201208998 六、發明說明： 【發明所屬之技術領域】 有關沿著在:J及割斷方法，詳言之，係 劃線（scribe line)的脆性材^之割dggg:割刀而形成 【先前技術】 以往，已知有如下之割斷 等的母玻璃，或液晶顯示器製程中的製造液晶顯示器 必要的切割預定線而進行脆性材料’沿著在其表面設定之 就此種脆性材料的割斷装置 切入到脆性材料之表面而形納 2知有如下裝置：其具備 刀的移動機構，係由上述移二、與用J移動該切割 該劃線擴展，來之後，使裂縫從 又，割斷裝置已知還有如下之穿 大致圓盤狀的劃線刀輪之外周上 作為上述切割刀之 ^刀輪沿著切割預定線進行旋轉，二面’，由使該劃 擊，一面形成上述劃線（專利文獻2)。 上述犬起細加打點衝 日本特開平4_224128號公報 【專利文獻2】日本特許第刺⑷號公報 【發明内容】 (發明所欲解決之課題） 的=裝⑽ 時，會ΐ=ί:=:二著4?碎?“ 的問題。 月座生微小碎片（碎屑） 4 201208998 又，如上述專利文獻丨般 =料的表面上紅柯_，形成崎時，在脆 強度下降，為其問題。 厅刀。彳之脆性材料的抗彎 從^嶋展的裂縫加深專^車=夕=雖然由於能使得 但是由於上駿起的打‘_擊，而產_ ^糊脆性材料， 裂紋，並產生大量碎屑， 為其問題。*軸文獻1更大的水平 J鑑於此種問題，本發明提供脆 ί ’其能使得從劃線擴展的裂缝加深，而置及割斷方 屑的產生。 了以抑制水平裂紋及碎 (解決課題之手段） 亦即依明求項1之脆性材料的割 在脆性材料之表面上形成劃線；及切割有：切割刀， =割刀進行相對移動；且上述_刀_=:2脆性材料 脆面所設定的切割預㈣移動，而3 成複數凹坑le)的凹坑形成機構表面上形 構使^^著縣有以凹⑽蝴歡軸彳動機 依明求項2之脆性材料的割斷裝置 ^動。 所載之脆性材料_置中，上相坑形求項1 ί行;，，將，盪機構所振盈的 射光的聚光位ί移》置:機構所聚光之雷 而形位置來絲上述紐材·面的一部分 上設i切Γίΐϊ3之脆性材料的割斷方法，在脆性材料的表面 形成劃線·，其特徵為：沿著上述切割預定線在脆 數之凹坑的切凹坑，然後令切割刀沿著形成有該複 201208998 所載的之方法’其特徵為:在請求項3 :位置的訪縣絲上魏 依請求項5涉之脆性材料 所载之脆性材料的割斷方法。法、、特徵為：在請求項4 ί_面進行移動’而沿著上述。預一定 (發明之效果） 隔形成凹坑先沿著切割預定線以既定間 =刀_^=== 生’乞磐抑制水平裂紋的產 因此射絲職凹坑， 隔形 縫加深。 。 ' s，於是能:得；劃線擴展的裂 生’而能ii二:::二:：強j抑制水平裂紋的產 因此射光來形成凹坑， 【實施方式】 6 201208998 (實施發明之最佳形態） . ，下說_示之實闕，其中，圖1係顯示切觀性材斜 Ιΐΐΐ進行切割之脆性材料1的俯視圖。 a、廣来ΐ材料1 ’係由tft(薄膜電晶體)基板盘彩 色肩先片基板枯δ在-起而成的液晶單元，切割成：佥: la’使用作液晶晝面；端子部lb，面邛 lb之上方接鄰。 卜万制驗置、及與端子部 於上^割斷裝置2中，在上沭蚩而都， ic的分界部分設物_線Sp Γ並、ς ^二預^及餘= 劃線S來娜削分之後，虹述端子部 光片基板，而露出上述TFT基板。 调離上逑衫色慮 而且，在上述脆性材料丨中之上述晝面 =lc各自的_隅分別設有定位標記丨^子。y= X 1 又作為上述脆性材料丨，此外還有 基板、Si基板等，依本實施例之割斷方法，曰的^^基板Θ、SiC 0.1〜4mm左右的脆性材料1。 、 、s刀。'J厚度為 上述割斷裝置2具備：加工台3， 頭4，用來在脆性材料丨形成劃線s / =斗1 ;加工 動機構及聚絲歸動_，f切割刀移 圖示左右方向的X方向上移動;及第加工頭4在 整上述加工頭4的定位；而且此等機 、7 ’用來調 在上述加工纟3 來控制。 吸附孔與未圖示的真空源及壓縮空氣源接。^的=孔’該 吸附孔產生負壓來吸附固持脆性材料丨，^^且，错由使上述 氣，以在劃線S的位置上切割脆性^料，且從吸附孔喷射壓縮空 又，加工台3係藉由γ向驅動機構％ 、、 方向上進退機’並域_罐軸構3b t ^深方向的Y 中心來旋轉，而能夠改變所載置之脆性 J方向的Z軸為 201208998 ㈣4包括:殼體U ’藉由上述移動機構5進行移動. 凹士几形成。Ρ 12，設在該殼體U的内部，並且在脆 ;及劃線形成部13 ’在上i4脆性材料1的表面3 上述移動機構5由沿著X方向架設在加工台3 、與用來驅動該滾珠螺桿5a的馬達5b所構成，33 珠螺柃5a的旋轉，而令上述殼體u在又 9滾 當形成劃線s時，上述凹坑形成部12位於 劃線形成部13更前方。 社A方向上較上述201208998 VI. Description of the invention: [Technical field to which the invention pertains] Related to: J and the cutting method, in detail, a scribe line of a brittle material, a dggg: a cutter is formed [prior art] Conventionally, it has been known that a mother glass such as a cut or the like, or a cutting line required for manufacturing a liquid crystal display in a liquid crystal display process, is used to cut a brittle material into a brittle material along a cutting device of such a brittle material set on a surface thereof. The surface and the shape 2 are known as a device having a moving mechanism of a knife, which is moved by the above-mentioned shifting, and is moved by the cutting of the scribe line by J, and then the crack is known, and the cutting device is also known as follows. In the outer circumference of the scribing cutter wheel which is substantially disk-shaped, the cutter wheel as the cutter is rotated along the line to be cut, and the two sides are formed by the stroke (Patent Document 2). . In the case of the device (10), the Japanese version of the Japanese Patent Publication No. 4-224128 (Patent Document 2) Japanese Patent No. 4 (No. 4), the content of the invention (the problem to be solved by the invention) is ΐ=ί:=: Second, the problem of "breaking?". The tiny pieces of debris in the moon (debris) 4 201208998 In addition, as in the above-mentioned patent document, the surface of the material is red ke, and when the formation of the smear, the brittle strength decreases, which is a problem.