TW201204797A - Adhesive composition, connecting structure and fabricating method thereof, and use of adhesive composition - Google Patents

Adhesive composition, connecting structure and fabricating method thereof, and use of adhesive composition Download PDF

Info

Publication number
TW201204797A
TW201204797A TW100119004A TW100119004A TW201204797A TW 201204797 A TW201204797 A TW 201204797A TW 100119004 A TW100119004 A TW 100119004A TW 100119004 A TW100119004 A TW 100119004A TW 201204797 A TW201204797 A TW 201204797A
Authority
TW
Taiwan
Prior art keywords
adhesive composition
circuit member
acrylate
resin
connection
Prior art date
Application number
TW100119004A
Other languages
Chinese (zh)
Other versions
TWI445789B (en
Inventor
Hiroyuki Izawa
Shigeki Katogi
Sunao Kudou
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW201204797A publication Critical patent/TW201204797A/en
Application granted granted Critical
Publication of TWI445789B publication Critical patent/TWI445789B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/06—Polyurethanes from polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/67—Unsaturated compounds having active hydrogen
    • C08G18/671—Unsaturated compounds having only one group containing active hydrogen
    • C08G18/672—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/75—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic
    • C08G18/751—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring
    • C08G18/752—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group
    • C08G18/753—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group
    • C08G18/755—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group and at least one isocyanate or isothiocyanate group linked to a secondary carbon atom of the cycloaliphatic ring, e.g. isophorone diisocyanate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/75—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic
    • C08G18/758—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing two or more cycloaliphatic rings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C09J171/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L24/80 - H01L24/90
    • H01L24/92—Specific sequence of method steps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2471/00—Presence of polyether
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/13117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/13124—Aluminium [Al] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/13138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/13139—Silver [Ag] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/13138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/13144—Gold [Au] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/13138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/13147—Copper [Cu] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/13138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/13155—Nickel [Ni] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/13163—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
    • H01L2224/13164—Palladium [Pd] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H01L2224/274—Manufacturing methods by blanket deposition of the material of the layer connector
    • H01L2224/2743—Manufacturing methods by blanket deposition of the material of the layer connector in solid form
    • H01L2224/27436—Lamination of a preform, e.g. foil, sheet or layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/29101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199—Material of the matrix
    • H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/29338—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/29339—Silver [Ag] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/29338—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/29344—Gold [Au] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/29338—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/29347—Copper [Cu] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/29338—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/29355—Nickel [Ni] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/29386—Base material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2224/29387—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/29386—Base material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2224/29388—Glasses, e.g. amorphous oxides, nitrides or fluorides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/2939—Base material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29399—Coating material
    • H01L2224/294—Coating material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/29438—Coating material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/29439—Silver [Ag] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29399—Coating material
    • H01L2224/294—Coating material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/29438—Coating material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/29444—Gold [Au] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29399—Coating material
    • H01L2224/294—Coating material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/29438—Coating material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/29447—Copper [Cu] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29399—Coating material
    • H01L2224/294—Coating material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/29438—Coating material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/29455—Nickel [Ni] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29399—Coating material
    • H01L2224/2949—Coating material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/921—Connecting a surface with connectors of different types
    • H01L2224/9211—Parallel connecting processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01025—Manganese [Mn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0103—Zinc [Zn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01045—Rhodium [Rh]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01049—Indium [In]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01073—Tantalum [Ta]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01077—Iridium [Ir]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections

Abstract

This invention provides an adhesive composition for connecting a first circuit part having a first connecting terminal on a main surface and a second circuit part having a second connecting terminal on a main surface, and the first circuit part and/or second circuit part include substrates having thermal plastic resin with a glass transition temperature of 200 DEG C or less. The adhesive composition includes (a) a thermal plastic resin, (b) a radical polymerization compound, (c) a radical polymerization initiator and (d) a vinyl compound having phosphoryl group, and (b) the radical polymerization compound includes a urethane (meth)acrylate having a critical surface tension of 25 to 40 mN/m.

Description

201204797 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種黏著劑組成物、連接結構體、連 接結構體的製造方法以及黏著劑組成物的應用。 【先前技術】 於半導體元件及液晶顯示元件中，為了使元件中的各 種構件結合的目的’自先前以來使用各種黏著劑組成物。 對黏著劑的要求是以黏著性為代表，涉及耐熱性、高溫高 濕狀態下的可靠性等。另外’用於黏著的被黏附體是以印 刷配線板或聚醯亞胺（polyimide )、聚對苯二曱酸乙二酉旨 (polyethylene terephthalate，PET )、聚碳酸酯 (polycarbonate，PC )、聚萘二曱酸乙二酉旨（p〇lyethylene naphthalate，PEN )等有機基材為代表，使用銅、紹等金 屬或ITO (indium tin oxide，銦與錫的複合氧化物）、IZ〇 (indium zinc oxide，銦與辞的複合氧化物）、siN、Si〇2 等具有多種多樣的表面狀態的基材，因此需要根據各被黏 附體來進行黏著劑組成物的分子設計。另外，近年來，隨 著搭載有半導體元件及液晶顯示元件的電子設備的薄型 化，成為被黏附體的基材亦要求薄型化。 —f先前以來’上述半導體元件或液晶顯示元件用的黏 著劑是使用利用高黏著性且表現出高可靠性的環氧樹脂的 ，硬化，樹脂（例如參照專利文獻η。樹脂的構成成分通 $使用環氧樹脂、與環氧樹脂具有反應性的賴脂等硬化 劑、促進環氧樹脂與硬化劑的反應的熱潛在性觸媒。熱潛 4201204797 VI. Description of the Invention: [Technical Field] The present invention relates to an adhesive composition, a bonded structure, a method of producing the joined structure, and an application of the adhesive composition. [Prior Art] In the semiconductor element and the liquid crystal display element, various adhesive compositions have been used since the purpose of bonding various members in the element. The requirements for the adhesive are represented by adhesion, and are related to heat resistance, reliability in a high temperature and high humidity state, and the like. In addition, the adherend for adhesion is a printed wiring board or polyimide, polyethylene terephthalate (PET), polycarbonate (PC), poly An organic substrate such as p〇lyethylene naphthalate (PEN) is used as a representative, and a metal such as copper or ITO or ITO (indium tin oxide, a composite oxide of indium and tin), IZ〇 (indium zinc) is used. A substrate having a wide variety of surface states, such as oxide, indium, and composite oxide, siN, and Si〇2, requires molecular design of the adhesive composition in accordance with each adherend. In addition, in recent years, with the reduction in the thickness of electronic devices in which semiconductor elements and liquid crystal display elements are mounted, the substrate to be adhered is also required to be thinner. - "Before, the adhesive for the above-mentioned semiconductor element or liquid crystal display element is an epoxy resin which exhibits high adhesion and exhibits high reliability, and is cured. (For example, refer to Patent Document η. The composition of the resin is $ A hardening agent such as an epoxy resin, a lyophilized resin reactive with epoxy resin, or a thermal latent catalyst that promotes the reaction between an epoxy resin and a hardener.

X X201204797 >蜀媒疋在至溫專儲藏溫度下不反應而在加熱時表現出 1¾反應丨生的物^ ’成為決定硬化溫度及硬化速度的重要因 素，f黏著劑的於室溫下的儲藏穩定性及加熱時的硬化速 3觀點而言，使用各種化合物。實際步驟中的硬化條件 是藉由在170t〜250t的溫度下硬化H、時〜3小時 獲得所需的黏著。 古然而’隨著最近的半導體元件的高集積化、液晶元件 的冋精細化，TL件間及配線間的間距狹小化，存在藉由硬 化時的加熱而產生對周邊構件造成不良影響的顧慮。進而 為了低f本化’必需提高產量，要求更低溫且短時間的硬 化、，換言之，要求低溫下快速硬化的黏著。為了達成該低 /m速硬化，必需使用活化能低的熱潛在性觸媒，但 具室溫附近的儲藏穩定性。 一兼 如上所述中’將丙燁酸醋衍生物或曱基丙稀酸醋衍生 物等自由基聚合性化合物與作為自由基聚合起始劑的過 化，併用的自由基硬化型黏著劑受到關注。自由基硬化型 黏著劑由於作為反應活性種的自由基f有反紐 短時間硬化（例如參照專利文獻2)'然而，自由基硬 黏著劑由於加熱時的硬化收社，故而與使用 情況相比較’黏著強度差。對於上述黏著強度的降低，提 出有藉由醚鍵來賦忖撓性，改善黏著強度的劑 照專利文獻3、專利文獻4)。另外，亦提出有 二 分散包含橡膠㈣性材料的應力吸t粒子而實現^二 的改善的黏著劑（參照專利文獻5)。 ·者強又 201204797 先前技術文獻 專利文獻 專利文獻1 :日本專利特開平M13480號公報 專利文獻2 :日本專利特開2〇〇2_2〇3427號公報 專利文獻3 :日本專利第3522634號公報 專利文獻4 :日本專利特開2〇〇2 285128號公報 專利文獻5:曰本專利第3477367號公報 然而，自由基硬化型黏著劑由於以低溫、短時間而硬 化，故而難以充分獲得對於聚醯亞胺、PET、pc、pEN等 有機基材或ITO、IZO、SiN、Si02等無機基材的潤濕性。 例如，即便使用上述專利文獻3〜專利文獻5中記載的方 法，亦未獲得對上述有機基材、無機基材的充分潤濕性， 產生黏著強度降低的問題。另外，伴隨成為被黏附體的上 述有機基材、無機基材的薄型化，更需要黏著劑組成物的 可撓性化或延伸，但上述專利文獻3、專利文獻4中記載 的方法中，未對黏著劑組成物獲得充分的可撓性或延伸， 產生黏著強度降低的問題。 【發明内容】 因此本發明的目的在於提供一種在低溫、短時間的 硬=條件I亦可獲得優_減強度，且於長咖的可靠 性試驗（高溫高濕試驗）後亦可維㈣定的龍（黏著強 度或連接電阻）的黏著劑喊物，使㈣黏著劑組成物的 電路構件的連接結制、連接結碰的製造綠以及黏著 劑組成物的應用。 6 201204797ι 為了達成上述目的’本發明提供一種黏著劑組成物（第 1黏著劑組成物），用於將主面上具有第一連接端子的第一 电路構件、與主面上具有第二連接端子的第二電路構件連 接，上述黏著劑組成物含有（a)熱塑性樹脂、（b)自由基 聚合性化合物、（C)自由基聚合起始劑、及（d)具有填酸 基的乙烯基化合物，並且（b)自由基聚合性化合物包含具 有20 mN/m〜40 mN/m的臨界表面張力的胺基曱酸酯（曱 基）丙烯酸 g旨（urethane (meth)acrylate )。 上述第1黏著劑組成物藉由含有上述各成分，並且（b) 自由基聚合性化合物包含具有20mN/m〜4〇mN/m的臨界 表面張力的胺基曱酸酯（曱基）丙烯酸酯，則對聚醯亞胺、 PET、PC、PEN 等有機基材或 ITO、IZO、SiN、Si〇2 等無 機基材的潤濕性提高，可進行低溫硬化下的黏著，可使電 路構件間的黏著強度提高《另外，即便於長時間的可靠性 試驗後亦可維持穩定的性能。 本發明的第1黏著劑組成物較佳為，胺基曱酸酯（曱基) 丙烯酸酯的25t下的黏度為600 Pa.s〜50〇〇 Pa.s。藉由胺 基曱酸g旨（甲基)丙烯酸_坑下的黏度在上述範^内， 可獲得適度的㈣性，减潤祕，並可提高電路構件間 的黏著強度。 另外，本發明的第1黏著劑組成物較佳為，胺基甲酸 醋（曱基)⑽酸醋的重量平均分子量為1〇〇〇〇卩上且小於 25000。藉由胺基曱酸酯（曱基)丙烯酸酯的重量平均分子量 在上述範圍内，而對黏著劑組成物賦予適度的可撓性，電 201204797 χ- Α 路構件間_著強度提高，可獲得優異的連接可靠性β 本發明的第1黏著劑組成物較佳為，斷裂伸長率為 300%〜5GG%。藉由斷裂伸長率在上述範圍内而對黏著 f组成物賦予充分的可撓性，電路構件_黏著強度提 尚，可獲得優異的連接可靠性。 本發明提供-種黏著劑組成物（第2黏著劑組成物） 用於將主面上具有第—連接端子的第—電路構件、與主语 上具有第二連接端子的第二電路構件連接，上述黏著劑每 成物含有⑴熱随樹脂、㈦自由基聚合性化合物、及 (c)自由絲合起始冑，（b)自由絲合性化合物包含啦 基甲酸醋（甲基)丙_醋，且斷裂伸長率為期％〜5_ c 上述第2黏著劑組成物藉由含有上述各成分，而且⑴ 合性化合物包含胺基甲酸醋（甲基旨，且 =裂伸長率在上述範_，而賦予充分的可撓性，可追隨 被黏附體（聚醯·、PET、pc、pEN等）的變形，因此 電路構件間的黏著強度提高，可獲得優異的連接可靠性。 =發_第2㈣聽祕擁為更含有⑷具有鱗 乙稀基化合物。藉由含有⑷#有顧基的乙烯基 ，合物’可提高對金餘材_著性。另外，可獲 =:ΓΙΖΟ等所構成的連接端子的電路構件: 佳為H 著劑組成物及/或第2黏著劑組成物輕 2，【00 c下的儲藏彈性模數為〇 5 Mpa〜5 Mpa 4，藉由2〇(TC下的儲藏彈性模數在上 』 8 201204797 具充分的可撓性與交聯密度，緩和黏著劑組成物的被黏附 體與黏著劑組成物界面的應力。因此，不僅提高電路構件 間的黏著強度，而且即便於長時間的可靠性試驗後亦可維 持穩定的性能。 另外，本發明的第1黏著劑組成物及/或第2黏著劑組 f物較佳為，（a)熱塑性樹脂含有選自由苯氧基樹脂、聚 胺基甲酸酯樹脂、聚酯胺基甲酸酯樹脂、丁醛樹脂、丙烯 1¼月曰、及聚酸亞胺樹脂所組成組群中的至少1種。藉由 含有上述樹脂作為（a)熱塑性樹脂，則黏著劑組成物4耐 熱性、黏著性進一步提高。 另外，本發明的第1黏著劑組成物及/或第2黏著劑組 成物較佳為更含有（e)導電性粒子。藉由含有（e)導電 性粒子，可對黏著劑組成物賦予良好的導電性或者異向導 電性，因此可更適錢於具有連接端子的f路構件彼^的 黏著用途等。另外’可更充分崎低經由上述第丨黏著劑 組成物及/或第2黏著劑組成物*電性連接的電路構件的X X201204797 > 蜀 疋 不 不 不 至 至 至 至 至 至 至 至 至 至 至 至 至 至 至 至 至 至 至 至 至 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 ' ' ' ' ' ' ' ' ' ' ' Various compounds were used from the viewpoint of storage stability and curing rate at the time of heating. The hardening conditions in the actual step were obtained by hardening H at a temperature of 170 t to 250 t for 〜3 hours. However, with the recent increase in the integration of semiconductor elements and the refinement of the liquid crystal element, the pitch between the TL members and the wiring is narrow, and there is a concern that the surrounding members are adversely affected by the heating at the time of hardening. Further, in order to reduce the yield, it is necessary to increase the yield, and it is required to be hardened at a lower temperature and for a shorter period of time, in other words, adhesion which is rapidly hardened at a low temperature is required. In order to achieve this low/m speed hardening, it is necessary to use a thermal latent catalyst having a low activation energy, but has a storage stability near room temperature. As described above, the radically polymerizable compound such as a propionate vinegar derivative or a mercapto acrylate derivative is used as a radical polymerization initiator, and a radical hardening type adhesive is used. attention. The radical-curable adhesive has a short-time hardening of the radical f as a reactive species (for example, see Patent Document 2). However, since the radical hard adhesive is cured by heating, it is compared with the use. 'The adhesion strength is poor. For the reduction of the above-mentioned adhesive strength, there is proposed a method of imparting flexibility by an ether bond and improving the adhesive strength. Patent Document 3 and Patent Document 4). Further, there has been proposed an adhesive which is obtained by dispersing a stress-absorbing t-particle containing a rubber (tetra) material and achieving improvement (see Patent Document 5). Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. Japanese Patent Laid-Open Publication No. Hei. No. 2,477,128. However, since the radical-curable adhesive is hardened at a low temperature for a short period of time, it is difficult to sufficiently obtain a polyimine. Wetability of organic substrates such as PET, pc, and pEN or inorganic substrates such as ITO, IZO, SiN, and SiO 2 . For example, even if the method described in Patent Document 3 to Patent Document 5 is used, sufficient wettability to the organic base material or the inorganic base material is not obtained, and the problem that the adhesive strength is lowered is caused. In addition, in the method described in Patent Document 3 and Patent Document 4, the method of the above-described Patent Document 3 and Patent Document 4 is not required, as the thickness of the organic substrate or the inorganic substrate to be adhered is reduced. Adequate flexibility or elongation of the adhesive composition results in a problem of reduced adhesive strength. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a low-temperature, short-time hard=condition I that can also obtain an excellent-decrease strength, and can also be maintained after a reliability test (high temperature and high humidity test) of a long coffee. The adhesive of the dragon (adhesive strength or connection resistance) makes the connection of the circuit components of the (4) adhesive composition, the manufacturing green of the connection, and the application of the adhesive composition. 6 201204797ι In order to achieve the above object, the present invention provides an adhesive composition (first adhesive composition) for using a first circuit member having a first connection terminal on a main surface and a second connection terminal on a main surface The second circuit member is connected, and the adhesive composition contains (a) a thermoplastic resin, (b) a radical polymerizable compound, (C) a radical polymerization initiator, and (d) a vinyl compound having an acid group. And (b) the radically polymerizable compound contains an urethane (meth)acrylate having a critical surface tension of 20 mN/m to 40 mN/m. The first adhesive composition contains the above components, and (b) the radically polymerizable compound contains an amino phthalate acrylate having a critical surface tension of 20 mN/m to 4 〇 mN/m. In addition, the wettability of an organic substrate such as polyimide, PET, PC, PEN, or an inorganic substrate such as ITO, IZO, SiN, or Si〇2 is improved, and adhesion under low-temperature hardening can be performed, and circuit components can be interposed. The adhesion strength is improved. In addition, stable performance can be maintained even after a long period of reliability test. The first adhesive composition of the present invention preferably has a viscosity at 25t of an amino phthalate acrylate of 600 Pa.s to 50 Å Pa.s. By the amino acid g acid g (meth)acrylic acid _ pit viscosity within the above range, a moderate (four) property can be obtained, the moisture is reduced, and the adhesion strength between circuit members can be improved. Further, the first adhesive composition of the present invention preferably has a weight average molecular weight of urethane (mercapto) (10) acid vinegar of 1 Å and less than 25,000. By the weight average molecular weight of the amino phthalate acrylate being within the above range, the adhesive composition is given a moderate flexibility, and the electric strength is improved between the components of the 201204797 χ-Α Excellent connection reliability β The first adhesive composition of the present invention preferably has an elongation at break of 300% to 5 GG%. When the elongation at break is within the above range, sufficient flexibility is imparted to the adhesive composition, and the circuit member_adhesive strength is improved, and excellent connection reliability can be obtained. The present invention provides an adhesive composition (second adhesive composition) for connecting a first circuit member having a first connection terminal on a main surface, and a second circuit member having a second connection terminal on a subject, Each of the adhesive contains (1) heat with a resin, (7) a radically polymerizable compound, and (c) a free silk starting ruthenium, and (b) a free silk compound comprising a benzyl acetonate (methyl) propyl vinegar, And the elongation at break is %~5_c. The second adhesive composition contains the above components, and (1) the compound contains amino carboxylic acid vine (methyl, and the elongation at break is in the above-mentioned range). Sufficient flexibility, which can follow the deformation of the adherend (poly 醯, PET, pc, pEN, etc.), so the adhesion strength between the circuit components is improved, and excellent connection reliability can be obtained. = _ 2 (4) (4) A compound having a quaternary ethylene compound. By containing a vinyl group of (4)#, the compound can improve the balance of the gold material. In addition, a circuit for connecting terminals such as ΓΙΖΟ can be obtained. Component: Jia H composition and/or 2 The composition of the adhesive is light 2, and the storage elastic modulus under [00 c is 〇5 Mpa~5 Mpa 4, by 2〇 (the storage elastic modulus under TC is above) 8 201204797 has sufficient flexibility and The cross-linking density moderates the stress at the interface between the adherend of the adhesive composition and the adhesive composition. Therefore, not only the adhesion strength between the circuit members is improved, but also stable performance can be maintained even after a long-term reliability test. Further, it is preferable that the first adhesive composition and/or the second adhesive composition f of the present invention contain (a) the thermoplastic resin contains a phenoxy resin, a polyurethane resin, or a polyester amine group. At least one of a group consisting of a formate resin, a butyral resin, a propylene resin, and a polyimine resin. The heat resistance of the adhesive composition 4 is obtained by containing the above resin as the (a) thermoplastic resin. Further, the first adhesive composition and/or the second adhesive composition of the present invention preferably further contains (e) conductive particles. By containing (e) conductive particles, it is possible to Adhesive composition imparts good electrical conductivity or Since it is electrically conductive, it can be more suitable for the adhesive use of the f-way member having the connection terminal, etc. Further, it can be more sufficiently low through the above-mentioned second adhesive composition and/or second adhesive composition* Sexually connected circuit components

