201206635 六、發明說明： 【發明所屬之技術領域】 本發明係關於玻璃基板之研磨方法及研磨裝置。 【先前技術】 液晶顯示器等FPD(Flat Panel Dispiay，平板顯示器）用玻 璃基板係藉由如下方法而製造為特定外形尺寸之玻璃基 板：將藉由例如浮式！爐等玻璃帶成形裝置而呈帶狀地成 形之成形玻璃帶於切斷步驟中切斷加工為特定矩形狀尺寸 之玻璃隸，並於倒角步驟中對該玻璃基板之端面進行倒 角加工繼而，该玻璃基板經過設置於倒角步驟後段之清 洗步驟及檢查步冑後移送至研磨步驟而絲面之微小凹凸 或起伏研磨除去，藉此製造為滿足FpD用玻璃基板所要求 之平坦度之薄板狀。 上述研磨步驟中，將玻璃基板之非研磨面吸附固定於載 台’並將載台搬送至研磨部，一面對玻璃基板之研磨面供 給研磨液（漿液），-面藉由研磨工具對玻璃基板之研磨面 進行研磨。 於進仃》亥研磨時會產生如下不良情況，即研磨液自玻場 土板之..彖。卩/叉入至玻璃基板之非研磨面之緣部，作為研磨 液之成刀之氧化鈽或藉由研磨而磨掉之玻璃成分固定於玻 璃基板之非研磨面之緣部而污染緣部。 為防止β亥不良情況，專利文獻丨之晶圓之研磨方法中， 於曰曰圓之非研磨面形成包含合成樹脂製之保護材料之保護 膜。隔著該保護膜將晶圓之非研磨面固定於研磨夹具，藉 156581.doc 201206635 此保護晶圓之非研磨面之緣部免受研磨液之侵害β 又，專利文獻2所揭示之晶圓之研磨方法中，於晶圓之 非研磨面與晶圓載置用平板之間介插有多元醇等緩衝材 料，藉此保護晶圓之非研磨面之緣部免受研磨液之侵害。 [先前技術文獻] [專利文獻] [專利文獻1 ]曰本專利特開昭62-5 1226號公報 [專利文獻2]曰本專利特開平6-61203號公報 【發明内容】 [發明所欲解決之問題] 且說’稱作連續式研磨裝置之玻璃基板之研磨裝置，一 面以特定環路搬送吸附固定玻璃基板之非研磨面之載台， 一面對玻璃基板之研磨面進行研磨。即，於構成環路之載 台之搬送路中依序設置有玻璃基板之吸附固定部、研磨 部、玻璃基板之取出部及載台清洗部。研磨前之玻璃基板 於將非研磨面吸附固定於位於上述吸附固定部之載台之 後，藉由載台而搬送至上述研磨部並進行研磨。繼而，研 磨後之玻璃基板藉由載台而搬送至上述取出部，並於此自 載台取出。取出玻璃基板後之載台於通過上述清洗部之過 程中被清洗後’準備為下一玻璃基板之吸附用載台。 於此’專利文獻1所揭示之研磨方法係於晶圓之非研磨 面預先形成保護膜之後進行研磨之方法。又，專利文獻2 所揭示之研磨方法係於晶圓之非研磨面與晶圓載置用平板 之間設置保護膜之方法。 156581.doc 201206635 然而，玻璃基板之尺寸中之縱橫尺寸超過1〇〇〇爪⑺者為 主流，自處理之難度方面而言，難以於該大型玻璃基板預 先形成上述保護膜。又，另外必需有用以形成保護膜之設 備，因此存在難以將專利文獻1之研磨方法用作玻璃基板 之研磨方法之問題。 另一方面，採用於藉由載台而直接吸附玻璃基板之玻璃 基板之研磨裝置中在晶15之非研磨面與晶圓載置用平板之 間設置保護膜之專利文獻2的研磨方法，則於研磨時玻璃 基板變得不穩定，因而無法採用該研磨方法。 上述玻璃基板之研磨裝置之載台之吸附面由具有自吸附 性之片材構成。若片材之表面乾燥’則片材之自吸附性減 弱，從而存在研磨玻璃基板時玻璃基板斷裂之虞。因此， 為防止吸附固定於該片材之玻璃基板之非研磨面之乾燥， 或者提高片材之自吸附性，而必需經由乾燥防止用液將玻 璃基板吸附固定於片材上。該情形時，亦必需將乾燥防止 用液良好地供給至玻璃基板與片材之間。 本發明係鑒於該情況而完成者，其目的在於提供一種可 防止研磨液污染玻璃基板之非研磨面之緣部，且可將玻璃 基板之非研磨面良好地吸附固定於載台之玻璃基板之研磨 方法及研磨裝置。 [解決問題之技術手段] 本發明之玻璃基板之研磨方法為達成上述目的而包括： 液體喷霧步驟，朝向吸附固定玻璃基板之非研磨面之載 台，對上述載台之吸附固定有玻璃基板之整個非研磨面之 156581.doc 201206635 區域從第1喷嘴以霧狀喷出乾燥防止用液，然後對上述載 σ ’向上述載台之吸附固定有玻璃基板之非研磨面之緣部 之區域從第2噴嘴以霧狀喷出緩衝液；玻璃基板固定步 驟將玻璃基板之整個非研磨面經由上述乾燥防止用液吸 附固定於上述載台，並且將上述玻璃基板之非研磨面之緣 部經由上述緩衝液吸附固定於上述載台；以及研磨步驟， 一面對非研磨面吸附固定於上述載台之上述玻璃基板之研 磨面供給研磨液，一面藉由研磨工具對該研磨面進行研 磨。 本發明之玻璃基板之研磨裝置為達成上述目的而包括： 載台，其吸附固定玻璃基板之非研磨面；液體喷霧部，其 包含朝向上述載台對上述載台之吸附固定有玻璃基板之整 個非研磨面之區域以霧狀喷出乾燥防止用液之第丨喷嘴、 及對上述載台向上述載台之吸附固定有玻璃基板之非研磨 面之緣部之區域以霧狀噴出緩衝液之第2喷嘴；玻璃基板 固定部，其將玻璃基板之整個非研磨面經由上述乾燥防止 用液吸附固定於上述載台，並且將上述玻璃基板之非研磨 面之緣部經由上述緩衝液吸附固定於上述載台；以及研磨 部，其一面對非研磨面吸附固定於上述載台之上述玻璃基 板之研磨面供給研磨液’一面藉由研磨工具而對該研磨2 進4于研磨。 根據本發明，首先，自第丨喷嘴朝向載台以霧狀喷出乾 燥防止用液而對吸附固定有玻璃基板之整個非研磨面之區 域塗佈乾燥防止發’然後自第2噴嘴朝向載台以霧狀噴 15658l.doc201206635 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a polishing method and a polishing apparatus for a glass substrate. [Prior Art] A glass substrate for an FPD (Flat Panel Dispiay) such as a liquid crystal display is manufactured into a glass substrate of a specific outer shape by the following method: by, for example, floating! a formed glass ribbon which is formed into a strip shape by a glass ribbon forming apparatus such as a furnace is cut into a glass having a specific rectangular size in a cutting step, and chamfered the end surface of the glass substrate in a chamfering step, and then The glass substrate is subjected to a cleaning step and a step of inspecting the step after the chamfering step, and then transferred to the polishing step to remove minute irregularities or undulating polishing of the surface of the wire, thereby manufacturing a thin plate satisfying the flatness required for the glass substrate for FpD. shape. In the polishing step, the non-polishing surface of the glass substrate is adsorbed and fixed to the stage ' and the stage is transferred to the polishing unit, and the polishing liquid (slurry) is supplied to the polishing surface of the glass substrate, and the surface is coated with the polishing tool. The polished surface of the substrate is polished. In the case of Yujin, the following problems occur, that is, the grinding liquid is from the glass field. The crucible is forked to the edge of the non-polishing surface of the glass substrate, and the ruthenium oxide which is a knives of the polishing liquid or the glass component which is ground by polishing is fixed to the edge portion of the non-polishing surface of the glass substrate to contaminate the edge portion. In the method for polishing a wafer of the patent document, a protective film containing a protective material made of a synthetic resin is formed on the non-polishing surface of the round. The non-polishing surface of the wafer is fixed to the polishing jig via the protective film, and the edge of the non-polishing surface of the wafer is protected from the polishing liquid by 156581.doc 201206635. Further, the wafer disclosed in Patent Document 2 In the polishing method, a buffer material such as a polyol is interposed between the non-polishing surface of the wafer and the wafer mounting flat plate, thereby protecting the edge portion of the non-polishing surface of the wafer from the polishing liquid. [PRIOR ART DOCUMENT] [Patent Document 1] [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. 6-61203. The problem is that a polishing apparatus for a glass substrate called a continuous polishing apparatus transports a polishing surface of a glass substrate to a polishing surface of a glass substrate by a specific loop. In other words, the adsorption fixing portion of the glass substrate, the polishing portion, the glass substrate take-out portion, and the stage cleaning portion are sequentially provided in the transfer path of the stage constituting the loop. The glass substrate before polishing is adsorbed and fixed to the stage on the adsorption fixing portion by the non-polishing surface, and then conveyed to the polishing portion by the stage and polished. Then, the ground glass substrate is transferred to the take-out portion by the stage, and taken out from the stage. The stage after the glass substrate was taken out was cleaned by the cleaning unit, and was prepared as an adsorption stage for the next glass substrate. The polishing method disclosed in Patent Document 1 is a method in which a non-polishing surface of a wafer is previously formed with a protective film and then polished. Further, the polishing method disclosed in Patent Document 2 is a method of providing a protective film between a non-polishing surface of a wafer and a flat plate for wafer placement. 