TW201214900A - Automatic Soldering Device and Soldering Method thereof - Google Patents

Automatic Soldering Device and Soldering Method thereof Download PDF

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Publication number
TW201214900A
TW201214900A TW99131602A TW99131602A TW201214900A TW 201214900 A TW201214900 A TW 201214900A TW 99131602 A TW99131602 A TW 99131602A TW 99131602 A TW99131602 A TW 99131602A TW 201214900 A TW201214900 A TW 201214900A
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Taiwan
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component
electronic component
tin
soldering
head
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TW99131602A
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Chinese (zh)
Inventor
Ji-Dong Tian
Xiao-Lin Wu
Sung-Lin Chen
shao-bo Zhang
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Cheng Uei Prec Ind Co Ltd
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Priority to TW99131602A priority Critical patent/TW201214900A/en
Publication of TW201214900A publication Critical patent/TW201214900A/en

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Abstract

The present invention provides An Automatic Soldering Device And Soldering Method, Soldering Method Including the following step: S1, Locate the welds the part and electronic component with the welding material; S2, Actuates the hotbar first moving, until the hotbar contact welds the part, S3, Uses the hotbar heating welding material; S4, After welding material on electronic component's has melted, actuates the hotbar to second move to Compressing melting welding material, causes fusinon of welds the part and the soldering part on the electronic component. When carry on the welding work using the present invention Automatic Soldering Device And Soldering Method, we can control the moving schedule of the hotbar. the welding material distort after melt, Thus we can avoids damage because of impulsive force of the hotbar's quickly moving.

