TW201243501A - Resin composition, manufacturing method of cured object, manufacturing method of resin pattern, cured object and optical member - Google Patents

Abstract

The resin composition of disclosure is characterized as including: (compoment A) a polymer including (a-1) a monomer unit having a group liaving due to acid and/or heat and (a-2) a monomer unit having a crosslinking group; (compoment B) particles; and (compoment C) a solvent. Moreover, a cured object of the disclosure is obtained by curing the resin composition, and an optical member of the disclosure is obtained by curing the resin composition.

Description

201243501 SUMMARY OF THE INVENTION Technical Field The present invention relates to a resin composition, a method for producing a cured product, a method for producing a resin pattern, a cured product, and an optical member. [Prior Art] Due to the development of solid-state imaging devices or liquid crystal display devices, optical members such as microlenses, optical waveguides, and anti-reflective films have been widely produced from organic materials (resins). As for the optical members, a method of adding particles such as titanium oxide has been studied in order to achieve a high refractive index (refer to the following Japanese Patent Special Publication No. 5, Japanese Patent Laid-Open No. 181, and the Japanese Patent JP-A-200M17U4, PCT Patent Publication No. 2011-29474, and Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. 2006-98985, Japanese Patent Application No. 2001-154181, Japan In the viewpoint of the stability of the particles in the resin composition as described in the Japanese Patent Publication No. 2011-29474 and the Japanese Patent No. 2011-29474, the patent of the Japanese Patent Publication No. 2011-47474 can be used to treat the particles. Therefore, the starting point and the surface of the amount which cannot be used in this method are sufficiently high (for example, the refractive index is 17 or more) =====, including her purpose (for example, Japanese 201243501) Provided is a resin composition obtained by obtaining a cured product having a refractive index. Further, 'the object of the present invention is to provide an optical member which is obtained by hard-facing a fat composition of the present invention. It has a high refractive index and is excellent in mechanical strength. The above-described problems of the present invention can be resolved by the means referred to in the following &lt;1&gt; or &lt;16&gt;~&lt;&lt;&gt;&gt;2&lt;15&gt; is described below. Eight &lt;1&gt; A resin composition comprising: (component Α) containing (a-Ι) having a group desorbed by acid and/or heat a monomer unit and (5) a polymer of a monomer unit having a crosslinkable group; (a component granules and a (component C) solvent. The resin composition according to the above &lt;1&gt;, characterized in that The resin composition according to the above-mentioned <1> or <2>, which further comprises (Component D) a photo-acid generator (Ph〇toacid generator). (Component E) The resin composition according to any one of the above-mentioned <3>, which further comprises (Component F) an alkali-insoluble resin. (5) The resin composition according to the above <4>, wherein the component F is present The resin composition according to the above-mentioned item <5>, wherein the component F has an epoxy group as a crosslinkable group. 201243501 &lt;7&gt; The resin composition according to any one of the above-mentioned items, wherein the component F is an epoxy resin or an acrylic resin. The resin composition according to any one of the above-mentioned items, wherein the (a-Ι) has a detachment due to acid and/or heat. The monomer unit of the group is a monomer unit having a (a-1 - 1) residue having a group or a desired group protected by an acid-decomposable group. The resin group according to any one of the above-mentioned items, wherein the (a-2) monomer unit having a crosslinkable group (a-) is a resin group according to any one of the above-mentioned items (a-2). 2-l) a monomer unit having an epoxy group and/or an oxetanyl group. The resin composition as described in any one of the above-mentioned <1>, wherein the component B is an inorganic particle. The resin composition according to the above <10>, wherein the inorganic particles are metal oxide particles. The resin composition according to the above <1>, characterized in that the inorganic particles are titanium oxide particles. The resin and the composition according to any one of the above aspects, which is a photosensitive resin composition. The resin according to any one of the above-mentioned <1:> to <13> is characterized in that it is a positive photosensitive resin composition. The resin according to any one of the above-mentioned items, wherein the resin is a resin composition for an optical member. The coating method of the packaged Wei compound, the ship is at least in the order of G 3 steps (a) to (c): if 2) the coating step 'will be according to any of the above &lt; 1 &gt; ~ &lt; 15 &gt; The resin composition described in the above paragraph is coated on a substrate; the item 201243501 agent; (b) the solvent removal step, the removal of the resin composition from the applied resin composition (4) heat treatment step 'heat-packing the solvent-removed resin composition Second, the method of manufacture is characterized by at least a sequential agent; (2) a solvent removal step, which is removed from the applied resin composition to remove the oxime resin group ===, and is exposed by an aqueous developer solution. Resin treatment. ..., process V, 'heating the resin composition that has been developed> 2: = square ==: using the tree-type optical material according to the above-described &lt;16 lipid pattern manufacturing method or according to the above &lt;17&gt; The outline is: according to the above &lt;resin map == method or [effect of the invention] according to the above &lt;17&gt;& according to the present invention, a resin composition can be provided, and the material can be obtained with #S refraction _ hardened material. (10) The obtained resin composition of the present invention has a high refractive index, which is obtained by curing the optical grease composition of the invention, and the optical resin composition is cured according to the present invention. [Embodiment] Hereinafter, the resin composition of the present invention will be described in detail. instruction of. In addition, in the present invention, the "lower limit to the upper limit of the numerical range" indicates that "the lower limit is equal to or higher than the upper limit, and the upper limit to the lower limit are included. That is, the numerical range including the upper limit and the lower limit is indicated. Further, in the present invention, the monomer unit having (a component A) containing (a-Ι) having a group desorbed due to acid or heat and (a 2) a polymer of a monomer unit having a crosslinkable group, and the like is simply referred to as "component A" or the like, and "(a_n has a monomer unit which has a group which is desorbed by acid or heat," is simply referred to as "monomer unit" (a-Ι), etc. Further, in the expression of the group (atomic group) in the present specification, the case where the substituted or unsubstituted expression includes a substituent and a substituent is not described. For example, "Alkyl, not only contains an unsubstituted alkyl group (unsubstituted alkyl group), but also contains a substituted alkyl group (substituted alkyl group). (Resin composition) The following 'pair resin' Description of the components of the composition The resin composition of the present invention is characterized in that (Component A) contains U-1) a monomer unit having a group which is desorbed by acid and/or heat, and a monomer unit having a crosslinkable group (a_2) The polymer, (component B) particles, and (component C) solvent. s 8 201243501 The resin composition of the present invention is preferably a photosensitive resin composition. When the resin composition of the present invention is a photosensitive resin composition, it is preferably contained ( Component D) Photoacid generator. Further, the resin composition of the present invention is preferably a resin composition having a property of being harden by heat. Further, the resin composition of the present invention is particularly preferably thermosetting and photosensitive. The resin composition of the present invention is preferably a positive photosensitive resin composition. Further, the positive photosensitive resin composition of the present invention is preferably a chemically amplified positive photosensitive resin composition (chemically amplified positive type) Photosensitive resin composition) The resin composition of the present invention preferably does not contain a 1,2-quinonediazide compound as a photoacid generator for inducing active light. 1,2_醌Napride Although a carboxyl group is formed by a sequential photochemical reaction, the quantum yield thereof must be 1 or less. The acid generated by the (component D) photoacid generator used in the present invention to induce active light is protected. The deprotection of the acidic group acts as a catalyst. Therefore, the acid generated by the action of one photon contributes to a plurality of deprotection reactions, and the quantum yield exceeds 1, which is, for example, a larger n-th power of 1 〇. The value of the chemical amplification is a high sensitivity. The resin composition of the present invention is preferably an optical component such as a microlens, an optical waveguide, an antireflection film, a sealing material for an LED, or a chip coating material for an LED. The resin composition for reducing the visibility of the wiring electrode used in the panel is more preferably a resin composition for a microlens. The composition for reducing the visibility of the wiring electrode used in the touch panel can reduce the touch β 201243501 The visibility of the wiring electrode used in the control panel, and the component composition which is hard to be seen by the wiring electrode, for example, IT〇 (indium tin oxide) The resin composition of the present invention, such as an interlayer insulating film between electrodes, can be suitably used for this purpose. It is presumed that the resin composition of the present invention is obtained by post-bake or the like to remove the group which is desorbed by the acid and/or heat in the component A, whereby the proportion of the particles in the obtained cured product can be increased. Obtain a hardened material of the south refraction that is often difficult to achieve. (Component A) contains (a-Ι) having a group which is detached due to acid and/or heat

Polymer A of the monomer unit having a crosslinkable group (a_2) The resin composition of the present invention contains (Component A) containing (a-i) a group having a detachment due to acid and/or heat (also referred to as a a monomer unit having a "crosslinking group" and a polymer unit having a crosslinkable group (a-2). Further, from the viewpoint of processing suitability in the field of a solid-state image sensor or a liquid crystal display device It is preferable that the component A is a compound which does not have a sulfur atom. The component A preferably contains (a-3) a monomer having an alkali-soluble group in addition to the monomer unit (a_i) and the monomer unit (a_2). The unit and/or (a_4) a monomer unit having an aromatic ring. Further, the component A may further contain a monomer unit (a-5) other than the monomer unit (a-Ι) to the monomer unit (a_4). In the present invention, the "monomer unit" is not only a structural unit formed of a ruthenium molecular monomer but also a structure in which a structural unit formed of a monomer molecule is modified by a polymer reaction or the like. unit. The weight average molecular weight (Mw) of the component A is preferably 3,000 or more, more preferably 5,000 or more, and still more preferably 10,000 or more, and 201243501 is preferably 1,000,000 or less, and more preferably 8 Å or less, more preferably further. It is 60,000 or less. By making it into the above range, good resolution can be obtained. The 'other' weight average molecular weight is a value calculated by GPC (Gel Permeation Chromatograph). Preferably, the solvent uses tetrahydroanion (THF), and the column uses TSKgel SuperHZ3000 and TSKgel.

SuperHZM-M (all manufactured by Tosoh Corporation) was used for measurement. Component A is preferably an acrylic polymer. The "acrylic polymer" in the present invention is an addition polymerization type resin, and is a polymer containing a monomer unit derived from (mercapto)acrylic acid or an ester thereof, and may also have a (mercapto)acrylic acid derived therefrom. a monomer other than the monomer unit of the ester, for example, a monomer unit derived from a styrene or a monomer unit derived from a vinyl compound, etc. Further, the component A may also contain a single derived from (meth)acrylic acid. The bulk unit and the monomer unit derived from (meth) acrylate. In addition, in the present specification, the "monomer unit derived from (fluorenyl) acrylate or its ester" is also referred to as "acrylic monomer unit". Further, (mercapto)acrylic acid is a general term for methacrylic acid and acrylic acid. Hereinafter, each monomer unit such as a monomer unit (a-fluorene) or a monomer unit (a_2) will be described. The monomer unit A having a heat-desorbed group contains at least (a-Ι) a monomer unit having a group which is desorbed due to acid and/or heat. The group which is desorbed due to acid and/or heat may be a base that is detached due to acid, a base that is detached due to heat, The group which is detached by acid and heat is preferably a group which is detached at least by an acid, that is, a group which is detached by an acid or a group which is detached by an acid and heat of 201243501. A group which is detached at least by an acid is exemplified by an acid. A residue which is protected by a decomposable group. The monomer unit (preferably a monomer unit having a slow group or an acidic group protected by an acid-decomposable group) is preferred from the viewpoints of sensitivity and resolution. (a-1-l) The soil component A is preferably a resin which is insoluble in alkali when the monomer unit is contained and is soluble in the decomposition of the monomer unit-decomposing group. The "alkali-soluble" other than the component F to be described later means a coating film of the compound (resin) formed by applying a solution of the compound (resin) onto a substrate and heating at 9 〇 for 2 minutes (thickness for 23) The solution of the compound (resin) is applied to the substrate at a rate of G·〇1 μιη/sec or more, other than the component F described later, in the case of G.4 Wt%M. Above, the compound (resin) formed by adding 2 minutes at rc The coating film (thickness: 4 μm) has a dissolution rate of less than 0.01 μm/sec for a 0.4 wt% aqueous solution of tetramethylammonium hydroxide of 23 C, preferably less than 0.005 gm/sec. Further [having a carboxyl group or a phenolic hydroxyl group by an acid The monomer unit (a-1-l) of the residue which is protected by the decomposable group is preferably a monomer unit (a_M) which contains a residue having a few groups or a disciplinary group which is decomposed by acid decomposition. Soil protection> By including the monomer unit (a_M) in the component A, it is possible to obtain a resin composition having a high sensitivity, a resin composition, a monomer having a residue in which a carboxyl group is protected by an acid-decomposable group, and having a phenolic property. The hydroxy group which is protected by the acid-decomposable group is characterized by the fact that the early body of the residue having the acid-decomposable group is protected by the acid-decomposing group. Therefore, in the case of shadows, the secrets of the money are the g units of the females. On the contrary, in the poem, the monomer unit of the residue which is protected by the acid-decomposable group is improved. Further, the acid-decomposable group is particularly preferably a decyloxyethyl group or a tetrahydrofuranyl group, and most preferably a tetrahydrofuranyl group. A monomer unit (a-1-2) having a residue in which a carboxyl group is protected by an acid-decomposable group] - a monomer unit having a repellent group - for example, a monomer unit having a carboxyl group is exemplified by the following compound Monomer unit: an unsaturated carboxylic acid having at least one carboxyl group in the molecule, such as an unsaturated monocarboxylic acid, an unsaturated dicarboxylic acid, or an unsaturated tricarboxylic acid. The unsaturated carboxylic acid used to obtain a monomer unit having a carboxyl group can be used as exemplified below. Namely, examples of the unsaturated monocarboxylic acid include acrylic acid, methacrylic acid, crotonic acid, α-chloropropionic acid, phenylacrylic acid and the like. Further, examples of the unsaturated dicarboxylic acid include maleic acid, fumaric acid, itaconic acid (acid), citrac〇nic acid, and mesaconic acid (removal (10) butyl ton, etc. The unsaturated polycarboxylic acid having a monomer unit having a carboxyl group may also be an acid anhydride thereof, and specific examples thereof include maleic anhydride, itaconic anhydride, tococanic anhydride, etc. Further, the 'unsaturated polycarboxylic acid may also be a polyvalent carboxyl group. The acid mono(2-methylpropenyloxyalkyl) ester may, for example, be succinic acid mono(2-propenyloxyethyl ester) or succinic acid mono(2-methylpropenyloxy group B). Ester), mono(2-propenyloxyethyl) phthalate, mono(2-methylpropenyloxyethyl)g phthalate, etc. 13 201243501 In addition, unsaturated poly The carboxylic acid may be a mono(meth)acrylate of a dicarboxyl polymer at both ends thereof, and examples thereof include ω-carboxypolycaprolactone monoacrylate, ω-carboxypolycaprolactone monomethacrylate, and the like. As the unsaturated carboxylic acid, carboxyethyl acrylate, 2-carboxyethyl methacrylate, monoalkyl maleate, monoalkyl fumarate can also be used. 4-carboxystyrene or the like. Among them, in order to form a monomer unit having a carboxyl group, it is preferable to use an acid anhydride such as acrylic acid, mercaptoacrylic acid or an unsaturated polycarboxylic acid, and more preferably acrylic acid. Or a methacrylic acid. The monomer unit having a carboxyl group may be contained alone or in combination of two or more. For example, the monomer unit having a carboxyl group may be a monomer obtained by reacting a monomer unit having a hydroxyl group with an acid anhydride. The acid anhydride may be a known acid anhydride, specifically, maleic acid.

