JP2007212931A - Display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a display device having a structure which prevents a circuit substrate attached to the display device by adhesion from being peeled. <P>SOLUTION: The display device comprises: a frame body having a frame shape; a display panel which connects a circuit substrate and is stored and supported on one opening part side of the frame body; a metal plate member which is attached to the other opening part side of the frame body, has a side wall part for covering the other opening part and is substantially formed in a box shape; and the circuit substrate which is fixed by adhesion while being folded and being wired along the back surface of the metal plate member, wherein opening space parts 55s, 55r facing the circuit substrate side 51 are disposed between the opposing side wall parts 57e, 57g of the metal plate member 57 and the frame body 55, folded retaining parts 51e, 51g are disposed on outer side edge part of a part wired along the back side of the metal plate member 57 of the circuit substrate side 51, a plurality of electronic parts 52 are mounted massively in a line on regions or near regions of the folded retaining parts 51e, 51g, and the folded retaining parts 51e, 51g and the electronic parts 52 are stored into the space parts 55s, 55r. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a display device such as a liquid crystal display device, and more particularly to a thinned structure of a display device and an arrangement structure of a circuit board connected to the display device.

  Electro-optical display devices include liquid crystal display devices, plasma display display devices, and electroluminescence display devices. Especially, liquid crystal display devices are information devices such as personal computers, fax machines, and telephones, office equipment such as copiers, and microwave ovens. It is now widely used in various devices such as home appliances such as refrigerators, washing machines, and control display boards for machine tools. Among them, in particular, portable information terminal devices such as mobile phones are strongly required to be thin, light and downsized.

  In explaining the background art, a typical liquid crystal display device will be taken up and a conventional technology in a liquid crystal display device used for a mobile phone will be explained. 8A and 8B are a plan view and a cross-sectional view of a main part of a liquid crystal display device of a model in the prior art. FIG. 8A is a plan view and FIG. 8B is a cross-sectional view of the main part. Yes. FIG. 9 is a plan view of the FPC in FIG. 8B as viewed from below.

In FIG. 8, the liquid crystal display device 20 includes an FPC (Flexible) on the liquid crystal panel 10.
A printed circuit board) 11 is attached, and the FPC 11 is placed on the back surface of the holding frame 13 that supports the liquid crystal panel 10. The liquid crystal panel 10 includes a transparent upper substrate 1 and a lower substrate 2 which are arranged to face each other with a certain gap, and a liquid crystal material is sealed between the gaps. 8A, the liquid crystal driving IC 5 is provided on the extending portion 2a provided on the lower substrate 2, the polarizing plate 3 is provided on the upper surface of the upper substrate 1, and the polarizing plate 4 is provided on the lower surface of the lower substrate 2. There is no.

  A plurality of display pixels are provided by a transparent electrode made of an ITO film on the surface on the liquid crystal material side between the upper substrate 1 and the lower substrate 2, and a lead electrode pattern for conducting the transparent electrode is formed on the lower substrate 2. They are gathered on the extended portion 2a. The liquid crystal driving IC 5 is connected. Further, a plurality of connection electrode patterns are provided on the extended portion 2a so as to be connected to the liquid crystal drive IC 5 in order to input signals from the outside to the liquid crystal drive IC 5, and the FPC 11 is connected to the connection electrode pattern. It has become. The liquid crystal driving IC 5 is routed via an anisotropic conductive adhesive and connected to the electrode pattern and the connection electrode pattern, and the FPC 11 is connected to the connection electrode pattern via an anisotropic conductive adhesive. Then, a signal is input from the outside to the liquid crystal driving IC 5 via the FPC 11, and the display driving of the liquid crystal panel 10 is performed based on the driving signal from the liquid crystal driving IC 5. Further, a protective film 7 is provided on the mounting portion of the FPC 11 and the liquid crystal driving IC 5 to protect the electrode pattern from electrolytic corrosion.

  Various electronic components 12 such as a capacitor, a resistor, and a diode are mounted on the FPC 11.

  Since this FPC 11 is used in a narrow space of a cellular phone, as shown in FIG. 8B, the FPC 11 is bent and arranged so that the back surface of the holding frame 13 holding the liquid crystal panel 10 is turned. Yes. At this time, the mounted electronic component 12 is mounted outside the FPC 11 so as not to be damaged. FIG. 9 is a plan view of the FPC in FIG. 8B as viewed from below. The electronic component 12 is dispersedly exposed to the outside and is visible from the outside.

  The liquid crystal panel 10 is supported by the holding frame 13. The holding frame 13 has a holding portion for holding the liquid crystal panel 10 on the upper side, and has an illumination storage portion for storing the lighting device on the lower side. The illumination device includes a light guide plate 14, a light diffusion sheet 15 disposed on the upper surface of the light guide plate 14, a reflection sheet 16 disposed on the lower surface of the light guide plate 14, a light source 19, and the like. In some cases, a prism sheet is stacked on the light diffusion sheet 15 and used. An LED is used as the light source 19. The light source 19 is attached to the light source FPC 18, and the light source 19 is disposed close to the side surface of the light guide plate 14 by bonding and fixing the light source FPC 18 to the shield plate 17. It has become so. The light source FPC 18 is connected to the FPC 11 described above, and a lighting signal of the light source 19 is obtained via the FPC 11. The illuminating device having the above configuration is accommodated in the illumination accommodating portion of the holding frame 13, and the liquid crystal panel 10 is illuminated by light from the illuminating device.

  Further, a shield plate 17 is supported on the holding frame 13 on the back side of the holding frame 13. The shield plate 17 is provided for the purpose of protecting the liquid crystal panel 10 from electromagnetic waves and preventing the influence on other devices.

The problem to be solved by the present invention is that the FSC liquid crystal device becomes incapable of color display in an environment with strong external light.
The FPC 11 with the back side of the holding frame 13 is bonded and fixed to the shield plate 17 with a double-sided adhesive tape or the like so that it does not move on the back side of the holding frame 13.

The liquid crystal display device 20 having the above configuration has irregularities on the outer surface due to the mounting of electronic components having different heights on the back surface side. For this reason, a space corresponding to this unevenness is required between other components in the case of the mobile phone. Therefore, the cellular phone incorporating the liquid crystal display device 20 is limited in the thickness reduction of the cellular phone due to the convex portion, and the construction of a thin liquid crystal display device has been strongly desired.
JP 2002-72242 A

  Under such circumstances, the technique described in Patent Document 1 below can be seen as a technique aiming at thinning of the liquid crystal display device. The thinning technique described in Patent Document 1 includes a liquid crystal panel, a holding member, a liquid crystal panel, a holding member, and a liquid crystal driving IC holding concave portion and a light emitting element housing concave portion provided on a circuit board. The circuit board is stacked, and the liquid crystal driving IC of the liquid crystal panel and the light emitting element of the circuit board are accommodated in a holding member, so that the thickness is reduced. Further, the circuit board may be a thick printed circuit board based on glass epoxy resin or a flexible circuit board based on polyimide resin, and this circuit board may be attached to a holding member with an adhesive tape, an adhesive, or the like. It is preferably fixed.

  Here, when the liquid crystal display device having the configuration described in Patent Document 1 is used for a mobile phone or the like, the circuit board has a thin structure that is attached to a holding member with an adhesive tape or the like using a thin FPC, A display device unit that can be easily assembled in a case of a mobile phone is used. Further, while the trend toward widening the FPC is progressing as the number of functions of the mobile phone increases, on the other hand, the allowable width of the FPC is limited due to the relationship used for mobile phones with a high component mounting density. Yes.

For this reason, the FPC is designed to reduce the line width of the conductive circuit pattern and at the same time increase the pattern formation density so that the width of the FPC is within the width of the holding member. However, even with such a structure, the problem shown in FIG. 10 occurs. FIG. 10 is an explanatory view for explaining a problem occurrence point when the FPC is bonded to the holding member.

