201213950 六、發明說明： 【發明所屬之技術領域】 本發明為一種觸控面板之製造方法，可以提升電容式觸控面板 製程良率’以及減少投射電容式觸控面板之製造程序和減少貼合 步驟。 σ 【先前技術】 如第1圖和第2a圖所示，投射電容式觸控面板結構為將分別 鍍有X軸方向透明導電電極202之透明基板200和鍍有y軸方向 透明導電電極212之透明基板210以黏接層220對貼而成，然後 • 將貼合好之感測結構以黏接層240黏貼於硬質透明基板260上， 形成film/film/硬質透明基板之堆疊結構’其中硬質透明基板26〇 為成形強化玻璃、PC或PMMA ’作為觸控面板外層之cover iens。 Film/film/硬質透明基板之結構複雜，製作上需要使用到兩層黏 貼層220、240 ’以及多道黏貼及對位手續，使得產品良率偏低。 並且投射電容式觸控面板之結構包含了兩層透明基板2〇〇、21〇、 兩層黏貼層220、240以及硬質透明基板260，使得整體堆疊厚度 增加，不但造成透光度降低，也不符目前電子裝置尺寸輕^短= 之發展趨勢。 •如第1圖和第2b ®所示’投射電容式觸控面板結構可將具有 X軸方向透明導電電極202製作於透明基板2〇〇之上，y軸方^透 明導電電極212製作於硬質透明基板26〇之上，硬質透明基板26〇 為成形強化玻璃。然後以黏接層240黏貼具有X軸方向透明導電 電極202之透明基板200和具有y軸方向透明導電電極pi〗之硬 質透明基板260 ’形成fiim/giass之結構。Film/glass社構比 Film/f ilm/glass結構簡單，製程上少了一次貼合的步驟，^ 率提升。然而，硬質透明基板260為成形強化玻璃，作為觸^ 板cover lensj需要依手機或電子產品設計而有不同外形 強化玻璃硬度咼且相對於一般玻璃較難加工，切割成形時容易& 5 201213950 260 .：f Γμ T^tt 21 ί ίϊ^ίίίί低於5G财讀’麵外形的公差將使得透明 導電極202與周邊線路280不易對位，而造成良率偏低。 心曰m合辭續目前仍f要人讀仙及貼合，因此多次對位 程穩定度上將造成極大影響。隨著觸控面2邊 ? itιϊϊϊ程之後’周邊線路線寬尺寸縮小到5〇微米以 將使付傳、洗多:人人工對位貼合之製程穩定度遭受極大考驗。 【發明内容】 提升電容細控面板製㈣率，減少補電容式觸控面 程序和減少貼合步驟，並且可製作出窄邊寬與細線路之 觸控面板’發明人經由努力不懈的實驗以及鑛， 化以及良雜狀㈣。 ^枉間 為達成上述之目的，本發明之觸控面板的製造方法，包括： ，供可饒式透明紐’具有複數制區和複數線·，其中每一 :路區位於每一感測區之侧邊；形成透明導電層於可饒式透明基 巧之上’形成圖案化光阻層於透明導電層之上；蝕刻透明導電層， ，成複數個第-制Φ列、複數個和複數對位記號， 其中複數第一感測串列分別具有複數第一感測墊和複數第一橋接 線，複數第一感測墊以陣列方式排列，該些第一橋接線於一第一 方向電性連接複數第一感測墊，複數第二感測墊以陣列方式排 6 201213950 二第一感測塾相互交錯，複數對位記號 阻層於其-層透明保護層於具有圖案化光 數“ϊΐϊί 叙上；移除圖案化光阻，留下位於複 圖索彳思之，案化光阻；形成絕緣層於透明導電層之上； 橋及線之上，數絕緣墊’複數絕緣墊分別位於複數第-=ίί異金屬層於絕緣層之上;移除至少-層透 屬層’形成複數第二橋接線和端子線路數‘及 :於==上’複數第二橋接線與於 複數線路區以供連接軟性電二 測串列與複數第二感測墊，形成感測結刀別連接複數第一感 緣層之之觸控面板的製造絲，其中絕 曰 、有機魏材質、域絕賴質或光阻。 二金屬為ίΐ二的導控面板的製造方法，其中第 成第=5=後本板的製造方法’其中形 之上；以及圖案化抗反射層和第層於第二金屬層 其上之複數第二橋接線。—金屬層’成具有抗反射層於 於圖if ί 土後===的製造方法’更包括 =著層於感測結構之上之可饒;透；=構== 更包括 為達成上述之目的，本發明之觸控面板的製造方法， 7 201213950 以黏著層黏著每一片狀感測基材於硬質透明基板。 為達成上述之目的，本發明之觸控面板的製造 更包括 =著物織_之下;_上=層= 可饒式透明基材，形成複數片狀感測基材，·以及以黏著 層黏者母一片狀感測基材於硬質透明基板。 述之目的’本發明之觸控面板的製造方法，更包括 形成抗干擾層於可饒式透明基材之下。201213950 VI. Description of the Invention: [Technical Field] The present invention is a method for manufacturing a touch panel, which can improve the process yield of a capacitive touch panel and reduce the manufacturing process and reduce the fit of the projected capacitive touch panel. step. σ [Prior Art] As shown in FIG. 1 and FIG. 2a, the projected capacitive touch panel structure is a transparent substrate 200 plated with an X-axis direction transparent conductive electrode 202 and a y-axis transparent conductive electrode 212. The transparent substrate 210 is pasted with the adhesive layer 220, and then the bonded sensing structure is adhered to the rigid transparent substrate 260 by the adhesive layer 240 to form a stacked structure of the film/film/hard transparent substrate. The transparent substrate 26 is formed reinforced glass, PC or PMMA 'as the cover iens of the outer layer of the touch panel. The structure of the Film/film/hard transparent substrate is complicated, and it is necessary to use two layers of adhesive layers 220, 240 ′ and multiple paste and alignment procedures to make the product yield low. The structure of the projected capacitive touch panel comprises two transparent substrates 2〇〇, 21〇, two adhesive layers 220 and 240, and a rigid transparent substrate 260, so that the overall stack thickness is increased, which not only causes the