201201643 六 [0001] [0002] [0003] 發明說明： 【發明所屬之技術領域】 本發明涉及電路板技術領域，尤其涉及一種於電路板 作過程中便能完成識別碼製作之電路板製作方法。 【先前技術·】 隨著科學技術進步’印刷電路板於電子領域得到廣泛廣 用。關於電路板之應用請參見文獻Takahashi，a.[0001] [0001] [0002] [0002] [0002] [Technical Field] The present invention relates to the field of circuit board technology, and more particularly to a circuit board manufacturing method capable of completing identification code creation in a circuit board process. [Prior Art·] With the advancement of science and technology, printed circuit boards have been widely used in the field of electronics. For the application of the circuit board, please refer to the literature Takahashi, a.
Ooki, N. Nagai, A. Akahoshi, H. Mukoh, a Wajima， M. Res. Lab, High density multiiayer printed circuit board for HITAC M-880 > IEEE Trans, on Components, Packaging, and Manufacturing Technology， 1992， 15(4): 418-425 。 於電路板實際生產過程中，每個生產工站中有大量之電 路板半成品流入流出，難以記錄每個製作完成之電路板 產品於每個工站進行處理之時間區間。當於進行檢測過 程中發現電路板產品之某一工站之處理出現問題時，由 於其於對應工站處理之時間難以追蹤，從而不易尋找於 處理该問題產品時該工站之生產狀況，亦難以尋找與問 題產品同時進行處理其他產品之流向。這樣，電路板產 品之品質難以進行追蹤。如採用人工進行清點並進行記 錄之方式進行追蹤，需要耗費大量時間，造k人力成本 之浪費。但如果於電路板生產過程中於電路板之每一層 形成不同之識別碼，再藉由侍服器讀取不同之識別碼， 即可對電路板生產流程中之每—步驟進行管控。為防止 於電路板製作過程中對識別碼之磨損形成之識別碼一 099121375 表單編號A0101 第4頁/共27頁 0992037667-0 201201643 :為::結構。先前技街，識別瑪通常採用雷射燒 成，但係，雷射植紅 呢蚀礼> 生產成本。而採用㈣+，，、 ^電路板之 時採用之底片$式形成識別碼由於受到曝光 同，從而採用叙限制’對於相同之底片產生之識別碼相 從而知用麵刻之方 同識別碼之製作。 用於相问導電線路與不 [0004]Ooki, N. Nagai, A. Akahoshi, H. Mukoh, a Wajima, M. Res. Lab, High density multiiayer printed circuit board for HITAC M-880 > IEEE Trans, on Components, Packaging, and Manufacturing Technology, 1992, 15(4): 418-425. In the actual production process of the circuit board, a large number of circuit board semi-finished products flow into and out of each production station, and it is difficult to record the time interval in which each completed circuit board product is processed at each station. When it is found that there is a problem in the processing of a certain station of the circuit board product during the detection process, it is difficult to trace the time of processing at the corresponding station, so that it is difficult to find the production status of the station when processing the problem product. It is difficult to find the flow of other products at the same time as the problem product. In this way, the quality of the board product is difficult to track. If you use manual methods for inventory and record, it takes a lot of time and wastes labor costs. However, if different identification codes are formed on each layer of the board during the board production process, and the server can read different identification codes, each step in the board production process can be controlled. The identification code formed to prevent the wear of the identification code during the board manufacturing process is 099121375 Form No. A0101 Page 4 of 27 0992037667-0 201201643 :: Structure. In the previous technology street, the identification horse was usually fired by a laser, but the system was laser-etched and etched. When the (4)+,,,^ circuit board is used, the film formation identification code is formed by the same exposure, so that the identification code generated for the same negative film is used to know the same identification code. Production. Used for interrogating conductive lines and not [0004]
【發明内容】 有鐘於此，提供 識別碼之具有識 一種能夠枝於電路㈣作難中形成 別碼之電路板之製作方法實屬必要。 [0005] [0006]SUMMARY OF THE INVENTION There is a clock to provide identification code. It is necessary to create a circuit board capable of forming a different code in the circuit (4). [0006] [0006]
