TW201142175A - Far infrared ceramic light bulb structure - Google Patents

Abstract

A far infrared ceramic light bulb structure comprises a lighting component, a ceramic substrate, a far infrared thermal radiation layer, a circuit unit, a lamp housing, a lamp hood, and a connector. The far infrared thermal radiation layer and the lighting component are respectively formed on upper and lower surfaces of the ceramic substrate. The circuit unit is located in the connector and is electrically connected to the lighting component and the connector for supply of electrical power. The lamp hood encloses the lighting component and the ceramic substrate. The lamp shell is coupled to the connector to enclose the far infrared thermal radiation layer. The connector is to connect to an external power source. The far infrared thermal radiation layer transmits the heat generated by the lighting component to the outside of the lamp hood in the form of far infrared thermal radiation and at the same time reduces the operation temperature of the lighting component and improves stability of light emission and lifespan of the lighting component, thereby enhancing far infrared light emission efficiency and operation safety.

Description

201142175 ... VI. Description of the Invention: [Technical Field to Be Invented by the Invention] The present invention relates to a structure of a crypto-bubble, in particular, a luminescent element reading bubble. [Prior Art] According to the foreign machine _ research, when the water molecules are subject to the financial infrared (four) Qing's, they will immediately vibrate at the speed of the milk seconds, and due to the vibration of the molecules, the vibration of the two children will be generated. The sun wheel will warm the human body, making the blood vessels slightly inflated, the blood (4) flow rate increasing, and the effect of the tissue movement of the Dal. In addition, when the moisture is generated by the far-infrared irradiation, the oxygen-bonded _, stretching, and spinning materials are used to break the hydrogen bonds between the original macromolecules to form smaller small water molecules. For example, 5 to 6 eight sons, the so-called activated water. 77 The way in which the conventional technique produces far-infrared rays—there is a lack of passive far-infrared radiation, such as printing, positive temperature _: £(pTc) or brocade. However, the job is to heat the far-infrared emitters of the lake, so that the heat energy is converted into infrared rays and emitted, so the radiation efficiency is very low, generally far below. The temperature resistance of Shishan film printing is not higher than the shoulder c, and the PTC and the coffee maker are ^ and fine. c, thus the application area and process are limited. In addition, m: and the secret silk in operation, if the _ water will (four) explosion is safe and ugly. & use the r r_w, magnetic like fine _ radiant layer / / there is a danger of explosion in contact with water to generate a far-infrared shark bulb structure, and then solve the above problems of the conventional technology. SUMMARY OF THE INVENTION The main purpose of the present invention is to make money and transfer in the ship-species far red, including 201142175

Light-emitting elements, ceramic substrate, far-infrared heat radiation layer, circuit Cuiyuan, lamp private cover and joint 'far red (four) heat spoke county and light-emitting components are divided into upper and lower wire 'electric material element threat _ and Wei miscellaneous To the illuminating element connector, the fresh-package illuminating element and the _Yu, the lamp _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The (10) component is connected by a first electrical connection to provide the power or power required to drive the smuggler. The far-infrared ray-reducing layer transmits the heat generated by the illuminating element to the outside of the lamp cover in a far-line heat-producing manner. At the same time, the operating temperature of the illuminating element can be lowered to improve the illuminating stability of the illuminating element, slow down the aging rate, and extend the use of the shovel. Limit, and thus improve the