201144187 六、發明說明： 【發明所屬之技術領域】 本發明係關於用以在避免與塵埃或不適當的氣體（氧 或水分等）接觸的狀態下，保持作爲積體電路等基板所被 使用的矽晶圓、積體電路用的圖案遮罩、液晶式顯示裝置 的零件等保管對象物（原料、零件、製品等）的保管系統 及保管方法。 【先前技術】 以與該類保管系統相關連的先前技術文獻資訊而言， 有以下所示的專利文獻1。該專利文獻1所記載的保管系統 係具備有：可以密封狀收納複數枚矽晶圓，而且具備有供 沖洗用氣體之用的導入口及排出口（氣體控制璋）的 FOUP (保管容器）；及以上下左右排列成棚架狀的多數 保管室，在各保管室的內部設有與用以將FOUP內進行沖 洗的惰性氣體或乾燥空氣的供給路徑相連接的沖洗閥。若 將保管容器載置於保管室內的正確位置，使保管容器的導 入口與沖洗閥相連通連接，藉由透過沖洗閥所被導入的惰 性氣體或乾燥空氣來沖洗保管容器的內部。亦即’保管容 器內的不適當的氧或水分等被不良情形較少的惰性氣體或 乾燥空氣所趕出，而被置換成惰性氣體或乾燥空氣。 專利文獻1的沖洗閥係具有：被固定在各保管室的地 板面等的外殼、及設在外殼的上方的致動器。致動器係被 設爲可上下移動’俾以達成將被形成在沖洗閥內部的氣體 -5- 201144187 流路作開閉的開閉閥的功能。致動器通常係藉由彈簧而被 保持在不容許氣體通過的上方的閉鎖位置，藉由被載置於 保管室內的保管容器的下面的一部分而被下壓在下方的開 放位置，執行惰性氣體或乾燥空氣的導入。藉由使用如上 所示之構成的沖洗閥，來實現在氣體流路切換時不需要消 耗電力等的自動沖洗機構。 此外，以與該類氣體置換裝置或氣體置換方法相關連 的其他先前技術文獻資訊而言，有以下所示之專利文獻2 。該專利文獻2所記載的技術係使用：在底面具備有通常 以密封栓予以閉塞的沖洗埠的FOUP (保管容器）、及可 收納該FOUP的真空容器（保管室），在真空容器的底部 附近設有將沖洗埠的密封栓進行開閉操作的栓開閉裝置。 在操作氣體置換時，在可藉由栓開閉裝置來將FOUP的密 封栓進行開閉操作的真空容器內的預定位置設置FOUP之 後，將真空容器的蓋部密閉，藉由栓開閉裝置來去除 FOUP的密封栓之後，首先透過真空容器而將FOUP的內部 暫時減壓，接著透過真空容器而導入惰性氣體或乾燥空氣 ，再藉由栓開閉裝置而以密封栓來閉塞FOUP的沖洗埠。 因此，可一面使用無法承受較大的氣壓變化的FOUP—面 將FOUP內暫時減壓，與習知方法相比，可在短時間內進 行有效率的氣體置換操作。 [先前技術文獻] [專利文獻] [專利文獻1]曰本特開2005- 1 67 1 68號公報（0017-1 8段 201144187 落、002 1 -22段落、第i_3圖） [專利文獻2]日本特開2004- 1 2 842 8號公報（001 1段落 、第2圖） 【發明內容】 (發明所欲解決之課題） 但是’在專利文獻1所記載的保管系統中，由於爲藉 由氮等惰性氣體或乾燥空氣來將既有的空氣趕出至FOUP 內的構成，因此會有所被導入的惰性氣體或乾燥空氣所含 有的水分對矽晶圓造成不良影響、所被導入的惰性氣體或 乾燥空氣使FOUP內的塵埃上浮而附著在矽晶圓等之虞。 此外，必須配備具備有藉由保管容器的收納而與保管 容器的導入口自動連結的高精度的沖洗閥的昂貴保管室。 此外’爲FOUP內的沖洗結束後亦接著供給與沖洗初期相 同大流量的惰性氣體或乾燥空氣的構成，由於需要此程度 大量的惰性氣體或乾燥空氣，因此亦孕育出運轉成本高、 容易造成資源浪費等問題。 另一方面’在專利文獻2所記載的保管系統中，並非 爲如專利文獻1所示藉由惰性氣體或乾燥空氣來將既有的 空氣趕出至FOUP內的構成，但是爲在將F〇up內形成爲真 空之後立即將惰性氣體或乾燥空氣導入至FOUP內的構成 ，因此仍然會有所被導入的惰性氣體或乾燥空氣所含有的 水分對矽晶圓造成不良影響、所被導入的惰性氣體或乾燥 空氣使FOUP內的塵埃上浮而附著在矽晶圓等之虞。 201144187 此外，在專利文獻2所記載的保管系統中，係必須藉 由設在真空容器的栓開閉裝置將閉塞FOUP的沖洗埠的密 封栓進行開閉操作，但是在實際的半導體製造工廠等存在 有沖洗埠的配置或密封栓的形狀不同的多數種類的FOUP ，因此必須按FOUP的每個種類，準備具備有適合於各 FOUP的沖洗埠的配置或密封栓的形狀的栓開閉裝置的不 同氣體置換裝置。 本發明之目的係鑑於如上所例示的各習知技術所得之 保管系統所供予的課題’提供可以更佳的條件來保管矽晶 回等保管對象物的保管系統及保管方法。 本發明之其他目的係鑑於如上所例示的各習知技術所 得之保管系統所供予的課題，提供可削減惰性氣體或乾燥 空氣之消耗Μ的保管系統及保管方法。 本發明之其他目的係鑑於如上所例示的習知技術所供 予的課題’提供不需要在保管室設置栓開閉裝置的保管系 統及保管方法。 (解決課題之手段） 藉由本發明所得之保管系統之第1特徵構成係具備有 保管容器’其係可以密閉狀收納保管對象物，且具備 有：根據內外的壓力差而容許氣體由內部朝外部移動與氣 體由外部朝內部移動的氣體控制埠； 密閉狀的真空腔室，其係用以可取出放入的方式收納 -8 - 201144187 前述保管容器； 排氣路徑，其係將前述真空腔室與真空減壓裝置相連 接；及 惰性氣體或乾燥空氣供給路徑，其係以開閉自如的方 式連接前述真空腔室與惰性氣體或乾燥空氣供給手段， 具有：在將前述惰性氣體或乾燥空氣供給路徑閉鎖的 狀態下，藉由前述真空減壓裝置將前述真空腔室內保持在 預定的真空位準的真空保管模式；及在所被選擇的保管容 器出庫時，爲了以惰性氣體或乾燥空氣充滿前述真空腔室 與前述保管容器而將相對應的前述惰性氣體或乾燥空氣供 給路徑切換成開放狀態的出庫準備模式。 在藉由本發明之第1特徵構成所得的保管系統中，對 適當的保管對象物發出出庫指令爲止，基本上係採取將真 空腔室繼續保持爲真空狀態的構成，在被發出出庫指令時 才僅對適當的真空腔室供給充滿真空腔室與內部保管容器 的量的惰性氣體或乾燥空氣，因此可明顯減少矽晶圓等保 管對象物因惰性氣體或乾燥空氣所含有的水分而受到不良 影響的機會，此外，可大幅減少惰性氣體或乾燥空氣的消 耗量。此外，在真空保管模式中，保管容器之中的空氣等 透過氣體控制埠而被排氣，在出庫準備模式中，惰性氣體 或乾燥空氣透過氣體控制埠而被注入至保管容器，因此變 得不需要使用具備有沖洗閥或栓開閉裝置等的昂貴保管室 。此外，在對被發出出庫指令的保管容器的真空腔室供給 氮等惰性氣體或乾燥空氣時，亦並非趕出保管容器內的空 -9 - 201144187 氣，而是以較小流量傳送真空狀態的真空腔室與保管容器 所需最小限度的惰性氣體或乾燥空氣即可，因此所被導入 的惰性氣體或乾燥空氣使保管容器內的塵埃上浮而附著在 矽晶圓等保管對象物之虞亦會變少。 本發明之其他特徵構成在於：複數前述真空腔室透過 個別的開閉閥而對一個前述真空減壓裝置作連接，而且， 在前述真空保管模式下同時被減壓的前述真空腔室的數量 被限制在一定値以下。 若爲本構成，可一次保管多數保管容器與被收納在該 保管容器的保管對象物，而且同時被減壓的真空腔室的數 Μ被限制在一定値以下，因此與真空腔室的數量無關係， 即使採用較小能力的真空泵來作爲真空減壓裝置，亦可將 各真空腔室迅速形成爲所希望的真空狀態。 本發明之其他特徵構成在於：設有用以判定前述真空 腔室內的真空度的真空度判定手段，在前述真空保管模式 下，係根據藉由前述真空度判定手段所得的判定結果來實 施藉由前述真空減壓裝置所爲的減壓。 若爲本構成，即使由於由矽晶圓等保管對象物及保管 容器所發生的水分或微量的外部氣體，或者由於真空腔室 的氣密度的不足，而真空腔室及保管容器內的真空度降低 ，亦藉由真空度判定手段來檢測出該真空度的降低’而實 施藉由真空減壓裝置所爲的減壓，藉此使真空腔室及保管 容器內的真空度經常保持爲一定位準。 本發明之其他特徵構成在於：設有用以限制由前述真 -10- 201144187 空減壓裝置之側朝向各真空腔室的氣體流向的逆止閥。 若爲本構成，萬一沒有發現在真空減壓裝置的能力發 生異常而開放一個排氣路徑時，亦抑制空氣等在真空腔室 逆流之虞。 本發明之其他特徵構成在於：在前述真空保管模式下 ，將藉由前述真空減壓裝置而被減壓成前述預定的真空位 準的前述真空腔室的前述惰性氣體或乾燥空氣供給路徑， 一面繼續藉由前述真空減壓裝置所爲的減壓一面開放，藉 此藉由惰性氣體或乾燥空氣來沖洗殘留在前述真空腔室及 前述保管容器的氣體。 在僅藉由真空減壓裝置而被減壓至真空位準爲止的狀 態下，殘留在真空腔室或保管容器內的微量氣體的成分係 接近於空氣的成分，而含有20%前後的氧，但是若爲本構 成，大部分的殘留氣體會被氮等惰性氣體或乾燥空氣所置 換，因此矽晶圓等保管對象物可更加安全保管。此時，藉 由控制所被導入的惰性氣體或乾燥空氣的流入量，真空腔 室的壓力係爲可控制且以接近於真空狀態的壓力來流通惰 性氣體或乾燥空氣，可一面將來自保管容器或保管對象物 的外部氣體及塵埃進行排氣，一面將惰性氣體或乾燥空氣 充滿在真空腔室及保管容器內。 本發明之其他特徵構成在於：無關於藉由前述真空減 壓裝置所爲的減壓，若藉由前述真空度判定手段所得的判 定結果不低於預定値時，在發出警告的同時，爲了以惰性 氣體或乾燥空氣充滿前述真空腔室與前述保管容器而將適 -11 - 201144187 當的前述惰性氣體或乾燥空氣供給路徑切換成開放狀態。 無關於藉由前述真空減壓裝置所爲的減壓，若藉由前 述真空度判定手段所得的判定結果不低於預定値時，由於 其真空腔室的氣密度降低、或真空度判定手段發生故障之 虞較高，因此如本構成所示，將適當的惰性氣體或乾燥空 氣供給路徑切換成開放狀態，而以惰性氣體或乾燥空氣充 滿真空腔室與保管容器，藉此可有效抑制因進入至真空腔 室的空氣所含有的氧或水分而使保管對象物沒必要地被污 染的可能性。此外，根據自動發出的荇告，可催促操作人 員檢查真空腔室的氣密度或真空度判定手段。 藉由本發明所得之保管方法之特徵構成在於：使用具 備有前述各特徵構成之任一者之保管系統。 若爲藉由本構成所致的保管方法，至對保管對象物發 出出庫指令爲止，基本上係將真空腔室繼續保持爲真空狀 態，若發出出庫指令才僅對適當的真空腔室供給充滿真空 腔室與內部保管容器的量的惰性氣體或乾燥空氣，因此可 明顯減少保管對象物因惰性氣體或乾燥空氣所含有的水分 而受到不良影#的機會，此外，可大幅減少惰性氣體或乾 燥空氣的消耗it。此外，在對被發出出庫指令的保管容器 的真空腔室供給惰性氣體或乾燥空氣時，亦以較小流量來 傳送真空狀態的真空腔室與保管容器所需最小限度的惰性 氣體或乾燥空氣即可，因此惰性氣體或乾燥空氣使保管容 器內的塵埃上浮而附著在保管對象物之虞亦會變少。 -12- 201144187 【實施方式】 以下一面參照圖示，一面針對用以實施本發明的形態 加以說明。 (保管系統之全體構成） 藉由本發明所得之保管系統之目的在將各種電子零件 在避免與對該零件而言爲不適當的塵埃或氣體（〇2等）及 水分相接觸的狀態下進行保管。在此係以將屬於半導體材 料的矽晶圓2作爲電子零件來進行處理的情形爲例來進行 說明，但是亦可適用在曝光裝置所使用的光罩（reticle) 或遮罩（mask )等。 藉由本發明所得之保管系統係被設置於在進行矽晶圓 2的製造或加工的製程裝置（未圖示）的機側具備單一的 真空腔室、或由相鄰接配置的清淨室所構成的共通的保管 區域，如第1圖所示’具備有彼此獨立的多數真空腔室C( Cl ' C2...Cn )。基本上，矽晶圓2係在被收納在可以密封 狀收納多數枚矽晶圓2的複數FOUP4 (保管容器之一例） 的狀態下予以處理。 FOUP4係以在大氣壓附近予以使用爲前提來作設計， 由於並無法藉由減壓裝置來將FOUP4的內部直接減壓化， 因此透過收納有FOUP4的真空腔室c來作減壓化。 在此，雖然同時使用多數真空腔室C，但是亦可以具 備有單一真空腔室C的構成來實施。在製程裝置的機側設 置單一的真空腔室時’ 一般而言由保管容器搬送裝置自動 -13- 201144187 移載至真空腔室。此時，真空腔室的蓋部依來自上位的指 令’在保管容器從搬送裝置被搬送至真空腔室之前即自動 閉鎖。此外’在真空保管結束時，以惰性氣體或乾燥空氣 充滿後，以來自上位的指令使蓋部開放，保管容器係藉由 搬送裝置而被取出至真空腔室之外。 (FOUP的構成） FOUP4大槪由長方體狀框體所構成，一般在其正面設 有可將內部以氣密狀閉鎖的開閉蓋（未圖示）。開閉蓋係 藉由專用開具（未圖示）或手動來作裝卸。此外，在 FOUP4的底靣係設有：根據內外的壓力差來容許氣體由 FOUP4的內部朝外部移動的排出埠4a ;及根據內外的壓力 差來容許氣體由外部朝內部移動的導入埠4b。在排出埠4a 係介裝有僅容許超過預定壓力的氣體排出的第1止回閥（ check valve)(未圖示），在導入埠4b係介裝有僅容許超 過預定壓力的氣體進入的第2止回閥（未圖示）。排出埠 4a與導入埠4b係協同構成氣體控制埠。在排出埠4a與導入 埠4b的各止回閥的內側亦可配置一面防止塵埃侵入至 FOUP4內一面解決FOUP4之內外氣壓差的微量過濾器（未 圖示）。或者亦可省略止回閥，而以僅具備有微量過濾器 的氣體控制埠的形態來實施。 (真空腔室的構成） 各個真空腔室c ( Cl、C2…Cn )的一側面或上面係藉 -14- 201144187 由可以密閉狀閉鎖內部的蓋構件CL而以開閉自如的方式予 以關閉。在將蓋構件CL呈開放的狀態下係可藉由手動或機 器手（未圖示）等，將一個或複數FOUP4對真空腔室c作 取出放入。 各真空腔室C係與後述的真空減壓裝置P、5作並聯連 接，同時亦與氮氣筒等惰性氣體或乾燥空氣供給手段7作 並聯連接。 在將各真空腔室C與真空減壓裝置P、5相連接的減壓 路徑Rd(Rdl、Rd2…Rdn)(排氣路徑之一例）的中間係介 裝有氣體排出用的開閉閥Va(Val、Va2...Van)。同樣地， 在惰性氣體或乾燥空氣供給路徑Rp(Rpl、Rp2...Rpn)的中 間亦介裝有氣體供給用的開閉閥Vb(Vbl、Vb2... Vbn)。該 等開閉閥Va、Vb係可藉由來自後述控制單元1 0的訊號來作 開閉操作。 此外，在各真空腔室C係設有檢測腔室內之壓力（真 空度）的壓力感測器PS1(PS1、PS1、…PSn)(真空度判定 手段之一例）。 (真空減壓裝置的構成） 用以將真空腔室C的內部減壓的真空減壓裝置係具有 :透過主減壓路徑RdT (排氣路徑之一例）而與各真空腔 室C的減壓路徑Rd(Rdl、Rd2…Rdn)相連接的輔助真空腔室 5;及將輔助真空腔室5的內部保持爲預定的真空度的真空 -15- 201144187 在輔助真空腔室5亦設葙用以檢測該腔室內之壓力（ 真空度）的壓力感測器PSt。在輔助真空腔室5與主減壓路 徑RdT之間係介裝有反應速度高的逆止閥CV，來作爲阻止 由輔助真空腔室5朝向各真空腔室c的氣體流入的手段。 在保管系統的平常運轉狀態下，若藉由將適當的減壓 用的開閉閥Va開放而使正在收納FOUP4中的一個真空腔室 C與輔助真空腔室5相連通時，該真空腔室C的內部的氣體 被排氣，同時FOUP4的內部的氣體亦藉由內外的壓力差而 透過排出埠4a被排氣，因此真空腔室C及FOUP4均達到預 定的真空度。 (惰性氣體或乾燥空氣供給手段的構成） 惰性氣體或乾燥空氣供給手段7係爲了對視需要所被 選擇的真空腔室C供給惰性氣體或乾燥空氣而設，可藉由 透過主供給路徑RpT而與各真空腔室C的惰性氣體或乾燥 空氣供給路徑Rp(Rpl、Rp2...Rpn)相連接的氮氣筒等來構 成。 若在保管系統的平常運轉狀態下，藉由將適當的惰性 氣體或乾燥空氣供給用的開閉閥Vb開放而使正在收納必須 作出庫準備的FOUP4中的一個真空腔室C與惰性氣體或乾 燥空氣供給手段7相連通時，則會透過開閉閥Vb而對真空 腔室C導入惰性氣體或乾燥空氣，同時被導入至真空腔室C 的惰性氣體或乾燥空氣係藉由內外的壓力差而透過導入埠 4b亦被導入至FOUP4的內部，因此真空腔室C及FOUP4係 -16- 201144187 均被預定壓力（一般而言與保管系統所存在的保管區域的 氣壓相同）的惰性氣體或乾燥空氣所充滿。 (控制單元的構成） 管理保管系統的大致全體的控制單元1 0係基本上維持 將全部惰性氣體或乾燥空氣供給路徑Rp保持在閉鎖狀態， 而將正在收納FOUP4中的全部真空腔室C的內部藉由真空 減壓裝置P、5而保持在預定的真空位準（真空保管模式） 的真空保管體制，進行僅在當將所被選擇的FOUP4從保管 系統出庫時（出庫準備模式）的出庫準備時期，爲了以惰 性氣體或乾燥空氣充滿FOUP4而僅將適當的真空腔室C的 惰性氣體或乾燥空氣供給路徑Rp切換成開放狀態的控制。 因此，在保管系統的一部分係配置有輸入裝置20，其 用以以手動對各真空腔室C設定輸入真空保管模式與出庫 準備模式與休止模式的任一者。休止模式係對未收納 FOUP 4的真空腔室C作設定’被設定爲休止模式的真空腔 室C係減壓路徑Rd與供給路徑Rp之雙方均被保持爲閉鎖狀 態。 如第1圖所示，控制單元1 〇係具有：模式判定部〗2、 壓力判定部1 3、運轉控制部1 4、閥開閉操作部丨5等。模式 判定部1 2係判定藉由輸入裝置2 0所被設定輸入的每個真空 腔室C的模式。壓力判定部1 3係將藉由壓力感測器p S (p s j 、PS2、…PSn)所被檢測出的各真空腔室c內的壓力（真空 度）與基準値相比較來進行判定。運轉控制部〗4係按照藉 -17- 201144187 由壓力感測器p St所被檢測到的輔助真空腔室5內的壓力’ 將真空泵P的驅動狀態作ON / OFF切換。閥開閉操作部1 5 係根據模式判定部1 2的判定結果或各真空腔室C內的壓力 (真空度），將減壓路徑Rd的開閉閥Va(Val、Va2…Van) 或惰性氣體或乾燥空氣供給路徑Rp的開閉閥vb(vbl、 Vb2...Vbn)進行開閉操作。 其中，以用以將藉由真空減壓裝置P、5來同時進行減 壓的真空腔室C的數量限制在一定値以下的手段而言’在 控制單元1 0係設有用以防止減壓路徑Rd的複數開閉閥 Va(Val ' Va2...Van)同時被開放的連鎖裝置（未圖示）。 但是，依相對真空腔室C的規模的真空泵P或輔助真空腔室 5的能力狀況，亦可將可同時減壓的真空腔室C的上限數設 定爲2以上。其中，若將彼此真空度有所不同的複數真空 腔室C的開閉閥Va同時開放時，會有氣體從真空度低的真 空腔室C流至真空度高的真空腔室C之虞。因此，若以將複 數真空腔室C同時減壓的構成來實施時，爲了防止如上所 示之氣體的移動’若在各真空腔室C的開閉閥Va的下游側 (真空泵P側）等’設置限制氣體從主減壓路徑RdT側朝真 空腔室C進入的逆止閥即可。 (保管系統的運轉方法） 在保管系統初次運轉時，係將減壓路徑Rd的全部開閉 閥Va(Val、Va2…Van)及惰性氣體或乾燥空氣供給路徑Rp 的全部開閉閥Vb(Vbl、Vb2... Vbn)閉鎖，使真空泵P驅動至 -18- 201144187 輔助真空腔室5的內部壓力（真空度）成爲預定的下方基 準値5RL爲止。之後，保管系統運轉中，控制單元1 0的運 轉控制部1 4係根據壓力判定部1 3的判定結果，若輔助真空 腔室5的內部壓力（真空度）成爲預定的上方基準値5 RH， 則驅動真空泵P。