  In FIG. 10, the FPC 21 connected to a liquid crystal cell (not shown) is bent and bonded to the back surface 23b of the holding member 23 and fixed as the surface 21b. The FPC 21 has a connector portion 21c on the side opposite to the side connected to the liquid crystal cell. The holding member 23 supports and stores the liquid crystal cell on the surface 23a side (viewing side). The width W of the FPC 21 is substantially the same as the width of the holding member 23, so that it does not protrude from the side surface 23 c of the holding member 23. The entire rear surface 23b of the holding member 23 is covered with the FPC 21, and is bonded to the FPC 21 with a double-sided adhesive tape or the like.

  Although the display device is handled with such a structure, the FPC 21 peels off when the end side surface rubbing or pulling of the FPC 21 occurs during handling. As shown in FIG. 10, peeling 21f1 in a state of turning over from a corner and peeling 21f2 in a state of turning up in the middle occur. And this peeling gradually increases with each handling. In some cases, the FPC 21 may be completely peeled off from the holding member 23.

  Further, the FPC 21 is bonded and fixed with a double-sided adhesive tape or the like over the back surface and the entire surface of the holding member 23. For this reason, the amount of adhesive tape used is also increasing, which is a factor in increasing costs. Further, when the liquid crystal cell is removed from the holding member 23, the double-sided adhesive tape is not peeled off and maintenance work is troublesome, resulting in a problem that the maintenance cost becomes high.

The present invention has been made in view of such problems, and has found a structure in which the FPC does not turn up and peel off, and further finds a structure that can reduce the amount of double-sided adhesive tape used and can reduce maintenance costs. It is the purpose. Another object of the present invention is to solve the problem of unevenness and obtain a portable electronic device that is smaller and thinner.

  In order to solve the above problems, a first means of the present invention is a display device in which a plate-like member is arranged between a display panel and a flexible circuit board, wherein the plate-like member has an opening or a recess. And at least a part of the end of the circuit board is inserted into the opening or the recess.

  In order to solve the above problems, a second means of the present invention is characterized in that in the first means of the present invention, the plate member is a metal member.

  In order to solve the above-mentioned problem, the third means of the present invention is the first or second means of the present invention, wherein the plate-like member has a plane portion parallel to the display panel and perpendicular to the plane portion. And the opening or the concave portion is provided in the flat portion.

  In order to solve the above problems, a fourth means of the present invention is characterized in that in the first, second or third means of the present invention, the flexible circuit board is connected to the display panel. And

  In order to solve the above-mentioned problem, a fifth means of the present invention is a frame-shaped member further between the display panel and the plate-shaped member in any one of the first to fourth means of the present invention. A certain frame is provided.

  In order to solve the above-mentioned problems, the sixth means of the present invention is the frame having the frame shape in the fifth means of the present invention, and the display panel accommodated on one opening side of the frame. A metal plate member that is a plate member and has a surface portion that covers the other opening side of the frame body and a side wall portion that covers at least a part of the side surface portion of the frame body, and is connected to the display panel A circuit board having flexibility, and the circuit board is bent and arranged from the display panel side through the outside of the side surface of the frame body along the flat portion of the metal plate member. And having a bent holding portion at an outer edge portion of at least a part of the circuit board routed along the flat portion, the bent holding portion being connected to the side wall portion of the metal plate member and the It is arranged between the side surfaces of the frame body.

  In order to solve the above-mentioned problem, a seventh means of the present invention is the sixth means of the present invention, wherein the side surface portion of the metal plate member is provided on two opposite sides, and the side wall portion of the metal member is A space portion that opens toward the circuit board is provided between the frame body and the bent holding portion is disposed in the space portion.

  In order to solve the above-mentioned problem, an eighth means of the present invention is the sixth or seventh means of the present invention, wherein the bent portion of the circuit board or a portion of the circuit board in the vicinity of the bent holder. Is mounted with an electronic component, and the electronic component is housed in the space.

  In order to solve the above-mentioned problems, a ninth means of the present invention includes a frame that forms a frame shape and supports the display panel on one opening side, at least the display panel, and the other opening of the frame. A metal plate member assembled to the frame body having a flat surface portion covering the portion side and a side wall portion covering at least a part of the side surface portion of the frame body, and a side surface of the frame body connected to the display panel And a flexible circuit board that is routed along the flat portion of the metal plate member through the outside, and the side wall portions of the metal plate member are provided on two opposite sides and A space part that opens toward the circuit board side is provided between the side wall part and the frame body of the metal plate member, and at the outer edge part of at least a part of the circuit board routed along the plane part. Provided with a bending holding portion, the bending holding portion or Serial mounting electronic components on the circuit board in the vicinity of the bent holding portion, characterized in that the electronic component inserting the bent holding portion to the space portion and housed in the space portion.

  In order to solve the above-described problem, the tenth means of the present invention is the projection means provided in the outer side of the circuit board in any one of the sixth to ninth means of the present invention. It is characterized in that a fold line that is a boundary of the fold line or the vicinity of the fold line is bent along the fold line.

  In order to solve the above problems, an eleventh means of the present invention is the sixth or seventh means of the present invention, wherein the metal plate member includes the side wall portion of the metal plate member and the side surface of the frame. And an inner wall portion which is a second side wall portion, and the bent holding portion is disposed between the side wall portion and the inner wall portion.

  In order to solve the above problems, a twelfth means of the present invention is the metal plate member according to any one of the eighth to eleventh aspects of the present invention, wherein the side wall portion and the frame of the metal plate member are provided. It has an inner wall part which is the 2nd side wall part between the side surfaces of a body, and has arranged the electronic parts between the side wall part and the inner wall part.

  In order to solve the above-mentioned problems, according to a thirteenth means of the present invention, in the tenth means of the present invention, the circuit board and the metal plate member are arranged at least near the fold line of the circuit board. It is characterized by being bonded by an installed adhesive member.

  In order to solve the above problems, the fourteenth means of the present invention is the means according to any one of the fourth means or the sixth to thirteenth aspects of the present invention, wherein the circuit board is connected to the display panel. A connector portion is provided at an end portion opposite to the end portion, and the width of the circuit board in the connector portion is narrower than the width of the end portion of the circuit board on the display panel side.

In order to solve the above problems, the fifteenth means of the present invention is characterized in that in any one of the sixth to fourteenth aspects of the present invention, the metal plate member is a stainless steel material or a galvanized steel plate material. To do.

  As an effect of the invention, in the present invention, the circuit board is provided with a bending holding portion, and the bending holding portion is disposed between the side wall portion of the metal plate member and the side surface of the frame body. Accordingly, the side surface of the end portion of the circuit board is rubbed on the inner side of the side wall portion of the metal plate member between the frame body and is not exposed to the outside. In addition, even if the other part of the circuit board is rubbed, the side surface of the end part is not turned over or peeled off, and the reliability is improved.

Further, the side wall portion of the metal plate member is provided on two opposite sides, and a space portion that opens toward the circuit board side is provided between the side wall portion and the frame body, and the circuit board is folded in this space portion. By adopting a structure in which the bending holding portion is arranged, the circuit board receives a pressing force from the side wall portions of the two opposite sides of the metal plate member, and the force to be sandwiched between the metal plate member and the frame body on the circuit board. Works to be firmly supported by the metal plate member. And a circuit board does not peel off from a metal plate member, and it has the effect that reliability improves.
On the other hand, the side wall portion of the metal plate member is also provided in the orthogonal direction between the two opposite side walls (FIG. 3B) and the side wall portions 57e and g) (FIG. 3). (B)) A side wall portion 57f) and a space portion that opens toward the circuit board side are provided between the side wall portion 57f and the side surface 55f of the frame, and the circuit board bending holding portion (folding portion) is provided in this space portion. With the structure in which the bending holding part 51e or 51g is provided, the circuit board receives a pressing force from the side wall part of the side of the metal plate member, and the circuit board receives the metal plate member. And the force sandwiched by the frame works, and it becomes a structure that is firmly supported by the metal plate member. And a circuit board does not peel off from a metal plate member, and it has the effect that reliability improves.
As a place for instructing the bending holding portion, the side wall portions 57e, g, and f may be configured at any of three locations, two locations, or one location, and which side wall of the three locations is appropriately determined. What is necessary is just to combine.
At this time, if the circuit board or a component on the circuit board is short-circuited with the metal plate member (short circuit, unnecessary electrical connection), an insulating member (eg, insulating sheet, insulating tape, insulation) is at least in the shorted portion. It is better to sandwich the adhesive).

