KR101194523B1 - Adhesive composition and connecting structure for circuit member using the adhesive composition - Google Patents

Abstract

The present invention provides an adhesive composition which can obtain excellent adhesive strength even under low temperature and short curing conditions, and can sufficiently maintain characteristics such as adhesive strength and connection resistance even after a reliability test (a long time exposure test under high temperature and high humidity conditions). It is a subject to provide the connection structure of the circuit member using the said adhesive composition.
The present invention relates to (a) a thermoplastic resin, (b) a radically polymerizable compound, (c) a dendritic compound bonded to a core site such that a branching site is water-branched, and having a terminal site at the end of the branching site, and (d ) Provides an adhesive composition comprising a radical polymerization initiator.

Description

An adhesive composition and the connection structure of the circuit member using the said adhesive composition {ADHESIVE COMPOSITION AND CONNECTING STRUCTURE FOR CIRCUIT MEMBER USING THE ADHESIVE COMPOSITION}

The present invention relates to an adhesive composition and a connection structure of a circuit member using the adhesive composition.

BACKGROUND OF THE INVENTION In semiconductor devices and liquid crystal display devices, various kinds of adhesives have conventionally been used to bond various members in devices. The properties required for the adhesive cover many aspects such as adhesion, heat resistance, reliability under high temperature and high humidity. In addition, substrates having various surface states, such as metals such as copper and aluminum, and ITO, SiN, and SiO ₂ , as well as organic substrates such as printed wiring boards and polyimides, are used for the adherend. Molecular design of the adhesive composition tailored to is required.

In the adhesive composition for semiconductor elements and liquid crystal display elements, the thermosetting resin which used the epoxy resin as a main component which shows high adhesiveness and high reliability conventionally has been used (for example, refer patent document 1). As a constituent of the thermosetting resin, a curing agent such as an epoxy resin and a phenol resin having reactivity with the epoxy resin, and a thermal latent catalyst for promoting the reaction of the epoxy resin and the curing agent are generally used. Thermal latent catalysts are an important factor in determining the cure temperature and cure rate of an adhesive composition, and various compounds have been used in terms of storage stability at room temperature and cure rate upon heating.

In addition, in the conventional manufacturing process of a semiconductor element and a liquid crystal display element, desired adhesion was obtained by hardening the adhesive composition mentioned above for 1 to 3 hours at the temperature of 170-250 degreeC. However, with the recent high integration of semiconductor elements and the high precision of liquid crystal elements, the pitch between elements and wirings has narrowed, and there is a fear that the heating at the time of curing may adversely affect the peripheral members. In addition, in order to reduce the cost, it is necessary to improve the throughput, and the adhesive composition is required to have a property of curing (low temperature fast curing) at a lower temperature and in a short time. In order to achieve this low temperature fast hardenability, it is necessary to use a thermal latent catalyst having a low activation energy, and in this case, it is known that it is very difficult to have storage stability near room temperature.

In recent years, the radical curable adhesive composition which used together radical polymerizable compounds, such as an acrylate derivative and a methacrylate derivative, and a peroxide which is a radical polymerization initiator, attracts attention. Radical hardening was possible for hardening for a short time because the radical which is reactive active species is rich in reactivity (for example, refer patent document 2). However, since the radical curing type adhesive composition has a fast curing reaction, there is a problem in that wettability with an adherend is insufficient and adhesive strength is inferior. As a method of improving wettability, the method of adding liquid rubber to an adhesive composition, improving wettability, and improving adhesive strength is proposed (for example, patent document 3).

Japanese Patent Laid-Open No. 1-13480 International Publication 98/44067 International Publication 2004/50779

The hardened | cured material of the adhesive composition used for a semiconductor element and a liquid crystal display element is calculated | required that a characteristic is stable even if it exposes to high temperature, high humidity conditions (for example, 85 degreeC / 85% RH) for a long time. However, in the adhesive composition of patent document 3, although adhesive strength improves, it cannot be said that adhesive physical properties, such as the elasticity modulus after hardening, are sufficient, and adhesive strength and connection after a reliability test (long-term exposure test in high temperature, high humidity conditions). There is a problem that it is difficult to sufficiently maintain characteristics such as resistance.

Therefore, an object of this invention is to provide the adhesive composition which can obtain the adhesive strength excellent in low-temperature and short-term hardening conditions, and can fully maintain characteristics, such as adhesive strength and connection resistance, even after a reliability test. An object of this invention is also to provide the connection structure of the circuit member using the said adhesive composition.

The present invention is bonded to (a) the thermoplastic resin, (b) radically polymerizable compound, (c) the core portion so that the branched portion is a water phase branching, and the terminal portion is provided at the end of the branched portion The adhesive composition containing the dendritic compound and (d) radical polymerization initiator is provided. In addition, a core part means the center of a molecule | numerator, ie, the part used as the center of a branch, and a terminal part may be a terminal of a branch part, or a functional group formed in the terminal of a branch part.

By including each component (a)-(d) mentioned above, the adhesive composition of this invention can obtain the adhesive strength excellent also in hardening conditions of low temperature and a short time, and fully maintains a characteristic (adhesive strength and connection resistance) even after a reliability test. Can be.

Moreover, it is preferable that the weight average molecular weights of a dendritic compound are 1000 or more and less than 10000. By such a structure, the heat resistance of the hardened | cured material of an adhesive composition can be improved, and a characteristic (adhesive strength and connection resistance) can fully be maintained even after a reliability test.

As a dendritic compound, the thing in which at least one part of a terminal site is a radically polymerizable functional group can be used. Since the dendritic compound can be expected to react with other components by using such a dendritic compound, the heat resistance of the cured product of the adhesive composition can be further improved. Corresponding to this, it becomes possible to sufficiently maintain the characteristics (adhesive strength and connection resistance) after the reliability test.

It is preferable that the number of radically polymerizable functional groups is 6 or more per molecule of a dendritic compound. If the number of functional groups is 6 or more per molecule, a high crosslinking density can be obtained, so that the heat resistance of the cured product of the adhesive composition is remarkably improved, and the characteristics (adhesive strength and connection resistance) can be sufficiently maintained even after the reliability test.

(b) It is preferable that a radically polymerizable compound contains 1 or more types of (b) radically polymerizable compounds other than the vinyl compound which has a phosphoric acid group, and the vinyl compound which has a phosphoric acid group, respectively. By using such a radically polymerizable compound, the adhesive strength of an adhesive composition with a base material, especially a metal base material can be improved.

