201214779 六、發明說明： 【發明所屬之技術領域】 [0001]本發明涉及一種發光裝置及發光衣置的製造方沐 π，尤其 涉及一種以半導體發光元件作為光源的發光骏置A 、 1及其製 造方法。 [先前技術] [0002] 習知的發光裝置一般有發光二極體模組或單個的發先 桠體 極體（Light Emitting Diode，1^1))等。發先 〜 模組的製作通常是基於能夠承載發光二極體同晦 Ο 呵'為發光 二極體提供電力的印刷電路板。一般的印刷電政 扳的防 焊漆有各種顏色之選擇，而現有的運用於發先- 〜極趙镇 ' 組中的印刷電路板均採用白色的防焊漆，旨在増如 、 二極體的反射亮度。然而該亮度反射僅有7至8戍養先 Λβ 〇Jb 導致必須增加發光二極體的數量以使該發光-k 的亮度違到所需要求。 [0003]201214779 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to a light-emitting device and a manufacturing method for a light-emitting device, and more particularly to a light-emitting device A, 1 and a semiconductor light-emitting device as a light source Production method. [Prior Art] [0002] A conventional light-emitting device generally has a light-emitting diode module or a single light-emitting diode (Light Emitting Diode) (1). The production of the module ~ is usually based on a printed circuit board capable of carrying the light-emitting diodes and providing power to the light-emitting diodes. The general printed electro-technical anti-welding paint has a variety of color choices, and the existing printed circuit boards used in the first-~Jiao Zhaozhen group are all made of white anti-welding paint, aiming at the two poles. The reflected brightness of the body. However, the brightness reflection is only 7 to 8 戍 Λβ 〇 Jb, resulting in the necessity to increase the number of light-emitting diodes so that the brightness of the luminescence-k violates the required requirements. [0003]
白色塑膠作為 從而對先進行 光二槌體的亮 同樣，發光二極體在封裝制程上也是採用 光反射層或者參反射面上電锻金屬材質， 反射’然而此反射率也很低，致使單個發 度不高。 【發明内容】 [0004] 有鑒於此，有必要提供一種增強光反射效率的發光裝置 及其製造方法。 [0005] —種發光裝置’包括發光元件以及設置於發光元件週邊 的反射層’所述反射層的反射材質為鏡面油墨。 099132993 表單編號A0101 第3頁/共16頁 0992057725-0 201214779 [0006] 一種發光裝置的製造方法，包括以下步驟： [0007] 提供一個透明基體與鏡面油墨； [0008] 將鏡面油墨攪拌均勻，並將鏡面油墨塗布在透明基體上 7 [0009] 使鏡面油墨乾燥、固化，得到與透明基體緊貼的鏡面層 以及與該鏡面層相對的霧面層； [0010] 對透明基體進行機械加工，得到所需形狀的反射層；及 [0011] 將反射層的霧面層黏貼在發光裝置的預設表面上。 [0012] 採用鏡面油墨作為反射材質在反射面形成鏡面或電鍍效 果，由此可使反射率達9成以上，對於發光裝置可以減少 發光二極體使用的數量，同時減少其功率及能耗。 [0013] 下面參照附圖，結合具體實施例對本發明作進一步的描 述。 【實施方式】 [0014] 圖1為本發明一實施例的發光裝置結構的剖面示意圖。該 發光裝置為發光二極體模組10。該發光二極體模組10包 括印刷電路板11，安裝於印刷電路板11上並與其電連接 的至少一發光二極體12，以及設置於該至少一發光二極 體12週邊的反射層13。 [0015] 該印刷電路板11上表面鋪設了一層反射層13，該反射層 13包括一透明基體14以及與該透明基體14緊貼的反射材 質1 5，並以此反射層1 3作為印刷電路板11的防焊漆代替 原有白色防焊漆。該反射材質15採用鏡面油墨材料。該 099132993 表單編號A0101 第4頁/共16頁 0992057725-0 201214779 鏡面油墨光線反射力強，可達95%或以上，光線射在， 射材質15上，經其發射後仍能達到接近原有亮度由^反 增強了該發光二極體模組1〇的整體亮度，同時可減少發 光二極體12的數量’降低功率和能耗1鏡面油墨具有 不導電、不氧化並且防焊的物理特性，其防焊特性表現 在該鏡面油墨乾燥後不與其他物質結合從而保護銅線， 同時也防止在對發光二極體12進行電連接的過程中將發 光二極體12焊接到不正確的地方。該鏡面油墨符合漆材The white plastic is used as the light-emitting diode first. The light-emitting diode is also made of a light-reflecting layer or a reflective surface on the reflective surface. The reflection is also low, resulting in a single hair. Not too high. SUMMARY OF THE INVENTION [0004] In view of the above, it is necessary to provide a light-emitting device that enhances light reflection efficiency and a method of fabricating the same. A light-emitting device 'includes a light-emitting element and a reflective layer disposed around the light-emitting element'. The reflective material of the reflective layer is a mirror ink. 099132993 Form No. A0101 Page 3 of 16 0992057725-0 201214779 [0006] A method of manufacturing a light-emitting device, comprising the steps of: [0007] providing a