TW201221607A - Self-aligning adhesive using solvent and solventless organic resin system in electronic packaging - Google Patents

Self-aligning adhesive using solvent and solventless organic resin system in electronic packaging Download PDF

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Publication number
TW201221607A
TW201221607A TW100136319A TW100136319A TW201221607A TW 201221607 A TW201221607 A TW 201221607A TW 100136319 A TW100136319 A TW 100136319A TW 100136319 A TW100136319 A TW 100136319A TW 201221607 A TW201221607 A TW 201221607A
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Taiwan
Prior art keywords
hydrophilic
hydrophobic
adhesive
substrate
semiconductor
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Application number
TW100136319A
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Chinese (zh)
Inventor
Han Wu
Qiaohong Huang
Shashi Gupta
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Henkel Corp
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Publication of TW201221607A publication Critical patent/TW201221607A/en

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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

An adhesive that is either hydrophilic or hydrophobic can be used first to self-align a semiconductor die onto a bonding pad on a substrate, and after alignment, to bond the semiconductor die to the bonding pad on the substrate. The adhesive will be hydrophilic if the bonding pad is hydrophilic, and hydrophobic if the bonding pad is hydrophobic.

Description

201221607 六、發明說明： 【先前技術】 為滿足具有更多記憶尽更多種終端應用之更小及更快的 電子裝置之需求，該半導體工業已引進大規模積體電路 (LSI)。然而，隨著LSI容量增加，信號傳播延遲且功率消 耗增加。一種克服此等問題之方式為使用三維（3-D)LSI， 其中採用垂直互連使多重半導體晶粒（已知為良品）堆疊在 半導體晶圓基板上。 串聯拾放機器人裝配法曾經係移動半導體晶粒至識別基 、板之習知方法。然而以機器人裝配LSI所使用之極小組件 時’對於要有效益之物料通產量來説過於緩慢且昂貴。此 係由於很難以高準確度控制該等組件之配置，且由於該等 晶粒之薄度及易碎性。 s玄等基板上。例如， 圓為基板，該算雜: 使用重力、表面能、靜電力、電磁力、射流力或毛細管 力之自行裝配製造法已領先替代機器人拾放法。在自行裝 配方法中，使許多半導體晶粒以高對準準確度同時對準在 其中一種自行裝配方法中，其中石夕晶201221607 VI. Description of the Invention: [Prior Art] In order to meet the demand for smaller and faster electronic devices with more memory for more end applications, the semiconductor industry has introduced large-scale integrated circuits (LSIs). However, as LSI capacity increases, signal propagation delays and power consumption increases. One way to overcome these problems is to use a three-dimensional (3-D) LSI in which multiple semiconductor dies (known as good) are stacked on a semiconductor wafer substrate using vertical interconnects. The tandem pick-and-place robot assembly method used to be a conventional method of moving semiconductor dies to identification substrates and plates. However, when robots are used to assemble extremely small components used in LSIs, it is too slow and expensive for efficient material throughput. This is because it is difficult to control the configuration of the components with high accuracy and due to the thinness and fragility of the grains. s Xuan et al. For example, the circle is the substrate, and the calculation: self-assembly manufacturing method using gravity, surface energy, electrostatic force, electromagnetic force, jet force or capillary force has been the leading alternative to the robot pick-and-place method. In the self-assembly method, many semiconductor dies are simultaneously aligned with one another in a self-assembly method with high alignment accuracy, wherein Shi Xijing

