TW200937122A - Photosensitive resin composition - Google Patents

Abstract

A photosensitive resin composition comprises (A) silicone-containing acrylic resin, (B) siloxane compound (provided that (A) is excluded) and (C) photosensitive substance.

Description

200937122 ... ^VI. Description of the Invention: - Technical Field of the Invention The present invention relates to a photosensitive resin composition. [Prior Art] - In recent years, many display elements represented by liquid crystal displays and organic EL displays have been developed and put into practical use. A proposal for producing a pattern comprising the display element, and various photosensitive resin compositions. For example, a photosensitive resin composition composed of an alkali-soluble resin and a photopolymerization initiator is disclosed (as will be described later). Patent Document 1). [Patent Document 1] Unexamined Patent Publication No. 433600. SUMMARY OF THE INVENTION When a pattern formed using a conventional photosensitive resin composition is exposed to a high temperature, there is a problem that transparency is lowered. As a result of the investigation of the above problems, the present inventors have found that a photosensitive resin composition capable of forming a pattern excellent in heat-resistant light transmittance can be obtained. The photosensitive wax composition of the present invention contains anthraquinone-based resin® (A), anthracene-oxygenated compound (B) (except (A)), and a photosensitive material (〇. Meanwhile, the present invention The photosensitive resin composition composition, wherein the fluorene-containing acrylic resin (A) contains at least a hydrolyzable polymerizable unsaturated compound (A1) having a ruthenium atom and an unsaturated carboxylic acid and/or an unsaturated group. A ruthenium-containing acrylic resin of a copolymer obtained by polymerizing a carboxylic acid anhydride (A2), and a non-hydrolyzable polymerizable unsaturated compound having a ruthenium atom in the above-mentioned photosensitive resin composition composition of the present invention.弋320856 200937122 (I) Compound. R5

[In the formula (I), R1 represents a hydrogen atom or a methyl group. R is not _〇-(CH2)W-, ~C( = 0)_0-(CH2)»- or -(CH2)W-. The carbon atom contained in R2 may also be substituted with a hetero atom. W represents an integer from 0 to 8. R3 to R5 each independently represent an aliphatic hydrocarbon group having 1 to 12 carbon atoms, an aryl group having 6 to 12 carbon atoms or an aralkyl group having 7 to 12 carbon atoms. The hydrogen atom contained in the aliphatic hydrocarbon group, the aryl group and the aralkyl group may be substituted by a halogen atom. y represents an integer of 1 to 5, and x and z each independently represent an integer of 〇 to 5. In the above-mentioned photosensitive resin composition of the present invention, the fluorene-containing acrylic resin (A) is a monomer (A3) which is complexed with (A1) & (A2) (but (A1) And (A2) except for the copolymerized acrylic resin containing a copolymer. In the above-mentioned photosensitive resin composition of the present invention, the oxoxane compound (8) (except for (A)) is a compound containing a structural unit derived from the monomer represented by the formula (1). K8"Si(〇R9)4_n (π) 4 320856 200937122 [In the formula (R), R and R9 independently represent an aliphatic/hydrocarbon group having a carbon number of 1 to 2, an aryl group having a carbon number of 6 to 12, or a carbon number. 7 to 12 aryl groups. The hydrogen atom in the aliphatic hydrocarbon group, the aryl group and the aryl group may also be a diazo atom, a gas atom, a gas atom, a cyano group, a mercapto group, an alkoxy group having a carbon number of 1 to 4, an amine group, or a thiol group. Substituted with an imido group, an epoxy group or a (meth)propyl group. n represents an integer from 〇 to 3. When n is an integer of 2 or less, r9 may be the same type or a different kind of base, respectively. When η is an integer of 2 or more, ^ may be the same type or a different kind of base, respectively. ] ❹ It, this aphid contains the thermal hardening promotion #KD) of the upper member of the photonic tree. Meanwhile, the present invention is the above-mentioned photosensitive resin composition containing the solvent (8). In the case of the above, the present invention is the above-mentioned sensory resin composition containing the photosensitizer (7). Meanwhile, the present invention is a ruthenium pattern formed using the above-mentioned photosensitive resin composition. At the same time, the present invention is described in detail below. [Embodiment] Best Mode for Carrying Out the Invention Hereinafter, the present invention will be described in detail. The photosensitive resin composition of the present invention contains a hair styrene-based resin (A). The acrylic resin (A) containing cerium refers to a polymer containing a silicate or a methyl acrylate of a cerium atom. 320856 5 200937122 The non-hydrolyzable polymerizable resin (4) has a non-hydrolyzable polymerizable property (3), and has an unsaturated Weihua 5 (9) (hereinafter sometimes also Said to be polymerized = saturated citric acid liver (10) with a sputum-containing acrylic tree under the lipid 0 (A1), 疋 is not hydrolyzable and contains a polymerizable group and is modified to contain no water-based groups (such as alkanes) a compound of an oxy group, an alkoxy group or a carboxyl group, or a compound having an unsaturated bond. 〇 The so-called (A2)-saturated (tetra) acid refers to a carboxylic acid having a money and a bond, and is not less fresh (four). Wei liver. (A1) is preferably a compound represented by the formula (I).

Ο) ❹ [In the formula (I), R1 represents a hydrogen atom or a methyl group. R2 represents -0-(CH2V, -C(= 〇)-0-(CH2)^_(CH2)w... The carbon atom contained in r2 may also be substituted by a hetero atom. w represents an integer from 〇 to 8. R3 to R5 independently represents a hydrocarbon atom of the carbon number i illusion 2, an aryl group having 6 to 12 carbon atoms or a carbon number 7 to 12 # aryl group, and is contained in the aliphatic hydrocarbon group, the aryl group and the aralkyl group. The hydrogen atom in the middle may be substituted by a dentate atom. 320856 6 200937122 The integer is not an integer of 1 to 5, and X and z each independently represent 0 to 5, and may be, for example, a single bond; an ester bond; Methylene, exoethyl, mono-, tetramethylene, methylene, ethyl, 2-methylexyltrimethylene, benzylidene, 2-methyltrimethylene, 3 - methoxymethylene, ^^, ethyl, 2-ethylethyl, etc.; ❹ ❹ group ethyl, methoxy, propyl, thiomethylene, thiopropyl, etc. a group, an aminomethylene group, an amine group, an ethyl group, an amine group, and a single bond, a stretching group, etc., preferably a methyl group, an ethyl group, an oxyalkylene group, an oxyethyl group, and a non-addition group. Adding a water-decomposable monovalent group. Group fine: 'Selectively selected from non-polymerizable groups and polymerizable water-decomposable properties such as any group. The so-called non-hydrolyzable group 'in the presence of moisture η such as 'silk base, cashmere wire, etc.) may exist The stench of nature. 'The blouse can be hydrolyzed, and it is stable to R3 5 〇5 butyl butyl, 'for example, methyl, ethyl, n-propyl, isopropyl, benzyl, tert-butyl, octyl, ten A aryl group such as a toluene group, a phenyl group or a trimethyl group; In comparison, the base of the scorpion is not Yinji or ethyl; the preferred aryl group is phenyl and pentacene benzene. Preferably, phenyl is used. Meanwhile, the preferred aromatic base is trisporin 320856 7 200937122 phenyl, bis(trifluoromethyl)phenyl. As the compound represented by the formula (1), for example, methyl-based decylalkyl decyl) methacrylic acid (p-styl decyl decyl) 1-(3-mercapto acryloxypropyl 3, 3, 3_pentamethyl-mono-ester, calcined, 1-(3-methylpropenyloxypropyl) polydimethyl oxalate oxymethoxymethyl bis(tridecyldecaneoxy) Decane, 3: '" Propenylpropyltris(trimethylsulfoxane)decane, r-base-two-thin brewing oxygen J^-methylethyl sulphide|μ 烧, propyl dimethyl; Burning, allyl triyl ketone, tribasic sulphur, methyl (10) sulphate, succinyldiethyl = decane, vinyl tris(trimethyldecyloxy) decane, ethylene The base compound can be used alone or in a plurality of kinds, and the compound can be used alone or in a plurality of kinds. Used in combination. As for (Α1)', you can also use, for example, fm_07u (Mw: 1〇〇〇, formula (Bu)), FM-0721 (Mw . 5000 ' (Bub 1)), fm_〇725 (Mw : 10000, formula (1-1-1)), FM-〇7〇i (Mw: 42〇, formula (Bub n), FM 〇7〇1T (Mw : 420 ' (1-2-1)) (both Chiss〇), x_22_174DX (Mw: 4600, (I-Bu 1)), X-24_82〇1 ( Mw: 21〇〇), x_22__2426 (Mw: 12000, formula (I-M)), X-22-2404 (Mw: 420, formula (1-2-1)), X-22-2406C are Shin-Etsu Chemical Commercial products such as industrial (share) system. ?h3 ch3/ 〇h3\ ch3 / ch3 \ HZC=C-|—O-iCH^-si^o-si-J-RS (1-1-1) H2C =CC-0-C3H6-Si-|-〇4i-CH3 ) (i^i) CH3 \ ChJ y 〇 \ d; H3 /4 [Formula G_1_1], R5, W and y are synonymous with the above. As for (A2), for example, acrylic acid 'methacrylic acid, crotonic acid, etc. 8 320856 200937122 ^ unsaturated monocarboxylic acid; * maleic acid, fumaric acid, citraconic acid, mesaconic acid, y Unsaturated dicarboxylic acids such as benzolic acid; anhydrides of the aforementioned unsaturated dicarboxylic acids (anhydrous); 'succinic acid mono[2-(methyl)acryloxyethyl)ester, fumaric acid mono a mono[2-(methyl)propenyloxyalkyl]ester of a divalent or higher polycarboxylic acid such as [2-(meth)acryloxyethyl]ester; like α-(hydroxymethyl) Acrylic acid, an unsaturated acrylate having a hydroxyl group and a carboxyl group in the same molecule. Among these, acrylic acid, methacrylic acid, maleic anhydride, and the like are preferably used because of their copolymerization reactivity and high solubility in an aqueous solution. These can be used alone or in combination. Further, the enamel-containing acrylic resin (Α) preferably contains a monomer (Α3) which is copolymerizable with (Α1) and (Α2) (except (Α1) and (Α2). Hereinafter also referred to as "( A3)")) A copolymer containing a copolymer made of a copolymer of Shishi. q (A3) is preferably a compound having at least one group and an unsaturated bond selected from the group consisting of an epoxy group, an oxetanyl group, an active fluorene group, and an active methine group. . For example, glycidyl (meth)propionate, 4-hydroxybutyl glycidyl (meth)acrylate, (3,4-epoxycyclohexyl)methyl (meth)acrylate, 3- (Meth) propylene methoxymethyl propylene oxide, 3-mercapto-3-(methyl) propylene fluorenyl decyl epoxide, 3-ethyl-3-(indenyl) propylene Oxycarbonyl propylene propylene, 2-phenyl-3-(indenyl) propylene methoxymethyl propylene oxide, 2-trifluoromethyl-3-(methyl) propylene methoxymethyl ring Oxypropane, 2-pentafluoroethyl-3-(methyl)propene oxime 9 320856 200937122 fluorenyl propylene oxide, 3-methyl-3-(fluorenyl) propylene methoxyethyl propylene oxide, 3-methyl-3-(methyl)propenyloxyethyl propylene oxide, 2-phenyl-3-(methyl)propenyloxyethyl propylene oxide, 2-trifluoromethyl-3_ (fluorenyl) propylene methoxyethyl propylene oxide or 2-pentafluoroethyl-3-(indenyl) propylene oxiranyl ethyl propylene oxide, etc., preferably 3-(methyl) propylene oxime Methyl propylene oxide, 3-methyl-3-(methyl) propylene methoxymethyl propylene oxide, 3-ethyl-3-(methyl) propylene methoxy group Propylene oxide, 2-phenyl-3-(indenyl) propylene fluorenyl decyl propylene oxide, 2-trifluoromethyl-3-(methyl) propylene decyl decyl propylene oxide, 2- Pentafluoroethyl-3-(methyl)propenyloxymethyl propylene oxide, 3-methyl-3-(methyl)propenyloxyethyl propylene oxide, 2-phenyl-3-( Methyl) propylene oxiranyl ethyl propylene oxide, 2-trifluoromethyl-3-(methyl) propylene oxiranyl ethyl propylene oxide or 2-pentafluoroethyl-3-(indenyl) propylene Ethoxyethyl propylene oxide. The compound having the above epoxy group and unsaturated bond is preferably a compound having an epoxy group and having an unsaturated bond on the ring of the aliphatic polycyclic compound. As the aliphatic polycyclic compound, for example, dicyclopentane, tricyclodecane, norbornane, isobornane, dicyclooctane, dicyclodecane, dicycloundecane, tricyclic eleven An alkane, a dicyclododecane, a tricyclododecane or the like is preferably a compound having a carbon number of 8 to 12. More preferably, the compound is at least one selected from the group consisting of a compound represented by the formula (ΙΠ) and a compound represented by the formula (IV). 200937122

In the formula (瓜) and the formula (IV), R represents an aliphatic hydrocarbon group having 1 to 4 carbon atoms which may be substituted by a hydrogen atom or a hydroxyl group. X represents an alkylene group having 1 to 6 carbon atoms which may contain a single bond or a hetero atom. R As R, for example, an aliphatic hydrocarbon group such as a hydrogen atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a t-butyl group or a t-butyl group; a hydroxymethyl group or a 1-hydroxy group; Ethyl, 2-hydroxyethyl, 1-hydroxy-n-propyl, 2-hydroxy-n-propyl, 3-carbyl-n-propyl, 1-trans-isopropyl-isopropyl, 2-pyridyl-isopropyl a hydroxyl group-containing aliphatic hydrocarbon group such as a 1-hydroxyl-n-butyl group, a 2-hydroxy-n-butyl group, a 3-trans-p-butyl group or a 4-hydroxy-n-butyl group, preferably a hydrogen atom, Methyl, hydroxymethyl, 1-hydroxyethyl and 2-hydroxyethyl are more preferably a hydrogen atom and a methyl group. © As for X, for example, a single bond, or an alkylene group such as a methylene group or an exoethyl propyl group; an oxymethylene group, an oxyethyl group, an oxypropyl group, a thiomethylene group, or a thio group a hetero atom-containing alkyl group such as a thiol-propyl group, an aminomethylene group, an amine group-extension group, an amine group-extension propyl group, etc., preferably a single bond, a methylene group, an ethyl group, an oxymethylene group The base and the oxy group are ethyl, more preferably a single bond and an oxy-ethyl group. The compound represented by the formula (dish) may, for example, be a compound represented by the formula (m-ι) to the formula (m 11 320856 200937122 preferably (mi) -15), preferably a formula (dish), a formula (dish_3), formula (羾-5), formula (Π_7), formula (melon-9), formula (ΠΙ-11) to formula (ffl'15), more than formula (诅-7), formula ( Dish-9), formula (ΠΙ-15).

