進行搬送;襄置搬人時自上述熱板提昇該搬 声厂二::構?冓成為如下:於將上述被加工物向上述 =二白為^日上升’而將载置著上述被加工物的搬送 2在自熱板提昇的狀態下移行,於上述被加工物搬送至 熱反上的規定的位置為止的時間點下降,從而將上述被加 工物經由搬达片材而载置於熱板上。 2. 却申請專利範圍第1項所述之層壓裝置,其中 上述升降構件包含藉由驅動手段使提昇銷進行升降動 作的銷提昇機構。 3. 如申請專利範圍第2項所述之層壓裝置,其中 作為上述升降構件的銷提昇機構包括多根提昇銷; 、,該些提昇銷設置為:自下表面平躲支撐載置被加工 物亚移打的搬送片材’藉此可將該被加工物保持為 態而支持的排列。 4. 如申明專利範圍第2項或第3項所述之層壓事置, 其中 ^ 上述提昇銷的前端部的形狀平坦。 S 23 201233554 別 ilpif 屢裝5置如專利範圍第2項至第4項中任-項所述之層 構成上述升降構件的提昇銷的前端設置著低摩捧部, ^摩擦部與載置著被加工物的搬則材之間的滑動接觸 阻力小。 鮮6番如:請專利範圍第1項至第5項中任—項所述之層 Μ裝置,其中 曰 上述被加工物為太陽電池模組。 7. 一種層壓方法,其使用層壓裝置,該層壓裝置包 藉由,片而分隔的上腔室與下腔室,下腔室中設置著熱 反藉由在賴板上移行的搬送諸來搬人被加工物並進 仃層壓加工,該層壓方法的特徵在於: ^於將被加工物搬入至層壓裝置時,使升降構件上升, 降構件用於在將上述被加卫物載置於搬送片材上而向 曰壓裝置搬人時自上述熱板提昇職送#材而進行搬送; 在將载置著被加工物的搬送片材自熱板提昇的狀態下 使搬送片材移行而將被加工物搬入至層壓裝置内; 於將該被加工物向熱板上的規定的位置的搬入结束的 時間點使升降構件下降,從而將被加工物經由搬送片材而 载置於熱板上; 之後進行層壓加 工。 24201233554 jyuipif VII. Application for patent garden: Chamber I, set: including the upper chamber and the lower piece of work separated by a diaphragm to move the second one. The transfer by W is: (10) Gongjin layer Processing 'The characteristics of the dust layer device are placed on the workpiece to carry the sheet for transport; when the moving person moves, the sound board is raised from the hot plate 2::Construction? In the case where the workpiece is lifted by the above-mentioned workpiece, the conveyance 2 on which the workpiece is placed is moved in a state where the workpiece is lifted, and the workpiece is transferred to the heat. The time point until the predetermined position is reversed, and the workpiece is placed on the hot plate via the conveyance sheet. 2. The laminating apparatus according to claim 1, wherein the elevating member comprises a pin lifting mechanism for causing the lifting pin to be moved up and down by a driving means. 3. The laminating apparatus according to claim 2, wherein the pin lifting mechanism as the lifting member comprises a plurality of lifting pins; and the lifting pins are arranged to: be placed on the lower surface to support the loading and being processed The moving sheet that is moved by the object 'by this means that the workpiece can be held in a state of support. 4. The lamination device according to claim 2, wherein the front end portion of the lifting pin has a flat shape. S 23 201233554 别 il il il il il il il il il il il il il il il il il il il il il il il il il il il il il il il il il il il The sliding contact resistance between the workpieces of the workpiece is small. 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 7. A laminating method using a laminating apparatus that packs an upper chamber and a lower chamber separated by a sheet, and a heat transfer in the lower chamber is carried out by moving on the board The laminating method is characterized in that: the laminating method is characterized in that: when the workpiece is carried into the laminating device, the elevating member is raised, and the descending member is used for the above-mentioned object to be added When the sheet is placed on the transporting sheet and transported to the squeezing device, the material is transported from the hot plate, and the transport sheet is lifted while the transport sheet on which the workpiece is placed is lifted from the hot plate. When the material is moved, the workpiece is carried into the laminating apparatus; when the workpiece is moved to a predetermined position on the hot plate, the elevating member is lowered, and the workpiece is transported through the sheet. Place on a hot plate; then laminate. twenty four
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