transparent substrate and a mirror ink; [0008] stirring the mirror ink uniformly, and Coating the mirror ink on the transparent substrate 7 [0009] drying and solidifying the mirror ink to obtain a mirror layer that is in close contact with the transparent substrate and a matte layer opposite to the mirror layer; [0010] mechanically processing the transparent substrate a reflective layer of a desired shape; and [0011] adhering the matte layer of the reflective layer to a predetermined surface of the light emitting device. [0012] The mirror ink is used as the reflective material to form a mirror surface or a plating effect on the reflecting surface, thereby achieving a reflectance of more than 90%, and the number of the light-emitting diodes can be reduced for the light-emitting device while reducing the power and energy consumption thereof. The invention will now be further described with reference to the specific embodiments thereof with reference to the accompanying drawings. Embodiments [0014] FIG. 1 is a cross-sectional view showing the structure of a light-emitting device according to an embodiment of the present invention. The light emitting device is a light emitting diode module 10. The LED module 10 includes a printed circuit board 11 , at least one LED body 12 mounted on the printed circuit board 11 and electrically connected thereto, and a reflective layer 13 disposed on the periphery of the at least one LED body 12 . . [0015] A reflective layer 13 is disposed on the upper surface of the printed circuit board 11. The reflective layer 13 includes a transparent substrate 14 and a reflective material 15 that is in close contact with the transparent substrate 14. The reflective layer 13 is used as a printed circuit. The solder resist of the board 11 replaces the original white solder resist. The reflective material 15 is made of a mirror ink material. The 099132993 Form No. A0101 Page 4 / Total 16 Page 0992057725-0 201214779 The mirror ink has a strong light reflection force of 95% or more. The light is incident on the material 15 and can still reach the original brightness after being emitted. The overall brightness of the light-emitting diode module 1〇 is enhanced by the reverse, and the number of the light-emitting diodes 12 can be reduced. 'Reducing power and energy consumption 1 The mirror ink has physical properties of non-conductivity, non-oxidation and solder resistance. The solder resist characteristic is that the mirror ink is not combined with other substances after drying to protect the copper wire, and also prevents the light-emitting diode 12 from being soldered to an incorrect place during the electrical connection of the light-emitting diode 12. The mirror ink meets the paint
的各項檢驗，如通過高溫高濕、冷熱循環、附著力等實 驗檢測。該鏡面油墨能夠在-40°C至l〇〇°c的工作環境下 連續7天不變質，能夠在28-0°C的高溫下逄續30秒至丨分鐘 不變質，耐水性至少達IPX6以上’無毒性和低鹵性符合 歐盟R 0 S Η指令要求。該鏡面油墨的附著力可達到耐附著 力實驗5Β標準’指甲刮不掉，同時耐3Μ賸帶，並且能夠 附著於任何軟性或硬性物體上。在本實施例中，該印刷 電路板11為平板狀，當然在其他實施例中，該印刷電路 板11也可為其他形狀，而其反射層13上塗布的反射材質 15也可隨之而做相應的改變。 [0016] 該至少一發光二極體12安裝在前述印刷電路板11上，為 該發光二極體模組10的發光元件，並與印刷電路板11電 性連接。 [0017] 當該至少一發光二極體12點亮時，光線射向反射層13並 經由該反射層13反射，反射率達95%或以上，也即反射出 的光線可達原光線的95%或以上。 [0018] 圖2示出了本發明另一實施例的發光裝置結構的剖面示意 099132993 表單編號 Α01〇ι 第 5 頁/共 16 頁 0992057725-0 201214779 圖。该發光裝置為一發光二極體2〇。