201232853 x iw t -r\*yi i~k 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種光源模組，且特別是有關於一種 減少散熱片與金屬背板之間熱阻（thermal resistance) 的光源模組。 【先前技術】 一般而言，發光元件係以導熱膠貼附於散熱片的吸熱 φ 面。為了減少導熱膠的熱阻，係以高導熱係數的銀膠為 主，因此很快地將熱由發光元件傳導至散熱片，而比較不 會囤積在導熱膠上。另外，散熱片通常以螺絲鎖固或是以 低導熱係數的導熱膠接合而固定於光源模組的背板上，但 使用導熱膠接合的方式將會造成發光元件所產生的熱仍 囤積在此導熱膠上而無法將熱傳導至光源模組的背板及 外界’影響發光元件的使用壽命及發光元件的發光效率。 為了改善散熱的問題，常見的做法是在導熱膠内添加 • 熱性較佳的材質，然而此種方式對於整體散熱改善有 ^且長時間熱反應後會造成導熱膠的黏性降低，而容易 毛生散熱片與背板分離。 【發明内容】 散孰片本有關於一種光源模組，藉由礙合的方式固定 觸，以減分離，且散熱片與背板直接接 散敎。 熱片與月板之_導熱膠的熱阻過高而影響 201232853201232853 x iw t -r\*yi i~k VI. Description of the Invention: [Technical Field] The present invention relates to a light source module, and in particular to a heat reduction between a heat sink and a metal back plate A light source module with thermal resistance. [Prior Art] In general, the light-emitting element is attached to the heat-absorbing φ surface of the heat sink with a heat-conductive adhesive. In order to reduce the thermal resistance of the thermal conductive adhesive, silver paste with high thermal conductivity is mainly used, so that heat is quickly conducted from the light-emitting element to the heat sink, and is less accumulated on the thermal conductive adhesive. In addition, the heat sink is usually fixed by screw or fixed by a low thermal conductivity thermal conductive adhesive on the back plate of the light source module, but the heat bonding adhesive will cause the heat generated by the light emitting component to accumulate here. The heat transfer adhesive does not transfer heat to the back plate of the light source module and the outside world 'affects the service life of the light-emitting element and the light-emitting efficiency of the light-emitting element. In order to improve the heat dissipation problem, it is common to add a material with better thermal properties in the thermal conductive adhesive. However, this method has improved the overall heat dissipation and will cause the viscosity of the thermal conductive adhesive to decrease after a long period of thermal reaction, and is easy to hair. The heat sink is separated from the back plate. SUMMARY OF THE INVENTION The diffused film has a light source module that is fixedly touched by means of a barrier to reduce separation, and the heat sink and the back plate are directly connected to each other. The heat resistance of the hot film and the moon plate is too high and affects 201232853
TW7409PA 根據本發明之一方面，提出一種光源模組，其包括一 發光元件、一散熱片以及一金屬背板。散熱片配置於發光 元件的底部，散熱片具有一第一嵌合部。金屬背板具有一 第二嵌合部，第二嵌合部與第一欲合部相互卡合，以使散 熱片固定在金屬背板上。 為了對本發明之上述及其他方面有更佳的瞭解，下文 特舉較佳實施例，並配合所附圖式，作詳細說明如下： 【實施方式】 本實施例之光源模組，係將散熱片以嵌合方式固定於 背板上，以使熱能快速地由發光元件傳輸至散熱片以及背 板，避免熱囤積在散熱片與背板之間而影響發光元件的使 用壽命及發光元件的發光效率。在組裝上，散熱片與背板 可藉由凹凸配合的嵌合結構組裝為一體，組裝方便，因此 所需的工時相對少於以螺絲鎖固或是以導熱膠貼附所需 的工時。 請參照第1A圖，其繪示依照一實施例之嵌合結構的 剖面圖。嵌合結構101包括一第一嵌合部121以及一第二 飯合部131。第一嵌合部121於垂直剖面上具有一第·— 勾部121a，第二嵌合部131於垂直剖面上具有一第二卡勾 部131a，第一卡勾部121a與第二卡勾部131a在垂直方向 上相互干涉。在一實施例中，第一嵌合部121例如為一凹 槽，凹槽凹陷於散熱片120的背面124，第一卡勾部121a 位於凹槽的開口處。此外，第二嵌合部131例如為一凸塊， 凸塊與凹槽的形狀互補且突出於金屬背板130的内表面 201232853 1 vv 二第:第卡勾 ，、第一嵌合部131相卡 . 