厅 刀 彳 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆 脆A large amount of debris is generated, which is a problem. * Axis Document 1 is a larger level. In view of such a problem, the present invention provides a crispy one which can deepen the crack extending from the scribe line and set the cut swarf. In order to suppress horizontal cracks and crushing (the means to solve the problem), that is, the cutting of the brittle material according to the item 1 is formed on the surface of the brittle material; and the cutting is: a cutting knife, = a relative movement of the cutter; _刀_=: 2 brittle material brittle surface set cutting pre (four) The surface of the pit forming mechanism of the moving, and 3 into a plurality of pits) is configured such that the county has a cutting device that uses a concave material of the concave (10). Brittle material _ centering, upper phase pit shape 1 ί 行;,, , 机构 机构 所 的 的 的 》 》 》 : : : : : : : 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构· A part of the surface is provided with a cutting method of brittle material of i cut Γ ΐϊ 3, forming a scribe line on the surface of the brittle material, which is characterized by: a crater along the cutting line in the number of pits of the brittle number, and then cutting The knives along the method of forming the method of 2012-0898 are characterized by the method of cutting off the brittle material contained in the brittle material referred to in claim 5 in the request of the county. The feature is: moving on the request item 4 ί_' and along the above. Pre-determination (effect of the invention) forming the pit first along the cutting line with a predetermined interval = knife _^ === The production of horizontal cracks is therefore a ray ditch, and the gap is deepened. ' s, then can: get; The splitting of the exhibition can be ii 2:::2:: strong j suppresses the production of horizontal cracks and thus illuminates to form pits, [Embodiment] 6 201208998 (Best form for implementing the invention). In fact, Fig. 1 is a plan view showing the brittle material 1 for cutting the oblique material. A. Guanglai ΐ material 1 ' is made of tft (thin film transistor) substrate plate colored shoulder first substrate δ at - The liquid crystal cell is cut into: 佥: la' is used as a liquid crystal surface; the terminal portion lb is adjacent to the upper side of the surface 邛 lb. The Bu Wan system is inspected, and the terminal portion is in the upper cutting device 2, In the upper part, the boundary portion of the ic is provided with the object _ line Sp Γ ς, ς ^ two pre- and the remaining = scribe line S to be cut, and the terminal portion of the light-film substrate is illuminated to expose the TFT substrate. The 逑 色 子 而且 而且 而且 而且 而且 而且 而且 而且 而且 而且 而且 而且 而且 而且 而且 而且 而且 而且 而且 而且 而且 而且 而且 而且 而且 而且 而且 而且 而且 而且 而且y = X 1 Further, as the brittle material 丨, there are also a substrate, a Si substrate, and the like, and according to the cutting method of the present embodiment, the substrate 1 and the SiC have a brittle material 1 of about 0.1 to 4 mm. , s knife. 