TWI542434B - Electrically conductive ball supplying device - Google Patents

Description

Conductive ball supply device

The present invention relates to a conductive ball supply device for supplying a conductive ball to a conductive ball mounting mechanism that mounts a conductive ball at a position where a top surface of a mounted object is formed in a predetermined pattern.

In the related art, the conductive ball mounting mechanism in which the conductive ball is placed in a predetermined pattern on the top surface of the object to be mounted is known, for example, in which the conductive ball is adsorbed and held on the bottom surface as shown in Patent Document 1. a mechanism for accommodating a ball absorbing body inside a bell-shaped cup and releasing the conductive ball by dropping it on the arranging jig, and dropping the conductive ball against the disposition jig to mount the conductive ball; or as in Patent Document 2 In the illustrated spherical cup, a plurality of conductive balls are accommodated on the inner bottom surface side, and the conductive ball is dropped by the bottom surface opening portion of the bottom surface of the box-shaped spherical cup while the cartridge-shaped cup is moved. This mechanism is equipped with a conductive ball.

The supply device for supplying the conductive ball to the spherical cup of the mounting mechanism shown in Patent Documents 1 and 2 is as follows. That is, as shown in Patent Document 3, as a solder ball replenishing device, a solder ball stored in a solder ball storage tank is extruded from a tube into a container (ball) by a pressurized gas derived from a pressurized gas source. Pressure gas supply device.

Further, in the conductive ball mounting mechanism of the above-described fishing bell type cup, a welding ball supply device (pressure gas type supply device) as shown in Patent Document 3 is used, and the pressurized gas acts on the welding on the placement jig. The ball disperses the welded ball and cannot supply the welded ball efficiently.

Further, the conductive ball mounting mechanism disclosed in Patent Document 2 generally employs a pressure gas type supply device because it does not have a vacuum suction device that acts on a cartridge type. When the pressure gas type supply device shown in Patent Document 3 is used in this one-box type cup, the welding ball is stirred and moved by the pressure gas in the box type cup, and the ball in the longitudinal direction of the box type cup is made. The distribution is uneven, and the welding ball may be misplaced.

In addition, since the pressure gas type supply device presses the welding ball by the pressure gas, the supply time or pressure of the pressure gas must be controlled by parameters, but since this parameter is controlled by the diameter of the welding ball, whenever This parameter must be adjusted when the diameter of the supplied solder ball is changed.

Further, the amount of extrusion varies depending on the amount of balls (the remaining capacity of the ball) stored in the welded ball storage tank, and the quantitative supply to the cup is difficult.

[Practical Technical Literature]

[Patent Literature]

Patent Document 1 Japanese Patent Laid-Open Publication No. 2008-153336

Patent Document 2 Japanese Patent Laid-Open Publication No. 2007-299836

Patent Document 3 Japanese Patent Laid-Open No. Hei 8-236916

SUMMARY OF THE INVENTION An object of the present invention is to solve the problem of the prior art which occurs due to the residual pressure of a pressurized gas, that is, the dispersion of conductive balls on a part of the ball-mounted mechanism, and the stirring of the ball in one part of the ball-mounted mechanism The conductive ball supply device that mounts the ball without mistake is caused by the uneven phenomenon of the welding ball, and is a conductive ball supply device that can efficiently supply a proper amount of the welded ball.

A conductive ball supply device that supplies a conductive ball to a conductive ball mounting mechanism in which a conductive ball is placed on a top surface of a mounted object in a predetermined pattern, and adopts the following mechanism:

First, there is a ball supply hopper having a conductive ball.

Second, there is a ball pocket that can accommodate a predetermined amount of conductive balls.

Thirdly, there is provided a vacuum suction mechanism for the bag which is connected to the ball suction mechanism.

Fourthly, the vacuum switching mechanism that switches the ON and OFF of the suction state of the vacuum suction mechanism is provided.

Fifth, there is provided a ball supply passage connecting the ball supply hopper and the bag.

Sixth, there is provided a ball discharge passage having a receiving position of the conductive ball connecting the bag and the ball mounting mechanism.

Seventh, it is set that the suction force of the ball supply passage sucked from the vacuum suction mechanism is stronger than the suction force of the ball discharge passage.

Eighth, the vacuum switching mechanism turns ON the suction state of the vacuum suction mechanism, introduces a conductive ball from the ball supply path, and accommodates a predetermined amount of conductive balls in the bag, and then The suction state of the vacuum suction mechanism is OFF, and the conductive ball is discharged from the ball discharge passage to the conductive ball receiving position.

