201200965 六、發明說明： 【發明所屬之技術領域】 本發明係有關感光性樹脂組成物之組成，旨在 感光性樹脂組成物可應用於觸控面板或平面顯示器供 品中，以達到高透光率及高硬度之需求。 相關產 【先前技術】 觸控板（Touch Panel)通常被配置在手機、喷# 等電子產品的顯示幕前方使用，以便增進機具操接目機、 入的便利性；而在各式觸控板種類中，由於電容$及孰婕輪 有性能穩定、使用壽命長等優點，因此逐漸被廣杈戽 訊產品（Communication)、電腦產品（computer)以及=用在％ 子產品（Consumer)等方面；如所知者，習知電容消費|具踅 電容感測結構略係包括一 X轴感應層及一 γ軸感二啕％杈的 Υ轴感應層絕緣地設置該觸控板體之内，並將χ、^層，使χ、 分別接地並連接至-控制電路，運作時，藉細織巍層 或導體碰觸的瞬間產生一個電容效應，因而可者的手耜 變化確定手指或導體之位置；由於電容式觸控板 :輸入’具有輸入操作的便利性，而其輸入：〜 = 有承受反覆應力、變形導致損害的=過简 以產〇〇性能穩疋、使用壽命長。 、點，所 習有觸控面板係設有一透光基板， 電結構，以作為“感應層面: 為Υ軸感應層，而:= 二::列之下f月導電結構以代 透明導電結構並覆蓋有金屬結構，y 201200965 各金屬結構係裸露在外，容易形成氧化或被刮傷，使得電路 無法正常傳遞而形成短路，進而影響整觸控面板導通之結果。 故為了改善上述缺失，必須在基板表面設置硬化膜（Hard Coating)作為保護或絕緣，以改善透光基板的環境穩定性與 機械強度；而對當時在硬化膜的使用技術領域中上，可以作 為硬化膜的材料有很多種，包含類鑽碳膜（Diamond Like 〇n ’ DLC)、秒基化合物（siiicon-Based Compound)及金 屬氧化物等’·其中以二氧化料化膜，為具有較低的折射率 (約1.46)及較為優異的硬度，已廣泛地應用在各種以透光基 板為主的元件之光學鑛臈上。 對於目别製作二氧化々硬化膜的技術上，許多塑膠 、土，彳日β ϋ 達丨/儿積一氧化矽硬化膜的技術為主 :得浸漬法容易受到透光基板本身形狀的影響， 使仔一氧化矽硬化臈的均勻性 製程的良率，且透光基杯所二“降低^作相關疋件下游 量之㈣加以細 之特定溶液中需要藉由高含 量之☆劑加以稀釋’以便於 溶劑含量高導致固含量較低，木氓该特疋冷液t因 於該透光基板表面之-^二㊉成型溶劑揮發後’形成 低⑽為卿；然而，:===導致整體硬度較. 明顯的到痕等操作痕跡’抗到能力明顯不足錢用下容易出現 【發明内容】 a 有鑑於此，本發明旨在提供 面顯示器等相關產〜《連到高透二::::需，平 201200965 為達上述目的’本發明之感光性樹脂組成物，係含有樹 脂（Resin)、感光起始劑（Photo initiat〇r)、單體（M〇n_r)201200965 VI. Description of the Invention: [Technical Field] The present invention relates to a composition of a photosensitive resin composition, and is intended to be used in a touch panel or a flat display display to achieve high light transmittance. And the need for high hardness. Related Products [Previous Technology] Touch Panels are usually deployed in front of the display screens of electronic products such as mobile phones and sprayers to enhance the convenience of the machine and the convenience of entry. Among the types, due to the advantages of stable performance and long service life of the capacitors $ and the wheel, it has gradually been used in communications, computer products and = in the sub-products (Consumer); As is known, the conventional capacitive sensing structure has a x-axis sensing layer and a gamma-axis sensing layer disposed insulatively within the touch panel body, and The χ and 层 layers are grounded and connected to the - control circuit. During operation, a capacitive effect is generated by the moment when the fine woven layer or the conductor touches, so that the handcuff change determines the position of the finger or conductor. Because of the capacitive touch panel: input 'has the convenience of input operation, and its input: ~ = has the ability to withstand repeated stress, deformation and damage = over-simplification, stable performance, long service life. The point that the touch panel is equipped with a light-transmissive substrate, the electrical structure, serves as the "induction layer: the Υ-axis sensing layer, and:==2:: under the column, the ferroelectric structure is replaced by a transparent conductive structure. Covered with a metal structure, y 201200965 each metal structure is exposed, easy to form oxidation or scratch, so that the circuit can not be