'J thickness is the above-mentioned cutting device 2: a processing table 3, a head 4 for forming a scribe line s / = hopper 1 in a brittle material ;; a machining mechanism and a concentrating yarn _, f cutting knife shifting the left and right directions Moving in the X direction; and the positioning of the processing head 4 in the entire processing head 4; and these machines, 7' are used to adjust the processing 纟3 to control. The adsorption holes are connected to a vacuum source and a compressed air source (not shown). ^的孔' the adsorption hole generates a negative pressure to adsorb and hold the brittle material, and the gas is cut to make the brittle material at the position of the scribe line S, and the compressed space is ejected from the adsorption hole. The processing table 3 is rotated by the γ to the drive mechanism %, the direction advance and retreat 'the parallel field _ the can axis structure 3b t ^ depth Y center, and the Z axis of the brittleness J direction can be changed to 201208998 (4) 4 includes: the housing U' is moved by the moving mechanism 5 described above. Ρ 12, disposed inside the casing U, and brittle; and the scribe forming portion 13' on the surface 3 of the upper i4 brittle material 1. The moving mechanism 5 is erected on the processing table 3 along the X direction, and is used The motor 5b that drives the ball screw 5a is configured to rotate the bead screw 5a, and when the casing u is rolled again to form the scribe line s, the pit forming portion 12 is located further in front of the scribe line forming portion 13. . In the direction of the agency A, the above
換言之，上述凹坑形成部12沿著切 之後，上述劃線形成部13 一面通過凹坑D，—面形成^線1D 射光ί逑Zf"2包括:未圖示的雷射振盪器，用來缝雷 射TbL，&先機構14，將雷射光[進行 f田 導光的雷射光L進行聚光；及焦點調整機構Λ來^上= 射光L的焦點位置。 顺w肖木5周整上逑雷 發與=工台3接鄰的位置，作為激In other words, after the pit forming portion 12 is cut along, the scribing forming portion 13 passes through the pit D, and the surface is formed by the line 1D. The laser includes a laser oscillator (not shown). The slitting laser TbL, & first mechanism 14, condenses the laser light [the laser light L that conducts light in the field; and the focus adjustment mechanism Λ comes up = the focus position of the light beam L. Shun w Xiaomu 5 weeks on the whole thunder and thunder and = work station 3 next to the position, as a radical
，並且___來進行Q 上述導光機構14包括：光導纖維21，將 照射的雷射光L導光到加 盗所 。所射_射光以換成平行光;=== 照射的雷射光L朝向驗材料丨而向下方|^。使仔水千方向 射弁對於勤上鱗直透鏡22進行平行化的雷 面進行《 ^可^防止其由於球面像差導致絲直徑變大，-面進灯聚光，亦即作為消色差透鏡。 鏡23^ 纖維21之射出側的端部、準直透鏡22、分色 -體地固i 構成上述焦點調整機構16的框架24所 上述焦點調整機構16包括··上 定於該轉24上；3 _細分魏26紅1^可^ 8 201208998 =方式保持在上述殼體11内；及升降機構27，構成聚光位置移動 機構，用來使上述框架24在Z方向上升降。 上述第3相機25係拍攝凹坑D’該凹坑D由經過上述分色鏡 23而被上述聚光透鏡15聚光到脆性材料丨上的雷射光l所形成。 上述3個調整用分釐頭26可分別使上述框架24在X、γ、z 各方向上精密地移動，並能夠使上述聚光透鏡15所聚光之 L的照射位置吻合於切割預定線Sp上。 又1上述升降機構27可藉由使上述框架24在z方向上 ^對於被上述聚光透鏡15聚光在脆性材料丨之表面上的雷 l 之光點直徑進行調整。 亦即，用來移動藉由上述聚光透鏡15聚光的雷射 ^的聚光位置移動機構係由如下之機構構成：上述移動機構5先 使加工頊4(包含該聚光透鏡15在内)在χ方向上 降機構27，絲調整雷射光L的絲直徑。