201141694 六、發明說明： - - —— ------------------------------一 一 【發明所屬之技術領域】 … 本發明係關於一種沖壓基板之模具結構及其沖壓製 品，尤指一種可於沖壓一基板時，同時將該基板沖入安 裝於一承載板上之沖壓模具者。 【先前技術】 按，一般習用之沖壓基板之模具，請參閱第1圖所 示，其係設有一上模11及一下模12，其中，該上模^頂 部設有一固定夾頭111，用以安裝固定於一沖壓機（圖中 未示）上，該上模11底部則設有一沖頭，用以沖切一基 板及一承載板（圖中未示）。 該下模12設有一上承座121及一下承座122，該上、 下承座121、122中設有一供該沖頭穿設之穿孔（圖中未 示）’該上模11以複數個螺栓鎖固於該下模12之上承座 121上’該上模11與該上承座121之間設有複數個彈簧 114，用以調節沖壓之力量，該上承座121四邊分別穿設 有一定位柱13，該等定位柱13並穿設於該上承座121、 下承座122所設之定位孔115、122丨上，藉以達到定位作 用。 使用時，可將基板及承載板分別置入該上承座121、 下承座122之間的穿孔上，藉由該沖頭之沖切，使基板可 被沖切出數個基板單位（如：圓形基板單位），而承載 板上則被沖切出數個相等大小之安裝孔，嗣再將數個基 板單位安裝於承載板之安裝孔上，製成成品，以進行後 201141694 續之製作程序。 然’利用此方式沖壓基板及^載;f反，ϋ以人工將 基板單位安裝於承載板之安裝孔上，相當耗費時間及人 力，且沖ib之基板單位料遺失，而且絲板單位安裝 於承載板之絲孔上時，亦需重較位絲，相當不便 利。 【發明内容】 鑑於上述1用沖壓基板之模具所衍生的各項缺點，本 f發明人乃亟思加以改良_，並經多年苦^職潛心研 究後，終於成功研發完成本件-種沖壓基板之模具結構及 其沖壓製品。 本發明之目的，在於提供一種沖壓基板之模具結構及 其沖壓製品’以於沖壓—基板時，同時將該基板沖入安裝 於一承載板上，使作業一次完成。 為達上述之目的，本發明之技術手段在於，設有一上 模及二下模，其中，該上模頂部設有—固定夾頭，用以安 裝固疋於冲壓機上’該上模底部貞彳設有—沖頭，用以沖 切-基板及-承做；㈣下模設有—上承座、一中承座 及一下承座’該上、中、下承座中設有—供該沖頭穿設之 穿孔，該上模轉數_栓__上承座上方，該上模 與該上承座之間設有複數_性元件，用以調節沖壓之力 量’該上承座四邊分別穿設有一定位柱，該等定位柱並穿 ，於該上模、中承座、下承座所設之定位孔上，藉以達到 定位作用’該中承座與該下承座之間設有複數個彈性元 201141694 ——· -一沖壓之力量—.L使用時，可將該基板置入該上 承座、中承座之_穿孔上 座、下承座之間的穿孔上，藉由該沖頭之沖切，使基板可 被沖切出數個基板單位，及承載板上被沖切出數個相等大 小之安裝孔，同時透過該沖頭之沖壓力量，將基板單位沖 入女裝於該承載板之安褒孔上，使沖麗、安裝作業一次完 成’而能直接再進行後續之製作程序。 Φ 凊參閱以下有關本發明一較佳實施例之詳細說明及其 附圖’將可進-步瞭解本發明之技術内容及其目的功效： 【實施方式】 U本發明所提供之一種「沖壓基板之模具結構及其沖壓 製扣」，請參閱第2、3圖所示，其係設有一上模2及一下模 3其中，該上模2頂部設有一固定夾頭21，用以安裝固定 於一沖壓機（圖中未示）上，該上模2底部則設有一沖頭 22，用以沖切一基板4 (如：LED電路板）及一承載板5。 • 訂模3設有—上承細、-中承座32及-下承座33， §上中下承座31、32、33中設有一供該沖頭22穿設之 穿孔311、321、331，該上模2以複數個螺栓23鎖固於該上 承座31上方，該上模2與該上承座μ之間設有複數個彈性元 件24 (如：彈簧），用以調節沖壓之力量，該上承座幻四 邊分別穿設有一定位柱312，該等定位柱312並穿設於該上 模2、中承座32、下承座33所設之定位孔25、322、332上， 藉以達到定位作用，該中承座32與該下承座33之間設有複 數個彈性元件323 (如··彈簧），藉以調節沖壓之力量。 201141694 _ _成’請參閱第3、4、5圖所示，使用 時，可將該基板4置入該上表座31 之間的穿孔 311、321上，同時將該承載板5置入該中承座32、下承座33 之間的穿孔321、331上，藉由該沖頭22之沖切，使基板4可 被沖切出數個基板單位41 (如：圓形基板單位），及承載 板5上被沖切出數個相等大小之安裝孔η ,同時透過該沖頭 22之沖壓力量，將基板單位41沖入安裝於該承載板5之安裝 孔51上，形成一基板成品42，使沖壓、安裝作業一次完 成，而能直接再進行後續之製作程序（如：SMD製作程 序）。 如此，透過該沖頭22之沖壓力量，將基板單位41沖入 安裝於該承載板5之安裝孔51上，使沖壓、安裝作業一次完 成，而可避免前述習用需安裝該基板單位之耗費時間、人 工之缺失。 又，請參閱第6圖所示，該沖壓基板之模具結構所沖出 的沖壓製品，係由該沖壓基板之模具結構一體所沖出，該 沖壓製品包括有： 複數個基板單位41，係由該模具結構所沖出； 一承載板5，其上嵌設有該等基板單位41藉以一體成 形。 其中该承載板5上具有經由該沖壓基板41之模具結構 所分別沖出之一安裝孔51，該等安裝孔51之容置空間恰可 供該·#基板單位41嵌設安裝於其中，且該等基板單位Μ上 «又有複數個供安裝LED晶圓基座之谭接點4〗〗、連接該led晶 201141694 -------為絕緣狀絕緣層413 〇 請再參閱第2圖所示，it^3^L321^圍設有 至少二定位針324(如：三支粒針），而該基板4對應該 等定位針324之位置上，設有相配合之定位孔43，使沖壓該 基板4時，可將該基板4之定位孔仏穿設於該等定位針娜 上’ 7該基板4沖麗部分對準該沖頭22，而能準確沖出基板 單位41。 _ 丨餅細綱係針對本發明之-可行實關之具體說 明’惟該實施例並非用以限制本發明之專利範圍，凡未脫 離本發明技藝精神所為之等效實施或變更，例如：等變化 之等效性實酬，均應包含於本案之專利範圍中。 【圖式簡單說明】 第1圖為習用之正面示意圖。 第2圖為本發明之立體示意圖。 第3〜5圖為本發明之連續動作示意圖。 • 第6圖為本發明之基板成品之立體分解圖。 【主要元件符號說明】 21固定夾頭 23螺拴 25、322、332 定位孔 31上承座 312定位柱 321穿孔 324定位針 2上模 22沖頭 24彈性元件 3下模 311、321、331 穿孔 32中承座 323彈性元件 201141694 33 下承座 4 41 基板單位 411 412 電路層 413 42 基板成品 43 5 承載板 51 基板 焊接點 絕緣層 定位孔 安裝孔201141694 VI. Description of the invention: - - —— ------------------------------------------------------------------ The invention relates to a die structure of a stamped substrate and a stamped product thereof, in particular to a stamping die which can be punched into a substrate and simultaneously punched into a stamping die mounted on a carrier plate. [Prior Art] According to the conventionally used stamping substrate mold, as shown in Fig. 1, it is provided with an upper mold 11 and a lower mold 12, wherein the upper mold top is provided with a fixing chuck 111 for The mounting is fixed on a punching machine (not shown), and a punch is arranged at the bottom of the upper die 11 for punching a substrate and a carrying plate (not shown). The lower mold 12 is provided with an upper bearing seat 121 and a lower bearing seat 122. The upper and lower bearing seats 121 and 122 are provided with a through hole (not shown) through which the punch is inserted. A bolt is fixed on the upper part 121 of the lower mold 12. A plurality of springs 114 are disposed between the upper mold 11 and the upper bearing seat 121 for adjusting the force of the punching. The upper bearing seat 121 is respectively disposed on