transmitted normally and form a short circuit, which affects the result of the entire touch panel conduction. Therefore, in order to improve the above defects, it must be on the substrate The surface is provided with a hard coating as a protection or insulation to improve the environmental stability and mechanical strength of the transparent substrate. However, there are many materials that can be used as a cured film in the technical field of use of the cured film at that time, including Diamond Like 〇n ' DLC, siiicon-Based Compound, metal oxide, etc. · Among them, the dioxide film has a lower refractive index (about 1.46) and Excellent hardness has been widely used in optical ore of various light-emitting substrate-based components. For the technical production of cerium oxide hardened film, many plastics , soil, the next day, β ϋ 丨 丨 / 积 一 矽 矽 矽 矽 的 的 : : : : : 儿 儿 儿 儿 儿 儿 儿 儿 儿 儿 儿 儿 得 得 得 得 得 得 得 得 得 得 得 得 得 得 得 得 得 得 得And the light-transparent base cup is “reduced by the amount of the downstream part of the relevant element (4) and the specific solution needs to be diluted by a high content of ☆ agent to facilitate the low solid content of the solvent content. The cold liquid t is formed by the evaporation of the solvent on the surface of the light-transmissive substrate. The formation of low (10) is clear; however, :=== results in an overall hardness comparison. Obvious traces to the traces, etc. In view of the above, the present invention is directed to providing a related product such as a surface display, etc. - "Connecting to a high transparent 2:::: need, flat 201200965 for the above purpose" Resin composition containing resin (Resin), photoinitiator (Photo initiat〇r), monomer (M〇n_r)
及溶劑(S〇lvent);其中’該樹脂至少包含有甲基丙_氧 丙醋及曱基丙_，該曱基丙稀酸環氧_在該樹脂中為5~ 4〇wt% ’該曱基丙稀酸在該樹脂中為15〜4()wt%，由該感光性樹 脂組成物^置於-透光基板表面，而形成具有保護絕緣作用 之面板結構，可應用於觸控面板或平面顯示器等相關產品 中，使波長範圍於380〜400nm之可見光其透光率可達到95%以 上’且硬度可達到5H之需求。 【實施方式】 為旎使貴審查委員清楚本發明之主要技術内容，以及 實施方式，茲配合圖式說明如下： 本發明之感光性樹脂組成物，係含有5〜3〇wt%之樹脂 Uesin)、1 〜2wt%之感光起始劑（Photo initiator)、5~15wt〇/〇 之單體（Monomer)及50〜80wt%之溶劑（Solvent);其中，該樹 •脂至少包含有曱基丙烯酸環氧丙酯、曱基丙烯酸，該甲基丙 烯酸環氧丙酯在該樹脂中為5〜40wt%(而以15〜35 wt %為最 佳）’該甲基丙稀酸在該樹脂中為15〜40wt%(而以20〜35wt% 為最佳）’且該感光性樹脂組成物中樹脂以12〜15 wt %為最 佳’或者該感光起始劑以1.5 wt %為最佳，或者該單體以1〇 %為最佳；當然，本發明之感光性樹脂組成物進一步包含 有小於lwt%之添加劑（Additives)。 而本發明之感光性樹脂組成物可應用於觸控面板或平面 顯示器等相關產品中，如第一圖所示，其係於一透光基板g 201200965 由旋轉塗佈（spin coating)步驟，將本發明之感光性樹脂組 成物塗佈於該透光基板上表面，再依序經由真空乾燥（vacuum dry)、預烤（pre-baking)、曝光（exp0Sure)、顯影 (developing)、硬烤（post baking)等步驟，使該透光基板 11上表面111形成有感光性樹脂層U2，如第二圖所示，形 成具有保護絕緣作用之面板結構1，該透光基板下表面可進 一步結合有觸控組件，而形成觸控面板，或可應用於平面顯 示器等相關產品中，本發明之感光性樹脂層可使波長範圍於 380〜400nm之可見光其透光率可達到95%以上，且硬度可達 到5H之需求。 具體的實施例如下所述，然而，並非以此侷限本發明。 樹脂採用以下的組成’如表一所列： 表一 ^樹脂成 樹脂名稱 比較 實施例 樹脂2 實施例 樹脂3 樹脂成份（重量百分比） 樹脂1 甲基丙烯酸笮基酯 45 0 甲基丙烯酸 ~ΪΓ 20 25 甲基丙烯酸环氫丙酯 5 25 笨乙烯 0 20 35 含不飽合嫌基單體 10 15 鎞合 _ Llmzi 100 100 其中，比較樹脂1不含有甲基丙烯酸环氧丙酯，也不含 有本乙稀，實施例樹脂2含有甲基丙稀酸、甲基丙稀酸环氧 丙酯以及苯乙烯；實施例樹脂3含有曱基丙烯酸、曱棊丙烯 酸环氧丙酯以及苯乙烯。 