另外’本發明提供-種電路構件的連接結構體 主面上具有第一連接端子的第一電路構件、與主面上且 第二連接端子的第二電路構件及連接構件，並且 I 連接端子及第二連接端子對向的方式配置第—電路 第二電路構件，其中包含上述第i黏著劑組成物及 黏著劑組成物的連接構件介於第—電路構件及第二=2 件之間，而且第-連接端子及第二連接端子電性連接，^ 201204797 -電路構件及/或第二電路構件是由包含_轉移溫 200 C以下的熱塑性樹脂的基材所構成。 又為 如上所述的連接結構體由於將本發明的上述 =成物及/或第2點著劑組成物的硬化物 = 的連接，故而可追隨包含玻璃轉移溫度為2〇〇。= 塑性树脂的基材的變形，對基材的潤濕性亦提高 充为提同電路構件間的简強度。 可靠性試驗後亦可_穩定的性能。卩吏、長時間的 一 「 j热塑性树脂是選自由聚對苯二甲酿7 :旨及聚萘二甲酸乙二醋所組 至乙 上述連接結構體由於將本發明的上述第！黏著· 的連或f2黏著劑組成物的硬化物用於-對電路構件 =連接，故而可追隨包含聚對苯二甲酸乙二醋等的二 穩定的性能。卩狀長時_可靠賴雜亦可維持 -電=22的^構件的連接結構體中較佳為，第 有件中的-方的電路構件是由含 =自由聚對本一甲酉文乙二酿、聚碳酸酯及聚萘二甲酸乙 群中的至少1種的基材所構成，且第-電路 d!路構件中的另一方的電路構件為聚醯亞胺 、曰。連接、U 聋體藉由第一電路構件與第二電路構件以 吐所述的基材所構成’則與黏著劑組成物的潤濕性及黏 201204797 著強度進-步提高，可獲得優制連接可靠性。 本發明提供一種電路構件# =下步驟:將主面上具有第-連接二 件、與主面上具有第二連接端子的第二電路‘= :連接端子及第二連接端子對向的方式配置，其中上述黏 者劑組成物介於第-電路構件與第二電路構件之間； 將黏著劑組成物加熱，使其硬化而 j路，。依據本製造方法，藉由將第一=構七 第-電路構件以上述黏著敝成物連接，可獲得具有優異 的連接可靠性的電路構件的連接結構體。 、 另外’本發明提供一種黏著劑經成物的應用，用於將 f面上具有第—連接端子的第-電路構件、與主面上具有 第^連接端子的第二電路構件連接，上述黏著劑組成物（第 1黏者劑組成物）含有（a)熱塑性樹脂、⑴自由基聚合 I1 生化δ物（e)自由基聚合起始劑、及⑷具有填酸基的 乙烯基化口物’且（b)自由基聚合性化合物包含具有 mN/m〜40 mN/m的臨界表面張力的胺基甲酸醋（甲基)丙 烯酸醋。上述第i黏著劑組成物藉由含有上述各成分，並 且（b)自由基聚合性化合物包含具有2〇mN/m〜4〇mN/m 的界表面張力的&基甲酸酯（曱基)丙烯酸自旨，而對聚酿 ，胺、PET、PC、PEN等有機基材或ITO、IZ〇 '随、Si〇2 等無機基材_祕提高，可進行低溫硬化下的黏著，可 提高電路構件間的黏著強度。另外，即便於長時間的可靠 性試驗後亦可維持穩定的性能。 11 201204797 Λ, 。於上述應用中較佳為，胺基甲酸g旨（甲基)丙烤酸醋的 25C下的黏度為600Pa.s〜5〇〇〇 Pa.s。藉由胺基甲酸酯（甲 基)丙缔酸黯的坑下的黏度在上述範圍内，而獲得適度 的流動性，潤濕性提高，可獲得優異的連接可靠性。 於上述應时較佳為，胺基旨（甲基)丙烯酸醋的 重1平均分子量為10000以上且小於25〇〇〇。藉由胺基甲 酸醋（甲基)丙__重量平均分子量在上述範圍内:而 對黏Ϊ劑組成物賦予適度的可撓性，電路構件間的黏著強 度提兩’可獲得優異的連接可靠性。 於上述應財較佳為，黏著劑組成物的斷裂伸長率為 /。〜5GG%。藉由斷裂伸長率在上述範_，而對黏著 充分的可撓性，電路構件_黏著強度提 冋可獲仔優異的連接可靠性。 另外本發明提供—種黏著劑組成物的 具有第-連接端子的第—電路構件、與主面上4 2 子㈣二^構件連接，上獅著舰成物（第 黏者劑、、且成物）含有（a)熱塑性樹脂、（b)自由基聚入 =2丄及自由基聚合起始劑，㈦自由基聚“ 300:〜二，基甲酸酯(甲基ί丙烯酸酯’且斷裂伸長率為 八 。上述第2黏著劑組成物藉由含有上述各成 =、且⑴自由絲合性化合物包含胺基甲酸 ^稀^旨，斷裂伸長率在上述範圍内，而賦予充分的可^ 性可追隨被黏_ (聚醯亞胺、pET、pc、卿 變形’因此電路構件間的黏著強度提高’可獲得優異的連 12Further, the present invention provides a first circuit member having a first connection terminal on a main surface of a connection structure of a circuit member, a second circuit member and a connection member on the main surface and a second connection terminal, and an I connection terminal and a second circuit member is disposed in a manner opposite to the second connection terminal, wherein the connection member including the ith adhesive composition and the adhesive composition is interposed between the first circuit member and the second member; The first connection terminal and the second connection terminal are electrically connected, and the circuit component and/or the second circuit member are made of a base material containing a thermoplastic resin having a temperature of 200 C or less. Further, since the bonded structure as described above is connected to the cured product of the above-mentioned = object and/or the second dot composition of the present invention, it is possible to follow the glass transition temperature of 2 Å. = Deformation of the base material of the plastic resin, and improved wettability to the substrate. After the reliability test, it can also be stable performance.卩吏, a long time, a "j thermoplastic resin is selected from the group consisting of polyparaphenylene 7 : a combination of polyethylene naphthalate and ethylene glycol to the above-mentioned bonded structure. The hardened material of the f2 or the adhesive composition of the f2 is used for the circuit member = connection, so that it can follow the two stable properties including polyethylene terephthalate, etc. The long-term shape of the adhesive can be maintained. Preferably, in the connection structure of the member of the electric quantity of 22, the circuit component in the first part is composed of the group containing the = free poly-pair, the polycarbonate, and the polyethylene naphthalate. At least one of the base materials is formed, and the other circuit member of the first circuit d! path member is polyimide or ruthenium. The connection, the U body is composed of the first circuit member and the second circuit member. By forming the substrate of the spit, the wettability of the adhesive composition and the strength of the adhesive composition are further improved, and excellent connection reliability can be obtained. The present invention provides a circuit member # = next step: a second surface having a first connection and a second connection terminal on the main surface Circuit '=: the connection terminal and the second connection terminal are disposed opposite to each other, wherein the adhesive composition is interposed between the first circuit member and the second circuit member; and the adhesive composition is heated to harden it According to the manufacturing method, the connection structure of the circuit member having excellent connection reliability can be obtained by connecting the first-conducting seventh-circuit member to the above-mentioned adhesive composition. Further, the present invention provides An adhesive composition for connecting a first circuit member having a first connection terminal on a f-plane to a second circuit member having a second connection terminal on a main surface, the adhesive composition (first The adhesive composition) comprises (a) a thermoplastic resin, (1) a radically polymerized I1 biochemical delta (e) radical polymerization initiator, and (4) a vinylated mouth having an acid group and (b) a radical The polymerizable compound contains urethane methacrylate (meth) acrylate having a critical surface tension of mN/m to 40 mN/m. The above i-th adhesive composition contains the above components, and (b) radical polymerization Sex compound There are 2 〇mN/m~4〇mN/m boundary surface tension & urethane (mercapto) acrylate, and for the brewing, amine, PET, PC, PEN and other organic substrates or ITO, IZ〇's, Si〇2 and other inorganic substrates _ secret increase, can be adhered under low temperature hardening, can improve the adhesion strength between circuit components. In addition, even after long-term reliability test can maintain stable performance 11 201204797 Λ, In the above application, it is preferred that the urethane is a viscosity of 600 Pa.s to 5 Å Pa.s at 25 C. The viscosity under the pit of the acid ester (methyl) propionate is in the above range, and moderate fluidity is obtained, the wettability is improved, and excellent connection reliability can be obtained. Preferably, the above-mentioned amino acid-based (meth)acrylic acid vinegar has a weight average molecular weight of 10,000 or more and less than 25 Å. The weight average molecular weight of the (meth) propyl methacrylate is within the above range: while imparting moderate flexibility to the adhesive composition, the adhesion strength between the circuit members is improved to obtain excellent connection reliability. Sex. Preferably, the above composition is such that the elongation at break of the adhesive composition is /. ~5GG%. By the elongation at break in the above-mentioned range, and the sufficient flexibility for adhesion, the adhesion of the circuit member_adhesive strength can be obtained with excellent connection reliability. In addition, the present invention provides a first circuit member having a first connection terminal of an adhesive composition, and is connected to a 4 2 (four) two member on the main surface, and the upper lion is a ship (the adhesive agent, and (a) containing (a) a thermoplastic resin, (b) a radical polymerization = 2 丄 and a radical polymerization initiator, (7) a radical poly "300: ~ bis, a carbamic ester (methyl acrylate) and cleavage The elongation is 8. The second adhesive composition contains the above-mentioned respective = and (1) the free-filamentous compound contains an amino formic acid, and the elongation at break is within the above range, and sufficient elongation is provided. Sex can follow the sticky _ (polyimine, pET, pc, qing deformation 'so improve the adhesion strength between the circuit components' to obtain excellent connection 12

201204797 L 接可靠性。 於上述應用中較佳為’黏著劑組成物更含有（d)具有 磷酸基的乙烯基化合物。藉由含有（d)具有磷酸基的乙烯 基化合物，可提高對金屬基材的黏著性，另外，可獲得對 具有由金屬或ITO、IZO等所構成的連接端子的電路構件 的優異黏著強度。 *於上述應用中較佳為，黏著劑组成物的200°c下的儲 藏彈性模數為0.5 MPa〜5 MPa。一般認為，藉由200。(：下 藏彈性模數在上述範圍内，可兼具充分的可撓性與交 聯密度，緩和黏著劑組成物的被黏附體與黏著劑組成物界 面的應力。因此，不僅提高電路構件間的黏著強度，而且 即便於長時間的可靠性試驗後亦可維持穩定的性能。 一，上述應用中較佳為’（a)熱塑性樹脂含有選自由苯 氧巧脂、聚胺基曱酸賴脂、聚g|胺基旨樹脂、丁 醛树知、丙烯酸樹脂、及聚醯亞胺樹脂所組成組群中的至 少1種。藉由含有上述樹脂作為（a)熱塑性樹脂，則黏著 劑組成物的耐熱性、黏著性進一步提高。 於上述應用中較佳為，黏著劑組成物更含有（e)導電 2子。H由含有⑷導電性粒子，可雌著劑組成物賦 予良好的導電性或者異向導電性，因此可更適宜用於且有 連接端子的電路構件彼此的黏㈣途等，可更充分地降低 t上述第1黏著劑組成物及/或第2黏著劑組成物而電性 連接的電路構件的連接電阻。 [發明的效果] 13 201204797 依據本發明，可提供—種於低溫的硬化條件下亦可獲 得優異的麟強度，且於長_的可靠性試驗（高溫高濕 試驗）後亦可轉穩定_能⑽著強度錢接電阻）的 黏者劑組成物’使用該黏著劑組成物的電路構件的連接結 構體、連接結構體的製造方法以及黏著劑組成物的應用。 【實施方式】 Μ卜 很踝m況 一遭參照圖式，一邊對本發明的較 佳實施形態進行詳細朗。此外，圖式巾，制—或者相 當部分標註同-紐’省略重複的說明。另外，本發明中， 所謂（甲基)丙職是表示丙賊或者與其制的甲基丙 酸，所謂（甲基是表示__或者與其對應 甲基丙烯酸g旨’所謂（甲基)丙稀醯基是表示丙稀醯基^ 甲基丙烯醯基。 本實施形態中的所謂「臨界表面張力（Yc)」，是指如 下表面張力：利用塗佈裝置，將液狀的胺基甲酸酯（甲美 丙婦酸醋或者使胺基甲git i旨（甲基)丙稀酸醋溶解於溶劑土中 而得的液狀物塗佈於氟樹脂膜上，進行7(rc、1〇分鐘或 可去除所使用的溶劑的溫度及時間的熱風乾燥，實際測旦 剛對所得的膜狀胺基曱酸酯（曱基）丙烯酸酯分別在幻它$ 滴加1 μΐ的純水、潤濕張力試驗用混合溶液n〇 5〇、6〇 光純藥工業（股）製造）後的與胺基曱酸酯（曱基)丙_ 酯表面所形成的角（接觸角θ)，以各液體的表面張力為2 軸且以COS0為y軸而製圖時，直線成為γ=1時的表^ 張力。此外，關於當通過上述純水、N〇 5〇、6〇的測定中 201204797 所得的3點的直線為γ=1時又成為 用純水、濁濕張力試驗用混合溶液版6〇的'^^可使 純藥工業⑻製造）進行與上述相同的測定=(牙口光 過所得3點的直線成為Y=1時的表面張力的值而使用通 另外，本實施形態中的所謂「儲藏彈性模 θ201204797 L Connection reliability. In the above application, it is preferred that the 'adhesive composition further contains (d) a vinyl compound having a phosphate group. By containing (d) a vinyl compound having a phosphoric acid group, adhesion to a metal substrate can be improved, and excellent adhesion strength to a circuit member having a connection terminal made of metal, ITO, IZO or the like can be obtained. * In the above application, it is preferred that the storage modulus of the adhesive composition at 200 ° C is 0.5 MPa to 5 MPa. It is generally believed that by 200. (The lower elastic modulus is within the above range, and it can have sufficient flexibility and crosslink density to alleviate the stress at the interface between the adherend and the adhesive composition of the adhesive composition. Therefore, not only the circuit members are improved. Adhesive strength, and stable performance even after long-term reliability test. 1. In the above application, it is preferred that '(a) the thermoplastic resin contains a selected from the group consisting of phenoxy oligosaccharides and polyamine phthalic acid lysates. At least one of a group consisting of a resin, a butyral resin, an acrylic resin, and a polyimide resin. The resin composition is used as the (a) thermoplastic resin. The heat resistance and the adhesion are further improved. In the above application, it is preferred that the adhesive composition further contains (e) conductive particles. H contains (4) conductive particles, and the female composition can impart good conductivity or Since it has an anisotropic conductivity, it can be more suitably used for the adhesion of circuit members having connection terminals, and the like, and the first adhesive composition and/or the second adhesive composition can be more sufficiently reduced and electrically Connected electricity Connection resistance of the road member. [Effects of the Invention] 13 201204797 According to the present invention, it is possible to provide an excellent lin strength under hardening conditions at a low temperature, and after a reliability test (high temperature and high humidity test) It is also possible to stabilize the adhesive composition which can be used for the circuit member of the adhesive composition, the method for producing the bonded structure, and the application of the adhesive composition. [Embodiment] It is a matter of fact that the preferred embodiment of the present invention will be described in detail with reference to the drawings. In addition, the drawings, the system or the corresponding parts are labeled with the same - the same as the repeated description. Further, in the present invention, the term "(methyl)-propyl" means a thief or a methylpropionic acid produced by the same, and the so-called (methyl means __ or a corresponding methacrylic acid) The fluorenyl group means an acrylonitrile group. The "critical surface tension (Yc)" in the present embodiment means a surface tension: a liquid urethane is applied by a coating device. (A propylene glycol vinegar or a liquid material obtained by dissolving a methacrylic acid (meth) acrylate vinegar in a solvent soil is applied to a fluororesin film, and 7 (rc, 1 minute) Or the hot air drying can be carried out to remove the temperature and time of the solvent used. Actually, the obtained film-like amino phthalic acid ester (mercapto) acrylate is added dropwise with 1 μΐ of pure water and moistened. The angle (contact angle θ) formed by the surface of the amine phthalate ester (manufactured by Nippon Pure Chemical Industries Co., Ltd.) after the tension test is used for each liquid. When the surface tension is 2 axes and COS0 is the y-axis, the straight line becomes the tension of γ = 1. In addition, when In the measurement of the above-mentioned pure water, N〇5〇, and 6〇, the straight line at 3 o'clock obtained by 201204797 is γ=1, and it becomes pure with the mixed solution of pure water and turbidity tension test. In the pharmaceutical industry (8), the same measurement as described above is performed. (The value of the surface tension when the straight line of the obtained three points is Y = 1 is used, and the so-called "storage elastic mode θ in the present embodiment" is used.

用=裝置將黏著劑組成物塗佈於氟樹脂‘ 1利 C、10分鐘或者可去除所使㈣溶劑的溫度 J 風乾燥，將所得的膜狀黏著劑組成物進们及、=熱 加熱硬化’對所得的試料使用ΤΑ1一 = =，，3」(商品名)，於升溫速度5。上的 頻率10ΗΖ、測定溫度七叱〜300。 WC的儲藏彈性模數⑻的值。⑽件下叙而得的 =施形態中的所謂「斷裂伸長率」，是指利 置將财齡成物塗佈於氣樹賴上，進行贼、ι〇 2 或者可去除所使用的溶_溫度及時_熱風乾燥，= 仲的膜狀黏著劑組成物進行⑽。c、〗小時的加熱硬化 ，得的試料使用InStr〇n公司製造的材料試驗機 Μ咖tester 5548」（商品名），於拉伸速度5Qmm/min、 測定溫度饥的條件下測定，使用下述式⑴，算出膜斷 裂時的標點_長度L與原本的標點。而得的值。 斷裂伸長率（％) = (L-Lg) /L()X⑽ ⑴ 另外，本實施形態中的所謂「黏度」，是指對胺基甲酸 酉曰（曱基）丙烤IS曰使用Anton Paar公司製造的流變儀 Physica MCR301」（商品名），於頻率i Hz、測定溫度 15 201204797 25°C的條件下測定而得的值。 本實施形態中的所謂「玻璃轉移溫度（Tg)」，是指對 膜狀的有機基材使用TA Instruments公司製造的黏彈性分 析儀「RSA-3」（商品名），於升溫速度5°C/min、頻率1〇 Hz、測定溫度-150°C〜300°C的條件下測定而得的Tg附近 的tan5峰值溫度的值。 另外，本實施形態中，所謂「重量平均分子量」及「數 量平均分子量」，是指依據表1所示的條件，利用凝膠滲透 層析法（gel permeation chromatograph，GPC)，使用標準 聚苯乙烯的校正曲線而測定的值。 [表1] 裝置 Tosoh股份有限公司製造，GPC-8020 檢測器 Tosoh股份有限公司製造，RI-8020 管柱 曰立化成工業股份有限公司製造’ 〇却3淡(31^\-160-8 + GL-A150-SG2000Hhr 試料濃度 120 mg/3 ml 溶劑 四氫呋喃 注入量 60 μΐ 壓力 30 kgfi^cm ‘ 流量 1.00 ml/min (第1實施形態） 本發明的第1貫施形態的黏著劑組成物是用於將主面 上具有第一連接端子的第一電路構件、與主面上具有第二 連接端子的第二電路構件連接的黏著劑組成物，1述黏^ 劑組成物的特徵在於：含有（a)熱塑性樹脂、（b)自由基 聚合性化合物、（c)自由基聚合起始劑、及⑷具有鱗ς 201204797, 二的=烯基:匕合物’且(b)胃由基聚合性化合物包含具有 Γ G mN/m的臨界表面張力的胺基甲酸醋（甲基) 丙烯酸酯。 以下，對各成分進行詳細朗。本實細彡態中使用的 a熱塑性樹脂，具有如下性質的樹脂（高分子）：藉 由加‘、,、而成為黏度高的液狀狀態，利用外力而自由變形， 若冷卻，去除外力’則於保持其形狀離態下變硬，將該 過私重複進彳T。另外’亦包括包含具有上述性質的反應性 ”匕基的娜（冋分子卜⑷熱塑性樹脂的玻璃轉移溫度 (Tg)較佳為（TC〜19(rc，更佳為2(rc〜i7(rc。 如上所述的（a)熱塑性樹脂可使用聚醯亞胺樹脂、聚 醯胺（polyamide)樹脂、笨氧基樹脂、（甲基)丙稀酸樹脂、 月女基甲酸g旨樹脂、聚g旨胺基甲酸g旨樹脂、聚乙烯基丁酸 (polyvinylbutyral)樹脂等。該些樹脂可單獨使用或者將2 種以上混合使用。進而’該些_性樹脂巾亦可包含石夕氧 ，鍵或I取代基。該些樹脂若為所混合的樹脂彼此完全相 溶、或產生微相分離而白濁的狀態，則可適宜使用。 於將黏著劑組成物製成膜狀而利用的情況，上述熱塑 性樹脂的分子量越大’越容易獲得良好的膜形成性，另外， 可將對作為膜狀黏著劑組成物的流動性造成影響的熔融黏 度設定為較廣範圍。（a)熱塑性樹脂的重量平均分子量較 佳為5,0〇〇〜150,000，更佳為10,000〜8〇,〇〇〇。若重量^ 均分子量小於5,000，則存在難以獲得良好的臈形成=的 傾向，若超過150,000，則存在難以獲得與其他成分的， 17 201204797 v一 一士 好相溶性的傾向。 以黏著劑組成物總量為基準，黏著劑組成物中的（a) 熱塑性樹脂的含量較佳為5質量％〜8〇質量％，更佳為i5 質里％〜7G質量％。若該含量小於5質量％，則於將黏著 劑組成物製成餘關㈣情況，尤其存在難以獲得良好 的膜形=性的傾向，若超過80質量％，則存在難以獲得良 好的黏著劑組成物的流動性的傾向。 本實施形態的黏著劑組成物中所含有的（b)自由基聚 合性化合物是指藉由自由基聚合起始劑的作用而產生^由 基聚合的化合物，但亦可為藉由賦予光或熱等活化能而使 其自身產生自由基的化合物。（b)自由基聚合性化合物例 如可適宜使用具有藉由乙烯基、（曱基)丙烯醯基、烯丙基、 順丁烯二醯亞胺基等活性自由基而聚合的官能基的化合 物。 (b)自由基聚合性化合物具體而言可列舉：環氧（曱 基)丙稀酸酯（epoxy (meth)acrylate )寡聚物、胺基甲酸酯（曱 基）丙細酸S旨养聚物、聚驗（曱基）丙婦酸g旨（polyether (meth)acrylate )券聚物、聚酉旨（曱基）丙稀酸醋（p〇iyester (meth)acrylate)寡聚物等寡聚物；三羥曱基丙烷三（曱基) 丙烯酸酯（trimethylolpropane tri(meth)acrylate )、聚乙二醇 二（曱基）丙烯酸酯（polyethylene glycol di(meth)acrylate)、 聚伸烧基二醇二（曱基）丙烯酸醋（polyalkylene glycol di(meth)acrylate )、（曱基）丙稀酸二環戊埽酯 (dicyclopentenyl (meth)acrylate)、（甲基）丙烯酸二環戊烯 18 201204797 氧基乙醋（dicyclopentenyloxy ethyl (meth)acrylate )、新戊 二醇二（曱基）丙婦酸醋 （neopentyl glycol di(meth)acrylate )、二季戊四醇六（曱基）丙烯酸酯 (dipentaerythritol hexa(meth)acrylate )、異三聚氰酸 (isocyanuric acid )改質2官能（曱基）丙烯酸酯、異三聚氰 水甘油賴縮水甘油基上而成的環氧（？基）_酸醋、於 使乙二醇或丙二醇加成於雙㈣二縮水甘油嘱縮水甘油 基上而成的化合物中導入有（曱基)丙騎基氧基的化合 物、下述通式⑷及通式⑻絲示的化合物等。 酸改質3官能（曱基)丙烯酸酯、雙苯氧基乙醇苐丙埽酸酯 (bisphenoxyethanol fluorene acrylate)、使（曱基）丙烯酸加 成於雙酚苐二縮水甘油醚（bisphenol fluorene diglycidyl ether)的縮水甘油基上而成的環氧（曱基）丙烯酸酯、雙笨 氧基乙醇苐丙烯酸酯、使（曱基）丙烯酸加成於雙酚g二縮 [化1]The adhesive composition is applied to the fluororesin by a = device for 1 minute, or the temperature of the solvent (4) can be removed by air drying, and the obtained film-like adhesive composition is heated and hardened. 'For the obtained sample, ΤΑ1 ==,, 3" (trade name) was used at a temperature increase rate of 5. The frequency is 10 ΗΖ and the measurement temperature is 7 叱 to 300. The value of the storage elastic modulus (8) of WC. (10) The following article describes the "elongation at break" in the form of the application. It refers to the application of the aging entity to the gas tree, and the thief, ι〇2 or the solvent used for removal. The temperature is timely _ hot air drying, = secondary film adhesive composition is carried out (10). c, 〗 〖Heat-hardening of the hour, and the obtained sample was measured using a material testing machine test coffee tester 5548" (trade name) manufactured by InStr〇n Co., Ltd. under the conditions of a tensile speed of 5 Qmm/min and a temperature hunger. Formula (1) calculates the punctuation length _ length L of the film breakage and the original punctuation. And the value obtained. Elongation at break (%) = (L - Lg) / L () X (10) (1) In addition, the "viscosity" in the present embodiment means the use of Anton Paar for the bismuth carbamate bismuth. The manufactured rheometer Physica MCR301" (trade name) was measured at a frequency of i Hz and a measurement temperature of 15 201204797 at 25 °C. In the present embodiment, the "glass transition temperature (Tg)" is a viscoelastic analyzer "RSA-3" (trade name) manufactured by TA Instruments Co., Ltd. at a temperature rising rate of 5 ° C. /min, a frequency of 1 〇 Hz, and a value of a tan5 peak temperature near the Tg measured under the conditions of a temperature of -150 ° C to 300 ° C. In the present embodiment, the "weight average molecular weight" and the "number average molecular weight" mean the use of standard polystyrene by gel permeation chromatograph (GPC) according to the conditions shown in Table 1. The measured value of the calibration curve. [Table 1] The device is manufactured by Tosoh Co., Ltd., manufactured by Tosoh Co., Ltd., GPC-8020, and manufactured by RI-8020, the column is manufactured by 曰立化成工业股份有限公司. 〇 3 3 light (31^\-160-8 + GL -A150-SG2000Hhr sample concentration 120 mg/3 ml solvent tetrahydrofuran injection amount 60 μΐ pressure 30 kgfi^cm 'flow rate 1.00 ml/min (first embodiment) The adhesive composition of the first embodiment of the present invention is used for An adhesive composition having a first circuit member having a first connection terminal on a main surface and a second circuit member having a second connection terminal on a main surface, wherein the adhesive composition is characterized by: (a a thermoplastic resin, (b) a radically polymerizable compound, (c) a radical polymerization initiator, and (4) a squamous compound 201204797, a bis-alkenyl group: a chelating compound' and (b) a gastric-based polymerizable compound Amino formate (meth) acrylate having a critical surface tension of Γ G mN/m. Hereinafter, each component is described in detail. A thermoplastic resin used in the actual fine state, a resin having the following properties ( Polymer): by adding ',, In the liquid state with high viscosity, it is freely deformed by external force. If it is cooled, the external force is removed, and the shape is hardened while maintaining its shape, and the excess is repeated into T. In addition, 'including the above properties are included. The glass transition temperature (Tg) of the reactive thiol-based (4) thermoplastic resin is preferably (TC~19 (rc, more preferably 2 (rc~i7(rc). (a) thermoplastic as described above As the resin, a polyimide resin, a polyamide resin, a strepellyloxy resin, a (meth)acrylic acid resin, a ruthenium glycol, a resin, a polyglycolic acid, a resin, a poly A vinyl butyral resin, etc. These resins may be used singly or in combination of two or more. Further, the _ resin towels may contain a sulphur, a bond or an I substituent. When the resin to be mixed is completely compatible with each other or is in a state of being microphase-separated and turbid, it can be suitably used. In the case where the adhesive composition is used in a film form, the larger the molecular weight of the thermoplastic resin, the easier it is to obtain. Good film formation, in addition, The melt viscosity which affects the fluidity of the film-like adhesive composition can be set to a wide range. (a) The weight average molecular weight of the thermoplastic resin is preferably from 5,0 to 150,000, more preferably from 10,000 to 8, 〇, 〇〇〇. If the weight ^ average molecular weight is less than 5,000, there is a tendency that it is difficult to obtain a good ruthenium formation =, and if it exceeds 150,000, there is a tendency that it is difficult to obtain compatibility with other components. . The content of the (a) thermoplastic resin in the adhesive composition is preferably from 5% by mass to 8% by mass based on the total amount of the adhesive composition, more preferably from 7% to 7% by mass of the i5 mass. When the content is less than 5% by mass, in the case where the adhesive composition is made into a residual condition (4), in particular, it tends to be difficult to obtain a good film form = property, and if it exceeds 80% by mass, it is difficult to obtain a good adhesive composition. The tendency of the fluidity of the object. The (b) radically polymerizable compound contained in the adhesive composition of the present embodiment means a compound which is polymerized by the action of a radical polymerization initiator, but may be imparted with light or A compound that activates energy such as heat to generate free radicals by itself. (b) The radically polymerizable compound, for example, a compound having a functional group polymerized by an active radical such as a vinyl group, a (meth) acryl group, an allyl group or a maleimide group can be suitably used. (b) The radically polymerizable compound specifically includes an epoxy (meth) acrylate oligomer and a urethane (mercapto) propionate S. Polyester (meth)acrylate, polyether (meth)acrylate, oligo(meth)acrylate, oligomer, etc. Polymer; trimethylolpropane tri(meth)acrylate, polyethylene glycol di(meth)acrylate, poly(diethyl acrylate) Polyalkylene glycol di(meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentene (meth)acrylate 18 201204797 Oxygen Dicyclopentenyloxy ethyl (meth)acrylate, neopentyl glycol di(meth)acrylate, dipentaerythritol hexa(meth) Acrylate), isocyanuric acid modified 2-functional (fluorenyl) An epoxy (?)-acid vinegar obtained by adding an enoic acid ester or an isomeric cyanuric glycerol to a glycidyl group, and adding ethylene glycol or propylene glycol to bis(tetra) diglycidyl glycidyl group A compound having a (fluorenyl)-propenyloxy group, a compound represented by the following formula (4) and the formula (8), and the like are introduced into the compound. Acid-modified trifunctional (fluorenyl) acrylate, bisphenoxyethanol fluorene acrylate, bisphenol fluorene diglycidyl ether Epoxy (mercapto) acrylate, bis-oxyethanol oxime acrylate formed on the glycidyl group, and (mercapto)acrylic acid added to bisphenol g dimethyl [Chemical Formula 1]