親水性結合墊上。蒸養 、’、。&至s亥專晶圓基板。 蒸發該等水溶液 水溶液，並最終使該等矽晶粒 159l35.doc 201221607 然而，於半導體製造業中，通常不希望涉及水溶液，原 因在於總是不可能完全蒸發，且固化後，來自被困住水份 的蒸汽壓可導致孔隙及裝置失效。因此，需要一種不會出 現目前所經歷問題的自對準調配物。 【發明内容】 本發明係一種黏著劑，其可首先用於使半導體晶粒對準 至基板上之結合墊上，並在對準後，使該半導體晶粒結合 在該基板上之結合墊《該黏著劑可為親水性或疏水性，且 若該結合墊為親水性時，則該黏著劑為親水性，而若該結 合塾為疏水性時’則該黏著劑為疏水性。 在另貫施例中，本發明係一種使一個或更多個半導體 晶粒結合至基板之方法’其包括：⑷提供—基板，其上有 個或更多個被疏水.性區域圍繞之親水性結合墊圖案化於 該基板上；（b)提供一個或更多個具有親水性表面之半導體 晶粒；（C)使該一個或更多個結合墊與親水性黏著劑接觸； ⑷置放並對準該—個或更多個半導體晶粒至該等親水性結 合區域上’其中使該等晶粒之親水性表面©向該等親水性 結合墊；及（e)固化該親水性黏著劑。 在又一實施例中，該等結合墊、該等晶粒中之一個表面 及該黏著劑為疏水性，而圍繞該等疏水性結合塾之區域則 為親尺f生在此貫施例中，該結合—個或更多個半導體晶 粒至基板之方法包括：⑷提供一基板，其上有一個或更多 個被親水性區域圍繞之疏水性結合墊圖案化於該基板上； W提供-個或更多個具有疏水性表面之半導體晶粒；⑷ 159135.doc 201221607 使該一個或更多個結合墊與疏水性黏著劑接觸；（d)置放並 對準該一個或更多個半導體晶粒至該等疏水性結合區域 上，其中使該等晶粒之疏水性表面面向該等疏水性結合 墊；及（e)固化該疏水性黏著劑。 【實施方式】 該等黏著劑包括黏著樹脂及（視需要選用）用於調整該樹 脂黏度的溶劑。適用於該等黏著劑之樹脂可為單一或混合 樹脂系統，且包括環氧樹脂、丙烯酸酯樹脂、雙馬來醯亞 胺樹脂、苯并噁嗪樹脂、聚矽氧樹脂、氰酸酯樹脂、環氧 丙烷樹脂、乙烯醚樹脂 '酚醛樹脂及聚胺基曱酸酯樹脂。 該等樹脂可為純液體、固體或液體及固體之組合。若為固 體，則該等樹脂需要與溶劑摻合，以獲得適於點膠之黏 度。 可藉由在該黏著劑樹脂分子上併入親水性或疏水性側鏈 或末端基團’而修飾該等樹脂成為親水性或疏水性。適宜 親水性末端基團包括羥基基團、環氧基基團及酸酐基團。 適且疏水性末端基團為碳_碳不飽和基。當該等親水性及 疏水性之相對程度較高時’該自對準作用更精確。因此， 該等表面及物質之疏水性越強及親水性越強，則該自對準 越精確。疏水性及親水性官能度含量較高時，可各自達到 更高程度之親水性及疏水性。 可採用任何有效反應來添加該侧鏈或末端基團至該黏著 劑樹脂。在添加側鏈或末端疏水性或親水性基團之一種方 法中’該黏著樹脂將包含會與含該疏水性或親水性基團之 I59135.doc 201221607 化δ物上的g能基反應的官能基，而該黏著樹脂上的官能 基則不會與該疏水性或親水性基團反應。例如，含側鏈及/ 或末端羥基基團之樹脂可與含環氧官能基及乙烯基不飽和 的化合物反應。該等羥基與環氧官能基會反應（在陽離子 引發劑存在下），從而使該乙烯基不飽和併入至該黏著樹 脂上。或者，該樹脂可含側鏈或末端乙烯基不飽和，並與 具有乙烯基不飽和及環氧基之化合物反應。該等乙烯基會 反應（在自由基引發劑存在下），從而使該環氧基併入至該 黏著樹脂上。此等及其他反應方案係為彼等熟習此項技術 者所已知。 需要時，可添加有機溶劑至該黏著劑，以調節黏度。該 溶劑之類型及用量的選擇係依據用作黏著劑的樹脂及最終 所需黏度而變化。$宜的溶劑包括甲基乙基酮、丙酮 '異 丙醇及四氫t南。針對㈣樹脂決^溶劑類型及用量以獲 得用於點膠之有效黏度係、在熟習此項技術者之專門知識範 圍内，無需過度試驗。在—實施例_，有效黏度係在5〇〇 至1 〇，咖…之範圍内，且更特定言之在500至刪cPs之 範圍内’但此等範圍並不固定且可以配合該特定黏著劑及 點膠方法變化。 使該黏著賊载圖案㈣至該晶圓基板上，且針對本 發明之目I該預定圖案包括結合塾及周圍區域。該等周 圍區域可被該結合塾周界.所限制，或可包含該基板更大範 圍。該貫際圖案將由所採用半導體之構架及佈局決定。· 該周圍區域為疏水性時’該結合塾、黏著劑及晶粒表面將 I59135.doc 201221607 為親水性，且該周圍區域為親水性時，其等則為疏水性。 使該等半導體表面呈疏水性或親水性之方法係已知者且包 括（例如）使用該等疏水或親水的表面材料，或塗覆該等設 計成疏水性或親水性的聚合物薄塗層。若使用聚合物塗層 時，稍後將會藉由（諸如）電漿清潔法移除。 該黏著劑可藉由相關技術中已知之任何有效方法進行點 膠。在一實施例中，該點膠法係由模版或網版印刷完成。 若該黏著劑調配物中使用溶劑時，該溶劑可藉由加熱法蒸 發，直至該黏著劑呈半固體或高黏性（此稱爲B階段過 程）。在置放該等晶粒之前，必須移除該溶劑，以有效消 除該等由任何殘留溶劑引起的孔隙。B-階段後，再次加熱 該黏著劑，以降低該黏度，其後該等晶粒可接觸該等結合 墊上的黏著劑。當該等晶粒對準在該等結合墊上時，該等 晶粒即在該等結合墊上進行自對準（亦稱爲自行裝配）過 程。當完全並精確對準時，該裝配法即經過合適固化過 程，使該黏著劑固化。 實例 製備含下列組分之親水性黏著劑調配物。 組分 產品名稱及來源 重量份 環氧樹脂 CYRACURE uvr-6105 (Daicel) 60.10 與1，6-己二醇形成之ε-己内 酯聚酯 CAPA 2047A (Perstorp) 34.20 1,4-丁二醇 (溶劑） 2.50 矽烷(黏著促進劑） silquest A187 J (Aldrich) 1.00 觸媒 cxc-1612 (King Industries) 2.00 偶氮染料 Neptune Black x60 (Seegott Inc.) 0.20 將上述組分與足量溶劑摻合以達到900 cp之黏度。採用 159135.doc 201221607 厚度0.73 mm (28 mil)並具有SiN鈍化塗層的矽晶粒22 mmx 22 mm(866 milx866 mil)作為基板及自對準晶粒。製備五 種樣品，各具有點膠於該基板晶粒上之不同含量黏著劑調 配物。實例1係點膠0.0135 gm ;實例2點膠0.028 1 gm ;實 例3點膠0.043 8 gm ;實例4點勝0.061 8 gm ;且實例5點膠 0.0804 gm。在電熱板上加熱該基板晶粒及黏著劑調配物 裝配至8(TC，以蒸發該溶劑。當該黏著劑仍然為液體時， 將一晶粒置於每一基板之黏著劑上，並使其自對準。實例 1及2並未自對準，因爲該黏著劑之量太低，實例3、4及5 自對準。實例3出現令人滿意之填角，實例4及5在填角時 出現溢流。在125°C ’ 3〇分鐘完成最終固化。固化後，所 有該等樣品之晶粒之間的最終間隙為381微米。此檢測顯 不’可製備該等黏著調配物以用作自行裝配材料及 針對特定應用進行過度試驗即可決定該黏著劑 之合適用量。 &別 胺Ϊ =檢測基板包括玻璃载片、#刻玻璃栽片及聚•亞 ::Γ.