以下將以實施例說明—種具有識別碼之電路板之製 法。 一種電路«作方法，包括步驟：提供電路基板，其具 有產品區域與識別碼區域，所述電路基板包括第-銅落 層；於所述第—鋼㈣表面形成第-光致抗關層；於 與識別碼區域相對應第—光致抗㈣層表面形成第一識 別碼圖形，所述第一識别碼圖形用於阻擋光照射至第一 識別碼圖形覆蓋之部分第一光致抗姓劑層；提供一第— 底片’所述第一底片具有與產品區域相對應之之第一透 光區域及與條碼區域相對應之第二透光區域，第一透光 區域之形狀與第一銅羯層欲形成之導電線路圖形之形狀 相對應；將第一底片放置於光源與第一光致抗蝕劑層之 間，使得第一透光區域與產品區域相對應，第二透光區 域與條瑪區域相對應，並對第一光致抗钱劑層進行曝光 :對曝光後之第一光致抗蝕劑層進行顯影，從而得到與 欲形成之導電線路圖形與第一識別碼圖形相對應之第一 099121375 表單編號A0101 第5頁/共27頁 0992037667-0 201201643 剩餘光致抗_層；及對第—㈣層進行_，從而得 到第一導電線路圖形與第一識別碼。 闺才目車又於先别技術，本技術方案提供之具有識別碼之電路 板之II作H先於光致抗#劑層表面形成由不透光材 料形成識別碼圖形，於進行曝光過程中，對製作相同線 路圖形之電路基板可採用相同之底片進行曝光，只需於 底片與形成識別碼相對應之位置形成透光區域。從而， 對於不同之電路基板可形成相同之導電線路圖形與不同 之第一識別碼’可方便地對電路板資訊進行讀取，從而 方便地對電路板之品質進行管控。 【實施方式】 [0008] 下面結合複數附圖及實施例對本技術方案提供之具有識 別碼之電路板之製作方法作進一步說明。 [0009] 本技術方案實施例提供一種具有識別碼之電路板之製作 方法，所述具有識別碼之電路板之製作方法包括如下步 驟： [〇〇1〇] 請參閱圖1，第一步，提供電路基板11 〇，電路基板丨丨〇具 有產品區域111及環繞產°〇區域111之非產品區域112。 [0011] 電路基板110為用於製作電路板之覆鋼板。本實施例中， 電路基板110為雙面覆銅板，其包括第一銅箔層113、第 二銅箔層114及夾於第一銅箔層U3與第二銅箔層114之 間之絕緣層115。當然，電路基板110亦可由單層銅箱層 之單面覆銅板。 [0012] 產品區域111用於形成電路板產品，非產品區域112環繞 099121375 表單編號A0101 第6頁/共27頁 0992037667-0 201201643 產品區域111。本實施例中，產品區域lu大致為長方形 〇產。口區域112内包括識別碼區域119，識別碼區域 Μ大致為長方形。㈣電路板製作之需要，於電路板產 品之表面需要形成識別碼，識別碼區域U9亦可設置於產 品區域⑴内。狀欲製作相同之導電線路即用於製作相 同導電線路圖形之複數電路基板11Q，識㈣區域ιΐ9於 電路基板110内設置相對位置應該相同。 [0013] Ο [0014] 第二步’請參閱圖2’於第—㈣層113之表面形成第一 光致抗蚀騎m，於第二銅制114之表面形成第二光 致抗姓劑層122。 ❹ :形成第-光致抗_層121與第二光·㈣層122之 J還可於電路基板110之產品區域111内形成貫穿電路 基板之通孔’並於通孔㈣形成金屬錢層以將第一銅箱 層113與第一銅箱114相互導通。可採用機械鐵孔或者 雷射成孔之方式於電路純UQ_成―顧者複數通孔 。通孔開設之位置可根據後續形成之導電線路需要導通 之區域相對應。於形成通孔之後，可藉由電鍵銅或者化 學鑛銅之方式，於通狀㈣形成金屬制。金屬鑛層 覆蓋每個通孔之整個内壁，並與第一鋼羯層1丨3與第二銅 箔層114均相連通。 [0015] 第一光致抗蝕劑層121與第二光致抗蝕劑層122可藉由壓 合幹膜形成，亦可藉由印刷液態感光油墨形成。第一光 致抗餘劑層121與第二光致抗姓劑層122之成分包括感光 劑（Sensitizer)、樹脂（Resin)及溶劑（s〇lvent )等。第一光致抗蝕劑層121與第二光致抗蝕劑層122可 099121375 表單編號Α010Ϊ 第7頁/共27頁 0992037667-0 201201643 為正型光致抗蝕劑材料，其亦可為負 。本實施例中，以第—光致抗_層121:= 劑材料 劑層122為正型光致抗敍劑材料來進行 、’致抗飯 抗钱劑層121與第二光致抗蚀劑層⑵與。即第—光致 分可與顯影液反應而從第一銅箔層113或a用之部 表面去除，所述照射光可為紫外5 —銅泊層114 線。 尤等具有較高能量之光 [0016] 第 步，凊參閲圖3，於識別碼區域丨19 [0017] 099121375 B 1 1 〇 * 對應之第一銅箔 表面之第一光致抗賴層121上形成由阻光材料形 成之第一識別碼圖形13〇 〇 採用噴碼袭置於第-銅羯層1131?1 . 卸之第—先致抗蝕劑層^上形成第一識別碼圖形13〇。第—識別瑪圖形_ _阻擋光照射至其遮蓋部分第_㈣層ιΐ3表面之第一 =致抗_層121之阻光材料製成。具體地第―識別碼 之材料可為抗照射光之油墨。並且，採用之喷碼 二選採用電腦控制之噴碼裝置，從而可藉由電腦控 =㈣心不同之第—識__13() ’以賴形成之 I别碼包含之内容各不相同。第1別碼圖形13〇大致為 方形區域’本實施财，第—則碼圖形i3Q為條碼， =包括多條相互設置粗細不等之條狀線構成之條紋與複 /立於條紋—侧之數位。當然1—識別碼圖形13〇亦可 :置為其他形式’如二維碼等。第—識別碼圖形13〇亦可 斑^述之多條相互設置粗細不等之條狀線構成之條紋^數位於錢―侧之數位互補之圖形形成，即第一識 "圖3G中間之空隙構成多條相互設置粗細不等之條 表單蝙號A_ m R f/4i ,7 ^ 第8買/共27頁 0992037667-0 201201643 [0018] [0019] [0020] Ο [0021] 狀線構成之條紋與複數位於條紋一侧之數位圖形。 十於欲製作相同之導電線路圖形之電路基板，第一識別 馬圖形13〇於第一光致抗蝕劑層121形成之位置應相同， U便製作相同之導電線路圖形之電路基板採用相同之底 片進行曝光。 第四步，請參閱圖4 ,提供第一底片140與第二底片150。 所述第一底片140具有第一透光區域141與第二透光區域 142，第一透光區域141與第二透先區域142分別與產品 區域111與識別碼區域u9相互對應、第一透光區域i4工 與第一銅箔層11 3欲形成之導電線路圖形之形狀互補，即 第底片140與產品區域Hi相對應之部分除與欲形成導 電線路圖形相同之部分為不透光區域外，其他區域均為 第一透光區域141。與第二透光區域142之形狀與大小與 識別瑪區域119相對應，以使得光線可照射至識別碼區域 119對應之第-光致抗餘劑層121表面及第一識別形 130。本實施例中’第二透光區域142之形狀大致亦為長 方形。第二透光區域142之形狀不限於本實施例中提供之 長方形，亦可為將第一底片140與非產品區域112之形狀 相對應之部分均設置為可透光之第二透光區域142。 所述第二底片150與產品區域lu相對應區域具有第三透 光區域15卜第三透光區域151與第二銅箱層ιΐ4欲形成 之導電線路圖形相互補，即第二底片15〇與產品區域m 相對應之區域除與欲形成之導電線路圖形相同之部分之 外’其他部分為透光區域。本實施例中，第二底片⑸與 099121375 表單編號A0101 第9頁/共27頁 0992037667-0 201201643 非產品區域112對應之區域均為不透光區域。當然，第二 底片150與非產品區域11 2對應之區域亦可為透光區域。 第二光致抗蝕劑層122與第三透光區域151對應部分之材 料發生化學反應。 [0022] 本實施例中，第一透光區域141與第二透光區域142為於 第一底片140中開設之通孔，第三透光區域151為於第二 底片150開設之通孔。第一透光區域141、第二透光區域 142及第三透光區域151亦可採用具有良好透光性能之材 料製成。 [0023] 當第一光致抗蝕劑層121與第二光致抗蝕劑層122採用負 型光致抗蝕劑材料時，第一透光區域141與第三透光區域 151之形狀應與對應要形成之導電線路圖形之形狀相同， 而第二透光區域142之形狀不必進行改變。 [0024] 第五步，採用第一底片140對第一光致抗蝕劑層121進行 曝光，採用第二底片150對第二光致抗蝕劑層122進行曝 光。 [0025] 將第一底片140放置於光源與第一光致抗蝕劑層1 21之間 。第一光致抗蝕劑層121上之第一識別碼圖形130與第二 透光區域142相對應，第一銅箔層113之產品區域111與 第一透光區域141相互對應。從而於對第一光致抗蝕劑層 121進行曝光時，與第一透光區域141相對應區域之第一 光致抗蝕劑層121之材料於照射光之照射下發生化學反應 ，與與第二透光區域142對應之第一光致抗蝕劑層121之 表面與第一識別碼圖形130之表面，第一識別碼圖形130 099121375 表單編號A0101 第10頁/共27頁 0992037667-0 201201643 [0026] Ο [0027] ❹ [0028] 採用不透光材料製成，從而使得與第二透光區域142對應 之且不被第一識別碼圖形130遮蓋之第一光致抗蝕劑層 121處之材料發生化學反應。而不與第一透光區域141與 第二透光區域142相對應之部分照射光不能照射至第一光 致抗蝕劑層121，該部分之第一光致抗蝕劑層121之材料 不發生化學反應。 將第二底片150放置於光源與第二光致抗蝕劑層122之間 。第二銅箔層114之產品區域111與第三透光區域151相 互對應。從而於對第二光致抗蝕劑層122進行曝光時，與 第三透光區域151相對應區域之第二光致抗蝕劑層122之 材料於光源之照射下發生化學反應。而不與第三透光區 域151相對應之部分光不能照射至第二光致抗蝕劑層122 ，該部分之第二光致抗蝕劑層122之材料不發生化學反應 〇 第六步，請一併參閱圖5與圖6，對曝光後之第一光致抗 蝕劑層121與第二光致抗蝕劑層122進行顯影。 本實施例中，由於採用之第一光致抗蝕劑層121與第二光 致抗蝕劑層122為正型光致抗蝕劑。對曝光後之第一光致 抗蝕劑層121與第二光致抗蝕劑層122進行顯影時，被照 射光照射之部分與顯影液發生反應後從第一銅箔層113與 第二銅箔層114之表面脫離，從而於第一銅箔層113之表 面形成與第一銅箔層113欲製作之導電線路圖形與欲形成 之第一識別碼相對應之第一剩餘光致抗蝕劑層123，第二 銅箔層114之表面形成與第二銅箔層114欲製作之導電線 路圖形相對應之第二剩餘光致抗蝕劑層124。 