201212764 六、發明說明： 【發明所屬之技術領域】 本發明係關於在配線基板上形成有樹脂層之樹脂其 板、在配線基板上構裝有t +零件且形&有樹脂層之^ 零件内設樹脂基板、以及在基板上構裝有電子零件且形成 有树脂層之電子零件等的電子元件之製造方法，更詳+ 之，係關於-種在導電通孔之形成方法施加改良的電子： 件之製造方法。 ’ 兀 又，本發明係關於一種可藉由使用上述電子元件之製 &方法來製造且具有經過改良之導電通孔的電子元件。 【先前技術】 以在，已使用在配線基板上形成有樹脂層之樹脂基 板、在配線基板上構裝有電子零件且形成有樹脂層之電子 零件内設樹脂基板、以及在基板上構裝有其他電子零件且 形成有樹脂層之電子零件等的電子元件。此外，在這些電 子7G件，有時會形成從樹脂層之表面至形成於配線基板之 連接用電極、或所構裝之電子零件之端子電極的導電通孔。 在圖9(A)〜（c)係表示習知之導電通孔之形成方法的一 例此外，51 9(A)〜（〇係表示在將導電通孔形成於樹脂基 板時所實施.之步驟的截面圖。 首先，如圖9(A)所示，在配線基板1〇2之上形成熱硬 化性或光熱硬化性之樹脂層1〇3，其中該配線基板1〇2係由 也成有由Cu等構成之連接用電極1 〇丨之陶瓷、玻璃環氧 201212764 (glass epoxy)等所構成。 其次，進行加熱或光照射，以使樹脂層1〇3硬化。 其次’如圖9(B)所示，朝向連接用電極1 〇丨，將雷射光 照射於樹脂層1〇3,以形成從樹脂層1〇3之表面至連接用電 極101的通孔104。由於通扎104係藉由雷射光之照射所形 成，因此係以愈接近於樹脂層1〇3之表面則截面積愈大， 而愈接近於連接用電極1〇1則截面積愈小的方式，將内壁 面形成為錐狀。 其次’在露出於通孔丨〇4之連接用電極1〇ι的表面， 進行除渣以除去照射雷射光時所附著之構成樹脂層1〇3之 物質等的殘渣。此外，除渣係使用專用之除渣液來進行。 其次，如圖9(C)所示，在通孔1〇4内形成由Cu等構成 之導電通孔105。導電通孔1〇5例如可藉由電鍍來形成。或 者，可在進行化學鍍之後，再進行電鍍來形成。或者，可 在填充導電性糊之後，再予以加熱以使其硬化來形成。 在由以上之步驟所構成之習知之導電通孔的形成方 法，係有以下之問題。 首先，由於藉由雷射光之照射而形成通孔1〇4，因此通 孔104係愈接近於連接用電極1〇1則截面積愈小’而無法 充分地擴大導電通孔1〇5與連接用電極1〇1之接合面積， 導致難以獲得較大的接合強度。此外，由於通孔1〇4之内 壁面係錐形為朝向外側擴展，因此導電通孔1〇5容易從通 孔104之壁面剝離，若導電通孔1〇5從通孔1〇4之壁面剝 離，則導電通孔105即容易從通孔1〇4脫落。此外，若導 201212764 電通孔105從通孔104脫落，則導電通孔105與連接用電 極1 0 1之間亦容易剝離，而有導致兩者間斷線之情形。 又，由於從樹脂層103之表面朝向埋設於樹脂層1〇3 之連接用電極101照射雷射光，因此若配線基板1〇2中之 連接用電極101的形成位置偏移時，則有通孔104未到達 連接用電極101，會有無法將導電通孔1〇5連接於連接用電 極101之情形。又’會因連接用電極1〇1之形成位置偏移， 導致導電通孔105與連接用電極1〇1之接合面積小於設計 上之接合面積，而有兩者間之電氣連接性或接合強度不夠 充分的情形。又，若配線基板102中之連接用電極1〇1的 形成位置偏移，則會因雷射光之照射而形成貫通配線基板 102之通孔，而有損毁配線基板1〇2之情形。因此，有將連 接用電極101之面積形成到大於所需之情形，此時便會導 致樹脂基板本身之大型化，而有造成材料成本上升等的問 題。 此外，連接用電極101之形成位置的偏移，例如在配 線基板102為陶竟基板的情況下，有時係因燒成時之燒成 不均而產生。X，在配線基板1〇2為玻璃環氧基板的情況 下’有時係因製造時之加壓條件等的狀態而產生。此外， 配線基板1〇2 +，若在連接用電極⑻之形成位置產生偏 :二於雷射光之照射一般係以配線基1〇2之外形等 為，準來進行，因此會發生將雷射光照射在偏離 極1 0 1之位置的情形。 Έ 此種作為在習知之導電通孔之形成方法嘗試進行改善 201212764 者，係有專利文獻曰本特開2〇〇6_ 253 189號公報）所揭 示之另一種習知之導電通孔的形成方法。 在圖10(A)〜（C)係表示專利文獻i所揭示之導電通孔 的形成方法。此外，圖10(A)〜（c)係表示在將導電通孔形 成於樹脂基板時所實施之步驟的截面圖。 首先，如圖10(A)所示，在由形成有由Cu等構成之連 接用電極201之陶瓷、玻璃環氧等所構成的配線基板2〇2 上，形成由易於受除渣液蝕刻之樹脂所構成的第丨樹脂層 203a，並進一步在第1樹脂層2〇3a之上，形成由不易受除 渣液蝕刻之樹脂所構成的第2樹脂層2〇3b。此外，第i樹 脂層203a、及第2樹脂層203b皆由熱硬化性或光熱硬化性 之樹脂所構成。 其次，進行加熱或光照射，以進行第i樹脂層2〇3&及 第2樹脂層203b之硬化。然而，在此時點，並不使第i樹 月曰層203a、及第2樹脂層203b完全地硬化。 其次，朝向連接用電極201，將雷射光照射於樹脂層 203a及第2樹脂層203b’以形成從樹脂層2〇3a之表面至連 接用電極201的通孔204。由於通孔2〇4係藉由雷射光之照 射所形成，因此係以愈接近於樹脂層2心之表面則截面積 愈大，而愈接近於連接用電極2〇1貝,m面積愈小的方式， 將内壁面形成為錐狀》 其次’如圖10(B)所示’進行通孔2〇4之除渣。如上述 般’由於帛1樹脂層203a倍'易於受除渣液银刻之樹脂所構 成，第2樹脂層203b則由不易受除渣液触刻之樹脂所構 6 ⑤ 201212764 成’因此在通孔204中第1播f t風 樹知層203a部分便受到 形成鼓狀之鼓狀部204a，第2槲昨a〜叩 弟2樹脂層2〇3b部分則幾乎 到#刻而形成維持原來之錐狀的錐狀部2〇仆。 & 其次，如圖H)(C)所示，在通孔綱内形成由C 構成之導電通孔205。 專利文獻1 :日本特開2006— 253189號公報 【發明内容】 根據上述圖10(A)〜（C)所示之專利文獻i所揭示之習 知之導電通孔之形成方法，由於導電通孔2〇5係在通孔 之鼓狀部204a形成為鼓狀，因此可擴大與連接用電極2〇ι 之接合面積，而可謀求兩者之接合強度的提升。又，由於 以鼓狀之部分可阻止導電通孔2〇5從通孔2〇4剝離，因此 可將導電通孔205設置成不易從連接用電極2〇1剝離之構 造。 然而，專利文獻1所揭示之習知之導電通孔之形成方 法，在配線基板202申之連接用電極2〇1之形成位置偏移 的情况下，仍然還有通孔204未到達連接用電極2〇 1，而無 法將導電通孔205連接於連接用電極2〇1的情形，或者導 電通孔205與連接用電極2〇 1之接合面積小於設計上之接 合面積’而有兩者間之電氣連接性或接合強度不夠充分的 情形等問題尚未解決。 又’若未能在正確之位置進行雷射光之照射，則會形 成貫通配線基板202之通孔，或者造成埋設在配線基板202 201212764 内之電子零件破損等的問題亦未解決。又，亦有難以將雷 射光照射於斜方向.，而難以形成斜方向之導電通孔的問題。 此外’專利文獻1所揭示之習知之導電通孔之形成方 法’最大的問題在於必需在配線基板202之上，形成由易 於受除渣液蝕刻之樹脂所構成的第1樹脂層203a、以及由 不易受除渣液蝕刻之樹脂所構成的第2樹脂層203b之2種 樹脂層，而有製程繁雜等的問題。 本發明係為了解決上述習知之問題而構成，作為其手 段’本發明之電子元件之製造方法，係設置成具備：準備 在至少一主面形成有連接用電極之配線基板的步驟；在連 接用電極上形成柱狀暫置體的步驟；以覆蓋至少柱狀暫置 體與連接用電極之連接部之方式埋設柱狀暫置體，以在配 線基板之至少一主面形成樹脂層的步驟；對樹脂層賦予所 欲之硬度的步驟；使用樹脂層不易溶解而柱狀暫置體可溶 解之藥液來溶解埋設在樹脂層之柱狀暫置體，以在樹脂層 形成與柱狀暫置體大致同形狀之空孔的步驟；以及在空孔 内填充導電成分，以形成導電通孔的步驟。 亦可取代連接於形成在配線基板之連接用電極的導電 通孔’而以同樣之方法來形成連接於構裝在配線基板之電 子零件之端子電極的導電通孔。 由於本發明之電子元件之製造方法係由上述之内容所 構成’因此可發揮以下效果。 可將導電通孔確實地連接於形成在配線基板之連接用 電極、或構裝在配線基板之電子零件的端子電極。 ⑤ 201212764 又’在製造過程中，柱狀暫置體之形成位置若不佳， 即可除去該柱狀暫置體’並在正確之位置再次重新形成板 狀暫置體。又，所形成之柱狀暫置體的形狀若不佳，即可 修正形狀’或者再次重新形成柱狀暫置體。 又，由於並無照射雷射光之步驟，因此即使在連接用 電極或所構裝之電子零件之端子電極的位置有偏移，亦無 造成配線基板或所構裝之電子零件破損的情形。 又’根據本發明所製造之電子元件，係可發揮以下效 果。 月&將導電通孔形成為從樹脂層之表面附近起，越朝向 形成在配線基板之連接用電極、或構裝在配線基板之電子 零件的端子電極，截面積越大。在此情況下，即可防止導 電通孔從樹脂層剝離，而可防止導電通孔從配線電極或端 子電極剝離。 又，可在形成於配線基板之連接用電極的附近部分、 或構裝於配線基板之電子零件之端子電極的附近部分，設 置截面積較大的擴張部（底座部在此情況下，即可謀求導 電通孔與連接用電極或端子電極之接合強度的提升。又， 可防止導電通孔從樹脂層之剝冑，進而可防止導電通孔從 配線電極或端子電極之剝離。 又，可在導電通孔之全長的中間部分，形成截面積較 大的擴張部。在此情況下，即可可防止導電通孔從樹脂層 之剝離’ $而可防止導電通孔從連接用電極或端子電極之 剝離》 201212764 又可在導電通孔之樹脂層表面的附近部分，形成截 面積較大的擴張部。在此情況下，例如在電子元件之表面， 並非另外再形成連接用電極，而可利用從樹脂層露出之導 電通孔的擴張部來做為連接用電極。 又，相對於配線基板之表面，可將導電通孔形成為斜 方向。在此情況下，可提升導電通孔之配置自由度，例如 亦可利用在將集_形成於配線基板表面之狹窄範圍的複數 個連接用電極分別連接於形成在樹脂層表面之較廣範圍的 複數個連接用電極等，電極間間距的變更。 【實施方式】 以下，針對用以實施本發明之形態，與圖式一起加以 說明。 [第1實施形態] 圖1 (A) ® 2(F)係表示本發明之第i實施形態之電子 凡件1〇〇之製造方法。此外，圖1(A)〜圖2⑻之各圖係表 丁在第1貫施形態所實施之各個步驟的截面圖。 第1實施形態之電子ϋ牛1〇〇，係一種在内部埋設有電 子零件之電子零件内設基板，或者在内部埋設有其他電子 零件之電子零件。 、首先，如圖1㈧所示’準備在-主面預先形成有複數 :連接用電極la，lb之配線基板2，並將在兩端形成有1對 端子電極3a之電子零件3構裝於既定之連接用電極^。此 構裝係例如可藉由在連接用電極lb上預先塗布焊膏，將端 ⑤ 201212764 子電極3 a載置於甘卜，$二 戟直歹…、上，再予以加熱使 冷卻使焊料目化錢連細◎ ’接者予以 行。 ’、鲕千電極3a接合來進 此外，作為配線基板2，除了 成的酎蝻其缸，v & + 瓦坡璃％氧等所構 成的配線基板以外，亦可使用 ^ _ 丁守m曰日圓4表面具有連 接用之電極的基板形狀者。x，構裝在配線基板2上= :零件3的種類、個數、以及所具有之端子電極仏的個數 4係任意’並不限於圖示之内容。 其次’如圖1 (B)所示，在連接用 „ 隹連接用電極h上形成柱狀暫 置體4a，在電子零件3之端子 噼千電極3a上形成柱狀暫置體 柱狀暫置體4a 4b係# 係鞛由此以特定之藥液溶解之材料 所形成。具體而言，例如可作用At w 了使用此浴解於氫氧化鈉或氫氧 化鉀之酚樹脂。 本實施形態中，係將桂狀暫罟興 、 了狂狀皙置體4a，4b之形狀皆設置 成愈接近於連接用電極丨3或端子雷朽7 乂 ^于電極3a則截面積愈大的圓 錐形狀。然而’柱狀暫置體4a，4b之形狀係任意，並不限 制於圓錐形狀，而可採用圓柱形狀、角錐形狀、以及角柱 形狀等之各種形狀。 柱狀暫置體4a，4b係可藉由將預先成形為所欲之形狀 者接合在連接用電極la上或端子電極3a上之既^位置來形 成。然而’更佳為在柱狀暫置體4a，4b之材料使用熱硬化 性或光硬化性之樹脂’並藉由喷墨法將樹脂之液滴吐出至 既定之位置來形成。此外，在將熱硬化性或光熱硬化性之 樹脂使用於柱狀暫置體4a，4b且以喷墨法形成的情況下’ 11 201212764 較佳為在形成後藉由進行加熱或光照射以使其硬化成具備 所欲之硬度》 在將喷墨法使用於柱狀暫置體4a，4b之形成的情況 下’即可發揮以下之效果。首先，可對應所製造之電子元 件隨時變更柱狀暫置體4a，4b之形成位置。因此，在丨條 生產線即可製造多種電子元件。又，在可吐出成形之範圍 可自由地設定柱狀暫置體4a，4b之形狀，並且可隨時加以 變更。例如’若將形成初期之吐出量預先予以增加，而從 圖中逐漸予以減少，即可形成愈接近於連接用電極u或端 子電極3a則截面積愈大之所謂錐狀的柱狀暫置體4a，4b〇 同樣地，可藉由調整吐出量而在柱狀暫置體4a，4b之連接 用電極1 a或端子電極3a的附近部分、全長之中間部分、後 續說明之樹脂層（5)之表面的附近部分，設置截面積較大之 擴張部。再者，亦可將柱狀暫置體4a，4b相對於配線基板2 之表面形成為斜方向。 此外，欲將柱狀暫置體4a，4b形成在既定位置，係可 藉由攝影機來掌握配線基板2之連接用電極u或電子零件 3之端子電極3a的位置，並以電腦加以控制來進行。或者， 亦可在配線基板2預先設置顯示基準位置之標記，掌握該 標記之位置，並以該標記為基準來控制形成柱狀暫置體4a， 4b的位置。 ’ 此外，柱狀暫置體4a，4b之底面整面並無需接合在連 接用電極la或端子電極33上。尤其，在電子零件3較小的 情況下，亦可使桎狀暫置體4b之底面的一部分接合在端子 12 201212764 電極3a上，並使其餘部分接合在端子電極化之基材上。 其次，如圖1(C)所示，埋設柱狀暫置體⑪及電子 零件3,以在配線基板2之主面上形成樹脂層卜 由於樹脂層5亦有兼作所製造之電子元件之外裝的情 形，因此較佳為由耐熱性、耐藥性等較佳之材料構成。且 體而言’料樹脂層5之材料，可使用熱硬化性、光魏 性、或熱可塑性之環氧樹脂、丙烯酸樹脂、聚矽氧樹脂、 氰酸㈣1及聚苯㈣脂等。又’除了溶解性或耐熱 性、耐藥性以外，亦可使用能使柱狀暫置體％仆或電子 零件3貫通’在能滿足與配線基板2之接合性的情況下， 亦可使用熱可塑性樹脂。 树月曰層5之形成，係可藉由使加熱後呈半熔融狀態之 熱硬化性樹脂片、光硬化性樹脂片、以及熱可塑性樹脂片 之任一種貫通柱狀暫置體4a，4b或電子零件3,並載置於配 線基板2上來進行。然而，更佳為藉由將液狀之熱硬化性 樹月s、光硬化性樹脂、以及熱可塑性樹脂之任一者塗布在 配線基板2上來進行。在使用液狀之樹脂的情況下，便不 會有不希望之應力作用於柱狀暫置體43，仆，而可避免柱狀 暫置體4a，4b倒塌。 此外’柱狀暫置體4a，4b之前端，較佳為從樹脂層5 之表面露出。然而，在柱狀暫置體4a，4b之前端為埋入樹 脂層5的情況下，如後續說明般，在對樹脂層5賦予所欲 之硬度後’只要研削樹脂層5之表面，以使柱狀暫置體4a, 之前端露出於樹脂層5之表面即可。 13 201212764 其次，對樹脂層5賦予所欲之硬度。在樹脂層$為由 熱硬化性樹脂構成的情況下係藉由予以加熱，在樹脂層5 為由光硬化性樹脂構成的情況下，則藉由進行光照射來進 行。又，在樹脂Μ 5為由熱可塑性樹脂構成的情況下，係 藉由返回熔點以下之溫度來進行。此外，對樹脂層5賦予 所欲之硬度，係為了在以下說明之步驟中，在溶解柱狀暫 置體4a，4b以形成空孔（6a，6b)時，使樹脂層$不會受到藥 液所造成之影響。因此，在樹脂4 5為藉由熱硬化性樹脂 或光硬化性樹脂形成的情況下’在此時點並無需使樹脂層5 完全地硬化，只要可獲得所欲之硬度即可。 其次，如圖2(D)所示，溶解柱狀暫置體心，仆以在樹 =層5形成空孔以，6b。