Tetraoxyphthalic anhydride or succinic anhydride; anhydrides such as trimellitic anhydride, tetrazoic tetrabenzial, and biphenyl tetraphthalic anhydride. In view of driving, phthalic anhydride and an acid anhydride are preferred. The reaction rate of the radical is more preferably 30 mol% to 1 〇〇 from the viewpoint of self-developability, the acid Hu is preferably 10 mol% to 100 m〇i%, and the monomer unit of the residue formed by the ruthenium has The monomer unit which is protected by an acid-decomposable group (a-1-2)-201243501/, a residue in which a carboxyl group is protected by an acid-decomposable group, or al-2), is preferably a single having the following residue Body unit: The residue is a residue in which the carboxyl group of the monomer unit having a buffer group is protected by an acid-binding group as described in detail below. The acid-decomposable group can be used as a positive type anti-money agent for KrF and a positive type (tetra) decomposable fiber for ArF, and is not particularly limited. In the prior art, as an acid-decomposable group, an acetal functional group such as a tetrahydropyranyl group is known to be easily decomposed by an acid, and a tributyl butyl group is known to be relatively difficult to be decomposed by an acid. A tributyl functional group such as a tertiary butyl carbonate group can be used. Further, such an acetal functional group or a tertiary butyl functional group or a ketal functional group described below is a functional group which can be removed by heat. From the viewpoints of sensitivity and resolution, a monomer unit having the following groups in the acid-decomposable group is preferably a residue in which a carboxyl group is protected by an acetal or a residue in which a carboxyl group is protected by a ketal. base. Further, among the acid-decomposable groups, a residue in which a carboxyl group is protected by an acetal or a ketal represented by the following formula is more preferable. Further, when the carboxyl group is protected by an acetal or a ketal represented by the following formula, the entire residue has a structure of -C(=Oyo-CR^R^OR3). 〇

2 R 3 I 3R CIO (In the formula (al-l), R1 and R2 each independently represent a hydrogen atom or an alkane 15 201243501 group, except where 'R and R2 are both hydrogen atoms. R3 represents a graft. R1 or R2 may also be bonded to R3 to form a cyclic ether. Moreover, the wavy line portion indicates a bonding position with other structures.) In the formula (aM), R1 and R2 each independently represent a hydrogen atom or an alkyl group, and R3 represents an alkane. Further, the alkyl group may be any of a linear chain, a branched chain, and a cyclic group. Here, neither R1 nor R2 represents a hydrogen atom, and at least one of R1 and R2 represents an alkyl group. In the formula (al-Ι), when R1, r2&amp; R3 represents an alkyl group, the alkyl group may be any of a linear chain, a branched chain or a cyclic group. The linear or branched fatty group preferably has 1 to 12 carbon atoms, more preferably 1 to 6' carbon atoms, and still more preferably has 1 to 4 carbon atoms. Specific examples thereof include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, secondary butyl group, tert-butyl group, n-pentyl group, neopentyl group, n-hexyl group, and 2, 3_ dimethyl-2-butyl (thexyl), n-heptyl, n-octyl, 2-ethylhexyl, n-decyl, n-decyl, and the like. The cyclic alkyl group preferably has 3 to 12 carbon atoms, more preferably 4 to 8 carbon atoms, still more preferably 4 to 6 carbon atoms. The cyclic alkyl group may, for example, be a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, a cyclooctyl group, a norbornyl group, an isobornyl group or the like. The alkyl group may further have a substituent, and the substituent may be exemplified by a phenyl group, an aryl group, or an alkoxy group. When a dentate atom is used as a substituent, R1, R and R are a halogen group; and when an aryl group is used as a substituent, Ri, R2 and r3 are aralkyl groups. The halogen atom may, for example, be a gas atom, a gas atom, a bromine atom or an iodine atom, and among these, a fluorine atom or a chlorine atom is preferred. Further, the aryl group is preferably an aryl group having 6 to 2 carbon atoms, more preferably an aryl group having 6 to 12 carbon atoms. Specifically, a phenyl group, a phenylphenyl group, a naphthyl group or the like can be exemplified. The aralkyl group is preferably an aralkyl group having 7 to 32 carbon atoms, more preferably an aralkyl group having 7 to 20 carbon atoms. Specifically, a benzyl group, an α-methylbenzyl group, a phenethyl group, a naphthylmethyl group or the like can be exemplified. The calcination group is preferably an alkoxy group having a ruthenium atom number of 1 to 6, more preferably an alkoxy group having a number of broken atoms of 1 to 4, still more preferably a decyloxy group or an ethoxy group. Further, when the alkyl group is a cycloalkyl group, the cycloalkyl group may further have a linear or branched alkyl group having 1 to 1 carbon atom as a substituent; the alkyl group is linear or In the case of a branched alkyl group, a cycloalkyl group having 3 to 12 carbon atoms may be further contained as a substituent. These substituents may be further substituted by the above substituents. In the formula (al-Ι), when R1, R2&amp; R3 represents an aryl group, the aryl group preferably has 6 to 12' carbon atoms, more preferably 6 to 1 ring. The aryl group may further have a substituent, and the substituent may preferably be an alkyl group having 1 to 6 carbon atoms. The aryl group may, for example, be a phenyl group, a fluorenyl group, a diphenyl group, an isopropyl group or a 1-naphthyl group. Further, R1, R2 and R3 may be bonded to each other to form a ring together with the carbon atoms to which the groups are bonded. R1 and R2, % of the ruler 1 and R3 or R2 and R3 are bonded, and examples of the structure include a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, a tetrahydrofuranyl group, an adamantyl group, and a tetrahydroanthraquinone. More than murray. Among them, tetrahydrofuranyl group is preferred. In the formula (aM), one of R1R2 is preferably a radically polymerizable monomer of hydrogen 17 201243501, or a radically polymerizable monomer. For example, in the presence of a chemical agent, (mercapto)acrylic acid is used to form a compound having the formula (al-i). The polymerizable monomer can be used commercially. It can be synthesized by a known method, and can be synthesized as shown below by a known method. Synthesis by reaction of vinyl ether. Representation of the monomer unit of the residue

R represents no hydrogen atom or a burnt group, and is preferably a hydrogen atom or a methyl group. Ή3 as 颂Rl2)(R13) is synonymous with Ri in the formula (al-i) and Ri in the formula (al-l), Rl5 is synonymous with R in the formula (I), and the radicals The preferred range is also the same. The above synthesis may also be carried out by pre-copolymerizing (mercapto)acrylic acid with other monomers, followed by reaction with ethyl ether in the presence of an acid catalyst. A preferred specific example of the monomer unit (a-1-2) having a residue in which the group is protected by an acid-decomposable group is exemplified by the following monomer unit. Further, R represents a hydrogen atom or a methyl group.

s 18 201243501 Unit [(ttr)r-based (four) sub-sense care __-based monomer - monomer unit having phenolic hydroxyl group - monomer unit having phenolic hydroxyl group can be exemplified by element or secret varnish material S . In the case of B-monomer = single element, the monomer unit represented by the single color is considered from the viewpoint of transparency and sensitivity. k selection U1-2)

(al-2) (In the formula (al-2), R represents a hydrogen atom or a methyl group, r21 represents a single bond or a monovalent linking group, R22 represents a halogen atom or an alkyl group, and a represents an integer of i~5 'b indicates The integer 'a + b of 〇~4 is 5 or less. When two or more R22 are present, the R22 may be different from each other or the same.) In the formula (al-2), 'R0 represents a hydrogen atom or a The group is preferably a fluorenyl group. N Further, R21 in the formula (al-2) represents a single bond or a divalent linking group. When R is a single bond, the sensitivity can be improved, and the transparency of the cured film can be improved. Therefore, it is preferably used. The divalent linking group of R2i may be an alkylene group, and the specific example of R21 being a stretching group may be a methylene group, an ethylene group, a propyl group (pr〇pyiene), or a stretching. Propyl (isopropylene), n-butylene, iso-butylene, tert-butylene, pentyl 201243501 (pentyiene), isoamyl (1S0_pentylene) ), new (ne〇-pentyiene), hexylene and so on. Among them, Ril is excellent: bond, methylene, and ethyl. Further, the divalent linking group may be a substituent, and examples of the substituent include a dentate atom, a hydroxyl group, an alkoxy group and the like. In addition, a in the formula (al-2) represents an integer of ～5, and the viewpoint of the effect or the ease of manufacture is preferable, and it is more preferable that a is 1 or not. Further, as for the bond position of the radical in the benzene ring, it is preferably bonded to the 4-position on the basis of the carbon atom of (1 position). ... Gu 2 (/1_2) MW is a linear or branched alkyl group having (a) atomic number and a number of atoms of 5. Specific examples thereof include a fluorine atom, a bromine atom, a methyl group, an ethyl group, a propyl group, an isopropyl group, a n-butyl group, and a different group; a tertiary butyl group, a pentyl group, an isopentyl group, a neopentyl group, and the like. Among them, from the viewpoint of self-contained two, it is preferable that a chlorine atom, a bromine atom, a methyl group or an ethyl group is easily produced. Further, b represents an integer of 0 or 1 to 4. Earth element - a monomer having a residue in which a residue is protected by an acid-decomposable group, and a monomer unit of a monomer having a residue which is protected by an acid-decomposable group The residue is an acid-decomposable base acid-decomposable group having an oxime group as described in detail below. A known acid component can be used as described above, in particular, self-sensitivity or preservation of a resin composition. In view of the above, it is preferred that the monomer having the following residue in the acid-decomposable group be a residue in which the mesogenic group is protected by shrinkage or a residue in which the desired trans group is protected by the s 20 201243501 ketone. Further, from the viewpoint of sensitivity, the acid-decomposable group is more preferably a residue in which a phenolic hydroxyl group is protected by an acetal or a ketal represented by the above formula (aM). Further, it is a phenolic hydroxyl group. When the residue obtained by protecting the acetal or ketal represented by the formula (al-1), the entire residue is a structure of -Ar-O-CRWOR3), and Ar represents an extended aryl group. A preferred example of the condensed ester structure of the ketone group can be exemplified by a combination of R1 = R2 = R - methyl or R1 = R2 = methyl and r3 = benzyl. The radical polymerizable monomer which is a monomer unit for forming a residue having a phenolic hydroxyl group protected by an acetal or a ketal may, for example, be a 1-alkoxyalkyl protecting agent of hydroxystyrene. Tetrahydroanthracene hydroxy styrene, alkoxyalkyl protecting agent of α-mercaptohydroxy styrene, tetrahydropyranyl protecting agent of α-methyl hydroxystyrene, methacrylic acid 1-alkoxyalkyl protecting agent of _4-hydroxyphenyl ester, _4-hydroxyphenyl methacrylate, tetrahydrogen quaternary protecting agent, etc. acetal protecting group of phenolic hydroxyl group and ketal protecting group The group (aM) is preferably used alone or in combination of two or more. The preferred specific examples of the early morning (a-1 - 3 ) may exemplify the following monomer units, but the present invention It is not limited to these monomer units. Further, R in the following monomer unit represents a hydrogen atom or a fluorenyl group.

21 201243501

叨J±«

33 Η fOCH2CH ch3 Η 3 (ch2)3-o_ Η o—|—OCH2CH3 ch3

The 1-ethoxyethyl group or the tetra- 2 is preferably a monomer unit having a retardation group or an age-sensitive light group which is a residue of the component A. From the viewpoint of the content of octagonal (a_1), it is preferable that 3 is preferably 20 _% to ^= for all the monomer units of ～7 G_% of sensitivity. 10 Μ Μ Μ 进 进 进 进 进 进 进 进 进 a a a a a a a a a a a a a a a a a 单体 单体 单体 单体 单体 单体 单体 单体 单体 单体 单体 单体 单体 单体 单体 单体The size of the scale is limited, and the form which produces the hardening reaction may comprise a monomer unit selected from the group consisting of one monomer unit such as a group: the group of the constituents, and the ethyl bromide group The monomer list is as follows. The hand of the cockroach is as early as possible. In more detail, it can be self-storing stability or the characteristics of the cured film. + 〇〇 (a-2) preferably has an epoxy; Monomeric oxime (a-2-l). Monomer unit of ketone ketone butyl group &lt; monomer unit having epoxy group and /Wei ray group (Μ七£22 201243501 Optimum component A contains Having an epoxy group and/or a member (...). Component A may further comprise a monomer unit and a unit having a monomer unit having a oxo group and an oxoyl group. The preferred axis A contains a monomer having a hydroxyl group-transferred group. If it has an epoxy ring, there is no particular limitation to the water-based, 3-hydroxycyclohexylmethyl group. The base may be preferably exemplified (3-ethyloxanium as a monomer unit UU) in the i-butan-3-yl) methyl group. The m-hetero group may be One or more (four) mer ΐ ί ί ί ί 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 ί ί ί ί ί ί ί ί ί ί 步 步 步 步 步More preferably, it has an epoxy group or an oxetane monomer as a single oxygen peak of the oxidized monomer. ίίίΓ n-butyl propyl acrylate condensate, acrylic acid, methacrylic Oxygen butyl vinegar, acrylic acid ♦ epoxidized heptanoic acid, o-ethene acrylic acid, 6,7·epoxy heptane, α•ethylpropane, 6-epoxy epoxide, condensed water, sweet, fresh An alicyclic epoxide containing alicyclic octoxide as described in Japanese Patent No. 4168443

S 23 201243501 Compounds, etc. The exemplified _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ ^% free silky monomeric acid succulent structure monomer. Monomer of acrylate structure, propylene = fresh money, more preferred monomer glycerin brewing, acrylic glycidol private water paragraph _ ~ paragraph 003 曰曰 2J 4168443 bulletin compound and Japanese patent ring epoxy The paragraph ester of the publication No. 3^1=330953. Of the (meth) propyl group having an oxetanyl group, the ethyl oxetane's '3 her, and the methyl sulfonate _3_ yl) methyl ester are considered from the viewpoint of heat-resistant transparency. Monomer unit of any. The above-mentioned body unit (_ can be used alone or in two preferred units of the unit cell unit (...) to escape the monomer 24 201243501

<Monomer unit (a-2-2) having an ethylenically unsaturated group> As one type of the monomer unit (a-2) having a crosslinkable group, a monomer having an ethylenically unsaturated group is exemplified. Unit (a-2-2). The monomer unit (a-2-2) having an ethylenically unsaturated group is preferably a monomer unit having an ethylenically unsaturated group in a side chain, more preferably an ethylenically unsaturated group at the terminal group and having a carbon number of 3 The monomer unit of the side chain of ～16 is more preferably a monomer unit having a side chain represented by the formula (a2-2-2). [R2 / eight /

Cf^O-R1 R3 (a2 - 2 - 2 ) (In the formula (a2-2-2), R1 represents a divalent linking group having a carbon number of 1 to 13, and R2 and R3 each independently represent a hydrogen atom or a methyl group. R1 may be a divalent linking group having a carbon number of 1 to 13, and preferably contains an alkenyl group, a cycloaliphatic group, an arylene group or a group in which the groups are combined, and may further contain an ester bond, A bond such as an ether bond, a guanamine bond or a urethane bond. and,

S 25 201243501 A 4 shell linker can also be used in the position of JL Gu J A yV Λ ^ /&quot;, set the octagonal base, carboxyl group and other substituents. As all of the arms of the soap unit (a_2) in the squeegee, it is preferably _% to 60 m 〇 1%, more preferably 〇 mol / ^ 〜 55 mol%, relative to the scorpion. Particularly preferred? n 诵 η 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、兀U'2), the monomer unit capable of causing the hardened film (a-3) to have an alkali-soluble group, preferably component A contains a monomer unit having an alkali-soluble group = test group (4) having an inspection (display) The component A is dissolved in the test solution, and the component A containing the monomer unit U_3) can be easily developed by the developer. The oxime-containing monomer may be crosslinked or crosslinked with an epoxy group or an oxetan group (for example, derived from the monomer unit (a_n)) of the component oxime molecule (10). The reaction is hardened to impart hardness to the obtained cured product. The alkali-soluble group in the monomer unit (a-3) having an alkali-soluble group may be a group generally used in the field of the anti-residue agent, and examples thereof include a buffer group and a phenolic hydroxyl group. Representative examples of the monomer unit (a-3) having an alkali-soluble group include, but are not limited to, a monomer unit derived from an unsaturated acid or an acid needle thereof, or a phenylethylidene or a derivative thereof. These monomer units. The monomer unit (a-3) may suitably use the monomer unit having a carboxyl group or a monomer unit having a heterocyclic group. Among these monomer units, monomer units derived from an unsaturated carboxylic acid or an anhydride thereof are particularly preferred. The unsaturated carboxylic acid or its anhydride may, for example, be an α, Ρ-unsaturated carboxylic acid such as acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid or fumaric acid.

