TW201224075A - Solvent or solvent composition for printing - Google Patents
Solvent or solvent composition for printing Download PDFInfo
- Publication number
- TW201224075A TW201224075A TW100138572A TW100138572A TW201224075A TW 201224075 A TW201224075 A TW 201224075A TW 100138572 A TW100138572 A TW 100138572A TW 100138572 A TW100138572 A TW 100138572A TW 201224075 A TW201224075 A TW 201224075A
- Authority
- TW
- Taiwan
- Prior art keywords
- solvent
- pattern
- printing method
- printing
- organic
- Prior art date
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- 239000002904 solvent Substances 0.000 title claims abstract description 65
- 239000000203 mixture Substances 0.000 title claims abstract description 53
- 238000007639 printing Methods 0.000 title claims abstract description 49
- 238000000034 method Methods 0.000 claims abstract description 82
- -1 dipropylene glycol dialkyl ether Chemical class 0.000 claims abstract description 36
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 18
- 150000001875 compounds Chemical class 0.000 claims abstract description 9
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 7
- 238000007646 gravure printing Methods 0.000 claims abstract description 6
- 238000000813 microcontact printing Methods 0.000 claims abstract description 6
- 238000007645 offset printing Methods 0.000 claims abstract description 6
- 238000007650 screen-printing Methods 0.000 claims abstract description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 37
- 239000000758 substrate Substances 0.000 claims description 15
- 239000004840 adhesive resin Substances 0.000 claims description 14
- 229920006223 adhesive resin Polymers 0.000 claims description 14
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 13
- 229910052799 carbon Inorganic materials 0.000 claims description 13
- 230000007261 regionalization Effects 0.000 claims description 10
- 238000005401 electroluminescence Methods 0.000 claims description 9
- 238000010304 firing Methods 0.000 claims description 6
- 238000007644 letterpress printing Methods 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- 239000004925 Acrylic resin Substances 0.000 claims description 4
- 229920000178 Acrylic resin Polymers 0.000 claims description 4
- 239000012461 cellulose resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 abstract description 14
- 239000011347 resin Substances 0.000 abstract description 14
- 239000000654 additive Substances 0.000 abstract description 11
- 230000000996 additive effect Effects 0.000 abstract description 7
- 125000004432 carbon atom Chemical group C* 0.000 abstract description 3
- 239000011230 binding agent Substances 0.000 abstract 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 16
- 239000010410 layer Substances 0.000 description 12
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 11
- 239000001856 Ethyl cellulose Substances 0.000 description 10
- 229920001249 ethyl cellulose Polymers 0.000 description 10
- 235000019325 ethyl cellulose Nutrition 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- QQONPFPTGQHPMA-UHFFFAOYSA-N Propene Chemical group CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 4
- 229940022663 acetate Drugs 0.000 description 4
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 4
- 239000012153 distilled water Substances 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 3
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 150000001346 alkyl aryl ethers Chemical class 0.000 description 3
- 229920002678 cellulose Polymers 0.000 description 3
- 239000001913 cellulose Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000012074 organic phase Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- LEEANUDEDHYDTG-UHFFFAOYSA-N 1,2-dimethoxypropane Chemical compound COCC(C)OC LEEANUDEDHYDTG-UHFFFAOYSA-N 0.000 description 2
- QMGJMGFZLXYHCR-UHFFFAOYSA-N 1-(2-butoxypropoxy)butane Chemical compound CCCCOCC(C)OCCCC QMGJMGFZLXYHCR-UHFFFAOYSA-N 0.000 description 2
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- JDSQBDGCMUXRBM-UHFFFAOYSA-N 2-[2-(2-butoxypropoxy)propoxy]propan-1-ol Chemical compound CCCCOC(C)COC(C)COC(C)CO JDSQBDGCMUXRBM-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- 244000291564 Allium cepa Species 0.000 description 2
- 235000002732 Allium cepa var. cepa Nutrition 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
- 229940072049 amyl acetate Drugs 0.000 description 2
- PGMYKACGEOXYJE-UHFFFAOYSA-N anhydrous amyl acetate Natural products CCCCCOC(C)=O PGMYKACGEOXYJE-UHFFFAOYSA-N 0.000 description 2
- QUKGYYKBILRGFE-UHFFFAOYSA-N benzyl acetate Chemical compound CC(=O)OCC1=CC=CC=C1 QUKGYYKBILRGFE-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229920001940 conductive polymer Polymers 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- FLKPEMZONWLCSK-UHFFFAOYSA-N diethyl phthalate Chemical compound CCOC(=O)C1=CC=CC=C1C(=O)OCC FLKPEMZONWLCSK-UHFFFAOYSA-N 0.000 description 2
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 2
- 150000002009 diols Chemical class 0.000 description 2
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- MTZQAGJQAFMTAQ-UHFFFAOYSA-N ethyl benzoate Chemical compound CCOC(=O)C1=CC=CC=C1 MTZQAGJQAFMTAQ-UHFFFAOYSA-N 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 2
- MNWFXJYAOYHMED-UHFFFAOYSA-M heptanoate Chemical compound CCCCCCC([O-])=O MNWFXJYAOYHMED-UHFFFAOYSA-M 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 239000010416 ion conductor Substances 0.000 description 2
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 2
- XMGQYMWWDOXHJM-UHFFFAOYSA-N limonene Chemical compound CC(=C)C1CCC(C)=CC1 XMGQYMWWDOXHJM-UHFFFAOYSA-N 0.000 description 2
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- ZWRUINPWMLAQRD-UHFFFAOYSA-N nonan-1-ol Chemical compound CCCCCCCCCO ZWRUINPWMLAQRD-UHFFFAOYSA-N 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 2
- 239000003208 petroleum Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 235000019260 propionic acid Nutrition 0.000 description 2
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 2
- URAYPUMNDPQOKB-UHFFFAOYSA-N triacetin Chemical compound CC(=O)OCC(OC(C)=O)COC(C)=O URAYPUMNDPQOKB-UHFFFAOYSA-N 0.000 description 2
- VPBZZPOGZPKYKX-UHFFFAOYSA-N 1,2-diethoxypropane Chemical compound CCOCC(C)OCC VPBZZPOGZPKYKX-UHFFFAOYSA-N 0.000 description 1