1〜8的整數。] [式（A)中’ 及r2 基’ a及b分別獨立地表示 [化2] 分別獨立地表示氫原子或者曱 201204797An integer from 1 to 8. [In the formula (A) and the r2 groups 'a and b are each independently represented. [Chem. 2] independently represent a hydrogen atom or 曱 201204797

[式（B)中，R3及R4分別獨立地表示氫原子或者曱 基，c及d分別獨立地表示0〜8的整數。] 另外，（b)自由基聚合性化合物即便是於單獨在30¾ 下靜置的情況為躐（wax )狀、躐狀、結晶狀、玻鴻狀、 粉狀等的無流動性且表現出固體狀態的化合物，亦可無特 別限制地使用。如上所述的（b)自由基聚合性化合物具體 而言可列舉：N，N，-亞甲基雙丙烯醯胺（N，N，-methylene bisacrylamide )' 二丙酮丙稀醯胺（diacetone acrylamide)、 N-羥曱基丙烯醯胺、N-苯基甲基丙烯醯胺、2-丙烯醯胺 曱基丙磺酸、異三聚氰酸三(2-丙烯醯基氧基乙基)g旨、Ν_ 苯基順丁稀二醯亞胺（N-phenyl maleimide )、Ν-(鄰甲基苯 基)川員丁稀二醯亞胺、N-(間甲基苯基)順丁稀二醯亞胺、 N-(對甲基苯基)-順丁烯二醯亞胺、(鄰曱氧基苯基)順丁 烯一醯亞胺、N-(間曱氧基苯基)順丁烯二醯亞胺、N-(對甲 氧基苯基)-順丁烯二醯亞胺、N-曱基順丁烯二醯亞胺、N-乙基順丁烯二醯亞胺、N-辛基順丁烯二醯亞胺、4,4，_二苯 基甲烷雙順丁烯二醯亞胺、間伸苯基雙順丁烯二醯亞胺、 二曱基-5,5’-二乙基-4,4’-二苯基曱院雙順丁烯二醢亞 胺、4-甲基_ι，3_伸苯基雙順丁烯二醯亞胺、N_曱基丙烯醯 氧基順丁烯二醯亞胺、N-丙烯醯氧基順丁烯二醯亞胺、丨，6· 201204797. 雙順丁烯二醯亞胺_(2,2,4-三甲基）己烷、N_甲基丙烯醯基氧 基丁二酸醯亞胺、N-丙烯醯基氧基丁二酸酿亞胺、曱基丙 烯酸2-萘基酯、丙烯酸2-萘基酯、季戊四醇四丙烯酸酯、 二乙烯基伸乙基尿素、二乙烯基伸丙基尿素、曱基丙烯酸 2-聚苯乙烯基乙酯、N-苯基-N'-(3-曱基丙烯醯基氧基_2·經 基丙基)-對苯二胺、N-苯基-N，-(3-丙烯醯基氧基_2-羥基丙 基)·對苯二胺、甲基丙烯酸四曱基哌啶基酯、丙烯酸四甲 基痕°定基酯、曱基丙烯酸五曱基派啶基酯、丙烯酸五曱基 旅咬基酯、丙烯酸十八烷基酯、N-第三丁基丙烯醯胺、二 丙酮丙烯醯胺、N-(羥基曱基)丙烯醯胺、下述通式（c)〜 通式（L)所表示的化合物等。 [化3]In the formula (B), R3 and R4 each independently represent a hydrogen atom or a fluorenyl group, and c and d each independently represent an integer of 0 to 8. In addition, (b) the radically polymerizable compound exhibits no fluidity and exhibits solidity even when it is left alone at 303⁄4 in the form of wax, scorpion, crystal, glass, or powder. The compound in the state can also be used without particular limitation. The (b) radically polymerizable compound as described above may specifically be exemplified by N, N, -methylene bisacrylamide, diacetone acrylamide. , N-hydroxydecyl acrylamide, N-phenyl methacrylamide, 2-propenyl amidinopropane sulfonic acid, tris(3-propenyl methoxyethyl) g , Ν _ phenyl cis-butyl diimide (N-phenyl maleimide), Ν-(o-methylphenyl) Chuan butyl diimide, N-(m-methylphenyl) cis-butane dioxime Imine, N-(p-methylphenyl)-m-butyleneimine, (o-nonyloxyphenyl)-n-butylimine, N-(metamethoxyphenyl)-n-butene Dimethyleneimine, N-(p-methoxyphenyl)-m-butyleneimine, N-fluorenyl maleimide, N-ethyl maleimide, N- Octyl succinimide, 4,4,-diphenylmethane bis-n-butylene imide, meta-phenylbis-s-butylene diimide, dimercapto-5,5'-di Benzyl-4,4'-diphenyl fluorene bis-xenylenediamine, 4-methyl-ι, 3-phenylenebis-synylenediamine, N-mercaptopropene fluorene Isobutyleneimine, N-propylene decyloxymethyleneimine, hydrazine, 6· 201204797. Bis-m-butylene diimide _(2,2,4-trimethyl) Alkane, N-methylpropenyl sulfoxy succinimide, N-propylene decyloxy succinic acid, imine, 2-naphthyl methacrylate, 2-naphthyl acrylate, pentaerythritol Acrylate, divinyl exoethyl urea, divinyl propyl urea, 2-polystyryl ethyl methacrylate, N-phenyl-N'-(3-mercaptopropenyloxy-2) Benzyl)-p-phenylenediamine, N-phenyl-N,-(3-propenyloxy 2-hydroxypropyl)-p-phenylenediamine, tetradecylpiperidyl methacrylate , tetramethyl methacrylate, decyl hexyl hexyl acrylate, octadecyl acrylate, octadecyl acrylate, N-tert-butyl acrylamide, diacetone propylene Amidoxime, N-(hydroxyindenyl) acrylamide, a compound represented by the following formula (c) to formula (L), and the like. [Chemical 3]

[式（C)中，e表示1〜1〇的整數。] [化4][In the formula (C), e represents an integer of 1 to 1 。. ] [Chemical 4]

[化5] 21 201204797[Chemical 5] 21 201204797

"(E) [式（E)中，R5及R6分別獨立地表示氫原子或者曱 基，f表示15〜30的整數。] [化6]<(E) [In the formula (E), R5 and R6 each independently represent a hydrogen atom or a thiol group, and f represents an integer of 15 to 30. ] [Chem. 6]

."(F) [式（F)中，R7及R8分別獨立地表示氫原子或者曱基， g表示15〜30的整數。] [化7](F) [In the formula (F), R7 and R8 each independently represent a hydrogen atom or a fluorenyl group, and g represents an integer of 15 to 30. ] [Chem. 7]

[式（G)中，R9表示氫原子或者曱基。] [化8] 22 201204797. R10O H2c==c—c- oO~v~0"o~cHi~?H^cHr ο^Ο-ί-Ο-0 H.(H)In the formula (G), R9 represents a hydrogen atom or a fluorenyl group. ] [Chem. 8] 22 201204797. R10O H2c==c-c- oO~v~0"o~cHi~?H^cHr ο^Ο-ί-Ο-0 H.(H)

OH ch3 [式（H)中，R1G表示氫原子或者曱基，h表示1〜10 的整數。] [化9] R11 R11 R11OH ch3 [In the formula (H), R1G represents a hydrogen atom or a fluorenyl group, and h represents an integer of 1 to 10. ] [Chem. 9] R11 R11 R11

- "(I) [式（I)中，R11表示氫原子或者下述通式（i)或通式 (ii)所表示的有機基，i表示1〜10的整數。] [化 10] 〇 ch3 II T . —CH2—CH一CH2—〇—C一C=CH2 •"⑴- (I) In the formula (I), R11 represents a hydrogen atom or an organic group represented by the following formula (i) or formula (ii), and i represents an integer of 1 to 10. ] [化 10] 〇 ch3 II T . —CH2—CH—CH2—〇—C—C=CH2 •"(1)

II

OHOH

[化 11] 23 201204797 一CH2-CH—CH2—O—C—CH=CH2 …（ii )[Chem. 11] 23 201204797 A CH2-CH-CH2-O-C-CH=CH2 (ii)

OHOH

[化 12][化 12]

[式（:〇中，r12表示氫原子或者下述通式（iii)或通 式（iv)所表示的有機基，j表示1〜10的整數。] [化 13] · *( iii) —ch2-nh—c-ch=ch2 [化 14] 〇 ch3 III · * (iv) 一 CH2—NH-C—CH=CH2 [化 15] 24 201204797“[In the formula: r12 represents a hydrogen atom or an organic group represented by the following formula (iii) or (iv), and j represents an integer of 1 to 10.] [Chemical 13] · *( iii) - Ch2-nh-c-ch=ch2 [Chemical 14] 〇ch3 III · * (iv) One CH2—NH-C—CH=CH2 [Chem. 15] 24 201204797 “

[式（K)中，R13表示氫原子或者曱基。] [化 16][In the formula (K), R13 represents a hydrogen atom or a fluorenyl group. ] [Chem. 16]

…（L) [式（L)中，R14表示氫原子或者曱基。] 另外’可將屬於（b)自由基聚合性化合物的化合物即 選自由N-乙烯基化合物及ν，ν·二烧基乙浠基化合物所組 成組群中的Ν-乙烯基系化合物，與該些化合物以外的（b) 自由基聚合性化合物併用。藉由併用乙烯基系化合物， 可提高黏著劑組成物的交聯率。 Ν-乙烯基系化合物具體而言可列舉：Ν-乙烯基咪唑 (N-vinyl imidazole)、Ν-乙烯基π比。定（N-vinyl pyridine)、 N-乙稀基吼哈。定酮（N-vinyl pyrrolidone)、N-乙稀基甲醯 胺（N-vinyl formamide )、Ν-乙烯基己内醯胺（N-vinyl 25 201204797 caprolactam )、4,4’-亞乙嫦基雙（N，N- —甲基笨胺） (4,4’-vinylidene bis(N，N-dimetihyl aniline) )、N-乙埽基乙驢 胺（N-vinyl acetamide )、N，N-二曱基丙场隨胺 (N，N-dimet;hyl acrylamide )、N，N-二乙基丙缚酿胺 (N，N-diethyl acrylamide )等。 此外，後述的（d)具有磷酸基的乙烯基化合物是作為 自由基聚合性化合物而發揮功能，但本說明書中的（b)自 由基聚合性化合物是指（d)具有磷酸基的乙烯基化合物以 外的自由基聚合性化合物。 相對於（a)熱塑性樹脂1〇〇質量份，黏著劑組成物中 的（b)自由基聚合性化合物的含量較佳為5〇質量份〜25〇 質量份，更佳為60質量份〜150質量份。若上述含量小於 5〇質量份，則存在硬化後難以獲得充分的耐熱性的傾向， 另外，若超過250質量份，則於作為膜而使用的情況，存 在難以獲得良好的膜形成性的傾向。 本貫施形態的黏著劑組成物含有臨界表面張力為2 mN/m〜40 mN/m的胺基曱酸酯（曱基)丙烯酸酯作為‘（匕) 自由^聚合性化合物。其巾’本實細彡態巾，錢宜使月 上述臨界表©張力的胺基甲酸§|丙烯酸§旨。上述胺基甲酉 醋（甲基旨可藉由脂肪族系二異氰_旨及脂肪族: 醇的縮合反應而獲得。 、 異 ,5- ㈣Ιίΐ上述胺基甲義(甲基)丙烯酸醋的脂肪族系二 ^酉曰疋選自於以下化合物中：四亞曱基二異氛酸0旨、 亞曱基一異旨、離胺酸二異氣酸自旨、2_甲基戊院 26 201204797 ^ f n 3_甲基戊H5•二異氰酸自旨、2,2,4_三甲基六 酸酯一異氛酸醋、2,4,4-三甲基六亞甲基-1，6_二異氰 甲=—爾酮二異氰酸酯、二異氰酸環己酯、氫化苯二 二:異氰酸酯、氫化二苯基甲烷二異氰酸酯、氫化三甲 基本二甲基二異氰酸酯等。 一 >另外，構成上述胺基曱酸酯（曱基）丙烯酸酯的脂肪族 4疋選自於以下化合物中：乙二醇、丙二醇、α丙二 ::1:3-丙二醇、以丁二醇、Μ_丁二醇、新戊二醇、❻ 醇Μ-戊二醇、1，5-戊二醇、2,4-戊二醇、2_甲基·2 4· 戊二醇、2,4'二甲基_2,4_戊二醇、2,2,4-三甲基-U_戊二醇、 1，2-己二醇、π己二醇、…己二醇、a己二醇、2_乙基 一，▲己一醇、2,5_一曱基_2,5-己二醇、i,2_辛二醇、158_辛 一醇、二醇、1，9-壬二醇、丨，2_癸二醇、u〇癸二醇、 1^12-癸二醇:十二烷二醇、頻哪醇（pinac〇i)、14 丁炔二 酉子一乙—醇、二乙二醇、二丙二醇、環己烷二甲醇等飽 ，的低分子二醇類；藉由至少i種以上的上述二醇類與光 氣的反應而獲得的聚碳酸g旨二醇類；藉由以至少i種以上 ^述一軸作聽始劑，湘公知的方法將環氧乙烧、 環氧丙烧、表氣醇（epichlorohydriu)等單體的丨種<者並 以上進行加成聚合而獲得的聚趟二醇類二 3曱基己—g夂、2,2,5,5-四曱基己二酸、順丁烯二酸、反丁 烯一鲅了—酸、2,2-二甲基丁二酸、2_乙基_2•甲基丁二 酸、2,3·二甲基丁二酸、乙二酸、丙二酸、曱基丙二酸、 乙基丙二酸、丁基丙二酸、二甲基丙二酸 '戊二酸、2_甲 27 201204797 -----r ·ι 基戊二酸、3-曱基戊二酸、2,2-二甲基戊二酸、3,3_二曱 戊二酸、2,4-二曱基戊二酸、庚二酸、辛二酸、壬二酸, 癸二酸等二元酸或與邊些二元酸對應的酸酐進行脫水縮人 而獲得的聚S旨二賴或將ε_己_旨等環狀合物進行二 環聚合而獲得的«二賴。由上述二_及二魏^ 得的聚醋二醇類除了單獨使用以外，亦可將2種以上的^ 酯二醇類混合使用。若使用該些聚酯二醇類，則容易將 基曱酸醋（甲基)丙稀酸酷的臨界表面張力控制在2〇 mN/〇i 〜40 mN/m的範圍内。 上述胺基甲酸酯（甲基)丙烯酸酯的臨界表面張力為 mN/m〜40 mN/m，較佳為 20 mN/m〜35 mN/m，更佳為 2〇 mN/m〜33 mN/m。於胺基甲酸酯(甲基)丙烯酸酯的臨界表 面張力在上述範_的情況，藉由與作為被麵體的聚酿 亞胺、PET等的臨界表面張力麵，且顧性提高，則黏 著強度提高，可獲得優異的連接可靠性。另外，若該臨界 表面張力小於20 mN/m或者超過4〇福如，則存在對聚醯 亞胺、PET、PC、PEN f的潤濕性的降低或相容性惡化的 顧慮。-般認為，上述絲甲@魄？基)丙烯義的臨界 ，面張力與胺基曱酸自旨鍵當量有關，可藉由改變二醇的數 ，平均分子1_整。例如，若增大二賴數量平均分子 置’則存在縣甲_旨鍵當減少，臨界表面張力降低的 傾向。 本實，形態的黏著劑組成物中，就對聚醯亞胺、PET、 PC、PEN等基材的鱗強度提高的觀點而言，上述胺基甲 28 201204797(L) [In the formula (L), R14 represents a hydrogen atom or a fluorenyl group. Further, a compound belonging to the (b) radically polymerizable compound, that is, a quinone-vinyl compound selected from the group consisting of an N-vinyl compound and a ν, ν-dialkylethenyl compound, and (b) a radically polymerizable compound other than these compounds is used in combination. By using a vinyl compound in combination, the crosslinking ratio of the adhesive composition can be improved. Specific examples of the fluorene-vinyl compound include N-vinyl imidazole and Ν-vinyl π ratio. N-vinyl pyridine, N-ethylene based hip hop. N-vinyl pyrrolidone, N-vinyl formamide, Ν-vinyl caprolactam (N-vinyl 25 201204797 caprolactam ), 4,4'-ethylidene (4,4'-vinylidene bis(N,N-dimetihyl aniline)), N-vinyl acetamide, N,N-II N,N-dimet;hyl acrylamide, N,N-diethyl acrylamide, and the like. Further, (d) the vinyl compound having a phosphate group described below functions as a radically polymerizable compound, but (b) the radically polymerizable compound in the present specification means (d) a vinyl compound having a phosphate group. A radical polymerizable compound other than the above. The content of the (b) radically polymerizable compound in the adhesive composition is preferably 5 parts by mass to 25 parts by mass, more preferably 60 parts by mass to 150 parts by mass per part by mass of the (a) thermoplastic resin. Parts by mass. When the content is less than 5 parts by mass, it is difficult to obtain sufficient heat resistance after curing. When the amount is more than 250 parts by mass, it is difficult to obtain good film formability when used as a film. The adhesive composition of the present embodiment contains an amino phthalate acrylate having a critical surface tension of 2 mN/m to 40 mN/m as a '(匕) free polymerizable compound. Its towel 'this kind of fine scented towel, Qian Yi makes the above-mentioned critical table © tension of urethane § | acrylic § purpose. The above-mentioned aminomethanthine vinegar (methyl group can be obtained by a condensation reaction of an aliphatic diisocyanate and an aliphatic: an alcohol., iso, 5-(tetra) Ι ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ The aliphatic bismuth is selected from the following compounds: tetradecyl succinic acid 0, sulfhydryl, cis-amino acid, 2-methyl ketone 26 201204797 ^ fn 3_Methylpenta H5•Diisocyanate, 2,2,4-trimethylhexanoate-isoaceous acid vinegar, 2,4,4-trimethylhexamethylene-1 , 6_diisocyanomethyl = ketone diisocyanate, cyclohexyl diisocyanate, hydrogenated benzene diisocyanate: isocyanate, hydrogenated diphenylmethane diisocyanate, hydrogenated trimethyl dimethyl diisocyanate, etc. Further, the aliphatic fluorene constituting the above amino decanoate (decyl) acrylate is selected from the group consisting of ethylene glycol, propylene glycol, α-propylene: 1:3:3-propanediol, butanediol, hydrazine. _Butanediol, neopentyl glycol, decyl hydrazine-pentanediol, 1,5-pentanediol, 2,4-pentanediol, 2-methyl-2,pentanediol, 2,4' Dimethyl 2,4-pentanediol, 2,2,4-trimethyl-U-pentanediol 1,2-hexanediol, π-hexanediol, ... hexanediol, a hexanediol, 2-ethylidene, ▲hexanol, 2,5-monodecyl-2,5-hexanediol , i, 2_octanediol, 158-octanol, diol, 1,9-nonanediol, hydrazine, 2-diol, ruthenium diol, 1^12-nonanediol: twelve a low molecular diol such as an alkanediol, a pinacol, a 14-butyne dioxime-ethyl alcohol, a diethylene glycol, a dipropylene glycol, or a cyclohexane dimethanol; a polyglycol g obtained by reacting one or more kinds of the above-mentioned diols with phosgene; a diol which is obtained by reacting at least one or more of the above-mentioned axes; Any of the above-mentioned types of monomers such as oxypropyl ketone and epichlorohydriu, and polyglycol diols such as 2,2,5,5- obtained by addition polymerization. Tetradecyl adipate, maleic acid, antibutene, acid, 2,2-dimethylsuccinic acid, 2-ethyl-2-methyl succinic acid, 2,3· Dimethyl succinic acid, oxalic acid, malonic acid, mercaptomalonic acid, ethylmalonic acid, butylmalonic acid, dimethylmalonic acid 'glutaric acid, 2_A 27 201204797 -----r ·ι glutaric acid, 3-mercaptoglutaric acid, 2,2-dimethylglutaric acid, 3,3-dioxaglutarate, 2,4-di A dibasic acid such as glutaric acid, pimelic acid, suberic acid, azelaic acid or sebacic acid or an acid anhydride corresponding to some dibasic acids is dehydrated and reduced to obtain a poly-S or a ε_ The above-mentioned di- and di-wei-derived polyglycol diols may be used alone or in combination of two or more kinds of ester diols. Mixed use of classes. When these polyester diols are used, it is easy to control the critical surface tension of the base vinegar (meth) acrylate to be in the range of 2 〇 mN / 〇i to 40 mN / m. The above urethane (meth) acrylate has a critical surface tension of mN/m to 40 mN/m, preferably 20 mN/m to 35 mN/m, more preferably 2 〇mN/m to 33 mN. /m. In the case where the critical surface tension of the urethane (meth) acrylate is in the above-described range, by the critical surface tension surface of the polyanilin, PET, or the like as the facet, and the concern is improved, The adhesion strength is improved and excellent connection reliability can be obtained. Further, if the critical surface tension is less than 20 mN/m or exceeds 4 Å, there is a concern that the wettability of the polyimide, PET, PC, PEN f is lowered or the compatibility is deteriorated. - I think that the above-mentioned silk armor @魄? The basis of the propylene meaning, the surface tension is related to the amino citric acid from the equivalent bond equivalent, and the average molecule is 1 _ by changing the number of diols. For example, if the number of average molecular weights is increased, there is a tendency for the county to decrease and the critical surface tension to decrease. In the adhesive composition of the present invention, the above-mentioned amine group A 28 201204797 is considered from the viewpoint of improving the scale strength of a substrate such as polyimide, PET, PC, or PEN.