S 26 201243501 ϊ: (formic acid coat;: etc.). Among these compounds, it is particularly preferable to use a single unit or a monomer unit having a 2 ring group (5)) (a-4) having an aromatic ring from the viewpoint of refractive index, and a monomer unit (") as the single " ; monomer: broad 3;, monomeric units other than 曰%. 体早Ma·1)~ monomer unit (5)) The monomer forming the monomer unit U-4) has an aromatic ring (fluorenyl group) Acrylates and the like. For example, styrenes may be mentioned, and a single r is derived from a phenylethyl group. The composition may also include the monomer unit (5) in the case of the present invention. The unit cell (a_5) other than the unit cell (a_4). The radical polymerizable monomer for forming the monomer unit (a-5), for example, paragraph 〇〇21 to paragraph of JP-A-2-26463 The compound described in 0024 (excluding the monomer in which the monomer unit (al) to the monomer unit (a-4) described above is formed). Further, the compound described below may be mentioned. Examples of the (mercapto) acrylate monomer of the chain include: ethylene oxide modified cresol acrylate (trade name) AronixTO-901), epoxy epoxide modified dodecyl acrylate (trade name Aronix TO-950), ethylene oxide modified tridecyl acrylate (trade name Aronix TO-951), 2 -ethylhexyl polyethylene glycol acrylate (trade name Aronix ΤΟ-946), 2-ethylhexyl polyethylene glycol propanate (trade name Aronix TO-947), 2-ethylhexyl polyethyl Glycol acrylate

C 27 201243501 Product name: Aronix ΤΟ-948), 2-ethylhexyl polyethylene glycol acrylate (trade name: AronixTO-949), manufactured by Toagosei Co., Ltd.; ethoxy-diethylene glycol acrylate (trade name: Light acrylate EC-A), methoxy-triethylene glycol acrylate vinegar (trade name Light acrylate MTG-A), decyloxy-polyethylene glycol acrylate (trade name Light acrylate) 130A), phenoxy-polyethylene glycol acrylate (trade name: Light acrylate P-200A), nonylphenyl-polyoxyethylene chain adduct acrylate (trade name: Light acrylate NP_4EA), mercaptobenzene Base-polyoxyethylene bond adduct acrylate (trade name: Light acrylate NP-8EA), manufactured by Kyoeisha Chemical Co., Ltd.; polyethylene glycol acrylate (trade name: Blemmer AE-350), poly Glycolyl methacrylate g (trade name: Blemmer PE-90), polyethylene glycol methacrylate (trade name: Blemmer PE-200), polyethylene glycol methacrylate (trade name Blemmer PE- 350), methoxy polyethylene glycol monoacrylate (trade name Blemmer AME- 400), methoxy polyethylene glycol methacrylate (trade name Blemmer PME-100), methoxy polyethylene glycol methacrylic acid S (trade name Blemmer PME-200), methoxy polymerization Ethylene glycol methacrylate (trade name Blemmer PME-400), polypropylene glycol methacrylate (trade name Blemmer ΡΡ·5〇0), polypropylene glycol fluorenyl acrylate (trade name BlemmerPP-800) ), polyethylene glycol polypropylene glycol methacrylate (trade name Blemmer 70PEP-370B), polyethylene glycol polybutylene glycol methacrylate (trade name Blemmer 50PET-800), octyloxy polyethylene glycol Polypropylene glycol monomethylpropionate (trade name: Blemmer 28 201243501 50POEP-800B), octyloxy polyethylene glycol poly- (trade name Blemmer 50AOEP-800B), early methyl propyl sputum Co., Ltd. manufactures; 彳4 Japanese oil and fat shares ^ NK Est- NK Ester M-90G), phenoxy diethylene glycol said 酉^曰 (Shangkoukou name =:-), the above is preferred by Xinzhongcun (曱Base) Acrylic acid-2-ylaminopentanyl vinegar. Age A may contain 1 fresh 7 base) propylene U coat containing 2 or more monomer units (a-5). l U_5) ' can also be packaged as all the monomer units of A of the monomer unit (a_1) in the component A, and when the component A contains the monomer unit U5), the content in the component A is relative to The content of all the monomer units of the component A is preferably from 1 mol% to 40 mol%, more preferably from 5 to 3% to 3 mol%, particularly preferably from 5 mol% to 25 mol%. Further, the method of introducing each monomer unit contained in the component A may be a polymerization method or a polymer reaction method, or two methods may be used in combination. Component A may be used alone or in combination of the above-mentioned resin compositions. The content of the component A in the resin composition of the present invention is preferably 20 wt% / 0 to 99 wt%, more preferably 40 wt% to 97 wt%, more preferably all the solid matter of the resin composition. Preferably, it is 6 〇 wt% 〜 95 29 1 201243501 wt %. When the content is within this range, it is found that r = r: the content of the resin other than A is less than the content of the component A. Excellent &amp; (Component B) particles £ sub. The resin composition of the present invention contains particles for the purpose of adjusting the refractive index. The particles preferably contain particles having a higher refractive index including azimuth = and a higher Z content. Specifically, it is more preferable to have a sub-in: Step: Select the above particles with a particle size of (four) or more, and it is particularly preferable to fold here. The so-called 400 nm to 75 () η rate is 1.50 or more, which is dry and right μ, + Fracture in the light of the wavelength of ...: the incident rate is ===== The refractive index of each light in the light is 1 5 〇 in μ, and the refractive index of each light of the i:r wavelength is determined by the length of the skin. Two = particles: _ high in nature and light transmissive, the inorganic oxide particles having excellent light transmittance and high refractive index are preferably contained

S 30 201243501

Be, Mg, Ca, Sr, Ba, Sc, Υ, La, Ce, Gd, Tb, Dy, Yb, Lu, Ti, Zr, Hf, Nb, Mo, W, Zn, B, Ai, Si, Ge, The oxide particles of atoms such as fn, Pb, or Bi, and Te are more preferably titanium oxide, zinc oxide, oxidized pentoxide, indium/tin oxide, or antimony/tin oxide, and particularly preferably titanium oxide. Titanium oxide is particularly preferably a rutile-type titanium oxide having a high refractive index. These inorganic particles can also be treated with an organic material to impart dispersion stability. In order not to lower the transparency of the resin composition, the particles are preferably 1 nm to 35 Å nm, and particularly preferably 3 Å to 10 Å. The particle-minor particle size is the particle size of any particle used by an electron microscope, which refers to its level. And when the shape of ^ is not spherical, the longest side is taken as the diameter. The opening 7 of the recording material has 15 in the light of the resin composition of the present invention. The optical member obtained by the above two refractive index particles == resin composition can be appropriately determined in consideration of use, and the light-receiving property of the phase-forming composition is equal to that of the present invention, and the particles are also 2 = 〇: t%~7〇Wt%. On the other hand, it is also possible to mix and disperse in a mixing device such as a dispersion mill such as a dispersion mill, and to use a ball mill or a solvent (component C) in the preparation of the dispersion. For example, in addition to 2-butanol, 2-methyl-2, alcohol, r-pentanol-propion: 2-propanol, r-butanol '1-butanol, and from butanol, neopentyl Alcohols, alcohols such as 3-pentanol and 3-methyl alcohol, and the like. Pentaerythritol, 1-hexanol, cyclohexyl

S 31 201243501 The dispersant preferably exemplifies the dispersant described in the (Component G) dispersant described later. These solvents may be used alone or in combination of two or more. (Component C) Solvent The resin composition of the present invention contains (Component c) a solvent. The resin composition of the present invention is preferably prepared by dissolving or dispersing any components of the component A and the component B and various additives described later in a solvent of (component c). The solvent (component c) used in the resin composition of the present invention may be a known solvent, and examples thereof include ethylene glycol monoalkyl ethers, ethylene glycol dialkyl mysteries, and ethyl alcohol monoalkyl ether acetates. , propylene glycol, single-base, propylene glycol dialkyl ether, propylene glycol monoalkyl ether acetate, diethylene glycol dialkyl ether, diethylene glycol monoalkyl ether acetate, dipropylene glycol monoalkane A primordial-propanol-alkyl radical, a dipropylene glycol monoalkyl group-acetic acid g, an ester, a ketone, a guanamine, a lactone, and the like. In the above solvent, diethylene glycol ethyl methyl ether and/or propylene glycol monomethyl ether acetate are preferable, and propylene glycol monomethyl ether acetate is particularly preferable. The solvent which can be used in the present invention may be used singly or in combination of two or more. The content of the (Component C) solvent in the resin composition of the present invention is preferably 5 parts by weight to 1 part by weight based on the content of the component A~ '〇(8) heavy damage, more preferably part by weight to 2 Further, it is more preferably 150 parts by weight to 1500 parts by weight. (Component D) Photoacid generator When the resin composition of the present invention is used as a photosensitive resin composition, β 32 201243501 The resin composition of the present invention preferably contains (Component D) a photoacid generator. The component D is preferably a compound which induces an acid to generate an acid by an active light having a wavelength of 300 nm or more, preferably a wavelength of 300 nm to 450 nm, and its chemical structure is not limited. Further, as for the photoacid generator which does not directly induce active light having a wavelength of 300 nm or more, if it is a compound which can induce an active light having a wavelength of 300 nm or more by using it together with a sensitizer, an acid generating compound can be used. The sensitizer is preferably used in combination. The component D is preferably a photoacid generator which can produce an acid having a pKa of 4 or less, and more preferably a photoacid generator which can produce an acid having a pKa of 3 or less. Examples of the photoacid generator include tris-mercapto-s-triazines, sulfonium salts or iodonium salts, quaternary ammonium salts, diazomethane compounds, sulfilimine sulfonate compounds, and sulfonium sulfonates. Compounds and the like Among these photoacid generators, an oxime sulfonate compound is preferably used from the viewpoint of high sensitivity. These photoacid generators may be used alone or in combination of two or more. Specific examples of the photoacid generators can be exemplified as follows. The class of trichloromethyl-s-triazine can be exemplified by 2_(3-hydrophenyl)-bis(4,6-trichloroindolyl)-s-triazine, 2-(4-methoxy) Phenyl)_bis(4,6-trichloromethyl)-s-triazine, 2-(4-mercaptothiophenyl)-bis(4,6-trichloroindolyl)·s-triazine, 2-(4) _Methoxy-β-styryl)-bis(4,6-trimethylsulfonyl)-s-triazine, 2-piperidinyl-bis(4,6-trichloroindolyl)-s-triazine, 2_ [2-7-pentan-2-yl) vinyl]-bis(4,6-trimethylsulfonyl)-s-triazine, 2_[2-(5-fluorenylfuran-2-yl)vinyl]-bis ( 4,6·three gas methyl)_s-triazine, 2_[2_(4_diethylamino-2-methylphenyl)vinyl]-bis(4,6-trichloroindenyl)_all three Pyrazine, or 2-(4-decyloxynaphthyl)-bis(4,6-trimethylsulfonyl)-s-triazine or the like. The diaryl iodine salt can be exemplified by diphenyl iodine rust trifluoroacetate, diphenyl 33 201243501 sulfonium trifluoromethanesulfonate, 4-methoxyphenyl phenyl iodonium trifluorosulfonate , 4-methoxyphenylphenyl iodine rust trifluoroacetate, phenyl 4-(2'-hydroxy-;; [, _ tetradecyloxy) base-breaking iron sulphate, 4 -(2'-transyl-I1-tetradecyloxy)phenyl iodine hexafluoroantimonate, or phenylhydroxy-1,-tetradecyloxy)phenyliodonium p-toluenesulfonate Wait. The triarylsulfonium salt can be exemplified by triphenylsulfonium trifluoromethanesulfonate, triphenylsulfonium trifluoroacetate, 4-methoxyphenyldiphenylsulfonium trifluoromethane, and 4 salts. - methyl lactyl stearyl diphenyl thiazole trifluoroacetate, 4-phenyl u-sepionyl diphenyl sulphide triflate, or 4-phenyl phenyl phenyl rust Fluoroacetate and the like. The quaternary ammonium salt can be exemplified by tetramethylammonium butyl tris(2,6-difluorophenyl)borate, tetramethylammonium hexyltris(p-phenylphenyl)borate, tetradecylammonium hexyl tris(3) -trifluorodecylphenyl)borate, benzyldidecylphenylammonium butyl tris(2,6-difluorophenyl)borate, benzyldidecylphenylammonium hexyltris(p-chlorophenyl) Borate, benzyldimethylphenylammonium hexyltris(3-trifluorodecylphenyl)borate, and the like. ^ The diazomethane derivative can be exemplified by bis(cyclohexylsulfonyl)diazomethane, bis(tert-butylsulfonyl)diazononane, bis(p-toluenesulfonyl)diazomethane, and the like. The quinone imide sulfonate derivative can be exemplified by trifluoromethylsulfonyloxybicyclo[2.2.1]hept-5-female-bis-reradylimine, bourbonimide trifluoromethane hydrochloride, ortho Benzoquinone imine trifluorosulfonate, N-hydroxynaphthalene iminium sulfonate, N-carbyl-5-norbornene-2,3-dicarboxy quinone imine propyl yellow Acid salt, etc. The resin composition of the present invention preferably contains, as a component D, a salt compound represented by the following formula (1) in the form of 34 201243501. In addition, the wave adjacent to eight;; = the junction position of the meteorite structure. m卩丝读其他化学 0 (1)

μ ^ II -Ν—〇—S-

The oxime acid salt compound having at least one acid salt residue represented by the formula (1) is preferably a compound represented by the following formula (7). RIA-C(R2a) = N-〇-S〇2-R3a (2) In the formula (2), ^^ represents an alkyl group having a carbon number of 丨6, and a halogenated alkyl group having a carbon number of 1 to 4. , phenyl, biphenyl, naphthyl, 2_. A bromo group, a 2-thienyl group, an alkoxy group having 1 to 4 carbon atoms or a cyano group. When ria is a phenyl group, a biphenyl group, a naphthyl group or a fluorenyl group, the groups may also be selected from the group consisting of a halogen atom, a hydroxyl group, an alkyl group having 1 to 4 carbon atoms, and an alkyl group having 1 to 4 carbon atoms. Substituted by a substituent of a group consisting of an oxy group and a nitro group. In the formula (2), R2A represents an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a halogenated alkyl group having 1 to 5 carbon atoms, and 1 to 5 carbon atoms. The i-alkoxy group, a phenyl group which may be substituted by W, a naphthyl group which may be substituted by W or a fluorenyl group, a dialkylamino group, a morpholinyl group or a cyano group which may be substituted by w. The ruler and the ruler may also be bonded to each other to form a 5-membered ring or a 6-membered ring, which may also be bonded to a benzene ring which may have one or two arbitrary substituents. 35 201243501 In the formula (2), 11^ represents an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a halogenated alkyl group having 1 to 5 carbon atoms, and a carbon number of a haloalkoxy group of 1 to 5, a phenyl group which may be substituted by W, a naphthyl group which may be substituted by W, or a fluorenyl group which may be substituted by W. W represents a halogen atom, a cyano group, a nitro group, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, an alkyl group having 1 to 5 carbon atoms or a carbon atom. The number i is 1 to 5 of the i alkoxy group. The alkyl group having 1 to 6 carbon atoms represented by R1A may be a linear or branched alkyl group, and examples thereof include a mercapto group, an ethyl group, a propyl group, an isopropyl group, a n-butyl group, a first-butyl group, and a third-order group. Butyl, n-pentyl, isopentyl, n-hexyl, or 2-ethylbutyl. Examples of the halogenated alkyl group having 1 to 4 carbon atoms represented by R1A include a gas group, a triazepine group, a trifluoromethyl group, or a 2-bromopropyl group. The alkoxy group having 1 to 4 carbon atoms represented by RA may be a decyloxy group or an ethoxy group. When R represents a strepyl, biphenylyl, naphthyl or anthracenyl group, the groups may be substituted by a substituent selected from the group consisting of a halogen atom (for example, (10), _, _ #), 秘, an alkyl group having 1 to 4 carbon atoms (e.g., methyl, ethyl, propyl, isopropyl 'n-butyl, one butyl, secondary butyl), having 1 carbon atom a decyloxy group of ~4 (e.g., an oxiranyloxy group, a hexyloxy group, a n-propoxy group, an isopropylidene group, a n-butoxy group). Specific examples of the filaments having a carbon number of i~1 () represented by a radical, a tertiary butyl group, a n-pentyl group, an isopentyl group, and R2A may be a mercapto group, an ethyl group: n-propyl group, an isopropyl group, or a n-butyl group. Base 'isobutyl, dibutyl pentyl, n-hexyl, positive 36 201243501 heptyl, n-octyl, underarm + pot 〒丞 壬 、, n-decyl and the like. Specific examples of the secret of methoxy~1() can be listed as oxime fA and n-octane; i, t:: isopropoxy group, and a specific example of a self-generated alkyl group having a number of R- atoms of 1 to 5 Keto, pentafluoroethyl 'perfluoro-n-propyl, perfluoro-n-butyl, all

Specific examples of the self-aeronautical secret of R n i &quot;1 material number 1 to 5 include dioxooxy group, pentaethoxyethoxy group, perfluoro-n-butoxy group f, and total gas n-pentyloxy group. Specific examples of the phenyl group which may be substituted by w represented by the positive +R of the mouse include o-nonylphenyl group, m-nonylphenyl group, p-tolyl group, o-ethylphenyl group, m-ethylphenyl group, and p-ethylphenyl group. , p-(n-propyl)phenyl, p-(isopropyl)phenyl, p-(n-butyl)phenyl, p-(isobutyl)phenyl, p-(tert-butyl)phenyl, p-(three Butyl)phenyl, p-(n-pentyl)phenyl, p-(isopentyl)phenyl, p-(tripentyl)phenyl, o-decyloxy, m-methoxyphenyl, p. Methoxyphenyl, o-ethoxyphenyl, m-ethoxyphenyl, p-ethoxyphenyl, p-(n-propoxy)phenyl, p-(isopropoxy)phenyl, p- Butoxy)phenyl, p-(isobutoxy)phenyl, p-(di-butoxy)phenyl, p-(tertiary butoxy)-p-yl-p-(n-pentyloxy)phenyl, (isopentyloxy)phenyl, p-(tripentyloxy)phenyl, p-chlorophenyl, p-bromophenyl, p-fluorophenyl, 2,4-dichlorophenyl, 2,4-dibromo Phenyl, 2,4-difluorophenyl, 2,4,6-trisylphenyl, 2,4,6-tribromophenyl, 2,4,6-trifluorophenyl, pentachlorophenyl, Pentabromophenyl, pentafluorophenyl, p-biphenyl, and the like. Specific examples of the naphthyl group which may be substituted by W represented by R2Am include 2-mercapto-1-cainyl, 3-mercapto-1-methyl, 4-methyl-1-caiyl, 5-methyl- 1-

