201205162 六、發明說明： 【發明所屬之技術領域】 本發明有關於-種背储組，尤其是有關於—種具有靜電 防護措施的背光模組。 【先前技術】 隨著電子技術的不斷發展，目前，液晶顯示器（Liquid Crystal Display ’ LCD)因為具有體積小以及重量輕的優點， 已漸漸取代傳統體積較為龐大的陰極射線顯示器（Cath〇de Ray Tube’ CRT) ’進而普遍地被社會大眾所使用，尤其已廣 #泛應驗監視器、筆記本電腦、數位相機及投影機等電子產 品。LCD模組一般包括液晶顯示面板、背光模組及印刷電路 板（PCB)。其中’背光模組是LCD的重要組成部分，因此， LCD的市場需求必然會帶動背光模組的需求持續成長。 在背光模組中’因發光二極管(light-emitting di〇de，led) 背光源具有壽命長、彩色表現能力強及綠色環保等優點，使得 L E D背光模組具有巨大的市場前景，也將逐漸成為背光模組的 主流趨勢。現今的LED背光模組包括LED燈條（lightbar)， Φ 且LED燈條包括電路基板及設於電路基板上的若干LED。其 中，電路基板上設置有與若干LED對應的LED連接墊（pad)， 以連接並固定LED元件。201205162 VI. Description of the Invention: [Technical Field] The present invention relates to a back storage group, and more particularly to a backlight module having electrostatic protection measures. [Prior Art] With the continuous development of electronic technology, liquid crystal display (LCD) has gradually replaced the traditional bulk cathode ray display (Cath〇de Ray Tube) because of its small size and light weight. 'CRT' is generally used by the public, especially the electronic products such as monitors, notebook computers, digital cameras and projectors. LCD modules generally include a liquid crystal display panel, a backlight module, and a printed circuit board (PCB). Among them, the backlight module is an important part of the LCD. Therefore, the market demand for LCD will inevitably drive the demand for backlight modules to continue to grow. In the backlight module, the light-emitting diode (LED) backlight has the advantages of long life, strong color performance and green environmental protection, which makes the LED backlight module have a huge market prospect and will gradually become The mainstream trend of backlight modules. Today's LED backlight modules include LED light bars, Φ and the LED light strips include a circuit substrate and a plurality of LEDs disposed on the circuit substrate. Wherein, an LED connection pad corresponding to a plurality of LEDs is disposed on the circuit substrate to connect and fix the LED elements.
f SI 然而，任一機種的LCD模組，由於在組裝時會有靜電的 產生，例如是人員或是機台在操作時可能產生的高壓靜電，因 此常會導致LED受損，甚至透過燈條的電路導致pCB板上元 件的損傷。目前的普遍做法為在LED燈條的電路基板週邊設 計一防護帶（guard band) ’並增加接地引腳，把燈條上的靜 電帶到PCB板的接地端。但，隨著電子裝置輕、薄、短、小 的發展超勢’考慮到LED燈條設計的情況，由於LED連接墊 3 201205162 與電路基板的邊緣相當接近，因此防護帶可能無法有效的遏止 靜電放電（Electro-Static discharge，ESD)，而損傷燈條上的 LED及PCB板上的組件。 且’、、 【發明内容】 本發明的目的在於，提供一種背光模組，能有效解決esd 損傷燈條上的LED及PCB板上的元件之問題。 、 本發明的目的及解決其技術問題是採用以下的技術方 來實現的。 本發明提供一種背光模組，其包括光源模組、主電路板、 _軟性印刷電路板以及m持紐模_支架。支架由導體材料製 成。光源模組包括光源電路基板以及固設於光源電路基板上的 多個光源，且光源電路基板有多個接地墊。支架用以固持光源 模組並電性連接至前述接地墊其中的一部份。軟性印刷電路板 電性連接於别述接地墊其中的一部份與主電路板的接地端之 間。 上述背光模組中’與支架電性連接的接地墊以及與軟性電 路板電性連接的接地墊有一部分是電性導通的。 瞻上述背光模組中，接地墊與支架通過連接件相連接。其 中，連接件可為導電膠帶或導體。 、 上述背光模組中，接地墊與支架還可以是直接接觸，例如 支架的部分位置直接接觸接地墊。 ^ 進一步地，支架可為反射罩，光源模組利用反射罩進行定 背光模組除了將光源模組的部分接地墊與支架相連接之 外’也將光源模組的部分接地墊與主電路板的接地端通過軟性 印刷電路板做電性連接，如此可使光源模組上的靜電接地，有f SI However, LCD modules of any model have static electricity generated during assembly, such as high-voltage static electricity that may be generated by personnel or machine during operation, which often causes damage to the LEDs, even through the light bar. The circuit causes damage to components on the pCB board. It is currently common practice to design a guard band around the circuit substrate of the LED strip and add a ground pin to bring the static current on the strip to the ground of the PCB. However, with the development of the light, thin, short