201228488 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種印刷電路板，尤其涉及一種用於傳送高 頻信號之電連接器内部之印刷電路板。 【先前技術】 [0002] 隨著信號傳送速度迅猛的提高和高頻電路的廣泛應用， 對印刷電路板也提出了更高的要求。印刷電路板提供的 電路性能必須能夠使信號在傳輸過程中不發生反射現象 ，信號保持完整，降低傳輪損耗，提供匹配阻抗的作用 ^ ，這樣才能得到完整、可靠、精確、無干擾、噪音之傳 輸仏號。使用於尚頻電連接器的印刷電路板一般由幾層 材料粘合在一起。傳統的印刷電路板通常包括絕緣基板 、接地層、隔層及位於最外層的銅質導電路徑，印刷電 路板之特性阻抗通常由導電路徑的寬度、銅厚度、絕緣 層之）丨貝係數及厚度等條件決定，然而當導電路徑與外 邓心線或端子焊接時，往往由於壽勒較大:，拓寬了導電 ❹ 路徑的寬度，從而導致特性阻板竣小，¥從而令使用該印 刷電路板之電連接器無法符合相應協會的要求。 故針對上述技術問題，確有必要提供一種改進的印刷 電路板。 【發明内容】 _]本發明之目的在於提供一種印刷電路板，可調整其特性 阻抗。 本發月之目的係通過以下技術方案實現：一種印刷電路 板，其包括沿縱向堆疊在—起的絕緣基板、接地層、隔 099145961 表單編號 A〇l〇l * „ , 頁/共 11 頁 0992079087-0 201228488 [0006] [0007] [0008] [0009] 099145961 層以及導電路徑，所述導電路徑位於最外層，所述隔層 位於接地層與導電路徑之間，所述導電路徑包括若干導 電片，每個導電片包括至少一焊接部，所述接地層設有 與所述焊接部沿縱向對齊之通槽。 與現有技術相比，本發明具有如下有益效果：導電路徑 之焊接部與接地層之通槽縱向對齊，從而可降低導電路 徑與接地層之電容值，從而提高印刷電路板之特性阻抗 〇 【實施方式】 請參閱第一圖至第二圖，本發明印刷電路板100包括沿縱 向堆疊在一起的絕緣基板1、第一接地層21、第二接地層 22、第一隔層31、第二隔層32、第一導電路徑41及第二 導電路徑42。印刷電路板100整體呈凸字形，然而在其他 實施例中也可以為其他形狀。 第一接地層21、第二接地層22分別由銅印刷於絕緣基板1 之上下兩個表面，第一接地層21設有位於其前邊緣之第 一通槽211及位於後邊緣之第二通槽212，第二接地層22 設有位於前邊緣的第一通槽221及位於後邊緣的第二通槽 222。第一隔層31位於第一接地層22與第一導電路徑41 之間，第二隔層32位於第二接地層22與第二導電路徑42 之間。第一導電路徑41與第二導電路徑42分別位於印刷 電路板100之頂層和底層。 第一導電路徑41由若干第一導電片411組成，每個第一導 電片411包括位於前端的第一焊接部4111及位於後端的第 二焊接部4112，第一焊接部4111沿橫向排成一排，第二 表單編號A0101 第4頁/共11頁 0992079087-0 201228488 焊接部4112沿橫向排成一排。第二導電路徑42由若干第 二導電片421組成’每個第二導電片421包括位於前端及 後端的第一焊接部4211、第二焊接部4212，第一焊接部 4211沿橫向排成一排，第二焊接部4212沿橫向排成一排 [0010] 參閱第三圖所示，第一導電片41之第一焊接部4111、第 二焊接部4112分別與第一接地層21之第一通槽211、第 二通槽21 2沿縱向相對齊。第二導電片42之第一焊接部 4111、第二焊接部4112分別與第二接地層22之第一通槽 221、第二通槽222縱向對齊。這樣設計，則可降低接地 層與導電路徑之電容值，提高印刷電路板1〇〇之特性阻抗 ，進而提高對應連接器之特性阻抗。 [0011] 本實施例中，第一、第二導電路徑41、42為分別在隔層 31、32上印刷銅而製成，但也可由其他金屬材料取代， 第一通槽211、221或者第二通槽212、222可以為矩形或 其他形狀，也可以分成若千個小通槽，只要保證接地層 與焊接部縱向對齊的部分為通孔從而降低電容值即可。 絕緣基板1、第一隔層31及第二隔層32由環氧玻璃布層壓 板（FR-4)製成，但也可由其他材料製成。本發明並不局 限於上述實施方式，在這裏不——贅述。 【圖式簡單說明】 [0012] 第一圖係本發明印刷電路板之立體組合圖。 [0013] 第二圖係本發明印刷電路板之立體分解圖。 [0014] 第三圖係印刷電路板之絕緣基板、第一隔層及第二隔層 0992079087-0 099145961 表單編號A0101 第5頁/共11頁 201228488 拿掉後之部分組合圖。 【主要元件符號說明】 [0015] [0016] [0017] [0018] [0019] [0020] [0021] [0022] [0023] 絕緣基板1印刷電路板1 0 0 第一接地層21第一通槽211、221 第二通槽212、222第二接地層22 第一隔層31第二隔層32 壓板4第一導電路徑41 第一導電片411第一焊接部4111 第二焊接部4112第二導電路徑42 第二導電片421第一焊接部4211 第二焊接部4212 099145961 表單編號A0101 第6頁/共11頁 0992079087-0201228488 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to a printed circuit board, and more particularly to a printed circuit board for use in an electrical connector for transmitting high frequency signals. [Prior Art] [0002] With the rapid increase in signal transmission speed and the wide application of high-frequency circuits, higher requirements have been placed on printed circuit boards. The circuit performance provided by the printed circuit board must be such that the signal does not reflect during transmission, the signal remains intact, the transmission loss is reduced, and the impedance is matched to provide a complete, reliable, accurate, interference-free, noise-free Transfer the apostrophe. Printed circuit boards used in still frequency electrical connectors are typically bonded together by several layers of material. A conventional printed circuit board usually includes an insulating substrate, a ground layer, a spacer, and a copper conductive path at the outermost layer. The characteristic impedance of the printed