JP2011198953A - Method of manufacturing electronic component laminate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To ensure high precision and high reliability even when a semiconductor package is made compact by adjusting the amount of an adhesive for electronic component which protrudes from a junction region of a semiconductor chip or wafer.SOLUTION: A method of manufacturing an electronic component laminate having the semiconductor chip or wafer bonded to a substrate, the other semiconductor chip, or the other wafer through the adhesive for electronic component includes a coating process (1) of applying the adhesive for electronic component to the substrate, the other semiconductor chip, or the other wafer, a bonding process (2) of laminating the semiconductor chip or wafer on the substrate, the other semiconductor chip, or the other wafer through the applied adhesive for electronic component while heating and pressing them so that a region that the adhesive for electronic component spreads to wet is 60 to 100% of the junction region of the semiconductor wafer or wafer, and releasing them from being pressed thereafter; a process (3) of allowing the adhesive for electronic component to uniformly spread to wet the whole junction region of the semiconductor chip or wafer by heating the adhesive for electronic component; and a curing process (4) of curing the adhesive for electronic component. The region to which the adhesive for electronic component is applied in the coating process (1) is 40 to 90% of the junction region of the semiconductor chip or wafer, and the adhesive for electronic component has a viscosity of 20 to 100 Pa s at 0.5 rpm when the viscosity is measured at 25°C using an E type viscometer, and also has a viscosity of 4 to 25 Pa s at 0.5 rpm when the viscosity is measured at a bonding temperature using the E type viscometer, the viscosity at 0.5 rpm being 2 to 4 times as large as the viscosity at 5 rpm.

Description

The present invention adjusts the amount of the adhesive for electronic components that protrudes from the bonding region of the semiconductor chip or wafer, and manufactures an electronic component laminate that can provide a highly accurate and reliable electronic component laminate even if it is downsized. Regarding the method.

In recent years, with the demand for miniaturization of semiconductor packages, semiconductor chips or wafers have become very thin films, and bonding wires connected to the semiconductor chips have become finer. In addition, since an extremely thin semiconductor chip or wafer can be manufactured, a movement toward three-dimensional mounting is also progressing, in which a plurality of semiconductor chips are stacked to form a multilayer semiconductor chip stack.

However, in a multilayer semiconductor chip stacked body, simply stacking semiconductor chips of the same size causes the bonding wires connected to the lower semiconductor chip to come into contact with the upper semiconductor chip, and wire bonding cannot be performed. Sometimes. Therefore, conventionally, a method of stacking semiconductor chips of different sizes or a method of forming a gap between the semiconductor chips has been performed. However, the semiconductor chips are stacked without damage and kept horizontal. Was not easy.

On the other hand, for the purpose of obtaining a highly reliable semiconductor chip laminated body, a method for protecting the wires of the lower layer semiconductor chip, or a spacer chip between the semiconductor chips for the purpose of laminating while maintaining the level. A method of intervening has been studied. For example, in Patent Document 1, when a plurality of semiconductor chips are stacked, a spacer is formed in a dotted pattern on the surface of one semiconductor chip on which the other semiconductor chip is stacked, and then the other semiconductor chip is stacked. A method is disclosed. Patent Document 2 discloses a method of laminating a dummy chip and a spacer between semiconductor chips to be connected when laminating a plurality of semiconductor chips.

However, in recent years, the miniaturization of semiconductor packages has progressed, and the distance from the semiconductor chip to the wire bonding pad has been shortened to about several hundred μm. There is a new problem that cannot be done.

That is, as the distance from the semiconductor chip to the wire bonding pad becomes shorter, it has become difficult to perform wire bonding due to the protruding portion of the adhesive bonding the semiconductor chip, that is, a so-called fillet. In a miniaturized semiconductor package, the distance from the bonding region where the adhesive protrudes is required to be about 200 μm or less. On the other hand, when the amount of adhesive used is reduced in order to prevent the adhesive from protruding, the adhesive does not spread over the entire bonding area of the semiconductor chip, and a cavity is created after mold sealing. It is difficult to obtain a chip stack.
In order to solve these problems, it is conceivable to use an adhesive film in place of the paste-like adhesive, but the adhesive film requires a step of forming into a film at the time of manufacture, compared to the adhesive. The problem is high cost.

JP 2003-179200 A JP 2006-66816 A

The present invention adjusts the amount of the adhesive for electronic components that protrudes from the bonding region of the semiconductor chip or wafer, and manufactures an electronic component laminate that can provide a highly accurate and reliable electronic component laminate even if it is downsized. It aims to provide a method.

The present invention relates to a method of manufacturing an electronic component laminate in which a semiconductor chip or wafer is bonded to a substrate, another semiconductor chip or another wafer via an adhesive for electronic components, the substrate, the other semiconductor chip or On the substrate, another semiconductor chip, or another wafer through the application step (1) for applying the adhesive for electronic components to another wafer and the applied adhesive for electronic components while heating and pressing. A bonding step (2) of laminating semiconductor chips or wafers, and setting the area where the adhesive for electronic components is spread out to 60% or more and less than 100% of the bonding area of the semiconductor chips or wafers, and then releasing the pressure; And heating the electronic component adhesive to uniformly wet and spread the electronic component adhesive over the entire bonding region of the semiconductor chip or wafer, and the electronic component A curing step (4) for curing the adhesive, and in the coating step (1), the area for applying the electronic component adhesive is 40 to 90% of the bonding area of the semiconductor chip or wafer. When the viscosity of the adhesive for electronic parts is measured at 25 ° C. using an E type viscometer, the viscosity at 0.5 rpm is 20 to 100 Pa · s, and the bonding temperature is set using the E type viscometer. Thus, when the viscosity is measured, the viscosity is 4 to 25 Pa · s at 0.5 rpm, and the viscosity at 0.5 rpm is 2 to 4 times the viscosity at 5 rpm.
The present invention is described in detail below.

In the method for manufacturing an electronic component laminate in which a semiconductor chip or wafer is bonded to a substrate, another semiconductor chip or another wafer via an adhesive for electronic components, By using a component adhesive and performing a predetermined coating step (1), a bonding step (2), a step (3) for spreading the adhesive for electronic components, and a curing step (4), a semiconductor chip or By adjusting the amount of the adhesive for electronic components that protrudes from the bonding area of the wafer and reducing the size, it has been found that a highly accurate and reliable electronic component laminate can be obtained, and the present invention has been completed.

The method for producing an electronic component laminate of the present invention is a method for producing an electronic component laminate in which a semiconductor chip or wafer is bonded to a substrate, another semiconductor chip or another wafer via an adhesive for electronic components.
In the electronic component laminate manufacturing method of the present invention, for example, a semiconductor chip may be bonded to a substrate. For example, a semiconductor chip may be bonded to another semiconductor chip such as a semiconductor chip bonded to the substrate. The semiconductor chip may be bonded to the wafer, or the wafer may be bonded to the substrate. For example, the wafer may be further bonded to another wafer such as a wafer bonded to the substrate. May be joined.

In the method for manufacturing an electronic component laminate of the present invention, first, an application step (1) of applying an adhesive for electronic components to a substrate, another semiconductor chip, or another wafer is performed.