transmittance to decrease, but also does not. At present, the size of electronic devices is light and short = the trend of development. • As shown in Fig. 1 and 2b®, the projected capacitive touch panel structure can be formed on the transparent substrate 2〇〇 with the X-axis transparent conductive electrode 202, and the y-axis transparent conductive electrode 212 can be made on the hard substrate. Above the transparent substrate 26, the hard transparent substrate 26 is formed tempered glass. Then, the transparent substrate 200 having the X-axis direction transparent conductive electrode 202 and the hard transparent substrate 260' having the y-axis direction transparent conductive electrode pi are adhered to the structure of the fiim/giass by the adhesive layer 240. The Film/glass structure is simpler than Film/f ilm/glass, and there is one less step in the process, and the rate is improved. However, the rigid transparent substrate 260 is a shaped tempered glass, and the cover lensj needs to have different shapes to strengthen the glass hardness according to the design of the mobile phone or the electronic product, and is difficult to process with respect to the general glass, and is easy to cut and form. 5 201213950 260 .:f Γμ T^tt 21 ίίϊ^ The tolerance of the surface shape of the 5G financial reading will make the transparent conductive electrode 202 and the peripheral line 280 difficult to align, resulting in low yield. The heartbeat m is still in the process of reading the fairy and the fit, so the stability of the position will be greatly affected many times. With the touch surface 2? It is after the process, the peripheral line width is reduced to 5 μm, which will make the transfer and wash: the process stability of the artificial alignment is greatly tested. SUMMARY OF THE INVENTION The lifting capacitor fine control panel system (four) rate, reduce the complementary capacitive touch surface program and reduce the bonding step, and can produce a narrow side width and thin line touch panel 'the inventor through unremitting experiments and Mine, chemical and good miscellaneous (four). In order to achieve the above object, the manufacturing method of the touch panel of the present invention comprises: a transparent transparent button having a plurality of zones and a plurality of lines, wherein each of the road zones is located in each of the sensing zones Forming a transparent conductive layer on the transparent transparent substrate to form a patterned photoresist layer on the transparent conductive layer; etching the transparent conductive layer to form a plurality of first-order Φ columns, plural and plural a aligning mark, wherein the plurality of first sensing series respectively have a plurality of first sensing pads and a plurality of first bridge wires, the plurality of first sensing pads are arranged in an array, and the first bridge wires are electrically connected in a first direction The plurality of first sensing pads are connected in a plurality, and the plurality of second sensing pads are arranged in an array. 