Description

201214900 六、發明說明: 【發明所屬之技術領域】 本發明涉及一種焊錫技術,特別是涉及一種自動焊接設備 及該自動焊接設備的焊接方法。 【先前技術】 按,習知的焊接設備一般包括由機座、作為驅動單元的氣 缸及熱壓頭所組成。利用該焊接設備藉由焊錫焊接兩電子元件 時,為了焊接牢固,在加熱焊錫前,一般利用氣缸產生的沖擊 力一次性地藉由熱壓頭及其中一電子元件擠壓焊錫,使焊錫產 生一定程度的變形。 惟,上述之習知焊接設備在進行焊錫作業時,利用氣缸的 沖擊力使焊錫產生變形時,容易壓壞其中一電子元件。 【發明内容】 本發明之目的係針對上述習知技術之不足提供一種可避 免壓壞其中一電子元件的自動焊接設備及其焊接方法。 為達成上述目的,本發明提供一種自動焊接設備,該自動 焊接設備包括一機座、一驅動單元、一熱壓頭及一控制裝置。 驅動單元裝設於機座上,該驅動單元包括一步進馬達和與步進 馬達連接的絲桿傳動機構,該絲桿傳動機構包括受步進馬達驅 動的絲桿和受絲桿驅動的滑塊。熱壓頭固定裝設於滑塊上。控 制裝置與步進馬達電連接,用以控制步進馬達工作,以帶動滑 塊上之熱壓頭步進式移動。 為達成上述目的,本發明提供一種自動焊接設備的焊接方 法,包括如下步驟: si,將待焊元件及設有錫料的電子元件定位; S2,驅動熱壓頭第一次移動,直至熱壓頭接觸待焊元件; 201214900 S3,利用熱壓頭加熱錫料; S4,待電子元件上的錫料熔化後,再驅動熱壓頭第二次移 動以擠壓熔化的錫料,使待焊元件和電子元件上之焊接部分的 錫料熔接,從而實現待焊元件與電子元件藉由錫料充分接合。 如上所述,利用本發明自動焊接設備及其焊接方法進行焊 接作業時,可控制熱壓頭的行程,在錫料熔化後再使其變形, 從而可避免對待焊元件產生沖擊,避免壓壞待焊元件。 【實施方式】 為詳細說明本發明之技術内容、構造特徵及其所達成之目 的與功效,以下茲例舉實施例並配合圖式詳予說明。 請參閱第三圖至第五圖,本發明之自動焊接設備包括一控 制裝置(圖中未標示)、一機座10、裝設於機座10上的一驅動 單元12、一夾持單元14及一熱壓頭16。驅動單元12包括一 固設於機座10上的固定座120、一步進馬達121、一連軸器125 和與步進馬達121連接的絲桿傳動機構,該絲桿傳動機構包括 受步進馬達121驅動的絲桿123和受絲桿123驅動的滑塊 124。固定座120上設有導執1200,步進馬達121設置於固定 座120上方,且絲桿123係以連軸器125軸接於步進馬達121 下方。滑塊124套裝於絲桿123上並可隨絲桿123的轉動而沿 導軌1200移動。夾持單元14包括一載114卜定位於載蓋_141 上的一夾具142以及可驅動載1141左右移動的調位裝置 143,載^141上於夾具142前方還設置有可對夾具142前後 位置調整的調整裝置144。 熱壓頭16固定裝設於滑塊124上。控制裝置與步進馬達 121電連接,用以控制步進馬達121工作,以帶動絲桿123旋 轉,從而帶動滑塊124上之熱壓頭16步進式向下移動。 201214900 J碩16上還設有-與控制裝置電連接的溫度感應器(圖 未不),溫度感應器量測並將熱屢頭的溫度即時反饋給控制裝 置,由控制裝置調整熱壓頭16的即時溫度為最佳溫度值 保證焊接質量。 請參閱第一圖至第二圖,一種利用本發明自動焊接設備的 焊接方法,包括如下步驟: 51 ’將待焊元件A及設有錫料B的電子定位 52 ’驅動熱壓頭16第―次移動,直至熱壓頭觸 元件A; *啁付坏 S3,利用熱壓頭16加熱錫料丑; Μ,待電子元件A上的簡B熔化後,再_熱壓頭μ 第二次移動以擠㈣化⑽料B,使待焊元件A和電子元件c 上之焊接部分的錫料B祕,從而實現待焊元件A與電子 C藉由踢料b充分接合。 請續參閱第三圖至第五圖,在上述焊接方法中,熱壓頭Μ 藉由一步進馬4⑵和與步進馬達121連接的絲桿傳動機構 123驅動而移動。且熱壓頭16的溫度藉由溫度感應器量測並即 夺反饋、控制裝置,並由控制裝置調整熱麼頭Μ的即時溫 度為最佳溫度值,以保證焊接質量。 ▲ 績參’’、、第二圖至第五圖所示,本發明自動焊接設備工作 前’先將-電子元件c固定於夾具142上,再將夾具142定位 於載。M1上。藉由夾持單元Μ之調位裝置142調整載台141 右位置’使載台141上之夹y 42内的電子元件C的焊接 部分在左右方向和上方的熱壓頭16對準,並通過調整裝置⑷ 周整載° 141上之夾具142的前後位置,使電子元件C的焊接 部分在前後方向和上方的熱壓頭16對準。然後即可用上 接方法之步驟進行焊接,即: 201214900 S卜將待焊元件A及設有錫料B的電 具⑷上,並將夾具142置於熱遷頭16的下方並定:立於夹 在本實施财,待焊元件A為線纜,錫料, 一的錫絲,經多次試驗後得出, :: 距離取0.4mm最佳。 弟一-人移動的 元件I2;’驅動熱壓頭16第—次移動,直至熱壓頭16接觸待焊 溫度升高以加熱錫絲; ’再驅動熱壓頭16第 A和電子元件C上之 A與電子元件C的接 S3 ’控制裝置發出指令使熱壓頭工6 S4,待電子元件c上的錫絲熔化後201214900 VI. Description of the Invention: [Technical Field] The present invention relates to a soldering technique, and more particularly to an automatic soldering apparatus and a soldering method of the same. [Prior Art] Conventional welding equipment generally comprises a machine base, a cylinder as a drive unit, and a thermal head. When the two electronic components are soldered by soldering using the soldering device, in order to solder firmly, before the solder is heated, the impact force generated by the cylinder is generally used to squeeze the solder by the thermal head and one of the electronic components at one time, so that the solder is generated. Degree of deformation. However, in the above-mentioned conventional welding equipment, when the solder is deformed by the impact force of the cylinder during the soldering operation, it is easy to crush one of the electronic components. SUMMARY OF THE INVENTION An object of the present invention is to provide an automatic welding apparatus and a welding method thereof that can prevent crushing of one of the electronic components in view of the above-described deficiencies of the prior art. To achieve the above object, the present invention provides an automatic welding apparatus including a machine base, a drive unit, a thermal head and a control device. The driving unit is mounted on the base, the driving unit comprises a stepping motor and a screw drive mechanism connected to the stepping motor, the screw drive mechanism comprises a screw driven by the stepping motor and a slider driven by the lead screw . The thermal head is fixedly mounted on the slider. The control device is electrically connected to the stepping motor for controlling the operation of the stepping motor to drive the stepping movement of the thermal head on the slider. In order to achieve the above object, the present invention provides a soldering method for an automatic soldering apparatus, comprising the steps of: si, positioning an element to be soldered and an electronic component provided with a tin material; S2, driving the thermal head to move for the first time until hot pressing The head contacts the component to be welded; 201214900 S3, the solder is heated by the hot head; S4, after the tin on the electronic component is melted, the second step of the hot head is driven to squeeze the molten tin to make the component to be welded The solder is soldered to the soldered portion of the electronic component, thereby achieving sufficient bonding of the component to be soldered to the electronic component by solder. As described above, when the welding operation is performed by the automatic welding apparatus of the present invention and the welding method thereof, the stroke of the thermal head can be controlled, and the tin material is deformed after being melted, thereby