TW201207561A - Photosensitive composition, cured film obtained from the composition, and display device having the cured film - Google Patents

Photosensitive composition, cured film obtained from the composition, and display device having the cured film Download PDF

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TW201207561A
TW201207561A TW100126616A TW100126616A TW201207561A TW 201207561 A TW201207561 A TW 201207561A TW 100126616 A TW100126616 A TW 100126616A TW 100126616 A TW100126616 A TW 100126616A TW 201207561 A TW201207561 A TW 201207561A
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polymer
photosensitive composition
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radical
formula
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TW100126616A
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TWI470349B (en
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Hisanobu Minamisawa
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Jnc Corp
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/022Quinonediazides
    • G03F7/023Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/26Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/32Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
    • C08F220/325Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals containing glycidyl radical, e.g. glycidyl (meth)acrylate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/022Quinonediazides
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/022Quinonediazides
    • G03F7/0226Quinonediazides characterised by the non-macromolecular additives
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • G03F7/0757Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • G03F7/0757Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G03F7/0758Macromolecular compounds containing Si-O, Si-C or Si-N bonds with silicon- containing groups in the side chains

Abstract

A positive photosensitive composition capable of forming a cured film having excellent liquid repellency and UV ozone ashing resistance is provided. The photosensitive composition includes a polymer (A) containing a siloxane structure and a 1, 2-quinone diazide compound (B). The polymer (A) containing a siloxane structure uses a radical polymer in which the monomers contain a specific siloxane compound and an alkali-soluble radical polymer monomer. The specific siloxane compound has two radical-polymerizable positions. The alkali-soluble radical polymer monomer has ability to make the polymer (A) alkali-soluble and radical polymerizable.

Description

201207561 該Pi壁材可藉由如上所狀㈣級倾聚合物組成 物以及感光性組成物的公知方法而形成為圖案化之膜。於 此種障壁材中,要求不附著自喷墨裝置之喷嘴頭所喷出之 液狀物質的特性、亦即撥墨性(例如參照日本專利特開平 11-281815號公報以及日本專利特開2〇〇4 149699號公 報)。另外,於半導體製造*LCD製造製程等中,進行 臭氧灰化處理步驟以使應塗佈所述液狀物質之開口部的墨 水塗佈性或濕潤性提高。此時,障壁材之表面亦被處理, 因此需求障壁材之撥祕降低,但可耐此種處理,可抑制 表面撥液性之降低的障壁材料。 如上所述,光硬化性聚合物組成物以及感光性組成物 之用途不僅僅是構成所述顯示元件巾之層的材料,亦擴展 至起到顯示元件之製造巾賴祕仙賴,隨著此種用 ,之擴大’對光硬錄聚合敝缝以及感紐組成物要 求較先前更多樣之性能。 【發明内容】 本發明之課題在於提供可形成撥液性以及耐w臭氧 灰化性優異之硬化膜的正型感光性組成物。而且,本發明 之課題在於提供此種正型感光性組成物之硬化膜、罝 有此臈之顯示元件。 、 本發明者等人為了解決上制題㈣行了銳意研究, 見藉由於感光性組成物中使用含有多官能石夕氧炫之 早體共聚而成之聚合物,可麟_是撥祕錢耐— 臭氧灰化性優異之硬化膜,從而完成如下所示之本發明。 4 201207561.201207561 The Pi wall material can be formed into a patterned film by a known method of the above-mentioned (four) graded polymer composition and a photosensitive composition. In the barrier material, the characteristics of the liquid substance which is not attached to the nozzle head of the ink jet apparatus, that is, the ink repellency, are required (for example, refer to Japanese Patent Laid-Open No. Hei 11-281815 and Japanese Patent Laid-Open No. Hei 2) 〇〇4 149699). Further, in the semiconductor manufacturing*LCD manufacturing process or the like, an ozone ashing treatment step is performed to improve the ink coating property or wettability of the opening portion to which the liquid material is to be applied. At this time, since the surface of the barrier material is also treated, it is required to reduce the barrier of the barrier material, but it is resistant to such a treatment, and the barrier material which can reduce the surface repellency can be suppressed. As described above, the use of the photocurable polymer composition and the photosensitive composition is not only a material constituting the layer of the display member, but also extends to the manufacture of the display element. The use of this kind of expansion 'requires more performance than the previous ones for the optical hard recording polymerization quilting and the sensation composition. SUMMARY OF THE INVENTION An object of the present invention is to provide a positive photosensitive composition which can form a cured film excellent in liquid repellency and ozone ashing resistance. Further, an object of the present invention is to provide a cured film of such a positive photosensitive composition and a display element having such a flaw. In order to solve the above problem (4), the inventors of the present invention conducted a keen study, seeing that the polymer obtained by using the multi-functional Shixia Oxygen-based early body copolymerization in the photosensitive composition can be used for secret money. Resistant to a cured film excellent in ozone ashing, thereby completing the present invention as shown below. 4 201207561.

[1] -種感光性組成物,包括:包含 合物(A)以及1,2-二疊氮酉昆化合* (B),構之聚 構之聚合物⑷是包含如下化合物之單 聚&物.式(1)所表示之矽氧烷化人物、 、自由基 (A)驗可溶性之驗溶性與自由基聚合性 聚合性單體, 驗/合性自由基 [化1][1] A photosensitive composition comprising: an inclusion compound (A) and a 1,2-diazide quinone compound* (B), wherein the polymer (4) is a monomeric mixture of the following compounds (1) The oxiranated person represented by the formula (1), the free radical (A), the soluble solubility test and the radical polymerizable polymerizable monomer, the test/combination free radical [Chemical 1]

Si一rA^Si-rA^

(1) 於式(1)中,R1〜R4分別獨立地表示氫、或任 ,可經氟取代且並不連續之任意亞曱基亦可經氧 = 月& 數1〜30之烷基,Αι以及Α2分別表示自由基聚合=官反 基’ η表示1〜i,〇〇〇之整數。 ^ [2]如[1]所述之感光性組成物,其中,鹼溶性自由基 t合性單體包含選自由具有不飽和羧酸之自由基聚合性翠 體、具有不飽和羧酸酐之自由基聚合性單體、以及^有: 性經基之自由基聚合性單體所構成之群組之一種以上。 [3]如[1]或[2]所述之感光性組成物,其中,鹼溶性自 由基聚合性單體包含式(2)所表示之自由基聚合物單體, 5 201207561. JO^OUplf [化2](1) In the formula (1), R1 to R4 each independently represent hydrogen, or any of the fluorene groups which may be substituted by fluorine and which are not continuous may also be an alkyl group having an oxygen = month & , Αι and Α2 respectively represent radical polymerization = official anti-base ' η represents 1 to i, an integer of 〇〇〇. [2] The photosensitive composition according to [1], wherein the alkali-soluble radical t-bonding monomer comprises a radical selected from a radically polymerizable green body having an unsaturated carboxylic acid and having an unsaturated carboxylic acid anhydride. One or more of the group consisting of a base polymerizable monomer and a radical polymerizable monomer having a transradical group. [3] The photosensitive composition according to [1] or [2] wherein the alkali-soluble radical polymerizable monomer comprises a radical polymer monomer represented by the formula (2), 5 201207561. JO^OUplf [Chemical 2]

於式(2)中,R5〜R7分別表示氫、或任意之氫亦可 經氟取代之碳數1〜3之院基,R8〜R12分別表示氫,齒素’ _CN ’ _CF3 ’ -OCF3,經基’任意之亞甲基亦可經_c〇0-、 -OCO-、-CO-取代且任意之氫亦可經_素取代之碳數1〜5 之烧基’或任意之氫亦可經函素取代之碳數1〜5之烷氧 基。其中,r8〜r12中之至少1個為羥基。 [4]如[1]〜[3]中任一項所述之感光性組成物,其中, ^含矽氧烷結構之聚合物(A)是進一步包含式(1)所表 不之矽氧烷化合物以及鹼溶性自由基聚合性單體以外之其 他自由基聚合性|體的單體之自由基聚合物。 如[4]所述之感光性組成物,其中,其他自由基聚 σ f生單體包含式⑴所表示之⑦城化合物, [化3] 201207561 -5〇y〇upif 於式(3)中,R13〜R17分別獨立地表示任意之氫亦可 經氟取代且任意之亞甲基亦可經氧取代之碳數1〜30之烷 基、或矽數1〜500之三(烷基/炫氧基)矽烷氧基,A3表示 自由基聚合性官能基,η表示0〜1,000之整數。 [6] 如[5]所述之感光性組成物,其中,其他自由基聚 合性單體是η為〇之式(3)所表示之矽氧烷化合物。 [7] 如[6]所述之感光性組成物,其中,式(3)之R13 〜R15分別如下述式(5)所示, [化4]In the formula (2), R5 to R7 respectively represent hydrogen, or any of the hydrogens may be substituted by fluorine, and the carbon number is 1 to 3, and R8 to R12 respectively represent hydrogen, and dentate ' _CN ' _CF3 ' -OCF3, The radical "any methylene group may be substituted by _c〇0-, -OCO-, -CO- and any hydrogen may be substituted by a ketone with a carbon number of 1 to 5 or any hydrogen. An alkoxy group having a carbon number of 1 to 5 which can be substituted by a functional element. Among them, at least one of r8 to r12 is a hydroxyl group. [4] The photosensitive composition according to any one of [1] to [3] wherein the polymer (A) having a siloxane structure further comprises oxime represented by the formula (1). A radical polymer of a radical polymerizable monomer other than an alkyl compound and an alkali-soluble radical polymerizable monomer. The photosensitive composition according to [4], wherein the other radical poly-sigma monomer comprises a 7-city compound represented by the formula (1), [Chemical 3] 201207561 -5〇y〇upif in the formula (3) R13 to R17 each independently represent an arbitrary hydrogen group which may be substituted by fluorine, and any methylene group may be substituted with an oxygen group having an alkyl group having 1 to 30 carbon atoms or a number of valences of 1 to 500 (alkyl/hyun). Oxy) decyloxy, A3 represents a radical polymerizable functional group, and η represents an integer of 0 to 1,000. [6] The photosensitive composition according to [5], wherein the other radical polymerizable monomer is a oxoxane compound represented by the formula (3) wherein η is ruthenium. [7] The photosensitive composition according to [6], wherein R13 to R15 of the formula (3) are each represented by the following formula (5), [Chemical 4]

(5) 於式(5)中, 20之燒基、或碳數 21〜R23分別獨立地表示氫、碳數1〜 ^ 〜20之烷氧基(其中,末端之R21〜 之至乂、一個疋所述烧基或所述烧氧基),m表示1〜500 之整數。 [8]如[4]〜[7]中任一項所述之感光性組成物,其中, 其他自由基聚合性單體包含(甲基)丙烯酸衍生物。 人[]如[1]〜[8]中任一項所述之感光性組成物,其進一 ^ 3有驗可溶性聚合物(c),所述鹼可溶性聚合物(c) =式(1)所表不之石夕氧烷化合物以外之單體的自由基聚合 物’且具有鹼可溶性。 7 201207561. jo^uupif [10]如[9]所述之感光性組成物,其中,鹼可溶性聚合 物(C)是包含選自由具有不飽和羧酸之自由基聚合性單 體、具有不飽和羧酸酐之自由基聚合性單體、以及具有酚 性經基之自由基聚合性單體所構成之群組之一種以上的單 體之自由基聚合物。 [11] 如[1]〜[10]中任一項所述之感光性組成物,其進 一步含有溶劑。 [12] 種硬化膜,其是對如[1]〜[11]中任一項所述之 感光性組成物之膜進行煅燒而獲得。 [13] —種顯示元件,其具有如[12]所述之硬化膜。 [發明的效果] ' 本發明之感光性組成物是包含式(i )所表示之 化合物之單體的驗可溶性自由基聚合物,因此可藉由適用 =型抗_射㈣成在uv臭氧灰化處理之前後之任 思情况中撥液性均優異之硬化膜。 【實施方式】 ' .不i明之感光性組成物 物包括:包切纽結構之驾 入物rA、,化合物(Β)。包切氧烧結構4 j (A)可為-種亦可為兩種以上且u•二 合物(B)可為一種亦可為兩锸 且氮酉1 ^包^氧餘構之聚合物⑷肖= 物(B)加以混合而獲得。 ⑽ M.包含矽氧烷結構之聚合物(A) 8 201207561. 單體的自由之聚合物⑷是包含如下化合物之 與二個自由.具有石夕數2以上之直鍵石夕氧炫結構 物(以下“能基的式⑴所表示切氧炫化合 聚合物(A)驗·^由基聚合性單體(a_1)」)、具有賦予 自由基聚合性之鹼溶性與自由基聚合性的鹼溶性 U-2)」)。早體(以下亦稱為「自由基聚合性單體 單體構之聚合物⑷具有由自由基聚合性 之聚合物4之^容性是指將藉由旋塗包含石夕氧燒結構 厚度為0 01 μηι :以及於100C下加熱1 2分鐘而形成之 前。二卿之膜,於例如坑左右之 而洗濯時,並未殘留膜。 〜貝5刀知後,错由純水 分別M及自由基聚合性單體U-2) ::r,. ==聚合性單體㈤)之含量細^ wt%^〇°wt〇/0 〇 1 考慮,構成包含秒氧燒結It:充St 之所有早體中的自*絲合性單體 (: 1 1 W:/〇^5〇 Wt% ^ 〇·5 -〇^30 w; 2 佳的是1 wt0/。〜20 wt%。 V更 201207561 1-1-1.自由基聚合性單體(a-l) 自由基聚合性單體(a-1)是具有矽數2以上之直鏈矽 氧烷結構與二個自由基聚合性官能基之化合物,以式 而表示。 [化5](5) In the formula (5), the alkyl group of 20 or the carbon number 21 to R23 independently represents hydrogen, and the alkoxy group having a carbon number of 1 to 〜 20 (wherein the terminal R21 to 乂, one疋 The alkyl group or the alkoxy group), m represents an integer of from 1 to 500. [8] The photosensitive composition according to any one of [4], wherein the other radical polymerizable monomer contains a (meth)acrylic acid derivative. The photosensitive composition according to any one of [1] to [8], which further comprises a soluble polymer (c), wherein the alkali-soluble polymer (c) = formula (1) The radical polymer of the monomer other than the oxalate compound is represented and has alkali solubility. [10] The photosensitive composition according to [9], wherein the alkali-soluble polymer (C) is selected from the group consisting of a radically polymerizable monomer having an unsaturated carboxylic acid, and having an unsaturated state. A radical polymer of a monomer having at least one of a group consisting of a radical polymerizable monomer of a carboxylic anhydride and a radical polymerizable monomer having a phenolic radical. [11] The photosensitive composition according to any one of [1] to [10] which further contains a solvent. [12] A cured film obtained by calcining a film of the photosensitive composition according to any one of [1] to [11]. [13] A display element having the cured film according to [12]. [Effects of the Invention] The photosensitive composition of the present invention is a solvent-soluble radical polymer containing a monomer of the compound represented by the formula (i), and thus can be formed into a uv ozone ash by applying a type of anti-radiation (tetra) A cured film excellent in liquid repellency in the case of any treatment before and after the treatment. [Embodiment] The photosensitive composition of the present invention includes: a driving material rA, a compound (Β). The oxygen-sintering structure 4 j (A) may be a species of two or more and the u•dimer (B) may be a polymer which may be two oximes and a nitrogen oxime (4) Xiao = (B) is obtained by mixing. (10) M. Polymer containing a siloxane structure (A) 8 201207561. The free polymer of the monomer (4) is a linear bond containing the following compounds and two free radicals having a stone number of 2 or more. (hereinafter, the "oxygenated polymer (A) represented by the formula (1) of the energy base) has a base-polymerizable monomer (a_1)"), and has an alkali-soluble and radical polymerizable base which imparts radical polymerizability. Solubility U-2)"). The early body (hereinafter also referred to as "the polymer of the radical polymerizable monomer monomer (4) having the polymerizable property of the radical polymerizable property 4 means that the thickness of the structure comprising the magnetotelluric structure by spin coating is 0 01 μηι : and heated at 100 ° for 12 minutes before the formation. The film of the second Qing, when washing, for example, around the pit, there is no residual film. ~ Behind the 5 knife, the difference is pure water and M Base polymerizable monomer U-2) ::r,. ==Polymerizable monomer (5)) Content fine ^ wt%^〇°wt〇/0 〇1 Consider, consisting of containing second oxygen sintering It: filling St Self-synthesis monomer in the early body (: 1 1 W: / 〇 ^ 5 〇 Wt% ^ 〇 · 5 - 〇 ^ 30 w; 2 is better than 1 wt0 /. ~ 20 wt%. V more 201207561 1-1-1. Radical polymerizable monomer (al) The radical polymerizable monomer (a-1) is a compound having a linear oxime structure of 2 or more and a radical polymerizable functional group. , expressed in terms of formula. [Chemical 5]

