CN103180124A - Lamination device, and lamination method - Google Patents

Lamination device, and lamination method Download PDF

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Publication number
CN103180124A
CN103180124A CN2011800523032A CN201180052303A CN103180124A CN 103180124 A CN103180124 A CN 103180124A CN 2011800523032 A CN2011800523032 A CN 2011800523032A CN 201180052303 A CN201180052303 A CN 201180052303A CN 103180124 A CN103180124 A CN 103180124A
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CN
China
Prior art keywords
machined object
hot plate
conveyance
stacked
mentioned
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Pending
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CN2011800523032A
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Chinese (zh)
Inventor
油布淳
筱田隆志
榊原活之
高木靖史
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Nisshinbo Mechatronics Inc
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Nisshinbo Mechatronics Inc
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Publication of CN103180124A publication Critical patent/CN103180124A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/02—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • B32B37/0015—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid warp or curl
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1009—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using vacuum and fluid pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/12—Photovoltaic modules
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Mechanical Engineering (AREA)
  • Fluid Mechanics (AREA)
  • Quality & Reliability (AREA)
  • Photovoltaic Devices (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)

Abstract

Provided are a lamination device and lamination method which reduce warping in a transparent substrate constituting a workpiece, which can reduce the lamination time, and which can maintain at least a predetermined product quality, even when more than one workpiece is simultaneously delivered to one lamination device and laminated. In a lamination device (100) which has an upper chamber (113) partitioned by a diaphragm (112) and a lower chamber (121) provided with a heat plate (122), and which delivers a workpiece (10) by a conveyance sheet (130) which travels over the heat plate, the heat plate is provided with a lifting member (400). The lamination device is configured so that when the workpiece is delivered into a lamination section (101), the lifting member (400) is raised, and the conveyance sheet travels raised from the heat plate, and when the workpiece on the conveyance sheet is delivered to a predetermined position above the heat sheet, the lifting member (400) is lowered, the workpiece is placed on the heat sheet, and is laminated.

Description

Stacked laminator and laminating method
Technical field
The invention relates to and a kind of the machined objects such as solar module are carried out the stacked laminating method that adds the stacked laminator that uses man-hour and use this device.
Background technology
At present, the disclosed stacked laminator of patent documentation 1 for example comprises: have free wxpansion downwards diaphragm (diaphragm) upper shell and have the lower house of hot plate.Solar module is being carried out when stacked, at first, the component parts of solar module is overlapping after, conveyance to upper shell and lower house be on the hot plate of the lower house in open state up and down.Then, stacked laminator is closed with upper shell and lower house, and makes the space that is formed by upper shell and lower house become vacuum state, and under the state that this component parts that is disposed on hot plate is heated, atmospheric pressure is directed into the top of the diaphragm of upper shell.Diaphragm and this component parts of hot plate cramping carry out stacked processing, and each component parts sticks together by the packing material of melting, thereby obtain solar module.
[patent documentation 1] Japanese patent laid-open 11-204811 communique
No. 3017231 communiques of [patent documentation 2] Japanese Utility Model registration
No. 3759257 communiques of [patent documentation 3] Japan Patent
[patent documentation 4] Japanese Patent Laid-Open 2008-126407 communique
In these existing stacked laminators, the machined objects such as solar module are by moving into conveyer etc. by the dead ahead of conveyance to stacked laminator in pretreatment procedure, then transferred load on the conveyance band that the hot plate cocycle of stacked laminator is moved, by the assigned position of conveyance band conveyance hot plate to the stacked laminator.At this moment, for machined object is carried out stacked processing, hot plate is under heated condition.
The conveyance band moves on hot plate, when carrying out conveyance on machined object being positioned in this conveyance band, the transparency carrier (for example glass substrate) as the component parts of machined object is heated from hot plate by the conveyance band, and its result makes transparency carrier, and bending phenomenon occurs before carrying out stacked processing.Larger problem can occur utilizing 1 stacked laminator to carry out simultaneously stacked adding to the polylith machined object man-hour in the buckling phenomenon of this transparency carrier.
