201212735 六、發明說明： 【發明所屬之技術領域】 本發明涉及板間隔柱，附著在板上，所以不用—_用手工 插入到板上祕中，即使大量生產也能倾—定的厚度，焊接 在板上，會使板和其他拼版之間_距—致。另外，本發明還 涉及製造所述間隔柱的製造方法。 【先前技術】 LCD LED PDP專平板式顯示幕（細panei，ρρο ) 已常用在生活中。隨著平板顯示幕㈣，裝有軸LCD面板等 的驅動回路的PCB板需要近接’由此pCB板被LCD面板壓住 形成短路等問題。而且因PCB板上㈣子部件和焊接部位的高 度不-致，當PCB板和LCD ©板密鱗，其高度差會使pCB 板弯曲。 圖1至圖3是韓國專利第2007_58〇6號（液晶背光燈裝置 及利用它的液晶裝置）中說明以往的LCD裝置的圖面，圖i是 分解斜視® ’圖2及@ 3用來說賴圖丨的柔性印刷電路板 (230)彎曲，印刷電路板（21〇)位於液晶背光燈裝置（2〇〇〇) 的底面。 參照圖1，LCD裝置包含螢幕裝置（1〇〇〇)和液晶背光燈 裝置（2000)，這裏，螢幕裝置（1〇〇〇)包含液晶顯示面板（1〇〇)， 驅動回路部（200) ’上部收藏部件（300)，背光燈裝置（2000) 包含燈管裝置（400)，導光板（5〇〇)，反射板（600)，光學薄 膜（700)，下部收藏部件（8〇〇)，緩衝部件（9〇〇)。 201212735 液晶顯示面板（100)由彩色濾光片基板（110)在TFT基 板（120)上積層形成。TFT基板（120)邊緣的驅動ic (111) 通過柔性印刷電路板（230)與PCB板（210)連接。PCB板（210) 上設有控制1C，向TFT基板（120)的資料線及栅極線傳送資 料信號及栅極信號。 設置在燈夾子（411)中的燈（410)發出的線光源形態的 光通過導光板（500)變為面光源形態，在反射板（6〇〇)的幫 助下通過光學板（710)及擴散板（720) ’均勻照射在液晶顯示 面板（100)上。 反射板（600)到液晶顯示面板（1〇〇)的積層構造由下部 收藏部件（800)和上部收藏部件（3〇〇)堅固維持著，如圖2 及3所不，柔性印刷電路板（23〇)向下彎曲，pCB板（21〇) 位於下部收藏部件（8〇〇)的底面。下部收藏部件設有緩衝部件 (900) ’防止柔性印刷電路板（23〇)的破損。 内的電子部件，Pi 存在一定的間隙。 如上所述’以往隨著平板顯示裝置變得越薄，板（2⑺） 4乎雄著於下部收藏部件（動）的底面，為了保護板(训) pCB板（21〇)和下部收藏部件（8〇〇)之間要 PCB板（210)密著於下部收藏部件（_)， 板⑽)上的電子部件的高度和焊接雜沒有規律，當 PCB 板（210)會 彎曲，為了防止其結果， 也要形成一定的間隙。201212735 VI. Description of the Invention: [Technical Field] The present invention relates to a plate spacer column which is attached to a board, so that it is not required to be manually inserted into the board, even if mass production can be tilted to a certain thickness, welding On the board, it will make the board and other impositions _ distance. Further, the present invention relates to a method of manufacturing the spacer. [Prior Art] LCD LED PDP flat panel display (fine panei, ρρο) has been used in life. With the flat display screen (4), the PCB board with the drive circuit of the shaft LCD panel or the like needs to be close-contacted, so that the pCB board is pressed by the LCD panel to form a short circuit. Moreover, due to the high degree of sub-components and solder joints on the PCB board, when the PCB board and the LCD board are densely scaled, the height difference causes the pCB board to bend. 1 to 3 are views showing a conventional LCD device in Korean Patent No. 2007_58-6 (liquid crystal backlight device and liquid crystal device using the same), and Fig. i is an exploded strabismus® 'Fig. 2 and @3 for The flexible printed circuit board (230) of Laituu is bent, and the printed circuit board (21〇) is located on the bottom surface of the liquid crystal backlight unit (2〇〇〇). Referring to Fig. 1, an LCD device includes a screen device (1) and a liquid crystal backlight device (2000). Here, the screen device (1) includes a liquid crystal display panel (1〇〇), and a driving circuit portion (200) 'Upper collection unit (300), backlight unit (2000) including lamp unit (400), light guide plate (5〇〇), reflector (600), optical film (700), lower collection parts (8〇〇) , buffer unit (9〇〇). The 201212735 liquid crystal display panel (100) is formed by laminating a color filter substrate (110) on a TFT substrate (120). The driving ic (111) at the edge of the TFT substrate (120) is connected to the PCB board (210) through a flexible printed circuit board (230). A control 1C is provided on the PCB (210) to transmit a data signal and a gate signal to the data line and the gate line of the TFT substrate (120). The light in the form of a line source emitted from the lamp (410) disposed in the lamp clip (411) is changed into a surface light source form by the light guide plate (500), and passes through the optical plate (710) with the help of the reflector (6). The diffusion plate (720) 'is uniformly irradiated on the liquid crystal display panel (100). The laminated structure of the reflecting plate (600) to the liquid crystal display panel (1〇〇) is firmly maintained by the lower collecting member (800) and the upper collecting member (3〇〇), as shown in FIGS. 2 and 3, the flexible printed circuit board ( 23〇) Bend downward, the pCB board (21〇) is located on the underside of the lower collection unit (8〇〇). The lower collecting member is provided with a cushioning member (900)' to prevent breakage of the flexible printed circuit board (23 〇). There is a certain gap in the Pi inside the electronic components. As described above, in the past, as the flat panel display device became thinner, the board (2(7)) was placed on the bottom surface of the lower collecting member (moving), in order to protect the board (training) pCB board (21〇) and the lower collecting part ( 8〇〇) The PCB board (210) is attached to the lower part (_), board (10), and the height of the electronic components and the soldering are irregular. When the PCB board (210) is bent, in order to prevent the result , also form a certain gap.
和PCB板 201212735 板以往間隔柱(10)的圖面。如圖4所示⑽And PCB board 201212735 board drawing of the previous spacer (10). As shown in Figure 4 (10)
搞/面相鱗接電子部件（21)的雜，如果PCB (800) j 位會被抽傷，會形成電氣故障。If the PCB (800) j position is scratched, it will cause an electrical fault.
為了防止上述問題’在PCB板（21())上穿孔後在孔 插^端料關陳⑽。鎌間陳⑽會結合在PCB 板21〇)上’因其間隔柱（10)下部1欠藏部件（800)和PCB 板（210)之間形成一定的間隙，從而防止pcB板⑵〇)上電 子部件（21)的故障。 以上’說明了下部收藏部件（800)和PCB板（210)之間 設有間隔㈣情況，但不限於此，其他面板和pCB板之間也發 生類似情況，設置間隔柱（1〇)β 以上，舉例說明了 PCB板（21G)的後面設有間隔柱⑽）， 4-不限於此’备PCB板（21〇)的前面，即裝有電子部件（21) 的一側密著於其他面板時，可以在pCB板（21())的前面設置 間隔柱（10)。 另外，舉例說明了驅動液晶顯示面板（1〇〇)的PCB板 (210)’此外可以在主PCB板，背光燈pCB板，電源pcB板 等多種PCB板上設置間隔柱（1〇)。 但是，以往的間隔柱（1〇)要由工作人員--用手工插入 到PCB板（210)孔中，所以在其設置費用及時間上非常不合 理。而且，因通過手工插入，所以多個間隔柱（1〇)的高度不 一致，形成略小的高度差，從而導致PCB板（21〇)和面板之 201212735 間間隔不'一致。 【發明内容】 為了解決上述問題，本發明提供一種板間隔柱及其製造方 ^，其間隔柱附著在板上，不用由工作人員一_用手插入到板 的孔中，而是通過自動化工程完成，所以即使大量生產，也 2具有相_厚度，焊接在板上時，會使板和其他面板之間 的間隔一致。 為了解決上綱題，本發明提供—種設置在板上的間隔柱， 其特徵在於，包含··六面體縣絕緣體本體；及覆蓋在本體相 對兩側面上的下部分的金屬箱，上述兩側面的上部分露著，下 部分被金紐蓋著；上述金屬糾接在上述板上，使上述本 體的底面附著在板。 上述本體且形成穿孔’貫通覆蓋金屬落的兩側面，穿孔中 塞入金屬悶頭，連接本體兩側面的金屬箔。 根據解決上述問題的本發明的一個例子，間隔柱的製造方 法’包含以下步驟：在絕緣板的兩面覆蓋金屬羯的第一步驟， 腐蝕上述金屬箔，使上述絕緣板露出，在上述絕緣板兩面，按 疋間距並排著多個條帶（stripe)的第二步驟；及跟著上述條 帶（Stripe)的一側邊緣，在與上述條帶（stripe)平行和垂直的 方向上，進行切斷的第三步驟。 上述第一步驟以後，可以包含在絕緣板上以點陣形態形成 穿孔的步驟’和在形成上述穿孔的物體上進行鍍金，在上述金 屬4上形成鍍金箔，上述穿孔内形成金屬悶頭的步驟；這時，In order to prevent the above problem, after the perforation on the PCB board (21()), the end of the hole is inserted (10).镰间陈(10) will be combined on the PCB board 21〇) because a certain gap is formed between the lower part 1 (800) of the spacer column (10) and the PCB board (210), thereby preventing the pcB board (2) 〇) Failure of the electronic component (21). The above 'describes the case where the lower part (800) and the PCB board (210) are provided with a space (four), but is not limited thereto, and a similar situation occurs between the other panel and the pCB board, and the spacer column (1〇) β is set or more. For example, a spacer (10) is provided behind the PCB board (21G), 4- is not limited to the front of the 'prepared PCB board (21〇), that is, the side on which the electronic component (21) is mounted is attached to the other panel A spacer (10) can be placed in front of the pCB board (21()). Further, a PCB board (210) for driving the liquid crystal display panel (1) is exemplified. Further, spacer bars (1 〇) may be provided on various PCB boards such as a main PCB board, a backlight pCB board, and a power pc board. However, the conventional spacer (1〇) was manually inserted into the hole of the PCB board (210) by the worker, so it was very unreasonable in terms of installation cost and time. Moreover, because of the manual insertion, the heights of the plurality