201206609 六、發明說明： 【發明所屬之技術領域】 關於-料電性球供給裝m對於導電性球搭 ==合，性球搭載機構係於被搭載物頂面以 既疋圖案形成之處搭載導電性球。 【先前技術】 性破ί/ϋι，於在被搭載物頂面以既定圖案形成之處搭載導電 ί 載機構，吾人所知悉有例如：將導·球_ 體獻1所示之底面開放的釣鐘型球杯内部之球吸附 對著配上Ϊΐ導電性球之吸附使其落下，使導電性球 戶ί示之二Ϊί搭載導電性球之機構;或如專利文獻2 球杯側收容有多數的導電性球，邊使盒型 電性開口部咖 1 ^2 =士置，藉二 從管子擠出至容器娜來供給的壓力 用如==若/^上述釣鐘型球杯之導電性球搭載機構上，使 dSS== 衣杯長邊方向的球分布產生不均，可能發生焊接球之 201206609 搭載錯誤。 此外’因壓力氣體方式之供給裝置係藉壓力氣 出，故必須將壓力氣體之供給時間或壓力以參數進接球擠 為此一參數被焊接球之徑所左右，故每當所供终，但因 更時，必須對該參數進行調整。 。斗接球之徑變 擠出量依悍接球貯藏槽所貯藏之球量(球剩餘 而變動，在球杯之定量供給困難。 里)之夕养 [習知技術文獻] [專利文獻] 專利文ftl日本特開2008-153336號公開特許公報 專利文獻2日本特開2007-299836號公開特許公報 一……專利文獻3日本特開平8-236916號公開特許公報 — - ..... — . _ .. . 【發明内容】 [發明所欲解決的問題] i象ί搭======，拌造成之焊接球不ίίί .[解決問ϋΓϋΓ 導紐球供給裝置。 電職形成之處上搭餅·球之導 機構：载機構供、给導電性球之導電性球供給裝置，其採用以下 =1、具備有儲存導電性球之球供料斗。 第可收容既定量之導電性球的球袋。 空抽吸機構針對該球袋，隔著阻止球吸入機構與其連接之真 off之真 該真空抽吸機構的抽吸狀況，切換其ON及 201206609 第6、具找供給通路。 球排出通路。 〃衣搭載機構之導電性球接受位置的 抽吸力，較棘f触狀該雜給通路的 第8、藉由該真空切更強。 況為ON，從該球供給通路該真空抽吸機構的抽吸狀 導電性球後，使對於該真空抽吸於該球袋收容既定量之 性球通路排為⑽，將導電 第2發明係於第！發明上 :供又位置。 袋之剖面積小，較球排出通路n求供給通路之剖面積較球 裝置。此-附加為：將藉由 ^積大之條件的導電性球供給 成的球供給通路之抽吸力，π =明之真空抽吸機構抽吸所造 之-例。力^為較該球排出通路之抽吸力更強 第3發明係於第！發明上 閉機構的導電性球供給裝置。此置使球排出通路封閉之封 真空抽吸機構抽吸所造成的 將藉由以第1發明之 出通路之抽吸力變得更強之一例了通路之抽吸力，設定為較球排 [發明之效果] 本發明’第1採用之方式為：使 狀況為ON，將既定量之導電性 ^真空抽吸機構的抽吸 下(自然洛下)方式。因此，成為會 接，置之重力落 球在配置遮罩上分散，或因球杯内=2殘麗而使導電性 之導電性球供給裝置。 ％拌而使導電性球不均聚集 性球之時延長#至=^^，==^’即便抽吸導電 性球袋内，柯使對球搭載機構之上之導電 第3 ’藉者將真空抽吸機構之抽吸 為-疋。 使用之最大導獅徑的抽吸壓力，故所 201206609 便不需調整繁雜的參數。 藉丨第為因使球供、給通路之剖面積較球袋之剖面 3賦ϊϊϊίίΐί剖面積大，故可將較球排出通路更大的抽 性球導入3袋，广，而可確實地魏供料斗將既定量之導電 可較因設有將球排出通路封閉之封閉機構， 電性球;入至球袋的過程^；錄給通路，故從球供料斗將導 【實施方式】 太二：:與實施例一同對本發明之實施態樣加以說明。 ίί二ίϊίΐ載機構之實糊，係為如圖4與圖5所示之 =接ί=ί置?。=本對7接lii生Λ供給裝置的一實施例 内方，球2數量是== 安 的焊接球2之麵容量妨f理。 爾Ή·寸·3内 接球袋量(既定量)之焊 袋 201206609 2球供給通路5之上坡，即便在抽吸狀況為 g況下’夕餘的焊接球2不會由球供給通路5往球排出通路6落 為通二具 相連接。真空㈣具有電磁開_2'= 空= 頂部連接/ 真工源1〇經由抽吸通路13細4之 ίο 七球吸入機構之_9。藉該筛網9之存 接。球排出it路6 ,= 6連 另外’焊接球供給裝置1中，兔由 通過球供給通路5並導入球袋衫表2可由球供料斗3 形為較球袋4之略圓柱形狀空間的=剖面積Ai成 二^ 之抽吸力賊枝球ί給通路5 塞滿焊接球2之狀態下，仍可二：球= 路5 Μ與球排出通 與球細部之物_===== 201206609 3倍以上°依此—構成’可更增大賦予至球供^通 。另外，本實施例中，上述球供給通路5之 形狀狀、以及_出通路6與球袋4之^剖面 此-^+ 1 ，但不祕此之热彡肖形狀亦可。 路之=’3=上通路6之糊方向長度LQ亦宜為球排出通 ，f*上述焊接球供給裝置1之動作加以說明。 將電11調整真空源1G的氣體抽吸之壓力或流量， ;4, 〇 4, . 面積較大’抽吸力較強，故焊接球2 ==r9—之存在，焊接球2不會脫= 使真 ii _電_ 闕12， 10方向之抽吸Hit球2失去往真空源 袋4通過球排出通路6，往(焊)其本體重量’自球 排出，將焊接球=給&置之焊接球2的接受位置 使其顧料3技触置^開始，先 體重量供給予球袋4，故祕如、=3收谷之焊接球2不藉其本 内既定量之烊接球)2 _的多鱗接H^ QFF，球袋4 往球排出通路6溢出。 、’不會從球供給通路5 將往接球2之消費量多的搭载情況下，由以下方式因庳· 雜=====排出焊― 之二5之抽通路6 _接球2之供給’故將球供給通路5之剖面積 201206609 =====⑽心_ ’其他的實施例 問門14 ’設置於球排出通路封閉機構的 於4 焊接球2往球袋4導人時封閉，將焊接球2自球 並經過既定時間後略同時，此外’亦可為關閉電磁開閉閥12 一情^路至球供給通路5。此 之間的關係並無特別限定，可^ 出通，6之剖面積Ao 中任一情形。T^Ai>Ao>Ai=Ao>Ai<Ao^* 間門出通路6細堅硬爾構成，故將 撓材舰^下==但球=輸嘛等之可 夾持封刪村設綱排出通路6 p弓!持之情況下，無論何者皆不必將球排A通路6完全封 因賦予至球供給通路5之抽吸力較賦予至球排^路^: ^戶^可’故即賴放球料通路6之—部分使其不完全封閉 以下’對焊接球搭縣置之焊接球供給裝置丨其 以說明。® 4為使關鐘型雜16之焊接球搭餘/置的 ^ 該^球搭餘置係為：將由焊接球供給裝置丨所供給之焊接 2 ’藉抽吸裝置21之抽吸力吸附保持於底面開放之釣鐘 内部的球吸附體20，在配置治具之遮罩17上使抽吸裝置 OFF，並解除焊接球2之吸附使其落下，谭接球2 ^ 於平台22上所載置之基板23的電 、此一情況如圖4所示，釣鐘型球杯16與焊接球供給裝置j 為一體之設置。於焊接球供給裝置1之球排出通路6的球排口、 19下方设置球導軌15，引導使焊接球2集令於釣鐘型球杯μ之 201206609 J面開放部附近的遮罩17上。所供給之焊接球 Z罩St積存。當然，球導執15並非為必要之5。 成。