As the thermoplastic resin (a), at least one resin selected from the group consisting of phenoxy resins, urethane resins, polyester urethane resins, polyvinyl butyral resins, acrylic resins and polyimide resins can be used. By adopting such a resin, heat resistance and adhesiveness can be improved, excellent adhesive strength can be obtained, and sufficient characteristics (adhesive strength and connection resistance) can be maintained even after a reliability test.

The adhesive composition of this invention may contain (f) electroconductive particle further. By containing electroconductive particle, favorable electroconductivity or anisotropic electroconductivity can be provided and it becomes possible to use especially suitably for the adhesive use of the circuit members which have a circuit electrode. In addition, the connection resistance between the circuits electrically connected through the adhesive composition can be more sufficiently reduced.

The present invention also provides a connection structure of a circuit member including a first circuit member having a first connection terminal on a main surface, a second circuit member having a second connection terminal on a main surface, and a connection member. While the 1st and 2nd circuit member are arrange | positioned through a connection member so that 2 connection terminals may oppose, the 1st and 2nd connection terminals are electrically connected, and a connection member is comprised from the hardened | cured material of the adhesive composition of this invention, It provides a connection structure of a circuit member. In the connection structure of the circuit member of such a structure, since the connection member which connects a pair of circuit members is comprised by the hardened | cured material of the said adhesive composition of this invention, the adhesive strength between circuit members can be made high enough, and Moreover, the connection structure of the circuit member which can fully maintain a characteristic (adhesive strength or connection resistance) after a reliability test (for example, 85 degreeC / 85% RH standing) is obtained. In addition, the adhesive composition of this invention used as a connection member does not need to be fully hardened | cured (the highest hardening which can be achieved by predetermined hardening conditions), and may be in the state of partial hardening so long as it produces the said characteristic. .

According to the present invention, excellent adhesive strength can be obtained even at low temperature and short curing conditions, and properties such as adhesive strength and connection resistance can be obtained even after a reliability test (e.g., maintained at 85 ° C / 85% RH for 240 hours). It is possible to provide and to provide the adhesive composition excellent in handleability, and the connection structure of the circuit member using the same.

BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing of the bonded structure of the circuit member using the adhesive composition which does not contain electroconductive particle concerning embodiment of this invention.
2 is a cross-sectional view of the first circuit member, the second circuit member, and the adhesive composition (containing no conductive particles) according to the embodiment of the present invention.
It is sectional drawing of the bonded structure of the circuit member using the adhesive composition containing electroconductive particle concerning embodiment of this invention.
4 is a cross-sectional view of a first circuit member, a second circuit member, and an adhesive composition (containing conductive particles) according to an embodiment of the present invention.

EMBODIMENT OF THE INVENTION Hereinafter, preferred embodiment of this invention is described in detail, referring drawings in some cases. In addition, in drawing, the same code | symbol is attached | subjected to the same or equivalent part, and the overlapping description is abbreviate | omitted. In addition, in this specification, (meth) acryl means an acryl or methacryl corresponding to it, and it interprets similarly also in the other compound which has the same frame | skeleton.

In addition, in this specification, (a) glass transition temperature (Tg) of a thermoplastic resin means main dispersion peak temperature defined below. That is, using a dynamic viscoelasticity measuring device (for example, viscoelastic analyzer "RSA-3" (trade name) manufactured by TA Instruments Co., Ltd.), the temperature increase rate 5 占 폚 / min, frequency 10 for the film of the thermoplastic resin (a) Dynamic viscoelasticity is measured on condition of Hz and measurement temperature -150-300 degreeC, and the peak temperature of tan-delta is made into main dispersion peak temperature.

In this invention, a weight average molecular weight and a number average molecular weight are standard polystyrene conversion values obtained by measuring by gel permeation chromatography (GPC) according to the conditions shown in Table 1.

The adhesive composition of the present invention is (a) a thermoplastic resin, (b) a radically polymerizable compound, (c) a branched portion bonded to the core portion in the form of a water phase branch, a dendritic compound having a terminal portion at the end of the branched portion, And (d) radical polymerization initiators.

(a) The thermoplastic resin (hereinafter sometimes referred to simply as (a) component) becomes a liquid state having high viscosity by heating, and can be freely deformed by external force, and maintains its shape when cooled and removed from external force. It refers to resin (polymer) which hardens | cures with one and has the property which can carry out this process repeatedly. Moreover, resin (polymer) which has a reactive functional group which has the above-mentioned property is also included. (a) 0-190 degreeC is preferable and, as for Tg of a thermoplastic resin, 20-170 degreeC is more preferable.

Moreover, even if it corresponds to the definition of (a) thermoplastic resin mentioned above, the structure of (c) component mentioned later, ie, "a branch part binds to a core part in water phase branching, and has a terminal part in the terminal part of the said branch part. The compound which has a structure "is classified as component (c).

(a) The thermoplastic resin is preferably a polymer having a linear main chain. In addition, when (a) a thermoplastic resin has a side chain, it is preferable that the said side chain does not form an aqueous phase shape (it refers to the shape which branches increase as it goes to the front end). As such a thermoplastic resin, polyimide resin, polyamide resin, phenoxy resin, (meth) acrylic resin, urethane resin, polyester urethane resin, polyvinyl butyral resin and the like can be used. In addition, these polymers may contain a siloxane bond and a fluorine substituent. These resin can be used individually or in mixture of 2 or more types. These resins can be suitably used as long as the resins to be mixed are completely compatible or have a microphase separation.

When molding an adhesive composition into a film form, the larger the molecular weight of the (a) thermoplastic resin, the more easily the film formability is obtained, and the melt viscosity that affects the fluidity as the film adhesive composition can be set widely. (a) The molecular weight of the thermoplastic resin is preferably from 5000 to 150000, particularly preferably from 10000 to 80000 as the weight average molecular weight. When the weight average molecular weight is 5000 or more, good film formability is easily obtained, while when it is 150000 or less, good compatibility with other components is easily obtained.

In the adhesive composition, the content of the (a) thermoplastic resin is preferably 5 to 80% by weight, more preferably 15 to 70% by weight based on the total amount of the adhesive composition. If it is 5 weight% or more, favorable film formability will be easy to be obtained, and if it is 80 weight% or less, there exists a tendency for adhesive composition to show favorable fluidity.