此外，存在有柱狀暫置體仏之部 分係成為空孔6a，而存在有柱狀暫置體仆之部分則成為空 孔6b。接著’連接用電極la即露出於空孔^之底面，而 連接用電極lb則露出於空孔6b之底面。 柱狀暫置體4a，4b之溶解，係藉由將整體浸潰在樹脂 層5不易溶解而柱狀暫置體4a，❹會溶解之藥液來進行。曰 例如，在樹脂層5為由環氧樹脂構成而柱狀暫置體^，仆 ^由酚樹脂構成的情況下，可將環氧樹脂不易溶解而酚樹 月曰可溶解之氫氧化鈉或氫氧化鉀使用於藥液。 其次，如圖2(E)所示，在空孔6a，6b内填充導電成分， Μ形成導電通孔7a’ 7b。此結果’導電通孔7a即與連接用 電極la接合，而導電通孔7b則與電子零件3之端子電極 3a接合。 ⑧ 14 201212764 作為填充於空孔6a，6b内之導電成分，例如可使用以 Cu、Ag、Ni等為主成分之導電性糊。在使用導電性糊的情 況下，係於填充後予以加熱以使導電性糊硬化。假設，在 树月曰層5為由熱硬化性樹脂構成，且在此時點尚未完全地 硬化的情況下，亦可同時地進行導電性糊之硬化與樹脂層5 之硬化。此外，這些硬化亦可在以下說明之步驟中，將 箔等壓接於樹脂層5之表面後進行。 又’欲將導電成分填充於空孔6a，6b内，亦可藉由電 鍍來進行。或者，亦可藉由化學鍍、以及接續於此之電鍍 來進行。就電鍍之金屬的種類而言，係可使用Cu、Ag、Ni 等。 最後，如圖2(F)所示，在樹脂層5之表面形成連接用 電極8，而完成電子元件1〇〇。連接用電極8之形成，例如 可藉由將Cu猪等壓接在樹脂層5之表面整面，並蝕刻成所 欲之形狀來進行。此結果，導電通孔7a，7b即分別與既定 之連接用電極8接合。 以上，已針對第I實施形態之電子元件之製造方法作 了說明。然而，本發明並不限制於上述之内容，按照發明 之主旨可作各種變更。 例如，在本實施形態所製造之電子元件丨〇〇，雖屬在内 :埋設有電子零件3之電子零件内設基板，或者在内部埋 設有電子零件3之電子零件’不過本發明亦可應用於在内 部未埋設電子零件之樹脂基板之製造方法，而能以同樣之 方法形成導電通孔。201212764 6. TECHNOLOGICAL FIELD OF THE INVENTION The present invention relates to a resin in which a resin layer is formed on a wiring substrate, a t + part is formed on the wiring substrate, and a resin layer is formed. A method of manufacturing an electronic component in which a resin substrate and an electronic component in which an electronic component is formed on a substrate and an electronic component is formed, and more specifically, an improved electron is applied to a method of forming a conductive via. : The manufacturing method of the piece. Further, the present invention relates to an electronic component which can be manufactured by using the above-described method of manufacturing electronic components and having improved conductive vias. [Prior Art] A resin substrate having a resin layer formed on a wiring substrate, a resin component having an electronic component formed on the wiring substrate and having a resin layer formed thereon, and a resin substrate are mounted thereon An electronic component such as an electronic component in which a resin layer is formed of another electronic component. Further, in these electronic 7G members, a conductive via hole is formed from the surface of the resin layer to the connection electrode formed on the wiring substrate or the terminal electrode of the mounted electronic component. 9(A) to 9(c) show an example of a method of forming a conventional conductive via hole, and 51 9 (A) to (〇) denote a step of performing a step of forming a conductive via hole on a resin substrate. First, as shown in FIG. 9(A), a thermosetting or photothermable resin layer 1〇3 is formed on the wiring substrate 1〇2, wherein the wiring substrate 1〇2 is also formed by The connection electrode 1 made of Cu or the like is made of ceramic, glass epoxy 201212764 (glass epoxy), etc. Next, heating or light irradiation is performed to cure the resin layer 1〇3. Next, as shown in Fig. 9(B) As shown, the laser beam 1 〇 3 is irradiated toward the connection electrode 1 以 to form a through hole 104 from the surface of the resin layer 1 〇 3 to the connection electrode 101. Since the irradiation of the light is formed, the closer the cross-sectional area is to the surface of the resin layer 1〇3, the closer the cross-sectional area is to the connection electrode 1〇1, the inner wall surface is formed into a tapered shape. Next, 'on the surface of the connection electrode 1〇 exposed on the through hole 4, the slag is removed to remove the irradiation ray. The residue of the material constituting the resin layer 1〇3 adhered to the light, etc. Further, the slag removal is performed using a dedicated slag-removing liquid. Next, as shown in Fig. 9(C), it is formed in the through hole 1〇4. a conductive via 105 made of Cu, etc. The conductive via 1 5 can be formed, for example, by electroplating, or can be formed by electroplating after electroless plating, or after filling the conductive paste. The method of forming the conventional conductive via formed by the above steps has the following problems. First, since the via hole 1〇4 is formed by the irradiation of the laser light, The closer the through hole 104 is to the connection electrode 1〇1, the smaller the cross-sectional area is, and the joint area of the conductive via hole 1〇5 and the connection electrode 1〇1 cannot be sufficiently enlarged, resulting in difficulty in obtaining a large joint strength. In addition, since the inner wall surface of the through hole 1〇4 is tapered toward the outer side, the conductive through hole 1〇5 is easily peeled off from the wall surface of the through hole 104, and if the conductive through hole 1〇5 is from the wall surface of the through hole 1〇4 When peeling off, the conductive via 105 is easily detached from the through hole 1〇4 In addition, if the conduction hole 105 of the 201212764 is detached from the through hole 104, the conductive via 105 and the connection electrode 110 are also easily peeled off, which may cause a disconnection between the two. The surface of the substrate 103 is irradiated with the laser beam by the connection electrode 101 embedded in the resin layer 1A. Therefore, when the formation position of the connection electrode 101 in the wiring substrate 1A2 is shifted, the through hole 104 does not reach the connection electrode. 101, there is a case where the conductive via 1〇5 cannot be connected to the connection electrode 101. Further, the position of the connection electrode 1〇1 is shifted, resulting in the conductive via 105 and the connection electrode 1〇1. The joint area is smaller than the joint area of the design, and there is a case where the electrical connection or the joint strength between the two is insufficient. In addition, when the formation position of the connection electrode 1〇1 in the wiring substrate 102 is shifted, the through hole passing through the wiring substrate 102 is formed by the irradiation of the laser light, and the wiring substrate 1〇2 is damaged. Therefore, there is a case where the area of the connection electrode 101 is formed to be larger than necessary, and at this time, the resin substrate itself is enlarged, which causes a problem of an increase in material cost. In addition, when the wiring substrate 102 is a ceramic substrate, the offset of the formation position of the connection electrode 101 may occur due to uneven firing during firing. When the wiring board 1〇2 is a glass epoxy board, the X may be caused by a state such as pressurization conditions at the time of manufacture. In addition, the wiring board 1〇2 + is deflected at the position where the connection electrode (8) is formed: the irradiation of the laser light is generally performed by the wiring substrate 1〇2 or the like, and the laser light is generated. The case of illuminating at a position deviating from the pole 1 0 1 . 