201219896 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種顯示裝置，特別是關於一種以外框膠 帶取代金屬外框的顯示裝置。 【先前技術】 液晶顯示器通常包括液晶面板模組、光源模組以及驅動 電路模組三大部份。在液晶面板模組（Liquid Crystal Module，LCM)封裝中，液晶面板與驅動電路模組之電連接 係採用各種不同的封裝技術，例如：Chip 〇n B〇arc^c〇B)、 捲帶接合（Tape Automatic Bonding，TAB)、玻璃覆晶（Chip201219896 VI. Description of the Invention: [Technical Field] The present invention relates to a display device, and more particularly to a display device in which an outer frame tape is substituted for a metal frame. [Prior Art] A liquid crystal display usually includes three parts of a liquid crystal panel module, a light source module, and a driving circuit module. In a liquid crystal module (LCM) package, the electrical connection between the liquid crystal panel and the driver circuit module is carried out using various packaging technologies, such as: Chip 〇n B〇arc^c〇B), tape bonding (Tape Automatic Bonding, TAB), glass flip chip (Chip
On Glass，C0G)以及薄膜覆晶（Chip 〇n FUm，c〇f)等技 術。COB封裝是—種早期的IC封裝技術，其體積大、成 本高。TAB封裝是後續發展出的體積小、重量輕的技術， 隨後又發展出COG封裝技術，玻璃阻抗高、無法承載被動 兀件。在輕量及薄型封裝的需求下，業界研發出更高密度 之驅動1C封裝技術，即更細線化、彎折性優良且可承載被 動元件之驅動1C之c〇F封裝技術。目前，在業界對c〇F 的需求漸增的情況下，已有從COG製程向COF製程轉變 的趨勢#而-般顯示器中的軟性電路板並無善加利用其 可撓性’而無法使顯示器額緣或厚度尺寸縮小。 /此外’驅動電路模組中的驅動晶片通常容易受到外界的 "響&帛丨要影響的原因有短路或因液晶顯示器是屬 於一㈣電流高電麼之轄射源，故液晶顯示器之電磁波干 擾主要疋以電場為主。在液晶顯示器運作或傳送過程中， 201219896 常會因靜電電壓之產生而發生靜電釋放（ESD)之現象，而 此釋放出之靜電常會造成液晶顯示器中之液晶模組或驅動 電路模組的電路損壞。一般通常會使用0.1毫米厚的絕緣 i來避免短路或高壓靜電所造成的永久性損壞，進而使液 日日顯示器之產DO可罪度提升。然而絕緣片本身的厚度也會 增加顯不器的厚度尺寸，因此不利於輕量化及薄型化的需 求。 如圖1所示的先前技術中，顯示器10包含一背光模組 1卜一液晶顯示模組12、一組相對立設置的金屬外框13、 一軟性電路段14、—印刷電路板15、―驅動晶片17以及 一絕緣片16。液晶顯示模組12係設置於背光模組丨丨之 上，且液晶顯示模組12藉由軟性電路段14電性連接至印 刷電路板15。此外，為了避免印刷電路板15短路或因靜 電放電而損壞，通常需要絕緣片16覆蓋而隔絕金屬外框 13的影響^由於金屬外框13與絕緣片16的疊加厚度及重 • 量過於厚重，因此也可能造成顯示器10貼合良率較差。 综上所述，先前技術的金屬外框13無法符合現今薄型化 的需求，而傳統的絕緣片也有相同的問題。 【發明内容】 本發明之一目的係提供一新穎且改良的顯示裝置，其具 有一外框膠帶可取代一金屬外框（bezel)及絕緣片，而有助 於縮小顯示裝置厚度的尺寸。 本發明之另一目的係提供一新穎且改良的顯示裝置，其 具有一軟性電路段可彎折貼附印刷電路板於背光模組之第 201219896 表面’因❿有助於縮小顯示裝置額緣(。utline)的尺寸 為達上述目的’本發明揭示__種顯示裝置包含—背光模 、卫液S日模、’且、驅動電路模組以及-外框膠帶。背光模 ”且3有f纟面與一第二表面，而液晶模組設置於第一 表面上。驅動電路模組含有_印刷電路板、—軟性電路段 與-驅動晶片，軟性電路段電性輕合液晶模組且彎折電性 連接在背光模組之第二表面的印刷電路板，而驅動晶片則On Glass, C0G) and Chip 〇n FUm (c〇f). The COB package is an early IC packaging technology that is bulky and costly. The TAB package is a small-volume, lightweight technology that has been developed in the future. Later, COG packaging technology was developed, which has high glass impedance and cannot carry passive components. In the demand for lightweight and thin packages, the industry has developed a higher-density driver 1C package technology, which is a thinner, more flexible, and capable of carrying the drive 1C c〇F package technology. At present, in the industry, the demand for c〇F is increasing, there has been a trend from COG process to COF process. The soft circuit board in the display does not make good use of its flexibility. The display's fore edge or thickness is reduced. / In addition, the driver chip in the driver circuit module is usually susceptible to external short-circuiting, and there is a short circuit or because the liquid crystal display belongs to one (four) current high-power source, so the liquid crystal display Electromagnetic wave interference is mainly caused by electric fields. During the operation or transmission of the liquid crystal display, 201219896 often causes electrostatic discharge (ESD) due to electrostatic voltage generation, and the static electricity released often causes damage to the