(1) 於式(1)中,R1〜R4分別獨立地表示氫、或任意氫 亦可經氟取代且並不連續之任意亞曱基亦可經氧取代之碳 數1〜30之烷基。此種烷基例如包括氟化烷基或碳數丄〜 20之烷氧基。 於式(1)中,A1以及A2分別表示自由基聚合性官能 基。A1以及A2可相同亦可不同。自由基聚合性官能基可 使用於自由基聚合性單體(a-l)中具有可自由基聚合之結 構的基。此種自由基聚合性官能基可列舉公知之自由基聚 合性官能基’例如可列舉乙烯基、丨,2_伸乙稀基 (vinylene )、1,1 亞乙烯基(vinylidene )、(曱基)丙烯醯基、 以及苯乙烯基等。 自由基聚合性官能基亦可於獲得自由基聚合性之範圍 内進一步具有取代基。此種取代基例如可列舉碳數2〜10 之伸烷基;甲氧基、乙氧基等烷氧基;以及異丙基以及異 201207561 joyoupif 丁基等分支烷基。 自獲得良好 更佳的是5 於式(1)中,n表示之整數。 之驗顯影性之觀點考慮,n較佳的是2〜5〇〇, 〜300,進一步更佳的是1〇〜15〇。 一自由基聚合性單體(a_l)例如可列舉於式(1_〇所 表不之兩末端具有甲基丙烯醯基之魏院系單體。自初始 之^性高’域乎沒有於高溫下之職所造成之透雜 之劣化’另外顯料對㈣性水溶社溶紐高(亦 影性高),容易地獲得圖案狀透明膜,且顯示出耐溶劑性、 高耐水性、耐酸性、耐祕、耐熱性,另外與基底之密接 性高的感光性組成物或硬化膜之觀點考慮,較佳的是於自 由基聚合性單體(a.l)巾使用魏衫單體。另外,於式 (1-1 )中,η表示1〜ι,〇〇〇之整數。 [化6](1) In the formula (1), R1 to R4 each independently represent hydrogen, or any hydrogen which may be substituted by fluorine and which is not continuous, any of the fluorenylene groups may be substituted by an oxygen having 1 to 30 carbon atoms. . Such an alkyl group includes, for example, a fluorinated alkyl group or an alkoxy group having a carbon number of 丄-20. In the formula (1), A1 and A2 each represent a radical polymerizable functional group. A1 and A2 may be the same or different. The radical polymerizable functional group can be used in a radically polymerizable monomer (a-1) having a radically polymerizable structure. Examples of such a radical polymerizable functional group include a known radical polymerizable functional group, and examples thereof include a vinyl group, an anthracene, a vinylene group, a vinylidene group, and a mercapto group. An acrylonitrile group, a styryl group, and the like. The radical polymerizable functional group may further have a substituent in the range in which the radical polymerizability is obtained. Examples of such a substituent include an alkylene group having 2 to 10 carbon atoms; an alkoxy group such as a methoxy group or an ethoxy group; and a branched alkyl group such as an isopropyl group and a different 201207561 joyoupif butyl group. It is better to obtain good from 5 in the formula (1), and n is an integer. From the viewpoint of the developability, n is preferably 2 to 5 Å, 〜300, and still more preferably 1 〇 to 15 〇. The radically polymerizable monomer (a-1) may, for example, be a univalent monomer having a methacryl fluorenyl group at both ends of the formula (1_〇). The deterioration caused by the next job's addition to the (four) water-soluble solution, which is high in color (highly visible), easily obtains a pattern-like transparent film, and exhibits solvent resistance, high water resistance, and acid resistance. From the viewpoint of the photosensitive composition having a high adhesion to the substrate or the cured film, it is preferred to use a Wei-shirt monomer for the radical polymerizable monomer (al). In the formula (1-1), η represents an integer of 1 to ι, 〇〇〇. [Chem. 6]

(1-1) 自由基聚合性單體(a-Ι)亦存在有市售品。式(Ul) 所表示之化合物例如可列舉Silaplane FM7711 (商品名, CHISSO CORPORATION 製造)。 1-1-2.自由基聚合性單體(a_2) 自由基聚合性單體(a_2)具有賦予聚合物(a)驗可 溶性之鹼溶性與自由基聚合性。自由基聚合性單體(a_2) 201207561 溶性是指即使於自由基聚合性單體(…之自 ίΐϊ:形態下亦藉由鹼而形成水溶性之鹽。此種鹼 〜疋藉由如下結構而賦予,所述結構具有與自由基 Γί獨=利水溶性鹽之部位,例如繞基i盼i ^ θ 自由基聚合性單體(a_2)所具有之自由 ,疋指與包括自由基聚合性單體^ 自由基聚合之性質。舲搞Aβ x 丹他早體進仃 聚人性官炉美而❹種自由基聚σ性是藉由上述自由基 = 而賦予。因此’自由基聚合 括所述可溶解於射之部位與自由絲合㈣包 此種自由基聚合性單體(a 2)例如可 ς 和叛酸之自由絲合性單體、含有不飽和魏 聚合性單體、以及含__基之自轉聚 二由^ 有不飽和魏之自由基聚合性單體例如 = ,含料飽和舰技自由絲合性單體=可t: 來酸肝,含有盼性經基之自由基聚合 歹J舉馬 :纖基之乙稀基崎具有經基之== 具有酚性羥基之乙烯基嗣例如可丨礙 化合物。 舉式(2)所表示之 [化η D 11 D 12(1-1) A radically polymerizable monomer (a-Ι) is also commercially available. The compound represented by the formula (Ul) is, for example, Silaplane FM7711 (trade name, manufactured by CHISSO CORPORATION). 1-1-2. Radical polymerizable monomer (a_2) The radically polymerizable monomer (a_2) has alkali solubility and radical polymerizability which impart solubility to the polymer (a). Radical polymerizable monomer (a_2) 201207561 Solubility refers to a salt which forms a water-soluble salt by a base even in the form of a radical polymerizable monomer. Providing that the structure has a moiety which is free from a radical, such as a free radical polymerizable monomer (a_2), and a radical polymerizable monomer Body ^ The nature of free radical polymerization. The Aβ x danta early body enters the 人 仃 人 官 官 官 官 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基Dissolved in the site of the shot and the free filament (4) coated with such a radical polymerizable monomer (a 2), such as a free-filament monomer which can be deuterated and tickered, contains an unsaturated Wei polymerizable monomer, and contains __ The self-rotating polydition of the base is composed of a radical polymerizable monomer having an unsaturated Wei, for example, a saturated spheroidal free-synthesis monomer = t: a sour liver, a radical polymerization containing a desired thiol group J lifts the horse: the vinyl group of the fiber base has a base group == a vinyl group with a phenolic hydroxyl group Shu may hinder compound. For formula (2) is the [η D 11 D 12 of

12 (2) 201207561 ^oyoupif 於式(2)中,R5〜R7分別表示氫、或任意之氫亦可 經氟取代之碳數1〜3之烷基,R8〜R〗2分別表示氫,_素, -CN,-CF3,-〇CF3,羥基,任意之亞甲基亦可經、 -oco-、-Co-取代且任意之氫亦可經鹵素取代之碳數i〜5 之烷基,或任意之氫亦可經鹵素取代之碳數丨〜5之烷氧 基。其中,R8〜R12中之至少i個為羥基。 自提高鹼可溶性之觀點考慮,較佳的是R5〜R7以及除 經基以外之R8〜R12為氫。式⑵所麵之化合物例如二 列舉4-經基苯基乙稀基酮。 …具有酚性羥基之乙烯基酮可藉由公知之方法合成而獲 知’或者可以市售品之形式獲得。例如,4錄苯基乙 基酮可如日本專利特開細4_189715號公報中所記載般 由如下方式而獲得:於2·氯乙基·4·甲氧基苯基酮之二氣; 烧溶液中添純倾,使所得之混合物喊、冷卻 酸乙醋而萃取械相,水溶料輯獲得之 相,藉由鹽酸使其為酸性後,再次藉由乙酸乙s旨進行萃^機 具有雜麟之苯乙烯衍生齡了雜錄以外,且 ,乙烯所具有之聚合性雙鍵。具有紛性錄之 ^ 列舉_基苯乙婦、間減苯乙稀、以及^ 1-1_3·其他之自由基聚合性單體(a-3) 3包含魏燒結構之聚合物(A)所具有 ^增3加之觀點考慮,較佳的是包含魏_構J = )疋進—步包含自由基聚合性單體U.1)以及自:義 13 201207561 -^ν^ν/νρίί* 眾令、性單體(a_2) 自由基聚合轉體㈤) 體之自料聚合物。 高包切纽結構之聚合物⑷種^^兩細上。自提 包含石夕氧炫結構之聚合物 α有之特性或者賦予 慮,構成包含石夕氧燒結構 步之特性的觀點考 自由基聚合性軍體心=二:=有單趙中的 魂,更佳狀 70.0 wt%〜99 5 w _ wt%〜"9 wt%〜99.0wt%。 進一步更佳的是80.0 自由基聚合性單體(叫例如 之矽氧烧化合物、含有環氧美 工)所表示 丙烯酸衍生物、N取代馬來^亞胺、單體^甲基) 自由基聚合性單體。 匕&一%戊基之 [化8]12 (2) 201207561 ^oyoupif In the formula (2), R5 to R7 respectively represent hydrogen, or any hydrogen which may be substituted by fluorine with an alkyl group having 1 to 3 carbon atoms, and R8 to R2 represent hydrogen, respectively. , -CN, -CF3, -〇CF3, hydroxy, any methylene group may also be substituted by -oco-, -Co- and any hydrogen may be substituted by halogen with an alkyl group having an alkyl number i~5. Or any hydrogen may be substituted with a halogen to have an alkoxy group having a carbon number of 丨~5. Wherein at least one of R8 to R12 is a hydroxyl group. From the viewpoint of improving alkali solubility, it is preferred that R5 to R7 and R8 to R12 other than the substituent are hydrogen. The compound of the formula (2), for example, is exemplified by 4-phenylphenyl ketone ketone. The vinyl ketone having a phenolic hydroxyl group can be obtained by synthesis by a known method' or can be obtained in the form of a commercially available product. For example, 4 phenyl ethyl ketone can be obtained by the following method as described in Japanese Patent Laid-Open Publication No. Hei-4-189715: a gas of 2·chloroethyl·4·methoxyphenyl ketone; a burning solution; In the pure addition of the mixture, the resulting mixture is shouted, the acid vinegar is cooled and the mechanical phase is extracted, and the phase obtained by the water-soluble material is made acidic by hydrochloric acid, and then the extraction machine is further mixed with acetic acid. The styrene is derived from the age of the miscellaneous, and the polymerizable double bond of ethylene. Having a succinct record ^ List _ phenyl benzene, styrene, and 1-1 _ 3 · other radical polymerizable monomers (a-3) 3 containing Wei Shao structure of polymer (A) From the viewpoint of increasing the number of additions, it is preferred to include a Wei-Structure J = ), and the step comprises a radical polymerizable monomer U.1) and from: 13 201207561 -^ν^ν/νρίί* , the monomer (a_2) radical polymerization (5)) self-material polymer. The high-cut-cut structure of the polymer (4) is ^^ two fine. From the point of view of the characteristics of the polymer α containing the Shihe oxygen structure, or the considerations, the composition of the structure of the structure of the stone-like oxygen-burning body is tested. The free radical polymerized body heart = two: = the soul of the single Zhao Zhong, More preferably 70.0 wt% ~ 99 5 w _ wt% ~ " 9 wt% ~ 99.0 wt%. Further preferably, the radical polymerizable monomer represented by 80.0 radically polymerizable monomer (for example, an oxime-emitting compound, an epoxy-containing compound), an N-substituted maleimide, a monomer, and a methyl group are radically polymerizable. monomer.匕&1% pentyl [Chemical 8]

-於式(3)+ R〜R17分別獨立地表示任意之氫亦可 、,至氟取代且任,¾之亞甲基亦可經氧取代之碳數丨〜川之烧 基、或院基之f數卜扣的魏1〜500之三(絲/燒氧基) 石夕烧氧基,A麵自由基聚合性官能基,η衫0〜1,000 之整數。其中’較佳的是於η為G時,Rl3〜Rl5分別為式 201207561. jo^uupif (5)所示之基。另外,自由基聚合性官能基A3與上述式 (1)中之自由基聚合性官能基同義。而且,「三(烷基/烷 氧基)」是表示包含烷基以及烷氧基之一者或兩者的三個 基。 [化9] (p^22 、- wherein the formula (3) + R to R17 independently represent any hydrogen, and the fluorine is substituted, and the methylene group of 3⁄4 may be substituted by oxygen, or the base of the group. The f-number of Wei 1~500 three (silk/alkoxy) is an alkyl group, an A-radical polymerizable functional group, and an integer of 0 to 1,000. Wherein ' is preferably when η is G, and Rl3 to Rl5 are each a group represented by the formula 201207561. jo^uupif (5). Further, the radical polymerizable functional group A3 has the same meaning as the radical polymerizable functional group in the above formula (1). Further, "tris(alkyl/alkoxy)" means three groups including one or both of an alkyl group and an alkoxy group. [化9] (p^22,

Si—〇]— (5) R23 於式(5)中,R21〜R23分別獨立地表示氫、碳數1〜 20之烷基或碳數1〜20之烷氧基(其中,末端之R21〜R23 之至少一個是所述烷基或所述烷氧基)。m表示1〜500之 整數。 式(3)所表示之矽氧烷化合物例如可列舉式(3-1) 所表示之α-丁基-ω-(3-曱基丙烯醯氧基丙基)聚二甲基矽氧 烷(商品名:FM07U、CHISSO CORPORATION 製造)。 其自由於所含有之矽而使表面撥液性提高之觀點考慮較 佳。 [化 10] 丄〒h3〒h3 2 十〒-oj—〒—C4Hg \ ChVn CH3 ch3 (3-1) h2c=c-c-o-ch2ch2chSi—〇]—(5) R23 In the formula (5), R21 to R23 each independently represent hydrogen, an alkyl group having 1 to 20 carbon atoms or an alkoxy group having 1 to 20 carbon atoms (wherein the terminal R21~) At least one of R23 is the alkyl group or the alkoxy group). m represents an integer from 1 to 500. The alkoxyalkyl compound represented by the formula (3) is, for example, α-butyl-ω-(3-mercapto propyleneoxypropyl)polydimethyloxane represented by the formula (3-1). Product name: FM07U, manufactured by CHISSO CORPORATION). It is considered to be free from the viewpoint of containing the flaws and improving the surface liquid repellency.化h3〒h3 2 十〒-oj—〒—C4Hg \ ChVn CH3 ch3 (3-1) h2c=c-c-o-ch2ch2ch

II 〇 而且,以式(3)而表示且n為0之矽氧烷化合物例如 15II 〇 Furthermore, a oxane compound represented by the formula (3) and n is 0, for example, 15

