201030583 六、發明說明： 【發明所屬之技術領域】 本發明係相關於-種電容式觸控面板製 可製造^於追縱生產履歷之觸控面板。 法，其 【先前技術】 近年來隨著科技的進步，電子、資訊業的發 賴的電子周邊元件技術亦如雨後春筒般受到廣泛利用，觸^新 ❹ (T〇UchPanel)即為—最々 ’ 觸控面板 )P為取佺之例子，其取代了傳統技術中電子產^ 輸入模式’使得使用者得以實現於顯示面板上直接:的 ;令等輸入之動作，且觸控面板之應用層面也擴及諸如;::電201030583 VI. Description of the Invention: [Technical Field] The present invention relates to a touch panel manufactured by a capacitive touch panel system that can manufacture a tracking history. Law, its [prior technology] In recent years, with the advancement of technology, the electronic peripheral components technology that electronics and information industry relies on is also widely used like a rainy spring. Touching T❹UchPanel is the most 々 'Touch Panel' P is an example of 佺 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The level is also extended to such things as: ::
細、=眾資訊查詢裝置、個人數位助理(PDA)等等各種資訊J 上儼然使得觸控面板相關之技術研究成為電子領域發展一 大重點。 ，電容式面板為於—透明之玻璃额上佈設以 ❿ 减銦錫_)層導鶴膜以形成—導電玻璃結構，而後再 =,之、.口構諸如絕緣(sl02，p01ymer)層及金屬⑽咖)層等藉由 ΐ之板1 ㈣科技術手縣設於解電_結構上，料成一完 控制\配σ於其上接設排線及電路板，並_電路板上之 工铁根據使用者於面板上的觸控位置而啟動對應之控制指令； 中/而值待'主忍的是’目前現有技術中之電容觸控面板的製程 此夕=1可以有效追蹤各層結構之生產流程以作為流程控管，因 夕半需於其巾之金制上透過雷射_上生產祕序號(Sheet 201030583 ID) ’以作為成品之控管依據，但在現有技術中’刻劃生產履歷序 號之較佳方式應為將金屬層設於鄰貼玻璃基板上，亦即使金屬層 成為生產流程U ’以供完整控管整個面板之各環節作業時 間等纪錄貧料，但由於現有技術中金屬層之設置上，其層體結構 之周緣處的傾斜肖乡半較陡，該處之結構不平緩導致無法使氧化 銦錫_)層絲时佈在金屬層的聰處表面上，進而於導電性 能上產生致使產品良率不佳，於是#界之製造廠商紛紛退 ❼ 而放棄將金屬層設為第一層之作法； 此外’當金制設於㈣離玻璃基板時，要於屬層上刻 晝生產履歷序號時，因為工作機台於對位上不易，因此多半需要 將機台加以改裝而後方能於絲排顺賤金屬層上刻上對應序 號，而改裝機台職味者成本的提高，對於生產而言為一負面影 響’有鑑槪，本發日狀發日狀騎—種便於追额有生產履歷 的電容式觸控面板製作方法。 參 【發明内容】 為解決上述之現有技術不足之處，本發明目的在提供一改良 之電容式觸控面板製作方法以製作便於 延蹤所有生產履歷之觸控 面板。 本發明係提供一種電容式觸0 含下歹雜 觸控面板製作方法，係包 金屬層(Metal layer)成型步驟，其為於玻璃基層 上成型-金屬層’首先透過鑛膜技術將該金屬層設於玻 4 201030583 璃基層上，其厚度為500埃至5〇〇〇埃之間，而後藉由 黃光蝕刻技術（Wet Etchmg或Dry Etching (特殊胃氣體 CHF3, SF6, 〇2, CF4, Ar，m，He刀2 etc來控制傾蝕角度））於該金屬 層上蝕刻圖樣，其中該Wet Etching蝕刻作業利用特定 比例之硫酸、鹽酸與硝酸之混成蝕刻液，或DryEtchi^ 蝕刻作業用特殊氣體CHF3,稿，％ CFi4,知，％取此咖以將金 屬層之圖樣周緣侵蝕成具有小於6〇度侵蝕角度之構造； © 銦錫氧化層（IT0 layer)成型步驟’其為於金屬層 所成型之圖樣及玻璃基層上先行鍍一層厚度為5⑽埃至 1 500埃銦錫氧化層以形成導電玻璃之結構，而後進行黃 光姓刻（Wet Etching 或 Dry Etching (特殊氣體（TO,·， 〇2’ CF4, Ar，N2, He，H2 etc來控制傾蝕角度））程序於銦錫氧化層 上蝕出圖樣； 絕緣層（Si02, P〇lyffier layer)成型步驟，其為先於 ® 蝕刻後之銦錫氧化層上藉塗佈技術設以一層絕緣層，其 厚度為〇· 5微米至2. 0微米之間，而後藉由黃光蝕刻於 絕緣層蝕出預設圖樣； 次銦錫氧化層（Second ITO layer)成型步驟，其為 利用銦錫氧化物’配合以鍍膜技術先於蝕刻後之絕緣層 錢上一厚度為500埃至1500埃之次銦錫氧化層，而後 再透過頁光餘刻（Wet Etching或Dry Etching (特殊氣 體CHF3, SF6, 〇2, CF4, Ar，N% He ,m etc來控制傾蝕角度））於次銦 201030583 錫氧化層上蝕出圖樣。 而猎本發明之電容式觸控面板製作方法之流程所 產的觸控面板，因金屬層與玻璃基層間可均句且完整 的佈滿銦錫氧化物，亦即銦 ^ w即銦錫虱化層與玻璃基層之間不 曰產生斷點’因此可具有完全導電之性能，再者，因以 =屬層作為第—層之故，其具有於編列生產履歷序號上Fine, = public information inquiry device, personal digital assistant (PDA) and other information J has made touch panel related technology research become a major focus of the development of the electronics field. The capacitive panel is provided on the transparent glass for the surface of the indium tin oxide layer to form a conductive glass structure, and then the structure of the interface such as the insulating (s02, p01ymer) layer and the metal (10) café layer, etc. by the board of the ΐ 1 1 (4) Section of the technical hand county is set on the _ _ structure, the material into a complete