201220986 六、發明說明： 【發明所屬之技術領域】 本發明係有關於一種壓合裝置及其壓合方法，尤其係 指一種基板壓合裝置、壓合方法及其基板組。 【先前技術】 按，目前之電子產品之效能及功率越來越高，因而散 發出之熱量也越來越高，因此大部分需要高散熱效率之電 子產品皆會設置一具有散熱金屬層之基板於該電子產品内 部，舉例來說，個人電腦之電源供應器、發光二極體，甚 至汽車内部之散熱，皆使用該具有散熱金屬層之基板以辅 助政熱。此外，上述具有散熱金屬層之基板更可製作成具 有姓刻電路單元之印刷電路板(print Circuit Board, pcB)，而 大量應用於電子電機領域(如手機、電表、遙控器、寬頻器 、TVBOX、衛星追蹤器或交通號誌)及汽車領域(如防鎖死 煞車系統)等，因此具有散熱金屬層之基板具有極高的商業 價值。 然而，習知的壓合裝置1，如第一圖所示，其係包括一 壓合部10,、一基座1Γ、一銅箔層ir及一金屬板13，。製 作基板的方法如下：首先將銅箔層12,及金屬板13,疊合在 一起，之後透過一驅動裝置使一壓合部10,往基座u，的方 向下壓’因此當壓合部1〇,接觸到銅箔層12,時，對金屬板 13’產生一擠壓的力量，進而使銅箔層12，及金屬板13，彼此 壓合在一起。習知的壓合裝置1，具有以下缺點：（1)習知的 壓合裝置1，，其壓合部1〇’與基座n，用於進行壓合作業的 平面會因為長期使用磨損或是本身結構設計不良而發生不 4/24 201220986 $支之問題。_層12，及金屬板13,亦同樣會受到製造 =之影響，而產生平整度从之問題。⑽知的壓合裝 ’需在壓合裝置1，與欲進行壓合之㈣層ir及金屬板 之間加人_緩衝材’而使作#程序 力^不環保。⑶習知的壓合方法是直接利用壓好^ 銅、泊層12,及金屬板13,進行壓合作業，因此只要壓合部⑻ 、基座11’或是銅騎12,及金屬板13，等任—元件之平整度 不足時，即會造成溫度及壓力無法平均分佈之問題，= _ 厭重影響壓合之效果。（4)習知的壓合方法容易受到元件平 正度不足之影響，而導致微裂痕或是破片等情況發生，造 成良率不佳之問題。 :、’彖疋本發明人有感上述之課題，乃特潛心研究並配 合學理之運用，終於提出一種設計合理且有效改善上述缺 失之本發明。 【發明内容】 • 本發明之主要目的，在於提供一種可有效節省製程時 間、減少成本且獲得平整無氣泡及無皺褶之散熱金屬層在 内側而銅箔層顯露於外側之基板組者。 為了達成上述之目的，本發明提供一種基板壓合裝置 及其塵合方法，該基板壓合震置係包括：一主體單元；一 輸送單元’其係設置於該承載單元的底部，該輸送單元係 用於輸送至少一第一基板及至少一第二基板至該基板壓合 裝置内，遠第一基板及該第二基板係分別包含一銅箔層、 一散熱金屬層及一置於該銅羯層與該散熱金屬層之間之絕 緣層，忒第一基板及該第二基板係正反交錯排列於該輸送 5/24 201220986 單元上；一上蓋單元，其係對應設置於該承載單元上方， 該上蓋單元設置至少一吸附元件，該吸附元件係用於吸附 該第一基板的銅箔層，使該第一基板吸附於該上蓋單元； -塗膠單元’其係設置於該主體單元，該塗膠單元係用於 將一黏合膠塗佈於該第二基板的散熱金屬層表面形成一黏 合部，該第二基板定位在該第一基板的正下方；一抽真空 早^其係設置於該主體單元，該抽真空單元係用以將被 泫上蓋單元吸附之該第一基板及該第二基板之間的空隙抽 ，空；以及一加溫單元，其係設置於該主體單元，該加溫 單元係對該第-基板及該第二基板加熱；藉由該基板壓合鲁 裝置’使該第-基板及該第三基板緊密貼合，形成一散熱 金屬層在内側而銅箔層顯露於外側的基板組。 。玄基板壓合方法’包括以下步驟：一備料步驟，苴係 提供至少-第-基板及至少一第二基板，該第一基板及該 第二基板係分別包括一銅箔層、一散熱金屬層及一置於該 銅箱層與該散熱金屬層之間的絕緣層；一輸送步驟，其係 利用:輸送單元將該第一基板及該第二基板正反交錯地依 士輸送至-基板壓合裝置内；一吸附步驟，其係利用一上· 蓋單元之至γ及附元件將首先輸送至該基板壓合裝置内 =第-基板暫時地吸附定位於該上蓋單元，並利用該上 蓋單7L將所吸附之該第一基板上移一預定高度；一定位步 驟’其係將輸达至該基板壓合裝置内之該第二基板精確地 定位於吸附於該上蓋單元之該第一基板的正下方；一塗膠 步驟’其係利用-塗膠單元將一黏合膠均勻地塗佈於該第 二基板的該散熱金屬層表面；一歷合步驟，該壓合步驟更 包括以下步驟：-下屋步驟，其係使該上蓋單元朝該輸送 6/24 201220986 早Γ 驟，其係將_於該上 -基板釋放，使該第-基板與該第二基板接觸；一抽真空 步驟’其侧用—抽真#元將該第—基板及該第二基板 ，間的郎:抽真空；-加溫步驟，其係利用—加溫單元將 遠第-基板及該第二基板加熱，使該第—基板及該第二基 板穩固黏合，而形成-該散熱金屬層在内側而該銅羯層顯 露於外側的基板組。 板且&括—第—基板、—第二基板及一黏合201220986 VI. Description of the Invention: [Technical Field] The present invention relates to a press-fitting device and a press-fitting method thereof, and more particularly to a substrate press-fitting device, a press-fitting method, and a substrate set thereof. [Prior Art] According to the current high performance and power of electronic products, the amount of heat emitted is also higher and higher. Therefore, most electronic products requiring high heat dissipation efficiency are provided with a substrate having a heat dissipation metal layer. Inside the electronic product, for example, a power supply of a personal computer, a light-emitting diode, or even a heat dissipation inside the automobile, the substrate having a heat-dissipating metal layer is used to assist the heat. In addition, the substrate having the heat dissipation metal layer can be fabricated into a printed circuit board (pcB) having a circuit unit of a surname, and is widely used in the field of electronic motors (such as a mobile phone, an electric meter, a remote controller, a broadband device, and a TVBOX). , satellite trackers or traffic signs) and automotive areas (such as anti-lock brake systems), so the substrate with a heat-dissipating metal layer has a very high commercial value. However, the conventional press-fit device 1, as shown in the first figure, includes a nip 10, a susceptor 1 Γ, a copper foil layer ir, and a metal plate 13. The method of fabricating the substrate is as follows: first, the copper foil layer 12 and the metal plate 13 are stacked together, and then a pressing portion 10 is pressed by a driving device to the direction of the base u, so that when the nip is pressed 1〇, when the copper foil layer 12 is contacted, a pressing force is generated on the metal plate 13', and the copper foil layer 12 and the metal plate 13 are pressed together. The conventional press-fit device 1 has the following disadvantages: (1) a conventional press-fit device 1 having a nip 1' and a base n, and the flat for pressing cooperation may be worn out due to long-term use or It is a problem that the structural design itself is not good and does not occur 4/24 201220986 $. _ layer 12, and metal plate 13, will also be affected by manufacturing =, resulting in flatness problems. (10) Known press-fit device □ It is necessary to add a _ cushioning material between the press-fit device 1 and the (four) layer ir and the metal plate to be pressed, so that the process is not environmentally friendly. (3) The conventional pressing method is to directly press the copper, the mooring layer 12, and the metal plate 13 to perform the press cooperation, so that only the nip (8), the pedestal 11' or the copper ride 12, and the metal plate 13 are used. If the flatness of the component is insufficient, the temperature and pressure cannot be evenly distributed. = _ The effect of the weight on the press. (4) Conventional press-fitting