156581.doc 201206635 However, the vertical and horizontal dimensions of the glass substrate are more than one jaw (7), and it is difficult to form the protective film in advance on the large glass substrate in terms of difficulty in handling. Further, since it is necessary to use a device for forming a protective film, there is a problem that it is difficult to use the polishing method of Patent Document 1 as a polishing method for a glass substrate. On the other hand, in the polishing apparatus using the glass substrate in which the glass substrate is directly adsorbed by the stage, the polishing method of Patent Document 2 in which a protective film is provided between the non-polishing surface of the crystal 15 and the wafer mounting flat plate is used. The glass substrate becomes unstable during polishing, and thus the polishing method cannot be employed. The adsorption surface of the stage of the polishing apparatus for the glass substrate is composed of a sheet having self-adsorptivity. If the surface of the sheet is dried, the self-adsorptivity of the sheet is weakened, so that the glass substrate is broken when the glass substrate is polished. Therefore, in order to prevent drying of the non-polishing surface of the glass substrate fixed to the sheet or to improve the self-adsorptivity of the sheet, it is necessary to adsorb and fix the glass substrate to the sheet via the drying prevention liquid. In this case, it is also necessary to supply the drying prevention liquid favorably between the glass substrate and the sheet. The present invention has been made in view of the above circumstances, and an object thereof is to provide a glass substrate which can prevent the polishing liquid from contaminating the edge portion of the non-polishing surface of the glass substrate and can adsorb and fix the non-polishing surface of the glass substrate to the stage. Grinding method and grinding device. [Means for Solving the Problem] In order to achieve the above object, the polishing method for a glass substrate of the present invention includes: a liquid spraying step of adsorbing and fixing a glass substrate to a stage on which a non-polishing surface of a glass substrate is adsorbed and fixed; 156581.doc 201206635 The entire non-polishing surface is sprayed with the drying prevention liquid in a mist form from the first nozzle, and then the region of the non-polishing surface of the glass substrate is fixedly attached to the above-mentioned carrier σ' The buffer solution is sprayed from the second nozzle in a mist form; the glass substrate fixing step is performed by adsorbing and fixing the entire non-polishing surface of the glass substrate to the stage via the drying prevention liquid, and passing the edge of the non-polishing surface of the glass substrate via The buffer solution is adsorbed and fixed to the stage; and the polishing step is performed by applying a polishing liquid to the polishing surface of the glass substrate fixed to the stage on the non-polishing surface, and polishing the polishing surface by a polishing tool. In order to achieve the above object, a polishing apparatus for a glass substrate according to the present invention includes: a stage that adsorbs and fixes a non-polishing surface of a glass substrate; and a liquid spray unit that includes a glass substrate that is adhered to the stage toward the stage. In the entire non-polishing surface region, the second nozzle for ejecting the drying prevention liquid in a mist form, and the region where the edge of the non-polishing surface of the glass substrate is adsorbed and fixed to the stage to the stage is sprayed with a buffer in a mist form. The second nozzle; the glass substrate fixing portion that adsorbs and fixes the entire non-polishing surface of the glass substrate to the stage via the drying prevention liquid, and adsorbs and fixes the edge portion of the non-polishing surface of the glass substrate via the buffer solution And the polishing portion, wherein the polishing portion is supplied to the polishing surface of the glass substrate that is fixed and fixed to the stage by the non-polishing surface, and the polishing liquid is polished by the polishing tool. According to the present invention, first, the drying prevention liquid is sprayed from the second nozzle toward the stage in a mist form, and the area where the entire non-polishing surface of the glass substrate is adsorbed and fixed is coated with drying prevention and prevention, and then the second nozzle is directed toward the stage. Spray 15658l.doc in a mist
S 201206635 出緩衝液而對載台向吸附固定有玻璃基板之非研磨面之緣 部之區域塗佈緩衝液。 其次，以玻璃基板固定部將玻璃基板之整個非研磨面經 由上述乾燥防止用液吸附固定於載台，並且將玻璃基板之 非研磨面之緣部經由上述緩衝液吸附固定於載台。 繼而，於研磨部，一面對玻璃基板之研磨面供給研磨液 面藉由研磨工具對研磨面進行研磨。該研磨中，玻璃基 板之非研磨面之緣部受到緩衝液保護，因此上述緣部不會 受到研磨液污染。 如以上所述，本發明自液體喷霧部朝向載台以霧狀喷出 乾燥防止用液及緩衝液’因此可防止研磨液污染玻璃基板 之非研磨面之緣部，且可將玻璃基板之非研磨面良好地吸 附固定於載台。 根據本發日月之玻璃基板之研磨方法，較佳為，上述液體 喷霧步驟中’―面使上述載台及上述第1嗔嘴、第2噴嘴中 之至少一者相對性地移動’一面自上述第！噴嘴以霧狀噴 出上述乾燥防止用液’並且自上述第2噴嘴以霧狀噴出上 述緩衝液。 根據本發明之玻璃基板之研磨裝置，較佳為，—面使上 述載台及上述^噴嘴、第2噴嘴中之至少_者相對 動’一面由上述液體喷霧部自上述^噴嘴以霧狀喷出上 述乾燥防止用液，並且自上述第2喷嘴以霧狀嘴 衝液。 双 於使載台移動之情料，首先，沿著載台搬送路將空閒 156581.doc 201206635 送至液體喷霧部。然後，-面沿著载台搬送路搬 用二二自第1嗔嘴朝向載台以霧狀喷出乾燥防止 口塗佈乾燥防止用液，並且自第2喷嘴向載台 以霧狀喷出緩衝液而對载台塗佈緩衝液。 又，於使第1喷嘴、第2嗔嘴移動之情形時，使第】喷 嘴、第2喷嘴相對於固定之載台之上表面移動而對載台以 霧狀喷出乾燥防止用液及緩衝液。然而，於一面使載台沿 著搬送路移動_面對破璃基板進行研磨之情形時，形成將 第1嘴嘴、第2噴嘴設為固定型，並利用現有之載台搬送設 備朝向搬送令之載台以霧狀喷出乾燥防止用液及緩衝液之 構成’則無需附加喷嘴移動設備即可以霧狀喷出乾燥防止 用液及緩衝液，故而較佳。 根據本發明之玻璃基板之研磨方法及研磨裝置，較佳為 上述乾燥防止用液與上述緩衝液為同一液體。 根據本發明之玻璃基板之研磨方法及研磨裝置，較佳為 上述液體為多元醇。 根據本發明’於使用同一液體作為乾燥防止用液及緩衝 液之情形時，多元醇為佳。再者，可例示水作為乾燥防止 用液。然而，因多元醇之乾燥防止作用高於水，故而多元 醇為佳。又’多元醇作為防止研磨液污染玻璃基板之緣部 之污染防止液亦較佳。 再者’多元醇之種類並無特別限定，具體而言，可例示 丙三醇、聚乙二醇、乙二醇、丙二醇、二乙二醇等。又， 乾燥防止用液及緩衝液可包含2種以上之多元醇，亦可使 156581.doc -8 · 201206635 多元醇與水混合而形成多元醇水溶液。 根據本發明之玻璃基板之研磨方法，較佳為將複數個使 上述第1喷嘴與上述第2喷嘴共用化之同一共用噴嘴於與上 述載台正交之方向配置於上述載台之上方，自上述共用喷 嘴朝向上述載台以霧狀喷出上述液體。 根據本發明之玻璃基板之研磨裝置，較佳為複數個使上 述第i噴嘴與上述第2喷嘴制化之同—共用噴嘴於與上述 載台正交之方向配置於上述載台之上方，自上述共用喷嘴 朝向上述載台以霧狀噴出上述液體。 根據本發明，將自複數個共用喷嘴以霧狀喷出之多元醇 等同-液體塗佈於吸附固定有玻璃基板之整個非研磨面之 載台之區域，並且將上述液體塗佈於吸附固定有玻璃基板 之非研磨面之整個緣部之載台之區域。