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Fig. 10 (A) to (C) show a method of forming a conductive via disclosed in Patent Document i. Further, Fig. 10 (A) to (c) are cross-sectional views showing steps performed when a conductive via hole is formed on a resin substrate. First, as shown in FIG. 10(A), the wiring board 2〇2 made of ceramic, glass epoxy or the like formed with the connection electrode 201 made of Cu or the like is formed to be easily etched by the slag removal liquid. Further, on the first resin layer 2A3a made of a resin, a second resin layer 2?3b made of a resin which is hard to be etched by the slag-removing liquid is formed on the first resin layer 2?3a. Further, both the i-th resin layer 203a and the second resin layer 203b are made of a thermosetting or photothermable resin. Next, heating or light irradiation is performed to cure the i-th resin layer 2〇3& and the second resin layer 203b. However, at this time, the i-th tree layer 203a and the second resin layer 203b are not completely cured. Then, toward the connection electrode 201, laser light is applied to the resin layer 203a and the second resin layer 203b' to form a through hole 204 from the surface of the resin layer 2A3a to the connection electrode 201. Since the through holes 2〇4 are formed by the irradiation of the laser light, the closer to the surface of the core of the resin layer 2, the larger the cross-sectional area, and the closer to the connection electrode 2〇1, the smaller the m area is. In the way, the inner wall surface is formed into a tapered shape. Next, as shown in FIG. 10(B), the slag removal of the through holes 2〇4 is performed. As described above, the resin layer 203b is easily formed of a resin which is silver-etched by the slag-removing liquid, and the second resin layer 203b is made of a resin which is not easily etched by the slag-removing liquid. In the hole 204, the portion of the first ft wind tree layer 203a is subjected to the drum-shaped portion 204a, and the second layer of the resin layer 2〇3b of the second layer of the second layer of the second layer is almost formed to maintain the original shape of the cone. The cone is 2 servants. & Next, as shown in Fig. H) (C), a conductive via 205 composed of C is formed in the via hole. Patent Document 1: Japanese Laid-Open Patent Publication No. Hei. No. 2006-253189. SUMMARY OF THE INVENTION According to the conventional method for forming a conductive via disclosed in Patent Document i shown in FIGS. 10(A) to (C), a conductive via 2 is formed. Since the 〇5 is formed in a drum shape in the drum portion 204a of the through hole, the joint area with the connection electrode 2〇 can be enlarged, and the joint strength between the two can be improved. Further, since the portion of the drum can prevent the conductive via 2 〇 5 from being peeled off from the through hole 2 〇 4, the conductive via 205 can be formed to be less likely to be peeled off from the connection electrode 2 〇1. However, in the method of forming a conventional conductive via disclosed in Patent Document 1, in the case where the wiring substrate 202 is displaced from the formation position of the connection electrode 2〇1, the via hole 204 still does not reach the connection electrode 2 〇1, the conductive via 205 cannot be connected to the connection electrode 2〇1, or the bonding area of the conductive via 205 and the connection electrode 2〇1 is smaller than the designed bonding area ′ Problems such as the case that the connectivity or the joint strength is insufficient are not solved. Further, if the laser light is not irradiated at the correct position, the through hole penetrating the wiring board 202 or the electronic component buried in the wiring board 202 201212764 is not solved. Further, it is also difficult to irradiate the laser light in the oblique direction, and it is difficult to form the conductive via hole in the oblique direction. Further, the most problem of the conventional method for forming a conductive via hole disclosed in Patent Document 1 is that it is necessary to form a first resin layer 203a composed of a resin which is easily etched by the slag-removing liquid on the wiring substrate 202, and There are two kinds of resin layers of the second resin layer 203b which are not easily affected by the resin for etching the slag liquid, and there are problems such as complicated processes. In order to solve the above-mentioned problems, the present invention provides a method for manufacturing an electronic component according to the present invention, comprising: a step of preparing a wiring board on which a connection electrode is formed on at least one main surface; a step of forming a columnar temporary body on the electrode; and a step of burying the columnar temporary body so as to cover at least one main surface of the wiring substrate so as to cover at least the connection portion between the columnar temporary body and the connection electrode; a step of imparting a desired hardness to the resin layer; and dissolving the columnar temporary body embedded in the resin layer by using a chemical solution in which the resin layer is not easily dissolved and the columnar temporary body is soluble, so as to form a columnar portion in the resin layer a step of forming substantially the same shape of the void; and filling the void with a conductive component to form a conductive via. Instead of the conductive vias connected to the connection electrodes formed on the wiring substrate, conductive vias connected to the terminal electrodes of the electronic components mounted on the wiring substrate may be formed in the same manner. Since the method of manufacturing the electronic component of the present invention is constituted by the above-described contents, the following effects can be exhibited. The conductive via can be reliably connected to the connection electrode formed on the wiring substrate or the terminal electrode of the electronic component mounted on the wiring substrate. 