methods are susceptible to insufficient flatness of the components, resulting in micro-cracks or fragmentation, which causes problems of poor yield. : 彖疋 彖疋 彖疋 彖疋 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明SUMMARY OF THE INVENTION The main object of the present invention is to provide a substrate group which can effectively save process time, reduce cost, and obtain a flat heat-free metal layer without bubbles and wrinkles on the inner side and a copper foil layer exposed on the outer side. In order to achieve the above object, the present invention provides a substrate pressing apparatus and a dusting method thereof, the substrate pressing and shaking system comprising: a main body unit; a conveying unit 'which is disposed at a bottom of the carrying unit, the conveying unit For transporting at least one first substrate and at least one second substrate into the substrate pressing device, the far first substrate and the second substrate respectively comprise a copper foil layer, a heat dissipation metal layer and a copper layer An insulating layer between the germanium layer and the heat dissipating metal layer, the first substrate and the second substrate are arranged in a forward and reverse staggered manner on the transporting 5/24 201220986 unit; and an upper cover unit correspondingly disposed above the carrying unit The upper cover unit is provided with at least one adsorption component for adsorbing the copper foil layer of the first substrate, so that the first substrate is adsorbed to the upper cover unit; the glue application unit is disposed on the main body unit, The glue coating unit is configured to apply an adhesive to the surface of the heat dissipation metal layer of the second substrate to form an adhesive portion, and the second substrate is positioned directly under the first substrate; Provided in the main body unit, the vacuuming unit is configured to pump the gap between the first substrate and the second substrate adsorbed by the upper cover unit, and a heating unit, and the heating unit is disposed on the main body a heating unit that heats the first substrate and the second substrate; and the substrate and the third substrate are closely adhered by the substrate pressing device to form a heat dissipation metal layer on the inner side The copper foil layer is exposed to the outer substrate group. . The method for pressing a substrate includes the following steps: a preparation step of providing at least a first substrate and at least a second substrate, the first substrate and the second substrate respectively comprising a copper foil layer and a heat dissipation metal layer And an insulating layer disposed between the copper box layer and the heat dissipating metal layer; and a transporting step of: transporting the first substrate and the second substrate to each other in a forward-reverse manner to a substrate pressure In the apparatus, an adsorption step is performed by using an upper cover unit to the γ and the attached component to be first transported into the substrate pressing device. The first substrate is temporarily adsorbed and positioned on the upper cover unit, and the upper cover unit is utilized. 7L moves the adsorbed first substrate up by a predetermined height; a positioning step of accurately positioning the second substrate conveyed into the substrate pressing device to the first substrate adsorbed to the upper cover unit Directly below; a step of applying a glue to uniformly apply a glue to the surface of the heat dissipating metal layer of the second substrate; and in a step of combining, the step of pressing further comprises the following steps: - the next step, The cover unit is directed to the transport 6/24 201220986, which releases the upper substrate and contacts the second substrate; a vacuum step is used for the side #元。 The first substrate and the second substrate, between: vacuuming; - heating step, which uses a heating unit to heat the far-substrate and the second substrate, so that the first substrate and The second substrate is firmly bonded to form a heat dissipating metal layer on the inner side and the copper beryllium layer is exposed on the outer substrate group. Plate and & - substrate, - second substrate and a bond
膠’該〜基板由上而下依序包括—鋼騎、—絕緣層及 -散熱金屬層’而該第二基板由上而下依序包括—散熱金 屬層:-絕緣層及-散熱金屬層；其中，該第二基板設置 於該第-基㈣下方；_合膠為介於該第—基板及該第 =基板之__型膠圈層，姉合膠韻第—基板及該 苐一基板上下黏合在一起。 本發明具有以下有益的效果： —該基板壓合裝置的該上蓋單元係利用真空吸力將該些 基板⑽mi單元，故該些第—基板可獲得良好 ^定位π會因邊基板壓合裝置振動而移位，因此可提升 该些第-基板及該些第二基板壓合的效率及品質。 。亥基板£ &數置的該抽真空單元於壓合時，可將該些 第，，及该些第二基板之間的空隙抽真空，而獲得多個 平整無氣泡及無皺褶之基板組。 、為使能更進-步瞭解本發明的特徵及技_容，請參 閱^下有關本發明的詳細說明與關，然而賴圖式僅提 供芬考與說_，並非时對本發明加以限制者。 7/24 201220986 【實施方式】 由於本發明所提供之基板壓合裝置及其壓合方法，可 廣泛運用於各種基板壓合，不限於後文所述之基板態樣。 請參閱第二圖至第六圖所示，本創作提供一種基板壓 合裝置1及其壓合方法；如第二圖所示，基板壓合裝置1 係^括—主體單元10、一輸送單元11、一上蓋單元12、一 ，膠單70 13、一抽真空單元14、一加溫單元15及一偵測 單7^ 口。輸送單元U係設置於主體單元1〇的底部’用於 輸达至少一第一基板2及至少一第二基板3至基板壓合裝 置1内’其中第一基板2及第二基板3係為正反交錯排列 於輸达單元Π上；上蓋單元12係對應設置於輸送單元11 之上方，上蓋單元]2設置至少一吸附元件121，吸附元件 係用以吸附第一基板2的銅箔層2〗，使第一基板2暫 τ地吸附於上盍單;^ 12 ;塗勝單元13係設置於主體單元 10 ’用於將一黏合膠131塗佈於第二基板3的散熱金屬層 ^表面，抽真空單元14係設置於主體單元〗0,在基板壓 合過程中’用以將第—基板2及該第二基板3之間的空隙 抽真空:加溫單元15係設置於主·體單元10，用以對第-基 板2及第一基板3進行加熱。