and small electronic devices, considering the design of the LED light bar, since the LED connection pad 3 201205162 is quite close to the edge of the circuit substrate, the protective tape may not effectively suppress the static electricity. Electro-Static discharge (ESD), which damages the LEDs on the light strip and the components on the PCB. And the present invention aims to provide a backlight module that can effectively solve the problem of LEDs on the esd damage light bar and components on the PCB board. The object of the present invention and solving the technical problems thereof are achieved by the following technical means. The invention provides a backlight module, which comprises a light source module, a main circuit board, a _soft printed circuit board and a m holding mold _ bracket. The bracket is made of a conductor material. The light source module includes a light source circuit substrate and a plurality of light sources fixed on the light source circuit substrate, and the light source circuit substrate has a plurality of ground pads. The bracket is for holding the light source module and electrically connecting to a part of the grounding pad. The flexible printed circuit board is electrically connected between a portion of the other ground pad and the ground of the main circuit board. A portion of the backlight module in which the ground pad electrically connected to the bracket and the ground pad electrically connected to the flexible circuit board are electrically conductive. In the above backlight module, the ground pad and the bracket are connected by a connecting member. The connector may be a conductive tape or a conductor. In the above backlight module, the ground pad and the bracket may also be in direct contact, for example, the partial position of the bracket directly contacts the ground pad. ^ Further, the bracket can be a reflector, and the light source module uses the reflector to fix the backlight module. In addition to connecting part of the grounding pad of the light source module to the bracket, the partial grounding pad of the light source module and the main circuit board are also The grounding end is electrically connected through a flexible printed circuit board, so that the static electricity on the light source module can be grounded.
i SJ 4 201205162 效保護光源模組的元件。 +本發明提供另_種背絲組，其包括光賴組以及固持光 源模、、且的支架。支架為導體材料製成。光源模組包括光源電路 基板以及m⑤於光源電路基板上的辣光源，且光源電路基板 有多個接地墊。這些接地墊與支架相電性連接。 背光模組將光源模組的接地墊與支架相連接，由於支架為 導體’，支架透過光賴組的接地墊而得以吸收統模組上的靜 電，藉此保護光源模組上的元件不受靜電而受損傷。 本發明提供另一種背光模組，其包括光源模組、主電路板 以及軟性印刷電路板。光源模組包括光源電路基板以及固設於 光源電路基板上的乡個綠，且杨電絲板有乡健地墊。 主電路板包括一個接地端，且接地端通過軟性印刷電路板而與 光源電路基板上的接地墊電性連接。 #光模組藉由軟性印刷電路板而使光源模組的接地墊與 主電路板的接地端電性相連接，從而使光源模組上的靜電接 地’並藉此保護光源模組元件。 ^本發明提供另一種背光模組。此背光模組包括支架、光源 模組、連接件、軟性電路板及主電路板。光源模組設置於支架 上並包括光源電路基板與固設於光源電路基板上的多個光 源，且光源電路基板具有多個接地墊。連接件一端連接於支架 上，另一端則與接地墊之一部分連接以使支架與這部份的接地 墊形成電性連接，並讓支架、連接件與光源電路基板間形成第 —接地導電路徑。軟性電路板一端連接於另一部份的接地墊， 另一端則連接於主電路板的接地端，而且電路板、軟性電路板 與光源電路基板間形成第二接地導電路徑。 背光模組除了將光源模組的其中一部分接地墊與支架相 201205162 連接之外，也通過軟性印刷電路板將光源模組的另一部分接地 墊與主電路板的接地端做電性連接，如此可使光源模組上的靜 電接地以保護光源模組的元件。 為讓本發明之上述和其他目的、特徵和優點能更明顯易 懂，下文特舉較佳實施例，並配合所附圖式，作詳細說明如下。 【實施方式】 請參閱圖1 ’本發明一實施例所述背光模組的實施例包括 光源模組11、用於固持光源模組u的支架13以及連接件15。 在本實施例中，光源模組11包括光源電路基板11〇及固設於 • 光源電路基板uo上的多個光源112，其中該些光源包括多個 發光二極體(LED)燈。光源電路基板n〇為狹長形板狀體，且 於光源電路基板110表面上設有多個連接墊114和接地墊 116。每個光源112的正負兩極對應裝配於一對連接墊114上， 光源112通過連接墊114與光源電路基板π〇内部的電路相連 接。 