?H35? ;Q—Q H2C=CH-G—0 0 h2c=ch-c—o—ch2 ο H2CaCH«C-0-C2H4 H2C=CH—C—Ο—〇2士~~o ch3o • I II Η2〇=0—CTM0 CHS 0 ,,Λ I li H2C=(3-""-C—0 —CHg CH30 u Λ I II —iwQ—Q—Q2H4

(m-i3)

O

H2C=CH-C—0—〇2Η4—s o II Η2〇=ΟΗ"*0·~0"TM·〇2Η4~·Ν H HgC—C"~C—O —C2H4—S

(m-4) (ΠΙ>6) CH3 0 h2c=c-c-o-cyv-N·

CHaOH ο h2c=c--c—0

〇

HgO^sQ — —Q ~—0

C2H4OH 0 H2C—C~· — c a 0 (ΠΜ5)

The compound represented by the formula (IV) may, for example, be a compound represented by the formula (Han~丨) to the formula (IV-15), and is preferably a formula (jyy), a formula (IV-3), a formula-5), or a formula ( IV-7), Formula OV-9), Formula (IV-H) to Formula (IV) 5, more preferably Formula (IV-1), Formula (IV-7), Formula (IV-9), Formula (IV_15). 〇 320856 12 200937122 5/ Ο ?h3j

H2c=ch-c-ο ο h2c=ch-c-o-ch2 H2C=CH-C—O—C2H4 ο II H2C=CH—C—O—(^一丨ch3o I II h2c=c-c H2C= sCe_*C—〇—C2H4 CH30 h2c=c—C—0—C2H4—0

Ch3o H2C=C—C—O-C2H4-N (IV-15)

(IV-2) H2C=CH,C—O—C2H4-S ο II H2C=CH-C—Ο—C2H4—N H CH30 I 11 „ u Q HZC=C-C—O—C2H4-S

(IV-6) (IV-8)

(IV-10) ch2oh o h2c=c-c-0

(TV-12)

H2C-C

(IV-14) At least one compound selected from the group consisting of the compound represented by the formula On) and the compound represented by the formula (iv) may be used singly. At the same time, ' these compounds can be mixed at any ratio. When the mixing ratio at the time of mixing is a molar ratio, it is preferably (the compound represented by the formula (Gua): (the compound represented by the formula (IV)) = 5: 95 to 95: 5 ' More preferably 丨〇: 9 〇 to 9〇: 1〇, particularly preferably 20: 80 to 8〇: 20. As for the radical and unsaturated bond having at least one selected from the group consisting of the aforementioned active methylene group and active methine group The compound may, for example, be a compound represented by the formula (V-1) to the formula (v-18), etc. 13 320856 200937122

(V-2) (V-4) (V-6) (V-8) (v-io) (V-12)

(V-13)

0 Ό O 0 0Λρ〇 from (V-14)

o

O

, CN (V-15) (V-16)

, NO a (V-17)

0 0 S (V-18) Among them, 2-(methylpropenyloxy)ethyl acetylacetate represented by the formula (v-1) is preferred.

(Vl) 14 320856 0 200937122 'The acrylic resin (A) containing ruthenium may be added to other copolymerizable mono-body (A4) (except for (A1), (A2) and (A3). "(A4)"). As the (A4), for example, (fluorenyl) decyl acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, dibutyl (meth) acrylate, (mercapto) • acrylic acid Alkyl (meth)acrylates such as tributyl ester; alkyl acrylates such as methyl acrylate and isopropyl acrylate; cyclohexyl (meth)acrylate, 2-mercaptocyclohexyl (meth)acrylate , . , (Mercapto) acrylic tricyclo [5. 2. 1. 02·6] decane-8-yl ester (in the technical field, the conventional name is dicyclopentanyl (meth) acrylate (meth) ester, (meth)acrylic acid dicyclopentyloxyethyl vinegar, (meth)acrylic acid isodecyl ester and other (meth)acrylic acid cycloalkyl esters; cyclohexyl acrylate, 2-methyl ring acrylate Hexyl ester, tricyclo[5.2.1.02'6]nonane-8-yl ester (commonly known in the art as dicyclopentyl acrylate), dicyclopentyloxyethyl acrylate, Acrylic cyclic alkyl esters such as isodecyl acrylate; 0 phenyl (meth) acrylate, phenyl fluorenyl (meth) acrylate, etc. (fluorenyl) acrylates; acrylates such as phenyl acrylate and benzyl acrylate; diethyl maleate, diethyl fumarate, diethyl itaconate, etc. Dicarboxylic acid diester; 2-hydroxyethyl (meth) acrylate, hydroxyalkyl esters such as 2-hydroxypropyl (meth) acrylate; bicyclo [2. 2. 1] hept-2-ene, 5 - mercaptobicyclo[2.2.1]hept-2-ene, 5-ethylbicyclo[2.2.1]hept-2-ene, 5-hydroxybicyclo[2.2.1]hept-2-ene, 5- 15 320856 200937122 Carboxybicyclo[2. 2·1]hept-2-ene, 5-hydroxyindenylbicyclo[2·2·1]hept-2-ene, 5-(2'-hydroxyethyl)bicyclo[2 2. 1]hept-2-ene, 5-methoxybiscyclo[2.2.1]hept-2-ene, 5-ethoxybicyclo[2.2.1]hept-2-ene, 5, 6 -dihydroxybicyclo[2.2.1]hept-2-ene, 5,6-dicarboxybicyclo[2.2.1]hept-2-ene, 5,6-di(hydroxymethyl)bicyclo[ 2.2. 1]hept-2-ene, 5,6-di-(2,-hydroxyethyl)bicyclo[2.2.1]hept-2-ene, 5,6-dioxaoxybicyclo, [2. 2 1]hept-2-ene, 5,6-diethoxybicyclo[2.2.1]hept-2-ene, 5-hydroxy-5-mercaptobicyclo[2. 2,1]hept-2 -ene, 5-hydroxy-5-B Bicyclo[2.2.1]hept-2-ene, 5-carboxy-5-methylbicyclo[2.2.1]hept-2-ene, 5-nonylcarboxy-5-ethylbicyclo[2.2.1]g 2-ene, 5-hydroxymethyl-5-methylbicyclo[2.2.1]hept-2-ene, 5-carboxy-6-methylbicyclo[2.2.1]hept-2-ene , 5-carboxy-6-ethylbicyclo [2.2. 1] hept-2-dilute, 5, 6-dicarboxybicyclo[2. 2. 1]hept-2-acid Sf (haimic acid Xuan (himic) Anhydride)), 5-tert-butoxycarbonylbicyclo[2.2.1]hept-2-ene, 5-cyclohexyloxycarbonylbicyclo[2.2.1]hept-2-ene, 5-phenoxycarbonylbicyclo [2. 2.1] Hept-2-ene, 5,6-di(t-butoxycarbonyl)bicyclo[2. 2·1]hept-2-ene, 5,6-di(cyclooctene V# hexyloxy) Bicyclic unsaturated compounds such as bicyclo[2.2.1]hept-2-ene; N-phenyl maleimide, N-cyclohexylmethyleneimine, N-benzene Methyl cis-butanol-----imine, N-bromine-branched imine-3~ cis-butyl bis-imine, phthalic acid S-, Ν- 醯 醯 醯 醯 醯 顺 顺 顺Amine succinic acid vinegar, samarium-succinimide, imidate-6-m-butyleneimine hexanoate, hydrazine-copenopyrimidin-3-oxanediimide propionate Ν-(9-acridinyl Dicarbonyl ruthenium derivatives such as maleimide; styrene, mercaptostyrene, m-methyl styrene, p-nonyl styrene, 320856 16 200937122 vinyl toluene, p-methoxy Ethylene styrene, acrylonitrile, methacrylonitrile, chloroethylene, vinylidene chloride, acrylamide, vinyl acetate, 1,3-butadiene, isoprene, 2, 3-dimethyl a vinyl compound such as -1,3-butadiene. Among these compounds, in terms of copolymerization reactivity and for alkaline aqueous solutions; the solution of bismuth, N-phenyl maleimide, n-, cyclohexyl-butene Diimine imine, N-benzylthene maleimide, and the like are preferred. These compounds may be used singly or in combination: The enamel-containing acrylic resin (A) is an enamel-containing acrylic resin formed by copolymer containing at least a polymerized copolymer. It can also contain the constituent units from (A3) and further constituent units from (A4) in accordance with the demand. When the enamel-containing acrylic resin (A) is formed only from the constituent units of (A1) and (A2), the molar fraction based on the total number of moles of the constituent components constituting the copolymer is included. The ratio of the components derived from (A1) and (A2) of the acrylic resin (A) is preferably in the following range.组成 Composition unit from (A1): 50 to 95 mol% Component unit from (A2): 5 to 50 mol% Except for the constituent units from (A1) and (A2), when it contains When the tannic acid tree arsenic (A) contains the constituent units derived from (A3) and (A4), the oxime-containing acrylic resin is based on the molar fraction of the total number of moles of the constituent components constituting the copolymer. The ratio of the components from (A1) to (A4) of (A) is preferably in the following range. Composition unit from (A1): 5 to 75 mol% Composition unit from (A2): 5 to .50 mol% 17 320856 200937122 Composition unit from (A3): 〇 to 85 mol% From (Α4) The unit of composition: 〇 to 5 〇 mol % When the molar fraction of the composition is within this range, the enamel-containing acrylic resin (Α) and the siloxane compound (Β) can be used (but (Α) Except for the compatibility, the compatibility tends to be good, and at the same time, it is not easy to cause film reduction during development, and the non-pixel portion of the image is good at the time of development, and the tendency to have good resolution is good.

When manufacturing an acrylic resin containing ruthenium, for example, please refer to the "Experimental Method for Polymer Synthesis" (Otsuno Ryokan, Ltd., Chemical Co., Ltd., 1st Edition, 1st Brush, March 1st, 1972) The disclosed method and the references disclosed in the literature. ★ Specifically, after the units (Α1) and (Α2) of the quantitative copolymer are charged into the reactor, the oxygen is replaced by nitrogen, and the mixture is stirred in the absence of oxygen. After heating and holding, the poly-collection can be obtained. Further, the obtained polymer may be directly used as a solution after the reaction, a solution which can be used by agro-shrinking or dilution, or a method in which a body (powder) is taken out by a method such as re-sinking. ❹ ν 矽 矽 丙烯酸 丙烯酸 丙烯酸 丙烯酸 丙烯酸 换算 换算 换算 换算 换算 换算 换算 = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = The weight average molecular weight of the acryl-containing resin (4) containing ♦ is such that ==, the coating property tends to be good, and it is difficult to produce at the same time; the property is: and the non-pixel portion has good peeling property during development. , can be fine and good. The fraction of the acrylic resin (1) to be cut is preferably from 1.2 to 4.0. When the molecular weight distribution is in this range, 320856 18 200937122 • It is preferable that the development is excellent and the resolution is excellent. The content of the acrylic resin containing enamel is preferably based on the mass fraction of the solid content in the photosensitive resin composition (which means that the composition of the composition is 'solid at 25 C'). It is 5 to 90% by mass, more preferably • 10 to 70% by mass. When the content of the enamel-containing acrylic resin (Α) is in this range, there is a tendency that the heat-resistant light penetration rate is further improved. The term "rich light transmittance" in the present specification means the rate of change of the light transmittance in the visible luminescence before and after heating when the coating film containing the photosensitive resin composition is heated. The photosensitive tree eagle composition of the present invention contains an oxo-oxygen compound (excluding (Α)). The decane compound (excluding (Α)) is preferably a compound containing a structural unit derived from a monomer represented by the formula (π). R8nSi(0R9)4-„ (Π) [In the formula (H), R8 and r9 are aliphatic fluorenyl groups independently represented by carbon number 1 to α, aryl groups having 6 to 12 carbon atoms or carbon numbers 7 to 12 The aralkyl group, the hydrogen atom of the aliphatic hydrocarbon group, the aryl group and the aralkyl group may also be a heavy hydrogen atom, a fluorine atom, a chlorine atom, a cyano group, a hydroxyl group, an alkoxy group having 1 to 4 carbon atoms, an amine group, sulfur Alcohol, imido, epoxy or (meth)acrylinyl substituted. η represents an integer from 0 to 3. When η is an integer of 2 or less, R9 may be the same or different kinds of groups, respectively. When η is an integer of 2 or more, R8 may be the same type or a different type of base.] The gas-emitting compound (excluding (Α)) is a structural unit containing a monomer derived from the formula (Π). Oligopolymer, polymer or a mixture of these. 19 320856 200937122 As for R8 and R9, for example, an aliphatic hydrocarbon group may, for example, be a propyl group, a butyl group, an octyl group, a dodecyl group, and a heavy hydrogen substituent of the group. The aryl group may, for example, be a substituent of a base group, a biphenyl group, a naphthyl group, or a heavy hydrogen of the groups; and the aralkyl group may be a phenyl group or a xylene gas. : base gas, gas or gasification. As for the preferred heart =, may be exemplified by fluorenyl, 3'3' 3-trifluoropropyl, triterpene; to a base, may be listed as stupid, five 1 phenyl, penta-phenyl group, and particularly preferred aryl = phenyl. Meanwhile, the preferred aramid may, for example, be a trifluoromethyl group: fluoromethyl group.

The hydrogen atom of the aliphatic hydrocarbon group, the aryl group and the aralkyl group may also be a heavy gas atom, a fluorine atom, a (tetra), a cyano group, a hydroxyl group, a carbon number of 丨 to 4, an amine group, a thiol group, or a sub Silk, epoxy or (methyl)-aryl substituted.