(b) The radically polymerizable compound refers to a compound which generates radical polymerization by the action of a radical polymerization initiator, and may be a compound which itself generates radicals by applying activation energy such as light or heat. As a radically polymerizable compound, the compound which has a functional group superposed | polymerized by active radicals, such as a vinyl group, a (meth) acryloyl group, an allyl group, and a maleimide group, can be used preferably, for example.

Specifically, oligomers, such as an epoxy (meth) acrylate oligomer, a urethane (meth) acrylate oligomer, a polyether (meth) acrylate oligomer, and a polyester (meth) acrylate oligomer, and a trimethylol propane tri (meth) acrylate , Polyethylene glycol di (meth) acrylate, polyalkylene glycol di (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, neopentyl glycoldi (meth) Acrylate, dipentaerythritol hexa (meth) acrylate, isocyanuric acid modified bifunctional (meth) acrylate, isocyanuric acid modified trifunctional (meth) acrylate, bisphenoxyethanol fluorene acrylate, Epoxy (meth) acrylate and bisphenoxy ethanol fl which added (meth) acrylic acid to glycidyl group of bisphenol fluorene diglycidyl ether Ethylene glycol or propylene glycol is added to the glycidyl group of the epoxy (meth) acrylate and bisphenol fluorene diglycidyl ether, in which (meth) acrylic acid is added to the glycidyl group of the orene acrylate and bisphenol fluorene diglycidyl ether. The compound which introduce | transduced the (meth) acryloyloxy group into the added compound, and the compound represented by following General formula (1) and (2) are mentioned.

(Wherein R ₁ and R ₂ each independently represent a hydrogen or methyl group, and a and b each independently represent an integer of 1 to 8)

(Wherein R ₃ and R ₄ each independently represent a hydrogen or methyl group, and c and d each independently represent an integer of 0 to 8)

In addition, when (b) the radically polymerizable compound is left alone at 30 ° C., it can be used without particular limitation even if it exhibits a solid state without fluidity such as wax, lead, crystal, glass, or powder.

Specifically, N, N'-methylenebisacrylamide, diacetone acrylamide, N-methylol acrylamide, N-phenyl methacrylamide, 2-acrylamide-2-methylpropanesulfonic acid, tris (2-acrylo) Iloxyethyl) isocyanurate, N-phenylmaleimide, N- (o-methylphenyl) maleimide, N- (m-methylphenyl) maleimide, N- (p-methylphenyl) -maleimide, N- (o -Methoxyphenyl) maleimide, N- (m-methoxyphenyl) maleimide, N- (p-methoxyphenyl) -maleimide, N-methylmaleimide, N-ethylmaleimide, N-octylmaleimide , 4,4'-diphenylmethanebismaleimide, m-phenylenebismaleimide, 3,3'-dimethyl-5,5'-diethyl-4,4'-diphenylmethanebismaleimide, 4- Methyl-1,3-phenylenebismaleimide, N-methacryloxymaleimide, N-acryloxymaleimide, 1,6-bismaleimide- (2,2,4-trimethyl) hexane, N-methacryl Loyloxysuccinimide, N-acryloyloxysuccinimide , 2-naphthyl methacrylate, 2-naphthyl acrylate, pentaerythritol tetraacrylate, divinyl ethylene urea, divinyl propylene urea, 2-polytyryl ethyl methacrylate, N-phenyl-N '-( 3-methacryloyloxy-2-hydroxypropyl) -p-phenylenediamine, N-phenyl-N '-(3-acryloyloxy-2-hydroxypropyl) -p-phenylenediamine, tetra Methyl piperidyl methacrylate, tetramethyl piperidyl acrylate, pentamethyl piperidyl methacrylate, pentamethyl piperidyl acrylate, octadecyl acrylate, Nt-butyl acrylamide, diacetone acrylamide, N The compound represented by-(hydroxymethyl) acrylamide and following General formula (3)-(12) is mentioned.

Where e represents an integer from 1 to 10

(Wherein R ₅ and R ₆ each independently represent a hydrogen or methyl group, f represents an integer of 15 to 30)

(Wherein R ₇ and R ₈ each independently represent a hydrogen or methyl group, g represents an integer from 15 to 30)

Wherein R ₉ represents hydrogen or a methyl group

(Wherein R ₁₀ is hydrogen or methyl group, h represents an integer from 1 to 10)

(Wherein R ₁₁ is hydrogen or an organic group represented by formula (I) or (II), i represents an integer of 1 to 10)

(In addition, in the chemical formula, * represents bonding with another atom.)

(Wherein R ₁₂ is hydrogen or an organic group represented by formula III or IV below, j represents an integer of 1 to 10)

(In addition, in the chemical formula, * represents bonding with another atom.)

Wherein R ₁₃ represents hydrogen or a methyl group

Wherein R ₁₄ represents hydrogen or a methyl group

(b) A radically polymerizable compound may use 1 type of compounds, and may mix and use a some compound.

Moreover, the phosphoric acid group containing vinyl compound which is a compound which belongs to (b) component, and the N-vinyl type compound chosen from the group which consists of N-vinyl compound and N, N-dialkylvinyl compound are used together with (b) component other than these. can do. By using together a phosphoric acid group containing vinyl compound, it becomes possible to improve adhesiveness of an adhesive composition to a metal base material. Moreover, the crosslinking rate of an adhesive composition can be improved by using together N-vinyl type compound.

Although there will be no restriction | limiting in particular if it is a compound which has a phosphoric acid group and a vinyl group as a phosphoric acid group containing vinyl compound, The compound represented by following General formula (35)-(37) is preferable.

(Wherein R ₁₅ represents a (meth) acryloyl group, R ₁₆ represents a hydrogen atom or a methyl group, n and o each independently represent an integer of 1 to 8, wherein, R ₁₅ and R ₁₆ are , n and o may be the same or different)

(Wherein R ₁₇ represents a (meth) acryloyl group, p and q each independently represent an integer of 1 to 8, wherein R ₁₇ , p and q may be the same or different, respectively.

(Wherein R ₁₈ represents a (meth) acryloyl group, R ₁₉ represents a hydrogen atom or a methyl group, r and s each independently represent an integer of 1 to 8, wherein, R ₁₈ and R ₁₉ are each Each and s may be the same or different)

Specific examples of the phosphoric acid group-containing vinyl compound include acid phospho oxyethyl methacrylate, acid phospho oxyethyl acrylate, acid phospho oxypropyl methacrylate, acid phospho oxypolyoxyethylene glycol monomethacrylate, and acid phospho oxy. Polyoxypropylene glycol monomethacrylate, 2,2'-di (meth) acryloyloxydiethyl phosphate, EO modified dimethacrylate phosphate, phosphoric acid modified epoxy acrylate, vinyl phosphate, etc. are mentioned.