099121375 表單編號Α0101 第11頁/共27頁 0992037667-0 201201643 [0029] [0030] [0031] [0032] [0033] 099121375 第七步，請參閱圖7,對第-鋼羯層113進行餘刻從 到於產品區域1U形成第-導電線路圖形ii6與第 瑪m ’對第二銅箱層114進行触刻從而得到第二導電線 路圖形118，從而得到電路板1 〇〇。 、'、 由於第一銅馆層m表面覆蓋有第—剩餘光致抗姓劑芦 123 ’第一細層113被第一剩餘光致抗蚀劑層12⑼蓋 之部分不與關液進行反應，而從第—剩餘光致抗姓劑 層123露出之第一銅猪層113之銅被钱刻去除，從而第— 銅猪層113經钱刻後形成第一導電線路圖形ιΐ6與第―〜 別碼m。其中’第一導電線路圖形116輿產品區域^ 相對應，第-識別碼117形成於非產品區域112。同樣之 方法，將第二銅箱層114钱刻形成第二導電線路圖形= 〇 於得到第-導電線路圖形U6、第一識別碼m與第 電線路圖形118之後，請參閲圖8，可將第一剩 _層123與第二剩餘光致抗钕劑層·去除。从 :施光致抗_層一 -識別形13°之圖咖^ 當然，於第致Γ於絕緣層115銅形成之條 糊二:：_層121表面形成之第-識別碼圖 敍刻對應之第補之圖形’第一識別碼117為由 碼圖形。…，自層113後露出之絕緣層115形成之條 另外，當第—光致抗_層121採用負型光致抗韻劑材料 表單編號A0101 第12頁/共27頁 0992037667-0 201201643 [0034]Hereinafter, a method of a circuit board having an identification code will be described by way of an embodiment. A circuit as a method comprising the steps of: providing a circuit substrate having a product area and an identification code area, the circuit substrate comprising a first-copper falling layer; forming a first photo-resistance layer on the surface of the first steel (four); Forming a first identification code pattern on a surface of the first photo-resistance (four) layer corresponding to the identification code area, wherein the first identification code pattern is used to block light from being irradiated to a portion of the first photo-resistance agent covered by the first identification code pattern a first film having a first light-transmissive region corresponding to the product region and a second light-transmissive region corresponding to the bar code region, the shape of the first light-transmissive region and the first copper Corresponding to the shape of the conductive line pattern to be formed; placing the first film between the light source and the first photoresist layer such that the first light-transmissive region corresponds to the product region, and the second light-transmitting region Corresponding to the strip area, and exposing the first photo-anti-money agent layer: developing the exposed first photoresist layer to obtain the conductive line pattern to be formed and the first identification code pattern Corresponding Form Number A0101 099 121 375 Page 5/27 0992037667-0 Total 201 201 643 _-resist layer remaining light; -㈣ layer and the first _ to obtain a first wiring pattern and the first identification code. The 目 目 目 又 又 又 又 又 目 目 目 目 目 目 目 目 目 目 目 目 目 目 目 目 目 目 目 目 目 目 目 目 目 目 目 目 目 目 目 目 目 目 目 目 目 目 目 目 目For the circuit substrate on which the same line pattern is formed, the same film can be used for exposure, and the light-transmissive region is formed only at a position corresponding to the film forming the identification code. Therefore, the same conductive pattern and different first identification codes can be formed for different circuit substrates to conveniently read the board information, thereby conveniently controlling the quality of the board. [Embodiment] The method for fabricating a circuit board having an identification code provided by the present technical solution will be further described below with reference to the accompanying drawings and embodiments. [0009] Embodiments of the present disclosure provide a method for fabricating a circuit board having an identification code, and the method for manufacturing the circuit board having the identification code includes the following steps: [〇〇1〇] Please refer to FIG. 1, the first step, A circuit substrate 11 is provided which has a product area 111 and a non-product area 112 surrounding the production area 111. [0011] The circuit board 110 is a coated steel sheet for manufacturing a circuit board. In this embodiment, the circuit substrate 110 is a double-sided copper clad plate, and includes a first copper foil layer 113, a second copper foil layer 114, and an insulating layer sandwiched between the first copper foil layer U3 and the second copper foil layer 114. 