6 201213950 The first sensing electrodes are interlaced, and the plurality of matching marks are layered on the transparent protective layer of the layer to have a patterned light number. Ϊΐϊί 上上; remove the patterned photoresist, leaving the complex photoresist in the complex diagram; forming an insulating layer on the transparent conductive layer; above the bridge and the line, the number of insulating pads 'multiple insulating mats respectively Located in the plural -= ίί different metal layer Above the layer; removing at least the layer of the transmissive layer 'to form a plurality of second bridge lines and the number of terminal lines' and: at == above the second plurality of bridge lines and in the plurality of line areas for connecting the flexible second series And the plurality of second sensing pads, the sensing knots are formed by connecting the manufacturing wires of the touch panel of the plurality of first sensing layers, wherein the conductive wires, the organic Wei materials, the domain absolute properties or the photoresists. The manufacturing method of the second control panel, wherein the first method is the fifth=5=the manufacturing method of the rear panel is formed thereon; and the patterned anti-reflection layer and the plurality of second bridges on the second metal layer are - The metal layer 'in the manufacturing method with the anti-reflective layer in the figure after the soil ===' includes: the layer is above the sensing structure; the transparent; = structure == more included to achieve the above For the purpose of the method for manufacturing the touch panel of the present invention, 7 201213950, each sheet-shaped sensing substrate is adhered to the rigid transparent substrate by an adhesive layer. To achieve the above object, the manufacture of the touch panel of the present invention further includes Material weave _ under; _ upper = layer = reproducible transparent substrate, forming a plurality of flakes The substrate, and the adhesive substrate are sensed on the rigid transparent substrate. The purpose of the method for manufacturing the touch panel of the present invention further comprises forming an anti-interference layer on the transparent transparent substrate. under.
ΐί if if ϊ ’本發明之觸控面板的製造方法，更包括 形成杬干擾層於可饒式透明基材和透明導電層之間。 【實施方式】 請參考第3a圖至第3k圖所示係為 3〇〇 意圖。如第3a圖二 303 可饒式透明基材3GG為可饒曲之^^7_區3G1之四周。 可饒式透明某;M· qnn夕#断材質所構成’可以捲曲成滾筒狀。 質之上亦可職有多層之歸複合材料，而前述材 結構例如可為抗反射居。‘货0隹且結構之基材，多層之透明堆疊 於可饒式透日月基材300之上，示，接著形成透明導電層310 可為銦錫氧化物、氧化銦、氣化透，導電層310之材質，例如 鋅、以及掺雜有錄之氧化錫鋅、摻雜有敗氧化 黃光製程，如第3c圖和第3d圖或，、混σ物。接耆進行第一道 <-· η 5 i 圖所示，形成圖案化光阻層於透明^ [ δ 201213950 導電層310之上，進行蝕刻透明導電層31〇，形成具有光阻層於其 上之複數個第一感測串列311、複數個第二感測墊3121和複數對 位記號3115，其中第一感測串列311分別具有複數第一感測墊 3111和複數第一橋接線3112,複數第一感測墊3111以陣列方式排 列，複數第一橋接線3112於第一方向D1電性連接複數第一感測 墊3111 ’複數第二感測墊3121以陣列方式排列，複數第二感測墊 3121與複數第一感測墊31Π彼此相互交錯，複數對位記號3115 位於複數感測區301之外。複數對位記號3115位於複數咸測區3〇1 之外，例如複數對位記號3115可位於複數線路區3〇3之中，或者 位於複^感測區301和複數線路區303之外。接下來如第允圖所 示，覆蓋至少一層透明保護層321於位於複數對位記號3115之光 阻層上，避免因為後續鍍膜製程覆蓋住複數對位記號3115上之 阻層而影響(XD對位。接著移除位於複數第—感測串列311 屬 12i ί之光阻層。如第3f圖所示，再形成絕緣層(無 於第-金屬層320之上’絕緣層之材f可為二氧化邦 機麟材f或光阻，光_如可驗態光阻或 iL5丄上ί*阻層。接著以CCD對位複數對位記號 案化絕緣層形成複數絕緣塾33卜複數絕緣墊331 一橋接線3112之上，每一絕緣塾331沿第二方向 ^ 1^2：：橋接線3112 °纟_若為紐，製程為將絕緣層 有機數絕緣墊331。若絕緣層為二氧化雜〇2)、 機絕緣材質’製程為於絕緣層上形成光阻，再 曝先顯4及_。而賊緣顧魏而職複數舰緣塾别。 知m第/g圖’形成至少一金屬層(無圖示)於絕緣層之上，外 •，層，裸露出複=== 带成複數第號3115進彳了第三道黃光餘’圖案化金屬層 v成複數第-橋接線迎㈣子線路助，複數橋麟3出分 9 i 201213950 ，複數第二橋接線3122與於第二方向D2 312ϋ ,感測塾3121電性連接，形成複數第二感測串列 (血線路3123形成於複數線路區303以供連接軟性電路板 齡笛二、、端子線路3123分別連接複數第一感測串列3丨1與該複 括形二312 ’形成感測結構％。