- IMSVBNQVZVQSND-UHFFFAOYSA-N 1,5-bis(sulfanyl)pentan-3-one Chemical compound SCCC(=O)CCS IMSVBNQVZVQSND-UHFFFAOYSA-N 0.000 description 1
- CUVLMZNMSPJDON-UHFFFAOYSA-N 1-(1-butoxypropan-2-yloxy)propan-2-ol Chemical compound CCCCOCC(C)OCC(C)O CUVLMZNMSPJDON-UHFFFAOYSA-N 0.000 description 1
- FJJOLPMSHZJZPV-UHFFFAOYSA-N 1-(2-propoxypropoxy)decane Chemical compound CCCCCCCCCCOCC(C)OCCC FJJOLPMSHZJZPV-UHFFFAOYSA-N 0.000 description 1
- JWZSJQJEMGTJHC-UHFFFAOYSA-N 1-[1-(1-propoxypropan-2-yloxy)propan-2-yloxy]decane Chemical compound CCCCCCCCCCOC(C)COC(C)COCCC JWZSJQJEMGTJHC-UHFFFAOYSA-N 0.000 description 1
- UOWSVNMPHMJCBZ-UHFFFAOYSA-N 1-[2-(2-butoxypropoxy)propoxy]butane Chemical compound CCCCOCC(C)OCC(C)OCCCC UOWSVNMPHMJCBZ-UHFFFAOYSA-N 0.000 description 1
- HNAGHMKIPMKKBB-UHFFFAOYSA-N 1-benzylpyrrolidine-3-carboxamide Chemical compound C1C(C(=O)N)CCN1CC1=CC=CC=C1 HNAGHMKIPMKKBB-UHFFFAOYSA-N 0.000 description 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- GFMGMTAHHMMNTA-UHFFFAOYSA-N 1-ethoxy-2-methoxypropane Chemical compound CCOCC(C)OC GFMGMTAHHMMNTA-UHFFFAOYSA-N 0.000 description 1
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 1
- HGERSUQOJQWENV-UHFFFAOYSA-N 1-pentan-2-yloxypropan-2-ol Chemical compound CCCC(C)OCC(C)O HGERSUQOJQWENV-UHFFFAOYSA-N 0.000 description 1
- JOERQAIRIDZWHX-UHFFFAOYSA-N 1-propoxy-2-(2-propoxypropoxy)propane Chemical compound CCCOCC(C)OCC(C)OCCC JOERQAIRIDZWHX-UHFFFAOYSA-N 0.000 description 1
- FENFUOGYJVOCRY-UHFFFAOYSA-N 1-propoxypropan-2-ol Chemical compound CCCOCC(C)O FENFUOGYJVOCRY-UHFFFAOYSA-N 0.000 description 1
- HFZLSTDPRQSZCQ-UHFFFAOYSA-N 1-pyrrolidin-3-ylpyrrolidine Chemical compound C1CCCN1C1CNCC1 HFZLSTDPRQSZCQ-UHFFFAOYSA-N 0.000 description 1
- ASMIMLSFWXNZNW-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate;2-(2-hydroxyethoxy)ethanol Chemical compound OCCOCCO.CCCCOCCOCCOC(C)=O ASMIMLSFWXNZNW-UHFFFAOYSA-N 0.000 description 1
- UVNSFSOKRSZVEZ-UHFFFAOYSA-N 2-(2-decoxyethoxy)ethanol Chemical compound CCCCCCCCCCOCCOCCO UVNSFSOKRSZVEZ-UHFFFAOYSA-N 0.000 description 1
- CPXAVMWHYAGLNU-UHFFFAOYSA-N 2-(2-decoxypropoxy)propan-1-ol Chemical compound CCCCCCCCCCOC(C)COC(C)CO CPXAVMWHYAGLNU-UHFFFAOYSA-N 0.000 description 1
- DJCYDDALXPHSHR-UHFFFAOYSA-N 2-(2-propoxyethoxy)ethanol Chemical compound CCCOCCOCCO DJCYDDALXPHSHR-UHFFFAOYSA-N 0.000 description 1
- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 description 1
- YGZNPWLHYNXTGF-UHFFFAOYSA-N 2-[2-(2-decoxypropoxy)propoxy]propan-1-ol Chemical compound CCCCCCCCCCOC(C)COC(C)COC(C)CO YGZNPWLHYNXTGF-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- CRWNQZTZTZWPOF-UHFFFAOYSA-N 2-methyl-4-phenylpyridine Chemical compound C1=NC(C)=CC(C=2C=CC=CC=2)=C1 CRWNQZTZTZWPOF-UHFFFAOYSA-N 0.000 description 1
- YEYKMVJDLWJFOA-UHFFFAOYSA-N 2-propoxyethanol Chemical compound CCCOCCO YEYKMVJDLWJFOA-UHFFFAOYSA-N 0.000 description 1
- QMAQLCVJIYANPZ-UHFFFAOYSA-N 2-propoxyethyl acetate Chemical compound CCCOCCOC(C)=O QMAQLCVJIYANPZ-UHFFFAOYSA-N 0.000 description 1
- NMUMFCGQLRQGCR-UHFFFAOYSA-N 3-methoxypentyl acetate Chemical compound CCC(OC)CCOC(C)=O NMUMFCGQLRQGCR-UHFFFAOYSA-N 0.000 description 1
- VATRWWPJWVCZTA-UHFFFAOYSA-N 3-oxo-n-[2-(trifluoromethyl)phenyl]butanamide Chemical compound CC(=O)CC(=O)NC1=CC=CC=C1C(F)(F)F VATRWWPJWVCZTA-UHFFFAOYSA-N 0.000 description 1
- LMLBDDCTBHGHEO-UHFFFAOYSA-N 4-methoxybutyl acetate Chemical compound COCCCCOC(C)=O LMLBDDCTBHGHEO-UHFFFAOYSA-N 0.000 description 1
- ZMFWEWMHABZQNB-UHFFFAOYSA-N 6-acetyloxyhexyl acetate Chemical compound CC(=O)OCCCCCCOC(C)=O ZMFWEWMHABZQNB-UHFFFAOYSA-N 0.000 description 1
- 240000006108 Allium ampeloprasum Species 0.000 description 1
- 235000005254 Allium ampeloprasum Nutrition 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- PKYHITJUXVNAGP-UHFFFAOYSA-N C(C)OC(COCCCCCCCCCC)C Chemical compound C(C)OC(COCCCCCCCCCC)C PKYHITJUXVNAGP-UHFFFAOYSA-N 0.000 description 1
- QYRXNZKFJFBFOM-UHFFFAOYSA-N CC(=O)OCCOC(=O)C1=CC=CC=C1C(=O)OC2=CC=CC=C2 Chemical compound CC(=O)OCCOC(=O)C1=CC=CC=C1C(=O)OC2=CC=CC=C2 QYRXNZKFJFBFOM-UHFFFAOYSA-N 0.000 description 1
- NWIFCOZPZAEKDX-UHFFFAOYSA-N CCCCCCCCCCOCC(C)OCCCCC Chemical compound CCCCCCCCCCOCC(C)OCCCCC NWIFCOZPZAEKDX-UHFFFAOYSA-N 0.000 description 1
- 239000005635 Caprylic acid (CAS 124-07-2) Substances 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- 239000004713 Cyclic olefin copolymer Substances 0.000 description 1
- YYLLIJHXUHJATK-UHFFFAOYSA-N Cyclohexyl acetate Chemical compound CC(=O)OC1CCCCC1 YYLLIJHXUHJATK-UHFFFAOYSA-N 0.000 description 1
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical compound O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 240000002853 Nelumbo nucifera Species 0.000 description 1
- 235000006508 Nelumbo nucifera Nutrition 0.000 description 1
- 235000006510 Nelumbo pentapetala Nutrition 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- NQHAZTDQFIYTQD-UHFFFAOYSA-N SOS Chemical compound SOS NQHAZTDQFIYTQD-UHFFFAOYSA-N 0.000 description 1
- 241000779819 Syncarpia glomulifera Species 0.000 description 1
- 244000269722 Thea sinensis Species 0.000 description 1
- RNFAKTRFMQEEQE-UHFFFAOYSA-N Tripropylene glycol butyl ether Chemical compound CCCCOC(CC)OC(C)COC(O)CC RNFAKTRFMQEEQE-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000001242 acetic acid derivatives Chemical class 0.000 description 1
- HQNVSUZJHUXJAX-UHFFFAOYSA-N acetic acid;butane-1,4-diol Chemical compound CC(O)=O.CC(O)=O.OCCCCO HQNVSUZJHUXJAX-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 229940007550 benzyl acetate Drugs 0.000 description 1
- 235000019445 benzyl alcohol Nutrition 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 210000004556 brain Anatomy 0.000 description 1
- OBNCKNCVKJNDBV-UHFFFAOYSA-N butanoic acid ethyl ester Natural products CCCC(=O)OCC OBNCKNCVKJNDBV-UHFFFAOYSA-N 0.000 description 1
- XUPYJHCZDLZNFP-UHFFFAOYSA-N butyl ester butanoic acid Natural products CCCCOC(=O)CCC XUPYJHCZDLZNFP-UHFFFAOYSA-N 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 235000013877 carbamide Nutrition 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 150000001983 dialkylethers Chemical class 0.000 description 1
- 229940028820 didecyl ether Drugs 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- WYACBZDAHNBPPB-UHFFFAOYSA-N diethyl oxalate Chemical compound CCOC(=O)C(=O)OCC WYACBZDAHNBPPB-UHFFFAOYSA-N 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- UYAAVKFHBMJOJZ-UHFFFAOYSA-N diimidazo[1,3-b:1',3'-e]pyrazine-5,10-dione Chemical compound O=C1C2=CN=CN2C(=O)C2=CN=CN12 UYAAVKFHBMJOJZ-UHFFFAOYSA-N 0.000 description 1