In the coating step (1), the area to which the electronic component adhesive is applied is 40 to 90% of the bonding area (also simply referred to as a bonding area in the present specification) of the semiconductor chip or wafer.
In addition, in this specification, the area | region which apply | coats the said adhesive agent for electronic components draws the outermost part of the apply | coated adhesive for electronic components with a straight line, and is the inside of one or more polygons formed with the straight line. It means the area and the sum of the areas.
When the area for applying the adhesive for electronic components is less than 40% of the bonding area, the electronic component adhesive is bonded to the entire bonding area after the step (3) of wetting and spreading the adhesive for electronic components described later. Therefore, the obtained electronic component laminate is not reliable. When the area to which the adhesive for electronic parts is applied exceeds 90% of the joining area, the amount of the adhesive for electronic parts that protrudes from the joining area when the step (3) of wetting and spreading the adhesive for electronic parts described later is performed. Therefore, it becomes difficult to wire-bond the resulting electronic component laminate. The area where the adhesive for electronic parts is applied is preferably 60% or more and 90% or less of the bonding area.

In the application step (1), the application shape of the adhesive for electronic components is not particularly limited, and examples thereof include a cross shape, a double cross shape, a triple cross shape, a snow cross shape, and a double Y shape. In this specification, the cross shape means a cross shape, the double cross shape means a shape in which two cross shapes overlap, and the triple cross shape means three cross shapes. It means a shape with overlapping shapes. In this specification, the snow cross shape means a shape in which one end of a double cross shape is Y-shaped, and the double Y shape means a shape in which two Y-shaped end portions are joined. Means.

When the adhesive for electronic parts is applied in a cross shape or a double cross shape, the length of the diagonal line of the cross shape or the double cross shape is 70 to 90% of the length of the diagonal line of the joining region. preferable. When the length of the cross-shaped or double-cross-shaped diagonal is less than 70% of the length of the diagonal of the joining region, the electronic component is subjected to the step (3) of wetting and spreading the adhesive for electronic components described later. Since the component adhesive is not uniformly wetted and spreads over the entire bonding region, and a cavity is formed after mold sealing, the obtained electronic component laminate may lack reliability. If the length of the diagonal line of the cross shape or the double cross shape exceeds 90% of the length of the diagonal line of the joining region, the step (3) of wetting and spreading the adhesive for electronic components described later, The amount of the adhesive for protruding electronic components increases, and it may be difficult to wire bond the resulting electronic component laminate.

The application method in the application step (1) is not particularly limited, and examples thereof include a method of applying using a combination of a syringe equipped with a precision nozzle and a dispenser.

It is preferable that the said adhesive for electronic components contains the adhesive composition containing a sclerosing | hardenable compound and a hardening | curing agent.
The curable compound is not particularly limited, and a compound that is cured by addition polymerization, polycondensation, polyaddition, addition condensation, or ring-opening polymerization reaction can be used. Specific examples of the curable compound include urea resin, melamine resin, phenol resin, resorcinol resin, epoxy resin, acrylic resin, polyester resin, polyamide resin, polybenzimidazole resin, diallyl phthalate resin, xylene resin, alkyl -Thermosetting compounds such as benzene resin, epoxy acrylate resin, silicon resin, urethane resin and the like. Especially, since the reliability and joining strength of the electronic component laminated body obtained are excellent, an epoxy resin and an acrylic resin are preferable, and an epoxy resin having an imide skeleton is more preferable.

The epoxy resin is not particularly limited. For example, bisphenol type epoxy resins such as bisphenol A type, bisphenol F type, bisphenol AD type and bisphenol S type, novolac type epoxy resins such as phenol novolak type and cresol novolak type, resorcinol type epoxy Resin, aromatic epoxy resin such as trisphenolmethane triglycidyl ether, naphthalene type epoxy resin, fluorene type epoxy resin, dicyclopentadiene type epoxy resin, polyether modified epoxy resin, NBR modified epoxy resin, CTBN modified epoxy resin, and These hydrogenated products can be mentioned. Of these, bisphenol F type epoxy resin, resorcinol type epoxy resin, and polyether-modified epoxy resin are preferable because an adhesive for electronic parts having a low viscosity can be obtained.

Among the bisphenol F-type epoxy resins, examples of commercially available products include EXA-830-LVP, EXA-830-CRP (manufactured by DIC). Moreover, EX-201 (made by Nagase ChemteX Corporation) etc. are mentioned as a commercial item among the said resorcinol type epoxy resins. Moreover, EX-931 (made by Nagase ChemteX), EXA-4850-150 (made by DIC), EP-4005 (made by ADEKA) etc. are mentioned as a commercial item among the said polyether modified epoxy resins. .

The above-mentioned curable compound has a preferable upper limit of moisture absorption of 1.5% and a more preferable upper limit of 1.1%. Examples of the curable compound having such a moisture absorption rate include naphthalene type epoxy resins, fluorene type epoxy resins, dicyclopentadiene type epoxy resins, phenol novolac type epoxy resins, cresol novolac type epoxy resins and the like.

The said hardening | curing agent is not specifically limited, A conventionally well-known hardening | curing agent can be suitably selected according to the said sclerosing | hardenable compound. When using an epoxy resin as the curable compound, examples of the curing agent include latent heat-curing acid anhydride-based curing agents such as trialkyltetrahydrophthalic anhydride, phenol-based curing agents, amine-based curing agents, and dicyandiamide. For example, a cationic curing agent and a cationic catalyst-type curing agent. These curing agents may be used alone or in combination of two or more.

Although the compounding quantity of the said hardening | curing agent is not specifically limited, When using the hardening | curing agent which reacts equally with the functional group of the said sclerosing | hardenable compound, it is 60-100 equivalent with respect to the functional group amount of the said sclerosing | hardenable compound. preferable. Moreover, when using the hardening | curing agent which functions as a catalyst, as for the compounding quantity of the said hardening | curing agent, a preferable minimum is 1 weight part with respect to 100 weight part of said curable compounds, and a preferable upper limit is 20 weight part.

In the adhesive composition, a curing accelerator may be added in addition to the curing agent in order to adjust the curing speed or the physical properties of the cured product.

The said hardening accelerator is not specifically limited, For example, an imidazole series hardening accelerator, a tertiary amine type hardening accelerator, etc. are mentioned. Among these, an imidazole-based curing accelerator is preferable because it is easy to control the reaction system for adjusting the curing speed or the physical properties of the cured product. These hardening accelerators may be used independently and may use 2 or more types together.

The imidazole curing accelerator is not particularly limited. For example, 1-cyanoethyl-2-phenylimidazole in which the 1-position of imidazole is protected with a cyanoethyl group, or an imidazole curing accelerator in which basicity is protected with isocyanuric acid (product) Name "2MA-OK", manufactured by Shikoku Kasei Kogyo Co., Ltd.). These imidazole type hardening accelerators may be used independently and may use 2 or more types together.

Examples of the curing accelerator include 2MZ, 2MZ-P, 2PZ, 2PZ-PW, 2P4MZ, C11Z-CNS, 2PZ-CNS, 2PZCNS-PW, 2MZ-A, 2MZA-PW, C11Z-A, 2E4MZ- A, 2MAOK-PW, 2PZ-OK, 2MZ-OK, 2PHZ, 2PHZ-PW, 2P4MHZ, 2P4MHZ-PW, 2E4MZ · BIS, VT, VT-OK, MAVT, MAVT-OK (above, manufactured by Shikoku Kasei Kogyo Co., Ltd.) And so on.

The compounding quantity of the said hardening accelerator is not specifically limited, A preferable minimum is 1 weight part with respect to 100 weight part of said curable compounds, and a preferable upper limit is 10 weight part.

When an epoxy resin is used as the curable compound and the curing agent and the curing accelerator are used in combination, the blending amount of the curing agent used is equivalent to the theoretically required equivalent to the epoxy group in the epoxy resin to be used. The following is preferable. When the blending amount of the curing agent exceeds the theoretically required equivalent, chlorine ions may be easily eluted by moisture from a cured product obtained by curing the adhesive for electronic components. That is, if the curing agent is excessive, for example, when the eluted component is extracted with hot water from the cured product of the obtained adhesive for electronic components, the pH of the extracted water becomes about 4-5, Large amounts of chloride ions may elute. Accordingly, it is preferable that the pH of pure water after 1 g of the cured product of the adhesive for electronic parts obtained is immersed in 10 g of pure water at 100 ° C. for 2 hours is 6 to 8, and the pH is 6.5 to 7. 5 is more preferable.