201207561 ^ ^ A X 可列舉3-甲基丙烯醯氧基丙基三甲氧基矽烷(商品名. S710 &gt; CHISSO CORPORATION t ϋ ) &gt; 3- 丙土二(二甲基矽烷氧基)矽烷(商品名:TM0701T、CHISSO CORPORATION製造)、以及3_ψ基丙_氧基丙基甲λ 二甲氧基魏(商品名:ΚΒΜ_5()2、信越化學 ^ 限公司製造)。其中,自提高對於驗性顯影液之溶解性之觀 點考慮’難的是3_甲基丙騎氧基丙基三?氧基魏。 含有環氧基之自由基聚合性單體例如可列舉(曱基)丙 烯酸縮水甘油酯、(曱基)丙烯酸曱基縮水甘油酯、(甲基 丙烯酸-3,4-環氧環己基甲g旨、以及3·乙基_3_(ψ基)丙稀土酿 氧基甲基環氧丙I該些化合物自容易獲得,以及提高所 得之圖案狀透明膜之耐溶劑性、耐水性、耐酸性、耐鹼性、 耐熱性、透明性之觀點考慮較佳。 (曱基)丙烯酸衍生物若為具有(甲基)丙烯酸所具有之 聚合性雙鍵的衍生物即可。(甲基)丙烯酸衍生物例如可列 舉甲基丙稀酸甲酉旨、曱基丙婦酸乙醋、甲基丙稀酸異丙醋、 曱基丙烯酸正丙酯、曱基丙烯酸正丁酯、曱基丙烯酸異丁 酯、曱基丙烯酸第三丁酯、曱基丙烯酸己酯、曱基丙烯酸 乙基己酯等曱基丙烯酸烷基酯;曱基丙烯酸苄酯、甲基丙 烯酸苯氧基乙酯等具有芳香環之曱基丙烯酸烷基酯;曱基 丙烯酸羥基曱酯、曱基丙烯酸-2-羥基乙酯、曱基丙烯酸_2_ 羥基丙酯、曱基丙烯酸-4-羥基丁酯、曱基丙烯酸羥基戊 酯、曱基丙烯酸羥基己酯等具有羥基之甲基丙烯酸烷酯; 曱基丙烯酸二曱胺基乙酯等曱基丙烯酸二烷基胺基烷基 201207561 joyoupif 酯;以及甲基丙烯酸苯酯等曱基丙烯酸芳基酯。 N取代馬來醯亞胺例如可列舉N-曱基馬來醯亞胺、N-乙基馬來醢亞胺、N- 丁基馬來醯亞胺、;N-環己基馬來酿亞 胺、N-苄基馬來醯亞胺、N-苯基馬來醯亞胺、n-(4-乙醯基 苯基)馬來醯亞胺、N-(2,6_二乙基苯基)馬來醯亞胺、n_(4-二甲胺基-3,5_二确基苯基)馬來醢亞胺、Ν-(ΐ·苯胺基萘基_4) 馬來醯亞胺、Ν-[4-(2-苯并。惡唾基)苯基]馬來酿亞胺、以及 Ν-(9-吖啶基)馬來醯亞胺。 包含二環戊基之自由基聚合性單體例如可列舉丙烯酸 二環戊基酯以及甲基丙烯酸二環戊基酯。 自提南由感光性組成物所形成之硬化膜之耐熱性之觀 點考慮,較佳的是自由基聚合性單體(a_3)包含Ν取代馬 來醯亞胺以及包含三環祕之自由基聚合性單體之一者或 兩者。 删%矽氧烷結構之聚合物(Α)之單體, 2 =結構之聚合物⑷之鹼可溶性之觀點考慮冋 ‘以ϋ由(甲基)丙烯酸羥基乙酯、(甲基)丙烯酸:生 Λ及具有雜祕之苯乙烯衍生物所構成 種以上包含於所述單體中。 、、之 r . 結構之聚合物(Α)可藉由如下方式而獲 ::加自由基聚合性單體⑹)以及自 = (⑷’而且視需要進—步添加自 眭早體 使該些化合物自由心人—h U平體(a-3), 法而進行。由基聚5 4自由基聚合可藉由公知之方 17 201207561. 包4魏結構之聚合物⑷之聚合转雖益特別 I制’但難的是於使用溶狀溶液巾的自由基聚合。聚 &amp;溫度若為由所使用之聚合起始劑而充分產生自&amp; 二Si特別限定,通常為耽〜15代之範圍:聚: 無特別蚊,通f為!小時〜24小時之範圍。而且, 邊聚s可於加壓、減壓或大氣壓之任意壓力下進行。 自由所使用之溶劑較佳的是可溶解二吏用之 ^由基聚δ性早體以及生成物的溶劑。溶劑可為—種亦可 為兩種以上。溶劑例如可列舉曱醇、乙醇、“ 四氫呋喃、乙 醇單乙越、丙 醇二甲醚、二 乙氧基丙酸乙 醇、丙酮、2-丁酮、乙酸乙酯、乙酸丙酯 _ 腈、二噁烷、甲苯、二甲苯、環己酮、乙 一醇單曱醚、丙二醇單曱醚乙酸酯、二乙 乙二醇曱基乙基醚、3_甲氧基丙酸曱酯、 醋、以及Ν,Ν-二曱基曱醯胺 =基聚合中所使用之聚合起始劑例如 而產生自岭之化合物、偶氮雙異丁腈等偶 = 以及過氧化笨甲酿等過氧化物系起始劑 ^^ 用=::r之單體總量1。。重量份二= 1重里伤30重量份,更佳的是5重量份〜25重量/疋 而且,於自由基聚合中,為了調節分子量,习° =3:移劑。鏈轉移劑之添加量相對於成I: 之羊體,、!# 1GG重4份而言較佳的是 重量份,更佳的是0.005重量份〜0.03重量份。里刀〜〇.05 自曝光部分於鹼性顯影液中直至溶解之顯麥時尸、 18 201207561 jo^uupif 當’且於顯影時膜之表面難以變粗糙之觀點考慮,較佳的 是包含矽氧烷結構之聚合物(A)之重量平均分子量為 l’GGG〜100,〇〇〇。進一步自顯影殘渣變得極其少之觀點考 慮’重量平均分子量更佳的是1,5〇〇〜5〇,〇〇〇,進一步更佳 的是 2,000〜2〇,〇〇〇。 重量平均分子量可藉由以聚苯乙烯為標準之GPC分 析而求出’例如可使用分子量為500〜150,000之聚笨乙烯 (例如 Polymer Laboratories 製造之 PL2010-0102 (S-M2-10) standard),所述測定時之管枉可使用Shodex PLgel MIXED-D ( Polymer Laboratories 製造),所述測定時 之流動相可使用THF。可於此種條件下測定所述重量平均 分子量。 另外’包含矽氧烷結構之聚合物(A)之單體可藉由 可確認包含矽氧烷結構之聚合物(A)中之包含矽原子之 特定結構與源自自由基聚合性官能基之結構的公知之分析 方法而確認,例如可藉由利用檢測出1H-NMR之Si-CH3 之峰值與檢測出伸乙基(ethylene)或伸丙基(propylene) 之峰值而確認。 1-2. 1,2-二疊氮醌化合物(B) 1,2·二疊氮醌化合物(B)例如可使用於抗蝕劑領域中 作為光敏劑而使用之化合物。1,2_二疊氮醌化合物例 如可列舉:羥基二苯曱酮化合物與丨,2_苯醌二疊氮_4•磺酸 或1,2-笨醌二疊氮_5·磺酸之酯、羥基二苯曱酮化合物與 1,2-二疊氮萘醌_4_磺酸或L2—二疊氮萘醌_5_磺酸之酯、酚 201207561 化合物與1,2-笨醌二疊氮_4_磺酸或l,2-苯醌二疊氮_5-續酸 之酯、酚化合物與1,2-二疊氮萘醌-4-磺酸或1,2-二疊氮萘 醌-5-橫酸之酯、酚化合物之羥基被取代為胺基之化合物與 1,2-苯酿二疊氮-4-磺酸或1,2-苯醌二疊氮_5_磺酸之礦醯 胺、酚化合物之羥基被取代為胺基之化合物與丨,2_二疊氮 萘醌-4-磺酸或1,2_二疊氮萘醌-5-績酸之磺醯胺。 經基二苯曱_化合物例如可列舉2,3,4-三經基二苯甲 酮、2,4,6-三羥基二苯曱酮、2,2,,4,4,_四羥基二苯曱酮、 2,3,3’,4-四羥基二苯甲酮、以及2,3,4,4’-四羥基二苯曱酮。 酚化合物例如可列舉雙(2,4_二羥基笨基)曱烷、雙(對 經基苯基)甲烧、三(對祕苯基)甲烧、1Λ1三(對經基苯 乙烧、雙(2,3,4-三Μ基苯基)甲院、2,2_雙(2,3,4·三羥基 苯基)丙貌、1,1,3·三(2,5-二甲基_4_祕苯基)_3•苯基丙燒、 从⑽-⑽,基苯基]小甲基乙基]苯基]亞乙基 酚、雙(2,5-二甲基·4_經基苯基)·2-經基苯基甲院、如,3|· 四甲基-1,1’·螺二節_5,6,7,5’,6,,7,_己醇、以及 三基 •7,2,,4,_三羥基黃酮。 一?基 自提而感絲組成物之透雖之觀點考慮,較佳 二二2疊氮疊 :二笑 磺酸之醋、2,3,4·三羥基二苯甲_與 ,『一醌-5-磺酸之醋、2,3,4,四羥基二苯甲輞盥 1,2-一且氮萘醌斗磺酸之酯、2,3,4 盥 甲基乙基]本基]亞乙基]雙盼與二疊氛蔡酿韻之 201207561 Km/ 自曰、以及4,4’m[4-經基苯基η-曱基乙基]苯基]亞乙 基]雙酚與1,2_二疊氮萘醌·5_磺酸之醋所構成之群組之— 種以上。 1-3.其他成分 感光性組成物可於充分獲得本發明之效果之範圍内進 一步含有上述包含矽氧烷結構之聚合物(A)以及1,2·二 疊氣酿化合物⑻料之其他成分。雜其他成分例如 可列舉驗可溶性聚合物⑹、溶劑、添加物、以及多元緩 酸針。 1-3-1.鹼可溶性聚合物(c) 自進一步提高感光性組成物之鹼可溶性而容易地獲得 圖案狀透_之觀點,以及提高&lt;溶劑性、高耐水性、高 对酸性、高耐驗、以及高耐齡等所狀硬化膜之特性 的觀點考慮,較佳的是感光性組成物進一步含有鹼可溶性 聚合物⑻。驗可雜聚合物(c)可為—種亦可為兩種 以上。而且,鹼可溶性聚合物(c)中之「鹼可溶性」是 指將藉由旋塗驗可溶性聚合物(c)之減以及於1〇〇。〇下 加熱j分鐘而形成之厚度為0.01 μιη〜1〇〇μιη之膜,於例 如25°C左右之2.38 wt%之四曱基氫氧化銨水溶液中浸潰5 分鐘後’藉由純水而清洗時,並未殘留膜。 於驗可溶性聚合物(C)中可使用自由基聚合物,所 述自由基聚合物是以所獲得之聚合物具有鹼可溶性之方 式’使自由基聚合性單體(a_2)、或自由基聚合性|體(a 2) 以及自由絲合性單體(a_3)巾所含之兩種以上自由基聚 21 201207561. :性早體進行自由基聚合而成。此種自由基聚合 考慮於本發明之感光性組成物中具有石夕氧&amp;結 2可 (A)之使用量,以獲得所期望之功能之 物 性聚合物(C)中。 用於鹼可溶 於鹼可溶性聚合物(C)之單體中,可使用 合性單體(a-2)作為具有雜減之自由絲合性^聚 自提高感光性組成物之鹼可溶性之觀點考慮,較 ,性聚合物(C)之單體包含選自由(?基)_酸^ 酸酐、經絲乙烯、以及4_祕苯基乙絲崎構之 組之一種以上。 外 去自曝光部分於驗性顯影液中直至溶解之顯影時間適 且於顯影時膜之表面難以變粗縫之觀點考慮’較佳的 疋驗可溶性聚合物(C)之重量平均分子量與包含石夕氧院 結構之聚合物(A)同樣地為1,_〜;進-步自顯 衫殘〉査變%·極其少之觀點考慮,更佳的是⑻〜5〇卿, 進θ ^更佳的是2,000〜2〇,_。驗可溶性聚合* (C)之 重!平均分子量例如可藉由與包含⑦氧㈣構之聚合物 (A)相同之條件的Gpc分析而求出。 驗可溶性聚合物(C)例如可藉由與包含矽氧烷結構 ,聚合物⑷同樣之聚合方法而獲得。而且,驗可溶性 聚合物(C)之單體例如可藉由如下方式而推定:於使鹼 可溶性聚合物(C)熱分解時,藉由GC-MS而測定由於熱 分解所產生之氣體。 1-3-2.溶劑 22 201207561. o〇yO\)pii 感光性組成物較佳為進一步含有溶劑。溶劑較佳的是 ~τ溶解感光性組成物_所調配之包含破氧烧結構之聚合物 (A)、1,2-一疊氮g昆化合物(Β)、以及驗可溶性聚合物(c) =溶,。而且,溶劑較佳的是沸點為1〇(rc〜3〇(rc之溶 ’ °溶劑可為一種亦可為兩種以上。 峻沸點為10(TC〜30(TC之溶劑例如可列舉乙酸丁酯、丙 己萨酯、乳酸乙醋、氧基乙酸曱酯·、氧基乙酸乙酯、氧基 峻^酯、甲氧基乙酸甲酯、曱氧基乙酸乙酯、曱氧基乙 曱酽~、乙氧基乙酸甲酯、乙氧基乙酸乙酯、3_氧基丙酸 醆曰t3·氧基丙酸乙酯、3_曱氧基丙酸甲酯、3_曱氧基丙 酯、3_乙氧基丙酸甲酯、3_乙氧基丙酸乙酯、2-氧基 丙=甲知、2_氧基丙酸乙酯、2_氧基丙酸丙酯、2-曱氧基 ^曱酯'2-甲氧基丙酸乙酯、2-曱氧基丙酸丙酯、2_乙 =基内酸甲酉旨、2-乙氧基丙酸乙醋、2_氧基_2_曱基丙酸曱 2厶氣基-2·曱基丙酸乙酯、曱氧基-2-甲基丙酸甲酯、 氧基·2_甲基丙酸乙酯、丙醐酸甲酯、丙酮酸乙醋、丙 唣-、丙S曰、乙醯乙酸甲酯、乙醯乙酸乙酯、2·侧氧丁酸曱 二二厶側氧丁酸乙酯、二噁烷、乙二醇、二乙二醇、三乙 醇丙二醇、二丙二醇、三丙二醇、1,4-丁二醇、乙二 乙二醇單丁醚、丙二醇單㈣、丙二醇單甲 乙-酸,、丙二醇單乙醚乙酸酯、丙二醇單丙醚乙酸酯、 一〜醇單丁醚乙酸酯、環己酮、環戊酮、二乙二醇單曱醚、 ^〜醇單曱醚乙酸酯、二乙二醇單乙醚、二乙二醇單乙 、久酉9、一乙二醇單丁醚、一乙二醇單丁_乙酸酯、二 23 201207561. 乙二醇二曱醚 曱苯、 —乙*一醉二乙 、二甲苯、γ· 丁内醋、二=二醇甲基乙基醚、 自提高形成感光性組成物切二基乙醯胺。 考慮,較佳岐溶劑是選自塗偶—性之觀點 醚乙酸酿、兩二醇單乙喊乙喊、丙二醇單甲 乙氧基丙酸乙醋、二乙二醇單I:氧基丙酸甲醋、3· 醚乙酸醋、二乙二醇二甲喊、二,乙酸醋、二乙二醇單丁 乙醋以及乙酸丁1旨所構成之‘之基乙細、乳酸 人體之安全性之觀點考慮 :亡:二卜,自對 單甲趟乙酸酿、3_甲氧基丙=疋f劑是選自由丙二醇 二乙二醇甲基乙細、乳酸乙\曰、3·乙氧基丙酸乙醋、 群組之-種以上。 &lt;以日、以及乙酸TS旨所構成之 之、:::為含有2〇 Wt%以上之彿點為隱〜3⑻。C =劑的混。溶劑。混合溶劑中之沸點為鮮c〜戰之 洛劑以外的溶劑可制公知之溶劑之-種或兩種以上。 1-3-3.添加劑 自使解析度、塗佈均—性、顯雜、以及接著性等感 f组成物以及所形成之硬化膜之特性進—步提高之觀點 考慮,較佳的是感紐組成物進—步含有添加劑 。添加劑 可使用=抗侧劑領域中,於感光性組成物或硬化膜之特 性之提局巾所_的各種添加劑。添加劑可為_種亦可為 兩種以上。此種添加劑例如可列舉丙烯酸系、苯乙烯系、 聚乙烯亞胺系或聚胺I旨系高分子分散劑,陰離子系、陽離 子系、非離子系或氟系之界面活性劑,矽氧樹脂系塗佈性 24 201207561 jeyoupif 改二劑硬烧偶合劑專岔接性改善劑,烧氧基二苯曱酮類 等紫^卜線吸收劑,聚丙烯酸鈉等凝聚抑制劑,環氧化合物、 三聚氰胺化合物或雙疊氮化物等熱交聯劑,以及有機羧酸 專驗溶性促進劑。 更具體而言’添加劑例如可列舉p〇ly£j〇w No.45、201207561 ^ ^ AX exemplified by 3-methacryloxypropyltrimethoxydecane (trade name: S710 &gt; CHISSO CORPORATION t ϋ ) &gt; 3-propenyl bis(dimethyl decyloxy) decane (commodity Name: TM0701T, manufactured by CHISSO CORPORATION), and 3_mercaptopropoxy methoxymethyl λ dimethoxy Wei (trade name: ΚΒΜ_5 () 2, manufactured by Shin-Etsu Chemical Co., Ltd.). Among them, from the point of view of improving the solubility of the test developer, it is difficult to make 3-methyl-propyloxypropyl three? Oxygen Wei. Examples of the epoxy group-containing radical polymerizable monomer include glycidyl (mercapto)acrylate, decyl glycidyl (mercapto) acrylate, and (3,4-epoxycyclohexyl methacrylate). And 3·ethyl_3_(indenyl)propene rare earth oxymethyl epoxide I These compounds are readily available, and the solvent resistance, water resistance, acid resistance and resistance of the resulting patterned transparent film are improved. The viewpoint of alkalinity, heat resistance, and transparency is preferable. The (fluorenyl) acrylic acid derivative may be a derivative having a polymerizable double bond of (meth)acrylic acid. For example, a (meth)acrylic acid derivative Examples thereof include methyl methacrylate formazan, ethyl propyl acetoacetate, isopropyl methacrylate, n-propyl decyl acrylate, n-butyl decyl acrylate, isobutyl methacrylate, hydrazine. Alkyl methacrylate such as butyl acrylate, hexyl methacrylate or ethyl hexyl acrylate; thiol acrylate having aromatic ring, such as benzyl methacrylate or phenoxyethyl methacrylate Alkyl ester; hydroxy decyl acrylate, methacrylic acid - 2-hydroxyethyl ester, 2-hydroxypropyl methacrylate, 4-hydroxybutyl methacrylate, hydroxyamyl decyl acrylate, hydroxyhexyl methacrylate, etc., alkyl methacrylate having a hydroxyl group; Dialkylaminoalkyl decyl acrylate such as diamylaminoethyl acrylate 201207561 joyoupif ester; and aryl methacrylate such as phenyl methacrylate. N-substituted maleimide, for example, N-fluorenyl Maleic imine, N-ethyl maleimide, N-butyl maleimine, N-cyclohexyl maleimide, N-benzyl maleimide, N-benzene Kamalyimide, n-(4-ethylmercaptophenyl)maleimide, N-(2,6-diethylphenyl)maleimide, n-(4-dimethylamine -3,5-di-diphenyl) maleimide, Ν-(ΐ·anilinonaphthyl-4) maleimide, Ν-[4-(2-benzo. oxoyl) Phenyl]maleimine, and fluorenyl-(9-acridinyl)maleimide. Examples of the radical polymerizable monomer containing a dicyclopentyl group include dicyclopentyl acrylate and methyl group. Dicyclopentyl acrylate. Resistant to the cured film formed by the photosensitive composition from the south From the viewpoint of the nature, it is preferred that the radical polymerizable monomer (a-3) contains one or both of a fluorene-substituted maleimide and a radical-polymerizable monomer containing a tricyclic ring. The structure of the polymer (Α) monomer, 2 = the structure of the polymer (4) alkali solubility from the viewpoint of 冋 'ϋ from (meth)acrylic acid hydroxyethyl ester, (meth)acrylic acid: oysters and have a secret The styrene derivative is contained in the monomer or more. The polymer (Α) of the structure can be obtained by: adding a radical polymerizable monomer (6)) and self = ((4)' and if necessary, adding the self-preserving body to make these compounds free-hearted - h U-flat (a-3), proceed. Polymerization by a radical poly 5 4 radical can be carried out by a known method. 17 201207561. The polymerization of the polymer (4) of the package 4 is particularly advantageous. However, it is difficult to carry out radical polymerization using a solution solution. The poly & temperature is particularly limited by the polymerization initiator used, and is particularly limited to the range of 耽~15 generations: poly: no special mosquitoes, pass f! Hours ~ 24 hours range. Further, the edge polymerization s can be carried out under any pressure of pressure, reduced pressure or atmospheric pressure. The solvent to be used freely is preferably a solvent which can dissolve the ruthenium-based precursor and the product. The solvent may be one type or two or more types. Examples of the solvent include decyl alcohol, ethanol, "tetrahydrofuran, ethanol monoethylidene, glyceryl ether, diethoxypropionic acid ethanol, acetone, 2-butanone, ethyl acetate, propyl acetate-nitrile, dioxins. Alkane, toluene, xylene, cyclohexanone, ethyl ketone monodecyl ether, propylene glycol monoterpene ether acetate, diethylene glycol decyl ethyl ether, decyl 3-methoxypropionate, vinegar, and hydrazine , Ν-dimercaptodecylamine = a polymerization initiator used in the base polymerization, for example, a compound derived from ridge, an azobisisobutyronitrile or the like; and a peroxide initiator such as a peroxide The amount of the monomer used in the =::r is 1. The weight of the two = 1 weight loss 30 parts by weight, more preferably 5 parts by weight to 25 weight / 疋 and, in the radical polymerization, in order to adjust the molecular weight , ° ° = 3: transfer agent. The amount of chain transfer agent added relative to the formation of I: sheep, , # 1GG weight of 4 parts is preferably part by weight, more preferably 0.005 parts by weight ~ 0.03 weight里刀. 〇.05 self-exposure part in alkaline developer until dissolved maiden corpse, 18 201207561 jo^uupif when and the surface of the film during development From the viewpoint of being difficult to roughen, it is preferred that the polymer (A) having a siloxane structure has a weight average molecular weight of 1'GGG to 100, 〇〇〇. Further self-developing residue becomes extremely small from the viewpoint of 'weight The average molecular weight is more preferably 1,5 〇〇 5 〇, 〇〇〇, and even more preferably 2,000 〜 2 〇, 〇〇〇. The weight average molecular weight can be determined by GPC analysis based on polystyrene standards. For example, polystyrene having a molecular weight of 500 to 150,000 (for example, PL2010-0102 (S-M2-10) standard manufactured by Polymer Laboratories) can be used, and the tube can be used as Shodex PLgel MIXED-D (Polymer Laboratories). Manufactured, the mobile phase at the time of the measurement may be THF. The weight average molecular weight may be determined under such conditions. Further, the monomer of the polymer (A) containing a siloxane structure may be confirmed to contain ruthenium The specific structure including the ruthenium atom in the polymer (A) of the oxyalkylene structure is confirmed by a known analysis method derived from the structure of the radical polymerizable functional group, for example, by using Si-CH3 which detects 1H-NMR. Peak and It is confirmed by measuring the peak of ethylene or propylene. 1-2. 1,2-diazide compound (B) 1,2·diazide compound (B) A compound used as a photosensitizer in the field of resists. Examples of the 1,2-diazide compound include a hydroxybenzophenone compound and hydrazine, 2 benzoquinone diazide _4 sulfonic acid or 1,2- alum, diazide _5. sulfonic acid ester, hydroxy benzophenone compound and 1,2-diazepine naphthoquinone_4_sulfonic acid or L2-diazide naphthoquinone _5_sulfonate Acid ester, phenol 201207561 compound and 1,2-cracked diazide _4_sulfonic acid or l,2-benzoquinonediazide_5-supply acid ester, phenolic compound and 1,2-diazide Naphthoquinone-4-sulfonic acid or 1,2-diazepinenaphthoquinone-5-cross-acid ester, a compound in which a hydroxyl group of a phenol compound is substituted with an amine group, and a 1,2-benzene-containing diazide-4-sulfonate Acid or a 1,2-benzoquinonediazide-5-sulfonic acid ore, a phenolic compound having a hydroxyl group substituted with an amine group and hydrazine, 2_diazepinenaphthoquinone-4-sulfonic acid or 1, 2_Diazonaphthoquinone-5-protonic acid sulfonamide. Examples of the perylene diphenyl hydrazine compound include 2,3,4-trisylbenzophenone, 2,4,6-trihydroxydibenzophenone, 2,2,4,4,_tetrahydroxy phenanthrene. Phenylketone, 2,3,3',4-tetrahydroxybenzophenone, and 2,3,4,4'-tetrahydroxydibenzophenone. Examples of the phenol compound include bis(2,4-dihydroxyindolyl)decane, bis(p-phenylphenyl)methane, tris(p-phenyl)methane, and 1Λ1 tris(p-phenylene bromide, Bis(2,3,4-tridecylphenyl)-methyl, 2,2-bis(2,3,4·trihydroxyphenyl)propene, 1,1,3·3 (2,5-di Methyl 4-4 phenyl), phenylene propylene, from (10)-(10), phenyl) small methyl ethyl] phenyl] ethylene phenol, bis (2,5-dimethyl·4 _Phenylphenyl)·2-Phenylphenyl-based, for example, 3|· tetramethyl-1,1'· snail two _5,6,7,5',6,7,_ Alcohol, and tribasic•7,2,,4,-trihydroxyflavone. One base is self-raising and the composition of the silk is transparent, although it is preferable to use di-2-azide stack: two laughing sulfonic acid vinegar , 2,3,4·trihydroxybenzophenone _, and vinegar of 2 醌-5-sulfonic acid, 2,3,4, tetrahydroxydibenzopyrene 1,2-mononaphthoquinone Acid ester, 2,3,4 盥methylethyl] benzyl]ethylene] bispan and bismuth fragrant broth 201207561 Km/ self 曰, and 4,4'm[4-pyridylbenzene a group consisting of η-mercaptoethyl]phenyl]ethylidene]bisphenol and 1,2-diazide naphthoquinone-5-sulfonic acid vinegar 1-3. Other components The photosensitive composition may further contain the above-mentioned polymer (A) containing a oxoxane structure and the 1,2· bis-stuff gas compound (8) in a range in which the effects of the present invention are sufficiently obtained. The other components may be, for example, a soluble polymer (6), a solvent, an additive, and a polybasic acid-fastening needle. 1-3-1. Alkali-soluble polymer (c) Further improving the alkali solubility of the photosensitive composition From the viewpoint of easily obtaining a pattern-like permeability and improving the properties of a cured film such as solvent, high water resistance, high acidity, high hardness, and high age resistance, a photosensitive composition is preferred. Further, the substance further contains an alkali-soluble polymer (8). The hetero-polymer (c) may be of two or more kinds. Further, the "alkali-soluble" in the alkali-soluble polymer (c) means that it is to be spin-coated. The decrease of the soluble polymer (c) is as follows: a film having a thickness of 0.01 μm to 1 μmη formed by heating under the arm for 1 minute, for example, 2.38 wt% of tetradecyl hydrogen at about 25 ° C. Immersion in aqueous ammonium oxide solution 5 After the bell's cleaning by pure water, no film remains. A free radical polymer can be used in the soluble polymer (C), which is a method in which the obtained polymer has alkali solubility. 'Separating two or more kinds of radicals contained in the radical polymerizable monomer (a_2) or the radical polymerizable body (a 2) and the free silky monomer (a_3) towel 21 201207561. : Sexual early body The radical polymerization is carried out. Such a radical polymerization is considered to have a physical property of the photosensitive composition of the present invention having the use amount of the alloy (A) to obtain a desired function (C). )in. In the case where the base is soluble in the alkali-soluble polymer (C), the conjugate monomer (a-2) can be used as the free-filament property of the reduction, and the alkali solubility of the photosensitive composition can be improved. In view of the above, the monomer of the polymer (C) is one or more selected from the group consisting of (?)-acid anhydride, warp vinyl, and 4-phenylene. From the viewpoint that the self-exposed portion is in the expansive developing solution until the development time of the dissolution is appropriate and the surface of the film is difficult to be roughened at the time of development, the weight average molecular weight of the soluble polymer (C) and the stone containing the stone are preferably considered. The polymer (A) of the oxygen-oxygen structure is similarly 1, _~; from the point of view of the smear of the smear of the smear of the smear of the smear of the smear; The best is 2,000~2〇, _. Check the solubility of the polymer* (C)! The average molecular weight can be determined, for example, by Gpc analysis under the same conditions as the polymer (A) having a 7-oxo (tetra) structure. The soluble polymer (C) can be obtained, for example, by the same polymerization method as the polymer (4) containing a decane structure. Further, the monomer of the soluble polymer (C) can be estimated, for example, by measuring the gas generated by thermal decomposition by GC-MS when the alkali-soluble polymer (C) is thermally decomposed. 1-3-2. Solvent 22 201207561. o〇yO\)pii The photosensitive composition preferably further contains a solvent. The solvent is preferably a ~τ-dissolved photosensitive composition_polymer containing a oxy-combustible structure (A), a 1,2-azide g-kun compound (Β), and a soluble polymer (c) = dissolve,. Further, the solvent preferably has a boiling point of 1 〇 (rc 〜 3 〇 (the solvent of rc can be one type of solvent or two or more types. The boiling point is 10 (TC~30 (the solvent of TC is, for example, butyl acetate) Ester, propylene, acetoacetate, ethyl acetoacetate, decyl oxyacetate, ethyl oxyacetate, oxymethyl ester, methyl methoxyacetate, ethyl decyloxyacetate, decyloxyacetate ~, ethoxyacetic acid methyl ester, ethyl ethoxyacetate, 3,3-oxypropionic acid 醆曰t3.oxypropionic acid ethyl ester, 3_methoxypropionic acid methyl ester, 3_decyloxypropyl ester , 3_ethyl ethoxypropionate, ethyl 3-ethoxypropionate, 2-oxypropene = methyl, ethyl 2-oxypropionate, propyl 2-oxypropionate, 2-曱oxy oxime ester '2-methoxypropionic acid ethyl ester, 2-methoxyoxypropionic acid propyl ester, 2_B=base acid formazan, 2-ethoxypropionic acid ethyl vinegar, 2_ Ethyloxy 2-indole propionate 2厶 gas base-2·mercaptopropionate ethyl ester, decyloxy-2-methylpropionic acid methyl ester, oxy-2-methyl propionate ethyl ester, C Methyl decanoate, ethyl acetonate, propionate-, propylene sulfonate, ethyl acetacetate, ethyl acetate, ethyl 2-oxo-butoxybutyrate Oxane, ethylene glycol, diethylene glycol, triethanol propylene glycol, dipropylene glycol, tripropylene glycol, 1,4-butanediol, ethylene glycol monobutyl ether, propylene glycol mono(tetra), propylene glycol monomethyl-acid, Propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, mono-ol monobutyl ether acetate, cyclohexanone, cyclopentanone, diethylene glycol monoterpene ether, ^ ~ alcohol monoterpene ether acetate , diethylene glycol monoethyl ether, diethylene glycol monoethyl, kiln 9, monoethylene glycol monobutyl ether, monoethylene glycol monobutyl acetate, two 23 201207561. ethylene glycol diterpene ether benzene - B * a drunk diethylene, xylene, γ · butyl vinegar, bis = diol methyl ethyl ether, self-improving to form a photosensitive composition of di-diethyl acetamide. Consider, better 岐 solvent is selected Self-coating-sexual view, ether acetic acid brewing, di-diol monoethylation, shouting, propylene glycol monomethyl ethoxy propionate, vinegar mono-I: oxypropionic acid methyl vinegar, 3 · ether acetate vinegar, The consideration of the safety of the human body of the bismuth dimethyl sulfonate, the second, the acetic acid vinegar, the diethylene glycol monobutyl vinegar and the acetic acid butyl 1 : 二卜, from the monomethylhydrazine acetic acid brewing, 3_methoxypropane=疋f agent is selected from the group consisting of propylene glycol diethylene glycol methyl methacrylate, lactic acid ethyl hydrazine, 3 · ethoxy propionate ethyl vinegar, <Group> or more. &lt;Consisting of Japanese and acetic acid TS::: is a point containing 2〇Wt% or more is hidden ~ 3 (8). C = mixing of the agent. Solvent. Mixed solvent The boiling point of the solvent other than fresh c ~ war tyros can be prepared as a known solvent or two or more. 1-3-3. Additive resolution, coating uniformity, heterogeneity, and adhesion In view of the fact that the composition of the sensitized f composition and the cured film formed are further improved, it is preferred that the sensitization composition further contains an additive. The additive can be used in the field of the anti-side agent, in the photosensitive composition. Or various additives for the characteristics of the cured film. The additive may be singly or in combination of two or more. Examples of such an additive include acrylic, styrene, polyethyleneimine or polyamine I polymer dispersants, anionic, cationic, nonionic or fluorine surfactants, and oxirane resins. Coating property 24 201207561 jeyoupif Two-component hard-burning coupler special splicing improver, alkoxy benzophenone and other purple ray absorbers, aggregation inhibitors such as sodium polyacrylate, epoxy compounds, melamine compounds Or a thermal crosslinking agent such as a double azide, and an organic carboxylic acid specific solubility promoter. More specifically, the additive may, for example, be p〇ly£j〇w No. 45,