如此可藉由使用同 -液體而使第i喷嘴、第2噴嘴共用化，因此可簡化相對於 嗔嘴之液體供給系、統’由此’本發明可用簡單的設備構成 液體喷霧部。 再者’本發明中’設置有朝向載台以霧狀喷出乾燥防止 用液及緩衝液的液體喷霧步驟，但亦可代替該步驟，而設 置對玻璃基板之整個非研磨面塗佈乾燥防止用&，且對上 述非研磨面之緣部塗佈緩衝液。 [發明之效果] 根據本發明之玻璃基板之研磨方法及研磨裝置，自液體 育霧部朝向載台以霧狀噴出乾燥防止用液及緩衝液，因此 可防止研磨液巧染玻璃基板之非研磨面之緣部，且可將玻 35658l.doc 201206635 璃基板之非研磨面良好地吸附固定於載台。 【實施方式】 以下’依照隨附圖式對本發明之實施方式之玻璃基板之 研磨方法及研磨裝置之較佳形態進行詳細說明。 圖1係表示實施方式之玻璃基板之研磨裝置10之整體構 成之平面圖。圖1中，以箭頭表示吸附固定矩形狀之玻璃 基板G之非研磨面之矩形狀之載台12的載台搬送路。 載台搬送路中，自載台搬送路之上游側朝向下游側依序 配置有液體喷霧部14、玻璃基板固定部16及研磨部18。 又’於研磨部18之下游側設置有未圖示之玻璃基板取出部 與載台清洗部》 於研磨部18中’玻璃基板G—面以玻璃基板g之非研磨 面吸附固定於載台12之狀態沿著載台搬送路搬送，一面藉 由沿著載台搬送路配置之複數台研磨工具而連續性地進行 研磨。此時，一面對玻璃基板G之研磨面供給研磨液，一 面藉由旋轉之上述研磨工具對研磨面進行研磨。而且，於 研磨部18之出口處’玻璃基板g製造為滿足FPD用玻璃基 板所要求之平坦度等之薄板狀》再者，配置於研磨部18之 研磨工具之台數並不限定於複數台。即，根據玻璃基板G 之尺寸而亦為1台研磨工具。 結束研磨之玻璃基板G自研磨部18搬出並搬入至上述之 玻璃基板取出部，於此處自載台12取出。然後，取出玻璃 基板G之載台12於通過上述载台清洗部之過程中被清洗液 清洗之後’再次搬送至液體喷霧部丨4以吸附固定下一玻璃 156581.doc •10· 201206635 基板G°如以上所述，載台搬送路以載台12依序通過液體 喷霧部14、玻璃基板固定部16、研磨部18、玻璃基板取出 部及載台清洗部之方式構成為環路狀。 實施方式之載台12於載台搬送路上配置有複數台，又， 於1台載台12上吸附固定有2片玻璃基板再者，配置於 載台搬送路上之載台12之台數並無限定，又，吸附固定於 載台12上之玻璃基板G之片數並不限定於2片。即，根據玻 璃基板G之尺寸而亦可為1片、3片以上。 圖2係自載台搬送路之下游側觀察液體喷霧部丨4之構成 之正視圖。即，載台12自圖2之紙面内側朝向近前側搬 送。又’圖3係液體喷霧部μ之平面圖。圖3中，載台12上 所圖不之二點劃線表示定位並吸附固定於載台12上之玻璃 基板G之緣部。 如圖2所示，於載台搬送路之上方配置有向載台上之吸 附區域以霧狀喷出乾燥防止用液之由4個第1喷嘴2〇a、 2〇b、20c、20d構成之第i喷嘴群22。該些第i喷嘴2〇a〜2〇d 於與載台搬送路正交之方向，配置於載台12上方之未圖示 之架台上，並且經由液體供給系統24而連結於乾燥防止用 液供給部（未圖示）。藉由自該些第i喷嘴2〇a〜2〇d以霧狀喷 出之乾燥防止用液，而於吸附固定有以圖3所示之二點劃 線包圍之玻璃基板G之整個非研磨面之吸附區域26塗佈乾 燥防止用液。再者，乾燥防止用液之喷霧區域亦可為載台 12之整個表面，但自節約乾燥防止用液之觀點考慮，較佳 為吸附區域26。 156581.doc 201206635 該第1喷嘴20a〜20d經由電磁閥而連結於上述乾燥防止用 液供給部。該電磁閥藉由未圖示之控制部而進行間歇開閉 控制以僅於吸附區域26通過第1喷嘴20a〜2〇d下方之過程中 打開。因此’藉由第1喷嘴20a~20d而僅於吸附區域26塗佈 乾燥防止用液。 又，於載台搬送路之上方，配置有相對於載台12而向吸 附固定有玻璃基板G之非研磨面之緣部之區域以霧狀喷出 緩衝液之由14個第2噴嘴28a、28b、28c、28d、28e、28f、 28g、28h、28i、28j、28k、28卜 28m、28n構成之第 2喷嘴 群30。該些第2喷嘴28a〜28n於與載台搬送路正交之方向 上’固疋於載台12上方之未圖示之架台上，並且經由液體 供給系統32而連結於緩衝液供給部（未圖示）。再者，緩衝 液係用以防止研磨液污染玻璃基板G之非研磨面之液體。 第2喷嘴28a〜28η中配置於兩側之2個第2喷嘴28a、28η， 分別對向配置於圖3中以二點劃線表示之玻璃基板G之緣部 中對向之短邊部所通過的區域34A、34B。該2個第2喷嘴 28a、2 8η經由電磁閥而連結於上述緩衝液供給部。該電磁 閥藉由未圖示之控制部而進行間歇開閉控制以僅於區域 34Α、34Β通過2個第2喷嘴28a、28η下方之過程中打開。 因此’藉由2個第2噴嘴28a、28η而僅對區域34Α、34Β塗 佈緩衝液。 另一方面’除第2噴嘴28a及喷嘴28η以外之其他噴嘴 28b〜28m ’對向配置於圖3中以二點劃線表示之玻璃基板〇 之緣部中對向之長邊部所通過的區域36A、36B。又，該 156581.doc •12· 201206635 些第2喷嘴28b〜28m經由電磁閥而連結於上述緩衝液供給 部。該電磁閥藉由未圖示之控制部而進行間歇開閉控制以 僅於區域36A、36B通過第2喷嘴28b~28m下方之過程中打 開。 即’第2喷嘴28b〜28m藉由上述控制部而控制電磁閥之 開閉（ON-OFF) ’以於圖4所示之A〜E分割區域中之相當於 圖3之區域36A、36B之分割區域A、C(E亦相同）通過第2噴 嘴28b〜28m下方之過程中，如圖5所示使電磁閥打開 (ON)。因此，藉由12個第2喷嘴28b〜28m而僅對區域36A、 36B塗佈緩衝液。 藉由以上步驟，對吸附固定有圖3中以二點劃線包圍之 玻璃基板G之整個非研磨面之吸附區域26塗佈乾燥防止用 液，並且對圖3中以二點劃線表示之玻璃基板G之非研磨面 之緣部之區域34A、34B、36A、36B塗佈緩衝液。又，第丄 喷嘴群22配置於載台搬送路之上游側，第2喷嘴群3〇配置 於載台搬送路之下游側，因此於區域34A、34B、36A、 3 6B中’於乾燥防止用液之上層塗佈有緩衝液。 如此，塗佈有乾燥防止用液與緩衝液之載台12沿著載台 搬送路而搬送至圖1所示之玻璃基板固定部16。於此處， 玻璃基板G之非研磨面定位並吸附固定於載台12上，即圖3 t以二點劃線表示之玻璃基板G之位置。 吸附固定於載台12之2片玻璃基板G沿著載台搬送路而搬 送至圖1之研磨部18，於此處如上所述玻璃基板G之研磨面 藉由複數個研磨工具而連續研磨。 156581.doc -13- 201206635 其次’對如上述般構成之玻璃基板之研磨裝置之作用進 行說明。 首先，沿著載台搬送路將空間之載台12搬送至液體喷霧 部14。然後，一面沿著載台搬送路搬送該載台12，一面自 第1喷嘴群22向載台12以霧狀喷出乾燥防止用液，而對圖3 之吸附區域26塗佈乾燥防止用液。繼而，自第2喷嘴群3〇 向載台12以霧狀喷出緩衝液，而於玻璃基板G之非研磨面 之緣部之區域34A、34B、36A、36B塗佈緩衝液。 其次，將該載台12搬送至玻璃基板固定部16，於此將玻 璃基板G之整個非研磨面經由上述乾燥防止用液而吸附固 疋於載台12，並且將玻璃基板G之非研磨面之整個緣部經 由上述緩衝液而吸附固定於載台12。 繼而，將該載台12搬送至研磨部18，於此—面對玻璃基 板G之研磨面供給研磨液一面藉由研磨工具而對研磨面二 行研磨。於該研磨中玻璃基板G之非研磨面之緣部受到緩 衝液保護，因此上述緣部不會受到研磨液污染。 如此，根據上述實施方式之研磨裝置1〇，於裁台搬送路 上设置液體喷霧部14,向沿著載台搬送路搬送過程中之載 台12自第丨喷嘴群22以霧狀喷出乾燥防止用液，並且自第2 噴嘴群30以霧狀喷出緩衝液。 —因此’根據該玻璃基板之研磨裝置1〇，一面搬送載 -面對非研磨面吸附固定於載台12之玻璃基板〇進行：磨 之玻璃基板之研磨裝置10中’可防止研磨液污染破 G之非研磨面之緣部，且可將玻璃基板G之非研磨面良好 156581.doc -14- 201206635 地吸附固定於载台12。 再者，作為乾燥防止用液 饬、+ ^j抝不多兀醇、多元醇水溶 液欠作為緩衝液而可例示多元醇、夕-γ 7 7L醇、多兀醇水 圖6〜圖1 1係用以說明 π从況明液體噴霧部之另一 圖0係自載台搬送路之下游#]_ " 广抒惻硯察另—實施方式之液體喷 霧部狀構叙正視H請„讀和之平面 圖再者，圓7之載台12上所圖示之二點劃線表示定位並 吸附固^於載台12上之玻璃基板G的緣部。 圖6、圖7所示之液體喷霧部财，以霧狀噴出乾燥防止 用液及緩騎為同—㈣之多元，液时霧部4〇包 括使第1喷嘴與第2噴嘴共用化之由同—構成之14個共用喷 嘴 42a、42b、42c、42d、42e、42f、42g、42h、42i、 42j、42k、421、42m、42n構成之共用喷嘴群44。該些共 用喷嘴42a〜42n於與載台搬送路正交之方向上，固定於載 台12上方之未圖示之架台上，並且經由液體供給系統46而 連結於圖8、圖9所示之多元醇供給部48。再者，圖8中表 示有對共用噴嘴42a〜42η供給多元醇之液體配管系統，圖9 中表示有對供給至共用喷嘴42a〜42η之多元醇之喷射進行 ON-OFF控制之氣體配管系統。即，藉由電磁閥52、60、 62、64而對來自泵72之壓縮空氣進行ON-OFF(導通-關閉） 控制，並使用如此控制之壓縮空氣使各共用噴嘴42a〜42η 之活塞動作，藉此對多元醇之喷射進行ON-OFF控制。 共用噴嘴42a〜42η中配置於兩側之2個共用喷嘴42a、 42η，對向配置於圖7中以二點劃線表示之玻璃基板G之緣 156581.doc • 15- 201206635 部中對向之短邊部所通過之區域5〇A、50B。該2個共用噴 嘴42a、42η如圖8所示經由流量計43a、43η、液體供給系 統46、過濾器78而連結於多元醇供給部48。又，圖9所示 之電磁閥52藉由未圖示之控制部而進行間歇開閉控制以僅 於區域50Α、50Β通過2個共用喷嘴42a、42η下方之過程中 打開。因此’藉由2個共用喷嘴42a、42η而僅對區域50A、 50B塗佈多元醇。 另一方面’除共用喷嘴42a及喷嘴42n以外之其他共用喷 嘴42b〜42m ’對向配置於圖7中以二點劃線表示之玻璃基 板G之緣部中對向之長邊部所通過的區域52八、52B。又， δ亥些共用喷嘴42b〜42m如圖9所示，三分割為共用喷嘴 42b〜42e、共用喷嘴42f〜42i及共用喷嘴42j〜42m之系統而 構成共用噴嘴小群54、56、58。該些共用喷嘴小群54、 56、58經由電磁閥6〇、62、64而連結於泵72，又，如圖8 所不經由流量計43b〜43m、液體供給系統46、過濾器78而 連結於多元醇供給部48。電磁閥6〇、62、64藉由未圖示之 控制部而進行間歇開閉控制，以僅於包含區域52A、52B 之圖7中以一點劃線包圍之玻璃基板G之吸附區域66通過12 個共用噴嘴42b〜42m下方之過程中打開。 多凡醇供給部48如圖8所示包括貯存多元醇之貯箱7〇、 對貯箱70供給壓縮空氣之未圖示之泵、對供給至貯箱70之 壓縮空氣量進行計測之流量計74、及防止自貯箱7〇輸送至 液體供給系統46之多元醇之逆流之止回閥76。 根據該多元醇供給部48，藉由自上述泵對貯箱7〇供給壓 15658l.doc 201206635 縮空氣，而使貯箱70内之多元醇自止回閥76經由過據器78 輸送至液體供給系統46。再者，亦可如圖8所示並設2台貯 箱70、流量計74及止回閥76。 且說，為發揮防止研磨液污染玻璃基板之非研磨面之緣 部之緩衝液之功能，較佳為將作為緩衝液而塗佈於載台^ 之多元醇之量（每單位面積之塗佈量），設定為多於較作為 乾燥防止用液而塗佈之多元醇之量（每單位面積之塗佈 量）。 換言之，若設載台12之搬送速度為固定，且設來自所有 共用喷嘴42a〜42η之多元醇喷霧量為相同量’則無法進行 上述設定。又，若將來自所有共用喷嘴42a〜42η之多元醇 噴霧量’設定為向與緣部對應之區域5〇Α、5〇β、52八、 52Β喷霧之緩衝液之塗佈量，則會向區域66塗佈多餘之多 元醇’從而導致多元醇浪費。 由此，實施方式之液體喷霧部40中，將來自除兩側之共 用喷嘴42a、42η以外之12個喷嘴42b〜42m之喷霧量設定為 喷霧至區域52A、52B之緩衝液之喷霧量。又，將來自兩 側之共用喷嘴42a、42η之喷霧量設定為較來自其他共用喷 嘴42b〜42m之噴霧量多若干量，而且，如下述般控制載台 12之搬送速度。於此，多若干量係指來自共用喷嘴42a、 42η之喷霧量為來自其他共用喷嘴42b〜42m之嘴霧量之ι〇〇 倍以上。 即’於圖10所示之A〜E分割區域中，將相當於圖7之區 域52A、52B之分割區域A、C(E亦相同）如圖u般設定為通 156581.doc •17· 201206635 吊之載台搬送速度S1，而將相當於圖7之區域66之分割區 域B(D亦相同）如圖11般設定為較S1高之速度之S2。 再者’向與緣部對應之區域50A、50B、52A、52B喷霧 之緩衝液之塗佈量較佳為0.001 ml/cm2，較佳為向區域66 喷霧之緩衝液之塗佈量之1 00倍以上。 藉此，向圖7之區域52A、52B塗佈之多元醇之量成為作 為緩衝液而較佳之量，向區域66喷霧之多元醇量成為較作 為緩衝液而較佳之量少但作為乾燥防止用液而較佳之量。 又，載台搬送速度S2為高速，但由於來自兩側之共用喷嘴 42& 42n之噴霧量，設定為較其他共用喷嘴42b〜42m之喷 霧量夕若干量，故而向區域5 〇A、5 0B喷霧之多元醇之量 成為作為緩衝液而較佳之量。於此，多若干量係指來自共 用噴嘴42a、42η之噴霧量為來自其他共用喷嘴42b〜42m之 喷霧量之100倍以上。 作為如此噴霧之液體而使用同一液體之多元醇，藉此可 使圖2、圖3所示之第！喷嘴群22與第2喷嘴群3〇共用化，因 而可簡化相對於共用喷嘴42a〜42η之液體供給系統，由 此，該實施方式之液體噴霧部4〇與圖2、圖3所示之液體喷 霧部14相比成為簡單之設備。 再者，液體喷霧部40中，使載台12之搬送速度為可變而 控制多元醇之塗佈量’但並不限定於此。 例如，設載台12之搬送速度為固定，將來自兩側之共用 喷嘴42a、42η之喷霧量設定為作為緩衝液而最佳之量’並 控制其他12個共用喷嘴42b〜42m之喷霧量。