藉由本發明之基板壓合裝置工 使第-基板2及第二基板3緊密黏合，形成__散熱金屬 d3,3l在内側而銅落層21，33顯露於外側的基板組。 以下將詳述本發明之具體實施例，如第三圖所示，主 =早元1G的底部凹設有—υ型槽18，上蓋單元12係對應 ;U型槽18 ’而輪送單元u之_端係可容置於^型槽 ，另一端則延伸出U型槽〗8之外。The plastic substrate comprises a steel riding, an insulating layer and a heat dissipating metal layer from top to bottom, and the second substrate is sequentially arranged from top to bottom - a heat dissipating metal layer: - an insulating layer and a heat dissipating metal layer Wherein, the second substrate is disposed under the first base (four); the glue is a __ type apron layer interposed between the first substrate and the third substrate, and the glued first substrate and the first one The substrate is bonded together. The invention has the following beneficial effects: - the upper cover unit of the substrate pressing device uses the vacuum suction force to the substrate (10) mi unit, so that the first substrate can obtain good positioning π due to vibration of the edge substrate pressing device The displacement is improved, so that the efficiency and quality of the first substrate and the second substrates can be improved. . The vacuuming unit of the substrate and the number of the vacuuming unit can vacuum the gap between the second and the second substrates to obtain a plurality of flat, bubble-free and wrinkle-free substrates group. In order to enable a more advanced understanding of the features and techniques of the present invention, please refer to the detailed description of the present invention. However, the Lai Figure only provides Fencao and _, and does not limit the present invention. . [Embodiment] The substrate press-fitting device and the press-fitting method thereof according to the present invention can be widely applied to various substrate press-bonding, and are not limited to the substrate aspect described later. Referring to the second to sixth figures, the present invention provides a substrate pressing device 1 and a pressing method thereof; as shown in the second figure, the substrate pressing device 1 includes a main body unit 10 and a conveying unit. 11. An upper cover unit 12, a plastic sheet 70 13 , a vacuum pumping unit 14, a warming unit 15 and a detecting unit 7 port. The transport unit U is disposed at the bottom of the main body unit 1 for transmitting at least one first substrate 2 and at least one second substrate 3 into the substrate pressing device 1 wherein the first substrate 2 and the second substrate 3 are The upper cover unit 12 is disposed above the transport unit 11 , and the upper cover unit 2 is provided with at least one adsorption element 121 for adsorbing the copper foil layer 2 of the first substrate 2 . The first substrate 2 is temporarily adsorbed on the upper substrate; the 12; the coating unit 13 is disposed on the main body unit 10' for applying an adhesive to the surface of the heat dissipation metal layer of the second substrate 3. The vacuuming unit 14 is disposed in the main body unit "0", and is used to evacuate the gap between the first substrate 2 and the second substrate 3 during the substrate pressing process: the heating unit 15 is disposed on the main body The unit 10 is for heating the first substrate 2 and the first substrate 3. The substrate-bonding apparatus of the present invention causes the first substrate 2 and the second substrate 3 to be in close contact with each other to form a substrate group in which the heat-dissipating metal d3, 31 is on the inner side and the copper falling layers 21, 33 are exposed on the outer side. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a specific embodiment of the present invention will be described in detail. As shown in the third figure, the bottom of the main = early element 1G is recessed with a υ-shaped groove 18, and the upper cover unit 12 is corresponding; the U-shaped groove 18' and the transfer unit u The end system can be placed in the ^-shaped slot, and the other end extends beyond the U-shaped slot.
輪达單7G 1】係可為具有彈性之滾輪結構，其容設於U 8/24 201220986 里抬18中亚向外延伸’輸送單元11可充當基板壓合時之 緩衝材4吏得壓力與溫度能平均地施加於第一基板2及第 一基板3’而維持第—基板2及第二基板3壓合之平整性， 避免抗曲艾形，從而使第一基板2及第二基板3平整地塵 緊貼合。 上盍單元12係對應U型槽18並設於輸送單元u之上 方，上蓋單元12的内面設置有至少一吸附元件121，吸附 几件.121係可為吸盤或氣吸結構，其數量及結構不在此做 _ 限制’ 0及附70件12】係用以吸附第一基板2的銅羯層21， Ϊί Γ基板2於上蓋單元12獲得良好的定位，不會因基板 壓合裝置1振動而移位，因此可提升第一基板2及第二基 板3壓合的效率及品質。由於上蓋單元12係對應於口型槽 =，因此藉由一連接於上蓋單元12及輸送單元η之動力 單70 16驅動上蓋單元12朝輸送單元11靠近，使上蓋單元 12與u型槽18密封而形成一密閉空間Μ。 塗膠單元13可設於U型槽18 —側，塗膠單元13係用 • 於將一黏合膠131以田字形均勻地塗佈於第二基板3的散 熱金屬層31表面的四周緣及中間部分，換言之，黏合膠 係可為以田字型塗佈於該第二基板之散熱金屬層表面的膠 圈層，具體來說，黏合膠131可為介於第一基板2及第二 基板3之間的田字型膠圈層，而可使第一基板2及第二基 板3上下黏合在一起。其中，第二基板3係藉由至少一設 置於上蓋單元12或主體單元底部之U型槽18的偵測單 兀Π，使第二基板3精確地定位於第一基板2的正下方。 由於第一基板2及第二基板3彼此間的精確定位，可避免 在後續第一基板2及第二基板3壓合過程中，黏合膠131 9/24 201220986 叉熱車人化後溢出滴下而沾污週邊 與基板之歸度，減讀機清叫持周邊環境 動作迅速，而能提升其黏合的效# 1 ，合 附加價值，進—步增進其競爭力與經^益。^產品的 抽真空早兀14可設於^^ 係用以將第一基板2及該第_ #真二早70 14 抽真空單以4亦可將上4=\3^_隙抽真空， 閉空間19抽真空形成直空狀能，而、型槽18所形成之密 該第二基板3壓合形成平後第-基板2及 加溫單元15可設之基板組° 以對第-基板2及第二基板3槽二:^^ 進熱’而使第一基板2 及第-基板3間之黏合膠121因受熱軟化 及第二基板3緊密穩固地黏合。 