That is until last piece in the polylith machined object can be heated from hot plate by the 1st complete, initial machined object of conveyance always, thereby larger bending can occur.Known at present: as if machined object bends, stackedly to add the Temperature Distribution that easily occurs man-hour in the machined object uneven first-class problem that becomes, thereby can cause harmful effect to the product quality after stacked processing.
The problem that bends in order to solve transparency carrier, patent documentation 2 to patent documentation 4 proposes following technology.
Be provided with a plurality of holding components in the structure of patent documentation 2 to the patent documentation 4, this holding components can carry out lifting action when machined object being moved into to the stacked laminator, make machined object to separate mounting with hot plate.Stacked processing is carried out as follows.When upper shell and lower house are in the up and down open state, machined object is positioned on holding components, make holding components increase by the lifting means, thereby machined object and hot plate are separated.Then, after upper shell and lower house closure, its inner space is vacuumized.After vacuumizing, by the lifting means, holding components is descended, machined object is positioned on hot plate, heat.Then, atmospheric pressure is directed into the top of the diaphragm of upper shell, diaphragm expands towards the below, and diaphragm and hot plate cramping machined object carry out stacked processing.
Patent documentation 2 is to patent documentation 4, and before vacuumizing end, machined object all separates with hot plate by holding components.Therefore, the heating of machined object be vacuumize finish after, machined object contacts inchoately with hot plate, thereby be difficult to shorten time of stacked processing.
There are following problem in patent documentation 2 and patent documentation 3.When machined object anchor when conveyance is in the stacked laminator rises to the top of hot plate, the machined object of therefore moving into is positioned on the workbench of pronged shape (fork), makes this movable workbench to device and machined object is positioned on anchor.Therefore, by 1 stacked laminator, the polylith machined object is being carried out the stacked man-hour that adds simultaneously, it is complicated that apparatus structure becomes.
And there is following problem in patent documentation 4.The method that machined object is moved into to the stacked laminator has been used the conveyance band.It constitutes: make a plurality of rectangular-shaped plates rise to hot plate top, separate with hot plate, machined object is moved into to device.Therefore, vacuumize finish after, be positioned in machined object on hot plate and when machined object was heated, the contact area of machined object and hot plate had reduced the amount of area that is equivalent to a plurality of rectangular-shaped plates.Therefore, only utilize underheat of hot plate, need to be from the top blowing hot-air of diaphragm, thus make the formation of stacked laminator become complicated and expensive.
Summary of the invention
In view of the above problems, though the object of the present invention is to provide a kind of the machined object more than moved into simultaneously a stacked laminator carry out stacked add man-hour, also can reduce the phenomenons such as the transparency carrier that consists of machined object bends, shorten stacked process time, product quality maintained stacked laminator and laminating method more than prescribed level.
In order to achieve the above object, the stacked laminator of the 1st invention, comprise upper chamber and the lower chambers separated by diaphragm, be provided with hot plate in lower chambers, move into machined object and carry out stacked processing by conveyance band mobile above this hot plate, this stacked laminator is characterised in that: comprise Lift Part, when being positioned in above-mentioned machined object on the conveyance band and moving into to stacked laminator, this Lift Part promotes this conveyance band from above-mentioned hot plate and carries out conveyance; Above-mentioned Lift Part constitutes as follows: rise when above-mentioned machined object is moved in the above-mentioned stacked laminator, and the conveyance band that will load above-mentioned machined object moves under the state that promotes from hot plate, descend during assigned position in above-mentioned machined object conveyance to the hot plate, thereby above-mentioned machined object is positioned on hot plate by the conveyance band.
The stacked laminator of the 2nd invention, based on the 1st invention, it is characterized in that: above-mentioned Lift Part comprises by driving means makes lift pin (lift pin) carry out the pin hoisting mechanism of lifting action.
The stacked laminator of the 3rd invention, based on the 2nd invention, it is characterized in that: the pin hoisting mechanism as above-mentioned Lift Part comprises a plurality of lift pins; Described a plurality of lift pin spread configuration from lower surface balanced support mounting machined object and mobile conveyance band, thereby can maintain level support with machined object.
The stacked laminator of the 4th invention, based on the 2nd invention or the 3rd invention, it is characterized in that: the shape of the leading section of above-mentioned lift pin is smooth.