The monomer represented by the formula (?) may, for example, be an alkoxydecane or a decane coupling agent. Specific examples thereof include tetradecyloxy tert-butyl, tetraethoxydecane, tetrabutoxydecane, tetrakis(2-methylpropenyloxyethoxy)decane, and tetrakis(2-propyleneoxyl). Oxy) decane, tetraoxane, tetraethoxy decane, tetraamino decane, decyl tridecyl decane, methyl trichloro decane, methyl dioxane, methyl dimethoxy decane, hydrazine Triethoxy decane, decyl triethoxy decane, decyl tributoxy decane, 3, 3, 3-trifluoropropyltrimethyl decane, 3'3, 3-trifluoropropyl Ethoxy decane, dimethyl dimethoxy decane, dimethyl dioxane, trimethylchlorodecane, trimethyl methoxy decane, diethyl oxime, triethyl chloranil, benzene Trimethoxy oxime, phenyl trimethoxy decane, phenyl decane, phenyl triethoxy decane, stupid 320856 20 200937122 ' s-triamino decane, phenyl trioxane, phenyl triethoxy Decane,: methyl-phenyltrimethoxytoxane, trifluoromethylphenyltrimethoxydecane, bis-trimethoxydecane, biphenyltrichlorodecane, diphenyldimethyl hydrazine , Diphenyldichloromethanol, Ethyltriosyloxyxanthene, Ethyltrimethoxy-decane, Vinyltris(2-methoxyethoxy)decane, N-(2-Amino Ethyl,-3-aminopropylmethyldimethoxydecane, N-(2-aminoethyl)-1,3-aminopropyltrimethoxydecane, 3-aminopropyltriethoxylate矽 、, 3-glycidoxypropyl trimethoxy decane, 3-glycidoxypropyl dimethyl methoxy oxet, 2-(3,4-epoxycyclohexyl)ethyltrimethoxy Decane, 3-apropylpropylmercaptodimethoxydecane, 3-chloropropyltrimethoxydecane, 3-methylpropenyloxypropyltrimethoxysulfonate, 3-thiolpropyltrimethoxy Base decane and the like. Shixi Oxygen Compound (8) (except (A)) can be listed as #organic polyoxygen: ::=: The poly-n-resin can be roughly divided into methyl poly-n-resin and methyl-based poly-stone-oxygen resin. 'CH3S1O3 three-dimensional network as for the methyl polyacetal resin, generally a combination of Si〇2 / 2, (CH3) 2Si 〇, (CH3) 3Si0 / 2 structural units into a ^ structure of the copolymer ^ As. The methylphenyl polymethane resin is generally copolymerized by a three-dimensional network of CH3Si〇3/2^C6HsSi〇3/2^(CH3)2Si0>(CeH5)3Si〇3,2. The heat resistance of these materials is higher than that of the tombstone oxy-alloy resin. In the case of organopolysiloxane resins, for example, KR_242A, KC-89, KC-89S, KR-500, X-40-9225, χ-40—9246, 320856 21 200937122 X-40-9250, X-40 can be used. -9227, Χ-40-9247, KR-251, Kr_4 KR-401N, KR-510, KR-9218, KR-217, X-41~1〇53~, 〇, X-41-1056, X-41 -1805, X-41-1810, X-40~2651, X-40-2655A, KR-271, KR-282, KR-300, KR~3]}, KR KR-213, KR-400, KR- 255, ES-l〇01N, ES-10()2T, Es:12, ES-5206, ES-5230, ES-5235, ES-9706 (all are Shin-Etsu Chemicals 23, (share) system), etc. Product. ° The stanol content of the industrial oxirane compound (B) (however, the decane rate is 3, the oh group of SGGcnr1 applied by infrared analysis (from the remnant t and the absorption peak from the um1, the absorption peak of the methyl group) )〇

AbS (3, 50 〇 Cm -!) / AbS (l, 271 cm -1). ) should be less than 1%. P is preferably 2G in terms of the mass fraction of the solid content in the photosensitive resin composition (the component in the composition is solid at 25 ° C.). To 9Q f amount %, more preferably ^ 80 mass %. When the content of the cerium oxide compound (8) is in this range, the heat-resistant light transmittance tends to be more improved. The heat-resistant light of the photosensitive resin composition of the present invention can be improved by the inclusion of the acrylic resin (1) and the stone compound (8) (except for 〇), and the photosensitive resin composition of the present invention contains the photosensitive material. The photoreceptor (6)' may be a photoacid generator or a photoinitiator. The photoacid generator has a nonionic compound and an ionic compound. As the nonionic compound, for example, a dentate-containing compound, a diazonium compound, a diazo-methyl compound, a hard compound, an acid vinegar compound, a carboxylic acid 320856 22 200937122 acid ester compound, a sulfone sulfoximine compound, a sulfone benzotriene can be used. An azole compound or the like. - The halogen-containing compound may, for example, be a halogen-containing hydrocarbon compound or a halogen-containing heterocyclic compound. Preferred examples of the halogen-containing compound include 1,1-bis(4-chlorophenyl)-2,2,2-trichloroethane and 2-phenyl-4,6-bis-(trichloroanthracene). Base)-s-triazine, 2-naphthyl-4,6-bis(trichloromethyl)-s-triazine^, and the like. The diazonium compound may, for example, be a 1,3 -diin-2 -diazide compound, a diazonium quinone compound or a diazonaphthoquinone compound. Preferred diazoketone compounds are 1,2-diazonaphthoquinone-5-sulfonic acid or 1,2-diazonaphthoquinone-4-sulfonic acid and 2,3,4,4'-four. An ester compound of hydroxybenzophenone, 1,2-diazonaphthoquinone-5-sulfonic acid or 1,2-diazonaphthoquinone-4-sulfonic acid and 1,1,1-tris(4-hydroxyphenyl) Ethyl ester compound, 1,2-diazonaphthoquinone-5-sulfonic acid or 1,2-diazonaphthoquinone-4-sulfonic acid and 4,4'-[1-[4-[1-[ 4-hydroxyphenyl]-didecylethyl]phenyl]ethylidene] is a compound of the formula. The diazonium compound may, for example, be bis(trifluoromethylsulfonyl)diazomethane, bis(cyclohexylsulfonyl)diazomethane, bis(indolyl) ◎diazomethane, double (p-nonylphenylsulfonyl)diazomethane, bis(2,4-dimethylphenylsulfonyl)diazomethane, bis(p-chlorophenylsulfonyl)diazononane, mercaptosulfonate Mercapto-p-toluenesulfonyldiazomethane, cyclohexylsulfonyl (1,1-dimethylethylsulfonyl)diazomethane, bis(1,1-dimethylethylsulfonyl) Diazomethane, phenylsulfonyl, (phenylhydrazine) diazomethane, etc. The sulfone compound may, for example, be a 5-ketosulfone compound, a sulfonylsulfone compound or a diaryldifluorene compound. Preferred hydrazine compounds include 4-trityl hydrazine methyl sulfone compound, trimethylphenyl benzhydryl methyl sulfonate 23 320856 200937122, bis(phenylsulfonyl)methane, 4-chlorobenzene A 4-methylphenyl ruthenium compound or the like. The sulfonate compound may, for example, be an alkyl sulfonate, a haloalkyl sulfonate, a quaternary acid ester or an imide acid vinegar. Preferred examples are benzoin tosylate, five times dry phenol trimethyl acid vinegar, nitrophenyl fluorenyl-9,10-diethoxy fluorene-2-sulfonic acid Ester, 2,6-dinitro, benzyl sulfonate, and the like. As the imidosulfonate, for example, pAI_l〇l 〇^ this]~11^231〇1 (share) system, ? 1-1〇6(]^(1〇14 1^运&1〇1(share) system), C:GI-1311 (made by Ciba japan), ❹ As for carboxylic acid The ester compound may, for example, be a carboxylic acid-o-nitro-m-methyl ester. The sulfone oxime imide compound may, for example, be N-(trifluoromethylsulfonyloxy) succinimide, N-( Decanesulfonyloxy) succinimide, N_(4-methylphenylsulfonyloxy) succinimide, N-(2-trifluoromethylphenyl), oxane Imine, fluorinated benzyloxy) succinimide, N~(trifluoromethylsulfonyloxy) quinone imine, N_(decanesulfonyloxyf) ugly imine, (4) - Tri-morphic methylphenyl phenyloxy) ugly imine, (2_~ murmur sulfonyloxy) quinone imine, N_(trifluoromethylsulfonyloxycarbonyl: two Stupid cis-butyl diimide, N_(莰院Continuous oxy)diphenyl cis T, monodecimide, N-(4-mercaptophenylsulfonyloxy)diphenyl cis Butylene-imine, N-(2-difluoromethylphenylsulfonyloxy)di-p-butylene: styrene, N~(4-fluorophenyl-nonyloxy)diphenyl Base butene —_N (Hong fluoro phenylsulfonyloxy) diphenyl maleimide, bis(trisyl)oxybicyclo[2.2·1]hept-5-ene-U-di m醯iamine, Ν'"(decanesulfonyloxy)bicyclo[2. 2·1]hept-5-ene-2, 3~ 320856 24 200937122 Dicarboxy quinone imine, N-(decane sulfonate Mercaptooxy)-7-oxabicyclo[2.2.1]hept-5-ene-2,3-dicarboxylimenine, N-(trifluoromethylsulfonyloxy)-7-oxygen Heterobicyclo[2.2.1]hept-5-ene-2,3-dicarboxyarsenine, N-(4-methylphenylsulfonyloxy)bicyclo[2.2.1]hept-5-ene- 2, 3-dicarboxylimine imine, N-(4- -nonylphenylsulfonylhydrazino)-7-oxabicyclo[2.2. 1]hept-5-ene-2, 3-. Dicarboxyl Yttrium imine, N-(2-trifluoromethylphenylsulfonyloxy)bicyclo[2.2.1]hept-5-rare-2,3_di-birth imine, N-(2- Trifluorodecylphenyl phenyloxy)-7-oxabicyclo[2. 2.]hept-5-ene-2,3-dicarboxylimenide, N-(4-fluorenylphenyl) Sulfhydryloxy)bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylimenine, N-(4-fluorophenylsulfonyloxy)-7-oxabicyclo[2 2. 1]hept-5-ene-2,3-dicarboxylimenine, N-(trifluoromethylsulfonyloxy) Bis-ring [2. 2. 1] Geng-sinter _5,6-oxy-2, 3-di-sub-Hi-imine', N-(calcined ethoxyl)bicyclo[2.2.1]g Burning-5,6-oxy-2,3-di-birth imine, Ν.-(4-mercaptophenyl yloxy)bicyclo[2. 2. 1 ]g-but-5,6- Oxy-2,3_di-birth imine, Ν-(2-trifluoromethylphenylsulfonyloxy)bicyclo[2.2.1]heptane-5,6-oxy-2, 3- Dicarboxylated imine, Ν-(4-fluorophenylsulfonyloxy) bis[[2.2.1]heptane-5,6-oxy-2,3-di-supplemented imine, Ν-(Trifluoromethylphenylsulfonyloxy)naphthyldicarbenium imine, Ν-(decanesulfonyloxy)naphthyldicarboxylimideimine, Ν-(4-methylbenzene Alkyl sulfonyloxy)naphthyl dicarboxy quinone imine, Ν-(2-trifluoromethylphenylsulfonyloxy)naphthyl dicarboxy quinone imine, Ν-(4-fluorophenyl sulfonate Mercaptooxy)naphthyldicarboquinone imine, Ν-(pentafluoroethylsulfonic acid oxy-)Calchi II ruthenium imine, Ν-(penta-propylpropyl aryloxy) tea base Carboxylium imine, Ν-(nonafluoropropylsulfonyloxy)naphthyldicarbenium imine, Ν-(ethylsulfonyloxy)naphthyldicarbenium imine, Ν-(propyl Sulfonyloxy 25 320856 200937122 Naphthyl dicarboxy quinone imine, N-(butylsulfonyloxy)naphthyl dicarboxy quinone imine, N-(pentylsulfonyloxy)naphthyl dicarboxy quinone imine, N-(hexylsulfonyloxy)naphthyldicarbenium imine, N-(heptylsulfonyloxy)naphthyldicarbenium imine, N-(octylsulfonyloxy)naphthyl Dicarboxy quinone imine, N-(decylsulfonyloxy)naphthyl dicarboxy quinone imine, and the like. As for the hindered benzotriene compound, for example, 1_trifluoromethyl succinyloxybenzotriazin, 1-nonafluorobutyl decyloxybenzotriazine, 1-(4- Methylphenylsulfonyloxy)-benzotriazole and the like. In the case of ionic compounds, those composed of an onium cat ion and an anion derived from a Lewis acid can also be used. Examples of the above phosphonium cation include diphenyl iodine rust, bis (p-tolyl) ruthenium rust, bis (p-tert-butylphenyl) iodine rust, and bis (p-octylphenyl) iodine rust. Bis(p-octadecylphenyl) iodine, bis(p-octyloxyphenyl) iodine, bis(p-octadecylphenyl) iodonium, phenyl (p-octadecyl benzene) Iodine, iodonium, (p-phenylphenyl) (p-isopropylphenyl) iodine, triphenylsulfide, tris(p-phenylphenyl) sulfide, tris(p-isopropylphenyl) Pyrite, tris(2,6-dimercaptophenyl)sulfide, tris(p-tert-butylphenyl)sulfonium, tris(p-cyanophenyl)sulfide, tris(p-chloro) Phenyl) sulfonium, dimethyl (methoxy) sulphide, dimethyl (ethoxy) sulphide, dimethyl (propoxy) sulphide, dinonyl (butoxy) sulphur, Dimethyl (octyloxy) sulfonium, didecyl (octadecyloxy) sulphide, dinonyl (isopropoxy) sulphur, dimethyl (t-butyl) sulphur, dimethyl (cyclopentyloxy) sulphur, dimercapto (cyclohexyloxy) sulfonium, dinonyl (fluoromethoxy) sulfonium, dimethyl (2-chloroethoxy) sulphur, dimercapto(3-bromopropoxy) sulphur iron, dimethyl (4-cyanobutoxy) sulphur iron, dimethyl (8-battery octyl)氧基oxy) 26 320856 200937122 .Sulphide cadmium, dimethyl (18-trifluorodecyl octadecyloxy) sulphur, dimethyl hydroxyisopropoxy) sulphur or dimethyl (three (three) Gas methyl)-based group (2~ as a preferred phosphonium cation, for example, bis(p-, a-, s) sulphur iron, etc. (p-tolyl) (p-isopropylphenyl) dish rust, double (preferentially, 基, 基), 峨 、, triphenylsulfuron or bis (for ''t-butyl phenyl) ruthenium. The base). As for the anion from the Lewis acid, for example Hexafluoroarsenate, hexafluoroantimonate or ruthenium (pentafluorophenyl)borate '〇 (pentafluorophenyl) borate The above phosphonium cation and anion derived from Lewis acid can be preferably derived from Lewis. The anion of the acid may be referred to as 'as for η, .... 4 锑 肆 肆 肆 意 意 ( ( ( ( ( ( ( 四 ( 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四Hexafluorophosphate, double (pair No. = + base) moth hexa-acid salt, bis(p-octylphenyl) rhodium hexahydrate bis(p-octadecylphenyl) iodonium hexafluorophosphate, bis(p-octyloxybenzene) Beautiful rust hexafluoride side, bis(p-octadecyloxyphenyl) ruthenium; salt, base (p-octadecyloxyphenyl) moth hexafluoro-Wei salt, (p-tolyl) (p-isopropylphenyl) rust hexafluorophosphate, methylnaphthyl moth hexaphosphate, ethylnaphthyl moth hexafluorophosphate, triphenyl sulphur iron hexafluorophosphate , p-tolyl) sulfonium hexafluorophosphate, tris(p-isopropylphenyl) sulfonium hexafluorophosphate, tris(2,6-dimethylphenyl)thiazide hexafluorophosphate, Bis(p-t-butylphenyl) sulfonium hexafluorophosphate, tris(p-cyanophenyl) guanidine, fluorofluoride, bis(p-chlorophenyl) sulphur hexafluorodisc Salt, dimethylnaphthyl sulfonium hexafluorodislate, diethylnaphthyl sulphide hexafluorophosphate, dimethyl 27 320856 200937122 based (decyloxy) sulphur hexafluorophosphate, dimethyl (B Oxy) sulfonium hexafluorophosphate, dimethyl (propoxy) sulfonium hexafluorophosphate, diterpenes (butoxy) sulphur hexafluorophosphate, dimethyl (octyloxy) sulfonium hexafluorophosphate, dimethyl (octadecyloxy) sulfonium hexafluorophosphate, dimethyl (iso Propoxy) sulfonium hexafluorophosphate, dimercapto (t-butoxy) sulfonium hexafluorophosphate, dimethyl (cyclopentyloxy) sulphur hexafluorophosphate, dimercapto (cyclohexyl) Oxy) sulfonium hexafluorophosphate, dimethyl (fluoromethoxy) sulfonium hexafluorophosphate, dimethyl (2-chloroethoxy) sulphur hexafluorophosphate, dimercapto (3- Bromopropoxy) sulfonium hexafluorophosphate, dimercapto (4-cyanobutoxy) sulfonium hexafluorophosphate, dimethyl (8-nitrooctyloxy) sulfonium hexafluorophosphate, Dimethyl (18-trifluorodecyl octadecyloxy) sulphur hexafluorophosphate, dimercapto (2-hydroxyisopropoxy) sulfonium hexafluorophosphate, dimercapto (tris(trichloro) Methyl)fluorenyl) rust hexafluorophosphate; diphenyliodonium hexafluoroarsenate, bis(p-tolyl) iodine hexafluoroarsenate, bis(p-tert-butylphenyl) Iodine hexafluoroarsenate, bis(p-octylphenyl) iodine hexafluoroarsenate , bis(p-octadecylphenyl)iodonium hexafluoroarsenate, bis(p-octyloxyphenyl)iodine hexafluoroarsenate, bis(p-octadecyloxyphenyl)iodine Rust hexafluoroarsenate, phenyl (p-octadecyloxyphenyl) iodine hexafluoroarsenate, (p-tolyl) (p-isopropylphenyl) iodonium hexafluoroarsenate , methylnaphthyl iodonium hexafluoroarsenate, ethylnaphthyl iodonium hexafluoroarsenate, triphenylsulfide hexafluoroarsenate, tris(p-nonylphenyl) sulphur hexafluoroarsenic acid Salt, tris(p-isopropylphenyl)sulfide hexafluoroarsenate, tris(2,6-dimethylphenyl)sulfide hexafluoroarsenate, tris(p-tert-butylphenyl) Sulphate hexafluoroarsenate, tris(p-cyanophenyl) sulphur hexafluoroarsenate, tris(p-chlorophenyl) sulphur hexafluoroarsenate, dinonylnaphthyl sulphide Fluor arsenate, diethyl naphthyl rust hexafluoroarsenic 28 320856 200937122 acid salt, dimethyl (decyloxy) sulfonium hexafluoroarsenate, dimethyl (ethoxy) • rust hexafluoride Koked acid, dimercapto (propoxy) sulfonium hexafluoroarsenate, dimethyl (butoxy) rust hexafluoroarsenic acid Di-mercapto (octyloxy) sulphur hexafluoroarsenate, dimethyl(octadecyloxy) sulphide hexafluoroarsenate, dimercapto (isopropyl-oxy) sulphur hexafluoroarsenic Acid salt, dimethyl (tert-butoxy) sulfonium hexafluoroarsenic acid. salt, dimethyl (cyclopentyloxy) sulphur hexafluoroarsenate, dimethyl (cyclohexyloxy) rust Hexafluorokunate, dimethyl (fluoromethoxy) sulfonium hexafluoroarsenate, dimethyl (2-chloroethoxy) sulphur hexafluoroarsenate, dimethyl (3-bromopropyl) Oxy) sulphur hexafluoroarsenate, dimethyl (4-cyanobutoxy) sulfonium hexafluoroarsenate, dimercapto (8-nitrooctyloxy) sulphur hexafluoro arsenate Salt, dimercapto (18-trifluoromethyloctadecyloxy) sulphur hexafluoroarsenate, dimethyl (2-hydroxyisopropoxy) sulphide hexafluoroarsenate, dimethyl ( Tris(trichloroindenyl)indenyl)sulfide hexafluoroarsenate; diphenyliodonium hexafluoroantimonate, bis(p-tolyl)iodonium hexafluoroantimonate, double (p-third Butyl phenyl) iodine hexafluoroantimonate, bis(p-octylphenyl) iodine hexafluoroantimonate, bis(p-octadecylphenyl) Iodine hexafluoroantimonate bismuth salt, bis(p-octyloxyphenyl) iodine hexafluoroantimonate, bis(p-octadecyloxyphenyl)iodonium hexafluoroantimonate, phenyl ( p-Octadecyloxyphenyl)iodonium hexafluoroantimonate, (p-tolyl) (p-isopropylphenyl) iodine hexafluoroantimonate, methylnaphthyl iodonium hexafluoroantimonate Acid salt, ethylnaphthyl iodonium hexafluoroantimonate, triphenylsulfonium hexafluoroantimonate, tris(p-nonylphenyl) sulfonium hexafluoroantimonate, tris(p-isopropylbenzene) Thiophene hexafluoroantimonate, tris(2,6-dimethylphenyl) sulphur hexafluoroantimonate, tris(p-tert-butylphenyl) sulphur hexafluoroantimonate, three (p-cyanophenyl) sulfonium hexafluoroantimonate, tris(p-chlorophenyl) sulfonium hexafluorene hexafluorene hexafluoride, dimethyl phthalate sulphur hexafluoroantimonate, diethyl Naphthyl rust hexafluoroantimonate, dimethyl (decyloxy) sulfonium hexafluoroantimonate, dimethyl (ethoxy) sulphur hexafluoroantimonate, dimethyl (propoxy) Thiophene hexafluoroantimonate, dimethyl (butoxy) sulphur hexafluoroantimonate, dimethyl (octyloxy) Hexafluoroantimonate, dimethyl (octadecyloxy) sulphur hexafluoroantimonate, dinonyl (isopropoxy) sulphur hexafluoroantimonate, dimercapto (third butoxide) Thiophene hexafluoroantimonate, dimethyl (cyclopentyloxy) sulfonium hexafluoroantimonate, dimethyl (cyclohexyloxy) sulfonium hexafluoroantimonate, dimercapto Oxy) sulfonium hexafluoroantimonate, dimethyl (2-glyoxy) sulfonium hexafluoroantimonate, dimercapto (3-bromopropoxy) sulfonium hexafluoroantimonate, two Methyl (4-cyanobutoxy) sulfonium hexafluoroantimonate, dimethyl (8-nitrooctyloxy) sulphur hexafluoroantimonate, dimethyl (18-trifluoromethyl decyl) Octacooxy)thioindole hexafluoroantimonate, dimethyl(2-hydroxyisopropoxy)sulfide hexafluoroantimonate, dimercapto (tris(trichloroindenyl)methyl)sulfonium Fluoride; diphenyl iodine rust (pentafluorophenyl) borate, bis (p-tolyl) iodonium (pentafluorophenyl) borate, bis (p-tert-butylphenyl) Iodine rust (pentafluorophenyl) borate, bis(p-octylphenyl) iodonium (pentafluorophenyl) phthalate, double (p-octadecylphenyl)iodonium (pentafluorophenyl)borate, 4-nonylphenyl[4-(1-methylethyl)phenyl]mothium pentoxide (pentafluorophenyl) Borate, bis(p-octyloxyphenyl) iodine rust (pentafluorophenyl) borate, bis(p-octadecyloxyphenyl) iodine ruthenium (pentafluorophenyl) borate, benzene (p-octadecyloxyphenyl) iodine rust (pentafluorophenyl) borate, (p-tolyl) (p-isopropylphenyl) iodine rust (pentafluorophenyl) side acid Salt, methylnaphthyl iodine rust (pentafluorophenyl) borate, ethylnaphthyl iodine rust (pentafluorophenyl) borate, triphenyl sulfide 30 320856 2〇〇937i22 曲 / pentafluorobenzene ^Jisan, tris(p-tolyl) thiopurine (five l-phenyl) (2, di-t-isopropylphenyl) sulphur ruthenium (pentafluorophenyl) borate, tripoddin + armor Phenyl phenyl) sulfonium (pentafluorophenyl) borate, tris (p-third' 镊肆 (2 = 肆 (pentaphenoxyphenyl) borate, tris (p-cyanophenyl) sulphate) Magnesium base, salt, tris(p-chlorophenyl) sulphide (pentafluorophenyl) phenyl) borate Si dimethyl, (a Thiopurine (pentafluororefluoride dimethyl sulfonate, earth (ethoxy) sulphur rust (pentafluorophenyl) borate, furnace gamma gamma oxy) thiophene pentoxide (pentafluorophenyl) Acid salt, dimethyl (butoxy) group HI fluoride (tetra) salt, dimethyl (octyloxy) sulfonium (five gas benzene:, _ ", monodecyl (octadecyloxy) sulfur锵肆(pentafluorophenyl)boronic acid 7V monomethyl (isopropoxy) sulphur iron (pentaphene phenyl) rhyme, dimethyl second butoxy) sulphur rust (five silk) monoacid Salt, bicyclo z (five gas stupid-oxy) sulfur =: base), dimethyl (fluoromethoxy) sulphide (pentafluorobenzene fine acid ◎ should - methyl (2 chloro Oxygen] sulphur rust (pentafluorobenzene, yl) phthalate, dimethyl (3-indolyl) thioindole (pentafluorophenyl) salt, dimethyl (4-alkoxy) Thiopurine (pentafluorophenyl)borate, dimethyl (8-decyloctyloxy) ruthenium pentoxide (pentafluorophenyl) borate, dimercaptopurine 8_trifluoromethyl Octyloxy) sulfonium (pentafluorophenyl) lye, di-T ((di)isopropoxy) sulfonium (pentafluorophenyl) lysine, dimethyl Tris(trichloromethyl)fluorenyl) sulphur ruthenium (pentafluorophenyl) borate; etc.; preferably, for example, bis(p-tolyl)=phosphonium hexaphosphate, (p-tolyl) ( P-isopropylphenyl) broken six rustic acid salt, bis(p-butyl butyl) hexamethylene hexafluoride, triphenyl sulphide 320856 31 200937122 hexafluorophosphate, three ( p-T-butylphenyl) sulphur hexafluorophosphate, bis-(p-tolyl) iodine hexafluoroarsenate, (p-tolyl) (p-isopropylbenzene' yl) iodonium Hexafluoroarsenate, bis(p-tert-butylphenyl)iodonium hexafluoroarsenate, triphenylsulfide hexafluoroarsenate, tris(p-tert-butylphenyl)sulfonium Fluor arsenate, bis(p-nonylphenyl) iodine hexafluoroantimonate, (p-toluene') (p-isopropylphenyl) iodine hexafluoroantimonate, double (p-- Tributylbenzene. Iodine rust hexafluoroantimonate, triphenylsulfide hexafluoroantimonate, tris(p-tert-butylphenyl) sulfonium hexafluoroantimonate, bis(p-toluene) Iridine rust (pentafluorophenyl) borate, (p-tolyl) (p-isopropyl Phenyl) iodine rust (pentafluorophenyl) borate, bis(p-tert-butylphenyl) iodonium (pentafluorophenyl) borate, triphenyl sulfonium pentoxide (pentafluorophenyl) a borate, a tris(p-tert-butylphenyl) sulphur ruthenium (pentafluorophenyl) borate or the like; more preferably, for example, bis(p-nonylphenyl) iodine hexafluoroantimonate (p-tolyl) (p-isopropylphenyl) iodonium hexafluoroantimonate, bis(p-tert-butylphenyl) iodonium hexafluoroantimonate,