circuit board is usually determined by the width of the conductive path, the thickness of the copper, the coefficient of the insulating layer, and the thickness of the insulating layer. When the condition is determined, however, when the conductive path is soldered to the outer Dengxin wire or the terminal, the life is often larger: the width of the conductive 路径 path is widened, resulting in a small characteristic slab, so that the printed circuit board is used. The electrical connector does not meet the requirements of the corresponding association. Therefore, it is indeed necessary to provide an improved printed circuit board for the above technical problems. SUMMARY OF THE INVENTION The object of the present invention is to provide a printed circuit board that can be adjusted in its characteristic impedance. The purpose of this month is achieved by the following technical solution: a printed circuit board comprising an insulating substrate stacked in the longitudinal direction, a ground layer, a partition 099145961, a form number A〇l〇l * „ , Page / Total 11 pages 0992079087 - 0 201228488 [0007] [0009] [0009] [0009] 099145961 layer and conductive path, the conductive path is located at the outermost layer, the spacer is located between the ground layer and the conductive path, the conductive path includes a plurality of conductive sheets Each of the conductive sheets includes at least one soldering portion, and the grounding layer is provided with a through slot aligned with the soldering portion in the longitudinal direction. Compared with the prior art, the present invention has the following beneficial effects: the soldering portion and the grounding layer of the conductive path The through slots are longitudinally aligned, thereby reducing the capacitance value of the conductive path and the ground layer, thereby improving the characteristic impedance of the printed circuit board. [Embodiment] Referring to the first to second figures, the printed circuit board 100 of the present invention includes the longitudinal direction. The insulating substrate 1 , the first ground layer 21 , the second ground layer 22 , the first interlayer 31 , the second interlayer 32 , the first conductive path 41 , and the second conductive path 42 are stacked together The printed circuit board 100 has a convex shape as a whole, but may be other shapes in other embodiments. The first ground layer 21 and the second ground layer 22 are respectively printed on the lower surface of the insulating substrate 1 by copper, and the first ground layer 21 is provided with a first through slot 211 at a front edge thereof and a second through slot 212 at a rear edge. The second ground layer 22 is provided with a first through slot 221 at the front edge and a second through slot 222 at the rear edge. The first interlayer 31 is located between the first ground layer 22 and the first conductive path 41, and the second layer 32 is located between the second ground layer 22 and the second conductive path 42. The first conductive path 41 and the second conductive path The paths 42 are respectively located on the top and bottom layers of the printed circuit board 100. The first conductive path 41 is composed of a plurality of first conductive sheets 411, each of which