The adhesive composition may contain a diluent in order to reduce the viscosity.
The diluent preferably has an epoxy group, and the preferable lower limit of the number of epoxy groups in one molecule is 2, and the preferable upper limit is 4. If the number of epoxy groups in one molecule is less than 2, sufficient heat resistance may not be exhibited after the adhesive for electronic parts is cured. If the number of epoxy groups in one molecule exceeds 4, distortion due to curing may occur, or uncured epoxy groups may remain, which may result in poor bonding strength or poor bonding due to repeated thermal stress. May occur. A more preferable upper limit of the number of epoxy groups in one molecule of the diluent is 3.
The diluent preferably has an aromatic ring and / or a dicyclopentadiene structure.

The above-mentioned diluent has a preferred upper limit of the weight loss at 120 ° C. or 150 ° C. of 1%. If the weight loss at 120 ° C. or 150 ° C. exceeds 1%, unreacted substances will volatilize during or after curing of the adhesive for electronic components, adversely affecting the productivity or performance of the resulting electronic component laminate. May give.
The diluent preferably has a lower curing start temperature and a higher curing rate than other curable compounds.

The preferable lower limit of the blending amount of the diluent in the adhesive composition is 1% by weight, and the preferable upper limit is 20% by weight. If the blending amount of the diluent is outside the above range, the viscosity of the adhesive composition may not be sufficiently reduced.

The adhesive for electronic components preferably contains spacer particles having a CV value of 10% or less.
By including spacer particles having a CV value of 10% or less, for example, when a multilayer electronic component laminate is manufactured using the method for manufacturing an electronic component laminate of the present invention, a dummy chip or the like is interposed. The distance between the electronic components can be kept constant.

When the CV value of the spacer particles exceeds 10%, the particle size varies greatly, so that it is difficult to keep the distance between the electronic components constant, and the function as the spacer particles may not be performed sufficiently. A more preferable upper limit of the CV value of the spacer particles is 6%, and a more preferable upper limit is 4%.
In addition, in this specification, CV value is a numerical value calculated | required by following formula (1).
CV value of particle diameter (%) = (σ2 / Dn2) × 100 (1)
In formula (1), σ2 represents the standard deviation of the particle diameter, and Dn2 represents the number average particle diameter.
In this specification, the distance between electronic components is the distance between the substrate and the semiconductor chip, the distance between the semiconductor chips, the distance between the substrate and the wafer, the distance between the wafers, and the distance between the semiconductor chip and the wafer. Means.

The average particle diameter of the spacer particles having the CV value of 10% or less (hereinafter also simply referred to as spacer particles) is not particularly limited, and it is possible to select a particle diameter that can achieve a desired distance between electronic components. However, the preferable lower limit is 5 μm and the preferable upper limit is 200 μm. When the average particle diameter of the spacer particles is less than 5 μm, for example, when manufacturing a multilayer electronic component laminate using the method for manufacturing an electronic component laminate of the present invention, It may be difficult to reduce the distance between the components, and the electronic components may not be kept horizontal. When the average particle diameter of the spacer particles exceeds 200 μm, for example, when a multilayer electronic component laminate is manufactured using the method for manufacturing an electronic component laminate of the present invention, the distance between the electronic components becomes larger than necessary. Sometimes. The more preferable lower limit of the average particle diameter of the spacer particles is 9 μm, and the more preferable upper limit is 50 μm.

The average particle size of the spacer particles is preferably 1.2 times or more the average particle size of solid components other than the spacer particles added to the adhesive for electronic components. When the average particle size of the spacer particles is less than 1.2 times the average particle size of solid components other than the spacer particles, for example, a multilayer electronic component laminate using the method for producing an electronic component laminate of the present invention When manufacturing the above, it may be difficult to reliably reduce the distance between the electronic components to the particle size of the spacer particles. The average particle size of the spacer particles is more preferably 1.3 times or more the average particle size of solid components other than the spacer particles.

The spacer particles represented by the following formula (2) preferably the lower limit is 980 N / mm ² of K value represented by, and the desirable upper limit is 4900 N / mm ^{2.
K = (3 / √2) ·} F · S -3/2 · R -1/2 (2)
In Formula (2), F and S represent the load value (kgf) and compression displacement (mm) in 10% compression deformation of the spacer particles, respectively, and R represents the radius (mm) of the spacer particles.

The K value can be measured by the following measuring method.
First, after dispersing spacer particles on a steel plate having a smooth surface, one spacer particle is selected from the spacer particles, and the spacer particles are applied to the smooth end face of a diamond cylinder having a diameter of 50 μm using a micro compression tester. Compress. At this time, the compression load is electrically detected as an electromagnetic force, and the compression displacement is electrically detected as a displacement by the operating transformer. Then, a load value and a compression displacement in 10% compression deformation are obtained from the obtained compression displacement-load relationship, and a K value is calculated from the obtained result.

The preferable lower limit of the compression recovery rate when the spacer particles are released from the 10% compression deformation state at 20 ° C. is 20%. By using spacer particles having such a compression recovery rate, for example, in the case of producing a multilayer electronic component laminate using the method for producing an electronic component laminate of the present invention, the laminated electronic component Even when spacer particles larger than the average particle diameter are present between the parts, the shape can be recovered by compressive deformation and used as a gap adjusting material. Therefore, semiconductor chips or wafers can be horizontally stacked at a more stable and constant interval.

The compression recovery rate can be measured by the following measuring method.
The compression displacement is electrically detected as the displacement by the actuating transformer by the same method as in the measurement of the K value, and after compressing to the reverse load value, the load is reduced and the relationship between the load and the compression displacement at that time is shown. taking measurement. The compression recovery rate is calculated from the obtained measurement result. However, the end point in the removal load is not a load value of zero but an origin load value of 0.1 g or more.

The material of the spacer particles is not particularly limited, but is preferably resin particles.
The resin constituting the resin particles is not particularly limited. For example, polyethylene, polypropylene, polymethylpentene, polyvinyl chloride, polytetrafluoroethylene, polystyrene, polymethyl methacrylate, polyethylene terephthalate, polybutylene terephthalate, polyamide, polyimide , Polysulfone, polyphenylene oxide, polyacetal and the like. Among these, it is preferable to use a crosslinked resin because the hardness and compression recovery rate of the spacer particles can be easily adjusted and the heat resistance can be improved.

The cross-linked resin is not particularly limited. For example, epoxy resin, phenol resin, melamine resin, unsaturated polyester resin, divinylbenzene polymer, divinylbenzene-styrene copolymer, divinylbenzene- (meth) acrylic ester copolymer And resins having a network structure such as diallyl phthalate polymer, triallyl isocyanurate polymer, and benzoguanamine polymer. Of these, divinylbenzene polymer, divinylbenzene-styrene copolymer, divinylbenzene- (meth) acrylate copolymer, diallyl phthalate polymer, and the like are preferable. When these cross-linked resins are used, after bonding a semiconductor chip or wafer, resistance to heat treatment processes such as a curing process and a solder reflow process is excellent.

The spacer particles are preferably surface-treated as necessary. By subjecting the spacer particles to a surface treatment, it is possible to achieve the viscosity characteristics described below in the obtained adhesive for electronic components.
Although the method of the said surface treatment is not specifically limited, For example, it is preferable to provide a hydrophobic group on the surface. In addition, when a hydrophilic group is imparted to the surface as the surface treatment, a method for imparting the hydrophilic group to the surface is not particularly limited. For example, a method of treating the surface of the resin particles with a coupling agent having a hydrophilic group, etc. Is mentioned.