之弟基板2 以下將說明本發明之基板麈合方法，其包括以 ’請參閱第四圖至第六圖所示之連續作動示意圖；如第四 圖所不’首先步驟-為—備料步驟’其係主要提供至少一 第-基板2及至少-第二基板3;第—基板]係包括一銅络 層2卜一散熱金屬層23及置於㈣層21與散熱金屬層23 之間之-絕緣層22，而第二基板3則係包括—㈣層幻、 -散熱金屬層31及置於銅 33與散熱金屬層31之間之 一絕緣層32。 步驟一為一輸送步驟，其係利用一輸送單元將第一 基板2及第二基板3正反交錯地依序輸送至基板壓合裝置！ 内；其中，第一基板2係以銅箔層21在上方而散熱金屬層 23在下方的方式輸送至基板壓合袈置〗内，第二基板3則 相反地以散熱金屬層31在上方而散熱金屬層31在下方的 10/24 201220986 方式輸送至基板壓合裝置1内；最先輸送至基板壓合裝置j 内之第一基板2與第二基板3壓合後再輸送另一組第一基 板2與第二基板3至基板壓合裝置1内；其中，第一基板2 係包括一銅箔層21、一散熱金屬層23及置於銅箔層21與 散熱金屬層23之間之一絕緣層22,第二基板3係包括一銅 箔層33、一散熱金屬層31及置於銅箔層33與散熱金屬層 31之間之一絕緣層32。散熱金屬層23,31及絕緣層22,32 之結構不在此限制’於本具體實施例中，散熱金屬層23 31 鲁係可為鋁板、銅板或碳鋁合金板，而絕緣層22,32則係可為 樹酯、纖維布、填充物或至少兩種以上混合者，該填充物 係可為有機填充物或無機填充物，但不在此限。 步驟三為一吸附步驟，其係利用上蓋單元12内面之至 少一吸附元件121’將首先送入基板壓合装置丨之第一基板 2暫時地吸附定位於上蓋單元U，並利用上蓋單元】2二所 吸附之第一基板2上移至一預定高度。如第四圖所示，該 吸附步驟中，吸附元件121係可為吸盤或氣吸結構，但不 • 在此限制；上蓋單元12透過吸附元件121之真空吸力吸附 第一基板2之銅箔層21 ,使第一基板2吸附定位於上蓋單 元II。 步驟四為一定位步驟，如第五圖所示，該定位步驟係 將接著送入基板壓合裝置！之第二基板3精確地定位於吸 附於上蓋單兀11之第-基板2的正下方。該定位步驟係可 利用-偵測單元17積測第-基板2及接著送入基板麼合裝 之第二基板3的相對位置，使第二基板3精確地定位 ^第一基板2之正下方，其中偵測單元口係可設置於上蓋 單疋12或主體單元10。舉例來說，债測單元17係可藉由 11/24 201220986 影像擷取裝置捕咖像、視覺自㈣位或細預設於第二 基板3上之標定點或定錄/孔，使第二基板3精準地配置 於第-基板2的正下方，但該偵測單^ 17偵測定位第一基 板2及第一基板3的方式不在此限。 步驟五為-塗勝步驟’其係利用一塗膠單元】3將 131均勻地塗佈於第二基板3的散熱金屬層w表面。 如第=圖所示’該塗膠步驟中，塗膠單元13係將黏合勝⑶ 以田子形、四方形或其他形式均勻地塗佈於第二基板3的 散熱金屬層31表面的四周緣及中間部位，該塗佈的方 形狀不在此限。 久 步驟六為-壓合步驟，如第六圖所示，該壓合步驟包 括：下：步驟、一釋放步驟、一抽真空步驟及一加溫步驟 。該下壓步驟係使上蓋單幻2朝輸送單幻丨靠近； =系將暫時吸附於上蓋單元12的第一基板2釋放;使 :反2與第二基板3接觸；該抽真空步驟制用一抽 14將第—基板2及第二基板3接觸後之間的空隙 溫步驟係利用一加溫單元15將第一基板2及 第二加熱:使第-基板2及第二基板3穩固黏合。 驅動步t利用一連接於上蓋單元12之動力單元16 =上盖衫12朝輸鮮元„靠近，使上蓋單元12㈣ =8㈣而形成—密閉空間⑼接著該釋放步驟係利用 及附元件】21使暫時吸附於卜笔_ ，而使第一其柘？，：上盍早兀】2的第一基板2釋放 屬散熱金屬層23與第二基板3之散熱金 ，當第一基板2及第二基板3接觸後，該 ==除:將第:基板2及第二基板猶之間的 ,一二可將密閉空間19抽真空而形成真空狀態。 12/24 201220986 對第一基板2及第二基板3進行加熱，使 ^ 基板3的散熱金屬層31表面之黏合膠121因受 使第—基板2之散熱金屬層23及第二基板3之散 =屬層3丨彼此m穩固雜合，而形成—該散熱金 蜀曰在内側而該銅箔層顯露於外側的基板組。The wheel 7G 1] can be a flexible roller structure, which is accommodated in U 8/24 201220986 and is extended to the middle of Asia. The conveying unit 11 can serve as a cushioning material for the substrate to be pressed. The temperature can be uniformly applied to the first substrate 2 and the first substrate 3' to maintain the flatness of the first substrate 2 and the second substrate 3, and the resistance to the curved shape is avoided, thereby making the first substrate 2 and the second substrate 3 The dust is tightly fitted. The upper unit 12 is corresponding to the U-shaped groove 18 and is disposed above the conveying unit u. The inner surface of the upper cover unit 12 is provided with at least one adsorption element 121, and several parts are adsorbed. The 121 system can be a suction cup or a suction structure, and the number and structure thereof. Do not do this _ limit '0 and attach 70 pieces 12】 are used to adsorb the copper layer 21 of the first substrate 2, and the substrate 2 is well positioned in the upper cover unit 12 without being vibrated by the substrate pressing device 1 Since the displacement is performed, the efficiency and quality of the first substrate 2 and the second substrate 3 can be improved. Since the upper cover unit 12 corresponds to the mouth groove=, the upper cover unit 12 and the u-shaped groove 18 are sealed by driving the upper cover unit 12 toward the transport unit 11 by a power unit 70 16 connected to the upper cover unit 12 and the transport unit η. And form a confined space. The glue application unit 13 can be disposed on the side of the U-shaped groove 18, and the glue application unit 13 is used to uniformly apply an adhesive layer 131 in a square shape to the periphery and the middle of the surface of the heat dissipation metal layer 31 of the second substrate 3. In part, in other words, the adhesive glue may be a rubber ring layer coated on the surface of the heat dissipation metal layer of the second substrate in a field shape. Specifically, the adhesive glue 131 may be interposed between the first substrate 2 and the second substrate 3 . The first substrate 2 and the second substrate 3 can be bonded to each other up and down. The second substrate 3 is precisely positioned below the first substrate 2 by at least one detecting unit disposed on the U-shaped groove 18 of the upper cover unit 12 or the bottom of the main unit. Due to the precise positioning of the first substrate 2 and the second substrate 3, it is possible to prevent the adhesive film 131 9/24 201220986 from being melted and dripped after the first substrate 2 and the second substrate 3 are pressed. Staining the surrounding and the substrate, the reading machine clears the surrounding environment and moves quickly, and can improve the adhesion effect #1, add value, and further enhance its competitiveness and economic benefits. ^The vacuuming of the product can be set at ^^ to draw the vacuum from the first substrate 2 and the first _#真二早70 14 to 4 or the upper 4=\3^_ gap. The closed space 19 is evacuated to form a straight space, and the second substrate 3 formed by the groove 18 is pressed to form a flat substrate 1 and a substrate group which can be provided by the heating unit 15 to the first substrate. 