of spacers (1〇) are not uniform, resulting in a slightly smaller height difference, resulting in a gap between the PCB board (21〇) and the panel 201212735. SUMMARY OF THE INVENTION In order to solve the above problems, the present invention provides a plate spacer column and a manufacturing method thereof, wherein the spacer column is attached to the board, and is not required to be inserted into the hole of the board by a staff member, but through automation engineering. Finished, so even if it is mass produced, 2 has a phase thickness, which will make the spacing between the board and other panels consistent when soldered on the board. In order to solve the above problem, the present invention provides a spacer column disposed on a board, characterized by comprising: a hexahedron county insulator body; and a metal case covering a lower portion on opposite sides of the body, the above two The upper portion of the side surface is exposed, and the lower portion is covered by the gold button; the metal is attached to the plate so that the bottom surface of the body is attached to the plate. The body is formed with a through hole </ </ RTI> covering the two side faces of the metal drop, and the metal boring head is inserted into the through hole to connect the metal foil on both sides of the body. According to an example of the present invention for solving the above problems, the method for manufacturing a spacer column includes the steps of: covering a metal crucible on both sides of the insulating sheet, etching the metal foil, and exposing the insulating sheet to both sides of the insulating sheet a second step of arranging a plurality of strips along the 疋 spacing; and following one side edge of the stripe, in a direction parallel and perpendicular to the stripe, cutting The third step. After the first step, the method may include the steps of forming a perforation in a lattice form on an insulating plate and performing gold plating on the object forming the perforation, forming a gold-plated foil on the metal 4, and forming a metal bulkhead in the perforation; At this time,
S 6 201212735 上述第二步财的條帶是㈣鑛上述金難讀金_成 的0 在上述第四步驟完成的板間隔柱宜包含-個金屬悶頭。 、根據解決上述問題的本發明的另—個例子，間隔柱的製造 方法’包含以下步驟：在絕緣板的兩面覆蓋金屬的第-步驟， 腐钱上述金使上親緣板露出，在上述絕緣板兩面，按 -定間距麟著多雜帶（stripe)的第二步驟；及跟著上述條 帶（stripe)的一側邊緣，在與上述條帶（stripe)平行和垂 方向上，進行切斷的第三步驟。 的 上述第-步驟以後，可以包含在絕緣板上以點陣形態形成 穿孔的步驟’上述穿孔兩排相互接近形成—套，各套之間間隔 寬度比上述套_排之關距更大的步驟，在形成上述穿孔的 物體上進練金’在上述金屬紅形賴錢，上述穿孔内形 成金屬悶頭的步驟；這時，上述第二步驟中的條帶是通過腐姓 上述金屬fl及齡f|形成的，使上述—套穿孔位於上述條帶之 間，在上述第三步驟的切斷過程中，使形成一套的上述穿孔 兩排分開。 上述第二步驟以後，跟著上述條帶的中間，在與上述條帶 並排方向上形成V型槽’上述V型槽上以-賴距形成貫通上 述絕緣板的⑽孔。這時，在上述第三步射，跟著上述條帶 的中間在與其並行的方向上進行崎時，且雜通過上述V型 槽的中間。P刀’跟著與上述條帶垂直的方向上進行切斷時，切 斷線通過上述倒角孔。 201212735 根據為解決以上問題的本發明的另—個例子 構成包含六_形象絕緣讀，及位 ^間隔柱的 羯，其特徵為上述麵雜蓋在上述板上。體底面的金屬 上述本體的上懒落及衫部宜形綱角而傾斜。 根據解決上述問題的本發_另 造方法包含以下步驟：在絕緣板的板間隔柱的製 m , jh λ/- 面覆蓋金屬箔的第一步 驟在沒有金屬杂的另—側以格子形態形成互相W, 槽的第二步驟，及跟著上述ν型槽的 父型 成板間隔柱的第三步驟。 進仃靖，從而完 效果 以㈣隔妓侧板咖的，從而可 心設還因為是附著在板表面上，所以不用擔 生產。面度差，另外，其設置是自動化I程，適於大量 【實施方式】 例二：’ Ϊ照附圖對於本發明進行詳細的說明。以下的實施 了幫助理解本發明提示的，如果具有本領域通常知識 取明沾ί本發明的技術思想内，可以進行多種變形。因此，本 月的權利要求範圍不能限於以下的實施例。 【實施例1】 5a / 5疋說明本發明中實施例1的間隔柱（30)的圖面，圖 疋斜視圖’ gj 5b是圖根據A_A，線切斷圖$壮的垂直截面圖， 201212735 ' 是說明間隔柱㈤設置在PCB板（210)上的側面圖。 參照圖5a及圖5b，本發明中間隔柱（30)本體(；31)為六 面體形象’由j衣氧樹脂或塑膠等絕緣體組成，本體（Μ)相對 的兩側面附著形成金屬㈤，32b)。金屬(32a，32b)覆 蓋在本體（31)兩側面的下部分，本體（31)的側面上部分露 著，下部分被覆蓋著。 本體（31)上形成穿孔，貫通覆蓋本體上的金屬箔（32a， 32b) ’上述穿孔中塞入金屬悶頭（33)，相互連接金屬箔（32a， 32b)。金屬悶頭（33)防止金屬箔（32a，32b)剝離本體（31) 兩侧面，提高間隔柱（30)的信賴度。 如圖5c所示，間隔柱（3〇)在本體（31)的底面附著在 PCB板（21〇)上的狀態下，通過金屬(32a，32b)與PCB 板（21a〇)的焊接，固定設置在PCB板（210)上。金屬箱〇2a ’ 則疋為了進仃焊接而覆蓋的。間隔柱（30)還可以用膠枯劑 把本體（31)底面粘接在pCB板（21〇)上。 由於本體(31)底面附著在PCB板（210)上，金屬落㈤， 32b)鄰接PCB板（21〇)，但與面板（8〇)維持隔離狀態（參 :、、符號d)„如果金屬羯（32a，32b)覆蓋到兩側面的上部分的 居金屬4 (32a ’ 32b)會於面板（8〇)相接，pCB板（21〇) 和面板（80 )會形成電氣連接，導致短路，所以上述 32b)設置在本體（31)兩側面的下部分。 