移動，及上述升And ___ to perform Q. The light guiding mechanism 14 includes an optical fiber 21 that guides the irradiated laser light L to the pirate. The emitted light is replaced by parallel light; === The irradiated laser light L is directed downward toward the material |. The water surface of the water is swayed for the parallelizing of the straight lens 22 to prevent the wire diameter from becoming larger due to the spherical aberration, and the surface is concentrated, that is, as an achromatic lens. . The lens 23 is disposed on the exit side of the fiber 21, the collimating lens 22, and the color separation-body fixing frame. The focus adjustment mechanism 16 of the focus adjustment mechanism 16 includes the above-mentioned focus adjustment mechanism 16; 3 _ subdivision Wei 26 red 1 ^ can be 8 201208998 = mode is held in the housing 11; and the lifting mechanism 27 constitutes a concentrating position moving mechanism for raising and lowering the frame 24 in the Z direction. The third camera 25 is a shooting pit D'. The pit D is formed by the laser light 1 that has passed through the dichroic mirror 23 and is collected by the collecting lens 15 onto the brittle material. The three adjustment slits 26 can precisely move the frame 24 in the respective directions of X, γ, and z, and can match the irradiation position of the light collected by the collecting lens 15 to the cutting planned line Sp. on. Further, the elevating mechanism 27 can adjust the diameter of the spot of the beam 1 on the surface of the brittle material 被 by the condensing lens 15 in the z direction. That is, the concentrating position shifting mechanism for moving the laser condensed by the condensing lens 15 is constituted by a mechanism in which the moving mechanism 5 first processes the cymbal 4 (including the condensing lens 15) The mechanism 27 is lowered in the χ direction to adjust the wire diameter of the laser light L. Mobile, and above
32 劃線形成部13包括：大致圓盤狀的切割刀31 ;固持構件 =’將_割刀31以可旋轉方式固持；氣壓紅％，將H 固持構件32 —齊向下方推壓；負载檢測元件34，用1測旦 ===的負載;及升降機㈣^ 面呈成有剖 ^上鶴時，該域刀3卜面切人_^^=而在X 在X方向上旋轉，而在脆性材料i之表面上 一面 亦即，切割刀具有與專利文獻！ 屬S。 的形狀，為财的公知技術。 。識之⑽!7?大致相同 上述固持構件32以可使上述切割刀31婊 方式固持該切割刀31，且當加工頭4在X方二卜軸為中心旋轉的 調整上述切割刀31之方向的自定位。 σ .私動時，進行可 上述氣壓缸33始終將切割刀31向下方推茂 刀31藉由該氣_知33而切入到脆性材料 J丄士當上述切割 '-、 叼衣面時，以上述負 9 201208998 载檢測元件34來測量該負載。 割刀t 構35包括：框架故，—體地固持上述切 35b，設在Z方^ 負，測元件34 ;滾珠螺桿 且隨著滚—馬達用來令該滾珠螺桿视旋轉，· 進螺杯35b的旋轉，切割刀31會連同上述框架说一齊 述加機6、^以沿χ方向排列的方式配置在與上 上私叙pin主，且分別藉由移動機構6a、7a而在X方向 向3向=量示之Y方向移動機構及_動機構，而 Π Ϊ万⑽里移動，並以視野中央為中心來進行旋轉。 游辞又、第2械6、7的視野巾央設定有十字形的+字 :T w在該視野内拍攝上述劃線s或 :整上便依據該十娜，來進二== °周整或者識別脆性材料的位置。 的方明具有上述構成之割斷裝置2來切割脆性材料1 g方法又’在下面說明中，說明切割單層之跪性材料ι時的順 —最初，由於上述加工頭4中的切割刀31存在製造誤荽，阳μ_ 母次更換切割刀31時進行定位調整。 、 德ίΐ在Λ述加工頭4的齡形成部13上安裂新的切割刀31 4在几，部12照射雷射光L的情況下，使加工頭 ΐ.ί ΐΐ 要之測試件的表面上形成臨時劃線。 μ後，藉由排列在X方向上的第！、第2相機6、7 力:工頭4内的第3相機25 ’來拍攝上述臨賴線 構8令上述第i、《 2相機6、7移動，以使設定在 範圍中央針字游標位於上述臨軸線上，並财 果’來調整在上述加工頭4中之凹坑形成部12的焦點調 接著，當在上述加工台3上設置新的脆性材料丨時，從加工 台3之頂面所形成的吸附孔供給負壓，而將脆性材料丨吸附固持 201208998 在加工台3的頂面。 