2 and the second substrate 3, the groove 2: ^^ heats up, and the adhesive 121 between the first substrate 2 and the first substrate 3 is softened by heat and the second substrate 3 is tightly and firmly bonded. The substrate bonding method of the present invention will be described below, which includes a schematic diagram of the continuous operation shown in the fourth to sixth figures; if the fourth figure does not, the first step is the preparation step. The system mainly provides at least one first substrate 2 and at least a second substrate 3; the first substrate comprises a copper layer 2 and a heat dissipation metal layer 23 and is disposed between the (four) layer 21 and the heat dissipation metal layer 23 - The insulating layer 22, and the second substrate 3 includes a (four) layer of phantom, a heat dissipating metal layer 31 and an insulating layer 32 interposed between the copper 33 and the heat dissipating metal layer 31. Step 1 is a transport step of sequentially transporting the first substrate 2 and the second substrate 3 to the substrate pressing device in a staggered manner by a transport unit! The first substrate 2 is transported to the substrate press-fit device with the copper foil layer 21 on the upper side and the heat-dissipating metal layer 23 on the lower side, and the second substrate 3 is oppositely disposed on the heat-dissipating metal layer 31. The heat dissipation metal layer 31 is transported to the substrate pressing device 1 in the following 10/24 201220986 mode; the first substrate 2 and the second substrate 3 which are first transported into the substrate pressing device j are pressed together and then transported to another group. a substrate 2 and a second substrate 3 are connected to the substrate pressing device 1; wherein the first substrate 2 includes a copper foil layer 21, a heat dissipation metal layer 23, and a copper foil layer 21 and a heat dissipation metal layer 23; An insulating layer 22, the second substrate 3 includes a copper foil layer 33, a heat dissipation metal layer 31, and an insulating layer 32 interposed between the copper foil layer 33 and the heat dissipation metal layer 31. The structure of the heat dissipating metal layers 23, 31 and the insulating layers 22, 32 is not limited thereto. In the specific embodiment, the heat dissipating metal layer 23 31 may be an aluminum plate, a copper plate or a carbon aluminum alloy plate, and the insulating layers 22, 32 The resin may be a resin, a fiber cloth, a filler or a mixture of at least two or more, and the filler may be an organic filler or an inorganic filler, but is not limited thereto. Step 3 is an adsorption step in which the first substrate 2 first fed into the substrate pressing device is temporarily adsorbed and positioned on the upper cover unit U by using at least one adsorption element 121' on the inner surface of the upper cover unit 12, and the upper cover unit is used. The two adsorbed first substrates 2 are moved up to a predetermined height. As shown in the fourth figure, in the adsorption step, the adsorption element 121 can be a suction cup or a gas suction structure, but not limited thereto; the upper cover unit 12 adsorbs the copper foil layer of the first substrate 2 through the vacuum suction of the adsorption element 121. 21, the first substrate 2 is adsorbed and positioned on the upper cover unit II. Step 4 is a positioning step. As shown in the fifth figure, the positioning step is then sent to the substrate pressing device! The second substrate 3 is accurately positioned directly under the first substrate 2 adhered to the upper cover unit 11. The positioning step can use the detecting unit 17 to measure the relative positions of the first substrate 2 and the second substrate 3 which are then fed into the substrate, so that the second substrate 3 is accurately positioned directly below the first substrate 2. The detecting unit port can be disposed on the upper cover unit 12 or the main unit 10. For example, the debt measuring unit 17 can use the 11/24 201220986 image capturing device to capture the coffee image, visually (four) bits or finely preset the calibration point or the recording/hole on the second substrate 3 to make the second The substrate 3 is accurately disposed directly under the first substrate 2, but the manner in which the detecting unit 17 detects the positioning of the first substrate 2 and the first substrate 3 is not limited thereto. In the fifth step, the coating step is performed by uniformly coating the surface of the heat dissipation metal layer w of the second substrate 3 by a coating unit. As shown in the figure of Fig. 4, in the step of applying the glue, the glue unit 13 uniformly coats the periphery of the surface of the heat dissipation metal layer 31 of the second substrate 3 in a field shape, a square shape or the like. In the middle portion, the square shape of the coating is not limited thereto. The step 6 is