5 201212764 Further, in the manufacturing process, if the position of the columnar temporary body is not good, the columnar temporary body can be removed and the plate-shaped temporary body can be newly formed again at the correct position. Further, if the shape of the formed columnar temporary body is not good, the shape can be corrected or the columnar temporary body can be newly formed again. Further, since there is no step of irradiating the laser light, even if the position of the terminal electrode of the connection electrode or the mounted electronic component is shifted, the wiring board or the mounted electronic component is not damaged. Further, the electronic component manufactured according to the present invention can exert the following effects. In the vicinity of the surface of the resin layer, the conductive via hole is formed so as to face the connection electrode formed on the wiring substrate or the terminal electrode of the electronic component mounted on the wiring substrate. In this case, the conductive via hole can be prevented from being peeled off from the resin layer, and the conductive via hole can be prevented from being peeled off from the wiring electrode or the terminal electrode. Further, in the vicinity of the connection electrode formed on the wiring board or in the vicinity of the terminal electrode of the electronic component mounted on the wiring board, an expansion portion having a large cross-sectional area can be provided (in this case, the base portion can be used) The bonding strength between the conductive via and the connecting electrode or the terminal electrode is improved, and the conductive via is prevented from being peeled off from the resin layer, thereby preventing the conductive via from being peeled off from the wiring electrode or the terminal electrode. The intermediate portion of the entire length of the conductive via forms an expanded portion having a large cross-sectional area. In this case, the conductive via can be prevented from being peeled off from the resin layer to prevent the conductive via from being connected to the electrode or the terminal electrode. Peeling 201212764 Further, an expansion portion having a large cross-sectional area can be formed in the vicinity of the surface of the resin layer of the conductive via. In this case, for example, on the surface of the electronic component, the connection electrode is not newly formed, and the connection can be utilized. The expanded portion of the conductive via exposed through the resin layer serves as a connection electrode. Further, the conductive via hole can be formed obliquely with respect to the surface of the wiring substrate. In this case, the degree of freedom in the arrangement of the conductive vias can be increased. For example, a plurality of connection electrodes formed in a narrow range formed on the surface of the wiring substrate can be respectively connected to a wide range formed on the surface of the resin layer. The plurality of connecting electrodes and the like are used to change the pitch between the electrodes. [Embodiment] Hereinafter, the embodiment for carrying out the present invention will be described together with the drawings. [First Embodiment] Fig. 1 (A) ® 2 ( F) shows a method of manufacturing the electronic article 1 of the first embodiment of the present invention. Further, each of the drawings of Figs. 1(A) to 2(8) is in each step of the first embodiment. The electronic yak 1 in the first embodiment is an electronic component in which an electronic component is embedded in an electronic component, or an electronic component in which other electronic components are embedded. First, as shown in Fig. 1 (A). 'Prepared on the main surface, a plurality of wiring boards 2 for connecting electrodes 1a and 1b are formed in advance, and electronic components 3 having a pair of terminal electrodes 3a formed at both ends are formed in a predetermined connection electrode ^. For example, the equipment can be borrowed The solder paste is applied to the connection electrode lb in advance, and the terminal 5 201212764 sub-electrode 3 a is placed on the ganb, the 戟 戟 、, and then heated to cool the solder to make it fine. In addition, as the wiring board 2, in addition to the wiring board formed by the cylinder, v & + tile glass % oxygen, etc., it is also possible to use ^ _ Ding Shou m曰 The shape of the substrate having the electrode for connection on the surface of the Japanese yen 4 is x. The structure is mounted on the wiring board 2 =: the type, the number of the parts 3, and the number of the terminal electrodes 4 are arbitrary. The present invention is not limited to the one shown in the figure. Next, as shown in Fig. 1(B), a columnar temporary body 4a is formed on the connection 电极 connection electrode h, and a column is formed on the terminal 噼 thousand electrode 3a of the electronic component 3. The temporary temporary columnar temporary body 4a 4b is formed of a material which is dissolved by a specific chemical solution. Specifically, for example, At w can be used to use a phenol resin which is dehydrated to sodium hydroxide or potassium hydroxide. In the present embodiment, the shape of the scorpion-shaped squatting body 4a, 4b is set such that the closer to the connection electrode 或3 or the terminal radiance 7 乂^ to the electrode 3a, the larger the cross-sectional area is. Conical shape. However, the shape of the columnar temporary bodies 4a, 4b is arbitrary, and is not limited to a conical shape, and various shapes such as a cylindrical shape, a pyramid shape, and a prism shape can be employed. The columnar temporary bodies 4a, 4b can be formed by bonding the preformed shape to a desired shape to the connection electrode 1a or the terminal electrode 3a. However, it is more preferable to use a thermosetting or photocurable resin in the materials of the columnar temporary bodies 4a and 4b and to eject the droplets of the resin to a predetermined position by an inkjet method. Further, in the case where a thermosetting or photothermable resin is used for the columnar temporary bodies 4a, 4b and formed by an inkjet method, '11 201212764 is preferably formed by heating or light irradiation after formation. It is hardened to have a desired hardness. When the inkjet method is used for the formation of the columnar temporary bodies 4a and 4b, the following effects can be exhibited. First, the formation positions of the columnar temporary bodies 4a, 4b can be changed at any time in accordance with the manufactured electronic components. Therefore, a variety of electronic components can be manufactured in the purlin production line. Further, the shape of the columnar temporary bodies 4a, 4b can be freely set in the range in which the discharge can be formed, and can be changed at any time. For example, when the amount of discharge at the initial stage of formation is increased in advance and gradually reduced from the drawing, a so-called tapered columnar temporary body having a larger cross-sectional area as the connection electrode u or the terminal electrode 3a is formed. 