根據本發明’不是如同往常把間隔柱插入到PCB板的孔 中’而是通過焊接附著在PCB板上，與以往用手工設置間隔柱 201212735 相比’可以通鱗接工作的自動化，使_柱的設置變為自動 化。 製造方法1 圖6是說明圖5中製造間隔柱（30)的方法的圖面。首先， 如圖6a所不，準備一個兩面覆蓋著1次金屬箔(metal foil,320a， 320b)，例如銅箱（C0PPer foil)的絕緣板（310)，如圖6b，在絕 緣板（310 )上以點陣形式形成規則的穿孔（thr〇ugh h〇le，mo ), 直徑約為0.5mm，貫通1次金屬箔（32〇a，32〇b)。 然後’如圖6c所示，在形成穿孔（33〇)的物體的全體上 進行金屬鍍金，例如銅鍍金。這樣，不知是丨次金屬箔（32〇a， 320b) ’而且在穿孔（330)内也形成了金屬鍍金，丨次金屬箔 (320a，320b)上形成2次金屬箔（340a，340b)，穿孔（330)内 形成由銅形成的金屬悶頭（33)。 接著，如圖6d所示，用微影工程蝕刻2次金屬箔（34〇a， 340b)及1次金屬箔（320a，320b)，使絕緣板（320)露出，在 絕緣板（310)兩側以一定間距排列多個寬（d)相同的條帶 (stripe，50 )。 最後，如圖6e所示，跟著條帶（stIjpe，6〇)的一側邊緣進 行1次切斷（C1)，在與1次切斷（C1)垂直的方向上進行2 次切斷（C2)，以格子形式切斷絕緣板（31〇)，形成如圖7所示 的具有一個金屬悶頭（33)的間隔柱（30)。1次切斷（ci)和 2次（C2)切斷的順序無妨。 圖7是說明通過圖6製造過程完成的間隔柱（30)的圖面， 201212735 圖7a是外觀斜視圖，圖7b是枢姑 圄。如圖7所-丄據A線切斷7a的垂直截面 ^如圖7所不，本體⑼兩側形成的金㈣（32a，32b) 由於金屬_ (33 )不會輕易剝離本體（3ι )，在焊接工作中充 备本身的魏。把圖7抑标_著_陳⑽豎起來如 圖5所示，然後在PCB板（21〇)上進行焊接的話，pcB板⑵ 和面板（80)之間會形成一定間距。 根據上述的f造方法’通過靖工程（圖⑹的自動化， 可以使間隔柱（30)的大小—致，從而可以使間隔柱（3〇)的 高度一致。因此，PCB板⑵〇)和面板⑽）之間的間距會一 致’而且因為間隔柱（3〇)附著在pCB板（2⑹上可以通 過把附著王程成為自動化*料使設置間隔柱⑼）的過程成 為自動化。 製造方法2 圖8疋說明根據圖5製造間隔柱（3〇)的另一個例子的圖 面。首先’如圖8a所示，準備一個兩面覆蓋著i次金屬箔(metal £^1，320木3201))，例如銅箔（(；(^红如1)的絕緣板（31〇)，如圖 8b ’在絕緣板（310)上形成直徑約為〇 5mm的穿孔（如〇11讲 hole，330)，貫通1次金屬箔（320a, 320b)。這時，不像圖6b， 兩排穿孔（330)互相接近形成一套’其套之間的間距大於每套 的排之間的間距。 然後’如圖8c所示’在形成穿孔（330)的物體的全體上 進行金屬鑛金，例如銅鍍金。這樣，不知是1次金屬落（320a， 320b) ’而且在穿孔（330)内也形成了金屬鑛金，1次金屬箱 201212735 (320a，320b)上形成2次金屬箔（340a，340b)，穿孔（330)内 形成由銅形成的金屬悶頭（33)。 接著’如圖8d所示，用微影工程蝕刻2次金屬箔（340a， 340b)及1次金屬箔（320a，320b)，使絕緣板（32〇)露出，在 絕緣板（310)兩側以一定間距排列多個寬（2d)相同的條帶 (stripe，50)。這時，不像圖6d，在條帶（stripe，50)之間設 有上述一套（兩排）穿孔（330)。 最後，如圖8e所示，跟著條帶（stripe，6〇)的中間與條帶 (50)並行著進行1次切斷（C1)，條帶（5〇)之間的兩行穿孔 (330)分開，使在與！次切斷（C1)垂直的方向上進行2次切 斷（C2) ’以格子形式切斷切斷板⑽），形成如圖7所示的具 有一個金屬悶頭（33)的間隔柱（30)。1次切斷（C1)和2次 (C2)切斷的順序無妨。 【實施例2】 圖1 〇是說明本發明中第2實施例的間隔柱㈤的圖面。 如圖10所示實施例2具有與圖7相同的構造，間隔柱（3〇) 設置在PCB板(210)上時，位於上侧的角落（b)及角尖部⑷ 开j倒角，形成斜^這是為防止面板⑽）的損壞，如圖义， 時’ _ (3G)的編角尖部會壓到面 板（80)，使面板（8〇)破裂而損壞。 9疋°兒明圖1G中製造間隔柱（3G)的方法關面，經過 如同圖8的過程，如圖9b所示，其特徵 （ 和倒角孔（56)的步驟。 M v㈣ 201212735 並排&跟著上述條帶（5G)的中間，在與上述條帶（50) 並排方向切成v型槽⑻，上述v型槽⑻ 孔⑼。這時’物1(56)位於金屬悶頭（33)之間成= 孔（56)的截面宜顧形或菱形，但不限於此。 如圖9c所示，跟著v型槽（55)的中央和條帶 60)的中間與條帶⑼）並行著進行1次切斷（⑴，使條帶（50、 之間的兩仃？孔（33G)分開’在與1次切斷（α)垂直的方向 上進行2次靖（C2)’使其經過则孔⑼，以格子形式切 斷切斷板（31Gj。這樣’如圖1G所示，當豐起間隔柱⑽時 位於上側的祕⑻及角尖部⑷形成倒角而傾斜。 ，根據解決上述問題的本發明的另一個例子，板間隔柱的製 造方法包含以下步驟：在絕緣板的—面覆蓋金職的第一步 驟’在沒有金的另—㈣格子形態形成互相垂直交叉V型 槽的第二步驟’麟著上述v型槽的中間進行切斷，從而完 成板間隔柱的第三步驟。 【實施例3】 圖12是說明本發明的第3實施例的間隔桂⑼）的圖面。 如圖12所示，實施例3中的間隔柱⑼）在六面體形象的絕緣 本體⑶）的底面覆蓋著金難（則，金屬箱⑽）部位是 通過膠_⑽）細著在PCB板⑽）上。間隔柱（3〇) 枯著在PCB板（210)時，位於上側的角落（B)及角尖部⑷ 形成姻而傾斜。上述倒肖不是必要的，但輪止面板（8〇) 破損，宜存在。 13 201212735 圖11是說明製造圖12的間隔柱（30)的方法的圖面，如 圖11a所示，在絕緣板（310)的一侧形成金屬箔（320b)，如 同圖lib，在沒有形成金屬箔（32b)的一面以格子形態互相垂 直交叉形成V型槽（55a，55b)。然後如同圖llc，跟著v型槽 (55a ’ 55b)的中央進行切斷（Q，C2)的話，會如圖lid在 的與面板（80)接觸的角落（B)和角尖部（A)形成倒角。 如同上述，根據本發明間隔柱（30)在與面板（8〇)相接 觸的上側角落及角尖部形成倒角而傾斜，面板（8〇)不會被尖 銳的角落或角尖壓住或撕裂而破損。 【圖式簡單說明】 圖1至圖3是說明以往lcd裝置的圖面； 圖4是說明以往間隔柱（10)的圖面； 圖c疋說明本發明十第j實施例的間隔柱（)的圖面； =6a-6e是說明根據圖純製造間隔柱⑽的—個例子的圖 =.7b疋說明經過圖的製造過程之後的間隔柱（3〇)的 :8e是說明根據圖5峰製造間隔柱㈤的另-個例子的 圖㈣是說明圖10中製造間隔柱（30)的方法的圖面； 圖X說明本發明中第2實施例的間隔柱 (30 )的圖面；S 6 201212735 The strip of the second step of the above is (4) the above-mentioned gold difficult gold reading _ into the 0. The plate spacer column completed in the fourth step above should contain a metal bulkhead. According to another example of the present invention for solving the above problems, the method for manufacturing a spacer column includes the following steps: a step of covering the metal on both sides of the insulating plate, the rot of the gold to expose the upper edge plate, and the insulating plate a two-sided, second step of a stripe of a stripe at a predetermined interval; and a side edge of the stripe that is cut in parallel and perpendicular