當如此設置脆性材料i時， 冲 於上述脆性材料i上之必 g d'弟2相機6、7拍攝設 =二r、7之拍“：字而== 的:f向=====8f】上述加工台3 設置i加工^ 向χ方向的狀態下將脆性材料1 移動，而形成上賴力=，X方向上 上設定朝向X方向的切割預由上逑動作，在脆性材料1 1二方面，當上述脆性材料丨設置 13 ^ 性材料i之端部更靠圖示多動機構5而處於退避到比脆 及上述升降機構％而位於 令加工頭4 ’ Γ此讎態下，#上述移動機構5 缸33之推壓力而^ 、刀口在坻抗軋壓 在脆性材料r中的切=進行測量，來判斷上述切割刀31 料二不中的切入量，依切割的脆性材 先登記在上述控賴ί^_5爾之切_31的高度係事 s的ΐί，if Γ (a)、4⑻所示之放大圖’來說明形朗線 S的順序。當上述移動機構5使加^ 4在χ方向飾時幻線 201208998 綠，被上輕光魏15綠，而照射 在脆除脆性材料1的表面，而 凹坑D。 上形成直仨為20〜5〇μιη、深度為5〜ΙΟμιη的 預定^田的^上^著2^^42動而照射’並沿著上述切割 通過St者預定線卸形成凹坑D後，切割刀31便 驗面在脆性材料1上形成劃線s，而使裂缝從劃線s 著凹^由於被上述議"33向下方推壓，因此沿 往脆性材m的表面侧3切割刀31抵抗嫌33的推壓力而32 The scribe line forming portion 13 includes: a substantially disk-shaped dicing blade 31; a holding member = 'the _ cutter 31 is rotatably held; the air pressure is red %, and the H holding member 32 is pushed downward; Element 34, with a load of 1 denier ===; and when the lift (4) ^ surface is formed with a cross-section crane, the domain knife 3 faces the person _^^= and X rotates in the X direction, and One side of the surface of the brittle material i, that is, the cutting blade has a patent document! Is S. The shape is known for the wealth of technology. . It is known that the holding member 32 is substantially the same as the holding cutter 32 so that the cutting blade 31 can hold the cutting blade 31, and the processing head 4 rotates in the direction of the cutting blade 31 while rotating around the X-axis. Self-positioning. σ. In the case of the private movement, the pneumatic cylinder 33 can always push the cutter 31 downward to push the knife 31, and the gas material 33 is cut into the brittle material J. When the cutting is performed, the The above negative 9 201208998 carries the detecting element 34 to measure the load. The cutter t structure 35 includes: a frame, for example, holding the above-mentioned cutting 35b, and is disposed at the Z square and negative, measuring element 34; the ball screw and the roller-motor is used to rotate the ball screw, and the screw cup In the rotation of 35b, the cutter 31 will be arranged in the direction of the χ in the χ direction, together with the above-mentioned frame, and arranged in the upper direction, and in the X direction by the moving mechanism 6a, 7a, respectively. In the direction of the Y direction, the movement mechanism and the _ moving mechanism are moved, and the movement is performed in the ( Ϊ (10), and the rotation is performed centering on the center of the field of view. The vocabulary and the second machine 6 and 7 have a cross-shaped + word: T w shoots the scribe s in the field of view or: according to the ten, the second == ° week Or identify the location of the brittle material. The method of cutting the brittle material 1g having the above-described cutting device 2 is further described in the following description, and the scission of the singular material ι of the single layer is explained. First, since the cutting blade 31 in the processing head 4 is present Manufacturing error, Yang μ_ The positioning adjustment is performed when the cutting blade 31 is replaced. De ΐ 安 ΐ ΐ ΐ 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 新 新 新 新 新 新 新 新 新 新 新 新 新 新 新 新 新 新 新 新 新 新 新 新 新 新 新 新 新 新 新 新 新 新 新Form a temporary line. After μ, by arranging the number in the X direction! The second camera 6, 7 force: the third camera 25' in the