Polyflow KL-245、Polyflow No.75、Polyflow No.90、Polyflow KL-245, Polyflow No.75, Polyflow No.90,

Polyflow No.95 (以上均為商品名、共榮社化學股份有限公 司製造)、Disperbyk 161、Disperbyk 162、Disperbyk 163、 Disperbyk 164、Disperbyk 166、Disperbyk 170、Disperbyk 180、Disperbyk 181、Disperbyk 182、BYK300、BYK306、 BYK310、BYK320、BYK330、BYK344、BYK346 (以上 均為商品名、BYK-CHEMIE JAPAN K.K.製造)、KP-341、 KP-358、KP-368、KF-96-50CS、KF-50-100CS (以上均為Polyflow No. 95 (all of which are trade names, manufactured by Kyoeisha Chemical Co., Ltd.), Disperbyk 161, Disperbyk 162, Disperbyk 163, Disperbyk 164, Disperbyk 166, Disperbyk 170, Disperbyk 180, Disperbyk 181, Disperbyk 182, BYK300, BYK306, BYK310, BYK320, BYK330, BYK344, BYK346 (all of which are trade names, manufactured by BYK-CHEMIE JAPAN KK), KP-341, KP-358, KP-368, KF-96-50CS, KF-50-100CS ( All of the above