即，於區域S 201206635 A buffer solution is used to apply a buffer to a region of the stage where the surface of the non-abrasive surface of the glass substrate is adsorbed and fixed. Then, the entire non-polishing surface of the glass substrate is adsorbed and fixed to the stage via the glass substrate fixing portion, and the edge portion of the non-polishing surface of the glass substrate is adsorbed and fixed to the stage via the buffer. Then, in the polishing portion, the polishing surface is supplied to the polishing surface facing the glass substrate, and the polishing surface is polished by the polishing tool. In this polishing, the edge portion of the non-polishing surface of the glass substrate is protected by the buffer, so that the edge portion is not contaminated by the polishing liquid. As described above, according to the present invention, the drying prevention liquid and the buffer liquid are sprayed from the liquid spray portion toward the stage in a mist form. Therefore, the polishing liquid can be prevented from contaminating the edge portion of the non-polishing surface of the glass substrate, and the glass substrate can be prevented. The non-polishing surface is well adsorbed and fixed to the stage. In the method of polishing a glass substrate according to the present invention, it is preferable that at least one of the stage, the first nozzle, and the second nozzle is relatively moved while the liquid spraying step is performed. Since the above! The nozzle sprays the drying prevention liquid 'in a mist form', and the buffer liquid is sprayed from the second nozzle in a mist form. In the polishing apparatus for a glass substrate according to the present invention, it is preferable that the liquid spray portion is misted from the nozzle by the liquid spray portion while the surface of the polishing table is at least one of the nozzle and the second nozzle. The drying prevention liquid is ejected, and the liquid is sprayed from the second nozzle in a mist nozzle. In the case of moving the stage, first, the idle 156581.doc 201206635 is sent to the liquid spray unit along the stage transfer path. Then, the surface is transported along the stage transfer path by the second nozzle from the first nozzle toward the stage, and the drying prevention liquid is sprayed to the drying prevention port to apply the drying prevention liquid, and the buffer is sprayed from the second nozzle to the stage in a mist form. The solution is coated with a buffer on the stage. In the case where the first nozzle and the second nozzle are moved, the first nozzle and the second nozzle are moved relative to the upper surface of the fixed stage, and the drying liquid and the buffer are sprayed on the stage in a mist form. liquid. However, when the stage is moved along the conveyance path and the glass substrate is polished, the first nozzle and the second nozzle are fixed, and the conventional carrier transport device is used to move the order. The carrier is configured to eject the drying prevention liquid and the buffer liquid in a mist form. Therefore, it is preferable to spray the drying prevention liquid and the buffer liquid in a mist form without adding a nozzle moving device. In the polishing method and polishing apparatus for a glass substrate of the present invention, it is preferable that the drying prevention liquid and the buffer liquid are the same liquid. According to the polishing method and polishing apparatus for a glass substrate of the present invention, it is preferable that the liquid is a polyol. According to the present invention, when the same liquid is used as the drying prevention liquid and the buffer, the polyol is preferred. Further, water can be exemplified as the drying prevention liquid. However, since the drying prevention effect of the polyol is higher than that of water, the polyol is preferred. Further, the polyhydric alcohol is also preferable as a contamination preventing liquid for preventing the polishing liquid from contaminating the edge portion of the glass substrate. Further, the type of the polyol is not particularly limited, and specific examples thereof include glycerin, polyethylene glycol, ethylene glycol, propylene glycol, and diethylene glycol. Further, the drying prevention liquid and the buffer solution may contain two or more kinds of polyols, and the 156581.doc -8 · 201206635 polyol may be mixed with water to form a polyol aqueous solution. According to the polishing method of the glass substrate of the present invention, it is preferable that a plurality of the same common nozzles for sharing the first nozzle and the second nozzle are disposed above the stage in a direction orthogonal to the stage, The common nozzle ejects the liquid in a mist form toward the stage. According to the polishing apparatus for a glass substrate of the present invention, preferably, the plurality of common nozzles for making the i-th nozzle and the second nozzle are disposed above the stage in a direction orthogonal to the stage, The common nozzle ejects the liquid in a mist form toward the stage. According to the present invention, a polyol equivalent-liquid which is sprayed from a plurality of common nozzles is applied to a region of a stage on which the entire non-polishing surface of the glass substrate is adsorbed, and the liquid is applied to the adsorption-fixed portion. The area of the stage on the entire edge of the non-polished surface of the glass substrate. Since the i-th nozzle and the second nozzle can be shared by using the same liquid, the liquid supply system can be simplified with respect to the nozzle. Thus, the present invention can be constituted by a simple device. Further, in the present invention, a liquid spraying step of ejecting the drying prevention liquid and the buffer liquid toward the stage is provided, but instead of this step, the entire non-polishing surface of the glass substrate may be coated and dried. Prevent the use of & and apply a buffer to the edge of the non-abrasive surface. [Effect of the Invention] According to the polishing method and the polishing apparatus for a glass