circuit of the liquid crystal module or the driving circuit module in the liquid crystal display. Generally, 0.1 mm thick insulation is used to avoid permanent damage caused by short circuit or high voltage static electricity, which in turn increases the viciousness of liquid DO display. However, the thickness of the insulating sheet itself also increases the thickness of the display, which is disadvantageous for the need for weight reduction and thinning. In the prior art as shown in FIG. 1 , the display 10 includes a backlight module 1 , a liquid crystal display module 12 , a set of oppositely disposed metal frames 13 , a flexible circuit segment 14 , a printed circuit board 15 , and The wafer 17 and an insulating sheet 16 are driven. The liquid crystal display module 12 is disposed on the backlight module ,, and the liquid crystal display module 12 is electrically connected to the printed circuit board 15 by the flexible circuit segment 14. In addition, in order to avoid short circuit of the printed circuit board 15 or damage due to electrostatic discharge, it is generally required to cover the insulating sheet 16 to insulate the metal outer frame 13 because the thickness and weight of the metal outer frame 13 and the insulating sheet 16 are too thick. Therefore, it is also possible that the display 10 has a poor fit yield. In summary, the prior art metal frame 13 cannot meet the needs of today's thinning, and the conventional insulating sheet has the same problem. SUMMARY OF THE INVENTION One object of the present invention is to provide a novel and improved display device having an outer frame tape that can replace a metal bezel and an insulating sheet to help reduce the thickness of the display device. Another object of the present invention is to provide a novel and improved display device having a flexible circuit segment that can be bent and attached to a printed circuit board on the surface of the backlight module at 201219896, which helps to reduce the display device's front edge ( The size of the utline is for the above purpose. The present invention discloses a display device including a backlight module, a swatch, a drive circuit module, and an outer frame tape. The backlight module has a surface and a second surface, and the liquid crystal module is disposed on the first surface. The driving circuit module includes a printed circuit board, a flexible circuit segment and a driving chip, and a flexible circuit segment electrical Lightly aligning the liquid crystal module and bending the printed circuit board electrically connected to the second surface of the backlight module, and driving the chip
設置於印刷電路板上。而外框膠帶則貼附液晶模組之顯示 區域以外，並覆蓋驅動晶片以供避免電路因靜電釋放或短 路而損壞。 【實施方式】 在下文中本發明的實施例係配合所附圓式以闡述細節。 參照圖2所示’顯示裝置20包含背光模組21、液晶模組 22、驅動電路模組23以及外框膠帶％。背光模組21含有 第一表面（出光面）2n與第二表面212。在此實施例中，液 晶模組22設置於第一表面211上，此處所言之「於第一表 面211上」’包含但不限於液晶模組22底面直接與背光模 組21相鄰接’亦可因應不同的設計規格而使液晶模組22 與背光模組21之間存在不同的光學元件或其他模組，因此 不論液晶模組22與背光模組21是直接或間接相鄰，液晶 模組22皆設置於背光模組21之第一表面211上。 如圖2所示之實施例中，驅動電路模組23含有軟性電路 段24與印刷電路板25及驅動晶片27 ^軟性電路段一 知電性耦合液晶模組22而另一端則電性耦合（或連接）於印 -6 · 201219896 刷電路板25，由於軟性電路段24的可撓性較佳，因此可 沿液晶模組22與背光模組21的侧緣貼附，彎折並使印刷 電路板25順利地貼附於第二表面212。在此實施例中，印 刷電路板25較佳係直接貼附於第二表面212上。然而在另 一實施例中，印刷電路板25與第二表面212之間亦可存在 其他兀件或模組，而造成印刷電路板25間接貼附於第二表 面212上。驅動晶片27則設置於印刷電路板乃上。由於 軟性電路段24之可撓性使得印刷電路板25可被貼附於第 一表面212，進而縮小顯示裝置2〇的額緣（〇uUine)尺寸。 相較於某些先前技術，若無軟性電路段或軟性電路段長度 不夠則印刷電路板勢必要設置於液晶模組的一側，進而造 成顯示裝置的額緣尺寸增大，不利於顯示裝置的薄型化。 