foreman 4 takes the above-mentioned rigging line 8 to make the above-mentioned i, "2 cameras 6, 7 move so that the center of the needle cursor is set in the range On the axis, and the result of the adjustment, the focus of the pit forming portion 12 in the processing head 4 is adjusted, and when a new brittle material 丨 is placed on the processing table 3, from the top surface of the processing table 3 The formed adsorption holes are supplied with a negative pressure, and the brittle material is adsorbed and held at the top surface of the processing table 3 at 201208998. When the brittle material i is set in this way, it must be rushed to the above-mentioned brittle material i. The camera 2, 6 and 7 are set to shoot = two r, 7 beats: "word and ==: f direction ===== 8f] The processing table 3 is arranged to move the brittle material 1 in the direction of the 加工 direction, and the upper material is formed, and the cutting direction in the X direction is set by the upper squeezing action, and the brittle material 1 1 On the other hand, when the brittle material 丨 is provided with the end portion of the 13 ^ material i, the multi-moving mechanism 5 is further retracted to the brittleness and the above-mentioned lifting mechanism %, and the processing head 4 ′ is in this state, # The pushing force of the moving mechanism 5 cylinder 33 and the cutting edge of the cutting edge are measured in the brittle material r to determine the cutting amount of the cutting blade 31, and the cutting material is first registered according to the cutting brittle material. In the above-mentioned height _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ 4 When the χ direction is decorated, the phantom line 201208998 is green, and it is lightly glazed by Wei 15 green, and is irradiated on the surface of the brittle removal brittle material 1, while the pit D. The straight cymbal is 20~5〇μιη, and the depth is 5~ΙΟμιη. The upper part of the ^^^^2^^42 is irradiated and the dimple D is formed after the cutting is performed by the predetermined line of the St. 31, the face is formed on the brittle material 1 to form the scribe line s, and the crack is recessed from the scribe line s. Since it is pushed downward by the above-mentioned discussion "33, the cutting blade 31 is resisted along the surface side 3 of the brittle material m. Suspected the pressure of 33
sP D ^r,j! , , ^ 到脆6魏（Nu)會擴展 確認又由t本f明f割崎置2所形成的劃線s，也能約 材料1的矣31切入脆性材料1時的衝擊較小，因此在脆性 '而且，各上各乎不會產生因該衝擊所形成的水平裂紋。 在脆性姑粗加工頭4移動到脆性材料1之圖示右端部而已 31退避到劃線S時’上述升降麵35令切割刀 移動2示左端部的H而上述移動機構5令加玉頭4再次 不至於二2 止對上述吸附孔供給負壓，而以脆性材料1 劃線s形成Ί度來供給上述壓縮空氣。由於在脆性材料1上從 ' v 較深的裂縫，因此只要供給該壓縮空氣，即可分離 12 201208998 腺性材料1 ο 其結果’在進行分離時，在 _ ’ _上所述，在脆性·^會產 因此在脆性材料的表面上也幾乎不ΐίΓί屑會產生水平裂蚊， 而刀?形成凹-， 較深處移動。 會在、過凹^ D _向於綱凹坑D的 X方ίΪΐϊ ’由於切割刀31傾向於按照沿著切割預定線Sp之 D的直坑D移動’因此可將切割刀Μ的搖晃抑制在凹坑 之抗=度針實驗酬之騎方法所切脆性材料！ 狀的據上财摘蝴峨性娜1放置在兩根橫樑 ^於該狀態下，從上方對於兩個支持構件』 二载以使脆性材料的底面產生張力，並測量出 脆性材枓被折幫時的負載，而作為抗彎Μ。 ® 少並」分Π 先泳面之抗幫強度❸9〇%左右。換言 Ϊ係純例之割斷方法所切割的脆性材料1之抗彎強度 切宝ijims係在於：由於藉由依上述實施例之割斷方法來 紋口’ ^卜郎二日Γ、:、在脆性材料1絲面上幾乎不會產生水平裂 平裂紋供i更張力作用於劃線面的情形，裂縫也不會從水 較“度。财赶水平狀之絲面姻程度的 =對於此種依本發明之I倚方法，個柯誠凹坑d且外周 凸之專利文獻1所载的切割刀來形成劃線S時，上述裂 缝只擴展到脆性材料之板厚的約5〇%左右。 13 201208998 於此情況’另外需要用來切割跪性材料 f時有碎雜脆性材料的表面及背面飛散，.