將上述樹脂：比較樹脂1、實施例樹脂2及實施例樹脂3 搭配感光起始劑、單體、溶劑及界面活性劑，調製成感光性 201200965 樹脂組成物如表二所列： 表二感光性換 •脂組成物的組成 感光性樹脂組成物 ί重量百分比） 比較例1 實施例2 實施例3 樹脂 比較樹脂1 實施例樹脂2 實施例榭脂3 樹脂比例 12.2 12.2 12.2 感光起始劑 1.0 1.0 1.0 單體 6.6 6.6 6.6 溶劑 73.0 73.0 73.0 界面活性劑 7.2 7.2 7.2 總合 100 100 100 比較例1、實施例2及實施例3具有相同的感光起始劑、 單體、溶劑及界面活性劑組成。其中，比較例1，以比較樹 脂1為樹脂；實施例2以實施例樹脂2為樹脂；實施例3， 以實施例樹脂3為樹脂。 將上述比較例1、實施例2及實施例3進行顯影解析度 及附著力測試，結果如表三所列： 表三測試結果一 感光性樹脂組成物 比較例1 實施例2 實施例3 光阻顯影後之解析度 5分最佳、1分最差 2 5 5 圖案之直線性 線邊不良 難以顯影 良好 其中’係將各感光性樹脂組成物以旋轉塗佈（spin coating)方式，塗佈於一透光基板上，經過真空乾燥（vacuumAnd a solvent (wherein the resin contains at least methyl propyl propylene acrylate and decyl propylene _, the fluorenyl acrylate acid _ in the resin is 5 to 4 〇 wt% ' The mercaptoacrylic acid is 15 to 4 (wt%) in the resin, and the photosensitive resin composition is placed on the surface of the light-transmitting substrate to form a panel structure having a protective insulating effect, which can be applied to a touch panel. In a related product such as a flat panel display, the light transmittance of the visible light having a wavelength range of 380 to 400 nm can reach 95% or more and the hardness can reach 5H. [Embodiment] In order to clarify the main technical contents and embodiments of the present invention, the present invention will be described as follows: The photosensitive resin composition of the present invention contains 5 to 3 % by weight of resin Uesin) 1 to 2 wt% of a photoinitiator (photo initiator), 5 to 15 wt% of a monomer (Monomer), and 50 to 80 wt% of a solvent (Solvent); wherein the tree fat contains at least mercaptoacrylic acid Glycidyl acrylate, methacrylic acid, the propylene methacrylate is 5 to 40% by weight in the resin (and preferably 15 to 35 wt%) - the methyl methic acid is in the resin 15 to 40 wt% (and preferably 20 to 35 wt%) 'and the resin is preferably 12 to 15 wt% in the photosensitive resin composition' or the photoinitiator is preferably 1.5 wt%, or The monomer is preferably 1% by weight; of course, the photosensitive resin composition of the present invention further contains less than 1% by weight of additives. The photosensitive resin composition of the present invention can be applied to related products such as a touch panel or a flat panel display, as shown in the first figure, which is attached to a transparent substrate g 201200965 by a spin coating step. The photosensitive resin composition of the present invention is applied onto the upper surface of the light-transmitting substrate, and then sequentially subjected to vacuum drying, pre-baking, exp0Sure, developing, hard baking (pre-baking). In the step of baking, the upper surface 111 of the transparent substrate 11 is formed with a photosensitive resin layer U2. As shown in the second figure, a panel structure 1 having a protective insulating effect is formed, and the lower surface of the transparent substrate can be further combined. The touch component can be used to form a touch panel, or can be applied to a related product such as a flat panel display. The photosensitive resin layer of the present invention can achieve a transmittance of visible light having a wavelength ranging from 380 to 