結果，輔助真空腔室5的內部係經常被維 持在下方基準値5RL至上方基準値5RH的範圍內。 接著，操作人員若藉由輸入裝置20而將正在收納 FOUP4中的全部真空腔室C設定爲真空保管模式時，控制 單元1 0的閥開閉操作部1 5係從所被設定的真空腔室C中僅 選擇一個，僅將與該真空腔室C相對應的開閉閥Va切換成 開放狀態。若所被選擇的真空腔室C的內部壓力（真空度 )成爲預定的下方基準値CRL時，以接著選擇第2個真空 腔室C，同樣地僅將相對應的開閉閥Va切換成開放狀態的 順序，而使正在收納FOUP4中的全部真空腔室C減壓成下 方基準値CRL。其中，關於從哪一個真空腔室C先適用減 壓成下方基準値CRL的操作，係可形成爲預先作成方便規 定真空腔室C之優先度的LUT，控制單元10根據該LUT來決 定處理順序的構成。 (真空保管模式） 之後，保管系統運轉中，若壓力判定部1 3判定正在收 納FOUP4中的任意真空腔室C的內部壓力（真空度）成爲 預定的上方基準値C R Η時，閥開閉操作部1 5將適當的開閉 閥Va開放，藉此使該真空腔室C的內部壓力（真空度）恢 -19- 201144187 復成下方基準値CRL。結果’全部真空腔室C的內部係經 常被實質維持在由下方基準値CRL至上方基準値CRH的範 圍內。 (出庫準備模式） 若操作人員藉由輸入裝置20而將某真空腔室C設定爲 出庫準備模式時，與真空腔室C的內部壓力（真空度）無 關係地將適當的開閉閥Va切換成開放狀態。若藉由開閉閥 V a切換成開放狀態而使該真空腔室C被減壓成下方基準値 CRL時，立即將開閉閥Va閉鎖，接著，將適當的惰性氣體 或乾燥空氣供給路徑Rp的開閉閥Vb開放，藉此對適當的真 空腔室C與FOUP4導入惰性氣體或乾燥空氣。第1圖中係顯 示第三個真空腔室C3被設定爲出庫準備模式的狀態。 其中，將適於對各真空腔室C判定大氣壓附近的壓力 的壓力計，有別於壓力感測器PS而另外設置，若形成爲在 該壓力計的判定結果表示與保管系統所存在的保管區域的 氣壓爲大致相同的壓力値的時點將開閉閥Vb閉鎖的構成即 可。接著，若將適當的真空腔室C的蓋構件CL開放，即可 順利地取出塡充有惰性氣體或乾燥空氣的FOUP4。 (密閉不良時等的流動） 其中’關於被設定爲真空保管模式的真空腔室C，亦 無關於藉由真空減壓裝置P、5所爲之減壓，在藉由壓力判 定部1 3所得的判定結果未達到下方基準値cRL時，以緊急 -20- 201144187 對策而言，將適當的減壓路徑Rd的開閉閥Va閉鎖，且在發 出「必須查核密閉度」等警告的同時，爲了以惰性氣體或 乾燥空氣充滿真空腔室C與FOUP4而將適當的惰性氣體或 乾燥空氣供給路徑Rp的開閉閥Vb切換成開放狀態。 [實施例] 在表1中顯示將在習知之藉由仏沖洗所致之保管系統 與本發明之真空保管系統之間，保管中的保管對象物所曝 露的雰圍氣是如何不同加以比較硏究的實驗結果。 [表1] N2沖洗(10公升/分鐘)保管 真空抽引+保管 時間(分鐘） 氧濃度(％) 濕度(％) 氧濃度(％) 濕度(％) 0 20.6 37.0 20.6 35.7 5 4.15 14.5 0.074 0.8 10 0.732 8.3 0.074 0.8 表的左側所記載的習知的藉由N2沖洗所爲的保管中， 並未使用真空腔室，而由導入埠4b以10L/分鐘的流量將 N 2氣體注入至F Ο U P 4，藉此將內部空氣進行沖洗。另一方 面，表的右側所記載的藉由本發明所爲的真空保管中，係 使用收納在真空腔室C的內部的FOUP4，以上述實施形態 所記載的方法來進行減壓且進行真空保管。 如表1所示，可得習知的藉由保管系統所爲的N2沖洗 開始5分鐘後的曝露雰圍氣係氧濃度爲4.1 5 % '濕度爲 1 4.5%，相對於此，藉由本發明之真空保管所爲之減壓開 始5分鐘後的曝露雰圍氣係氧濃度爲0.074%、濕度爲〇. 8% -21 - 201144187 的結果，可知在藉由本發明所得之真空保管系統中，可獲 得對矽晶圆2等保管對象物而言爲非常有利的雰圍氣。 可知從N2沖洗或減壓開始經過1 0分鐘後，在習知的藉 由保管系統所爲的N2沖洗中，氧濃度爲〇.73 2% '濕度爲 8.3 %時可得更爲清淨的雰圍氣，但是並未達及藉由本發明 所得的真空保管系統的氧濃度爲0.074%、濕度爲0.8 %的結 果。 (其他實施形態〕 <1>亦可省略輔助真空腔室5，而以將各真空腔室C的 減壓路徑Rd與真空泵P的抽吸口直接連結的構成來實施。 <2>在真空保管模式中，並非爲根據藉由設在真空腔 室C的真空度判定手段所得的判定結果來實施藉由真空減 壓裝置P、5所爲的減壓，而亦可與真空腔室C內的壓力測 定値無關係地，在每次經過事前設定的一定期間時即實施 藉由真空減壓裝置P、5所爲之減壓的構成來實施。 <3 >在真空保管模式中，亦可將藉由真空減壓裝置P、 5而被減壓成預定真空位準的真空腔室C的惰性氣體或乾燥 空氣供給路徑Rp，一面繼續藉由真空減壓裝置P、5所爲的 減壓一面進行開放，藉此可一面保持在某真空度，一面藉 由惰性氣體或乾燥空氣來沖洗殘留在真空腔室C及保管容 器4的氣體（殘留氣體沖洗）的構成來實施。此外，該殘 留氣體沖洗亦可爲了在任意的真空腔室C中將內部壓力（ 真空度）恢復成下方基準値CRL而在每次將開閉閥Va重新 -22- 201144187 開放時進行。或者，亦可與真空腔室C的內部壓力（真 度）無關係地僅定期隔著間隔反覆進行殘留氣體沖洗。 <4>亦可省略上述實施形態所記載之將被設定爲出 準備模式的真空腔室C的開閉閥Va暫時切換成開放狀態 藉此減壓至下方基準値CRL的工程，而立即將適當的惰 氣體或乾燥空氣供給路徑Rp的開閉閥Vb開放，藉此以對 當的真空腔室C與FOUP4導入惰性氣體或乾燥空氣的形 來實施。但是，被設定爲出庫準備模式的真空腔室C的 閉閥Va形成爲真空保管模式內的操作而呈開放中的情形 ’係等待開閉閥Va閉鎖至下方基準値CRL恢復爲止，在 復後即關閉開閉閥V a，而將惰性氣體或乾燥空氣供給路 Rp的開閉閥Vb開放即可。 <5>在保管容器（FOUP等）並不一定必須設置具備 逆止閥的埠，若爲設置有根據內外的壓力差才容許氣體 內部朝外部移動與氣體由外部朝內部移動的氣體控制埠 容器即可。例如，，以設在FOUP4的氣體控制埠而言，係 代設置第1止回閥與第2止回閥，而爲設置根據內外的壓 差而朝內側或外側打開，在沒有壓力差的狀態下藉由彈 手段而被保持在閉鎖位置的閥的構成亦可。或者，考慮 以壁部包圍全周的保管容器的壁部的一部分設置單數或 數貫穿孔，利用作爲根據內外的壓力差才容許氣體由內 朝外部移動與氣體由外部朝內部移動的氣體控制膜的微 過濾器等來封上該貫穿孔的構成等。 <6>第2圖係顯示可同時收納複數FOUP4的真空腔室[Technical Field] The present invention relates to a substrate for holding a substrate such as an integrated circuit while avoiding contact with dust or an inappropriate gas (oxygen, moisture, or the like). A storage system and storage method for storage objects (materials, parts, products, etc.) such as a pattern mask for a wafer or an integrated circuit, and a component of a liquid crystal display device. [Prior Art] The prior art document information related to such a storage system includes Patent Document 1 shown below. The storage system described in Patent Document 1 includes a FOUP (storage container) that can store a plurality of wafers in a sealed state, and has an inlet port and a discharge port (gas control port) for supplying a gas for rinsing; A plurality of storage compartments arranged in a scaffolding shape are disposed above and below, and a flush valve for connecting an inert gas or a supply passage of dry air for flushing in the FOUP is provided inside each storage compartment. When the storage container is placed in the correct position in the storage chamber, the inlet port of the storage container is connected to the flush valve, and the inside of the storage container is rinsed by the inert gas or the dry air introduced through the flush valve. That is, inappropriate oxygen or moisture in the storage container is ejected by an inert gas or dry air having a small amount of trouble, and is replaced with an inert gas or dry air. The flush valve of Patent Document 1 has an outer casing that is fixed to a floor surface of each storage chamber, and an actuator that is provided above the outer casing. The actuator is configured to be movable up and down to achieve an opening/closing valve that opens and closes the gas that is to be formed inside the flush valve -5 - 201144187. The actuator is normally held by a spring at a locked position above which gas is not allowed to pass, and is placed under a lower portion of the storage container placed in the storage chamber to be pressed downward to perform an inert gas. Or the introduction of dry air. By using the flush valve constructed as described above, an automatic flushing mechanism that does not require power consumption or the like when switching the gas flow path is realized. Further, in other prior art document information related to such a gas replacement device or a gas replacement method, there is Patent Document 2 shown below. The technique described in Patent Document 2 uses a FOUP (storage container) having a flushing port that is normally closed by a sealing plug, and a vacuum container (storage chamber) that can accommodate the FOUP, near the bottom of the vacuum container. A plug opening and closing device that opens and closes the sealing plug of the washing bowl is provided. When the operation gas is replaced, the FOUP is sealed at a predetermined position in the vacuum container in which the sealing plug of the FOUP can be opened and closed by the plug opening and closing device, and the lid portion of the vacuum container is sealed, and the FOUP is removed by the plug opening and closing device. After sealing the plug, the inside of the FOUP is first temporarily decompressed through the vacuum vessel, and then an inert gas or dry air is introduced through the vacuum vessel, and the flushing plug of the FOUP is closed by a sealing plug by the plug opening and closing device. Therefore, it is possible to temporarily decompress the FOUP while using the FOUP-face which cannot withstand a large pressure change, and it is possible to perform an efficient gas replacement operation in a short time as compared with the conventional method. [Prior Art Document] [Patent Document 1] [Patent Document 1] JP-A-2005- 1 67 1 68 (0017-1 8 paragraph 201144187, 002 1 -22, i-3) [Patent Document 2] Japanese Laid-Open Patent Publication No. 2004- 1 2 842 No. 001 (No. 001, paragraph 2) [Explanation of the Invention] However, the storage system described in Patent Document 1 is based on nitrogen. An inert gas or dry air is used to drive out the existing air into the FOUP, so that the introduced inert gas or the moisture contained in the dry air adversely affects the wafer, and the introduced inert gas Or dry air causes the dust in the FOUP to float and adhere to the crucible or the like. In addition, it is necessary to provide an expensive storage room having a high-precision flush valve that is automatically connected to the inlet of the storage container by storage of the storage container. In addition, after the flushing in the FOUP is completed, the inert gas or dry air having the same large flow rate as the initial stage of the flushing is supplied, and since a large amount of inert gas or dry air is required, the running cost is high and the resources are easily generated. Waste and other issues. On the other hand, in the storage system described in Patent Document 2, the configuration in which the existing air is driven out into the FOUP by inert gas or dry air is not disclosed in Patent Document 1, but in the case of F〇 The formation of the inert gas or the dry air into the FOUP immediately after the formation of the vacuum is performed, so that the inert gas or the moisture contained in the