因此，在此實施例中，驅動電路模組23之軟性笮路段24 及其彎折方式可縮小顯示裝置2〇之額緣尺寸。 參照圖2的實施例所示，液晶模組22含有一顯示區域 221，顯示區域221係顯示裝置2〇主要顯示影像的區域。 相較於先前技術的圖1所示，顯示區域以外的區域主要是 由金屬外框13所覆蓋，金屬外框13主要是提供顯示裝置 2〇整體支撐外部形狀的支撐元件，然而為了避免因短路或 因靜電放電造成驅動晶片27或印刷電路板25的損壞，通 常先前技術係利用絕緣片16由金屬外框13的一側，貼附 至背光模組11第二表面以覆蓋並保護印刷電路板丨5及驅 動晶片17。然而，絕緣片16與金屬外框13皆會造成顯示 裝置的額緣尺寸增加，而不利於薄型化。 201219896 為了解決此難題，本發明使用外框膠帶（bezel tape)26來 取代先前技術中的金屬外框13與絕緣片16，因此本發明 之顯不裝置20的額緣尺寸可進一步地縮小，此外，外框膠 帶26對於一般尺寸的顯示裝置而言，亦可提供足夠的支撐 力來維持其外部形狀，及固定背光模組2丨、液晶模組22 及驅動電路模組23。再者’由於外框膠帶26也具備絕緣 的特性’故其亦可取代絕緣片而覆蓋並保護印刷電路板25 及驅動晶片27。因此，外框膠帶26可貼附液晶模組22之 顯示區域221以外的區域（如顯示區域221之周邊及背光模 組3 1之侧邊）’並覆蓋保護印刷電路板25以避免印刷電路 板25或驅動晶片27的短路或因靜電放電造成的損壞，並 達成本發明欲使顯示裝置20薄型化的目的。換言之，本發 明的目的在於使軟性電路段24彎折貼附於印刷電路板25 於第二表面212 ’避免印刷電路板25與驅動晶片27設置 於液晶模組22與背光模組21的一側，以供縮小顯示裝置 20之額緣寬度。 具體而言，參照圖3所示之實施例，顯示裝置3〇包含背 光模組3 1 '液晶模組32、驅動電路模組3 3以及外框膠帶 36。在此實施例中’驅動電路模組33包含軟性電路段34 與印刷電路板35及驅動晶片37 ’驅動電路模組33的結構 及功能與上述實施例所述的驅動電路模組23相同。在此實 施例中’主要是背光模組31另包含導光板313與光源 314又奇光模組31尚可包含反光片、均光片、增亮膜及 偏光片等其他光學元件（圖未示光源314設置於導光板 201219896 313之一侧，且導光板313設置於液晶模組32下方。此處 所言之「液晶模組下方」，包含但不限於液晶模組32底面 直接與導光板313頂面相鄰接，亦可因應不同的設計規格 而使液晶模組32與導光板313之間存在不同的元件或其他 模組’因此不論液晶模組3 2與導光板313是直接或間接相 鄰’導光板3 13皆設置於液晶模組32下方。在此實施例中， 軟性電路段3 4没置於背光模組3 1 —側，並沿導光板313 之侧邊向下延伸至印刷電路板35。換言之，軟性電路段34 • 與光源314分別設置於導光板313的相異侧。在此實施例 中，光源314包含但不限於發光二極體（LED)光源或冷陰 極管’亦可為OLED光源或其他可提供相似功能的光源。 本發明之技術内容及技術特點已揭示如上，然而熟悉本 項技術之人士仍可能基於本發明之教示及揭示而作種種不 为離本發明精神之替換及修飾。因此，本發明之保護範圍 應不限於實施例所揭示者，而應包括各種不背離本發明之 替換及修飾’並為以下之申請專利範圍所涵蓋。 【圖式簡單說明】 圖1為一先前技術之顯示器剖面圖； 圖2為本發明之一實施例顯示裝置之剖面圖；以及 圖3為本發明之另一實施例顯示裝置之剖面圖。 【主要元件符號說明】 10 顯示器 11 背光模組 201219896Set on the printed circuit board. The outer frame tape is attached to the outside of the display area of the liquid crystal module and covers the drive chip to prevent the circuit from being damaged by electrostatic discharge or short circuit. [Embodiment] Hereinafter, embodiments of the present invention are incorporated in the accompanying drawings to explain details. Referring to Fig. 2, the display device 20 includes a backlight module 21, a liquid crystal module 22, a drive circuit module 23, and an outer frame tape %. The backlight module 21 includes a first surface (light-emitting surface) 2n and a second surface 212. In this embodiment, the liquid crystal module 22 is disposed on the first surface 211. The term "on the first surface 211" includes, but is not limited to, the bottom surface of the liquid crystal module 22 is directly adjacent to the backlight module 21. Different optical components or other modules may exist between the liquid crystal module 22 and the backlight module 21 according to different design specifications, so that the liquid crystal module 22 and the backlight module 21 are directly or indirectly adjacent to each other, the liquid crystal mode The groups 22 are disposed on the first surface 211 of the backlight module 21. In the embodiment shown in FIG. 2, the driving circuit module 23 includes a flexible circuit segment 24 and a printed circuit board 25 and a driver chip 27, a flexible circuit segment, an electrically coupled liquid crystal module 22, and the other end is electrically coupled ( Or connected to the -6 - 201219896 brush circuit board 25, because the flexibility of the flexible circuit segment 24 is better, it can be attached along the side edge of the liquid crystal module 22 and the backlight module 21, bending and making the printed circuit The plate 25 is smoothly attached to the second surface 212. In this embodiment, the printed circuit board 