The stacked laminator of the 5th invention, arbitrary invention in inventing to the 4th based on the 2nd invention, it is characterized in that: the front end that consists of the lift pin of above-mentioned Lift Part is provided with low friction part, and the sliding-frictional resistance between the conveyance band of this low friction part and mounting machined object is little.
The stacked laminator of the 6th invention, the arbitrary invention in inventing to the 5th based on the 1st invention, it is characterized in that: above-mentioned machined object is solar module.
In order to achieve the above object, the laminating method of the 7th invention uses stacked laminator, this stacked laminator comprises upper chamber and the lower chambers of separating by diaphragm, be provided with hot plate in lower chambers, bring by conveyance mobile above this hot plate and move into machined object and carry out stacked processing, this laminating method is characterised in that: when machined object being moved into to stacked laminator, make Lift Part increase, thereby make mounting above-mentioned machined object be arranged, promote from above-mentioned hot plate to the conveyance band of stacked laminator conveyance and carry out conveyance; Under the state that the conveyance band that mounting is had machined object promotes from hot plate, make the conveyance Tape movement and machined object moved into to stacked laminator; After the assigned position to the hot plate with this machined object conveyance, Lift Part is descended, thereby machined object is positioned on hot plate by the conveyance band; Carry out afterwards stacked processing.
[invention effect]
As previously discussed, according to the stacked laminator of the 1st invention or the laminating method of the 7th invention, because it has following structure: be provided with Lift Part, this Lift Part promotes the conveyance band of conveyance machined object when machined object is moved into to this device, Lift Part is promoted, move into the machined object that is positioned on this conveyance band, after machined object arrives regulation position on hot plate, Lift Part is descended, this machined object is positioned on hot plate by the conveyance band, thereby carries out stacked processing.Therefore, can be achieved as follows the effect of described various excellences.
Namely, when for the machined object more than is carried out stacked processing, it being moved into stacked laminator, move into after utilizing Lift Part that the conveyance band is promoted, make Lift Part descend, machined object is positioned on hot plate by the conveyance band after moving into end, thereby before stacked processing, machined object can not be subject to unnecessary heat from hot plate.Therefore, can not produce bending as the transparency carrier of the component parts of machined object, thereby the Temperature Distribution homogeneous in machined object, improve the quality of stacked converted products.
And, utilize stacked laminator to carry out simultaneously stacked processing, can eliminate the quality deviation of a plurality of products.
In addition, the product after stacked processing is stay in grade not only, and can the transparency carrier bending not occur man-hour in stacked adding, and compared to the prior art, each position of machined object reaches in advance target temperature thereby can shorten stacked process time.
Stacked laminator according to the 2nd invention is made as lift pin with Lift Part, has simplified elevating mechanism; In addition, with respect to the entire area of hot plate, the area of pin lifting parts is very little, can the heating of machined object not impacted, thereby need not to set up hot plate other heater meanses in addition because of underheat.
According to the 3rd the invention stacked laminator, will be configured to as the lift pin of Lift Part support evenly the conveyance band from lower surface, even thereby the conveyance band move on lift pin, also can make the conveyance band move smoothly, with the machined object conveyance to stacked laminator.
According to the stacked laminator of the 4th invention, be tabular surface as the leading section of the lift pin of Lift Part, therefore can in the situation that the conveyance band that do not wear and tear with the machined object conveyance to stacked laminator.
Stacked laminator according to the 5th invention, when moving into machined object, make the lift pin as Lift Part increase, even the conveyance band moves on lift pin, because being formed with low friction part on lift pin, therefore can in the situation that the conveyance band that do not wear and tear with the machined object conveyance to stacked laminator.
Stacked laminator according to the 6th invention can improve the quality as the solar module of machined object, and can shorten the process time of solar module.
Description of drawings
Fig. 1 will decompose the profile of laggard line display as the solar module of the machined object of stacked laminator of the present invention.
Fig. 2 means the integrally-built summary section of applicable stacked laminator of the present invention.
Fig. 3 means the profile of the laminated section of stacked laminator in Fig. 2.
Fig. 4 means in the laminated section of stacked laminator in Fig. 2 and carries out the stacked state diagram that adds man-hour.