Ll 酸酯（甲基）丙烯酸酯的重量平均分子量較佳為10000以上 且小於25000的範圍内。若上述胺基曱酸酯（甲基)丙烯酸 醋的重量平均分子量為上述範圍内，則可獲得柔軟性及凝 集力兩者，與聚醯亞胺、PET、PC、PEN等有機基材的黏 著強度提高’可獲得優異的連接可靠性。另外，就更充分 地獲得上述效果的觀點而言，上述胺基曱酸酯（曱基）丙烯 酸酯的重量平均分子量更佳為12〇〇〇以上且小於20000。 上述胺基曱酸酯（曱基）丙烯酸酯的重量平均分子量若為小 於10000的情況，則存在無法獲得充分的可撓性的傾向， 若為25000以上，則存在黏著劑組成物的流動性降低的傾 向0 上述胺基曱酸酯（甲基)丙烯酸酯的25。〇下的黏度較佳 為 600 Pa.s〜5000 Pa.s，更佳為 _ Pa.s〜45〇〇 pa.s。於胺 基曱酸酯（曱基)丙烯酸酯的25°C下的黏度在上述範圍内的 情況，獲得充分的流動性，可獲得優異的連接可靠性。另 外，可獲得適度的黏接力，操作性優異。另一方面，於小 於600 Pa.s的情況，存在黏接力增加，操作生惡化的傾向: 若超過5000 Pa.s，則存在無法獲得充分的流動性對被 附體的潤濕性降低，黏著強度及連接可靠性惡化 ’ 另外，以黏著劑組成物總量為基準，上^胺基甲酸酿 (曱基)丙烯酸酯的含量較佳為5質量。/〇〜95質旦。/ 曰 為K)質量％〜8〇質量％。於含量小於5 f 在耐熱性容紐低的傾向，若超過95質量％，則 而使用的情況，存在膜形成性容易降低的傾向。 ‘”、膜 29 201204797 本貫施形態的黏著劑組成物中所含有 合起始劑可使用自先前以來已知的有 就穩定性'反應性、相溶性的觀點而言， 起始劑較佳為1分鐘半衰期溫度為9(TC〜175t^ = 為180〜1000的有機過氧化物。藉由ι分鐘半:二 Ϊ =間=藏穩定性優異，自由基聚合性^ 基)醋、過氧化二碳酸二(2_乙基己基 土二 丙苯絲、過氧崎碰u，3,3^化新癸酸異 過氧化物、過氧化新癸環己Al ^曰—月桂醯基 癸酸第三己醋、過氡化新癸酸“ ;^旨、過氧化新 過乳化-2-乙基己酸u，3,3_四甲基 ^ 基-2’5-二(2_乙基己醯基過氧化)己烧、過氧化，其= 第二己酯、過氧化_2_乙基己 土己酉夂 三丁酯、過氧化-2-乙基己酸第第^酉日:氧化新庚酸第 甲酸二-第三丁醋、過氧化:公化六氫對苯二 氧化新癸酸3•減·U•二fA — ^己^第二戊酯、過 I⑽四甲基丁醋、過氧化;::第，^ 乙基己酸第三賴、二㈣2 戊知、過氧化1 、二物過： 異丙基早域第三己酯、第三丁基過氧化順丁稀二Ξ = 201204797 氧化-3,5,5-三曱基己酸第三丁酯、過氧化月桂酸 丁 醋、2,5-二曱基-2,5-二(3:甲基苯甲酿基過氧化)己烧、過氧 化-2-乙基己基單碳酸第三丁酯、過氧化笨甲酸第三己酯、 2,5-二曱基-2,5-二(苯曱醯基過氧化）己烷、過氧化苯甲酸第 三丁酯、過氧化三甲基己二酸二丁酯、過氧化正辛酸第三 戊酯、過氧化異壬酸第三戊酯、過氧化笨甲酸第三戊酯等 有機過氧化物；2,2’-偶氮雙-2,4·二甲基戊腈、'氮雙0(1_ 乙醯氧基-1-苯基乙烷）、2,2’-偶氮雙異丁腈、2,2,_偶氮雙(2· 甲基丁腈）、一甲基-2,2 -偶氮雙異丁腈、4,4，_偶氮雙(4_氰基 戊酸）、1，Γ-偶氮雙(1-環己烷甲腈)等偶氮化合物土 該些化合物除了單獨使用以外，亦可將2種以上的化 合物混合使用。 另外’（c)自由基聚合起始劑可使用藉由i5〇nm〜75〇 nm的光照射而產生自由基的化合物。作為如上所述的化合 物，例如 Photoinitiation, Photop〇lymerizati〇n，andThe weight average molecular weight of the L1 acid ester (meth) acrylate is preferably in the range of 10,000 or more and less than 25,000. When the weight average molecular weight of the above amino phthalate (meth) acrylate is within the above range, both flexibility and cohesive force can be obtained, and adhesion to an organic substrate such as polyimide, PET, PC, or PEN can be obtained. Increased strength's excellent connection reliability. Further, from the viewpoint of more sufficiently obtaining the above effects, the weight average molecular weight of the above amino decanoate (decyl) acrylate is more preferably 12 Å or more and less than 20,000. When the weight average molecular weight of the above-mentioned amino phthalic acid ester (mercapto) acrylate is less than 10,000, sufficient flexibility may not be obtained, and if it is 25,000 or more, the fluidity of the adhesive composition may be lowered. The tendency is 0 for the above amino phthalate (meth) acrylate. The viscosity under the armpit is preferably from 600 Pa.s to 5000 Pa.s, more preferably from _ Pa.s to 45 〇〇 pa.s. When the viscosity at 25 ° C of the amino decanoate (decyl) acrylate is within the above range, sufficient fluidity is obtained, and excellent connection reliability can be obtained. In addition, a moderate adhesive force can be obtained, and the workability is excellent. On the other hand, in the case of less than 600 Pa.s, there is a tendency that the adhesive force is increased and the operation is deteriorated: if it exceeds 5000 Pa.s, sufficient fluidity cannot be obtained, and the wettability of the attached body is lowered, and adhesion is caused. Further, the strength and the connection reliability are deteriorated. Further, the content of the above-mentioned mercaptocarboxylic acid (mercapto) acrylate is preferably 5 mass based on the total amount of the adhesive composition. /〇~95 quality Dan. / 曰 is K) mass% ~ 8 〇 mass%. When the content is less than 5 f, the heat resistance is low, and if it is more than 95% by mass, the film formability tends to be lowered. '", film 29 201204797 The initiator in the adhesive composition of the present embodiment can be used as the starting agent from the viewpoint of stability 'reactivity and compatibility as known from the prior art. It is a 1-minute half-life temperature of 9 (TC~175t^ = 180~1000 organic peroxide. By ι min half: Ϊ = interst = excellent storage stability, free radical polymerizable base) vinegar, peroxidation Di-dicarbonate (2-ethylhexyl-dipropylbenzene, peroxysulphate, u, 3,3^ neodecanoic acid isoperoxide, peroxidic neodymium ring Al ^ 曰 - laurel ruthenium citrate Trihexyl vinegar, neodymium neodecanoic acid "; ^, peroxidation of new peremulsified-2-ethylhexanoic acid u, 3,3_tetramethyl^yl-2'5-di (2_ethylhexyl) Sulfhydryl peroxide, hexane, peroxidation, which = second hexyl ester, peroxy-2-ethylhexyl hexyl butyl hexyl acrylate, peroxy-2-ethylhexanoic acid Neoheptanoic acid dicarboxylic acid di-t-butyl vinegar, peroxidation: chemical hexahydro-p-phenylene dioxygenated neodecanoic acid 3 • minus · U• two fA — ^ hexane ^ second amyl ester, I (10) tetramethyl butyl vinegar , peroxidation;:: the first, ^ ethylhexanoic acid third La, two (four) 2 Peroxidation 1 , two substances: isopropyl early third hexyl ester, tert-butyl peroxy cis-butane dioxime = 201204797 Oxidized-3,5,5-tridecylhexanoic acid tert-butyl ester, Oxidized lauric acid butyl vinegar, 2,5-dimercapto-2,5-di (3:methyl benzoyl peroxide peroxidized) hexane, peroxy-2-ethylhexyl monocarbonate tert-butyl ester, Oxidized behenic acid, third hexyl ester, 2,5-dimercapto-2,5-bis(phenylhydrazinoperoxy)hexane, tert-butyl peroxybenzoate, trimethyl adipate diperoxide Organic peroxides such as butyl ester, third amyl peroxyoctanoate, third amyl peroxyisophthalate, and triamyl peroxyformate; 2,2'-azobis-2,4·2 Methyl valeronitrile, 'nitrogen double 0 (1_ethyloxy-1-phenylethane), 2,2'-azobisisobutyronitrile, 2,2,_azobis(2·methylbutyl) Nitrile), monomethyl-2,2-azobisisobutyronitrile, 4,4,-azobis(4-cyanovaleric acid), 1, Γ-azobis(1-cyclohexanecarbonitrile The azo compound soil may be used in combination of two or more kinds of compounds in addition to the above-mentioned compounds. Further, '(c) a radical polymerization initiator may be used by i5〇 A compound which generates radicals upon irradiation with light of nm to 75 〇 nm. As a compound as described above, for example, Photoinitiation, Photop〇lymerizati〇n, and

Photocuring，J.-P. Fouassier, HanserPublishers( 1995 年，ρ17 〜p35)中δ己載的α-乙酿胺基苯酮（a_acetamin〇phenone) 衍生物或膦氧化物衍生物對光照射的感度高，故而更佳。 該些化合物除了單獨使用以外，亦可與上述有機過氧 化物或偶氮化合物混合使用。 相對於（a)熱塑性樹脂！〇〇質量份’上述自由 基聚合起始劑的含量較佳為0.1質量份〜5〇〇質量份，更 佳為1質量份〜300質量份，尤佳為5質量份〜50質量份， 特佳為10質量份〜30質量份。若（c)自由基聚合起始劑 31 201204797 38555pif 的含量小於0.1質量份，則存在黏著劑組成物變得難以充 分硬化的傾向，若超過500質量份，則存在儲藏穩定性惡 化的傾向。 本實施形態中的（d)具有磷酸基的乙烯基化合物（含 構酸基的乙烯基化合物）若為具㈣酸基及乙縣的化合 物’則並無制限制，更佳為分子内具有至少—個以上的 f自(甲基）丙烯醯基作為乙烯基的填酸 土 -夂-曰&物。如上所述的化合物可列舉 式㈤〜通式（〇)所表示的化合物。“下述通 [化 17]Photocuring, J.-P. Fouassier, HanserPublishers (1995, ρ17 ~ p35) δ-loaded α-ethaamine phenone derivatives or phosphine oxide derivatives have high sensitivity to light irradiation Therefore, it is better. These compounds may be used in combination with the above organic peroxide or azo compound, in addition to being used singly. Relative to (a) thermoplastic resin! The content of the above-mentioned radical polymerization initiator is preferably 0.1 part by mass to 5 parts by mass, more preferably 1 part by mass to 300 parts by mass, even more preferably 5 parts by mass to 50 parts by mass, particularly preferably Preferably, it is 10 parts by mass to 30 parts by mass. When the content of the (c) radical polymerization initiator 31 201204797 38555pif is less than 0.1 part by mass, the adhesive composition tends to be difficult to be sufficiently hardened, and if it exceeds 500 parts by mass, the storage stability tends to deteriorate. In the present embodiment, (d) a vinyl compound having a phosphate group (a vinyl compound containing an acid group) is not limited as long as it has a compound of (4) acid group and B compound, and more preferably has at least one in the molecule. More than one of the (meth) propylene fluorenyl groups are used as the acid-filled earth-夂-曰 & The compound represented by the above formula (5) to the formula (〇) can be exemplified. "The following pass [Chemistry 17]

R 15- lV〇.R 15- lV〇.

I OH R16 0-(L- -R15 CM) [式（=)中’ R15表示（曱丙 氮原子f'f’…分別獨立地表示Λ的二表r 外，式中，R、此、R16彼此、k =二 相同，亦可不同。] 久1谈此分別可 [化 18] 中士 4令2朴。士 mJn OH l fCH,—(ϋ—( (CH2J—R17 -CN) 32 1 201204797 [式（N)中，Rl7表示（曱基)丙烯醯基氧基，131及11分 別獨立地表示1〜8的整數；此外，式中，r17彼此、瓜彼 此以及11彼此分別可相同，亦可不同。] [化 19] R18-I OH R16 0-(L- -R15 CM) [In the formula (=), R15 represents (the fluorinated nitrogen atom f'f'... independently represents the two tables of Λ, where R, this, R16 Each other, k = two is the same, can be different.] Long 1 talk about this separately [Chemistry 18] Sergeant 4 orders 2 Park. Shi mJn OH l fCH, - (ϋ - ( (CH2J-R17 -CN) 32 1 201204797 [In the formula (N), Rl7 represents a (fluorenyl) acrylonitrileoxy group, and 131 and 11 each independently represent an integer of 1 to 8; further, in the formula, r17, melon and 11 respectively are the same, respectively Can be different.] [Chem. 19] R18-

Ri$Ri$

〇11 -P— I OH〇11 -P- I OH

OH …（O) 卜[式（〇)中’ R18表示（曱基)丙烯醯基氧基，表示 氮原子或者曱基’ 0及P分別獨立地表示1〜8的整數；此 外，式中，:R19彼此以及〇彼此分別可相同，亦可不同。] (d)含碟酸基的乙烯基化合物具體而言可列舉：甲基 丙細酉夂酉夂式石粦氧基乙醋（acid phosphoxy ethyl methacrylate)、丙烯酸酸式磷氧基乙酯、曱基丙烯酸酸式 石粦氧基丙醋、酸式磷氧基聚氧乙二醇單曱基丙烯酸酯、酸 式碟氧基聚氧丙二醇單曱基丙烯酸酯、磷酸2,2，_二（甲基) 丙細酿氧基二乙醋、環氧乙烧（ethylene oxide，EO)改質 石舞酸二甲基丙烯酸酯、磷酸改質環氧丙烯酸酯、磷酸乙烯 酉旨等。 黏著劑組成物中的（d )含磷酸基的乙烯基化合物的含 量較佳為與含磷酸基的乙烯基化合物以外的（b)自由基聚 合性化合物的含量獨立地相對於（a)熱塑性樹脂100質量 份’設為0.2質量份〜3〇〇質量份，更佳為設為1質量份 33 20120479/. 〜200質量份，尤佳為設為i質量份〜5〇 設為1質，〜1G質量份。若將⑷含鱗“的乙烯基 化合物的含量設為小於〇.2質量份，則存在變得難以^ 高黏著強度的傾向，若超過·質量份，則存在硬化^的 黏者劑組成物的物性容易降低，變得難以確保可靠性的傾 向。 、 子若組成物中所含有的(e)導電性粒 子右為於/、1體或者表面具有導電性的粒子即可，於 的電路構件的連接的情況，較佳為平物: 小於連接端子間距離。 -7 丁 工 ⑷導紐粒子可解：Au、Ag、Ni、Cu 金屬粒子或碳等。另外，亦可為以非導電性的 旬 子τ核上包覆有上述金屬、金屬粒子i炭 導電性粒子為以塑膠為核且於該‘ 子的情況，由於ί由或碳的粒子或熱炼融金屬粒 與：接觸面=熱;變=:連接時 增加導電性粒子 因此適宜將复丄二二電極電路間的絕緣性可提高’ 就八，二 與（e)導電性粒子混合使用。 平均粒面而言，(e)導電性粒子的 電性粒子的情Γ 於含有如上所述的（e)導 月兄黏者劑組成物可適宜作為異向導電性黏 34 201204797. 著劑來使用。 黏著劑組成物中的（e)導電性粒子的含 制，相對於黏著劑組成物總體積，較佳為設為〇1體前 /刀比（V〇1%)〜30v〇1%，更佳為設為 〇.1 v〇1%〜10 v〇1%。 右祕小於0.1 VGl%，則存在導雜變低_向，若 =vol%，則存在變得容易產生電路的短路的傾向。此外， ，積百分比是基於23t的硬化前的各成分的體積來決 疋’各成分的_可_比4，由重量鮮為體積。另外， 亦可將向在量筒等巾加人有不使該成分溶解或賴而使該 成分充分潤濕的適當溶劑（水、醇等）者中投人該成分而 增加的體積作為該成分的體積來求出。 另外，本實施形態的黏著劑組成物中，為了控制硬化 速度或賦予儲藏穩定性，可添加穩定劑。如上所述的穩定 劑並無特別限制，可使用公知的化合物，較佳為苯醌 (benzoquinone )或對苯二驗（hydroquinone )等酿衍生物、 4_曱氧基苯酚（4-methoxyphen〇l)或4-第三丁基鄰苯二酚 j4-t-butyl catech〇l)等酚衍生物、2,2 6,6_四曱基哌啶卜 氧（2,2,6,6七加11161;1171卩1卩61^(11116-1-〇\71)或4-經基-2,2,6,6- 四曱基〇辰咬氧等胺基氧（aminoxyl)衍生物、曱基丙稀 酸四曱基哌啶基酯等受阻胺衍生物等。 相對於黏著劑組成物100質量份，穩定劑的含量較佳 質量份〜30質量份，更佳為〇.〇5質量份〜1〇質量 伤。、於含量小於〇 〇1質量份的情況，變得難以控制硬化速 度或賦予儲藏穩定性，於超過3〇質量份的情況，變得容易 35 201204797 Λ. 對與其他成分的相溶性造成不良影響。 另外’本貫施形態的黏著劑組成物中’ f適宜添加烧 氧基石夕烧（alkoxysilane)衍生物或矽氮烷（siiaZane)衍生 物所代表的偶合劑、密著性提高劑及調平劑等黏著助劑。 偶合劑具體而言較佳為下述通式（P)所表示的化合物。 黏著助劑除了單獨使用以外，亦可將2種以上的化合物混 合使用。 [化 20]OH ... (O) 卜 [in the formula (〇), R18 represents a (fluorenyl) acryloyloxy group, and represents a nitrogen atom or a thiol group, and 0 and P each independently represent an integer of 1 to 8; : R19 and the 〇 can be the same or different from each other. (d) The vinyl compound containing a disc acid group may specifically be exemplified by acid phosphoxy ethyl methacrylate, phosphatidyl acrylate, hydrazine. Acrylic acid fluorenyl propyl acrylate, acid phosphorus oxypolyethylene glycol monodecyl acrylate, acid oxy propylene glycol monodecyl acrylate, phosphoric acid 2, 2, _ (a Base) propylene fine oxyethylene glycol, ethylene oxide (EO) modified stone oxalate dimethacrylate, phosphoric acid modified epoxy acrylate, vinyl phosphate, etc. The content of the (d) phosphate group-containing vinyl compound in the adhesive composition is preferably independently from the (b) radical polymerizable compound other than the phosphoric acid group-containing vinyl compound (a) thermoplastic resin. 100 parts by mass is set to 0.2 parts by mass to 3 parts by mass, more preferably 1 part by mass of 33 20120479/. to 200 parts by mass, and more preferably set to i part by mass to 5 parts by weight to 1 mass, ~ 1G parts by mass. When the content of the (4) scaly vinyl compound is less than 0.2 parts by mass, the adhesive strength tends to be difficult to be high, and if it exceeds the mass portion, the cured adhesive composition is present. The physical properties are likely to be lowered, and it is difficult to ensure the reliability. The (e) conductive particles contained in the sub-composition are right-handed on the /, one-body or surface-conducting particles, and the circuit components are In the case of connection, it is preferably a flat object: less than the distance between the connection terminals. -7 Dinggong (4) The guide beam particles can be solved: Au, Ag, Ni, Cu metal particles or carbon, etc. In addition, it can also be non-conductive. The above-mentioned metal and metal particles i carbon conductive particles are coated with the plastic as the core and in the case of the ', the particles or the hot-smelting metal particles and the contact surface = heat; Change =: When conductive particles are added during connection, it is suitable to improve the insulation between the reticular and two electrode circuits. [Eight, two and (e) conductive particles are mixed. In terms of average grain, (e) conductivity The electrical particles of the particles are contained in the above (e) The composition of the guiding agent can be suitably used as an anisotropic conductive adhesive. The composition of the (e) conductive particles in the adhesive composition is relative to the total composition of the adhesive. The volume is preferably set to 〇1 body front/knife ratio (V〇1%)~30v〇1%, more preferably set to 〇.1 v〇1%~10 v〇1%. Right secret is less than 0.1 VGl %, there is a tendency that the impurity becomes low _ direction, and if it is = vol%, there is a tendency that a short circuit of the circuit tends to occur. Further, the product percentage is based on the volume of each component before hardening of 23t. _可_比4, from the weight of the fresh volume. In addition, it is also possible to add a suitable solvent (water, alcohol, etc.) to the towel such as the measuring cylinder without dissolving or relying on the component to sufficiently wet the component. The volume of the component added by the intermediate member is determined as the volume of the component. Further, in the adhesive composition of the present embodiment, a stabilizer may be added in order to control the curing rate or to impart storage stability. The agent is not particularly limited, and a known compound can be used, preferably benzoquinone or p-benzoquinone. a phenol derivative such as a hydroquinone, a 4-phenolic phenol derivative, a 4-butoxyphenol (4-methoxyphen〇l) or a 4-tert-butyl catechol j4-t-butyl catech〇l), 2, 2 6 , 6_tetradecylpiperidinyloxy (2,2,6,6-7 plus 11161; 1171卩1卩61^(11116-1-〇\71) or 4-mercapto-2,2,6,6 - a hindered amine derivative such as an aminoxyl derivative such as tetrahydrocarbyl acetophenone or a tetradecylpiperidyl thioglycolate, etc., and a stabilizer of 100 parts by mass relative to the adhesive composition The content is preferably in the form of parts by mass to 30 parts by mass, more preferably 〇.〇5 parts by mass to 1% by mass. When the content is less than 质量1 parts by mass, it becomes difficult to control the curing rate or to impart storage stability, and it becomes easy to exceed 3 parts by mass. 35 201204797 Λ. Adverse effects on compatibility with other components . Further, 'the adhesive composition of the present embodiment is suitable for adding a coupling agent, an adhesion improving agent and a leveling agent represented by an alkoxysilane derivative or a sulphin derivative. Adhesive additives. The coupling agent is specifically preferably a compound represented by the following formula (P). The adhesion promoter may be used alone or in combination of two or more kinds of compounds. [Chem. 20]