The spacer particles are preferably spherical. The preferable upper limit of the aspect ratio of the spacer particles is 1.1. By setting the aspect ratio to 1.1 or less, for example, when a multilayer electronic component laminate is manufactured using the electronic component laminate manufacturing method of the present invention, the distance between the electronic components is stably maintained constant. be able to.
In the present specification, the aspect ratio means the ratio of the length of the major axis to the length of the minor axis (the value obtained by dividing the length of the major axis by the length of the minor axis) with respect to the major axis and minor axis of the particle. . The closer the aspect ratio value is to 1, the closer the shape of the spacer particle is to a true sphere.

The preferable lower limit of the blending amount of the spacer particles in the adhesive for electronic components is 0.01% by weight, and the preferable upper limit is 5% by weight. When the amount of the spacer particles is less than 0.01% by weight, for example, when a multilayer electronic component laminate is manufactured using the method for manufacturing an electronic component laminate of the present invention, the distance between the electronic components is stabilized. May not be kept constant. When the amount of the spacer particles exceeds 5% by weight, the function of the obtained adhesive for electronic parts as an adhesive may be deteriorated.

Moreover, when the said adhesive for electronic components contains the solid component which has a particle diameter more than the average particle diameter of the said spacer particle | grain other than the said spacer particle | grain, the preferable upper limit of the compounding quantity of such a solid component is 1 weight. %.
The melting point of the solid component having a particle diameter equal to or larger than the average particle diameter of the spacer particles is preferably equal to or lower than the curing temperature of the adhesive for electronic components.
The maximum particle size of the solid component having a particle size equal to or larger than the average particle size of the spacer particles is preferably 1.1 to 1.5 of the average particle size of the spacer particles, and 1.1 to 1.2. More preferably it is.

It is preferable that the adhesive for electronic components further contains a thixotropic agent. By containing the thixotropy-imparting agent, the obtained adhesive for electronic components can achieve a desired viscosity behavior.

The thixotropy imparting agent is not particularly limited, and examples thereof include fine metal particles, calcium carbonate, fumed silica, inorganic fine particles such as aluminum oxide, boron nitride, aluminum nitride, and aluminum borate. Of these, fumed silica is preferable.

As the thixotropy-imparting agent, a thixotropy-imparting agent subjected to surface treatment can be used as necessary. Moreover, it is preferable to use the particle | grains which have a hydrophilic group on the surface as said thixotropy imparting agent. Specific examples of the particles having a hydrophilic group on the surface include fumed silica having a hydrophilic group on the surface.

When a particulate thixotropy imparting agent is used as the thixotropy imparting agent, the preferable upper limit of the average particle diameter is 1 μm. When the average particle diameter of the thixotropy-imparting agent exceeds 1 μm, the obtained adhesive for electronic parts may not exhibit desired thixotropy.

The blending amount of the thixotropy imparting agent in the electronic component adhesive is not particularly limited, but when the spacer particles are not surface-treated, the preferred lower limit is 0.5% by weight and the preferred upper limit is 20% by weight. is there. When the blending amount of the thixotropy-imparting agent is less than 0.5% by weight, sufficient thixotropy may not be imparted to the resulting adhesive for electronic components. When the blending amount of the thixotropy-imparting agent exceeds 20% by weight, when the electronic component laminate is produced using the method for producing an electronic component laminate of the present invention, the exclusion of the adhesive for electronic components is reduced. There is. A more preferable lower limit of the amount of the thixotropy-imparting agent is 3% by weight, and a more preferable upper limit is 10% by weight.

The adhesive for electronic components preferably further contains a polymer compound having a functional group capable of reacting with the curable compound (hereinafter, also simply referred to as a polymer compound having a functional group capable of reacting). By including such a polymer compound, the bonding reliability when heat distortion occurs is improved.

When an epoxy resin is used as the curable compound as the polymer compound having a reactive functional group, for example, a polymer compound having an amino group, a urethane group, an imide group, a hydroxyl group, a carboxyl group, an epoxy group, or the like. Etc. Among these, a polymer compound having an epoxy group is preferable. By adding the above-mentioned polymer compound having an epoxy group, the cured product of the adhesive for electronic parts exhibits excellent flexibility. That is, the cured product of the adhesive for electronic components has excellent mechanical strength, heat resistance and moisture resistance derived from an epoxy resin having a polycyclic hydrocarbon skeleton in the main chain as the curable compound, and the epoxy It has excellent flexibility derived from a polymer compound having a group, and is excellent in heat cycle resistance, solder reflow resistance, dimensional stability, etc., and exhibits high adhesion reliability and high conduction reliability. It will be.

The polymer compound having an epoxy group is not particularly limited as long as it is a polymer compound having an epoxy group at the terminal and / or side chain (pendant position). For example, an epoxy group-containing acrylic rubber, an epoxy group-containing butadiene rubber, Examples thereof include bisphenol type high molecular weight epoxy resin, epoxy group-containing phenoxy resin, epoxy group-containing acrylic resin, epoxy group-containing urethane resin, and epoxy group-containing polyester resin. Among them, an epoxy group-containing acrylic resin is preferable because a polymer compound containing a large amount of epoxy groups can be obtained and the cured product has better mechanical strength and heat resistance. These polymer compounds having an epoxy group may be used alone or in combination of two or more.

As the polymer compound having a functional group capable of reacting, a polymer compound having the epoxy group, particularly when an epoxy group-containing acrylic resin is used, the preferred lower limit of the weight average molecular weight of the polymer compound having the epoxy group is 1. Ten thousand. If the weight average molecular weight is less than 10,000, the film-forming property of the adhesive for electronic parts may be insufficient, and the flexibility of the cured product of the adhesive for electronic parts may not be sufficiently improved.

When the polymer compound having an epoxy group is used as the polymer compound having a functional group capable of reacting, particularly when an epoxy group-containing acrylic resin is used, the preferred lower limit of the epoxy equivalent of the polymer compound having the epoxy group is 200, A preferred upper limit is 1000. If the epoxy equivalent is less than 200, the flexibility of the cured product of the adhesive for electronic components may not be sufficiently improved. When the said epoxy equivalent exceeds 1000, the mechanical strength or heat resistance of the hardened | cured material of the adhesive for electronic components may become inadequate.

The amount of the polymer compound having a functional group capable of reacting in the adhesive for electronic parts is not particularly limited, but a preferable lower limit is 1 part by weight and a preferable upper limit is 30 parts by weight with respect to 100 parts by weight of the curable compound. It is. When the amount of the polymer compound having a functional group capable of reacting is less than 1 part by weight, the electronic component adhesive may not have sufficient reliability with respect to thermal strain. If the amount of the polymer compound having a functional group capable of reacting exceeds 30 parts by weight, the heat resistance of the adhesive for electronic parts may be lowered.

The adhesive for electronic parts preferably further contains a surface-treated silica filler. Although the said surface-treated silica filler is not specifically limited, The silica filler surface-treated with the phenylsilane coupling agent is preferable.

The blending amount of the surface-treated silica filler in the adhesive for electronic parts is not particularly limited, but a preferable lower limit is 30 parts by weight and a preferable upper limit is 400 parts by weight with respect to 100 parts by weight of the curable compound. When the compounding amount of the surface-treated silica filler is less than 30 parts by weight, the obtained adhesive for electronic parts may not be able to maintain sufficient reliability. When the compounding amount of the surface-treated silica filler exceeds 400 parts by weight, the viscosity of the obtained adhesive for electronic parts may become too high, and the coating stability may be lowered.