Fig. 5 (a), Fig. 5 (b) are the key diagrams that the action to the lift pin of the prior art of using in the stacked laminator of Fig. 2 describes.
Fig. 6 (a), Fig. 6 (b) mean an embodiment of stacked laminator of the present invention, to the Lift Part of invention characteristic, be the key diagram that the action of the lift pin of lift pin mechanism describes.
Fig. 7 (a), Fig. 7 (b) mean an embodiment of stacked laminator of the present invention, the key diagram that the action when wanting the lift pin of section to move into machined object to laminated section by conduct describes.
Fig. 8 (a), Fig. 8 (b) mean an embodiment of stacked laminator of the present invention, the key diagram that the action when wanting the lift pin of section to move into machined object to laminated section by conduct describes.
Fig. 9 (a), Fig. 9 (b), Fig. 9 (c) mean an embodiment of stacked laminator of the present invention, the key diagram that the action when wanting the lift pin of section to move into machined object to laminated section by conduct describes.
Figure 10 is the key diagram that the lift pin to other embodiments of stacked laminator of the present invention describes.
Figure 11 (a), Figure 11 (b) are in stacked laminator of the present invention, are provided with the key diagram of other embodiments of low friction part at the leading section of lift pin.
Figure 12 (a), Figure 12 (b) are in stacked laminator of the present invention, are provided with the key diagram of other embodiments of low friction part at the leading section of lift pin.
Symbol description
10: machined object (solar module)
11: cover glass (transparency carrier)
12: backing material
13,14: packing material
15: battery strings
16,17: electrode
18: solar battery cell
19: wire
100: stacked laminator
101: laminated section
110: upper shell
112: diaphragm
113: upper chamber
114,123: suction and exhaust ports
120: lower house
121: lower chambers
122: hot plate (plate heater)
130: the conveyance band
200: move into and use conveyer
300: take out of and use conveyer
400,401,402,403: lift pin (Lift Part)
406: columnar component
407: layer of low-friction material
408: cylindric roller
500: hot plate protection sheet material
600: existing lift pin
The specific embodiment
Fig. 1 to Figure 12 (a), Figure 12 (b) are the accompanying drawings of embodiment of explanation stacked laminator of the present invention, below by accompanying drawing to stacked laminator of the present invention and use the laminating method of this device to describe.
＜1〉solar module
At first, to stacked laminator of the present invention and use this device the handled object of laminating method, be that machined object 10 describes.
Fig. 1 means the profile as the solar module structure of machined object 10.
As shown in the figure, solar module (10) has following structure: at the transparent cover glass 11 that is disposed at downside and be disposed between the backing material 12 of upside, accompany by multiple row battery strings (string) 15 across packing material 13,14.
Backing material 12 is the opaque material of polyvinyl resin etc. such as what use.What packing material 13,14 for example used is ethylene vinyl acetate (ethylene vinylacetate, EVA) resin etc.Between electrode 16,17, after being connected by wire 19, solar battery cell 18 consists of multiple row battery strings 15.
Machined object 10 can be also to be commonly referred to as thin-film type solar cell.In the representative structure of this thin-film type solar cell, be configured in the generating element that on the transparent cover glass of downside, prior evaporation is made of transparency electrode, semiconductor, backplate.Glass is configured down, cover on generating element on glass and fill material, then filling covering back side material on material.Subsequently, by heating in vacuum, stacked, make film type solar battery assembly.
Film type solar battery assembly as machined object 10, only the system of crystallization battery unit of above-mentioned solar module to be replaced with the generating element of evaporation, with regard to the base closed structure, film type solar battery assembly is identical with above-mentioned solar module.
The machined object 10 that uses in stacked laminator of the present invention, be that solar module has the length of side and is the rectangular plate shape of 1m～2m left and right, weight is the 40Kg left and right.
＜2〉whole formation
Fig. 2 is the front view of applicable stacked laminator 100 of the present invention.
In the left side of stacked laminator shown in Figure 2 100, be provided with and move into conveyer 200, be provided with on the right side and take out of with conveyer 300.Move into conveyer 200 machined object 10 before with stacked processing, be that solar module is supplied to laminated section, take out of with conveyer 300 machined object 10 after with stacked processing and take out of.