According to a second aspect of the invention, there is provided a conductive ball supply device in which the cross-sectional area of the ball supply passage is smaller than the sectional area of the spherical bag and the sectional area of the ball discharge passage is larger. In addition, the suction force of the ball supply passage caused by the suction by the vacuum suction mechanism of the first invention is set to be stronger than the suction force of the ball discharge passage.

According to a third aspect of the invention, in the first aspect of the invention, a conductive ball supply device for a closing mechanism for closing a ball discharge passage is provided. In addition, the suction force of the ball supply passage caused by the suction by the vacuum suction mechanism of the first invention is set to be stronger than the suction force of the ball discharge passage.

According to the first aspect of the present invention, the suction state of the vacuum suction mechanism is turned ON, and a predetermined amount of conductive balls are accommodated in the bag, and then the suction state is turned OFF, and the conductive ball is turned on. The so-called "gravity drop (natural drop) method" in which the ball discharge passage is discharged to the conductive ball receiving position". Therefore, the conductive ball supply device that does not cause the conductive balls to be dispersed in the arrangement mask due to the residual pressure of the pressurized gas or that causes the conductive balls to be unevenly distributed due to the stirring in the spherical cup is used.

Secondly, since the ball bag capable of accommodating a predetermined amount of conductive balls is provided, even if the time for sucking the conductive balls is extended to a necessary time or longer, the conductive balls having a volume of the bag or more are not supplied to the bag. The supply amount of the ball to the ball mounting mechanism is made constant.

Thirdly, by setting the suction pressure of the vacuum suction mechanism to the suction pressure corresponding to the maximum conductive ball diameter to be used, it is not necessary to adjust the complicated parameters when the conductive ball diameter is changed. .

According to the second aspect of the invention, since the cross-sectional area of the ball supply passage is smaller than the sectional area of the bag and larger than the sectional area of the ball discharge passage, the suction force larger than the ball discharge passage can be given to the ball supply passage. And it is possible to reliably introduce a predetermined amount of conductive balls from the ball supply hopper into the bag.

According to the third aspect of the invention, since the closing mechanism for closing the ball discharge passage is provided, the strong suction force can be reliably imparted to the ball supply passage, so that the conductive ball is introduced into the bag from the ball supply hopper. Become smooth.

Hereinafter, embodiments of the present invention will be described with reference to the embodiments. The embodiment of the conductive ball mounting mechanism of the present invention is a solder ball loading device as shown in Figs. 4 and 5, and Fig. 1 is a welding ball supply device 1 of an embodiment of the conductive ball supplying device of the present invention. First, the outline of the solder ball supply device 1 will be described.

The solder ball supply device 1 is provided with a ball supply hopper 3 in which a plurality of solder balls 2 supplied for mounting are stored in a solder ball loading device as shown in FIGS. 4 and 5. Further, the ball supply hopper 3 is also shown in FIG. The detection sensor 7 for detecting whether the number of the welding balls 2 in the ball supply hopper 3 is filled or the lower portion of the inside of the ball supply hopper 3 is mounted in the upper portion of the inside of the ball supply hopper 3, and the detection ball supply hopper 3 is installed in the lower portion of the inside of the ball supply hopper 3. Whether the number of solder balls 2 is insufficient is detected by the sensor 8. The remaining capacity of the solder balls 2 in the ball hopper 3 is managed by the detecting sensors 7, 8.

The solder ball supply device 1 has a ball pocket 4 that can accommodate the size (volume) of the solder balls 2 in an appropriate supply amount (quantity). The ball pocket 4 is connected to the ball supply passage 5 in a side portion, and the other end of the ball supply passage 5 is connected to the ball supply hopper 3. In the illustrated embodiment, the bag 4 is disposed at a position lower than the ball supply hopper 3, but the cross section of the ball supply path 5 perpendicular to the direction in which the ball moves is a slightly circular shape, and the connection position 31 of the ball supply hopper 3 is 31. Initially, it is connected to the lateral portion of the bag 4 by a position lower than the position of the bag 4. That is, the ball supply path 5 mounts the bag 4 uphill to be connected thereto.

Thereby, the welded ball 2 accommodated in the ball supply hopper 3 is not moved to the bag 4 by the weight of the body. The welding ball 2 is stopped at a position lower than the bag 4 by the movement of the weight of the body. Further, by the upward slope of the ball supply passage 5, even when the suction state is OFF, the excess welded ball 2 does not fall from the ball supply passage 5 to the ball discharge passage 6.