該發光二極體2〇包 括基板21 ’該基板21具有反射杯22，該反射杯22内設有 封裝體24 ’安裝於基板21上並封裝於封裝體24内部的至 '一發光二極體晶片23，以及設置於該至少一發光二極 體晶片23週邊的反射層26。 [0019] 忒基板21包括電路結構25，用於承載發光二極體晶片23 並向其提供電力。該反射杯22形成於基板21上表面，該 基板21和反射杯22可以為—體成型結構，也可以為分開 成型。在本實施例中，該基板21為平板狀。該反射杯22 的内壁上舖設有—反射層26，讀反射層#6設置在發光二 極體晶片23週邊用以反射發光二極體晶片23發出的光。 亥反射層26包括一透明基體27以及與該透明基體27緊貼 的反射材質28，該反射材質28位於透明基體27與反射杯 22的内壁之間。該反射材質28採用鏡面油墨，該鏡面油 墨與則述發光二極體模組1〇中所述鏡面油墨相同。 [0020] it. +.+: ； 5 λ至v—發光二極體晶片23設置於基板Η上並與基板 21，表面的電路結構25電性連接，為該發光二極體20的 發光凡件。該至少一發光二極體晶片23可以通過覆晶、 共晶或者Ε)晶打線的方式電性連接在電路結構25中。在 本實施例中’該至少—發光二極體晶片23為—個，並採 用固晶打線方式電連接於電路結構25中。 [0021] 099132993 該封裝體24覆蓋於發光二極體晶片23和基板21上，從而 起到防濕氣與保護的作用。該封裝體24可採用模壓工藝 將透明封膠材料，如環氧樹脂或錢燒等形成於基板21 上，形成封裝體24。當然也可採用其他材料和方 表單編號Α010] 第6頁/共16 f ' 0992057725-0 201214779 該封裝體24。 [0022] 當該發光二極體20點亮，光線由發光二極體晶片23發出 ，部分光線射向反射層2 6後經由反射層2 6的鏡面油墨反 射後，其反射光線仍然可達入射光線的95%或以上，由此 增加該發光二極體20的亮度。若此光線為熱輻射光，經 由該反射層26的反射也同時將熱能光折射出去。 [0023] 該發光二極體20也可以運用於前述發光二極體模組1〇中 ，作為該發光二極體模組的發光元件。 Ο ^ [〇〇24] 圖3為本發明一實施例的發光裝置的製作流程圖。其包括 以下步驟： { [0025] 第一步驟1〇〇 :提供一透明基體31與鏡面油墨3〇 ; [0026] 第二步驟102 :將鏡面油墨30攪拌均勻，再塗布在透明基 體31上； [0027] 第三步驟104 :使鏡面油墨30乾燥、固化，得到與透明基 體31緊貼的鏡面層3 3以及與談鏡面層3 3相對的霧面層3 4 〇 . 9 [0028] 第四步驟106 :對透明基體31進行機械加工，得到所需形 狀； [0029] 請同時參閱圖4，所述第一步驟1〇〇為鏡面油墨30塗布前 的準備工作，提供一透明基體31，該透明基體31可以為 透明的PS板、PC板、ABS板、PET板' PVC板、PMMMA板 等。 [0030] 第二步驟102是將鏡面油墨30攪拌均勻，使其鋁粉與樹脂 099132993 表單編號A0101 0992057725-0 201214779 充分地混合均勻，並根據需要添加部分稀釋劑，以確保 鏡面效果的出現，否則，會影響到後續鏡面效果的產生 。然後將均勻的鏡面油墨3 0利用喷塗、絲網印刷等附著 方式塗布在前述透明基體31上。由於鏡面油墨30稀如水 ，應採取恰當的印刷技巧，在印刷時，鏡面油墨30倒入 網版後應連續快速印刷，才能完成順利印刷，有效的避 免例如堵網、鏡面油墨印不下去、在網版上結渣團、鏡 面效果不好等缺失。 [0031] 第三步驟104是將塗布好的鏡面油墨30進行乾燥固化。鏡 面油墨30的乾燥方法一般有自然乾燥、加熱乾燥、紫外 線乾燥、電子束照射乾燥、紅外線乾燥、微波乾燥等多 種形式。可以直接採用自然乾燥法，將塗布好的鏡面油 墨30靜置放置，待其慢慢乾燥。也可以先自然乾燥一段 時間，當鏡面油墨30出現鏡面效果後進行強制乾燥，如 ，採用烘烤等，將鏡面油墨30置於6(TC的溫度下強制乾 燥24小時，或置於150°C的溫度下強制乾燥10至15分鐘 ，使其完全固化。當然，還可採用其他合適的乾燥方式 將鏡面油墨30固化。固化後的鏡面油墨32在與透明基體 31緊貼的面形成鏡面層33，與該鏡面層33相對的面為霧 面層34。 [0032] 第四步驟106是通過切割、斷裂等機械加工工藝將前述整 塊透明基體31分割得到所需要的輪廓外形，如圓形、方 形等形狀。然後還可以通過壓模等機械加工工序使原有 平板狀透明基體31形成具有凹凸狀或其他各種形狀的形 態（圖未示），如在其表面形成微結構，以利於光線可 099132993 表單編號A0101 第8頁/共16頁 0992057725-0 201214779 由此即可得到所需反射 以達到全反射，增加反射效率 層40結構。 闕目4中1〇8是將該反射層侧定到發光|置中的步驟。將 反射層40翻轉’使鏡面層33朝向上方、霧面層以朝向下 . 方’在霧面層34上塗布減劑將霧面層34緊貼在發光敦 置附著物35的預設表面36上’由此得到具有鏡面效果或 電鍍效果的反射層。該附著物35可以為發光裝置中需要 進行光反射的物質，如前述發光二極體模組1()的印刷電 〇 路板11，或前述發光二極體20的反射杯22等，預設表面 36即為印刷電路板π的安裝發光二極體12的表面，或者 發光二極體20的反射杯22的内壁。 [0034] 可以理解的是，對於本領域的普通技術人員來說，可以 根據本發明的技術構思做出其他各種相應的改變與變形 ’而所有這些改變與變形都應屬於本發明權利要求的保 護範圍。 ， 【圖式簡單說明】 〇 [0035] 圖1為本發明一實施例的發光裝置結構的剖面示意圖。 [0036] 圖2為本發明另一實施例的發光裝置結構的剖面示意圖。 [0037] 圖3為本發明一實施例的發光裝置的製作流程圖。 [0038] 圖4為本發明一實施例的發光裝置製作方法的各步驟所得 的結構示意圖。 【主要元件符號說明】 [0039] 發光二極體模組：1〇 099132993 表單編號A0101 第9頁/共16頁 0992057725-0 201214779 [0040] 印刷電路板：1 1 [0041] 發光二極體：12、20 [0042] 反射層： 13 ' 26、40 [0043] 透明基體 :14 ' 27 、 31 [0044] 反射材質 :15 、 28 [0045] 鏡面層： 33 [0046] 霧面層： 34 [0047] 基板：21 [0048] 反射杯： 22 [0049] 發光二極體晶片：23 [0050] 封裝體： 24 [0051] 電路結構 ：25 [0052] 鏡面油墨 (液態）：30 [0053] 鏡面油墨 (固態）：32 [0054] 附著物： 35 [0055] 預設表面 ：36 099132993 表單編號A0101 第10頁/共16頁 0992057725-0Various tests, such as high temperature and high humidity, hot and cold cycle, adhesion and other tests. The specular ink can be degraded for 7 days in the working environment of -40 ° C to l ° ° C, and can be degraded for 30 seconds to 丨 minutes at a high temperature of 28-0 ° C, and the water resistance is at least IPX6. The above 'non-toxicity and low halogenity meet the requirements of the EU R 0 S Η directive. The