KR20120026206A - Gap supporter of board and method for fabricating the same - Google Patents

Abstract

PURPOSE: A gap supporter of a board and a manufacturing method thereof are provided to form a gap supporter by an automation process, thereby precisely controlling the size of the gap supporter. CONSTITUTION: A gap supporter(30) of a board comprises the following units. A body(31) has a rectangular shape made of an insulator. An upper edge and a vertex portion of the body are trimmed and inclined. Metal foils(32a,32b) are formed on both sides of the body which face each other. The metal foils are installed in a lower portion of both sides so that an upper portion of both sides is exposed and a lower portion of both sides of the body is covered.

Description

Gap supporter of board and method for fabricating the same

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate gap supporter (also called a substrate holder), and in particular, since it is attached to and installed on a substrate, the operator does not have to manually insert it into the hole of the substrate by hand. It is directed to a substrate gap supporter in which the gap between the substrate and the other panel becomes constant when adhered to. The present invention also relates to a manufacturing method suitable for manufacturing the substrate gap supporter.

Flat panel displays (FPDs), such as LCDs, LEDs and PDPs, have already been commercialized. As the flat panel display becomes thinner, the PCB panel and the PCB substrate on which the driving circuit for driving the LCD panel and the like are mounted are positioned close to each other, which causes a problem that an electric short circuit occurs due to the PCB substrate being pressed on the LCD panel. In addition, since the height of electronic components or soldering parts mounted on the PCB board is not constant, the PCB board is bent due to the difference in height when the PCB board is in close contact with the LCD panel.

1 to 3 are views for explaining a conventional LCD device disclosed in the Republic of Korea Patent Publication No. 2007-5806 (Backlight Assembly and the liquid crystal display using the same, January 10, 2007), Figure 1 is an exploded perspective view, 2 and 3 illustrate that the flexible printed circuit board 230 of FIG. 1 is bent so that the printed circuit board 210 is located on the bottom surface of the backlight assembly 2000.

 Referring to FIG. 1, the LCD device includes a display assembly 1000 and a backlight assembly 2000, wherein the display assembly 1000 includes a liquid crystal display panel 100, a driving circuit unit 200, and an upper accommodating member. The backlight assembly 2000 includes a lamp unit 400, a light guide plate 500, a reflecting plate 600, an optical sheet 700, a lower storage member 800, and a buffer member 900. .

 The liquid crystal display panel 100 is formed by stacking a color filter substrate 110 on a TFT substrate 120. The driver IC 111 installed at the edge of the TFT substrate 120 is connected to the PCB substrate 210 through the flexible circuit board 230. A control IC is mounted on the PCB substrate 210 to apply predetermined data signals and gate signals to data lines and gate lines of the TFT substrate 120.

Light in the form of a line light source from the lamp 410 installed in the lamp clamp 411 is changed into a surface light source through the light guide plate 500, and with the help of the reflector 600, the optical plate 710 and the diffuser plate 720. The liquid crystal display panel 100 is irradiated evenly through.

The stacked structure from the reflecting plate 600 to the liquid crystal display panel 100 is firmly held by the lower storage member 800 and the upper storage member 300, and the flexible circuit board 230 is illustrated in FIGS. 2 and 3. As described above, the PCB substrate 210 is bent downward and disposed on the bottom surface of the lower housing member 800. The lower housing member 800 is provided with a buffer member 900 to prevent the flexible circuit board 230 from being damaged.

As described above, in the conventional case, as the flat panel display device becomes slim, the PCB substrate 210 is positioned to be in close contact with the bottom surface of the lower storage member 800, so as to protect the electronic components mounted on the PCB substrate 210. There should be some gap between 210 and the lower housing member 800.

In addition, since the height of the electronic components mounted on the PCB board 210 or the soldering part is not constant, when the PCB board 210 is in close contact with the lower housing member 800, the PCB board 210 may be bent. A gap of degree should be formed. Therefore, a gap supporter is installed between the lower housing member 800 and the PCB substrate 210 to form such a gap.

