201203629 六、發明說明： 【發明所屬之技術領域】 本發明係揭露一種發光二極體的SMD雙色導線 架製造方法，且特別係有關於在導線區域上進行兩次 塑模射出成型之雙色導線架。 【先前技術】 由於發光二極體(Light-Emitting Diode，LED)壽命 長、無污染、低功耗的特性備受青睞，乃成為當前綠 色照明浪潮的主流，無論在功能性照明、景觀裝飾照 明、液晶顯示背光照明及汽車照明等市場中，LED所 占比率皆高度成長。 雖然如此，但LED的封裝仍存在一些技術上的問 題’導致LED照明燈具的光源會產生不均勻之散色等 問題，不利於LED照明燈具產業的長期發展。 習知發光二極體的SMD導線架製程技術已揭露 於中華民國發明專利公開號第200849535號，其主要 製程為在導線區域上進行塑模射出一晶粒座，然後將 接腳折彎。其晶粒座内埋端的接腳可與發光二極體晶 片電性連接’其折彎後外露於外部殼體之接腳則與電 路板(Printed Circuit Board，簡稱pCB)電性連接。發光 二極體下游封裝薇商使用此一習知製程所主產之 SMD導線架，將發光二極體黏晶封裝在導線架上之 201203629 後，為了解決光源不均勻之散色問題，必須將晶粒座 之白色表面以各種技術處理成黑色。將該晶粒座之白 色表面處理成黑色之過程必然造成封裝廠商製程時間 之延長與良率之降低。此外發光二極體在長時間使用 下所產生的熱’也會導致黑色塗料產生斑驳與脫落之 現象，導致該發光二極體之亮度以及光源不均勻之散 射等現象。 為了能夠解決習知技藝之各項問題，本發明人基 於多年研究開發與諸多實務經驗，提出一種發光二極 體的SMD雙色導線架製造方法，以改善上述習知技 藝之缺點並能兼容並蓄其優點。 【發明内容】 有鑑於上述習知技藝之問題，本發明之一目的即 在於提供一種發光二極體的SMD雙色導線架製造方 法，以兩次塑模射出製造雙色導線架結構，以改善傳 統導線架製程技術中，必須在發光二極體黏晶封裝在 導線架上之後，額外將晶粒座之白色表面以各種技術 處理成黑色之不便利性，並可同時降低下游封裝廠商 之製程成本、提高其產品良率以及延長產品使用壽命。 緣是，為達上述目的，本發明係揭露一種發光二 極體的SMD雙色導線架製造方法，包含步驟S11〜S17: 首先於步驟S11，提供一金屬基板；接著於該金 201203629 屬基板上進行步驟S12，沖壓複數個導線區域，且每 一導線區域包含至少一接腳；於步驟S13，電鍍該金 屬基板；之後，於步驟S14，在每一導線區域上進行 第一次塑模射出以成型一基座，其材料為具有高反射 率的白色塑料，該基座具有固接該接腳的功能；其次， 於步驟S15’在該基座上進行第二次塑模射出以成型 一外部殼體’其材料為不可透光之有色塑料，該有色 塑料較佳為黑色’該外部殼體完全包覆該基座而形成 一晶粒座；其後，於步驟S16，進行兩段沖模，將接 腳折彎在該外部殼體上；最後，於步驟S17，進行沖 模裁切下料，去除料腳以得到具有複數個發光二極體 的SMD雙色導線架。該SMD雙色導線架亦可應用於 其他固態發光元件，例如：OLED (Organic Light Emitting Diode)的導線架及 EL(Electro Luminescence) 的導線架。 緣是，本發明一種發光二極體的SMD雙色導線架 製造方法，係可以避免以習知製程技術製造的導線架 需於發光二極體黏晶封裝在導線架上之後，必須進一 步將阳粒座之自色表面以各種技術處理成黑色之不便 利I·生以及避免發光二極體在長時間使用下所產生的 熱導致黑色塗料產生斑駁與脫落之現象，造成發光二 極體之冗度以及光源不均勻之散射等等表現不佳之情 況0 啟為使貝番查委員對本發明之技術特徵及所達到 201203629 之功效有更進一步之瞭解與認識，謹佐以較佳之實施 例及配合詳細之說明如後，然所例舉之具體實施例與 圖示僅提供參考與說明用，並非用來對本發明加以限 制者。 【實施方式】 發明人考慮到所主張申請標的也可用其他方式具 體實施，例如包含不同步驟或結合類似於本文件内所 描述之步驟的步驟組合、與其他目前或未來技術結 合。再者，雖然此處可能會使用術語「步驟」等運用 不同的方法元件，不過除非有明確描述個別步驟的順 序，否則不應該將這些術語解譯為暗示此處揭示的許 多步驟之間的任何特定順序。 以下將參照相關圖式，說明依本發明一種發光二 極體的SMD雙色導線架製造方法之實施例，為使便 於理解，下述實施例中之相同元件係以相同之符號標 示來說明。 請同時參見圖1及圖2。圖1係為本發明一種發 光二極體的SMD雙色導線架製造方法的流程圖。首 先於步驟S11，提供一金屬基板；接著於該金屬基板 上進行步驟S12，沖壓複數個導線區域(2)，並且每一 導線區域(2)包含至少一接腳(210);於步驟S13，電鍍 該金屬基板；之後，於步驟S14，在每一導線區域(2) 201203629 上進行第一次塑模射出以成型一基座（230)，其材料為 具有高反射率的白色塑料，該基座（230)具有固接該接 腳(210)的功能；其次，於步驟S15，在該基座上進行 第二次塑模射出以成型一外部殼體(250)，其材料為不 可透光之有色塑料’該有色塑料較佳為黑色，該外部 殼體（250)完全包覆該基座（230)而形成一晶粒座 (20);其後’於步驟S16，進行兩段沖模，將接腳(21〇) 折彎在該外部殼體(250)上；最後，於步驟S17，進行 第二次沖模裁切下料去除料腳，即得到具有多數個發 光二極體的SMD雙色導線架。 請參見圖2’其係以本發明一種發光二極體的 SMD雙色導線架製造方法製造之晶粒座示意圖。圖 中，該外部殼體(250)將基座（230)完全包覆於其中。 本發明一種發光二極體的SMD雙色導線架製造 方法，亦可應用於其他固態發光元件的導線架製造， 如 OLED (Organic Light Emitting Diode)的導線架製 造、EL(Electro Luminescence)的導線架製造。 因此，本發明一種發光二極體的SMD雙色導線架 製造方法，可以避免以習知製程技術製造的導線架需 額外於發光二極體黏晶封裴在導線架上之後，必須將 晶粒座之白色表面以各種技術處理成黑色之不便利 性，亦可避免習知製程技術製造的導線架，其發光二 極體在長時間使用下所產生的熱使得黑色塗料產生斑 201203629 驳與脫落之現象，造成發光二極體之亮度以及光源不 均勻之散射等等表現不佳之情況。 以上具體實施例所述僅為本發明之例舉，而非為 限制性者，該等具體實施例除非有明確描述個別步驟 的順序，否則不應該將這些術語解譯為暗示此處揭示 的許多步驟之間的任何特定順序。任何未脫離本發明 之精神與範疇，而對其進行之等效修改或變更，均應 包含於後附之申請專利範圍中。 【圖式簡單說明】 圖1係為本發明一種發光二極體的SMD雙色導線 架製造方法之較佳實施例流程圖。 圖2係為本發明一種發光二極體的SMD雙色導線 架製造方法製造之晶粒座示意圖。 【主要元件符號說明】 2 導線區域 20 晶粒座 210 接腳 230 基座 250 外部殼體 S11〜S17 製造方法步驟201203629 VI. Description of the Invention: [Technical Field] The present invention discloses a method for manufacturing an SMD two-color lead frame of a light-emitting diode, and particularly relates to a two-color lead frame for two-molded injection molding on a wire region. . [Prior Art] Due to the long life, non-pollution and low power consumption of Light-Emitting Diode (LED), it is the mainstream of the current green lighting wave, whether in functional lighting or landscape lighting. In the market of liquid crystal display backlighting and automotive lighting, the proportion of LEDs is highly developed. Even so, there are still some technical problems in the packaging of LEDs. The problem that the light source of LED lighting fixtures will produce uneven color dispersion is not conducive to the long-term development of the LED lighting industry. The SMD lead frame process technology of the conventional light-emitting diode has been disclosed in the Republic of China Invention Patent Publication No. 200849535, the main process of which is to mold a die seat on the wire area and then bend the pin. The pin of the buried end of the die pad can be electrically connected to the LED of the light-emitting diode. The pin exposed to the