Triphenylsulfonium hexafluoroantimonate, bis(p-tert-butylphenyl)phosphonium hexafluoroantimonate, bis(p-nonylphenyl) iodine ruthenium (pentafluorophenyl) borate, (p-nonylbenzene Q-based) (p-isopropylphenyl) iodine rust (pentafluorophenyl) borate, bis(p-tert-butylphenyl) iodonium (pentafluorophenyl) boric acid Salt, triphenylsulfonium (pentafluorophenyl) borate or tris(p-tert-butylphenyl) sulphur ruthenium (pentafluorophenyl) borate. The photobase generator may, for example, be a transition metal complex such as cobalt, an o-nitrophenyl fluorenyl carbamate or an α-dimethyl-3, 5-dimethoxyphenyl benzoyl carbamate. An oxime compound, an α-aminoacetophenone compound, a β-beta compound, and the like. 32 320856 200937122 Any kind of machine or inorganic which can be produced by irradiation with light, but it is also used. Although it is better to use it, it can also be used for the propylene (4) fine purpose (A) The production efficiency, the test catalyst filament, and the polymer obtained from the polymerization of the former precursor (8) are required to be obtained from the reaction solution-solution, etc. , ^ Defeat the present ethyl ketone compound or biimidazole compound is preferred. As the transition metal complex described above, for example, pentane chain perchlorate, > odorous pentamethyl-methyl peroxy acid salt, pentapropylamine, perchlorate, and hexaammonium are used. Acid salt, hexamethylamine, chlorate, hexapropyl chlorinated salt, etc. As the aforementioned Zhengnitro-methylamino carboxylic acid carboxylic acid, for example, [[(2-nitrobenzyl)oxy]carbonyl]methylamine, [[(2-nitrobenzyl)oxy) ] benzylamine, [[(2-nitrobenzyl)oxy]carbonyl]hexylamine, [[(2-nitrobenzyl)oxy]carbonyl]cyclohexylamine, [[( 2-nitrobenzyloxy)carbonyl]aniline, [[(2-nitrophenylhydrazino)oxy]carbonyl]piperidine, bis[[(2_ ❾nitrophenylmethyl)oxy] Carbonyl]hexamethylenediamine, bis[[(2-nitrobenzyl)oxy]carbonyl]phenylene diamine, bis[[(2-nitrobenzyl)oxy]carbonyl] Tolyldiamine, bis[[(2-nitrobenzyl)oxy]carbonyl]diaminodiphenylmethane, bis[[(2-nitrobenzyl)oxy]carbonyl> , [[(2, 6-Dinitrobenzyl)oxy]carbonyl]methylamine, [[(2,6-dinitrobenzyl)oxy]carbonyl]propylamine, [[( 2,6-Dinitrobenzyl)oxy] benzyl]hexylamine, [[(2,6-dinitrophenylhydrazyl)oxy]carbonyl]cyclohexylamine, [[(2, 6-Dinitrobenzyl)oxy]carbonyl]aniline, [[(2,6-dinitro)methyl]oxy]carbonyl]acridine, bis[[ (2,6-Dinitrobenzyl)oxy] 33 320856 200937122 carbonyl] hexamethylenediamine, bis[[(2,6-dinitrobenzyl)oxy]carbonyl]· Benzene Diamine, bis[[(2,6-dinitrobenzyl)oxy]carbonyl] hydrazine Benzylamine, bis[[(2,6-dinitrophenylhydrazyl)oxy] Carbonyl]diaminodiphenylnonane, bis[[(2,6-dinitrobenzyl)oxy]carbonyl]pyridazine, and the like. As the above-mentioned α ' α -dimercapto-3,5-dimethoxyphenylhydrazinylamine--acid esters, for example, [[(α,α-dimethyl-3,5-dimethyl) Oxylbenzyl) oxy]carbonyl]methylamine, [[(α,α-dimethyl-3, 5-dimethoxybenzyl)oxy]methyl]propylamine, [ [(α, dimethyl-3, 5-dimethoxybenzyl)oxy] benzyl] hexylamine, [[(α,α-dimercapto-3, 5-dimethoxy oxime) Methyl)oxy]alkyl]cyclohexylamine, [[(α,α _dimethyl_3,dimethoxycarbenyl)oxy]alkyl]aniline, [[(α, α-工甲) Benzyl 3,5-dimethoxybenzyloxy]carbonyl]piperidine, bis[[(α,α-dimethyl-3,5-dimethoxybenzyl)oxy]carbonyl] Hexamethylenediamine, bis[[(〇,α-dimethyl-3,5-dimethoxybenzyl)oxy]carbonyl]phenylene diamine, bis[[(α,〇: _monomethyl-3, 5-dimethoxybenzyl)oxy] benzyl] tolyldiamine, bis[[(α,α-dimethyl-3, 5-dimethoxybenzene) Methyl)oxy] benzyl]-amino group-one base, bis[[(α,α-dimethyl-3, 5-dimethoxy) basic methyl)oxy] ] 0 ratio hee like. As the above-mentioned hydrazine compound, for example, propyl acetophenone oxime, propyl benzophenone oxime, propyl acetonide oxime, butyl ketone acetophenone oxime, butyl ketone benzophenone, and butyl ketone acetone can be mentioned. , hexamethylene acetophenone bis, hexamethylene benzophenone oxime, hexamethylene acetoacetone oxime, propylene fluorenyl acetophenone oxime, propylene fluorenyl benzophenone oxime, propylene fluorenyl acetonide oxime, 〇_ethoxycarbonyl_<2:-oxyimino-1-phenylpropanone, compound represented by formula (jy) 34 320856 200937122 * (1,2-octanedione' 1-[4- (phenylthio)phenyl-, 2-(anthracene-benzylidene)]) (IRGACURE OXE-01; manufactured by Ciba Japan Co., Ltd.), a compound represented by the formula (V), etc. The compound represented by the formula (IV) is preferred.