4 is a diagram for explaining a conventional gap supporter 10. As shown in FIG. 4, since the lead soldering portion of the electronic component 21 exists on the rear surface of the PCB substrate 210, when the PCB substrate 210 and the lower storage member 800 are completely in close contact with each other, an electrical short circuit occurs. There is a risk of electric failure due to the breakage, burnout of parts, and damage to soldered parts.

In order to prevent this, a hole is punched in the PCB substrate 210 and the plastic injection molded gap supporter 10 is pushed therein. Then, the gap supporter 10 is coupled to the PCB substrate 210 so as not to fall out, and there is a predetermined gap between the lower housing member 800 and the PCB substrate 210 by the gap supporter 10. It is possible to prevent a short circuit between wirings having different potentials, thereby preventing burnout of the circuit board and the components 21.

 In the above-described bar, the case in which the gap supporter 10 is installed between the lower housing member 800 and the PCB substrate 210 is described, but the present invention is not limited thereto, and the same situation occurs between the other panel and the PCB substrate. 10 is installed. In addition, the substrate on which the gap supporter 10 is installed is not limited to the PCB substrate, but also other types of substrates.

In addition, the gap supporter 10 is installed on the rear surface of the PCB substrate 210, but the present invention is not limited thereto, and the front surface of the PCB substrate 210, that is, the surface on which the electronic component 21 is mounted closely adheres to another panel. The gap supporter 10 may be installed on the front surface of the PCB substrate 210.

Although the PCB substrate 210 for driving the liquid crystal display panel 100 is taken as an example, the gap supporter 10 may be installed on various PCB substrates such as a main PCB substrate, a backlight PCB substrate, and a power PCB substrate. In particular, the recent emergence of the smart phone a lot of the above situation occurs in the mobile phone is also increasing the need for the gap supporter 10 in the mobile phone.

However, the conventional gap supporter 10 is very unreasonable in terms of installation cost and time because the operator has to install by manually pushing into the hole of the PCB board 10 one by one. In addition, since a plurality of gap supporters 10 do not protrude to a certain height and have a slight height difference because they are manually inserted into holes, there is a problem that the gap between the PCB substrate 10 and the panel is not constant. .

Therefore, the problem to be solved by the present invention, because it is attached to the substrate is installed, the operator does not have to be manually inserted into the hole of the substrate can be installed in an automated process, even if produced in large quantities all have a constant thickness on the substrate The present invention provides a substrate gap supporter and a method of manufacturing the same, wherein the gap between the substrate and the other panel becomes constant.

The substrate gap supporter according to an embodiment of the present invention for achieving the above object is a hexahedron shape made of an insulator, the upper edge and the vertex of the body inclined to be chamfered; And metal foils installed on both sides of the body facing each other, the upper portions of both sides of the body being exposed, and the metal foils installed on the lower portions of both sides of the body so as to cover the lower portions of both sides of the body. It is characterized in that it is installed to be attached.

A through hole may be formed in the body to penetrate both sides of the metal foil, and in this case, a metal plug is embedded in the through hole to connect the metal foils formed on both sides of the body to each other.

Method for manufacturing a substrate gap supporter according to an embodiment of the present invention for achieving the above object, the first step of forming a metal foil on both sides of the insulating plate; Etching the metal foil so that the insulating plate is exposed so that a plurality of stripes arranged on the both sides of the insulating plate are arranged side by side at regular intervals; And a third step of cutting a gap supporter along one edge of the stripe in parallel with the stripe and in a direction perpendicular to the stripe.

After the first step, forming through-holes in a matrix form in the insulating plate so as to pass through the metal foil; And forming a plated foil on the metal foil by performing metal plating on a resultant in which the through hole is formed, and forming a metal plug in the through hole. In this case, the stripe in the second step may be included. Is formed by etching the metal foil and the plated foil.

Preferably, the gap supporter completed in the fourth step includes one metal plug.

According to another aspect of the present invention, there is provided a method of manufacturing a substrate gap supporter, the method including: forming a metal foil on both surfaces of an insulating plate; Etching the metal foil so that the insulating plate is exposed so that a plurality of stripes arranged to expose the insulating plate with a predetermined width on both sides of the insulating plate are arranged in parallel at regular intervals; And a third step of completing a gap supporter by cutting in a direction parallel to the stripe along the middle of the stripe, in a direction parallel to the stripe along the middle between the stripes, and in a direction perpendicular to the stripe. Characterized in that.