* [式（P)中’R2〇、R21及R22分別獨立地表示氮原子、 碳數1〜5的烷基、碳數1〜5的烷氧基、碳數丨〜5的烷氧 基羰基或者芳基，R23表示（曱基)丙烯醯基、乙烯基、異氰 酸酯基、咪唑基、巯基、胺基、曱基胺基、二曱基胺基、 苄基胺基、苯基胺基、環己基胺基、嗎啉基、哌嗪基、脲 基或者縮水甘油基，q表示1〜1〇的整數。] 本實施形態的黏著劑組成物亦可以應力緩和及黏著性 提高為目的而併用橡膠成分。所謂橡膠成分，是指在其原 本的狀態下表現出橡膠彈性（JISK6200)的成分或者藉由 反應而表現出橡膠彈性的成分。橡膠成分於室溫（25七） 下可為固形，亦可為液狀，就流動性提高的觀點而言，較 36 201204797 佳1液狀。橡膠成分較佳為具有聚丁二稀骨架的化合物。 ，膠成分可具有氰基、絲、減、（？基)丙烯醯基或者 ，啉f。另外，就黏著性提高的觀點而言，較佳為於側鏈 或末，合有作為南極性基的氣基、緩基的橡膠成分。此外， =便疋具有聚丁二烯骨架的化合物，亦於表現出熱塑性的 月況分類為（a)熱塑性樹脂，於表現出自由基聚合性的情 況分類為（b)自由基聚合性化合物。 橡膠成分具體而言可列舉：聚異戊二稀、聚丁二稀、 j端聚丁二烯、經基末端聚丁二烯、u•聚丁二稀、 梭二、_? 1,2-聚丁二稀、經基末端I2-聚丁二稀、丙烯酸 ^昧本乙婦-丁二婦橡膠、經基末端苯乙婦-丁二烯橡膠、 j t丁二烯橡膠，於聚合物末端含有羧基、羥基 基丙=丁二_，_腈 炼）、^ W氧丙婦）、烧氧基石夕絲末端聚(氧丙 烯）來（乳四亞甲基)二醇、聚烯烴二醇等。 分且=二有高極性基且於室溫下為液狀的橡膠成 竣基、趣基、（甲基)丙婦酿基或者嗎琳基的液狀丙 稀’錄絲化麟鱗；作為極性基的丙 烯腈3 1較佳為10質量％〜6〇質量％。 忒些橡膠成分除了單獨使用以外， 化合物混合使用。 Η將2種以上的 黏著f生1卜=實施形態的黏著劑組成物中，以應力緩和及 —的，亦可添加有機微粒子。有機微粒子的 37 4. 201204797 平均粒徑較佳為〇.05 μηι〜1 〇 μηι。此外，於有機微粒子包 含上述橡膠成分的情況’分類為橡膠成分而並非有機微粒 子’於有機微粒子包含上述（a)熱塑性樹脂的情況，分類 為（a)熱塑性樹脂而並非有機微粒子。 有機微粒子具體而言可列舉包含以下化合物的有機微 粒子：聚異戊二烯、聚丁二烯、羧基末端聚丁二烯、羥基 末端聚丁二烯、1，2-聚丁二烯、羧基末端ι，2-聚丁二烯、丙 烯酸橡膠、笨乙烯-丁二烯橡膠、丙烯腈_丁二烯橡膠，於 聚合物末端含有羧基、羥基、（甲基）丙烯醯基或者嗎啉基 的丙烯腈•丁二烯橡膠’羧基化腈橡膠、羥基末端聚(氧丙 烯）、烷氧基矽烷基末端聚(氧丙烯）、聚(氧四亞曱基)二醇、 聚烯烴二醇（曱基）丙烯酸烷基酯-丁二烯-苯乙烯共聚物、 (曱基)丙烯酸烷基酯-聚矽氧共聚物或者聚矽氧（曱基)丙稀 酸共聚物或者複合物。 該些有機微粒子除了單獨使用以外，亦可將2種以上 的化合物併用來使用。 本實施形態的黏著劑組成物的斷裂伸長率較佳為 300%〜500°/。’更佳為300%〜450%。藉由斷裂伸長率在上 述範圍内，而賦予充分的可撓性，即便為具有有機基材的 被黏附體（聚醯亞胺、PET、PC、PEN等）’亦可追隨其 等的變形’電路構件間的黏著強度提高’可獲得優異的連 接可靠性。若斷裂伸長率小於300%，則存在無法賦予充 分的可撓性，變得難以追隨被黏附體的變形的傾向，若大 於500% ’則存在可撓性過大，電路構件間的黏著強度變 38 201204797 得容易降低的傾向。 了般認為’斷裂伸長率可藉由使用由脂肪族系或者芳 香族系的二異氰酸@旨與脂肪族㈣二醇而獲得的胺基甲酸 酉曰（甲基)丙烯酸酯來調整。例如，若增加上述胺基曱酸酿 (曱基)丙，咖的含量’則存在斷裂伸長率變大的傾向。 f外’若上述胺基曱㈣（曱基)丙烯酸s旨的重量平均分子 里變大’則存在斷裂伸長率亦變大的傾向。另外，若熱塑 ，树月a的重量平均分子量高且Tg低，則存在斷裂伸長率 4大的倾肖$外，自由基聚合性化合物中的上述胺基甲 酸(甲基旨所佔的比例高者存在斷裂伸長率變大 的傾向、。另外，加人有橡膠成分者存在斷裂伸長率變大的 傾向進而’ &有機微粒子或無機填料的含量少，則 辦裂伸長率變大的傾向。 、 本實施形態的雜著劑組成物的2〇(rc下的儲藏彈性模 0.5 MPa-5 MPa » 0.5 MPa-3.5 MPa ° - 般認為，藉由20(TC下的儲藏彈性模數在上述範圍内，可 兼顧充分的可撓性及交《度，緩和轉·錢的被黏 =體與黏著敝成物界面的應力。因此，不僅可提高電路 構件間的黏著強度’而且即便於長時間的可靠性試驗後亦 可維持穩定的性能。若賊雜觀小於G.5 MPa或者大 =5 MPa，則存在變得難以兼顧充分的連接強度及良好的 連接可靠性的傾向。 本實施形態的黏著劑組成物於在常溫下為液狀的情況 可以㈣狀使用。於在室溫下為固體的情況，除了加熱而 39 201204797 a i 使用以外，亦可使用溶劑而聚料化。可使用的溶劑較佳為 與黏著齡賴及添加舰減應性，且魏出充分的溶 解性的溶劑，較佳為常壓下的沸點為 劑。於彿點小於50。(:的情況，存在若於室溫下放置則揮發 的顧慮增多’於開放系統中的使用變得困難的傾向。另外， 若沸點超過15Gt，财在難以使溶卿發，對黏著後的 可靠性造成不良影響的情況增多的傾向。 另外’本實施形態的黏著劑組成物亦可製成膜狀而使 用。可將於黏賴組成物巾視需要添加溶鮮而成的溶液 塗佈於氟樹脂膜、聚對苯m膜、脫模紙等剝離 性基材上’或者使錢料基财含浸上雜㈣載置於 剝離性基^上’去除溶解而製成膜來使^若以膜的形 狀使用黏著劑組成物’職操作性等方面*言更便利。/ 本實施形態的黏著劑組成物可將加熱及加壓併用而黏 著。加熱溫度較佳為100。(：〜20(rc的溫度。壓力較佳為不 對被黏附體造成損傷的範圍，通常較佳為Q」略〜1〇 MPa。該些加熱及加壓較佳為於〇 5秒〜12〇秒的範圍内進 f於12GC〜19GC、3 MPa、1G秒的加熱下亦可使其黏 著。 本實施形態的點著劑組成物可作為熱膨脹係數不同的 異種被黏附體的黏著劑而使用。具體而言，可作為異向 電黏著劑、銀祕、賴等所代表的電路連接材料，晶片 尺寸封裝（chip scale package，csp)用彈性體、csp用底 部填充材料、引線覆蓋晶 >;封裝（leadGnehip，L〇c)帶 201204797 ΙΑ. 等所代表的半導體元件黏著材料而使用。 (第2實施形態） 另外，本發明的第2實施形態的黏著劑組成物是用於 將主面上具有第一連接端子的第一電路構件、與主面上具 有第二連接端子的第二電路構件連接的黏著劑組成物，上 述黏著劑組成物的特徵在於：含有（a)埶塑性樹脂、（b) .自由基聚合性化合物、及⑷Μ基聚合曰⑻（自) 由基聚合性化合物含有胺基甲酸酯（甲基）丙烯酸酯，且斷 裂伸長率為300%〜500%。 、藉由上述第2實施形態的黏著劑組成物含有上述各成 分’（b)自由基聚合性化合物含有胺基甲酸酯（曱基）丙烯 馱酉曰，且斷裂伸長率為300%〜5〇〇%，可對黏著劑組成物 賦予充分的可撓性，可追隨被黏附體（聚醯亞胺、pET、 PC、PEN等）的變形’因此電路構制的黏著強度提高， 可獲知優異的連接可靠性。上述黏著劑組成物的斷裂伸長 率更佳為300%〜450%。 士上述第2實施形態的黏著劑組成物中，關於（a)熱塑 i·生j脂及（c)自由基聚合起始劑，是使用與上述第丨實施 =悲的黏著劑組成物相同的化合物。另外，（b)自由基聚 合性化合物於所含有的胺基曱酸酯（曱基)丙烯酸酯的臨界 f面張力並無特別限定的方面有所不同，但與第1實施形 態的黏著劑組成物同樣地，所含有的胺基甲酸g旨（甲基)丙 烯酸酯的臨界表面張力較佳為20 mN/m〜40 mN/m，更佳 為 0 mN/m〜35 mN/m ’ 尤佳為 2〇 mN/m〜33 mN/m。另 201204797· 外，關於200°C下的儲藏彈性模數，亦與上述第！實施形 態的黏著劑組成物同樣地，較佳為〇 5MPa〜5MPa，更佳 為 0.5 MPa〜3.5 MPa。 上述第2實施形態的黏著劑組成物與第丨實施形態的 黏著劑組成物同樣地，較佳為包含（d)具有磷酸基的乙烯 基化合物。藉由包含（d)具有磷酸基的乙烯基化合物，可 提南黏著劑組成物對金屬基材的黏著性。另外，可獲得對 具有由金屬或ITO、IZO等所構成的連接端子的電路構件 的優異黏著強度。 另外，上述第2貫施形態的黏著劑組成物中，與第1 貫施形態的黏著劑組成物同樣地，可添加（e)導電性粒子 或穩定劑、偶合劑、黏著助劑、橡膠成分及有機微粒子。 關於（a)熱塑性樹脂、（b)自由基聚合性化合物、及 (c)自由基聚合起始劑，上述第2實施形態的黏著劑組成 物較佳為具有與第1實施形態的黏著劑組成物相同範圍的 含量。另外，於含有（d)具有磷酸基的乙烯基化合物或（幻 導電性粒子、穩定劑、偶合劑、黏著助劑、橡膠成分、及 有機微粒子的情況，關於該等，亦較佳為具有與第丨實施 形態的黏著劑組成物相同範圍的含量。 本發明的第1實施形態或者第2實施形態的黏著劑植 成物是作為用於將主面上具有第一連接端子的第_電路構 件、與主面上具有第二連接端子的第二電路構件連接的 著劑組成物來使用。此處，上述第一電路構件及/戈上、// 二電路構件較佳為由包含玻璃轉移溫度為200¾^下 42 201204797 塑性柄·脂·的基材所構成，上述第一連接端子及/或上述第二 連接端子較佳為由ITO及/或IZO所構成。玻璃轉移溫度 為200 c以下的熱塑性樹脂並無特別限定，例如可列舉聚 對苯二甲酸乙二酯、聚碳酸酯及聚萘二甲酸乙二酯等。 接著，對使用上述本實施形態的黏著劑組成物的電路 構件的連接結構體進行說明。圖1是表示使用不含（e)導 電性粒子的本貫施形態的黏著劑組成物的電路構件的連接 結構體的一實施形態的示意剖面圖。圖2是表示製作圖i 所示的電路構件的連接結構體之前的第一電路構件、第二 電路構件及黏著劑組成物（不含導電性粒子）的示意剖面 圖。 ’ 圖1所示的電路構件的連接結構體10〇包括：於第一 電路基板31的主面31a上具有第一連接端子32的第一電 路構件30、於第二電路基板41的主面41a上具有第二連 接端子42的第二電路構件4〇、以及以第一連接端子32與 第二連接端子42對向的方式將第一電路基板31的主面 31a與第二電路基板41的主面41a連接的連接構件1〇c。 第一連接端子32與第二連接端子42是藉由相互接觸而電 性連接。另外，連接構件10C包含本實施形態的黏著劑組 成物10的硬化物。 圖1所示的電路構件的連接結構體1〇〇例如可以如下 方式來製造。 首先，如圖2所示，準備第一電路構件30、第二電路 構件40及成形為膜狀的黏著劑組成物1〇。接著，將黏著 43 201204797 =成的物二trr路構件4°的形成有第二連接端 -連接端子m、二:於黏著劑組成物10上，以第 路爐株m 、第一連接鳊子42對向的方式載置第一電 。^後，經由第—電路構件 第__ 40,將黏著劑组纽1Λ鱼㈣構件3G及第—電路構件 Ήρ»、'成物10 一邊加熱一邊使其硬化，同時對主 電路構向垂直方向加壓，於第—電路構件3〇及第二 的連接結構體H形成連接構件1〇C，獲得圖1的電路構件 點菩L3 ΐ表示使用含有（e)導電性粒子的本實施形態的* [In the formula (P), 'R2〇, R21 and R22 each independently represent a nitrogen atom, an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, and an alkoxycarbonyl group having a carbon number of 丨5. Or aryl, R23 represents (fluorenyl)propenyl, vinyl, isocyanate, imidazolyl, fluorenyl, amine, decylamino, dimethylamino, benzylamino, phenylamino, ring A hexylamino group, a morpholinyl group, a piperazinyl group, a ureido group or a glycidyl group, and q represents an integer of 1 to 1 Å. In the adhesive composition of the present embodiment, a rubber component can be used together for the purpose of stress relaxation and adhesion improvement. The rubber component refers to a component which exhibits rubber elasticity (JISK6200) in its original state or a component which exhibits rubber elasticity by reaction. The rubber component may be solid at room temperature (25), or may be liquid. From the viewpoint of improved fluidity, it is better than 36 201204797. The rubber component is preferably a compound having a polybutadiene skeleton. The gum component may have a cyano group, a silk, a minus, a (meth) acryl fluorenyl group, or a porphyrin f. Further, from the viewpoint of improving the adhesion, it is preferred to have a rubber component which is a gas base or a slow base of the south polar group at the side chain or the end. Further, the compound having a polybutadiene skeleton is classified into (a) a thermoplastic resin in the case of exhibiting thermoplasticity, and is classified as (b) a radically polymerizable compound in the case of exhibiting radical polymerizability. Specific examples of the rubber component include polyisoprene, polybutadiene, j-terminal polybutadiene, trans-terminal polybutadiene, u•polybutylene, shuttle II, _? 1,2- Polybutadiene dilute, trans-terminal end I2-polybutadiene dilute, acrylic acid 昧 乙 乙 乙 丁 丁 丁 丁 妇 妇 、 、 、 、 、 、 、 、 含有 含有 含有 含有 含有 含有 含有 含有 含有Carboxylic acid, hydroxy group C = butyl _, _ nitrite, ^ oxypropyl ketone), alkoxy sulphide terminal poly(oxypropylene) (milktetramethylene) diol, polyolefin diol, and the like. a rubber with a high polarity group and a liquid at room temperature, which is a thiol group, a fun group, a (meth) propylene base or a linalyl liquid propyl ray. The polar group acrylonitrile 31 is preferably 10% by mass to 6% by mass. These rubber components are used in combination of compounds in addition to being used alone. 2 Two or more types of adhesives can be added to the adhesive composition of the embodiment, and the organic fine particles can be added by stress relaxation. Organic microparticles 37 4. 201204797 The average particle size is preferably 〇.05 μηι~1 〇 μηι. Further, the case where the organic fine particles contain the rubber component is classified as a rubber component and not the organic fine particles. When the organic fine particles include the above (a) thermoplastic resin, they are classified into (a) a thermoplastic resin and not organic fine particles. Specific examples of the organic fine particles include organic fine particles containing polyisoprene, polybutadiene, carboxyl terminal polybutadiene, hydroxyl terminated polybutadiene, 1,2-polybutadiene, and carboxy terminal. ι,2-polybutadiene, acrylic rubber, stupid ethylene-butadiene rubber, acrylonitrile-butadiene rubber, carboxy, hydroxyl, (meth)acrylonitrile or morpholinyl propylene at the end of the polymer Nitrile butadiene rubber 'carboxylated nitrile rubber, hydroxyl terminated poly(oxypropylene), alkoxyfluorenyl terminal poly(oxypropylene), poly(oxytetradecyl) glycol, polyolefin diol An alkyl acrylate-butadiene-styrene copolymer, an alkyl (meth) acrylate-polyoxy oxycopolymer or a poly(oxymethylene) acrylate copolymer or composite. These organic fine particles may be used alone or in combination of two or more kinds. The elongation at break of the adhesive composition of the present embodiment is preferably from 300% to 500 °/. ‘More preferably 300%~450%. When the elongation at break is within the above range, sufficient flexibility is imparted, and even an adherend having an organic substrate (polyimine, PET, PC, PEN, etc.) can follow its deformation. Improved adhesion strength between circuit components' provides excellent connection reliability. When the elongation at break is less than 300%, sufficient flexibility cannot be provided, and it tends to be difficult to follow the deformation of the adherend. If it is more than 500%, the flexibility is too large, and the adhesion strength between the circuit members is changed. 201204797 has a tendency to be easily lowered. It is generally considered that the elongation at break can be adjusted by using hydrazine urethane (meth) acrylate obtained by using an aliphatic or aromatic diisocyanate, and an aliphatic (tetra) diol. For example, when the above amino phthalic acid is added, the content of coffee is increased, and the elongation at break tends to increase. When the above-mentioned amine fluorene (tetra)(fluorenyl)acrylic acid has a large weight average molecular weight, the elongation at break also tends to increase. In addition, in the case of thermoplastics, the weight average molecular weight of the tree a is high and the Tg is low, and the elongation at break is 4, and the aminocarboxylic acid in the radically polymerizable compound (the proportion of the methyl group) In the case of a person having a rubber component, the elongation at break tends to increase, and the elongation at break tends to increase, and the content of the organic fine particles or the inorganic filler is small, and the elongation at break tends to increase. 2〇 of the hybrid composition of the present embodiment (the storage elastic modulus at rc 0.5 MPa-5 MPa » 0.5 MPa-3.5 MPa ° is generally considered to be 20 (the storage elastic modulus at TC is above) In the range, it is possible to achieve sufficient flexibility and balance, and to relieve the stress of the interface between the body and the adhesive. Therefore, not only the adhesion strength between the circuit members can be improved, but also for a long time. After the reliability test, stable performance can be maintained. If the thief is less than G.5 MPa or large = 5 MPa, it tends to be difficult to achieve sufficient connection strength and good connection reliability. Adhesive composition When it is liquid at normal temperature, it can be used in the form of (4). When it is solid at room temperature, in addition to heating, it can be polymerized using a solvent other than 39 201204797 ai. The solvent which can be used is preferably the age of adhesion. The solvent which relies on the addition of the ship to reduce the solubility and is fully soluble, preferably the boiling point under normal pressure is less than 50. In the case of :, if it is placed at room temperature, it volatilizes. In addition, when the boiling point exceeds 15 Gt, it is difficult to cause dissolution, and there is a tendency that the reliability after adhesion is adversely affected. The adhesive composition can also be used in the form of a film. It can be applied to a fluororesin film, a polyparaphenylene m film, a release paper, etc., in a solution in which a composition film is added as needed. On the substrate, 'or make the money base impregnated with miscellaneous (4) on the exfoliating base' to remove the solution to form a film, so that if the shape of the film is used, the adhesive composition is used. More convenient. / Adhesive of this embodiment The composition may be adhered by heating and pressurization. The heating temperature is preferably 100. (: 〜20 (the temperature of rc. The pressure is preferably a range which does not cause damage to the adherend, and is usually preferably Q" slightly ~1 〇 MPa. The heating and pressurization are preferably carried out in the range of 5 seconds to 12 sec seconds, and may be adhered to the heating of 12GC to 19GC, 3 MPa, and 1 G sec. The composition of the agent can be used as an adhesive for a heterogeneous adherend having different coefficients of thermal expansion. Specifically, it can be used as a circuit connecting material represented by an anisotropic electric adhesive, a silver secret, a ray, etc., and a chip scale package. , csp) using an elastomer, a csp underfill material, a lead-coated crystal >; a package (leadGnehip, L〇c) with a semiconductor element adhesive material represented by 201204797 等. (Second Embodiment) The adhesive composition according to the second embodiment of the present invention is a first circuit member having a first connection terminal on the main surface and a second connection terminal having a second connection terminal on the main surface. An adhesive composition to which a circuit member is connected, the adhesive composition comprising: (a) a ruthenium plastic resin, (b) a radical polymerizable compound, and (4) a ruthenium-based polymer ruthenium (8) (from) a base polymerizable compound It contains a urethane (meth) acrylate and has an elongation at break of 300% to 500%. The adhesive composition according to the second embodiment contains the above-mentioned respective components '(b) The radically polymerizable compound contains a urethane (mercapto) propylene oxime and has an elongation at break of 300% to 5 〇〇%, which gives sufficient flexibility to the adhesive composition, and can follow the deformation of the adherend (polyimine, pET, PC, PEN, etc.), so the adhesion strength of the circuit structure is improved, and excellent Connection reliability. The above adhesive composition preferably has an elongation at break of from 300% to 450%. In the adhesive composition according to the second embodiment, the (a) thermoplastic i·jj and (c) radical polymerization initiator are the same as the above-mentioned third embodiment=sad adhesive composition. compound of. Further, (b) the radically polymerizable compound differs in the critical f-plane tension of the amino phthalate acrylate contained in the radically polymerizable compound, but is different from the adhesive composition of the first embodiment. Similarly, the critical surface tension of the methic acid g-containing (meth) acrylate is preferably 20 mN/m to 40 mN/m, more preferably 0 mN/m to 35 mN/m'. It is 2〇mN/m~33 mN/m. In addition, 201204797·, regarding the storage elastic modulus at 200 ° C, also with the above! Similarly, the embodiment of the adhesive composition is preferably 〇 5 MPa to 5 MPa, more preferably 0.5 MPa to 3.5 MPa. In the same manner as the adhesive composition of the second embodiment, the adhesive composition of the second embodiment preferably contains (d) a vinyl compound having a phosphate group. By including (d) a vinyl compound having a phosphoric acid group, the adhesion of the south adhesive composition to the metal substrate can be improved. Further, excellent adhesion strength to a circuit member having a connection terminal made of metal, ITO, IZO or the like can be obtained. Further, in the adhesive composition of the second embodiment, (e) conductive particles, a stabilizer, a coupling agent, an adhesion aid, and a rubber component may be added in the same manner as the adhesive composition of the first embodiment. And organic microparticles. The (a) thermoplastic resin, (b) a radically polymerizable compound, and (c) a radical polymerization initiator, the adhesive composition of the second embodiment preferably has an adhesive composition according to the first embodiment. The same range of content. Further, in the case of containing (d) a vinyl compound having a phosphoric acid group or (a magic conductive particle, a stabilizer, a coupling agent, an adhesion promoter, a rubber component, and an organic fine particle, it is preferable to have such a The adhesive composition of the first embodiment or the second embodiment of the present invention is a _th circuit member for having a first connection terminal on the main surface of the present invention. And the composition of the composition connected to the second circuit member having the second connection terminal on the main surface is used. Here, the first circuit member and/or the upper/two circuit members preferably comprise a glass transition temperature. Preferably, the first connection terminal and/or the second connection terminal are made of ITO and/or IZO, and the glass transition temperature is 200 c or less. The thermoplastic resin is not particularly limited, and examples thereof include polyethylene terephthalate, polycarbonate, and polyethylene naphthalate. Next, the electric charge using the adhesive composition of the present embodiment described above is used. The connection structure of the member will be described. Fig. 1 is a schematic cross-sectional view showing an embodiment of a connection structure of a circuit member using an adhesive composition of the present embodiment without (e) conductive particles. A schematic cross-sectional view showing a first circuit member, a second circuit member, and an adhesive composition (excluding conductive particles) before the connection structure of the circuit member shown in Fig. i is produced. The connection structure 10 includes: a first circuit member 30 having a first connection terminal 32 on a principal surface 31a of the first circuit substrate 31, and a second connection terminal 42 on a main surface 41a of the second circuit substrate 41. The second circuit member 4A and the connecting member 1c connecting the main surface 31a of the first circuit board 31 and the main surface 41a of the second circuit board 41 in such a manner that the first connecting terminal 32 and the second connecting terminal 42 face each other The first connection terminal 32 and the second connection terminal 42 are electrically connected to each other by contact with each other. The connection member 10C includes the cured product of the adhesive composition 10 of the present embodiment. The structure 1 can be manufactured, for example. First, as shown in Fig. 2, the first circuit member 30, the second circuit member 40, and the adhesive composition 1 成形 formed into a film shape are prepared. Next, the adhesive 43 is adhered. 201204797=The formation of the second trr path member 4° has the second connection end-connection terminal m, two: on the adhesive composition 10, the way of the first furnace g and the first connection tweezers 42 After the first electric device is placed, the adhesive member group 1 squid (4) member 3G and the first circuit member Ήρ», 'the product 10 are heated and hardened by the first circuit member __40, and simultaneously The main circuit is pressed in the vertical direction, and the connecting member 1〇C is formed in the first circuit member 3〇 and the second connecting structure H, and the circuit member of FIG. 1 is obtained. The use of the (e) conductive particles is indicated. The present embodiment