The adhesive for electronic parts may contain a solvent as necessary.
The solvent is not particularly limited, and examples thereof include aromatic hydrocarbons, chlorinated aromatic hydrocarbons, chlorinated aliphatic hydrocarbons, alcohols, esters, ethers, ketones, glycol ethers (cellosolves), and fats. Examples thereof include cyclic hydrocarbons and aliphatic hydrocarbons.

The said adhesive for electronic components may contain an inorganic ion exchanger as needed.
Among the inorganic ion exchangers, examples of commercially available products include IXE series (manufactured by Toagosei Co., Ltd.). A preferable upper limit of the amount of the inorganic ion exchanger in the electronic component adhesive is 10% by weight, and a preferable lower limit is 1% by weight.

The adhesive for electronic parts may further contain other additives such as an anti-bleeding agent and an adhesion-imparting agent such as an imidazole silane coupling agent, if necessary.

When the viscosity of the adhesive for electronic parts is measured at 25 ° C. using an E-type viscometer, the viscosity at 0.5 rpm is 20 Pa · s or more and 100 Pa · s or less.
When the viscosity at 0.5 rpm is less than 20 Pa · s, it is difficult to maintain the shape at the time of application until the bonding step (2) described later after application. When the viscosity at 0.5 rpm exceeds 100 Pa · s, it is difficult to apply the adhesive for electronic components in a desired shape.
When the viscosity of the adhesive for electronic parts is measured at 25 ° C. using an E-type viscometer, the viscosity at 0.5 rpm is more preferably 60 Pa · s or less.

When the viscosity of the adhesive for electronic parts is measured at 25 ° C. using an E-type viscometer, the viscosity at 0.5 rpm is preferably 2 to 5 times the viscosity at 5 rpm.
When the viscosity at 0.5 rpm is less than twice the viscosity at 5 rpm, the amount of the adhesive for electronic components that protrudes from the bonding region is large when the step (3) for spreading the adhesive for electronic components described later is performed. Therefore, it may be difficult to wire bond the obtained electronic component laminate. When the viscosity at 0.5 rpm exceeds 5 times the viscosity at 5 rpm, the electronic component adhesive is uniformly wetted and spreads over the entire bonding region when the step (3) of wetting and spreading the adhesive for electronic components described later is performed. However, since a cavity is generated after mold sealing, the obtained electronic component laminate may lack reliability.
When the viscosity of the adhesive for electronic parts is measured at 25 ° C. using an E-type viscometer, the viscosity at 0.5 rpm is more preferably 4 times or less than the viscosity at 5 rpm.

When the viscosity of the adhesive for electronic parts is measured at a bonding temperature using an E-type viscometer, the viscosity at 0.5 rpm is 4 Pa · s or more and 25 Pa · s or less. By having such a viscosity characteristic, the adhesive for electronic parts is bonded in the step (3) of wetting and spreading the adhesive for electronic components described later after releasing the pressure in the bonding step (2) described later. It is possible to uniformly spread the entire bonding area without overhanging from the area or insufficiently spreading the area.
When the viscosity at 0.5 rpm is less than 4 Pa · s, the amount of the adhesive for electronic components that protrudes from the joining region is increased when the step (3) for spreading the adhesive for electronic components described later is performed. It becomes difficult to wire bond to the electronic component laminate. When the viscosity at 0.5 rpm exceeds 25 Pa · s, the electronic component adhesive does not spread evenly over the entire bonding area when the electronic component adhesive (step 3) described later is wetted and spread. Since a cavity is generated after sealing, the obtained electronic component laminate lacks reliability. When the viscosity at 0.5 rpm exceeds 25 Pa · s, for example, in the case of manufacturing a multilayer electronic component laminate using the method for manufacturing an electronic component laminate of the present invention, in the bonding step (2) described later. Even when the stacked semiconductor chip or wafer is pressed, it is difficult to make the distance between the electronic components substantially equal to the particle diameter of the spacer particles.

In the present specification, the bonding temperature means a temperature used in a bonding step (2) described later. As said bonding temperature, the temperature of the range of 25-80 degreeC is mentioned, for example.

When the viscosity of the adhesive for electronic components is measured at a bonding temperature using an E-type viscometer, the viscosity at 0.5 rpm is 2 to 4 times the viscosity at 5 rpm. By having such a viscosity characteristic, in the bonding step (2), which will be described later, the adhesive for electronic components uniformly spreads in a predetermined range of the bonding region in a short time by heating and pressing. Then, after releasing the pressure, in the step (3) of wetting and spreading the adhesive for electronic components, which will be described later, the joining region does not protrude greatly or the wetting and spreading does not become insufficient. It can spread evenly throughout.
When the viscosity at 0.5 rpm is less than twice the viscosity at 5 rpm, the amount of the adhesive for electronic components that protrudes from the bonding region is large when the step (3) for spreading the adhesive for electronic components described later is performed. Therefore, it becomes difficult to wire bond the obtained electronic component laminate. When the viscosity at 0.5 rpm exceeds 4 times the viscosity at 5 rpm, the electronic component adhesive is uniformly spread over the entire joining region when the step (3) of wetting and spreading the adhesive for electronic components described later is performed. In addition, since a cavity is formed after mold sealing, the obtained electronic component laminate lacks reliability.
When the viscosity of the adhesive for electronic parts is measured at a bonding temperature using an E-type viscometer, the viscosity at 0.5 rpm is preferably not more than 3 times the viscosity at 5 rpm.

The adhesive for electronic components has a preferable lower limit of the elastic modulus E at −55 to 125 ° C. after curing, 1 GPa, and a preferable upper limit of 8 GPa. If the elastic modulus E is less than 1 GPa, sufficient heat resistance may not be obtained. When the elastic modulus E exceeds 8 GPa, stress generated by strain due to temperature change concentrates, which may adversely affect the bonding reliability. The adhesive for electronic components has a more preferable lower limit of the elastic modulus E at −55 to 125 ° C. after curing, 2 GPa, and a more preferable upper limit of 7 GPa.

The electronic component adhesive preferably has a reaction rate of less than 5% after 5 minutes at 20 to 120 ° C. When the reaction rate is 5% or more, wetting and spreading of the adhesive for electronic components may be insufficient, or the target space reachability may not be obtained.

The method for producing the adhesive for electronic parts is not particularly limited. For example, the adhesive composition having the curable compound and the curing agent may be functionally reacted with the curing accelerator and the curable compound as necessary. A method of blending the spacer particles after blending a predetermined amount of the polymer compound having a group, the thixotropy-imparting agent, other additives, and the like.
The mixing method is not particularly limited, and examples thereof include a method using a homodisper, a universal mixer, a Banbury mixer, a kneader and the like.

In the method for manufacturing an electronic component laminate according to the present invention, the semiconductor chip is then placed on the substrate, another semiconductor chip, or another wafer through the adhesive for electronic components applied as described above while being heated and pressed. Alternatively, a bonding step (2) for releasing the pressure is performed after laminating the wafers and setting the area where the adhesive for electronic parts is spread to 60% or more and less than 100% of the bonding area.
In the bonding step (2), the semiconductor chip or the wafer is laminated and bonded to the substrate, another semiconductor chip or another wafer through the applied adhesive for electronic components.

In the bonding step (2), heating and pressing are performed when the semiconductor chip or wafer is stacked on the substrate, another semiconductor chip, or another wafer.
By performing the heating and pressing, the adhesive for electronic components can be spread evenly in a predetermined range of the joining region. Moreover, when the said adhesive for electronic components contains the said spacer particle | grains by performing the said press, it can laminate | stack so that the space | interval between electronic components may be supported by the spacer particle | grains. Further, when only pressing is performed without heating, the time required for the adhesive for electronic components to spread out gets longer, whereas by performing the heating and pressing, the electronic components can be made in a short time. The adhesive can spread evenly in a predetermined range of the joining area.