- POLCUAVZOMRGSN-UHFFFAOYSA-N dipropyl ether Chemical compound CCCOCCC POLCUAVZOMRGSN-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- IFDFMWBBLAUYIW-UHFFFAOYSA-N ethane-1,2-diol;ethyl acetate Chemical compound OCCO.CCOC(C)=O IFDFMWBBLAUYIW-UHFFFAOYSA-N 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- BHXIWUJLHYHGSJ-UHFFFAOYSA-N ethyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OCC BHXIWUJLHYHGSJ-UHFFFAOYSA-N 0.000 description 1
- UDOUIRSXTJAWOV-UHFFFAOYSA-N ethyl acetate;propyl acetate Chemical compound CCOC(C)=O.CCCOC(C)=O UDOUIRSXTJAWOV-UHFFFAOYSA-N 0.000 description 1
- WDAXFOBOLVPGLV-UHFFFAOYSA-N ethyl isobutyrate Chemical compound CCOC(=O)C(C)C WDAXFOBOLVPGLV-UHFFFAOYSA-N 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000001087 glyceryl triacetate Substances 0.000 description 1
- 235000013773 glyceryl triacetate Nutrition 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 235000001510 limonene Nutrition 0.000 description 1
- 229940087305 limonene Drugs 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052987 metal hydride Inorganic materials 0.000 description 1
- 150000004681 metal hydrides Chemical class 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- BDJSOPWXYLFTNW-UHFFFAOYSA-N methyl 3-methoxypropanoate Chemical compound COCCC(=O)OC BDJSOPWXYLFTNW-UHFFFAOYSA-N 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 235000010981 methylcellulose Nutrition 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 229960002446 octanoic acid Drugs 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 239000001739 pinus spp. Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- 229940116423 propylene glycol diacetate Drugs 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 235000015096 spirit Nutrition 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- CXWXQJXEFPUFDZ-UHFFFAOYSA-N tetralin Chemical compound C1=CC=C2CCCCC2=C1 CXWXQJXEFPUFDZ-UHFFFAOYSA-N 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 229960002622 triacetin Drugs 0.000 description 1
- 229940036248 turpentine Drugs 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 210000002700 urine Anatomy 0.000 description 1
- 239000000052 vinegar Substances 0.000 description 1
- 235000021419 vinegar Nutrition 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
201224075 六、發明說明: 【發明所屬之技術領域】 發月係關於#溶劑或溶劑組成物,其係難吸濕 且具優越之樹脂溶解性、於藉印刷法而形成圖案之際; 使用。 【先前技術】 習知之配線基板或顯*器等之電子零件$圖案形成 大多為利用所謂的光刻之方法所形成。光刻係將糊组成 物塗布於基板上,進行微細㈣之曝光後㈣,利用姓 刻而去除不要之部分後進行圖案形成之方法。但是一般 而言,問題係由於必須具有蝕刻廢液處理設備,裝置本 身變仟龐大,且必須具有巨額之設備投資,材料之使用 效率也差,由於製造步驟多而導致生產性差。另外,由 於受裝置之容量所限制,對大面積基板難以形成圖案。 因此,近年來圖案形成方法並不需要龐大的裝置且 材料之使用效率佳,也容易對應於大面積基板的喷墨 法、網板印刷法、凸版印刷法、膠版印刷法、照相凹版 印刷法、微接觸印刷法、奈米印跡法等之印刷法而受到 矚目。可用於印刷法之糊組成物所使用的溶劑大多為使 用二乙二醇二甲基醚或二乙二醇二丁基醚等之乙二醇醚 系溶劑;二丙二醇二甲基醚、二丙二醇二乙基醚、二丙 二醇二丙基醚、二丙二醇二丁基醚等之丙二醇醚系溶劑 等之例子。但是,由於乙二醇醚系溶劑係具有生態毒性, 故有不便使用之問題(非專利文獻1 )。 -4- 201224075 另一方面,針對丙二醇醚系溶劑,於專利文獻丨中, 已。己載於藉印刷法而形成構成有機電致發光裝置(以後 有稱為「有機EL裝置」之情形)之元件(以後有稱為「有 機EL裝置」之情形)之圖案的糊組成物中,將丙二醇二 乙基醚當做溶劑使用。另外,於專利文獻2中,已記載 使用丙二醇二丁基醚。而且,於專利文獻3中,已記載 使用丙二醇乙基甲基醚、丙二醇曱基丙基醚、丙二醇乙 基丙基趟。 先前技術文獻 專利文獻 專利文獻1日本特開2010-0099 13號公報 專利文獻2曰本特開2001-135 140號公報 專利文獻3日本特開2 0 1 0 -1 5 2 3 3 5號公報 非專利文獻 非專利文獻1國際化學物質簡潔評估文件No.41二乙 一醇二甲基醚(Diethylene Glycol Dimethyl Ether) (2002) 【發明内容】 〔發明所欲解決之問題〕 得知丙二醇二烷基醚係具優越之揮發性,但由於尤 其丙二醇二甲基醚係親水性高且容易吸濕,若於形成有 機EL裝置的元件糊組成物中當做溶劑使用時,將有使該 有機EL裝置的元件劣化之虞,另一方面,丙二醇二丁基 鍵係親油性高且吸濕性低’但由於糊組成物中所含有的 乙基纖維素或丙烯酸樹脂等之黏著劑樹脂的溶解性低, 201224075 難以當做印刷用溶劑使用。另外,得知基 甲基,、丙二醇甲基丙基喊、及丙二醇乙基 樹脂添加物之溶解性與吸濕性的均衡之觀點為不足。 因而,本發明之目的係在於提供一種黏著劑樹脂等 之樹脂添加物之溶解性高且吸濕性低的有機el裝置(例 如顯不器、照明等)之圖案印刷用溶劑或溶劑組成物。 本發明之其他目的係提供一種含有該有機el裝置 之圖案印刷用溶劑或溶劑組成物之有機EL装置的圖案 形成用糊組成物。 ' 本發明之其他目的係在提供一種使用該有機£1裝 置的圖案形成用糊組成物,而進行圖案形成之圖案形成 丁 L解決問題 本發明人等係為了解決上述課題而鑽研探討之釺果 發現.丙二醇二烷基醚之一側末端烷基為甲基,且另— 側末端院基為直鍵狀或分枝鍵狀烧基之c ^ 4·5現基的化合 物係具優異的樹脂添加物之溶解性、及吸濕性的平 若將當做溶劑之該化合物添加於形成有機裝置 件的圖案形成用組成物中之時,將該化合物當做溶= 用時’能夠藉印刷法而對進行元件圖案之形成 之黏著劑樹脂溶解性;且能夠藉吸濕、而形成 刀 有機裝置元件。本發明係基於此等 之 rfn ιΨ* 卜j 亦即,本發明係提供一種有機E]L裝 〜圆茶Ep屆丨|田 溶劑或溶劑^物’其係用於藉印刷法而形成構 EL·裝置之兀件時的溶劑或溶劑組成物; 开符徵為含有丙 ' 6 - 201224075 二醇二院基驗之二個末端烷基之一側為甲基,另一側為 碳數4或碳數5之直鏈狀或分枝鏈狀烷基的化合物。 該印刷法較佳為由噴墨法、網板印刷法、凸版印刷 法、膠版印刷法、照相凹版印刷法、微接觸印刷法、奈 米印跡法所構成之群組中所選出的至少一種方法。 另外’本發明更提供一種至少含有該圖案印刷用溶 劑或洛劑組成物與黏著劑樹脂之有機EL裝置之圖案形 成用糊組成物。 該黏著劑樹脂較佳為纖維素系樹脂及/或丙烯酸系 樹脂。 另外,本發明更提供一種圖案形成方法,其係構成 有機EL裝置之元件的圖案形成方法;其特徵為具有:藉 由利用印刷法將該有機EL裝置之圖案形成用糊組成物 塗布於基板上而形成圖案層之步驟;與硬化或燒製該圖 案層之步驟。 〔發明之效果〕 由於本發明之有機EL裝置之圖案印刷用溶劑或溶 劑組成物係含有上述丙二醇二烷基醚之二個末端烷基之 側為曱基,另一侧為碳數4或碳數5之直鏈狀或分枝 鏈狀烷基的化合物’具優越之黏著劑樹脂等之樹脂添加 物的溶解性’另外吸濕性極低。 因此,本發明之含有有機EL裝置之圖案印刷用溶劑 或溶劑組成物的有機E L裝置之圖案形成用糊組成物,即 使對於大面積及/或可撓性之基板,藉印刷法也能夠有效 地均勻塗布’於有機EL裝置元件的製造中,能夠高精確 201224075 j地形成微細之元件圓案。另外,由於難吸濕,能夠抑 制因濕氣所造成的有機EL裝置元件之件劣化。 【實施方式】 〔用於貫施發明之形態〕 〔有機EL裝置之圖案印刷用溶劑或溶劑組成物〕 有關本發明之有機EL裝置之圖案印刷用溶劑或溶 劑、.且成物係用於藉印刷法而形成構成有機EL裝置之元 件時的,谷劑或溶劑組成物;其特徵為含有丙二醇二烷基 越之二個末端烧基之一侧為甲基,另一側為碳數4或碳 數5之直鏈狀或分枝鏈狀烷基的化合物。 例如’該印刷法可舉例:喷墨法、網板印刷法、凸 版印刷法、膠版印刷法、照相凹版印刷法、微接觸印刷 法、奈米印跡法等。 在丙二醇二烧基醚之末端烷基的碳數4或碳數5之 直鍵狀或分枝鍵狀烧基’例如,可舉例:正丁基、正戊 基等之直鏈狀烷基;異丁基、二級丁基、三級丁基、異 戊基、二級戊基、三級戊基等之分枝鏈狀烷基。於本發 月中’其中基於容易供應原料之觀點,較佳為正丁基、 正戊基等之碳數4或碳數5的直鏈狀烷基。 在本發明之丙^一醇_一燒基驗之二個末端烧基之一側 為甲基’另一側為碳數4或碳數5之直鏈狀或分枝鏈狀 烷基的化合物,例如,可舉例:丙二醇甲基正丁基醚、 丙二醇曱基正戊基醚等。此等可單獨地使用,亦可混合 二種以上而使用。 -8 - 201224075 另外’有關本發明之有機EL裝置之圖案印刷用溶 /合劑組成物較佳為採取親水性與親油性均衡者,例士 ^水率較佳為3〇/〇以下(其中,更佳為1 5〇/〇以下) 含水率超過上述範圍時,將有使得使用有關本發明之= 機EL裝置之圖案印刷用溶劑或溶劑組成物所形成的有 機EL裝置元件變得容易劣化之傾向。 另外’有關本發明之有機EL裝置之圖案印刷用溶劑 或溶劑組成物較佳為乙基纖維素等之具優越之樹脂添加 物的溶解性,例如較佳為溶解5重量%以上乙基纖維素。 若乙基纖維素等之樹脂添加物的溶解量低於上述範圍 時,將有黏度變得過低且觸變性及印刷物之形狀安定性 不足之傾向。 除了上述丙二醇二烷基醚以外,本發明之有機EL 裝置之圖案印刷用溶劑或溶劑組成物係在不損害親水性 或親油性之均衡的範圍内,視需要亦可混合其他溶劑後 使用。其他溶劑的摻合比例能夠適當選擇。 其他;谷劑成夠使用在印刷用途一般所用之溶劑,例 如,可舉例:己酸、辛酸等之羧酸類;異丙醇、丨_辛醇、 1-壬醇、苄醇等之醇類;乙二醇單甲基醚、乙二醇單乙 基醚、乙二醇單丙基醚、乙二醇單丁基醚等之乙二醇單 烧基醚類,乙二醇單甲基醚乙酸酯、乙二醇單乙基越乙 酸酯'乙二醇單丙基醚乙酸酯、乙二醇單丁基醚乙酸酯、 乙二酵單苯基趟乙酸酯等之乙二醇單烧基醚乙酸酯類; 二乙二醇單曱基醚、二乙二醇單乙基醚、二乙二醇單丙 基醚、二乙二醇單丁基醚等之二乙二醇單烷基醚類;二 -9 - 201224075 乙二醇單乙基醚乙酸酯、二乙二醇單丁基醚乙酸酯 二乙二醇單烷基醚乙酸酯類;二乙二醇二甲基醚、 二醇二乙基醚等之二乙二醇二烷基醚類;苄基乙基 二己基醚、四氫呋喃等之其他醚類;丙二醇單甲基 酸酯、丙二醇單乙基醚乙酸酯、丙二醇單丁基醚乙 等之丙二醇單烷基醚乙酸酯類;二丙二醇曱基醚乙 等之二丙二醇單烷基醚乙酸酯類;丙二醇丙基醚、 醇丁基醚等之丙二醇單烷基醚類;丙二醇二曱基醚 二醇二乙基醚、丙二醇曱基乙基醚、丙二醇曱基丙 等之上述以外之丙二醇二烷基醚;二丙二醇曱基醚 丙二醇丙基醚、二丙二醇丁基醚等之二丙二醇單烷 類;三丙二醇曱基醚、三丙二醇丁基醚等之三丙二 烷基醚類;二丙二醇曱基丙基醚、二丙二醇曱基丁基 二丙二醇甲基戊基謎、二丙二醇二甲基醚、二丙二 乙基醚等之二丙二醇二烷基醚類;三丙二醇二甲基 之三丙二醇二烷基醚類;丙二醇二乙酸酯、1,3-丁 二乙酸酯、1,6-己二醇二乙酸酯、1,4-丁二醇二乙酸 之二乙酸酯類;環己醇乙酸酯、3 -曱氧基丁基乙酸 乳酸乙基乙酸酯、甘油三乙酸酯、乙酸二氫萜品酯 其他乙酸酯類;丙酮、曱基乙基酮、甲基異丁基酮 酮基丙酮、環己酮、異佛酮、2 -庚酮、3 -庚酮等之酮 2-羥基丙酸曱酯、2-羥基丙酸乙酯、乙酸苄酯、乙 醯基乳酸酯、安息香酸乙酯、草酸二乙酯、順丁烯 酸二乙酯、γ- 丁内酯、碳酸乙烯酯、碳酸丙烯酯、 基-2-甲基丙酸乙酯、3-曱氧基丙酸甲酯、3-曱氧基 等之 二乙 謎、 醚乙 酸酯 酸酯 丙二 、丙 基醚 、二 基 醇單 醚、 醇二 醚等 二醇 酯等 醋、 等之 、丙 類; 基乙 一尿 2 -經 丙酸 -10- 201224075 乙=3_乙氧基丙酸曱酯、3-乙氧基丙酸乙酯、乙 夂乙S曰經基乙酸乙酯、2 -經基_3_甲基丁酸曱® 甲基-3-甲氧丁基乙酸酯、4_甲氧丁基乙酸酯、卜甲 =氧I基丙酸酯、乙酸乙酯 '乙酸丙酯、乙酸丁酿 酸戊酯、乙酸戊酯、丙酸丁酯、丁酸乙酯、丁酸两 I 丁自曰丙酮酸甲酯、丙鋼酸乙酯、丙銅酸丙齡 醯乙酸曱酯、乙醯乙酸乙酯、2_羰基丁酸乙酯等之g 甲笨、一甲 一 Τ本等之芳香族烴類;Ν_曱基吡咯啶酮、 :基甲醯胺、Ν,Ν_二甲基乙醯胺等之醯胺類;蔥^ 了虱蔥品醇、丙酸二氫蔥品酯 '檸檬烯、萜烷、^ *之萜烯類,礦油精、石油輕油s _ 1 〇 〇、石油輕油s 四氫萘、松節油等之高沸點溶劑等。 