Moreover, the electronic component mounted on the circuit board can be accommodated in the space portion by mounting or arranging the electronic component in the area of the bent holding portion of the circuit board or in the vicinity thereof. Thus, the thickness of the display device is not affected by the thickness of the electronic component, and a thin display device can be formed. Since protrusions due to electronic components are not exposed on the outer surface, a display device and a portable electronic device using the display device can be thinned.
In particular, the electronic components are mounted in a space in a lump by arranging a plurality of electronic components in a lump in the region of the circuit board bending holding portion or in the vicinity thereof. Can be stored. Thus, the thickness of the display device is not affected by the thickness of the electronic component, and a thin display device can be formed. Since protrusions due to electronic components are not exposed on the outer surface, the display device and portable electronic devices using the display device can be made thinner.

  Further, the bent holding portion of the circuit board is formed by bending a portion formed by protruding to the outer side of the circuit board. Alternatively, it is formed by bending a portion sandwiched between a pair of slit portions provided on the outer side. Since such a portion can be easily bent, the bent holding portion can be provided without impairing the quality of other regions of the circuit board.

  Moreover, the side wall part of the metal plate member is provided with two side wall parts, an outer wall part and an inner wall part, in a part thereof. And an electronic component is accommodated in the meantime. By making such a structure, a shield structure for the electronic component is formed, the electronic component can be protected from noise such as electromagnetic waves, and the influence of noise generated from the electronic component on other electronic devices can be prevented. .

In the present invention, since the side edge of the circuit board is supported by the frame and the metal plate member, it is not necessary to apply a double-sided adhesive tape to the entire circuit board as in the prior art, and the cost of the adhesive member is eliminated. There is an effect that can be reduced.
In addition, this makes the present invention easy to disassemble and replace members at the time of maintenance, and brings about an effect of reducing maintenance costs.

Further, by forming the metal plate member with a stainless steel material or a galvanized steel plate material, it is possible to enhance protection from noise such as electromagnetic waves, and to prevent the influence from noise. In addition, the influence on other components can be eliminated. In addition, stainless steel is particularly durable because it has excellent corrosion resistance. In addition, deformation of the frame body can be prevented, and an effect of preventing breakage can be obtained.

Frame bodies 55 and 85 that form a frame shape and support the display panel (30, 80) on one opening side, at least the display panel (30, 80), and the other opening of the frame bodies 55, 85 Metal plate member 57 assembled to the frame bodies 55 and 85 having flat surface portions 57a and 87a covering the side portions and side wall portions 57e, 57g, 87e and 87g covering at least a part of the side surfaces of the frame body. , 87 and connected to the display panel (30, 80) through the outer sides of the side surfaces 55d, 85d of the frames 55, 85, and routed along the flat portions 57a, 87a of the metal plate members 57, 87. In the display device having the flexible circuit boards 51 and 81, the side wall portions of the metal plate members 57 and 87 are provided on two opposing sides, and the side wall portions and the frame bodies 55 and 85 are provided. Between the circuit Space portions 55r, 55s, 85r, and 85s that open toward the plates 51 and 81 are provided, and folded to at least a part of the outer edge of the circuit boards 51 and 81 routed along the flat portions 57a and 87a. Bending holders 51e, 51g, 81e, 81g are provided, electronic parts 52, 82 are mounted on the circuit board 51, 81 in the vicinity of the bending holding part or the bending holding part, and the bending holding part is mounted. The display device is characterized in that it is inserted into the space and the electronic component is stored in the space.
However, the present invention is not limited to this embodiment.
According to such an embodiment, at least the effects shown in the above-mentioned effect section can be obtained.

Hereinafter, the best mode for carrying out the present invention will be described with reference to the drawings. First, a display device according to a first embodiment of the present invention will be described with reference to FIGS. Here, FIG. 1 shows a plan view, a cross-sectional view, and a rear view of the display device according to the first embodiment of the present invention. FIG. 1 (a) is a plan view, and FIG. 1 (b) is FIG. FIG. 1A is a cross-sectional view taken along the line AA, and FIG. 1C is a rear view. 2A is a cross-sectional view taken along line BB in FIG. 1C, and FIG. 2B is an enlarged perspective view of a portion G in FIG. 2A. FIG. 3 is a perspective view of the frame, the metal plate member, and the circuit board in FIG. 1B. FIG. 3A is a perspective view of the frame, and FIG. A perspective view of the plate member, and FIG. 3C shows a developed perspective view of the circuit board. Note that this embodiment will be described using a liquid crystal display device of a mobile phone.

  As shown in FIGS. 1A and 1B, the display device 60 according to the first embodiment houses the liquid crystal panel 30 in the upper opening side of the frame body 55 having a frame shape. I support it. The lighting device 40 is housed in a space portion inside the frame body 55, and the lower opening portion side of the frame body is covered with a metal plate member 57 to block the lower opening portion. The liquid crystal panel 30 is connected to a circuit board 51, which is an FPC (Flexible Printed Circuit Board), and the connected circuit board 51 is bent and passes through the outside of the side surface 55 d that is the outer side of the frame body 55. Along the flat portion of the plate member 57 (the flat portion on the surface that is opposite to the liquid crystal panel 30 side), the plate member 57 is drawn and disposed in a band shape.

  Further, as shown in FIG. 1C, the circuit board 51 has bent holding portions 51e and 51g at the ends of the upper and lower outer sides in the drawing, and the bent holding portions 51e and 51g are provided. In addition, as shown in E part and G part of FIG. 1C, a plurality of electronic components 52 are mounted in a lump in a row. And the bending holding | maintenance parts 51e and 51g which mounted the electronic component 52 are inserted in the space parts 55r and 55s provided between the frame 55 and the side wall part of the metal plate member 57, as shown in FIG. And stored.

  Here, the part details and specifications of the main components will be briefly described. The liquid crystal panel 30 includes a transparent upper substrate 31 and a lower substrate 32 which are arranged to face each other with a certain gap, and a liquid crystal material is sealed between the gaps. As shown in FIGS. 1A and 1B, a driving IC (driving integrated circuit) 35 is provided on an extending portion 32 a provided on the lower substrate 32 of the liquid crystal panel 30, and the upper substrate of the liquid crystal panel 30 is further provided. A polarizing plate 33 is provided on the upper surface of 31, and a polarizing plate 34 is provided on the lower surface of the lower substrate 32.

  A plurality of display pixels are provided by transparent electrodes made of an ITO film on the surface of the upper substrate 31 and the lower substrate 32 which are encapsulated with liquid crystal material, and a lead electrode pattern for conducting the transparent electrodes is formed on the lower substrate 32. They are gathered on the extended portion 32a. And it is connected to the drive IC 35. In addition, a plurality of connection electrode patterns are provided on the extended portion 32a so as to be connected to the drive IC 35 in order to input signals from the outside to the drive IC 35, and a circuit board 51 serving as an FPC is connected to the connection electrode pattern. It is like that. The drive IC 35 is routed via an anisotropic conductive adhesive and connected to the electrode pattern and the connection electrode pattern, and the circuit board 51 is connected to the connection electrode pattern via an anisotropic conductive adhesive. Then, a signal is input from the outside to the drive IC 35 via the circuit board 51, and the display drive of the liquid crystal panel 30 is performed based on the drive signal from the drive IC 35. Further, a protective film 37 is provided on the mounting portion of the circuit board 51 and the drive IC 35 to protect the electrode pattern from electrolytic corrosion. This protective film 37 is formed of silicon resin, epoxy resin or the like.

  The illuminating device 40 includes a light guide plate 43, a light diffusion sheet 45 disposed on the upper surface of the light guide plate 43, prism sheets 46 a 1 and 46 a 2, and a reflection sheet 42 disposed on the lower surface of the light guide plate 43. The light source unit 47 is disposed on the side surface adjacent to the light plate 43. The light source unit 47 is formed by mounting a light source 49 made of LEDs on a light source circuit board 48, and the light source circuit board 48 is connected to the circuit board 51. Further, the light source unit 47 is arranged on the side surface of the light guide plate 43 by bonding the light source circuit board 48 to the metal plate member 57.