Hi 路構件的連接結構體的—實施形態的示 之·^Ξ4是表示製作圖3所示的電路構件的連接結 的第一電路構件、第二電路構件及黏著劑組成物 (S有導電性粒子）的示意剖面圖。 圖3所示的電路構件的連接結構體2〇〇包括：於第一 電路基板31的主面31a上具有第—連接端子％的第一電 路構件30、於第二電路基板41❸主面化上具有第二連 接端子42㈣二電路構件4〇、以及以第一連接端子％與 第二連接端子42對向的方式將第一電路基板31的主面 31a與第二電路基板41的主面41a連接的連接構件％c。 此外，連接構件20C是於黏著劑組成物的導電性粒子以外 的成分21中分散有導電性粒子22的黏著劑組成物2〇的硬 化物（即，於黏著劑組成物的導電性粒子以外的成分的硬 化物21C中分散有導電性粒子22的硬化物），於所對向的 第一連接端子32與第二連接端子42之間，藉由導電^粒 44 201204797 Λ 1 子22與兩連接端子接觸，而經由導電性粒子22使兩連接 端子電性連接。 一圖、3所不的電路構件的連接結構體200例如可如圖4 t 第一電路構件3〇、第二電路構件40及成形為 '、的按著劑組成物2〇’利用與獲得上述電路構件的連接 結構體⑽的方法相同的方法來製造。 一此處’第一電路構件30及第二電路構件40中的至少 一者車 =佳為由含有聚對苯二甲酸乙二自旨、聚碳酸醋及聚蔡 -，乙—g旨等玻璃轉移溫度為2⑽。下賴塑性樹脂 ^ 土材所構成。即，第—電路基板31及第二電路基板41 =至者較佳為含有聚對笨二甲酸乙二自旨、聚碳酸酿 及，1 一 已一醋等玻璃轉移溫度為200°C以下的熱塑 =第-電路構件3〇及第二電路構件4〇中的^少 鼓者疋^含有選自由聚對苯二曱酸乙二目旨、聚碳酸酷及聚 乙二s旨所組成組群中的至少1種的基材所構成的 θ&gt;，則與黏著劑組成物的潤濕性提高，黏著強度進 ν提冋因此，如上所述的電路構件的連接結構體可蔣 侍更優異的連接可靠性。 更 此外’第一電路構件30及第二電路構件40中的一者 ”含聚對笨二甲酸乙二醋、聚碳酸_及聚萘 :::乙—酯等破璃轉移溫度為2〇〇。。以下的熱塑性 .^所構成。形成此種電路構件的基材可使用：半導體、 的^陶物的基材；聚醢亞胺等包含有機物 壤I氧荨纟且合有無機物與有機物的基材等。 45 201204797 另外，第一連接端子32及第二連接端子42令的至少 一者較佳為由選自由ITO及ιζο所組成組群中的至少！種 所構成。ITO及IZO由於容易蝕刻且圖案加工性優異，故 而適宜作為連接端子。而且，藉由使用本實施形態的黏著 劑組成物，可充分抑㈣ΙΊΌ及/或IZ〇所構成的連接端 子的腐I虫。 此外，第-連接端子32及第二連接端子42中的一者 或兩者可由IT〇及肋以外的材料所構成。如上所述的連 ίί Mm金、1^ '錄及該些金屬的 合金等金屬的連接端子。 此外，作為連接構件來使用的本實施形態的黏著劑组 需完全硬化（於規定硬化條件下可達成的最高度的 要產^述特性，則亦可為部分硬化的狀態。 不限對本發明進行具體說明，但本發明並 〈熱塑性樹脂〉 (聚酯胺基曱酸酯的準備） 聚醋胺基甲酸S旨樹脂（東洋紡股份有限么 UR-8200 (商品名））是使用樹脂成分3〇質量 = 基酮與曱苯的1 : 1混合溶劑溶解品。 土 (苯氧基樹脂的準備） 苯氧基樹脂（東都化歧份有限公gj製造 品名））是將樹脂40質量份溶解於甲基乙基酉同6〇質量份 46 201204797 中，製成固體成分為40質量％的溶液。 (乙烯-乙酸乙烯醋共聚物的準備） 乙細-乙酸乙烯g旨共聚物（Mitsui DuPont Polychemicals 製造，EV40W (商品名））是使用樹脂成分為3〇質量❶/〇的 甲苯溶解品。 〈自由基聚合性化合物〉 (胺基甲酸酯丙烯酸酯（UA1)的合成） 於具備擾拌機、溫度計、安裝有氯化妈乾燥管的回流 冷卻官、氮氣導入管的反應容器中，投入丙烯酸2_羥基乙 醋（Aldrich股份有限公司製造）238質量份（2.05莫耳）、 對^苯二酚單甲醚（Aldrich股份有限公司製造）0.53質量 &lt;刀、數$平均分子量為1〇〇〇的聚(16己二醇碳酸酯）（商 口口 f · Duranol咖52，旭化成化學股份有限公司製造）2〇〇〇 質置伤（2.00莫耳）、二月桂酸二丁基錫（舰―股份有 ^司製造）5.53 f量份。充分導人氮氣後，加熱至70。。 ’然後以3小時均勻滴加氫化二苯基甲烧二異氰酸 =。口名· VESTANAT Hi2MD，以即卿公司製造）銜 夢由ΐ/3 〇〇莫耳），使其反應。滴加完畢後反應11小時， 定來確認異驗㈣失㈣歧應，獲得胺基甲 界♦面黾^。所得的胺基甲酸酯丙烯酸酯（UA1)的臨 為_=為24 mN/m ’重量平均分子量為13500，黏度 上，基甲酸醋丙烯酸醋(UA2)的合成） '、備攪拌機、溫度計、钱有氣简乾燥管的回流 47 201204797 -----r*li· 冷卻管、氮氣導入管的反應容器中，投入丙烯酸2-羥基乙 酯（Aldrich股份有限公司製造）238質量份（2.05莫耳）、 對苯二酚單曱醚（Aldrich股份有限公司製造）0.53質量 份、數量平均分子量為1000的聚(1,6-己二醇碳酸酯）（商 品名·· Duranol T5652 ’旭化成化學股份有限公司製造）1〇〇〇 質量份（2.00莫耳）、二月桂酸二丁基錫（Aldrich股份有 限公司製造）5.53質量份。充分導入氮氣後，加熱至70。^ 〜75°C，然後以3小時均勻滴加氫化二苯基甲烷二異氰酸 酉旨（商品名：VESTANAT H12MD，Degussa公司製造）787 質量份（3.00莫耳），使其反應。滴加完畢後反應13小時， 藉由IR測定來確認異氰酸醋消失而結束反應，獲得胺基甲 酸酯丙烯酸酯。所得的胺基甲酸酯丙烯酸酯（UA2)的臨 界表面張力為23 mN/m，重量平均分子量為15500，黏度 為 4100 Pa-s。 (胺基甲酸酯丙烯酸酯（UA3)的合成） 於具備攪拌機、溫度計、安裝有氣化鈣乾燥管的回流 冷卻管、氮氣導入管的反應容器中，投入丙稀酸2_經基乙 酯（Aldrich股份有限公司製造）238質量份（2〇5莫耳）、 對苯一酚單曱醚（Aldrich股份有限公司製造）0.53質量 伤、數1平均分子量為2〇〇〇的聚己内酯二醇（商品名： Placed 220，Daicel化學工業股份有限公司製造）4〇〇〇質 里伤（2‘00莫耳）、二月桂酸二丁基锡（Aldrich股份有限 公。司製造）5.53質量份。充分導入氮氣後 ，加熱至70°C〜 75 C然後以3小時均勻滴加異佛爾g同二異氰酸醋（入版沾 48The connection structure of the Hi-channel member - the embodiment of the structure is the first circuit member, the second circuit member, and the adhesive composition (S having conductivity) for forming the connection of the circuit member shown in Fig. 3 A schematic cross-sectional view of a particle). The connection structure 2 of the circuit member shown in FIG. 3 includes a first circuit member 30 having a first connection terminal % on the main surface 31a of the first circuit substrate 31, and a main surface of the second circuit substrate 41 The main surface 31a of the first circuit substrate 31 is connected to the main surface 41a of the second circuit substrate 41 in such a manner that the second connection terminal 42 (four) two circuit members 4A and the first connection terminal % and the second connection terminal 42 face each other Connection member %c. In addition, the connecting member 20C is a cured product of the adhesive composition 2〇 in which the conductive particles 22 are dispersed in the component 21 other than the conductive particles of the adhesive composition (that is, other than the conductive particles of the adhesive composition). A cured product of the conductive particles 22 is dispersed in the cured product 21C of the component, and is connected between the first connection terminal 32 and the second connection terminal 42 which are opposed by the conductive film 44 201204797 Λ 1 The terminals are in contact with each other, and the two connection terminals are electrically connected via the conductive particles 22. The connection structure 200 of the circuit member of FIG. 3 and FIG. 3 can be utilized, for example, as shown in FIG. 4 t, the first circuit member 3 〇, the second circuit member 40, and the composition 2 ′ which is formed as ' The method of connecting the structural members (10) of the circuit member is manufactured in the same manner. Here, at least one of the first circuit member 30 and the second circuit member 40 is preferably made of glass containing polyethylene terephthalate, polycarbonate, poly-Cai-, and B-g. The transfer temperature is 2 (10). It consists of plastic resin ^ soil material. That is, the first circuit board 31 and the second circuit board 41 = preferably contain a polyethylene terephthalate, a polycarbonate, and a glass transition temperature of 200 ° C or less. Thermoplastic=the first circuit member 3〇 and the second circuit member 4〇 include a group selected from the group consisting of poly(ethylene terephthalate), polycarbonate and polyethylene. The θ> of the at least one type of substrate in the group improves the wettability with the adhesive composition, and the adhesion strength is increased. Therefore, the connection structure of the circuit member as described above can be more excellent. Connection reliability. Furthermore, the 'one of the first circuit member 30 and the second circuit member 40' contains a polyethylene diacetate, a polycarbonate, and a polynaphthalene::: ethyl ester, etc. The following thermoplastic materials are used to form a substrate for forming such a circuit member: a substrate of a semiconductor or a ceramic; a polyimine or the like containing an organic substance and having an inorganic substance and an organic substance; 45 201204797 In addition, at least one of the first connection terminal 32 and the second connection terminal 42 is preferably made of at least one selected from the group consisting of ITO and ιζο. ITO and IZO are easy. Since it is excellent in etching and pattern workability, it is suitable as a connection terminal. Moreover, by using the adhesive composition of this embodiment, it is possible to sufficiently suppress the rot of the connection terminal formed by (4) ΙΊΌ and/or IZ 。. One or both of the connection terminal 32 and the second connection terminal 42 may be composed of a material other than the IT 〇 and the rib. The connection of the metal such as the ίί Mm gold, the 1^ 'record, and the alloy of the metal as described above. Terminal. In addition, as a connecting member The adhesive group of the present embodiment needs to be completely cured (the highest level of properties that can be achieved under predetermined curing conditions, and may be partially cured. The present invention is not limited to the specific description, but the present invention is not limited thereto. And <thermoplastic resin> (preparation of polyester amide phthalate) Polyacetate formic acid S resin (Toyobo Co., Ltd. UR-8200 (trade name)) is a resin component 3 〇 mass = ketone and benzene 1 : 1 mixed solvent dissolved product. Soil (preparation of phenoxy resin) phenoxy resin (Dongdu Chemical Co., Ltd. manufactured by GJ)) is prepared by dissolving 40 parts by mass of resin in methyl ethyl hydrazine. In a mass part of 46 201204797, a solution having a solid content of 40% by mass was prepared. (Preparation of ethylene-vinyl acetate copolymer) Ethylene-vinyl acetate g copolymer (manufactured by Mitsui DuPont Polychemicals, EV40W (trade name)) A toluene-soluble product having a resin component of 3 〇 mass ❶/〇 is used. <Free radical polymerizable compound> (Synthesis of urethane acrylate (UA1)) With a scrambler, a thermometer, and a chlorinated mother In the reaction vessel of the reflux cooling unit and the nitrogen inlet tube, 238 parts by mass (2.05 mol) of acrylic acid 2-hydroxyethyl vinegar (manufactured by Aldrich Co., Ltd.), and hydroquinone monomethyl ether (Aldrich Co., Ltd.) were charged. Manufactured) 0.53 mass &lt;knife, number: poly(16 hexanediol carbonate) having an average molecular weight of 1 ( (Shangkoukou f · Duranol Coffee 52, manufactured by Asahi Kasei Chemicals Co., Ltd.) Injury (2.00 mol), dibutyltin dilaurate (manufactured by Ships Co., Ltd.) 5.53 f. After fully introducing nitrogen, heat to 70. . Then, the diphenylcarbazone diisocyanate was uniformly added dropwise over 3 hours. The name of the mouth · VESTANAT Hi2MD, made by the company of the company, dreams of ΐ / 3 〇〇 Mo ear), make it react. After the completion of the dropwise addition, the reaction was carried out for 11 hours, and it was confirmed that the heterogeneity (four) was lost (four) and the amino group was obtained. The obtained urethane acrylate (UA1) has a _= of 24 mN/m 'the weight average molecular weight is 13,500, and the viscosity is synthesized by the hydroxyacetic acid vinegar (UA2)), a mixer, a thermometer, The return of the gas with a simple drying tube 47 201204797 -----r*li· In the reaction vessel of the cooling tube and the nitrogen inlet tube, 238 parts by mass of 2-hydroxyethyl acrylate (manufactured by Aldrich Co., Ltd.) is put in (2.05 Mo Ear), hydroquinone monoterpene ether (manufactured by Aldrich Co., Ltd.) 0.53 parts by mass, poly(1,6-hexanediol carbonate) having a number average molecular weight of 1000 (trade name··Duranol T5652 'Asahi Kasei Chemicals Co., Ltd. (manufactured by the company) 〇〇〇 parts by mass (2.00 mol), dibutyltin dilaurate (manufactured by Aldrich Co., Ltd.) 5.53 parts by mass. After introducing nitrogen gas sufficiently, it was heated to 70. ^75 ° C, and then hydrogenated diphenylmethane diisocyanate (trade name: VESTANAT H12MD, manufactured by Degussa Co., Ltd.) 787 parts by mass (3.00 mol) was uniformly dropped over 3 hours to cause a reaction. After completion of the dropwise addition, the reaction was carried out for 13 hours, and it was confirmed by IR measurement that the isocyanic acid disappeared, and the reaction was terminated to obtain an urethane acrylate. The obtained urethane acrylate (UA2) had a critical surface tension of 23 mN/m, a weight average molecular weight of 15,500, and a viscosity of 4,100 Pa-s. (Synthesis of urethane acrylate (UA3)) In a reaction vessel equipped with a stirrer, a thermometer, a reflux cooling tube equipped with a vaporized calcium drying tube, and a nitrogen introduction tube, 2-ethyl peracetate was introduced. (manufactured by Aldrich Co., Ltd.) 238 parts by mass (2 〇 5 mol), p-benzene phenol monodecyl ether (manufactured by Aldrich Co., Ltd.) 0.53 mass injury, number 1 polycaprolactone having an average molecular weight of 2 〇〇〇 Glycol (trade name: Placed 220, manufactured by Daicel Chemical Industry Co., Ltd.) 4 〇〇〇 里 ( (2'00 mol), dibutyltin dilaurate (made by Aldrich Co., Ltd.) 5.53 parts by mass. After fully introducing nitrogen gas, heat to 70 ° C ~ 75 C and then add isophorol with the same diisocyanate vinegar evenly for 3 hours.