與第二卡勾〜垂直方向二;:卡勾部心 的二剖::看:第一嵌合部丨21的形狀可為向内凹 卞…構’例如以球形凹面為卡合面之 可=卡合^ ^ ’、、、“#卡合結構’例如是以球形塊為卡合塊之結TW7409PA According to one aspect of the invention, a light source module is provided that includes a light emitting element, a heat sink, and a metal backing plate. The heat sink is disposed at the bottom of the light emitting element, and the heat sink has a first fitting portion. The metal back plate has a second fitting portion, and the second fitting portion and the first desired portion are engaged with each other to fix the heat dissipation sheet to the metal back plate. In order to better understand the above and other aspects of the present invention, the following description of the preferred embodiments, together with the accompanying drawings, will be described in detail as follows: [Embodiment] The light source module of this embodiment is a heat sink. The utility model is fixed on the back plate in a fitting manner, so that the heat energy is quickly transmitted from the light emitting element to the heat sink and the back plate, thereby avoiding heat accumulation between the heat sink and the back plate and affecting the service life of the light emitting element and the luminous efficiency of the light emitting element. . In assembly, the heat sink and the back plate can be assembled by a fitting structure with a concave-convex fit, and the assembly is convenient, so the required working time is relatively less than the man-hour required for screwing or fixing with a thermal conductive adhesive. . Referring to Figure 1A, a cross-sectional view of a mating structure in accordance with an embodiment is shown. The fitting structure 101 includes a first fitting portion 121 and a second rice portion 131. The first fitting portion 121 has a first hook portion 121a in a vertical cross section, and the second fitting portion 131 has a second hook portion 131a on the vertical cross section, and the first hook portion 121a and the second hook portion The 131a interfere with each other in the vertical direction. In one embodiment, the first fitting portion 121 is, for example, a recess, and the recess is recessed in the back surface 124 of the heat sink 120, and the first hook portion 121a is located at the opening of the recess. In addition, the second fitting portion 131 is, for example, a bump, and the shape of the bump is complementary to the groove and protrudes from the inner surface of the metal back plate 130 201232853 1 vv two: the first hook portion, and the first fitting portion 131 Card. The second hook hook is perpendicular to the second direction; the second section of the hook portion is: see: the shape of the first fitting portion 21 can be an inward concave shape... for example, a spherical concave surface is used as the engaging surface Can be = card ^ ^,,, "# snap structure", for example, a ball block as the junction of the block
121 形臂為卡合臂之結構’均可與第一嵌合部 達到形狀互補且相互卡合之功效。 請參照第1B圖，其緣示依照另一實施例之嵌合 ?剖面圖。在本實施例中’第一嵌合部122不為凹槽，而 疋以一凸塊取代’此凸塊突出於散熱片12〇的背面⑼， :第-卡勾部122a位於凸塊的頂部。同樣地，第二嵌合 不為凸塊，而是以—凹槽取代，此凹槽與凸塊的入ς 互補且凹陷於金屬背板130的内表面134。第二卡勾呷 132a位於凹槽的開口處，以使第二卡勾部131a與第一^ 勾部121a於垂直方向上相互卡合。 請參考第2圖’其緣示依照一實施例之光源模組的剖 面圖。光源模組1〇〇包括一發光元件11〇、一散熱片 以及一金屬背板130。散熱片12〇配置於發光元件、11〇的 底部’散熱片12G具有-第—嵌合部121。金屬背板13〇 具有一第二嵌合部131’第二嵌合部131與第一嵌合部121 相互卡合，以使散熱片12〇固定在金屬背板13〇上。 在第2圖中，光源模組1〇〇更可包括一電路板112。 電路板112具有一導熱區U2a以及一電性連接區U2b， 201232853The 121-shaped arm is a structure of the engaging arm, which can be complementary to the first fitting portion and can be engaged with each other. Please refer to FIG. 1B for a cross-sectional view of another embodiment. In the present embodiment, 'the first fitting portion 122 is not a groove, and the cymbal is replaced by a bump. The protrusion protrudes from the back surface (9) of the heat sink 12A, and the first hook portion 122a is located at the top of the bump. . Similarly, the second fit is not a bump but is replaced by a groove that is complementary to the entrance of the bump and that is recessed into the inner surface 134 of the