25 is preferably attached directly to the second surface 212. In yet another embodiment, other components or modules may be present between the printed circuit board 25 and the second surface 212, causing the printed circuit board 25 to be indirectly attached to the second surface 212. The driver chip 27 is disposed on the printed circuit board. Due to the flexibility of the flexible circuit segment 24, the printed circuit board 25 can be attached to the first surface 212, thereby reducing the size of the front edge of the display device 2. Compared with some prior art, if there is no flexible circuit segment or the length of the flexible circuit segment is insufficient, the printed circuit board is necessarily disposed on one side of the liquid crystal module, thereby causing an increase in the front edge size of the display device, which is disadvantageous to the display device. Thin. Therefore, in this embodiment, the soft section 24 of the driving circuit module 23 and the bending manner thereof can reduce the size of the front edge of the display device 2. Referring to the embodiment of Fig. 2, the liquid crystal module 22 includes a display area 221 which is an area in which the display device 2 mainly displays images. Compared with the prior art of FIG. 1, the area outside the display area is mainly covered by the metal outer frame 13, and the metal outer frame 13 mainly provides the support member for the overall support outer shape of the display device 2, however, in order to avoid short circuit Or the damage of the driving chip 27 or the printed circuit board 25 due to electrostatic discharge. Generally, the prior art uses the insulating sheet 16 from one side of the metal frame 13 to the second surface of the backlight module 11 to cover and protect the printed circuit board.丨5 and drive wafer 17. However, both the insulating sheet 16 and the metal outer frame 13 cause an increase in the size of the front edge of the display device, which is disadvantageous for thinning. 201219896 In order to solve this problem, the present invention uses a bezel tape 26 in place of the metal outer frame 13 and the insulating sheet 16 of the prior art, so that the front edge size of the display device 20 of the present invention can be further reduced. The outer frame tape 26 can also provide sufficient supporting force to maintain the outer shape of the display device of a general size, and fix the backlight module 2, the liquid crystal module 22 and the driving circuit module 23. Further, since the outer frame tape 26 also has an insulating property, it can cover and protect the printed circuit board 25 and the driving wafer 27 instead of the insulating sheet. Therefore, the outer frame tape 26 can be attached to an area other than the display area 221 of the liquid crystal module 22 (such as the periphery of the display area 221 and the side of the backlight module 31) and cover the printed circuit board 25 to avoid the printed circuit board. 