to the stripe The third step. After the above-mentioned first step, the step of forming a perforation in a lattice form on the insulating plate may be included. The two rows of the perforations are close to each other to form a sleeve, and the interval between the sleeves is larger than the distance between the sleeves and the rows. a step of forming a metal boring head in the above-mentioned perforation in the above-mentioned perforated object; at this time, the strip in the second step is passed through the metal fl and the age f| Formed so that the above-mentioned sleeve perforations are located between the strips, and in the cutting process of the third step, the two rows of the perforations forming the set are separated. After the second step, in the middle of the strip, a V-shaped groove is formed in the direction parallel to the strip. The V-shaped groove is formed with a hole (10) penetrating the insulating plate at a distance. At this time, in the third step, the middle of the strip is carried out in the direction parallel thereto, and the mist passes through the middle of the V-groove. When the P blade 'cuts in the direction perpendicular to the above strip, the cut line passes through the chamfered hole. 201212735 According to another example of the present invention for solving the above problems, a crucible including a six-image insulating read and a spacer is formed, and the surface is covered on the board. Metal on the bottom surface of the body The upper body of the body is lazy and the shirt portion is inclined at an angle. According to the present invention, the method for solving the above problems includes the following steps: the first step of covering the metal foil on the m, jh λ/- surface of the spacer spacer of the insulating plate is formed in a lattice form on the other side without metal impurities The second step of mutually W, the groove, and the subsequent step of forming the spacer spacer with the parent of the above-mentioned ν-shaped groove. Into the appeasement, so that the effect is completed. (4) Separating the side panels, so that the heart can be set because it is attached to the surface of the board, so it is not required to be produced. The surface is inferior, and the setting is an automatic I process, and is suitable for a large number of embodiments. [Embodiment] Example 2: The present invention will be described in detail with reference to the accompanying drawings. The following implementations are provided to assist in understanding the present invention, and various modifications can be made without departing from the spirit and scope of the invention. Therefore, the scope of the claims of this month is not limited to the following embodiments. [Embodiment 1] 5a / 5疋 illustrates the drawing of the spacer column (30) of Embodiment 1 of the present invention, and the oblique view 'gj 5b is a vertical sectional view of the figure according to A_A, the line cutting diagram, 201212735 ' is a side view showing the spacer (5) placed on the PCB board (210). Referring to FIG. 5a and FIG. 5b, in the present invention, the spacer (30) body (; 31) is a hexahedral image composed of an insulator such as j-oxygen resin or plastic, and the opposite sides of the body (Μ) are attached to form a metal (5). 