metal backing plate 130. The second hook hook 132a is located at the opening of the recess such that the second hook portion 131a and the first hook portion 121a are engaged with each other in the vertical direction. Referring to Figure 2, there is shown a cross-sectional view of a light source module in accordance with an embodiment. The light source module 1A includes a light emitting element 11A, a heat sink and a metal back plate 130. The heat sink 12 is disposed on the bottom of the light-emitting element 11 ’. The heat sink 12G has a - - fitting portion 121. The metal back plate 13A has a second fitting portion 131'. The second fitting portion 131 and the first fitting portion 121 are engaged with each other to fix the heat sink 12A on the metal back plate 13A. In FIG. 2, the light source module 1 can further include a circuit board 112. The circuit board 112 has a heat conducting area U2a and an electrical connection area U2b, 201232853
TW7409PA 導熱區112a與發光元件110的底部接觸，電性連接區112b 與發光元件110的電極111電性連接。 在一實施例中，發光元件11〇可直接以導熱膠貼附在 散熱片120上’並以多條導線電性連接發光元件的電 極111至外部的驅動電路。因此，本實施例之發光元件110 不限定以電路板112配置於散熱片120上，以減少熱阻之 產生。此外，當發光元件以電路板112固定在散熱片 120上，電路板112之背面可藉由高導熱性之導熱膠114 貼附在散熱片120上’以加快散熱的時間。 以下介紹第一嵌合部121與電路板112的導熱區U2a 及電性連接區112b的相對位置關係。請參考第2圖，在 一實施例中，第一嵌合部121對應位於導熱區U2a的下 方，也就疋位於發光元件Π0的熱源下方，可得知熱傳導 的路徑為最短的直線’因此發光元件11〇所產生的熱可直 接由導熱區112a傳導至第一嵌合部121，再由第一嵌合部 121傳導至第一嵌合部丨μ，以加快散熱的時間。 此外，在另一實施例（未繪示於圖中），第一嵌合部 121對應位於電性連接區U2b的下方，也就是位於導熱區 112a之周圍區域，由此可知熱傳輸的路徑是先向兩側擴散 之後再往下傳導，因此同樣可使導熱區心上的敎經由 第一嵌合部121傳導至第二嵌合部131。另外，為了減少 熱阻之產生’散熱片12〇之背面124與金屬背板13〇之内 表面134較佳為完整的平面，如此散熱片⑽之背面124 可完全貼附在金屬背板⑽的内表面134上，增 效果。_，在理想的公差配合下，散熱片⑽靠 201232853 ιττ/ -ryjyi r\ 合結構固定在金屬背板130上，不需藉由外加的螺絲鎖附 或以導熱膠貼附等傳統的做法來固定散熱片12〇，即使可 以使用螺絲或黏膠，但螺絲的使用量可減少以及避免黏膠 可月b因長時間熱反應後會造成黏性降低，進而避免發生散 熱片120與金屬背板130分離的現象。 接著，請參考第3A及3B圖，其繪示兩種型態之陣列 光源模組的示意圖。陣列光源模組2〇〇包括多個發光元件 21〇 政熱片220以及一金屬背板230。發光元件210例 • 如是發光二極體，其可沿著散熱片220的延伸方向排列， ，形成一陣列光源。散熱片22〇為長板狀，散熱片22〇的 第一嵌合部221與金屬背板230的第二嵌合部231相互卡 合，以使散熱片220固定在金屬背板230上。第一嵌合部 221包括多個凹槽221a，此些凹槽221&凹陷於散熱片 的月面224，並沿著散熱片220的延伸方向排列。此外， =一t入σ 231包括多個凸塊231a，此些凸塊231β與此 些凹槽221a的形狀互補且突出於金屬背板23〇的内表面 參234，以使第一嵌合部221與第二被合部231才目互卡合。 在一實施例中，各個凹槽231a對應位於各個發光元 牛的下方，如第3A圖所示，因此每個發光元件gw 的下2均有獨立的熱傳輸路徑，以增加散熱量。此外，在 另一實施例中，若發光元件21〇所需的散熱量較少時，凹 槽Ula的數量可少於發光元件21()的數量，例如為三個， 如第3B圖所示。另外，第一嵌合部221與第二嵌合部231 可藉由擠製、衝壓或銑削的方式成形，擠製或衝壓成形的 時間較紐，且成本較低，適合大量製造及減少工時。 201232853The TW7409PA thermal conduction region 112a is in contact with the bottom of the light-emitting element 110, and the electrical connection region 112b is electrically connected to the electrode 111 of the light-emitting element 110. In one embodiment, the light-emitting element 11 can be directly attached to the heat sink 120 with a thermal conductive paste and electrically connected to the external driving circuit by the plurality of wires electrically connecting the electrode 111 of the light-emitting element. Therefore, the light-emitting element 110 of the present embodiment is not limited to being disposed on the heat sink 120 by the circuit board 112 to reduce the occurrence of thermal resistance. In addition, when the light-emitting element is fixed on the heat sink 120 by the circuit board 112, the back surface of the circuit board 112 can be attached to the heat sink 120 by the high thermal conductive adhesive 114 to accelerate the heat dissipation time. The relative positional relationship between the first fitting portion 121 and the heat transfer portion U2a and the electrical connection portion 112b of the circuit board 112 will be described below. Referring to FIG. 