outer casing after being bent is electrically connected to the printed circuit board (pCB). In the downstream package of the LED, Weishang uses the SMD lead frame, which is mainly produced by this conventional process, and encapsulates the LED of the LED in the lead frame on 201203629. In order to solve the problem of uneven color dispersion of the light source, it must be The white surface of the die pad is treated black in various techniques. The process of treating the white surface of the die pad to black inevitably results in a prolonged process time and yield reduction of the package manufacturer. In addition, the heat generated by the LED during long-term use can also cause mottled and peeling of the black paint, resulting in the brightness of the light-emitting diode and the uneven scattering of the light source. In order to solve the problems of the prior art, the inventors have proposed a method for manufacturing an SMD two-color lead frame of a light-emitting diode based on years of research and development and many practical experiences, in order to improve the shortcomings of the above-mentioned prior art and to be compatible with its advantages. . SUMMARY OF THE INVENTION In view of the above problems in the prior art, an object of the present invention is to provide a method for manufacturing an SMD two-color lead frame of a light-emitting diode, which is manufactured by two-mold injection to manufacture a two-color lead frame structure to improve a conventional wire. In the process technology, the white surface of the die pad must be additionally processed into a black inconvenient after the LED is bonded on the lead frame, and the process cost of the downstream package manufacturer can be reduced at the same time. Improve product yield and extend product life. In order to achieve the above object, the present invention discloses a method for manufacturing an SMD two-color lead frame of a light-emitting diode, comprising the steps S11 to S17: first, in step S11, a metal substrate is provided; and then on the substrate of the 201203629 substrate. Step S12, punching a plurality of wire regions, and each wire region includes at least one pin; in step S13, plating the metal substrate; then, in step S14, performing a first molding injection on each wire region to form a pedestal whose material is a white plastic having high reflectivity, the pedestal has a function of fixing the pin; secondly, a second molding injection is performed on the pedestal to form an outer casing at step S15' The body 'the material is a non-transparent colored plastic, and the colored plastic is preferably black'. The outer casing completely covers the base to form a die seat; thereafter, in step S16, a two-stage die is performed, The pin is bent on the outer casing; finally, in step S17, the die is cut and cut to remove the foot to obtain an SMD two-color lead frame having a plurality of light emitting diodes. The SMD two-color lead frame can also be applied to other solid-state light-emitting elements such as an OLED (Organic Light Emitting Diode) lead frame and an EL (Electro Luminescence) lead frame. Therefore, the method for manufacturing the SMD two-color lead frame of the light-emitting diode of the present invention can avoid the need for the lead frame manufactured by the conventional process technology to be encapsulated on the lead frame after the light-emitting diode is mounted on the lead frame, and the positive grain must be further The self-color surface of the seat is treated with various techniques to make it black. It is difficult to avoid the heat generated by the LED during long-term use, which causes the black paint to become mottled and peeled off, resulting in the redundancy of the LED. And the poor performance of the light source, such as the unevenness of the light source, etc. 0. In order to make the members of the company more aware of and understand the technical features of the present invention and the effectiveness of the 201203629, please refer to the preferred embodiment and the detailed details. The exemplifications of the present invention are intended to be illustrative and not restrictive. [Embodiment] The inventors have considered that the claimed subject matter may also be embodied in other specific ways, for example, including different steps or combinations of steps similar to those described in this document, in combination with other current or future technologies. Furthermore, although the terms "step" and the like may be used herein to apply different method elements, unless the order of the individual steps is explicitly described, these terms should not be interpreted to imply any of the many steps disclosed herein. Specific order. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a method for fabricating an SMD two-color lead frame for a light-emitting diode according to the present invention will be described with reference to the accompanying drawings. For the sake of understanding, the same elements in the following embodiments are denoted by the same reference numerals. Please also refer to Figure 1 and Figure 2. 1 is a flow chart of a method for manufacturing an SMD two-color lead frame of a light-emitting diode according to the present invention. First, in step S11, a metal substrate is provided; then, step S12 is performed on the metal substrate, a plurality of wire regions (2) are punched, and each wire region (2) includes at least one pin (210); and in step S13, The metal substrate is electroplated; then, in step S14, a first molding injection is performed on each of the wire regions (2) 201203629 to form a pedestal (230) made of white plastic having high reflectivity. The seat (230) has a function of fixing the pin (210); secondly, in step S15, a second molding injection is performed on the base to form an outer casing (250), the material of which is opaque The colored plastic is preferably black, and the outer casing (250) completely covers the base (230) to form a die seat (20); thereafter, in step S16, a two-stage die is performed. The pin (21〇) is bent on the outer casing (250); finally, in step S17, the second die cutting is performed to remove the material to obtain the SMD two-color with a plurality of light-emitting diodes. Lead frame. Referring to Fig. 2', a schematic diagram of a die pad manufactured by the method for manufacturing an SMD two-color lead frame of a light-emitting diode according to the present invention is shown. In the figure, the outer casing (250) completely encloses the base (230) therein. The invention relates to a method for manufacturing an SMD two-color lead frame of a light-emitting diode, which can also be applied to lead frame manufacturing of other solid-state light-emitting elements, such as OLED (Organic Light Emitting Diode) lead frame manufacturing, EL (Electro Luminescence) lead frame manufacturing. . Therefore, the method for manufacturing the SMD two-color lead frame of the light-emitting diode of the present invention can avoid that the lead frame manufactured by the conventional process technology needs to be additionally bonded to the light-emitting diode to be sealed on the lead frame, and the die holder must be The white surface is treated with black in various techniques to avoid the inconvenience of black. It can also avoid the lead frame manufactured by the conventional process technology. The heat generated by the LED in the long-term use causes the black paint to produce spots 201203629. Phenomenon, the brightness of the light-emitting diode and the uneven scattering of the light source, etc., are not good. The above specific examples are merely illustrative of the invention and are not intended to be limiting, and the specific embodiments should not be construed as Any specific order between steps. Any equivalent modifications or alterations to the spirit and scope of the invention are intended to be included in the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a flow chart showing a preferred embodiment of a method for fabricating an SMD two-color lead frame of a light-emitting diode according to the present invention. 2 is a schematic view of a die pad manufactured by a method for manufacturing an SMD two-color lead frame of a light-emitting diode according to the present invention. [Main component symbol description] 2 Wire area 20 Die holder 210 Pin 230 Base 250 External housing S11~S17 Manufacturing method steps