The amount of the phosphoric acid group-containing vinyl compound added is preferably 0.2 to 300 parts by weight based on 100 parts by weight of (a) the thermoplastic resin, independently of the amount of the (b) radically polymerizable compound other than the phosphoric acid group-containing vinyl compound. It is more preferable to set it as 200 weight part. When the addition amount of the phosphoric acid group-containing vinyl compound is 0.2 parts by weight or more, high adhesive strength is easily obtained, and when the amount of the phosphoric acid group-containing vinyl compound is 300 parts by weight or less, the physical properties of the adhesive composition after curing are less likely to be lowered and reliability is easily secured.

As the N-vinyl compound, specifically, N-vinylimidazole, N-vinylpyridine, N-vinylpyrrolidone, N-vinylformamide, N-vinyl caprolactam, 4,4'-vinylidene bis (N, N-dimethylaniline), N-vinylacetamide, N, N-dimethyl acrylamide, N, N-diethyl acrylamide, etc. are mentioned.

It is preferable that the addition amount of the (b) radically polymerizable compound except the compound contained in the above-mentioned phosphoric acid group containing vinyl compound is 50-250 weight part with respect to 100 weight part of (a) thermoplastic resin, More preferably, it is 60-150 weight It is wealth. Sufficient heat resistance is easy to be obtained after hardening that addition amount is 50 weight part or more. Moreover, when it is 250 weight part or less, when using as a film, favorable film formability will be easy to be obtained.

In the present invention, the (c) core portion is bonded to the branched portion so that the branched portion is subjected to an aqueous phase branching, and the dendritic compound having a terminal portion at the end of the branched portion has an aqueous phase consisting of a core portion, a branched portion and a terminal portion. A core part consists of a compound which has at least 2 or more reactive functional group A, for example. The branching site is, for example, one functional group C capable of generating a coupling reaction with the reactive functional group A of the core moiety, and a reactive functional group B capable of generating a coupling reaction with the functional group C (the same as the reactive functional group A of the core moiety, or It may consist of a unit compound having two or more). The unit compound is bonded to the core moiety by the bonding of the reactive functional group A and the functional group C, and the branching site is formed by repeating the bond between the unit compound of the reactive functional group B and the functional group C. As a result, an aqueous phase branch is formed. It is desirable to have. The terminal portion corresponds to, for example, the reaction terminal of the branching portion. The terminal portion may remain unreacted reactive functional group B, or may be modified with a compound having functional group D in which all or part of it can generate a coupling reaction with reactive functional group B. In addition, the unit compound of a branch part may contain 2 or more types of compounds, and 2 or more types of reactive functional group B and / or functional group C may be sufficient as it. The same applies to the compound and the functional group D of the terminal moiety.

Examples of reactive functional groups A and / or B include carboxyl groups, hydroxyl groups, amino groups, epoxy groups and the like. Moreover, as a compound which has the functional group D which can generate | occur | produce a coupling reaction with the reactive functional group B of a terminal site | part, monoalcohol, a monocarboxylic acid, a fatty acid, etc. are mentioned, for example.

Moreover, it is preferable that the bond produced | generated by reaction of reactive functional group A and / or B, and functional group C is an ester bond and an amide bond. Moreover, it is preferable that the bond produced | generated by reaction of reactive functional group B and functional group D is an ester bond and an amide bond. When the bond produced by the reaction of the reactive functional group A and / or B and the functional group C and the bond produced by the reaction of the reactive functional group B and the functional group D are ester bonds or amide bonds, respectively, a printed wiring board or a polyimide There exists a tendency for interaction with an organic base material and wettability to improve, high adhesive strength is easy to be obtained, and connection reliability tends to improve.

It is preferable that a dendritic compound is a compound which has a structure as mentioned above, and a dendritic compound may be a polymer or an oligomer. In addition, dendrimers having high regularity of branching and hyper branched polymers having low regularity are also included in the dendritic compound.

As a specific example of a dendritic compound, For example, polyester dendrimer, poly (amideamine) dendrimer, polyimine dendrimer, polyamine dendrimer, polyamide dendrimer, polyetheramide dendrimer, polyether dendrimer, polyetherester dendrimer, polyether ketone dendrimer, And polycarbonate dendrimers.

In addition, the core portion is composed of one compound selected from the group of compounds represented by the following formulas (13) to (20), and the branched portion is one of the repeating structures represented by the following formulas (21) to (33), or The compound which consists of a structure which consists of two or more types, and couple | bonds with the whole or a part of reactive functional group B at the terminal site consists of a compound represented by following General formula (34), and the compound comprised by them as mentioned above is also dendritic Specific examples of the compound can be given. Moreover, it is preferable that the bond of the core site | part and the branch site | part of the said dendritic compound, the bond between a branch part, and the bond of a branch part and a terminal part are ester bond or an amide bond, respectively. When these bonds are ester bonds or amide bonds, there exists a tendency for interaction and wettability with organic substrates, such as a printed wiring board and a polyimide, to improve, and high adhesive strength tends to be obtained, and connection reliability tends to improve. .

(In addition, k and l represent the integer of 1-5, and * shows couple | bonding with another atom.)

(m represents an integer of 2 to 26, and * represents bonding with another atom)

The component (c) may contain a plurality of dendritic compounds. The component (c) is a dendritic compound in which all or part of the reactive functional group B at the terminal portion is modified with a compound having a functional group D and a radical polymerizable functional group such as a (meth) acryl group, a vinyl group and a styryl group in terms of heat resistance. It is preferable to contain 1 or more types. As said dendritic compound, what modified | denatured with the compound which has a (meth) acryl group and functional group D in consideration of reactivity with (b) radically polymerizable compound is more preferable. Moreover, it is preferable that the number of radically polymerizable functional groups is 6 or more per molecule, and, as for the said dendritic compound, it is more preferable that the number of radically polymerizable functional groups is 6 or more and 15 or less per molecule. There exists a tendency for heat resistance to fully improve because the number of functional groups of a radically polymerizable functional group is six or more per molecule.

The addition amount of (c) component is 0.2-100 weight part with respect to 100 weight part of (a) thermoplastic resin, Preferably it is 0.5-70 weight part. When the amount is 0.2 parts by weight or more, the heat resistance of the cured product of the adhesive composition tends to be improved, and when the amount is 100 parts by weight or less, good film formability is easily obtained when used as a film.