2, in an embodiment, the first fitting portion 121 is located below the heat conducting region U2a, that is, under the heat source of the light emitting element Π0, and the heat conduction path is the shortest straight line. The heat generated by the element 11 is directly conducted to the first fitting portion 121 by the heat conducting portion 112a, and then conducted to the first fitting portion 丨μ by the first fitting portion 121 to accelerate the heat dissipation time. In addition, in another embodiment (not shown), the first fitting portion 121 is located below the electrical connection region U2b, that is, in the surrounding area of the heat conduction region 112a, so that the path of the heat transmission is After being diffused to the both sides and then conducting downward, the enthalpy on the core of the heat conduction zone can also be conducted to the second fitting portion 131 via the first fitting portion 121. In addition, in order to reduce the occurrence of thermal resistance, the back surface 124 of the heat sink 12 and the inner surface 134 of the metal back plate 13 are preferably completely flat, so that the back surface 124 of the heat sink (10) can be completely attached to the metal back plate (10). On the inner surface 134, the effect is increased. _, under the ideal tolerance, the heat sink (10) is fixed on the metal back plate 130 by the 201232853 ιττ/ -ryjyi r\ structure, without the traditional method of attaching by screws or attaching with thermal adhesive. Fixing the heat sink 12〇, even if screws or adhesives can be used, the amount of screws can be reduced and the adhesive can be prevented. The viscosity can be reduced due to long-term thermal reaction, thereby avoiding the occurrence of the heat sink 120 and the metal back plate. 130 separation phenomenon. Next, please refer to Figures 3A and 3B, which show schematic diagrams of two types of array light source modules. The array light source module 2 includes a plurality of light emitting elements 21, a thermal sheet 220, and a metal back sheet 230. Examples of the light-emitting elements 210 are, for example, light-emitting diodes which are arranged along the extending direction of the heat sink 220 to form an array of light sources. The heat sink 22 is formed in a long plate shape, and the first fitting portion 221 of the heat sink 22A and the second fitting portion 231 of the metal back plate 230 are engaged with each other to fix the heat sink 220 to the metal back plate 230. The first fitting portion 221 includes a plurality of grooves 221a recessed in the lunar surface 224 of the fins and arranged along the extending direction of the fins 220. In addition, the =t into σ 231 includes a plurality of bumps 231a, and the bumps 231β are complementary to the shapes of the recesses 221a and protrude from the inner surface of the metal back plate 23〇 to the first mating portion. 221 and the second merging portion 231 are mutually engaged. In one embodiment, each of the recesses 231a is located below each of the illuminating elements, as shown in FIG. 3A, so that the lower 2 of each of the illuminating elements gw has an independent heat transfer path to increase the amount of heat dissipation. In addition, in another embodiment, if the amount of heat dissipation required for the light-emitting element 21 is small, the number of the grooves U1a may be less than the number of the light-emitting elements 21(), for example, three, as shown in FIG. 3B. . In addition, the first fitting portion 221 and the second fitting portion 231 can be formed by extrusion, stamping or milling, and the time of extrusion or stamping is relatively short, and the cost is low, which is suitable for mass production and reduced working hours. . 201232853