Machined object 10 carries out moving into and taking out of of laminated section according to moving into conveyer 200, stacked laminator 100 and taking out of order with conveyer 300 constantly to the right side conveyance of Fig. 2.
Also be provided with conveyance band 130 in stacked laminator 100, this conveyance band 130 is accepted machined object 10 from moving into conveyer 200, and is handed over to and takes out of with conveyer 300.
＜3〉laminated section
The below describes the laminated section of stacked laminator of the present invention according to Fig. 3.Utilize stacked laminator 100 of the present invention carry out simultaneously stacked processing machined object 10, be that solar module can be one or more, for the purpose of simplifying the description, only illustrate one.
Fig. 3 means the profile of laminated section 101.
In the mode that the inner horizontal of upper shell 110 is separated, diaphragm 112 is installed, the space that is surrounded by the internal face of this diaphragm 112 and upper shell 110 becomes upper chamber 113.Diaphragm 112 uses is the stable on heating rubber such as fluorubber etc.
On upper shell 110, be provided with the suction and exhaust ports 114 that is connected with upper chamber 113.Suction and exhaust ports 114 is connected, can will vacuumizes in upper chamber 113 with not shown vavuum pump, or be communicated with extraneous gas, can be to the interior importing atmospheric pressure of upper chamber 113.
Dispose hot plate (plate heater) 122 in the lower chambers 121 as lower house 120 inner spaces.As Fig. 3 or shown in Figure 4, hot plate 122 is supported by support component of arranging on lower chambers 121 bottoms etc.
Below lower house 120, be provided with the suction and exhaust ports 123 that is connected with lower chambers 121.Lower chambers 121 constitutes: the top seals by upper shell 110, can will vacuumize in lower chambers 121 from suction and exhaust ports 123, or can be to the interior importing atmospheric pressure of lower chambers 121 from this suction and exhaust ports 123.
＜4〉stacked manufacturing procedure
The stacked processing of machined object 10 is carried out according to following mode.
At first, drive conveyance band 130 and move it conveyance machined object 10, stop mobile when the position of stacked processing is carried out in arrival.
Close upper shell 110, make itself and lower house 120 overlapping, suction and exhaust ports 114,123 is connected with vavuum pump, upper chamber 113 is reduced pressure with the space in lower chambers 121.
Because hot plate 122 is in heated condition, machined object 10 obtains heat by conveyance band 130 from hot plate 122.
After the space in upper chamber 113 and lower chambers 121 reaches the vacuum of regulation, to the interior importing atmosphere of upper chamber 113.
Therefore, as shown in Figure 4, diaphragm 112 expands towards the below, and machined object 10 strongly is pressed on hot plate 122.
After machined object 10 was heated by hot plate 122, the packing material 13 in machined object 10,14 meltings, generation cross-linking reaction were carried out stacked processing.
After stacked process finishing, to the interior importing atmosphere of lower chambers 121, open upper shell 110.Drive conveyance band 130 and move it, machined object 10 advances, arrives and take out of the position to the right-hand of Fig. 2, transfers to take out of with conveyer 300 is rear and is taken out of.Machined object take out of end after, accept next machined objects 10 from moving into conveyer 200, and repeat above-mentioned operation.
＜5〉warpage issues of transparency carrier
Have in the stacked laminator 100 of said structure, also have and adopt following methods to move into machined object 10 in the laminated section 101.Namely, when moving into machined object 10 in stacked laminator, make that conveyance band 130 moves, the conveyance machined object on hot plate, after the assigned position that arrives on hot plate 122, by Fig. 5 (a), Fig. 5 (b) thus shown in a plurality of lift pins 600 machined object 10 promoted separate with hot plate 122, through after the regular hour, lift pin 600 is descended again, machined object 10 is positioned on hot plate by conveyance band 130, utilizes＜4〉described in method carry out stacked processing.
Yet, when adopting this method, make on hot plate 122 that conveyance band 130 moves, the assigned position with machined object 10 conveyances to the hot plate during in, machined object 10 is heated from hot plate, transparency carrier bends.Because the bending of transparency carrier makes the temperature distributing disproportionation on 10 directions of machined object, the product quality after stacked processing is caused harmful effect.