luminous efficiency and safety of far infrared rays. π 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Referring to the drawings - the schematic diagram of the far infrared ray bulb structure of the present invention. As shown in the first figure, the far-infrared, _ bubble structure of the present invention includes the light-emitting element 10, the ceramic substrate 20, the far-infrared heat radiation layer 3, the circuit unit 4, the lamp housing, and the lampshade 60. And Wei 70, for emitting light by the light-emitting element 1〇, and emitting the far-infrared rays r by the infrared heat radiation layer 30, mainly including a range between 4~4〇〇^m, especially between 6μηι and 14μηι The scope. Light emitting element 10 can include a light emitting diode (LED) wafer. The ceramic substrate 20 has an upper surface and a lower surface, and the LED wafer 1 is formed on a sapphire substrate (not shown) and is bonded to the lower surface of the ceramic substrate. The far-infrared heat radiation layer 30 is formed on the upper surface of the ceramic substrate 2A. The circuit unit 40 is located within the connector 70, and the lamp housing 50 is coupled to the connector 70 to enclose the far infrared ray 201142175 heat radiation layer 30. The lamp cover 60 surrounds the lower surface of the LED chip 1 and the ceramic substrate 2 . 70 joints are connected to the external power supply, and the second electrical connection line is connected by the first electrical connection line (not shown)* to the secret private unit, and the second electrical connection line (10) is not shown in the figure. And connected to the LED chip 1 to provide the electrical signal or power required to drive or illuminate the LED chip. ~ Far-infrared thermal light-emitting layer 3〇 includes metal non-metallic composition, including at least one of silver, copper, tin, Shao, titanium, iron and recorded, or including silver 'steel, tin, Ming, Chin, iron And at least one of the alloys, or oxides including silver, copper, tin, indium, titanium, iron, and at least the towels thereof, or oxides including at least one of carbon and carbon Or a nitride or inorganic acid compound. The lamp housing 5〇 can be made of Tauman material or acrylonitrile-butadiene-benzene bake (ABS), which is suitable for higher power and higher operating temperature applications, and fine for medium and Low power and medium and low temperature fields. The lamp cover 6G may be a translucent polycarbonate or glass. The far-infrared brain ray layer 3 〇 has a surface appearance structure, and the heat generated by the LED chip 10 and the circuit unit 4 传播 can be propagated in a difficult radiation manner to the lower surface of the substrate 20 by far infrared ray. Shown. Since the far-infrared rays R emitted by the far-infrared heat radiation 30 include a far-infrared spectrum, that is, a range of 5 μm to 18 μm, or preferably a range of 6 μm to 14 μm, the far-infrared light bulb structure of the first embodiment of the present invention is It can produce the required far infrared rays. It is to be noted that the joint 7' in the figure is represented by a joint joint, such as Ε27, but is merely used to exemplify the exemplary embodiment of the present invention, and is turned over to define the scope of the present invention, thus 'joint 7G Links to other bulbs may be included, such as £14, G4, G9, MR11 or MR16. 201142175 Reference is made to the first 'second embodiment of the far infrared ray ray bulb structure of the second embodiment of the present invention. As shown in the second figure, the far-infrared ceramic bubble structure of the second embodiment includes an LED 33 sheet, a ceramic substrate 2, a far-infrared heat radiation layer%, a circuit unit, a lamp housing 50', a lampshade 60, and a nano glaze. The heat dissipating cover 65 and the joint 70 are used to emit light by the lED wafer 10 while the second embodiment of the far infrared ray radiating layer 32 emits the far infrared ray. The second embodiment is similar to the first embodiment of the first figure, and the second embodiment. The far-infrared ray-emitting layer 32 of the figure is similar to the 帛-gate far-infrared thermal light-emitting layer 30. ’...