1 W/4UyFA 由此可知，本實施例之陣列光源模組2 0 0，係將散熱 片220以嵌合方式固定於金屬背板230上，以使熱能快速 地由多個發光元件210傳輸至散熱片220以及金屬背板 230,避免熱囤積在散熱片220與金屬背板230之間而影 響發光元件的使用壽命及發光元件的發光效率。在組裝 上，散熱片220與金屬背板230可藉由凹凸配合的嵌合結 構組裝為一體，組裝方便，因此所需的工時相對少於以螺 絲鎖固或是以導熱膠貼附所需的工時。 同時，在理想的公差配合下，散熱片220可單靠嵌合 結構固定在金屬背板230上，不需藉由外加的螺絲鎖附或 以導熱膠貼附等傳統的做法來固定散熱片220，即使可以 使用螺絲或黏膠，但螺絲的使用量可減少以及避免黏膠可 能因長時間熱反應後會造成黏性降低，進而避免發生散熱 片220與金屬背板230分離的現象。 綜上所述，雖然本發明已以較佳實施例揭露如上，然 其並非用以限定本發明。本發明所屬技術領域中具有通常 知識者，在不脫離本發明之精神和範圍内，當可作各種之 更動與潤飾。因此，本發明之保護範圍當視後附之申請專 利範圍所界定者為準。 【圖式簡單說明】 第1Α圖繪示依照一實施例之嵌合結構的剖面圖。 第1Β圖繪示依照另一實施例之嵌合結構的剖面圖。 第2圖繪示依照一實施例之光源模組的剖面圖。 2012328531 W/4 UyFA It can be seen that the array light source module 200 of the embodiment fixes the heat sink 220 to the metal back plate 230 in a fitting manner, so that the thermal energy is quickly transmitted from the plurality of light emitting elements 210 to The heat sink 220 and the metal back plate 230 prevent heat from being accumulated between the heat sink 220 and the metal back plate 230 to affect the service life of the light emitting element and the light emitting efficiency of the light emitting element. In assembly, the heat sink 220 and the metal back plate 230 can be assembled by a fitting structure with a concave-convex fit, and the assembly is convenient, so that the required working time is relatively less than that required by screwing or fixing with a thermal conductive adhesive. Working hours. At the same time, under the ideal tolerance, the heat sink 220 can be fixed on the metal back plate 230 by the fitting structure alone, and the heat sink 220 is not fixed by the conventional method such as external screw locking or thermal adhesive bonding. Even if screws or adhesives can be used, the amount of screws can be reduced and the viscosity of the adhesives may be reduced due to long-term thermal reaction, thereby preventing the separation of the heat sink 220 from the metal back plate 230. In the above, the present invention has been disclosed in the above preferred embodiments, but it is not intended to limit the present invention. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view showing a fitting structure according to an embodiment. Figure 1 is a cross-sectional view showing a fitting structure in accordance with another embodiment. 2 is a cross-sectional view of a light source module in accordance with an embodiment. 201232853
1 / TV·/ 矗 i~V 第3A及3B圖繪示兩種型態之陣列光源模組的示意 圖。 【主要元件符號說明】 100 :光源模組 101 :嵌合結構 110、210 :發光元件 111 :電極 112 :電路板 112a :導熱區 112b :電性連接區 114 :導熱膠 120、 220 :散熱片 121、 122、221 :第一嵌合部 121a、122a :第一卡勾部 124、224 :背面 131、132、231 :第二嵌合部 131a、132a :第二卡勾部 130、230 :金屬背板 134、234 :内表面 200 :陣列光源模組 221a :凹槽 231a :凸塊1 / TV·/ 矗 i~V Figures 3A and 3B show schematic diagrams of two types of array light source modules. [Main component symbol description] 100: Light source module 101: fitting structure 110, 210: light emitting element 111: electrode 112: circuit board 112a: heat conducting area 112b: electrical connection area 114: thermal conductive adhesive 120, 220: heat sink 121 122, 221: first fitting portions 121a, 122a: first hook portions 124, 224: back faces 131, 132, 231: second fitting portions 131a, 132a: second hook portions 130, 230: metal back Plate 134, 234: inner surface 200: array light source module 221a: groove 231a: bump