115. Of course, the circuit substrate 110 can also be a single-sided copper clad laminate of a single-layer copper box layer. [0012] The product area 111 is used to form a circuit board product, and the non-product area 112 is surrounded by 099121375 Form No. A0101 Page 6 of 27 0992037667-0 201201643 Product area 111. In this embodiment, the product area lu is substantially rectangular. The port area 112 includes an identification code area 119, and the identification code area Μ is substantially rectangular. (4) For the production of the circuit board, an identification code needs to be formed on the surface of the circuit board product, and the identification code area U9 may also be disposed in the product area (1). It is intended to make the same conductive line, that is, a plurality of circuit boards 11Q for making the same conductive line pattern, and the relative position of the (4) area ι 9 in the circuit board 110 should be the same. [0013] 第二 [0014] The second step 'please refer to FIG. 2' to form a first photoresist ride m on the surface of the first (four) layer 113, and to form a second photo-resistance surname on the surface of the second copper 114 Layer 122. ❹ : forming the first photo-resistance layer 121 and the second photo-(four) layer 122 may also form a via hole through the circuit substrate in the product region 111 of the circuit substrate 110 and form a metal layer in the via hole (4). The first copper box layer 113 and the first copper box 114 are electrically connected to each other. The mechanical iron hole or the laser hole can be used to make the circuit pure UQ_ into a plurality of through holes. The location at which the via is opened may correspond to the area in which the subsequently formed conductive traces need to be turned on. After the via holes are formed, the metal can be formed in the through-shape (4) by means of a copper bond or a chemical copper. The metal ore layer covers the entire inner wall of each of the through holes and is in communication with both the first reed layer 1丨3 and the second copper foil layer 114. [0015] The first photoresist layer 121 and the second photoresist layer 122 may be formed by pressing a dry film or by printing a liquid photosensitive ink. The components of the first photo-resistance layer 121 and the second photo-resistance layer 122 include a sensitizer, a resin (Resin), a solvent, and the like. The first photoresist layer 121 and the second photoresist layer 122 may be 099121375 Form No. Α 010 Ϊ Page 7 / Total 27 Page 0992037667-0 201201643 is a positive photoresist material, which may also be negative . In this embodiment, the first photo-resistance layer 121:= the agent material layer 122 is used as a positive photo-resistance material, and the anti-rice agent layer 121 and the second photoresist are used. Layer (2) with. That is, the first photo-reactive component can be removed from the surface of the first copper foil layer 113 or a by reacting with the developing solution, and the irradiation light can be an ultraviolet 5-copper layer 114 line. Especially for light with higher energy [0016] In the first step, referring to FIG. 3, the first photo-resisting layer on the surface of the first copper foil corresponding to the identification code region 丨19 [0017] 099121375 B 1 1 〇* A first identification code pattern 13 formed of a light-blocking material is formed on the 121, and is sprayed onto the first-copper layer 1131?1. The first-first resist layer is formed on the first resist pattern to form a first identification code pattern. 13〇. The first-identification pattern _ _ blocks the light to be irradiated to the surface of the _(four) layer ι 3 of the cover portion thereof. Specifically, the material of the first identification code may be an ink resistant to illumination. Moreover, the code selection device adopts a computer-controlled coding device, so that the contents of the I-code formed by the computer-controlled = (four) heart-related __13() ′ are different. The first code pattern 13 is roughly a square area. In the present embodiment, the code pattern i3Q is a bar code, and includes a plurality of stripes formed by mutually arranging strip lines having different thicknesses and a plurality