control \ with σ on the connection line and circuit board, and _ circuit board According to the user's touch position on the panel, the corresponding control command is activated; the middle/value is to be 'mainly forbearance'. The current prior art capacitive touch panel process can effectively track the production of each layer structure. The process is controlled as a process, and it is necessary to use the laser on the gold system of the towel for the first time (Sheet 201030583 ID) as the basis for the control of the finished product, but in the prior art, the production history is scribed. The preferred method of the serial number should be to place the metal layer on the adjacent glass substrate, and even if the metal layer becomes the production process U' for the complete control of the operation time of each link of the entire panel, etc., due to the metal in the prior art. The setting of the layer, the periphery of the layer structure The slope of Xiaoxiang is relatively steep, and the structure of this place is not smooth, which makes it impossible to make indium tin oxide_) layered wire on the surface of the metal layer, and thus the conductivity is poor, so the product yield is not good, so # Manufacturers in the world have retired and abandoned the practice of setting the metal layer as the first layer. In addition, when the gold system is set on (4) from the glass substrate, the production history number is engraved on the genus layer because the working machine is It is not easy to position, so most of the machine needs to be modified, and then the corresponding serial number can be engraved on the metal layer of the wire. The cost of the machine is changed. It has a negative impact on production. In view of this, the Japanese-style hair-like riding is a kind of capacitive touch panel manufacturing method that is easy to track the production history. SUMMARY OF THE INVENTION In order to solve the above-mentioned deficiencies of the prior art, the present invention aims to provide an improved capacitive touch panel manufacturing method for manufacturing a touch panel that facilitates the tracking of all production history. The invention provides a method for manufacturing a capacitive touch panel comprising a lower doped touch panel, which is a metal layer forming step for forming a metal layer on a glass substrate layer. First, the metal layer is transmitted through a mineral film technology. It is set on glass base layer 201030583, its thickness is between 500 angstroms and 5 angstroms, and then by yellow etching technology (Wet Etchmg or Dry Etching (special stomach gas CHF3, SF6, 〇2, CF4, Ar) , m, He knife 2 etc. to control the angle of erosion)) etching the pattern on the metal layer, wherein the Wet Etching etching operation utilizes a specific ratio of sulfuric acid, a mixed solution of hydrochloric acid and nitric acid, or a special gas for etching operation of DryEtchi^ CHF3, manuscript, % CFi4, know, % take this coffee to etch the perimeter of the metal layer into a structure with an erosion angle of less than 6 