25 or short circuit of the driving wafer 27 or damage due to electrostatic discharge, and achieve the object of the present invention to make the display device 20 thin. In other words, the purpose of the present invention is to bend the flexible circuit segment 24 to the printed circuit board 25 on the second surface 212 to prevent the printed circuit board 25 and the driving chip 27 from being disposed on the side of the liquid crystal module 22 and the backlight module 21. For narrowing the margin of the display device 20. Specifically, referring to the embodiment shown in FIG. 3, the display device 3A includes a backlight module 3 1 'the liquid crystal module 32, a driving circuit module 33, and an outer frame tape 36. In this embodiment, the structure and function of the drive circuit module 33 including the flexible circuit segment 34 and the printed circuit board 35 and the drive chip 37' drive circuit module 33 are the same as those of the drive circuit module 23 described in the above embodiment. In this embodiment, the backlight module 31 further includes a light guide plate 313 and a light source 314. The odd light module 31 may further include other optical components such as a reflective sheet, a homogenizing sheet, a brightness enhancing film, and a polarizing plate (not shown). The light source 314 is disposed on one side of the light guide plate 201219896 313, and the light guide plate 313 is disposed under the liquid crystal module 32. The "under the liquid crystal module" as used herein includes, but is not limited to, the bottom surface of the liquid crystal module 32 directly adjacent to the light guide plate 313. Adjacent to the surface, different components or other modules may exist between the liquid crystal module 32 and the light guide plate 313 according to different design specifications. Therefore, whether the liquid crystal module 32 and the light guide plate 313 are directly or indirectly adjacent to each other The light board 3 13 is disposed under the liquid crystal module 32. In this embodiment, the flexible circuit segment 34 is not placed on the side of the backlight module 31, and extends down the side of the light guide plate 313 to the printed circuit board 35. In other words, the flexible circuit segment 34 and the light source 314 are respectively disposed on different sides of the light guide plate 313. In this embodiment, the light source 314 includes, but is not limited to, a light emitting diode (LED) light source or a cold cathode tube OLED light source or other available </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; The scope of the invention is not limited by the scope of the invention, and should be construed as being included in the scope of the following claims. 2 is a cross-sectional view of a display device according to an embodiment of the present invention; and FIG. 3 is a cross-sectional view of a display device according to another embodiment of the present invention. [Description of Main Components] 10 Display 11 Backlight Module 201219896
12 液晶顯不模組 13 金屬外框 14 軟性電路段 15 印刷電路板 16 絕緣片 17 驅動晶片 20 顯示裝置 21 背光模組 211 第一表面 212 第二表面 22 液晶模組 221 顯不區域 23 驅動電路模組 24 軟性電路段 25 印刷電路板 26 外框膠帶 27 驅動晶片 30 顯示裝置 31 背光模組 313 導光板 314 光源 32 液晶模組 33 驅動電路模組 34 軟性電路段 201219896 35 印刷電路板 36 外框膠帶 37 驅動晶片12 LCD display module 13 Metal frame 14 Flexible circuit segment 15 Printed circuit board 16 Insulation sheet 17 Driver wafer 20 Display device 21 Backlight module 211 First surface 212 Second surface 22 Liquid crystal module 221 Display area 23 Drive circuit Module 24 Flexible circuit segment 25 Printed circuit board 26 Frame tape 27 Drive wafer 30 Display device 31 Backlight module 313 Light guide plate 314 Light source 32 Liquid crystal module 33 Drive circuit module 34 Flexible circuit segment 201219896 35 Printed circuit board 36 Frame Tape 37 drive wafer
-11-11