❹ As the above-mentioned α-aminoacetophenone compound, for example, 2-.benzylmethyl-2-methylamino-1-(4-(indolyl)phenyl)butane-1 -keto' 2-(2-mercaptophenyl)-2-dimethylamino-ι-(4-(ν-morpholinyl)phenyl)-butanone, 2-(3-methylbenzene Methyl)-2-dimethylamino-indole-(4-(indolyl-phenyl)phenyl)-butanone, 2-(4-methylphenylindenyl)-2-dimethylamino -1 -(4-(N-morpholinyl)phenyl)-butanone, 2-(2-ethylphenylindenyl)-2-dimethylamino-1-(4-(indole-morpholine) Phenyl)-butanone, 2-(2-propylbenzyl)-2-dimethylamino-i-(4-(N-morphinyl)phenyl)-butyl, 2- (2-D butyl benzyl)-2-dimethylamino-i — (4-(N-morphinyl)phenyl)-butanone, 2-(2,3-dimercaptobenzoic acid >-2-Dimethylamino-i-(4-(N-morpholinyl)phenyl)-butanone, 2-(2,4-dimercaptobenzyl)-2-dimethyl Amino 1 (4-(N-morphinyl)phenyl)-butan, 2-(2-chlorophenylindenyl)-2.-dimethylamino-1-(4-(indole-morpholine) Phenyl)-butanone, 2-(2-bromobenzyl)-2-dimethylamino-1-(4-(indolyl-morpholino)phenyl)-butanone, 2-( 3-chlorobenzyl -2-Dimethylamino-(4-0-morpholinyl)phenyl)-butanone, 2-(4- gasbenzyl)-2-dimethylamino-1-(4- (Ν-morpholinyl) phenyl) a little brewed! , 320856 .35 200937122 2-(3-bromobensyl)-2-methylamino-1-(4-(indolyl)-butanone-butanone, 2-(4-bromobenzene) Methyl)-2-dimethylamino-indole-(4-(indolyl-morpholino)phenyl)-butanone, 2-(2-methoxybenzyl)-2-dimethylamino 1-(4-(indolyl-morpholinyl)phenyl)-butanone, 2-(3-methoxybenzyl)-2-dimethylamino-1-(4-(indole-morpholinyl) Phenyl)-butanone, 2-(4-methoxybenzyl)-2-didecylamino-1-(4-(indolyl-morpholino)phenyl)-butyl, 2__( 2_ decyl-4-decyloxybenzyl)-2-dimethylaminomorpholino)phenyl)butanone, 2-(2-methyl-4-bromobenzyl)-2- Dimethylamino-1-(4-(indolyl-morpholino)phenyl)-butanone, 2-(2-bromo-4-methoxybenzyl)-2-didecylamino- A polymer of i-(4-(N-morpholinyl)phenyl)-butanone or the like. As the aforementioned biimidazole compound, for example, 2 2, bis(2-indolyl)-4,4',5'5'-tetraphenylbiimidazole, 2,2, _bis (2,3_2) may be mentioned. Benzene) 4,4,5,5-tetraphenyl-linked yttrium (for example, see JP-A-H06-75372, JP-A-6-75373, etc.), 2, 2, monophenyl 4, 4,5,5,-Tetraphenyl linkage. Sit, 2,2,-bis(2-^-yl)-4,4,5,5'-tetrakis(alkoxyphenyl)biimidazole, 2,2,-dichlorophenyl)~4, 4,5,5,-tetrakis(dialkoxyphenyl)biimidazole, bis(2-chlorophenyl)-4,4',5,5,-tetrakis(trialkoxyphenyl) = (for example, refer to Japanese Patent Publication No. Sho 48_384(3), JP-A No. 2,174,204, etc.), and 4, 4', 5 5'-position of a phenyl group to be reposted/substituted with a salivary compound (for example, Referring to Japanese Patent Laid-Open No. 7-10913, etc., and etc., and preferably 2, 2,-bis (2-chlorobenzene,,, 5 - 4 benzyl imidazole, 2, 2, - bis (2, 3) - Digas benzene 320856 36 200937122 * Base)-4, 4',5,5'-Tetraphenyl phenylidene, 2,2'-double (2 in ___知.基)-4,4', 5'5'-tetraphenylbiimidazole, 2,2',4~3 (2-butoxyphenyl)-5-(3,4-dimethoxyphenyl)-4, 5-diphenyl- 1, the total amount of the photosensitive material (C) is preferably from 40 to 40, based on the mass fraction of the total amount of the acrylic resin (A) and the oxy-oxygen compound (B). % by mass, more preferably 1 to 30% by mass. When the content of the photosensitive material (C) is in the above range, the photosensitive resin composition becomes high-sensitivity. The strength of the halogen component is formed by using the photosensitive resin composition described above, or the aforementioned halogen is used. The smoothness of the surface has a good tendency. Meanwhile, as long as the effect of the present invention is not impaired, a photosensitizer (F) such as a benzophenone compound or a thioxanthone may be used. More specifically, the following compounds may be mentioned, and these compounds may be used singly or in combination of two or more. As the benzophenone compound, the benzene may be exemplified above. Anthrone, o-benzyl benzoyl phthalate, 4-phenylbenzophenone, 4-benzylidene-4'-methyldiphenyl sulfide, 3,3',4,4 '-tetra(t-butylperoxy.carbonyl)dibenzophenone, 2,4,6-trimethylbenzophenone, etc. As the aforementioned thioxanthone compound, for example, 2-isopropyl group Thioxanthone, 4-isopropylxanthone, 2,4-diethylxanthene, 2,4-dichloroxanthone, 1-chloro-4-propoxy As the aforementioned quinone compound, for example, 9,10-dimethoxyanthracene, 2-ethyl-9, 10-dimethoxyanthracene, 9,10-diethoxyanthracene, 2-ethyl 37 320856 200937122 -9,10-monoethoxy hydrazine, etc. Others can also be cited as 10-butyl 2K biting, 2_ethyl hui, biphenyl brewing (benzUe), 9, 1 ()- phenanthrene , waking up, phenyl acetonate, titanocene compounds and the like. Meanwhile, in the case of the photosensitizer (F), a compound having a group capable of inducing bond shift can be used as described in 曰本特表2002-544205. As the compound of the above-mentioned oxime which can initiate chain movement, for example, a compound of the following formulas (5) to (10) can be mentioned. '

38 320856 200937122 • The above-mentioned compound which can initiate the movement of the bond can also be contained in the photosensitive resin composition as a constituent component of the above copolymer. Meanwhile, the content of the photosensitizer (F) is preferably V 〇. 〇1 to 50, based on the mass fraction of the total amount of the fluorene-containing acrylic resin (A) oxime compound (B). The mass % ' is more preferably 〇. 1 to 40% by mass. Meanwhile, a photopolymerization initiation aid (G) may be used in combination in the photosensitive material (C), or a plurality of photopolymerization initiation assistants may be used in combination. The photopolymerization initiation aid (G) may, for example, be an amine compound, a carboxylated φ compound, a polyfunctional thiol compound or a compound represented by the formula (VII). The amine compound may, for example, be an aliphatic amine compound such as triethanolamine, methyldiethanolamine or triisopropanolamine; methyl 4-dimethylaminobenzoate or ethyl 4-dimethylaminobenzoate; Isoamyl 4-dimethylaminobenzoate, 2-ethylhexyl 4-dimethylaminobenzoate, 2-dimethylaminoethyl benzoate, N,N-dimethyl-p- Aniline, 4, 4'-bis (dimethylamino group benzophenone (general name: Michler, Michler, sket〇ne), 4, 4, a pair of (diethylamino) diphenyl Aromatic amine compounds of ketones. J. in succinic acid silks, for example, *sulfuric acid, phenylthioacetic acid, ethyl phenylthiocarboxylic acid, methyl ethyl phenylthioacetic acid, dimethyl Phenylthioacetic acid, methoxyphenylthioacetic acid, dimethoxyphenylthioacetic acid, chlorophenylthioacetic acid, disulphuryl _, phenylphenyl lysine, phenoxyacetic acid, naphthylthioacetic acid, An aromatic heteroacetic acid such as N-naphthylglycine or naphthyloxyacetic acid. Examples of the polyfunctional thiol compound include hexanedithiol, decanedithiol, U-dimethylthiol benzene, and dibutyl. Alcohol dithiopropionate Butanediol disulfide 320856 39 200937122 [In the formula (VII), a cyclic aromatic ring. Glycolate, ethylene glycol dithioglycolic acid vinegar, trimethylolpropane trisulfide. Acid vinegar, butanediol disulfide Propionic acid vinegar, tris(tetra)propylpropane trithiocyanate, alcohol hydroxydecyl propane dithioglycolate, pentaerythritol thiopropionate, quaternary alcohol oxime, trihydroxyethyl trithiopropene , quarter fine = thiol butyrate), 1,4-bis(3- mercaptobutoxy)butane.

(VII) X represents a carbon number of 6 to 12 which may be substituted by a halogen atom, and represents an oxygen atom or a sulfur atom. > represents an aliphatic hydrocarbon group having a carbon number of 1 to 6 - I... an aliphatic nicotine group of Jiulong 1 King D. R11 represents the carbon number that can be substituted by (iv) atoms! An aliphatic group of up to 12 is an aryl group substituted with a halogen atom. The radical is as long as the (iv) atom, and examples thereof include a fluorine atom, a gas atom, a bromine atom, and an aromatic ring having a carbon number of 6 and 2, and examples thereof include a benzene ring H, and a carbon number of 6 to 12 which can be substituted with a * atom. 'Examples such as benzene ring, methyl phenyl ring, -methyl group, 袤' clothing, butyl benzene ring, pentyl benzene ring, hexyl benzene ring, cyclohexyl. * ring, two gas benzene ring, bromobenzene ring, hydrazine , gas exhibition, silk-based benzene ring, turn, gas Cai ring 1 (four) and so on. The gas radical is derived from an aliphatic n-propyl group, an isopropyl group, a n-butylene group having a carbon number of 1 to 6, for example, a sulfhydryl group, a benzyl group, a benzyl group, a methyl group, a 2-methyl group, a Butyl, n-pentyl, i, methane 2 methyl-n-n-butyl, 2-methyl-n-butyl j 320856 40 200937122 % 3_methyl-n-butyl, 1,1-didecyl _ N-propyl, 1,2-didecyl-n-propyl-yl, 2,2-dimethyl-n-propyl, n-hexyl, cyclohexyl and the like. As the aliphatic hydrocarbon group having 1 to 12 carbon atoms which may be substituted by a halogen atom, for example, a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a 1-decyl-n-propyl group or a 2-fluorenyl group may be mentioned. - n-propyl, tert-butyl, n-pentyl, 1-decyl-n-butyl, 2-methyl-n-butyl, 3-mercapto-n-butyl, 1,1-didecyl- N-propyl, 1,2-dimethyl-n-propyl, 2,2-diindenyl-n-propyl, n-hexyl, cyclohexyl, 1-chloro-n-butyl, 2-cyclo-n-butyl, 3-chloro-n-butyl and the like. ❹ As the aryl group which may be substituted by a halogen atom, for example, a phenyl group, a chlorophenyl group, a dichlorophenyl group, a bromophenyl group, a diphenyl group, a chlorobromophenyl group, a biphenyl group, a chlorobiphenyl group, or a second group may be mentioned. Chlorinated biphenyl, bromophenyl, dibromophenyl, naphthyl, chloronaphthyl, dichlorochayl, > stinky base, dimethoprim, and the like. As the compound represented by the formula (W), for example, 2-benzylidenemethylene-3-mercapto-naphtho[2, fluorene-d]thiazoline, 2-benzylidenemethylene-3 -methyl-naphtho[1,2-d]thiazoline, 2-benzylidenemethylidene-3-methyl-naphtho[2,3-d]thiazoline,

Q 2-(2-naphthylmethylidene methylene)-3-methylbenzothiazoline, 2-U-naphthylmethyl fluorenyl)-3-mercaptobenzothiazoline, 2-(2 -naphthylmethyl fluorenyl)-3-methyl-5-phenylbenzothiazoline, 2-(b-naphthylfluorenylene)-3-methyl-5-phenylbenzothiazoline , 2-(2-naphthylmethylidene methylene)-3-methyl-5-fluorobenzothiazoline, 2-(1-naphthylmethylidene methylene)-3-methyl-5-fluoro Benzothiazoline, 2-(2-naphthylmethylhydrazino)-3-indolyl-5-chlorobenzothiazoline, 2-(1-naphthylmethylidene)-3-fluorenyl -5-chlorobenzothiazoline, 41 320856 200937122 2-(2-naphthylmethylhydrazinyl)-3-methyl-5-bromobenzimidazoline, 2-α-naphthylmethylidene fluorenyl -3-methyl-mute thiazoline, 2-(4- phenylidene benzylidene)_3-methylbenzothiazoline, 2-(4-biphenylmethylmercaptomethyl)_3 _methyl+ stupid base and shoot, 2-(2-naphthylmethylidene f-group)_3_mercapto-naphtho[2, η]嗟,, 2-(1-naphthylmethylidene) )- 3-methyl-naphthoquinone, 2_d] 嗟 琳, 2-(4-biphenylmethylidene methylene)-3-methyl pin 2, pus thiazoline, 2-(4-linked Benzoyl methylene) m naphthalene And, ❹ 2_(p-fluorobenzylmethylidene) {mercapto-naphthoquinone H] noodles 2-(p-stupidyl fluorenyl)-3_methyl-naphtho[ Nd] 嗟 琳 2- 2- 苯 2- 2- 2- 2- 2- 2- _ _ _ _ _ _ _ _ _ _ 2 2 2 2 2 2 2 2 2 2 2 2 萘 萘 2 萘 萘 2 萘 萘 2 萘 萘 萘 2 2 2 2琳琳, 2-benzylidene benzylidene _3_methyl _naphtho[2,3_d], phthalocyanine, 2-(2-naphthyl benzylidene)-3-methyl benzoxazole Porphyrin, 2(p-naphthylmethylidene)-3-methylbenzoxazoline, ❹ 醯 醯 亚 亚 亚 、 、 甲基 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ |methyl i phenyl benzo sulphur sulphate, ---naphthyl benzylidene methyl group | methyl + fluorobenzophenantine, methylene) _3 - methyl ~ 5 ~ fluorobenzoyl, ^ fluorenyl Methylene)-3ϋ benzophenone octagonal,; = methoxymethylmethyl '5' chlorobenzoxene, methyl benzox, _ _ _ _ _喔 琳,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, Methyl-naphthoene, 2-(2-naphthylmethylidene)_3 Q"~嗤琳土土和[l 2~d]oxazoline, -L - ΐΐ 2 (bromomethylidene)_3-methyl·naphtho(1) acetoin, • 2—(p-fluorobenzamide)-3 - 〒 - - - - - - - - - - - - - - - - - - - - - - - - - - - 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 Methyl- & methyl-naphtho[1,2-d]嗟 琳 及 and 2_(4_联笨, 醯 亚 methylene)-3-methyl-naphthoquinone represented by formula (w_3) —d]嗟嗟琳 is better.