其中第三道黃光製程包 除㈣=化光阻層於金射之上，紐進行_步驟，以及去 阻二第案ΙίΓ層。其中光阻層之材質可為液態光阻或乾膜光 導雷ίΐί接線3122之結構可為至少一層導電金屬層，或者多層 Ζ電金屬層。其中導電金屬層之材質可為銅合金、銘合金、金、 制如^=、鱗導電金屬或導電合金。多層導電金屬層之結構， y如:為麵層/銘層_之堆疊結構，或者可為選自銅合金、紹合 ΐ而t銀广、銅、19等導電金屬或導電合金之—種或多種材 層導電金屬層結構。導電金屬層多為使用物理氣相 I，成抗反射層於第二金屬層之上，再進行第三道 之笛案化抗反射層和金屬層，形成具有抗反射層於其上 2。抗反射層之材質可為深色導電金屬，例如 iN、TlA1CN、TlA1N、NbO、NbN、Nb2〇x、Tic、Sic 或 亦可為深色絕緣材質，例如可為Cu〇、c〇〇、她、m心、 抗反射層可有效降低金屬材質所造成之光 製針餘干鬚(無㈣)於賴式透明基材 窗Γ擾層之材質例如可為銦錫氧化物' 氧化銦、氧化鋅、 ίίίϊ、摻雜雜之氧化鋅、以及摻雜有録之氧化錫中之一或 ς 抗干擾層可防止觸控面板受到下方顯示器之電性干 之ϊ，而抗干擾層和透明導電層之間為具有透明 擾層可防止觸控面板受到下方顯示器 3h圖和第3圖所示’形成黏著層於複數感測結構3〇之上， 201213950 然後裁切覆蓋有該黏著層於複數感測結構3〇之上之可饒式透明基 材’形成複數片狀感測基材370。然後將每一片狀感測基材37〇 上之每一感測結構30沖切下來形成觸控基材39〇,再以黏著 ％ 黏貼於硬質透明基板36〇。其，觸控基材39〇與硬f透明基板· 形狀相似。由於觸控基材390為軟性材質，所以很容易依昭觸^ 面板設計之外型來㈣。並且免除黃域鋪 $ 社細職供馳面板_紗法。形成複數感測 “上式ΪϊίΪΐί，再形成透明絕緣保護層覆蓋複數i測 具有感測結構之可饒式透明基板之上，僅於端 覆蓋。圖示)無透明絕緣保護層 質、益機解缝f為二氧化石夕(si〇2)、有機絕緣材 物S二^^乾_， 明。施例揭露如上，然其並非用以限定本發 範圍戶=2=潤飾’因此本發明之保護範圍當視申請專利 【圖式簡單說明】 ϊ 示為f知之投射電容式觸控面板 第此圖所:之俯期 第3c圖至第3h二5 ^•實 觸控面板之侧視圖 圖至第3h圖所不為本發明之-實施例之觸控面板之俯視 第31圖至第3k圖所示為本發明之一實施例之觸控面板之側視 201213950 圖 【主要元件符號說明】 200、210透明基板 202 X轴方向透明導電電極 220、240黏接層 212 y軸方向透明導電電極 260硬質透明基板 30感測結構 300可饒式透明基材 • 301複數感測區 303複數線路區 310透明導電層 311複數第一感測串列 3111複數第二感測墊 3112複數第二橋接線 3121複數第二感測墊 3122複數第二橋接線 3115複數對位記號 320金屬層 9 321透明保護層 331複數絕緣墊 3123端子線路 350黏著層 360硬質透明基板 370複數片狀感測基材 390觸控基材 12Ϊ́ί if if ϊ </ RTI> The method of manufacturing the touch panel of the present invention further comprises forming a ruthenium interference layer between the transparent transparent substrate and the transparent conductive layer. [Embodiment] Please refer to Figures 3a to 3k for the purpose of 3〇〇. For example, Figure 3a, Figure 2, 303, the transparent transparent substrate 3GG is surrounded by the ^^7_ area 3G1. It can be transparent and transparent; M·qnn 夕# is made of broken material, which can be curled into a roll shape. Above the quality, there may be a multi-layered composite material, and the foregoing material structure may be, for example, an anti-reflection. The substrate of the structure and the structure are transparently stacked on the surface of the substrate 300, and then the transparent conductive layer 310 is formed to be indium tin oxide, indium oxide, vaporized, and electrically conductive. The material of layer 310, such as zinc, and doped with zinc tin oxide, doped with oxidized yellow light process, such as Figure 3c and Figure 3d or, mixed σ. Then, a patterned photoresist layer is formed on the transparent conductive layer 310, and the transparent conductive layer 31 is etched to form a photoresist layer on the first conductive layer </ RTI> </ RTI> a plurality of first sensing series 311, a plurality of second sensing pads 3121 and a plurality of alignment marks 3115, wherein the first sensing series 311 respectively have a plurality of first sensing pads 3111 and a plurality of first bridge wires 3112, the plurality of first sensing pads 3111 are arranged in an array manner, and the plurality of first bridge wires 3112 are electrically connected to the plurality of first sensing pads 3111 in the first direction D1. The plurality of second sensing pads 3121 are arranged in an array manner. The two sensing pads 3121 and the