The bag 4 is constituted by a space having a substantially cylindrical shape having a shaft in the vertical direction, and the welding ball 2 is sucked through the ball supply passage 5, and is connected to the vacuum source 10 of the vacuum suction mechanism. The vacuum source 10 has an electromagnetic opening and closing valve 12 and a regulator 11 as a vacuum switching mechanism for switching the suction state to ON and OFF, the latter being provided for adjusting the pressure or flow rate of the suction gas, and the vacuum source 10 is via the suction passage. 13 is connected to the top of the bag 4.

Further, the connection port in the bag 4 and the suction passage 13 is provided to block the ball suction mechanism in order to block the suction of the welding ball 2 to the suction passage 13 side by the suction force of the vacuum source 10. Screen 9. By the presence of the screen 9, the amount of ball supplied can be made a certain amount.

The bottom of the bag 4 is connected to a ball discharge passage 6 having a substantially circular shape in a horizontal cross section. The ball discharge passage 6 is connected to the receiving position of the welding ball 2 of the welding ball mounting device. The receiving position of the solder ball 2 is on the mask 17 adjacent to the outer side of the open bottom portion of the bell-type ball cup 16 in Fig. 4, and the mask 17 on the inner bottom side of the box-shaped ball cup 26 in Fig. 5. In the embodiment, the above position is the receiving position, but it is not limited to this position.

Further, in the solder ball supply device 1, in order to allow the solder ball 2 to pass through the ball supply path 5 from the ball supply hopper 3 and into the ball pocket 4, the sectional area Ai of the ball supply path 5 is formed into a slightly cylindrical space of the ball pocket 4. The cross-sectional area Ap of the horizontal section is small, which is larger than the sectional area Ao of the ball discharge passage 6. By forming the sectional area Ai of the ball supply passage 5 to be larger than the sectional area Ao of the ball discharge passage 6, the suction force imparted to the ball supply passage 5 is larger than the suction force given to the ball discharge passage 6. As a result, even in a state where the ball supply passage 5 is filled with the welding balls 2, the welding balls 2 can be sucked and introduced into the bag 4.

Preferably, the relationship between the sectional area Ai of the ball supply path 5 and the sectional area Ao of the ball discharge path 6 is added, and the ball discharge direction length Lo of the ball discharge path 6 is calculated from the connection portion with the bottom of the bag 4 to The length of the ball discharge port 19 is preferably three times or more the diameter Ro of the ball discharge passage. According to this configuration, the suction force applied to the ball supply passage 5 can be further increased. Further, in the present embodiment, the cross-sectional shape of the ball supply passage 5 perpendicular to the moving direction of the ball and the horizontal cross-sectional shape of the ball discharge passage 6 and the bag 4 are described as being slightly circular, but are not limited thereto. Multi-angle shapes are also available. In this case, the ball discharge direction length Lo of the ball discharge passage 6 is preferably three times or more the width of the ball discharge passage.

Hereinafter, the operation of the above-described solder ball supply device 1 will be described.

First, the pressure or flow rate of the gas suction of the vacuum source 10 is adjusted by the regulator 11, and the electromagnetic opening and closing valve 12 is opened to turn the suction state of the vacuum source 10 ON. As shown in FIG. 2(a), the solder ball 2 is housed (supplied) from the ball supply hopper 3 through the ball supply path 5 into the bag 4 by the suction force of the vacuum source 10. At this time, since the ball supply passage 5 has a larger cross-sectional area and a larger suction force than the ball discharge passage 6, the welding ball 2 can move into the ball supply passage 5. Further, due to the presence of the screen 9, the welded ball 2 is not sucked out of the bag 4 to the suction passage 13 side.

When the welding ball 2 in the bag 4 reaches the predetermined amount, the electromagnetic opening and closing valve 12 is closed, and the suction state of the vacuum source 10 is turned OFF. Therefore, the welding ball 2 loses the suction force in the direction of the vacuum source 10, as shown in FIG. 2(b), the welding ball 2 passes through the ball discharge passage 6 from the bag 4 by the weight of the body, and the welding ball mounting device The receiving position of the solder ball 2 is discharged, and the solder ball 2 is supplied to the solder ball loading device.