Although the said heating is not specifically limited, It is preferable to carry out at the temperature of 25 to 80 degreeC. When the heating temperature is less than 25 ° C., the electronic component adhesive cannot uniformly spread and spread in a predetermined range of the joining region, and the electronic component adhesive described later (3) ), The electronic component adhesive is not uniformly spread over the entire bonding region, and the obtained electronic component laminate may be unreliable. When the temperature for performing the heating exceeds 80 ° C., the curing of the adhesive for electronic components may start, and wetting and spreading may be difficult, and the step of wetting and spreading the adhesive for electronic components to be described later When (3) is passed, the amount of the adhesive for electronic components that protrudes from the joining region increases, and it may be difficult to wire bond the resulting electronic component laminate.
The heating is more preferably performed at a temperature of 40 ° C. or higher and 60 ° C. or lower.

Although the said press is not specifically limited, It is preferable to perform by the pressure of 0.005 Mpa or more and 0.2 Mpa or less. When the pressure for performing the pressing is less than 0.005 MPa, the electronic component adhesive cannot be uniformly wetted and spread in a predetermined range of the joining region, and the electronic component adhesive described later is wetted and spread ( When 3), the electronic component adhesive is not uniformly spread over the entire bonding region, and the obtained electronic component laminate may be unreliable. When the pressure for pressing exceeds 0.2 MPa, the amount of the adhesive for electronic components that protrudes from the joining region increases when the electronic component adhesive described later (3) is wetted and spread, and the resulting electronic It may be difficult to wire bond the component stack.
The pressing is more preferably performed at a pressure of 0.05 MPa or more.
In addition, the said press is performed with respect to the semiconductor chip or wafer laminated | stacked on the said board | substrate, another semiconductor chip, or another wafer through the said adhesive agent for electronic components.

The pressing is preferably performed so that the distance between the electronic components is reduced to 1 to 1.5 times the desired distance between the electronic components. Thereby, in the step (3) of spreading the adhesive for electronic components described later, the adhesive for electronic components uniformly spreads over the entire joining region, and a desired distance between the electronic components is obtained in the resulting electronic component laminate. Can be achieved.

The heating and pressing time is not particularly limited, but is preferably 0.1 second or more and 5 seconds or less. When the heating and pressing time is less than 0.1 seconds, the adhesive for electronic components cannot be spread evenly in a predetermined range of the joining region, and the adhesive for electronic components described later is spread. When the step (3) is performed, the electronic component adhesive is not uniformly spread over the entire bonding region, and the obtained electronic component laminate may lack reliability. If the heating and pressing time exceeds 5 seconds, the amount of the adhesive for electronic components that protrudes from the joining region increases when the electronic component adhesive (step 3) described later is wetted and spread. It may be difficult to wire bond the component laminate, or the production efficiency of the electronic component laminate may be reduced.
The heating and pressing time is more preferably 1 second or less.

In the bonding step (2), the area where the adhesive for electronic components is spread out is set to 60% or more and less than 100% of the bonding area, and then the pressing is released. In this way, the adhesive for electronic components wets and spreads the adhesive for electronic components, which will be described later, by releasing the pressure after setting the region where the adhesive for electronic components spreads within the above range. In 3), it is possible to uniformly spread the entire bonding region without overhanging from the bonding region or insufficiently spreading the wetting.
When the area where the adhesive for electronic components spreads is less than 60% of the bonding area, the adhesive for electronic parts is bonded to the bonding area after the step (3) of spreading the adhesive for electronic components described later. The entire electronic component laminate is not reliable because it does not wet and spread uniformly throughout. When the region where the adhesive for electronic parts spreads out is 100% or more of the joining region, the adhesive for electronic components that protrudes from the joining region when the step (3) for spreading the adhesive for electronic components described later is performed. Therefore, it becomes difficult to wire-bond the resulting electronic component laminate.

In addition, in the manufacturing method of the electronic component laminated body of this invention, the state after passing through the said bonding process (2) is typically shown in FIG. In FIG. 1, a semiconductor chip or wafer 2 is laminated on a substrate, another semiconductor chip or another wafer 1 through an applied electronic component adhesive 3.

In the method for manufacturing an electronic component laminate according to the present invention, the electronic component adhesive is then heated to uniformly wet and spread the electronic component adhesive throughout the bonding region (3) (this specification). In the middle, the process (also referred to as the step (3) of simply spreading the electronic component adhesive) is performed.
The method for heating the adhesive for electronic components is not particularly limited. For example, a method of heating at the same temperature as that used in the bonding step (2) is preferable.

2 and 3 schematically show the state after the step (3) of wetting and spreading the adhesive for electronic components in the method for producing an electronic component laminate of the present invention.
After the step (3) of wetting and spreading the adhesive for electronic parts, the adhesive for electronic parts does not protrude from the joining area as shown in FIG. 2 as long as it spreads uniformly throughout the joining area. Alternatively, as shown in FIG. 3, the fillet may be formed so as to protrude from the joining region. By forming the fillet, the reliability of the obtained electronic component laminate can be further increased.
In addition, in this specification, a fillet means the thick part of the adhesive agent for electronic components which protruded from the joining area | region.

When the adhesive for electronic components protrudes from the joining region to form a fillet, the preferred lower limit of the distance from the joining region of the fillet is 50 μm, and the preferred upper limit is 300 μm. If the distance from the bonding region of the fillet is less than 50 μm, the effect of forming the fillet may not be sufficiently obtained. When the distance from the bonding region of the fillet exceeds 300 μm, the fillet may contaminate the wire bonding pad and cause wire bonding failure.
A more preferable lower limit of the distance from the joining region of the fillet is 100 μm, and a more preferable lower limit is 150 μm.

Next, in the method for manufacturing an electronic component laminate of the present invention, a curing step (4) for curing the adhesive for electronic components is performed. Thereby, the said adhesive agent for electronic components can be hardened and an electronic component laminated body can be obtained.

The curing method in the curing step (4) is not particularly limited, and curing conditions suitable for the curing characteristics of the electronic component adhesive can be appropriately selected and used, for example, at 120 ° C. for 30 minutes and at 170 ° C. Examples include a method of heating for 30 minutes.

In the manufacturing method of the electronic component laminate of the present invention, by using the adhesive for electronic components having the above-described viscosity characteristics, the heating and pressing are performed in the bonding step (2), whereby the above-described method can be performed in a short time. By heating the adhesive for electronic components in the step (3) of spreading the adhesive for electronic components uniformly and then spreading the adhesive for electronic components in a predetermined range of the joining region, the electronic component The adhesive is spread evenly throughout the bonding area. Thereby, even if it adjusts the quantity of the adhesive for electronic components which protrudes from a joining area | region, and it reduces in size, a highly accurate and reliable electronic component laminated body can be obtained.

The distance between the electronic components of the electronic component laminate obtained by the method for producing an electronic component laminate of the present invention is preferably 5 to 10 μm longer than the average particle diameter of the spacer particles. If the distance between the electronic components is out of the above range, it may be difficult to control the distance between the electronic components.

When a multilayer electronic component laminate is produced using the method for producing an electronic component laminate of the present invention, the variation in the distance between the electronic components of the obtained electronic component laminate is preferably less than 5 μm at 3σ. If the variation in the distance between the electronic components is 5 μm or more at 3σ, wire bonding failure and flip chip bonding failure may occur in the obtained electronic component laminate. Note that σ represents a standard deviation.