X X201204797 股份有限公司製造）666質量份（3.00莫耳），使其反應。 滴加完畢後反應12小時’藉由IR測定來確認異氰酸酯消 失而結束反應，獲得胺基甲酸酯丙婦酸酯。所得的胺基甲 酸酯丙稀酸酯（UA3)的臨界表面張力為；27mN/m,重量 平均分子量為13800，黏度為650 Pa-s。 (胺基曱酸酯丙烯酸酯（UA4)的合成） 於具備攪拌機、&gt;盖度計、安裝有氯化約乾燥管的回流 冷卻管、氮氣導入管的反應容器中，將3-曱基-l，5-戊二醇 1650質量份（14莫耳）及癸二酸2023質量份（1〇莫耳） 加入至反應器令，於常壓下充分導入氮氣後，一邊將於約 170 C下生成的水蒸顧去除至系統外一邊進行酯化反應。於 聚醋的酸值成為0.3 mgKOH/g以下的時刻利用真空泵緩緩 提高真空度，使反應完結。以上述方式獲得的聚酯二醇的 數量平均分子量為1〇〇〇。 進而於具備攪拌機、溫度計、安裝有氯化鈣乾燥管的 回流冷卻管、氮氣導入管的反應容器中，投入丙烯酸2-羥 基乙酷（Aldrich股份有限公司製造）238質量份（2.05莫 耳）、對苯二酚單曱醚（Aldrich股份有限公司製造）0.53 質量份、上述所得的聚酯二醇2000質量份（2·00莫耳）、 二月桂酸二丁基錫（Aldrich股份有限公司製造）5.5 3質量 份。充分導入氮氣後，加熱至70°C〜75t，然後以3小時 均句滴加異佛爾酮二異氰酸酯（Aldrich股份有限公司製 造）666質量份（3.00莫耳），使其反應。滴加完畢後反應 約15小時時，藉由IR測定來確認異氰酸酯消失而結束反 49 201204797 應，獲得胺基甲酸s旨丙烯_旨。所得的胺基甲酸醋丙稀酸 醋（UA4)的臨界表面張力為43_m，重量平均分子量 為 18500，黏度為 4800 Pa.s。 (胺基甲酸酯丙烯酸酯（UA5)的合成） 於具備撥拌機、溫度計、安農有氣化舞乾燥管的回流 冷卻管、氮氣導人管的反應容器+，投人丙_2_經基乙 酯（Aldrich股份有限公司製造）238質量份（2〇5莫耳）、 對苯二酚單甲醚（Aldrich股份有限公司製造）〇53'質量 份、數量平均分子量為1000的聚四亞甲基醚二醇（商品 名.保土谷化學工業股份有限公司製造，Tgioqo) 2〇〇〇 質量份（2.00莫耳）、二月桂酸二丁基錫（Aldrich股份有 限公司製造）5.53質量份。充分導入氮氣後，加熱至7〇&lt;t 〜75 C ’然後以3小時均勻滴加異佛爾酮二異氰酸酯 (Aldrich股份有限公司製造）666質量份（3.00莫耳）， 使其反應。滴加完畢後反應13小時。藉由ir測定來確認 異氰酸酯消失而結束反應，獲得胺基曱酸酯丙烯酸酯。所 得的胺基曱酸酯丙烯酸酯（UA5)的臨界表面張力為17 mN/m，重量平均分子量為14500，黏度為2900 Pa.s。 (胺基曱酸酯丙烯酸酯（UA6)的合成） 於具備攪拌機、温度計、安裝有氣化鈣乾燥管的回流 冷卻管、氮氣導入管的反應容器中，將3-曱基_1，5-戊二醇 1650質量份（14莫耳）及癸二酸2023質量份（1〇莫耳） 加入至反應器中，於常壓下充分導入氮氣後，一邊將於約 170°C下生成的水蒸顧去除至系統外，一邊進行酯化反應。 50 201204797」 於聚醋的酸值成為0.3 mgKOH/g以下的時刻利用真空泵緩 缓提向真空度，使反應完結。以上述方式獲得的聚酯二醇 的數量平均分子量為1000。 進而’於具備攪拌機、溫度計、安裝有氣化鈣乾燥管 的回流冷卻管、氮氣導入管的反應容器中，投入丙烯酸2-羥基乙酯（Aldrich股份有限公司製造）238質量份（2.05 莫耳）、對苯二酚單曱醚（Aldrich股份有限公司製造）0.53 質量份、上述所得的聚酯二醇2500質量份（2.50莫耳）、 二月桂酸二丁基錫（Aldrich股份有限公司製造）5.53質量 份。充分導入氮氣後，加熱至70°C〜乃。(：，然後以3小時 均勻滴加異佛爾酮二異氰酸酯（Aldrich股份有限公司製 造）666質量份（3.00莫耳），使其反應。滴加完畢後反應 約17小時，藉由IR測定來確認異氰酸酯消失而結束反應， 獲得胺基甲酸酯丙烯酸酯。所得的胺基甲酸酯丙烯酸酯 (UA6)的臨界表面張力為41 mN/m，重量平均分子量為 23500，黏度為 6800 Pa.s。 (胺基曱酸酯丙烯酸酯（UA7)的合成） 於具備攪拌機、溫度計、安裝有氣化鈣乾燥管的®流 冷卻管、氮氣導入管的反應容器中，投入丙烯酸2-羥基乙 酯（Aldrich股份有限公司製造）238質量份（2.05莫耳）、 對苯二酚單曱醚（Aldrich股份有限公司製造）0.53質量 份、數量平均分子量為1〇〇〇的聚四亞甲醚二醇（商品名： 保土谷化學工業股份有限公司製造，TG1000) 2500質量 份（2.50莫耳）、二月桂酸二丁基錫（Aldrich股份有限公 51 201204797 司製造）5.53質量份。充分導入氤氣後，加熱至7(rc〜 75°C，然後以3小時均勻滴加異佛爾酮二異氰酸醋（Aldrich 股份有限公司製造）666質量份（3.00莫耳），使其反應。 滴加完畢後反應15小時。藉由IR測定來確認異氰酸酯消 失而結束反應’獲得胺基甲酸酯丙烯酸酯。所得的胺基甲 酸g旨丙歸酸自旨（UA7)的臨界表面張力為16 mN/m，重量 平均分子量為20400，黏度為3500 Pa.s。 (異三聚氰酸改質2官能丙稀酸醋（M-215)的準備） 準備異二聚氰酸改質2官能丙婦酸@旨（東亞合成股份 有限公司製造，M-215 (商品名）。 (具有破酸基的乙晞基化合物（p_2M)的準備） 準備磷酸2·(曱基）丙烯醯氧基乙酯（商品名：Light Ester P-2M，共榮社化學股份有限公司製造）。 〈自由基聚合起始劑〉 準備二苯甲醯過氧化物（商品名：NyperBW，日油股 份有限公司製造）作為自由基聚合起始劑。 〈導電性粒子〉 (導電性粒子的製作） 於以聚苯乙稀為核的粒子的表面設置厚度〇2阿^ 鎳層，且於該錄層的外側設置厚度0.02 μιη的金層，製^ 平均粒為ΙΟμηι、比重為2 5的導電性粒子。 [實例1〜實例12及比較例1〜比較例5] 以如表2所示固體重量比調配熱塑性樹脂、自由基】 〇化口物及自由基聚合起始劑，進而調配分散1.5 vol( 52 201204797 的導電性粒子，獲得黏著劑組成物。使用塗佈裝置，將所 得的黏著劑組成物塗佈於厚度為80 μιη的氟樹脂膜上，藉 由70°C、10分鐘的熱風乾燥而獲得黏著劑層的厚度為20 μιη的膜狀黏著劑組成物。 201204797 J'asoorn 【(Nd666 parts by mass (3.00 mol) manufactured by X X201204797 Co., Ltd. to make it react. After completion of the dropwise addition, the reaction was carried out for 12 hours. The reaction was confirmed by IR measurement to confirm the disappearance of the isocyanate, and the urethane propionate was obtained. The obtained urethane acrylate (UA3) had a critical surface tension of 27 mN/m, a weight average molecular weight of 13,800 and a viscosity of 650 Pa-s. (Synthesis of Aminophthalic Acid Acrylate (UA4)) In a reaction vessel equipped with a stirrer, a lid meter, a reflux cooling tube equipped with a chlorination drying tube, and a nitrogen gas introduction tube, 3-mercapto- 1,5 parts by mass of 5,5 parts of pentanediol (14 moles) and 2023 parts by mass of azelaic acid (1 Torr) are added to the reactor, and after fully introducing nitrogen under normal pressure, the side will be about 170 C. The resulting water is removed to the outside of the system for esterification. When the acid value of the vinegar is 0.3 mgKOH/g or less, the vacuum degree is gradually increased by the vacuum pump to complete the reaction. The polyester diol obtained in the above manner had a number average molecular weight of 1 Å. Furthermore, 238 parts by mass (2.05 mol) of 2-hydroxyethyl acrylate (manufactured by Aldrich Co., Ltd.) was placed in a reaction vessel equipped with a stirrer, a thermometer, a reflux cooling tube to which a calcium chloride drying tube was attached, and a nitrogen gas introduction tube. 0.53 parts by mass of hydroquinone monoterpene ether (manufactured by Aldrich Co., Ltd.), 2000 parts by mass of the polyester diol obtained above (2·00 mol), and dibutyltin dilaurate (manufactured by Aldrich Co., Ltd.) 5.5 3 Parts by mass. After the introduction of nitrogen gas, the mixture was heated to 70 ° C to 75 t, and then 666 parts by mass (3.00 mol) of isophorone diisocyanate (manufactured by Aldrich Co., Ltd.) was added dropwise over 3 hours to cause a reaction. When the reaction was completed for about 15 hours, the disappearance of the isocyanate was confirmed by IR measurement, and the reaction was terminated. The obtained urethane acetoacetate (UA4) had a critical surface tension of 43 mm, a weight average molecular weight of 18,500, and a viscosity of 4,800 Pa.s. (Synthesis of urethane acrylate (UA5)) In a reaction vessel with a mixing machine, a thermometer, a reflow cooling tube of Annon with a gasification dance drying tube, and a nitrogen gas guiding tube, the investment of C-_2 238 parts by mass (2〇5 mol), hydroquinone monomethyl ether (manufactured by Aldrich Co., Ltd.), 53 parts by mass, and a polytetraethylene having a number average molecular weight of 1000, based on ethyl acrylate (manufactured by Aldrich Co., Ltd.) Methylene ether glycol (trade name: manufactured by Hodogaya Chemical Industry Co., Ltd., Tgioqo) 2 parts by mass (2.00 mol), and dibutyltin dilaurate (manufactured by Aldrich Co., Ltd.) 5.53 parts by mass. After nitrogen gas was sufficiently introduced, the mixture was heated to 7 Torr &lt; t 〜 75 C ', and then 666 parts by mass (3.00 mol) of isophorone diisocyanate (manufactured by Aldrich Co., Ltd.) was uniformly added dropwise over 3 hours to cause a reaction. After the completion of the dropwise addition, the reaction was carried out for 13 hours. The reaction was confirmed by the ir measurement to confirm the disappearance of the isocyanate, and an amino phthalate acrylate was obtained. The obtained amino phthalate acrylate (UA5) had a critical surface tension of 17 mN/m, a weight average molecular weight of 14,500, and a viscosity of 2,900 Pa.s. (Synthesis of Aminophthalic Acid Acrylate (UA6)) In a reaction vessel equipped with a stirrer, a thermometer, a reflux cooling tube equipped with a vaporized calcium drying tube, and a nitrogen gas introduction tube, 3-mercapto-1,5 - 650 parts by mass of pentanediol (14 mol) and 2023 parts by mass of sebacic acid (1 Torr) were added to the reactor, and after nitrogen gas was sufficiently introduced under normal pressure, it was formed at about 170 ° C. The water vapor is removed to the outside of the system and the esterification reaction is carried out. 50 201204797 When the acid value of the vinegar is 0.3 mgKOH/g or less, the vacuum pump is used to slowly lift the vacuum to complete the reaction. The polyester diol obtained in the above manner had a number average molecular weight of 1,000. Further, 238 parts by mass (2.05 mol) of 2-hydroxyethyl acrylate (manufactured by Aldrich Co., Ltd.) was placed in a reaction vessel equipped with a stirrer, a thermometer, a reflux cooling tube equipped with a vaporized calcium drying tube, and a nitrogen gas introduction tube. 0.53 parts by mass of hydroquinone monoterpene ether (manufactured by Aldrich Co., Ltd.), 2500 parts by mass of the polyester diol obtained above (2.50 mol), and dibutyltin dilaurate (manufactured by Aldrich Co., Ltd.) 5.53 parts by mass . After introducing nitrogen gas sufficiently, it was heated to 70 ° C to 乃. (:, then, 666 parts by mass (3.00 mol) of isophorone diisocyanate (manufactured by Aldrich Co., Ltd.) was uniformly added dropwise over 3 hours to cause a reaction. After the completion of the dropwise addition, the reaction was carried out for about 17 hours, by IR measurement. It was confirmed that the isocyanate disappeared and the reaction was terminated to obtain a urethane acrylate. The obtained urethane acrylate (UA6) had a critical surface tension of 41 mN/m, a weight average molecular weight of 23,500, and a viscosity of 6,800 Pa.s. (Synthesis of Aminophthalic Acid Acrylate (UA7)) In a reaction vessel equipped with a stirrer, a thermometer, a ® flow cooling tube equipped with a vaporized calcium drying tube, and a nitrogen introduction tube, 2-hydroxyethyl acrylate was introduced ( 238 parts by mass (2.05 mol), hydroquinone monoterpene ether (manufactured by Aldrich Co., Ltd.), 0.53 parts by mass, polytetramethylene ether glycol having a number average molecular weight of 1 Torr (manufactured by Aldrich Co., Ltd.) Product Name: Manufactured by Baotu Valley Chemical Industry Co., Ltd., TG1000) 2500 parts by mass (2.50 mol), dibutyltin dilaurate (made by Aldrich Co., Ltd. 51 201204797) 5.53 quality After the helium gas was sufficiently introduced, it was heated to 7 (rc to 75 ° C, and then 666 parts by mass (3.00 mol) of isophorone diisocyanate (manufactured by Aldrich Co., Ltd.) was uniformly added dropwise over 3 hours. After the completion of the dropwise addition, the reaction was carried out for 15 hours. The disappearance of the isocyanate was confirmed by IR measurement to terminate the reaction. The urethane acrylate was obtained. The obtained aminocarboxylic acid g was used as the critical surface of the amino acid (UA7). The tension is 16 mN/m, the weight average molecular weight is 20400, and the viscosity is 3500 Pa.s. (Preparation of iso-cyanuric acid modified 2-functional acrylic acid vinegar (M-215)) Preparation of hetero-cyanuric acid modification 2-functional propyl benzoate @ ( (manufactured by Toagosei Co., Ltd., M-215 (trade name). (Preparation of acetamido compound (p_2M) having a decomposing acid group) Preparation of phosphoric acid 2·(fluorenyl) propylene oxime Ethyl ethyl ester (trade name: Light Ester P-2M, manufactured by Kyoeisha Chemical Co., Ltd.). <Free radical polymerization initiator> Preparation of benzophenone peroxide (trade name: NyperBW, Nippon Oil Co., Ltd. Manufacture) as a radical polymerization initiator. <Electrically conductive particles> (Guide Preparation of a particle) A thickness of 〇2 A + nickel layer is provided on the surface of a particle having polystyrene as a core, and a gold layer having a thickness of 0.02 μηη is disposed outside the recording layer, and the average grain is ΙΟμηι, and the specific gravity is 2 to 5 conductive particles. [Example 1 to Example 12 and Comparative Example 1 to Comparative Example 5] A thermoplastic resin, a radical, a sulfonated product, and a radical polymerization initiator were prepared in a solid weight ratio as shown in Table 2. Further, 1.5 vol (52 201204797 conductive particles) were dispersed to obtain an adhesive composition. The obtained adhesive composition was applied onto a fluororesin film having a thickness of 80 μm using a coating device, and dried at 70 ° C for 10 minutes by hot air to obtain a film-like adhesive having a thickness of the adhesive layer of 20 μm. Agent composition. 201204797 J'asoorn [(Nd

Nyper BW yn in yn in in P-2M CO m m m m m ΓΟ ro m ro m m m m m m M-215 o 〇 O 1 1 1 1 〇 Ο 1 1 1 1 o cn o cn 1 1 UA7 16 mN/m 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 UA6 41 mN/m 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 UA5 17 mN/m 1 1 1 1 1 1 1 1 Ο 1 1 1 1 1 UA4 43 mN/m 1 1 1 1 1 1 1 ο 1 1 1 1 1 1 UA3 27 mN/m 1 1 o 1 1 1 1 1 1 1 1 1 1 1 咖 1 1 UA2 23 mN/m 1 o 1 1 1 1 1 1 1 1 1 1 1 1 1 UA1 24 mN/m 〇 1 1 1 1 1 1 l 1 \ i t 1 \ t EV40W yn 1 1 1 1 m ΙΟ YP-50 1 1 1 1 » 1 1 1 o yr) 〇 in 1 1 1 1 1 UR 8200 jn jn 1 1 $ jn »rj 1 1 )n jn 實例1 實例2 苳 實例4 I實例5 1 1實例6 1 1實例7 1 1實例8 1 i實例9 1 實例10 1實例π 1 |實例12 | |比較例i| |比較例2| |比較例3| |比較例4| |比較例5| 201204797 [斷裂伸長率、儲藏彈性模數、連接電阻、黏著強度的 測定] 使實例1〜實例12及比較例1〜比較例5的膜狀黏著 劑組成物，介隔存在於在聚醯亞胺膜上具有5〇〇根線寬為 25 μιη、間距為50 μπι '厚度為8 μιη的銅電路的可撓性電 路板（flexible printed circuit，FPC)與形成有 〇·2 μιη 的 ΙΤ0 薄層的玻璃（厚度為1·1 mm ’表面電阻為2〇 q/口）之間。 對其使用熱壓接裝置（加熱方式：恆溫型，T〇my Engineering公司製造），於16〇〇c、3 Mpa下加熱加壓1〇 秒，遍及寬度2 mm而連接，製作連接體。於剛黏著後及 在85°C、85%RH的高溫高濕槽中保持24〇小時後（試驗 後），利用萬用表來測定該連接體的鄰接電路間的電阻值。 電阻值是以鄰接電路間的電阻37點的平均值所表示。 另外，依據JIS-Z0237，利用90度剝離法來測定各個 連，體的黏著強度，進行評價此處，黏著強度的測定裝 置是使用Toyo Baldwin股份有限公司製造的Tensil〇n UTM-4 (剝離速度為 5〇 mm/min，25°C )。 另外，膜狀黏著劑组成物的斷裂伸長率是將膜狀的黏 著劑組成物騎18代、H、_加熱硬化， Instron 公司製造的材料試驗機「MieiOtestei&gt; 5548」（拉伸速度為 50 mm/min，25°C )對所得的試料進行測定。另外，膜狀 ，著劑組成物_藏雜觀是將酿的黏著劑組成物進 打18〇C、1小時的加熱硬化’利用TAInstruments公司製 造的黏彈性分析儀「RSA_3」（升溫速度為似―，頻率 55 201204797 為i〇Hz’測定溫度為-150°C〜300。〇對所得的試料進行 測定°將以上述方式進行的膜狀黏著劑組成物的斷裂伸長 率'儲藏彈性模數、連接電阻及黏著強度的測定的結果示 於下述表3。 [表3]Nyper BW yn in yn in in P-2M CO mmmmm ΓΟ ro m ro mmmmmm M-215 o 〇O 1 1 1 1 〇Ο 1 1 1 1 o cn o cn 1 1 UA7 16 mN/m 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 UA6 41 mN/m 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 UA5 17 mN/m 1 1 1 1 1 1 1 1 Ο 1 1 1 1 1 UA4 43 mN/m 1 1 1 1 1 1 1 ο 1 1 1 1 1 1 UA3 27 mN/m 1 1 o 1 1 1 1 1 1 1 1 1 1 1 Coffee 1 1 UA2 23 mN/m 1 o 1 1 1 1 1 1 1 1 1 1 1 1 1 UA1 24 mN/m 〇1 1 1 1 1 1 l 1 \ it 1 \ t EV40W yn 1 1 1 1 m ΙΟ YP-50 1 1 1 1 » 1 1 1 o Yr) 〇in 1 1 1 1 1 UR 8200 jn jn 1 1 $ jn »rj 1 1 )n jn instance 1 instance 2 苳 instance 4 I instance 5 1 1 instance 6 1 1 instance 7 1 1 instance 8 1 i instance 9 1 Example 10 1 Example π 1 | Example 12 | | Comparative Example i | | Comparative Example 2 | | Comparative Example 3 | | Comparative Example 4 | | Comparative Example 5 | 201204797 [Elongation at break, storage elastic modulus, connection resistance, Measurement of Adhesive Strength] The film-like adhesive compositions of Examples 1 to 12 and Comparative Examples 1 to 5 were interspersed to have a line width of 25 on the polyimide film. Μιη, a flexible printed circuit (FPC) of a copper circuit with a thickness of 8 μπη and a thin layer of ΙΤ0 thin layer formed with a thickness of 〇2 μηη (thickness of 1·1 mm 'surface resistance) It is between 2〇q/口). Using a thermocompression bonding apparatus (heating method: constant temperature type, manufactured by T〇my Engineering Co., Ltd.), the mixture was heated and pressed at 16 ° C and 3 Mpa for 1 〇 second, and connected to each other over a width of 2 mm to prepare a joined body. After the adhesion and after holding for 24 hours in a high-temperature and high-humidity bath at 85 ° C and 85% RH (after the test), the resistance between the adjacent circuits of the connected body was measured with a multimeter. The resistance value is represented by the average value of the resistance 37 points between adjacent circuits. In addition, according to JIS-Z0237, the adhesion strength of each of the joints was measured by a 90-degree peeling method, and evaluation was made here. The apparatus for measuring the adhesion strength was Tensil〇n UTM-4 manufactured by Toyo Baldwin Co., Ltd. (peeling speed) It is 5〇mm/min, 25°C). In addition, the elongation at break of the film-like adhesive composition is a film-like adhesive composition which is 18-generation, H, _ heat-hardened, and a material testing machine "MieiOtestei" 5548 manufactured by Instron Co., Ltd. (stretching speed is 50 mm). /min, 25 ° C) The obtained sample was measured. In addition, the film-like composition of the coating agent is a heat-curing composition of the adhesive composition of the brewing agent at 18 ° C for 1 hour, using a viscoelastic analyzer "RSA_3" manufactured by TA Instruments (the rate of temperature rise is similar) ―, frequency 55 201204797 The temperature measured for i〇Hz' is -150 ° C to 300. 〇 The obtained sample is measured. The elongation at break of the film-like adhesive composition as described above is the storage elastic modulus, The results of measurement of the connection resistance and the adhesion strength are shown in Table 3 below. [Table 3]