32b). The metal (32a, 32b) is covered on the lower portions of both sides of the body (31), the side portion of the body (31) is partially exposed, and the lower portion is covered. Perforations are formed in the body (31), and the metal foils (32a, 32b) are covered through the covering body. The metal plugs (33) are inserted into the through holes, and the metal foils (32a, 32b) are connected to each other. The metal bulkhead (33) prevents the metal foils (32a, 32b) from peeling off both sides of the body (31), improving the reliability of the spacers (30). As shown in FIG. 5c, the spacer (3〇) is fixed by soldering the metal (32a, 32b) and the PCB board (21a〇) in a state where the bottom surface of the body (31) is attached to the PCB board (21〇). Set on the PCB board (210). The metal box 〇 2a ' is covered for welding. The spacer (30) may also be bonded to the pCB board (21〇) by a bottom coat of the body (31). Since the bottom surface of the body (31) is attached to the PCB board (210), the metal falling (5), 32b) is adjacent to the PCB board (21〇), but is kept isolated from the panel (8〇) (see:,, symbol d) „If metal羯 (32a, 32b) covers the upper part of the two sides of the metal 4 (32a ' 32b) will be connected to the panel (8 〇), pCB board (21 〇) and panel (80) will form an electrical connection, resulting in a short circuit Therefore, the above 32b) is disposed on the lower portion of both sides of the body (31). According to the present invention, 'the spacer is not inserted into the hole of the PCB as usual, but is attached to the PCB by soldering, and is manually set by the prior art. The spacer 201212735 compares the automation of the grading work, making the setting of the _column automatic. Manufacturing Method 1 Fig. 6 is a diagram illustrating the method of manufacturing the spacer (30) in Fig. 5. First, as shown in Fig. 6a No, prepare an insulating plate (310) covered with metal foil (320a, 320b) on both sides, such as a copper box (C0PPer foil), as shown in Fig. 6b, in the form of a dot matrix on the insulating plate (310). Forming a regular perforation (thr〇ugh h〇le, mo), with a diameter of about 0.5mm, through a gold Foil (32〇a, 32〇b). Then, as shown in Fig. 6c, metal plating, such as copper plating, is performed on the entire object forming the perforations (33 。). Thus, it is unknown that the metal foil (32〇) a, 320b) 'and metal plating is also formed in the perforation (330), the metal foil (340a, 340b) is formed twice on the secondary metal foil (320a, 320b), and the metal formed by copper is formed in the perforation (330). The bulkhead (33). Next, as shown in Fig. 6d, the metal foil (34〇a, 340b) and the primary metal foil (320a, 320b) are etched twice by lithography to expose the insulating plate (320). A plurality of strips (s) having the same width (d) are arranged at a certain interval on both sides of the plate (310). Finally, as shown in Fig. 6e, one side of the strip (stIjpe, 6〇) is performed once. The cutting (C1) is performed twice in the direction perpendicular to the primary cutting (C1) (C2), and the insulating plate (31〇) is cut in a lattice form to form a metal as shown in FIG. The spacer (30) of the bulkhead (33). The order of the first cut (ci) and the second (C2) cut may be omitted. Fig. 7 is a view showing the spacer (30) completed by the manufacturing process of Fig. 6. Fig. 7a is a perspective view of the appearance, Fig. 7b is a schematic view of the axis. Fig. 7 is a vertical section of the 7a cut according to the line A. As shown in Fig. 7, the gold formed on both sides of the body (9) (32a, 32b) Since the metal _ (33) does not easily peel off the body (3ι), it is filled with its own Wei in the welding work. Figure 7 is suppressed. _Chen (10) is erected as shown in Figure 5. Then, when soldering on the PCB board (21〇), a certain gap is formed between the pcB board (2) and the panel (80). According to the above-mentioned f-making method 'through the Jing engineering (automation of Fig. 6), the size of the spacer (30) can be made uniform, so that the height of the spacer (3〇) can be made uniform. Therefore, the