dry air may still have an adverse effect on the wafer and the inertness introduced. The gas or dry air causes the dust in the FOUP to float and adhere to the crucible or the like. In the storage system described in the patent document 2, it is necessary to open and close the sealing plug of the flushing dam that closes the FOUP by the plug opening and closing device provided in the vacuum container, but there is a flush in an actual semiconductor manufacturing plant or the like. There are many types of FOUPs in which the shape of the crucible or the shape of the sealing plug is different. Therefore, it is necessary to prepare different gas displacement devices having a plug opening and closing device having a configuration suitable for the flushing of each FOUP or a shape of a sealing plug for each type of FOUP. . The object of the present invention is to provide a storage system and a storage method for storing a storage object such as a crystal back, which can be stored under better conditions, in view of the problem of the storage system which is obtained by the above-described conventional techniques. Other objects of the present invention are to provide a storage system and a storage method capable of reducing the consumption of inert gas or dry air in view of the problems to be provided by the storage systems obtained by the above-described conventional techniques. Other objects of the present invention are to provide a storage system and a storage method that do not require a plug opening and closing device in a storage room in view of the problems of the prior art as exemplified above. (Means for Solving the Problem) The first characteristic configuration of the storage system obtained by the present invention includes a storage container that can store and store the storage object in a sealed state, and is provided with a gas that is allowed to be internal to the outside according to a pressure difference between the inside and the outside. a gas control chamber that moves and moves from the outside to the inside; a closed vacuum chamber that is detachably placed to receive the storage container -8 - 201144187; an exhaust path that connects the vacuum chamber And an inert gas or dry air supply path connecting the vacuum chamber and the inert gas or dry air supply means in an openable and closable manner, having: supplying the inert gas or the dry air to the path In the locked state, the vacuum chamber is maintained in a vacuum storage mode of a predetermined vacuum level by the vacuum decompression device; and when the selected storage container is taken out, the vacuum is filled with an inert gas or dry air. The inert gas or dry air supply path corresponding to the chamber and the storage container It is switched to the open state library preparation mode. In the storage system obtained by the first aspect of the present invention, basically, the vacuum chamber is continuously maintained in a vacuum state until a storage instruction is issued to an appropriate storage object, and only when the delivery instruction is issued By supplying an inert gas or dry air which is filled in the vacuum chamber and the internal storage container to an appropriate vacuum chamber, it is possible to significantly reduce the adverse effect of the storage object such as the ruthenium wafer due to the moisture contained in the inert gas or the dry air. Opportunities, in addition, can significantly reduce the consumption of inert gas or dry air. Further, in the vacuum storage mode, the air in the storage container is exhausted through the gas control port, and in the delivery preparation mode, the inert gas or the dry air is injected into the storage container through the gas control port, so that it does not become An expensive storage room equipped with a flush valve or a plug opening and closing device is required. In addition, when an inert gas such as nitrogen or dry air is supplied to the vacuum chamber of the storage container to which the delivery instruction is issued, the vacuum is not ejected from the storage container, but the vacuum is transmitted at a small flow rate. In the vacuum chamber and the storage container, the minimum amount of inert gas or dry air is required. Therefore, the introduced inert gas or dry air floats on the storage container and adheres to the storage object such as the wafer. Fewer. Another feature of the present invention is that the plurality of vacuum chambers are connected to one of the vacuum decompression devices through individual opening and closing valves, and the number of the vacuum chambers simultaneously decompressed in the vacuum storage mode is limited. Be sure to be below. According to this configuration, the number of vacuum chambers that are stored in the storage container and the number of vacuum chambers that are simultaneously decompressed can be limited to a certain amount or less, so that the number of vacuum chambers is not limited. Relationship, even if a vacuum pump of a smaller capacity is used as the vacuum decompression device, each vacuum chamber can be quickly formed into a desired vacuum state. According to another aspect of the present invention, a vacuum degree determining means for determining a degree of vacuum in the vacuum chamber is provided, and in the vacuum storage mode, the determination result obtained by the vacuum degree determining means is performed by the foregoing The reduced pressure of the vacuum decompression device. According to this configuration, the degree of vacuum in the vacuum chamber and the storage container is caused by moisture or a small amount of external air generated by the storage object or the storage container such as the wafer or the air density of the vacuum chamber. The vacuum degree reduction means is also detected by the vacuum degree determining means, and the pressure reduction by the vacuum pressure reducing means is performed, whereby the vacuum degree in the vacuum chamber and the storage container is constantly maintained as a positioning. quasi. Another feature of the present invention is that a check valve for restricting the flow of gas toward the respective vacuum chambers from the side of the true -10-201144187 air pressure reducing device is provided. In the case of this configuration, in the event that an abnormality in the capacity of the vacuum decompression device is opened and an exhaust path is opened, the backflow of air or the like in the vacuum chamber is also suppressed. According to still another aspect of the present invention, in the vacuum storage mode, the inert gas or dry air supply path of the vacuum chamber that is depressurized to the predetermined vacuum level by the vacuum decompression device is The pressure reduction is continued by the vacuum decompression device, whereby the gas remaining in the vacuum chamber and the storage container is flushed by an inert gas or dry air. In a state where the pressure is reduced to a vacuum level only by the vacuum decompression device, the component of the trace gas remaining in the vacuum chamber or the storage container is close to the component of the air, and contains 20% of oxygen before and after. However, in the present configuration, most of the residual gas is replaced by an inert gas such as nitrogen or dry air, so that the object to be stored such as a wafer can be safely stored. At this time, by controlling the inflow amount of the inert gas or the dry air to be introduced, the pressure of the vacuum chamber is controllable and the inert gas or the dry air is circulated at a pressure close to the vacuum state, and the container can be supplied from the storage container. The external gas and dust of the object to be stored are exhausted, and an inert gas or dry air is filled in the vacuum chamber and the storage container. According to another aspect of the present invention, in addition to the pressure reduction by the vacuum decompression device, when the determination result obtained by the vacuum degree determination means is not lower than a predetermined