In addition, if adopt said method, moving into a plurality of machining object 10 and carrying out simultaneously the stacked man-hour that adds, the machined object of moving at first can produce larger bending.Thereby produce the problem of the difference of product quality between the polylith machined object of moving into.
＜6〉formation of lift pin (embodiment 1)
According to the present invention, in the stacked laminator 100 of above-mentioned formation, as shown in Fig. 6 (a), Fig. 6 (b), be provided with a plurality of lift pins 400, consist of the pin hoisting mechanism that is equal to Lift Part.When moving into machined object 10 in laminated section 101, lift pin 400 makes mounting have the conveyance band 130 of this machined object 10 to move under the state that promotes from hot plate 122.
400 of this lift pins need to utilize to be arranged on such as the lift cylinder of hot plate 122 belows etc. and can carry out lifting action.The number of the number of described a plurality of lift pin 400 or the driving means of configuration, cylinder etc. or configuration etc. can suitably be set.
A plurality of lift pins 400 are set, make lift pin 400 increase, make the conveyance band move on this lift pin, with machined object 10 to laminated section 101 conveyances.During the assigned position of hot plate 122 tops in machined object 10 arrives laminated sections 101, make lift pin 400 declines, machined object 10 is positioned on hot plate.Therefore, different with prior art, when machined object being moved into to stacked laminator, cover glass 11 can not touch hot plate 122, thereby can suppress the bending of cover glass 11.Simultaneously, can make the Temperature Distribution homogeneous on 10 directions of machined object, cripetura stacked process time, and can improve product quality.
According to the present invention, the tabular surface shape that the front end shape of lift pin 400 is changed to as shown in Fig. 6 (a), Fig. 6 (b) etc. contacts with generating planes such as conveyance bands 130 and sells diameter also the existing pin diameter than shown in Figure 5 is thick.For example will sell diameter and be made as 6mm～12mm, preferably be made as 8mm～10mm.The diameter of pin or number also can be set according to the weight of the cover glass 11 of machined object 10 etc. or the durability of conveyance band.
If the leading section that above-mentioned lift pin is contacted with conveyance band 130 forms pointed as shown in Fig. 5 (a), Fig. 5 (b), then the transport method of applicable machined object of the present invention, can produce following problem.After machined object 10 is promoted, make the conveyance band mobile when coming conveyance on this lift pin 600, because the front end shape of lift pin 600 is pointed, easily damages the conveyance band or shorten its life-span.For example data show: after about continuous operation 1 Week, conveyance band fracture.
If the shape of lift pin is made as the shape shown in Fig. 6 (a), Fig. 6 (b), move on the lift pin 400 that rises even be equipped with the conveyance band 130 of machined object 10, also can prevent as much as possible the damage of conveyance band, thereby extend its life-span.
＜7〉transport method of machined object.
Machined object 10 is moved into the method in the stacked laminator 100 with above-mentioned formation, described with reference to Fig. 7 (a), Fig. 7 (b), Fig. 8 (a), Fig. 8 (b), Fig. 9 (a) and Fig. 9 (c).These figure utilize 1 stacked laminator that 3 machined objects are carried out stackedly adding man-hour, make the conveyance Tape movement and sequentially move into situation to the stacked laminator since the 1st machined object under the state that lift pin 400 rises for explanation.
In addition, in figure, the equipping position of lift pin 400 schematically is made as 9 for each machined object 10.In figure, zero mark, * position of mark is the lift pin position.* mark position represents that the lift pin position is at the downside of machined object.Zero mark position represents that lift pin is not covered by machined object.Certainly the number of lift pin is not limited to this, and its number can suitably be set.
Fig. 7 (a), Fig. 7 (b) expression is moved into state to stacked laminator with the 1st machined object, Fig. 8 (a), Fig. 8 (b) expression is moved into state to stacked laminator with the 2nd machined object, and Fig. 9 (a) moves into state to stacked laminator with the 3rd machined object to Fig. 9 (c) expression.Fig. 7 (a), Fig. 8 (a) and Fig. 9 (a) are the planes of having moved into the state of machined object.Fig. 7 (b), Fig. 8 (b) and Fig. 9 (b) are the side views of having moved into the state of machined object.Fig. 9 (c) expression lift pin 400 descends, and all machined objects 10 are positioned in state on hot plate 122 by conveyance band 130.