avoiding impact on the member to be welded and avoiding crushing. Welding components. [Embodiment] In order to explain the technical contents, structural features, and the objects and effects of the present invention in detail, the embodiments will be described in detail below with reference to the drawings. Referring to the third to fifth figures, the automatic welding apparatus of the present invention comprises a control device (not shown), a base 10, a drive unit 12 mounted on the base 10, and a clamping unit 14. And a thermal head 16. The driving unit 12 includes a fixing base 120 fixed on the base 10, a stepping motor 121, a coupling 125 and a screw drive mechanism connected to the stepping motor 121. The screw transmission mechanism includes a stepping motor 121. The driven screw 123 and the slider 124 driven by the screw 123. A guide 1200 is disposed on the fixed base 120. The stepping motor 121 is disposed above the fixed base 120, and the lead screw 123 is axially coupled to the stepping motor 121 by the coupling 125. The slider 124 is fitted over the lead screw 123 and is movable along the guide rail 1200 as the screw 123 rotates. The clamping unit 14 includes a clamping device 142 positioned on the loading cover 141 and a positioning device 143 for driving the driving device 1141 to move left and right. The loading device 141 is further disposed in front of the clamping device 142 to position the front and rear of the clamping member 142. Adjusted adjustment device 144. The thermal head 16 is fixedly mounted on the slider 124. The control device is electrically connected to the stepping motor 121 for controlling the operation of the stepping motor 121 to drive the screw 123 to rotate, thereby driving the thermal head 16 on the slider 124 to move stepwise downward. 201214900 J Shuo 16 also has a temperature sensor electrically connected to the control device (not shown), the temperature sensor measures and the temperature of the hot head is immediately fed back to the control device, and the thermal head 16 is adjusted by the control device. The instantaneous temperature is the optimum temperature value to ensure the quality of the weld. Referring to the first to second figures, a welding method using the automatic welding apparatus of the present invention comprises the following steps: 51 'Electrical positioning of the component A to be soldered and the soldering material 52' is driven by the thermal head 16 - Moves until the hot head contact element A; * 啁 坏 S S3, using the hot head 16 to heat the ugly material; Μ, after the simple B on the electronic component A is melted, then the _ hot head μ second move By extruding (4) material B, the solder material B of the soldered portion on the component A to be soldered and the electronic component c is secreted, thereby achieving sufficient bonding of the component to be soldered A and the electron C by the kick b. Referring to the third to fifth figures, in the above welding method, the thermal head 移动 is moved by a stepping horse 4 (2) and a screw drive mechanism 123 connected to the stepping motor 121. Moreover, the temperature of the thermal head 16 is measured by the temperature sensor and the feedback device is controlled, and the instantaneous temperature of the thermal head is adjusted by the control device to the optimum temperature value to ensure the welding quality. ▲ The results are shown in the '', and the second to fifth figures, before the automatic welding equipment of the present invention is operated, the electronic component c is fixed on the jig 142, and the jig 142 is positioned on the load. On M1. By adjusting the right position of the stage 141 by the positioning unit 142 of the clamping unit ', the welded portion of the electronic component C in the clip y 42 on the stage 141 is aligned in the left and right direction and above the thermal head 16 and passed. The adjusting device (4) circumferentially positions the front and rear positions of the jig 142 on the 141, so that the welded portion of the electronic component C is aligned in the front-rear direction and the upper thermal head 16. Then, the welding can be performed by the step of the upper connection method, that is: 201214900 S will be to be welded to the component A and the electric appliance (4) provided with the tin material B, and the clamp 142 is placed under the heat transfer head 16 and set: Sandwiched in this implementation, the component A to be soldered is a cable, tin, and a tin wire. After many tests, the following: :: The distance is 0.4mm. Brother-man moving component I2; 'drives the thermal head 16 to move first until the thermal head 16 contacts the temperature to be soldered to heat the tin wire; 're-drives the thermal head 16 on the A and the electronic component C The connection between the A and the electronic component C S3 'control device issues an instruction to the hot header 6 S4, after the tin wire on the electronic component c is melted