threshold, a warning is issued and The inert gas or the dry air fills the vacuum chamber and the storage container to switch the inert gas or dry air supply path to the open state. Regardless of the pressure reduction by the vacuum decompression device, if the determination result obtained by the vacuum degree determination means is not lower than the predetermined enthalpy, the gas density of the vacuum chamber is lowered, or the degree of vacuum determination means occurs. Since the failure is high, the appropriate inert gas or dry air supply path is switched to an open state as shown in the present configuration, and the vacuum chamber and the storage container are filled with an inert gas or dry air, thereby effectively preventing entry. Oxygen or moisture contained in the air in the vacuum chamber makes it unnecessary to contaminate the object to be stored. In addition, according to the automatically issued obituary, the operator can be urged to check the gas density or vacuum degree determination means of the vacuum chamber. The storage method obtained by the present invention is characterized in that a storage system having any of the above-described various features is used. According to the storage method by this configuration, the vacuum chamber is basically kept in a vacuum state until the storage instruction is issued to the storage object, and only the vacuum chamber is supplied to the appropriate vacuum chamber if the delivery instruction is issued. The amount of inert gas or dry air stored in the chamber and the inside of the container can significantly reduce the chance that the object to be stored will be adversely affected by the moisture contained in the inert gas or the dry air, and the inert gas or dry air can be greatly reduced. Consume it. In addition, when inert gas or dry air is supplied to the vacuum chamber of the storage container from which the delivery instruction is issued, the vacuum chamber and the minimum inert gas or dry air required for the storage container are also delivered at a small flow rate. Therefore, the inert gas or the dry air may also cause the dust in the storage container to float and adhere to the object to be stored. -12- 201144187 [Embodiment] Hereinafter, embodiments for carrying out the invention will be described with reference to the drawings. (The entire configuration of the storage system) The purpose of the storage system obtained by the present invention is to store various electronic components in a state in which they are prevented from being in contact with dust or gas (such as 〇2) and moisture which are inappropriate for the components. . Here, a case where the germanium wafer 2 belonging to the semiconductor material is processed as an electronic component will be described as an example, but a reticle or a mask used in the exposure apparatus may be applied. The storage system obtained by the present invention is provided in a single vacuum chamber provided on a machine side of a processing apparatus (not shown) for manufacturing or processing the tantalum wafer 2, or a clean room arranged adjacently. The common storage area, as shown in Fig. 1, has a plurality of vacuum chambers C (Cl ' C2 ... Cn ) which are independent of each other. Basically, the tantalum wafer 2 is processed in a state in which it is stored in a plurality of FOUPs 4 (an example of a storage container) in which a plurality of wafers 2 can be accommodated in a sealed state. The FOUP 4 is designed to be used in the vicinity of the atmospheric pressure. Since the inside of the FOUP 4 cannot be directly decompressed by the decompression device, the vacuum chamber c in which the FOUP 4 is housed is decompressed. Here, although a plurality of vacuum chambers C are used at the same time, a configuration in which a single vacuum chamber C is provided may be employed. When a single vacuum chamber is installed on the machine side of the process unit, it is generally transferred from the storage container transfer unit to the vacuum chamber. At this time, the lid portion of the vacuum chamber is automatically locked by the instruction from the upper position before the storage container is transported from the transfer device to the vacuum chamber. Further, when the vacuum storage is completed, after the inert gas or the dry air is filled, the lid portion is opened by a command from the upper position, and the storage container is taken out of the vacuum chamber by the transfer device. (Configuration of FOUP) The FOUP 4 is composed of a rectangular parallelepiped frame, and generally has an opening and closing cover (not shown) that can be internally sealed in an airtight manner. The opening and closing cover is attached or detached by a special opening (not shown) or manually. Further, the bottom of the FOUP 4 is provided with a discharge port 4a for allowing the gas to move outward from the inside of the FOUP 4 in accordance with the pressure difference between the inside and the outside, and an introduction port 4b for allowing the gas to move from the outside to the inside in accordance with the pressure difference between the inside and the outside. In the discharge port 4a, a first check valve (not shown) that allows only a gas exceeding a predetermined pressure to be discharged is introduced, and the inlet 埠4b is provided with a gas that allows only a gas exceeding a predetermined pressure to enter. 2 check valve (not shown). The discharge port 4a and the introduction port 4b cooperate to form a gas control port. A microfilter (not shown) that prevents dust from entering the FOUP 4 and solves the difference in pressure between the inside and outside of the FOUP 4 may be disposed inside the respective check valves of the discharge port 4a and the introduction port 4b. Alternatively, the check valve may be omitted and implemented in the form of a gas control crucible provided only with a microfilter. (Configuration of the vacuum chamber) One side surface or the upper surface of each of the vacuum chambers c (Cl, C2, ..., Cn) is closed by a lid member CL that can be closed in an airtight manner. In a state where the lid member CL is opened, one or a plurality of FOUPs 4 can be taken out and placed in the vacuum chamber c by a manual or robot hand (not shown) or the like. Each of the vacuum chambers C is connected in parallel to the vacuum decompressing devices P and 5 to be described later, and is also connected in parallel with an inert gas such as a nitrogen gas cylinder or a dry air supply means 7. In the middle of the pressure reducing path Rd (Rd1, Rd2 ... Rdn) (an example of the exhaust path) in which the vacuum chambers C are connected to the vacuum decompressing devices P and 5, an opening and closing valve Va for gas discharge is interposed ( Val, Va2...Van). Similarly, an opening/closing valve Vb (Vb1, Vb2, ..., Vbn) for supplying gas is also interposed between the inert gas or dry air supply path Rp (Rpl, Rp2, ..., Rpn). The on-off valves Va and Vb can be opened and closed by a signal from a control unit 10 to be described later. Further, in each of the vacuum chambers C, a pressure sensor PS1 (PS1, PS1, ..., PSn) for detecting the pressure (vacuum) in the chamber is provided (an example of a vacuum degree determining means). (Configuration of Vacuum Decompression Apparatus) The vacuum decompression apparatus for decompressing the inside of the vacuum chamber C has a main pressure reduction path RdT (an example of an exhaust path) and a decompression of each vacuum chamber C. The auxiliary vacuum chamber 5 to which the path Rd (Rdl, Rd2...Rdn) is connected; and the vacuum to maintain the inside of the auxiliary vacuum chamber 5 to a predetermined degree of vacuum -15-201144187 is also provided in the auxiliary vacuum chamber 5 A pressure sensor PSt that detects the pressure (vacuum) in the chamber. A check valve CV having a high reaction speed is interposed between the auxiliary vacuum chamber 5 and the main pressure reducing path RdT as means for preventing the inflow of gas from the auxiliary vacuum chamber 5 toward