201209223 ' 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明係有關於鍍膜裝置，尤其有關於一種用於在 銅線上鍍錫的鍍膜裝置。 【先前技術】 鑛錫裝置為可在銅線上鍵錫，銅線在嫂錫之後，即 可供電子電路元件的電性接點使用，其可供作為焊接媒 介而連接不同的電性接點用。 [0003] Ο Ο [0004] 099127605 習知鍵錫裝置其先準備一錫爐，該錫爐裝有溶融狀 態的錫液，同時讓一麵銅線拉線進入該錫爐内，讓該銅 線附著該錫液，該鋼線並朝垂直上方拉線，並穿線經過 一成型模具，藉由該成型模具去除多餘的錫液，在去除 多餘的錫液之後隨即進入—冷卻管路，該冷卻管路與— 冷卻水槽連通’冷卻水槽提供源源不絕的冷卻水，以快 速降低銅線的溫度，以避免錫液函重力吟影響而滴落或 變形。201209223 ' VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION [0001] The present invention relates to a coating apparatus, and more particularly to a coating apparatus for tin plating on a copper wire. [Prior Art] The tin-plating device can be used to bond tin on the copper wire. After the copper wire is tin-tin, it can be used as an electrical contact for electronic circuit components. It can be used as a soldering medium to connect different electrical contacts. . [0003] 99 Ο [0004] 099127605 The conventional key tin device first prepares a tin furnace, which is filled with tin liquid in a molten state, and at the same time, a copper wire is drawn into the tin furnace, and the copper wire is attached thereto. Tin liquid, which is drawn upwards vertically and threaded through a molding die, and the excess tin liquid is removed by the molding die, and then the excess tin liquid is removed and then enters the cooling pipe, which is connected to the cooling pipe. — Cooling water tank connection 'The cooling water tank provides an endless supply of cooling water to quickly reduce the temperature of the copper wire to avoid dripping or deformation due to the influence of the tin liquid.
d !；· '8 !!1 ^ W 甘 \ 1'::丨 rJ*’ f 此種習知鍍锡裴皇為垂直方向設置，受到重力與銅 線移動的慣性力的加乘作用影響，該銅線附著該錫液的 量相當的有限，換句話說，該銅線可以鍍上錫的厚度相 當的有限’ 一般只能達到10微米〜15微米之間。又^ 少慣性力的影響，銅線移動的迷度受到了限制，因此其 生產速度慢，難以滿足產能的需 丹 的冷卻效果不足或損壞時，該_ = ’ 管路 滴落的可能，而踢液由高空滴落㊉附著的錫液亦會有 時，會產生㈣麟而導致危I \該錫爐或冷卻水槽 表單編號A0101 〇992〇48534-〇 201209223 【發明内容】 [0005] 爰此，本發明之主要目的在於揭露一水平設置的鍍 錫裝置，以安全、快速地於一銅線上鍍錫，並可滿足形 成厚的錫鍍層的需求。 [0006] 本發明為鍍錫裝置，其包含一浸錫盒、一第一模具 、一第二模具、一第一加熱模組與一第二加熱模組，其 中該浸錫盒具有一容置空間，且該容置空間的兩侧具有 一第一穿孔與一第二穿孔，而該第一模具裝設於該容置 空間内，並具有一成型孔，且該成型孔對準並位於該第 二穿孔的一侧，另該第二模具具有一定型孔，該定型孔 對準並位於第二穿孔的另一側，此外該第一加熱模組設 於該第一模具的下方，而該第二加熱模組設於該第二模 具的下方。 [0007] 據此，本發明可於該容置空間内裝填一錫液，並讓 該銅線水平拉線的進入該容置空間被該錫液所淹蓋，而 讓該銅線附著該錫液，同時藉由該第一加熱模組的加熱 維持流動性以利用該成型孔去除多餘的錫液，再藉該第 二加熱模組的加熱維持可塑性而藉該定型孔加以定型成 所需尺寸，即可以完成該銅線的鍍錫作業，據此形成一 水平配置的鍍錫裝置，其沒有錫液滴落的危險，且容易 形成厚的錫鍍層，並可快速形成錫鍍層，滿足使用上的 需求。 【實施方式】 [0008] 為使貴委員對本發明之特徵、目的及功效，有更加 深入之瞭解與認同，茲列舉較佳實施例並配合圖式說明 099127605 表單編號A0101 第4頁/共17頁 0992048534-0 201209223 如后： [0009] 請參閱「圖1」所示，其為本發明的可能實施例之一 ，其包含一浸錫盒10、一第一模具20、一第二模具30、 一第一加熱模組40、一第二加熱模組50與複數冷卻管路 60 ° [0010] ❹ 請再配合參閱「圖2」與「圖3」所示，其中該浸錫 盒10具有一容置空間11，且該容置空間11的兩側具有一 第一穿孔12與一第二穿孔13，並該第一穿孔12上設有一 止漏環14，而該第一模具20裝設於該容置空間11内，並 具有一成型孔21，且該成型孔21對準並位於該第二穿孔 13的一侧，另該第二模具30具有一定型孔31，該定型孔 31對準並位於第二穿孔13的另一側，又該第二穿孔13的 兩側可各設有一定位座80，該二定位座80具有一滑槽81 ，該第一模具20與該第二模具30分設於該二滑槽81内， 並分藉螺鎖於該定位座80的一擋板82夾制固定。 [0011] ❹ 此外該容置空間11於靠近該第二穿孔13之處形成一 狹長的長槽111，該第一加熱模組40設於該長槽111的底 部並伸入該第一模具20的下方，而該第二加熱模組50設 於該第二模具30的下方。並本發明更可具有一第一測溫 模組41與一第二測溫模組51，該第一測溫模組41鄰近該 第一加熱模組40設置，該第二測溫模組51鄰近該第二加 熱模組50設置。 請再配合參閱「圖4」所示，本發明的浸錫盒10可以 兩兩為一組的置入一錫爐90内，並該容置空間11連通有 099127605 表單編號A0101 第5頁/共17頁 0992048534-0 [0012] 201209223 一侧腔室1 5，該側腔室1 5設有一開口 1 51與一液體導流裝 置16，該開口 151與該錫爐90連通，並該液體導流裝置 16的導流方向為由該開口 151朝向該容置空間11，並該液 體導流裝置16可以為螺槳，又該液體導流裝置16可連結 一驅動桿70，該驅動桿70受一馬達71的驅動而轉動。 [0013] 請再參閱「圖5」所示，本發明的該冷卻管路60具有 一位於内層的冷卻通道61與一位於外層的冷卻水通道62 ，該冷卻通道61對準該定型孔31，而該冷卻水通道62具 有一入口 621與一出口 622。且該冷卻管路60可具有複數 個，且該複數冷卻管路60的該複數冷卻通道61彼此對準 串接。 [0014] 請再參閱「圖6」所示，本發明可用於一銅線91的鍍 錫作業，其於該容置空間11内裝填一錫液92，該錫液92 可藉該液體導流裝置16由該錫爐90中導流至該容置空間 11内，並讓該銅線91水平拉線的由該第一穿孔12經該止 漏環14的止漏，進入該容置空間11被該錫液92所淹蓋， 而讓該銅線91附著該錫液92，同時藉由該第一加熱模組 40的加熱與第一測溫模組41的測溫來控制溫度以維持流 動性，再讓該銅線91穿過該成型孔21去除多餘的錫液92 ，再藉該第二加熱模組5 0與第二測溫模組51的加熱與測 溫來控溫，維持可塑性並讓該銅線91穿過該定型孔31加 以定型成所需尺寸，接著即讓銅線91進入冷卻管路60， 該冷卻管路60由該入口 621與該出口 622循環導入與排出 一冷卻水6 3，而快速降低銅線91的溫度。 [0015] 如上所述，即可以完成該銅線91的鍍錫作業，據此 099127605 表單編號A0101 第6頁/共17頁 0992048534-0 201209223 ' 形成一水平配置的鍍錫裝置，由於銅線91為水平拉線， 因此沒有錫液92高空滴落的危險，且重力與銅線91移動 的影響不會產生加乘效應而可容易形成厚的錫鍍層，並 銅線91的移動速度可加快，而增加產能，其可滿足使用 上的需求。 [0016] 綜上所述僅為本發明的較佳實施例而已，並非用來 限定本發明之實施範圍，即凡依本發明申請專利範圍之 内容所為的等效變化與修飾，皆應為本發明之技術範疇 ❹ 。 【圖式簡單說明】 [0017] 圖1，係本發明平面配置圖。 [0018] 圖2，係本發明浸錫盒俯視結構圖。 [0019] 圖3，係本發明成形模具裝設圖。 [0020] 圖4，係本發明浸錫盒浸入錫爐結構圖。 [0021] 圖5，係本發明冷卻管結構圖。 〇 [0022] 圖6，係本發明使用示意圖。 【主要元件符號說明】 [0023] 10 :浸錫盒 [0024] 11 :容置空間 [0025] 111 :長槽 [0026] 1 2 :第一穿孔 [0027] 13 :第二穿孔 099127605 表單編號A0101 第7頁/共17頁 0992048534-0 201209223 [0028] [0029] [0030] [0031] [0032] [0033] [0034] [0035] [0036] [0037] [0038] [0039] [0040] [0041] [0042] [0043] [0044] [0045] [0046] 1 4 :止漏環 15 :側腔室 1 51 :開口 16 :液體導流裝置 20 :第一模具 21 :成型孔 30 :第二模具 31 :定型孔 40 :第一加熱模組 41 :第一測溫模組 50 :第二加熱模組 51 :第二測溫模組 60 :冷卻管路 61 :冷卻通道 62 :冷卻水通道 621 :入口 622 :出 口 63 :冷卻水 70 :驅動桿 099127605 表單編號Α0101 第8頁/共17頁 0992048534-0 201209223 > [0047] [0048] [0049] [0050] [0051] [0052] [0053] Ο 71 :馬達 80 :定位座 81 :滑槽 82 :擋板 90 :錫爐 91 :銅線 9 2 .錫液 ο 099127605 表單編號Α0101 第9頁/共17頁 0992048534-0d !;· '8 !!1 ^ W 甘\ 1'::丨rJ*' f This kind of conventional tin-plated enamel is set in the vertical direction and is affected by the multiplication of the inertial force of gravity and copper wire movement. The amount of the copper wire attached to the tin liquid is rather limited. In other words, the thickness of the copper wire which can be plated with tin is quite limited 'generally only between 10 micrometers and 15 micrometers. Moreover, the influence of the low inertia force is limited, so the production speed of the copper wire is limited, so the production speed is slow, and it is difficult to meet the capacity of the demand. If the cooling effect is insufficient or damaged, the _ = ' pipe may drip, and The kicking liquid is dropped by the high-altitude ten-attached tin liquid, and sometimes it will produce (four) Lin and cause danger. The tin furnace or cooling water tank form number A0101 〇992〇48534-〇201209223 [Abstract] [0005] The main purpose of the present invention is to disclose a horizontally disposed tin plating apparatus for safely and rapidly plating tin on a copper wire and satisfying the demand for forming a thick tin plating layer. [0006] The present invention is a tin plating apparatus, comprising a immersion tin box, a first mold, a second mold, a first heating module and a second heating module, wherein the immersion tin box has an accommodation a space, and a first through hole and a second hole are formed on the two sides of the accommodating space, and the first die is disposed in the accommodating space and has a forming hole, and the forming hole is aligned and located a second perforated side, the second mold has a certain type of hole, the setting hole is aligned and located on the other side of the second perforation, and the first heating module is disposed under the first mold, and the The second heating module is disposed below the second mold. According to the present invention, the tin space can be filled in the accommodating space, and the horizontal wire of the copper wire can be covered by the tin liquid into the accommodating space, and the copper wire is attached to the tin. Liquid, while maintaining fluidity by heating of the first heating module to remove excess tin liquid by using the forming hole, and maintaining the plasticity by heating of the second heating module, and shaping