The light from the light source 49 is incident on the light guide plate 43, and the light is also received by the action of the reflection sheet 42 and emitted above the light guide plate 43. Vertical light enters the liquid crystal panel 30 under the action of the prism sheets 46a1 and 46a2. Then, the liquid crystal panel 30 is illuminated brightly. Each of the prism sheets 46a1 and 46a2 has a prism surface continuously arranged in a stripe shape, and vertical light can be obtained by arranging the prism surface of the prism sheet 46a1 and the prism surface of the prism sheet 46a2 orthogonally. ing.

As shown in FIG. 3A, the frame 55 has a hollow square frame shape. A step portion 55b is provided on the upper side, and the liquid crystal panel 30 is accommodated in the step portion 55b. The lighting device 40 is accommodated in the hollow portion of the interior 55a. Further, of the four outer side surfaces 55d, 55e, 55f, and 55g, a stepped surface 55h that is recessed at each part of the side surfaces 55e, 55f, and 55g (in FIG. 3A, one stepped surface 55h can be seen. ), And a side wall portion of a metal plate member 57 to be described later is aligned with this stepped surface. Further, a hook 55j that slightly protrudes is provided on the stepped surface 55h of the pair of side surfaces 55e and 55g facing each other, and the hook 55j engages with a small hole provided in a side wall portion of a metal plate member 57 described later. The plate member 57 is supported by the frame body 55. Further, the pair of side surfaces 55e and 55g are provided with a notch portion 55i further deeper than the step surface (one notch portion 55i can be seen in FIG. 3A). A part of a space portion between a side wall portion of a metal plate member 57 described later and the frame body 55 is formed.
Here, as shown in FIG. 1B, the side surface 55d of the frame 55 comes to the side where the bent portion 51m of the circuit board 51 is disposed, and the side surface 55f is a connector described later of the circuit board 51. It comes to the part side where the part 51c is disposed.
Further, as shown in FIG. 2, the pair of opposing side surfaces 55e and 55g are substantially parallel to the bent holding portions 51e and 51g of the drawn belt-like circuit board 51. And the notch part 55i (refer FIG. 3) provided in a pair of side surfaces 55e and 55g is also made into the substantially parallel notch part corresponding to the bending holding | maintenance parts 51e and 51g of the circuit board 51. FIG. The notch 55i corresponds to the spaces 55r and 55s in FIG.
The frame 55 is formed by an injection molding method using a resin excellent in heat resistance, moisture resistance, impact resistance, chemical resistance, etc., such as a white colored polycarbonate resin or polyethylene resin.

  As shown in FIG. 3B, the metal plate member 57 is made of a thin metal plate, and has side wall portions 57e, 57f, and 57g formed by bending a part of the outer periphery thereof. The side wall portions 57e and 57g are opposed to each other, and a small hole 57c is provided in a part of the side wall portions 57e and 57g, and the metal plate member 57 is supported by the frame body 55 by engaging the small hole 57c with the hook 55j of the frame body. It has become so. The side wall portions 57e, 57f, and 57g are aligned with the step surfaces 55h provided on the side surfaces 55e, 55f, and 55g of the frame body 55, and are supported by the engagement between the hooks 55j and the small holes 57c. Further, the side wall portions 57e, 57f, and 57g are aligned with the step surface 55h of the frame body 55 so as not to protrude from the side surfaces 55e, 55f, and 55g of the frame body 55. The inner side surrounded by the side wall portions 57e, 57f, and 57g forms a flat surface, that is, a flat surface portion 57a. Here, the side wall 57e is aligned with the stepped surface 55h of the side surface 55e of the frame 55, and the side wall 57g is aligned with the stepped surface of the side surface 55g of the frame 55, but inside the side wall 57e and the side wall 57g, An opening 57d is provided along the side wall, and the opening 57d coincides in position with the notch 55i provided in the frame 55, as shown in FIG. Two space portions 55 r and 55 s are formed between the side wall portions 57 e and 57 g of the metal plate member 57 and the frame body 55. That is, a space portion 55 s is formed between the side wall portion 57 e of the metal plate member 57 and the frame body 55, and a space portion 55 r is formed between the side wall portion 57 g of the metal plate member 57 and the frame body 55. Accordingly, the openings of the space portions 55r and 55s are provided so as to open toward the circuit board 51 that is routed along the metal plate member 57.

The metal plate member 57 is formed by pressing a thin metal plate having a thickness of 0.15 mm. The metal plate material 57 is preferably made of stainless steel or galvanized steel plate, and the stainless steel or galvanized steel plate serves to protect electronic components against noise such as electromagnetic waves. The metal plate member 57 is provided to protect the liquid crystal panel 30 against external noise and to prevent the noise generated from the liquid crystal panel 30 from adversely affecting external devices and circuits. In addition, the stainless steel is excellent in heat dissipation, so that it effectively dissipates heat generated by the light source. Moreover, there is little deformation with respect to the external force, and it also serves to prevent deformation of the frame 55 with respect to the external force. Moreover, it is excellent in corrosion resistance, can be easily formed by pressing and cutting, and various shapes can be easily formed.

  FIG. 3C shows a developed perspective view of the circuit board 51 in a portion drawn to the back side of the metal plate member 57. The circuit board 51 is composed of FPC. The FPC is formed of polyimide resin, copper foil, etc., and has a thickness of 0.1 to 0.15 mm and has flexibility, so that it can be easily folded. Bending holders 51e and 51g are provided at portions shown by E and G in the drawing at a part of the opposing outer edge of the circuit board 51 extending in a band shape. And the electronic component 52 is mounted in this bending holding | maintenance part 51e, 51g in the lump form. The electronic component 52 is composed of a resistor, a diode, a transistor, and the like, has a surface mounting type specification, and is mounted on a conductive circuit pattern of the circuit board 51. The bent holding portions 51e and 51g are provided in a slightly protruding state, and the bent holding portions 51e and 51g are formed by bending the protruding portion along a bending line 51i indicated by a one-dot chain line. It has become so. Further, the circuit board 51 is provided with a connector part 51c at the tip part (the tip part is on the opposite side to the side connected to the liquid crystal panel), and is connected to a control board (not shown) so that the signal is transmitted to the circuit board 51. It flows to the substrate 51. Further, the circuit board 51 has a cutout portion 51j obtained by cutting out a portion without a conductive circuit pattern. The shape of the cutout portion 51j is a portion in the alternate long and short dash line, and the portion represented by 51j indicates the shape of the cutout portion.

  As shown in FIG. 2 (a), the bending holding portions 51e and 51g mounted with the electronic component 52 and bent into a substantially L shape include side walls 57e and 57g of the frame body 55 and the metal plate member 57. Are inserted and stored in the space portions 55s and 55r provided between the two. The space portions 55s and 55r only need to have enough space to accommodate the folding holding portions 51e and 51g of the circuit board 51 and the electronic component 52, and the electronic components 52 are arranged in a row. As shown in (b), it has a long quadrangular prism shape. A plurality of electronic components 52 arranged in a row are housed therein.

  The electronic component 52 has a vertical width of 1.0 to 1.8 mm, a horizontal width of 0.5 to 0.8 mm, and a thickness of 0.2 to 1.0 mm. Since the electronic component 52 is relatively thin, the electronic component 52 is mounted on the bending holding portions 51e and 51g and stored in the space portion. The storage width of the space portion may be about 1.3 mm as max, without increasing the size of the frame body 55, and without affecting the lighting device 40 stored inside the frame body 55. Can be stored.

  In the storage structure having such a configuration, the bending holding portions 51e and 51g having flexibility and stored in the space portions 55s and 55r are the side wall portions 57e facing the metal plate member 57. , 57g, and firmly held by the metal plate member 57.

  The circuit board 51 drawn along the flat portion of the metal plate member 57 is bonded and fixed to the flat portion with a double-sided adhesive tape or the like.