(d) As a radical polymerization initiator, the compound which generate | occur | produces a radical by provision of activation energy, such as a peroxide and an azo compound, can be used, The half life temperature is 90-175 degreeC for 1 minute from a stability, reactivity, and a compatibility point, Peroxides having a molecular weight of 180 to 1000 are preferred. When the half-life temperature is within this range for 1 minute, the storage stability is excellent, the radical reactivity is sufficiently high, and it can be cured in a short time. Moreover, since molecular weight exists in this range, it is excellent in compatibility with the other component of an adhesive composition.

As a specific example of such a (d) component, 1,1,3,3- tetramethylbutyl peroxy neodecanoate, di (4-t-butylcyclohexyl) peroxydicarbonate, di (2-ethylhexyl) peroxydi Carbonate, cumylperoxy neodecanoate, dilauroyl peroxide, 1-cyclohexyl-1-methylethylperoxy neodecanoate, t-hexyl peroxy neodecanoate, t-butylperoxy neode Decanoate, t-butylperoxy pivalate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, 2,5-dimethyl-2,5-di (2-ethylhexanoylper Oxy) hexane, t-hexylperoxy-2-ethylhexanoate, t-butylperoxy-2-ethylhexanoate, t-butylperoxy neoheptanoate, t-amylperoxy-2-ethylhexa Noate, di-t-butylperoxyhexahydroterephthalate, t-amylperoxy-3,5,5-trimethylhexanoate, 3-hydroxy-1,1-dimethylbutylperoxyneodecanoate, 1,1,3,3-tetramethylbutylperox 2-ethylhexanoate, t-amylperoxyneodecanoate, di (3-methylbenzoyl) peroxide, dibenzoylperoxide, di (4-methylbenzoyl) peroxide, 2,2'-azobis -2,4-dimethylvaleronitrile, 1,1'-azobis (1-acetoxy-1-phenylethane), 2,2'-azobisisobutyronitrile, 2,2'-azobis (2 -Methylbutyronitrile), dimethyl-2,2'-azobisisobutyronitrile, 4,4'-azobis (4-cyanovaleric acid), 1,1'-azobis (1-cyclohexanecarboni Trill), t-hexyl peroxy isopropyl monocarbonate, t-butylperoxy maleic acid, t-butylperoxy-3,5,5-trimethylhexanoate, t-butylperoxylaurate, 2,5- Dimethyl-2,5-di (3-methylbenzoylperoxy) hexane, t-butylperoxy-2-ethylhexyl monocarbonate, t-hexylperoxybenzoate, 2,5-dimethyl-2,5-di ( Benzoyl peroxy) hexane, t-butyl peroxy benzoate, dibutyl peroxy trimethyl adipate, t-amyl peroxy normal octo Y, t-amyl peroxy isononanoate, t-amyl peroxy benzoate, etc. are mentioned. These compounds may be used alone or in combination of two or more compounds.

Moreover, as (d) component, the compound which generate | occur | produces a radical by light irradiation of 150-750 nm can also be used preferably. Such compounds include, for example, α-acetoaminophenone derivatives and phosphine oxide derivatives described in Photoinitiation, Photopolymerization, and Photocuring, J.-P.Fouassier, Hanser Publishers (1995), pages 17 to 35. It is more preferably used because of its high sensitivity to irradiation.

These compounds may be used alone or in combination with the peroxide and azo compounds.

0.1-500 weight part is preferable with respect to 100 weight part of (a) thermoplastic resins, and, as for the addition amount of (d) component, 1-300 weight part is more preferable. When the addition amount of the component (d) is 0.1 parts by weight or more, the adhesive composition is easy to cure sufficiently, and when it is set to 500 parts by weight or less, the leaving stability tends to be good.

(f) Although electroconductive particle should just have electroconductivity as a whole particle | grain, when using for the connection of the circuit member which has a connection terminal, the thing whose average particle diameter is smaller than the distance between connection terminals is used. (f) As a specific example of electroconductive particle, metal particle | grains, such as Au, Ag, Ni, Cu, solder, carbon etc. are mentioned. In addition, a non-conductive glass, ceramic, plastic, or the like may be used as a nucleus, and the nucleus may be coated with the metal, metal particles, or carbon. (f) The conductive particles are made of plastic as a nucleus, and the nucleus is coated with the metal, metal particles or carbon, or hot melt metal particles, which are deformable by heating and pressurization. It is preferable because it increases and reliability improves.

Moreover, since the microparticles | fine-particles which further coat | covered the surface of these (f) electroconductive particle with a polymer resin etc. can suppress the short circuit by the contact of the particles when the compounding quantity of electroconductive particle is increased, the insulation between electrode circuits can be improved. You may use this individually or in mixture with electroconductive particle suitably.

It is preferable that the average particle diameter of this (f) electroconductive particle is 1-18 micrometers from a dispersibility and electroconductivity. When it contains such (f) electroconductive particle, an adhesive composition can be used suitably as an anisotropically conductive adhesive composition.

(f) It is preferable to set it as 0.1-30 volume% with respect to the total volume of components other than (f) electroconductive particle of an adhesive composition, and, as for the addition amount of electroconductive particle, it is more preferable to set it as 0.1-10 volume%. By containing 0.1 volume% or more, the electroconductivity of the adhesive composition after hardening improves and it is preferable. Moreover, it is preferable that the short circuit of a circuit hardly arises by setting it as 30 volume% or less. In addition, although the volume% is determined based on the volume of each component before hardening at 23 degreeC, the volume of each component can be calculated | required in conversion from volume to volume using specific gravity. In addition, the increased volume can be obtained as the volume by adding the component to an appropriate solvent (water, alcohol, etc.) that wets the component well without dissolving or swelling the component in a measuring cylinder or the like.

Stabilizers can be added to the adhesive composition in order to control the curing rate and impart storage stability. As such stabilizers, compounds known as stabilizers can be used without particular limitation, but quinone derivatives such as benzoquinone and hydroquinone, phenol derivatives such as 4-methoxyphenol and 4-t-butylcatechol, 2,2, Aminooxyl derivatives, such as 6,6- tetramethyl piperidine-1-oxyl and 4-hydroxy-2,2,6,6-tetramethyl piperidine-1-oxyl, tetramethyl piperidyl methacrylate Hindered amine derivatives, such as these, are preferable.