PCB board (2) and the panel The spacing between (10)) will be the same 'and because the spacer (3〇) is attached to the pCB board (2(6) can be automated by setting the spacer to be automated* to set the spacer (9)). Manufacturing Method 2 Fig. 8A is a view showing another example of manufacturing a spacer (3〇) according to Fig. 5. First, as shown in Fig. 8a, prepare an insulating plate (31 〇) with two sides covered with i-time metal foil (metal £^1, 320 wood 3201), such as copper foil ((;^红如1), such as Figure 8b 'A perforation having a diameter of about mm5 mm is formed on the insulating plate (310) (such as hole11, hole, 330), through the metal foil (320a, 320b) once. In this case, unlike Figure 6b, two rows of perforations ( 330) approaching each other to form a set of 'the spacing between the sets is greater than the spacing between the rows of each set. Then 'as shown in Figure 8c', the metal ore, such as copper, is applied over the entirety of the object forming the perforations (330). Gold plating. In this way, I do not know that it is a metal drop (320a, 320b) 'and metal gold is formed in the perforation (330), and the metal foil (340a, 340b) is formed twice on the metal case 201212735 (320a, 320b). a metal bulkhead (33) formed of copper is formed in the perforation (330). Next, as shown in Fig. 8d, the metal foil (340a, 340b) and the metal foil (320a, 320b) are etched twice by lithography. The insulating plate (32 〇) is exposed, and a plurality of strips (50) of the same width (2d) are arranged at a certain interval on both sides of the insulating plate (310). Unlike Figure 6d, the above set (two rows) of perforations (330) is provided between the strips (50). Finally, as shown in Fig. 8e, the middle of the strip (6) The strip (50) is cut once in parallel (C1), and the two rows of perforations (330) between the strips (5) are separated so that the direction is perpendicular to the cut (C1) twice. Cutting (C2) 'cuts the cutting plate (10) in a lattice form to form a spacer (30) having a metal bulkhead (33) as shown in Fig. 7. One cut (C1) and two times (C2) [Embodiment 2] Fig. 1 is a view showing a spacer (f) of a second embodiment of the present invention. As shown in Fig. 10, the embodiment 2 has the same structure as that of Fig. 7, and a spacer (3〇) When it is placed on the PCB board (210), the corner (b) and the corner tip (4) on the upper side are chamfered to form a slope. This is to prevent damage to the panel (10). The angled tip of ' _ (3G) will be pressed against the panel (80), causing the panel (8〇) to break and be damaged. The method of making spacers (3G) in Figure 1G is shown in Figure 9b, as shown in Figure 9b, and features (and steps of chamfering holes (56). M v(4) 201212735 Side by Side &amp In the middle of the strip (5G), the v-groove (8) is cut in parallel with the strip (50), and the v-groove (8) is (9). At this time, the object 1 (56) is located in the metal bulkhead (33). The cross section of the hole (56) is preferably a shape or a diamond shape, but is not limited thereto. As shown in Fig. 9c, the center of the v-groove (55) and the middle of the strip 60) are carried out in parallel with the strip (9)). One cut ((1), the strip (50, the two 仃? hole (33G) is separated' in the direction perpendicular to the one cut (α), the second jing (C2)' is passed The hole (9) cuts the cutting plate (31Gj in a lattice form. Thus, as shown in Fig. 1G, when the spacer column (10) is raised, the secret (8) and the corner portion (4) located on the upper side are chamfered and inclined. In another example of the present invention, the method for manufacturing a spacer spacer comprises the steps of: covering the gold