4a, 4b, similarly, the vicinity of the connection electrode 1a or the terminal electrode 3a of the columnar temporary bodies 4a, 4b, the middle portion of the entire length, and the resin layer (5) described later can be adjusted by adjusting the discharge amount. In the vicinity of the surface, an expansion portion having a large cross-sectional area is provided. Further, the columnar temporary bodies 4a, 4b may be formed in an oblique direction with respect to the surface of the wiring board 2. Further, in order to form the columnar temporary bodies 4a, 4b at predetermined positions, the position of the connection electrode u of the wiring board 2 or the terminal electrode 3a of the electronic component 3 can be grasped by a camera and controlled by a computer. . Alternatively, a mark indicating the display position may be provided in advance on the wiring board 2, the position of the mark may be grasped, and the positions of the columnar temporary bodies 4a, 4b may be controlled based on the mark. Further, the entire bottom surface of the columnar temporary bodies 4a, 4b does not need to be joined to the connection electrode 1a or the terminal electrode 33. In particular, in the case where the electronic component 3 is small, a part of the bottom surface of the dome-shaped temporary body 4b may be bonded to the terminal 12 201212764 electrode 3a, and the remaining portion may be bonded to the terminal-polarized substrate. Next, as shown in FIG. 1(C), the columnar temporary body 11 and the electronic component 3 are embedded to form a resin layer on the main surface of the wiring substrate 2, and the resin layer 5 also serves as an electronic component to be manufactured. In the case of mounting, it is preferably composed of a material which is preferable in heat resistance and chemical resistance. Further, as the material of the resin layer 5, an epoxy resin, an acrylic resin, a polyoxymethylene resin, a cyanic acid (IV) 1, a polyphenylene (tetra) resin, or the like which is thermosetting, optically, or thermoplastic can be used. In addition, in addition to solubility, heat resistance, and chemical resistance, it is also possible to use a columnar temporary body or a metal component 3 to pass through, and it is also possible to use heat when the bonding property with the wiring board 2 is satisfied. Plastic resin. The formation of the sapphire layer 5 can be performed by passing through any of the thermosetting resin sheet, the photocurable resin sheet, and the thermoplastic resin sheet which are semi-molten after heating, through the columnar temporary bodies 4a, 4b or The electronic component 3 is placed on the wiring board 2 to be carried. However, it is more preferably carried out by applying any of the liquid thermosetting resin s, the photocurable resin, and the thermoplastic resin to the wiring board 2. In the case where a liquid resin is used, no undesired stress acts on the columnar temporary body 43, and the columnar temporary bodies 4a, 4b can be prevented from collapsing. Further, the front ends of the columnar temporary bodies 4a, 4b are preferably exposed from the surface of the resin layer 5. However, in the case where the resin layer 5 is buried at the front end of the columnar temporary bodies 4a, 4b, as described later, after the desired hardness is applied to the resin layer 5, it is necessary to grind the surface of the resin layer 5 so that The columnar temporary body 4a may have its front end exposed on the surface of the resin layer 5. 13 201212764 Next, the resin layer 5 is given a desired hardness. When the resin layer $ is made of a thermosetting resin, it is heated, and when the resin layer 5 is made of a photocurable resin, it is irradiated with light. Further, when the resin crucible 5 is made of a thermoplastic resin, it is carried out by a temperature lower than the melting point. Further, the resin layer 5 is imparted with a desired hardness in order to prevent the resin layer $ from being medicated when the columnar temporary bodies 4a, 4b are dissolved to form the pores (6a, 6b) in the step described below. The effect of the liquid. Therefore, when the resin 45 is formed of a thermosetting resin or a photocurable resin, it is not necessary to completely cure the resin layer 5 at this point, as long as the desired hardness can be obtained. Next, as shown in Fig. 2(D), the columnar temporary body is dissolved, and a hole is formed in the tree = layer 5, 6b. Further, the portion in which the columnar temporary body is present is the void 6a, and the portion in which the columnar temporary body is present becomes the void 6b. Then, the connection electrode 1a is exposed on the bottom surface of the hole, and the connection electrode 1b is exposed on the bottom surface of the hole 6b. The dissolution of the columnar temporary bodies 4a, 4b is carried out by dipping the entire liquid in the columnar temporary body 4a, which is not easily dissolved in the resin layer 5, and is dissolved. For example, when the resin layer 5 is made of an epoxy resin and the columnar temporary body is formed of a phenol resin, the epoxy resin is not easily dissolved, and the phenol tree can be dissolved in sodium hydroxide or Potassium hydroxide is used in the drug solution. Next, as shown in Fig. 2(E), the holes 6a, 6b are filled with a conductive component, and the conductive holes 7a' 7b are formed. As a result, the conductive via 7a is bonded to the connection electrode 1a, and the conductive via 7b is bonded to the terminal electrode 3a of the electronic component 3. 8 14 201212764 As the conductive component filled in the pores 6a and 6b, for example, a conductive paste containing Cu, Ag, Ni or the like as a main component can be used. In the case where a conductive paste is used, it is heated after filling to harden the conductive paste. When the eucalyptus layer 5 is made of a thermosetting resin and is not completely cured at this time, the curing of the conductive paste and the curing of the resin layer 5 can be simultaneously performed. Further, these hardening may be carried out by pressing a foil or the like on the surface of the resin layer 5 in the step described below. Further, the conductive component is filled in the voids 6a, 6b, and may be formed by electroplating. Alternatively, it may be carried out by electroless plating and electroplating which is continued there. As the kind of the metal to be plated, Cu, Ag, Ni, or the like can be used. Finally, as shown in Fig. 2(F), the connection electrode 8 is formed on the surface of the resin layer 5, and the electronic component 1 is completed. The formation of the connection electrode 8 can be carried out, for example, by crimping a Cu pig or the like onto the entire surface of the resin layer 5 and etching it into a desired shape. As a result, the conductive vias 7a, 7b are respectively joined to the predetermined connection electrodes 8. The method of manufacturing the electronic component of the first embodiment has been described above. However, the present invention is not limited to the above, and various modifications can be made in accordance with the gist of the invention. For example, in the electronic component manufactured in the present embodiment, the electronic component is embedded in the electronic component 3 or the electronic component of the electronic component 3 is embedded therein. However, the present invention can also be applied. A conductive via hole can be formed in the same manner in a method of manufacturing a resin substrate in which an electronic component is not embedded.