較佳地，支架13為利用導體材料所製成，如銅、鐵等。 支架13例如為反射罩，通常光源模組η利用反射罩進行定 φ 位’從而於組裝時能夠較精準地使光源模組11的發光面對準 電子裝置的導光板（圖未示）。在本實施例中，支架13為l 型框體，其包括底壁132及側壁134。光源模組11裝配於底 壁132上並靠近側壁Π4，從而使光源模組11被容置並固持 於支架13内。支架π的側壁134包括一個貼近光源模級η 的第一表面1341。可以理解，光源模組U可以黏貼的方式固 定於支架13内。 連接件15為導體，其連接了部份的接地墊116與支架13 以使兩者之間電性相連《在本實施例中，連接件15為導電膠 201205162 帶或導電荡片，其連接於光源電路基板110表面上的接地堅 116和支架13側壁134的第一表面1341上，從而使光源電路 基板110的至少一部份的接地墊116通過連接件15與支架 電性連接。藉由上述的結構，支架13、連接件15與>光源電路 基板110的接地塾116將組合成一個接地導電路和^ 請參閱圖2 ’其為本發明背光模組的另一實施例。本實施 例包括了前述的光源模組U、主電路板17與軟性電路板19。 同樣的，光源模組11包括了光源電路基板11〇及固設於光源 電路基板110上的多個光源112，而且光源電路基板11〇上還 _有多個接地墊116。此外，主電路板17上有一個接地端172， 而軟性印刷電路板19則直接電性連接光源模組u的光源電路 基板110上的接地墊116與主電路板π的接地端172。藉由 上述的連接關係，主電路板17、軟性電路板19與光源電路基 板110就可以形成另一條接地導電路徑。接下來請參閱圖3， =圖所示之實施例為圖1與圖2所示之實施例的結合。特別的 疋，在光源電路基板11〇上的多個接地墊116中，連接件μ 電性連接了其中一部份的接地墊116，另外有一部份的接地墊 • 116是與軟性電路板19相電性連接。如此一來，此實施例就 同時擁有由支架13、連接件15與光源電路基板11〇的接地墊 116所組合成的第一個接地導電路徑，以及由主電路板17、軟 性電路板19與光源電路基板110所形成的第二個接地導電路 徑。 當然’兩個接地導電路徑所使用到的接地墊116可以包含 一個以上重複的接地墊116，或者兩個接地導電路徑所使用到 的接地墊116之間彼此電性連接，如此一來就可以接通第一接 地導電路徑與第二接地導通路徑而形成另一個第三接地導電 201205162 此外，上述本發明所提供的實施例也可以配合習知技術使 用。舉例來說，光源電路基板U0上可以如同習知技術一般設 置有接地線圈。此接地線圈環繞於光源電路基板110之周邊， 且與接地墊116電性連結。如此一來就可以使接地墊U6與接 地線圈間形成第四接地導電路徑。 頰似的，第四接地導電路徑也可以與前述的第一、第二或 第三接地導電路徑電性連接而形成另一種接地導電路徑設計。i SJ 4 201205162 Effectively protect the components of the light source module. + The present invention provides another type of backing wire set comprising a light-receiving group and a holder for holding the light source mold. The bracket is made of a conductor material. The light source module includes a light source circuit substrate and a spicy light source on the light source circuit substrate, and the light source circuit substrate has a plurality of ground pads. These ground pads are electrically connected to the bracket. The backlight module connects the grounding pad of the light source module to the bracket, and since the bracket is a conductor, the bracket absorbs static electricity on the module through the grounding pad of the light group, thereby protecting components on the light source module from Static electricity is damaged. The present invention provides another backlight module including a light source module, a main circuit board, and a flexible printed circuit board. The light source module comprises a light source circuit substrate and a green color fixed on the light source circuit substrate, and the Yang wire board has a home floor mat. The main circuit board includes a grounding end, and the grounding end is electrically connected to the grounding pad on the light source circuit substrate through the flexible printed circuit board. The optical module electrically connects the ground pad of the light source module to the ground end of the main circuit board by using a flexible printed circuit board, thereby electrically grounding the light source module and thereby protecting the light source module component. The present invention provides another backlight module. The backlight module comprises a bracket, a light source module, a connector, a flexible circuit board and a main circuit board. The light source module is disposed on the bracket and includes a light source circuit substrate and a plurality of light sources fixed on the light source circuit substrate, and the light source circuit substrate has a plurality of ground pads. One end of the connecting member is connected to the