the desired size by the shaping hole That is, the tin plating operation of the copper wire can be completed, thereby forming a horizontally arranged tin plating device, which has no danger of tin droplets falling, and is easy to form a thick tin plating layer, and can quickly form a tin plating layer, which satisfies the use. Demand. [Embodiment] [0008] In order to make the members of the present invention more fully understand and agree with the features, objects and effects of the present invention, the preferred embodiment will be described with reference to the drawings. 099127605 Form No. A0101 Page 4 of 17 0992048534-0 201209223 As follows: [0009] Please refer to FIG. 1 , which is a possible embodiment of the present invention, which comprises a dip box 10 , a first mold 20 , a second mold 30 , A first heating module 40, a second heating module 50 and a plurality of cooling pipes 60 ° [0010] ❹ please refer to "FIG. 2" and "FIG. 3", wherein the immersion tin box 10 has a The accommodating space 11 has a first through hole 12 and a second through hole 13 on both sides of the accommodating space 11 , and the first through hole 12 is provided with a leak stop ring 14 , and the first die 20 is mounted on the first die 20 . The accommodating space 11 has a molding hole 21, and the molding hole 21 is aligned and located on one side of the second through hole 13. The second mold 30 has a certain type of hole 31, and the sizing hole 31 is aligned. The two sides of the second through hole 13 are respectively disposed on the other side of the second through hole 13 , and a positioning seat 80 is disposed on each side of the second through hole 13 . Two positioning seat 80 has a sliding groove 81, 20 of the first die and the second die 30 is divided into two in the chute 81, and screwed to the division, by positioning a baffle holder 8280 fixed to the caliper. [0011] In addition, the accommodating space 11 forms an elongated long slot 111 near the second through hole 13. The first heating module 40 is disposed at the bottom of the long slot 111 and extends into the first die 20 The second heating module 50 is disposed below the second mold 30. The first temperature measuring module 41 is disposed adjacent to the first heating module 40, and the second temperature measuring module 51 is further disposed. Adjacent to the second heating module 50. Please refer to FIG. 4 again. The immersion tin box 10 of the present invention can be placed in a tin furnace 90 in groups of two, and the accommodating space 11 is connected with 099127605. Form No. A0101 Page 5 / Total 17 page 0992048534-0 [0012] 201209223 A side chamber 15 is provided with an opening 1 51 and a liquid guiding device 16 which communicates with the tin furnace 90 and the liquid is diverted The flow guiding direction of the device 16 is from the opening 151 toward the accommodating space 11, and the liquid guiding device 16 can be a propeller, and the liquid guiding device 16 can be coupled to a driving rod 70, and the driving rod 70 is subjected to a driving The motor 71 is driven to rotate. [0013] Referring to FIG. 5 again, the cooling duct 60 of the present invention has a cooling passage 61 located in the inner layer and a cooling water passage 62 located in the outer layer, and the cooling passage 61 is aligned with the shaping hole 31. The cooling water passage 62 has an inlet 621 and an outlet 622. And the cooling line 60 can have a plurality of, and the plurality of cooling passages 61 of the plurality of cooling lines 60 are aligned in series with each other. [0014] Please refer to FIG. 6 