有機EL裝置之圖案形成用糊組成物〕 有關本發明之有機E]L裝置之圖案形成用糊 物’其特徵為至少含右f 3有上述有機EL裝置之圖案印屌 劑或溶劑組成物與黏著劑樹脂。 黏著劑樹脂並未予以特;限定,能夠使用構4 裝置元件之形成所使用的習用之樹脂,例如, 例.甲基纖維素、乙基纖 纖維素等之镞…谢 基纖維素、甲基 等之纖維素系樹脂;丙歸酸系樹 知'聚乙烯醇等之乙烯樹 永^ 二種以邱樹知等。此等能夠單獨地或 離把杜。 其令基於塗布時之 既^ 及印刷物之形狀安定性 ,較佳為使用纖維素系樹脂。 氧基 '' 3-基'3 - '甲 酯、 、乙 ί類; Ν,Ν- ^醇、 荷腦 15〇、 丨組成 J用溶 :有機 可舉 羥基 乙酸 混合 版剝 之觀 201224075 有機 EL裝署 > 固& 农ι之圖案形成用糊組成物中之上述有機 、置之圖案印刷用溶劑或溶劑組成物之含量例如為1 至9重量%左右,較佳為3至75重量%左右。若有機 EL裝置之圖案印刖田w _ 卩刷用洛劑或溶劑組成物之含量低於上 述範:時:有有機EL裴置之圖案形成用糊組成物之黏 度變得過间且用於印刷用途變得困難之傾向。另一方 面,若有機肛裝置之圖案印刷用溶劑或溶劑組成物之含 超過上述範圍時’將有乾燥費時、作業效率降低之傾 向。 有機EL裝置之圖案形成用糊組成物中之黏著劑樹 脂=量例如4 (Μ 1 15重量%左右,較佳為i至1〇 重罝%左右。若黏著劑樹脂之含量低於上述範圍時,將 有觸變性及印刷物之形狀安定性不足之傾向;另一方 面,若黏著劑樹脂之含量超過上述範圍時,將有黏度變 得過高而當做印刷用使用變得困難之傾向。 有關本發明之有機EL裝置之圖案形成用糊組成物 亦可為發現導體機能、絕緣機能、半導體機能中之任一 種’除上述之外,也可以摻合其他添加物。其他添加物, 例如,可舉例:金屬氧化物、介電體材料等之金屬材料; 導電性高分子材料、離子導體材料、有機.無機混雜離子 導體材料、有機或無機顏料、分散劑、消泡劑、安定劑、 抗氧化劑、硬化加速劑、增感劑、填充劑、紫外線吸收 劑 ' 抗凝聚劑等。只要其他添加物之摻合量為不損害本 發明之效果的範圍内即可,例如有機EL裝置之整體圖案 形成用糊組成物之0.1至99重量%左右。 -12- 201224075 有關本發明之有機EL裝置之圖案形成用糊組成物 係例如藉由使Μ合搜拌機等之㈣裝置而摻合上述有 機EL #置之圖案印刷用溶劑或溶劑組成物、黏著劑樹 脂、及視需要之其他添加物後充分混攪、均勻分散而能 夠調製。 由於有關本發明之有機EL裝置之圖案形成用糊組 成物係藉由利用印刷法塗布於元件等之上而能夠形成圖 案’故能夠容易而有效且廉價地在大面積且可撓性的基 板表面上形成有機EL|置元彳牛。 〔圖案形成方法〕 有關本發明之圖案形成方法係構成有機EL裝置元 件之圖案形成方法,其特徵為具有藉由利用印刷法,將 上述有機EL裝置之圖案形成用糊組成物塗布於基板上 而形成圖案層之步驟(圖案印刷步驟);及使該圖案層 硬化或燒製之步驟(圖案硬化或燒製步驟)。 另外,在圖案印刷步驟中之印刷法,可舉例:由喷 墨法、網板印刷法、凸版印刷法、膠版印刷法、照相凹 版印刷法、微接觸印刷法、奈米印跡法所構成之群組中 所選出的至少一種方法。 利用上述印刷法所形成的圖案層係藉由進行乾燥, 其後進行加熱處理及/或光照射而能夠使其硬化。另外乾 燥後,亦可不使其硬化而進行燒製。乾燥方法,例如, 可舉例:在8 0至2 0 〇 c左右之溫度,例如加熱〇 1至3 小時左右之方法等。進行加熱處理之情形,其溫度係按 照供給反應之成分或觸媒之種類等而能夠適當調整,例 -13- 201224075 如為50至200°C左右。另外,加熱時間係例如〇 5至3 小時左右。進行光照射之情形,其光源能夠使用例如水 銀燈、氙燈、碳弧燈、金屬南化物燈、陽光、電子線、 雷射光等。光照射時間例如為〇 5至3〇分鐘左右。進行 燒製之情形’燒製溫度例如為2〇〇至丨5〇〇^左右。另外, 燒製時^間例如為0.1至5小時左右。 利用上述方法所獲得的圖案層厚度係按照用途而能 夠適當調整,例如為數nm至200 μηι左右。 形成圖案層之基板較佳為具有耐熱性及财溶劑性, 例如’可舉例.聚對苯二曱酸乙二g旨、聚萘二甲酸乙一 酯、聚酯、聚乙烯、聚丙烯、聚苯乙烯、聚醯胺、聚醯 亞胺、聚乙烯醇、聚乙烯縮丁醛、聚氣乙烯、聚偏二氯 乙烯、聚氟乙烯等之含氟樹脂;聚碳酸酯、丙烯酸樹脂、 甲基丙烯酸樹脂、環烯烴共聚物、導電性聚合物、耐給、 纖維素、玻璃、ιτο等❶基板厚度例如為〇丨至5() mm 左右。 一般而言,有機EL裝置係具有一層至多層所構成的 發光層被二個電極(陽極、陰極)所夹住之構造。 有機EL裝置係例如經由下列步驟所製造。若根據有 關本發明之圖案形成方法’能夠形成高精確度之有機EL 裝置元件。 1 :在玻璃等之基板上形成陽極。 2.在玻璃荨之基板上之形成陽極之部分以外的部分 形成隔壁。 3:在陽極上,藉印刷法而形成紅、綠、藍、或白色 之發光層後使其硬化。 -14- 201224075 4:在發光層及隔壁之上形成陰極。 由於有關本發明之圖案形成方法係刹田e 成饰利用印刷法,能 夠以非接觸之狀態而對基板形成圖案,故At执+ ' 狄把约在大面積 及/或可撓性基板也容易地進行圖案形成。因此,尤其 構成有機EL裝置元件之製造中’能夠高精確度地形成^ 細之元件圖案。另外,不經由作成遮罩等之複雜的步驟 而能夠直接地描繪,無須使用微細之加工技術。而且, 能夠在常溫常壓環境下製造。因此,能夠大幅簡化製程、 簡化設備、削減製造成本。 〔實施例〕 以下,藉實施例而更具體說明本發明,但本發明並 不受此等之實施例所限定。 實施例1 將丙二醇曱基正丁基醚(商品名「PMNB」、Daicel 化學工業股份有限公司製,以後有稱為「PMNB」之情形) 2〇 g、蒸餾水20 g倒入50 ml燒瓶中,攪拌約10分鐘後, 靜置10分鐘’進行有機相之水分測定,在25〇c環境下之 水分濃度為0.7 %。 將該PMNB各20.00 g分別置入4個50 ml燒瓶中, 分別追加 1.05 g ( 5%溶液)、1.28 g ( 6%溶液)、1.51 g (7%溶液)、1.74 g ( 8%溶液)之商品名「ETHOCEL」 (註冊商標)(乙基纖維素、DOW股份有限公司製)° 之後’在651攪拌後靜置,自然冷卻至251止之後,以 目視確認乙基纖維素之溶解性,依照下列基準進行評估。 -15- 201224075 評估基準 乙基纖維素完全溶解:〇 乙基纖維素一部分不溶、或完全不溶:X 比較例1 將丙二醇二曱基醚(商品名「HIS〇LVE MMPOM」、 東邦化學工業股份有限公司製’以後有稱為「MMPOM」 之情形)20 g、蒸餾水20 g倒入50 ml燒瓶中,攪拌約 1 〇分鐘後,靜置10分鐘,進行有機相之水分測定,在 25°C環境下之水分濃度為7.3%° 除了使用該MMPOM以取代PMNB以外’進行與實 施例1同樣方式而評估乙基纖維素之溶解性。 比較例2 將依照「第5版實驗科學講座14」(丸善股份有限 公司出版、p239-2 41)記載之方法所合成的丙二醇二丁 基醚(以後有稱為「PDB」之情形)20 g、蒸餾水20 g 倒入50 ml燒瓶中,攪拌約10分鐘後’靜置1 〇分鐘, 進行有機相之水分測定,在25 °C環境丁之水分濃度為 0.1%。 除了使用該PDB以取代PMNB以外’進行與實施例 1同樣方式而評估乙基纖維素之溶解性。 將上述結果彙整而顯示於下表中。 表1201224075 VI. Description of the invention: [Technical field to which the invention pertains] The invention relates to a solvent or a solvent composition which is difficult to absorb moisture and has excellent solubility in a resin, and is formed by a printing method; [Prior Art] The electronic component $ pattern formation of a conventional wiring board or a display device is often formed by a so-called photolithography method. The photolithography method is a method in which a paste composition is applied onto a substrate, subjected to fine (four) exposure, and (4), and the unnecessary portion is removed by a surname to form a pattern. However, in general, the problem is that the apparatus itself has a large amount of equipment investment due to the necessity of having an etching waste liquid processing apparatus, and the use efficiency of materials is also poor, resulting in poor productivity due to many manufacturing steps. In addition, it is difficult to form a pattern for a large-area substrate due to the limitation of the capacity of the device. Therefore, in recent years, the pattern forming method does not require a bulky device and the material is used efficiently, and it is also easy to correspond to a large-area substrate inkjet method, screen printing method, letterpress printing method, offset printing method, gravure printing method, The printing method such as the microcontact printing method and the nanoimprint method has been attracting attention. Most of the solvents used in the paste composition which can be used in the printing method are glycol ether solvents such as diethylene glycol dimethyl ether or diethylene glycol dibutyl ether; dipropylene glycol dimethyl ether and dipropylene glycol. Examples of a propylene glycol ether solvent such as diethyl ether, dipropylene glycol dipropyl ether or dipropylene glycol dibutyl ether. However, since the glycol ether solvent is ecotoxic, it is inconvenient to use (Non-Patent Document 1). -4- 201224075 On the other hand, the propylene glycol ether solvent is described in the patent document 丨. In the paste composition which forms a pattern of an element (hereinafter referred to as an "organic EL device") which constitutes an organic electroluminescence device (hereinafter referred to as "organic EL device") by a printing method, Use propylene glycol diethyl ether as a solvent. Further, Patent Document 2 describes the use of propylene glycol dibutyl ether. Further, Patent Document 3 describes the use of propylene glycol ethyl methyl ether, propylene glycol decyl propyl ether, and propylene glycol ethyl propyl hydrazine. CITATION LIST PATENT DOCUMENT PATENT DOCUMENT PATENT DOCUMENT PATENT DOCUMENT PATENT DOCUMENT PATENT DOCUMENT