adhesion of the specular ink can reach the adhesion test 5 Β standard' nail can not be scraped, while resisting 3 Μ remaining, and can be attached to any soft or hard object. In this embodiment, the printed circuit board 11 is in the shape of a flat plate. Of course, in other embodiments, the printed circuit board 11 may have other shapes, and the reflective material 15 coated on the reflective layer 13 may also be formed accordingly. The corresponding change. The at least one light-emitting diode 12 is mounted on the printed circuit board 11 and is a light-emitting element of the light-emitting diode module 10 and is electrically connected to the printed circuit board 11. [0017] When the at least one light-emitting diode 12 is illuminated, the light is incident on the reflective layer 13 and reflected by the reflective layer 13, and the reflectance is 95% or more, that is, the reflected light reaches 95 of the original light. %or above. 2 is a cross-sectional view showing the structure of a light-emitting device according to another embodiment of the present invention. 099132993 Form No. Α01〇ι Page 5 of 16 0992057725-0 201214779 Figure. The illuminating device is a light emitting diode 2 〇. The light-emitting diode 2 includes a substrate 21'. The substrate 21 has a reflective cup 22. The reflective cup 22 is provided with a package body 24' mounted on the substrate 21 and encapsulated in the package body 24 to a light-emitting diode. The wafer 23 and the reflective layer 26 disposed on the periphery of the at least one light emitting diode wafer 23. [0019] The germanium substrate 21 includes a circuit structure 25 for carrying and supplying power to the light emitting diode chip 23. The reflective cup 22 is formed on the upper surface of the substrate 21. The substrate 21 and the reflective cup 22 may be formed into a body-formed structure or may be separately formed. In the present embodiment, the substrate 21 has a flat shape. A reflective layer 26 is disposed on the inner wall of the reflector cup 22, and a read reflection layer #6 is disposed around the periphery of the light-emitting diode wafer 23 for reflecting light emitted from the light-emitting diode wafer 23. The reflective layer 26 includes a transparent substrate 27 and a reflective material 28 in close contact with the transparent substrate 27, the reflective material 28 being located between the transparent substrate 27 and the inner wall of the reflective cup 22. The reflective material 28 is a mirror ink that is identical to the mirror ink in the light-emitting diode module 1A. [0020] It is a λ to v-light-emitting diode chip 23 disposed on the substrate 并 and electrically connected to the circuit structure 25 on the surface of the substrate 21, which is the illuminating light of the illuminating diode 20 Pieces. The at least one LED chip 23 can be electrically connected in the circuit structure 25 by flip chip, eutectic or germanium. In the present embodiment, the at least one of the light-emitting diode chips 23 is one-piece, and is electrically connected to the circuit structure 25 by a die bonding method. [0021] 099132993 The package body 24 covers the LED array 23 and the substrate 21 to prevent moisture and protection. The package body 24 can be formed on the substrate 21 