the respective vacuum chambers c. In the normal operation state of the storage system, when a vacuum chamber C in the storage FOUP 4 is communicated with the auxiliary vacuum chamber 5 by opening an appropriate opening and closing valve Va for decompression, the vacuum chamber C The internal gas is exhausted, and the gas inside the FOUP 4 is also exhausted through the discharge port 4a by the pressure difference between the inside and the outside, so that both the vacuum chamber C and the FOUP 4 reach a predetermined degree of vacuum. (Configuration of Inert Gas or Dry Air Supply Device) The inert gas or dry air supply means 7 is provided for supplying an inert gas or dry air to the selected vacuum chamber C as needed, and can be transmitted through the main supply path RpT. It is configured by a nitrogen gas cylinder or the like that is connected to the inert gas or the dry air supply path Rp (Rpl, Rp2, ..., Rpn) of each vacuum chamber C. When the opening/closing valve Vb for supplying an appropriate inert gas or dry air is opened in the normal operation state of the storage system, a vacuum chamber C and inert gas or dry air in the FOUP 4 in which the library preparation must be prepared are accommodated. When the supply means 7 is in communication, the inert gas or the dry air is introduced into the vacuum chamber C through the opening and closing valve Vb, and the inert gas or the dry air introduced into the vacuum chamber C is introduced through the pressure difference between the inside and the outside.埠4b is also introduced into the interior of the FOUP4, so the vacuum chamber C and the FOUP4 system-16-201144187 are filled with inert gas or dry air at a predetermined pressure (generally the same as the air pressure in the storage area where the storage system exists). . (Configuration of Control Unit) The control unit 10 that manages substantially all of the storage system basically maintains the entire inert gas or dry air supply path Rp in a locked state, and stores the inside of all the vacuum chambers C in the FOUP 4 The vacuum storage system that maintains the predetermined vacuum level (vacuum storage mode) by the vacuum decompressing devices P and 5, and performs the outbound preparation only when the selected FOUP 4 is taken out of the storage system (outbound preparation mode) In the period, in order to fill the FOUP 4 with an inert gas or dry air, only the control of the inert gas or dry air supply path Rp of the appropriate vacuum chamber C is switched to the open state. Therefore, an input device 20 for manually setting the vacuum storage mode, the delivery preparation mode, and the rest mode to each of the vacuum chambers C is disposed in a part of the storage system. In the rest mode, the vacuum chamber C in which the FOUP 4 is not accommodated is set. The vacuum chamber C in which the vacuum mode C is set to the rest mode is maintained in a closed state. As shown in Fig. 1, the control unit 1 includes a mode determination unit 2, a pressure determination unit 13 , an operation control unit 14 , a valve opening/closing operation unit 丨 5 , and the like. The mode determining unit 1 2 determines the mode of each vacuum chamber C that is input by the input device 20. The pressure determining unit 13 determines the pressure (vacuum degree) in each vacuum chamber c detected by the pressure sensors p S (p s j , PS2, ..., PSn) in comparison with the reference 値. The operation control unit 4 switches ON/OFF of the driving state of the vacuum pump P in accordance with the pressure ' in the auxiliary vacuum chamber 5 detected by the pressure sensor p St by -17-201144187. The valve opening and closing operation unit 15 is configured to open or close the valve Va (Val, Va2, ...) of the pressure reducing path Rd or the inert gas according to the determination result of the mode determining unit 12 or the pressure (degree of vacuum) in each vacuum chamber C. The opening and closing valve vb (vbl, Vb2, ..., Vbn) of the dry air supply path Rp is opened and closed. Here, in the means for limiting the number of vacuum chambers C which are simultaneously decompressed by the vacuum decompressing devices P and 5 to a certain value or less, the control unit 10 is provided with a decompression preventing path. The interlocking valve Va (Val 'Va2...Van) of Rd is simultaneously opened (not shown). However, depending on the capacity of the vacuum pump P or the auxiliary vacuum chamber 5 on the scale of the vacuum chamber C, the upper limit of the vacuum chamber C which can simultaneously reduce the pressure can be set to 2 or more. When the opening and closing valve Va of the plurality of vacuum chambers C having different degrees of vacuum are simultaneously opened, gas flows from the vacuum chamber C having a low degree of vacuum to the vacuum chamber C having a high degree of vacuum. Therefore, when the vacuum chamber C is simultaneously decompressed, in order to prevent the movement of the gas as described above, the downstream side of the opening and closing valve Va of each vacuum chamber C (the side of the vacuum pump P) It is sufficient to set a check valve that restricts the gas from entering the vacuum chamber C from the main pressure reducing path RdT side. (Operation method of the storage system) When the storage system is first operated, all the opening and closing valves Va (Val, Va2... Van) of the pressure reducing path Rd and all the opening and closing valves Vb (Vbl, Vb2) of the inert gas or dry air supply path Rp are provided. ... Vbn) The lock is applied to drive the vacuum pump P to -18-201144187. The internal pressure (vacuum degree) of the auxiliary vacuum chamber 5 becomes a predetermined lower reference 値5RL. After the storage system is in operation, the operation control unit 14 of the control unit 10 determines the internal pressure (vacuum degree) of the auxiliary vacuum chamber 5 to be a predetermined upper reference 値5 RH based on the determination result of the pressure determination unit 13 . Then the vacuum pump P is driven. As a result, the internal system of the auxiliary vacuum chamber 5 is often maintained in the range from the lower reference 値5RL to the upper reference 値5RH. Next, when the operator sets all the vacuum chambers C in the storage FOUP 4 to the vacuum storage mode by the input device 20, the valve opening and closing operation portion 15 of the control unit 10 is from the set vacuum chamber C. Only one of them is selected, and only the opening and closing valve Va corresponding to the vacuum chamber C is switched to the open state. When the internal pressure (vacuum degree) of the selected vacuum chamber C becomes the predetermined lower reference 値CRL, the second vacuum chamber C is next selected, and only the corresponding opening and closing valve Va is switched to the open state. In this order, all the vacuum chambers C in the storage FOUP 4 are decompressed into the lower reference 値CRL. Here, the operation of decompressing the lower pressure reference CRL from which vacuum chamber C is first applied may be formed as a LUT which is preliminarily made to specify the priority of the vacuum chamber C, and the control unit 10 determines the processing order based on the LUT. Composition. (Vacuum Storage Mode) After the pressure determination unit 13 determines that the internal pressure (vacuum degree) of any of the vacuum chambers C in the FOUP 4 is in the predetermined upper reference 値CR Η, the valve opening and closing operation unit is in operation. 