The main difference between the second embodiment of the soil and the first embodiment is that the far-infrared heat radiating layer 32 of the second embodiment is formed on the upper surface of the fresh crucible, that is, the upward facing surface in the second drawing. Another difference is that the lamp housing 5G is connected to the joint % to surround the upper surface of the ceramic substrate 20. Therefore, when the light emitted by the LED chip 1 is transmitted toward the lamp cover 60, the (4) two far infrared radiation layer % can be added to the cover 6 (), and the heat radiation characteristics of the far infrared heat radiation layer 32 are utilized to generate the far infrared. Light, and convey down, as shown in the far picture of the far infrared (four). At the same time, the second far-infrared thermal light-emitting layer 32 has a transmissive layer so that the light emitted by 1() penetrates and propagates downward, while having an illumination function. The left common point is that a nano-axis heat-dissipating cover 65 is disposed under the lamp housing 50, and the nano-glaze heat-dissipating cover 65 and the lamp housing 5 〇 surround the upper surface of the ceramic substrate 2, wherein the nano-sleeve heat sink & It is formed by sintering of nano particles, including rice oxidized 35, nitrogen, oxygen, and gasification #5. In addition, the nano glaze heat-dissipating cover 65 has a plurality of heat-dissipating holes π, and the lamp housing is provided in the opening of the heat-dissipating hole to enhance the heat-dissipating efficiency by air convection. In the figure, the 3-meter sleeve heat-dissipating cover 65 is not connected to the shaft plate, but is not limited to this, but the present invention is also limited to the wire plate 2 amp. You can ride the second _ Fu straight through hole, but it should be noted that the straight tubular through hole of the 201142175 two figure is only (4) to illustrate the example of the hair, so the vent 67 can be other types, such as The three figures show a heat dissipation hole 67A having a bent through hole, a heat dissipation hole 67B having a bent hole, or a heat dissipation hole 67C having a straight tubular hole. Refer to the fourth®, the intention of the three-way far infrared _ 泡 bubble structure. As shown in the fourth figure, the far-infrared ray light bulb structure of the third embodiment includes an LED chip 1 〇, a ceramic substrate 2 〇, a far-infrared heat radiation layer 32, a thermal light-radiating heat-dissipation layer 34' circuit unit 40, and a lamp housing. 50. The lampshade 6 〇, the nano glaze heat-dissipating cover and the joint %, use the 遂 infrared heat radiation layer 32 to emit the required far-infrared ray, and use the heat radiation heat-dissipating layer 34 to generate the heat radiation Ri to enhance the heat dissipation efficiency. The third embodiment of the fourth figure is similar to the second embodiment of the second figure, wherein the far infrared ray thermal layer 32 of the fourth figure has the same features as the far infrared ray heat radiation layer 32 of the second figure, and the fourth The nano glaze heat dissipation cover 65 of the figure is identical to the nano shaft heat dissipation cover 65 of the second figure. Therefore, the details of the same function will not be described here. The main difference between the third embodiment of the fourth figure and the second embodiment of the second figure is that the thermal light-emitting heat dissipation layer 34 of the third embodiment is formed under the ceramic substrate 2〇. The P surface 'and the LED wafer 1 are bonded to the thermal light-emitting heat sink layer 34 by means of silver paste, wherein the heat radiation heat dissipation layer 34 has the same composition as the far-infrared heat radiation layer 32 of the second figure. The heat-radiating heat-dissipating layer 34' receives heat generated by the LED wafer 1 and is thermally radiated to the nano-glaze heat-dissipating cover 65, such as the heat radiation ri in the figure. Referring to Fig. 5, there is shown a schematic view of a structure of a far infrared ray ceramic bulb according to a fourth embodiment of the present invention. The far-infrared ceramic bulb structure of the fourth embodiment of the present invention comprises a light-emitting element 10, a ceramic substrate 20, a far-infrared heat radiation layer 3, a circuit unit 4, a lamp housing 5, a lamp cover 60 and a joint 70 for borrowing a light-emitting element. 