15 201212764 [第2實施形態] 在圖3(A)〜（C)，表示本發明之第2實施形態之電子元 件200之製造方法。&外，冑3(A)〜（C)之各圖係表示在第 2實施形態所實施之各個步驟的截面圖。 第2實施形態中’係在圖1(A)〜圖2(F)所示之第丄實 施形態之電子元件之製造方法之步驟的一部分加入變更。 第2實施形態係至以下所述之處為止，使用與第丨實 施形態相同之步驟，亦即第i實施形態中圖丨所示之在 形成於配線基板2之連接用電極la上形成柱狀暫置體 在構裝於配線基板2之電子零件3之端子電極3&上形成柱 狀暫置體4b。 第2實施形態中，接著，係如圖3(A)所示，完全地埋 設柱狀暫置體4a，4b及電子零件3，以在配線基板2之主面 上形成樹脂層15。 其次’對樹脂層15賦予所欲之硬度。亦即，在樹脂層 15為由熱硬化性樹脂構成的情況下係予以加熱，在樹脂層 15為由光硬化性樹脂構成的情況下則進行光照射。又，在 樹脂層15為由熱可塑性樹脂構成的情況下係返回熔點以下 之溫度。 其次’圖3(A)中，在以鏈線χ-χ所示之部分，研削樹 脂層15之表面，如圖3(B)所示，以使柱狀暫置體4a，4b之 前端露出於樹脂層1 5之表面。 其次，如圖3(C)所示，與第1實施形態同樣地，溶解 柱狀暫置體4a，4b以在樹脂層15形成空孔6a，6b » 16 201212764 第2實施形態中’其後續之步驟技^ ^ μ 7鄉係使用與第1實施形 態相同之步驟，以完成電子元件2〇〇。 如第2實施形態般’若加入研削樹脂層15之表面的步 驟，即可確實地進行導電通孔7a，7b與連接用電極8之接 合。又，可製得樹㈣Η之表面為平滑的電子元件期。 [第3實施形態] 在圖4(A)〜圖5(E)，表示本發明之第3實施形態之電 子元件300之製造方法。此外，圖4(Α)〜圖5(Ε)之各圖係 表示在第3實施形態所實施之各個步驟的截面圖。 第3實施形態中，係在圖1(a)〜圖2(F)所示之第1實 施形態之電子元件之製造方法之步驟的一部分加入變更。 第3實施形態係至以下所述之處為止，使用與第i實 施形態相同之步驟，亦即第1實施形態中圖1 (B)所示之在 連接用電極la上形成柱狀暫置體4a’在電子零件3之端子 電極3a上形成柱狀暫置體4b» 第3實施形態中，接著，係如圖4(A)所示，完全地埋 設柱狀暫置體4a，4b及電子零件3，以在配線基板2之主面 上形成樹脂層5，並且在該樹脂層5上配置治具基板9，其 中該治具基板9係形成有以與柱狀暫置體4a，4b大致同成 分所形成之複數個追加柱狀暫置體14a，14b。追加枉狀暫置 體14a，14b例如係由半球形狀構成，與治具基板9之接合 面積係大於柱狀暫置體4a，4b之前端部分的面積。此外， 追加柱狀暫置體14a，14b之形狀係任意，並不限制於上述 之内容。 17 201212764 欲將追加柱狀暫置體14a，14b形成於治具基板9,與柱 狀暫置體4a，4b之形成同樣地，係可使用喷墨法》治具基 板9之材質係不拘。 其次’如圖4(B)所示，使治具基板9抵接於樹脂層5 之表面。在此時點’由於樹脂層5尚未完全地硬化，因此 追加柱狀暫置體14a，14b即埋入樹脂層5，追加柱狀暫置體 14a係配置在柱狀暫置體4a之附近，追加柱狀暫置體 則配置在柱狀暫置體4b之附近，並視需要而分別予以一體 化。此處之附近係指可在後述暫置體之溶解步驟除去之程 度的樹脂厚度。此外’第3實施形態中’係異於第2實施 形態’而無需使柱狀暫置體4a，4b之前端露出於樹脂層5 之表面。又’在柱狀暫置體4a與追加柱狀暫置體i^a之間、 以及柱狀暫置體4b與追加柱狀暫置體14b之間，即使些微 殘留有樹脂層5之樹脂亦無妨。因若只是些微之殘留則在 後續之溶解追加柱狀暫置體14a，14b及柱狀暫置體4a，4b 的步驟即可除去之故。 其次，如圖5(C)所示，從樹脂層5之表面剝離治具基 板9 〇 其次，藉由加熱、光照射等，對樹脂層5賦予所欲之 硬度。 其次，如圖5(D)所示’溶解追加柱狀暫置體14a，14b 及柱狀暫置體4a，4b，以在樹脂層5形成空孔16a，16b。空 孔16a係和一體化後之柱狀暫置體4a與追加柱狀暫置體 14a大致同形狀，而空孔16b則和一體化後之柱狀暫置體々b 18 ⑤ 201212764 與追加柱狀暫置體14b大致同形狀。 其次，如圖5(E)所示，在空孔16a，16b内填充導電成 分’以形成導電通孔17a，17b，而完成電子元件300。此外， 在使用導電糊作為導電成分的情況下，係在填充後予以加 熱以使導電糊硬化。 電子元件300中’係在導電通孔17a，17b之從樹脂層5 之表面的露出部分’形成有截面積較大的擴張部17(^此擴 張部17c係藉由使用追加柱狀暫置體14a，14b所形成的部 分0 電子元件300中，由於可利用擴張部17c作為連接用電 極’因此在樹脂層5之表面無需另外再形成連接用電極。 因此，可簡化製程。此外，當然在樹脂層5之表面的擴張 部17c之上，另外再形成連接用電極亦無妨。 [第4實施形態] 在圖6表示本發明之第4實施形態之電子元件4〇〇之 截面圖。此外，圖6中，對與第丨實施形態之電子元件1〇〇(參 照圖2(F))相同之部分係賦予同一符號。此外，以下如無特 別必要則省略該部分之說明。又，若無特別說明，則該部 分之形成方法係利用與第丨實施形態相同之形成方法。 電子兀件4GG係'在樹脂層5之内部形成有複數個導電 通孔27a，27a’ 27b’ 27b。此外’ f電通孔…係連接於形成 在配線基板2之連接用電極u ’導電通孔27b則連接於構 裝在配線基板2之電子零件3的料電極3” 、 導電通孔27a係在從樹脂層 之露出部分，形成有截面 19 201212764 積較大的擴張部27c，在與連接用電極u之接合部分，則 形成有截面積較大的擴張部27de又，導電通孔2%係在從 樹脂層5之露出料’形成有截面積較大的擴張部27卜 擴張部27c，27d可藉由在柱狀暫置體設有該種截面積 較大的部分來形成^在藉由噴墨法形成柱狀暫置體的情況 下’只要在該部分增加樹脂之吐出量即可。然而，針對擴 張部27c，與第3實施形態同樣地（參照圖4(a)、（b))，亦可 藉由使追加柱狀暫置體接合在柱狀暫置體之前端而予以一 體化來形成。 由於電子元件400具有擴張部27d ,因此導電通孔27& 與連接用電極la即確實地連接^又，由於具有擴張部27c， 因此可利用此作為連接用電極，在樹脂層5上無需另外再 形成連接用電極，而可簡化製程。 [第5實施形態] 在圖7表示本發明之第5實施形態之電子元件5〇〇之 截面圖。此外，圖7中，對與第1實施形態之電子元件100(參 照圖2(F))相同之部分係賦予同一符號。此外，以下如無特 別必要則省略該部分之說明。又，若無特別說明，則該部 分之形成方法係利用與第丨實施形態相同之形成方法。 電子元件500係在樹脂層5之内部形成有複數個導電 通孔37a，37b。此外’導電通孔37a係連接於形成在配線基 板2之連接用電極u ’導電通孔37b則連接於構裝在配線 基板2之電子零件3的端子電極3&。 導電通孔37a係在從樹脂層5之露出部分，形成有截面 ⑧ 201212764 積較大的擴張部37c，在全長之中間部分則形成有截面積較 大的擴張部37e。又，導電通孔37b係在從樹脂層5之露出 部分，形成有截面積較大的擴張部37c。此外，擴張部 係只要形成在導電通孔37a之樹脂層5表面與連接用電極 la間的任一部分即可，而無需形成在兩者之中點部分。 擴張部37c，37e可藉由預先在柱狀暫置體設有該種截 面積較大的部分來形成。 由於電子元件5〇〇具有擴張部37e，因此可防止導電通 孔37a從樹脂層5剝離，進而可防止導電通孔37&從連接用 電極la剝離。又’亦可利用從樹脂層5露出之擴張部 作為連接用電極。 [第6實施形態] 在圖8表示本發明之第6實施形態之電子元件6〇〇之 截面圖。此外，圖8中，對與第i實施形態之電子元件1〇〇(參 照圖2(F))相同之部分係賦予同一符號。此外，以下如無特 =必要則省略該部分之說明。又，絲特別說明，則該部 分之形成方法係利用與第丨實施形態相同之形成方法。 電子元件600係在樹脂層5之内部形成有複數個導電 通孔47a，47b。此外，導電通孔47a係連接於形成在配線基 板2之連接用電極u，導電通孔梢則連接於構裝在配線 基板2之電子零件3的端子電極3a。 導電通孔47a係相對於配線基板2之表面形成為斜向。 又，導電通孔47a，47b係在從樹脂層5之露出部分，形成 有戴面積較大的擴張部47c。 21 201212764 導電通孔47a係藉由將柱狀暫置體相對於配線基板2 之表面形成為斜向，而可相對於配線基板2之表面形成為 斜向。擴張部47c可藉由預先在柱狀暫置體設有該種截面積 較大的部分來形成。 由於電子元件600係於斜方向形成有導電通孔47a，因 此可提升在樹脂層5内之配線的自由度。例如，可在樹脂 層5之表面擴大間距並導出集中形成於配線基板2表面之 狹窄範圍的複數個連接用電極i a，i a。又，可利用從樹脂層 5露出之擴張部47c作為連接用電極。 【圖式簡單說明】 圖UA)〜（C)係表示在本發明之第i實施形態之電子元 件之製造方法中所實施之各個步驟的截面圖。 圖係圖1之後續，圖2(D)〜（F)係表示在本發明之第 1實施形態之電子元件之製造方法中所實施之各個步驟的 截面圖。 圖3(A)〜(〇係表示在本發明之第2實施形態之電子元 件之製造方法中所實施之各個步驟的截面圖。 圖4(A) (B)係表示在本發明之第3實施形態之電子元 件之製造方法中所實施之各個步驟的截面圖。 圖5係圖4之接έέ m Ρ , 之後續，圖5(c)〜（E)係表示在本發明之第 3實施形態之電子元杜夕制、λ 牛之製ie方法中所實施之各個步驟的 截面圖。 圖6係表示本發_日只 + 穷月之第4貫施形態之電子元件的截面 ⑤ 201212764 圖。圖7係表示本發明之第5實施形態之電子元件的截面 圖。圖8係表示本發明之第6實施形態之電子元件的戴面 圖9(A)〜(C)係表示在習知之導電通孔之形成方法 實施之各個步驟的截面圖。 圖10(A)〜（〇係表示在另一習知之導電通孔之形成方 法（專利文獻1所揭示之導電通孔的形成方法）中所實施之 各個步驟的截面圖。 【主要元件符號說明】 1 a’ 1 b 連接用電極（形成在配線基板2上） 2 配線基板 3 電子零件 3a，3b 端子電極· 4a，4b 柱狀暫置體 5 ’ 15 樹脂層 6a> 6b, 16a, 16b 通孔 7b} 17a, 17b, 27as 27b, 37a, 37b, 17a, 17b, 47a, 47b 導電通孔 8 連接用電極（形成在樹脂層5, 15上）[2012] [Second Embodiment] A method of manufacturing an electronic component 200 according to a second embodiment of the present invention is shown in Figs. 3(A) to 3(C). In addition, each of 胄3 (A) to (C) shows a cross-sectional view of each step performed in the second embodiment. In the second embodiment, a part of the steps of the method of manufacturing the electronic component of the third embodiment shown in Figs. 1(A) to 2(F) is incorporated. In the second embodiment, the same steps as in the second embodiment are used, that is, the column electrode formed on the connection electrode 1a formed on the wiring board 2 as shown in the figure of the i-th embodiment is formed. The temporary body forms a columnar temporary body 4b on the terminal electrodes 3& of the electronic component 3 which is mounted on the wiring board 2. In the second embodiment, as shown in Fig. 3(A), the columnar temporary bodies 4a, 4b and the electronic component 3 are completely embedded to form the resin layer 15 on the main surface of the wiring board 2. Next, the resin layer 15 is imparted with a desired hardness. In other words, when the resin layer 15 is made of a thermosetting resin, the resin layer 15 is heated, and when the resin layer 15 is made of a photocurable resin, light irradiation is performed. Further, when the resin layer 15 is made of a thermoplastic resin, it is returned to a temperature equal to or lower than the melting point. Next, in Fig. 3(A), the surface of the resin layer 15 is ground at a portion indicated by a chain line χ-χ, as shown in Fig. 3(B), so that the front ends of the columnar temporary bodies 4a, 4b are exposed. On the surface of the resin layer 15. Then, as shown