According to the present invention, when machined object 10 is positioned on conveyance band 130, is moved into when interior to laminated section 101 according to the order of the 1st, the 2nd, the 3rd, lift pin 400 all rises, and maintains the state of lifting.Therefore, the state that all machined objects 10 are in hot plate 122 tops, separate with predetermined distance and hot plate is by the assigned position of conveyance to this hot plate 122 tops.
Under this state, lift pin 400 descends, and machined object 10 is positioned on hot plate 122.Therefore, before each machined object 10 was positioned on hot plate 122, the cover glass 11 (transparency carrier) in solar module can not produce bending, heats with needed state by hot plate 122, and carries out stacked processing.
In addition, at Fig. 7 (a), Fig. 7 (b), Fig. 8 (a), Fig. 8 (b), Fig. 9 (a) to the example of Fig. 9 (c), be illustrated in stacked laminator 100, move into 3 machined objects 10, the situation of carrying out simultaneously stacked processing in laminated section 101.Certainly be not limited to this, the piece number of machined object 10 can suitably be set.
＜8〉possesses the embodiment (embodiment 2) of the hot plate of hot plate protection sheet material
Figure 10 is illustrated in the situation that is provided with hot plate protection sheet material 500 on hot plate 122.
Cause is provided with hot plate protection sheet material 500 on hot plate 122, thereby when applicable of the present invention, if rise as the lift pin 400 of Lift Part, hot plate protection sheet material 500 also rises to and the lift pin 400 identical height of rising.Therefore, when machined object 10 being moved into to the stacked laminator 100 (laminated section 101), conveyance band 130 mounting machined objects 10, move above hot plate protection sheet material 500.Hot plate protection sheet material only needs be positioned on hot plate 122, fix 4 jiaos by bolt etc., and its rising with lift pin 400 is raise.
When having above-mentioned formation, when conveyance band mounting has machined object to move, thereby hot plate is protected generation friction between sheet material 500 and conveyance band 130, impaired causing of conveyance band ruptured.Therefore, need to manage to reduce friction between hot plate protection sheet material 500 and conveyance band 130.
For example; thereby the glass cloth of protecting the core of sheet material as hot plate can be immersed in the friction that reduces in fluororesin between hot plate protection sheet material 500 and conveyance band 130; when rising lift pin conveyance machined object; reduce the damage of two sheet materials (conveyance band 130 and hot plate protection sheet material 500), extend its life-span.
＜9〉be provided with the embodiment (embodiment 3) of the lift pin of low friction part
Consist of the lift pin 400 of above-mentioned Lift Part, thereby its front end can form the contact of tabular surface generating plane, also can low-friction material be set at the leading section of lift pin, even if the conveyance band 130 that machined object 10 is arranged in mounting is when the leading section of lift pin 400 moves, this low-friction material also has very little sliding-frictional resistance.
The front end that Figure 11 (a) is illustrated in lift pin 401 is provided with the profile that hangs down when rubbing resin component.Can use the low friction of the conduct resins such as fluororesin.The columnar component 406 made from fluororesin is arranged on the leading section of lift pin 401 with interchangeable form.Figure 11 (b) is provided with the embodiment of layer of low-friction material 407 at the leading section of lift pin 402.Can adopt flame-spraying molybdenum coating or coating fluororesin layer etc. to form layer of low-friction material 407.
In the structure of Figure 12, in order to reduce the sliding-frictional resistance between lift pin and conveyance band, be provided with the rolling elements such as roller at the front end of lift pin.Figure 12 (a) means the figure that observes the lift pin of the present embodiment from the moving direction of conveyance band.Figure 12 (b) is the side view of Figure 12 (a).As shown in the figure, at the fore-end of lift pin 403, the rectangular-shaped groove that arranges along the moving direction of conveyance band.Be provided with in this groove by pin and rotate the cylindric roller 408 of supporting.Also can use cylindrical bearing or ball shape bearing as rolling element.