by a molding process using a transparent sealing material such as epoxy resin or money to form the package body 24. Of course, other materials and squares can also be used. Form No. Α 010] Page 6 / Total 16 f ' 0992057725-0 201214779 This package 24. [0022] When the light emitting diode 20 is lit, the light is emitted by the LED chip 23, and some of the light is reflected by the mirror ink of the reflective layer 26 after being reflected toward the reflective layer 26, and the reflected light is still incident. 95% or more of the light, thereby increasing the brightness of the light-emitting diode 20. If the light is thermally radiated, the reflection of the reflective layer 26 also refracts the thermal energy. [0023] The light-emitting diode 20 can also be used in the light-emitting diode module 1 as a light-emitting element of the light-emitting diode module. Ο ^ [〇〇24] FIG. 3 is a flow chart showing the fabrication of a light-emitting device according to an embodiment of the present invention. The method includes the following steps: [0025] The first step 1〇〇: providing a transparent substrate 31 and a mirror ink 3〇; [0026] a second step 102: uniformly stirring the mirror ink 30, and then coating on the transparent substrate 31; [0027] The third step 104: drying and solidifying the mirror ink 30 to obtain a mirror layer 3 3 which is in close contact with the transparent substrate 31 and a matte layer 3 4 opposite to the mirror layer 33. [0028] Step 106: Machining the transparent substrate 31 to obtain a desired shape; [0029] Please refer to FIG. 4 simultaneously, the first step 1 is a preparation work before the coating of the mirror ink 30, and a transparent substrate 31 is provided. The transparent substrate 31 may be a transparent PS plate, a PC plate, an ABS plate, a PET plate 'PVC plate, a PMMMA plate, or the like. [0030] The second step 102 is to uniformly stir the mirror ink 30, and fully mix the aluminum powder with the resin 099132993 Form No. A0101 0992057725-0 201214779, and add a part of the diluent as needed to ensure the appearance of the mirror effect, otherwise Will affect the subsequent mirror effect. Then, the uniform mirror ink 30 is applied onto the transparent substrate 31 by means of spraying, screen printing or the like. Since the mirror ink 30 is as thin as water, appropriate printing techniques should be adopted. During printing, the mirror ink 30 should be continuously and quickly printed after being poured into the screen to complete the smooth printing, effectively avoiding, for example, blocking the screen, the mirror ink can not be printed, There is a lack of slag formation on the screen, poor mirror effect, and so on. [0031] The third step 104 is to dry and cure the coated mirror ink 30. The drying method of the mirror ink 30 generally has various forms such as natural drying, heat drying, ultraviolet drying, electron beam irradiation drying, infrared drying, and microwave drying. The coated mirror ink 30 can be left to stand still by natural drying, and dried slowly. It is also possible to naturally dry for a while, and then perform forced drying after the specular ink 30 has a mirror effect. For example, baking or the like, the mirror ink 30 is placed at 6 (forced drying for 24 hours at TC temperature, or placed