in Fig. 3(C), in the same manner as in the first embodiment, the columnar temporary bodies 4a, 4b are dissolved to form voids 6a in the resin layer 15, 6b » 16 201212764. The steps of the technique are the same as in the first embodiment to complete the electronic component 2〇〇. When the step of grinding the surface of the resin layer 15 is added as in the second embodiment, the conductive via holes 7a, 7b can be surely joined to the connection electrode 8. Moreover, the surface of the tree (four) can be made into a smooth electronic component period. [Third Embodiment] A method of manufacturing the electronic component 300 according to the third embodiment of the present invention is shown in Figs. 4(A) to 5(E). Further, each of Figs. 4(Α) to 5(Ε) shows a cross-sectional view of each step performed in the third embodiment. In the third embodiment, a part of the steps of the method of manufacturing the electronic component of the first embodiment shown in Figs. 1(a) to 2(F) is incorporated. In the third embodiment, the same steps as in the i-th embodiment are used, that is, the columnar temporary body is formed on the connection electrode 1a shown in Fig. 1(B) in the first embodiment. 4a', the columnar temporary body 4b is formed on the terminal electrode 3a of the electronic component 3. In the third embodiment, the columnar temporary bodies 4a, 4b and the electrons are completely embedded as shown in Fig. 4(A). In the component 3, the resin layer 5 is formed on the main surface of the wiring substrate 2, and the jig substrate 9 is disposed on the resin layer 5, wherein the jig substrate 9 is formed to be substantially parallel to the columnar temporary bodies 4a, 4b. A plurality of additional columnar temporary bodies 14a, 14b formed by the same component. The additional braided temporary bodies 14a and 14b are formed, for example, in a hemispherical shape, and the joint area with the jig substrate 9 is larger than the area of the front end portion of the columnar temporary bodies 4a and 4b. Further, the shape of the additional columnar temporary bodies 14a and 14b is arbitrary, and is not limited to the above. 17 201212764 The additional columnar temporary bodies 14a and 14b are formed on the jig substrate 9, and the material of the jig substrate 9 can be used in the same manner as the formation of the columnar temporary bodies 4a and 4b. Next, as shown in Fig. 4(B), the jig substrate 9 is brought into contact with the surface of the resin layer 5. At this time, the resin layer 5 is not completely cured. Therefore, the columnar temporary bodies 14a and 14b are additionally embedded in the resin layer 5, and the additional columnar temporary bodies 14a are disposed in the vicinity of the columnar temporary bodies 4a. The columnar temporary bodies are disposed in the vicinity of the columnar temporary bodies 4b, and are integrated as needed. Here, the vicinity refers to the thickness of the resin which can be removed in the dissolution step of the temporary body described later. Further, in the third embodiment, the second embodiment is different from the second embodiment, and the front ends of the columnar temporary bodies 4a, 4b need not be exposed on the surface of the resin layer 5. Further, between the columnar temporary body 4a and the additional columnar temporary body i^a, and between the columnar temporary body 4b and the additional columnar temporary body 14b, even if the resin of the resin layer 5 remains slightly No problem. If only a slight residue remains, the subsequent addition of the columnar temporary bodies 14a, 14b and the columnar temporary bodies 4a, 4b can be removed. Next, as shown in Fig. 5(C), the jig substrate 9 is peeled off from the surface of the resin layer 5. Next, the resin layer 5 is given a desired hardness by heating, light irradiation or the like. Next, as shown in Fig. 5(D), the additional columnar temporary bodies 14a and 14b and the columnar temporary bodies 4a and 4b are dissolved to form voids 16a and 16b in the resin layer 5. The hollow hole 16a and the integrated columnar temporary body 4a and the additional columnar temporary body 14a have substantially the same shape, and the hole 16b and the integrated columnar temporary body 々b 18 5 201212764 and the additional column The temporary body 14b has substantially the same shape. Next, as shown in Fig. 5(E), the conductive members are filled in the holes 16a, 16b to form the conductive via holes 17a, 17b, and the electronic component 300 is completed. Further, in the case where a conductive paste is used as the conductive component, it is heated after filling to harden the conductive paste. In the electronic component 300, 'the exposed portion from the surface of the resin layer 5 of the conductive vias 17a, 17b' is formed with an enlarged portion 17 having a large cross-sectional area (the expanded portion 17c is formed by using an additional columnar temporary body) In the partial 0 electronic component 300 formed by 14a, 14b, since the expanded portion 17c can be used as the connecting electrode ', it is not necessary to separately form the connecting electrode on the surface of the resin layer 5. Therefore, the process can be simplified. In addition, the connection electrode may be formed on the surface of the layered portion of the layer 5, and the connection electrode may be formed. [Fourth Embodiment] Fig. 6 is a cross-sectional view showing the electronic component 4A according to the fourth embodiment of the present invention. In the sixth embodiment, the same components as those of the electronic component 1A (see Fig. 2(F)) of the second embodiment are denoted by the same reference numerals, and the description of the portions will be omitted unless otherwise specified. In addition, the formation method of this part is the same as the formation method of the ninth embodiment. The electronic component 4GG is formed with a plurality of conductive vias 27a, 27a' 27b' 27b inside the resin layer 5. Electric through hole... The connection electrode u' electrically connected via hole 27b formed in the wiring board 2 is connected to the material electrode 3' of the electronic component 3 mounted on the wiring substrate 2, and the conductive via hole 27a is exposed from the resin layer. The expanded portion 27c having a large cross-section 19 201212764 is formed, and the portion to be joined to the connection electrode u is formed with the expanded portion 27de having a large cross-sectional area, and the conductive via 2% is exposed from the resin layer 5. 