CN210306152U - Multi-window lead bonding clamp - Google Patents
Multi-window lead bonding clamp Download PDFInfo
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- CN210306152U CN210306152U CN201921152534.0U CN201921152534U CN210306152U CN 210306152 U CN210306152 U CN 210306152U CN 201921152534 U CN201921152534 U CN 201921152534U CN 210306152 U CN210306152 U CN 210306152U
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Abstract
The utility model discloses a multi-window lead bonding fixture, including base and apron, the base includes first face and second face, first face is fixed and stacks with the second face on the second face, be provided with a plurality of rectangle recesses on the first face, a plurality of rectangle recesses are the matrix arrangement, be provided with two side by side in the rectangle recess and will the first round hole that the second face runs through, each rectangle recess both sides respectively are provided with a T type recess; the apron includes third face and fourth face, the third face is fixed with the fourth face and is stacked on the fourth face, be provided with a plurality ofly on the third face with rectangle recess adaptation, and will the rectangle window that the fourth face runs through. The utility model discloses owing to add a plurality of lead bonding windows for the time and the number of times of drawing material number of times, heat time, equipment reading electron device of equipment when welding reduce by a wide margin, improved the efficiency of lead bonding.
Description
Technical Field
The utility model relates to an integrated circuit field, in particular to multi-window lead bonding anchor clamps.
Background
The lead bonding is a process for communicating a bonding wire area on an integrated circuit chip and an internal lead welding area of a lead support by using a metal bonding wire in a bonding mode, is simple in process and low in cost, is suitable for various electronic packaging forms, and has a leading position in a connection mode. With the rapid development of electronic components and devices, the types of the electronic components are numerous, the production efficiency of the traditional bonding clamp is slightly low at present, the traditional bonding clamp cannot follow the development rhythm, the social average productivity is not favorably improved, and the aim of improving the production benefit is not favorably achieved.
Thus, the prior art has yet to be improved and enhanced.
SUMMERY OF THE UTILITY MODEL
In view of the above-mentioned prior art's weak point, the utility model aims to provide a multi-window bonding anchor clamps can show the efficiency that improves integrated circuit chip wire bonding.
In order to achieve the purpose, the utility model adopts the following technical proposal:
a multi-window wire bonding fixture, comprising:
the base comprises a first board surface and a second board surface, the first board surface and the second board surface are fixed and stacked on the second board surface, a plurality of rectangular grooves are formed in the first board surface and arranged in a matrix manner, two first round holes penetrating through the second board surface are formed in the rectangular grooves side by side, and a T-shaped groove is formed in each of two sides of each rectangular groove;
the cover plate is used for being pressed on the base and comprises a third plate surface and a fourth plate surface, the third plate surface and the fourth plate surface are fixed and stacked on the fourth plate surface, and a plurality of rectangular windows which are matched with the rectangular grooves and penetrate through the fourth plate surface are arranged on the third plate surface.
In the multi-window wire bonding clamp, the length of the rectangular window is greater than that of the rectangular groove, and the width of the rectangular window is greater than that of the rectangular groove.
In the multi-window lead bonding clamp, the number of the rectangular grooves and the number of the rectangular windows are 24, and the 24 rectangular grooves and the 24 rectangular windows are arranged in an 8-row 3-column matrix.
In the multi-window wire bonding clamp, the depth of the T-shaped groove is lower than that of the rectangular groove.
In the multi-window lead bonding fixture, the second plate surface is further provided with two U-shaped limiting grooves which are located on two sides of the rectangular groove array and are symmetrical relative to the center of the second plate surface.
In the multi-window lead bonding fixture, the edge of the second plate surface is also provided with two U-shaped clamping grooves which are symmetrical relative to the center of the second plate surface.
In the multi-window lead bonding fixture, 2 spring pieces are respectively arranged on two sides of the rectangular window array, and the spring pieces are arranged on the third plate surface.
In the multi-window lead bonding fixture, two sides of each row of rectangular windows are respectively provided with a strip-shaped groove, and the strip-shaped grooves are formed in the fourth plate surface.
In the multi-window lead bonding fixture, the base further comprises a first screw pin, and the first plate surface and the second plate surface are fixedly connected through the first screw pin.
In the multi-window lead bonding fixture, the cover plate further comprises a round hole ball stud, an elliptical hole ball stud and two second screw studs, the round hole ball stud and the elliptical hole ball stud penetrate through the third plate surface and the fourth plate surface so as to fix the cover plate on the lead bonding equipment, and the third plate surface and the fourth plate surface are fixedly connected through the second screw studs.