所有該等基板均可藉由該自行裝配黏著劑進： 159135.docHydrophilic bonding pad. Steaming, ',. & to shai wafer substrate. Evaporating the aqueous solution of the aqueous solution and finally bringing the ruthenium crystal grains to 159l35.doc 201221607 However, in the semiconductor manufacturing industry, it is generally not desirable to involve an aqueous solution because it is always impossible to completely evaporate and, after solidification, from trapped water The vapor pressure of the part can cause voids and device failure. Therefore, there is a need for a self-aligning formulation that does not present the problems experienced so far. SUMMARY OF THE INVENTION The present invention is an adhesive that can be used first to align a semiconductor die to a bond pad on a substrate, and after aligning, bond the semiconductor die to the bond pad on the substrate. The adhesive may be hydrophilic or hydrophobic, and if the bond pad is hydrophilic, the adhesive is hydrophilic, and if the bond is hydrophobic, the adhesive is hydrophobic. In a further embodiment, the invention is a method of bonding one or more semiconductor grains to a substrate, which comprises: (4) providing a substrate having one or more hydrophilic regions surrounded by hydrophobic regions. a bonding pad patterned on the substrate; (b) providing one or more semiconductor grains having a hydrophilic surface; (C) contacting the one or more bonding pads with a hydrophilic adhesive; (4) placing And aligning the one or more semiconductor grains to the hydrophilic bonding regions, wherein the hydrophilic surfaces of the grains are directed toward the hydrophilic bonding pads; and (e) curing the hydrophilic bonding Agent. In still another embodiment, the bonding pads, one of the surfaces of the crystal grains and the adhesive are hydrophobic, and the region surrounding the hydrophobic bonding enthalpy is in the form of a parent. The method of combining one or more semiconductor dies to a substrate comprises: (4) providing a substrate having one or more hydrophobic bonding pads surrounded by a hydrophilic region patterned on the substrate; One or more semiconductor grains having a hydrophobic surface; (4) 159135.doc 201221607 contacting the one or more bonding pads with a hydrophobic adhesive; (d) placing and aligning the one or more The semiconductor grains are on the hydrophobic bonding regions, wherein the hydrophobic surfaces of the grains face the hydrophobic bonding pads; and (e) the hydrophobic adhesive is cured. [Embodiment] These adhesives include an adhesive resin and, if necessary, a solvent for adjusting the viscosity of the resin. The resins suitable for the adhesives may be single or mixed resin systems, and include epoxy resins, acrylate resins, bismaleimide resins, benzoxazine resins, polyoxyxylene resins, cyanate resins, Propylene oxide resin, vinyl ether resin 'phenolic resin, and polyamino phthalate resin. The resins can be pure liquids, solids or a combination of liquids and solids. In the case of a solid, the resins need to be blended with a solvent to obtain a viscosity suitable for dispensing. The resins may be modified to be hydrophilic or hydrophobic by incorporating hydrophilic or hydrophobic side chains