In the method for manufacturing an electronic component laminate of the present invention, the steps from the bonding step (2) to the curing step (4) may be performed as a series of steps, for example. It may be done separately. In any case, by appropriately selecting the temperature, pressure, time, temperature increase rate, etc. in each step, the electronic component adhesive is cured in a state where it is uniformly wetted and spreads over the entire bonding area. is important.

Moreover, when manufacturing a multilayer electronic component laminated body using the manufacturing method of the electronic component laminated body of this invention, the process from the said bonding process (2) to the said hardening process (4) is a semiconductor chip or a wafer. It may be performed every time one bonding is performed, or may be performed at once after a desired number of semiconductor chips or wafers are stacked.

In the method for manufacturing an electronic component laminate of the present invention, for example, a semiconductor chip may be bonded to a substrate, and for example, a semiconductor chip is bonded to another semiconductor chip such as a semiconductor chip bonded to the substrate. The semiconductor chip may be bonded to the wafer, or the wafer may be bonded to the substrate. For example, the wafer may be bonded to another wafer such as a wafer bonded to the substrate. May be.
The method for manufacturing an electronic component laminate of the present invention is particularly preferably used when semiconductor chips are joined in a cross shape.
Furthermore, an electronic component laminated body is manufactured using the manufacturing method of the electronic component laminated body of this invention, Furthermore, a semiconductor device can be manufactured by performing required processes, such as sealing with a sealing agent.

ADVANTAGE OF THE INVENTION According to this invention, the electronic component laminated body which can adjust the quantity of the adhesive for electronic components which protrudes from the joining area | region of a semiconductor chip or a wafer, and can obtain a highly accurate and reliable electronic component laminated body even if it reduces in size. The manufacturing method of can be provided.

FIG. 1 is a cross-sectional view schematically showing an example of a state after undergoing a bonding step (2) in the method for manufacturing an electronic component laminate of the present invention. FIG. 2 is a cross-sectional view schematically showing an example of a state after the step (3) of wetting and spreading the adhesive for electronic components in the method for manufacturing a semiconductor chip laminate of the present invention. FIG. 3 is a cross-sectional view schematically showing an example of a state after the step (3) of wetting and spreading the adhesive for electronic components in the method for manufacturing a semiconductor chip laminate of the present invention.

Hereinafter, the present invention will be described in more detail with reference to examples. However, the present invention is not limited to these examples.
In addition, the particle size measuring machine (Coulter counter ZB / C-1000, the product made by Coulter Electronics) was used for the measurement of the particle diameter as described in the following Examples and Comparative Examples.

Example 1
(1) Manufacture of adhesive for electronic components According to the composition of Example 1 in Table 1, materials other than the spacer particles shown below were stirred and mixed to prepare an adhesive composition. Spacer particles were blended into the obtained adhesive composition, and further stirred and mixed to produce an adhesive for electronic components.

1. Epoxy resin Polyether modified epoxy resin (Polyether type epoxy resin, Epogosay PT, manufactured by Yokkaichi Gosei Co., Ltd.)
2. Epoxy group-containing high molecular compound epoxy group-containing acrylic resin (Blenmer CP-30, manufactured by NOF Corporation)
3. Hardener acid anhydride (YH-306, manufactured by Japan Epoxy Resin Co., Ltd.)
4). Curing accelerator imidazole compound (2MA-OK, manufactured by Shikoku Chemicals)
5. Adhesiveness imparting agent imidazole silane coupling agent (SP-1000, manufactured by Nikko Materials)
6). Thixotropy imparting agent fumed silica (surface hydrophobic group-containing thixotropy imparting agent, PM-20L, manufactured by Tokuyama Corporation)
7). Spacer particle resin particles (Micropearl SP-225, manufactured by Sekisui Chemical Co., Ltd., average particle size 25 μm, CV value 4%)
8). Silica filler spherical silica (SE-4050-SPE, manufactured by Admatechs, average particle size 1 μm, maximum particle size 5 μm)

(2) Manufacture of electronic component laminate (2-1) Application process (1)
The obtained adhesive for electronic components was filled into a 10 mL syringe (Musashi Engineering Co., Ltd.), a precision nozzle (Musashi Engineering Co., Ltd., nozzle tip diameter 0.6 mm) was attached to the syringe tip, and a dispenser device (SuperΣCMII-V5, Musashi). (Manufactured by Engineering Co., Ltd.) was applied onto the glass epoxy substrate at a discharge pressure of 30 kPa, a gap between the glass epoxy substrate and the needle of 250 μm, and a coating amount of 3.0 μL.
At this time, the area where the electronic component adhesive was applied was 70% of the bonded area. Moreover, the application shape of the adhesive for electronic components was a cross shape, and the length of the diagonal line of the cross shape was 70% of the length of the diagonal line of the joining region.

(2-2) Bonding process (2)
The coated glass epoxy substrate is conveyed to the bonding part of a die bonder (BESTEM-D02, manufactured by Canon Machinery Co., Ltd.) while being heated at 60 ° C., and the bare silicon chip (chip 1) is passed through the applied adhesive for electronic components. The film was laminated on a glass epoxy substrate by pressing (thickness 100 μm, 9 mm × 13 mm square) at 60 ° C. and a pressure of 0.005 MPa for 0.5 seconds.
At this time, the area where the adhesive for electronic parts spread out was 95% of the bonded area.

(2-3) Step of wetting and spreading the adhesive for electronic components (3)
Next, the glass epoxy substrate after lamination of the bare silicon chip (chip 1) was conveyed to the unloading part of the die bonder (BESTEM-D02, manufactured by Canon Machinery) while heating at 80 ° C.
At this time, the area where the adhesive for electronic parts spread was 100% of the bonded area.

(2-4) Curing step (4)
Thereafter, the temperature is increased from 80 ° C. to 120 ° C. for 60 minutes in a hot air drying furnace, and the temperature is maintained by leaving it at 120 ° C. for 15 minutes, followed by heating at 170 ° C. for 30 minutes. The electronic component laminate was obtained by curing the component adhesive.

(Example 2)
An adhesive for electronic components and an electronic component laminate were obtained in the same manner as in Example 1 except that an adhesive composition was prepared according to the composition of Example 2 in Table 1.

(Example 3)
An adhesive for electronic components and an electronic component laminate were obtained in the same manner as in Example 1 except that an adhesive composition was prepared according to the composition of Example 3 in Table 1.

Example 4
An adhesive for electronic components and an electronic component laminate were obtained in the same manner as in Example 1 except that an adhesive composition was prepared according to the composition of Example 4 in Table 1.

(Example 5)
In the bonding step (2), the adhesive for an electronic component and the electronic component are the same as in Example 2 except that the pressure when the bare silicon chip (chip 1) is laminated on the glass epoxy substrate is 0.05 MPa. A laminate was obtained.

(Example 6)
In the bonding step (2), the adhesive for an electronic component and the electronic component were the same as in Example 2 except that the pressure when laminating the bare silicon chip (chip 1) on the glass epoxy substrate was 0.2 MPa. A laminate was obtained.

(Example 7)
In the bonding step (2), the adhesive for an electronic component and the electronic component were the same as in Example 4 except that the pressure when the bare silicon chip (chip 1) was laminated on the glass epoxy substrate was 0.05 MPa. A laminate was obtained.

(Example 8)
In the bonding step (2), the adhesive for an electronic component and the electronic component were the same as in Example 4 except that the pressure when laminating the bare silicon chip (chip 1) on the glass epoxy substrate was 0.2 MPa. A laminate was obtained.

Example 9
In the bonding step (2), the adhesive for an electronic component and the electronic component lamination are performed in the same manner as in Example 2 except that the temperature at which the bare silicon chip (chip 1) is laminated on the glass epoxy substrate is 40 ° C. Got the body.