substrate of the present invention, the drying prevention liquid and the buffer liquid are sprayed from the liquid sports mist portion toward the stage in a mist form, thereby preventing the polishing liquid from staining the glass substrate non-polishing. The non-polishing surface of the glass plate 35658l.doc 201206635 can be well adsorbed and fixed to the stage. [Embodiment] Hereinafter, a preferred embodiment of a polishing method and a polishing apparatus for a glass substrate according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. Fig. 1 is a plan view showing the overall configuration of a polishing apparatus 10 for a glass substrate of an embodiment. In Fig. 1, the stage transfer path of the rectangular stage 12 on which the non-polished surface of the rectangular glass substrate G is fixed is fixed by an arrow. In the stage transfer path, the liquid spray portion 14, the glass substrate fixing portion 16, and the polishing portion 18 are disposed in this order from the upstream side of the stage transfer path toward the downstream side. Further, a glass substrate take-out portion and a stage cleaning portion (not shown) are provided on the downstream side of the polishing portion 18. In the polishing portion 18, the glass substrate G-surface is adsorbed and fixed to the stage 12 by the non-polishing surface of the glass substrate g. The state is conveyed along the stage conveyance path, and the state is continuously polished by a plurality of polishing tools arranged along the stage conveyance path. At this time, the polishing liquid is supplied to the polishing surface of the glass substrate G, and the polishing surface is polished by the above-mentioned polishing tool on one side. Further, at the exit of the polishing unit 18, the glass substrate g is formed into a thin plate shape which satisfies the flatness required for the glass substrate for FPD. Further, the number of polishing tools disposed in the polishing unit 18 is not limited to a plurality of stages. . That is, it is also one grinding tool depending on the size of the glass substrate G. The glass substrate G that has been polished is carried out from the polishing unit 18 and carried into the above-mentioned glass substrate take-out portion, where it is taken out from the stage 12. Then, the stage 12 on which the glass substrate G is taken out is washed by the cleaning liquid in the process of passing through the stage cleaning unit, and then 're-transferred to the liquid spray unit 丨4 to adsorb and fix the next glass 156581.doc •10·201206635 Substrate G As described above, the stage transfer path is configured in a loop shape by the stage 12 passing through the liquid spray unit 14, the glass substrate fixing portion 16, the polishing unit 18, the glass substrate take-out portion, and the stage cleaning portion in this order. In the stage 12 of the embodiment, a plurality of stages are arranged on the stage transfer path, and two glass substrates are adsorbed and fixed on one stage 12, and the number of stages 12 placed on the stage transfer path is not provided. Further, the number of sheets of the glass substrate G adsorbed and fixed to the stage 12 is not limited to two. That is, it may be one sheet or three sheets or more depending on the size of the glass substrate G. Fig. 2 is a front elevational view showing the configuration of the liquid atomizing portion 丨4 from the downstream side of the stage conveying path. That is, the stage 12 is transported from the inner side of the paper surface of Fig. 2 toward the front side. Further, Fig. 3 is a plan view of the liquid spray portion μ. In Fig. 3, the two-dot chain line on the stage 12 indicates the edge portion of the glass substrate G which is positioned and adsorbed and fixed to the stage 12. As shown in Fig. 2, four first nozzles 2a, 2b, 20c, and 20d are disposed above the stage transfer path in which the drying prevention liquid is sprayed onto the adsorption area on the stage in a mist form. The i-th nozzle group 22. The i-th nozzles 2a to 2d are disposed on a gantry (not shown) above the stage 12 in a direction orthogonal to the stage transfer path, and are connected to the drying prevention liquid via the liquid supply system 24. Supply unit (not shown). The entire non-polishing glass substrate G surrounded by the two-dot chain line shown in FIG. 3 is adsorbed and fixed by the drying prevention liquid sprayed from the i-th nozzles 2a to 2〇d in a mist form. The adsorption area 26 of the surface is coated with a liquid for drying prevention. Further, the spray area of the drying prevention liquid may be the entire surface of the stage 12, but the adsorption area 26 is preferable from the viewpoint of saving the drying prevention liquid. 156581.doc 201206635 The first nozzles 20a to 20d are connected to the drying prevention liquid supply unit via a solenoid valve. The solenoid valve is intermittently opened and closed by a control unit (not shown) to open only during the process in which the adsorption region 26 passes under the first nozzles 20a to 2〇d. Therefore, the drying prevention liquid is applied only to the adsorption region 26 by the first nozzles 20a to 20d. In addition, 14 second nozzles 28a are sprayed with a buffer liquid in a mist-like region in a region where the edge of the non-polishing surface of the glass substrate G is adsorbed and fixed to the stage 12, and the carrier 12 is placed above the stage transfer path. The second nozzle group 30 composed of 28b, 28c, 28d, 28e, 28f, 28g, 28h, 28i, 28j, 28k, 28, 28m, and 28n. The second nozzles 28a to 28n are fixed to the gantry (not shown) above the stage 12 in a direction orthogonal to the stage transport path, and are connected to the buffer supply unit via the liquid supply system 32 (not Graphic). Further, the buffer is used to prevent the polishing liquid from contaminating the liquid on the non-abrasive surface of the glass substrate G. The two second nozzles 28a and 28n disposed on both sides of the second nozzles 28a to 28n are respectively opposed to the short side portions