商品名、信越化學工業股份有限公司製造)、Surflon SC-101、Surflon KH-40 (以上均為商品名、AGC SEIMI CHEMICAL Co.,Ltd.製造)、Ftergent 222F、Ftergent 251、 FTX-218 (以上均為商品名、Neos股份有限公司製造)、 EFTOP EF-351、EFTOP EF-352、EFTOP EF-601、EFTOP EF-801、EFTOP EF-802 (以上均為商品名、Mitsubishi Material Co” Ltd.製造)、Megafac F-171、Megafac F-177、 Megafac F-475、Megafac R-08、Megafac R-30 (以上均為 商品名、DIC股份有限公司製造)、氟烷基苯磺酸鹽、氟烷 基羧酸鹽、氟烷基聚氧乙烯醚、氟烷基碘化銨、氟烷基甜 菜鹼、氟烷磺酸鹽、二甘油四(氟烷基聚氧乙烯醚)、氟烷 25 201207561 基一甲知:鹽、it烧基胺基續酸鹽、聚孽 聚氧乙烯辛基苯基醚、聚氧乙烯烷基醚 聚氧乙烯壬基苯基醚、 良謎、聚氧乙稀月桂喊 μ取婦油細、聚氧乙料三絲_、聚氧乙烯錄蠛基 _聚氧乙烯硬脂基ϋ、聚氧乙烯月桂酸0旨、聚氧乙婦油 ‘、聚氧乙稀硬脂酸s旨、聚氧乙烯月桂基胺、山梨糖醇 酐月桂酸醋、山梨醇肝掠櫊酸酉旨、山梨醇針硬脂酸醋、山 梨醇肝油酸醋、山梨糖醇肝脂肪酸醋、聚氧乙烯山梨糖醇 =月桂酸酯、聚氧乙烯山梨醇酐棕橺酸酯、聚氧乙烯山梨 醇酐硬脂酸酯、聚氧乙烯山梨醇酐油酸酯、聚氧乙 ^ 趟、絲苯猶鹽、以及絲二苯醚二俩鹽。較佳^ 添加劑為選自該些化合物之一種以上。 自提高感光性組成物之塗佈均一性之觀點考慮,更佳 的是添加劑為氟系界面活性劑以及矽氧樹脂系塗佈性改善 劑之一者或兩者。更具體而言,自提高感光性組成物之塗 佈均一性之觀點考慮,更佳的是添加物為選自由氟烷基苯 礦自文鹽、氣烧基叛酸鹽、氣烧基聚氧乙稀趟、敗烧基換化 知、氟烧基甜菜驗、氟烧績酸鹽、二甘油四(氣烧基聚氧乙 稀喊)、氟貌基三曱銨鹽、氟烧基胺基績酸鹽、;BYK306、 BYK344、BYK346、KP-341、KP-358、以及 κρ-368 所構 成之群組之一種以上。 1-3-4.多元羧酸酐 自提兩由具有壤氧基之感光性組成物所形成之硬化膜 之耐熱性以及耐化學品性的觀點,以及防止由於保存時 1,2-二疊氮醌化合物(B)之分解所造成的感光性組成物著 26 201207561f 色之親點考慮,較佳的是感紐組成物進含有多元幾 酸肝二多ΐ紐酐可糾加熱而與具有環氧基之感光性組 成物中之環氧基反應。多元舰酐可為—種亦可為兩種以 上。多疋紐if例如可列舉偏苯三f料、鄰苯二甲酸針、 以及4_甲基祕酸酐。多元軸⑰中較佳的是 偏苯三甲酸酐。 1-4·感光性組成物中之各成分之含量 自表現出硬化膜之撥液性之觀點考慮,感光性組成物 中之包含矽氧烷結構之聚合物(A)之含量較佳的是2〇 wt% 〜80 wt%,更佳的是3〇 wt〇/o〜7〇 wt%,進〆步更佳的是 40 wt% 〜60 wt%。 自於硬化膜中形成精細之圖案之觀點考慮,感光性組 成物中之1,2-二疊氮醌化合物(B)之含量相對於包含矽 氧烧結構之聚合物(A)以及驗可溶性聚合物(c)之合計 量100重量份而言較佳的是5重量份〜5〇重量份,更佳的 是10重量份〜40重量份,進一步更佳的是15重量份〜3〇 重量份。 於感光性組成物中,自充分表現鹼可溶性之提高效果 之觀點考慮,於將包含矽氧烷結構之聚合物(A)之含量 設為100重量份時,驗可溶性聚合物(c)之含量較佳的 是20重量份〜150重量份’更佳的是50重量份〜12〇重量 份,進一步更佳的是70重量份〜1〇〇重量份。 自提高感光性組成物之塗佈均一性之觀點考慮’以及 自對人體之安全性之觀點考慮,較佳的是感光性組成物中 27 201207561. JO^UV/pif 之溶劑之含量是感光性組成物中之所有固體成分之含 為5 wt%〜50 wt%之量,更佳的是成為1〇 wt%〜45加%之 量,進一步更佳的是成為15 wt%〜4〇 wt。/。之量。 自賦予以及提域紐喊物以及硬⑽之特性的觀 點考慮,感光性組成物中之添加劑之含量相對於 烧結構之聚合物⑷以及驗可溶性聚合物(c)m^ 100重量份而言較佳的是0.01重量份叫重量份^佳= 是了重,份〜α7重量份,進1更佳的是⑽5重 〜U.5篁置份。 自提高上述魏膜之雜以騎域紐組成 之觀點考慮,感光性組錢巾0元紐社 包含石夕魏結構之聚合物⑷以及驗可溶性聚合物 之合计Η 100重量份而言較佳的是!重量份〜3〇重量份, 更佳的是2重量份〜2G重量份,進—步更 〜15重量份。 J疋)更重伤 1-5.感光性組成物之保存 自穩定地保韻紐組成物之触 =於===產- 2.本發明之硬化膜 本發明之硬化膜可藉由對上述本發 之膜進行職峨。總鳩 === 以下之小孔的絕緣膜。此處,所謂絕緣膜例如是指用以使 28 201207561. jo^uupif 配置為層狀之配線間絕緣而設置之膜(層間絕緣膜)卓β 透明膜以及絕緣膜等之硬化膜可藉由於抗钮劑領域中 形成硬化膜之通常方法而形成,例如可以下述方式而形成。 首先,形成感光性組成物之膜。感光性組成物之膜可 藉由旋塗、棍塗、狹缝塗佈等公知之方法而將感光性組成 物塗佈於玻璃等基板上而形成。較佳之塗佈方法例如可列 舉旋塗、輥塗、狹縫塗佈。基板例如可列舉白板玻璃、青 板玻璃、二氧化矽塗層青板玻璃等透明玻璃基板,聚碳酸 酯、聚醚砜、聚酯、丙烯酸樹脂、氯乙烯樹脂、芳香族聚 醯胺樹脂、聚醯胺醯亞胺、聚醯亞胺等合成樹脂製薄板、 薄膜或基板,鋁板、銅板、鎳板、不鏽鋼板等金屬基板, 其他陶瓷板,具有光電轉換元件之半導體基板等。於該些 基板上’可視需要而進行矽烷偶合劑等之化學處理、電聚 處理、離子電鍍、濺鍍、氣相反應法、真空蒸鍍等預處理。 其次,對感光性組成物之膜進行乾燥。感光性組成物 之膜例如可藉由加熱板或烘箱對具有感光性組成物之膜的 基板進行加熱而使其乾燥。通常於60。(:〜120。(:下進行1 分鐘〜5分鐘之乾燥。 ’、尺’丨隔所期望之圖案形狀之遮罩而對乾燥之感光 性組成物之朗射放麟。對感級組成物之膜的放射線 f ϊϋ ’例如可11由介隔遮罩而對基板上之乾燥之感光性 :中之。照射條件根據感光性組成 丄=類而定,例如感光性組成物含有u-二 。勿(Β),因此i線適當的是5 mJ/cm2〜1,〇〇〇 29 201207561, mJ/cm2。另外’於形成不具有圖案之硬化膜之情形時,無 須該放射線之照射步驟。 其次,藉由顯影液洗滌照射了放射線之感光性組成物 之膜而進行顯影。照射了放射線之感光性組成物之膜中的 1,2-二疊氮醌化合物(B)迅速成為茚羧酸而成為溶解於顯 影液中之狀態。藉由該顯影,膜中之被放射線照射之部分 迅速溶解於顯影液中。顯影方法並無特別限定,可使用浸 潰顯影、浸置式顯影、噴淋顯影等公知之方法之任意種。 另外,於形成未具有圖案之硬化膜之情形時,亦無須該顯 影步驟。 ° 顯影液較佳的是鹼溶液。顯影液可適宜使用鹼之水溶 液。鹼溶液+所含有之驗例如可列舉四甲基氫氧化敍、四 ^基氫氧化銨、2·紅基三甲基氫氧化銨、魏鈉、碳酸 ^納、碳_、碳酸氫鉀、氫氧化鈉、以及氫氧化卸。較 影液更具體而言可列舉:四甲基氫氧化録、四乙基 :=銨、二2·經乙基三甲基氫氧化録 ^二及碳_'氫氧化納'或氫氧化鉀等無機二 嘛iri低顯影絲或實現圖_狀之適當化,亦可於 性劑。於該些_,特別是若添加非=之界面活 峻,則自提高解析度之觀點而士較佳糸之5^乙稀坑基 其次,對顯影之膜進行清I膜之清洗例如可藉由純 30 201207561, 水而對膜與基板一同進行充分洗濯而進行。 其次,對所清洗之膜之前面照射放射線。藉由該放射 線之照射而使殘餘之1,2-二疊氮醌化合物去活化。 作為該放射線之照射,例如於放射線為紫外線之情形時, 藉由以100mJ/cm2之曝光量對膜照射 線而進行。 、 其次,對騎了放射線之難行煅燒而獲得硬化膜。 該膜之煅燒例如可藉由如下之方式之 :於⑽。C〜職下加熱丨0分鐘〜12〇分鐘。藉= 驟,獲得硬化膜而作為所駿之圖案化之透明膜。 膜!^ Γ Γ獲狀圖案狀透明膜亦可用作圖案狀絕緣 =於邑緣膜上所形成之孔之形狀,於自 =交佳的是正方形、長方形、圓形或橢圓形:;外 後緣成透明電極,藉由钱刻而進行圖案化 ίΓ 膜。該絕緣膜之而«鑛性高,因 的透明=極亦不於絕_上產生皺折,可保持高 3.本發明之顯示元件 元件之硬化膜。顯示 外,具===途中使用本發明之硬化膜以 元件同樣地製^ m-^同樣之構成,可與公知之顯示 樣崎造。顯不元件例如可使如上所述那樣於基板 201207561t 上具有㈣狀魏朗元件麵 遽光片基板對準預先於各基板上所二彩色 而將基板以外之其他部件組合進: 二=晶,將注入口密封,藉此而製作為液 於液晶顯示元件之製造中,液晶 進行:於元件基板上散布液晶後,使二“:: 色遽先片基板重合,以液晶不漏出之方式加以密封。顯^ 兀件亦可為如此而製作之液晶顯示元件。 · 液晶、亦即液晶化合物以及含有其之組成物並無特別 限疋’可使用任意之液晶化合物以及液晶組成物。 本發明之感光性組成物例如可形成具有對於圖案化透 明膜以及絕緣膜所通常要求之細溶舰、高耐水性、高 耐酸性、高耐鹼性、高耐熱性、高透明性、盥 性等各種特性,且撥液性優異之硬化膜。_ 而且,本發明之感光性組成物除了上述之高撥液性、 耐UV臭氧灰化性以外,關於顯影性、耐化學品性、以及 雄、接性等作為抗蝕劑劑材料所要求之通常特性,亦具有作 為抗蝕劑劑材料而言至少充分之性能。因此,本發明之感 光性組成物可形成除撥液性以外,圖案形成性亦優異之硬 化膜。而且,該膜可用作透明膜、絕緣膜或保護膜,因此 可作為顯示元件而使用。 本發明之硬化膜由本發明之感光性組成物而形成,因 此即使於溶劑、酸、鹼溶液等中受到浸潰、接觸、熱處理 32 201207561 yjpif ^oyyj 等處理亦難以產生表面粗糙。因此,太雜 硬化膜中之光透射率高,可獲得高顯示元件的 而且,本發明之硬化膜由感光性級成物 撥液性優異,於顯示元件之製造過程中,防止因此 膜之圖案(開π部)的液狀材料附著於圖案以化 而且該附著之所期望之紐料向開 。15刀 效率良好地獲得所期望之性能的顯示 此^ 之生產性之進一步提高。 4待顯不兀件 [實例] 以:,藉由實例對本發明進一步加以 並不限定於該些實例。 明Trade name, manufactured by Shin-Etsu Chemical Co., Ltd.), Surflon SC-101, Surflon KH-40 (all of which are manufactured by AGC SEIMI CHEMICAL Co., Ltd.), Ftergent 222F, Ftergent 251, FTX-218 (above) All are trade names, manufactured by Neos Co., Ltd.), EFTOP EF-351, EFTOP EF-352, EFTOP EF-601, EFTOP EF-801, EFTOP EF-802 (all of which are manufactured under the trade name, Mitsubishi Material Co. Ltd.). ), Megafac F-171, Megafac F-177, Megafac F-475, Megafac R-08, Megafac R-30 (all of which are trade names, manufactured by DIC Corporation), fluoroalkylbenzenesulfonate, halothane Carboxylic acid salt, fluoroalkyl polyoxyethylene ether, fluoroalkyl ammonium iodide, fluoroalkyl betaine, fluoroalkane sulfonate, diglycerol tetrakis(fluoroalkyl polyoxyethylene ether), halothane 25 201207561 A Jiazhi: salt, it burns amine sulfonate, polyfluorene polyoxyethylene octyl phenyl ether, polyoxyethylene alkyl ether polyoxyethylene nonyl phenyl ether, good mystery, polyoxyethylene laurel μ take the fine oil of women's oil, polyoxyethylene three wire _, polyoxyethylene recording 蠛 _ polyoxyethylene stearyl hydrazine, polyoxyethylene酸酸0的,聚氧乙妇油', polyoxyethylene stearic acid s, polyoxyethylene laurylamine, sorbitan lauric acid vinegar, sorbitol liver citrate, sorbitol needle hard Fatty acid vinegar, sorbitol liver vinegar, sorbitol liver fatty acid vinegar, polyoxyethylene sorbitol = laurate, polyoxyethylene sorbitan palmitate, polyoxyethylene sorbitan stearate, a polyoxyethylene sorbitan oleate, a polyoxyethylene oxime, a silk benzene salt, and a silk diphenyl ether salt. Preferably, the additive is one or more selected from the group of compounds. In view of coating uniformity, it is more preferable that the additive is one or both of a fluorine-based surfactant and a silicone resin-based coating property improving agent. More specifically, the coating of the photosensitive composition is improved. From the viewpoint of uniformity of cloth, it is more preferable that the additive is selected from the group consisting of a fluoroalkyl benzene ore self-salt salt, a gas-burning acid salt, a gas-burning polyoxyethylene sulfonium, a smoldering base, a fluorocarbon Base beet test, fluorine calcination acid salt, diglycerin four (gas-fired polyoxyethylene shunt), fluorine-like triammonium , fluoroalkylamine base acid salt; one or more groups of BYK306, BYK344, BYK346, KP-341, KP-358, and κρ-368. 1-3-4. From the viewpoints of heat resistance and chemical resistance of a cured film formed of a photosensitive composition having a soil oxygen, and prevention of photosensitivity caused by decomposition of the 1,2-diazide compound (B) during storage The composition is considered to be in the color of the photosensitive composition of the epoxy group, and it is preferable to react with the epoxy group in the photosensitive composition having the epoxy group. . The multiple ship anhydride may be of one type or two or more types. Examples of the polyindole may include a trimellitic material, a phthalic acid needle, and a 4-methylic acid anhydride. Preferred among the plural axes 17 is trimellitic anhydride. 1-4. The content of each component in the photosensitive composition is preferably from the viewpoint of exhibiting the liquid repellency of the cured film, and the content of the polymer (A) containing a siloxane structure in the photosensitive composition is preferably 2 〇 wt% ~ 80 wt%, more preferably 3 〇 wt 〇 / o ~ 7 〇 wt%, more advanced steps are 40 wt% ~ 60 wt%. From the viewpoint of forming a fine pattern in the cured film, the content of the 1,2-diazide ruthenium compound (B) in the photosensitive composition is relative to the polymer (A) containing the yttrium-oxygen structure and the soluble polymerization. The total amount of the component (c) is preferably 5 parts by weight to 5 parts by weight, more preferably 10 parts by weight to 40 parts by weight, still more preferably 15 parts by weight to 3 parts by weight. . In the photosensitive composition, the content of the soluble polymer (c) is determined when the content of the polymer (A) containing a siloxane structure is 100 parts by weight from the viewpoint of sufficiently exhibiting an effect of improving alkali solubility. It is preferably 20 parts by weight to 150 parts by weight 'more preferably 50 parts by weight to 12 parts by weight, still more preferably 70 parts by weight to 1 part by weight. From the viewpoint of improving the uniformity of coating of the photosensitive composition, and from the viewpoint of safety of the human body, it is preferable that the photosensitive composition is 27 201207561. The content of the solvent of JO^UV/pif is photosensitive. The content of all the solid components in the composition is from 5 wt% to 50 wt%, more preferably from 1 wt% to 45 wt%, still more preferably from 15 wt% to 4 wt%. /. The amount. The content of the additive in the photosensitive composition is higher than that of the polymer (4) and the soluble polymer (c) m^100 parts by weight of the composition and the characteristics of the hard (10). Preferably, 0.01 parts by weight is called part by weight = it is heavy, and the part is ~α7 parts by weight, and more preferably (10) 5 parts by weight to 9.5 parts. From the viewpoint of improving the composition of the above-mentioned Wei film, it is preferable that the photosensitive group money towel 0 yuan New Society contains the polymer of the Shi Xiwei structure (4) and the total of the soluble polymer is 100 parts by weight. Yes! The parts by weight are 3% by weight, more preferably 2 parts by weight to 2 parts by weight, more preferably 15 parts by weight. J疋) More serious injury 1-5. Preservation of photosensitive composition Self-stabilizing the touch of the composition of the rhyme composition ====Production - 2. Curing film of the present invention The cured film of the present invention can be obtained by the above Hair film for the job. Total 鸠 === The insulating film of the small holes below. Here, the insulating film is, for example, a film (interlayer insulating film) which is provided for insulating the wiring between the layers of the layered wiring, and the cured film of the insulating film or the like can be used as an anti-corrosion film. It is formed by a usual method of forming a cured film in the field of a button, and can be formed, for example, in the following manner. First, a film of a photosensitive composition is formed. The film of the photosensitive composition can be formed by applying a photosensitive composition onto a substrate such as glass by a known method such as spin coating, stick coating or slit coating. A preferred coating method can be, for example, spin coating, roll coating, or slit coating. Examples of the substrate include transparent glass substrates such as white glass, blue glass, and ceria coated green glass, and polycarbonate, polyethersulfone, polyester, acrylic resin, vinyl chloride resin, aromatic polyamide resin, and poly A synthetic resin sheet such as amidoxime or polyimine, a film or a substrate, a metal substrate such as an aluminum plate, a copper plate, a nickel plate or a stainless steel plate, and another ceramic plate, a semiconductor substrate having a photoelectric conversion element. On these substrates, a chemical treatment such as a decane coupling agent, electropolymerization treatment, ion plating, sputtering, gas phase reaction, vacuum vapor deposition or the like may be performed as needed. Next, the film of the photosensitive composition is dried. The film of the photosensitive composition can be dried, for example, by heating a substrate having a film of a photosensitive composition by a hot plate or an oven. Usually at 60. (:~120. (:: 1 minute to 5 minutes of drying. ', ruler' is the mask of the desired pattern shape and the dry photosensitive composition is applied. The radiation f ϊϋ ' of the film may be, for example, a photosensitive film which is separated from the substrate by a mask. The irradiation condition depends on the photosensitive composition , =, for example, the photosensitive composition contains u-two. (Β), so the i-line is suitably 5 mJ/cm2~1, 〇〇〇29 201207561, mJ/cm2. In addition, when the cured film having no pattern is formed, the irradiation step of the radiation is not required. The film of the photosensitive composition irradiated with the radiation is washed by the developer to develop the film. The 1,2-diazide compound (B) in the film of the photosensitive composition irradiated with radiation rapidly becomes a ruthenium carboxylic acid. In the state of being dissolved in the developing solution, the portion irradiated with the radiation in the film is rapidly dissolved in the developing solution. The developing method is not particularly limited, and known methods such as dipping development, dip development, and shower development can be used. Any of the methods. In the case of forming a cured film having no pattern, the development step is not required. ° The developer is preferably an alkali solution. The developer may be suitably used as an aqueous solution of alkali. Hydrogen oxyhydroxide, tetrahydroammonium hydroxide, 2·erythryl trimethylammonium hydroxide, Wei sodium, sodium carbonate, carbon _, potassium hydrogencarbonate, sodium hydroxide, and hydroxide are unloaded. Specifically, it may be exemplified by tetramethyl hydroxide, tetraethyl:=ammonium, di- 2, ethyltrimethyl hydroxide, bis- and carbon _'sodium hydroxide or potassium hydroxide. The iri low-developing silk or the realization of the figure-like shape can also be used as a sexual agent. In these _, especially if the interface of adding non-= is active, the viewpoint of improving the resolution is better. Next, the cleaning of the film to be developed is carried out by, for example, washing the film with the substrate by pure 30 201207561, water, and then irradiating the surface of the film to be cleaned. Residual 1,2-diazide ruthenium compound is deactivated by irradiation of the radiation. Irradiation of the radiation, for example, when the radiation is ultraviolet light, is performed by irradiating the film with an exposure amount of 100 mJ/cm 2 . Next, it is difficult to perform calcination on the radiation to obtain a cured film. It can be obtained by heating the crucible for 10 minutes to 12 minutes in (10). C~. By using the step, the cured film is obtained as a transparent film patterned by Jun. Film!^ Γ Capture pattern The transparent film can also be used as a pattern-like insulation = the shape of the hole formed on the edge film, which is square, rectangular, circular or elliptical in shape: the outer trailing edge is a transparent electrode, The film is engraved and patterned. The insulating film has a high minerality, and the transparent film is not wrinkled, and can be kept high. 3. The cured film of the display element device of the present invention. In addition, the use of the cured film of the present invention in the same manner as in the display is similar to that of the element, and can be similarly known to the display. For example, as described above, the display element can be formed on the substrate 201207561t with the (four)-shaped Weilang element surface slab substrate aligned with the two colors previously formed on each substrate to combine other components other than the substrate: The injection port is sealed, whereby liquid is produced in the manufacture of the liquid crystal display element, and the liquid crystal is performed by dispersing the liquid crystal on the element substrate, and then the two ":: color 遽 first substrate are superposed, and the liquid crystal is not leaked. The liquid crystal display element can be produced as such. The liquid crystal, that is, the liquid crystal compound and the composition containing the same are not particularly limited. Any liquid crystal compound and liquid crystal composition can be used. The composition can be formed, for example, with various properties such as a fine-dissolving ship which is generally required for a patterned transparent film and an insulating film, high water resistance, high acid resistance, high alkali resistance, high heat resistance, high transparency, and enthalpy, and A cured film excellent in liquid repellency. Further, the photosensitive composition of the present invention has developability and chemical resistance in addition to the above-described high liquid repellency and UV ozone ashing resistance. The general characteristics required for the properties of the resist, the male, the bismuth, etc., also have at least sufficient performance as a resist material. Therefore, the photosensitive composition of the present invention can form a liquid-repellent property. Further, the cured film is excellent in pattern formability. Further, since the film can be used as a transparent film, an insulating film or a protective film, it can be used as a display element. The cured film of the present invention is formed of the photosensitive composition of the present invention. Therefore, even in a solvent, an acid, an alkali solution or the like, it is difficult to produce surface roughness by being subjected to treatment such as impregnation, contact, heat treatment, etc. Therefore, the light transmittance in the too hardened film is high, and a high display element can be obtained. Further, the cured film of the present invention is excellent in liquid repellency of the photosensitive grade product, and prevents the liquid material of the pattern (open π portion) of the film from adhering to the pattern during the manufacturing process of the display element. The desired material is opened upwards. The 15 knives are able to obtain the desired performance efficiently, and the productivity of this product is further improved. 4 Waiting for the display [Example] To: The invention is further exemplified by the examples and is not limited to the examples.