degrees; © Indium tin oxide layer (IT0 layer) forming step 'is the metal layer The patterned pattern and the glass base layer are first plated with a thickness of 5 (10) angstroms to 1,500 angstroms of indium tin oxide to form a structure of conductive glass, and then subjected to yellow light engraving (Wet Etching or Dry Etching (special gas (TO, ·, 〇 2' CF4, Ar, N2, He, H2 etc. to control the erosion angle)) Procedure to etch the pattern on the indium tin oxide layer; Insulation layer (Si02, P〇lyffier layer) molding step, which is prior to ® etching The indium tin oxide layer is coated with an insulating layer having a thickness of between 5·5 μm and 2.0 μm, and then a predetermined pattern is etched on the insulating layer by yellow etching; indium tin oxide oxidation a second ITO layer forming step of using a layer of indium tin oxide to form a sub-indium tin oxide layer having a thickness of 500 angstroms to 1,500 angstroms before the etching of the insulating layer using indium tin oxide. The remaining engraving (Wet Etching or Dry Etching (special gas CHF3, SF6, 〇2, CF4, Ar, N% He, m etc to control the angle of erosion)) etched the pattern on the sub-indium 201030583 tin oxide layer. The touch panel produced by the flow of the capacitive touch panel manufacturing method of the invention can be uniformly and completely filled with indium tin oxide between the metal layer and the glass base layer, that is, indium silicon, ie, indium tin germanide layer and There is no break point between the glass base layers, so it can have full conductivity, and then Because the = genus layer is the first layer, it has the production history number.
乂為便利之優勢，亦依此其可相有效確實地控管追縱 整個面板之各流程生產資訊。 .【貫施方式】 請配合參看第—圖所示，本發明之觸控面板製作完 整之流程包含有下述步驟： 1. 金屬層（Metal layer)成型步驟 2. 銦錫氧化層（no layer)成型步驟 3. 絕緣層（Si〇2，P〇iymer iayer)成型步驟 L次銦錫氧化層（Second ITO layer)成型步驟 ;·保濩層（Passivation layer)成型步驟 6·背面銦錫氧化層（Backside IT〇 layer)成型步驟 請配合參看第二圖所示，前述之金屬層（Metai layer)成型步驟為於玻璃基層（1〇)上成型一金屬層 (20) ’該金屬層（20)為鉬\鋁\鉬（M〇\A1\M〇)三層（亦或 取代以其它導電金屬）鍍膜所成之夾層結構，首先透過 鐘膜技術將該金屬層（2〇)設於玻璃基層（1〇)上，其厚声 6 201030583 Ο 為500埃至5000埃之間，而後藉由黃光钱刻技術⑽ Etching或Dry Etchlng (特殊氣體哪㈣⑽⑽㈣2, 也32咖來控制傾蝕角度））於該金屬層（20)上蝕刻出所 需之圖樣（Pattern)，其中該钱刻作業需利用特定比例 之硫酸、鹽酸與石肖酸之混成蝕刻液，令蝕刻溫度介於Μ 至別度之間，且蝕刻時間需為5秒至5分鐘之間，或 用M Etching用特殊氣體_揭，〇2，咖，知^_ 以將金屬層（2G)姓刻後之圖樣周緣侵钱成具有小於6〇 度侵钱角度⑷之構造（請配合參看第三圖所示），而所 提及之鑛膜技術以及黃光普虫刻技術皆為現有技射所 A習之作業方式’為該技術領域中具有通常知識者應皆 具備之普及知識，因此不於本文中對其動作細節一一多 加贅述’僅就洲該技術所要得到之效果進行說明。 前述之鋼錫氧化層⑽layer)成型步驟為於金屬 層⑽所成型之圖樣及玻璃基層⑽上先行鑛一層錮 錫氧化層⑽以形成導電玻璃之結構，該鋼錫氧化層 (30)之厚度為_埃至]5⑽埃之間’而後進行黃光韻As a convenience, it is also effective in effectively controlling the production information of each process of the entire panel. [Comprehensive method] Please refer to the first figure, the complete process of the touch panel manufacturing of the present invention comprises the following steps: 1. Metal layer forming step 2. Indium tin oxide layer (no layer Molding step 3. Insulation layer (Si〇2, P〇iymer iayer) molding step L-time indium tin oxide layer (Second ITO layer) molding step; · Pasivation layer molding step 6 · Back indium tin oxide layer (Backside IT〇layer) molding