400 nm of 95% or more, and hardness. Can meet the needs of 5H. The specific implementation is as follows, however, the invention is not limited thereto. The resin has the following composition' as listed in Table 1: Table 1 resin-resin name Comparative Example Resin 2 Example Resin 3 Resin component (% by weight) Resin 1 Methyl methacrylate 45 0 Methacrylic acid ~ ΪΓ 20 25 cyclopropanol methacrylate 5 25 stupid ethylene 0 20 35 containing unsaturated monomer 10 15 _ _ Llmzi 100 100 wherein the comparative resin 1 does not contain glycidyl methacrylate, nor does it contain Ethylene, Example Resin 2 contained methacrylic acid, glycidyl methacrylate, and styrene; Example Resin 3 contained methacrylic acid, glycidyl acrylate, and styrene. The above resin: Comparative resin 1, Example resin 2 and Example resin 3 were mixed with a photosensitive initiator, a monomer, a solvent and a surfactant to prepare a photosensitive 201200965 resin composition as listed in Table 2: Table 2 Photosensitivity Composition of the fat composition: photosensitive resin composition ί by weight) Comparative Example 1 Example 2 Example 3 Resin Comparative Resin 1 Example Resin 2 Example Resin 3 Resin ratio 12.2 12.2 12.2 Photoinitiator 1.0 1.0 1.0 Monomer 6.6 6.6 6.6 Solvent 73.0 73.0 73.0 Surfactant 7.2 7.2 7.2 Total 100 100 100 Comparative Example 1, Example 2 and Example 3 have the same photoinitiator, monomer, solvent and surfactant composition. In Comparative Example 1, the comparative resin 1 was used as a resin; in Example 2, the resin 2 was used as a resin; and in Example 3, the resin 3 was used as a resin. The above Comparative Example 1, Example 2, and Example 3 were subjected to development resolution and adhesion test. The results are shown in Table 3: Table 3 Test Results - Photosensitive Resin Composition Comparative Example 1 Example 2 Example 3 Photoresist The resolution after development is 5 points, and 1 minute is the worst. 2 5 5 The linear line of the pattern is difficult to develop, and the photosensitive resin composition is applied by spin coating. Vacuum drying on a transparent substrate (vacuum
dry : 133Pa) ’ 預烤（pre-baking : ll〇t：/90sec)，曝光 (exposure : 200mJ/cm2)，驗液顯影（developing : 23 °C /6〇56<:)’硬烤（？〇31^31^1^:230°(：/3〇111丨11)後，進行測試結 果。測試方法如下： 第一種測試方法--感光性樹脂組成物顯影後以光學顯爲 7 201200965 鏡觀察保留在破璃基板上之圖案號碼（代表圖 ^4；^8.1〇M2M4.16.18.2〇.3〇.4〇^；； 案無掉落為5分、ίο以下掉落為4分、2G以下掉落為3分、 40以下掉落為2分、全掉落為1分。 第二種測試方法一以光學顯微鏡觀察圖案是否可呈現完 整之圖形（長條狀），依線邊狀況可分為良好（直線性佳）、線 邊不良（圖案間有縫隙但直線性不佳）以及難以顯影（圖案之 間無法顯影，導致圖案無法成形）。 表三的測試結果顯示，實施例3具有良好之顯影解析度 及附著力，故再以實施例3中所使用之實施例樹脂3進一步 搭配感光起始劑、單體、溶劑及界面活性劑，調製成感光性 樹脂組成物如表四所列·· 表四感光性樹脂組成物的組成 感光性樹脂組成物 ..(重量百分比） 實施例 3 實施例 4 實施例 5 實施例 6 實施例 7 樹脂比例 實施例樹脂3) 12.2 11.3 12.4 10.2 7.6 _感光起始劑 1.0 1.1 1.6 1.9 2.3 單體 6.6 7.5 10.5 12.8 15.1 - 溶劑 73.0 72.9 67.6 42.7 67.6 界面活性劑 7.2 7.2 7.6 63 67.4 總合 100 100 100 100 100 將上述實施例3〜實施例7進行耐熱性、百格刮刀附著 力、透光率及硬度比較測試，結果如表五所列： 表五測試結果二 感光性樹脂組成物 (重量百分比） 實施例 3 實施例 4 實施例 5 實施例 6 實施例 7 光阻顯影後之解析度 5分最佳、1分最差 5 5 5 5 5 圖案之直線性 良好 良好 「良好一 線邊 線邊 201200965Dry : 133Pa) ' Pre-baking ( ll〇t:/90sec), exposure (exposure: 200mJ/cm2), test development (developing : 23 °C /6〇56<:)' hard bake (? 