a press-pressing step. As shown in the sixth figure, the pressing step includes: a lower step, a release step, a vacuum step, and a warming step. The pressing step is such that the upper cover is singularly 2 toward the transporting single illusion; the first substrate 2 temporarily adsorbed to the upper cover unit 12 is released; the reverse 2 is in contact with the second substrate 3; The step of warming between the first substrate 2 and the second substrate 3 by a pumping 14 is performed by using a heating unit 15 to heat the first substrate 2 and the second substrate: the first substrate 2 and the second substrate 3 are firmly bonded. . The driving step t is formed by using a power unit 16 connected to the upper cover unit 12 = the top cover 12 toward the fresh-keeping element „ close to the upper cover unit 12 (four) = 8 (four) - the closed space (9) is followed by the release step utilizing and attaching the component 21 Temporarily adsorbed to the pen _, and the first substrate 2 of the first 柘?, 上上盍2] releases the heat dissipation metal belonging to the heat dissipation metal layer 23 and the second substrate 3, when the first substrate 2 and the second substrate After the substrate 3 is in contact, the == division: the first substrate 2 and the second substrate can be vacuumed to form a vacuum state between the substrate 2 and the second substrate. 12/24 201220986 For the first substrate 2 and the second The substrate 3 is heated so that the adhesive 121 on the surface of the heat dissipation metal layer 31 of the substrate 3 is stabilized by the heat dissipation metal layer 23 of the first substrate 2 and the second layer 3 of the second substrate 3 Forming—the heat dissipation gold crucible is on the inner side and the copper foil layer is exposed on the outer substrate group.
…值得-提喊，步驟六中之該塵合步驟中，由於輸送 早本身即為-具有彈性的滾輪結構，故可充當緩衝材 =此當上盍單元12朝輸送單元u靠近，而使第一基板〕 ”第二基板3接觸後’第—基板2對第二基板3產生-向 下播壓的力量，進錢輸送單元11向下位移-輯，藉此 可使壓力與溫度能更為均勻地施加於第一基板2與第二基 板3 ’使第一基板2與第二基板3更平整地壓緊貼合在一起 Λ 良Τ、上所述，本發明之基板壓合方法係可透過上述各步 驟，藉由壓合之方式，使第一基板2及第二基板3壓合形 成一無氣泡及無皺褶之基板組，並藉由黏合膠121所提供 之黏著力，有效降低第一基板2及第二基板3受熱膨脹或 變形之幅度，並保持黏合之精準度，有利於後續該基板組 的加工製程。更具體的來說，上述之該基板組包括有第一 基板2、第二基板3及黏合膠131 ;其中，第一基板2由上 而下依序包括銅箔層21、絕緣層22及散熱金屬層23，第 二基板3由上而下依序包括散熱金屬層31、絕緣層32及銅 羯層33 ’而黏合膠πι可為介於該第一基板及該第二基板 之間的田字型膠圈層，使第一基板2及第二基板3上下黏 合在一起。 本發明之基板壓合方法製作出之基板組更可進行各種 13/24 201220986 加工步驟，例如： ⑷為1刻步驟’其係其係將彼此壓緊貼合之第 層21與第二基板3之銅荡層31上分別蝕 刻形成hi料料元24,3卜換言之 下兩面皆具有_電路單元24,31之基板組，如第乍:二第 囷斤示該基板組由上而下依序為姓刻電路單元24、絕 緣層22、散熱金屬層23、黏合膠⑶、散熱金屬層3卜絕 緣層32及蝕刻電路單元34。 ッ驟(B)為一防焊步驟，其係包括防焊前處理步驟以及 防焊網印步驟’換言之’將具有侧電路單元24,34之第-基板2及第一基板3進行防焊處理。 步驟(c)為—鑽孔步驟’其係將具有蝕刻電路單元24,34 之第一基板2及第二基板3進行鑽孔以形成電路導通孔。 由於第一基板2及第二基板3之散熱金屬層23,31四周 緣及中間部分緊密黏貼，散熱金屬層23,31不會裸露於外， 故可完全杜絕散熱金屬層23,31在蝕刻步驟中受到蝕刻液 的知餘’亦能夠同時製作出具有姓刻電路單元25,34之第一 基板2及第二基板3，大幅減少製成具有蝕刻電路單元之基 板所需花費的時間’使成本降低而更具有市場競爭力。 步驟(D)為一切除步驟’其係利用刀具(如銳刀）將未塗 有黏合膠(未標號)的四周邊緣部位沿著切除線26切除，使 第一基板2及第二基板3因失去互相黏合之力而順勢彼此 分開’而獲得兩片分別具有蝕刻電路單元24之第一基板2 及具有蝕刻電路單元34之第二基板3。 步驟(£)為一分割步驟，其係將第一基板2再沿著分割 線27分割而使蝕刻電路單元24進一步分割形成多個個別 14/24 201220986 的蝕刻電路模組25，如第九圖所示。 本發明基板壓合方法所製作出的基板組，由於係將具 有散熱金屬層23,31之第一基板2及第二基板3壓緊黏合， 在經過後續蝕刻、切除及分割步驟後，可獲得比習知壓合 裝置所得的基板數量多出一倍，故可有效節省每一基板的 製作成本。 最後可再將該些蝕刻電路模組25進行有機保焊製程 (Organic Solderability Preservative，OSP)，其係於該些個別 的蝕刻電路模組25施加防污液及保焊液，以維持該些個別 的蝕刻電路模組25之後儲存及運送組裝過程中良好的焊錫 性。 因此，本發明基板壓合裝置及其壓合方法具有以下之 優點： 1. 本毛明基板壓合裝置1的上盖单元12係利用真空吸力將 第一基板2吸附於上蓋單元12,故第一基板2可獲得良 好的定位，不會因基板壓合裝置1振動而移位，因此可 長:升第一基板2及第二基板3壓合的效率及品質。 2. 本發明基板壓合裝置1的輸送單元u係為—具有彈性之 滾輪結構，故輸送單元11可充當基板壓合時之緩衝材， 使得壓力與溫度能平均地施加於第一基板2及第二式板 3，故可維持第一基板2及第二基板3壓合之平整性，避 免撓曲變形’而使第一基板2及第二基板3平整地壓緊 貼合。 、 3. 本發明基板壓合裝置1的抽真空單元14於壓合時，可將 第一基板2及第二基板3之間的空隙及上蓋單元12與^ 型槽18所形成之密閉空間19抽真空，而獲得平整^氣 15/24 201220986 泡及無皺褶之基板组。 4. 本發明基板壓合方法，藉由—_單元17精較位第二 基板3及第-基板2，故於壓合過程中，可避免黏合膠 】31受熱軟化後溢出滴下而沾污週邊環境，故可保持周 邊環境與基板之乾淨度，減少停機清理的次數與時間， 同時黏合動作迅速，而能提升其黏合的效率與品質，故 提高產品_加價值’進—步增進其競爭力與經濟致益 〇 5. 本發明基板壓合方法所製作出絲板組，藉由將第一基 板2及第一基板3之散熱金屬層23，S1四周緣及中間部鲁 分對合黏貼，使散熱金制*會裸露於外，故可 完全杜絕散熱金屬層23,31在後續的钱刻步驟中受到蝕 刻液的侵#，亦能_時製作出具有㈣電路單元24,34 之f一基板2及第二基板3，大幅減少製成具有姓刻電 路單元之基板所需花費的時間，使成本降低而更具有市 場競爭力。 6. 本發明基板麼合方法所製作出的基板組，僅需將第—基 板2及第二基板3基板四周緣未形成蝕刻電路單元的部 _ 份經過切除，即可順勢分開，而無需額外加入分開兩具 有蝕刻電路單元之基板的步驟，故製程步驟簡易且省時 〇 7. 本發明基板壓合方法所製作出的基板組，由於係將具有 散熱金屬層23,31之第一基板2及第二基板3壓緊黏合 ’在經過後續蝕刻及切除步驟後，可獲得比習知壓合裝 置所得的基板數量多出一倍，故可有效節省每一基板的 製作成本。 16/24 201220986 發明堇之較佳實施例’非意欲侷限本 容所為的等效變：，均同;明書及圖式内 圍内，合予陳日2⑽心包含於本發_權利保護範 【圖式簡單說明】 第一圖為習知壓合裝置之組合示意圖； % 第一圖為本發明基板壓合裝置之組合示意圖； 第二圖為本發明基板壓合裝置之立體組合示意圖； 第四圖為本發明基板壓合裝置之連續作動示意圖（一）； 第五圖為本發明基板壓合裝置之連續作動示意圖（二）； 第/、圖為本發明基板壓合裝置之連續作動示意圖（三）； 第七圖為本發明基板壓合裝置製作出的基板組經蝕刻後的 剖面圖； 第八圖為本發明基板壓合裝置製作出的基板組經蝕刻後的 φ 示意圖；以及 第九圖為本發明基板壓合裝置製作出的基板組經切除後的 示意圖。 