The amount of the stabilizer added is 0.01 to 30 parts by weight, and preferably 0.05 to 10 parts by weight based on 100 parts by weight of the adhesive composition. When the amount added is 0.01 part by weight or more, the effect of adding the stabilizer tends to appear, and when the amount is 30 parts by weight or less, it is difficult to adversely affect compatibility with other components.

Adhesion aids, such as a coupling agent represented by an alkoxysilane derivative and a silazane derivative, an adhesion improving agent, and a leveling agent, can also be added to an adhesive composition suitably. Specifically, the compound represented by the following general formula (38) is preferable, and in addition to being used alone, two or more kinds of compounds may be mixed and used.

(Wherein R ₂₀ , R ₂₁ , R ₂₂ are independently hydrogen, an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, an alkoxycarbonyl group having 1 to 5 carbon atoms, an aryl group, and R ₂₃ is a (meth) acryl Diary, vinyl group, isocyanate group, imidazole group, mercapto group, amino group, methylamino group, dimethylamino group, benzylamino group, phenylamino group, cyclohexylamino group, morpholino group, piperazino group, ureido group, glycidyl group, t is Represents an integer from 1 to 10)

The adhesive composition may contain a rubber component for the purpose of stress relaxation and adhesion improvement. A rubber component means the component which shows rubber elasticity by the component or reaction which shows rubber elasticity (for example, JIS K6200) in the state as it is. The rubber component may be solid or liquid at room temperature (25 ° C.), but is preferably liquid in terms of fluidity improvement. As the rubber component, a compound having a polybutadiene skeleton is preferable. The rubber component may have a cyano group, a carboxyl group, a hydroxyl group, a (meth) acryloyl group or a morpholine group. Moreover, the rubber component which contains the cyano group which is a high polar group, and a carboxyl group in a side chain or a terminal from an adhesive improvement viewpoint is preferable. Moreover, even if it has a polybutadiene frame | skeleton, when it shows thermoplasticity, it classifies as (a) component, and when it shows radical polymerization property, it classifies as (b) component.

As a specific example of the said rubber component, the liquid acrylonitrile- butadiene rubber which contains a liquid acrylonitrile butadiene rubber, a carboxyl group, a hydroxyl group, a (meth) acryloyl group, or a morpholine group at a polymer terminal, and a liquid carboxylated nitrile rubber are mentioned. The acrylonitrile content, which is a polar group, is preferably 10 to 60 mass%.

The adhesive composition of the present invention may further contain organic fine particles for the purpose of stress relaxation and adhesion improvement. Organic microparticles | fine-particles mean microparticles | fine-particles which consist of organic compounds (for example, an average particle diameter is 0.05-1.0 micrometer). In addition, when organic microparticles | fine-particles consist of the above-mentioned rubber component, it classifies as a rubber component instead of organic microparticles | fine-particles, and when organic microparticles | fine-particles consist of the above-mentioned (a) thermoplastic resin, it classifies as a thermoplastic resin instead of organic microparticles | fine-particles. .

Examples of the organic fine particles include polyisoprene, polybutadiene, carboxyl end polybutadiene, hydroxyl end polybutadiene, 1,2-polybutadiene, carboxyl end 1,2-polybutadiene, acrylic rubber, styrene-butadiene rubber, and acrylonitrile. Acrylonitrile-butadiene rubber, carboxylated nitrile rubber, hydroxyl group-terminated poly (oxypropylene), alkoxysilyl group-terminated poly (butadiene rubber, carboxyl group, hydroxyl group, (meth) acryloyl group or morpholine group containing at the polymer end) Oxypropylene), poly (oxytetramethylene) glycol, polyolefin glycol, polyolefin glycol (meth) alkyl acrylate-butadiene-styrene copolymer, alkyl (meth) acrylate-silicone copolymer, silicone (meth) -acrylic copolymer or composite Organic fine particles which are formed are mentioned. These compounds may be used alone or in combination of two or more kinds thereof.

The adhesive composition can be used in paste form when it is liquid at room temperature. In the case of a solid at room temperature, in addition to heating, it can also be pasteurized using a solvent. The solvent that can be used is not particularly limited as long as it is not reactive with the adhesive composition and the additive and exhibits sufficient solubility, but the boiling point at normal pressure is preferably 50 to 150 ° C. When boiling point is 50 degreeC or more, since it is hard to volatilize even if it leaves at room temperature, use in an open system is preferable, because it is preferable. Moreover, when a boiling point is 150 degrees C or less, it becomes easy to volatilize a solvent and it becomes easy to acquire the reliability after adhesion.

An adhesive composition can also be used as a film form. A solution obtained by adding a solvent or the like to the adhesive composition, if necessary, is applied onto a peelable base material such as a fluororesin film, a polyethylene terephthalate film, a release paper, or impregnated with the solution to a base such as a nonwoven fabric. It can put on and remove a solvent etc. and can use it as a film. When used in the shape of a film, it is more convenient in terms of handling properties.

The adhesive composition can be bonded using a combination of heating and pressure. Although heating temperature in particular is not restrict | limited, The temperature of 100-250 degreeC is preferable. The pressure is not particularly limited as long as it does not cause damage to the adherend. However, 0.1 to 10 MPa, which is a pressure generally used, is preferable. It is preferable to perform these heating and pressurization in the range for 0.5 second-120 second. In addition, the adhesive composition of the present invention can be adhered even if it is heated and pressurized at 140 to 200 ° C, 3 MPa, and 10 seconds.

The adhesive composition can be used as an adhesive for heterogeneous adherends having different coefficients of thermal expansion. Specifically, it can be used as a semiconductor element adhesive material represented by a circuit connection material represented by an anisotropic conductive adhesive, a silver paste, a silver film, etc., an elastomer for CSP, an underfill material for CSP, a LOC tape, and the like.

An adhesive composition can be used in order to obtain the connection structure and semiconductor device with which the circuit member and the circuit terminals were connected.

1: is sectional drawing which shows the connection structure of the circuit terminal which concerns on embodiment using the adhesive composition of this invention which does not contain (f) electroconductive particle.

The connection structure 100 of the circuit terminal shown in FIG. 1 is the 1st circuit member 30 which has the 1st connection terminal 32 on the main surface 31a of the 1st circuit board 31, and the 2nd circuit board. First circuit such that the second circuit member 40 having the second connecting terminal 42 on the main surface 41a of the 41 and the first connecting terminal 32 and the second connecting terminal 42 face each other. The connection member 10C which connects the main surface 31a of the board | substrate 31 and the main surface 41a of the 2nd circuit board 41 is provided. The 1st connection terminal 32 and the 2nd connection terminal 42 are electrically connected by contacting each other. In addition, the connection member 10C consists of hardened | cured material of the adhesive composition 10 of this invention.