1〇 emits light while using the far-infrared heat radiation layer 30 to emit far-infrared rays R' mainly consisting of a range between 4 and 4 μm, especially between 6 μm and 14 μm. 201142175 The fourth embodiment of the fifth figure is similar to the first embodiment, and the main difference between the fourth embodiment of the fifth figure and the first embodiment of the first figure is that the far-infrared heat radiation layer 30 times is placed under the enamel plate 2, and above the illuminating element 10, the slit generated by the circuit unit 40 is directly propagated downward with far infrared rays, that is, the far far infrared ray R shown in the figure. Referring to the eighth drawing, the display of the far-infrared ray bulb structure of the fifth embodiment of the present invention is shown. The far infrared ray lamp of the fifth embodiment of the present invention comprises a light-emitting element 10, a ceramic pocket substrate 20, a first heat-layer 36, a second woven layer 38, a circuit unit 4, a lamp housing 50, a fresh 60 and a joint 7G. The light-emitting element 1G emits light while the far-infrared heat radiation layer 3G is used to emit the far-infrared ray scale, mainly including a range between 4 and 400 μm, in particular, a range between —μηι. The fifth embodiment of the sixth embodiment is similar to the combination of the first embodiment of the first figure and the fourth embodiment of the fifth figure. The main difference is that the first heat enthalpy layer is disposed on the Tauman substrate 20. Above, the second heat radiation layer 38 is disposed under the ceramic substrate 2〇 and above the light-emitting element 1G, and the heat generated by the circuit unit 4G is propagated downward by far infrared rays, that is, the far-infrared rays R shown in the figure are downward. . The invention is mainly characterized in that the paste far infrared heat radiation layer absorbs the heat of the light emitting element and the circuit unit to generate far infrared rays, and operates at the normal temperature without additional heat treatment and device, thereby avoiding the high temperature operation. The dangers and shortcomings 'to improve the safety of use. Another feature of the present invention is that the 'far-infrared thermal light-emitting layer has a heat-radiating heat-dissipating effect' can reduce the operating temperature of the light-emitting element, that is, the temperature of the LED chip, thereby improving the wire and the hair field of the LED W, thereby Improve the efficiency of the overall far infrared ray emission. Another feature of the present invention is that the nano-glaze heat-dissipating cover provides an in-step heat-dissipating effect, and the nano-glaze heat-dissipating cover has a heat-dissipating hole, and the air-to-flow effect in the heat-dissipating hole can be utilized, and the reinforcing wire can be further advanced. Step to lower the operating temperature of the LED. The above-mentioned aspects are the actual details of the county (4). It is not intended to limit the prisoner's sentence to the prisoner's. Anyone who has made any (4) or change in this (4) under the spirit of the invention of the marriage includes It is intended to be within the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a schematic view of the structure of the far-infrared light bulb of the first embodiment of the present invention. The second figure is a schematic diagram of a far-infrared-bubble structure according to a second embodiment of the present invention. The third figure is a schematic view of another type of heat dissipation holes in the second figure. The fourth figure is a schematic diagram of the far infrared_bubble structure of the third embodiment of the invention. The fifth figure is a schematic diagram of the structure of the fourth real-time far-infrared shunting light bulb of the present invention. The sixth figure is a schematic diagram of the fifth real drama far infrared bubble structure of the present invention. [Main component symbol description] 10 light-emitting element (LED chip) 2 〇 ceramic substrate 30 far-infrared thermal ray-control layer • 32 far-infrared heat radiation layer 34 heat radiation heat dissipation layer 36 first heat radiation layer 38 second heat radiation layer 40 circuit Unit 50 lamp housing 60 lamp cover 65 nano glaze cooling 篕 67 cooling hole 201142175 67A cooling hole 67B cooling hole 67C cooling hole 70 connector R far infrared R1 thermal radiation R2 far infrared

Claims (1)

201142175 VII. Patent application scope: 1. A far-infrared shunt bulb structure, comprising: a ceramic substrate having an upper surface and a lower surface; x a ir, formed on a sapphire substrate, and coupled to the Tauman substrate a lower surface; j'·布线热幸田射层' is formed on the upper surface of the ceramic substrate having a surface microstructure and comprising a metal non-metal composition; a circuit unit; a lamp housing; the lamp cover package SI a light-emitting element and a lower surface of the Tauman substrate; and a connector 'connecting the lamp housing to (4) the upper surface of the wire board, and the connector is connected to an external power source; wherein the circuit is single-reading , the hybrid auxiliary - 帛 - electrical contact is connected to the 7 circuit unit to provide power, the circuit unit is connected to the optical 7L by a second electrical connection to provide the electrical required to illuminate the delivery The signal or the electric power, the infrared heat-emitting layer of the side propagates the heat-emitting element and the heat generated by the circuit unit to the lower surface of the ceramic substrate by means of thermal radiation. 