1 5 The appropriate opening and closing valve Va is opened, whereby the internal pressure (vacuum degree) of the vacuum chamber C is restored to -19-201144187 to form the lower reference 値CRL. As a result, the internal portions of all the vacuum chambers C are often substantially maintained within the range from the lower reference 値CRL to the upper reference 値CRH. (Delivery preparation mode) When the operator sets a certain vacuum chamber C to the delivery preparation mode by the input device 20, the appropriate opening and closing valve Va is switched to the internal pressure (vacuum degree) of the vacuum chamber C. Open state. When the vacuum chamber C is depressurized to the lower reference 値CRL by switching the opening and closing valve V a to the open state, the opening and closing valve Va is immediately closed, and then an appropriate inert gas or dry air supply path Rp is opened and closed. The valve Vb is opened, thereby introducing an inert gas or dry air to the appropriate vacuum chamber C and FOUP4. Fig. 1 shows a state in which the third vacuum chamber C3 is set to the outbound preparation mode. In addition, a pressure gauge suitable for determining the pressure in the vicinity of the atmospheric pressure in each vacuum chamber C is provided separately from the pressure sensor PS, and is formed to be stored in the storage system in the determination result of the pressure gauge. The air pressure in the region may be a configuration in which the opening and closing valve Vb is closed at a time when the pressure is substantially the same. Next, when the cover member CL of the appropriate vacuum chamber C is opened, the FOUP 4 filled with the inert gas or the dry air can be smoothly taken out. (Flow of sealing or the like) In the case of the vacuum chamber C set to the vacuum storage mode, the pressure reduction by the vacuum decompressing devices P and 5 is not obtained, and the pressure determining unit 13 obtains the pressure. When the result of the determination does not reach the lower reference point 値cRL, the opening/closing valve Va of the appropriate pressure reducing path Rd is blocked by the emergency -20-201144187 countermeasure, and a warning such as "must check the degree of sealing" is issued, The inert gas or the dry air fills the vacuum chamber C and the FOUP 4 to switch the opening/closing valve Vb of the appropriate inert gas or dry air supply path Rp to an open state. [Examples] Table 1 shows how the atmospheres of the storage objects stored in the storage are different from each other between the storage system by the conventional rinsing and the vacuum storage system of the present invention. Experimental results. [Table 1] N2 flushing (10 liters/min) Storage vacuum extraction + storage time (minutes) Oxygen concentration (%) Humidity (%) Oxygen concentration (%) Humidity (%) 0 20.6 37.0 20.6 35.7 5 4.15 14.5 0.074 0.8 10 0.732 8.3 0.074 0.8 In the storage of the conventional N2 flushing described on the left side of the table, the vacuum chamber is not used, and the N 2 gas is injected into the F Ο at a flow rate of 10 L/min by the introduction of 埠4b. UP 4, whereby the internal air is flushed. On the other hand, in the vacuum storage according to the present invention, the FOUP 4 housed in the vacuum chamber C is used for decompression and vacuum storage by the method described in the above embodiment. As shown in Table 1, the exposure atmosphere gas concentration after the start of the N2 flushing by the storage system is 4.15 % 'humidity is 14.5%, and the humidity is 14.5%. In the vacuum storage system, the oxygen concentration in the exposure atmosphere after the pressure reduction was started for 5 minutes was 0.074%, and the humidity was 〇 - 8% -21 - 201144187. It can be seen that in the vacuum storage system obtained by the present invention, the pair can be obtained. The storage object such as the wafer 2 is a very favorable atmosphere. It can be seen that after 10 minutes from the start of N2 rinsing or decompression, in the conventional N2 rinsing by the storage system, the oxygen concentration is 〇.73 2% 'the humidity is 8.3%, and a clearer atmosphere can be obtained. Gas, but did not reach the result of the oxygen storage system obtained by the present invention having an oxygen concentration of 0.074% and a humidity of 0.8%. (Other Embodiments) <1> The auxiliary vacuum chamber 5 may be omitted, and the pressure reducing path Rd of each vacuum chamber C may be directly connected to the suction port of the vacuum pump P. <2> In the vacuum storage mode, the pressure reduction by the vacuum decompression devices P and 5 is not performed based on the determination result obtained by the vacuum degree determination means provided in the vacuum chamber C, but may be performed with the vacuum chamber C. The internal pressure measurement is carried out irrespective of the configuration in which the vacuum decompression devices P and 5 are decompressed each time a predetermined period of time is set. <3> In the vacuum storage mode The inert gas or dry air supply path Rp of the vacuum chamber C which is depressurized to a predetermined vacuum level by the vacuum decompressing devices P, 5 may be continued by the vacuum decompressing devices P, 5 The pressure reduction is performed while opening, and the gas remaining in the vacuum chamber C and the storage container 4 (residual gas flushing) can be carried out by inert gas or dry air while maintaining a certain degree of vacuum. , the residual gas flushing can also The internal pressure (vacuum degree) is restored to the lower reference 値CRL in an arbitrary vacuum chamber C, and is performed every time the opening and closing valve Va is reopened -22-201144187. Alternatively, it may be internal to the vacuum chamber C. The pressure (trueness) is irrelevant, and the residual gas flushing is repeated only at regular intervals. <4> The opening and closing valve Va of the vacuum chamber C set in the preparation mode described above may be temporarily switched. In the open state, the pressure is reduced to the lower reference 値CRL, and the opening/closing valve Vb of the appropriate inert gas or dry air supply path Rp is immediately opened, thereby introducing inert gas or drying to the appropriate vacuum chamber C and FOUP4. However, the valve Va of the vacuum chamber C set to the delivery preparation mode is formed to be in operation in the vacuum storage mode, and is waiting for the opening and closing valve Va to be locked to the lower reference 値 CRL recovery. In this case, the opening and closing valve V a is closed after the completion, and the opening/closing valve Vb of the inert gas or the dry air supply path Rp is opened. <5> The storage container (FOUP or the like) does not necessarily have to be It is necessary to provide a weir with a check valve. If it is provided with a gas control chamber that allows the inside of the gas to move outward and the gas to move from the outside to the inside according to the pressure difference between the inside and the outside, for example, it is controlled by the gas provided in the FOUP4. In other words, the first check valve and the second check valve are provided, and are opened to the inside or the outside according to the pressure difference between the inside and the outside, and are held in the lock by the elastic means without the pressure difference. Alternatively, a single or a plurality of through holes may be provided in a part of the wall portion of the storage container surrounded by the wall portion, and the gas may be allowed to move from the inside to the outside by the pressure difference between the inside and the outside. A microfilter or the like of the gas control film that moves outside is externally sealed to constitute the through hole. <6> Fig. 2 shows a vacuum chamber in which a plurality of FOUPs 4 can be accommodated at the same time