S 37 201243501 Naphthyl, 6-fluorenyl-1-naphthyl, 7-fluorenylnaphthyl, 8-fluorenylnaphthyl, l-nonyl-2-naphthyl, 3-mercapto-2-naphthyl 4-methyl-2-naphthyl ' 5-methylnaphthyl, 6-fluorenyl-2-naphthyl, 7-methyl-2-naphthyl, 8-mercapto-2-naphthyl and the like. Specific examples of the mercapto group which may be substituted by W represented by R2Am include 2-indolyl-1-indenyl group, 3-indolyl fluorenyl group, 4-methylindolyl group, 5-nonyl fluorenyl group, 6- Mercapto-1-indenyl, 7-methyl-1-indenyl, 8-mercaptoindolyl, 9-mercapto-1-indenyl, 10-methyl-1-indenyl, 1-methyl- 2-indenyl, 3-methyl-2-indole, 4-methyl-2-indenyl, 5-methyl-2-indenyl, 6-methyl-2-indenyl, 7-decyl-2- Indenyl, 8-mercapto-2-indenyl, 9-mercapto-2-indenyl, 10-methyl-2-indyl, and the like. The dialkylamino group represented by R may, for example, be a dimethylamino group, a diyl group, a dipropylamino group, a dibutylamino group or a diphenylamino group. Specific examples of the alkyl group having 1 to 10 carbon atoms represented by R3A include an alkyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, an isobutyl group, a secondary butyl group, and a secondary butyl group. , n-pentyl, isopentyl, secondary pentyl, n-hexyl, n-heptyl, n-octyl, n-decyl, n-decyl and the like. Specific examples of the alkoxy groups of 3A j-methylpyrene having 1 to 10 carbon atoms: oxygen, ethoxy, n-propoxy, isopropoxy, n-butylpentyloxy, n-octyloxy Base, n-decyloxy, and the like. Specific examples of the dentate group having the m number of 1 to 1 listed in the soil can be based on quinone ethyl, all-gas n-propyl, all-gas n-butyl, and all ώ 3 Α ― table: base carbon butyl sulfhydryl, perfluoro-positive Pentoyloxy and the like. Specific examples of the phenyl group which may be substituted by w represented by the rolling base Wang Yongzheng 38 1 201243501 R may be o-tolyl, m-tolyl, p-nonylphenyl, o-ethylphenyl, m-ethyl phenyl, p-ethyl Phenyl, p-(n-propyl)phenyl, p-(isopropyl)phenyl, p-(n-butyl)phenyl, p-(isobutyl)phenyl, p-(tert-butyl)phenyl, (tertiary butyl)phenyl, p-(n-pentyl)phenyl, p-(isopentyl)phenyl, p-(tripentyl)phenyl, o-nonyloxyphenyl, m-methoxyphenyl , p-methoxyphenyl, o-ethoxyphenyl, m-ethoxyphenyl, p-ethoxyphenyl, p-(n-propoxy)phenyl, p-(isopropoxy)phenyl, (n-butoxy)phenyl, p-(isobutoxy)phenyl, p-(t-butoxy)phenyl, p-(tertiary butoxy)phenyl, p-(n-pentyloxy)phenyl , p-(isopentyloxy)phenyl, p-(tripentyloxy)phenyl, p-chlorophenyl, p-bromophenyl, p-fluorophenyl, 2,4-dichlorophenyl, 2,4- Dibromo-based, 2,4-fluorophenyl, 2,4,6-trisylphenyl, 2,4,6-trisylphenyl, 2,4,6-trifluorophenyl, pentaphenyl Pentabromophenyl, pentafluorophenyl, Biphenyl. Specific examples of the naphthyl group which may be substituted by W represented by R3AK include 2-hydrazino-1-methylyl, 3-methyl-1-naphthyl, 4-mercapto-1-naphthyl, 5-nonylylene. ,6-fluorenyl-1-naphthyl, 7-methyl-1-naphthyl, 8-indenylnaphthyl, i-methyl-2-nyl, 3-mercapto-2-naphthyl, 4- Mercapto-2-naphthyl, 5-fluorenyl-2-naphthyl, 6-fluorenyl-2-naphthyl, 7-fluorenyl-2-naphthyl, 8-mercapto-2-naphthyl and the like. Specific examples of the mercapto group which may be substituted by W represented by R3A include 2-indolyl-1-indenyl group, 3-mercapto-1-indenyl group, 4-methyl-1-indenyl group, 5-nonyl group- 1-indenyl, 6-fluorenyl-1-indenyl, 7-fluorenyl-1-indenyl, 8-methyl-1-indenyl, 9-fluorenyl-1-indenyl, 10-decyl- 1-fluorenyl, 1-mercapto-2-indenyl, 3-mercapto-2-indenyl, 4-mercapto-2-indenyl, 5-nonyl-2-indenyl, 6-fluorenyl- 2-indenyl, 7-methyl-2-indenyl, decyl-2-indenyl, 9-fluorenyl-2-indenyl, 1 indolyl-2-ylthiol, and the like.

S 39 201243501

The alkoxy group represented by w is an alkoxy group of ～10, the halogenated alkane having a carbon number of 1 to 5, an alkyl group having a M 10 atomic group, an i-alkyl group having a carbon number of 1 d, And a specific example of the halogen atom of the halogen atom: 15 is an alkoxy group or a carbon atom which has a number of carbon atoms represented by r2a or r3a and has a carbon number of 丨1. The same applies to the specific examples of the number of the alkyl group of the &amp; 5 and the halogenated alkoxy group of the carbon number of 5. R= and R|A may also be bonded to each other to form a 5-membered ring or a 6-membered ring. . When ^^ and ^ are bonded to each other to form a 5-membered ring or a 6-membered ring, the 5-membered ring or the 6-membered ring may be a carbocyclic group or a heterocyclic ring group, and for example, it may be cyclopentene or cyclohexene. Alkane, cycloheptane, pyrrole, furan, thiophene, imidazole, oxazole, thiazole, pyran, pyridine, pyrazine, morpholine, acridine or pyridazine ring. The 5-membered ring or the 6-membered ring may also be bonded to a benzene ring which may have an optional substituent, and examples thereof include tetralin, indane, hydrazine, dihydrobenzopyran, and Fluorene), xanthene or thioxanthene ring. The 5-membered ring or the 6-membered ring may further contain a carbonyl group, and examples thereof include a cyclohexadienone, a naphthone, and an anthrone ring. One of the suitable forms of the compound represented by the formula (2) is a compound represented by the following formula (2-1). The compound represented by the formula (2-1) is a compound which is bonded in the formula (2) to form a 5-membered ring.

(In the formula (2-1), r3A is synonymous with R3A in the formula (2), X represents an alkane 201243501 group, an alkoxy group or a halogen atom, and t represents an integer of 〇~3, and is too large at 7:3. The X groups may be the same or different.) The alkyl group represented by X is preferably a linear or branched alkyl group having a carbon number of 〜4. The alkoxy group represented by X is preferably a linear or branched alkoxy group having a carbon number of 丨4. The atom of the atom represented by X is preferably a fluorine atom. ‘,’ rolling in

t is preferably 0 or 1. Particularly preferred are the following compounds: in the formula (2_, t is 1, X is a methyl group, the substitution position of X is an ortho position, and the linear alkyl group having a subordination of 1 to 10 in Han 3A θ $, 7, 7_ a compound of the fluorenyl group or the p-tolyl fluorenyl group, wherein the compound (1) is a specific example of the fatty ore salt compound represented by the formula (2-1). a compound (H), a compound (exhibition), a compound, etc., which may be used singly or in combination with the compound (1) to the compound (iv) in a form of a commercially available product at a temperature of 2°. It can be used in combination with other kinds of photoacid generators.

One of the preferred forms of the compound represented by the formula is:

RlA represents an alkyl group having 1 to 4 carbon atoms, a trifluoromethyl group, a stupid, a chlorophenyl group, a dichlorophenyl group, a decyloxyphenyl group, a 4-biphenyl group, a naphthyl group or a fluorenyl group. 201243501 R2A And a halogenated group having 1 to 10 carbon atoms; a halogenated alkyl group having 1 to 5 carbon atoms; and 1 to 5 carbon atoms; a haloalkoxy group, a phenyl group which may be substituted by w, a naphthyl group which may be substituted by W or a fluorenyl group which may be substituted by W, and W represents a halogen atom, a cyano group, a nitro group, an alkane having 1 to 1 ring of carbon atoms. The group has an alkoxy group having 1 to 1 carbon atom, a halogenated alkyl group having 1 to 5 carbon atoms or a halogenated alkoxy group having 1 to 5 carbon atoms. The compound represented by the formula (2) is also preferably a compound represented by the following formula (2-2).

In the formula (2-2), 'R4A represents a halogen atom, a transradical group, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms or a nitro group, and L represents an integer of 0 to 5; . R3A represents an alkyl group having 1 to 1 ring of carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a halogenated alkyl group having 1 to 5 carbon atoms, and an i-alkoxy group having 1 to 5 carbon atoms. a phenyl group which may be substituted by w, a naphthyl group which may be substituted by W or a fluorenyl group which may be substituted by W, and W represents a halogen atom, a chaotic group, an exact group, a group having 1 to 10 carbon atoms, and a carbon number. It is a methoxy group of 1 to 10, a halogenated group having 1 to 5 carbon atoms or a halogenated alkoxy group having 1 to 5 carbon atoms. R3A in the formula (2-2) is preferably methyl, ethyl, n-propyl, n-butyl, n-octyl, trifluoromethyl, pentafluoroethyl, perfluoro-n-propyl, perfluoro-positive 42 201243501 Butyl, p-tolyl, 4-phenylphenyl or pentafluorophenyl is particularly preferably methyl, ethyl, n-propyl, n-butyl or p-nonylphenyl. The fang atom represented by r4A is preferably a fluorine atom, a chlorine atom or a bromine atom. ,

The alkyl group having 1 to 4 carbon atoms represented by 4 A is preferably a mercapto group or an ethyl group. The silk group having a carbon number represented by R4A is preferably a methoxy group or an ethoxy group. L is preferably 〇~2, and particularly preferably 〇~1. Among the compounds to be represented, a preferred form of the compound contained in the compound represented by the formula (2-2) is a form in which R represents a phenyl group or a 4-decyloxyphenyl group, and represents an aryl group, and the r3a table Undecyl, ethyl, n-propyl, n-butyl or 4-tolyl. The compound represented by the above formula (1) is also preferably a compound represented by the following formula.

(In the formula (1_2), R1 represents an alkyl group, an aryl group or a heteroaryl group, and R2 each independently represents a hydrogen atom, a pyridyl group, an aryl group or a 4-membered atom, and R6 is independently an ε:, a decyl group, an alkoxy group, a carboxylic acid group. , amino secret or porphyrin based on the shellfish, X is not 〇 or S, η represents i or 2, m represents 整数 ~ £: 43 201243501 6 integer.) In the resin composition of the present invention, the weight fraction In other words, it is preferred to use 0.1 part by weight of a photoacid generator in a content of t A, and more preferably a component (reagent D) D) photoacid generator of G. 5 parts by weight. The component (component E) thermal crosslinking agent of the present invention preferably contains the right side of the resin composition of the present invention, and the component E in the present invention is a component called a tempering film. It is not a secret, t component. Moreover, the component == is required; there is a = oxygen resin. The ring having an epoxy group is particularly preferably added as the component E, relative to the content of the component a, It is preferably 0.05 parts by weight to 5 parts by weight, more preferably 5% by weight to 10 parts by weight, more preferably 5% by weight to 5 parts by weight. (Component F) alkali-insoluble resin Resin composition of the present invention The component preferably contains (component F) an alkali-insoluble resin. Component F is an alkali-insoluble resin defined below and is a compound other than component A. Component F may not be produced when added to the resin composition of the present invention. a resin which has problems such as white turbidity, surface roughness, precipitation, etc. due to phase separation from other components. In the present invention, the term "alkali-insoluble" in the component F means that a solution of the compound (resin) is applied onto a substrate. Heating at 9 ° C for 2 minutes 44 20 The coating film of the compound (resin) formed by 1243501 (thickness is 4 μ 〇 for 23 Å. The dissolution rate of the 2.38-based aqueous ammonium hydroxide solution is less than 0.01 μm/sec. The component F can be enumerated as an insoluble epoxy resin. Or an acrylic resin, a styrene resin, a "resin, a polyacrylonitrile resin, a polycarbonate resin, a polycondensation resin", a carboxylic acid § resin, a heterophenyl quinone tree 笙 m, an epoxy resin, etc. The (cross-linking) insoluble resin with thermal crosslinkability can also be used as (component E) heat-crossing. However, the content of the insoluble resin is not a repair but a two-second hair: = 4 = final heat treatment The component of the hardened functional group is: a component which is also a functional component of the cross-linking agent. It is hardened as a single n-F, and is also cross-linked by reacting with a component such as a terpene component. Moreover, in the component group and the heterocyclic ring When the residue is protected by a butyl group, the hydroxyl group is crosslinked by an acid group. The compound having a carboxyl group or a phenolic hydroxyl group is exemplified by an epoxy group. Epoxy and/or oxyheterocyclic epoxy resins can be cited as double A penalty and deducting rouge, phenol secret varnish type epoxy tree enamel, double ❹ type epoxy tree joint stupid ring her purpose / type =;: / material _ oxygen resin, resin, aliphatic epoxy resin. , day, 3 epoxy with a fatty city structure

S 45 201243501

Examples of the bisphenol A type epoxy resin include JER827, JER828, JER834, JER1001, JER1002, JER1003, JER1055, JER1007, JER1009, JER1010 (above manufactured by Mitsubishi Chemical Corporation), EPICLON860, EPICLON1050, EPICLON1051, and EPICLON1055 (above Manufactured by DIC Co., Ltd., etc.; bisphenol F type epoxy resins include JER806, JER807, JER4004, JER4005, JER4007, JER4010 (above manufactured by Mitsubishi Chemical Corporation), EPICLON830, EPICLON835 (above manufactured by DIC Corporation) ), LCE-21, RE-602S (the above is manufactured by Sakamoto Chemical Co., Ltd.), etc.; phenol novolac type epoxy resins include JER152, JER154, JER157S65, and JER157S70 (the above is manufactured by Mitsubishi Chemical Corporation). EPICLON N-740, EPICLON N-740, EHCLON N-770, EPICLON N-775 (manufactured by DIC Corporation), etc.; cresol novolak type epoxy resin can be listed as EPICLON N-660, EPICLON N-665, EPICLON N-670, EPICLON N-673, EPICLON N-680, EPICLON N-690, EPICLON N-695 (above by DIC Co., Ltd. Manufactured), EOCN-1020 (above manufactured by Sakamoto Chemical Co., Ltd.); biphenyl type epoxy resin can be listed as YX-4000, YX-4000H, YL6121H, YL-6640, YL-6677, YX-7399 ( The above is made of Mitsubishi Chemical Co., Ltd., etc.; the naphthalene type epoxy resin may be EPICLON HP-4032D, EPICLON HP-4700 (manufactured by DIC Corporation) or the like; and the epoxy resin having an alicyclic structure may be exemplified by EPICLON. HP-7200 (manufactured by DIC Corporation), XD-1000 (manufactured by Nippon Kayaku Co., Ltd.), etc.; aliphatic epoxy resins include ADEKA RESIN EP-4080S, ADEKA RESIN 46 201243501 EP-4085S, ADEKA RESIN EP- 4088S (above manufactured by ADEKA Co., Ltd.), Celloxide 2021P, Celloxide 2081, Celloxide 2083, Celloxide 2085, EHPE 3150, EPOLEAD PB 3600, EPOLEADPB 4700 (above manufactured by Daicel Chemical Industry Co., Ltd.) and the like. In addition, ADEKA RESIN EP-4000S, ADEKA RESIN EP-4003S, ADEKA RESIN EP-4010S, ADEKA RESIN EP-4011S (above manufactured by ADEKA Co., Ltd.), NC-2000, NC-3000, NC- 7300, EPPN-501, EPPN-502 (above manufactured by ADEKA Co., Ltd.), JER1031S (manufactured by Mitsubishi Chemical Corporation), and the like. These epoxy resins may be used alone or in combination of two or more. As the acrylic resin, a polymer and a copolymer of a (meth) acrylate monomer can be used. Examples of such a monomer include (meth) acrylate, (meth) acrylate, (mercapto) acrylate, and (decyl) acrylate. Ester, n-butyl (mercapto) acrylate, isobutyl (meth)acrylate, butyl (meth) acrylate, hexamethylene (meth) acrylate, (meth) acrylate-2 -ethylhexyl vinegar, (meth)acrylic acid, ethyl oxyacetate, phenyl (meth) acrylate, (meth) acrylate 2-methoxy ethane, (mercapto) propionate -2-ethoxyethyl g, (indenyl)acrylic acid 2 - (2. methoxyethoxy) ethyl ester, (decyl) hexyl hexyl acrylate, benzyl (meth) acrylate, polypropylene glycol Monoterpene ether (meth) acrylate, and the like. These monomers may be polymerized by hydrazine alone or in combination of a plurality of copolymers. Further, 'if it is a range in which the alkali insolubility can be maintained, a small amount of a buffer, a hydroxyl group or an ethylene oxide may be copolymerized in the (meth) acrylate monomer using C: 47 201243501. The repeating unit, the monomer of the repeating unit of propylene oxide = the polymer formed. Examples of such a monomer include acrylic acid, methacrylic acid, butyric acid, (X-gas acrylic acid, cinnamic acid, maleic acid, fumaric acid, itaconic acid, citronic acid, mesaconic acid, and ω-carboxyl polycondensate). Lactone monoacrylate, ω-carboxy polycaprolactone monodecyl acrylate '-2-carboxyethyl acrylate, carboxyethyl methacrylate, monoalkyl maleate, monoalkyl fumarate, 4-carboxy styrene, 2-hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, diethylene glycol monomethyl ether (fluorenyl) Acrylic acid 曰, monoethyl alcohol monoethyl ether (mercapto) acrylate, diethylene glycol monophenyl ether (meth) acrylate, triethylene glycol monomethyl ether (meth) acrylate, triethylene glycol monoethyl ether (fluorenyl) acrylate, dipropylene glycol monoterpene ether (meth) acrylate, polyethylene glycol monomethyl ether (meth) acrylate, etc. It is preferred to use a polymer of the above (fluorenyl) acrylate The ester polymer has a small amount of repeating units having a carboxyl group, a hydroxyl group, an ethylene oxide, and a weight of propylene oxide. Further, a polymer obtained by copolymerizing a monomer having a crosslinkable group such as an epoxy group or an oxetanyl group in a polymer of a monomer of the unit. Examples of such a monomer include glycidyl acrylate and fluorenyl group. Glycidyl acrylate, α-glycidyl methacrylate, glycidyl propyl acrylate, glycidyl α-n-butyl acrylate, _3,4_butylene acrylate, methacrylic acid _3 , 4-epoxybutyl acrylate, _6,7-epoxyheptyl acrylate, _6,7-epoxyheptyl methacrylate, α_ethyl acrylate _6,7-epoxyheptyl ester, o-vinyl Benzyl glycidyl ether, m-vinylbenzyl glycidyl ether, p-vinylbenzyl glycidyl ether, alicyclic epoxide containing aliquots as described in paragraphs 0031 to 35 of Japanese Patent No. 4,184,443 48 201243501 The compound of the rack, etc. is an example of a free form of the monomer unit for forming an oxo-hetero group, and for example, a Japanese patent special open dress = (==;=; paragraph (8) The oxirane described in 16 is used in the monopoly, and more preferably the monomer can be condensed with methyl methacrylate. The compound containing the alicyclic epoxide matrix described in Japanese Patent Laid-Open No. 443, paragraph 0034 to paragraph 0035, and the paragraph of the Japanese Patent Correction _33Q953. The (meth) propyl group having an oxetanyl group described in the above is preferably derived from a propene acid (^·ethyloxeane _ from the viewpoint of heat-resistant transparency). a monomer unit of any of methyl ketone and methyl propyl phthalate (3-ethyl oxa, butan-3-yl) decyl ester. These monomer units may be used alone or in combination. Two or more types are used in combination. The amount of the component F added is preferably 3 parts by weight to 4 parts by weight, more preferably 5 parts by weight to 35 parts by weight based on 100 parts by weight of all solid contents of the resin composition. The part by weight is still more preferably 8 parts by weight to 3 parts by weight. (Component G) Dispersant The resin composition of the present invention preferably contains (Component G) a dispersant. Any dispersing agent can be used if the dispersing agent is a dispersing agent which can improve the dispersibility of the (component B) particles. Such commercially available dispersing agents include Disperbyk 101, Disperbyk 102, Disperbyk 103, Disperbyk 108, Disperbyk 109, g 49 201243501.