of the edge portions of the glass substrate G which are arranged by two-dot chain lines in FIG. Passed areas 34A, 34B. The two second nozzles 28a and 28n are connected to the buffer supply unit via a solenoid valve. The solenoid valve is intermittently opened and closed by a control unit (not shown) to open only during the passage of the two second nozzles 28a and 28n in the regions 34A and 34b. Therefore, only the buffers are applied to the regions 34A and 34B by the two second nozzles 28a and 28n. On the other hand, the nozzles 28b to 28m' other than the second nozzle 28a and the nozzle 28n are opposed to each other in the long side portion of the edge portion of the glass substrate 〇 which is indicated by a two-dot chain line in Fig. 3 Areas 36A, 36B. Further, the second nozzles 28b to 28m are connected to the buffer supply unit via a solenoid valve. The solenoid valve is intermittently opened and closed by a control unit (not shown) to open only when the regions 36A and 36B pass under the second nozzles 28b to 28m. In other words, the second nozzles 28b to 28m control the opening and closing (ON-OFF) of the electromagnetic valve by the control unit, so that the divisions corresponding to the regions 36A and 36B of Fig. 3 in the A to E division regions shown in Fig. 4 are formed. When the regions A and C (the same as E) pass under the second nozzles 28b to 28m, the solenoid valve is opened (ON) as shown in FIG. Therefore, only the buffers are applied to the regions 36A and 36B by the twelve second nozzles 28b to 28m. By the above steps, the drying prevention liquid is applied to the adsorption region 26 to which the entire non-polishing surface of the glass substrate G surrounded by the two-dot chain line in FIG. 3 is adsorbed and fixed, and is indicated by a two-dot chain line in FIG. A buffer solution is applied to the regions 34A, 34B, 36A, and 36B of the edge portion of the non-polishing surface of the glass substrate G. In addition, the second nozzle group 22 is disposed on the upstream side of the stage transport path, and the second nozzle group 3 is disposed on the downstream side of the stage transport path. Therefore, in the areas 34A, 34B, 36A, and 36B, the drying prevention is used. The upper layer of the liquid is coated with a buffer. In this manner, the stage 12 to which the drying prevention liquid and the buffer solution are applied is conveyed along the stage transfer path to the glass substrate fixing portion 16 shown in Fig. 1 . Here, the non-polishing surface of the glass substrate G is positioned and adsorbed and fixed on the stage 12, that is, the position of the glass substrate G indicated by a two-dot chain line in FIG. The two glass substrates G adsorbed and fixed to the stage 12 are transported along the stage transfer path to the polishing unit 18 of Fig. 1, where the polished surface of the glass substrate G is continuously polished by a plurality of polishing tools as described above. 156581.doc -13- 201206635 Next, the action of the polishing apparatus for the glass substrate configured as described above will be described. First, the stage 12 of the space is transported to the liquid spray unit 14 along the stage transfer path. Then, while the stage 12 is transported along the stage transfer path, the drying prevention liquid is sprayed from the first nozzle group 22 to the stage 12 in a mist form, and the drying prevention liquid is applied to the adsorption region 26 of Fig. 3 . . Then, the buffer liquid is sprayed from the second nozzle group 3 to the stage 12 in a mist form, and the buffer liquid is applied to the regions 34A, 34B, 36A, and 36B at the edge portions of the non-polishing surface of the glass substrate G. Then, the stage 12 is transported to the glass substrate fixing portion 16, and the entire non-polishing surface of the glass substrate G is adsorbed and fixed to the stage 12 via the drying prevention liquid, and the non-polishing surface of the glass substrate G is adhered. The entire edge portion is adsorbed and fixed to the stage 12 via the above buffer. Then, the stage 12 is transferred to the polishing unit 18, and the polishing surface is supplied to the polishing surface of the glass substrate G while the polishing surface is polished by the polishing tool. Since the edge portion of the non-polishing surface of the glass substrate G during the polishing is protected by the buffer, the edge portion is not contaminated by the polishing liquid. As described above, according to the polishing apparatus 1 of the above-described embodiment, the liquid spray unit 14 is provided on the cutting table transport path, and the stage 12 in the process of transporting along the stage transfer path is sprayed and dried from the second nozzle group 22 in a mist form. The liquid is prevented from being sprayed from the second nozzle group 30 in a mist form. - Therefore, 'the polishing apparatus 1 of the glass substrate can be used to prevent the polishing liquid from being contaminated by the glass substrate 吸附 which is adhered to the non-polishing surface and fixed to the glass substrate of the stage 12 G is the edge of the non-polishing surface, and the non-polishing surface of the glass substrate G can be adsorbed and fixed to the stage 12 by 156581.doc -14 - 201206635. In addition, as a buffer for drying prevention, ^ 拗 拗 兀 、 、 、 、 、 、 、 、 、 多元 多元 多元 多元 多元 多元 多元 多元 多元 多元 多元 多元 多元 多元 多元 多元 多元 多元 多元 多元 多元 多元 多元 多元 多元 多元 多元 多元 多元 多元 多元 多元 多元 多元Another figure to illustrate the π from the liquid spray part is the downstream of the transfer path from the stage. #]_ " 广抒恻砚察—The liquid spray part of the embodiment is described as H. „Read And the plan view, the two-dot chain line shown on the stage 12 of the circle 7 indicates that the edge of the glass substrate G on the stage 12 is positioned and adsorbed. The liquid spray shown in Fig. 6 and Fig. 7 In the case of the mist, the drying prevention liquid and the slow riding are the same as the above-mentioned (four), and the liquid mist portion 4 includes 14 common nozzles 42a which are configured to