Further, since the ball supply path 5 starts from the connection position 31 of the ball supply hopper 3, it passes through a position lower than the height of the bag 4, and is connected to the bag 4 which is higher than the ball supply path 5 via the uphill. The welding ball 2 accommodated in the ball supply hopper 3 is not supplied to the bag 4 by the weight of the body. Therefore, even if the suction state is OFF as described above, the ball 4 has a certain amount of excess welding balls 2 other than the welding ball 2, It does not overflow from the ball supply path 5 to the ball discharge path 6.

In addition, when the welding ball 2 is used in a large amount, the following method is adopted: the ball is introduced into the welding ball 2 and the ball is discharged to the ball discharging passage 6 to discharge the welding ball 2, or by expanding the ball. The size of the bag 4 is increased to increase the amount of ball supplied.

In the above embodiment, in order to make the suction force of the ball supply passage 5 larger than the suction force of the ball discharge passage 6, the supply of the welding ball 2 is performed, so that the sectional area Ai of the ball supply passage 5 is formed into a ball discharge passage. The sectional area of 6 is large. However, as shown in FIGS. 3(a) and (b), the other embodiment may be provided with a shutter 14 as a closing mechanism for closing the ball discharge passage 6, and a ball discharge port 19 provided at the bottom end of the ball discharge passage 6.

The shutter 14 is closed when the welding ball 2 is introduced into the bag 4, and is opened when the welding ball 2 is discharged from the bag 4 to the ball discharge passage 6. The opening timing of the shutter 14 may be slightly after the electromagnetic opening and closing valve 12 is closed, or may be after the electromagnetic opening and closing valve 12 is closed and after a predetermined period of time has elapsed.

By closing the shutter 14, a larger suction force can be imparted to the ball supply passage 5. In this case, the relationship between the sectional area Ai of the ball supply passage 5 and the sectional area Ao of the ball discharge passage 6 is not particularly limited, and may be any of Ai>Ao, Ai=Ao, and Ai<Ao.

In addition, in FIG. 3, since the ball discharge passage 6 is made of a hard material, the member of the shutter 14 is provided in the ball discharge port 19, but the ball discharge passage 6 is made of a flexible material such as rubber, although As shown, a closing mechanism for holding and closing the ball discharge passage 6 may be provided.

In the case of this clamping, it is not necessary to completely close the ball discharge passage 6, and the suction force applied to the ball supply passage 5 is larger than the suction force given to the ball discharge passage 6, so even if the ball is opened It does not matter whether one of the discharge passages 6 is partially closed.

Hereinafter, the state of use of the solder ball supply device 1 of the solder ball mounting device will be described. 4 is an explanatory view of a welding ball mounting device that uses a fishing bell type cup 16 to hold the welding ball 2 supplied from the welding ball supply device 1 by suction force of the suction device 21. The ball absorbing body 20 inside the fishing bell type cup 16 whose bottom surface is open is closed by the suction device 21 on the mask 17 on which the jig is placed, and the adsorption of the welding ball 2 is released to fall, and the welding ball 2 falls into the cover. The through hole 24 for mounting the cover 17 is a device for mounting the solder ball 2 on the electrode of the substrate 23 placed on the stage 22.

In this case, as shown in FIG. 4, the fishing bell type cup 16 is integrally provided with the welding ball supply device 1. A ball guide 15 is provided below the ball discharge port 19 of the ball discharge passage 6 of the welding ball supply device 1, and the welding ball 2 is guided to concentrate on the mask 17 near the open bottom portion of the bell type ball 16. The supplied solder balls 2 are guided by the ball guide 15 and accumulated on the mask 17. Of course, the ball guide 15 is not essential.

Further, it is not necessary to attach the welding ball supply device 1 to the bell-type ball cup 16. The solder ball supply device 1 can also be fixedly disposed at a predetermined position, in which the solder ball 2 is supplied to the mask 17, and the bell-type ball cup 16 is moved to the pick-up solder ball 2.

Fig. 5 is an explanatory view of a solder ball loading device using a box type cup 26, in which the inner bottom side of the box type cup 26 houses a plurality of solder balls 2, and the box type ball cup 26 is moved by the box. The bottom surface opening portion of the bottom surface of the spherical cup 26 is supplied with the solder ball 2 to the mask 17 on which the jig is placed, so that the solder ball 2 falls into the through hole 24 for mounting the mask 17, and is placed on the stage 22 A device for soldering the balls 2 is mounted on the electrodes of the substrate 23.