[合成例1]包含矽氧烷結構之聚合物(A 於附有勝機之4口燒瓶中裝人作為 乙二醇甲基乙基峻,另一方面,llg之二乙二二 基驗中以下述之重量而混合作為白 土 作為自由基聚合性單體(a·1) 之式(1-1)所表不之α,ω,3_曱基丙婦醯 Ιί:Γ: iOTSS〇 C〇RP〇™ ΡΜ;7Π: 數篁平Un’_)、作為自由基聚合性 之4-經基苯基乙婦基酮、作為自由基聚合性單體㈤)之 甲基丙稀酸縮水甘油酯、3·甲基丙烯醯 ^聚言,之2,2,_卿甲心^ S曰’將所狀混合额以丨小軸加 :中的溶劑中,於滴加後,於靴下夺進為一步力^ 33 201207561. JO^UUjjif 二乙二醇甲基乙基趟 -ν' 广 1 1、 11 .〇 g 夕氧二(M)之α,ω-雙(3-甲基丙烯醯氧基丙基)聚二曱基 0.675 g 6.075 g 2.025 g 4.725 g 2.025 g 3- 曱基丙烯醯氧基丙基三甲氧基矽烷 4- 經基苯基乙婦基酮 曱基丙烯酸縮水甘油酯 2,2 -偶氮雙(2-曱基丙酸g旨)二曱酉旨 [化 11] }—c—〇—Qh6—[Synthesis Example 1] A polymer comprising a decane structure (A was charged as a glycol methyl ethyl sulphate in a 4-necked flask equipped with a win, and on the other hand, llg of the bis-diethyl group was tested below The weight is described as a mixture of white earth as a radical polymerizable monomer (a·1), which is represented by the formula (1-1), α, ω, 3 曱 丙 丙 醯Ι Γ: Γ: iOTSS 〇 C 〇 RP 〇TM ΡΜ;7Π: 篁平 Un'_), 4-carbophenyl ketone as a radical polymerizable, glycidyl methacrylate as a radical polymerizable monomer (5), 3·Methyl propylene 醯 ^聚言, 2, 2, _ Qing A heart ^ S 曰 ' Add the amount of the mixture to the small axis: in the solvent, after the drop, take a step under the boot力^ 33 201207561. JO^UUjjif Diethylene glycol methylethyl 趟-ν' 广1 1,11 .〇g oxime (M) of α,ω-bis(3-methylpropenyloxypropane Poly) fluorenyl 0.675 g 6.075 g 2.025 g 4.725 g 2.025 g 3-decyl propylene methoxy propyl trimethoxy decane 4-phenyl phenyl keto keto thioglycol 2, 2 - Azobis(2-mercaptopropionic acid g) 1] }—c—〇—Qh6—

^Ηβ—〇 C II 〇^Ηβ—〇 C II 〇

ch3 將所得之反應液冷卻至室溫,獲得不含2,2,_偶氮雙(2_ 曱基丙酸酯)二曱酯之包含矽氧烷結構之聚合物(A1)的 33.3 wt%溶液。對反應液之一部分進行取樣,藉由gpc分 析(聚苯乙烯標準)而測定重量平均分子量》其結果,包 含矽氧烷結構之聚合物(A1)之重量平均分子量為4 〇〇〇。 [合成例2]包含矽氧烷結構之聚合物(A2)之合成 以下述重量使用下述成分而調製所述混合溶液,與合 成例1同樣地進行聚合。 二乙二醇甲基乙基醚 ll.Og 式(1-1)之α,ω-雙(3-曱基丙烯醯氧基丙基)聚二甲基 矽氧烷 0.675 g N-環己基馬來醯亞胺 4.725 g 34 201207561 joyoupif 4.725 g 3.375 g 2.025 g 得不含2,2,-偶氮雙(2_ 曱基丙烯酸二環戊基 甲基丙烯酸 2,2’-偶氣雙(2-曱基丙酸g旨)二甲酉旨 將所得之反應液冷卻至室溫,獲#小含2,2,_ 曱基丙酸自旨)二甲δ旨之包含發氡烧結構之聚合物(A2)的 33.3 Wt%溶液。對反應液之一部分進行取樣,藉由Gpc分 析(聚苯乙稀標準)而測定重量平均分子量。其纟士果包 3石夕氧烧結構之聚合物(A2)之重量平均分子量為3 1〇〇。 [合成例3]鹼可溶性聚合物(ci)之合成 使用式(3-1)所表示之α·丁基_ω·(3_曱基丙稀醯氧基 丙基)聚二甲基矽氧烷(CHISSO CORPORATION製造之 FM071卜數量平均分子量:woo)而代替α,ωκ3_甲基 丙烯醯氧基丙基)聚二甲基矽氧烷,以下述重量使用下述成 分而調製所述混合溶液,與合成例1同樣地進行聚合。 二乙二醇曱基乙基醚 ll.og 式(3-1)之α-丁基-ω_(3-曱基丙烯醯氧基丙基)聚&gt;^ 基矽氧烷 0.27 g 3·甲基丙烯醯氧基丙基三曱氧基矽烷 6.48 S 4-羥基苯基乙烯基酮 1.35 g 曱基丙稀酸縮水甘油酯 5.40 β 2,2’-偶氮雙(2-甲基丙酸酯)二甲酯 2.025 g [化 12] ch3Ch3 The resulting reaction solution was cooled to room temperature to obtain a 33.3 wt% solution of a polymer (A1) containing no oxoane structure containing no dimethyl 2,2,-azobis(2- mercaptopropionate) dinonyl ester. . A part of the reaction liquid was sampled, and the weight average molecular weight was measured by gpc analysis (polystyrene standard). As a result, the weight average molecular weight of the polymer (A1) containing the siloxane structure was 4 Å. [Synthesis Example 2] Synthesis of polymer (A2) containing a siloxane structure The mixed solution was prepared by using the following components under the following weight, and polymerization was carried out in the same manner as in Synthesis Example 1. Diethylene glycol methyl ethyl ether ll. Og α,ω-bis(3-mercapto propylene methoxypropyl) polydimethyl methoxy oxane of formula (1-1) 0.675 g N-cyclohexyl horse醯iimide 4.725 g 34 201207561 joyoupif 4.725 g 3.375 g 2.025 g Free 2,2,-azobis(2_ mercaptobutyl dicyclopentyl methacrylate 2,2'-even gas double (2-曱) Glycolic acid g) Dimethyl hydrazine is obtained by cooling the obtained reaction liquid to room temperature, and obtaining a polymer containing a cerium-burning structure (a small amount of 2,2,- methoxypropionic acid) A3) 33.3 Wt% solution. A part of the reaction liquid was sampled, and the weight average molecular weight was measured by Gpc analysis (polystyrene standard). The weight average molecular weight of the polymer (A2) of the gentleman's fruit packet 3 stone-oxygen structure is 31 〇〇. [Synthesis Example 3] Synthesis of alkali-soluble polymer (ci) Using α·butyl _ω·(3_mercaptopropyloxypropyl) polydimethyl oxime represented by the formula (3-1) Alkane (FM071, manufactured by CHISSO CORPORATION, number average molecular weight: woo) instead of α,ωκ3_methacryloxypropyl)polydimethyloxane, and the mixed solution was prepared by using the following components under the following weights; Polymerization was carried out in the same manner as in Synthesis Example 1. Diethylene glycol decyl ethyl ether ll.og Formula (3-1) α-butyl-ω_(3-mercapto propylene methoxypropyl) poly&gt;^ oxooxane 0.27 g 3·A Propylene methoxy propyl trimethoxy decane 6.48 S 4-hydroxyphenyl vinyl ketone 1.35 g thioglycolic acid glycidyl ester 5.40 β 2,2'-azobis(2-methylpropionate Dimethyl ester 2.025 g [Chemical 12] ch3

H2C=C-C-0-CH2CH2CH ο / c 、r ch3.H2C=C-C-0-CH2CH2CH ο / c , r ch3.

i-〇V CH3/n CH3i-〇V CH3/n CH3

Si—C4H9 CH3 (3-1) 35 201207561Si-C4H9 CH3 (3-1) 35 201207561

x]I 將所得之反應液冷卻至室溫,獲得不含2,2,_偶氮雙(2_ 甲基丙酸酯)二甲酯之鹼可溶性聚合物(C1)之33 3 wt% 溶液。對反應液之一部分進行取樣,藉由GPC分析(聚苯 乙歸標準)而測定重量平均分子量。其結果,鹼可溶性聚 合物(C1)之重量平均分子量為2,8〇〇。 [合成例4]鹼可溶性聚合物(C2)之合成 以下述重量使用下述成分而調製所述混合溶液,與合 成例1同樣地進行聚合。 ~ 二乙二醇曱基乙基醚 11Qg 0.675 g 6.075 g 2.025 g 4.725 g 2.025 g 式(3-1)之α-丁基-ω-(3-甲基丙烯醯氧基丙基)聚二曱 基矽氧烷 3- 甲基丙烯醯氧基丙基三甲氧基石夕燒 4- 羥基苯基乙烯基酮 甲基丙烯酸縮水甘油酯 2,2'-偶氮雙(2-曱基丙酸酯)二曱酯 將所得之反應液冷卻至室溫,獲得不含2,2,-偶氛雙(2- 甲基丙酸δ旨)二曱S旨之驗可溶性聚合物(C2)之33.3 wt% 各液^對反應液之一部分進行取樣,藉由GPC分析(聚苯 己埽標準)測定重量平均分子量。其結果,鹼可溶性聚合 物(C2)之重量平均分子量為3,5〇〇。 [合成例5]鹼可溶性聚合物(C3)之合成 以下述重量使用下述成分而調製所述混合溶液,與合 成例1同樣地進行聚合。 二乙二醇曱基乙基醚 U.Og 36 201207561. 式(3-1)之α-丁基-c〇-(3-曱基丙烯醯氧基丙基)聚二曱 0.675 g 4.725 g 4.725 g 3.375 g 2.025 g 基矽氧烷 N-環己基馬來醯亞胺 曱基丙烯酸二環戊基酯 曱基丙烯酸 2,2’-偶氮雙(2-曱基丙酸酯)二曱酯 將所得之反應液冷卻至室溫,獲得不含2,2,-偶氮雙(2-曱基丙酸酯)二曱酯之鹼可溶性聚合物(C3)之33.3 wt% 溶液。對反應液之一部分進行取樣,藉由GPC分析(聚苯 乙烯標準)而測定重量平均分子量。其結果,鹼可溶性聚 合物(C3)之重量平均分子量為2,8〇〇。 [合成例6]驗可溶性聚合物(C4)之合成 以下述重量使用下述成分而調製所述混合溶液,與合 成例1同樣地進行聚合。 二乙二醇〒基乙基醚 ll.Og N-環己基馬來酿亞胺 4.725 g 曱基丙烯酸二環戊基酯 5.400 g 甲基丙烯酸 3.375 g 2,2'-偶氮雙(2-甲基丙酸酯)二曱酯 2.025 g 將所得之反應液冷卻至室溫,獲得;f含2,2'-偶氮雙(2-曱基丙酸酯)二曱酯之驗可溶性聚合物(C4)之33.3 wt〇/〇 溶液。對反應液之一部分進行取樣,藉由GPC分析(聚苯 乙烯標準)測定重量平均分子量。其結果,驗可溶性聚合 物(C4)之重量平均分子量為2,8〇〇。 37 201207561 [比較合成例1]包含矽氧烷結構之聚合物(m、 之合 成 以下述重量使用下述成分而調製所述混合溶液, 合溶液之滴下時以及其後之反應中的4 口燒瓶中之、、容將成 溫度設為90。(:,除此以外與合成例1同樣地進行聚劑的 ll.o g 6.75 g 1.35 g 5.4〇g 2.025 g 二乙二醇曱基乙基醚 σ 3- 曱基丙烯醯氧基丙基三甲氧基矽烷 4- 羥基苯基乙烯基酮 甲基丙烯酸縮水甘油酯 2,2'-偶氮雙(2-曱基丙酸酯)二甲酯 _ 將所得之反應液冷卻至室溫’獲得不含2,2,_偶 甲基丙酸酯)二甲酯之包含矽氧烷結構之聚合物之 33.3 wt%溶液。對反應液之一部分進行取樣,藉由Gpc分 析(聚苯乙烯標準)測定重量平均分子量。其結果,包^ 矽氧烷結構之聚合物(D1)之重量平均分子量為2,7〇〇。 [實例1] [正型感光性組成物之製造] 將合成例1中所得之共聚物(A1)、合成例6中所得 之共聚物(C4 )、作為u•二疊請化合物之 4,4-[1-[4-[1-[4-經基苯基甲基乙基]苯基]亞乙基]雙酚 與〇1,2-一疊氮萘醌_5_磺醯氣之縮合物(平均酯化率為 =%、以下稱為「PAD」)、作為添加 界面 7綱(商品名™咖_ JAPANK.K•、以下心 &lt;、’、BYK344」)、作為溶劑之二乙二醇曱基乙基醚以下述 38 201207561. 重量進行混合溶解,獲得固形物濃度為3 5 w t%之正型感光 性組成物1。 〜 一乙二醇甲基乙基蜮 〇 451 g 包含矽氧烷結構之聚合物(A1)之33.3wt%溶液 3.00 g 3.00 g 0.400 g 0.007 gx]I The obtained reaction solution was cooled to room temperature to obtain a 33 3 wt% solution of an alkali-soluble polymer (C1) containing no dimethyl 2,2,-azobis(2-methylpropionate). A portion of the reaction solution was sampled, and the weight average molecular weight was determined by GPC analysis (polyphenylene standard). As a result, the weight average molecular weight of the alkali-soluble polymer (C1) was 2,8 Å. [Synthesis Example 4] Synthesis of alkali-soluble polymer (C2) The mixed solution was prepared by using the following components under the following weight, and polymerization was carried out in the same manner as in Synthesis Example 1. ~ Diethylene glycol decyl ethyl ether 11Qg 0.675 g 6.075 g 2.025 g 4.725 g 2.025 g α-butyl-ω-(3-methylpropenyloxypropyl) polydifluorene of formula (3-1) 3-oxomethoxy-3-methoxy methoxysulfate 4-hydroxyphenyl vinyl ketone glycidyl 2,2'-azobis(2-mercaptopropionate) Diterpene ester The resulting reaction solution was cooled to room temperature to obtain 33.3 wt% of the soluble polymer (C2) which was free of 2,2,-ocean bis(2-methylpropionic acid δ) Each of the solutions was sampled, and the weight average molecular weight was determined by GPC analysis (polyphenylene hydride standard). As a result, the weight average molecular weight of the alkali-soluble polymer (C2) was 3,5 Å. [Synthesis Example 5] Synthesis of alkali-soluble polymer (C3) The mixed solution was prepared by using the following components under the following weight, and polymerization was carried out in the same manner as in Synthesis Example 1. Diethylene glycol decyl ethyl ether U.Og 36 201207561. α-butyl-c〇-(3-mercapto propylene methoxypropyl) polydifluorene of formula (3-1) 0.675 g 4.725 g 4.725 g 3.375 g 2.025 g 矽 矽 N N-cyclohexylmaleimide hydrazide dicyclopentyl acrylate methacrylic acid 2,2'-azobis(2-mercaptopropionate) dinonyl ester The resulting reaction solution was cooled to room temperature to obtain a 33.3 wt% solution of an alkali-soluble polymer (C3) containing no 2,2,-azobis(2-mercaptopropionate) dinonyl ester. A part of the reaction liquid was sampled, and the weight average molecular weight was measured by GPC analysis (polystyrene standard). As a result, the weight average molecular weight of the alkali-soluble polymer (C3) was 2,8 Å. [Synthesis Example 6] Synthesis of the soluble polymer (C4) The mixed solution was prepared by using the following components under the following weight, and polymerization was carried out in the same manner as in Synthesis Example 1. Diethylene glycol decyl ethyl ether ll.Og N-cyclohexylmaleimine 4.725 g Dicyclopentyl decyl acrylate 5.400 g Methacrylic acid 3.375 g 2,2'-azo double (2-A Propyl ester) diterpene ester 2.025 g The obtained reaction solution was cooled to room temperature to obtain a soluble polymer containing 2,2'-azobis(2-mercaptopropionate) dinonyl ester ( C3) 33.3 wt〇/〇 solution. A portion of the reaction liquid was sampled, and the weight average molecular weight was determined by GPC analysis (polystyrene standard). As a result, the weight average molecular weight of the soluble polymer (C4) was 2,8 Å. 37 201207561 [Comparative Synthesis Example 1] a polymer containing a siloxane structure (m, a mixture of the following components, using the following components to prepare the mixed solution, and a 4-neck flask in the reaction of the solution and the subsequent reaction In the same manner as in Synthesis Example 1, ll.og 6.75 g 1.35 g 5.4 〇g 2.025 g of diethylene glycol decyl ethyl ether σ was prepared in the same manner as in Synthesis Example 1. 3-mercapto acryloxypropyltrimethoxydecane 4-hydroxyphenyl vinyl ketone glycidyl methacrylate 2,2'-azobis(2-mercaptopropionate) dimethyl ester _ The resulting reaction solution was cooled to room temperature to obtain a 33.3 wt% solution of a polymer containing a oxoxane structure containing no dimethyl ester of 2,2,-methoxypropionate. A portion of the reaction solution was sampled. The weight average molecular weight was measured by Gpc analysis (polystyrene standard), and as a result, the weight average molecular weight of the polymer (D1) having a siloxane structure was 2,7 Å. [Example 1] [Positive type photosensitive property] Manufacture of the composition] The copolymer (A1) obtained in Synthesis Example 1, the copolymer (C4) obtained in Synthesis Example 6, 4,4-[1-[4-[1-[4-Phenylphenylmethyl]phenyl]ethylidene]bisphenol and 〇1,2- a stack of compounds a condensate of flavonol-5_sulfonate (average esterification rate = %, hereinafter referred to as "PAD"), as an additive interface 7 (trade name TM coffee _ JAPANK.K•, the following heart &lt;, ', BYK344'), diethylene glycol decyl ethyl ether as a solvent was mixed and dissolved under the following weight of 38 201207561. The positive photosensitive composition 1 having a solid concentration of 35 wt% was obtained. Alcohol methyl ethyl hydrazine 451 g 33.3 wt% solution of a polymer containing a decane structure (A1) 3.00 g 3.00 g 0.400 g 0.007 g