因此ΙίΐΐΓ切 的脆性材料1，或者該碎屑的去除較麻煩等，為其問題^刀割 ^’由於形成劃線時在跪性材料的表 因此存在劃線面之抗彎強度變低的問題。 域水千裂紋， 其次，依補文獻2之崎方法，亦即藉 =切割刀來形成劃線S的方法，可使鶴擴展^脆卜 板厚的，80%左右，而能夠輕易地切割脆性材料i。 ”、之 但是，在脆性材料的表面上會形雜上述 更大的水平裂紋’而存在脆性材料i之抗 ^ ^況 題。此可認為係由於：當上述切割刀31 進^^的問 脆性材料1時，因教品+卩m 成的犬起切入 Π ! Λΐ衝擊而在脆性材料1形成上述水平裂紋。 而且，以上述犬起進行打點衝擊的結果，脆性材 ^㈣===狀： 可使用刖h形成四角錘狀之所謂的點劃線器。 而且，本實施例中，在上述加工頭4内—體 部12與劃線形成部13，但也可將其等設在不同的加^ :八 別藉由各自的移動機構來進行移動。 刀 .，由形成此種構成，若能在例如不具備凹坑形 文獻1結構的割斷裂置上設置上述凹坑形成部12 發明之割斷方法來進行脆性材料的切割。 义 【圖式簡單說明】 圖1係依本實施例之割斷裝置的側視圖。 圖2係脆性材料的俯視圖。 圖3係加工頭的放大剖面圖。 圖勢4(b)係割斷方法的說明圖，4(a)為側視圖，懒為俯視 14 201208998 _ 圖。 【主要元件符號說明】 1〜脆性材料 la〜晝面部 lb〜端子部 lc〜餘材部 Id〜定位標記 2〜割斷裝置 3〜加工台 3a〜Y方向驅動機構 3b〜軸驅動機構 4〜加工頭 5〜移動機構 5a〜滾珠螺桿 5b〜馬達 6〜第1相機 7〜第2相機 6a、7a〜移動機構 8〜控制機揭： 11〜殼體 12〜凹坑形成部 13〜劃線形成部 14〜導光機構 15〜聚光透鏡 16〜焦點調整機構 21〜光導纖維 22〜準直透鏡 23〜分色鏡 24〜框架. 201208998 25〜第3相機 26〜調整用分釐頭 27〜升降機構 31〜切割刀 31a〜齒部 32〜固持構件 33〜氣壓缸 34〜負載檢測元件 35〜升降機構 35a〜框架 35b〜滾珠螺桿 35c〜馬達 D〜凹坑 L〜雷射光 S〜劃線 Sp〜切割預定線 16sP D ^r,j! , , ^ to the brittle 6 Wei (Nu) will be extended to confirm the scribe line s formed by the t-f, f, and saki, and can also be cut into the brittle material 1 The impact at the time is small, so the brittleness is also 'and each of the horizontal cracks formed by the impact does not occur. When the brittle abbreviated processing head 4 moves to the right end portion of the brittle material 1 and has been retracted to the scribing line S, the lifting surface 35 causes the cutting blade to move 2 to indicate the H at the left end portion, and the moving mechanism 5 causes the jade head 4 to be added. Again, the negative pressure is not supplied to the adsorption holes, and the compressed air is supplied by forming the enthalpy of the brittle material 1 s. Since the crack is deeper from the 'v on the brittle material 1, as long as the compressed air is supplied, the 12 201208998 gland material 1 can be separated. The result 'when the separation is performed, as described in _ ' _, in the brittleness ^ The production will therefore produce almost no ΐ Γ Γ 会 会 会 会 会 会 会 会 会 会 会 会 会 会 会 会 会 会 会 会 会 会 会 会 会 会 会 会 会 会 会X, 过 向 向 向 向 向 向 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于The resistance of the pit = the degree of the needle experiment, the method of riding, the brittle material! According to the above-mentioned financial picking, the scorpion is placed on two beams. In this state, the two supporting members are loaded from above to create tension on the bottom surface of the brittle material, and the brittle material is measured and folded. The load is when it is resistant to bending. ® Less and "Divided" The anti-help strength of the first swimming surface is about 9〇%. In other words, the bending strength of the brittle material 1 cut by the cutting method of the pure example is based on the cutting method of the above embodiment by the cutting method of the '''''''''' There is almost no horizontal flat crack on the surface of the silk for the tension to act on the surface of the scribing surface. The crack will not be more than the degree of water. In the case where the scribe line S is formed by the dicing blade contained in Patent Document 1 of the Kecheng pit d and the outer periphery is convex, the crack extends only to about 5% of the thickness of the brittle material. 