After the first step, a plurality of through holes in a matrix form are formed in the insulating plate so as to penetrate through the metal foil, wherein the through holes are close to each other to form one set, and the sets are spaced farther apart than the line spacing in the set. Forming; Forming a plated foil on the metal foil by performing metal plating on the resultant in which the through hole is formed, and forming a metal plug in the through hole. In this case, the stripe in the second step may include It is formed by etching the metal foil and the plated foil so that the set of through holes is disposed between the stripes, and in the cutting process in the third step, two lines forming one set of the through holes are cut into one line.

After the second step, a V-groove line may be formed along the center of the stripe in a direction parallel to the stripe, and the chamfering holes penetrating the insulating plate may be formed at regular intervals in the V-groove line. In this case, the cutting line in the case of cutting in the direction parallel to the stripe along the middle of the stripe in the third step passes through the center portion of the V-groove line, and cuts in the direction perpendicular to the stripe in the third step. The cutting line in the case passes through the chamfering hole.

According to another aspect of the present invention, a substrate gap supporter includes: a body having a hexahedron shape formed of an insulator; And metal foil is installed on the bottom of the body; It includes, characterized in that the metal foil is installed to be attached to the substrate.

The upper edge and the vertex of the body is preferably chamfered and inclined.

According to another aspect of the present invention, there is provided a method of manufacturing a substrate gap supporter, the method including: forming a metal foil on one surface of an insulating plate; A second step of forming a V-groove line so as to vertically cross each other in a lattice form on the other surface where the metal foil is not formed on the insulating plate; And a third step of cutting along the center of the V-groove line to complete the gap supporter.

According to the present invention, since the gap supporter can be made through an automated process, its size can be precisely controlled, and since the gap supporter is attached to the surface of the substrate, there is little concern about a difference in installation height, and the installation can also be an automated process. It is suitable for mass production process.

1 to 3 are diagrams for explaining a conventional LCD device;
4 is a view for explaining a conventional gap supporter 10.
5 is a view for explaining a gap supporter 30 according to the first embodiment of the present invention;
6 is a view for explaining an example of the manufacturing method of the gap supporter 30 according to FIG.
7 is a view for explaining a gap supporter 30 completed through the manufacturing process of FIG.
8 is a view for explaining another example of the manufacturing method of the gap supporter 30 according to FIG.
9 is a view for explaining a method of manufacturing the gap supporter 30 of FIG.
10 is a view for explaining a gap supporter 30 according to the second embodiment of the present invention;
11 is a view for explaining a method of manufacturing the gap supporter 30 of FIG.
12 is a view for explaining the gap supporter 30 according to the third embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings, preferred embodiments of the present invention will be described in detail. The following embodiments are only presented to understand the content of the present invention, and those skilled in the art may make many modifications within the technical spirit of the present invention. Therefore, the scope of the present invention should not be construed as limited to these embodiments.

Example 1

5 is a view for explaining the gap supporter 30 according to the first embodiment of the present invention, Figure 5a is a perspective view, Figure 5b is a vertical cross-sectional view taken along the line AA 'of Figure 5a, Figure 5c It is a side view for demonstrating that the gap supporter 30 is installed in the PCB board 210.

5A to 5C, the gap supporter 30 according to the present invention has a hexahedron-shaped body 31 made of an insulator such as epoxy or plastic, and metal foils 32a on opposite sides of the body 31. , 32b) is attached. The metal foils 32a and 32b are installed at both lower sides of the body 31 so as to expose the upper side of the body 31 and hide the lower part thereof.

Through holes are formed in the body 31 to penetrate both sides of the metal foils 32a and 32b, and metal plugs 33 are embedded in the through holes to connect the metal foils 32a and 32b to each other. . The metal plug 33 prevents the metal foils 32a and 32b from being peeled off at both sides of the body 31, thereby increasing the reliability of the gap supporter 30. The metal plug 32 is not necessarily required unless the metal foils 32a and 32b are peeled off.