When having said structure, even mounting has the conveyance band 130 of machined object to move above lift pin, the conveyance band contact with roller 408, and roller 408 rotates, the friction between minimizing and conveyance band, the damage of reduction conveyance band, thus extend its life-span.
The present invention is not limited to structure illustrated in above-mentioned embodiment, and the shape of each parts of constituting layer stacking device 100 and structure etc. can suitably be out of shape, change.
For example, in the above-described embodiment, as the solar module of machined object 10, illustrative solar module is to have to be the rectangular plate shape about 1m to 2m on one side, but the present invention is not limited thereto, and machined object 10 can have any appropriate size of required form.
Stacked laminator 100 is not limited to stacked above-mentioned solar module etc., so long as machined object 10 similarly is all applicable, and the performance effect.
Formation can be used known driving means as the lifting drive source of the lift pin 400 of the pin hoisting mechanism of Lift Part.Such as the fluid cylinder device that can use air pressure, oil pressure etc., but be not limited to this, also can adopt the driving means of various structures, such as the mechanical actuation device that uses ball screw, rack pinion (rack and pinion) etc., or electro-motor etc. is combined in this mechanical actuation device and the device that consists of etc.

Claims (7)

1. a stacked laminator, comprise upper chamber and the lower chambers separated by diaphragm, is provided with hot plate in lower chambers, moves into machined object and carry out stacked processing by conveyance band mobile above this hot plate, and this stacked laminator is characterised in that:
Comprise Lift Part, when being positioned in above-mentioned machined object on the conveyance band and moving into to stacked laminator, this Lift Part promotes this conveyance band and carries out conveyance from above-mentioned hot plate;
Above-mentioned Lift Part constitutes: rise when above-mentioned machined object is moved in the above-mentioned stacked laminator, and the conveyance band that will load above-mentioned machined object moves under the state that promotes from hot plate, descended during the assigned position to the hot plate by conveyance at above-mentioned machined object, thereby above-mentioned machined object is positioned on hot plate by the conveyance band.
2. stacked laminator according to claim 1 is characterized in that:
Above-mentioned Lift Part comprises by driving means makes lift pin carry out the pin hoisting mechanism of lifting action.
3. stacked laminator according to claim 2 is characterized in that:
Pin hoisting mechanism as above-mentioned Lift Part comprises a plurality of lift pins;
Described a plurality of lift pin spread configuration has machined object and is in conveyance band mobile from lower surface balanced support mounting, thereby machined object can be maintained level support.
4. according to claim 2 or 3 described stacked laminators is characterized in that:
The shape of the leading section of above-mentioned lift pin is smooth.
5. the described stacked laminator of any one according to claim 2 to 4 is characterized in that:
The front end that consists of the lift pin of above-mentioned Lift Part is provided with low friction part, and this low friction part and the sliding-frictional resistance that loads between the conveyance band that machined object is arranged are little.
6. the described stacked laminator of any one according to claim 1 to 5 is characterized in that:
Above-mentioned machined object is solar module.
7. laminating method, it uses stacked laminator, and this stacked laminator comprises upper chamber and the lower chambers of separating by diaphragm, is provided with hot plate in lower chambers, move into machined object and carry out stacked processing by conveyance band mobile above this hot plate, this laminating method is characterised in that:
When machined object being moved into to stacked laminator, make Lift Part increase, thereby make mounting above-mentioned machined object be arranged, promote to the conveyance band of the above-mentioned machined object of stacked laminator conveyance from above-mentioned hot plate and carry out conveyance;
Under the state that the conveyance band that mounting is had machined object promotes from hot plate, make the conveyance Tape movement and machined object moved into to stacked laminator;
After the assigned position to the hot plate with this machined object conveyance, Lift Part is descended, thereby machined object is positioned on hot plate by the conveyance band;
Carry out afterwards stacked processing.
CN2011800523032A 2010-09-03 2011-07-28 Lamination device, and lamination method Pending CN103180124A (en)

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JP2010197717A JP2012051338A (en) 2010-09-03 2010-09-03 Lamination device, and lamination method
PCT/JP2011/067812 WO2012029493A1 (en) 2010-09-03 2011-07-28 Lamination device, and lamination method

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Application publication date: 20130626