bracket, and the other end is connected to a portion of the grounding pad to electrically connect the bracket to the grounding pad of the portion, and form a first-ground conductive path between the bracket, the connecting member and the light source circuit substrate. One end of the flexible circuit board is connected to another part of the ground pad, and the other end is connected to the ground end of the main circuit board, and a second ground conductive path is formed between the circuit board, the flexible circuit board and the light source circuit substrate. In addition to connecting a part of the grounding pad of the light source module with the support phase 201205162, the backlight module electrically connects another part of the grounding pad of the light source module with the grounding end of the main circuit board through the flexible printed circuit board, so that Ground the static electricity on the light source module to protect the components of the light source module. The above and other objects, features and advantages of the present invention will become more <RTIgt; Embodiments of the present invention include a light source module 11, a bracket 13 for holding a light source module u, and a connector 15. In this embodiment, the light source module 11 includes a light source circuit substrate 11 and a plurality of light sources 112 fixed on the light source circuit substrate uo, wherein the light sources include a plurality of light emitting diode (LED) lamps. The light source circuit substrate n is an elongated plate-like body, and a plurality of connection pads 114 and a ground pad 116 are provided on the surface of the light source circuit substrate 110. The positive and negative poles of each light source 112 are correspondingly mounted on a pair of connection pads 114, and the light source 112 is connected to the circuit inside the light source circuit substrate π〇 through the connection pads 114. Preferably, the bracket 13 is made of a conductor material such as copper, iron or the like. The bracket 13 is, for example, a reflector. Generally, the light source module η is fixed by the reflector φ position, so that the light-emitting surface of the light source module 11 can be accurately aligned with the light guide plate (not shown) of the electronic device during assembly. In the present embodiment, the bracket 13 is an l-shaped frame including a bottom wall 132 and side walls 134. The light source module 11 is mounted on the bottom wall 132 and adjacent to the side wall Π4, so that the light source module 11 is housed and held in the bracket 13. The sidewall 134 of the stent π includes a first surface 1341 that is proximate to the source mode η. It can be understood that the light source module U can be fixed in the bracket 13 in a manner of being attached. The connecting member 15 is a conductor, which is connected to a part of the grounding pad 116 and the bracket 13 to electrically connect the two. In the embodiment, the connecting member 15 is a conductive adhesive 201205162 tape or a conductive pad, which is connected to The grounding pad 116 on the surface of the light source circuit substrate 110 and the first surface 1341 of the sidewall 134 of the bracket 13 are such that at least a portion of the ground pad 116 of the light source circuit substrate 110 is electrically