【主要元件符號說明】 【習知】 r壓合裝置 10’壓合部 】】’基座 銅箔層 17/24 201220986 13’金屬板 【本發明】 1基板壓合裝置 10 主體單元 11輸送單元 12上蓋單元 121 吸附元件 13 塗膠單元 131黏合膠 14抽真空單元 15 加溫單元 16動力單元 17偵測單元 18 U型槽 19 密閉空間 2第一基板 21銅箔層 22 絕緣層 23散熱金屬層 24蝕刻電路單元 25蝕刻電路模組 26切除線 27分割線 3第二基板 31散熱金屬層 32 絕緣層 201220986 33銅箔層 34 I虫刻電路單元 19/24...worthy-speaking, in the dust-mixing step in step 6, since the conveying itself is an elastic roller structure, it can act as a cushioning material=this is when the upper unit 12 approaches the conveying unit u, and After the second substrate 3 is in contact with the second substrate 3, the first substrate 2 generates a downward-pressing force on the second substrate 3, and the money feeding unit 11 is displaced downwardly, thereby making the pressure and temperature more Uniformly applied to the first substrate 2 and the second substrate 3 ′ to press the first substrate 2 and the second substrate 3 more smoothly and tightly together, the substrate pressing method of the present invention is Through the above steps, the first substrate 2 and the second substrate 3 are pressed together to form a bubble-free and wrinkle-free substrate group, and the adhesive force provided by the adhesive 121 is effectively reduced. The first substrate 2 and the second substrate 3 are subjected to thermal expansion or deformation, and the accuracy of bonding is maintained, which is advantageous for the subsequent processing of the substrate group. More specifically, the substrate group includes the first substrate 2 a second substrate 3 and an adhesive 131; wherein the first substrate 2 is composed of The second substrate 3 includes a heat dissipation metal layer 31, an insulation layer 32, and a copper layer 33' from top to bottom, and the adhesive is πι. The first type substrate 2 and the second substrate 3 are bonded to each other by the field-shaped apron layer between the first substrate and the second substrate. The substrate group produced by the substrate pressing method of the invention can be further Various 13/24 201220986 processing steps are performed, for example: (4) is a one-step step of etching the material layer 24 on the copper layer 31 of the first layer 21 and the second substrate 3 which are pressed against each other, respectively. In other words, in both cases, the substrate group of the circuit unit 24, 31 is provided on both sides, such as the second layer: the second substrate shows that the substrate group is sequentially named as the circuit unit 24, the insulating layer 22, and the heat dissipation metal layer. 23. Adhesive (3), heat-dissipating metal layer 3, insulating layer 32 and etching circuit unit 34. Step (B) is a solder resisting step, which includes a pre-weld processing step and a solder resist screen printing step, in other words, The first substrate 2 of the side circuit units 24, 34 and the first substrate 3 are solder-proofed. Step (c) is The drilling step 'which drills the first substrate 2 and the second substrate 3 having the etched circuit cells 24, 34 to form circuit via holes. The heat dissipation metal layers 23, 31 of the first substrate 2 and the second substrate 3 The peripheral edge and the middle portion are closely adhered, and the heat dissipation metal layers 23, 31 are not exposed, so that the heat dissipation metal layer 23, 31 can be completely obscured by the etching liquid in the etching step, and the circuit with the surname can be simultaneously fabricated. The first substrate 2 and the second substrate 3 of the cells 25, 34 greatly reduce the time required to manufacture the substrate having the etched circuit unit, which makes the cost lower and more competitive in the market. Step (D) is a cutting step' The utility model uses a cutter (such as a sharp knife) to cut the peripheral edge portion of the uncoated adhesive (not labeled) along the cutting line 26, so that the first substrate 2 and the second substrate 3 are separated from each other by the force of losing mutual adhesion. And two sheets of the first substrate 2 having the etching circuit unit 24 and the second substrate 3 having the etching circuit unit 34 are obtained. The step (£) is a dividing step of dividing the first substrate 2 along the dividing line 27 to further divide the etching circuit unit 24 into a plurality of individual 14/24 201220986 etching circuit modules 25, as shown in FIG. Shown. The substrate group produced by the substrate pressing method of the present invention is obtained by pressing and bonding the first substrate 2 and the second substrate 3 having the heat dissipation metal layers 23, 31, after subsequent etching, cutting and dividing steps. Compared with the number of substrates obtained by the conventional press-fit device, the number of substrates is doubled, so that the manufacturing cost per substrate can be effectively saved. Finally, the etched circuit module 25 can be subjected to an Organic Solderability Preservative (OSP), which is applied to the individual etched circuit modules 25 to apply an antifouling liquid and a solder resist to maintain the individual The etched circuit module 25 then stores and transports good solderability during assembly. Therefore, the substrate pressing device of the present invention and the pressing method thereof have the following advantages: 1. The upper cover unit 12 of the present capillary substrate pressing device 1 adsorbs the first substrate 2 to the upper cover unit 12 by vacuum suction, so Since the substrate 2 can be positioned well and is not displaced by the vibration of the substrate pressing device 1, it can be long: the efficiency and quality of the first substrate 2 and the second substrate 3 are increased. 