'The expansion portion 27 having a large cross-sectional area is formed. The expansion portion 27c, 27d can be formed by providing a portion having a large cross-sectional area in the column-shaped temporary body to form a columnar temporary portion by an inkjet method. In the case of the body, the amount of discharge of the resin may be increased in this portion. However, the expansion portion 27c may be similar to the third embodiment (see FIGS. 4(a) and 4(b)). The columnar temporary body is joined to the front end of the columnar temporary body and integrated. The electronic component 400 has the expanded portion 27d, so that the conductive via 27& and the connecting electrode 1a are reliably connected. The expansion portion 27c can be used as the connection electrode In the resin layer 5, it is not necessary to separately form a connection electrode, and the process can be simplified. [Fifth Embodiment] Fig. 7 is a cross-sectional view showing an electronic component 5A according to a fifth embodiment of the present invention. The same components as those of the electronic component 100 (see FIG. 2(F)) of the first embodiment are denoted by the same reference numerals, and the description of the portions will be omitted unless otherwise specified. The formation method of this portion is the same as the formation method of the second embodiment. The electronic component 500 has a plurality of conductive vias 37a and 37b formed inside the resin layer 5. Further, the conductive vias 37a are connected to the wiring. The connection electrode u' of the substrate 2 is electrically connected to the terminal electrode 3& of the electronic component 3 which is mounted on the wiring board 2. The conductive via hole 37a is formed with an enlarged portion 37c having a large cross section 8 201212764 from the exposed portion of the resin layer 5, and an enlarged portion 37e having a large cross-sectional area is formed in the middle portion of the entire length. Further, the conductive via hole 37b is formed in an exposed portion from the resin layer 5, and an expanded portion 37c having a large cross-sectional area is formed. Further, the expanded portion may be formed in any portion between the surface of the resin layer 5 of the conductive via 37a and the connection electrode la, and it is not necessary to form a portion between the two. The expanded portions 37c, 37e can be formed by providing a portion having a large cross-sectional area in the columnar temporary body in advance. Since the electronic component 5 has the expanded portion 37e, the conductive via 37a can be prevented from being peeled off from the resin layer 5, and the conductive via 37& can be prevented from being peeled off from the connecting electrode 1a. Further, the expanded portion exposed from the resin layer 5 may be used as the electrode for connection. [Sixth embodiment] Fig. 8 is a cross-sectional view showing an electronic component 6A according to a sixth embodiment of the present invention. In Fig. 8, the same components as those of the electronic component 1A (refer to Fig. 2(F)) of the i-th embodiment are denoted by the same reference numerals. In addition, the following description is omitted if there is no special = necessary. Further, in particular, the method of forming the portion is the same as the formation method of the second embodiment. The electronic component 600 is formed with a plurality of conductive vias 47a, 47b inside the resin layer 5. Further, the conductive vias 47a are connected to the connection electrodes u formed on the wiring substrate 2, and the conductive via tips are connected to the terminal electrodes 3a of the electronic components 3 mounted on the wiring substrate 2. The conductive vias 47a are formed obliquely with respect to the surface of the wiring substrate 2. Further, the conductive via holes 47a, 47b are formed in an exposed portion from the resin layer 5, and an expanded portion 47c having a large wearing area is formed. 21 201212764 The conductive via hole 47a is formed obliquely with respect to the surface of the wiring board 2 by forming the columnar temporary body in an oblique direction with respect to the surface of the wiring board 2. The expanded portion 47c can be formed by providing a portion having a large cross-sectional area in the columnar temporary body in advance. Since the electronic component 600 is formed with the conductive via hole 47a in the oblique direction, the degree of freedom of the wiring in the resin layer 5 can be improved. For example, a plurality of connection electrodes i a, i a which are concentrated on a narrow range of the surface of the wiring board 2 can be formed by widening the pitch on the surface of the resin layer 5. Further, the expanded portion 47c exposed from the resin layer 5 can be used as the electrode for connection. BRIEF DESCRIPTION OF THE DRAWINGS FIGS. UA) to (C) are cross-sectional views showing respective steps performed in the method of manufacturing an electronic component according to the i-th embodiment of the present invention. 1(D) to 2(F) are cross-sectional views showing respective steps performed in the method of manufacturing an electronic component according to the first embodiment of the present invention. 3(A) to 3(B) are cross-sectional views showing respective steps performed in the method of manufacturing an electronic component according to the second embodiment of the present invention. Fig. 4(A)(B) shows the third aspect of the present invention. A cross-sectional view of each step performed in the method of manufacturing an electronic component of the embodiment. Fig. 5 is a έέm Ρ of Fig. 4, and subsequent Figs. 5(c) to (E) are diagrams showing a third embodiment of the present invention. Fig. 6 is a cross-sectional view showing the steps of the electronic component of the ternary system of the ternary system and the λ method of the horn. Fig. 6 is a cross section of the electronic component of the fourth embodiment of the present invention. Fig. 7 is a cross-sectional view showing an electronic component according to a fifth embodiment of the present invention. Fig. 8 is a perspective view showing an electronic component according to a sixth embodiment of the present invention. Figs. 9(A) to 9(C) are shown in the prior art. FIG. 10(A) to FIG. 10(A) show a method for forming a conductive via hole (a method of forming a conductive via hole disclosed in Patent Document 1) in another conventional conductive via hole. Sectional view of each step performed. [Main component symbol description] 1 a' 1 b Connection Pole (formed on the wiring board 2) 2 Wiring board 3 Electronic parts 3a, 3b Terminal electrode 4a, 4b Column-shaped temporary body 5' 15 Resin layer 6a> 6b, 16a, 16b Through hole 7b} 17a, 17b, 27as 27b, 37a, 37b, 17a, 17b, 47a, 47b Conductive via 8 connection electrode (formed on resin layers 5, 15)
23twenty three