four sides. There is a positioning post 13 which is disposed on the positioning holes 115 and 122 of the upper socket 121 and the lower socket 122 for positioning. In use, the substrate and the carrier plate can be respectively placed on the through holes between the upper socket 121 and the lower socket 122, and the substrate can be punched out by a plurality of substrate units by punching. : Round substrate unit), and the carrier board is punched out with several mounting holes of equal size, and then several substrate units are mounted on the mounting holes of the carrier board to make the finished product, which will be continued after 201141694 Production process. However, it is quite time consuming and labor-intensive to manually press the substrate unit on the mounting hole of the carrier plate, and the substrate unit is lost, and the wire board unit is installed on the substrate. When the wire hole of the bearing plate is used, it is also required to be heavier than the bit wire, which is quite inconvenient. SUMMARY OF THE INVENTION In view of the shortcomings derived from the above-mentioned die for stamping a substrate, the inventor of the present invention has improved it, and after years of painstaking research, finally succeeded in research and development of the stamping substrate. Mold structure and its stamped products. SUMMARY OF THE INVENTION An object of the present invention is to provide a die structure for stamping a substrate and a stamped product thereof for punching a substrate, and simultaneously punching the substrate into a carrier plate to complete the operation once. For the above purpose, the technical means of the present invention consists in that an upper mold and two lower molds are provided, wherein the top of the upper mold is provided with a fixing chuck for mounting on the punching machine.贞彳 — 冲 冲 冲 冲 , , , , 冲 冲 冲 冲 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板a punching hole for the punch, the upper mold rotation number _ _ _ _ above the upper seat, between the upper mold and the upper seat is provided with a plurality of _ sex elements for adjusting the power of the stamping Each of the four sides of the seat is respectively provided with a positioning post, and the positioning pillars are worn on the positioning holes provided by the upper mold, the middle socket and the lower socket, thereby achieving the positioning function. The middle socket and the lower socket are respectively disposed. There are a plurality of elastic elements 201141694 ——· - a punching force - when the L is used, the substrate can be placed on the perforations between the upper seat, the middle seat, the perforated upper seat and the lower seat, By punching the punch, the substrate can be punched out a plurality of substrate units, and the mounting plate is punched out into several equal-sized mounting holes. At the same time, through the punching force of the punch, the substrate unit is flushed into the ampule of the carrier plate, so that the rushing and the installation work can be completed once, and the subsequent production process can be directly performed. Φ 凊 Referring to the following detailed description of a preferred embodiment of the present invention and the accompanying drawings, the technical contents of the present invention and the effects of the objects of the present invention will be further understood: [Embodiment] U is a stamping substrate provided by the present invention. The mold structure and the stamping buckle thereof, as shown in Figures 2 and 3, are provided with an upper die 2 and a lower die 3, wherein a top of the upper die 2 is provided with a fixing chuck 21 for mounting and fixing A stamping machine (not shown) is provided on the bottom of the upper mold 2 with a punch 22 for punching a substrate 4 (such as an LED circuit board) and a carrier board 5. • The die 3 is provided with a top, a middle socket 32 and a lower socket 33. § The upper middle and lower sockets 31, 32, 33 are provided with a perforation 311, 321 for the punch 