亦供給裝置1安裝於觸型球杯16加以構201206609 VI. Description of the Invention: [Technical Field of the Invention] The electric ball supply device is mounted on the conductive ball ===, and the ball mounting mechanism is mounted on the top surface of the object to be mounted in a squat pattern. Conductive ball. [Prior Art] When the top surface of the mounted object is formed in a predetermined pattern, a conductive load mechanism is mounted. As is known, for example, the fishing clock with the bottom surface shown by the guide ball _ body 1 is opened. The ball inside the ball is adsorbed against the adsorption of the conductive ball to make it fall, so that the conductive ball can be used to display the mechanism of the conductive ball; or as in the patent document 2, the ball cup side contains a large number of Conductive ball, while making the box-type electrical opening part 1 ^ 2 = Shi set, by the second squeeze from the tube to the container Na to supply the pressure with == if / ^ above the bell-type ball of the conductive ball mounted In the mechanism, the dSS== ball distribution in the direction of the long side of the cup is uneven, and the 201206609 mounting error of the solder ball may occur. In addition, because the supply device of the pressure gas method relies on the pressure gas, the supply time or pressure of the pressure gas must be squeezed into the ball by the parameter, so that the parameter is welded to the ball path, so whenever it is supplied, However, this parameter must be adjusted for more time. . The amount of extrusion of the bucket catching ball depends on the amount of ball stored in the catching storage tank (the ball is left to change, and the quantitative supply of the ball is difficult. In the case of the ball) [Practical Technical Literature] [Patent Literature] Patent Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. _ .. . [Summary of the Invention] [The problem to be solved by the invention] i like ί 搭 ======, the welding ball caused by the mixing is not ίίί. [Solving the problem ϋΓϋΓ guide ball supply device. In the place where the electric service is formed, the cake and the ball are guided. The mechanism is a conductive ball supply device for supplying and feeding the conductive ball, and the following is provided: =1. A ball supply hopper having a conductive ball is stored. The first bag can accommodate a quantity of conductive balls. The air suction mechanism switches the ON of the bag and the supply path of the vacuum suction mechanism by blocking the suction state of the vacuum suction mechanism. Ball discharge path. The suction force of the conductive ball receiving position of the garment carrying mechanism is stronger than the eighth of the hybrid feeding path. In the case of ON, after the suction-type conductive ball of the vacuum suction mechanism is supplied from the ball, the vacuum ball is sucked into the bag to accommodate a predetermined amount of the spherical ball passage (10), and the second conductive system is used. In the first! Inventive: Supply and location. The sectional area of the bag is small, and the sectional area of the supply passage is smaller than that of the ball device than the ball discharge path n. This is additionally added as follows: the suction force of the ball supply passage supplied by the conductive ball under the condition