or terminal groups on the adhesive resin molecules. Suitable hydrophilic terminal groups include hydroxyl groups, epoxy groups, and anhydride groups. Suitable and hydrophobic end groups are carbon-carbon unsaturated groups. This self-alignment is more precise when the relative degrees of hydrophilicity and hydrophobicity are relatively high. Therefore, the stronger the hydrophobicity and hydrophilicity of the surfaces and materials, the more accurate the self-alignment. When the hydrophobic and hydrophilic functionalities are high, each can achieve a higher degree of hydrophilicity and hydrophobicity. Any of the effective reactions can be used to add the side chain or terminal group to the adhesive resin. In a method of adding a side chain or a terminal hydrophobic or hydrophilic group, the adhesive resin will comprise a functional group that will react with the g energy group on the I59135.doc 201221607 δ containing the hydrophobic or hydrophilic group. The group, while the functional group on the adhesive resin does not react with the hydrophobic or hydrophilic group. For example, a resin containing a side chain and/or a terminal hydroxyl group can be reacted with a compound having an epoxy functional group and a vinyl group. The hydroxyl groups react with the epoxy functional group (in the presence of a cationic initiator) to incorporate the vinyl unsaturation onto the adhesive resin. Alternatively, the resin may contain a side chain or terminal ethylenic unsaturation and react with a compound having a vinyl group and an epoxy group. The vinyl groups react (in the presence of a free radical initiator) to incorporate the epoxy group onto the adhesive resin. These and other reaction schemes are known to those skilled in the art. If necessary, an organic solvent may be added to the adhesive to adjust the viscosity. The type and amount of the solvent to be selected will vary depending on the resin used as the adhesive and the desired viscosity. Suitable solvents include methyl ethyl ketone, acetone 'isopropanol and tetrahydro t-nan. For (4) Resin type and amount of solvent to obtain the effective viscosity system for dispensing, no undue experimentation is required within the expertise of those skilled in the art. In the embodiment _, the effective viscosity is in the range of 5 〇〇 to 1 〇, 咖 ..., and more specifically in the range of 500 to c c s ' but these ranges are not fixed and can be matched with the specific adhesion Agent and dispensing methods vary. The adhesive thief carries the pattern (4) onto the wafer substrate, and for the purpose of the present invention, the predetermined pattern includes a bonded ridge and a surrounding region. The surrounding areas may be limited by the combined mean perimeter, or may comprise a larger range of the substrate. The pattern will be determined by the architecture and layout of the semiconductor used. · When the surrounding area is hydrophobic, the bonding enthalpy, the adhesive, and the surface of the crystal grain are hydrophilic, and when the surrounding area is hydrophilic, the surface is hydrophobic. Methods for