As shown in FIG. 5C, the gap supporter 30 is soldered to the metal foils 32a and 32b and the PCB substrate 210 with the bottom surface of the body 31 attached to the PCB substrate 210. And fixedly installed on the PCB substrate 210. The metal foils 32a and 32b are provided for soldering in this way. The gap supporter 30 may be attached to the PCB substrate 210 by attaching the bottom surface of the body 31 to the PCB substrate 210 with an adhesive.

Since the bottom surface of the body 31 is attached to the PCB 210, the metal foils 32a and 32b are adjacent to the PCB substrate 210 but not adjacent to the panel 80 and remain at a distance d. When the metal foils 32a and 32b are installed on both sides of the body 31, the metal foils 32a and 32b come into contact with the panel 80, so that the PCB substrate 210 and the panel 80 are undesirably electrically connected and electrically shorted. Since a problem may occur, the metal foils 32a and 32b are installed only on both side surfaces of the body 31 as described above.

According to the present invention, unlike the conventional case in which the gap supporter is inserted into the hole of the PCB substrate and installed directly, the gap supporter is directly attached and installed on the PCB substrate. It is possible to automate the installation of the gap supporter.

Manufacturing Method 1

6 is a view for explaining an example of the manufacturing method of the gap supporter 30 according to FIG. First, as shown in FIG. 6A, an insulating plate 310 coated with primary metal foils 320a and 320b, for example, copper foil, is prepared on both surfaces, and as shown in FIG. 6B, primary metal foils 320a and 320b. ), Through holes 330 having a diameter of about 0.5 mm are regularly formed in the insulating plate 310 in a matrix form.

Next, as shown in FIG. 6C, metal plating, for example, copper plating, is performed on the entire product in which the through hole 330 is formed. Then, the metal plating is formed not only in the portions having the primary metal foils 320a and 320b but also in the through holes 330, and the secondary metal foils 340a and 340b are formed on the primary metal foils 320a and 320b and the through holes 330. In it, a metal plug 33 made of copper is formed.

Subsequently, as shown in FIG. 6D, the secondary metal foils 340a and 340b and the primary metal foils 320a and 320b are etched by a photolithography process so that the insulating plate 310 is exposed. The stripe having a plurality (50) has to be arranged side by side at regular intervals.

Finally, as shown in FIG. 6E, the first cut C1 is formed along one edge of the stripe 50, and the second cut C2 is performed in a direction perpendicular to the first cut C1 to form the insulating plate 310 in a lattice shape. By cutting, the gap supporter 30 which has the metal plug 33 one by one is completed like FIG. The order of the primary cut C1 and the secondary cut C2 does not matter.

 7 is a view for explaining the gap supporter 30 completed through the manufacturing process of Figure 6, Figure 7a is an external perspective view, Figure 7b is a vertical cross-sectional view taken along the line AA 'of Figure 7a. As shown in FIG. 7, the metal foils 32a and 32b formed on both sides of the body 31 are not easily peeled off from the body 31 by the metal plug 33 to perform a function in the soldering operation. As shown in FIG. 7, when the gap supporter 30 lying on the side is soldered to the PCB substrate 210 by standing up as in FIG. 5, a constant gap is formed between the PCB substrate 210 and the panel 80.

According to this manufacturing method, since the size of the gap supporter 30 can be made constant through the automation of the cutting process (FIG. 6E), the height of the gap supporter 30 can be made constant. Therefore, the gap between the PCB substrate 210 and the panel 80 becomes constant, and since the gap supporter 30 is attached on the PCB substrate 210, the installation process of the gap supporter 30 is automated by automating the attachment process. Easy to do

Manufacturing Method 2

8 is a view for explaining another example of the manufacturing method of the gap supporter 30 shown in FIG. First, as shown in FIG. 8A, an insulating plate 310 coated with primary metal foils 320a and 320b, for example, copper foil, is prepared on both surfaces, and as shown in FIG. 8B, primary metal foils 320a and 320b. Through-holes 330 having a diameter of about 0.5 mm are formed in the insulating plate 310 so as to pass through them. At this time, unlike in the case of Figure 6b, the through-hole 330 is so close that two sets of a line, each set is spaced farther than the line spacing in the set.