Disperbyk 100, Disperbyk 111, Disperbyk 112, Disperbyk 116, Disperbyk 130, Disperbyk 140, Disperbyk 142, Disperbyk 145, Disperbyk 161, Disperbyk 162, Disperbyk 163, Disperbyk 164, Disperbyk 166, Disperbyk 167, Disperbyk 168, Disperbyk 170, Disperbyk 174 , Disperbyk 180, Disperbyk 182, Disperbyk 183, Disperbyk 185, Disperbyk 190, Disperbyk 191, Disperbyk 193, Disperbyk 194, Disperbyk 198, Disperbyk 2000, Disperbyk 2001, Disperbyk 2008, Disperbyk 2009 'Disperbyk 2010, Disperbyk 2012, Disperbyk 2015, Disperbyk 2022, Disperbyk 2025, Disperbyk 2050, Disperbyk 2070, Disperbyk 2096, Disperbyk 2150, Disperbyk 2155, Disperbyk 2163, Disperbyk 2164, Disperbyk-Pl04, Disperbyk-P104S, Disperbyk 105 (above BYKChemie), EFKA4008, EFKA4009, EFKA 4010 , EFKA 4015, EFKA 4020, EFKA 4046, EFKA 4047, EFKA 4050, EFKA 4055, EFKA 4060, EFKA 4080, EFKA 4400, EFKA 44 (U, EFKA 4402, EFKA 4403, EFKA 4406, EFKA 4408, EFKA 4300, EFK A 4330, EFKA 4340, EFKA 4015 ' EFKA 4800 ' EFKA 5010 ' EFKA 5065 &gt; EFKA 5066 &gt; EFKA 5070 , EFKA 7500 , EFKA7554 (above manufactured by Ciba Specialty Chemicals Co., Ltd.); Solsperse 3000, Solsperse 9000, Solsperse 13000, Solsperse 16000, Solsperse 17000, Solsperse 18000, Solsperse 20000, Solsperse 21000, Solsperse 24000, Solsperse 26000, Solsperse 27000, Solsperse 28000, Solsperse 32000, Solsperse 32500, Solsperse 32550, £50 201243501

Solsperse 33500, Solsperse 35100, Solsperse 35200, Solsperse 36000, Solsperse 36600, Solsperse 38500, Solsperse 41000, Solsperse 41090, Solsperse 20000, Solsperse D540 (above manufactured by The Lubrizol Corporation); Ajisper PA111, Ajisper PB711 'Ajisper PB821 ' Ajisper PB822 'Ajisper PB824 (above manufactured by Ajinomoto Fine-Techno Co., Inc.); Disparlon 1850, Disparlon 1860, Disparlon 2150, Disparlon 7004, Disparlon DA-100, Disparlon DA-234, Disparlon DA-325, Disparlon DA-375, Disparlon DA-705, Disparlon DA-725, Disparlon PW-36 (above manufactured by Shihua Chemical Co., Ltd.); and FLOWLEN DOPA-14, FLOWLEN DOPA-15B, FLOWLEN DOPA-17, FLOWLEN DOPA-22, FLOWLEN DOPA- 44. FLOWLEN TG-710, FLOWLEN D-90 (above manufactured by Kyoei Chemical Industry Co., Ltd.), ANTI-TERRA-205 (manufactured by BYK Chemie Co., Ltd.), and the like. The dispersing agent may be used alone or in combination of two or more. Particularly in the present invention, the dispersing agent is preferably a dispersing agent having a predetermined acid value (hereinafter also referred to as "acid value dispersing agent"). The acid value dispersant has good adsorptivity to inorganic particles, and as a result, good dispersibility can be obtained, and the viscosity of the pigment dispersion can be made low. Specific examples of the acid value dispersant can be enumerated

Disperbyk P104, Disperbyk P104S, Disperbyk 220S, Disperbyk 110, Disperbyk 111, Disperbyk 170, Disperbyk 171, Disperbyk 174, Disperbyk 2095 (above BYK Chemie); EFKA 5010, EFKA 5065, EFKA 5066, EFKA 5070, EFKA 7500, EFKA 7554 (above by Ciba Specialty Chemicals Co., Ltd.; 51 201243501); Solsperse 3000, Solsperse 16000, Solsperse 17000, Solsperse 18000, Solsperse 36000, Solsperse 36600, Solsperse 41000 (above by Lubrizol). The content of the dispersing agent in the resin composition of the present invention is preferably 50 parts by weight to 3,000 parts by weight, more preferably 100 parts by weight to 2,000 parts by weight, still more preferably 150, based on 100 parts by weight of the component B. Parts by weight to 1,500 parts by weight. &lt;Other components&gt; The resin composition of the present invention may further contain other components than the components A to G. As the other component, it is preferable to add (component H) sensitizer or (component) development accelerator from the viewpoint of sensitivity. In addition, the resin composition of the present invention preferably contains (Component J) adhesion improving agent from the viewpoint of adhesion of the substrate, and preferably contains (component κ) basic compound from the viewpoint of liquid storage stability; self-coating property The viewpoint considers that it is preferable to contain (component L) surfactant (fluorine-based surfactant, anthrone-based surfactant, etc.). In addition, the resin composition of the present invention may be added (component antioxidant, (component N) plasticizer, (component 〇) thermal radical generator, (component P) thermal acid generator, (component q)) A known additive such as an acid multiplier, a UV absorber, a thickener, and an organic or inorganic anti-precipitant. Hereinafter, the component (component H) sensitizer may be added to other components which may be contained in the resin composition of the present invention. s 52 201243501 In the resin composition of the present invention, in combination with the above-mentioned (component D) photoacid generator, (component H) sensitizer may be added in order to promote decomposition thereof. The sensitizer absorbs active light or The radiation is in an excited state, and the sensitizer which is in an excited state is brought into contact with the photoacid generator to cause movement of electrons, energy movement, heat generation, etc. The photoacid generator is chemically changed to be decomposed to generate an acid. Examples of the agent include compounds belonging to the following compounds and having an absorption wavelength in a region of 350 nm to 450 nm. Polynuclear aromatics (e.g., ruthenium, osmium, triphenylene, anthracene), oxalate Classes (such as fluorescein, blush, red erythroside, rhodamine B, bengal rose red), xanthenes @similar (such as oxazepine g, sigh. ketone, diterpene. Ethylthioxanthone), cyanines (e.g., thiocarbonate, carbocyanine), merocyanines (e.g., merocyanine, carbon merocyanine), rhodacyanie, oxaphthalocyanine, Sexazines (such as thionine, fluorenyl blue, indole quinone blue), 吖 ° 疋 (such as biting, flavonoids, flavonoids), biting the same kind (such as 吖σ Ketone, 10-butyl ketone ketone), guanidines (such as 蒽@昆), squarylium Cyanine (such as squaraine), stupid vinyl, basic styrene, coumarin Among the sensitizers, such as genus, 丫 、, coumarin, and styrene, are particularly preferred among the sensitizers (for example, 7-diethylamino-4-methyl coumarin). A commercially available sensitizer can be used, and it can also be synthesized by a well-known method. The amount of the sensitizer added is based on (component D) photoacid from the viewpoint of sensitivity and clarity. More preferably 100 parts by weight of the generating agent

C 53 201243501 is 20 parts by weight to 300 parts by weight, particularly preferably 3 parts by weight to 2 parts by weight. (Component I) Development Accelerator In the present invention, the liposome preferably contains (Component I) a development accelerator. As the (component I) development accelerator, any compound having a development promoting effect can be used, which is preferably at least i selected from the group consisting of a carboxyl group, an alkylene oxychrome, and an alkylene oxy group. The compound of the structure 'is more preferably a compound having a money base. Specifically, a compound having an acid dissociable group-protected group or a greenish group is preferred. The molecule nr; ±L· ' ' is more preferably 15 〇 to 1,500, and particularly preferably 15 〇 to i, . An example of a Lexon-Beiying agent is a compound having a rhodium-based oxy group which can be synthesized by the method of J-brown poly-alcohol, methyl ether of polyethylene glycol, and Japanese Patent No. 9.222724.特 + IS IS IS IS IS IS IS IS IS IS IS IS IS IS IS IS IS IS 06 06 06 06 06 06 06 06 06 06 06 06 06 06 06 06 06 06 06 06 06 06 06 06 06 06 06 06 06 06 06 . Now

The compound having a phenolic hydroxyl group can be exemplified by Japanese Patent No. M, Japanese Patent No. 9-194415, Japanese Patent No. 9-194415, Japanese Patent No. U_17181G, and Japanese Patent Special Open 20 (^^6 bulletin ^ newspaper, Japanese newspaper Japanese Patent Laid-Open No. 2〇〇3 43679, etc.

S 54 201243501 The compound described. Among these compounds, a suitable compound of h-class, more preferably, the number of rings of the benzene ring is 2 to 1〇1, and it can also be converted into a resin composition (ingredient I). ϊ, from the viewpoint of sensitivity and residual film rate, the splayed shirt promotes the content of 100 parts by weight and t, preferably 01 $ U is preferably 0.2 parts by weight for the component 8% ~ 20 Cao Jinsong, jil yK 〇 heavy parts, . Particularly preferred development accelerators are exemplified by 1S 1 to 5 phenol compounds 10-133366, which are disclosed as dissolution promotion; patents; (Component I) development accelerators can be single-etched, - compounds. More preferably, 10 or more parts of the two or more agents are 0.5 parts by weight. It is preferably 0.2 parts by weight to 20 parts by weight. (Component J) Adhesive Modifier The resin composition of the present invention preferably contains (the component can be used in the resin composition of the present invention, or the modifier is used as an inorganic substance (for example, 矽, 童成/刀J) the adhesion-improving compound 'metal, copper, metal, etc.) and the insulation = followed by = ί; the compound used in the Ming Dynasty (the composition of the adhesion modifier of the 丄 丄 2 疋 表面 表面 表面 表面 表面 表面 表面 表面The adhesion improving agent is not particularly limited. Preferred examples of the ceramsite coupling agent include &gt;aminopropyltrimethoxycarbazide, γ-aminopropyltriethoxywei, γ, and glyceryloxypropyl group. Trisodium oxide, γ-glycidoxypropyl alkyl dialkoxy decane, γ-methyl propylene I! oxypropyl trisodium oxide 11 hospital, γ, methyl propoxy propyl Pyridyl 2,oxy 7 calcination, γ-chloropropyl sarsyl, (tetra)propyl propyl 55 55 201243501 trialkoxy decane, |3-(3,4-epoxycyclohexyl)ethyltrialkoxy矽 、, vinyl trialkoxy decane. Among these decane coupling agents, γ-glycidoxypropyl trialkoxy decane and γ-fluorenyl group are more preferable. Further, propylene methoxy propyl trialkyloxy decane is further more preferably γ-glycidoxypropyl trialkoxy decane. These compounds may be used singly or in combination of two or more. 3 = of the (component J) adhesion improving agent in the resin composition is preferably 〇1 part by weight to 20 parts by weight, more preferably 0.5 part by weight to 1 part by weight based on 1 part by weight of the component Α. (Component K) Authentic Compound The resin composition of the present invention preferably contains (Component K) a basic compound. _ (Component K) The basic compound can be arbitrarily selected from those used in the chemical amplification resist. Examples thereof include an aliphatic amine, an aromatic amine, a heterocyclic amine, a quaternary ammonium hydroxide, and a quaternary ammonium salt of a carboxylic acid. Examples of the aliphatic amine include tridecylamine and diethylamine. , triethylamine, monopropylamine, tri-n-propylamine, di-n-pentylamine, tri-n-pentylamine, diethanol, f, triethanolamine, dicyclohexylamine, dicyclohexylmethylamine, etc. Examples of the mono-arylamine include aniline, benzylamine, N,N-dimethylamine, Diphenylamine, etc. Examples of the heterocyclic amine include pyridine, 2-methylpyridine, 4-methylpyridine, methylethylpyridine, 4-ethylpyridine, 2-phenylpyridine, 4-phenylpyridine, N_. I-phenyl pyridine, 4-dimethylaminopyridine, imidazole, benzimidazole, 4-pyrimazole, 2-phenylbenzimidazole, 2,4,5-triphenylimidazole, smog, smoker, amine Quinolin, 8_g-quinoline, pyridinium, oxime, sit, pyridazine, oxime 7, D-pyrrolidine, acridine, pyridazine, morpholine, 4-methylmorpholine, hydrazine, diazepine

S 56 201243501 Bicyclo[4.3.〇]-5-pinene, 1,8-diazabicyclo[5.3.〇]-7-undecene and the like. Examples of the quaternary ammonium hydroxide include tetradecyl ammonium hydroxide, tetraethyl emulsified alcohol, tetra-n-butyl chlorohydroxide, tetra-n-hexyl ammonium hydroxide, and the like. Examples of the quaternary ammonium salt of the carboxylic acid include tetradecyl ammonium acetate, ammonium tetramethyl benzoate, tetra-n-butyl ammonium acetate, and tetra-n-butyl benzoic acid. The basic compound which can be used in the present invention may be used singly or in combination of two or more. The content of the (component K) basic compound in the resin composition of the present invention is preferably 0.001 part by weight to 1 part by weight, more preferably 0.002 part by weight, per part by weight of the component A. 〇 2 parts by weight. (Component L) Surfactant (Fluorine Surfactant, Astragalus Surfactant, etc.) The resin composition of the present invention preferably contains (Component L) a surfactant (a gas surfactant, a sulphate) Surfactant, etc.). The surfactant (3) comprising the structural unit A and the structural unit B shown below is exemplified as a preferred example of the surfactant. The weight average molecular weight (Mw) of the copolymer is preferably 1,000 or more; 10 Å or less, more preferably 1,500 or more and 5,000 or less. The weight average molecular weight is a value in terms of polystyrene measured by a gel permeation chromatograph (GPC).