With the above configuration, even if the circuit board 51 is rubbed, a space between the bent holding parts 51e and 51g of the circuit board 51 and the side wall parts 57e and 57g of the metal plate member 57 is maintained. Since the portions 55r and 55s are firmly bitten and held, the phenomenon that the end of the circuit board 51 is turned up does not occur. Further, in the portion where the bending holding portions 51 e and 51 g are not provided, the portion which is inside the outer shape portion of the metal plate member 57 is bonded and fixed. For these reasons, even if an external force such as rubbing is applied, the end of the circuit board 51 is not turned or peeled off.
For this reason, a double-sided adhesive tape or a double-sided adhesive (a member that can be peeled off at the time of maintenance) or a portion where the adhesive is disposed is indicated by a fold line 51i shown in FIG. A predetermined adhesion strength between the metal plate members of the circuit board 51 can be obtained only by arranging the circuit board 51 only at the periphery, and the circuit board can be prevented from peeling off from the metal member or being twisted at a predetermined part. It has an effect that can be done. The adhesive member does not need to be adhered to the entire surface as in the prior art, and has the effect of reducing the cost of the adhesive.
Further, in the first embodiment, a cutout portion 51j is provided in a portion where the conductive circuit pattern is not formed on the circuit board 51. The cutout portion 51j corresponds to a portion where the flat portion 57a of the metal plate member 57 shown in FIG. Thus, by providing the cutout portion 51j, the adhesion area with the metal plate member 57 can be reduced.
As a result, the cost of materials such as double-sided adhesive tape can be saved, and the cost of material costs can be reduced. In addition, when the bonding area is small, repair work and the like are facilitated.

  In addition, since the electronic component 52 is stored in the space, a display device that is not affected by the thickness of the electronic component 52 can be obtained, and the display device can be thinned.

  Although the circuit board 51 of the first embodiment has a plurality of electronic components 52 mounted thereon, it can be applied to a circuit board on which no electronic components are mounted, and has the same effect. In this case, it suffices if there is a space that accommodates only the bending holding portions 51e and 51g of the circuit board 51.

On the other hand, the side wall portion of the metal plate member is also provided in the orthogonal direction between the two opposite side walls (FIG. 3B) and the side wall portions 57e and g) (FIG. 3). (B) corresponds to the side wall portion 57f), and a space portion (not shown) that opens toward the circuit board is provided between the side wall portion 57f and the side surface 55f of the frame body. By adopting a structure in which a circuit board bending holding portion (a bending holding portion similar to the bending holding portion 51e or 51g) is provided, the circuit board receives a pressing force from the side wall portion of the metal plate member. Thus, the circuit board is structured to be firmly supported by the metal plate member due to the force sandwiched between the metal plate member and the frame. And a circuit board does not peel off from a metal plate member, and it has the effect that reliability improves.
As a place for instructing the bending holding portion, the side wall portions 57e, g, and f may be configured at any of three locations, two locations, or one location, and which side wall of the three locations is appropriately determined. What is necessary is just to combine.
At this time, if the circuit board or a component on the circuit board is short-circuited with the metal plate member (short circuit, unnecessary electrical connection), an insulating member (eg, insulating sheet, insulating tape, insulation) is at least in the shorted portion. It is better to sandwich the adhesive).

As described above, the present invention provides a display device 60 in which the metal plate member 57 as an example of a plate-like member is disposed between the liquid crystal panel 30 as an example of a display panel and the FPC 51 as an example of a flexible circuit board. The plate-like member is provided with an opening 57d (in this embodiment, the opening 57d may be a recess), and at least a part of the end of the circuit board (for example, bent and held) The portions 51e and 51g) are inserted into the openings 57d or the recesses.
Further, the plate member is a metal member 57.
Further, the metal member 57 as an example of the plate-like member includes a flat portion parallel to the liquid crystal panel 30 and side wall portions 57e and 57g protruding perpendicularly to the flat portion, and the opening 57d or the concave portion. Is provided on the flat surface portion 57a.
The FPC 51 which is an example of the flexible circuit board is connected to the liquid crystal panel 30 which is an example of the display panel at or near the portion covered with the protective film 37 as shown in FIG.
Further, a frame body 55 that is a frame-like member is disposed between a liquid crystal panel 30 that is an example of the display panel and a metal plate member 57 that is an example of the plate-like member. That is, the display panel-frame-plate member-flexible substrate has a configuration in which the plane is sequentially arranged in the vertical direction as shown in FIG.

  Next, a display device according to a second embodiment of the present invention will be described with reference to FIG. FIG. 4 is a cross-sectional view of a main part of a display device according to a second embodiment of the present invention, and a perspective view showing a state in which an electronic component is mounted on a circuit board. FIG. 4B is a perspective view of a circuit board on which electronic components are mounted in the G part of FIG. 4A.

  The display device of the second embodiment is different from the display device of the first embodiment described above in the manner of mounting electronic components mounted on a circuit board. That is, only the configuration of the circuit board on which the electronic component is mounted is different. Other components such as a liquid crystal panel, a frame, a lighting device, and a metal plate member have the same configuration as that of the first embodiment. Accordingly, the same components are denoted by the same reference numerals. Here, a description will be given mainly of a circuit board portion having a configuration different from that of the first embodiment.

  As shown in FIG. 4A, the display device 70 according to the second embodiment has a pair of opposed space portions 55s and 55r formed by the frame body 55 and the metal plate member 57 (the space portions 55s and 55r are the same as those described above. The folding holding portion of the circuit board 61 and the electronic component are housed in the same configuration as the space portion in the first embodiment. In the E portion surrounded by a circle, the bending holding portion 61e and the electronic component 62b of the circuit board 61 are displayed, and in the G portion surrounded by a circle, the bending holding portion 61g and the electronic component 62a of the circuit board 61 are displayed. Has been. Here, the electronic component 62b is mounted at a position close to the bending holding portion 61e, that is, in the vicinity of the area of the bending holding portion 61e, and the electronic component 62a is mounted on the bending holding portion 61g, that is, the bending holding portion 61e. It is mounted in the area of the holding part 61g.

  FIG. 4B is an enlarged view of the mounting of the electronic component on the side of the bending holding portion 61g housed in the G portion. In FIG. 4B, 61i indicates a fold line, and the fold holding portion 61g is formed by bending at the fold line 61i. An electronic component 62a is mounted on the bend holding portion 61g, and an electronic component 62b is mounted at a close position immediately before the bend holding portion 61g. Although not shown, the same mounting is also performed in the bending holding portion 61e facing the bending holding portion 61g. The electronic component 62b shown by E part of Fig.4 (a) represents the electronic component 62b mounted in the proximity position of the bending holding part shown by (b) of FIG. Moreover, the electronic component 62a shown by the G part of (a) of FIG. 4 represents the electronic component 62a mounted on the bending holding part 61g shown in (b) of FIG.

  The electronic component to be mounted is composed of a resistor, a diode, a capacitor, etc., and the size is 1.0 to 1.8 mm in the vertical width, 0.5 to 0.8 mm in the horizontal width, and 0.2 in the thickness dimension. The range is -1.0 mm. When an electronic component having a large thickness dimension is mounted on the bending holding portion, it is necessary to increase the width w of the space portion for storing the electronic component. This is not preferable because the frame body 55 and the metal plate member 57 are enlarged. In order to solve this problem, an electronic component having a large thickness and an electronic component having a relatively small lateral width are mounted in the vicinity of the folding holder, and the electronic component having a small thickness is mounted on the folding holder. To be implemented above. In FIG. 4, an electronic component 62a represents an electronic component having a small thickness dimension, and an electronic component 62b represents an electronic component having a large thickness dimension. In this way, when the mounting configuration is taken into consideration in consideration of the thickness dimension of the electronic component, it is not necessary to increase the width w of the space for storing the electronic component. Further, it is possible to reduce the thickness without affecting the dimensions of the electronic component without increasing the size of the frame body 55 and the metal plate member 57 and without increasing the thickness. However, in this case, it is necessary to provide an appropriate gap between the metal plate member 57 and the electronic component 62b or to provide an insulating layer so that the metal plate member 57 and the electronic component 62b do not contact each other.