二次移動以擠壓熔化的錫絲,使待焊元件 焊接部分的錫絲熔接,從而實現待焊元件 合; 、16、_元件A及設有錫料B的電子 c降溫’然:後控制裝置控制驅動單元12驅動熱壓頭向上 動,以離開待焊元件A及電子元件C,即完成待焊元件八 子元件C的焊接。 电 在整個焊接過程中,溫度感應器感應熱壓頭16的溫度並 即時反饋給控制裝置,並由控制裝置調整熱壓帛16的即時溫 度為最佳溫度值,以確保焊錫品質。 恤 綜上所述,利用本發明自動焊接設備及其焊接方法進行焊 接作業時,可控制熱_ 16的行程,在錫料B㈣後再使其 變形從而可避免對待焊元件A產生沖擊,避免壓壞待焊元 A。 【圖式簡單說明】 第圖係本發明焊接方法之熱壓頭第一次移動至接觸待 焊元件時的示意圖。 201214900 第二圖係本發明焊接方法之錫料熔化後熱壓頭第二次移 動以擠壓熔化的錫絲,以焊接待焊元件和電子元件的示意圖。 第三圖係本發明自動焊接設備的部分立體圖。 第四圖係第三圖所示自動焊接設備的驅動單元的立體分 解圖。 第五圖係第三圖所示自動焊接設備的夾持單元的立體圖。 【主要元件符號說明】 待焊元件 A 錫料 B 電子元件 C 機座 10 驅動單元 12 固定座 120 導軌 1200 步進馬達 121 絲桿 123 滑塊 124 連軸器 125 夾持單元 14 載台 141 夾具 142 調位裝置 143 調整裝置 144 熱壓頭 16 8The second movement is to squeeze the melted tin wire, and the tin wire of the welded portion of the component to be welded is welded, thereby realizing the component to be welded; 16, 16, the component A, and the electron c with the tin material B are cooled. The device control driving unit 12 drives the thermal head to move upward to leave the component A to be soldered and the electronic component C, that is, to complete the soldering of the component to be soldered. Electricity Throughout the welding process, the temperature sensor senses the temperature of the thermal head 16 and feeds it back to the control unit, and the control unit adjusts the instantaneous temperature of the hot press 为 16 to the optimum temperature to ensure solder quality. In view of the above, when the welding operation is performed by the automatic welding device and the welding method thereof, the stroke of the heat _ 16 can be controlled, and then deformed after the solder material B (four), thereby avoiding the impact on the welding element A and avoiding the pressure. Bad to weld A. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing the first time when the thermal head of the welding method of the present invention is moved to contact a member to be welded. 201214900 The second figure is a schematic diagram of the second movement of the thermal head after the melting of the soldering method of the present invention to extrude the molten tin wire to weld the component to be soldered and the electronic component. The third figure is a partial perspective view of the automatic welding apparatus of the present invention. The fourth figure is a perspective exploded view of the drive unit of the automatic welding apparatus shown in the third figure. Figure 5 is a perspective view of the clamping unit of the automatic welding apparatus shown in the third figure. [Main component symbol description] Component to be soldered A Solder B Electronic component C Base 10 Drive unit 12 Mounting bracket 120 Guide rail 1200 Stepper motor 121 Lead screw 123 Slider 124 Coupling 125 Clamping unit 14 Stage 141 Fixture 142 Positioning device 143 adjustment device 144 thermal head 16 8