22 to be inserted. The upper mold 2 is locked above the upper bearing block 31 by a plurality of bolts 23, and a plurality of elastic members 24 (such as springs) are disposed between the upper mold 2 and the upper bearing block μ for adjusting the punching. The locating holes 312 are respectively disposed on the four sides of the upper bearing block, and the positioning posts 312 are disposed through the positioning holes 25, 322, 332 of the upper die 2, the middle socket 32, and the lower socket 33. In order to achieve the positioning function, a plurality of elastic members 323 (such as springs) are disposed between the middle socket 32 and the lower socket 33 to adjust the force of the punching. 201141694 _ _ _ _ Please refer to the figures 3, 4, 5, in use, the substrate 4 can be placed into the perforations 311, 321 between the upper table 31, while the carrier plate 5 is placed into the The punches 321 and 331 between the middle socket 32 and the lower socket 33 are punched by the punch 22, so that the substrate 4 can be punched out by a plurality of substrate units 41 (for example, a circular substrate unit). And the mounting plate 5 is punched out with a plurality of mounting holes η of equal size, and the substrate unit 41 is punched into the mounting hole 51 of the carrier plate 5 through the punching force of the punch 22 to form a finished substrate. 42, the stamping and installation work is completed at one time, and the subsequent production process (such as: SMD production program) can be directly performed. In this way, the substrate unit 41 is punched into the mounting hole 51 of the carrier plate 5 through the punching force of the punch 22, so that the stamping and mounting operations are completed once, and the time required for installing the substrate unit can be avoided. The lack of labor. Moreover, referring to FIG. 6, the stamped product punched out by the die structure of the stamped substrate is integrally punched out by the die structure of the stamped substrate, and the stamped article comprises: a plurality of substrate units 41, which are The mold structure is punched out; a carrier plate 5 on which the substrate units 41 are embedded is integrally formed. The mounting plate 5 has a mounting hole 51 through the die structure of the stamping substrate 41. The mounting space of the mounting holes 51 is suitable for the mounting of the substrate unit 41 therein. The substrate unit has a plurality of tan contacts 4 for mounting the LED wafer base, and the led crystal 201141694 ------- is an insulating insulating layer 413. Please refer to the second As shown in the figure, it^3^L321^ is provided with at least two positioning pins 324 (for example, three-pulse needles), and the substrate 4 is disposed at a position corresponding to the positioning pins 324, and is provided with matching positioning holes 43. When the substrate 4 is punched, the positioning hole of the substrate 4 can be inserted through the positioning pins. The substrate 4 is aligned with the punch 22, and the substrate unit 41 can be accurately punched out. 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The equivalent of the change shall be included in the scope of the patent in this case. [Simple description of the diagram] Figure 1 is a schematic diagram of the front of the application. Figure 2 is a perspective view of the present invention. Figures 3 to 5 are schematic views of the continuous operation of the present invention. • Figure 6 is an exploded perspective view of the finished substrate of the present invention. [Main component symbol description] 21 fixing chuck 23 screw 25, 322, 332 positioning hole 31 upper seat 312 positioning column 321 perforation 324 positioning needle 2 upper mold 22 punch 24 elastic member 3 lower mold 311, 321, 331 perforation 32 center socket 323 elastic element 201141694 33 lower socket 4 41 substrate unit 411 412 circuit layer 413 42 substrate finished product 43 5 carrier plate 51 substrate solder joint insulation layer positioning hole mounting hole