plurality of first sensing pads 31 are interlaced with each other, and the plurality of alignment marks 3115 are located outside the complex sensing region 301. The complex registration mark 3115 is located outside the complex salt zone 3〇1, for example, the complex alignment mark 3115 may be located in the complex line zone 3〇3 or outside the complex sensing zone 301 and the complex line zone 303. Next, as shown in the first diagram, at least one transparent protective layer 321 is overlaid on the photoresist layer of the complex alignment mark 3115 to avoid the influence of the subsequent coating process covering the resist layer on the complex alignment mark 3115 (XD pair) Then, the photoresist layer located in the plural-sensing string 311 is 12i ί. As shown in FIG. 3f, an insulating layer is formed (the material of the insulating layer is not present on the first metal layer 320). For the dioxide state of the machine material f or photoresist, light _ such as the detectable photoresist or iL5 丄 ί 阻 阻 。 。 。 。 。 。 CCD CCD CCD CCD CCD CCD CCD CCD CCD CCD 复 复 复 对 对 对 对 CCD CCD CCD CCD CCD CCD CCD CCD CCD CCD CCD CCD CCD CCD CCD CCD Pad 331 is a bridge wire 3112, each insulating 塾 331 is along the second direction ^ 1 ^ 2:: bridge wire 3112 ° 纟 _ if the button, the process is to insulate the organic number of insulating pads 331. If the insulating layer is dioxide Chowder 2), machine insulation material 'process is to form a photoresist on the insulation layer, and then exposed to show 4 and _. And the thief edge of the Wei and the job of multiple ship margins. Know m / g map 'form at least one The metal layer (not shown) is above the insulating layer, the outer layer, the layer, the bare exposed complex === the band becomes the plural number 3115 into the third Dao Huangguangyu 'patterned metal layer v into a complex number - bridge wiring welcome (four) sub-line help, complex bridge Lin 3 out points 9 i 201213950, plural second bridge wiring 3122 and in the second direction D2 312 ϋ, sense 塾 3121 electrical Connecting, forming a plurality of second sensing series (blood line 3123 is formed in the plurality of line areas 303 for connecting the flexible circuit board squad 2, and the terminal line 3123 is connected to the plurality of first sensing series 3 丨 1 and the multiplexed Form 2 312 'forms the sensing structure %. The third yellow light process package removes (4) = the photoresist layer is above the gold shot, the new step is performed, and the second layer is removed. The photoresist layer is The material can be liquid photoresist or dry film light guide. The structure of the wiring 3122 can be at least one layer of conductive metal or a plurality of layers of tantalum metal. The material of the conductive metal layer can be copper alloy, alloy, gold, and the like. =, scale conductive metal or conductive alloy. The structure of the multilayer conductive metal layer, y such as: the stack layer / the layer _ the stack structure, or may be selected from copper alloy, Shaohe ΐ and t silver, copper, 19, etc. One or more layers of conductive gold or conductive alloy Is a layer structure. The conductive metal layer mostly uses the physical gas phase I, and the anti-reflection layer is on the