^ 〇 :C=CH - CH,

[Ό (VU-2) A preferred photopolymerization initiation aid (G) is an amine compound, a polyfunctional thiol, or a compound represented by the formula (VH-2). Relative to the enamel-containing acrylic resin (A) and the siloxane compound (B) 43 320856 200937122

I mass spectrometer, silk compound. · (four)... % by mass, more preferably. When the amount of the photopolymerization initiation aid (6) is within the above range, the sensitivity of the obtained photosensitive resin composition is increased, and the pattern substrate formed using the photosensitive resin composition can be used. Productivity has a tendency to improve.

The photosensitive resin composition of the present invention may contain a thermosetting accelerator (D). The above-mentioned thermosetting accelerator (D) is not particularly limited as long as it accelerates the dehydration condensation reaction of the oxidized oxygen stone in the presence of hydrazine. Among them, ‘,’ is preferably a compound containing organic compounds and organic compounds. Examples of the compound containing an organic titanium include tetra-iso-propoxytitanium (TPT; manufactured by Sakamoto Soda Co., Ltd.), tetra-n-butoxybutadiene (TBT; manufactured by Nippon Soda Co., Ltd.), and ruthenium. (2-ethylhexyloxy)titanium (τοτ; manufactured by Nippon Soda Co., Ltd.), titanium-isopropoxyoctyl glycolate (T0G; manufactured by Japan Soda Co., Ltd.), di-iso-propoxy group Bis(Ethyl propyl ketone 1) titanium (T-5 〇; 曰本曹达 (share) system), 丙院一氧钛双(ethyl acetonitrile acetate )) (T-60; 曰本曹达(share) )), tri-n-butoxy titanium monostearate (TBSTA; 曰本曹达 (share) system), titanium stearate (S-151; Japan Soda (stock) system), Di-isopropoxytitanium diisostearic acid S (S-152; manufactured by Sakamoto Soda Co., Ltd.), (2_n-butoxybenzylbenzoyloxy) tributoxy fluorene (S-181; Sakamoto Soda (share) system) and so on. At the same time, you can also use D-20 (Shin-Etsu Chemical Industry Co., Ltd.), D_25 (Shin-Etsu Chemical Industry Co., Ltd.), D-30 (Shin-Etsu Chemical Industry Co., Ltd.), B_〗 (Sakamoto Soda) )), B-2 (Sakamoto Soda (share) system), B-3 (Sakamoto Soda (share) system), B-4 (Japan Soda (share) system), B-5 (Japan Soda (share) )), b-6 (曰44 320856 200937122 • Ben Caoda (share) system), B-7 (Japan Soda (share) system), B-8 (Japan Soda (share) system), B-9 ( Commercial products such as Sakamoto Soda (share) system and B-10 (Sakamoto Soda Co., Ltd.). The organic zirconium compound may, for example, be a reaction product of tetra-1-butoxy miscide• (TBZR; manufactured by Sakamoto Soda Co., Ltd.), tetrabutoxyzirconium (IV) and ethyl bromopropylamine. A product (ZR-181; a product of a reaction product of cerium oxyzirconium and acetophenone acetonitrile, which is manufactured by Japan's Soda Co., Ltd., and the like (ZM; _# 达()), etc. Commercial products such as ZR-151C Japan Soda Co., Ltd. can also be used. Although the photosensitive resin composition of the present invention may be solvent-free, it contains a solvent (E). The solvent (E) may be various organic solvents used in the field of photosensitive resin compositions. As specific examples thereof, ethylene glycol monoalkyl ethers such as ethylene glycol monodecyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, and ethylene glycol monobutyl ether can be mentioned; Diethylene glycol didecyl ether, diethylene glycol diethyl ether, diethylene glycol ethyl methyl ether, diethylene glycol dipropyl ether and diethylene glycol dibutyl _ diethylene Alcohol dialkyl ethers; glycol alkyl ether vinegar vinegar like methyl cyproterone acetate, ethyl cyproterone acetate, ethylene glycol monobutyl ether acetate and ethylene glycol monoethyl ether acetate Class; like propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, $ * 二醇 diol monopropyl ether acetate, methoxy butyl acetate and decyl pentyl succinate Glycolyl ether acetate g is similar to propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, 45 32 〇 856 200937122 propylene glycol monobutyl ether propylene glycol monoalkyl ether; like propylene glycol dihydrazide Ethyl ether, propylene glycol diethyl ether, propylene glycol ethyl decyl ether, propylene glycol dipropyl ether, propylene glycol propyl methyl ether and propylene glycol ethyl propyl a propylene glycol dialkyl ether; a propylene glycol alkyl ether propionate such as propylene glycol decyl ether propionate, propylene glycol ethyl ether propionate, propylene glycol propyl ether propionate, and propylene glycol butyl ether propionate; Butanediol monoalkyl ethers of methoxybutanol, ethoxybutanol, propoxybutanol and butoxybutanol; like methoxybutyl acetate, ethoxybutyl acetate, acetate acetate Butanediol monoalkyl ether acetates of oxybutyl ester and butoxybutyl acetate; like methoxybutyl propionate, ethoxybutyl propionate, propoxypropionate and propionic acid Butanediol monoalkyl ether propionate of butoxybutyl ester; dipropylene glycol dialkyl ether like dipropylene glycol dimethyl ether, dipropylene glycol diethyl ether and dipropylene glycol decyl ethyl ether; Aromatic hydrocarbons of benzene, toluene, xylene and tridecylbenzene; ketones like methyl ethyl ketone, acetone, methyl amyl ketone, methyl isobutyl ketone and cyclohexanone; like ethanol, C Alcohols, butanol, hexanol, cyclohexanol, ethylene glycol and glycerol alcohols; decyl acetate, ethyl acetate, propyl acetate, acetic acid Butyl ester, ethyl 2-hydroxypropionate, decyl 2-hydroxy-2-mercaptopropionate, ethyl 2-hydroxy-2-methylpropionate, hydroxy hydroxyacetate, ethyl hydroxyacetate, hydroxyacetate Ester, methyl lactate, ethyl lactate, propyl lactate, butyl lactate, methyl 3-hydroxypropionate, 3-hydroxy 46 320856 200937122 - ethyl propyl propionate, propyl 3-hydroxypropionate, 3-hydroxyl Butyl propionate, methyl 2-hydroxy--3-methyl decanoate, decyl methoxyacetate, ethyl methoxyacetate, propyl methoxyacetate, butyl methoxyacetate, ethoxylate Methyl acetate, ethyl ethoxyacetate, propyl ethoxyacetate, butyl ethoxyacetate, propoxy-methyl acetate, ethyl propoxyacetate, propyl propionate, propoxy Vinegar • Butyl acrylate, methyl butoxyacetate, ethyl butoxyacetate, propyl butoxyacetate, butyl butoxyacetate, decyl 2-methoxypropionate, 2-methoxy propyl Ethyl acetate, propyl 2-methoxypropionate, butyl 2-methoxypropionate, methyl 2-ethoxyanthopropionate, ethyl 2-ethoxypropionate, 2-ethoxyl Propyl propionate, butyl 2-ethoxypropionate, 2-butoxypropionic acid Ester, ethyl 2-butoxypropionate, propyl 2-butoxypropionate, butyl 2-butoxypropionate, methyl 3-methoxyoxypropionate, 3-methoxypropionic acid Ester, propyl 3-methoxypropionate, butyl 3-methoxypropionate, decyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, 3-ethoxypropionic acid Ester, butyl 3-ethoxypropionate, decyl 3-propoxypropionate, ethyl 3-propoxypropionate, propyl 3-propoxypropionate, butyl 3-propoxypropionate Esters such as ester, methyl 3-butoxypropionate, ethyl 3-butoxypropionate, propyl 3-butoxypropionate and butyl 3-butoxypropionate; a cyclic ether which is conjugated to 0-pyran; a cyclic ester such as 7-butane vinegar. In terms of coatability and drying property, among the above solvents, an organic solvent having a boiling point of 100 to 200 ° C in the solvent is preferred, and alkanediol alkyl ether acetates, ketones, and butyl groups are preferred. Glycol alkyl ether acetates, butanediol monoalkyl ethers, esters such as ethyl 3-ethoxypropionate and decyl 3-methoxypropionate, more preferably propylene glycol monoterpene Ethyl ether acetate, propylene glycol single 47 320856 200937122 ethoxybutanol, more than two kinds of ethyl mystery acetate, cyclohexanone, methoxybutyl acetate, ethyl 3-ethoxypropionate and 3_ Ethyl methoxy propionate. These solvents (E) may be used singly or in combination with 0 in terms of the mass fraction of the photosensitive resin composition.

The content of the solvent (E) in the photosensitive resin composition is preferably the amount % of the present invention, more preferably 70 to 85% by mass. When the solvent (E) = 〇 to 9 〇, it is expected that the coater, the slit and the amount of the coating machine can be applied to the above-mentioned slit coater (also known as a coater, a curtain type cloth machine, a fine cloth, etc.). When the device is coated (4), the cloth is good. The ink is applied to the photosensitive resin composition of the present invention, and the filler, other polymer compound, leveling agent, and anti-external absorbent can also be used. Additives such as a coagulant, a chain shifting agent, a thermoplastic resin such as a polyethylene glycol monobutyl squam or a polyfluoroacrylic acid, and the like, and examples of the filler include glass, cerium oxide, aluminum oxide, and the like. As the polymer compound, a curable resin such as an epoxy- or cis-butane-quinone imide resin, or a polyvinyl alcohol or a polyacrylic acid can be used.