£ 57 201243501 In the copolymer (3), 1121 and 八..., R22 represents that Wei is 1 or more and 4 is independently represented by a hydrogen atom or a hydrogen atom, or a carbon number is 1 or more and 4 is a straight line of τ order. Extending the base of the mountain, R24 means the alkyl group below 6 and the p and the second soil. The carbon number of the table is 3 to indicate the percentage of heavy weight of 10 wt% or more and 80 wt ° / Q or less. p 90 wt% The following numerical values represent ^, and q represents an integer of 2 〇 wt% or more and 1 or more and 10 or less. An integer of 18 or less, n represents that L in the structural unit 8 is preferably a stretching group represented by the following formula (4). &gt;25 (4) • CHgCH- In the formula (4), R25 represents an alkyl group having a carbon number of 1 or more and 3 or less, and more preferably a carbon number, and preferably a sum of p and q (= is, the number is 2 Or a burning base of 3. loowt%. q] is p+q^ioo, that is, as a fluorine-based surfactant, and a stone-like body, an example of the patented special-opening active agent can be cited. -226746, Japanese Patent Special 663唬, Japanese Patent Special Kelly Open Zhao Bicong No., Japanese Patent _Ping 7·230165, Japan 63·3 Side No., Japanese B 9-54432 „ ^' 2001- For the 330953 'sex agent', a commercially available surfactant can also be used. For example, the surface active agent can be exemplified by £ftopEF301 and EF303 (the above is manufactured by the two f-field Tianling comprehensive 58 201243501 materials electronic company) , FluoradFC430, 431 (above manufactured by Sumitomo 3M Co., Ltd.), Megafac F171, F780F, F173, F176, F189, R08 (above manufactured by DIC Corporation), Surflon S-382, SC01, 102, 103, 104, 105, 106 (above manufactured by Asahi Glass Co., Ltd.), p〇lyF〇x series (manufactured by OMNOVA), etc. A fluorine-based surfactant or an anthrone-based surfactant. Further, an anthrone-based polymer κρ-341 (manufactured by Shin-Etsu Chemical Co., Ltd.) can be used as an anthrone-based surfactant. The fluorochemical surfactant and the fluorenone surfactant may be used in combination. The (component L) surfactant (fluorinated surface) in the resin composition of the present invention may be used. The amount of the active ingredient and the surface active solution of the lysate is preferably 1 part by weight or less, more preferably 0.01 part by weight, more preferably 0.01 part by weight, based on 100 parts by weight of the component A. Parts ~! Weight I Heavy (10), more preferably _ (Component M) The antioxidant may further contain (Component m) an antioxidant through the resin composition. The film thickness reduction due to decomposition may be reduced. In the antioxidant, the antioxidant may be, for example, a phosphorus antioxidant: = minus f. Zinc sulfite, a saccharide, a nitrite, a sulfite, an acid, an amine derivative, etc. Among these compounds, from In view of the above, it is preferable to use a mixture of two or more kinds of these compounds, and a commercially available product of a phenolic antioxidant, for example, Adekastab AO-60, may be mentioned. Adekastab AO-80 (above manufactured by ADEKA Co., Ltd.) and Irganox 1098 (manufactured by Nippon Ciba Co., Ltd.). The content of the (Component M) antioxidant is preferably 〇_1 wt% to 6 wt〇/0, more preferably 〇.2 wt% to 5 wt%, with respect to all solids of the resin composition. It is 5.5 wt%~4 wt%. When it is in this range, sufficient transparency of the formed film can be obtained, and the sensitivity at the time of pattern formation also becomes good. Further, as an additive other than the antioxidant, a new expansion of the polymer additive (Nikkan Kogyo Shimbun Co., Ltd.), various ultraviolet absorbers or metal deactivators described in the above may be added to the resin composition of the present invention. (Component N) Plasticizer The resin composition of the present invention may further contain (Component N) a plasticizer. (Ingredient N) A plasticizer may, for example, be dibutyl phthalate, ortho-benzoate; Octyl ester, di(dodecyl) phthalate, polyethylene glycol, propylene glycol, dimercapto glycerol o-didecanoate, dibutyl tartrate, dioctyl adipate, triethyl Mercaptotriol or the like. The content of the (component N) plasticizer in the resin composition of the present invention is preferably in the range of 1 part by weight based on the content of the component A. The part by weight is more preferably 1 part by weight to 10 parts by weight. (Component Ο) Thermal radical generating agent The resin composition of the present invention may further comprise (component 〇) thermal radical m in the presence of, for example, an ethylenically unsaturated double bond. For the compound 201243501 ethylenically unsaturated compound, it is preferred to contain (Component 〇) Thermal radical generator. A known thermal radical generator can be used as the thermal radical generator. The thermal radical generator generates radicals due to heat energy, thereby starting or promoting polymerization of the polymerizable compound. By adding a thermal radical generating agent, the obtained cured film may be made tougher and heat resistance and solvent resistance may be improved. Preferred examples of the thermal radical generating agent include aromatic ketones and rust salts. Compound, organic peroxide, thio compound, hexaaryldiimidazole compound, ketoxime compound, borate compound, azine rust compound, metallocene compound, active ester compound, compound having carbon tooth bond, azo A compound, a bibenzyl compound, etc. (Component 〇) The thermal radical generating agent may be used singly or in combination of two or more kinds thereof. The content of the (component 〇) thermal radical generating agent in the resin composition of the present invention. From the viewpoint of improving the physical properties of the film, when the content of the component Α is 100 parts by weight, it is preferably 〇 part by weight to part by weight, more preferably 0.1 part by weight. The amount is preferably 20 parts by weight, and most preferably 5% by weight to 1 part by weight. (Component Ρ) Thermal acid generator The resin composition of the present invention may further contain (component Ρ) thermal acid generator. The agent is a compound which generates an acid due to heat, and the thermal decomposition point is preferably 13 (TC~25 (TC, more preferably 15 (rc~220. The compound of the range of 〇) is, for example, a sulfonic acid or a carboxylic acid which can be generated by heating. a compound of a low nucleophilic acid such as an acid or a disulfonimide. The resulting Ssl is a continuous acid having a pKa of 2 or less or an alkyl or aryl carboxylic acid substituted by an electron withdrawing group 201243501, The electron-withdrawing group may be a disulfonimide or the like. The electron-withdrawing group may be a halogen atom such as a fluorine atom or a haloalkyl group such as a trifluoromethyl group, a nitro group or a cyano group. Further, in the present invention, it is also preferred to use substantially An acid which does not generate an acid due to irradiation of exposure light, but which generates an acid due to heat. The molecular weight of the thermal acid generator is preferably 230 to 1, more preferably 230 to 800. The content of the thermal acid generator in the resin composition is preferably from 5 parts by weight to 20 parts by weight, particularly preferably from 1 part by weight to 15 parts by weight, per 100 parts by weight of the component A. (Component Q) Acid Proliferator The resin composition of the present invention can be used (component Q) for the purpose of improving the sensitivity. The acid-proliferating agent to be used in the present invention is a compound which can further generate an acid by an acid catalyst reaction to increase the acid concentration in the reaction system, and is a compound which stably exists in the absence of an acid. Such a compound can increase more than one St in a single reaction, so that the reaction proceeds to accelerate the reaction, and the generated acid itself induces self-decomposition. Therefore, the strength of the acid generated here is preferably an acid dissociation constant. The pKa is 3 or less, and particularly preferably 2 or less. Specific examples of the acid-proliferating agent include paragraphs 0016 to 0055 of Japanese Patent Laid-Open No. 1 〇 〇 〇 〇 么 # 020 020 020 020 020 020 020 022 022 022 022 022 022 022 022 022 022 022 022 022 022 022 022 022 022 022 022 022 022 022 022 022 022 022 022 022 022 022 The compound described in Japanese Patent Publication No. Hei 9-512498, page 39, line 12 to page 47, line 2. The acid multiplying agent which can be used in the present invention is decomposed by an acid generated by an acid generator, and produces an acid having a pKa of 3 or less as follows.

S 62 201243501 Methanesulfonic acid, benzenesulfonic acid, trifluoromethanesulfonic acid, gas acetic acid, tri-gas acetic acid, phenylphosphonic acid, and the like. Two == Cheng Kao = 'Two light parts and unproduced agent 100 heavy 詈 Pair (Component D) Photoacid and · King piece j ιυυ room injury and Lu is preferably 1 part by weight ~] More preferably 20 parts by weight ~ 5 〇〇 by weight. , severely wounded, (manufacturing method of hardened material) The method of manufacturing the rigid recording method of the hard recording, such as the use of the present invention = 曰, = cured product is not particularly limited, = to ^ sequentially includes steps (a) ~ steps (The sound of the hardened material of the invention is changed, and the shape of the cured product of the invention may be any shape, and may be any shape as in the method of the step (4) of the film u (). A cured product in the form of a pattern as described later: \a) a coating step 'application of the resin composition of the present invention on a substrate; an agent; b) a solvent removal step 'removing the dissolution U from the applied resin composition) The heat treatment step 'heats the resin composition from which the solvent has been removed. The steps are described in order below. &lt;Coating Step (Step (a)) &gt; The method for producing a cured product of the present invention preferably comprises (a) a coating step of applying the resin composition of the present invention onto a substrate. ^ In step (a), 'preferably apply the resin composition of the present invention to a substrate of a standard' to remove the solvent by depressurization and/or heating (prebake), thereby forming the desired drying by £63 201243501. Coating film. The substrate material which can be used in the present invention may be ruthenium, ruthenium dioxide, aluminum oxide, glass, glass, ceramics, gallium fluoride, indium phosphide, copper, nickel, iron, steel, copper-bismuth. Alloy, glass coated with indium-tin oxide; organic film of two; any substrate containing a patterned region of metal, semiconductor, and insulating material, but not limited thereto, before coating the resin composition, A baking step is performed on the substrate to remove the absorbed (four) minus. For example, a slit coating method, a spray method, a light coating method, or a spin coating method can be used. In the case of a large substrate, a slit coating method is preferred among the above methods. The large substrate referred to herein means a substrate having a size of h or less on each side. m &lt; solvent removal step (step (b)) &gt; The method for producing a cured product of the present invention preferably contains (b) solvent removal + step, that is, removal of the solvent from the applied resin composition. y In the step (1), it is preferable to form a dry coating film on the substrate by removing the solvent from the above-mentioned film of reduced pressure (vacuum) and/or heating = cloth. The conditions of the addition are preferably carried out at 701 to 1201: for about 30 seconds to about 3 seconds. Since the resin pattern producing method of the present invention has good shape controllability, it is suitable for use in a thickness of 4 μηχ or more after the solvent removal. The film thickness after removal of the solvent is preferably 4 μm to 0.01 μm, particularly preferably 4 μm to 1 μm. &lt;Heat treatment step (Step (c)) &gt; The method for producing a cured product of the present invention preferably comprises a heat treatment step (and a baking step), that is, a heat treatment in which the impurities are removed. ^

S 64 201243501 A cured film is formed by performing heat treatment. The heat treatment temperature (baking temperature) is preferably from 180 〇 c to 25 Torr, and the aging time is preferably from 30 minutes to 15 minutes. . . . , ▲ For example, a polymer of a monomer unit containing (aM) a residue having a carboxyl group or a phenolic hydroxyl group-protected group and a monomer unit of (2) and/or a heterocyclic butyl group is used as a polymer. Ingredients two, two = heat treatment step money 'monomer unit (a_M) _ acid decomposition of Wei two and raw lyophile or miscellaneous, and the county base and joint can form a hardened film. In the treatment step of the use of (Component E) thermal crosslinking agent, the thermal crosslinking agent of (Component E) is also subjected to heat transfer (the resin pattern manufacturing method). If the resin is (4) the resin of the present invention sequentially comprises the steps (1) to (5): ^ gj ^ cloth step 'coating the resin composition of the present invention on the substrate; agent; ~ bribe step 'self-coated The removal of the melt-forming activity of the product removes the resin treatment (5) heat treatment step of the lion resin group _ water-based material riding material, and the steps of the resin composition subjected to development are described below in the following order. 65 201243501 &lt;Coating step (Step (1)) &gt; The resin pattern producing method of the present invention preferably comprises (1) a coating step of applying the resin composition of the present invention onto a substrate. The procedure of (1) is the same as the step (a), and the preferred morphology is also the same. &lt;Solvent Removal Step (Step (2))&gt; The resin pattern production method of the present invention preferably comprises (2) a solvent removal step, i.e., removal of a solvent from the applied resin composition. Step "(2)" The same steps as in the step (b), the preferred embodiment is also the same. <Exposure step (Step (3)) &gt; The resin pattern manufacturing method of the present invention preferably comprises (3) an exposure step, That is, the resin composition from which the solvent has been removed is exposed to a pattern by active light. In the step (3), the substrate provided with the dried coating film is irradiated with a predetermined pattern of active light rays. The exposure can be performed by masking. It is possible to directly depict a green pattern. Active light can preferably use active light having a wavelength of 300 nm or more and 450 nm or less. Low-pressure mercury lamps, high-pressure mercury lamps, ultra-high pressure mercury lamps, chemical lamps, and laser generating devices can be used for exposure with active light. , LED light source, etc. When using a mercury lamp, it is preferable to use active light having a wavelength of g line (436 nm), i line (365 nm), h line (405 nm), etc., which is suitable for large-area exposure compared with laser light. In the aspect of the invention, a mercury lamp is preferred. When a laser is used, a wavelength can be appropriately selected without any particular limitation. 66 201243501 Various lasers, for example, in a solid (YAG) laser 343 nm, 355 nm, 351 nm (XeF) is used in the excimer laser, and 375 nm and 405 nm are used in the semiconductor laser. Among them, 355 nm or 405 nm is more preferable in terms of stability and cost. The laser beam can be irradiated to the coating film once or several times. In comparison with the mercury lamp, a laser beam is preferable in terms of easy to focus and a mask which does not require pattern formation in the exposure step, and is preferable in terms of cost. The exposure apparatus to be used is not particularly limited, and a commercially available exposure apparatus can be manufactured by Callisto (manufactured by V Technology Co., Ltd.) or AEGIS (manufactured by V Technology Co., Ltd.) or DF2200G (manufactured by Dainippon Screen Co., Ltd.). Further, it is also possible to use a device other than the above. It is also possible to adjust the illuminating light by a spectral filter such as a long wavelength cut filter, a short wavelength cut filter, or a band pass filter as needed. And after the exposure step, PEB (post-exposure heat treatment) may be performed as needed before the development step. The temperature at the time of pEB is preferably 30 C. 130 C or less, more preferably 4 〇 ° c or more and 11 〇. The following is particularly preferably 5 (TC or more and 90 Å or less. C or less &lt; development step (step (4)) &gt; Including (4) developing step, f is to use a water-based developing solution to process the resin composition of the shirt 0 in step (4) to develop the film. The aqueous developing solution is preferably a secret, which can be used in the developer. Make

For the basic compound used in S 67 201243501, for example, hydrogenated potassium or the like can be used for the detection of metal hydroxides; sodium carbonate hydrogenation; sodium hydrogencarbonate, potassium hydrogencarbonate, etc., metal carbonate, metal carbonate, ammonium oxide, four Ethyl ammonium hydroxide, hydrazine hydrate / 'tetradecyl hydroxy acid sodium, sulphuric acid sodium, etc.? = biliary 2 hydrazine money; Shi Xi's aqueous solution added with sterol or B in the appropriate amount will be The aqueous solution of the above-mentioned alkali surfactant is preferably used as a developing water-soluble organic solvent or a surface developing solution, and the pH is preferably ι 〇 14 14 14 14 〇. The development time is preferably from 30 seconds to ι 80 seconds, and any of the methods such as the = method, the dipping method, and the leaching method. Yu Xian ^ excellent to go ^ is Lai Shui recorded, from (4) recited _ and the resin pattern of the present invention 5 turns (1) (9) contains a re-exposure step, also H substrate re-exposure, but preferably does not include this step The exposure in the hand step is performed in the same manner as the exposure step, and the entire surface exposure is performed on the side of the re-exposure step which is formed with the resin composition film. Excellent L-substrate shape exposure step (4) material exposure ^ _通-2~Moo <heat treatment step (step (5)) &gt; roast beef Lai Lai Lai method #Select contains honest steps (twisting heat treatment, can be Forming a cured film. The first step is to use the step (4) to perform the display of the product, instead of removing the dissolved-tree chimera, except for the same as g 68 1 201243501, The preferred embodiment is also the same. And "Immediately: the lipid product can be suitably used as a transfer material. The ===::= printing material is suitably used: on the substrate of the device shown or semi-conducted == ::=Printed in the step (1) to the step (6,): y 撑 ΐ ΐ , , , , , , , , 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本In the middle of the removal of the solution group ===, the 'resin is exposed to the resin by the aqueous developer.'), the 'treatment step' is performed on the resin composition that has been developed, and the coating step (step (1)) is performed. The manufacturing method preferably includes (1) a coating step, that is, applying the present invention to the substrate. Step o') is to replace the substrate with a temporary support as shown below, except