rendering such semiconductor surfaces hydrophobic or hydrophilic are known and include, for example, the use of such hydrophobic or hydrophilic surface materials, or coating of such thin coatings of polymers designed to be hydrophobic or hydrophilic. . If a polymer coating is used, it will later be removed by, for example, plasma cleaning. The adhesive can be dispensed by any effective method known in the art. In one embodiment, the dispensing process is accomplished by stencil or screen printing. If a solvent is used in the adhesive formulation, the solvent can be evaporated by heating until the adhesive is semi-solid or highly viscous (this is referred to as the B-stage process). The solvent must be removed prior to placement of the grains to effectively eliminate the voids caused by any residual solvent. After the B-stage, the adhesive is again heated to reduce the viscosity, after which the grains can contact the adhesive on the bond pads. When the dies are aligned on the bond pads, the dies are self-aligned (also referred to as self-assembly) processes on the bond pads. When fully and precisely aligned, the assembly process is followed by a suitable curing process to cure the adhesive. EXAMPLES A hydrophilic adhesive formulation containing the following components was prepared. Component product name and source weight epoxy resin CYRACURE uvr-6105 (Daicel) 60.10 ε-caprolactone polyester CAPA 2047A (Perstorp) formed with 1,6-hexanediol 34.20 1,4-butanediol ( Solvent) 2.50 decane (adhesion promoter) silquest A187 J (Aldrich) 1.00 Catalyst cxc-1612 (King Industries) 2.00 Azo dye Black N60 (Seegott Inc.) 0.20 Mix the above components with a sufficient amount of solvent to achieve 900 cp viscosity. A ruthenium grain of 22 mm x 22 mm (866 milx 866 mil) with a thickness of 0.73 mm (28 mil) and a SiN passivation coating was used as the substrate and self-aligned grains. Five samples were prepared, each having a different amount of adhesive formulation dispensed onto the substrate grains. Example 1 was dispensing 0.0135 gm; Example 2 dispensing 0.028 1 gm; Example 3 dispensing 0.043 8 gm; Example 4 points winning 0.061 8 gm; and Example 5 dispensing 0.0804 gm. Heating the substrate die on the hot plate and assembling the adhesive to 8 (TC) to evaporate the solvent. When the adhesive is still liquid, a die is placed on the adhesive of each substrate and Self-aligned. Examples 1 and 2 were not self-aligned because the amount of adhesive was too low, Examples 3, 4, and 5 were self-aligned. Example 3 showed a satisfactory fillet, and Examples 4 and 5 were filled. An overflow occurred at the corners. The final cure was completed at 125 ° C '3 〇 minutes. After curing, the final gap between the grains of all of the samples was 381 μm. This test does not allow the preparation of these adhesive formulations. Use as a self-assembling material and over-test for specific applications to determine the appropriate amount of the adhesive. & amiamine oxime = detection substrate including glass slides, #刻玻璃片片,聚•亚::Γ. The substrate can be assembled by the self-assembling adhesive: 159135.doc