(Example 10)
In the bonding step (2), the adhesive for an electronic component and the electronic component were the same as in Example 9 except that the pressure when laminating the bare silicon chip (chip 1) on the glass epoxy substrate was 0.2 MPa. A laminate was obtained.

(Example 11)
In the bonding step (2), the adhesive for electronic components and the electronic component lamination were performed in the same manner as in Example 4 except that the temperature at which the bare silicon chip (chip 1) was laminated on the glass epoxy substrate was 80 ° C. Got the body.

(Example 12)
In the bonding step (2), the adhesive for an electronic component and the electronic component were the same as in Example 11 except that the pressure when laminating the bare silicon chip (chip 1) on the glass epoxy substrate was 0.2 MPa. A laminate was obtained.

(Comparative Example 1)
An adhesive for electronic components and an electronic component laminate were obtained in the same manner as in Example 1 except that an adhesive composition was prepared according to the composition of Comparative Example 1 in Table 2.

(Comparative Example 2)
An adhesive for electronic components and an electronic component laminate were obtained in the same manner as in Example 1 except that an adhesive composition was produced according to the composition of Comparative Example 2 in Table 2.

(Comparative Example 3)
In the bonding step (2), the adhesive for an electronic component and the electronic component lamination were performed in the same manner as in Example 1 except that the temperature at which the bare silicon chip (chip 1) was laminated on the glass epoxy substrate was 90 ° C. Got the body.

(Evaluation)
The adhesive for electronic components and the electronic component laminate obtained in Examples and Comparative Examples were evaluated by the following methods. The results are shown in Tables 1 and 2.

(1) Measurement of viscosity Adhesion for electronic components obtained using an E-type viscosity measuring device (trade name “VISCOMETER TV-22”, manufactured by TOKI SANGYO CO. LTD, used rotor φ15 mm, set temperature = 25 ° C.) The viscosity (A) at a rotation speed of 0.5 rpm and the viscosity (B) at 5 rpm were measured. Moreover, (A / B) was calculated | required as a ratio of the viscosity (A) in 0.5 rpm, and the viscosity (B) in 5 rpm.
Moreover, the number of rotations of the adhesive for electronic components obtained using an E-type viscosity measuring apparatus (trade name “VISCOMETER TV-22”, manufactured by TOKI SANGYO CO. LTD, used rotor φ15 mm, set temperature = bonding temperature) The viscosity (C) at 0.5 rpm and the viscosity (D) at 5 rpm were measured. Moreover, (C / D) was calculated | required as a ratio of the viscosity (C) in 0.5 rpm, and the viscosity (D) in 5 rpm.

(2) Fillability of adhesive for electronic parts About the fillability of adhesive for electronic parts in the bonding region between the glass epoxy substrate and the bare silicon chip (chip 1), an ultrasonic exploration imaging device (mi-scope hyper II, The following criteria were used for evaluation.
○ The adhesive for electronic parts was filled in the entire joining area.
X There was a portion where the adhesive for electronic components was not filled in the joining region.

(3) Overflow of adhesive for electronic components (fillet distance)
By measuring the maximum value of the protruding distance (fillet distance) of the adhesive for electronic components protruding from the bonding region between the glass epoxy substrate and the bare silicon chip (chip 1), the evaluation was performed according to the following criteria.
A The maximum value of the protruding distance was 1 to 100 μm.
(Circle) the maximum value of the protrusion distance was 101-200 micrometers.
(Triangle | delta) The maximum value of the protrusion distance was 201-300 micrometers.
X The maximum value of the protruding distance was 301 μm or more, or the entire bonding area was not filled with the adhesive for electronic components, and the maximum value of the protruding distance was 0 μm.

(4) Variation in distance between electronic components With respect to the obtained electronic component laminate, ten samples were produced, and the lamination state of each electronic component laminate was measured using a laser displacement meter (KS-1100, manufactured by KEYENCE). It was measured. Specifically, the step between the bare silicon chip (chip 1) and the upper surface of the glass epoxy substrate is measured, and the chip thickness is subtracted from the measured value, whereby the difference between the bare silicon chip (chip 1) and the glass epoxy substrate is obtained. After obtaining the distance between the electronic components, the variation in the distance between the electronic components was calculated as 3σ (μm) (σ = standard deviation).

(5) Reflow resistance test The obtained electronic component laminate was dried at 125 ° C. for 6 hours, then treated for 48 hours at 85 ° C. and 85% wet conditions, and then at 260 ° C. for 30 seconds as in the case of solder reflow. The heat treatment was performed under the conditions. And it was observed whether the delamination had generate | occur | produced about the electronic component laminated body after performing such heat processing 3 times. Observation of delamination was performed using an ultrasonic exploration imaging apparatus (mi-scope hyper II, manufactured by Hitachi Construction Machinery Finetech Co., Ltd.).
By evaluating the delamination according to the following criteria, the reflow resistance of the electronic component laminate was evaluated.
○ Almost no delamination was observed.
Δ Slight delamination was observed.
X Conspicuous peeling between layers was observed.

ADVANTAGE OF THE INVENTION According to this invention, the electronic component laminated body which can adjust the quantity of the adhesive for electronic components which protrudes from the joining area | region of a semiconductor chip or a wafer, and can obtain a highly accurate and reliable electronic component laminated body even if it reduces in size. The manufacturing method of can be provided.

DESCRIPTION OF SYMBOLS 1 Substrate, other semiconductor chip or other wafer 2 Semiconductor chip or wafer 3 Adhesive for electronic parts

Claims (5)

A method for producing an electronic component laminate in which a semiconductor chip or wafer is bonded to a substrate, another semiconductor chip or another wafer via an adhesive for electronic components,
An application step (1) of applying an electronic component adhesive to a substrate, another semiconductor chip or another wafer;
While heating and pressing, a semiconductor chip or wafer is stacked on the substrate, another semiconductor chip or another wafer through the applied electronic component adhesive, and the electronic component adhesive is spread and wetted. A bonding step (2) for releasing the pressure after setting the semiconductor chip or wafer bonding region to 60% or more and less than 100%,
Heating the electronic component adhesive to uniformly wet and spread the electronic component adhesive over the entire bonding region of the semiconductor chip or wafer; and
A curing step (4) for curing the adhesive for electronic components,
In the application step (1), the area where the adhesive for electronic components is applied is 40 to 90% of the bonding area of the semiconductor chip or wafer,
The adhesive for electronic parts has a viscosity of 20 to 100 Pa · s at 0.5 rpm when the viscosity is measured at 25 ° C. using an E-type viscometer, and at the bonding temperature using an E-type viscometer. A method for producing an electronic component laminate, wherein when measured for viscosity, the viscosity at 0.5 rpm is 4 to 25 Pa · s, and the viscosity at 0.5 rpm is 2 to 4 times the viscosity at 5 rpm. 2. The electronic component laminate according to claim 1, wherein the electronic component adhesive contains an adhesive composition containing a curable compound and a curing agent, and spacer particles having a CV value of 10% or less. Method. The method for producing an electronic component laminate according to claim 2, wherein the distance between the electronic components is 5 to 10 μm longer than the average particle diameter of the spacer particles. In the application step (1), the application shape of the adhesive for electronic components is a cross shape or a double cross shape, and the length of the diagonal line of the cross shape or the double cross shape is the diagonal line of the bonding region of the semiconductor chip or the wafer. 4. The method for manufacturing an electronic component laminate according to claim 1, wherein the length is 70 to 90% of the length. 5. The method of manufacturing an electronic component laminate according to claim 1, wherein the pressing is performed at a pressure of 0.005 MPa or more and 0.2 MPa or less in the bonding step (2).

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