Next, as shown in FIG. 8C, metal plating, for example, copper plating, is performed on the entire product in which the through hole 330 is formed. Then, the metal plating is formed not only in the portions having the primary metal foils 320a and 320b but also in the through holes 330, and the secondary metal foils 340a and 340b are formed on the primary metal foils 320a and 320b and the through holes 330. In it, a metal plug 33 made of copper is formed.

Subsequently, as shown in FIG. 8D, the secondary metal foils 340a and 340b and the primary metal foils 320a and 320b are etched by a photolithography process so that the insulating plate 310 is exposed. The stripe having a plurality (50) has to be arranged side by side at regular intervals. In this case, unlike the case of FIG. 6D, one set (two lines) of through holes 330 are disposed between the splines 50.

Finally, as shown in FIG. 8E, parallel to the stripe 50 along the middle of the stripe 50, and between the stripe 50 so that two rows of through holes 330 between the stripe 50 are divided by one line. A first cut (C1) parallel to the stripe 50 along the center, and a second cut (C2) in a direction perpendicular to the first cut (C1) to cut the insulating plate 310 in a grid shape as shown in FIG. The gap supporter 30 which has the metal plug 33 one by one is completed. Here, the order of the primary cut C1 and the secondary cut C2 does not matter.

[Example 2]

10 is a view for explaining the gap supporter 30 according to the second embodiment of the present invention. As shown in FIG. 10, the second embodiment has the same structure as that of FIG. 7, but when the gap supporter 30 is installed on the PCB substrate 210, the corners B and the vertices A located at the upper side thereof are chamfered. It is characterized by being inclined. This is to prevent the panel 80 may be damaged due to depression or tearing by the angular corners and vertices of the gap supporter 30 when the gap supporter 30 is installed as shown in FIG. 5C.

FIG. 9 is a view for explaining a method of manufacturing the gap supporter 30 of FIG. 10. The same process as that of FIG. 8 is performed, and as shown in FIG. Characterized in that there is a step of forming.

Specifically, the V-groove line 55 is formed in parallel with the stripe 50 along the center of the stripe 50, and the chamfer hole 56 is formed on the V-groove line 55. At this time, the chamfering hole 55 is located between the metal plug 33. The chamfering hole 55 is preferably a cross section or a rhombus, but the shape thereof is not particularly limited.

As shown in FIG. 9C, the center between the V-groove line 55 and the middle of the stripe 50 is first cut (C1) so that the two through-holes 330 forming one set are divided into one line, and the first Secondary cutting (C2) to pass the chamfering hole 56 in the direction perpendicular to the cutting (C1) to cut the insulating plate 310 in a grid shape. Then, as shown in FIG. 10, when the gap supporter 30 is erected, the corners B and the vertices A positioned upward are chamfered and inclined.

Example 3

12 is a view for explaining the gap supporter 30 according to the third embodiment of the present invention. As shown in FIG. 12, in the gap supporter 30 according to the third embodiment, a metal foil 31b is attached to a bottom surface of a hexahedral body 31, and a portion where the metal foil 31b is located is a PCB 210. ) Is attached to the substrate by an adhesive 140 or the like. When the gap supporter 30 is attached to the PCB substrate 210, the corners B and vertices A positioned upwards are chamfered and inclined. This chamfer is not required, but is preferably present to prevent damage to the panel 80 as described above.

FIG. 11 is a view for explaining a method of manufacturing the gap supporter 30 of FIG. 12. As shown in FIG. 11A, the metal foil 320b is formed only on one side of the insulating plate 310, and the metal foil is as shown in FIG. 11B. On the other surface where 32b is not formed, V-groove lines 55a and 55b are formed so as to vertically cross each other in a lattice form. Then, as illustrated in FIG. 11C, when the cutting lines C1 and C2 are cut along the centers of the V-groove lines 55a and 55b, the chamfers are formed at the vertices A and the edges B contacting the panel 80 as shown in FIG. 11D. .