sheet in the first step of the insulating sheet - in the absence of gold - The second step of the lattice form forming the V-shaped grooves perpendicularly intersecting each other is cut in the middle of the v-shaped groove to complete the third step of the plate spacer. [Embodiment 3] FIG. 12 is a third embodiment of the present invention. The plane of the spacer (9)) of the embodiment. As shown in Fig. 12, the spacer (9) in the embodiment 3 is covered with a gold-diffuse (then, metal box (10)) portion on the bottom surface of the insulating body (3) of the hexahedral image. It is glued on the PCB board (10) by glue _(10)). When the spacer (3〇) is dry on the PCB (210), the corner (B) and the corner (4) on the upper side form a marriage and are inclined. The above-mentioned inverted chord is not necessary, but the wheel stop panel (8 〇) is damaged and should exist. 13 201212735 FIG. 11 is a view illustrating a method of manufacturing the spacer post (30) of FIG. 12, as shown in FIG. 11a, a metal foil (320b) is formed on one side of the insulating plate (310), as shown in FIG. One side of the metal foil (32b) vertically intersects each other in a lattice form to form V-shaped grooves (55a, 55b). Then, as shown in Fig. 11, when the center of the v-groove (55a '55b) is cut (Q, C2), the corner (B) and the corner (A) which are in contact with the panel (80) are shown in the figure. Form a chamfer. As described above, according to the present invention, the spacer (30) is chamfered at the upper corner and the corner of the corner contact with the panel, and the panel is not pressed by sharp corners or corners or Torn and broken. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 to Fig. 3 are views showing a conventional lcd device; Fig. 4 is a view showing a conventional spacer (10); and Fig. c is a view showing a spacer (a) of a tenth embodiment of the present invention () Fig. =6a-6e is an example of a purely manufactured spacer (10) according to the figure. Fig. 7b疋 illustrates the spacer after the manufacturing process of the figure (3〇): 8e is the peak according to Fig. 5. FIG. 4 is a view for explaining a method of manufacturing the spacer column (30) in FIG. 10; FIG. X is a view showing a drawing of the spacer column (30) of the second embodiment of the present invention;
I 14 201212735 圖lla-lld是說明圖12中製造間隔柱（30)的方法的圖面； 圖12是說明本發明中第3實施例的間隔柱（30)的圖面。 【主要元件符號說明】 10:間隔柱 21:電子部件 30:間隔柱 31:本體 32a，32b:金屬箔 33:金屬悶頭 40:焊接 50:條帶 55, 55a, 55b: V 型槽 56:倒角孔 80:面板 100:液晶顯不面板 110:彩色濾光片基板 111:驅動1C 120: TFT 基板 200:驅動回路部 210: PCB 板 230:柔性印刷電路板 300:上部收藏部件 310:絕緣板 320a, 320b:金屬箔 330:穿孔 340a，340b:金屬箔 400:燈管裝置 410:燈 411:燈夾子 500:導光板 600:反射板 700:光學薄膜 710:光學板 720·.擴散板 800:下部收藏部件 900:缓衝部件 1000:螢幕裝置 2000:液晶背光燈裝置 A:角尖部 B:角落I 14 201212735 Figs. 11a-lld are views showing a method of manufacturing the spacer (30) in Fig. 12; Fig. 12 is a view showing a spacer (30) of the third embodiment of the present invention. [Description of main component symbols] 10: Spacer 21: Electronic component 30: Spacer column 31: Body 32a, 32b: Metal foil 33: Metal bulkhead 40: Solder 50: Strip 55, 55a, 55b: V-groove 56: inverted Corner hole 80: panel 100: liquid crystal display panel 110: color filter substrate 111: drive 1C 120: TFT substrate 200: drive circuit portion 210: PCB board 230: flexible printed circuit board 300: upper collection member 310: insulation board 320a, 320b: metal foil 330: perforations 340a, 340b: metal foil 400: tube device 410: lamp 411: lamp clip 500: light guide plate 600: reflector 700: optical film 710: optical plate 720. diffuser 800: Lower collection part 900: Buffer part 1000: Screen device 2000: Liquid crystal backlight device A: Corner portion B: Corner