酉 、, polyester, polyurethane to leveling agent, can be used to (4) surfactants, such as money, fluorine, lyon, cationic, anionic, nonionic, amphoteric active materials, each Do not use (4) the total amount of the two or more. To the above, the interface activity _, can be _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Modified polyurethane 320856 48 200937122 • Polyethylenimine, etc., in addition to the trade name κρ (Shin-Etsu Chemical Industry Co., Ltd.), P0LYFL0W (Kyoei Chemical Co., Ltd.), eft〇P (transliteration) (made by TOCHEM Products), MEGAFACE (made by Dainippon Ink Chemical Industry Co., Ltd.), Fluorad (Sumitomo 3M (share) system), AsahiGuard, -Surflon (above: Asahi Glass Co., Ltd.), SOLSPERSE (Zeneca) (share) system, EFKA (made by EFKA Chemicals Co., Ltd.), PB82U Ajinomoto (manufactured by the company), etc. As the antioxidant, for example, 2-tert-butyl-6-(3-tert-butylindole-2-p-yl-5-nonylbenzyl)-4-mercaptophenyl acrylate, hydroxy- 3'5~di-t-pentylphenyl)ethyl]-4,6-di-tris-pentylphenyl acrylate, 6-[3-(3-tert-butyl-4-hydroxy- 5-methylphenyl)propoxy]-2, 4, 8, ίο-tetra-tert-butyldibenzo[d,f ][,,3,2]dioxaheptane, 3 , 9-bis[2-{3-(3-tert-butyl-4-carboxy-5-methylphenyl)propanyloxyindole-1,1-dimethylethyl]-2, 4 , 8, 10-tetraoxaspiro[5, 5] eleven, 2,2,-arylene di(6-t-butyl-3-nonylphenol), 4,4,-indolylene Bis(6~t-butyl-3-methylphenol), 4,4,-thiobis(2-tert-butylmethylphenol), 2,2,-thiobis(6-t-butyl- 4-methylphenol), ')丨1·yl-propionic acid dilauryl vinegar, 3,3-thiodipropionic acid di-peas-capped vinegar, 3,3'-thiodipropionate distearyl Base ester, pentaerythritol bismuth (3-lauryl thiopropionate), 1,3,5-tris(3,5-di-t-butyl-4-hydroxybenzyl group 1,3, 5-three Pyrazine-2, 4, 6(1H,3H,5H)-three Ketone, 3'3',3",5,5',5"-hexa-t-butyl-a,a",a"-(methylene-2,4,triyl)tri-p-- Phenol, pentaerythritol 肆 [3-(3, 5-di-tertiary terbene 4 light 'base group) propionic acid vinegar], 2, 6-di-t-butyl _4~ methyl group, etc. 49 320856 200937122 As the ultraviolet absorber, for example, 2_(3_t-butyl-2-hydroxy-5-nonylphenyl)-5-chloro benzotriazole, alkoxybenzophenone, etc. may be mentioned. The agent may, for example, be sodium polyacrylate. Examples of the chain shifting agent include, for example, dodecyl mercaptan and 2,4-diphenyl-4-methyl-1-pentacene. The photosensitive resin composition is coated on a substrate, and after photo-hardening and development, the pattern can be patterned. First, the composition is coated on a substrate (usually glass) or has been formed in advance. After the layer of the solid resin composition is formed into a layer, the coated photosensitive resin is pre-baked, and the volatile component such as a solvent is removed to obtain a smooth coating film. The thickness of the coating film is approximately 1 to through the mask that can form the target pattern, The coating film thus obtained is irradiated with ultraviolet rays. At this time, it is preferable to uniformly irradiate the parallel light to the entire exposed portion, and it is preferable to use a device such as a mask aligner or a stepper to match the correct position of the mask and the substrate. Then, after that, the cured coating film is brought into contact with an alkaline aqueous solution to dissolve the non-exposed portion, and then the image of the desired pattern can be obtained by development. The development method may be any one of a liquid-filling method, a dip coating method, and a spray coating method. And 0 and the substrate can be tilted at any angle. As the coating method, a spin coating method, a cast coating method, a roll coating method, a slit and a spin coating method, or a slit coating method can be applied. After coating, it is heated and dried (prebaked) or dried under reduced pressure, and then heated to volatilize volatile components such as a solvent to form a photosensitive dendrimer composition layer. The temperature of heating at this time is usually 70 to 200 ° C', preferably 80 to 130 ° C. The photosensitive resin composition layer can be made to contain almost no volatile components. Meanwhile, the aforementioned sensitivity 320856 50 200937122 ‘the thickness of the resin composition layer is approximately 15 to 8 is difficult. After the exposure, in order to promote the hardening of the exposed portion, the heating condition may be different depending on the composition of the (four) New resin, the type of the agent, and the like. The Rittone 7 is 3° to _, preferably 5 Å to 2 Å. It can be used for developing a liquid chemical solution and an interface active _ aqueous solution for development after pattern exposure. It is usually an inorganic compound containing inorganic compounds and inorganic compounds. It can be pasteurized with an inorganic compound. It can be pasteurized as hydrazine (10), and both are: acid sinter, sodium dihydrogen phosphate, acid hydrogen Record, dish acid dioxane: unloading, potassium hydrogen, sodium citrate, potassium citrate, sodium carbonate, potassium carbonate,: money, potassium hydrogen citrate, sodium borohydride, potassium borate, ammonia, and the like. The sodium carbonate gas, ::: may be, for example, tetramethylammonium hydroxide, 2 violent monomethylammonium chloride, monomethylamine, di-2-aminoamine, diethylamine, triethylamine, Teresadiamine, amineamine, ethanolamine, and the like. This #inorganic and ～ 单独 单独 单独 单独 单独 单独 单独 单独 。 。 。 。 。 。 。 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ 蜂 蜂 蜂 蜂The 1 to 10 side is more preferably. Shoulder 2: The surfactant in the test imaging liquid is a non-ionic system (IV) (4) or a cationic interface (4), which is a surfactant, such as polyoxyalkylene :. Polyoxynexene y rif Γ Γ polyoxymethylene aryl aryl, other basic organisms, oxygen extended ethyl / oxy-based block copolymer, mountain 320856 51 200937122 sorbitol fatty acid vinegar, poly Oxygen extended ethyl sorbitan fatty acid ester, poly, oxygen extended ethyl sorbitol fatty acid vinegar, glycerin fatty acid vinegar, polyoxyethyl alcohol ester, polyoxyethylene ethylamine and the like. As the anionic surfactant, examples thereof include higher alcohol sulfate salts such as sodium lauryl sulfate or sodium oleyl sulfate, alkyl sulfates such as sodium lauryl sulfate or ammonium lauryl sulfate, and twelve groups. Sodium benzene sulfonate or a aryl group of decyl sulfonate. As the cationic surfactant, an amine salt such as stearylamine hydrochloride or lauryl dimethyl chloride or a quaternary salt can be exemplified. ❹ These surfactants may be used singly or in combination of two or more. The concentration of the surfactant in the test imaging liquid is preferably in the range of from 1 to 1% by mass, more preferably from 0.05 to 8% by mass, still more preferably from 0.1 to δ% by mass. After the development, the water is washed, and it is also possible to carry out the post-baking of 10 to 60 minutes in accordance with the demand. Using the photosensitive resin composition of the present invention, after the above steps, A pattern is formed on the substrate or on the glass filter substrate. This pattern is used as a photo-spacer for liquid crystal and organic EL display devices, and is formed by using a pattern of the dried coating film. The hole can be used as an interlayer insulating film by using a photomask, and the exposure film can be formed by exposing the dried coating film to full exposure and heat hardening without using a photomask, or by heating and hardening to form a transparent film. The transparent film can be used as an overcoat, and can also be used for the 52 320856 200937122 'touch panel. The photosensitive resin composition of the present invention can provide a hardened resin excellent in heat-resistant light transmittance. When the photosensitive resin composition of the present invention is used, a cured resin pattern of a desired shape can be easily formed, and it can be used for a light-sensitive gap material, an insulating film, and a liquid crystal alignment control. The use of a projection, a protective layer, a coating layer with a film thickness of a color pattern, an optical waveguide material, an optical switch material, etc., is used for forming a film of a display device. According to the present invention, excellent heat-resistant light transmittance can be formed. 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Nitrogen gas was introduced into a 1 L flask equipped with a reflux condenser, a dropping funnel and a stirrer to form a nitrogen atmosphere, and then 3 parts by weight of propylene glycol monomethyl ether acetate was added, and the mixture was heated to 9 Torr while stirring. Next, 30 parts of methacrylic acid and 135 parts of 3-mercaptopropenyloxypropane, tris(tridecyloxy)-stone ([3]], 18 parts of 2-(mercaptopropenyloxy) Ethyl acetamidine acetate [formula (v - 丨);! Dissolved in 16 parts of propylene glycol monomethyl bond acetic acid i to prepare a solution" using a dropping funnel to drip the solution into 9 (TC insulation Inside the flask. On the other hand, 15 parts of polymerization initiator 2 A solution of '2-azobis(2,4-dimethylvaleronitrile) dissolved in 18 parts of propylene glycol monoether ether acetate was dropped into the flask over 4 hours using another dropping funnel. After the solution of the initiator is held at 9 cc for 4 hours, after cooling to room temperature, the solid fraction can be obtained. 〇%, 320856 53 200937122 Acid value 65 mg-KOH/g (converted into 5x103。 The weight average molecular weight Mw of the obtained resin Aa was 9. 9x103.

HgC^O CHaD C-c-ο—CH3 H3C—S—*CH3 Η 〇^ C—C~C—Si—〇—Si—CHa η2 η2 II ο ch3 H3C—Si-r〇H3 CH3 (1-3 )

Synthesis Example 2 Nitrogen gas was introduced into a 1 L flask equipped with a reflux condenser, a dropping funnel and a stirrer at 0.02 L/min to form a nitrogen atmosphere, and then 200 parts of 3-decyloxy-1-butanol and 1 Torr were added. 5 parts of 3-methoxybutyl acetate were heated to 70X: while stirring. Next, 60 parts of methacrylic acid and 240 parts of 3,4-cyclodecyltricyclo[5.2.1.02.6]decyl acrylate (a compound represented by the formula (Π-1) and a compound represented by the formula (Π-1)) were obtained. The solution was dissolved in 140 parts of 3-methoxybutyl acetate in 50:50 molar ratio, and the solution was dropped into a flask maintained at 7 ° C using a dropping funnel. On the other hand, 30 parts of a polymerization initiator 2, 2,-azobis(2,4-dimercapto valeronitrile) was dissolved in 225 parts of a solution of butyl 3-methoxyacetate. The funnel was dropped into the flask over 4 hours. After the solution of the polymerization initiator was added, it was kept at 70 C for 4 hours, and then it was allowed to cool to room temperature, and then a solid fraction of 32.6%, an acid value of 〇 〇 mg-K 〇 H / A solution of a copolymer (resin Ab) of g (converted into a solid portion). The weight average molecular weight Mw of the obtained resin Ab was 1.354 320856 200937122, xlO4. ^aC^CH-C-

Synthesis Example 3 except that 3-methylpropenyloxypropyltris(trimethoxy)decane [formula (1_3)], 2~(methacryloyloxy)ethylacetamidine acetate [formula (formula) The Vjy was changed to 180 parts and 140 parts, respectively, and the same procedure as in the Example was followed, and the resin Ac was obtained. The weight average molecular weight of the obtained resin Ac was ❹ 1. 1×10, and Synthesis Example 4 except that 3-methyl propylene hydride was used. Oxypropyl tris(trimethoxy) oxime [formula (1-3)], 2~(methacryloyloxy)ethylacetamidine acetate [formula (ν^, changed to 220 parts, respectively) In the same manner as in the examples, the resin Ad was obtained in the same manner as in the examples. The weight average molecular weight iMw of the obtained resin Ad was 1.1×10, * ❹ Synthesis Example 5 氮气. 02 L/min of nitrogen gas was supplied to a reflux condenser. In a 1 L flask of a dropping funnel and a stirrer, a nitrogen atmosphere was formed, and then 2 () () propylene glycol monomethyl ether acetate was added, and the mixture was heated to 9 ° C while stirring. Then, 38 parts of methyl group was added. Acrylic acid, 150 parts of 3-methylpropenyloxy group = (dimethoxy) Mengzhu [Formula (I - 3)] and 210 parts of 2-(methylpropionate) Acetyl acetate [formula (V-1)] was dissolved in 155 parts of propylene glycol monomethyl ether acetate to prepare a solution, which was dropped into a 90 C flask by a dropping funnel. On the other hand, 17 parts were used. Polymerization initiator 2 9,; 55 * 32〇856 200937122 Azobis(2,4-dimethylvaleronitrile) was dissolved in 180 parts of propylene glycol methyl ether acetate, a solution of the ester, using another dropping funnel 4%的酸。 After the dropwise addition of the solution of the polymerization initiator was carried out, after the dropwise addition of the solution of the polymerization initiator, it was kept at 90 ° C for 4 hours, after which it was allowed to cool to room temperature. A solution of a copolymer (resin Ae) having a valence of 61 mg-KOH/g (calculated as a solid). The weight average molecular weight Mw of the obtained resin Ae is 1. 4×10 4 . Synthesis Example 6 A gas flow is made at 0·02 L/min. In a 1 L flask equipped with a reflux condenser, a dropping funnel and a stirrer, a nitrogen atmosphere was formed, and then 2 parts of propylene glycol monomethyl ether acetate was added, and the mixture was heated to 9 Torr while stirring. Mercaptoacrylic acid, 170 parts of 3-mercaptopropenyloxypropyl tris(tridecyloxy)decane [formula (1-3)] and 240 parts 2-(Methylpropenyloxyethylacetate acetate [form dissolved in 15 parts of propylene glycol monomethyl hydrazine acetate to prepare a solution]. The solution was dropped into the mixture at 9 ° C using a dropping funnel. In a flask that was kept warm. On the other hand, 17 parts of a polymerization initiator 2,2,-azobis(2,4-dimethylvaleronitrile) was dissolved in 18 parts of a solution of propylene glycol monomethylacetate, using The other dropping funnel was dropped into the flask for 14 hours. After the solution of the polymerization initiator was dropped, it was kept for 9 hours in the 9th generation, and then it was allowed to cool to room temperature, and then the solid fraction was obtained. A solution of a copolymer (resin Af) having 〇% and an acid value of 6〇mgWg (calculated as a solid portion). The weight average molecular weight Mw of the obtained resin Af was 丨.5 χΐ〇 4 ^ The weight of the above-mentioned adhesive polymerization was equal to VIII. The measurement of the molecular weight (Mw) and the number average molecular weight was carried out under the conditions of the GPC method. Device: K2479 (made by Shimadzu Corporation) 320856 56 200937122

Separation column: SHIMADZU Shim-pack GPC-80M &quot; Solvent: THF (tetrahydrofuran) Flow rate·· 1. OmL/min Detector: RI Example 1 - 143 parts of a resin solution containing the resin Aa obtained in Synthesis Example 1 ( a) (converted to 50 parts by solid content), 20 parts of KR-213 (Shin-Etsu Chemical Co., Ltd.) (B), 30 parts of KC-89SC Shin-Etsu Chemical Co., Ltd. (B), 5 parts 4_甲基 methyl benzyl [4-(1-methylethyl) benzyl] quinone (pentafluorophenyl) side acid salt (PI-2074; manufactured by Rhodia Co., Ltd.) (C), 1.5 parts 2, 4 -Diethylthioxanthone (F), 4 parts of D-20 (manufactured by Shin-Etsu Chemical Co., Ltd.) (d) and 13 parts of propylene glycol monomethyl ether acetate are mixed, and a photosensitive resin composition is obtained. Thereafter, its evaluation was carried out in the following manner. The results are shown in Table 6. &lt;Forming Pattern&gt; A 2-inch square glass substrate (Eagle 2000; manufactured by Corning Co., Ltd.) Q was sequentially washed with a neutral detergent, water, and alcohol, and then dried. After the photosensitive resin composition 1 was applied onto the glass substrate by a spin coating method, it was prebaked in a clean oven at 100 ° C for 3 minutes. After cooling, it was irradiated with light at an exposure amount of 100 mJ/cm 2 by an exposure machine (TME-150RSK; manufactured by T0PC0N). And in the case of a photomask, a photomask which allows the next pattern to be formed on the same plane is utilized. Meanwhile, at the time of light irradiation, the interval between the substrate on which the photosensitive resin composition was applied and the mask made of quartz glass was set to about 10 0 // m. 320856 57 200937122 • Make one side a light-transmissive part (pattern) of LINE (rectangular) shape with 7am, and the interval of the LINE (rectangular) shape is m. • Make one side a light-transmissive portion (pattern) having a LINE (rectangular) shape of 30/zm. The interval of the LINE (rectangular) shape is 3 〇//m. After the light irradiation, the film containing the photosensitive resin composition was impregnated at 80 ° C for 80 seconds after containing the nonionic surfactant 〇 12% and the hydrazine hydrazine 〇 4% aqueous imaging solution. After washing with water, it was 22 于 in the oven. (: After baking for 30 minutes. After 泠, the film thickness of the obtained film was measured by the film thickness measuring device (I) EktAK3; Japan Vacuum Technology Co., Ltd.). 3. Solubility> The sensitization in Example 1 was obtained. After the resin composition, the solution was visually observed. The photosensitive resin composition 1 is a transparent and uniform solution. The following is the case where it is transparent and uniform, and when the solution is uneven or cloudy, it is X. &lt;Coating film state&gt; A cured resin film was formed on a transparent glass substrate (#1737; manufactured by Corning Co., Ltd.) in the same manner as above except that the light was not applied, and the state of the coating film was visually observed. The photosensitive resin composition 1 is a transparent and uniform coating film. Hereinafter, when the coating film is transparent, it is 〇, and when it is white turbid, it is x. &lt;Line width, sectional shape&gt; The scanning line electron microscope (S-4000; manufactured by Hitachi, Ltd.) was used to observe and measure the line width and shape (cross section). The measurement can correspond to 7 μm on the mask and The line width of the pattern of the respective patterns of 30 // m is 8.0 #m in the 7//m portion and 30.3 //m in the 30//m portion. The cross-sectional shape is at an angle relative to the pattern of the substrate. Less than 90 degrees, 58 320856 200937122 ' is a cis cone. Moreover, when it is judged that the angle with respect to the substrate pattern is 9 〇 or more, it is an inverse cone. When it is a forward cone, when the liquid crystal display device is formed, It is not easy to cause breakage of the ΙΤ0 wiring. It is indicated by 〇 when it is a forward cone. <Heat-resistant light transmittance> In the case of light irradiation, the same operation is carried out except that the mask is not used - and then a coating film is produced. The prepared coating film was placed in a clean oven in the condition of the table, and the light transmittance before and after heating was measured. The light in the wavelength of 400 nm was measured by a microscopic spectrometer (OSP-SP200; manufactured by OLYMPUS). Wear penetration rate (%). According to formula (1), obtain the heat-resistant light transmittance 'and take this as The index of heat is 100% at 240 ° C, 97% at TC, 95% at 280 ° C, and 96% at 300 ° C. Heat-resistant light transmittance (% )= ................................... xinnm [light transmittance (%) before heating] The above-mentioned heat-resistant light transmittance is preferably 90% or more. Example 2 ◎ 143 parts of the resin solution (a) containing the resin Aa obtained in Synthesis Example 1 (in terms of a solid content of 50 parts), 50 parts of KR -213 (Shin-Etsu Chemical Co., Ltd.) (B), 10 parts of 2, 2' 4-tris(2-chlorophenyl)-5-(3,4-dimethoxyphenyl)-4,5 -Diphenyl-1,1'-biimidazole (CHEMCURE TCDM; manufactured by CHEMBRIDGE INTERNATIONAL C0RP.) (C), 4 parts D-20 (manufactured by Shin-Etsu Chemical Co., Ltd.) (D) and 228 parts of propylene glycol monomethyl After the ether acetate was mixed, the photosensitive resin composition 1 was obtained, and the evaluation was carried out by the following method. The results are shown in Table 7. 59 320856 200937122 <Formation pattern> In addition to the mask, it is utilized A pattern was formed in the same manner as in Example 1 except that a pattern was formed on the same plane. The edge is a light-transmissive portion having a LINE (rectangular) shape of 10//m (the pattern 'the interval of the LINE (rectangular) shape is 10/ί/πι. • One side is a LINE (rectangular) having a .15/zm The transparent portion (pattern) of the shape has a spacing of 15 // m. &lt;Solubility&gt; The same evaluation as in Example 1 was carried out. <Coating film state> The same evaluation as in Example 1 was carried out. &lt;Line width, cross-sectional shape&gt; The same evaluation as in Example 1 was carried out. &lt;Heat-resistant light transmittance&gt; The same evaluation as in Example 1 was carried out. 60 320856 200937122, [Table 1] Example 2 Example 3 Comparative Example 2 Photosensitive resin composition 1 2 3 Acrylic resin resin Aa (solid content only) ~~~~~ 50 50 A resin Ab (only Solids) — — 50 —Oxane compounds (B) KR-213 50 50 I. Photobase generator (C) 2,2'4-tris(2-phenylphenyl)-5-(3,4'- Dimethoxyphenyl]-4,5-diphenyl-U'-biimidazole 10 — compound represented by formula (IV) — a 5 photopolymerization initiator 2, 2-bis (2- benzene) -4,4,5,5'-tetraphenyl-1,2'-biimidazole (B-CIM; Baotu Valley Chemical Co., Ltd.) 4 Thermal Hardener (D) Organic Titanium Compound (D) -20; Shin-Etsu Chemical Co., Ltd.), 4 4 - Photosensitizer (F) 2, 4-Diethylthioxanthone (KAYACURE DETX-s; Nippon Chemical Co., Ltd.) — — 0.5 light Polymerization start-up aid (G) Pentaerythritol thiopropionate — _ 3 polyfunctional acrylic acid monomer dipentaerythritol hexaacetic acid vinegar — - 50 Solvent (E) Propylene glycol monomethyl ether acetate 228 228 — C Acid 3-ethoxyethyl ester - 88 3-methoxybutanol ~ _ 65 3-methoxybutyl acetate - 65 Example 3 光 The photobase generator (1,2-octanedione) represented by the formula (IV), 1-[4-(phenylthio)phenyl group, as shown in Table 1, can be formed; μ, 2-(0-benzoinyl) (IRGACURE ΟΧΕ-01; manufactured by Nippon Ciba Co., Ltd.), in addition to the exposure amount of 500 mJ/cm 2 (based on 365 nm) in <Forming Pattern> In the same manner as in the photosensitive resin composition 1, the photosensitive resin composition 2 was obtained, and the same evaluation as in Example 2 was carried out. The results are shown in Table 7. 320856 61 200937122