2. The far-infrared ceramic bubble structure according to the scope of the patent application scope, wherein the light-emitting element comprises a light-emitting diode, and the metal-nonmetal composition of the far-infrared radiation layer comprises silver, copper, tin, and , at least one of titanium, iron and recorded, or alloys including at least one of silver, copper, tin, sau, chin, iron and tantalum, or at least one of silver, copper, m iron and recorded An oxide or a dentate, or an oxide or a nitride or a mineral acid compound comprising at least one of a collar, a carbon shell, or a propylene-butylene styrene (ABS) ) constitutes. 201142175 3. A far-infrared ceramic bulb structure, comprising: - a pottery substrate having an upper surface and a lower surface; - a luminous 7G piece, formed on the sapphire substrate and coupled to the lower surface of the shingling substrate; a circuit unit; a lamp housing 'having a plurality of openings; - a heat dissipation I' of the nano shaft is placed under the leg shell ^, and surrounds the upper surface of the ceramic substrate and the circuit unit with the miscellaneous shell, and the circuit unit Nai Zai Qian has a lot of heat dissipation The hole system corresponds to. The corresponding surface of the hot hole of the Xuan dictator, the nano glaze heat-dissipating cover is in contact with or does not contact the ceramic substrate; the lamp cover surrounds the έ 发光 illuminating element and the lower surface of the 陶曼 substrate; Facing the upper surface of the ship cover of the (10) light-emitting element, having a surface-microstructure and including a non-metallic composition, the far-infrared heat light-emitting layer and having light transmissivity 'for light transmitted by the light-emitting element; and a connector connecting the lamp housing to (4) the _ wire_ upper surface, the city connector is connected to an external power source; wherein the circuit unit is located in the connector, the connector is connected by the first-electrical connection line to provide power, The circuit unit is connected to the lower part of the lamp cover by the second electrical connection line to provide electrical signals or electric power required to drive or illuminate the light-emitting element, k, the external heat radiation layer is radiated by heat radiation The method produces far infrared rays and spreads on the surface. 4. According to the application patent, the third aspect of the patent includes the illuminating-lung ap- ▲ t 卜, _ finished bulb structure, wherein the illuminating element ^ first-pole H interesting infrared hot thin layer of metal non-gold hybrid includes An alloy of at least one of iron, iron, copper, aluminum, titanium, iron and tantalum and at least one of its alloys, or silver, 'or silver, copper, pigeon, aluminum', copper, tin, aluminum Titanium, iron and lanthanum to [S] 12 201142175 One of the oxides or halides, or an oxide niobium or inorganic acid compound comprising at least boron, carbon. 5. According to the far-infrared _:-stage bubble structure described in item 3 of the applicator, the towel-turning heat-dissipating hole includes a heat-dissipating hole having a straight tubular through hole, a remaining hole having a material-like through hole, and a straight At least one of the heat dissipation hole of the tubular hole and the heat dissipation hole of the bent hole. 6.. - Far infrared ray ceramic bulb structure, including: a ceramic substrate having an upper surface and a lower surface; - a thermal radiation dispersion formed on the surface of the shim substrate, having a surface microstructure and including a metal non-metal composition; 'a circuit unit; The 7G piece is attached to the sapphire; the S-substrate is on the upper axis, and the Lai Na is secret to the heat-light radiation layer; a lamp housing has a plurality of openings; - a nano-sleeve cover, which is placed under the horse, and The lamp housing (10) is mounted on the upper surface of the ceramic substrate (10), and the plurality of heat dissipation holes corresponding to the corresponding openings of the heat dissipation holes such as βH, the nano glaze heat dissipation cover is in contact with Or not touching the ceramic substrate; a lampshade; a far-infrared seam, the shaft is attached to the thin «photon-shaped leg cover, and has a surface microstructure and includes a metal non-metal composition, and the far-infrared heat cable layer Light transmissive for the light emitted by the light emitting element to penetrate; and a joint 'connecting the shell to (10) the upper surface of the base (4), and the joint reaches an external power source; Γ Γ wherein the circuit unit Is located in the joint, the joint borrows - the first The electrical connection line connects 13 201142175 to the 'the circuit unit borrows the second electrical connection line and connects the itir to the drive field to illuminate the money signal or power required for the neon light element, 22=transmits heat to the nai The rice shaft heats off the cover, and the far-infrared rays emit a far infrared ray in a manner of emitting it toward the lower surface of the lamp cover. Γ Y f-shaped grain tree shouting slaves, the material of the Shanguang component spoons including the silver handle ra-- and the first-攸-outer hot 11-layer metal non-metal combination must not include silver, copper, tin, Shao 'titanium, iron And at least one of 锑, or an alloy comprising at least one of silver, copper, tin, ilu mtr, or an emulsion comprising silver, copper, tin, indium, titanium, iron/, broad, medium or A halide' or an oxide or nitride or inorganic acid compound comprising at least one of carbon and carbon. 