69 201243501 Other than the above step (a), the preferred embodiment is also the same. As the temporary support, a known material such as polyester or polystyrene can be used. Among them, from the viewpoint of cost, heat resistance, and dimensional stability, it is preferred to carry out biaxially extending polyethylene terephthalate. The thickness of the temporary support is preferably 15 μηη to 2 μm μm, more preferably 30 μm to 15 μm. <Solvent Removal Step (Step (2))&gt; The resin pattern production method of the present invention preferably comprises (2) a solvent removal step ‘that is, removing the solvent from the applied resin composition. Step (2') is the same step as step (b), and the preferred embodiment is also the same. &lt;Transfer Step (Step (3'))&gt; The resin pattern producing method of the present invention preferably comprises (3) a transfer step, that is, transferring the resin composition from which the solvent has been removed to the substrate (permanent support) The transfer step preferably includes a step of bonding the resin composition from which the solvent has been removed to the substrate (permanent support), and a step of removing the temporary support from the resin composition attached to the substrate. The bonding of the resin composition from which the solvent has been removed to the substrate can be carried out, for example, by pressure bonding or thermocompression bonding using a heated and/or pressurized roll or flat plate. Specifically, a laminating machine and lamination described in Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. Method, from the viewpoint of low foreign matter, = 201243501 The use of Japanese paste flat 7_ then No. 575 is not particularly limited. 2. If an adhesive roller with an adhesive layer is attached to the temporary support, The resin composition on the soil plate peels off the temporary support. Specifically, it is also possible to peel off the temporary continuous peeling or to hold the end portion of the temporary support larger than the one-piece separated earth plate. ^ is a method of peeling off the temporary support, and the method described in the Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. 2-297879. &lt;Exposure Step (Step (4))&gt; The resin pattern production method of the present invention preferably comprises (4) an exposure step of exposing the transferred resin composition to a pattern by active light rays. The step (4') is the same as the step (3) except that the resin composition which has been transferred by the step (3) is used instead of the resin composition from which the solvent has been removed, and the preferred form is also the same. &lt;Developing Step (Step (5')) &gt; The resin pattern producing method of the present invention preferably comprises (5) a developing step of developing the exposed resin composition with an aqueous developing solution. The step (5') is the same step as the step (4), and the preferred embodiment is also the same. &lt;Heat treatment step (Step (6))&gt; £71 201243501 The resin pattern production method of the present invention preferably comprises (6, heat treatment step 22) and the resin composition subjected to development is subjected to heat treatment. A cured film can be formed by heat treatment of the lamp. υ ^ () 忧 The same steps as in the step (5) are also the same. a# όΠΪ: 6! The resin composition is used as a transfer material to form a resin pattern. 2010 7^58曰9; The gas production method can also be referred to the Japanese Patent Publication No. 2〇10-725891. Further, when the tree assay of the present invention is used as a transfer material and the resin composition does not contain the (component D) photoacid generator, the method of the resin pattern of the rabbit is included in the sample. Step (1: step (2'), step Ο1) and step (8). (hardened material, optical member), the cured product is hardened, and is particularly limited, and is preferably produced by the method for producing a cured product of the present invention or the method for producing a resin pattern. Hardened material. Further, the cured product of the present invention can be suitably used as a microlens or a diaphragm member. Further, the cured product of the present invention can be suitably used to reduce the visibility of the wiring electrode used in the panel towel, and it can be particularly suitably used as a microlens. [Examples] Next, the present invention will be more specifically described by way of examples. Ming is not limited to this example of discrimination. In addition, in the following synthesis examples, the following abbreviations indicate the following combinations 72 1 201243501. V-601 : 2,2'-azobis(2-methylpropionic acid) dimethyl ester GMA: f-based (tetra)-axis glycerol vinegar PGMEA: propylene glycol monomethyl ether acetate &lt;synthesis of polymer A1&gt; A mixed solution of the following compound was heated under a nitrogen stream to 7 〇t:: tetrahydrofuran-2-yl methacrylate (63_2 parts (0,405 molar equivalents)), methyl acrylate (8·2 parts (0.095) Molar equivalent)), methyl methacrylate (3-ethyloxetane-3-yl) methyl ester fraction (〇375 molar equivalent), 2-hydroxyethyl methacrylate (16·3 parts) , (〇 125 _ eq)), and propylene glycol monoterpene ether acetate (PGMEA) (120 parts). While stirring the mixed solution, a radical polymerization initiator V-601: 2,2,-azobis(2-mercaptopropionic acid) dinonyl ester was added dropwise over 3.5 hours (Wako Pure Chemical Industries Co., Ltd.) Co., Ltd. manufactured, 12.0 parts) and PGMEA (80 parts) mixed solution. After completion of the dropwise addition, the reaction was carried out at 7 (TC for 2 hours) to obtain the I&gt; GMEA solution of the polymer A1. Further, PGMEA was added to adjust the solid concentration to 40 wt0 / Torr. The weight average molecular weight (Mw) measured by gel permeation chromatography (GPC) was 15,000. &lt;Polymer A2~Polymer A7, Polymer Α1, Polymer A, 2, and Polymer B1~ Polymerization Synthesis of the substance B5 &gt; Each monomer used in the synthesis of the polymer A1 was changed to the one shown in Table 1.

In the same manner as in the synthesis of the polymer A1, the amount of the monomer in which each monomer unit is used is changed to the amount of use described in Table 1, and the amount of the monomer in each of the monomer units described in S 73 201243501 is changed. Further, a polymer A2 to a polymer A7, a polymer A'1, a polymer A'2, and a polymer B1 to a polymer B5 were synthesized. The amount of addition of the radical polymerization initiator V-601 was adjusted so as to have the molecular weights shown in Table 1. 74 201243501 J'a§ (N inch

Mw 〇〇V | 15,000 | | 15,000 | | 25,000 | 〇o Λ 〇\ | 15,000 | | 15,000 | | 15,000 | 〇o uo | 15,000 | oo | 15,000 | o | 15,000 | Monomer (a5) Molar Ratio 1 1 1 1 1 1 1 40.5 | 37.5 | 1 1 1 1 1 Type 1 1 1 1 1 1 1 MMA| |MMA| 1 1 1 1 1 Molar ratio 1 12.5 1 in 1 12.5 | in 1 12-5 [ 1 12.5 I 1 12-5 | 1 12.5 I 〇o 〇〇〇 kind iHEMAl HEMA |HEMA| HEMA |HEMA HEMA |HEMA| |HEMA| |HEMA| PQ PQ u PQ monomer unit U4) -Ο m 1 幽1 o I 1 1 1 1 to in in Category 1 1 1 1 1 1 1 1 tri OO 00 Monomer unit (a3) Molar ratio in 〇〇\ o ο 〇in On cK tT) ooo 〇o Type MAA i MAA i MAA ί MAA MAA _ MAA MAA MAA MAA MAA Monomer unit (a2) Molar ratio 1 37.5 1 cn OO (N CN \ 37.5 I | 37.5 | | 37.5 I 1 om cn mm Type 1 OXE-30 | GMA | OXE-30 I | OXE -30 | I OXE-30 I GMA | AllylMA| I OXE-30 I 1 | OXE-30 I OXE-30 | | OXE-30 I OXE-30 | | OXE-30 | Monomer (al) Molarity 40.5 I oo 40.5 | 1 40.5 ooooo Species | MATHF I iMAEVEl MATHF I MATHF I [HS-EVEl I t-BuMA I MATHF 1 |MAEVE| IMAEVEl IMAEVEl IMAEVEl [MAEVEl ! MATHF | Polymer tH (N m &lt; inch &lt; c r- &lt; —A7 — PQ &lt;N PQ m PQ inch PQ in PQ 201243501 In addition, in Table 1 The amount described is a molar ratio and represents the copolymerization ratio of the monomer unit derived from each monomer described in the face column. Moreover, the table indicates that the monomer unit is not used. Moreover, the abbreviations in Table 1 are as follows. MAEVE: Methacrylic acid-丨-ethoxyethyl hydrazine MATHF: tetrahydrofuranyl methacrylate GMA: glycidyl methacrylate OXE-30: methyl acrylate (3_ethyl oxetane _3 _ base) methyl vinegar (made by Osaka Organic Chemical Industry Co., Ltd.)

St : Styrene HEMA . Methyl acrylate _2 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Compound (4-(1-ethoxy)ethoxystyrene)

AllylMA: allyl methacrylate A ·· nonylphenyl-polyoxyethylene chain adduct acrylate (manufactured by Kyoeisha Chemical Co., Ltd., trade name Light acrylate NP-4EA) B: methoxy polymerization Ethylene glycol methacrylate (manufactured by Nippon Oil & Fat Co., Ltd., trade name: Blemmer PME-400) C: Octyloxy polyethylene glycol polypropylene glycol monomethacrylate (manufactured by Sakamoto Oil Co., Ltd., trade name For Blemmer 50AOEP-800B) 76 201243501

〇vCH3 ch3 (Preparation of dispersion) The dispersion of the composition of Table 2 was blended and mixed with cerium oxide beads (150 parts by weight of 〇3 mm (p)' for 9 hours using a paint shaker. The beads (0.3 mm cp) were respectively obtained as a dispersion liquid qi and a dispersion liquid Q2. Further, regarding the dispersion liquid Q2, only the components described in Table 2 were mixed and stirred without dispersion.

In addition, the average primary particle diameter of TTO-51C (manufactured by Ishihara Sangyo Co., Ltd.) is 11 nm, and the average primary particle size of NanoUse OZ-S30K-AC (manufactured by Seiko Chemical Industry Co., Ltd.) is 18 Nm 〇 £ 77 201243501 [Table 2] Component Dispersion Q1 TTO-51C (Τι〇2 particles manufactured by Ishihara Sangyo Co., Ltd.) 18.8 DISPERBYK111 (Dispersant manufactured by BYKChemie Co., Ltd.) 6.90 PGMEA 49.3 Total (parts by weight) 75.00 Dispersion of ingredients Liquid Q2 NanoUse OZ-S30K-AC (22.5 Oxide particles manufactured by Nissan Chemical Industries, Ltd.) ............. PGMEA 49.3 Total (parts by weight) 71.8 (Modulation of photosensitive material liquid) After mixing the components shown in the following Tables 3 and 4 to obtain a uniform solution, the filter was prepared by using a poly-tose filter having a pore size of 2 μmη# to prepare a photosensitive material. Liquid (photosensitive solution). 78 201243501 J-aISCN inch [ε&lt;]

Surfactant 10.025 | 10.025 1 10.025 1 10.025 | 0.025 | 0.025 | 10.025| 0.025 | \ 0.025 | 0.025 0.025 | 0.025 | 10.025 | 10.025 | | 0.025 | | 0.025 | | 0.025| | 0.025 1 Type r~H r-H Kl t—HH &lt;&lt; r—H 1 ( hl HH v-1 rH μ-Ι 1 ( ί—H (b) r—HH test compound 0.0026 | 1 0.0026 1 | 0.0026 ! ;0.0026 ; 0.0026 0.0026 | 0.0026 | 0.0026 | | 0.0026 | | 0.0026 | | 0.0026 | | 0.0026 | | 0.0026 | | 0.0026 | | 0.0026 | | 0.0026 | | 0.0026 | | 0.0026 | i kind a 3 &lt;N a S a 2 Φ1 0.028 0.028] 0.028 0.028 0.028 0.028 0.028 0.028 0.028 0.028 0.028 10.028 0.028 0.028 0.028 0.028 0.028 0.028 Type 1 Η r ·Η ^Ή T—MT—H t—H 1 &lt; t—( i—H t—H i—HH Bonding agent 0.90 0.90 0.90 0. 0.9 0.9 0.9 0.9 0.9 0.9 0.9 0.9 0.9 0.9 0.9 0.9 0.9 0.9 0.9 0.9 0.9 0.9 0.9 0.9 0.9 0.9 0.9 0.9 0.9 0.9 0.9 0.9 ^ 5 Sensitizer 1 1 1 1 1 1 1 0.59 1 0.59 1 1 1 1 1 ! 1 1 Type 1 1 1 1 1 1 1 s 1 s 1 1 1 1 1 1 1 1 Crosslinker h^oi u^oj Ll^oJ U.20 U.20 1-20 Ll2〇J U-2〇i U-2〇U^oJ U^〇J LL2〇J U. 20—— U^ol U_20 U^〇J |l.2〇| Type τ—^ ww ω H w T—4 w H wr—H mwt 1 w rH W w tH PQ &gt; H rH w T—( W w rH ω Butterfly 1 π ♦1 0.59 0.59 0.59] 0-59 0.59 0.59 0.59 0.59 0.59J 0.59 1 10.59 0.59 0.59 0.59 0.59 0.59 0.59 1 Type QQQ rH Q rH Q 1TMHQQ (NQ m Q inch Q 1 rH Q rH QHQQHQQ iH Q Solvent | 29.10 | I 29.10 I 29.10 1 (29.10 II 29.10 II 29.10 II 29.10 1 | 29.10) I 29.10 I | 29.10 I | 29.10 | I 29.10 I | 29.10 | I 29.10 ! 29.10 ! I 29.10 1 29.10 | 29.10 species HU rH ut-H iH 〇rH U rH U rH U rH 〇U rH U rH U rH ur~HUHUUU t-HU r-HU polymer 68.10 68.10 68.10 68.10 68.10 68.10 68.10 68.10 68.10 68.10 _.10 68.10 ^8.10 68.10 ^8.10 (68.10 _.10 68.10 kind iH &lt; (N &lt; m &lt;i inch &lt;&lt;Τϊ c &lt;&lt; ct-H c &lt; i-1 PQ (N PQ m CQ inch PQ PQ t—H &lt; A, 2| Photosensitive liquid 1 ( m 2 Bu oo a\ R10 R—l jJ R12 R13 R14 R15 R16 &lt;N

6L 201243501

JaISCN inch [inch &lt;]

Surfactant I 0.025 I 0.025 I 0.025 I 0.025 I 0.025 0.025 1 0.025 Ι 1 0.025 I | 0.025 | 缌黩H rH h-1 rH r~H 1-Η h-1 • 4 η-) Factory Η n-Ι r-it-H 1 test compound 0.0026 0.0026 I 0.0026 0.0026 0.0026 1 0.0026 1 1 0.0026 Ι CN 〇o 0.0026 a S Ρ a S | 0.028 I 1 0.028 II 0.028 II 0.028 I 1 0.028 1 1 0.028 1 1 0.028 I 1 0.028 I 0.028 缌黩iH γ·Η rH ι··Η—Η iH r—H Adhesive agent o 冢ooo Ο C7\ Ο Ο Ον Ο Ο ΟΝ Ο o 〇O &gt;—&gt; t—i τ—Η &gt ;-&gt; τ-Η rH •—3 sensitizer φΐ 1 1 1 1 1 1 I 1 1 缌黩1 1 1 1 1 1 I 1 1 ±i φ! CN V£) &lt;N inch · (N Inch &lt;N inch · (Ν ν〇 inch · CN ν〇 inch · &lt;Ν ν〇 inch &lt;NV〇 inch CN inch K- ^ type PH (N m 2 13⁄4 13⁄4 rH &lt;N crosslinker 1 d |®i (N i—H (N t—H (N 1—H &lt;N 1 &lt;&lt; Ν Η (Ν ι i &lt;Ν I i CN &lt;N r—H #1 m 'ΓΓ W ϊ—HW w ω ι i W f ·Α ω Ξ r—^ w ϊ—HW Photoacid generator φΐ 〇\ &lt;T) o 〇\ yn OG\ in 〇σ\ ^Τ) Ο m ο \ m ο σ\ ο σ\ in O 〇\ wo O #1 m QQQQQQ τΉ QQQ Solvent 1_ Φ1 in iT) Inch · inch inch inch · inch inch · inch inch M mr*H ϋ iH 〇U 1—Η U τ—Η U τ-Η ι—Η υ rH U polymer inch CN inch inch inch ri inch r4 inch inch&lt;Ν inch inch&lt;Ν inch inch CN inch inch&lt;N inch inch 髅ττν ^mS rH c &lt; »—H &lt; tH &lt; τ-Η &lt; (Ν &lt;&lt;Ν&lt; fH 1 &lt;&lt; photographic liquid rH oo o\ 2 Ο 2 τ-Η 2 &lt;Ν 2 m S inch 2 CN 201243501 In addition, Table 3 and Table 4 The unit of the amount in the weight is part by weight. Moreover, the abbreviations in Tables 3 and 4 are as follows. C1: propylene glycol monomethyl ether acetate D1: an oxime sulfonate compound D2 synthesized by the following synthesis method: α-(p-toluenesulfonyloxyimino)phenylacetonitrile (synthesis method is as follows) D3 : CGI1397 (The following compound, manufactured by Ciba Specialty Chemicals Co., Ltd.) D4 : 4,7-Di-n-butoxy-1-naphthyltetrahydrothiophene trifluoromethanesulfonate El: JER157S65 (Mitsubishi Chemical Co., Ltd. Manufactured, epoxy equivalent: 200 g/eq to 220 g/eq) HI: 9,10-dibutoxyanthracene (DBA) J1: 3-glycidoxypropyltrimethoxy decane (KBM-403, Shin-Etsu Chemical Industry Co., Ltd.)