step, please refer to the second figure, the metal layer (Metai layer) forming step is to form a metal layer (20) on the glass base layer (1) 'the metal layer (20) The sandwich structure formed by coating three layers of molybdenum, aluminum, molybdenum (M〇\A1\M〇) (or substituted for other conductive metals), firstly, the metal layer (2〇) is placed on the glass base layer by a clock-film technique. (1〇), its thick sound 6 201030583 Ο is between 500 angstroms and 5000 angstroms, and then by the yellow light money engraving technique (10) Etching or Dry Etchlng (special gas which (4) (10) (10) (four) 2, also 32 coffee to control the angle of erosion)) Etching the desired pattern on the metal layer (20), The money engraving operation requires a certain proportion of sulfuric acid, hydrochloric acid and tartaric acid mixed etching solution, so that the etching temperature is between Μ and ,, and the etching time needs to be between 5 seconds and 5 minutes, or M Etching Use special gas _ 揭, 〇 2, coffee, know ^ _ to invade the metal layer (2G) surnamed pattern into a structure with less than 6 degrees of invasion angle (4) (please refer to the third figure ), and the mineral film technology mentioned in the above, as well as the yellow light worm engraving technology, are the working methods of the existing technology institute A, which is the universal knowledge that should be possessed by the general knowledge in the technical field, so it is not in this paper. The details of the action are described in more detail. 'Only the effect of the technology to be obtained is explained. The foregoing steel tin oxide layer (10) layer is formed by forming a layer of a tin-tin oxide layer (10) on the pattern formed on the metal layer (10) and the glass base layer (10) to form a structure of a conductive glass. The thickness of the steel tin oxide layer (30) is _ 埃至]5(10) 埃' and then carry Huang Guangyun
Etching^ Dry Etching ^ M chf3, sf6, 〇2, cf4 ㈣，He，H2ete來控制傾㈣度））程序而㈣錫氧化層⑽ 上姓出所需求之圖樣。 前述之絕緣層（⑽，p咖er layer)成型步驟為 先於飿刻後之銦錫氧化層⑽上藉塗佈(coatIng)技術 201030583 參 覆設一層絕緣層（40),其厚度為ο』微米至2·〇微米之 間或Si〇2厚度為0·05微米至〇·3微米之間而後藉由黃 光敍刻（Wet Etching或Dry Etching (特殊氣體邮^ 〇2, CM Ar, He阳etc來控制傾蝕角度））於絕緣層（4 〇)蝕出’ 預設之圖樣’而絕緣層（4G)之設置所使用之材質並不於 此作-練’可為現有技術巾該技術領域已熟習並使用 之材料如Si G2等聚合物亦或具絕緣特徵之材料，且 k佈技術亦為一晋及之技術，於本技術領域之具有通常 知識者應皆熟知，故不於文中對其細節多加贅述。 前述之次銦錫氧化層（Second iT〇 layer)成型步驟 為利用銦錫氧化物’配合以鑛膜技術先於钱刻後之絕緣 層（40)鑛上-厚度為5⑽埃至15⑽埃之次銦錫氧化層 而後再透過黃絲刻加Etdnng或㈣^㈣ (特殊氣體CHF3’ SF6, 〇2, CF4,紅N2, ％，編c來控制傾飯角度）） 於人銦錫氧化層（5〇)姓出預設之圖樣。 則述之保護層（Passivati〇n 一打）成型步驟為於 ㈣後之次銦錫氧化層⑽上藉塗佈技術覆上一厚度 ;、鉍米至2. 5微米間之Polymer聚合物或Si02 厚度為U5微米至Q. 3微米之保護層⑽以提供一對 板之保°隻作用’而後藉由黃光钱刻（Wet Etching或 y EtChlng (特殊氣體 C_，SF6, 〇2, CF4, Ar, N2, He，m etc 來控 制傾蝕角度))於其上蝕出所需之圖樣。 8 201030583 前述之背面銦錫氧化層（Backsu ττ β, 1Γ〇丄哪幻成划 步驟為於玻璃基層（10)之反向面，^ 亦即觸控面板之背而 處進行銦錫氧化物鍍膜，以於謗表二L^ 面上覆設一層厚度么 於100埃至600埃的背面銦錫氧化層（7〇) 而藉本發明之電容式觸控面柘制&一 饵衣作方法之流程 生產的觸控面板，因為於金屬層+ ra w〇)之周緣處具有較來 緩的侵蝕角度（θ )，因此其與破璃其个 參 ，基層（10)間可均勾 完整地佈滿姻錫氣化物’亦即表示銦錫氧化層（30)與且 璃基層(⑻之間不會產生斷點，因此可具有：全導電破 性能’再者’以金屬層（20)作為第一 “之 層之觸控面板具 於生產履歷序號（Sheed ID)之編列上較為便利 且亦依此可達到有效確實地控管物個=2=， 節生產資訊’係為現有技術之觸控面板製程所無法、| 的特徵，再者，由於金屬層（20)設置於宽— *、、/建到 使用機台對位並刻劃生產履歷序號，盔可直辏 '、、、肩對機台加以任何改 亦為-生舰本上之節約且本發明所採叫金料⑽t 小於0. 