空 庫 而 性 適 態 開 下 恢 徑 有 由 的 取 力 壓 在 複 部 量 C X -23- 201144187 之例。該真空腔室Cx係由：具有可設置複數FOUP4的棚架 狀設置空間的容器本體17a;及將容器本體17a的前面作開 閉的蓋構件17b所構成。蓋構件17b係藉由被線材W予以連 結的升降裝置18，形成爲可切換爲··可將FOUP4作取出放 入操作的開放狀態、及關閉設置空間的閉鎖狀態。在閉鎖 狀態下，以內部被保持爲氣密狀態的方式，在容器本體 17a與蓋構件17b之間配置有密封構件（未圖示）。此外， 在蓋構件1 7b係以氣密狀設有用以可透視內部的玻璃窗。 其中，以棚架所隔開的上下空間彼此、或上下各空間 內的各部彼此係呈氣體可經常自由往來彼此的連通狀態。 此外，在容器本體17a的內部設置FOUP4時，以FOUP4的排 出埠4a與導入埠4b不會被容器本體17a的地板面等所閉鎖 的方式，在設於容器本體17a的內部的棚架狀的設置空間 係水平舖設有網篩狀或烤架狀等的FOUP支持構件19。 如第3圖所示，在排出埠4a係介裝有僅容許超過預定 壓力的氣體排出、不容許氣體進入的第1止回閥24 a，在導 入埠4b係介裝有僅容許超過預定壓力的氣體進入、不容許 氣體排出的第2止回閥24b »在排出埠4a與導入埠4b的各止 回閥24a、24b的內側係配置有一面防止塵埃侵入至FOUP4 內一面解決FOUP4之內外氣壓差的微量過濾器25。但是， 亦可省略微量過濾器25。 在容器本體17a的頂棚架部等設置有將容器本體17a的 內部與外部形成爲連通狀態的主配管30。在主配管30係並 聯連接有：用以排出置換操作容器17的內部既有氣體的第 -24 - 201144187 1支管3 1、用以對置換操作容器丨7的內部供給惰性氣體或 乾燥空氣的第2支管32、及用以將置換操作容器17的內部 作大氣開放的第3支管33。 在第1支管31的另一端連接有真空泵等真空減壓裝置p ，在第2支管32的另一端連接有氮氣筒等惰性氣體或乾燥 空氣供給手段7。 在第1支管31中的真空減壓裝置P更爲上游側、第2支 管32中的惰性氣體或乾燥空氣供給手段7更爲下游側、及 第3支管33的開放端部附近，係配置有可將各支管的氣體 流路作開閉切換的第1開閉閥V 1、第2開閉閥V2、第3開閉 閥V3。 如第4圖之例示’在容器本體17a的頂棚架部等，設有 低壓側壓力感測器S1與高壓側壓力感測器S2來作爲用以檢 測容器本體1 7a的內部壓力的壓力感測器。 此外，在各個真空腔室Cx係連接有可根據低壓側壓力 感測器S 1與高壓側壓力感測器S 2的壓力檢測値來執行3個 開閉閥V 1、V2、V3的開閉控制的控制單元40。控制單元 40係維持在閉鎖蓋構件17b的狀態下，基本上將第2開閉閥 V2保持在閉鎖狀態下而僅將第1開閉閥VI開放，將正在收 納FOUP4中的真空腔室Cx的內部藉由真空減壓裝置P而保 持在預定的真空位準（真空保管模式）的真空保管體制， 進行僅在將適當的FOUP4從保管系統出庫時（出庫準備模 式）的出庫準備時期，爲了以惰性氣體或乾燥空氣充滿 FOUP4而將適當的真空腔室Cx的第1開閉閥VI閉鎖，而將 -25- 201144187 第2開閉閥V2切換成開放狀態的控制。 亦即，若僅開放第1開閉閥V 1來作爲真空保管模式的 一操作時，如第4圖（a)所示，藉由利用真空減壓裝置P 所爲之置換操作容器17的內部的減壓操作，FOUP4的內部 的氣體（空氣或氧）會透過第1止回閥24a而被排氣，因此 FOUP4的內部亦同樣地被減壓化。 接著，若僅開放第2開閉閥V 2來作爲出庫準備模式時 ，如第4_ ( b)所示，藉由氣體供給裝置16而被導入至容 器本體17a內部的N2氣體亦透過第2止回閥24b而進入至 FOUP4的內部，因此藉由FOUP4的內部的惰性氣體（N2 ) 或乾燥空氣所爲的置換操作即結束。置換結束後將第2開 閉閥V2閉鎖，而將第3開閉閥V3開放，藉此真空腔室形成 爲大氣壓力，之後進行蓋部的開閉。 控制單元40係根據低壓側壓力感測器S 1的壓力檢測値 來判定在真空保管模式下將第1開閉閥V 1保持爲開放狀態 的繼續期間，根據高壓側壓力感測器S2的壓力檢測値來判 定在出庫準備模式下將第2開閉閥V2保持爲開放狀態的繼 續期間。 其中，亦可形成爲控制單元40在真空保管模式之前亦 執行FOUP4對真空腔室Cjc的收納的形態來實施。此時，亦 可爲僅執行藉由升降裝置8而將蓋構件17b形成爲閉鎖狀態 的操作的形態’或者，亦可形成爲設置將由上游的製程裝 置等所被傳送而來的FOUP4收納在真空腔室Cx的機器人（ 未圖示）等，包含藉由該機器人所爲之FOUP4的收納操作 -26- 201144187 而由控制單元4〇執行的形態來實施。 <7>在第2圖〜第4圖的實施形態中，藉由在氮氣筒等 惰性氣體或乾燥空氣供給手段7設置調溫裝置，使得比置 放有真空腔室Cx的室內氣溫更爲充分高溫或低溫的惰性氣 體或乾燥空氣被供給至FOUP4，若在容器本體丨7a的內部 等設置用以檢測被收納在真空腔室Cx的FOUP4的表面溫度 的溫度感測器，可藉由利用該溫度感測器所得的溫度檢測 結果來判定暫時被減壓的F Ο U P 4的內部是否由充分量的惰 性氣體或乾燥空氣所充滿。因此，亦可構成爲控制單元40 根據藉由該溫度感測器所得的檢測結果來將第2開閉閥V 2 閉鎖。 <8>亦可構成爲：在各個FOUP4設置用以檢測FOUP4 的內部氣壓的壓力感測器、及用以將該壓力感測器的輸出 訊號連同FOUP 4的ID資訊一起傳送的送信手段，控制裝置 20根據由該送訊手段所接收到的壓力檢測結果，而將第1 開閉閥V 1及第2開閉閥V2閉鎖。 <9>或者，在第2圖〜第4圖的實施形態中，雖於圖中 未顯示，亦可在容器本體l7a的頂棚架部等並置：使容器 本體17a的內部透過氣體排出用的開閉閥Van而與第1圖的 主減壓路徑RdT (排氣路徑）相連通的第1配管；及使容器 本體17a的內部透過氣體供給用的開閉閥Vbn而與第1圖的 主供給路徑RpT (供給路徑）相連通的第2配管。在此，在 第1圖的主減壓路徑RdT (排氣路徑）與主供給路徑RpT ( 供給路徑）並聯連接有複數真空腔室C X。此外，此時’省 -27- 201144187 略低壓側壓力感測器s 1與高壓側壓力感測器S2，與第1圖 的形態同樣地，若在各個容器本體1 7a的頂棚架部等設置 用以檢測真空腔室Cx內的壓力（真空度）的單一壓力感測 器即可。 亦即，若根據來自控制單元1 0的指令（真空保管模式 )，氣體排出用的開閉閥Van被開放時，存在於真空腔室 Cx內的全部FOUP4的內部的空氣等係經由容器本體7a與主 減壓路徑R d T而被排出。此外，若根據來自控制單元1 〇的 指令（出庫準備模式），氣體供給用的開閉閥Vbn被開放 時，經由主供給路徑RpT，惰性氣體或乾燥空氣供給手段7 的N2氣體被導入至所有FOUP4的內部。 <1〇>藉由本發明所得之保管系統並不限於屬於晶圓收 納容器的FOUP4 (工程內/工程間搬送容器），亦可適用 於FOSB (工廠間搬運容器）及屬於200mm晶圆收納容器的 SMIF-POD、且在曝光裝置所被使用的光罩或遮罩的保管 容器（殼體）等。 <11>真空腔室並不一定必須構成爲可同時收納複數保 管容器（FOUP等），亦可構成爲可僅收納單一的保管容 器。 <12>在保管容器（FOUP等）設置複數個附有第i止回 閥的排出埠亦可，同樣地，亦可設置複數個附有第2止回 閥的導入埠。 [產業上利用可能性] -28- 201144187 可作爲改善具備有··可以密閉狀收納保管對象物，i 具備有根據內外的壓力差而容許氣體由內部朝外部移觀^胃 氣體由外部朝內部移動的氣體控制埠的保管容器；及胃M 述保管容器供給惰性氣體或乾燥空氣的惰性氣體或乾燥@ 氣供給手段的保管系統及保管方法的技術來加以利用。 【圖式簡單說明】 第1圖係顯示本發明之保管系統的槪略構成圖。 第2圖係顯示本發明之其他實施形態所得之保管系統 的槪略構成圖。 第3圖係顯示保管容器（FOUP)的主要部位的剖面圖 〇 第4圖係顯示第2圖之保管系統所得之作用的略圖。 【主要元件符號說明】 2 :矽晶圓 4 : FOUP (保管容器） 4a :排出璋 4b :導入埠 5:輔助真空腔室（真空減壓裝置） 7 :惰性氣體或乾燥空氣供給手段 1 〇 ··控制單元 1 2 :模式判定部（控制裝置單元：真空保管模式/出 庫準備模式） -29- 201144187 1 3 :壓力判定部（控制裝置單元） 1 4 :運轉控制部（控制裝置單元） 1 5 :閥開閉操作部（控制裝置單元） 17a :容器本體 17b :蓋構件 1 8 :升降裝置 19 : FOUP支持構件 20 :輸入裝置 24a :第1止回閥 24b :第2止回閥 25 :微S過濾器 3 0 :主配管 31 :第1支管 32 :第2支管 33 :第3支管 40 :控制單元 C ：真空腔室（Cl、C2...Cn、Cx) CV :逆止閥 P:真空泵（真空減壓裝置） PS:壓力感測器（PS1、PS2、...ΡΒη、SI、S2，真空 度判定手段）The empty reservoir and the appropriate state of the recovery path have the force of the pressure in the complex amount C X -23- 201144187. The vacuum chamber Cx is composed of a container body 17a having a scaffolding space in which a plurality of FOUPs 4 can be disposed, and a lid member 17b that opens and closes the front surface of the container body 17a. The lid member 17b is formed by the elevating device 18 connected by the wire W, and is switchable to an open state in which the FOUP 4 can be taken out and placed, and a closed state in which the installation space is closed. In the locked state, a sealing member (not shown) is disposed between the container body 17a and the lid member 17b so that the inside is kept in an airtight state. Further, the cover member 17b is airtightly provided with a glazing for seeing the inside. Among them, the upper and lower spaces separated by the scaffolding, or the respective parts in the upper and lower spaces are in a state in which the gas can be freely communicated with each other. In addition, when the FOUP 4 is provided in the inside of the container main body 17a, the discharge port 4a of the FOUP 4 and the introduction port 4b are not blocked by the floor surface of the container body 17a, and are placed in a rack-like shape provided inside the container body 17a. The installation space is horizontally laid with a FOUP support member 19 such as a mesh or a grill. As shown in Fig. 3, the discharge port 4a is provided with a first check valve 24a that allows only gas exceeding a predetermined pressure to be discharged, and does not allow gas to enter, and the introduction port 4b is only allowed to exceed a predetermined pressure. The second check valve 24b that enters the gas and does not allow the gas to be discharged is disposed inside the check valves 24a and 24b of the discharge port 4a and the introduction port 4b, and prevents the dust from entering the FOUP4 while solving the gas pressure inside and outside the FOUP4. Poor microfilter 25. However, the microfilter 25 can also be omitted. The main pipe 30 in which the inside and the outside of the container body 17a are in communication with each other is provided in the ceiling portion of the container body 17a. The main pipe 30 is connected in parallel with a pipe - 3 - 201144187 1 pipe 3 1 for discharging the internal gas of the replacement operation container 17, and a supply of inert gas or dry air to the inside of the replacement operation container 7 The two branch pipes 32 and the third branch pipe 33 for opening the inside of the replacement operation container 17 to the atmosphere. A vacuum decompression device p such as a vacuum pump is connected to the other end of the first branch pipe 31, and an inert gas such as a nitrogen gas cylinder or a dry air supply means 7 is connected to the other end of the second branch pipe 32. The vacuum decompression device P in the first branch pipe 31 is disposed on the upstream side, the inert gas or the dry air supply means 7 in the second branch pipe 32, and the vicinity of the open end of the third branch pipe 33. The gas flow path of each branch pipe can be opened and closed by the first opening and closing valve V1, the second opening and closing valve V2, and the third opening and closing valve V3. As illustrated in Fig. 4, 'the low-side pressure sensor S1 and the high-pressure side pressure sensor S2 are provided as the pressure sensing for detecting the internal pressure of the container body 17a in the ceiling portion of the container body 17a or the like. Device. Further, in each of the vacuum chambers Cx, the opening and closing control of the three on-off valves V1, V2, and V3 is performed in accordance with the pressure detection 値 of the low pressure side pressure sensor S1 and the high pressure side pressure sensor S2. Control unit 40. In the state in which the lid member 17b is closed, the control unit 40 basically holds the second opening and closing valve V2 in the locked state, and opens only the first opening and closing valve VI, and borrows the inside of the vacuum chamber Cx that is being housed in the FOUP 4. In the vacuum storage system in which the vacuum decompression device P is held in a predetermined vacuum level (vacuum storage mode), the storage preparation period is performed only when the appropriate FOUP 4 is taken out from the storage system (outbound preparation mode), in order to use an inert gas. Alternatively, the dry air is filled in the FOUP 4, and the first opening/closing valve VI of the appropriate vacuum chamber Cx is blocked, and the second opening/closing valve V2 of -25-201144187 is switched to the open state control. In other words, when only the first opening and closing valve V1 is opened to operate as the vacuum storage mode, as shown in FIG. 4(a), the inside of the operation container 17 is replaced by the vacuum decompressing device P. Under the pressure reduction operation, the gas (air or oxygen) inside