The connection structure 100 of the circuit terminal shown in FIG. 1 can be manufactured as follows, for example.

First, as shown in FIG. 2, the 1st circuit member 30, the 2nd circuit member 40, and the adhesive composition 10 shape | molded in the film form are prepared. Next, the adhesive composition 10 is mounted on the main surface 41a in which the second connection terminal 42 in the second circuit member 40 is formed, and the first connection terminal 32 is further placed on the adhesive composition 10. ) Is placed on the first circuit member 30 so as to face the second connection terminal 42. Subsequently, the adhesive composition 10 is cured while heating the adhesive composition 10 via the first circuit member 30 and the second circuit member 40, and simultaneously pressed in a direction perpendicular to the main surfaces 31a and 41a, The connection member 10C is formed between the first and second circuit members 30 and 40 to obtain the connection structure 100 of the circuit terminal of FIG. 1.

It is sectional drawing which shows the connection structure of the circuit terminal which concerns on embodiment using the adhesive composition of this invention containing (f) electroconductive particle.

The connection structure 200 of the circuit terminal shown in FIG. 3 is the 1st circuit member 30 which has the 1st connection terminal 32 on the main surface 31a of the 1st circuit board 31, and a 2nd circuit board. First circuit such that the second circuit member 40 having the second connecting terminal 42 on the main surface 41a of the 41 and the first connecting terminal 32 and the second connecting terminal 42 face each other. The connection member 20C which connects the main surface 31a of the board | substrate 31 and the main surface 41a of the 2nd circuit board 41 is provided. In addition, the connection member 20C is the hardened | cured material of the adhesive composition 20 in which the electroconductive particle 22 was disperse | distributed in the component 21 other than electroconductive particle of an adhesive composition (that is, hardened | cured material of components other than electroconductive particle of an adhesive composition). Electroconductive particle 22 in which the electroconductive particle 22 was disperse | distributed in (21C), and the electroconductive particle 22 contact | connects both connecting terminals between the 1st connecting terminal 32 and the 2nd connecting terminal 42 which oppose. Both connection terminals are electrically connected via 22.

The connection structure 200 of the circuit terminal shown in FIG. 3 is the adhesive composition 20 shape | molded into the 1st circuit member 30, the 2nd circuit member 40, and the film form, for example, as shown in FIG. ) Can be prepared and manufactured by the same method as that of obtaining the connection structure 100 of the circuit terminal mentioned above.

Here, as a circuit board provided with a connection terminal, each combination of these composites, such as inorganic substance, such as a semiconductor, glass, and ceramics, organic materials, such as polyimide and polycarbonate, and glass / epoxy, is applicable.

[Example]

EMBODIMENT OF THE INVENTION Below, although this invention is demonstrated concretely based on an Example, this invention is not limited to these Examples.

[Adjustment of Thermoplastic (Phenoxy Resin (YP-50))]

The phenoxy resin (product name: YP-50, manufactured by Toto Kasei Co., Ltd.) dissolved 40 g of the resin in 60 g of methyl ethyl ketone to obtain a solution having a solid content of 40% by weight.

[Preparation of Thermoplastic Resin (Polyester Urethane Resin (UR-1400))]

As the polyester urethane resin (product name: UR-1400, manufactured by Toyobo Co., Ltd.), a 1: 1 mixed solvent dissolved product of methyl ethyl ketone and toluene having a resin content of 30% was used.

[Synthesis of thermoplastic resin (urethane resin)]

450 parts by weight of polybutylene adipate diol (product name: polybutylene adipate diol, manufactured by Aldrich) and a polyoxytetramethylene glycol (product name: polyoxytetramethylene glycol) having an average molecular weight of 2000 450 parts by weight of Aldrich, 100 parts by weight of 1,4-butylene glycol (product name: 1,4-butylene glycol, manufactured by Aldrich), methyl ethyl ketone (product name: 2-butanone, Wako Junyaku High School) It was melt | dissolved in 4000 weight part of company made, and 390 weight part of diphenylmethane diisocyanate (product name: diphenylmethane diisocyanate, the Aldrich company) was added, it was made to react at 70 degreeC for 60 minutes, and the urethane resin was obtained. It was 100,000 when the weight average molecular weight of the obtained urethane resin was measured by GPC method.

[Synthesis of resinous compound (DA-1)]

55.7 g of BOLTORN H20 (OH value: 504 mgKOH / g) manufactured by Perstorp in a reactor equipped with a reflux condenser, a stirrer, a thermometer, a thermostat, and a water separator, and toluene as a reaction solvent 150 ml, 0.143 g of hydroquinone as a polymerization inhibitor, and 39.6 g of pyridine as a base catalyst are charged and 49.8 g (0.55 mol) of acrylic chlorides (Tokyo Kasei Kogyo Co., Ltd. product) are dripped. After dropping, the mixture was refluxed for 2 hours and allowed to cool. Then, water was added to the reaction mixture and extracted with toluene. The obtained toluene extract was washed three times with 10% sodium sulfate. Toluene was distilled off under reduced pressure to obtain 80.5 g of a dendritic compound (DA-1). The number of functional groups of the obtained dendritic compound was 16 functional (acryloyl group), and a weight average molecular weight (MW): 1580. In addition, the functional group number (acryloyl group) of a dendritic compound is a theoretical value obtained by calculating from the mixing amount (equivalent ratio) of reaction raw material.

[Preparation of Resin Compounds (H2004, and # 1000)]

Polyester polyol terminal acrylate # 1000 (MW: 1850, number of functional groups: 12 functional (acryloyl group), Osaka Yuki Chemical Co., Ltd. make) and Bolton H2004 (MW: 3200, no radically polymerizable functional group, first store) Psa) was prepared.

[Preparation of radically polymerizable compound (M-215)]

Isocyanuric acid EO modified diacrylate (product name: M-215, Toagosei Co., Ltd. make) was prepared.