〇31^31^1^: 230° (:/3〇111丨11), the test results are carried out. The test method is as follows: The first test method--the photosensitive resin composition is developed after optical display 7 201200965 Mirror Observe the pattern number remaining on the broken glass substrate (representative figure ^4; ^8.1〇M2M4.16.18.2〇.3〇.4〇^;; the case has no drop to 5 points, ίο falls to 4 points, Drops below 2G for 3 points, drops below 2 for 2 points, and drops all for 1 point. The second test method is to observe whether the pattern can present a complete pattern (long strip) by optical microscope, depending on the line condition It can be divided into good (good linearity), poor line edge (with gaps between patterns but poor linearity), and difficulty in development (the film cannot be developed between the patterns, resulting in a pattern that cannot be formed). The test results in Table 3 show that Example 3 With good development resolution and adhesion, the resin 3 of the example used in Example 3 is further combined with the sensitization start. , monomer, solvent and surfactant, prepared into a photosensitive resin composition as listed in Table 4 · Table 4 photosensitive resin composition composition photosensitive resin composition. (% by weight) Example 3 Example 4 Example 5 Example 6 Example 7 Resin ratio Example Resin 3) 12.2 11.3 12.4 10.2 7.6 Photosensitive starter 1.0 1.1 1.6 1.9 2.3 Monomer 6.6 7.5 10.5 12.8 15.1 - Solvent 73.0 72.9 67.6 42.7 67.6 Surfactant 7.2 7.2 7.6 63 67.4 Total 100 100 100 100 100 The above Examples 3 to 7 were tested for heat resistance, hundred-blade adhesion, light transmittance and hardness. The results are shown in Table 5: Table 5 Test Results 2 Photosensitive Resin composition (% by weight) Example 3 Example 4 Example 5 Example 6 Example 7 Resolution after photoresist development 5 points optimum, 1 minute worst 5 5 5 5 5 The pattern has good linearity "Good line sideline 201200965
不良 ~~~~ 百格測試附著力 5Β最佳、0Β最差 5B 5B 5B 3B 3Β 殘膜率（％) _愈高表示耐熱性愈好 93 93 95 —--- 96 --- 97 光阻成膜後之透光率 (%) @380~400nm 96 96 96 96 ———. 96 _ 光阻成膜後硬度 3H 3H^ 5H 4H ~ — 4H 其中，係同樣將各感光性樹脂組成物以旋轉塗佈 coating)方式，塗佈於一透光基板上，並依序經過真空乾燥、 預烤、曝光、鹼液顯影、硬烤後，進行測試結果。測試方法 如下： 1、光阻耐熱性測試方法：將硬烤後之感光性樹脂組成物 再以250°C/lhr方式烘烤，觀察膜厚變化百分率（殘膜率）， 殘膜率愈高代表耐熱性愈好。 2、 硬烤後附者力測试方法·以百格到刀測試法進行娜 無掉落為5B，全掉落為0B，以此類推。 物 3、 透光率測試方法：利用色度分析儀以穿透光穿透 經感測器偵測計算後得到透光百分比。 測 4、 硬度試方法：以全自動鉛筆硬度計量測（JIS規範） 表五的測試結果顯示，實施例3〜5具有較佳圖安 〇 性 同系之直綠 實施例3〜5的圖案之直線性為良好，優於實施例6 線邊不良；於百格測試附著力方面，實施例3〜5的百松的 附著力高達5B，優於實施例6〜7的3B ;於殘膜率方面測試 例7的殘膜率較高而耐熱性最佳，而實施例3的殘’實施 而耐熱性最差；透光率方面，各實施例透光率相、最低 面，實施例5的硬度高達5H ’優於其他實施例的3H 又万 因此於總體表現方面，實施例5為具有較佳圖案 5 4Η& >、<直線性 201200965 附著力、耐熱性、透光率以及硬度，均優於其他實施例的配 方組成。 如上所述，本發明提供一種感光性樹脂組成物及其所應 用之面板結構，爰依法提呈發明專利之申請；惟，以上之實 施說明及圖式所示，係本發明較佳實施例者，並非以此侷限 本發明，是以，舉凡與本發明之構造、裝置、特徵等近似、 雷同者，均應屬本發明之創設目的及申請專利範圍之内。 【圖式簡單說明】 第一圖係為本發明中製備面板之流程示意圖。 第二圖係為本發明中面板之結構示意圖。 