6歐姆/m2,反射率小於8%，光學定电n ¥電度 山度0D值大於3。 請進一步配合參看第四圖所示，复由 、T為一本發明之轡 態樣之成品示意圖，其於絕緣層（4〇肭你& 欠小貫把 」與次銦錫氧化屉卩 設置上為呈現點狀配置，如此作法下可 θ UOA)之 之光學性能提升，亦即其中板體之遮;^地讓整體觸控面板 性提高，進而具有節省光源模_電」少’因而可讓光源穿透 里之功能；另為助審查委員 201030583 201030583 .六圖）以供 更進一步理解本發明，故附上本發明之成品（第五及第 參考。 而综觀上述，可見本發明在突破先狀技術τ，確實已達到 所奴i曰進之功效，且也非熟悉該項技藝者所易於思及，再者，本 發明申凊W未曾公開，其所具之進步性、實用性，顯已符合發明 ft之申請要件’爰依法提出創作申請，懇請貴局核准本件創 作專利申請案，以勵創作，至感德便。 、上所逑之實㈣鶴為制本發明之技術思想及特點，其 >的在使$自此項技#之人士能夠瞭解本發明之内容並據以實 /【圖式^"物，織蓋在本敝專利範圍内。 圖係為本發明之實施步驟流程圖。 ―第二圖麵本發明之成品結構示意圖。 第三圖係為本發明之局部結構剖面圖。 為本發明之變形實施態樣成品結構示意圖。 第五圖係為本發明之成品上視圖。 第六『係為本發明之成品局部上視圖。 【主要元件符號說明 玻場基層(10) 金屬層(20) 銦錫氧化層（3〇) 10 201030583 絕緣考（40)(40A) 次銦錫氧化層（50)(50A) 保護層（60) 背面銦錫氧化層（70) 侵蝕角度(Θ )Etching^ Dry Etching ^ M chf3, sf6, 〇2, cf4 (four), He, H2ete to control the tilt (four) degree)) and (4) tin oxide layer (10) on the surname of the desired pattern. The insulating layer (10) is formed by coating a coating layer (40) on the indium tin oxide layer (10) after engraving, and the thickness of the insulating layer (40) is ο 』 Between micron to 2·〇 micron or Si〇2 thickness between 0·05 micron and 〇·3 micron and then by yellow light (Wet Etching or Dry Etching (Special Gas Mail ^ 〇 2, CM Ar, He Yang etc) To control the angle of erosion)) to etch the 'preset pattern' on the insulating layer (4 〇) and the material used in the setting of the insulating layer (4G) is not the same as the prior art. Materials that are familiar and used, such as polymers such as Si G2 or materials with insulating characteristics, and the k-cloth technology is also a technology that is common to those skilled in the art, so it is not in the text. The details are described in more detail. The foregoing indium tin oxide layer (Second iT layer) molding step is performed by using indium tin oxide as a mineral film technology prior to the engraving of the insulating layer (40) on the ore-thickness of 5 (10) angstroms to 15 (10) angstroms. Indium tin oxide layer and then through the yellow wire engraved with Etdnng or (four) ^ (four) (special gas CHF3 ' SF6, 〇 2, CF4, red N2, %, edit c to control the angle of the rice)) in the human indium tin oxide layer (5 〇) The surname is the default pattern. The layer of the protective layer (Passivati〇n a dozen) is formed by applying a coating technique on the indium tin oxide layer (10) after the (iv), and a polymer of SiO 2 to 2. 5 μm or SiO 2 . The protective layer (10) having a thickness of U5 micrometers to Q. 3 micrometers provides a pair of plates only for the role of 'the latter' and then by the yellow light (Wet Etching or y EtChlng (special gas C_, SF6, 〇2, CF4, Ar) , N2, He, m etc to control the angle of erosion)) to etch the desired pattern thereon. 