驗可溶性聚合物(C4)之33.3 wt%溶液 PAD BYK344 [正型感光性組成物之評價方法] 1)圖案狀透明膜之形成方法 將感光性組成物1以600 rpm而旋塗於玻璃基板上 秒,以lOOt:之加熱板進行2分鐘之乾燥。將該基板於空 氣中介隔孔圖案形成用光罩而使用T0PC0N股份有限公 司製造之近接式曝光機TME-l50PRC,介隔波長戴止濾光 器截止350 nm以下之光而出射g、h、i線,以曝光間隙 ΙΟΟμηι而進行曝光。曝光量設為i5〇mJ/cm2。曝光量是藉 由Ushio Inc.製造之累計光量計υιτ·1〇2以及光接收^ UVD-365PD而進行測定。將曝光後之玻璃基板於〇 4 之四曱基氫氧化銨水溶液中浸潰顯影6〇秒,除去曝光部之 樹脂組成物。將顯影後之基板於純水中洗滌6〇秒後以 100°C之加熱板乾燥2分鐘。將該基板於曝光機中,並不介 隔光罩而以300 mJ/cm2進行整個面曝光後,於烘箱中、 230°C下進行30分鐘之後烘烤,形成膜厚為3 μιη之圖案 39 201207561 2) 顯影後殘獏率 於顯影之前後測定膜厚,根據下式而進行計算。 (顯影後之膜厚/顯影前之膜厚)χ1〇〇 (%) 針式以-1^01·—股份有限公司製造之觸 針式膜厚4 P_15,败3處,取其平均值。 3) 解析度 藉由光學顯微鏡於400倍下觀察上述!)中 案狀透_之基板,確册孔_之底 寸。將未形成孔圖案之情形記為不良⑽)坡璃之遮罩尺 4) 密接性 藉由栅格剝離試驗(交又切割試驗)而評價上述〇 中所得之®餘透賴之紐。評價是於藉由切入而形成 有100個1 mm見方之柵格的圖案狀透明膜上貼附黏著帶 (住友3M股份有限公司製造之「聚酯膠帶N〇 % :黏著 力;5.5 N/cm」),以膠帶剝離後之殘存柵格數表示。 5) UV/03灰化處理 除了未形成圖案以外,亦即除了並不進行介隔光罩之 曝光以外,與上述1)同樣地形成透明膜,藉由以下之裝 置’於以下之條件下對所得之透明膜進行處理。 裝置:PL2003N-12 (SEN LIGHTS Co.,Ltd.製造之 PHOTO SURFACE PROCESSOR) 諸設定值:紫外線波長(254 nm)、曝光量(525 mJ/cm2) 201207561^ 另外,使用CUSTOM股份有限公司製造之UVC-254 而測定254 nm之曝光量。 6)接觸角 藉由協和界面化學股份有限公司製造之Drop Master500而於25t環境下測定上述5)之UV/03灰化處 理前後之所述透明膜的純水之接觸角。將純水附著1秒後 之值作為接觸角值。 將感光性組成物1之組成以及藉由上述之評價方法而 所得之結果示於表1。 [表1] 實例1 實例2 實例3 實例4 實例5 比較例 1 比較例 2 比較例 3 比較例 4 A1 100 100 100 A2 100 80 100 C1 120 100 C2 100 100 100 C3 100 100 100 C4 100 100 100 D1 100 顯影後殘膜率[%] 82 80 78 86 76 75 73 71 85 解析度[μιη] 7 7 7 7 7 7 7 7 7 ί 爸接性[-] 100/100 100/100 100/100 100/100 100/100 100/100 100/100 100/100 100/100 接觸角 uv/o3灰化前 95 97 95 96 96 98 97 92 85 [度] uv/o3灰化後 85 86 86 87 86 69 78 71 62 — [實例2〜實例5以及比較例1〜比較例4] 藉由表1中所示之組合以及量而與實例1同樣地調製 作為聚合物溶液之感光性組成物2〜感光性組成物5以及 比較用可溶性組成物1〜比較用可溶性組成物4,進行評 價。將該些感光性組成物之組成以及評價結果示於表丨中。 由表1可知’於實例1〜實例5中,與比較例1〜比較 201207561 叩ιί 例4相比而言’即使於UV/〇3灰化處理後亦可獲得高 觸角。 [產業上之可利用性] 如以上所說明那樣,本發明之感光性組成物可藉由已 知之7才卜V、、今7法而進行處理,所得之硬化^具有 作為障壁材料之充分之撥液性。而且,於電路基板製^製 程等中,可抑制為了提高濕潤性而進行υν/0 3灰化處理戶^ 造成之障壁材料表面之撥液性之降低,且於處理後亦維持 充分之撥液性。 、 【圖式簡單說明】 無。 【主要元件符號說明】33.3 wt% solution of soluble polymer (C4) PAD BYK344 [Evaluation method of positive photosensitive composition] 1) Method of forming patterned transparent film Spin-sensitive composition 1 was spin-coated on a glass substrate at 600 rpm In seconds, the plate was dried with a hot plate of lOOt: 2 minutes. The substrate is used in a mask for forming an air interposer pattern, and a proximity exposure machine TME-l50PRC manufactured by T0PC0N Co., Ltd. is used to emit light, g, h, i by blocking the light of a wavelength blocking filter of 350 nm or less. The line is exposed by the exposure gap ΙΟΟμηι. The exposure amount was set to i5 〇 mJ/cm 2 . The exposure amount was measured by an integrated light meter υιτ·1〇2 manufactured by Ushio Inc. and a light receiving unit UVD-365PD. The exposed glass substrate was immersed and developed in an aqueous solution of ruthenium hydride in 〇 4 for 6 sec seconds to remove the resin composition of the exposed portion. The developed substrate was washed in pure water for 6 seconds, and then dried on a hot plate at 100 ° C for 2 minutes. The substrate was exposed to the entire surface at 300 mJ/cm 2 without interposing the mask in an exposure machine, and then baked in an oven at 230 ° C for 30 minutes to form a pattern having a film thickness of 3 μm. 201207561 2) The residual film rate after development was measured before and after development, and was calculated according to the following formula. (Thickness after development/film thickness before development) χ1〇〇 (%) The stylus type film thickness of P-15 manufactured by -1^01·—Co., Ltd. was defeated at 3 points, and the average value was taken. 3) Resolution Observe the above at 400 times with an optical microscope! In the middle of the case, the substrate is __ hole. The case where the hole pattern is not formed is described as defective (10)) The mask of the glaze 4) Adhesiveness The 余 余 纽 纽 藉 藉 藉 藉 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The evaluation was carried out by attaching an adhesive tape to a patterned transparent film having 100 grids of 1 mm square formed by cutting. (Polyester tape N〇% manufactured by Sumitomo 3M Co., Ltd.: adhesion; 5.5 N/cm ")), expressed as the number of remaining grids after tape peeling. 5) The UV/03 ashing treatment forms a transparent film in the same manner as in the above 1) except that the pattern is not formed, that is, the exposure is not performed, and the following apparatus is used under the following conditions. The resulting transparent film was processed. Device: PL2003N-12 (PHOTO SURFACE PROCESSOR, manufactured by SEN LIGHTS Co., Ltd.) Settings: UV wavelength (254 nm), exposure (525 mJ/cm2) 201207561^ In addition, UVC manufactured by CUSTOM Co., Ltd. -254 and measure the exposure at 254 nm. 6) Contact angle The contact angle of pure water of the transparent film before and after the UV/03 ashing treatment of the above 5) was measured in a 25 t environment by a Drop Master 500 manufactured by Kyowa Interface Chemical Co., Ltd. The value after attaching pure water for 1 second was taken as the contact angle value. The composition of the photosensitive composition 1 and the results obtained by the above evaluation methods are shown in Table 1. [Table 1] Example 1 Example 2 Example 3 Example 4 Example 5 Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 A1 100 100 100 A2 100 80 100 C1 120 100 C2 100 100 100 C3 100 100 100 C4 100 100 100 D1 100 Residual film rate after development [%] 82 80 78 86 76 75 73 71 85 Resolution [μιη] 7 7 7 7 7 7 7 7 7 ί Daddy [-] 100/100 100/100 100/100 100/ 100 100/100 100/100 100/100 100/100 100/100 Contact angle uv/o3 before ashing 95 97 95 96 96 98 97 92 85 [degrees] uv/o3 after ashing 85 86 86 87 86 69 78 71 [Example 2 to Example 5 and Comparative Example 1 to Comparative Example 4] The photosensitive composition 2 to photosensitive composition as a polymer solution was prepared in the same manner as in Example 1 by the combination and amount shown in Table 1. 5 and the comparative soluble composition 1 to the comparative soluble composition 4 were evaluated. The composition and evaluation results of the photosensitive compositions are shown in the Table. It can be seen from Table 1 that in Examples 1 to 5, compared with Comparative Example 1 to Comparative 201207561 叩ιί Example 4, high tentacles can be obtained even after UV/〇3 ashing treatment. [Industrial Applicability] As described above, the photosensitive composition of the present invention can be treated by the known method of 7 and V, and the obtained hardened film has sufficient material as a barrier material. Liquid dialing. Further, in the circuit board manufacturing process or the like, it is possible to suppress the liquid repellency of the surface of the barrier material caused by the υν/0 3 ashing treatment to improve the wettability, and to maintain sufficient liquid discharge after the treatment. Sex. [Simplified description of the diagram] None. [Main component symbol description]

Ml 〇 42 201207561 發明專利說明書 (本說明書格式、順序,請勿任意更動,※記號部分請勿填寫) π 由 a安哚. / / / 4 ^f-7^ (2006.01) ※申請日:※工P C分類: 一、發明名稱:(中//英文)Ml 〇42 201207561 Invention patent specification (Do not change the format and order of this manual, please do not fill in the ※ part) π From a 哚. / / / 4 ^f-7^ (2006.01) ※Application date: ※工PC classification: First, the name of the invention: (Chinese / / English)

Sl!^ c ^s4 感光性組成物、由此組成物所獲得的硬化膜以及具有 此硬化膜的顯示元件Sl!^ c ^s4 photosensitive composition, cured film obtained from the composition, and display element having the cured film

PHOTOSENSITIVE COMPOSITION, CURED FILM OBTAINED FROM THE COMPOSITION, AND DISPLAY DEVICE HAVING THE CURED FILM 二、中文發明摘要: 提供一種可形成撥液性以及耐uv臭氧灰化性優異之 硬化膜的正型感光性組成物。一種感光性組成物,其是含 有包含矽氧烷結構之聚合物(A)以及1,2-二疊氮醌化合 物(B)之感光性組成物,包含矽氧烷結構之聚合物(A) 使用包含如下化合物之單體的自由基聚合物:具有兩處自 由基聚合部位之特定之矽氧烷化合物、具有賦予聚合物 (A)驗可溶性之鹼溶性與自由基聚合性的鹼溶性自由基 聚合性單體。 三、英文發明摘要: A positive photosensitive composition capable of forming a cured film having excellent liquid repellency andPHOTOSENSITIVE COMPOSITION, CURED FILM OBTAINED FROM THE COMPOSITION, AND DISPLAY DEVICE HAVING THE CURED FILM II. Abstract of the Invention: A positive photosensitive composition which can form a cured film excellent in liquid repellency and uv ozone ashing resistance is provided. A photosensitive composition comprising a photosensitive composition comprising a polymer (A) comprising a decane structure and a 1,2-diazide compound (B), and a polymer comprising a siloxane structure (A) A radical polymer using a monomer containing a compound having two radical polymerization sites, an alkali-soluble radical having an alkali solubility and a radical polymerizability imparting solubility to the polymer (A) Polymerizable monomer. A positive photosensitive composition capable of forming a cured film having excellent liquid repellency and

Claims (1)