connected to the bracket through the connecting member 15. With the above structure, the bracket 13, the connecting member 15 and the grounding pole 116 of the light source circuit substrate 110 will be combined into a grounding conductor and a second embodiment of the backlight module of the present invention. This embodiment includes the above-described light source module U, main circuit board 17, and flexible circuit board 19. Similarly, the light source module 11 includes a light source circuit substrate 11A and a plurality of light sources 112 fixed on the light source circuit substrate 110, and the light source circuit substrate 11 has a plurality of ground pads 116 thereon. In addition, the main circuit board 17 has a grounding end 172, and the flexible printed circuit board 19 is directly electrically connected to the grounding pad 116 on the light source circuit substrate 110 of the light source module u and the grounding end 172 of the main circuit board π. With the above connection relationship, the main circuit board 17, the flexible circuit board 19 and the light source circuit substrate 110 can form another ground conductive path. Referring next to Figure 3, the embodiment shown in Figure is a combination of the embodiments shown in Figures 1 and 2. In particular, in the plurality of ground pads 116 on the light source circuit substrate 11, the connection member μ is electrically connected to a portion of the ground pad 116, and another portion of the ground pad 116 is associated with the flexible circuit board 19. Phase electrical connection. In this way, the embodiment has the first ground conductive path combined by the bracket 13, the connecting member 15 and the ground pad 116 of the light source circuit substrate 11 , and the main circuit board 17 and the flexible circuit board 19 . A second ground conductive path formed by the light source circuit substrate 110. Of course, the ground pad 116 used by the two ground conductive paths may include more than one repeated ground pad 116, or the ground pads 116 used by the two ground conductive paths are electrically connected to each other, so that they can be connected. The first ground conductive path and the second ground conductive path are formed to form another third ground conductive 201205162. Furthermore, the embodiments provided by the present invention described above can also be used in accordance with conventional techniques. For example, a grounding coil can be disposed on the light source circuit substrate U0 as in the prior art. The grounding coil surrounds the periphery of the light source circuit substrate 110 and is electrically connected to the ground pad 116. In this way, a fourth grounded conductive path can be formed between the ground pad U6 and the ground coil. Buccal, the fourth grounded conductive path may also be electrically connected to the aforementioned first, second or third grounded conductive path to form another grounded conductive path design.