Claims (1)

201214900 七、申請專利範圍: 種自動焊接設備,包括: 一機座; 。,驅動單凡,裝設於機座上,該驅動單元包括一步進馬達 矛與步進馬達連接的絲桿傳動機構,麟 進馬達驅動的絲桿和受轉㈣㈣塊; 一熱壓頭’固定裝設於滑塊上;及201214900 VII. Patent application scope: A kind of automatic welding equipment, including: a machine base; The drive unit is mounted on the base, the drive unit includes a stepper motor spear and a stepper motor connected to the screw drive mechanism, the lead motor driven screw and the rotated (four) (four) block; a thermal head 'fixed Mounted on the slider; and :控制裝置,與步進馬達電連接,用以控制步進馬達工 ,以帶動滑塊上之熱壓頭步進式移動。 如申/月專利圍帛1項所述之自動焊接設備,其中還包 且、,持單疋,該夾持單元包括一載臺'定位於載臺上的夾 ::驅動載臺左右移動的調位裝置以及設置於載臺上的可 夹具前後位置調整的調整裝置。 孰塵3ΓΛ請專利範圍第1項所述之自動焊接設備,其中所述 頭上還設有—與控制裝置電連接的溫度感應器。 4·-種自動焊接設備的焊接枝,包括如下步驟: si ’將待;^元件及設有錫科的電子元件定位; ^驅動Μ頭第-次移動,直至熱朗接觸待谭元件; S3 ’利用熱壓頭加熱錫料; 待電子70件上的錫料^^化後,再驅動㈣頭第二次移 熔化的錫料,使待谭元件和電子元件上之輝接部分的 Γ 從而實現料元件與電子元件關㈣料充分接 〇 0 2申請專利範圍第4項所述之自動谭接 接方 傳動機構驅動而移動。》進馬達和與步進馬達連接的絲桿The control device is electrically connected to the stepping motor for controlling the stepping motor to drive the stepping movement of the hot head on the slider. For example, the automatic welding equipment described in claim 1 of the Japanese Patent Application Laid-Open Publication No. 1 is also included in the present invention. The clamping unit includes a carrier's clip positioned on the stage: driving the stage to move left and right. The positioning device and the adjusting device for adjusting the front and rear position of the clamp on the stage. The automatic welding device of the first aspect of the invention, wherein the head is further provided with a temperature sensor electrically connected to the control device. 4·- welding branch of automatic welding equipment, including the following steps: si 'will be; ^ component and electronic components with tin group positioning; ^ drive the first movement of the hammer until the hot contact with the tan component; S3 'Using a hot indenter to heat the tin; after the tin on the 70 pieces of electrons is turned on, the second (four) head is moved to melt the tin for the second time, so that the fused portion of the tan component and the electronic component is thereby The material element and the electronic component are connected to each other (4), and the automatic tandem joint transmission mechanism described in item 4 of the patent application scope is driven to move. 》Into the motor and the screw connected to the stepper motor
TW99131602A 2010-09-17 2010-09-17 Automatic Soldering Device and Soldering Method thereof TW201214900A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115283778A (en) * 2022-10-09 2022-11-04 靖江天元爱尔瑞电子科技有限公司 Welding device for surface mounting of flexible circuit board
CN117483897A (en) * 2023-12-29 2024-02-02 常州华振电子科技有限公司 Full-automatic soldering device suitable for processing of multiple types of circuit boards

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115283778A (en) * 2022-10-09 2022-11-04 靖江天元爱尔瑞电子科技有限公司 Welding device for surface mounting of flexible circuit board
CN115283778B (en) * 2022-10-09 2023-01-10 靖江天元爱尔瑞电子科技有限公司 Welding device for surface mounting of flexible circuit board
CN117483897A (en) * 2023-12-29 2024-02-02 常州华振电子科技有限公司 Full-automatic soldering device suitable for processing of multiple types of circuit boards
CN117483897B (en) * 2023-12-29 2024-03-19 常州华振电子科技有限公司 Full-automatic soldering device suitable for processing of multiple types of circuit boards

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