again, the present invention can be used for the tin plating operation of a copper wire 91. The tin space 92 is filled in the accommodating space 11, and the tin liquid 92 can be guided by the liquid. The device 16 is guided into the accommodating space 11 by the tin furnace 90, and the copper wire 91 is horizontally drawn from the first through hole 12 through the leakage preventing ring 14 to enter the accommodating space 11 The tin liquid 92 is covered by the tin liquid 92, and the copper wire 91 is attached to the tin liquid 92, and the temperature is controlled by the heating of the first heating module 40 and the temperature measurement of the first temperature measuring module 41 to maintain the flow. Then, the copper wire 91 is passed through the molding hole 21 to remove excess tin liquid 92, and then the second heating module 50 and the second temperature measuring module 51 are heated and measured to control the temperature to maintain plasticity. And the copper wire 91 is shaped into the required size through the shaping hole 31, and then the copper wire 91 is introduced into the cooling pipe 60. The cooling pipe 60 is circulated into and discharged from the inlet 621 and the outlet 622. Water 6 3, while rapidly reducing the temperature of the copper wire 91. [0015] As described above, the tinning operation of the copper wire 91 can be completed, according to which 099127605 Form No. A0101 Page 6 / Total 17 Page 0992048534-0 201209223 'Forms a horizontally arranged tin plating device due to the copper wire 91 In order to pull the wire horizontally, there is no danger of the tin liquid 92 dropping at a high altitude, and the influence of the movement of the gravity and the copper wire 91 does not cause a multiplication effect, and a thick tin plating layer can be easily formed, and the moving speed of the copper wire 91 can be accelerated. And increase production capacity, which can meet the needs of use. The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, that is, the equivalent changes and modifications of the content of the patent application scope of the present invention should be The technical scope of the invention ❹. BRIEF DESCRIPTION OF THE DRAWINGS [0017] FIG. 1 is a plan layout view of the present invention. 2 is a top plan view of the immersion tin box of the present invention. 3 is a view showing a molding die of the present invention. 4 is a structural diagram of the immersion tin box of the present invention immersed in a tin furnace. [0021] FIG. 5 is a structural view of a cooling pipe of the present invention. [0022] FIG. 6 is a schematic view showing the use of the present invention. [Main component symbol description] [0023] 10: immersion tin box [0024] 11 : accommodating space [0025] 111 : long groove [0026] 1 2 : first perforation [0027] 13 : second perforation 099127605 Form No. A0101 [0040] [0040] [0040] [0040] [0040] [0040] [0040] [0040] [0046] [0046] [0046] 1 4: leak stop ring 15: side chamber 1 51: opening 16: liquid flow guiding device 20: first mold 21: forming hole 30: Second mold 31: shaping hole 40: first heating module 41: first temperature measuring module 50: second heating module 51: second temperature measuring module 60: cooling line 61: cooling channel 62: cooling water Channel 621: inlet 622: outlet 63: cooling water 70: drive rod 099127605 Form No. 1010101 Page 8 of 17 0992048534-0 201209223 > [0047] [0049] [0052] [0052] 005 71 : Motor 80 : Positioning seat 81 : Chute 82 : Baffle 90 : Tin furnace 91 : Copper wire 9 2 . Tin liquid ο 099127605 Form number Α 0101 Page 9 / Total 17 pages 0992048534-0