  Next, a display device according to a third embodiment of the present invention will be described with reference to FIGS. Here, FIG. 5 shows a plan view, a cross-sectional view, and a rear view of the display device according to the third embodiment of the present invention. FIG. 5 (a) is a plan view, and FIG. 5 (b) is FIG. FIG. 5A is a cross-sectional view taken along line AA, and FIG. 5C is a rear view. FIG. 6 is a cross-sectional view taken along line BB in FIG. 7 is a perspective view of a circuit board on which the frame, the metal plate member, and the electronic component in FIG. 5 are mounted. FIG. 7A is a perspective view of the frame, and FIG. FIG. 7C is a perspective view of a circuit board on which electronic components are mounted.

  As shown in FIG. 5B, the display device 100 according to the third embodiment stores and supports the liquid crystal panel 80 on the opening side of the upper portion of the frame body 85 having a frame shape, and supports the liquid crystal panel 80 in the internal space. Accommodates the illuminating device 90, and further, the lower opening side of the frame 85 is covered with a metal plate member 87 to close the lower opening. Further, a circuit board 81 made of FPC is connected to the liquid crystal panel 80, and the connected circuit board 81 is bent and passes outside the side surface 85d of the frame 85 along the flat portion 87a of the metal plate member 87. It is arranged by being drawn around in a band shape.

  Further, as shown in FIG. 5C, the circuit board 81 has bent holding portions 81e and 81g at the ends of the upper and lower outer sides in the drawing, and the bent holding portions 81e and 81g are provided. In addition, as shown in E part and G part of FIG. 5C, a plurality of electronic components 82 are mounted in a single lump. And the bending holding parts 81e and 81g which mounted the electronic component 82 are inserted in the space parts 85s and 85r provided between the frame 85 and the side wall part of the metal plate member 87, as shown in FIG. And stored. In the cross-sectional view of FIG. 6, there is a gap between the electronic component 82 and the frame body 85, but it is good for miniaturization to avoid the gap.

  Here, the main component parts will be described in detail. The liquid crystal panel 80 includes an upper substrate 71 and a lower substrate 72 which are arranged to face each other with a certain gap, and a liquid crystal material is sealed in the gap. 5A and 5B, a driving IC 75 is provided on an extending portion 72a provided on the lower substrate 72, and further, a polarizing plate 73 is provided on the upper surface of the upper substrate 71, and a polarizing plate 74 is provided on the lower surface of the lower substrate 72. The configuration is provided.

  A plurality of display pixels are provided by electrodes on the surface on the liquid crystal material side sealed by a sealing member (sealing member) having a frame shape between the upper substrate 71 and the lower substrate 72, and conduction is made to these electrodes. The lead electrode patterns are gathered on the extended portion 72 a of the lower substrate 72. And it is connected to the drive IC 75. Further, a plurality of connection electrode patterns are provided on the extending portion 72a so as to be connected to the drive IC 75 in order to input signals from the outside to the drive IC 75, and a circuit board 81 serving as an FPC is connected to the connection electrode pattern. It is like that. The drive IC 75 is routed through an anisotropic conductive adhesive and connected to the electrode pattern and the connection electrode pattern, and the circuit board 81 is connected to the connection electrode pattern through an anisotropic conductive adhesive. Then, a signal is input from the outside to the driving IC 75 via the circuit board 81, and the display driving of the liquid crystal panel 80 is performed based on the driving signal from the driving IC 75. Further, a protective film 77 is provided on the mounting portion of the circuit board 81 and the drive IC 75 to protect the electrode pattern from electrolytic corrosion.

  The illuminating device 90 includes a light guide plate 93, a light diffusion sheet 95 disposed on the upper surface of the light guide plate 93, prism sheets 96a1 and 96a2, and a reflection sheet 92 disposed on the lower surface of the light guide plate 93. The light source unit 97 is arranged on the side surface adjacent to the light plate 93. The light source unit 97 is formed by mounting a light source 99 made of LEDs on a light source circuit board 98, and the light source circuit board 98 is connected to the circuit board 81. The light guide plate 93, the light diffusion sheet 95, the prism sheets 96a1 and 96a2, the reflection sheet 92, the light source circuit board 98, and the light source 99 constituting the illumination device 90 have the same specifications as those of the first embodiment. Therefore, description of component specifications and actions is omitted.

  As shown in FIG. 7A, the frame 85 has a hollow square frame shape. A stepped portion 85b is provided on the upper side, and the liquid crystal panel 80 is accommodated in the stepped portion 85b. The lighting device 90 is accommodated in the hollow portion of the interior 85a. Of the four outer peripheral side surfaces 85d, 85e, 85f, and 85g, a concave step surface 85h is seen on each of the side surfaces 85e, 85f, and 85g (in FIG. 7A, one step surface 85h is visible. The outer wall portion of the metal plate member 87 to be described later is aligned with the step surface 85h. Further, a hook 85j is provided on the stepped surface 85h of the pair of side surfaces 85e and 85g facing each other, and this hook 85j engages with a small hole provided in an outer wall portion of a metal plate member 87, which will be described later. 87 is supported by the frame body 85. Further, the pair of side surfaces 85e and 85g are provided with a notch 85i deeper than the stepped surface 85h (in FIG. 7A, one notch 85i is visible), and a metal plate member The outer wall portions 87e and 87g of 87 and the cutout portion 85i of the frame 85 (the cutout portion on the outer wall portion 87g side cannot be seen in FIG. The space portions 85r and 85s are formed between them. The frame body 85 is formed by an injection molding method using a resin excellent in heat resistance, moisture resistance, impact resistance, chemical resistance, etc., such as a white colored polycarbonate resin or polyethylene resin.

  As shown in FIG. 7B, the metal plate member 87 is made of a thin metal plate, and has outer wall portions 87e, 87f, and 87g formed by bending a part of the outer periphery thereof. Further, the pair of opposed outer wall portions 87e and 87g have inner wall portions 87j and 87k arranged in parallel with each other. The inner wall portions 87j and 87k are formed by cutting and bending the flat portion 87a inside the outer wall portions 87e and 87g. Therefore, an opening is formed with a required width in a portion obtained by cutting and bending the flat portion 87a. In FIG. 7B, 87d represents an opening, and an opening 87d having a required width is formed between the outer wall 87e and the inner wall 97j, and the outer wall 87g and the inner wall are formed. An opening 87d is also formed between the portion 87k. The opening 87d is provided at the same position as the notch 85i of the frame 85. Further, a small hole 87c is provided in a part of each of the opposing outer wall portions 87e and 87g, and the metal plate member 87 is supported by the frame body 85 by engaging the small hole 87c and the hook 85j of the frame body. It has become so. Further, the outer wall portions 87e, 87f, and 87g are aligned with the step surfaces 85h of the side surfaces 85e, 85f, and 85g of the frame body 85, and are further supported by the engagement between the hooks 85j and the small holes 87c. Further, the outer wall portions 87e, 87f, and 87g are configured not to protrude outward from the side surfaces 85e, 85f, and 85g of the frame body 85 by aligning with the step surface 85h of the frame body 85.

  Here, when the outer wall 87e is aligned with the stepped surface 85h of the side surface 85e of the frame 85, the inner wall 87j is in contact with or close to the side surface of the notch 85i of the frame 85 as shown in FIG. Come to the position to do. Then, the opening of the cutout portion 85 i of the frame body 85 and the opening portion 87 d of the metal plate member 87 is connected to form a space portion 85 s between the outer wall portion 87 e of the metal plate member 87. Similarly, a space portion 85r is formed between the outer wall portion 87g and the outer wall portion 87g when the outer wall portion 87g is aligned with the step surface 85h of the side surface 85g of the frame 85. Then, as shown in FIG. 6, the bending holding portions 81e and 81g of the circuit board 81 on which the electronic component 82 is mounted are inserted and stored in the space portions 85s and 85r.

The metal plate member 87 is formed by pressing a thin metal plate having a thickness of 0.15 mm. The metal plate material 87 is preferably made of stainless steel or galvanized steel plate, and the stainless steel or galvanized steel plate serves to protect from noise such as electromagnetic waves. The metal plate member 57 is provided to protect the liquid crystal panel 80 from external noise and prevent the noise generated from the liquid crystal panel 80 from adversely affecting external devices. The stainless steel material or galvanized steel plate material also serves to prevent the frame 85 from being deformed by an external force. It also has excellent corrosion resistance and is easy to press and cut.
Various shapes can be easily formed. In addition, the stainless steel material or the galvanized steel plate material also has an excellent heat dissipation property, so that it effectively dissipates heat generated by the light source.