PATENT DOCUMENT PATENT DOCUMENT PATENT DOCUMENT PATENT DOCUMENT PATENT DOCUMENT PATENT DOCUMENT PATENT DOCUMENT PATENT DOCUMENT Patent Document Non-Patent Document 1 International Chemical Substance Conformity Evaluation Document No. 41 Diethylene Glycol Dimethyl Ether (2002) [Summary of the Invention] [Problems to be Solved by the Invention] The propylene glycol dialkyl ether is known. The system has superior volatility, but since propylene glycol dimethyl ether is particularly hydrophilic and easily absorbs moisture, if it is used as a solvent in a component paste composition forming an organic EL device, there will be components for the organic EL device. On the other hand, the propylene glycol dibutyl bond is highly lipophilic and low in hygroscopicity. However, since the solubility of the adhesive resin such as ethyl cellulose or acrylic resin contained in the paste composition is low, 201224075 is difficult to be Printing solvent is used. Further, it was found that the viewpoints of the balance between the solubility of the methyl group, the propylene glycol methyl propyl group, and the propylene glycol ethyl resin additive were insufficient. In view of the above, it is an object of the present invention to provide a solvent or solvent composition for pattern printing of an organic EL device (e.g., a display device, an illumination device, etc.) having a high solubility of a resin additive such as an adhesive resin and having low hygroscopicity. Another object of the present invention is to provide a pattern forming paste composition of an organic EL device comprising a solvent or a solvent composition for pattern printing of the organic EL device. The other object of the present invention is to provide a pattern forming paste composition using the organic billing device, and to form a pattern forming pattern to solve the problem. The inventors of the present invention have studied the above problems in order to solve the above problems. It was found that one of the propylene glycol dialkyl ethers has a terminal alkyl group which is a methyl group, and the other terminal side is a straight bond or a branched bond group. The c ^ 4 · 5 present compound has an excellent resin. When the solubility of the additive and the hygroscopicity are added to the composition for forming a pattern of the organic device by using the compound as a solvent, when the compound is used as a solvent, it can be used by a printing method. The adhesive resin solubility is formed by forming the element pattern; and the knife organic device element can be formed by moisture absorption. The present invention is based on the above-mentioned rfn ιΨ* 卜, that is, the present invention provides an organic E]L-packed-round tea Ep 丨 田 | field solvent or solvent ^ which is used to form EL by printing method · Solvent or solvent composition of the device; the opening sign is that the side of the two terminal alkyl groups containing the C - 6 - 201224075 diol is the methyl group, and the other side is the carbon number 4 or A compound having a linear or branched chain alkyl group having 5 carbon atoms. The printing method is preferably at least one selected from the group consisting of an inkjet method, a screen printing method, a letterpress printing method, an offset printing method, a gravure printing method, a microcontact printing method, and a nanoprinting method. . Further, the present invention further provides a paste composition for pattern formation of an organic EL device containing at least the solvent for pattern printing or the composition of an adhesive and an adhesive resin. The adhesive resin is preferably a cellulose resin and/or an acrylic resin. Furthermore, the present invention further provides a pattern forming method for forming an element of an organic EL device, which is characterized in that the pattern forming paste composition for an organic EL device is applied onto a substrate by a printing method. And the step of forming a patterned layer; and the step of hardening or firing the patterned layer. [Effects of the Invention] The solvent or solvent composition for pattern printing of the organic EL device of the present invention contains the thiol group on the side of the two terminal alkyl groups of the propylene glycol dialkyl ether, and the carbon number 4 or carbon on the other side. The compound of the linear or branched chain alkyl group of the number 5 has a solubility of a resin additive such as a superior adhesive resin, and the hygroscopicity is extremely low. Therefore, the pattern forming paste composition of the organic EL device containing the solvent or solvent composition for pattern printing of the organic EL device of the present invention can be effectively used by a printing method even for a large-area and/or flexible substrate. Uniform coating 'In the manufacture of organic EL device elements, it is possible to form a fine component round with high precision 201224075 j. Further, since it is difficult to absorb moisture, deterioration of the member of the organic EL device element due to moisture can be suppressed. [Embodiment] [Formation for the Invention of the Invention] [Solvent or solvent composition for pattern printing of an organic EL device] The solvent or solvent for pattern printing of the organic EL device of the present invention is used for borrowing a granule or a solvent composition when forming an element constituting an organic EL device by a printing method; characterized in that a propylene glycol dialkyl group has a methyl group on one side of the two terminal alkyl groups and a carbon number 4 on the other side or A compound having a linear or branched chain alkyl group having 5 carbon atoms. For example, the printing method can be exemplified by an inkjet method, a screen printing method, a letterpress printing method, an offset printing method, a gravure printing method, a microcontact printing method, a nanoimprint method, or the like. The straight-chain or branched-chain alkyl group having a carbon number of 4 or a carbon number of 5 in the terminal alkyl group of the propylene glycol dialkyl ether, for example, a linear alkyl group such as n-butyl group or n-pentyl group; Branched chain alkyl groups such as isobutyl, secondary butyl, tertiary butyl, isopentyl, secondary pentyl, tertiary