【主要元件代表符號】 面板結構1 透光基板11 上表面111 感光性樹脂層12Bad ~~~~ 100 grid test adhesion 5Β best, 0Β worst 5B 5B 5B 3B 3Β residual film rate (%) _ higher the heat resistance is better 93 93 95 —--- 96 --- 97 photoresist Light transmittance after film formation (%) @380~400nm 96 96 96 96 ———. 96 _ After photoresist film formation hardness 3H 3H^ 5H 4H ~ — 4H Among them, each photosensitive resin composition is also The results of the test are carried out by spin coating coating on a light-transmissive substrate, followed by vacuum drying, pre-baking, exposure, lye development, and hard baking. The test method is as follows: 1. Photoresist heat resistance test method: the photosensitive resin composition after hard baking is baked at 250 ° C / lhr, and the percentage change of film thickness (residual film rate) is observed, and the residual film rate is higher. Represents the better heat resistance. 2, after the hard roasting attached to the force test method · with the hundred grid to the knife test method, no drop to 5B, all dropped to 0B, and so on. Material 3, Transmittance test method: using a colorimeter to penetrate the light through the sensor to determine the percentage of light transmission. Test 4, Hardness Test Method: Fully Automatic Pencil Hardness Measurement (JIS Specification) The test results of Table 5 show that Examples 3 to 5 have the preferred pattern of straight green embodiments 3 to 5 of the same type. The linearity is good, which is better than the defect of the wire of Example 6. In terms of the adhesion of the test, the adhesion of the pines of Examples 3 to 5 is as high as 5 B, which is superior to the 3B of Examples 6 to 7; In the test example 7, the residual film ratio is high and the heat resistance is the best, and the residual of the embodiment 3 is the worst and the heat resistance is the worst; the light transmittance is the light transmittance phase and the lowest surface of each embodiment, and the fifth embodiment. Hardness up to 5H' is superior to 3H of other embodiments. Therefore, in terms of overall performance, Example 5 has a preferred pattern of 5 4 Η &><linear 201200965 adhesion, heat resistance, light transmittance, and hardness, Both are superior to the formulation of other embodiments. As described above, the present invention provides a photosensitive resin composition and a panel structure to which the same is applied, and an application for a patent of the invention is provided according to the law; however, the above description and drawings show a preferred embodiment of the present invention. The present invention is not limited thereto, and any similarity and similarity to the structures, devices, features, and the like of the present invention should be within the scope of the present invention and the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a schematic flow chart of the preparation of a panel in the present invention. The second figure is a schematic structural view of the panel in the present invention. [Main component representative symbol] Panel structure 1 Transmissive substrate 11 Upper surface 111 Photosensitive resin layer 12