of stripes. digit. Of course, the ID code pattern 13 can also be set to other forms such as a two-dimensional code. The first-identification code pattern 13 can also be formed by a plurality of strip lines which are arranged in mutually different thicknesses and are formed by a pattern of complementary digits of the money side, that is, the first knowledge " The gap constitutes a plurality of strips of mutually different thicknesses. The form bat number A_ m R f/4i , 7 ^ 8th buy / total 27 pages 0992037667-0 201201643 [0018] [0020] 00 [0021] The stripe and the complex number are on the side of the stripe. For the circuit substrate on which the same conductive line pattern is to be formed, the first identification horse pattern 13 should be formed at the same position as the first photoresist layer 121, and the circuit board on which the same conductive line pattern is formed is the same. The film is exposed. In the fourth step, referring to FIG. 4, a first negative film 140 and a second negative film 150 are provided. The first negative film 140 has a first light-transmissive region 141 and a second light-transmissive region 142. The first light-transmissive region 141 and the second transparent region 142 respectively correspond to the product region 111 and the identification code region u9. The light region i4 is complementary to the shape of the conductive line pattern to be formed by the first copper foil layer 113, that is, the portion of the first film 140 corresponding to the product region Hi is the same as the portion of the conductive line pattern to be formed. The other areas are the first light transmitting areas 141. The shape and size of the second light-transmissive region 142 correspond to the identification region 119, so that the light can be incident on the surface of the first photo-resistance layer 121 corresponding to the identification code region 119 and the first identification shape 130. The shape of the second light transmitting region 142 in this embodiment is also substantially rectangular. The shape of the second light-transmissive region 142 is not limited to the rectangular shape provided in the embodiment, and the portion corresponding to the shape of the first negative film 140 and the non-product region 112 may be disposed as the second light-transmitting region 142 that can transmit light. . The second negative film 150 has a third light-transmissive region 15 corresponding to the product region lu. The third light-transmitting region 151 is complementary to the conductive circuit pattern to be formed by the second copper box layer ι 4, that is, the second negative film 15 The area corresponding to the m area of the product area is the same as the part of the conductive line pattern to be formed. In this embodiment, the second negative film (5) and the 099121375 form number A0101 page 9/27 pages 0992037667-0 201201643 the areas corresponding to the non-product areas 112 are all opaque areas. Of course, the area corresponding to the non-product area 11 2 of the second negative film 150 may also be a light-transmitting area. The second photoresist layer 122 chemically reacts with the material of the corresponding portion of the third light-transmitting region 151. In the embodiment, the first light-transmissive region 141 and the second light-transmissive region 142 are through holes formed in the first film 140, and the third light-transmissive region 151 is a through hole formed in the second film 150. The first light-transmitting region 141, the second light-transmitting region 142, and the third light-transmitting region 151 may also be made of a material having good light-transmitting properties. [0023] When the first photoresist layer 121 and the second photoresist layer 122 are made of a negative photoresist material, the shapes of the first light transmissive region 141 and the third light transmissive region 151 should be The shape is the same as the shape of the conductive trace pattern to be formed, and the shape of the second