of the accumulation, π = the suction by the vacuum suction mechanism. The force ^ is stronger than the suction force of the ball discharge passage. The third invention is in the first! Inventively, a conductive ball supply device for a closed mechanism. The suction force of the vacuum suction mechanism that closes the ball discharge passage is increased by the suction force of the passage of the first invention, and the suction force of the passage is set to be larger than the ball row. [Effects of the Invention] The first aspect of the present invention is a method in which the state is ON, and a predetermined amount of conductivity is applied to the vacuum suction mechanism (naturally). Therefore, it becomes a conductive ball supply device which is connected to the gravity ball, which is dispersed in the arrangement mask, or which is electrically conductive in the spherical cup. % mixing makes the conductive ball unevenly aggregated when the ball is extended # to =^^, ==^' Even if the conductive ball is sucked, Ke makes the conductive third 'borrower on the ball-mounted mechanism The suction of the vacuum suction mechanism is -疋. The maximum lion's diameter is used for the suction pressure, so the 201206609 does not need to adjust the complicated parameters. The first reason is that the cross-sectional area of the ball supply and the passage is larger than the cross-section of the bag. ίίΐί has a large cross-sectional area, so the pumping ball larger than the ball discharge passage can be introduced into 3 bags, which is wide and can be surely The supply hopper will be more conductive than the closed mechanism that is closed by the ball discharge passage, the electric ball; the process of entering the bag; the recording path, so it will be guided from the ball supply hopper [Implementation] Taiji The embodiment of the present invention will be described with reference to the embodiments. Ίί 二ίϊί The actual paste of the carrier is as shown in Figure 4 and Figure 5 = ί=ί. = In the embodiment of the pair of lii oyster supply devices, the number of balls 2 is == The surface capacity of the solder balls 2 is reasonable.尔Ή·inch·3 in-body bag quantity (both quantitative) welding bag 201206609 2 ball supply path 5 uphill, even if the suction condition is g, the remaining welding ball 2 will not be supplied by the ball supply path 5 The ball discharge passage 6 is connected to the two. Vacuum (4) has electromagnetic opening _2' = empty = top connection / real power source 1 〇 via the suction passage 13 ί _9 of the seven-ball suction mechanism. By the storage of the screen 9. Ball discharge it road 6, = 6 in the other 'welding ball supply device 1, the rabbit is passed through the ball supply passage 5 and introduced into the ball jersey. Table 2 can be shaped by the ball supply hopper 3 to be slightly cylindrically shaped than the ball pocket 4 The cross-sectional area Ai is divided into two. The suction force of the thief ball ί gives the passage 5 filled with the welding ball 2, and can still be two: the ball = the road 5 Μ and the ball is discharged and the ball is fine _===== 201206609 3 times