pentyl, and the like. In the present invention, a linear alkyl group having a carbon number of 4 or a carbon number of 5, such as n-butyl group or n-pentyl group, is preferred from the viewpoint of easily supplying a raw material. In the present invention, one of the two terminal alkyl groups of the present invention is a compound having a methyl group and the other side is a linear or branched linear alkyl group having a carbon number of 4 or a carbon number of 5. For example, propylene glycol methyl n-butyl ether, propylene glycol decyl n-pentyl ether or the like can be exemplified. These may be used singly or in combination of two or more. -8 - 201224075 Further, it is preferable that the composition of the solvent for the pattern printing of the organic EL device of the present invention is such that the hydrophilicity and the lipophilicity are balanced, and the water content is preferably 3 Å/〇 or less. More preferably, the organic EL device element formed by the solvent or solvent composition for pattern printing using the EL device of the present invention is easily deteriorated when the water content is more than the above range. tendency. Further, the solvent or solvent composition for pattern printing of the organic EL device of the present invention is preferably a solubility of a superior resin additive such as ethyl cellulose. For example, it is preferred to dissolve 5% by weight or more of ethyl cellulose. . When the amount of the resin additive such as ethyl cellulose is less than the above range, the viscosity tends to be too low, and the thixotropy and the shape stability of the printed matter tend to be insufficient. In addition to the propylene glycol dialkyl ether, the solvent or solvent composition for pattern printing of the organic EL device of the present invention may be used in a range in which the balance between hydrophilicity and lipophilicity is not impaired, and other solvents may be mixed as needed. The blending ratio of other solvents can be appropriately selected. Others; the granules are sufficient to use the solvent generally used for printing purposes, for example, carboxylic acids such as caproic acid and caprylic acid; alcohols such as isopropyl alcohol, octanol, 1-nonanol and benzyl alcohol; Ethylene glycol monomethyl ether, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, ethylene glycol monomethyl ether Ethyl ester, ethylene glycol monoethyl acetate, ethylene glycol monopropyl ether acetate, ethylene glycol monobutyl ether acetate, ethylene glycol monophenyl phthalate acetate, etc. Alcohol monoalkyl ether acetate; diethylene glycol monodecyl ether, diethylene glycol monoethyl ether, diethylene glycol monopropyl ether, diethylene glycol monobutyl ether, etc. Monoalkyl ethers; two-9 - 201224075 ethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate diethylene glycol monoalkyl ether acetate; diethylene glycol II Diethylene glycol dialkyl ethers such as methyl ether and glycol diethyl ether; other ethers such as benzyl ethyl dihexyl ether and tetrahydrofuran; propylene glycol monomethyl ester, propylene glycol monoethyl ether Acid ester, propylene glycol monobutyl Propylene glycol monoalkyl ether acetates such as ether B; dipropylene glycol monoalkyl ether acetates such as dipropylene glycol decyl ether B; propylene glycol monoalkyl ethers such as propylene glycol propyl ether and alcohol butyl ether; propylene glycol a propylene glycol dialkyl ether other than the above, such as dimercapto ether diol diethyl ether, propylene glycol decyl ethyl ether, propylene glycol decyl propyl group, etc.; dipropylene glycol decyl ether propylene glycol propyl ether, dipropylene glycol butyl ether, etc. Dipropylene glycol monoalkane; tripropylene dialkyl ether such as tripropylene glycol decyl ether, tripropylene glycol butyl ether; dipropylene glycol decyl propyl ether, dipropylene glycol decyl butyl dipropylene glycol methyl pentyl mystery, two Dipropylene glycol dialkyl ether such as propylene glycol dimethyl ether or dipropylene diethyl ether; tripropylene glycol dipropylene glycol dialkyl ether; propylene glycol diacetate, 1,3-butyl diacetate Ester, 1,6-hexanediol diacetate, diacetate of 1,4-butanediol diacetic acid; cyclohexanol acetate, ethyl 3-acetoxybutylacetate ethyl acetate , triacetin, dihydrofurfuryl acetate, other acetates; acetone, mercaptoethyl ketone, Ketone 2-hydroxypropionate, ethyl 2-hydroxypropionate, benzyl acetate, B, isobutyl ketone ketone acetone, cyclohexanone, isophorone, 2-heptanone, 3-heptanone Mercapto lactate, ethyl benzoate, diethyl oxalate, diethyl phthalate, γ-butyrolactone, ethylene carbonate, propylene carbonate, ethyl 2-methylpropionate, 3 - vinegar such as methyl methoxypropionate or 3-meroxy group, glycol ester such as ether acetate ester, propyl ether, dibasic alcohol monoether, alcohol diether, etc., etc. , Class C; base B - urine 2 - by propionic acid -10- 201224075 B = 3 - ethoxy propionate oxime ester, ethyl 3-ethoxypropionate, ethyl acetonitrile 2-Hydroxy-3-methylbutyrate® methyl-3-methoxybutyl acetate, 4-methoxybutyl acetate, bromide = oxygen I-propionate, ethyl acetate Propyl acetate, amyl acetate, amyl acetate, butyl propionate, ethyl butyrate, butyric acid, tetrabutyl phthalate, ethyl acetonate, ethyl acetoacetate曱 ester, ethyl acetate, ethyl 2-carbonyl butyl butyrate, etc. a class of aromatic hydrocarbons; Ν 曱 曱 pyrrolidone, carbamide, hydrazine, hydrazine dimethyl dimethyl phthalamide, etc.; onion ^ leeks alcohol, propionic acid Dihydrogen onion esters 'limonene, decane, ^ * terpenes, mineral spirits, petroleum light oil s _ 1 〇〇, petroleum light oil s tetrahydronaphthalene, turpentine and other high boiling solvents. The paste for pattern formation of the organic EL device is characterized in that the paste for pattern formation of the organic E]L device of the present invention is characterized in that it contains at least the right imprinting agent or solvent composition of the organic EL device. Adhesive resin. The adhesive resin is not particularly limited; it is possible to use a conventional resin used for the formation of a device element, for example, methyl cellulose, ethyl cellulose, etc.... A cellulosic resin such as a cellulose-based resin, a vinyl tree such as polyvinyl alcohol, and the like. These can be used alone or in