The box type cup 26 is generally in the shape of a longitudinal direction in a direction perpendicular to the direction of progress. In the box type cup 26, a moving mechanism (a mechanism using the slide rail 18) for moving the welding ball supply device 1 back and forth in the longitudinal direction of the box type cup 26 (in the direction from the front to the inside in Fig. 5) is used. The solder balls 2 are supplied equally. The solder ball supply device 1 is attached to the cartridge type cup 26 by the moving mechanism. Of course, a plurality of welding ball supply devices 1 are provided without providing a moving mechanism, so that the welding balls 2 can be uniformly supplied to the entire shape of the cartridge type cup 26.

Further, the solder ball supply device 1 may be fixedly provided, and when the solder ball 2 is supplied, the cartridge type cup 26 is moved below the solder ball supply device 1, and the solder ball 2 is supplied into the cartridge type cup 26.

1. . . Welding ball supply device

2. . . Welding ball

3. . . Ball hopper

4. . . Ball bag

5. . . Ball supply path

6. . . Ball discharge path

7, 8. . . Detection sensor

9. . . Screen

10. . . Vacuum source

11. . . Regulator

12. . . Electromagnetic on-off valve

13. . . Suction channel

14. . . Gate

15. . . Ball guide

16. . . Fishing bell cup

17. . . Mask

18. . . Slide rail

19. . . Ball discharge

20. . . Ball sorbent

twenty one. . . Suction device

twenty two. . . platform

twenty three. . . Substrate

twenty four. . . Through hole

26. . . Box type cup

31. . . Connection location

Ai. . . Cross-sectional area of the ball supply passage

Ao‧‧‧ sectional area of the ball discharge passage

Ap‧‧‧ sectional area of the bag

The length of the ball discharge direction of the Lo‧‧‧ ball discharge path

Ro‧‧‧Ball discharge passage diameter

Fig. 1 is an explanatory view showing a welding ball supply device.

2 is an explanatory view showing the relationship between the opening and closing of the electromagnetic opening and closing valve and the welding ball in the bag, wherein (a) shows a state in which the electromagnetic opening and closing valve is opened, and (b) shows a state in which the electromagnetic opening and closing valve is closed.

3 is an explanatory view showing the relationship between the opening and closing of the electromagnetic opening and closing valve and the gate and the welding ball in the bag, wherein (a) shows the state in which the shutter is closed and the electromagnetic opening and closing valve is opened, and (b) the state in which the electromagnetic opening and closing valve is closed and the gate is opened. .

Fig. 4 is an explanatory view of a welding ball mounting device using a fishing bell type cup.

Fig. 5 is an explanatory view of a solder ball mounting device using a box type cup.

1. . . Welding ball supply device

3. . . Ball hopper

4. . . Ball bag

5. . . Ball supply path

6. . . Ball discharge path

7, 8. . . Detection sensor

9. . . Screen

10. . . Vacuum source

11. . . Regulator

12. . . Electromagnetic on-off valve

13. . . Suction channel

19. . . Ball discharge

31. . . Connection location

Ai. . . Cross-sectional area of the ball supply passage

Ao. . . Cross-sectional area of the ball discharge passage

Ap. . . Cross-sectional area of the bag

Lo. . . Ball discharge direction ball discharge direction length

Ro. . . Ball discharge passage diameter

Claims (2)

A conductive ball supply device for supplying a conductive ball to a conductive ball mounting mechanism, wherein the conductive ball is mounted on a top surface of the mounted object in a predetermined pattern, and the conductive ball is supplied The device comprises: a ball supply hopper for storing a conductive ball; a ball bag for accommodating a predetermined amount of conductive balls; a vacuum suction mechanism connected to the bag through a blocking ball suction mechanism; and a vacuum switching mechanism for the vacuum suction The suction condition of the mechanism is switched between ON and OFF; the ball supply passage connects the ball supply hopper and the bag; and the ball discharge passage connects the conductive ball receiving position of the bag and the ball-carrying mechanism; wherein the conductivity The ball supply device is characterized in that: the sectional area of the ball supply passage is set to be "smaller than the sectional area of the bag and larger than the sectional area of the ball discharge passage", so that "the vacuum is drawn from the vacuum" The suction force of the ball supply passage caused by the suction of the suction mechanism is stronger than the suction force of the ball discharge passage; by the vacuum switching mechanism, the suction state of the vacuum suction mechanism is turned ON, The ball supply passage introduces a conductive ball, and accommodates a predetermined amount of conductive balls in the bag, and then the suction state of the vacuum suction mechanism is OFF, and the conductive ball is discharged from the ball discharge path to the conductive ball. Accept the location. The conductive ball supply device of claim 1, wherein a closing mechanism for closing the ball discharge passage is provided.