share the first nozzle and the second nozzle. a common nozzle group 44 composed of 42b, 42c, 42d, 42e, 42f, 42g, 42h, 42i, 42j, 42k, 421, 42m, 42n. The common nozzles 42a to 42n are orthogonal to the stage transport path. The upper portion is fixed to a gantry (not shown) above the stage 12, and is connected to the polyol supply unit 48 shown in FIGS. 8 and 9 via the liquid supply system 46. In addition, FIG. 8 shows a liquid piping system in which a polyol is supplied to the common nozzles 42a to 42n, and FIG. 9 shows a gas piping system in which the injection of the polyol supplied to the common nozzles 42a to 42n is ON-OFF controlled. That is, the compressed air from the pump 72 is controlled to be ON-OFF by the solenoid valves 52, 60, 62, 64, and the pistons of the common nozzles 42a to 42n are operated by the compressed air thus controlled. Thereby, the injection of the polyol is ON-OFF controlled. The two common nozzles 42a and 42n disposed on both sides of the common nozzles 42a to 42n are opposed to the glass substrate G which is arranged by a two-dot chain line in Fig. 7 . Edges 156581.doc • 15- 201206635 The regions 5 〇 A, 50B through which the short sides of the opposite sides pass. The two common nozzles 42a, 42n are flowmeters 43a, 43n, and the liquid supply system 46 as shown in FIG. The filter 78 is connected to the polyol supply unit 48. The electromagnetic valve 52 shown in Fig. 9 is intermittently opened and closed by a control unit (not shown) to pass through the two common nozzles 42a only in the regions 50A and 50Β. Opened under the process of 42η. So 'borrowed The two common nozzles 42a and 42n are used to apply only the polyol to the regions 50A and 50B. On the other hand, the other common nozzles 42b to 42m except the common nozzle 42a and the nozzle 42n are disposed opposite to each other in FIG. The line indicates the areas 52 and 52B through which the long side portions of the glass substrate G are opposed to each other. Further, as shown in FIG. 9, the common nozzles 42b to 42m are divided into three common nozzles 42b to 42e. The common nozzle small groups 54, 56, 58 are formed by the systems of the common nozzles 42f to 42i and the common nozzles 42j to 42m. The common nozzle groups 54, 56, and 58 are connected to the pump 72 via the electromagnetic valves 6A, 62, and 64, and are connected via the flow meters 43b to 43m, the liquid supply system 46, and the filter 78 as shown in Fig. 8 . The polyol supply unit 48 is provided. The solenoid valves 6A, 62, and 64 are intermittently opened and closed by a control unit (not shown), and 12 passages are formed only in the adsorption region 66 of the glass substrate G surrounded by a one-dot chain line in Fig. 7 including the regions 52A and 52B. The process under the common nozzles 42b to 42m is opened. As shown in FIG. 8, the polyol supply unit 48 includes a tank 7 for storing a polyol, a pump (not shown) for supplying compressed air to the tank 70, and a flow meter for measuring the amount of compressed air supplied to the tank 70. 74. and a check valve 76 for preventing backflow of the polyol from the tank 7 to the liquid supply system 46. According to the polyol supply unit 48, the polyol in the tank 70 is supplied from the check valve 76 to the liquid supply via the reactor 78 by supplying the pressure of the cylinder 7〇 from the pump to the pressure of 15658l.doc 201206635. System 46. Further, as shown in Fig. 8, two tanks 70, a flow meter 74, and a check valve 76 may be provided. In order to prevent the polishing liquid from contaminating the buffer of the edge portion of the non-polishing surface of the glass substrate, it is preferable to apply the amount of the polyol applied to the stage as a buffer (the coating amount per unit area). The amount of the polyol (coating amount per unit area) which is applied more than the liquid for drying prevention is set. In other words, if the transport speed of the stage 12 is fixed and the amount of polyol spray from all the common nozzles 42a to 42n is the same amount, the above setting cannot be performed. Further, when the amount of the polyol spray from all the common nozzles 42a to 42n is set to the amount of the buffer applied to the regions 5〇Α, 5〇β, 528, 52Β corresponding to the edge portion, The excess polyol is applied to the zone 66' resulting in wasted polyol. Thus, in the liquid spray unit 40 of the embodiment, the spray amount from the twelve nozzles 42b to 42m other than the common nozzles 42a and 42n on both sides is set as the spray of the buffer sprayed to the areas 52A and 52B. The amount of fog. Further, the amount of spray from the common nozzles 42a and 42n on both sides is set to be larger than the amount of spray from the other common nozzles 42b to 42m, and the conveyance speed of the stage 12 is controlled as follows. Here, the amount of the spray from the common nozzles 42a and 42n is 〇〇 or more than the amount of the mist from the other common nozzles 42b to 42m. In other words, in the A to E divided regions shown in Fig. 10, the divided regions A and C (the same as E) corresponding to the regions 52A and 52B of Fig. 7 are set to pass 156581.doc • 17· 201206635 The carriage conveyance speed S1 is hoisted, and the division area B (the same as D) corresponding to the area 66 of Fig. 7 is set to S2 which is higher than S1 as shown in Fig. 11 . Further, the amount of the buffer applied to the regions 50A, 50B, 52A, and 52B corresponding to the edge portion is preferably 0.001 ml/cm 2 , preferably the amount of the buffer sprayed to the region 66. More than 100 times. Thereby, the amount of the polyol applied to the regions 52A and 52B of Fig. 7 is preferably a buffer, and the amount of the polyol sprayed into the region 66 is preferably smaller than that of the buffer, but is used as a drying prevention. The liquid is used in a preferred amount. Further, the stage transport speed S2 is high speed, but the amount of spray from the common nozzles 42 & 42n on both sides is set to be larger than the spray amount of the other common nozzles 42b to 