Claims (1)

201221607 七、申請專利範圍： 1· 一種結合一個或更多個半導體晶粒至基板上之方法，其 包括.（a)提供一基板，其上有一個或更多個被疏水性區 域圍繞之親水性結合墊圖案化於該基板上；（b)提供一或 更多個具有親水性表面之半導體晶粒；（c)使該一或更多 個結合墊與親水性黏著劑接觸；（句置放並對準該一或更 多個半導體晶粒至該等親水性結合區域上，其中使該等 晶粒之親水性表面面向該等親水性結合墊；及（e)固化該 親水性黏著劑。 2_ —種結合一個或更多個半導體晶粒至基板上之方法，其 包括：⑷提供一基板’其上有-個或更多個被親水性區 域圍繞之疏水性結合墊圖案化於該基板上；（b)提供-或 更多個具有疏7jC性表面之半導體晶粒；⑷使該一或更多 個結合墊與疏水性黏著劑接觸；⑷置放並料該一或更 夕個半導體aa粒至該等疏水性結合區域上，其中使該等 晶粒之疏水性表面面向該等疏水性結合塾；及⑷固化該 疏水性黏著劑。 3 . 一種用於使半導體S私批、、仕 “ 體9粒對準至基板上之結合墊之黏著 劑，其包括親水性或疏水性基團。 159135.doc 201221607 四、指定代表圖·· (一) 本案指定代表圖為：（無） (二) 本代表圖之元件符號簡單說明： 五、本案若有化學式時，請揭示最能顯示發明特徵的化學式·· (無） 159135.doc201221607 VII. Patent Application Range: 1. A method of combining one or more semiconductor grains onto a substrate, comprising: (a) providing a substrate having one or more hydrophilic regions surrounded by a hydrophobic region a bonding pad patterned on the substrate; (b) providing one or more semiconductor grains having a hydrophilic surface; (c) contacting the one or more bonding pads with a hydrophilic adhesive; And aligning the one or more semiconductor grains onto the hydrophilic bonding regions, wherein the hydrophilic surfaces of the grains face the hydrophilic bonding pads; and (e) curing the hydrophilic adhesive A method of bonding one or more semiconductor grains to a substrate, comprising: (4) providing a substrate on which one or more hydrophobic bond pads surrounded by a hydrophilic region are patterned (b) providing - or more semiconductor crystal grains having a 7jC surface; (4) contacting the one or more bonding pads with a hydrophobic adhesive; (4) placing the one or more Semiconductor aa particles to the hydrophobic junctions a region in which the hydrophobic surface of the crystal grains faces the hydrophobic binder; and (4) cures the hydrophobic adhesive. 3. A method for aligning the semiconductor S in a private batch, An adhesive for a bonding pad on a substrate, which comprises a hydrophilic or hydrophobic group. 159135.doc 201221607 IV. Designated representative figure (1) The representative representative of the case is: (none) (2) The component of the representative figure Brief description of the symbol: 5. If there is a chemical formula in this case, please reveal the chemical formula that best shows the characteristics of the invention. (None) 159135.doc
TW100136319A 2010-10-11 2011-10-06 Self-aligning adhesive using solvent and solventless organic resin system in electronic packaging TW201221607A (en)

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CN105448645A (en) * 2014-07-07 2016-03-30 中芯国际集成电路制造(上海)有限公司 Bonding pad processing method

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KR20170023816A (en) 2014-06-26 2017-03-06 에베 그룹 에. 탈너 게엠베하 Method for bonding substrates while distributing a connecting material by bringing the substrate together

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US7645635B2 (en) * 2004-08-16 2010-01-12 Micron Technology, Inc. Frame structure and semiconductor attach process for use therewith for fabrication of image sensor packages and the like, and resulting packages
US7851930B1 (en) * 2008-06-04 2010-12-14 Henkel Corporation Conductive adhesive compositions containing an alloy filler material for better dispense and thermal properties
KR101036441B1 (en) * 2010-12-21 2011-05-25 한국기계연구원 Semiconductor chip stack package and manufacturing method thereof

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105448645A (en) * 2014-07-07 2016-03-30 中芯国际集成电路制造(上海)有限公司 Bonding pad processing method

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