8 201030583 The above-mentioned back indium tin oxide layer (Backsu ττ β, 1 Γ〇丄 幻 幻 幻 幻 幻 幻 幻 幻 幻 幻 幻 幻 幻 幻 幻 幻 幻 铟 铟 铟 铟 铟 铟 铟 铟 铟 铟 铟 铟 铟 铟 铟 铟 铟 铟 铟 铟 铟 铟 铟 铟 铟The surface of the L2 surface is covered with a thickness of 100 angstroms to 600 angstroms of the back indium tin oxide layer (7 〇) and the capacitive touch surface of the present invention is used to make a < The touch panel produced by the process has a relatively gentle erosion angle (θ) at the periphery of the metal layer + ra w〇), so that it can be completely integrated with the broken glass and the base layer (10). It is said that the indium tin oxide layer (30) and the glass base layer ((8) do not have a break point, so it can have: full conductivity breaking performance 'again' with metal layer (20) The first "layer of touch panels" is conveniently located in the production history number (Sheed ID) and can also achieve effective and effective control of the object = 2 =, the production information 'is a touch of the prior art The characteristics of the control panel process cannot be |, and, because the metal layer (20) is set to be wide - *, , / To use the machine to align and mark the production history number, the helmet can be directly 辏,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, Ohm/m2, reflectance less than 8%, optical constant power n ¥Electrical mountain 0D value is greater than 3. Please further refer to the fourth figure, complex, T is a schematic diagram of the finished product of the invention, It is arranged in a point-like configuration on the insulating layer (4 〇肭 & & 欠 」 与 与 与 与 与 与 与 与 与 与 , , , , , , , , , , , , θ θ θ θ θ θ θ θ θ θ θ θ θ θ θ θ θ θ θ ^^ to improve the overall touch panel, and thus save the function of the light source mode _ electric "less" so that the light source can penetrate the inside; another to help the review committee 201030583 201030583. Six figures) for a further understanding of the present invention, Therefore, the finished product of the present invention (fifth and reference) is attached. From the above, it can be seen that the present invention has achieved the effect of being a slave in the breakthrough of the prior art τ, and is not easy for those skilled in the art. In addition, the invention has not been disclosed, and it has Steps, practicality, has been in line with the application requirements of the invention ft '爰According to the law to create an application, I ask you to approve the creation of this patent application, to encourage creation, to the sense of virtue. The technical idea and the features of the present invention are described in the present invention by enabling those who are able to understand the contents of the present invention and according to the actual/[pattern]. The figure is a flow chart of the implementation steps of the present invention. The second drawing is a schematic view of the finished structure of the present invention. The third drawing is a partial structural sectional view of the present invention. The drawings are a top view of the finished product of the invention. The sixth "is a partial top view of the finished product of the present invention. [Main component symbol description Glass field base layer (10) Metal layer (20) Indium tin oxide layer (3〇) 10 201030583 Insulation test (40) (40A) Sub-indium tin oxide layer (50) (50A) Protective layer (60) Backside indium tin oxide layer (70) erosion angle (Θ)