light-transmitting region 142 does not have to be changed. [0024] In the fifth step, the first photoresist layer 121 is exposed by the first negative film 140, and the second photoresist layer 122 is exposed by the second negative film 150. [0025] The first backsheet 140 is placed between the light source and the first photoresist layer 1 21 . The first identification code pattern 130 on the first photoresist layer 121 corresponds to the second light transmissive region 142, and the product region 111 of the first copper foil layer 113 and the first light transmissive region 141 correspond to each other. Therefore, when the first photoresist layer 121 is exposed, the material of the first photoresist layer 121 corresponding to the first light-transmitting region 141 is chemically reacted under the irradiation of the irradiation light, and The second light-transmissive region 142 corresponds to the surface of the first photoresist layer 121 and the surface of the first identification code pattern 130. The first identification code pattern 130 099121375 Form No. A0101 Page 10 / Total 27 Page 0992037667-0 201201643 [0027] 第一 [0028] The first photoresist layer 121 is made of an opaque material so as to be corresponding to the second light-transmissive region 142 and not covered by the first identification code pattern 130. The material at the site undergoes a chemical reaction. The portion of the illuminating light that does not correspond to the first light-transmitting region 141 and the second light-transmitting region 142 cannot be irradiated to the first photoresist layer 121, and the material of the portion of the first photoresist layer 121 is not A chemical reaction occurred. A second backsheet 150 is placed between the light source and the second photoresist layer 122. The product region 111 of the second copper foil layer 114 and the third light transmitting region 151 correspond to each other. Therefore, when the second photoresist layer 122 is exposed, the material of the second photoresist layer 122 in the region corresponding to the third light-transmitting region 151 is chemically reacted under the illumination of the light source. A portion of the light that does not correspond to the third light-transmitting region 151 cannot be irradiated to the second photoresist layer 122, and the material of the portion of the second photoresist layer 122 does not undergo a chemical reaction. Referring to FIG. 5 and FIG. 6, the exposed first photoresist layer 121 and the second photoresist layer 122 are developed. In this embodiment, the first photoresist layer 121 and the second photoresist layer 122 are positive photoresists. When the exposed first photoresist layer 121 and the second photoresist layer 122 are developed, the portion irradiated with the light is reacted with the developer from the first copper foil layer 113 and the second copper. The surface of the foil layer 114 is detached, so that a first residual photoresist corresponding to the first identification code to be formed is formed on the surface of the first copper foil layer 113 and the conductive line pattern to be formed by the first copper foil layer 113. The layer 123, the surface of the second copper foil layer 114 forms a second residual photoresist layer 124 corresponding to the conductive trace pattern to be fabricated by the second copper foil layer 114. 099121375 Form No. 101 0101 Page 11 / Total 27 Page 0992037667-0 201201643 [0029] [0031] [0033] [993] 099121375 The seventh step, please refer to FIG. 7, for the left-steel layer 113 The second conductive wiring pattern 114 is obtained by forming the first conductive wiring pattern ii6 and the first metal wiring layer 114 from the product region 1U to obtain the second conductive wiring pattern 118, thereby obtaining the circuit board 1 〇〇. , 'Because the surface of the first copper pavilion m is covered with the first residual photo-resistance agent 123', the portion of the first fine layer 113 covered by the first residual photoresist layer 