As described above, since the gap supporter 30 according to the present invention is inclined by chamfering the upper edge and the vertex of the panel 80, the panel 80 may be crushed or torn by the angular edge and the vertex. There is no fear of damage.

30: gap supporter
31: body
33: metal plug
40: soldering
50: striped
55, 55a, 55b: V groove line
56: chamfer hole
210: PCB board
310: insulation plate
32a, 32b, 320a, 320b, 340a, 340b: metal foil
330: through hole

Claims (11)

A substrate gap supporter installed on the substrate such that the substrate is spaced apart without being in contact with another place.
A hexahedron shape made of an insulator and inclined by chamfering an upper edge and a vertex; And
It is installed on both sides of the body facing each other, but the upper portion of the both sides of the metal foil is installed on the lower portion of the both sides so as to cover the lower side of the both sides of the body; is made, including the bottom of the body to the substrate The substrate gap supporter, characterized in that the installation is attached. The substrate of claim 1, wherein a through hole is formed in the body to penetrate both sides of the metal foil, and a metal plug is embedded in the through hole to connect the metal foils formed on both sides of the body to each other. Gap supporter. Forming a metal foil on both sides of the insulating plate;
Etching the metal foil so that the insulating plate is exposed so that a plurality of stripes arranged on the both sides of the insulating plate are arranged side by side at regular intervals; And
And a third step of cutting a gap supporter along one edge of the stripe in parallel with the stripe and in a direction perpendicular to the stripe. The method of claim 3, wherein after the first step,
Forming through holes in the insulating plate in a matrix form so as to pass through the metal foil; And
Forming a plated foil on the metal foil by performing metal plating on the resultant product in which the through hole is formed, and forming a metal plug in the through hole; Including,
The stripe in the second step is a substrate gap supporter manufacturing method, characterized in that formed by etching the metal foil and plated foil. 5. The method of claim 4, wherein the gap supporter completed in the fourth step comprises one metal plug. Forming a metal foil on both sides of the insulating plate;
Etching the metal foil so that the insulating plate is exposed so that a plurality of stripes arranged to expose the insulating plate with a predetermined width on both sides of the insulating plate are arranged in parallel at regular intervals; And
A third step of completing a gap supporter by cutting in the direction parallel to the stripe along the middle of the stripe, in the direction parallel to the stripe along the middle between the stripes, and in a direction perpendicular to the stripe; Substrate gap supporter manufacturing method comprising a. The method of claim 6, wherein after the first step,
Forming a plurality of through holes in a matrix form in the insulating plate so as to penetrate through the metal foil, wherein the through holes are formed so that two lines are adjacent to each other to form a set, and the sets are spaced farther apart from each other in the set; And
Forming a plated foil on the metal foil by performing metal plating on the resultant product in which the through hole is formed, and forming a metal plug in the through hole; Including;
The stripe in the second step is formed by etching the metal foil and the plated foil so that the set of through holes is disposed between the stripes,
In the cutting process of the third step, the substrate gap supporter manufacturing method characterized in that the two lines forming a set of the through-holes are cut to be divided by one line. The method of claim 7, wherein after the second step, a V-groove line is formed along the center of the stripe in a direction parallel to the stripe, and the chamfering holes penetrating the insulating plate are formed at regular intervals in the V-groove line. The cutting line in the case of cutting in the direction parallel to the stripe along the middle of the stripe in the third step passes through the center portion of the V-groove line, in the case of cutting in the direction perpendicular to the stripe in the third step. The cutting line passes through the chamfering hole, characterized in that the substrate gap supporter manufacturing method. A substrate gap supporter installed on the substrate such that the substrate is spaced apart without being in contact with another place.
A body having a hexahedron shape formed of an insulator; And
A metal foil installed on the bottom of the body; And a metal foil is attached to the substrate. The substrate gap supporter of claim 9, wherein the upper edge and the vertex of the body are chamfered and inclined. A first step of forming a metal foil on one surface of the insulating plate;
A second step of forming a V-groove line so as to vertically cross each other in a lattice form on the other surface where the metal foil is not formed on the insulating plate; And
And a third step of completing a gap supporter by cutting along the center of the V-groove line.

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