or more ° According to this - the composition 'can be increased to give the ball to the pass. Further, in the present embodiment, the shape of the ball supply passage 5 and the cross section of the yoke passage 6 and the bag 4 are -^+1, but the shape of the heat is not secret. The path = '3 = the paste direction length LQ of the upper path 6 is also preferably the ball discharge pass, f* the operation of the above-described solder ball supply device 1. The electric 11 is adjusted to the pressure or flow of the gas suction of the vacuum source 1G, 4, 〇4, . The larger the area, the stronger the suction force, so the presence of the welding ball 2 == r9 - the welding ball 2 does not fall off = True ii _ electric _ 阙 12, 10 direction suction Hit ball 2 lost to the vacuum source bag 4 through the ball discharge path 6, to (weld) its body weight 'self-ball discharge, the welding ball = give & The receiving position of the welding ball 2 makes it possible to start with the touch of the technology, and the weight of the precursor is given to the bag 4, so that the welding ball 2 of the valley is not the same as the ball. The multi-scale of 2 _ is connected to H^QFF, and the bag 4 overflows to the ball discharge path 6. In the case where there is a large amount of consumption of the ball 2 from the ball supply path 5, the following method is used: 庳·杂 ===== discharge welding - 2 of the pumping path 6 _ catching the ball 2 Supply "The cross-sectional area of the ball supply path 5 201206609 =====(10) Heart_'Other embodiment door 14' is placed in the ball discharge passage closing mechanism when the 4 welding balls 2 are guided to the bag 4 , the welding ball 2 is self-balled and slightly after the lapse of a predetermined time, and in addition, the electromagnetic opening and closing valve 12 can be closed to the ball supply passage 5. The relationship between the two is not particularly limited, and can be performed in any of the cross-sectional areas Ao of 6. T^Ai>Ao>Ai=Ao>Ai<Ao^* The door exit passage 6 is composed of thin hard and hard, so the flexible material ship can be clamped down == but the ball = lose, etc. 6 p bow! In the case of holding, no matter which one does not need to give the ball row A passage 6 completely sealed due to the suction force given to the ball supply passage 5 is given to the ball row ^ ^ ^ ^ ^ ^ can be placed Part of the ball passage 6 is such that it does not completely close the following 'welding ball supply device for the welding ball. ® 4 is to make the balance of the welding ball of the bell-type hybrid 16 / the balance of the ball is: the welding 2 supplied by the welding ball supply device ' is sucked by the suction force of the suction device 21 The ball absorbing body 20 inside the fishing clock opened on the bottom surface is closed on the mask 17 on which the jig is placed, and the suction of the solder ball 2 is released to fall, and the tan ball 2 ^ is placed on the platform 22 The electric power of the substrate 23 is as shown in Fig. 4. The fishing bell type cup 16 is integrally provided with the welding ball supply device j. A ball guide 15 is provided below the ball discharge port 19 of the ball discharge passage 6 of the welding ball supply device 1, and the welding ball 2 is guided so as to be placed on the mask 17 near the opening portion of the 201206609 J-face opening portion of the bell-type ball cup μ. The supplied welding ball Z cover St accumulates. Of course, the ball guide 15 is not necessary. to make. The supply device 1 is also mounted on the touch cup 16 to be constructed.