Compared with the prior art, the utility model provides a multi-window lead bonding fixture, including the base and be used for the apron of pressfitting on the base, the base includes first face and second face, first face is fixed with the second face and stacks on the second face, be provided with a plurality of rectangle recesses on the first face, a plurality of rectangle recesses are the matrix arrangement, be provided with two side by side in the rectangle recess and run through the first round hole of second face, each rectangle recess both sides respectively are provided with a T type recess; the apron includes third face and fourth face, the third face is fixed with the fourth face and is stacked on the fourth face, be provided with a plurality ofly on the third face with rectangle recess adaptation, and will the rectangle window that the fourth face runs through. The utility model discloses owing to add a plurality of lead bonding windows for the time and the number of times of drawing material number of times, heat time, equipment reading electron device of equipment when welding reduce by a wide margin, improved integrated circuit chip lead bonding's efficiency.
Drawings
Fig. 1 is a schematic structural view of the base in the multi-window wire bonding fixture provided by the present invention.
Fig. 2 is a schematic structural view of the cover plate in the multi-window wire bonding fixture provided by the present invention.
Detailed Description
The utility model provides a many windows lead bonding anchor clamps, for making the utility model discloses a purpose, technical scheme and effect are clearer, clear and definite, and it is right that the following refers to the drawing and the embodiment is lifted the utility model discloses further detailed description. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
It will be understood that when an element is referred to as being "on," "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present.
It should be noted that the terms of orientation such as left, right, up and down in the embodiments of the present invention are only relative to each other or are referred to the normal use state of the product, and should not be considered as limiting.
Referring to fig. 1 and 2, the multi-window wire bonding fixture provided by the present invention includes a base 1 and a cover plate 2, wherein the cover plate 2 is pressed on the base 1, and when the multi-window wire bonding fixture is used, a wire bonding device presses the cover plate 2 on the base 1, and the bonding wire holder is fixed, so as to further implement wire bonding.
Further, referring to fig. 1 and 2, the base 1 includes a first board surface and a second board surface, the first board surface and the second board surface are fixed and stacked on the second board surface, the first board surface is provided with a plurality of rectangular grooves 11, the plurality of rectangular grooves 11 are arranged in a matrix, two first circular holes 12 penetrating through the second board surface are arranged in the rectangular grooves 11 side by side, and two sides of each rectangular groove 11 are respectively provided with a T-shaped groove 13; the cover plate 2 comprises a third plate surface and a fourth plate surface, the third plate surface and the fourth plate surface are fixed and stacked on the fourth plate surface, and a plurality of rectangular windows 21 which are matched with the rectangular grooves 11 and penetrate through the fourth plate surface are arranged on the third plate surface.
Particularly, the rectangular groove 11 is located in the middle of the first plate surface, the vacuum adsorption device of the wire bonding equipment adsorbs the electronic device to be subjected to wire bonding in the rectangular groove 11 through the two first round holes 12, so that the electronic device can be fixed, because the utility model discloses be provided with a plurality of rectangular grooves, so a plurality of electronic devices can be fixed simultaneously, the welding device of the wire bonding equipment welds the electronic device through each rectangular window 21 on the cover plate 2, thereby the material pulling times, the heating time and the time and times for reading the electronic device by the equipment during welding are all greatly reduced, and the efficiency of the wire bonding of the integrated circuit chip is improved; the T-shaped grooves 13 are located on the left side and the right side of the rectangular groove array, the depth of each T-shaped groove 13 is slightly deeper than the corresponding rectangular groove 11, the T-shaped grooves are used for placing the lead support of the electronic device in a positioning mode and providing a space required by reversible deformation of the local position of the lead support after pressing, the rectangular grooves 11 of the base are matched with the T-shaped grooves 13, the lead support of the electronic device is located on the base, the lead support of the electronic device is pressed and fixed through the cover plate 1, and lead keys can be conveniently conducted on the.
Preferably, the length of the rectangular window 21 is greater than the length of the rectangular groove 11, and the width of the rectangular window 21 is greater than the width of the rectangular groove 11, that is, the size of the rectangular window 21 is slightly greater than the size of the rectangular groove 11, so as to facilitate welding by equipment.
Furthermore, in this embodiment, the number of the rectangular grooves and the rectangular windows is 24, and the 24 rectangular grooves and the rectangular windows are arranged in an 8-row 3-column matrix, so as to achieve the purpose of improving the efficiency of wire bonding of the integrated circuit chip, wherein the row height and the column width of the matrix may be the same or different.
Referring to fig. 1, the second board surface is further provided with two U-shaped limiting grooves 14, the two U-shaped limiting grooves 14 are located at two sides of the rectangular groove array and are symmetrical with respect to the center of the second board surface, and the U-shaped limiting grooves 14 are used for positioning the base on the wire bonding equipment.