8. The far-infrared shunt bulb structure according to claim 6, wherein the heat dissipation holes comprise: a heat dissipation hole having a straight through hole, a heat dissipation hole having a bent through hole, and a straight At least one of the tubular hole _ heat dissipation system and the material hole _ vent hole. The far infrared ray light bulb, Ό structure according to the scope of claim 3 or 3 or 6 The s-light cover is made of polycarbonate or glass. 10. A far infrared ray ceramic bulb structure comprising: a ceramic substrate having an upper surface and a lower surface; the X-ray component is formed on the sapphire substrate and coupled to the lower surface of the ceramic substrate, - far infrared a thermal layer is formed (10) on the lower surface of the substrate and between the light-emitting elements 'having a surface microstructure and including a metal non-metal composition; 201142175 a circuit unit; a lamp housing; a lampshade 'encloses the a light-emitting element and a lower surface of the ceramic board; and a joint, a connecting leg and a light-faced surface, and a domain connector to an external power source; wherein the circuit unit is located at the connection, the connector is borrowed - the first An electrical connection is connected to the circuit to provide power, and the circuit unit is connected to the optical circuit by a second electrical connection to provide an electrical signal or power required to drive or to illuminate the component. The light-emitting layer transmits the heat generated by the light-emitting element and the circuit unit downward by far infrared rays by means of thermal light. 11. According to the shot, please refine the far-infrared shaft structure of the 1G item. The light-emitting element includes a light-emitting diode wafer. The metal non-metal composition of the far-infrared heat layer includes silver, copper, tin, At least one of Shao, Titanium, Iron and recorded, or alloys including at least one of silver, copper, tin, Ming, titanium, iron and recorded, or including silver, copper, tin, 35, titanium, iron and Oxidation of at least one of the oxides, or oxidation to one of (4), carbon A compound or a nitride or a sour compound, the shell is composed of a shunting material or styrene styrene (ABS). 12. A far-infrared ceramic bulb structure comprising: a ceramic substrate having an upper surface and a lower surface; - a light-emitting element formed on the sapphire substrate and coupled to a lower surface of the recording plate; a first heat a radiation layer is formed on an upper surface of the ceramic substrate; a second heat radiation layer is formed on a lower surface of the substrate and between the light emitting elements; 15 201142175 a circuit unit; a lamp housing; a lamp cover enclosing the light emitting element and a lower surface of the ceramic substrate: and a joint connecting the test case to surround the upper surface of the base (4), and connecting to an external power source; wherein the first heat radiation layer and the first The second heat radiating layer has a surface microstructure and includes a metal non-metal composition, the circuit unit is located in the joint, and the joint is connected to the circuit unit by a first electrical connection line to provide power, and the circuit unit borrows a second electrical connection is connected to the light-emitting element to provide an electrical=signal or power required to drive or illuminate the light-emitting element, the far-infrared heat radiation Heat emitted by the light emitting element and the way the heat of the circuit element produced by a single b downwardly beyond the infrared transmission. The far-infrared terrarium bulb structure according to claim 12, wherein the illuminating element comprises a luminescent diode chip, and the metal non-metal composition of the first thermal radiant layer and the second thermal radiant layer comprises At least one of silver, copper, tin, aluminum, titanium, iron, and niobium or an alloy including at least one of silver, copper, tin 'aluminum, titanium, iron, and niobium, or silver 'copper, tin, aluminum An oxide or halide of at least one of titanium, Φ, and lanthanum, or an oxide or nitride or inorganic acid compound comprising at least one of boron and carbon. The lamp envelope is made of ceramic material or Propylene-butadiene _ stupid ethylene (ABS).