42m, so that the area is 5 〇A, 5 The amount of the polyol sprayed by 0B becomes a preferred amount as a buffer. Here, the amount of the spray from the common nozzles 42a and 42n is 100 times or more the amount of spray from the other common nozzles 42b to 42m. As the liquid thus sprayed, the same liquid polyol is used, whereby the figures shown in Figs. 2 and 3 can be obtained! Since the nozzle group 22 and the second nozzle group 3 are shared, the liquid supply system with respect to the common nozzles 42a to 42n can be simplified, whereby the liquid spray portion 4 of the embodiment and the liquid shown in Figs. 2 and 3 The spray unit 14 is a simple device. Further, in the liquid spray unit 40, the transport speed of the stage 12 is made variable, and the amount of application of the polyol is controlled, but the present invention is not limited thereto. For example, the transport speed of the stage 12 is fixed, and the spray amount of the common nozzles 42a and 42n from both sides is set to the optimum amount as the buffer, and the spray of the other 12 common nozzles 42b to 42m is controlled. the amount. That is, in the area
15658 丨.doc 10 -Ιο- S 201206635 52A、咖通過共时嘴42b〜42mT方時，將㈣量設定為 作為緩衝液而最佳之量即可，而於區域66通過共用喷嘴 下方時，將喷霧篁设定為作為乾燥防止用液而最 佳之量即可。該流量控制可藉由使用流量可變閥，並且具 有根據載台12之移行位置而控制流量可變閥之開度之控制 部而達成。 又’實施方式中，說明了使載台為移動型，且使第4 嘴、第2喷嘴為固定型之構成’但並不F艮定於此。即，亦 可使載台為固定型，而使約喷嘴、第2噴嘴為移動型，且 使第1喷嘴、第2噴嘴一面於固定载台上方移動一面向載台 以霧狀喷出乾燥防止用液、緩衝液而於載台形成所期望之 噴霧圖案。 另一方面，亦可使載台及第1喷嘴、第2噴嘴為固定型。 該情形時，為於載台上形成所期望之㈣㈣，而_台 上方配置金屬遮罩等遮罩構件並向整個載台以霧狀喷出共 用之液體(多元醇）。藉此，可於載台上形成喷霧圖案。 又’藉由根據噴霧圖案而於載台上方調整p喷嘴、第磧 嘴之配置位置’亦可於载台上形成所期望之喷霧圖案。 參照詳細且特定之實施方式對本發明進行了說明^但熟 悉此技藝者當明白，可於不脫離本發明之範圍與精神之情 況下進行各種修正及變更。 本案係基於2G1G年6月1日中請之日本專利中請案2〇ι〇-126083者，並將其内容作為參照引用於此。 【圖式簡單說明】 156581.doc -19- 201206635 圖1係表示實施方# > ιγ}> , 气之破璃基板之研磨裝置之整體構成 之平面圖； 圖2係自載台搬送路之下游側觀察液體喷霧部之構成之 正視圖； 圖3係圖2所示之液體喷霧部之平面圖； 圖4係表示藉由第2嗔嘴群以霧狀喷出緩衝液之區域與未 喷霧之區域之說明圖； 圖5係表示第2喷嘴群之電則之開閉動作之時序圖； 圖6係自載台搬送路之下游側觀察另一實施方式之液體 噴霧部之構成之正視圖； 圖7係圖6所示之液體喷霧部之平面圖； 圖8係表示對共用喷嘴供給多元醇之液體配管系統之方 塊圖； 圖9係表示用以對供給至共用喷嘴之多元醇之喷射進行 ON-OFF控制之氣體配管系統之方塊圖； 圖10係表示變更載台於液體喷霧部之速度之區域之說明 圖；及 圖π係表示載台於液體喷霧部之速度之時序圖。 【主要元件符號說明】 10 玻璃基板之研磨裝置 12 載台 14 液體噴霧部 16 玻璃基板固定部 18 研磨部 J56581.doc -20- 201206635 20a〜20d 第1喷嘴 22 第1喷嘴群 24 液體供給系統 26 吸附區域 28a〜28η 第2喷嘴 30 第2噴嘴群 32 液體供給系統 34A、34B、36A、 區域 36B、50A、50B 40 液體喷霧部 42a〜42η 共用喷嘴 43a〜43η、74 流量計 44 共用喷嘴群 46 液體供給系統 48 多元醇供給部 52 電磁闊 54 、 56 、 58 共用喷嘴小群 60 、 62 ' 64 電磁閥 66 吸附區域 70 貯箱 72 泵 76 止回閥 78 過遽器 G 玻璃基板 156581.doc -21 -15658 丨.doc 10 -Ιο- S 201206635 52A, when the coffee passes through the common nozzle 42b~42mT, the amount of (4) is set to be the optimal amount as the buffer, and when the area 66 passes under the common nozzle, The spray enthalpy may be set to be the optimum amount as the drying prevention liquid. This flow rate control can be achieved by using a flow variable valve and having a control portion that controls the opening degree of the flow variable valve in accordance with the traveling position of the stage 12. Further, in the embodiment, the configuration in which the stage is of a movable type and the fourth nozzle and the second nozzle are of a fixed type has been described, but the present invention is not limited thereto. In other words, the stage can be fixed, and the nozzle and the second nozzle can be moved, and the first nozzle and the second nozzle can be moved over the fixed stage, and the surface can be sprayed and dried in a mist form. The desired spray pattern is formed on the stage with a liquid or a buffer. On the other hand, the stage, the first nozzle, and the second nozzle may be of a fixed type. In this case, a desired mask member such as a metal mask is placed on the stage, and a common liquid (polyol) is sprayed onto the entire stage in a mist form. Thereby, a spray pattern can be formed on the stage. Further, the desired spray pattern can be formed on the stage by adjusting the placement position of the p nozzle and the nozzle on the stage above the spray pattern. The present invention has been described with reference to the particular embodiments of the present invention. It is understood that various modifications and changes can be made without departing from the scope and spirit of the invention. This case is based on the Japanese Patent Application No. 2〇ι〇-126083, filed on June 1, the second of BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view showing the overall configuration of a polishing apparatus for a glass substrate; FIG. 2 is a self-propelled table conveying path. FIG. 3 is a plan view showing the liquid spray portion shown in FIG. 2; FIG. 4 is a view showing a region in which the buffer liquid is sprayed by the second pout group; FIG. 5 is a timing chart showing the opening and closing operation of the second nozzle group; FIG. 6 is a front view showing the configuration of the liquid atomizing portion of the other embodiment from the downstream side of the stage conveying path. Figure 7 is a plan view of the liquid spray portion shown in Figure 6; Figure 8 is a block diagram showing a liquid piping system for supplying a polyol to a common nozzle; Figure 9 is a view showing a polyol for supplying to a common nozzle. FIG. 10 is a block diagram showing a region in which the speed of the stage is changed to the liquid atomizing portion; and FIG. 10 is a timing chart showing the speed of the stage in the liquid atomizing portion; Figure. [Description of main component symbols] 10 Glass substrate polishing apparatus 12 Stage 14 Liquid atomizing unit 16 Glass substrate fixing unit 18 Polishing unit J56581.doc -20- 201206635 20a to 20d First nozzle 22 First nozzle group 24 Liquid supply system 26 Adsorption regions 28a to 28n Second nozzle 30 Second nozzle group 32 Liquid supply systems 34A, 34B, 36A, regions 36B, 50A, 50B 40 Liquid spray portions 42a to 42n Common nozzles 43a to 43n, 74 Flow meter 44 Common nozzle group 46 Liquid supply system 48 Polyol supply part 52 Electromagnetic width 54 , 56 , 58 Common nozzle small group 60 , 62 ' 64 Solenoid valve 66 Adsorption area 70 Tank 72 Pump 76 Check valve 78 Transmitter G Glass substrate 156581.doc -twenty one -