at 150 ° C). The temperature is forced to dry for 10 to 15 minutes to completely cure. Of course, the mirror ink 30 can be cured by other suitable drying methods. The cured mirror ink 32 forms a mirror layer 33 on the surface in close contact with the transparent substrate 31. The surface opposite to the mirror layer 33 is a matte layer 34. [0032] The fourth step 106 is to divide the entire transparent substrate 31 by a machining process such as cutting or breaking to obtain a desired contour shape, such as a circular shape. The shape of the square or the like can be further formed by a mechanical processing such as a stamper to form a shape having irregularities or other various shapes (not shown), such as forming a microstructure on the surface thereof to facilitate light. 099132993 Form No. A0101 Page 8 of 16 0992057725-0 201214779 Thereby the desired reflection can be obtained to achieve total reflection, and the structure of the reflection efficiency layer 40 is increased. 1〇8 is the step of setting the reflective layer to the light-emitting layer. The reflective layer 40 is flipped over so that the mirror layer 33 faces upward, and the matte layer faces downward. The coating on the matte layer 34 will be reduced. The matte layer 34 is in close contact with the predetermined surface 36 of the illuminating attachment 35. Thus, a reflective layer having a mirror effect or a plating effect is obtained. The attachment 35 may be a substance in the illuminating device that needs to be reflected by light, such as The printed circuit board 11 of the light-emitting diode module 1 (), or the reflective cup 22 of the light-emitting diode 20, and the like, the preset surface 36 is the surface of the printed circuit board π on which the light-emitting diode 12 is mounted. Or the inner wall of the reflector cup 22 of the light-emitting diode 20. [0034] It will be understood that those skilled in the art can make various other corresponding changes and modifications in accordance with the technical idea of the present invention. All of these changes and modifications are within the scope of the claims of the present invention. [FIG. 1] FIG. 1 is a cross-sectional view showing the structure of a light-emitting device according to an embodiment of the present invention. [0036] FIG. Another embodiment of the invention 3 is a schematic view showing the fabrication of a light-emitting device according to an embodiment of the present invention. [0038] FIG. 4 is a schematic structural view showing the steps of a method for fabricating a light-emitting device according to an embodiment of the present invention. [Main component symbol description] [0039] LED module: 1〇099132993 Form No. A0101 Page 9/16 Page 0992057725-0 201214779 [0040] Printed circuit board: 1 1 [0041] Light-emitting diode: 12, 20 [0042] Reflective layer: 13 ' 26, 40 [0043] Transparent substrate: 14 ' 27 , 31 [0044] Reflective material: 15, 28 [0045] Mirror layer: 33 [0046] Matte layer: 34 [ 0047] Substrate: 21 [0048] Reflective cup: 22 [0049] Light-emitting diode wafer: 23 [0050] Package: 24 [0051] Circuit structure: 25 [0052] Mirror ink (liquid): 30 [0053] Mirror Ink (solid state): 32 [0054] Attachment: 35 [0055] Preset surface: 36 099132993 Form number A0101 Page 10 / Total 16 page 0992057725-0