[Synthesis of radically polymerizable compound (urethane acrylate (UA))]

860 parts by weight (1.00 mol) of poly (hexamethylene carbonate) diol (manufactured by Aldrich) having a number average molecular weight of 860 in a reaction vessel equipped with a stirrer, a thermometer, a reflux cooling tube having a calcium chloride drying tube, and a nitrogen gas introduction tube; 5.53 parts by weight of butyltin dilaurate (manufactured by Aldrich) was added. After introducing nitrogen gas sufficiently, it heated at 70-75 degreeC, 666 weight part (3.00 mol) of isophorone diisocyanate (made by Aldrich) was dripped at the constant rate over 3 hours, and it was made to react. After completion of the dropping, the reaction was continued for about 10 hours. 238 parts by weight (2.05 mol) of 2-hydroxyethyl acrylate (manufactured by Aldrich) and 0.53 part by weight of hydroquinone monomethyl ether (manufactured by Aldrich) were added thereto, and the mixture was further reacted for 10 hours. It confirmed that it disappeared and reaction was complete | finished and urethane acrylate (UA) was obtained. The number average molecular weight of obtained UA was 3,700.

[Preparation of Phosphoric Acid Group-Containing Vinyl Compound (P-2M)]

2- (meth) acryloyloxyethyl phosphate (Product name: Light ester P-2M, Kyoisha Chemical Co., Ltd. make) was prepared.

[Preparation of radical polymerization initiator (perhexyl O)]

T-hexyl peroxy-2-ethyl hexanoate (product name: perhexyl O, the Nippon Yushi Co., Ltd. product) was prepared as a radical polymerization initiator.

[Production of Conductive Particles]

A nickel layer having a thickness of 0.2 μm was provided on the surface of the particles containing polystyrene as a nucleus, and a gold layer having a thickness of 0.02 μm was provided on the outside of the nickel layer to produce electroconductive particles having an average particle diameter of 4 μm and a specific gravity of 2.5.

(Examples 1 to 6, Comparative Examples 1 to 3)

It mix | blends as shown in Table 2 by solid weight ratio, and also electroconductive particle | grains are mix | blended and disperse | distributed 1.5 volume%, it apply | coats to the 80-micrometer-thick fluororesin film using a coating apparatus, and is adhesive by hot air drying of 70 degreeC for 10 minutes. The film adhesive composition whose layer thickness is 20 micrometers was obtained.

[Measurement of connection resistance and adhesive strength]

Examples 1 to 6 and Comparative Examples 1 to 3 of the film adhesive composition having a flexible circuit board (FPC) having 500 copper circuits having a line width of 25 μm, a pitch of 50 μm, and a thickness of 18 μm, and 0.2 μm of indium oxide (ITO) ) Was interposed between a glass (thickness of 1.1 mm and a surface resistance of 20 Ω / ° C) in which a thin layer was formed. This was heated and pressed for 10 seconds at 170 ° C and 3 MPa using a thermocompression bonding apparatus (heating method: constant heat type, manufactured by Toray Engineering Co., Ltd.) to produce a connecting body. The resistance value between adjacent circuits of this connection body was measured by a multimeter immediately after adhesion | attachment, after hold | maintaining for 240 hours in 85 degreeC and the high temperature and high humidity tank of 85% RH (after test). The resistance value was expressed as the average of 37 resistance points between adjacent circuits.

Moreover, the adhesive strength of this connector was measured and evaluated by the 90 degree peeling method according to JIS-Z0237. Here, Tensilon UTM-4 (peel rate 50 mm / min, 25 degreeC) by Toyo Baldwin Co., Ltd. was used for the measurement apparatus of adhesive strength. The result of the measurement of the connection resistance and adhesive strength of the film adhesive composition performed as mentioned above is shown in Table 3 below.

The adhesive composition obtained in Examples 1 to 6 had a good connection resistance of about 3 Ω or less and 600 immediately after bonding at a heating temperature of 170 ° C. and even after holding for 240 hours in a high temperature and high humidity bath at 85 ° C. and 85% RH (after a reliability test). It has been clarified to exhibit good adhesive strength of at least N / m.

Compared with these, although the adhesive composition of the comparative examples 1 and 2 which do not use the (c) dendritic compound in this invention shows favorable connection resistance, it is 240 hours immediately after adhesion | attachment and in the high temperature, high humidity bath of 85 degreeC and 85% RH. It became clear that the connection resistance after holding (after reliability test) was high. Moreover, in Comparative Examples 3 and 4, it became clear that the connection resistance was high immediately after adhesion and after holding for 240 hours in 85 degreeC and the high temperature high humidity tank of 85% RH (after reliability test).

[Description of Symbols]

10, 20: adhesive composition

10C, 20C: connection member

21: adhesive composition containing no conductive particles

22: conductive particles

21C: Cured product of adhesive composition not containing conductive particles

30: first circuit member

31: first circuit board

31a: giving

32: first connection terminal

40: second circuit member

41: second circuit board

41a: state

42: second connection terminal

100, 200: connection structure of a circuit member

Claims (8)

The first and second connection terminals are disposed to face each other between a first circuit member having a first connection terminal on a main surface and a second circuit member having a second connection terminal on a main surface, and the first and second connections In the adhesive composition for circuit member connection which electrically connects a terminal and connects a said 1st circuit member and a said 2nd circuit member,
(a) Thermoplastic resin, (b) Radical polymerizable compound, (c) A branched site is bonded to a core site so that an aqueous phase may be branched, and a terminal site is provided at the end of the branched site, and the weight Adhesive composition for connection to a circuit member containing the dendritic compound whose average molecular weight is 1000 or more and less than 10000, and (d) radical polymerization initiator. delete The adhesive composition for circuit member connection of Claim 1 whose at least one part of the said terminal site | part is a radically polymerizable functional group. The adhesive composition for circuit member connection of Claim 3 whose number of the said radically polymerizable functional groups is 6 or more per molecule of the said dendritic compound. The adhesive composition for connection to a circuit member according to claim 1, wherein the radical polymerizable compound (b) comprises at least one vinyl compound having a phosphoric acid group and at least one radical polymerizable compound other than the compound. The circuit member connection circuit according to claim 1, wherein (a) the thermoplastic resin is at least one member selected from the group consisting of phenoxy resins, urethane resins, polyester urethane resins, polyvinyl butyral resins, acrylic resins, and polyimide resins. Adhesive composition. The adhesive composition for circuit member connection of Claim 1 which further contains (f) electroconductive particle. As a connection structure of the 1st circuit member which has a 1st connection terminal on a main surface, the 2nd circuit member which has a 2nd connection terminal on a main surface, and the circuit member provided with a connection member,
The first and second circuit members are disposed via the connection member so that the first and second connection terminals face each other, the first and second connection terminals are electrically connected, and the connection member is firstly connected. The connection structure of the circuit member comprised from the hardened | cured material of the adhesive composition for circuit member connection of any one of Claims 3-7.

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