includes a first soldering portion 4111 at the front end and a second soldering portion at the rear end. In the portion 4112, the first soldering portions 4111 are arranged in a row in the lateral direction, and the second form number A0101 is 4th page/total 11 pages 0992079087-0 201228488. The soldering portions 4112 are arranged in a row in the lateral direction. The second conductive path 42 is composed of a plurality of second portions. Conductive sheet 421 constitutes 'each number The conductive sheet 421 includes a first soldering portion 4211 and a second soldering portion 4212 at the front end and the rear end. The first soldering portions 4211 are arranged in a row in the lateral direction, and the second soldering portions 4212 are arranged in a row in the lateral direction. [0010] As shown in the figure, the first soldering portion 4111 and the second soldering portion 4112 of the first conductive sheet 41 are respectively aligned with the first through slot 211 and the second through slot 21 2 of the first ground layer 21 in the longitudinal direction. The first soldering portion 4111 and the second soldering portion 4112 of the 42 are longitudinally aligned with the first through slot 221 and the second through slot 222 of the second ground layer 22, respectively. This design reduces the capacitance of the ground plane and the conductive path, improves the characteristic impedance of the printed circuit board, and improves the characteristic impedance of the corresponding connector. [0011] In this embodiment, the first and second conductive paths 41 and 42 are formed by printing copper on the spacers 31 and 32, respectively, but may be replaced by other metal materials, and the first through grooves 211, 221 or the first The two-way grooves 212 and 222 may be rectangular or other shapes, and may be divided into thousands of small through grooves, as long as the portion in which the ground layer is longitudinally aligned with the welded portion is a through hole to reduce the capacitance value. The insulating substrate 1, the first spacer 31, and the second spacer 32 are made of a glass epoxy cloth laminate (FR-4), but may be made of other materials. The present invention is not limited to the above embodiments, and is not described here. BRIEF DESCRIPTION OF THE DRAWINGS [0012] The first figure is a perspective assembled view of a printed circuit board of the present invention. [0013] The second drawing is an exploded perspective view of the printed circuit board of the present invention. [0014] The third figure is an insulating substrate, a first spacer, and a second spacer of the printed circuit board. 0992079087-0 099145961 Form No. A0101 Page 5 of 11 201228488 A part of the combined picture is removed. [0016] [0020] [0020] [0023] [0022] [0023] [0023] Insulating substrate 1 printed circuit board 1 0 0 first ground layer 21 first pass Slot 211, 221 second through slot 212, 222 second ground layer 22 first spacer 31 second spacer 32 press plate 4 first conductive path 41 first conductive sheet 411 first solder portion 4111 second solder portion 4112 second Conductive path 42 second conductive sheet 421 first welded portion 4211 second welded portion 4212 099145961 Form No. A0101 Page 6 / Total 11 pages 0992079087-0