FIG. 7C is a perspective view of a portion of the circuit board 81 in which the back side of the metal plate member 87 is routed (arranged).
The circuit board 81 is composed of a strip-shaped FPC. The circuit board 81 is provided on the back side of the metal plate member 87 with the left and right bent holding portions 81g and 81e mounted and bent, and the left and right folded boards. A thin extension portion 81b formed by a flat portion 81a sandwiched between the bending holding portions 81g and 81e and a cutout portion having a constricted shape on the left and right (the flat portion of the extension portion 81b and the metal member 87) 87a is shown by a one-dot chain line in the figure) and a connector part 81c provided at the tip of the extension part 81b. Here, the electronic parts 82 are mounted on the left and right bent holding portions 81g and 81e in rows. The electronic component 52 is composed of a resistor, a diode, a transistor, and the like, has a surface mounting type specification, and is mounted on a conductive circuit pattern of the circuit board 81. The fold holding portions 81g and 81e are formed by bending the fold line 81i.

Further, the narrow extension portion 81b is formed by cutting out a portion having no conductive circuit pattern on the left and right sides of the circuit board 81. This cutout shape includes cutout portions 81j and 81k indicated by alternate long and short dashed lines. The cutout portion 81j and the cutout portion 81k are connected cutout portions, and the cutout portion 81j is a cutout shape having a constriction on the circuit board 81. I am doing. The extension part 81b is provided a little longer, and the tip part (this tip part is a tip part opposite to the end part of the circuit board 81 on the side connected to the liquid crystal panel) is provided with a connector part 81c. A signal is transmitted from the control circuit to the circuit board 81 by being connected to a control board (not shown).

  Here, the bending holding portions 81e and 81g on which the electronic components 82 of the circuit board 81 are mounted are spaces formed between the outer wall portion 87e and the inner wall portion 87j of the metal plate member 87, as shown in FIG. A bending holding portion 81e in which the electronic component 82 is mounted in the portion 85s is accommodated, and the bending in which the electronic component 82 is mounted in the space portion 85r formed between the outer wall portion 87g and the inner wall portion 87k of the metal plate member 87. The holding part 81g is stored.

  The electronic component 82 to be mounted is a resistor, a diode, a capacitor, and the like. The size is 1.0 to 1.8 mm in the vertical width, 0.5 to 0.8 mm in the horizontal width, and 0.2 to 1 in the thickness. The range is 0.0 mm. Since the electronic component 82 is relatively thin, the electronic component 82 is mounted on the bent holding portion and stored in the space portion. The storage width or thickness of the space portion may be about 1.3 mm (for example, the thickness of the electronic component) as a maximum, without increasing the size of the frame 85, and also for other components such as a lighting device. It can be stored without affecting it.

  Further, the flat portion 81a of the circuit board 81 is bonded and fixed to the flat portion 87a of the metal plate member 87 with a double-sided adhesive tape or the like, as shown in FIG. The narrow extension 81b moves without being bonded. The connector part 81c at the tip of the extension part 81b is used by being inserted into a connector part (not shown) on the control board side. At that time, the extension part 81b connected to the connector part 81c is bent and inserted. Thus, the connector connection work can be easily performed, and the effect of reducing the number of assembly steps can be obtained. The extension portion 81b is not fixed, and is freely bent when the connector portion 81c is connected to the other side so that the assembling work can be easily performed.

As described above, in the embodiment of the present invention, the frame body 85 that forms a frame shape and supports the display panel (80) on one opening side, at least the display panel (80), and the frame body 85 A flat surface portion 87a covering the other opening side and a side wall portion 87 covering at least a part of the side surface portion of the frame.
e, 87g and a metal plate member 87 assembled to the frame 85, and the metal plate member 87 connected to the display panel (80) and passing through the outside of one side surface 85d of the frame 85. And a flexible circuit board 81 arranged by being routed along the flat surface portion 87a, and the side wall portions of the metal plate member 87 are provided on two opposite sides and the side wall portions 87e, 87e, Space portions 85r and 85s opening toward the circuit board 81 are provided between 87g and the frame body 85, and at least a part of the outer edge of the circuit board 81 routed along the flat surface 87a. Bending holding portions 81e, 81g are provided, and an electronic component 82 is mounted on the circuit board 81 in the vicinity of the bending holding portions 81e, 81g or the bending holding portions 81e, 81g, and the bending holding portion 81e. , 8 Said g space 85r, the insert into 85s electronic component 82 to the space portion 85r, constitute a display device, characterized in that housed in the 85s.
Further, the bending holding portions 81e and 81g are bent lines 81i at the folding line 81i or the vicinity of the folding line 81i which is the boundary between the protruding portions (81g and 81e) provided on the outer side of the circuit board 81. Bend along.
Further, the metal plate member 87 includes inner side wall portions 87j and 87k which are second side wall portions (87j and 87k) between the side wall portion of the metal plate member 87 and the side surfaces 85e and 85g of the frame body 85. The bent holding portions 81e and 81g are disposed between the side wall portions 87e and 87g and the inner wall portions 87j and 87k.
Further, the metal plate member 87 includes inner wall portions which are second side wall portions (87j, 87k) between the side wall portions 87e, 87g of the metal plate member 87 and the side surfaces 85e, 85g of the frame body 85. 87j, 87k, and the electronic component 82 is disposed between the side wall portions 87e, 87g and the inner wall portions 87j, 87k.
That is, the electronic component 82 is disposed so as to be sandwiched between the metal members. At this time, if the conductive terminal of the electronic component 82 is exposed, the metal member is short-circuited (short-circuited). Therefore, when this short-circuit becomes a problem, an insulating sheet or insulating paint is disposed on the metal member side, Or it is good to mold an electronic component with insulating resin.
Further, the circuit board 81 and the metal plate member 87 are bonded by an adhesive member disposed at least in the vicinity of the fold line 81 i of the circuit board 81.
Furthermore, the circuit board 81 has a connector part 81c at the end opposite to the end connected to the display panel (80), and the width of the circuit boards 81b and 81c of the connector part 81c It is narrower than the width of the end portion of the circuit board 81 on the display panel (80) side, that is, on the protective film 77 side.
Further, the metal plate member 81 is made of stainless steel, but may be galvanized steel plate.

  With the above configuration, the flexible bending holding portions 81e and 81g housed in the space portions 85s and 85r are pressed by the opposing outer wall portions 87e and 87g of the metal plate member 87. The metal plate member 87 is firmly held by the outer wall portions 87e and 87g.

  Even if an external force such as rubbing is applied to the circuit board 81, the phenomenon that the end of the circuit board 81 turns up does not occur. Further, at the end of the portion of the circuit board 81 where the bent holding portions 81e and 81g are not provided, the cutout portions 81j and 81k are provided so as to enter inside the outer shape portion of the metal plate member 87. The adhesive portion can be bonded and fixed to the portion with a double-sided adhesive tape, which can reduce the amount of the adhesive or the coating area, thereby reducing the material and man-hours.

  In the third embodiment, the cutout portions 81j and 81k of the circuit board 81 have a considerably wide area with both cutout portions. Since this part does not need to be bonded, a double-sided adhesive tape can be saved. Further, even if the adhesion area of the circuit board 81 is reduced, the bending holding parts 81e and 81g of the circuit board 81 are firmly held by the outer wall parts 87e and 87g of the metal plate member 87, so that the circuit board 81 is prevented from peeling off. it can.

  Further, the thin extension portion 81b of the circuit board 81 is not fixed and is provided with a slightly longer length, so that it is easy to bend, and it is easy to be assembled by bending when connecting to the mating side of the connector portion 81c. It becomes easy to work. Further, since the bending is easy, the flat portion 81a to which the circuit board 81 is bonded and fixed is hardly peeled off.