(2) 20120756 lit R10(2) 20120756 lit R10 (於式(2)中,R5〜r7分別表示氛、或任意之氫亦 可經氟取代之碳數1〜3之烷基,R8〜Rn分別表示氫,鹵 素’ -CN ’ -CF3 ’ -OCF3 ’經基,任意之亞甲基亦可經:^仏、 -OCO-、-CO-取代且任意之氫亦可經鹵素取代之碳數卜5 之烧基,或任意之氫亦可經齒素取代之碳數1〜5之烧氧 基;其中,R8〜R12中之至少i個為羥基 4.如申請專利範圍第丨項至第3項中任一項所述之感 ,性組成物,其中,所述包含矽氧烷結構之聚合物(a) 是進-步包含式(1)所表示之錢燒化合物以及驗溶性自 由基聚合性賴科之其他自由絲合性秘 之自 由某聚合铷。 士 i + 如甘申。月專利範圍第4項所述之感光性組成物,其 由絲合料體包料⑴絲示之石夕氧 烷化合物,(In the formula (2), R5 to r7 each represent an aryl group, or an arbitrary hydrogen group may be substituted by fluorine to have an alkyl group having 1 to 3 carbon atoms, and R8 to Rn each represent hydrogen, and halogen '-CN '-CF3 ' - OCF3 'trans group, any methylene group can also be substituted by: ^仏, -OCO-, -CO- and any hydrogen can also be substituted by halogen, the carbon number of 5, or any hydrogen can also be The alkoxy group substituted with a carbon number of 1 to 5; wherein at least i of R8 to R12 is a hydroxyl group. 4. The feeling of any one of the above claims, the composition of The polymer (a) comprising the oxoxane structure is a free-form containing free radical compound represented by the formula (1) and free of other free-filaments of the solvent-soluble radical polymerized lysine. a polymeric composition, such as Ganshen, a photosensitive composition according to item 4 of the patent scope of the present invention, which is represented by a silk composite material (1), which is a silk oxide compound. R14 / (3) R13-Si4〇- R15\ R17 (於式(3) + ’ R13〜R17分別獨立地表示任意之氮亦 201207561. 可經氟取代且任意之亞甲基亦可經氧取代之碳數1〜30之 烷基、或矽數1〜500之三(烷基/燒氧基)矽烷氧基,a3表 示自由基聚合性官能基,n表示〇〜1,000之整數)。 6. 如申請專利範圍第5項所述之感光性組成物,其 中,所述其他自由基聚合性單體是11為0之式(3)所表示 之矽氧烷化合物。 7. 如申請專利範圍第6項所述之感光性組成物,其 中’式(3)之R13〜分別如下述式(5)所示,R14 / (3) R13-Si4〇- R15\ R17 (wherein (3) + ' R13 to R17 each independently represent any nitrogen also 201207561. It may be substituted by fluorine and any methylene group may be substituted by oxygen. An alkyl group having 1 to 30 carbon atoms or a trimethyl (alkyl/alkoxy)decaneoxy group having a number of 1 to 500, a3 represents a radical polymerizable functional group, and n represents an integer of 〇1 to 1,000). 6. The photosensitive composition according to claim 5, wherein the other radical polymerizable monomer is a oxoxane compound represented by the formula (3) wherein 11 is 0. 7. The photosensitive composition according to claim 6, wherein R13~ of the formula (3) are respectively represented by the following formula (5), (於式(5)中,R21〜R23分別獨立地表示氫、碳數i 〜20之烧基、或碳數1〜2〇之烷氧基(其中,末端之β 〜R23之至少一個是所述烷基或所述烷氧基),m表示1〜 500之整數)。 8. 如申請專利範圍第4項至第7項中任一項所述之感 光性組成物,其中,所述其他自由基聚合性單體包含(曱基) 丙浠酸衍生物。 9. 如申請專利範圍第1項至第8項中任一項所述之感 光性組成物,其進一步含有驗可溶性聚合物(C),所述驗 可溶性聚合物(C)是式(1)所表示之矽氧烷化合物以外 之單體的自由基聚合物,且具有驗可溶性。 45 201207561 ,.Γιι 10. 如申請專利範圍第9項所述之感光性組成物,其 中,所述鹼可溶性聚合物(C)是包含選自由具有不飽和 羧酸之自由基聚合性單體、具有不飽和羧酸酐之自由基聚 合性單體、以及具有酚性羥基之自由基聚合性單體所構成 之群組之一種以上的單體之自由基聚合物。 11. 如申請專利範圍第丨項至第10項中任一項所述之 感先性組成物,其進—步含有溶劑。 12. —種硬化膜,其是對如申請專利範圍第丨項至第 11項+任一項所述之感光性組成物之膜進行煅燒而獲得。 13. —種顯示元件,其具有如申請專利範圍第12項所 述之硬化膜。 46 201207迅 UV ozone ashing resistance is provided. The photosensitive composition includes a polymer (A) containing a siloxane structure and a 1,2-quinone diazide compound (B). The polymer (A) containing a siloxane structure uses a radical polymer in which the monomers contain a specific siloxane compound and an alkali-soluble radical polymer monomer. The specific siloxane compound has two radical-polymerizable positions. The alkali-soluble radical polymer monomer has ability to make the polymer (A) alkali-soluble and radical polymerizable. 四、 指定代表圓: (一) 本案指定代表圖為:無。 (二) 本代表圖之元件符號簡單說明: fe. 〇 五、 本案若有化學式時,請揭示最能顯示發明特徵 的化學式: 益〇 2 201207561 爲第麵細6號中文酬書無麵修正頁 修正日期·年關26日 另外’使用CUSTOM股份有限公司製造之uvc_254 而測定254 nm之曝光量。 6)接觸角 藉由協和界面化學股份有限公司製造之Dr〇p Master500而於25°C環境下測定上述5)之UV/03灰化處 理鈿後之所述透明膜的純水之接觸角。將純水附著1秒後 之值作為接觸角值。 0 將感光性組成物1之組成以及藉由上述之評價方法而 所得之結果示於表1。 [表1] 實例1 實例2 實例3 實例4 實例5 比較例 1 比較例 2 比較例 3 比較例 4 A1 100 100 100 A2 100 80 100 C1 120 100 C2 100 100 100 C3 100 100 100 C4 100 100 100 D1 100 顯影後殘膜率[%] 82 80 78 86 76 75 73 71 85 解析度[μιη] 7 7 7 7 7 7 7 7 7 密接性[-] 100/100 100/100 100/100 100/100 100/100 100/100 100/100 100/100 100/100 接觸角 [度] uv/o3灰化前 95 97 95 96 96 98 97 92 85 uv/〇3灰化後 85 86 86 87 86 69 78 71 62 [實例2〜實例5以及比較例1〜比較例4] 藉由表1中所示之組合以及量而與實例1同樣地調製 作為聚合物溶液之感光性組成物2〜感光性組成物5以及 比較用可溶性組成物1〜比較用可溶性組成物4’進行評 價。將該些感光性組成物之組成以及評價結果示於表1中。 由表1可知,於實例1〜實例5中,與比較例1〜比較 201207561 爲第100126616號中文說明書無劃線修正頁 修正日期:⑽年10月26日 例4相比而言,即使於uv/〇3灰化處理後亦可獲得高的接 觸角。 [產業上之可利用性] 如以上所說明那樣,本發明之感光性組成物可藉由已 知之微影法㈣行處理,所得之硬賴具有作為障壁材料 =分之,液性。而^ ’於電路基板製造製程等中,可抑 fr提兩濕難㈣行υν/ο3灰化處賴造成之障壁材 二液性之降低’且於處理後亦維持充分之撥液性。 【圖式簡單說明】 無。 【主要元件符號說明】 Ml 〇 *\\\ 42 201207561 ^ο^υυριίΐ 修正日期:10()年10月26日 ' 爲第100126616號中文專利範圍無劃線修正本 七、申請專利範圍: 1. 一種感光性組成物,包括:包含矽氧烷結構之聚合 物(A)以及1,2-—疊氮酿化合物(b),其中包含石夕氧烧 結構之聚合物(A)疋含有式(1)所表示之石夕氧烧化合物、 具有賦予聚合物(A)驗可溶性之鹼溶性與自由基聚合性 的鹼溶性自由基聚合性單體的單體之自由基聚合物,(In the formula (5), R21 to R23 each independently represent hydrogen, a carbon number of i to 20, or an alkoxy group having a carbon number of 1 to 2 (wherein at least one of β to R23 at the end is a The alkyl group or the alkoxy group), m represents an integer of from 1 to 500). The photosensitive composition according to any one of claims 4 to 7, wherein the other radical polymerizable monomer comprises a (mercapto)propionic acid derivative. 9. The photosensitive composition according to any one of claims 1 to 8, further comprising a soluble polymer (C) which is a formula (1) A free radical polymer of a monomer other than the represented oxoxane compound, and having a solubility. The photosensitive composition according to claim 9, wherein the alkali-soluble polymer (C) comprises a radically polymerizable monomer selected from the group consisting of unsaturated carboxylic acids, A radical polymer having one or more monomers of a group consisting of a radically polymerizable monomer of an unsaturated carboxylic anhydride and a radical polymerizable monomer having a phenolic hydroxyl group. 11. The sensitizing composition according to any one of the preceding claims, which further comprises a solvent. A cured film obtained by calcining a film of the photosensitive composition according to any one of the above claims. A display element having a cured film as described in claim 12 of the patent application. 46.07-0707 The UV light ashing resistance is provided. The photosensitive composition includes a polymer (A) containing a siloxane structure and a 1,2-quinone diazide compound (B). The polymer (A) containing a siloxane structure uses a radical polymer in The alkali-soluble radical polymer monomer has ability to make the polymer (A) alkali-soluble and radical polymerizable. The specific siloxane compound has two radical-polymerizable positions. 4. Designated representative circle: (1) The representative representative of the case is: None. (2) A brief description of the symbol of the representative figure: fe. 、5. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: Yi Yi 2 201207561 is the No. 6 Chinese Reward No Face Correction Page Correction date · On the 26th of the year, the exposure amount at 254 nm was measured using 'uvc_254 manufactured by CUSTOM Co., Ltd.'. 6) Contact angle The contact angle of the pure water of the transparent film after the UV/03 ashing treatment of the above 5) was measured at 25 ° C by a Dr〇p Master 500 manufactured by Kyowa Interface Chemical Co., Ltd. The value after attaching pure water for 1 second was taken as the contact angle value. The composition of the photosensitive composition 1 and the results obtained by the above evaluation methods are shown in Table 1. [Table 1] Example 1 Example 2 Example 3 Example 4 Example 5 Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 A1 100 100 100 A2 100 80 100 C1 120 100 C2 100 100 100 C3 100 100 100 C4 100 100 100 D1 100 Residual film rate after development [%] 82 80 78 86 76 75 73 71 85 Resolution [μιη] 7 7 7 7 7 7 7 7 7 Adhesion [-] 100/100 100/100 100/100 100/100 100 /100 100/100 100/100 100/100 100/100 Contact angle [degrees] uv/o3 before ashing 95 97 95 96 96 98 97 92 85 uv/〇3 after ashing 85 86 86 87 86 69 78 71 62 [Example 2 to Example 5 and Comparative Example 1 to Comparative Example 4] The photosensitive composition 2 to the photosensitive composition 5 as a polymer solution were prepared in the same manner as in Example 1 by the combination and amount shown in Table 1. The comparative soluble composition 1 to the comparative soluble composition 4' was evaluated. The composition and evaluation results of the photosensitive compositions are shown in Table 1. As can be seen from Table 1, in Examples 1 to 5, compared with Comparative Example 1 to 201207561, the Chinese manual of No. 100126616 has no scribe correction date: (10) October 26, compared with Example 4, even in uv / 〇 3 ashing treatment can also obtain a high contact angle. [Industrial Applicability] As described above, the photosensitive composition of the present invention can be treated by the known lithography method (4), and the obtained hard ray has a liquid barrier property as a barrier material. In the manufacturing process of the circuit board, etc., it is possible to suppress the two wet conditions (4), and the liquid repellency of the barrier material caused by the ashing of the ash/v3 is maintained, and sufficient liquid repellency is maintained after the treatment. [Simple description of the diagram] None. [Main component symbol description] Ml 〇*\\\ 42 201207561 ^ο^υυριίΐ Date of revision: 10() October 26th' is the Chinese patent scope of No. 100126616. No slash correction. 7. Patent application scope: 1. A photosensitive composition comprising: a polymer comprising a oxoxane structure (A) and a 1,2- azide stilbene compound (b), wherein the polymer comprising the oxalate structure (A) has a formula ( 1) a cerium oxide compound represented by the above, and a radical polymer having a monomer which imparts solubility to the polymer (A) and an alkali-soluble radical polymerizable monomer which is radically polymerizable, ⑴ (於式(1)中,R1〜R4分別獨立地表示氫、或任意 氫亦可經氟取代且並不連續之任意亞曱基亦可經氧取代之 碳數1〜30之烷基,A1以及A2分別表示自由基聚合性官 能基,η表示1〜1,〇〇〇之整數)。 2. 如申請專利範圍第1項所述之感光性組成物,其 υ 中,所述鹼溶性自由基聚合性單體包含選自由具有不飽和 羧酸之自由基聚合性單體、具有不飽和羧酸酐之自由基聚 合性單體、以及具有酚性羥基之自由基聚合性單體所構成 之群組之一種以上。 3. 如申凊專利範圍第1項所述之感光性組成物,其 中’所述鹼溶性自由基聚合性單體包含式(2)所表示之自 由基聚合物單體, 43 201207561 爲第100126616號中文專利範圍無劃線修正本 D12(1) (In the formula (1), R1 to R4 each independently represent hydrogen, or any hydrogen which may be substituted by fluorine and which is not continuous, may be an alkyl group having 1 to 30 carbon atoms which may be substituted by oxygen. A1 and A2 respectively represent a radical polymerizable functional group, and η represents 1 to 1, and an integer of 〇〇〇). 2. The photosensitive composition according to claim 1, wherein the alkali-soluble radically polymerizable monomer comprises a radically polymerizable monomer selected from the group consisting of unsaturated carboxylic acids and has an unsaturated state. One or more of the group consisting of a radically polymerizable monomer of a carboxylic anhydride and a radically polymerizable monomer having a phenolic hydroxyl group. 3. The photosensitive composition according to claim 1, wherein the alkali-soluble radical polymerizable monomer comprises a radical polymer monomer represented by the formula (2), 43 201207561 is the 100126616 No. Chinese patent range without marking correction D12 (於式(2)中,R5〜R7分別表示氫 、或任意之氫亦 可經氟取代之碳數1〜3之縣,r8〜r12分職示氣,函 素’ -CN ’ -CF3 ’ -0CF3 ’經基,任意之亞甲基亦可經_c〇〇_、 -OCO-、-CO-取代且任意之氫亦可經鹵素取代之碳數丨〜5 之烷基,或任意之氫亦可經齒素取代之後數丨〜5之燒 基;其中,R8〜R12中之至少i個為羥基)。 70 4. 如申請專利範圍第丨項所述之感紐組成物,其 中,所述包含矽氧烷結構之聚合物(A)是進一步包含^ ⑴所表不之魏燒化合物m容性自由基聚合性單^ 以外之其他自由基聚合性單體的單體之自由基聚合物。立 5. 如申請專利範圍第4項所述之感光性組成物,| 中,所述其他自由基聚合性單體包含式(3)所表示之^ 烧化合物’ 氣(In the formula (2), R5 to R7 respectively represent hydrogen, or any hydrogen may be substituted by fluorine, and the number of carbon atoms is 1 to 3, r8 to r12 are divided into gas, and the element '-CN '-CF3 ' -0CF3 'trans group, any methylene group may be substituted by _c〇〇_, -OCO-, -CO- and any hydrogen may be substituted by halogen with a carbon number of 丨~5, or any Hydrogen may also be substituted with dentate after several 丨~5 of the alkyl group; wherein at least i of R8 to R12 is a hydroxyl group). 70. The sensation composition according to the above aspect of the invention, wherein the polymer (A) comprising a oxoxane structure further comprises a Wei-free compound m-capacity free radical represented by (1) A radical polymer of a monomer other than a polymerizable monomer other than the polymerizable monomer. 5. The photosensitive composition according to claim 4, wherein the other radical polymerizable monomer comprises a compound of the formula (3) (於式(3)中,Ri3〜Rn分別獨立地表示任意之氣 可經氟取代且任意之亞曱基亦可經氧取代之碳數i〜^亦 44 201207561 w ^ 爲第100126616號中文專利範_無麵修正本 修正日期:100年10月26日 院基、或矽數1〜500之三(炫基/烷氧基)石夕烷氧基,八3表 示自由基聚合性官能基,η表示〇〜1,〇〇〇之整數)。 6.如申請專利範園第5項所述之感光性組成物,其 中,所述其他自由基聚合性單體是!!為0之式(3)所表示 之矽氧烷化合物。 7·如申請專利範圍第6項所述之感光性組成物,其 令,式(3)之R1 2 3 4 5 6〜Ri5分別如下述式(5)所示,(In the formula (3), Ri3 to Rn each independently represent a carbon number in which any gas can be substituted by fluorine and any of the fluorenylene groups can be substituted by oxygen. i~^ also 44 201207561 w ^ is the Chinese patent No. 100126616 Fan _ no face correction This revision date: October 26, 100, the hospital base, or the number of 1 1 to 500 ( (Hyun / alkoxy) oxalatyloxy, 八 3 represents a radical polymerizable functional group, η represents 〇~1, an integer of 〇〇〇). 6. The photosensitive composition according to claim 5, wherein the other radical polymerizable monomer is! The oxoxane compound represented by the formula (3) of 0. 7. The photosensitive composition according to claim 6, wherein R1 2 3 4 5 6 to Ri5 of the formula (3) are respectively represented by the following formula (5). (於式(5)中,R2i〜R23分別獨立地表示氫、碳數i 20之烷基、或碳數1〜20之烷氧基(其中,末端之R2! 〜R23之至少一個是所述烷基或所述烷氧基),m表示1〜 500之整數)。(In the formula (5), R2i to R23 each independently represent hydrogen, an alkyl group having a carbon number of i20, or an alkoxy group having a carbon number of 1 to 20 (wherein at least one of R2! to R23 at the terminal is the said The alkyl group or the alkoxy group), m represents an integer of from 1 to 500). 45 1 .如申請專利範圍第4項至第7項中任一項所述之感 2 光性組成物,其中,所述其他自由基聚合性單體包含(甲基) 3 丙烯酸衍生物。 4 9. 如申请專利範圍第1項至第7項中任一項所述之感 5 光性組成物,其進一步含有鹼可溶性聚合物(C),所述鹼 可,性聚合物(C) *式⑴所麵之魏烧化合物以外 之單體的自由基聚合物,且具有鹼可溶性。 6 10. 如申請專利範圍第9項所述之感光性組成物,其 201207561 ,丄 爲第100126616號中文專利範圍無劃線修正本 修正日期,年10月26日 中,所述驗可溶性聚合物(C)是包含選自由具有不飽和 羧酸之自由基聚合性單體、具有不飽和羧酸酐之自由基聚 合性單體、以及具有酚性羥基之自由基聚合性單體所構成 之群組之一種以上的單體之自由基聚合物。 11. 如申請專利範圍第1項至第7項中任一項所述之 感光性組成物,其進一步含有溶劑。 12. —種硬化膜,其是對如申請專利範圍第1項至第 11項中任一項所述之感光性組成物之膜進行煅燒而獲得。 13. —種顯示元件,其具有如申請專利範圍第12項所 述之硬化膜。 46The photosensitive composition according to any one of claims 4 to 7, wherein the other radical polymerizable monomer comprises a (meth)acrylic acid derivative. The luminosity-sensitive composition according to any one of claims 1 to 7, further comprising an alkali-soluble polymer (C), the alkali-soluble polymer (C) * A radical polymer of a monomer other than the Wei-sinter compound of the formula (1), and having an alkali solubility. 6 10. If the photosensitive composition described in the scope of claim 9 is 201207561, the Chinese patent scope of No. 100126616 is not corrected by the slash correction date. On October 26, the soluble polymer is tested. (C) is a group comprising a radically polymerizable monomer selected from a radically polymerizable monomer having an unsaturated carboxylic acid, a radically polymerizable monomer having an unsaturated carboxylic acid anhydride, and a radical polymerizable monomer having a phenolic hydroxyl group. One or more monomeric free radical polymers. The photosensitive composition according to any one of claims 1 to 7, further comprising a solvent. A cured film obtained by calcining a film of the photosensitive composition according to any one of claims 1 to 11. A display element having a cured film as described in claim 12 of the patent application. 46
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