2. The conveying unit u of the substrate pressing device 1 of the present invention is a roller structure having elasticity, so that the conveying unit 11 can serve as a cushioning material when the substrate is pressed, so that pressure and temperature can be equally applied to the first substrate 2 and Since the second plate 3 maintains the flatness of the first substrate 2 and the second substrate 3, the first substrate 2 and the second substrate 3 are pressed and adhered smoothly. 3. When the vacuuming unit 14 of the substrate pressing device 1 of the present invention is pressed, the gap between the first substrate 2 and the second substrate 3 and the sealed space formed by the upper cover unit 12 and the ^-shaped groove 18 can be formed. Vacuum was applied to obtain a substrate group that was flat and gas-free 15/24 201220986 foam and wrinkle-free. 4. In the substrate pressing method of the present invention, the second substrate 3 and the second substrate 2 are better aligned by the -17 unit, so that during the pressing process, the adhesive can be prevented from colliding and dripping under heat and softening. Environment, so it can maintain the cleanliness of the surrounding environment and the substrate, reduce the number and time of shutdown cleaning, and at the same time, the bonding action is rapid, and can improve the efficiency and quality of its bonding, so improve the product _ plus value to further enhance its competitiveness And the economic benefit 〇 5. The substrate assembly method of the present invention, the wire assembly is made by bonding the first substrate 2 and the first metal substrate 23, the heat dissipation metal layer 23, the outer edge of the S1 and the middle portion. The heat dissipation gold system* is exposed to the outside, so that the heat dissipation metal layer 23, 31 can be completely prevented from being invaded by the etching liquid in the subsequent money engraving step, and the (four) circuit unit 24, 34 can be fabricated. The substrate 2 and the second substrate 3 greatly reduce the time required to manufacture a substrate having a circuit unit having a surname, thereby reducing the cost and making it more competitive in the market. 6. The substrate set produced by the method of the substrate of the present invention can be separated only by cutting off the portions of the substrate on which the first substrate 2 and the second substrate 3 are not formed with the etching circuit unit, without additional The step of separating the two substrates having the etched circuit unit is added, so that the process step is simple and time-saving. 7. The substrate set produced by the substrate pressing method of the present invention is a first substrate 2 having a heat-dissipating metal layer 23, 31. And the second substrate 3 is pressed and bonded. After the subsequent etching and cutting steps, the number of substrates obtained by the conventional pressing device can be doubled, so that the manufacturing cost of each substrate can be effectively saved. 16/24 201220986 The preferred embodiment of the invention is not intended to limit the equivalent changes of the content: the same; in the inner circumference of the book and the drawings, the combination of Chen Ri 2 (10) is included in the present issue. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a schematic view of the combination of the conventional press-fit device; the first figure is a schematic view of the combination of the substrate press-fit device of the present invention; FIG. 4 is a schematic view showing the continuous operation of the substrate pressing device of the present invention; FIG. 5 is a schematic view showing the continuous operation of the substrate pressing device of the present invention; (2); (3) FIG. 7 is a cross-sectional view of the substrate group prepared by the substrate pressing device of the present invention after etching; FIG. 8 is a schematic view showing the φ of the substrate group fabricated by the substrate pressing device of the present invention; FIG. 9 is a schematic view showing the substrate group produced by the substrate pressing device of the present invention after being cut. [Explanation of main component symbols] [Practical] r press-fit device 10' nip part]] pedestal copper foil layer 17/24 201220986 13' metal plate [present invention] 1 substrate press-fit device 10 main unit 11 transport unit 12 Upper cover unit 121 Adsorption element 13 Gluing unit 131 Adhesive 14 Vacuuming unit 15 Warming unit 16 Power unit 17 Detection unit 18 U-shaped groove 19 Confined space 2 First substrate 21 Copper foil layer 22 Insulation layer 23 Heat dissipation metal layer 24 etching circuit unit 25 etching circuit module 26 cutting line 27 dividing line 3 second substrate 31 heat dissipation metal layer 32 insulating layer 201220986 33 copper foil layer 34 I insect circuit unit 19/24