Moreover, in 3rd Embodiment, the outer wall part and the inner wall part are provided in the metal plate member 87, and the structure which accommodates an electronic component between the outer wall part and the inner wall part is comprised.
Accordingly, the electronic component can be protected against noise from the liquid crystal panel and noise from the outside. Further, it is possible to prevent adverse effects of noise from the electronic components on the liquid crystal panel and adverse effects of noise on other external electronic devices.

  In addition, since the electronic component 52 is stored in the space, a display device that is not affected by the thickness of the electronic component 52 can be obtained, and the display device can be thinned.

  The description of the embodiment of the present invention has been made by taking the liquid crystal display device as an example, but the display device of the present invention can be similarly applied to a plasma display device, an electroluminescence display device, and the like. Although the embodiments of the present invention have been described by taking up a liquid crystal display device of a mobile phone, the display device of the present invention can be applied to liquid crystal display devices other than a mobile phone in the same manner.

As described above, the present invention provides at least a frame having a frame shape, a display panel housed on one opening side of the frame, a surface portion covering the other opening side of the frame, and the frame A metal plate member having a side wall portion covering at least a part of a side surface portion of the body, and a flexible circuit board connected to the display panel, wherein the display is formed by bending the circuit board. In a display device configured to be routed from the panel side through the outside of one side surface of the frame body along the planar portion of the metal plate member, at least one of the circuit boards routed along the planar portion. The display device is characterized in that a bending holding portion is provided at an outer edge of the portion, and the bending holding portion is disposed between a side wall portion of the metal plate member and a side surface of the frame body. .

FIG. 1A is a plan view, FIG. 1B is a plan view, and FIG. 1B is a cross-sectional view taken along line AA in FIG. 1A. FIG. 1C is a rear view. 2A is a cross-sectional view taken along line BB in FIG. 1C, and FIG. 2B is an enlarged perspective view of a portion G in FIG. 2A. 3B is a perspective view of the frame, the metal plate member, and the circuit board in FIG. 1B, FIG. 3A is a perspective view of the frame, FIG. 3B is a perspective view of the metal plate member, FIG. (C) is an exploded perspective view of the circuit board. FIG. 4A is a cross-sectional view of a main part of a display device according to a second embodiment of the present invention, and a perspective view showing a state in which an electronic component is mounted on a circuit board. FIG. FIG. 5B is a perspective view of a circuit board on which electronic components in the G part of FIG. 5A is a plan view, a cross-sectional view, and a rear view of a display device according to a third embodiment of the present invention. FIG. 5A is a plan view, and FIG. 5B is a cross-sectional view taken along line AA in FIG. FIG. 5 (c) is a rear view. It is BB sectional drawing in (c) of FIG. 7 is a perspective view of a circuit board on which a frame, a metal plate member, and an electronic component are mounted in FIG. 5, FIG. 7A is a perspective view of the frame, and FIG. 7B is a perspective view of the metal plate member. FIG. 7C is a perspective view of a circuit board on which electronic components are mounted. FIG. 8A is a plan view and FIG. 8B is a main part sectional view of a liquid crystal display device of a model in the prior art. It is the top view which looked at FPC in (b) of Drawing 8 from the lower side. It is explanatory drawing explaining the problem occurrence point when adhere | attaching FPC on a holding member.

Explanation of symbols

30, 80 Liquid crystal panel (display panel)
31, 71 Upper substrate 32, 72 Lower substrate 33, 34, 73, 74 Polarizing plate 35, 75 Drive IC
37, 77 Protective film 40, 90 Illumination device 42, 92 Reflective sheet 43, 93 Light guide plate 45, 95 Light diffusion sheet 46a1, 46a2, 96a1, 96a2 Prism sheet 47, 97 Light source unit 48, 98 Light source circuit board 49, 99 Light source 51, 61, 81 Circuit board 51c, 81c Connector part 51e, 51g, 61e, 61g, 81e, 81g Bending holding part 51i, 61i, 81i Bending line 51j, 81j, 81k Cutout part 52, 62a, 62b, 82 Electronic parts 55, 85 Frames 55a, 85a Internal portions 55b, 85b Stepped portions 55d, 55e, 55f, 55g, 85d, 85e, 85f, 85g Side surfaces 55h, 85h Stepped surfaces 55j, 85j Hooks 55i, 85i Notched portions 55r, 55s 85r, 85s Space 57, 87 Metal plate member 57a, 1a, 87a flat portion 57c, 87c eyelet 57d, 87d opening 57e, 57f, 57g sidewall portion 60,70,100 display device 81b extensions 87e, 87f, 87g outer wall portion 87j, 87k inner wall portion

Claims (15)

In a display device in which a plate-like member is arranged between a display panel and a flexible circuit board,
An opening or a recess is provided in the plate-like member, and at least a part of an end of the circuit board is inserted into the opening or the recess.     The display device according to claim 1, wherein the plate-like member is a metal member.   The plate-like member has a plane part parallel to the display panel and a side wall part protruding perpendicular to the plane part, and the opening or the recess is provided in the plane part. The display device according to claim 1.   The display device according to claim 1, wherein the flexible circuit board is connected to the display panel.   5. The display device according to claim 1, wherein a frame body that is a frame-like member is further disposed between the display panel and the plate-like member.   The frame having a frame shape, a display panel accommodated on one opening side of the frame, a surface portion that is the plate-like member and covers the other opening side of the frame, and at least of the frame A metal plate member having a side wall portion covering a part of the side surface portion, and a flexible circuit board connected to the display panel, and the circuit board is bent from the display panel side. It is configured to be arranged by being routed along the flat part of the metal plate member through the outside of the side surface of the frame body, and at the outer edge of at least a part of the circuit board routed along the flat part. The display device according to claim 5, further comprising a bending holding portion, wherein the bending holding portion is disposed between the side wall portion of the metal plate member and the side surface of the frame body.   Side surfaces of the metal plate member are provided on two opposing sides, and a space portion that opens toward the circuit board is provided between the side wall portion and the frame body of the metal member, and the space portion includes the space portion. The display device according to claim 6, further comprising a bent holding portion.   7. The electronic component is mounted on a portion of the circuit board in the vicinity of the bent holding portion of the circuit board or in the vicinity of the bent holding portion, and the electronic component is housed in the space portion. Or the display apparatus of 7. A frame that has a frame shape and supports the display panel on one opening side, at least the display panel, a flat surface that covers the other opening side of the frame, and at least a side surface of the frame A metal plate member that has a side wall covering the portion and is assembled to the frame,
A display device having a flexible circuit board connected to the display panel and routed along the flat portion of the metal plate member through the outside of the side surface of the frame body;
A side wall portion of the metal plate member is provided on two opposite sides, and a space portion that opens toward the circuit board is provided between the side wall portion of the metal plate member and the frame body,
A folding holding portion is provided at an outer edge portion of at least a part of the circuit board routed along the flat portion, and the electronic component is placed on the circuit board in the vicinity of the folding holding portion or the bending holding portion. The display device is mounted, the bending holding portion is inserted into the space portion, and the electronic component is stored in the space portion. 7. The fold holding portion is bent along a fold line at or near a fold line that is a boundary of a protruding portion provided on an outer side of the circuit board. The display device according to any one of 9.   The metal plate member has an inner wall portion which is a second side wall portion between the side wall portion of the metal plate member and a side surface of the frame body, and is between the side wall portion and the inner wall portion. 8. The display device according to claim 6, wherein the bent holding portion is provided.   The metal plate member has an inner wall portion which is a second side wall portion between the side wall portion of the metal plate member and a side surface of the frame body, and is between the side wall portion and the inner wall portion. The display device according to claim 8, wherein the electronic component is disposed.   The display device according to claim 10, wherein the circuit board and the metal plate member are bonded to each other by an adhesive member disposed at least in the vicinity of the fold line of the circuit board.   The circuit board has a connector part at an end opposite to the end connected to the display panel, and the width of the circuit board in the connector part is equal to the end of the circuit board on the display panel side. 14. A display device according to claim 4, wherein the display device is narrower than the width. 15. The display device according to claim 6, wherein the metal plate member is a stainless steel material or a galvanized steel plate material.

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