12(9) does not react with the shut-off liquid, The copper of the first copper pig layer 113 exposed from the first remaining photoresist layer 123 is removed by the money, so that the first copper layer 113 is formed by the first conductive line pattern ιΐ6 and the first ~~ Code m. Wherein the first conductive line pattern 116 corresponds to the product area, and the first identification code 117 is formed in the non-product area 112. In the same manner, after the second copper box layer 114 is formed into a second conductive line pattern = after obtaining the first conductive line pattern U6, the first identification code m and the first electric line pattern 118, please refer to FIG. The first remaining layer 123 and the second remaining photodamping agent layer are removed. From: application of light-induced resistance _ layer one-recognition shape 13 ° figure ^ Of course, the first layer of the paste formed by the copper layer of the first layer of the insulating layer 115:: _ layer 121 surface formation - identification code map corresponding The first complement pattern 'the first identification code 117 is a code pattern. ..., the strip formed by the insulating layer 115 exposed from the layer 113. In addition, when the photo-resistance layer 121 is made of a negative photo-resistance material No. A0101 Page 12 of 27 pages 0992037667-0 201201643 [0034 ]
[0035] ❹ [0036] 099121375 時，第-識別碼圖形13〇之圖形為條碼時，形成之第一識 別碼117為由蝕刻對應之第-_層113後露出之絕緣層 115形成之第一識別碼117。當第一光致抗蚀劑層121採 用負型光致抗飯劑材料時，第一識別碼圖形13〇之圖形為 條碼圖形互補之圖形時，形成之第—識別碼ιΐ7為由飯刻 對應之第-銅箱層113後由第一銅羯層113之銅構成之條 碼圖形。 第—識別碼117形成之位置亦不限於本實施例中提供之非 產品區域，當第一識別瑪117之尺寸較小，並且產品區域 m内具有形成第一識別疼117之不具有導電線路之空白 區域時，第一識別碼117亦可形成於產品區域11工。 本技術方案提供之電路板製作方法，還可製作多層電路 板即於第導電線路圖形116之表面依次形成第一勝層 與第三銅箔層，然後採用與製作第一導電線路圖形116與 第一識別碼相同之方法，於第三銅箔層内製作第三導電 線路圖开>與第一識別碼。藉由對形成之第一識別碼11 7與 第二識別碼進行讀取1從而將電路板10 0之製作過程之資 訊存儲至管理伺服器中，從而可方便對電路板1〇〇資訊進 行管控。 本技術方案提供之電路板製作方法，先於光致抗蝕劑層 表面形成由不透光材料形成識別碼之圖形，於進行曝光 之過程中，對於製作相同線路圖形之電路基板可採用相 同之底片進行曝光，只需於底片與形成識別碼相對應之 位置形成透光區域，從而，對於不同之電路基板可形成 相同之導電線路圖形與不同之第一識別碼，可方便地對 表單编號顯！ 第頁/共27頁 0992〇3 201201643 電路板資訊進行讀取 管控。 從而方便地對電路板之品質進行 [0037] [0038] [0039] [0040] [0041] [0042] [0043] [0044] [0045] 099121375 綜上所述’本發明確已符合發料利之要件，遂依法提 出專射請。惟，以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之中請專利範圍。舉凡熟悉本 案技藝之人士援依本發明之精神所作之等效修飾或變化 ’皆應涵蓋於以下申請專利範圍内。 圖式簡單說明] 圖1係本技術方案實施例提供之電路基板示意圖。 圖2係本技㈣提供之於電路基板_對表面八 別形成第-光致抗_層與第二級抗_層後之示刀 意 圖3係本技術㈣實施難供於第—紐㈣劑層 第一識別碼圖形後之示意圖。 /成 圖4係本技術方案實施例提供之採用第—底片與第 =一光致抗_層與第等致袖劑層進行曝光之示 圖5係圖3沿線V-ν之剖視圖。 圖6係本技術方案實施例提供之第—紐抗糊層與第 光致抗蝕劑層顯影後之剖面示意圖。 、 圖7係本技術方案實_提供之對第—㈣層與第 層進行姓刻後之示意圖。 圖8係本技術方案 表單編號A0] 〇1 實施例提供之製作得到之電路板之示音 第14頁/共27頁 0992037667-0 201201643[0035] When the pattern of the first identification code pattern 13 is a barcode, the first identification code 117 is formed as the first layer formed by the insulating layer 115 exposed after etching the corresponding _th layer 113. Identification code 117. When the first photoresist layer 121 is a negative photo-resistance material, when the pattern of the first identification code pattern 13 is a pattern complementary to the barcode pattern, the first identification code ι7 is formed by the meal The first copper-clad layer 113 is followed by a bar code pattern of copper of the first copper layer 113. The position at which the first identification code 117 is formed is also not limited to the non-product area provided in the embodiment, when the size of the first identification horse 117 is small, and the product area m has the first identification pain 117 without the conductive line. In the blank area, the first identification code 117 may also be formed in the product area 11 . According to the circuit board manufacturing method provided by the technical solution, the first circuit layer and the third copper foil layer are sequentially formed on the surface of the first conductive line pattern 116, and then the first conductive line pattern 116 and the first conductive line pattern are formed. In the same method as the identification code, a third conductive circuit pattern is formed in the third