isolation. It is preferred to use a cellulose resin based on both the coating and the shape stability of the printed material. Oxy-'3-yl-3'-methyl ester, 乙乙; Ν, Ν-^ alcohol, lotus brain 15 〇, 丨 composition J solution: organic can be mixed with glycolic acid stripping view 201224075 organic EL The content of the above organic, patterned printing solvent or solvent composition in the paste composition of the solid & ι pattern is, for example, about 1 to 9% by weight, preferably 3 to 75% by weight. about. When the content of the pattern printing substrate or the solvent composition of the organic EL device is lower than the above: when the organic EL device is used, the viscosity of the pattern forming paste composition becomes excessive and is used for The tendency to use printing becomes difficult. On the other hand, if the content of the solvent or solvent composition for pattern printing of the organic anal device exceeds the above range, there will be a tendency to dry and reduce the work efficiency. The amount of the adhesive resin in the paste composition for pattern formation of the organic EL device is, for example, 4 (about 15% by weight, preferably about 1 to 1% by weight. If the content of the adhesive resin is less than the above range) On the other hand, when the content of the adhesive resin exceeds the above range, the viscosity tends to be too high, which tends to be difficult to use for printing. The paste composition for pattern formation of the organic EL device of the invention may be any one of the discovered conductor function, the insulating function, and the semiconductor function. In addition to the above, other additives may be blended. Other additives, for example, may be exemplified Metal materials such as metal oxides and dielectric materials; conductive polymer materials, ionic conductor materials, organic and inorganic hybrid ionic conductor materials, organic or inorganic pigments, dispersants, defoamers, stabilizers, antioxidants, Hardening accelerator, sensitizer, filler, ultraviolet absorber 'anti-agglomerating agent, etc. as long as the blending amount of other additives is not impairing the effect of the present invention For example, the paste composition of the organic EL device of the present invention is about 0.1 to 99% by weight. -12- 201224075 The paste composition for pattern formation of the organic EL device of the present invention is made, for example, by kneading The device (4), such as a mixer, can be prepared by blending the solvent or solvent composition for pattern printing, the adhesive resin, and other additives as needed, and then thoroughly mixing and uniformly dispersing. In the organic EL device of the invention, the paste composition for pattern formation can be formed by applying a pattern onto a device or the like by a printing method, so that an organic layer can be formed on a large-area and flexible substrate surface easily, efficiently, and inexpensively. The image forming method of the present invention is a pattern forming method of the organic EL device element, and is characterized in that the pattern forming paste of the organic EL device is formed by a printing method. a step of applying a composition on a substrate to form a pattern layer (pattern printing step); and a step of hardening or firing the pattern layer (pattern hardening or In addition, the printing method in the pattern printing step can be exemplified by an inkjet method, a screen printing method, a letterpress printing method, an offset printing method, a gravure printing method, a microcontact printing method, a nanoprinting method. At least one method selected from the group consisting of: The pattern layer formed by the above printing method is dried by being subjected to heat treatment and/or light irradiation, and may be cured after drying. The curing method is, for example, a temperature of about 80 to 200 ° C, for example, a method of heating the crucible for about 1 to 3 hours, etc. In the case of heat treatment, the temperature is as follows. The composition of the reaction or the type of the catalyst can be appropriately adjusted, and the example-13-201224075 is about 50 to 200 °C. Further, the heating time is, for example, about 5 to 3 hours. In the case of light irradiation, the light source can use, for example, a mercury lamp, a xenon lamp, a carbon arc lamp, a metal hydride lamp, sunlight, an electron beam, laser light, or the like. The light irradiation time is, for example, about 5 to 3 minutes. In the case of firing, the firing temperature is, for example, about 2 〇〇 to about 5 〇〇. Further, the firing time is, for example, about 0.1 to 5 hours. The thickness of the pattern layer obtained by the above method can be appropriately adjusted depending on the use, for example, from about several nm to about 200 μm. The substrate forming the pattern layer is preferably heat-resistant and rich in solvent, for example, 'polybutylene terephthalate, polyethylene naphthalate, polyester, polyethylene, polypropylene, polyphenylene. Fluorine resin such as ethylene, polyamide, polyimine, polyvinyl alcohol, polyvinyl butyral, polyethylene, polyvinylidene chloride, polyvinyl fluoride, etc.; polycarbonate, acrylic resin, methacrylic acid The thickness of the substrate of the resin, the cyclic olefin copolymer, the conductive polymer, the resistance, the cellulose, the glass, and the yttrium is, for example, about 〇丨 to 5 () mm. In general, an organic EL device has a structure in which a light-emitting layer composed of one layer to a plurality of layers is sandwiched by two electrodes (anode, cathode). The organic EL device is manufactured, for example, by the following steps. According to the pattern forming method of the present invention, a highly accurate organic EL device element can be formed. 1: An anode is formed on a substrate such as glass. 2. A partition wall is formed on a portion of the substrate of the glass crucible other than the portion where the anode is formed. 