黏著強度（N/m) 剛黏著後| 240 h後 600 680 650 620 690 630 6Ϊ0 290 290 300 250 240 290 260 220 350 290 650 面 690 660 730 雨 650 490 380 500 350 430 460 300 260 520 4Ό0 八藉由使用含有（a)成分、（b)成分、（C)成分及（d) 成分，且含有具有特定範圍的臨界表面張力的胺基曱酸酯 (―甲基)丙稀酸S旨作為⑴成分的黏著劑組成物，實例卜 貫例7中所得的黏著劑組成物與使用具有特定範圍外的臨 界表面張力的黏著劑組成物的實例8〜實例12或比較例J 〜比較例5相比，於加熱溫度16〇t下，於剛黏著後及在 56 201204797. 85°C、85%RH的高溫高濕槽中保持240小時後（試驗後）， 表現出約2.6 Ω以下的良好連接電阻及6〇〇 N/m以上的良 好黏著強度。另外，膜狀黏著劑組成物的斷裂伸長率及儲 藏彈性模數亦顯示出良好的值。 另一方面，比較例丨〜比較例5中所得的黏著劑組成 物於剛黏著後及在851、85%RH的高溫高濕槽中保持24〇 小時後（試驗後），表現出低黏著強度。另外，比較例4 及比較例5中所付的黏著劑組成物在gyc、85%rh的高 溫，濕槽中保持24〇小時後（試驗後）的連接電阻變高: 黏著強度亦變低。另外’關於膜狀黏著劑組成物的斷裂伸 長率或者儲藏彈性模數’絲現出良好的值，但比較例2 及比較例3的斷裂伸長率表現出小於良好範圍的值，比較 ^及比較例5的斷裂伸長率表現出大於良好範圍的值。 S好胤細軸跡嶋亦表現出大 八，藉由使用含有⑷成分、⑻成分及（c)成 二3有胺基甲酸醋（甲基)丙烯酸醋作為⑻成分且 ^特定^騎裂伸長率的黏著·成物，實例8〜制 例2 黏著劑組成物與斷裂伸長率在範圍外的比較 «此5械，賴賴雜著強度的平衡性良好。 物的斷裂伸‘ 撓性，可獲得平衡性良好的特ϋ對黏者劑組成物賦予可 201204797 另外’使實例1、實例2、實‘例4、實例5及實例10 以及比較例5的膜狀黏著劑組成物，位於可撓性電路板 (FPC)與基板之間，其中可撓性電路板在聚醯亞胺膜上 具有80根線寬為150 μπι、間距為3〇〇 μπ1、厚度為18 的銅電路，基板在PET膜（厚度為〇」111111，1^為ucrc)、 PC膜（厚度為〇.1 mm，Tg為i5〇°c )及pen膜（厚度為 0.1 mm，Tg為160°C )膜上形成有線寬為15〇 μιη、間距為 300 μιη、厚度為1〇 的Ag漿料電路。對該些分別使用 熱壓接裝置（加熱方式.怪溫型，T〇ray £ngineering公司 製造），於150°C、2MPa下加熱加壓1〇秒，遍及寬度2mm 而壓接’製作連接體。 另外，各個連接體的黏著強度是以與上述方法相同的 方式測定。將以上述方式進行的膜狀黏筆劑組成物的黏著 強度的測定結果示於下述表4。 58 201204797 [表4] 基材 黏著強度（N/m) 剛黏著後 240 h 後 實例13 (點者劑組成物·實例1) PET 600 590 PC 580 570 PEN 570 550 實例14 (黏著劑組成物：實例2) PET 610 600 PC 590 580 PEN 580 570 實例15 (黏著劑組成物：實例4 ) PET 650 610 PC 600 580 PEN 580 570 實例16 (黏著劑組成物：實例5) PET 620 610 PC 610 580 PEN 600 560 實例Π (黏著劑組成物：實例10) PET 400 320 PC 350 290 PEN 290 270 比較例6 (黏著劑組成物：比較例5 ) PET 350 290 PC 270 230 PEN 260 240 實例13〜實例16中所得的黏著劑組成物對於任一種 基材，均於加熱溫度150。(：下，於剛黏著後及在85°C、 85%RH的高溫高濕槽中保持24〇小時後（試驗後），表現 出560 N/m以上的良好黏著強度。相對於該些實例，比較 例6中於剛黏著後及在85¾、85%RH的高溫高濕槽中保 持240小時後（試驗後）的黏著強度變低。此外，實例17 並非實例13〜實例16的程度，與比酬6減可看到黏 著強度的改善。 [產業上之可利用性] θ依據本發明，可提供一種於低溫的硬化條件下亦可獲 知優異的崎強度且於長時間的可靠践驗（高溫高濕試 59 201204797 驗）後亦可維持穩定的性能（黏著強度或連接電阻）的點 著劑組成物、使用該黏著劑組成物的電路構件的連接結構 體、連接結構體的製造方法以及黏著齡成物的應用。 【圖式簡單說明】 圖1是表示使用本發明的黏著劑組成物的電路構件的 連接結構體的一實施形態的示意剖面圖。 圖2是表示製作圖i所示的電路構件的連接結構體之 則的第€路構件、第二電路構件及黏著劑組成物的示意 剖面圖。 ~ 圖3是表示使用本發明的黏著劑組成物（含有導電性 粒子）的電路構件的連接結構體的一實施形態的示意剖面 圖。 圖4是表示製作圖3所示的電路構件的連接結構體之 前的第一電路構件、第二電路構件及黏著劑組成物（含有 導電性粒子）的示意剖面圖。 【主要元件符號說明】 10、20 :黏著劑組成物 10C、20C :連接構件 21 :不含導電性粒子的黏著劑組成物/黏著劑組成物的 導電性粒子以外的成分 22 :導電性粒子 21C :不含導電性粒子的黏著劑組成物的硬化物/黏著 劑組成物的導電性粒子以外的成分的硬化物 30 :第一電路構件 201204797 31 :第一電路基板 31a :主面 32 :第一連接端子 40:第二電路構件 41 :第二電路基板 41a :主面 42 :第二連接端子 100、200 :電路構件的連接結構體 61Adhesion strength (N/m) just after adhesion | 240 h after 600 680 650 620 690 630 6Ϊ0 290 290 300 250 240 290 260 220 350 290 650 face 690 660 730 rain 650 490 380 500 350 430 460 300 260 520 4Ό0 By using (a) component, (b) component, (C) component, and (d) component, and containing a critical surface tension of a certain range of amino phthalic acid ester (-methyl) acrylic acid S (1) The adhesive composition of the composition, the adhesive composition obtained in Example 7 was compared with Example 8 to Example 12 or Comparative Example J to Comparative Example 5 using an adhesive composition having a critical surface tension outside a specific range. At a heating temperature of 16 〇t, after standing for 24 hours in the high-temperature and high-humidity bath of 56 201204797. 85 ° C and 85% RH (after the test), it shows a good connection resistance of about 2.6 Ω or less. And good adhesion strength above 6〇〇N/m. Further, the elongation at break and the storage elastic modulus of the film-like adhesive composition also showed good values. On the other hand, the adhesive compositions obtained in Comparative Example ～ Comparative Example 5 exhibited low adhesion strength after being adhered for 24 hours (after the test) in the high-temperature and high-humidity bath of 851 and 85% RH. . Further, in the adhesive compositions of Comparative Examples 4 and 5, the connection resistance after the gyc and the high temperature of 85% rh was maintained in the wet bath for 24 hours (after the test) became high: the adhesive strength was also lowered. Further, 'the elongation at break or the storage elastic modulus of the film-like adhesive composition' showed good values, but the elongation at break of Comparative Example 2 and Comparative Example 3 showed values smaller than the good range, and compared and compared. The elongation at break of Example 5 exhibited a value larger than the good range. S is better than the fine axis, and it also shows the big eight by using the (4) component, the (8) component, and the (c) to 3 urethane methacrylate (meth) acrylate as the component (8) and the specific ^ riding elongation Rate of adhesion and composition, Example 8 to Example 2 Comparison of the composition of the adhesive and the elongation at break outside the range «This 5 machine, the balance of the strength of the hybrid is good. The elongation of the material is 'flexible, and a good balance can be obtained. The adhesive composition can be imparted to the adhesive composition 201204797. Further, the films of the example 1, the example 2, the real example 4, the example 5 and the example 10, and the comparative example 5 are obtained. The adhesive composition is located between the flexible circuit board (FPC) and the substrate, wherein the flexible circuit board has 80 line widths of 150 μm and a pitch of 3〇〇μπ1 on the polyimide film. A copper circuit of 18, the substrate is on a PET film (thickness: 111111, 1^ is ucrc), PC film (thickness: 1.1 mm, Tg is i5〇°c) and pen film (thickness 0.1 mm, Tg) An Ag paste circuit having a wire width of 15 μm, a pitch of 300 μm, and a thickness of 1 Å was formed on the film at 160 ° C. The thermocompression bonding apparatus (heating method, strange temperature type, manufactured by T〇ray £ngineering Co., Ltd.) was heated and pressed at 150 ° C and 2 MPa for 1 second, and crimped to a width of 2 mm. . Further, the adhesion strength of each of the connectors was measured in the same manner as the above method. The measurement results of the adhesive strength of the film-shaped adhesive composition which was carried out in the above manner are shown in Table 4 below. 58 201204797 [Table 4] Adhesive strength of the substrate (N/m) 240 h after adhesion. Example 13 (Point composition: Example 1) PET 600 590 PC 580 570 PEN 570 550 Example 14 (Adhesive composition: Example 2) PET 610 600 PC 590 580 PEN 580 570 Example 15 (Adhesive Composition: Example 4) PET 650 610 PC 600 580 PEN 580 570 Example 16 (Adhesive Composition: Example 5) PET 620 610 PC 610 580 PEN 600 560 Example Π (Adhesive Composition: Example 10) PET 400 320 PC 350 290 PEN 290 270 Comparative Example 6 (Adhesive Composition: Comparative Example 5) PET 350 290 PC 270 230 PEN 260 240 Example 13 to Example 16 The resulting adhesive composition was at a heating temperature of 150 for either substrate. (: Next, after 24 hours of adhesion (after the test) after 8 mm and 85% RH in a high temperature and high humidity bath, it showed good adhesion strength above 560 N/m. In Comparative Example 6, the adhesion strength after the adhesion was maintained for 240 hours (after the test) in the high-temperature and high-humidity bath of 853⁄4, 85% RH. Further, Example 17 is not the extent of Examples 13 to 16, and The improvement of the adhesive strength can be seen by the difference of 6%. [Industrial Applicability] θ According to the present invention, it is possible to provide an excellent saturable strength under long-term hardening conditions and a reliable test over a long period of time ( A high-temperature and high-humidity test 59 201204797), a dot composition capable of maintaining stable performance (adhesive strength or connection resistance), a connection structure of a circuit member using the adhesive composition, a method of manufacturing a connection structure, and [Brief Description of the Invention] Fig. 1 is a schematic cross-sectional view showing an embodiment of a connection structure of a circuit member using the adhesive composition of the present invention. Fig. 2 is a view showing the production of the connection structure shown in Fig. Circuit component Schematic cross-sectional view of the constituting member, the second circuit member, and the adhesive composition of the connecting structure. Fig. 3 is a view showing the connection of the circuit member using the adhesive composition (containing conductive particles) of the present invention. Fig. 4 is a schematic cross-sectional view showing an embodiment of a structure, and Fig. 4 is a view showing a first circuit member, a second circuit member, and an adhesive composition (containing conductive particles) before the connection structure of the circuit member shown in Fig. 3 is produced. Fig. [Description of main component symbols] 10, 20: Adhesive composition 10C, 20C: Connecting member 21: Component other than conductive particles of the adhesive composition/adhesive composition containing no conductive particles 22 : Conductive particle 21C: cured product of component other than conductive particles of the cured material/adhesive composition of the adhesive composition containing no conductive particles: first circuit member 201204797 31: first circuit substrate 31a: main surface 32: first connection terminal 40: second circuit member 41: second circuit substrate 41a: main surface 42: second connection terminal 100, 200: connection structure body 61 of circuit member

Claims (1)

201204797 七、申請專利範園： 一連接端201204797 VII. Application for Patent Park: One connection end 路構件連接， 1.-難著敝成物，祕將主面上 子的第一電路構件、盥 連接^ 心，、主面上具有第二連接端子的第二電The connection of the road members, 1.- difficult to make the object, the first circuit component on the main surface, the connection of the core, and the second electric connection with the second connection terminal on the main surface 的乙稀基化合物，並且 〜人仰3负、aj熱塑性樹脂、（b)自由基 c)自由基聚合起始劑及（d)具有磷酸基 上述（b)自由基聚合性化合物包含具有2〇爾爪〜 爾111的臨界表面張力的胺基甲酸酉旨（曱基)丙稀酸酯。 2.如申請專利範圍第1項所述之黏著劑組成物，其中 十述胺基甲酸自旨（曱基)丙稀酸_坑下的黏度為_ Pa.s〜5000Pa.s。 3.如申請專利範圍第丨項或第2項所述之黏著劑組成 ，、’其中上述胺基曱酸酯（甲基)丙烯酸酯的重量平均分子 量為10000以上且小於25000。 —4.如申請專利範圍第1項至第3項中任一項所述之黏 著劑組成物，其中斷裂伸長率為300%〜500%。 5· —種黏著劑組成物，用於將主面上具有第一連接端 子的第一電路構件、與主面上具有第二連接端子的第二電 路構件連接， 上述黏著劑組成物含有（a)熱塑性樹脂、（b)自由基 聚合性化合物及（c)自由基聚合起始劑， 上述（b)自由基聚合性化合物包含胺基曱酸酯（曱基) 兩烯酸酯，並且 62 201204797 斷裂伸長率為300%〜500%。 6.如申請專利範圍第5項所述之黏著劑組成物，其中 更含有（d)具有磷酸基的乙烯基化合物。 7·如申請專利範圍第1項至第6項中任一項所述之黏 著劑組成物，其中20(TC下的儲藏彈性模數為〇5 Mpa〜5 MPa。 —8·如申請專利範圍第1項至第7項中任一項所述之黏 ，劑組成物，其中上述（a)熱塑性樹脂含有選自由苯氧基 1脂、聚胺基甲酸醋樹脂、聚醋胺基甲酸醋樹脂、丁醛樹 脂、丙烯酸樹脂及聚醯亞胺樹脂所組成組群中的至少丨種。 “ 9·如申請專利範項至第8項中任一項所述之黏 著劑組成物，其中更含有（e)導電性粒子。 〜—丨〜疋牧、、‘。偫菔，包括：主面上具有 ^ ^端子的第—電路構件、主面上具有第二連接端子 的第一電路構件及連接構件，並且 使上述第—連接端子及上述第二連接端子對向的方 上述第一電路構件及上述第二電 1 则第1項至第9項中任-項所述之黏:二 路禮株述連接構件介於上述第一電路構件及上述第二電 電性連而且上述第—連接端子及上述第二連接端子 玻域2苐-電路構件及/或上述第二電路構件是由包含 的熱舰樹脂的基材所構成。 ’ Μ專利1(1料1G項所叙f路構件的連接結 63 201204797 ，，其中上述玻璃轉移溫度為·。c以下的熱塑性樹脂 自由4對苯二甲酸乙二g旨、聚碳動旨及聚萘二甲酸乙 二醋所組成組群中的至少1種。 以如申請專利範圍第10項或第^項所述之電路構 的連接、、、。構體，其中上述第—電路構件或者上述第二電 路構件中的一方的電路構件是由含有選自由聚對苯二甲酸 ^二醋、聚碳酸s旨絲萘二曱酸乙二自旨所組成組群中的至 &gt;1種的基材所構成， 述第—電路構件或者第二電路構件中的另—方的電 路構件為聚醢亞胺樹脂。 u..—種電路構件的連接結構體的製造方法，包括以 下步驟· 將主面上具有第一連接端子的第一電路構件、與主面 t具有第二連接端子的第二電路構件，以使上述第一連接 端^'及上述第二連接端子對向的方式配置，其中如申請真 1項至第9項中任—項所述之黏著劑組成齡於 “第-電路構件及上述第二電路構件之間，·以及 將上述黏著劑組成物加熱，使其硬化而將上述第一雷 路構件與上述第二電路構件連接。 一種黏著劑組成物的應用，用於將主面上且 ^接^子的第一電路構件、與主面上具有第二連接端子 的第二電路構件連接， 丁 取人上述黏著劑組成物含有（a)熱塑性樹脂、⑻自由基 η性化合物、（e)自由基聚合起始劑及⑷具有鱗酸^ 64 201204797 的乙烯基化合物，且上述（b)自由基聚合性化合物包含具 有20 mN/m〜40 mN/m的臨界表面張力的胺基曱酸酯（曱 基)丙烯酸醋。 15. 如申清專利範圍第14項所述之黏著劑組成物的應 用，其中上述胺基曱酸酯（曱基)丙烯酸酯的25t下的黏度 為 600Pa.s〜5000Pa s。 16. 如申請專利範圍第14項或第15項所述之黏著劑 組成物的應用，其中上述胺基曱酸酯（曱基）丙烯酸酯的重 量平均分子量為10000以上且小於25000。 17. 如申請專利範圍第14項至第16項中任一項所述 之黏著劑組成物的應用，其中上述黏著劑組成物的斷裂伸 長率為300%〜500%。 18. —種黏著劑組成物的應用，用於將主面上具有第 一連接端子的第一電路構件、與主面上具有第二連接端子 的第二電路構件連接， 上述黏著劑組成物含有（a)熱塑性樹脂、（b)自由基 聚合性化合物及（c)自由基聚合起始劑， 上述（b)自由基聚合性化合物包含胺基甲酸酯（甲基) 丙烯酸酯，並且 斷裂伸長率為300%〜500%。 19. 如申請專利範圍第18項所述之黏著劑組成物的應 用其中上述黏著劑組成物更含有（d)具有磷酸基的乙烯 基化合物。 如申請專利範圍第14項至第19項中任一項所述 65 201204797 之黏著劑組成物的應用，其中上述黏著劑組成物的200°C 下的儲藏彈性模數為0.5 MPa〜5 MPa。 21. 如申請專利範圍第14項至第20項中任一項所述 之黏著劑組成物的應用，其中上述（a)熱塑性樹脂含有選 自由笨氧基樹脂、聚胺基曱酸酯樹脂、聚酯胺基甲酸酯樹 月曰、丁酸樹脂、丙稀酸樹脂及聚醯亞胺樹脂所組成組群中 的至少1種。 22. 如申請專利範圍第14項至第21項中任一項所述 之黏著劑組成物的應用’其中上述黏著劑組成物更含有（e) 導電性粒子。 66Ethylene-based compound, and ~ human 3 negative, aj thermoplastic resin, (b) free radical c) radical polymerization initiator and (d) having a phosphate group (b) the radical polymerizable compound containing 2 〇 The critical surface tension of the sulphate ~ er 111 is urethane hydrazide (mercapto) acrylate. 2. The adhesive composition according to claim 1, wherein the viscosity of the carbamic acid is from _ Pa.s to 5000 Pa.s. 3. The adhesive composition according to the invention of claim 2, wherein the weight average molecular weight of the above amino phthalate (meth) acrylate is 10,000 or more and less than 25,000. The adhesive composition according to any one of claims 1 to 3, wherein the elongation at break is from 300% to 500%. An adhesive composition for connecting a first circuit member having a first connection terminal on a main surface to a second circuit member having a second connection terminal on a main surface, wherein the adhesive composition contains (a a thermoplastic resin, (b) a radically polymerizable compound, and (c) a radical polymerization initiator, wherein the (b) radically polymerizable compound contains an amino phthalate ester, and 62 201204797 The elongation at break is 300% to 500%. 6. The adhesive composition of claim 5, further comprising (d) a vinyl compound having a phosphate group. 7. The adhesive composition according to any one of claims 1 to 6, wherein 20 (the storage elastic modulus at TC is 〇5 Mpa to 5 MPa.) The adhesive composition according to any one of the items 1 to 7, wherein the (a) thermoplastic resin is selected from the group consisting of phenoxy 1 fat, polyurethane vinegar resin, and polyacetamide resin And an adhesive composition according to any one of the claims of the present invention, wherein the adhesive composition is further contained in the composition of the present invention. (e) Conductive particles: 〜丨~疋牧,, '.偫菔, including: a first circuit member having a ^^ terminal on the main surface, a first circuit member having a second connection terminal on the main surface, and a connection a member, wherein the first connecting member and the second connecting terminal face each other, wherein the first circuit member and the second electric device are in any one of the first to the ninth items: The connecting member is interposed between the first circuit member and the second electric and the above - the connection terminal and the second connection terminal glass region 2 - the circuit member and / or the second circuit member are composed of a substrate containing the heat carrier resin. ' Μ Patent 1 (1 material 1G item) The connection of the member 63 201204797, wherein the thermoplastic resin having a glass transition temperature of less than .c is free from the group consisting of tetraphthalic acid ethylene terephthalate, polycarbonate, and polyethylene naphthalate. The connection of the circuit structure as described in claim 10 or claim 4, wherein the circuit member of one of the first circuit member or the second circuit member is The substrate comprises a substrate selected from the group consisting of poly(terephthalic acid) diacetate and poly(ethylene carbonate), and the first circuit member or the second The other circuit member in the circuit member is a polyimide resin. The manufacturing method of the connection structure of the circuit member includes the following steps: a first circuit member having a first connection terminal on the main surface And having a second connection with the main surface t The second circuit member of the terminal is disposed in such a manner that the first connecting end and the second connecting terminal are opposite to each other, wherein the adhesive composition as set forth in any one of the items 1 to 9 is aged "The first circuit member is connected to the second circuit member by heating and hardening the first circuit member between the first circuit member and the second circuit member. Application of an adhesive composition The first circuit member on the main surface and the second circuit member having the second connection terminal on the main surface are connected to each other, and the adhesive composition contains (a) thermoplastic resin, (8) a radical η compound, (e) a radical polymerization initiator, and (4) a vinyl compound having scaly acid 64 64 04 04 007, and the (b) radical polymerizable compound contains 20 mN/m to 40 mN/m. Amino phthalate (mercapto) acrylate vinegar with a critical surface tension. 15. The application of the adhesive composition according to claim 14, wherein the amino phthalate acrylate has a viscosity at 25 t of from 600 Pa·s to 5000 Pa s. 16. The use of the adhesive composition according to claim 14 or 15, wherein the amino phthalate acrylate has a weight average molecular weight of 10,000 or more and less than 25,000. The use of the adhesive composition according to any one of claims 14 to 16, wherein the adhesive composition has a elongation at break of 300% to 500%. 18. An application of an adhesive composition for connecting a first circuit member having a first connection terminal on a main surface to a second circuit member having a second connection terminal on a main surface, wherein the adhesive composition contains (a) a thermoplastic resin, (b) a radically polymerizable compound, and (c) a radical polymerization initiator, wherein the (b) radical polymerizable compound contains a urethane (meth) acrylate, and elongation at break The rate is 300%~500%. 19. The use of the adhesive composition according to claim 18, wherein the above adhesive composition further contains (d) a vinyl compound having a phosphate group. The use of an adhesive composition according to any one of claims 65 to 2004, wherein the adhesive composition has a storage elastic modulus at 200 ° C of 0.5 MPa to 5 MPa. The use of the adhesive composition according to any one of claims 14 to 20, wherein the (a) thermoplastic resin contains a resin selected from the group consisting of an epoxy resin, a polyamino phthalate resin, At least one of a group consisting of a polyester urethane tree, a butyric acid resin, an acrylic resin, and a polyimide resin. The application of the adhesive composition according to any one of claims 14 to 21 wherein the above adhesive composition further contains (e) conductive particles. 66
TW100119004A 2010-07-26 2011-05-31 Adhesive composition, connecting structure and fabricating method thereof, and use of adhesive composition TWI445789B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010167264 2010-07-26
JP2010188574 2010-08-25

Publications (2)

Publication Number Publication Date
TW201204797A true TW201204797A (en) 2012-02-01
TWI445789B TWI445789B (en) 2014-07-21

Family

ID=45529784

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100119004A TWI445789B (en) 2010-07-26 2011-05-31 Adhesive composition, connecting structure and fabricating method thereof, and use of adhesive composition

Country Status (5)

Country Link
JP (1) JP5454578B2 (en)
KR (3) KR20120068751A (en)
CN (3) CN102449095B (en)
TW (1) TWI445789B (en)
WO (1) WO2012014563A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI645420B (en) * 2014-03-25 2018-12-21 日商迪睿合股份有限公司 Anisotropic conductive film, connection method, and joined structure

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013066597A1 (en) * 2011-11-02 2013-05-10 Henkel Corporation Adhesive for electronic component
KR101535600B1 (en) * 2012-11-06 2015-07-09 제일모직주식회사 Anisotropic conductive film and semiconductor device
JP6157890B2 (en) * 2013-03-26 2017-07-05 日東電工株式会社 Underfill material, sealing sheet, and method for manufacturing semiconductor device
JP6123547B2 (en) * 2013-07-26 2017-05-10 日立化成株式会社 Circuit connection material, circuit connection structure, method for manufacturing circuit connection structure, adhesive composition, and adhesive sheet
CN103525355B (en) * 2013-10-16 2015-02-18 烟台德邦科技有限公司 Ultraviolet curing adhesive for liquid crystal display television side frame and preparation method of ultraviolet curing adhesive
TWI754073B (en) * 2017-06-26 2022-02-01 日商東亞合成股份有限公司 Adhesive composition and heat-adhesive member using the same
WO2021039877A1 (en) * 2019-08-30 2021-03-04 Dic株式会社 Adhesive tape
KR102515779B1 (en) * 2021-05-27 2023-03-31 유한회사 대구특수금속 Mehtod for manufacturing in-mold electrronics having terminal connector with stiffness and airtightness
KR102528889B1 (en) * 2021-05-27 2023-05-04 유한회사 대구특수금속 In-mold electrronics having terminal connector with stiffness and airtightness

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005320455A (en) * 2004-05-10 2005-11-17 Hitachi Chem Co Ltd Adhesive composition, material for connecting circuit, connecting structure of circuit member and semiconductor device
JP2008195852A (en) * 2007-02-14 2008-08-28 Hitachi Chem Co Ltd Film adhesive composition and joined structure in circuit terminal using the same composition
CN102199404B (en) * 2007-05-09 2013-12-04 日立化成株式会社 Film-like circuit connecting material and connection structure for circuit member
JPWO2009128530A1 (en) * 2008-04-17 2011-08-04 日立化成工業株式会社 Adhesive composition, adhesive for circuit connection, connector, and semiconductor device
JP5176139B2 (en) * 2008-05-12 2013-04-03 日立化成株式会社 Circuit connection material and circuit member connection structure using the same
JP2009277769A (en) * 2008-05-13 2009-11-26 Hitachi Chem Co Ltd Circuits connecting material and connection structure of circuit member using the same
JP4844677B2 (en) * 2010-01-27 2011-12-28 日立化成工業株式会社 Circuit connection material, circuit member connection structure, and circuit member connection method.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI645420B (en) * 2014-03-25 2018-12-21 日商迪睿合股份有限公司 Anisotropic conductive film, connection method, and joined structure

Also Published As

Publication number Publication date
KR101385422B1 (en) 2014-04-14
JPWO2012014563A1 (en) 2013-09-12
CN102449095A (en) 2012-05-09
KR20120068751A (en) 2012-06-27
CN105860910A (en) 2016-08-17
CN103351838A (en) 2013-10-16
JP5454578B2 (en) 2014-03-26
KR20130143673A (en) 2013-12-31
WO2012014563A1 (en) 2012-02-02
CN102449095B (en) 2016-06-01
KR20130042018A (en) 2013-04-25
TWI445789B (en) 2014-07-21

Similar Documents

Publication Publication Date Title
TW201204797A (en) Adhesive composition, connecting structure and fabricating method thereof, and use of adhesive composition
TWI445792B (en) Adhesive composition, connecting structure and fabricating method thereof, and use of adhesive composition
KR101025128B1 (en) Adhesive composition, and connection structure for circuit member
TWI580745B (en) Adhesive composition, film-like adhesive, adhesion sheet, connection structure, and method for manufacturing connection structure
TWI378751B (en)
TW201132724A (en) Adhesive composition, adhesive composition for circuit connection and circuit connection structure and semiconductor device using it
TWI436709B (en) Circuit connected structure and fabricating method thereof
JP5338753B2 (en) Adhesive composition and connection structure
TWI579360B (en) Adhesive composition, film-like adhesive, adhesion sheet, connection structure, and method for manufacturing connection structure
US20130075142A1 (en) Adhesive composition, use thereof, connection structure for circuit members, and method for producing same
JP6532850B2 (en) Adhesive composition, film adhesive, adhesive sheet, circuit connector, method of connecting circuit members, use of adhesive composition, use of film adhesive, and use of adhesive sheet
JP6834946B2 (en) Adhesive composition and connection structure
JP6107345B2 (en) Adhesive composition, adhesive for circuit connection, and connection structure for circuit member
JP7172991B2 (en) Adhesive composition and structure
JP2015151536A (en) Adhesive composition and connection structure
JP2012204059A (en) Circuit connection material and circuit connection structure using the same
TW201728730A (en) Adhesive composition and structure
TW201610061A (en) Adhesive composition and connection structure
JP2020111760A (en) Adhesive composition and connection structure
JP2023172562A (en) Adhesive composition, circuit connection material, and connection body