copper foil layer and the first identification code is used. The information of the manufacturing process of the circuit board 10 is stored in the management server by reading the formed first identification code 117 and the second identification code, thereby facilitating control of the board information. . The circuit board manufacturing method provided by the technical solution forms a pattern in which an identification code is formed by an opaque material before the surface of the photoresist layer, and in the process of performing exposure, the same circuit board can be used for the same circuit pattern. The film is exposed, and the light-transmissive area is formed only at a position corresponding to the film forming the identification code, so that the same conductive line pattern and the different first identification code can be formed for different circuit substrates, and the form number can be conveniently Show! Page / Total 27 pages 0992〇3 201201643 Circuit board information for reading and control. Therefore, the quality of the circuit board is conveniently performed [0037] [0040] [0044] [0044] [0044] [0045] [9945] In summary, the present invention has indeed met the requirements of the issue. The essentials, please put forward a special shot according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application in this case. Equivalent modifications or variations made by persons skilled in the art in light of the present invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram of a circuit substrate provided by an embodiment of the present technical solution. FIG. 2 is a schematic diagram of the present invention in which the present invention (4) is provided on the circuit substrate _ the surface is formed with the first photo-resistance layer and the second-level anti-layer layer. A schematic diagram of the layer after the first identification code pattern. FIG. 4 is a cross-sectional view taken along line V-ν of FIG. 3, which is provided by the embodiment of the present invention, using the first film and the first photo-resistance layer and the second armor layer. Fig. 6 is a schematic cross-sectional view showing the development of the first anti-stick layer and the photoresist layer provided in the embodiment of the present invention. Figure 7 is a schematic diagram of the first and second layers of the present technical solution provided after the last name. Figure 8 is a technical solution of the present invention. Form No. A0] 〇1 The sound of the circuit board produced by the embodiment is shown. Page 14 of 27 0992037667-0 201201643
[0046] 圖。 【主要元件符號說明】 電路板：100 [0047] 電路基板：110 [0048] 產品區域：111 [0049] 非產品區域：112 [0050] 第一銅箔層：113 [0051] 第二銅箔層：114 [0052] 絕緣層：115 [0053] 第一導電線路圖形：116 [0054] 第一識別碼：117 [0055] 第二導電線路圖形：118 [0056] 識別碼區域：119 [0057] 第一光致抗蝕劑層：121 [0058] 第二光致抗蝕劑層：122 [0059] 第一剩餘光致抗餘劑屠： 123 [0060] 第二剩餘光致抗蝕劑層： 124 [0061] 第一識別碼圖形：130 [0062] 第一底片：140 [0063] 第一透光區域：141 表單編號A0101 第15頁/共27頁 099121375 0992037667-0 201201643 [0064] 第二透光區域：142 [0065] 第二底片：150 [0066] 第三透光區域：1 5 1 099121375 表單編號A0101 第16頁/共27頁[0046] FIG. [Main component symbol description] Circuit board: 100 [0047] Circuit substrate: 110 [0048] Product area: 111 [0049] Non-product area: 112 [0050] First copper foil layer: 113 [0051] Second copper foil layer [1142] Insulation layer: 115 [0053] First conductive line pattern: 116 [0054] First identification code: 117 [0055] Second conductive line pattern: 118 [0056] Identification code area: 119 [0057] A photoresist layer: 121 [0058] Second photoresist layer: 122 [0059] First residual photo-resistance agent: 123 [0060] Second residual photoresist layer: 124 First identification code pattern: 130 [0062] First negative film: 140 [0063] First light transmissive area: 141 Form number A0101 Page 15 / Total 27 page 099121375 0992037667-0 201201643 [0064] Second light transmission Area: 142 [0065] Second negative: 150 [0066] Third transparent area: 1 5 1 099121375 Form number A0101 Page 16 of 27
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