the FOUP 4 is exhausted through the first check valve 24a, so that the inside of the FOUP 4 is also decompressed in the same manner. Then, when only the second opening and closing valve V 2 is opened to be in the delivery preparation mode, as shown in the fourth (b), the N2 gas introduced into the inside of the container body 17a by the gas supply device 16 also passes through the second check. Since the valve 24b enters the inside of the FOUP 4, the replacement operation by the inert gas (N2) inside the FOUP 4 or the dry air is completed. After the completion of the replacement, the second opening and closing valve V2 is closed, and the third opening and closing valve V3 is opened, whereby the vacuum chamber is formed at atmospheric pressure, and then the lid portion is opened and closed. The control unit 40 determines the continuation period in which the first opening and closing valve V 1 is kept in the open state in the vacuum storage mode based on the pressure detection 値 of the low pressure side pressure sensor S1, and detects the pressure according to the high pressure side pressure sensor S2. Then, the continuation period in which the second on-off valve V2 is kept in the open state in the delivery preparation mode is determined. However, it is also possible to implement the configuration in which the control unit 40 also performs storage of the vacuum chamber Cjc by the FOUP 4 before the vacuum storage mode. In this case, it is also possible to perform the operation of merely forming the lid member 17b in the locked state by the lifting device 8 or to provide the FOUP 4 to be conveyed by the upstream processing device or the like in the vacuum. The robot (not shown) or the like of the chamber Cx is implemented by the control unit 4A by the storage operation -26-201144187 of the FOUP 4 by the robot. <7> In the embodiment of Fig. 2 to Fig. 4, the temperature control device is provided by an inert gas such as a nitrogen gas cylinder or a dry air supply means 7, so that the temperature in the room where the vacuum chamber Cx is placed is more A high-temperature or low-temperature inert gas or dry air is supplied to the FOUP 4, and a temperature sensor for detecting the surface temperature of the FOUP 4 housed in the vacuum chamber Cx is provided inside the container body 7a, etc., by utilizing The temperature detection result obtained by the temperature sensor determines whether the inside of the F Ο UP 4 which is temporarily decompressed is filled with a sufficient amount of inert gas or dry air. Therefore, the control unit 40 may be configured to lock the second on-off valve V 2 based on the detection result obtained by the temperature sensor. <8> may be configured such that a pressure sensor for detecting the internal air pressure of the FOUP 4 and a transmission means for transmitting the output signal of the pressure sensor together with the ID information of the FOUP 4 are provided in each FOUP 4; The control device 20 closes the first opening/closing valve V1 and the second opening/closing valve V2 based on the pressure detection result received by the transmitting means. <9> or in the embodiment of Figs. 2 to 4, although not shown in the drawings, the ceiling portion of the container main body 17a or the like may be placed in parallel with the inside of the container main body 17a. a first pipe that communicates with the main pressure reducing path RdT (exhaust path) of FIG. 1 and an open/close valve Vbn for supplying gas inside the container body 17a and the main supply path of FIG. The second pipe in which the RpT (supply path) is connected. Here, a plurality of vacuum chambers C X are connected in parallel to the main decompression path RdT (exhaust path) in Fig. 1 and the main supply path RpT (supply path). In addition, at this time, the province -27-201144187, the low pressure side pressure sensor s 1 and the high pressure side pressure sensor S2 are provided in the ceiling portion of each of the container bodies 17a, as in the first embodiment. A single pressure sensor for detecting the pressure (vacuum degree) in the vacuum chamber Cx may be used. In other words, when the opening/closing valve Van for gas discharge is opened in accordance with an instruction from the control unit 10 (vacuum storage mode), air or the like inside all of the FOUPs 4 in the vacuum chamber Cx is passed through the container body 7a. The main decompression path R d T is discharged. When the gas supply opening/closing valve Vbn is opened in accordance with the command from the control unit 1 (outlet preparation mode), the N2 gas of the inert gas or dry air supply means 7 is introduced to all of the FOUPs 4 via the main supply path RpT. internal. <1〇> The storage system obtained by the present invention is not limited to the FOUP 4 (in-engine/inter-project transfer container) belonging to the wafer storage container, and may be applied to FOSB (inter-plant transfer container) and 200 mm wafer storage. The SMIF-POD of the container, the storage container (housing) of the mask or the mask used in the exposure apparatus, and the like. <11> The vacuum chamber does not necessarily have to be configured to accommodate a plurality of storage containers (FOUP or the like) at the same time, and may be configured to accommodate only a single storage container. <12> It is also possible to provide a plurality of discharge ports with the i-th check valve in a storage container (FOUP or the like), and similarly, a plurality of introduction ports with a second check valve may be provided. [Industrial use possibility] -28- 201144187 It is possible to improve the storage and storage of the object, and it is possible to allow the gas to be moved from the inside to the outside according to the pressure difference between the inside and the outside. The storage container for the moving gas control port; and the technique for storing the inert gas of the inert gas or the dry air or the storage system and the storage method of the dry @ gas supply means in the storage container. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic block diagram showing a storage system of the present invention. Fig. 2 is a schematic block diagram showing a storage system obtained in another embodiment of the present invention. Fig. 3 is a cross-sectional view showing a main part of a storage container (FOUP). Fig. 4 is a schematic view showing the action obtained by the storage system of Fig. 2. [Description of main component symbols] 2 : 矽 Wafer 4 : FOUP (storage container) 4a : Discharge 璋 4b : Introduction 埠 5 : Auxiliary vacuum chamber (vacuum decompression device) 7 : Inert gas or dry air supply means 1 〇 - Control unit 1 2 : Mode determination unit (control device unit: vacuum storage mode / delivery preparation mode) -29- 201144187 1 3 : Pressure determination unit (control unit) 1 4 : Operation control unit (control unit) 1 5 : valve opening and closing operation unit (control device unit) 17a : container body 17b : cover member 18 : lifting device 19 : FOUP supporting member 20 : input device 24 a : first check valve 24 b : second check valve 25 : micro S Filter 30: Main pipe 31: First branch pipe 32: Second branch pipe 33: Third branch pipe 40: Control unit C: Vacuum chamber (Cl, C2, ..., Cn, Cx) CV: Check valve P: Vacuum pump (Vacuum decompression device) PS: Pressure sensor (PS1, PS2, ...ΡΒη, SI, S2, vacuum degree determination means)
Rd :減壓路徑（Rdl、Rd2…Rdn，排氣路徑）Rd : Decompression path (Rdl, Rd2...Rdn, exhaust path)
RdT :主減壓路徑RdT: main decompression path
Rp :惰性氣體或乾燥空氣供給路徑（Rpl、Rp2...Rpn) -30- 201144187 s 1 :低壓側壓力感測器 S 2 :高壓側壓力感測器Rp: inert gas or dry air supply path (Rpl, Rp2...Rpn) -30- 201144187 s 1 : low pressure side pressure sensor S 2 : high pressure side pressure sensor
Va :氣體排出用的開閉閥（Val、Va2··. Van ) Vb :氣體供給用的開閉閥（Vbl、Vb2...Vbn) V 1 :第1開閉閥 V 2 :第2開閉閥 V 3 :第3開閉閥 W :線材 -31 -Va: On-off valve for gas discharge (Val, Va2··. Van) Vb: On-off valve for gas supply (Vbl, Vb2, ..., Vbn) V 1 : First on-off valve V 2 : Second on-off valve V 3 : 3rd opening and closing valve W: wire -31 -