Kl : 1,5-diazabicyclo[4.3.0]-5-nonene K2 : triphenylimidazole L1 : compound W-3 shown below

CGI1397 81 201243501

〇C4Hg DBA

20 wt% 8〇wt°/〇Mw : 1,500 W-3 &lt;Synthesis of D1&gt; Add aluminum chloride in a suspension solution of 2-naphthalene (10 g) and chlorobenzene (30 mL) 10.6 g:), 2_chloropropionyl chloride (10.1 g}, the mixture was added to the mixture) and reacted at 40 ° C for 2 hours. Under ice cooling, a California aqueous solution (60 mL) was added to the reaction solution, and acetic acid B was added. The ester was added to the organic layer (50 mL). Potassium carbonate (19.2 g) was added to the organic layer, and the reaction was carried out at 40 ° C for 1 hour, and then 2N HCl aqueous solution (60 mL) was added to carry out liquid separation to separate the organic layer. After concentration, the crystals were re-deuterated with diisopropyl scale (1 OmL), filtered and dried to obtain a ketone compound (6.5 g). A suspension solution of the obtained ketone compound (3.0 g), decyl alcohol (30 mL) Acetic acid (7_3g) and 50% aqueous hydroxylamine solution (8.0g) were added and heated and refluxed. After cooling, 'water (50 mL) was added and the crystals precipitated by hydrazine were washed with cold methanol and dried to obtain hydrazine. Compound (2.4 S: 82 201243501 g). The obtained hydrazine compound (L8g) was dissolved in acetone (2 〇mL), liters of cold I added triethylamine (1.5 g), Yue Gu benzene chloride U.4g), reaction was allowed to room temperature Shu hours. Water (5 Torr) was added to the reaction mixture, and the precipitated crystals were filtered, and then re-pulped with methanol (2 mL), filtered and dried to obtain D1 (2.3 g). In addition, the 1H-NMR spectrum of D1 (300 MHz, CDC13) is δ f 8.3 (d, 1 Η), 8.0 (d, 2 Η), 7.9 (d, 1 Η), 7.8 (d, 1 Η), 7.6 (dd, =, 7.4 (dd, 1H), 7.3 (d, 2H), 7.1 (d. 1H), 5.6 (q, 1H), 2.4 (s, X 1.7 (d, 3H). &lt; Synthesis of D2 &gt; The α-(p-toluenesulfonyloxyimino)phenyl ethidium was synthesized according to the method described in paragraph 5108 of JP-A-2002-528451. [Table 5] Types of the resin Resin details Alkali-insoluble F1 Epoxy Resin EPICLONN-695 (manufactured by DIC Corporation) Insoluble F2 Epoxy Resin EPICLONHP-4700 (manufactured by DIC Corporation) Insoluble Ρ3 Epoxy Resin JER1031S (Mitsubishi Chemical Co., Ltd.) Insoluble ^4 Acrylic The resin is referred to the following structure insoluble propionate-based resin. Reference is made to the following structure insoluble acrylic resin. The following structure is dissolved. 4 Acrylic resin is dissolved in the following structure. £ 83 201243501

Further, the numbers in the lower right of the brackets in the above F4, F5, F, 1 and Ρ2 indicate the molar ratio. &lt;Evaluation of Solubility of Component F&gt; With respect to the component ρ used in Table 5, PGMEA &gt; The coating film (thickness 4 μm) of the component F formed by applying each solution to the substrate and heating at 9 ° C for 2 minutes was studied with respect to the 2 -38 wt% aqueous solution of methyl ammonium hydroxide of 23 C. Dissolution rate. When the dissolution rate was less than 0.01 μm/sec, it was judged to be "insoluble, and it was judged to be "alkali solubility" when it was 1 gm/sec or more. The results are shown in Table 5. (Preparation of photosensitive resin composition) According to Table 6, a photosensitive material liquid (photosensitive liquid) and a dispersion liquid were mixed to prepare a uniform solution, and then a polyethylene having a pore size of 〇2 μm was used. In the prefecture, a photosensitive resin composition is separately prepared. The obtained photosensitive resin composition was used to carry out the following evaluation of 84 84,043,501. In addition, the unit of the amount in Table 6 is a part by weight. Among them, R11 used in Example 15 is not a photosensitive resin composition but a thermosetting resin composition. The results are shown in Table 7. s 85 201243501 [Table 6] Photosensitive liquid dispersion type Quantity type Example 1 R1 30 Q1 19 Example 2 R2 30 Q1 19 Example 3 R3 30 Q1 19 Example 4 R4 30 Q1 19 Example 5 R5 30 Q1 19 Example 6 R6 30 Q1 19 Example 7 R7 30 Q1 19 Example 8 R8 30 Q1 19 Example 9 R9 30 Q1 19 Example 10 R10 30 Q1 19 Example 11 R1 30 Q1 23 Example 12 R1 30 Q1 16 Example 13 R3 30 Q2 19 Example 14 R3 30 Q2 23 Example 15 R11 30 Q1 19 Example 16 R12 30 Q1 19 Example 17 R13 30 Q1 19 Example 18 R14 30 Q1 19 Example 19 R15 30 Q1 19 Example 20 R16 30 Q1 19 Example 21 R14 30 Q2 19 Example 22 R17 30 Q1 19 Example 23 R18 30 Q1 19 Example 24 R19 30 Q1 19 Example 25 R20 30 Q1 19 Example 26 R21 30 Q1 19 Example 27 R22 30 Q1 19 Example 28 R23 30 Q1 19 Example 29 R24 30 Q1 19 Example 30 R25 30 Q1 19 Comparative Example 1 R' l 30 Q2 19 Comparative Example 2 R'2 30 Q2 19 Comparative Example 3 R1 30 - - 86 201243501 (1) Evaluation of sensitivity After the slit of the photosensitive resin composition was applied onto the ruthenium film having the ruthenium oxide film, On the hot plate, a 12-second (4) film with a film thickness of 15 μm was formed. Next, exposure was carried out by using a 1 line stepper (ΡΡΑ'ΟΟβ制造 manufactured by Canon Inc.) to interpose the line and gap mask of 20 μm. Yu,, on, 50. After heating for 6 seconds in the armpit, using a 2 38% aqueous solution of tetramethylammonium hydroxide and performing a 6-second use of the liquid pool at 23 t:, the development was carried out in ultrapure water for 45 seconds. rinse. The exposure (E optimal exposure amount) at a line and a gap of 1:1 with a resolution of 1:1 was used as the sensitivity. 1 . Eopt less than 50 mJ/cm2 2 : Eopt is 50 mJ/cm2 or more and less than 15〇 mJ/cm2 3 : Eopt is 150 mj/cm2 or more. Sensitivity is preferred in the south, and 1 or 2 is a practical range. (2) Evaluation of resolution The slit of the photosensitive resin composition was applied to the Shixi tablet having the oxidized stone film, and the solvent was removed by a solvent on the hot plate at 9 (TC) for (10) seconds. 10 μιη of coating film. People's, using a 1-line stepper (FPA_300015 manufactured by Canon Inc.) to expose the line with a gap of 1: 1 for optimum exposure exposure. On the hot plate, The underarm was heated for (9) seconds. Secondly, the development was carried out by using a 2.38 wt% aqueous solution of tetramethylammonium hydroxide at 23 C for 6 g seconds, and the bath was further washed with ultrapure water for 45 seconds. Using an ultra-high pressure mercury lamp and heating at 3 n ^ s 87 201243501 at 140 ° C to obtain a line for measurement), followed by exposure in an oven, heating in minutes, followed by 3 minutes at 220 ° C. case. The pattern was observed with an optical microscope. The operation is started from the width of the line and the gap of the mask of 10 μπι, and the width is reduced by 1 μηη each time. The minimum j which can be well patterned is the resolution. , a is 1 : resolution is less than 5 μηη 2 : resolution is 5 μmη or more and less than 1 μπι 3 : resolution is 10 μηι or more (3) Shape evaluation of the pattern Slit coating of the photosensitive resin composition On the glass substrate. The solvent was removed by a hot plate at 90 ° C for 12 seconds to form a coating film having a film thickness of, for example, a human. Next, using a mercury lamp exposure machine (MPAsp-H750 manufactured by Canon Co., Ltd.), an exposure of an optimum exposure amount was performed by a mask having a gap width of 介 between the spacer and the gap 1: i. On the hot plate, 5 〇. The underarm is heated for 60 seconds. Next, development was carried out by using a 2.38 wt% of tetramethylammonium hydroxide water and a solution at 23 Torr for 6 sec., and further rinsing with ultrapure water for 45 seconds. In the oven to 230. The crucible was heated for 60 minutes, and then the shape of the pattern was observed using an electron microscope. Further, it is preferable that the shape of the pattern is a shape in which the water chestnut is eliminated and rounded. (4) Evaluation of pencil hardness (mechanical strength evaluation) A resin composition was slit-coated on a glass substrate. Second, at 9 〇. The solvent was removed on a hot plate of ruthenium for 120 seconds to form a coating film having a film thickness of 2 μm. 201243501 Using an ultra-high pressure mercury lamp, the sample was measured with m2 (measured by a twist line, followed by an oven, 23 (6 at TC to obtain a cured film of the integral film. 旳 heating to measure the pencil hard to obtain the cured film) According to JIS K5600-5-4 degrees. It is preferable that the pencil hardness is hard. 1 : 5H or more (hard)

2 : 3H to 4H 3 : 2H or less (soft) (5) Evaluation of refractive index The resin composition of Table 6 was applied onto a ruthenium substrate using a rotator, and dried at 8 (TC for 120 seconds). A film having a thickness of 5 Å was formed, and the substrate was exposed to light at 3 〇〇 mJ/cm 2 (measured by i-line) using an ultra-pressurized mercury lamp, followed by heating (9) in an oven at 22 Torr. The ellipsometer VUV-VASE (ja Woollam(10)c〇, heart-made) was used to measure the refraction of the cured film at 589 nm. It is shown in Table 7. Preferably, the refractive index is higher, more preferably 17 or more. Evaluation of Residual Film Rate of Part: The photosensitive resin composition of Table 6 was applied to a glass substrate (trade name: XG, manufactured by Corning Incorporated) of 1 mm×100 mm by a spin coater to reduce the film thickness. Drying on a hot plate for (four) seconds (pre-peering) Next, using a 2.38% aqueous solution of tetradecyl hydroxide to carry out the development of the liquid pool method of (9) seconds at 23 C, further ultrapure The water was rinsed for 1 G seconds. Thereafter, the film thickness was further measured to determine the original film thickness (i 〇μιη) The residual film ratio of 89 201243501 after development at 1〇〇%. The evaluation criteria are as follows: 1 : Residual film rate is 90% or more 2: Residual film rate is 80% or more and less than 90% 3 : The residual film ratio is less than 80%. The results are shown in Table 7. It is understood that the residual film ratio of the unexposed portion is improved by adding the insoluble component F'. <Evaluation of Solvent Resistance> Table 6 by spin coater The photosensitive resin composition was applied to a glass substrate (trade name: xg, manufactured by Corning Incorporated) of 1 mm×100 mm to have a film thickness of 4 μm, and dried on a hot plate at 90° C. for 120 seconds. The substrate was exposed to light at 300 mJ/cm 2 (measured by i-line) using a super-South mercury lamp, and then heated in an oven at 22 ° C for 4 亍 60 minutes. The substrate was immersed in NMP (N-methylpyrrolidine g) solvent at 4 ° C for 3 minutes, and then rinsed with ultrapure water for iq seconds. Thereafter, the film was visually evaluated. Reduced or film-like. The evaluation criteria are shown below. 1 : No film reduction was found at all. 2: A slight film reduction was observed. 3 : The reduction is large, and the surface roughness is also found. 201243501 [Table η Photosensitive resolution pattern shape Pencil hardness Refractive index Unexposed portion Residual film rate Solvent resistance Example 1 1 1 Convex and smooth 1 1.91 2 1 Example 2 1 1 Convex and sleek 1 1.90 2 1 Example 3 1 1 Convex and sleek 1 1.93 2 1 Example 4 1 1 Convex and smooth 1 1.97 2 1 Example 5 1 1 Convex and sleek 1 2.01 2 1 Example 6 2 1 Convex And sleek 1 1.89 2 1 Example 7 1 1 Convex and sleek 1 1.90 2 1 Example 8 1 1 Convex and sleek 1 1.90 2 1 Example 9 1 1 Convex and sleek 1 1.90 2 1 Example 10 2 1 Convex and smooth 1 1.90 2 1 Example 11 1 1 Convex and smooth 1 1.98 2 1 Example 12 1 1 Convex and smooth 2 1.81 2 1 Example 13 1 1 Convex and smooth 1 1.71 2 1 Example 14 1 1 Convex and sleek 1 1.75 2 1 Example 15 - - - 1 1.91 - 1 Example 16 1 1 Convex and smooth 1 1.90 2 1 Example 17 1 1 Convex and smooth 1 1.89 2 1 Example 18 1 1 Convex and smooth 1 1.89 2 1 Example 19 1 1 Convex and smooth 1 1.88 2 1 Example 20 1 1 Convex and sleek 1 1.91 2 1 Example 21 1 1 Convex and sleek 1 1.74 2 1 Real 22 1 1 Convex and smooth 1 1.85 1 1 Example 23 1 1 Convex and smooth 1 1.85 1 1 Example 24 1 1 Convex and smooth 1 1.85 1 1 Example 25 1 1 Convex and smooth 1 1.85 1 2 Example 26 1 1 Convex and smooth 2 1.85 1 1 Example 27 1 1 Convex and smooth 1 1.84 1 1 Example 28 1 1 Convex and smooth 2 1.84 1 1 Example 29 1 1 Convex and sleek 1 1.85 1 1 Example 30 1 1 Convex Type and smooth 1 1.85 1 1 Comparative Example 1 XXX 2 1.65 2 1 Comparative Example 2 1 3 Heat flow and landfill gap 3 1.69 2 3 Comparative Example 3 1 1 Convex and smooth 2 1.51 1 1 91 201243501 West, Table 7 The "x" in the middle means that the pattern cannot be formed, so it cannot be judged. Further, in Table 7, the resin composition was a thermosetting type resin composition, and therefore it was not evaluated. According to the evaluation results shown in Table 7, it was found that the sensitivity was higher when the monthly derivative compound was used as the photoacid generator. Further, it has been found that when a monomer having a carboxyl group or a phenolic hydroxyl group protected by an acid-decomposable group is used as a monomer unit of a leaving group, the sensitivity is higher. Further, it is understood that if it is a resin composition containing particles, the obtained 1 = is harder. Further, it is understood that if it is the component A having a crosslinkable group, the obtained cured product is harder. Gold: Further, it is understood from the examples that the resin composition of the present invention containing a polymer having a leaving group has a high refractive index. On the other hand, in Example 1 and Comparative Example 3, it was found that the refractive index did not increase much when there was no separation of the radical and the particles. [Simple diagram description] None [Main component symbol description] None 92

Claims (1)

201243501 VII. Patent application scope: L A resin composition characterized by comprising: ασ (component A) comprising (al) a monomer unit having a group desorbed due to acid and/or heat and (a-2) having an intersection Polymerization of a monomer unit of a linking group; (ingredient B) particles; and (ingredient C) a solvent. 2. A resin group (component ϋ) photoacid generator as described in the scope of the patent application. 3. The resin composition as described in the scope of the patent application, (Component E) thermal crosslinking agent. Further, among them, the resin composition as described in claim 1 of the patent application, (component F) is an insoluble resin. The resin composition as described in claim 4, wherein the component F is an alkali-insoluble resin having a crosslinkable group. The resin composition according to the fifth aspect of the invention, wherein the knives F have an epoxy group as a crosslinkable group. The resin composition described in Item 4 of the Patent No. 4, pp. 7-8, 遂成刀F疋 epoxy resin or acrylic resin. The resin composition according to the first aspect of the invention, wherein the resin composition is a monomeric monovalent monomer unit of the group which is ui ι Λ acid and/or thermally removed. There is a residue of the county or the secret decomposing «There is a resin composition described in item 1 of the patent range, and the monomer unit having a crosslinkable group is (,, and Or a monomer unit of a heterocyclic butyl group. - An epoxy group 93 s 201243501 ιο· The bifurcation is an inorganic particle as described in the first item of the patent application. (4) The resin described in the first paragraph of the patent scope The composition of the inorganic particles is a metal oxide particle. The resin composition according to the item 2, wherein the resin composition described in the light curtain 1 is a feeling 14. The resin composition of the present invention is a resin composition as described in claim j, which is a resin composition for a light-drying member. And characterized in that at least step (a) to step (c) are sequentially included: (a) a coating step of applying the resin composition as described in the application of the patent application to the substrate; (b) solvent removal step Removing the solvent from the applied resin composition; and (c) heat treatment Step 'heat treatment of the solvent-removed resin composition. A resin pattern manufacturing method characterized by at least sequentially including steps (1) to (5): U) a coating step 'will be as in claim 1 The resin composition is applied to the substrate; (2) the solvent removing step, removing the soluble S 94 201243501 from the applied resin composition, exposing the film to a pattern; (4) developing step, composition Development is carried out; and the resin group from which (4) has been removed by the active bond is treated with an exposed resin by an aqueous developer. (5) a heat-treating step of heat-treating the resin composition to be developed, using a method of producing a cured product according to claim 16 or applying the patent scope π The resin pattern manufacturing method described in the item is obtained. An optical component obtained by the method for producing a cured product according to claim 16 or the method for producing a resin pattern as described in the section of the patent application. S 95 201243501 IV. Designated representative map: (1) Designated representative figure of the case: None (2) Simple description of the symbol of the representative figure: Benefit 5: If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: no