Comparative Example 1 153 parts of a resin solution (a) containing the resin Ab obtained in Synthesis Example 2 (in terms of a solid content of 50 parts), 50 parts of dipentaerythritol hexaacrylate (KAYARADDPHA; manufactured by Nippon Kayaku Co., Ltd.), 4 2,2,-Biimidazole (B-CIM; Baogu Soil Chemical Co., Ltd.), 5 parts of 2,4-diethylthioxanthone (DETX), 3 parts of pentaerythritol thiol propionate (pEMp) ;堺Chemical Industry (stock, system), 88 parts of 3-ethoxyethyl propionate (1)), 5 parts of 3-methoxybutanol (D), 65 parts of 3-methoxybutyl vinegar (9) After mixing, the photosensitive resin plant 2 can be obtained. Carry out and the examples! The same assessment. The results are shown in Table 6. Comparative Example 2 As the composition shown in Table 1 was formed, the same evaluation was carried out after the same operation of 盥 έ i. The results were as shown in Table 7 in the same manner as in Example 1 except that the examples 4 to 30 were mixed with the following compositions.蛀娄1 * 曰, and into objects. get on ,,,. The results are shown in Tables 8 to 1〇. 320856 62 200937122 [Table 2] Example 1 4 5 6 7 8 9 10 11 12 Acrylic resin containing ruthenium (A) 50 50 50 — — 50 50 50 — _ Ac 50 Ad 50 Ae 50 — Af 50 Oxygen Alkyl compound (Β) KR-213 20 50 _ A _ 20 20 20 20 20 KC-89S 30 — 50 — — 21 18 15 30 30 KR-510 One — — 50 50 9 12 15 — — Photopolymerization initiator (C) PI-2074 5 5 5 5 5 5 5 5 5 5 Thermal hardening accelerator (D) D-20 4 4 4 4 4 4 4 4 4 4 Light sensitizer (F) ※ 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 Solvent (Ε) ※ 130 228 228 228 228 228 228 228 228 228 ❹ ※ Resin is only the amount of solids. . Photosensitizer 邙): 2,4-diethyl thioxanthone (〇丫人〇11^0£丁叉-3; 曰本化药(股)) ※Solvent (Ε): propylene glycol monomethyl Ethyl ether acetate 63 320856 200937122 [Table 3] Example 13 14 15 16 17 Acrylic resin containing Aussie (A) ※ Aa 80 60 50 40 50 Oxane compound (B) KR-213 20 40 50 60 50 Photopolymerization initiator (C) PI-2074 5 5 5 5 — SP-172 — — _ &quot;—— 5 Thermal hardening accelerator (D) D-20 One — — — 4 Light sensitizer (F) 1.5 1.5 1. 5 1.5 — Solvent (E) ※ 228 228 228 228 228 * Resin is only the amount of solids. ※Photopolymerization initiator (C) : SP-172 : Triarylsulfonium hexafluoroantimonate ※Photosensitizer (F): 2,4-diethylthioxanthone (KAYACUREDETX-s; 曰本化Pharmaceutical (manufactured by the company) * Solvent (E): propylene glycol monodecyl ether acetate [Table 4] Examples 18 to 30 Azure-based acrylic resin (A) ※ Aa 80 Alkoxylate compound (B) KR-213 20 photopolymerization initiator (C) Table 5 reference 5 heat hardening accelerator (D) D-20 a light sensitizer (F) 2,4-diethyl thioxanthone (KAYACURE DEH-s; Nippon Chemical Co., Ltd.) 1.5 Solvent (E) Propylene glycol monomethyl ether acetate 228 64 320856 200937122 [Table 5] * Photopolymerization initiator (C) Example 18 D-20; Shin-Etsu Chemical Co., Ltd. Example 19 D-25; Shin-Etsu Chemical Industry Co., Ltd. Example 20 Τ0Τ; Japan Soda Co., Ltd. Example 21 B-1; Sakamoto Soda Co., Ltd. Example 22 B-2; Japan Soda ( Example 23 B-4; Japan Soda Co., Ltd. Example 24 B-7; Sakamoto Soda Co., Ltd. Example 25 B-10; Japan Soda Co., Ltd. Example 26 D-30; Shin-Etsu Chemical Industry Co., Ltd. Example 27 ZR-151; Sakamoto Soda Co., Ltd. Example 28 ZR-181; Sakamoto Soda Co., Ltd. Example 29 TBZR; Sakamoto Soda Co., Ltd. Example 30 ZAA; Sakamoto Soda Co., Ltd. 65 320856 200937122 [Table 6] Item----- Remarks Example 1 Comparative Example 1 Solubility Visual Status 〇〇 Coating Status _____ Visual Status 〇〇 Section Shape 〇〇. Pattern Image (LINE 7 仁 m part) 8.0 —~ . Resolution (LINE 30; am part) 30.3 45.2 ._ 240〇C 2H(%) 100 82 Pair of thermal light transmittance _ 260〇C 2H(%) 99 47 _____ 280〇C 2H(%) 96 3 300 ° C 2H (%) 99 0 -: No pattern was formed. [Table 7] Example 2 Example 3 Comparative Example 2 1 ———. Photosensitive composition 1 2 3 Solubility Visual state 〇〇〇 Coating state 1 Visual state 〇〇〇 Cross-sectional shape 〇〇〇 Pattern resolution ( LINE 10//m part) .丨〇〇X resolution (LINE 15 μ m part) 〇〇〇Heat-resistant light transmittance----1 240〇C 2H(%) 100 100 83 250〇C 2H(%) 100 100 69 66 320856 200937122 , [Table 8] Item Example 4 5 6 7 8 9 10 11 12 Solubility Visual condition 〇〇〇〇〇〇〇〇〇 Film state Status 〇〇〇〇〇〇〇〇〇 Pattern cross-sectional shape 〇〇〇〇〇〇〇〇〇 resolution (LINE 10/zm part) 〇〇〇〇〇〇〇〇〇 Heat-resistant light transmittance 240〇C 2H(%) 100.1 99.4 98.9 260〇C 2H (% 97.7 97.0 98.8 98.7 280〇C 2H(%) 96.3 97.3 97.1 93.6 96.9 97.3 97.7 97.2 97.4 30(TC 2H(%) 97.0 95.4 92.6 [Table 9] Item Example 13 14 15 16 17 Solubility Visual Status〇〇〇 〇〇coating state, visual state〇 〇〇〇 pattern cross-sectional shape 〇〇〇〇〇 resolution (LINE 10/zm part) 〇〇〇〇〇 heat-resistant light transmittance 240〇C 2H(%) 100 100 100 100 260〇C 2H(°/〇) 100 99 98 99 27(TC 2H (8) 102 98 96 97 101 Ο 67 320856 200937122 [Table 10] Item Example 18 19 20 21 22 23 24 25 26 27 28 29 30 Solubility Visual State 0 〇〇〇〇〇〇〇〇 〇〇〇〇coat film state visual state 〇〇〇〇〇〇〇〇〇〇〇〇〇pattern cross-sectional shape 〇〇〇〇〇〇〇〇〇〇〇〇Ο resolution (LINE lO^m part) 〇〇〇 〇〇〇〇〇〇〇〇〇〇Heat-resistant light transmittance 2.80〇C 2H(%) 96.0 84.3 87.4 84.6 86.6 85.6 83.9 84.5 95.7 98.0 98.8 95.1 95.4 The results of the examples shown in Tables 6 to 10 show that The coating film formed of the photosensitive resin composition of the invention is excellent in heat-resistant light transmittance. In the comparative example, the heat-resistant light transmittance is very poor. [Possibility of application in the industry] By applying the photosensitive resin composition of the present invention, a pattern excellent in heat-resistant light transmittance can be formed. [Simple description of the diagram] None [Key component symbol description] None 68 320856

Claims (1)

200937122 % VII. Patent application scope: w 1 · A photosensitive resin composition containing a dreamy acrylic resin (A), a siloxane compound (B) (except (A)), and a photosensitive material (C) ). 2. The photosensitive resin composition according to the first aspect of the invention, wherein the 'ytterbium-containing acrylic resin (A) is a non-hydrolyzable polymerizable unsaturated compound (A1) containing at least a ruthenium atom and A hydrazine-containing acrylic resin of a copolymer formed by polymerization of an unsaturated carboxylic acid and/or an unsaturated carboxylic anhydride (A2). The photosensitive resin composition of the second aspect of the invention, wherein the non-hydrolyzable polymerizable unsaturated compound (A1) having a ruthenium atom is a compound represented by the formula (I), R5 [In the formula (I), R1 represents a hydrogen atom or a methyl group, and R2 represents -0-(CH2)w---C(=0)-0-(CH2)r~ or -(CH2)»-, which is contained in The carbon atom in R2 may also be a hetero atom substituted by 4 to represent an integer of 〇 to 8, and R3 to R5 each independently represent an aliphatic hydrocarbon group having 1 to 12 carbon atoms, an aryl group having 6 to 12 carbon atoms or a carbon number of 7 to 12 An aralkyl group, a hydrogen atom contained in the aliphatic hydrocarbon group, an aryl group and an aralkyl group, may also be substituted by a halogen 69 320856 200937122 atom, # y represents an integer of 1 to 5, and X and z are independently represented by 〇 to 5 Integer]. 4. The photosensitive resin composition according to claim 2 or 3, wherein the fluorene-containing acrylic resin (A) further contains a monomer copolymerizable with (A1) and (A2) (A3) (except for (A1) &amp; W2)) A fluorene-containing acrylic resin of a copolymer formed by polymerization. 5. The photosensitive resin composition according to any one of claims 1 to 4, wherein the oxirane compound (B) (except (A)) is contained in the formula (Π) A compound of a structural unit of a monomer, R8nSi(0R9)4-„(π) [In the formula (Π), 'R8 and R9 each independently represent an aliphatic hydrocarbon group having a carbon number of i to 12 and an aryl group having a carbon number of 6 to 12. Or an aralkyl group having 7 to 12 carbon atoms, and the hydrogen atom in the aliphatic hydrocarbon group, the aryl group and the aryl group may also be a hydrogen atom, a fluorine atom, a gas atom, a cyano group, a hydroxyl group or an alkane having a carbon number of 4 to 4. An oxy group, an amine group, a thiol group, an imido group, an epoxy group or a (fluorenyl) acrylonitrile group; η represents an integer of 0 to 3; when n is an integer of 2 or less, 〇R9 may be the same respectively a type or a different type of base; when 11 is an integer of 2 or more, R8 may be the same type or a different type of base, respectively. 6. The photosensitive resin composition according to any one of claims 5 to 5 'There is a thermosetting accelerator (D). The photosensitive resin composition of any one of the above-mentioned items of the above-mentioned (E) 8. The matte resin composition according to any one of claims 1 to 7 of the patent application 70 320856 200937122, which contains a photosensitizer (F). The photosensitive resin composition of any one of Claims 1 to 8 is used. 10. A display element containing the pattern of claim 9 of the patent application. ❹ ❹ 71 320856 200937122 ·, IV. Designated representative figure: There is no drawing in this case (1) The representative drawing of this case is: () Figure (2) The symbol of the symbol of this representative figure is simple: 5. If there is a chemical formula in this case, please reveal the best display of the characteristics of the invention. Chemical formula: 2 320856