當靜電出現在光源模組11上，靜電能量會開始累積並尋 求一個適當的管道進行放電。而一個與累積靜電之間的電位差 較大且易於導電的對象將會是靜電放電的較佳管道。因此，當 根據上述實施例而形成接地導電路徑的時候，所累積的靜電; 有很大的機率透過接地導電路徑來進行放電。以第一接地導4 路徑來看，由於支架13相當於—做容量的電·備裝置， 所以在光賴組11上所帛積的靜電錢賴支架13電性 的接地塾16而被職贱架13。使时可以藉由移除週期性 的將支架13上的額外電荷而保持支㈣在靜電放電方面的 效。用於移除支架13上的額外電荷的方法有很多，舉例來說， =等，支架U上多餘的電荷與空氣中失帶的· 中和，也可以將支架13週期性的接地 ^ 施例中所提及的第三接地導電路徑。 线使用則遠實 當採用第三接地導電路徑時，光源模組 13上的額外電荷可以藉由前述的第二 、*電或支架 :電路板丨9而被引導到主電路板17的接地端： 另一方面，當採用第四接地導電路徑時，被釋放到接地線 201205162 圈（接地線圈相當於另一個電荷儲備裝置）上的靜電會成為接 地線圈上的額外電荷，而此額外電荷同樣可以與空氣中炎帶的 =^行自财和，或者透過其他的導電路徑進行接地以完成 靜電中和的目的。 综上所述，本發明將光源模組Π的接地墊116八 架U、主電路板π的接地端172或其他金屬連接1伟、 ，模組11上的靜電得以接地’絲保護光賴組 文靜電放電效賴破壞。 的70件不When static electricity is present on the light source module 11, the electrostatic energy begins to accumulate and seeks an appropriate conduit for discharge. An object with a large potential difference from accumulated static electricity and which is easy to conduct will be a better conduit for electrostatic discharge. Therefore, when the grounded conductive path is formed according to the above embodiment, the accumulated static electricity has a large probability of being discharged through the grounded conductive path. In view of the first grounding guide 4 path, since the bracket 13 is equivalent to the electric and standby device for the capacity, the static electricity smashed on the light-receiving group 11 is electrically grounded 塾16 and is employed. Shelf 13. It is possible to maintain the effect of the branch (4) on electrostatic discharge by removing the extra charge on the holder 13 periodically. There are many methods for removing the extra charge on the holder 13, for example, =, etc., the excess charge on the holder U is neutralized with the neutralization in the air, and the holder 13 can be periodically grounded. The third grounded conductive path mentioned in the above. When the line is used, when the third grounded conductive path is adopted, the extra charge on the light source module 13 can be guided to the ground of the main circuit board 17 by the aforementioned second, *electric or bracket: circuit board 丨9. : On the other hand, when the fourth grounded conductive path is used, the static electricity that is released to the grounding line 201205162 (the grounding coil is equivalent to another charge storage device) becomes the extra charge on the grounding coil, and this extra charge can also be It is grounded with the air in the air zone, or through other conductive paths to complete the static neutralization. In summary, the present invention connects the grounding pad 116 of the light source module 八 eight U, the grounding end 172 of the main circuit board π or other metal connections, and the static electricity on the module 11 is grounded. The electrostatic discharge effect of the text is destroyed. 70 pieces are not
本發施例揭露如上，然、其並非用以限定 月任何热^此技藝者，在不脫離本發明之 内’當可作些許之更動與潤飾，因此本 ；：耗， 附之申請專利範圍所界定者為準。 當視後 【圖式簡單說明】 的光源模狀背域_較佳實施方式 實施例之背域組的切、模組、支 〇 圖3是根據本發明另一 架及主電路板的裝配示意圖 【主要元件符號說明】 11 :光源模組 110 :光源電路基板 112 :光源 114 :連接墊 116 :接地塾 13 :支架 201205162 132 :底壁 134 :側壁 1341 :第一表面 15 :連接件 17 :主電路板 172 :接地端 19 :軟性印刷電路板The present invention is disclosed above, but it is not intended to limit any heat of the art, and may be used to make some changes and refinements without departing from the invention, and therefore; The definition is final. </ RTI> </ RTI> </ RTI> </ RTI> <RTIgt; </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> [Main component symbol description] 11 : Light source module 110 : Light source circuit substrate 112 : Light source 114 : Connection pad 116 : Grounding 塾 13 : Bracket 201205162 132 : Bottom wall 134 : Side wall 1341 : First surface 15 : Connector 17 : Main Circuit board 172: ground terminal 19: flexible printed circuit board