Hi 16前往拾取焊接球2。 具之遮罩π上^的底關σ部對配置治 貫通孔24，於平:2洛入遮單17之搭載用的 之裝置。 〇上所载置之基板23的電極上搭載焊接球2 形狀為，以與進行方㈣直之方向為長邊方向的 之ί邊；m 朗麟賊絲社型球杯26 用滑軌18°之^槿方往内部之方向)來回移動的移動機構(使 球供給妓1絲於 =3?供給裝置b使其可於盒型球杯26 全域平均地供給 盒型=1，於獅2供給時使 球杯26内供t接表裝置1之下方移動，使焊接球2於盒型 【圖式簡單說明】 =1係表示焊接球供給裝置之說明圖。 圖，開關之開閉絲細焊接__之說明 態。 ”電開閉閥之狀態，（b)顯示關閉電磁開閉閥之狀 之說日m電ϊγ間ί間門之開閉與球袋内焊接球的關係 閉閥閉、閘門開=維。才電磁開閉閥開之狀態，⑼顯示電磁開 11 201206609 圖4係使用釣鐘型球杯之焊接球搭載裝置的說明圖。 圖5係使用盒型球杯之焊接球搭載裝置的說明圖。 【主要元件符號說明】 1焊接球供給裝置 2焊接球 3球供料斗 4球袋 5球供給通路 6球排出通路 7、8偵測感測器 9 篩網 10真空源 11調節器 12電磁開閉閥 13 抽吸通路 14閘門 15球導軌 16 釣鐘型球杯 17遮罩 18滑執 19球排出口 20球吸附體 21抽吸裝置 22 平台 23基板 24貫通孔 26盒型球杯 31連接位置Hi 16 goes to pick up the solder balls 2. The bottom θ portion of the mask π is placed on the through hole 24, and the device for mounting the slab: The welding ball 2 is mounted on the electrode of the substrate 23 placed on the crucible so as to be in the longitudinal direction with respect to the straight direction of the side (4); m lang thief silk type spherical cup 26 uses the sliding rail 18° ^ 槿 往 ) ) ) ) ) 移动 移动 移动 移动 内部 移动 移动 移动 = 移动 = = 供给 供给 供给 供给 供给 供给 供给 供给 供给 供给 供给 供给 供给 供给 供给 供给 供给 供给 供给 供给 供给 供给 供给 供给 供给 供给 供给 供给The inside of the ball cup 26 is moved under the t-contacting device 1 to make the welding ball 2 in the box type. [Illustration of the drawing is simple] =1 is an explanatory view showing the welding ball supply device. Fig., the opening and closing wire of the switch is thinly welded __ The state of the electric opening and closing valve, (b) shows the state of closing the electromagnetic opening and closing valve. The relationship between the opening and closing of the door and the welding ball in the bag is closed, and the gate is opened. (9) Display electromagnetic opening 11 201206609 Fig. 4 is an explanatory view of a welding ball mounting device using a fishing bell type cup. Fig. 5 is an explanatory view of a welding ball mounting device using a box type cup. Component symbol description] 1 welding ball supply device 2 welding ball 3 ball supply hopper 4 ball bag 5 ball supply Road 6 ball discharge passage 7, 8 detection sensor 9 screen 10 vacuum source 11 regulator 12 electromagnetic opening and closing valve 13 suction passage 14 gate 15 ball guide 16 fishing bell type cup 17 cover 18 slipper 19 ball discharge 20 ball absorbing body 21 suction device 22 platform 23 substrate 24 through hole 26 box type cup 31 connection position
Ai球供給通路之剖面積 12 201206609 . Ao球排出通路之剖面積Sectional area of the Ai ball supply passage 12 201206609 . Sectional area of the Ao ball discharge passage
Ap球袋之剖面積 Lo球排出通路之球排出方向長度 R〇球排出通路直徑 13Area of the Ap ball pocket The length of the ball discharge direction of the Lo ball discharge passage R The diameter of the ball discharge passage 13