second metal layer, and then the third channel of the flute anti-reflection layer and the metal layer are formed to form an anti-reflection layer thereon. The material of the anti-reflection layer may be a dark conductive metal, such as iN, TlA1CN, TlA1N, NbO, NbN, Nb2〇x, Tic, Sic or may be a dark insulating material, for example, Cu〇, c〇 〇, her, m core, anti-reflective layer can effectively reduce the light-made needle dry whisker caused by metal material (No (4)). The material of the lyotropic transparent substrate window irritating layer can be, for example, indium tin oxide 'indium oxide. , zinc oxide, Zn Zn, doped zinc oxide, and one of the doped tin oxide or anti-interference layer can prevent the touch panel from being subjected to the electrical dryness of the lower display, while the anti-interference layer and the transparent layer Having a transparent layer between the conductive layers prevents the touch panel from being exposed by the lower display 3h and the third layer forming an adhesive layer on the complex sensing structure 3, 201213950, and then the cover is covered with the adhesive layer in the plural Sensing structure of the transparent substrate on the top of the structure A plurality of sheet-like sensing substrates 370. Then, each of the sensing structures 30 on each of the sheet-shaped sensing substrates 37 is die-cut to form a touch substrate 39, and then adhered to the hard transparent substrate 36 with an adhesive %. The touch substrate 39 is similar in shape to the hard f transparent substrate. Since the touch substrate 390 is made of a soft material, it is easy to follow the design of the panel (4). And exempted from the Huang domain shop. Forming a complex sense "upper Ϊϊ Ϊΐ Ϊΐ Ϊΐ , 再 , , , , , , , , , , , , , , , , , , , , 透明 透明 透明 透明 复 复 复 复 复 复 复 复 复 复 复 复 复 复 复 复 复 复 复 复The slit f is a dioxide dioxide (si〇2), and the organic insulating material S2 is dry, and the embodiment is disclosed above. However, it is not intended to limit the scope of the present invention. The scope of protection is based on the patent application [Simple Description of the Drawings] ϊ Shown as the projected capacitive touch panel of this figure: The 3D to 3h 2 of the down period is a side view of the real touch panel to 3D is a perspective view of a touch panel according to an embodiment of the present invention. FIGS. 31 to 3k are side views of a touch panel according to an embodiment of the present invention. 201213950 [Description of main components] 200 210 transparent substrate 202 X-axis direction transparent conductive electrode 220, 240 adhesive layer 212 y-axis direction transparent conductive electrode 260 rigid transparent substrate 30 sensing structure 300 can be transparent transparent substrate 301 complex sensing area 303 complex line area 310 The transparent conductive layer 311 has a plurality of first sensing series 311 1 plural second sensing pad 3112 plural second bridge wire 3121 plural second sensing pad 3122 plural second bridge wire 3115 plural alignment mark 320 metal layer 9 321 transparent protective layer 331 plural insulating pad 3123 terminal line 350 adhesive layer 360 Hard transparent substrate 370 plural sheet sensing substrate 390 touch substrate 12