3: On the anode, a red, green, blue, or white light-emitting layer is formed by a printing method and then hardened. -14- 201224075 4: A cathode is formed on the light-emitting layer and the partition wall. Since the pattern forming method according to the present invention is based on the printing method, the substrate can be patterned in a non-contact state, so that it is easy to make a large area and/or a flexible substrate. Patterning is performed on the ground. Therefore, in particular, in the manufacture of the organic EL device element, a fine element pattern can be formed with high precision. Further, it is possible to draw directly without making complicated steps such as making a mask, and it is not necessary to use a fine processing technique. Moreover, it can be manufactured under normal temperature and normal pressure environment. Therefore, the process can be greatly simplified, the equipment can be simplified, and the manufacturing cost can be reduced. [Examples] Hereinafter, the present invention will be specifically described by way of Examples, but the present invention is not limited by the Examples. Example 1 propylene glycol decyl n-butyl ether (trade name "PMNB", manufactured by Daicel Chemical Industry Co., Ltd., and later referred to as "PMNB") 2 〇 g, 20 g of distilled water was poured into a 50 ml flask. After stirring for about 10 minutes, the mixture was allowed to stand for 10 minutes to measure the moisture of the organic phase, and the water concentration in the environment of 25 ° C was 0.7%. 20.00 g of each PMNB was placed in four 50 ml flasks, and 1.05 g (5% solution), 1.28 g (6% solution), 1.51 g (7% solution), and 1.74 g (8% solution) were added, respectively. Product name "ETHOCEL" (registered trademark) (ethyl cellulose, manufactured by Dow Co., Ltd.) ° After that, after stirring at 651, the mixture was allowed to stand, and after cooling to 251, the solubility of ethyl cellulose was visually confirmed. The following benchmarks are evaluated. -15- 201224075 Evaluation standard ethyl cellulose completely dissolved: 〇ethyl cellulose partially insoluble or completely insoluble: X Comparative Example 1 propylene glycol didecyl ether (trade name "HIS〇LVE MMPOM", Toho Chemical Industry Co., Ltd. The company's system is called "MMPOM". 20 g of distilled water and 20 g of distilled water are poured into a 50 ml flask. After stirring for about 1 minute, the mixture is allowed to stand for 10 minutes to measure the moisture of the organic phase at 25 ° C. The water concentration was 7.3%. The solubility of ethyl cellulose was evaluated in the same manner as in Example 1 except that the MMPOM was used instead of PMNB. Comparative Example 2 Propylene glycol dibutyl ether (hereinafter referred to as "PDB") synthesized in accordance with the method described in "The 5th Edition of Experimental Science Lecture 14" (published by Maruzen Co., Ltd., p239-2 41) 20 g 20 g of distilled water was poured into a 50 ml flask, stirred for about 10 minutes, and then allowed to stand for 1 minute, and the moisture of the organic phase was measured. The water concentration of the organic solution at 25 ° C was 0.1%. The solubility of ethyl cellulose was evaluated in the same manner as in Example 1 except that the PDB was used instead of PMNB. The above results are summarized and shown in the table below. Table 1
丙二醇 二烷基醚 含水率 (%) 乙基纖约 6% 隹素溶解性 7% 8% 實施例1 PMNB 0.7 〇 〇 〇 比較例1 MMPOM 7,3 〇 〇 〇 比較例2 PDB 0.1 ><~ X —X_ X 201224075 【圖式簡單說明】 無。 【主要裝置符號說明 無。Water content of propylene glycol dialkyl ether (%) Ethyl fiber about 6% Alkali solubility 7% 8% Example 1 PMNB 0.7 〇〇〇Comparative Example 1 MMPOM 7,3 〇〇〇Comparative Example 2 PDB 0.1 >< ;~ X —X_ X 201224075 [Simple description] None. [Main device symbol description None.
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WO2015087811A1 (en) * | 2013-12-09 | 2015-06-18 | 株式会社ダイセル | Solvent composition for electric device production |
JP6645132B2 (en) * | 2015-11-13 | 2020-02-12 | セイコーエプソン株式会社 | Ink composition |
JP6996260B2 (en) * | 2017-11-30 | 2022-01-17 | コニカミノルタ株式会社 | Organic functional thin film, organic functional laminated film, organic electroluminescence element, photoelectric conversion element and coating liquid for forming organic functional thin film |
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US5597517A (en) * | 1996-04-30 | 1997-01-28 | Jame Fine Chemicals, Inc. | Two-component chemiluminescent composition |
US5922109A (en) * | 1997-03-11 | 1999-07-13 | The Dow Chemical Company | Gas drying process using glycol solution solubility suppressants |
JP3861462B2 (en) * | 1998-05-28 | 2006-12-20 | 三菱化学株式会社 | Photopolymerizable composition for color filter |
TWI383271B (en) * | 2004-03-03 | 2013-01-21 | Daicel Chem | Detergent and rinsing solution for lithography |
JP4586402B2 (en) * | 2004-04-16 | 2010-11-24 | 凸版印刷株式会社 | TRANSFER BODY USED FOR MANUFACTURING ORGANIC ELECTROLUMINESCENT DEVICE AND METHOD FOR PRODUCING THE DEVICE |
WO2008123388A1 (en) * | 2007-03-26 | 2008-10-16 | Jsr Corporation | Curable resin composition, protective film, and method for forming protective film |
JP5187492B2 (en) * | 2007-11-22 | 2013-04-24 | Jsr株式会社 | Curable resin composition, protective film and method for forming protective film |
JP5051371B2 (en) * | 2007-11-26 | 2012-10-17 | Jsr株式会社 | Radiation-sensitive resin composition, spacer and protective film for liquid crystal display element, and liquid crystal display element |
JP5178407B2 (en) * | 2008-09-03 | 2013-04-10 | 株式会社Dnpファインケミカル | Resin composition for color filter protective film and color filter |
TWI521300B (en) * | 2008-11-18 | 2016-02-11 | Sumitomo Chemical Co | Photosensitive resin composition and display device |
JP2010192475A (en) * | 2009-02-13 | 2010-09-02 | Mitsubishi Chemicals Corp | Organic electric-field light-emitting device, organic el display apparatus, and organic el illumination |
JP4937411B2 (en) * | 2009-03-17 | 2012-05-23 | 積水化学工業株式会社 | Inorganic fine particle dispersed paste composition |
CN102193316B (en) * | 2010-03-15 | 2015-11-18 | 富士胶片株式会社 | The formation method of positive type photosensitive organic compound, cured film, cured film, organic EL display and liquid crystal indicator |
JP5486521B2 (en) * | 2010-03-15 | 2014-05-07 | 富士フイルム株式会社 | Positive photosensitive resin composition, method for forming cured film, cured film, organic EL display device, and liquid crystal display device |
JP2011233480A (en) * | 2010-04-30 | 2011-11-17 | Ricoh Co Ltd | Forming method of laminate structure and manufacturing method of organic electroluminescent device |
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