13 201208998 In this case, the surface and the back surface of the crumbly brittle material are scattered when the material f is cut. Therefore, the brittle material 1 or the removal of the debris is troublesome, and the problem is ^ 'Because of the formation of the scribe line, there is a problem that the bending strength of the scribe line becomes low on the surface of the enamel material. The domain water crack, secondly, according to the method of the Kawasaki of the literature 2, that is, the knives are used to form the stroke Line S method, can make the crane expand ^ crispy plate thickness , About 80%, and can be easily cut brittle material i. ", But it, on the surface of the brittle material will form a larger horizontal cracks above heteroaryl 'and the presence of anti-i ^ ^ brittle material condition problem. This is considered to be because when the above-mentioned cutting blade 31 enters the brittle material 1, the horizontal crack is formed in the brittle material 1 due to the impact of the dog + 卩m. Further, as a result of the impact of the above-mentioned dog, the brittle material ^(4) === shape: A so-called dot scriber having a square hammer shape can be formed using 刖h. Further, in the present embodiment, the body portion 12 and the scribe line forming portion 13 are formed in the processing head 4, but they may be provided in different additions: they are moved by the respective moving mechanisms. According to the above configuration, the cutting method of the above-described pit forming portion 12 can be provided to cut the brittle material, for example, by providing a cutting method for the structure of the pit forming portion 12 without the configuration of the pit-shaped document 1. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a side view of a cutting device according to this embodiment. Figure 2 is a top view of a brittle material. Figure 3 is an enlarged cross-sectional view of the processing head. Figure 4 (b) is an explanatory diagram of the cutting method, 4 (a) is a side view, and lazy is a top view 14 201208998 _ Figure. [Description of main component symbols] 1 to brittle material la to face lb to terminal portion lc to remaining material portion Id to positioning mark 2 to cutting device 3 to processing table 3a to Y direction drive mechanism 3b to shaft drive mechanism 4 to processing head 5 to moving mechanism 5a to ball screw 5b to motor 6 to first camera 7 to second camera 6a, 7a to moving mechanism 8 to control machine: 11 to case 12 to pit forming portion 13 to line forming portion 14 - Light guiding mechanism 15 - concentrating lens 16 - focus adjusting mechanism 21 - optical fiber 22 - collimating lens 23 - dichroic mirror 24 - frame. 201208998 25~3rd camera 26~ adjusting centring 27~ lifting mechanism 31 -Cutting blade 31a to tooth portion 32 to holding member 33 to pneumatic cylinder 34 to load detecting element 35 to lifting mechanism 35a to frame 35b to ball screw 35c to motor D to pit L to laser light S to line Sp to cutting schedule Line 16