Please continue to refer to fig. 1, the edge of the second board surface is further provided with two U-shaped clamping grooves 15, the two U-shaped clamping grooves 15 are symmetrical with respect to the center of the second board surface, the U-shaped clamping grooves 15 are used for clamping the base to prevent the position of the base from moving and causing bonding failure during wire bonding, when the device is used, the base 1 is fixed on the device by matching the U-shaped limiting groove 14 with the U-shaped clamping grooves 15, and after the cover plate 1 is fixed on the device, the cover plate 1 is matched with the base 2 to fix the lead wire support of the electronic device.
Referring to fig. 2, two sides of the rectangular window array are respectively provided with 2 spring pieces 22, the spring pieces 22 are arranged on the third plate surface, and the spring pieces 22 can assist the lead frame to be smoothly separated from the cover plate after the lead bonding of the electronic device is completed.
Referring to fig. 2, two sides of each row of rectangular windows are provided with a strip-shaped groove 23, and the strip-shaped grooves 23 are disposed on the fourth plate surface, that is, each side of the rectangular window array is provided with 8 rows of strip-shaped grooves 23 parallel to the same row of rectangular windows, so as to prevent the bonded lead from being damaged.
Preferably, referring to fig. 1, the base 1 further includes a first screw pin 16, and the first board surface and the second board surface are fixedly connected by the first screw pin 16, so that the base is convenient to mount and dismount, and scalding is prevented.
Preferably, referring to fig. 2, the cover plate 2 further includes a round-hole ball stud 24, an elliptical-hole ball stud 25 and two second screw studs 26, and the round-hole ball stud 25 and the elliptical-hole ball stud 26 penetrate through the third plate surface and the fourth plate surface to fix the cover plate 1 on a wire bonding apparatus; third face and fourth face pass through second screw round pin 26 fixed connection, and are convenient the installation and the dismantlement of apron prevent to take place to scald the incident.
To sum up, the utility model provides a multi-window lead bonding fixture, including the base and be used for the apron of pressfitting on the base, the base includes first face and second face, first face and second face are fixed and stack on the second face, be provided with a plurality of rectangle recesses on the first face, a plurality of rectangle recesses are the matrix arrangement, be provided with two side by side in the rectangle recess and run through the first round hole of second face, each side of rectangle recess respectively is provided with a T type recess; the apron includes third face and fourth face, the third face is fixed with the fourth face and is stacked on the fourth face, be provided with a plurality ofly on the third face with rectangle recess adaptation, and will the rectangle window that the fourth face runs through. The utility model discloses owing to add a plurality of lead bonding windows for the time and the number of times of drawing material number of times, heat time, equipment reading electron device of equipment when welding reduce by a wide margin, improved integrated circuit chip lead bonding's efficiency.
It should be understood that equivalent alterations and modifications can be made by those skilled in the art according to the technical solution of the present invention and the inventive concept thereof, and all such alterations and modifications should fall within the scope of the appended claims.
Claims (10)
1. A multi-window wire bonding fixture, comprising:
the base comprises a first board surface and a second board surface, the first board surface and the second board surface are fixed and stacked on the second board surface, a plurality of rectangular grooves are formed in the first board surface and arranged in a matrix manner, two first round holes penetrating through the second board surface are formed in the rectangular grooves side by side, and a T-shaped groove is formed in each of two sides of each rectangular groove;
the cover plate is used for being pressed on the base and comprises a third plate surface and a fourth plate surface, the third plate surface and the fourth plate surface are fixed and stacked on the fourth plate surface, and a plurality of rectangular windows which are matched with the rectangular grooves and penetrate through the fourth plate surface are arranged on the third plate surface.
2. The multi-window wire bonding fixture of claim 1, wherein the length of the rectangular window is greater than the length of the rectangular recess, and the width of the rectangular window is greater than the width of the rectangular recess.
3. The multi-window wire bonding fixture of claim 2, wherein the number of rectangular recesses and rectangular windows is 24, and the 24 rectangular recesses and rectangular windows are arranged in an 8-row 3-column matrix.
4. The multi-window wire bonding fixture of claim 3, wherein the depth of the T-shaped groove is lower than the depth of the rectangular groove.
5. The multi-window wire bonding fixture of claim 4, wherein the second plate surface is further provided with two U-shaped limiting grooves, and the two U-shaped limiting grooves are located on two sides of the rectangular groove array and are symmetrical with respect to the center of the second plate surface.
6. The multi-window wire bonding fixture of claim 5, wherein the edge of the second plate surface is further provided with two U-shaped clamping grooves, and the two U-shaped clamping grooves are symmetrical with respect to the center of the second plate surface.
7. The multi-window wire bonding fixture of claim 6, wherein 2 spring tabs are disposed on each side of the rectangular window array, the spring tabs being disposed on the third plate surface.
8. The multi-window wire bonding fixture of claim 7, wherein each row of rectangular windows has an elongated groove disposed on both sides of the rectangular window, and the elongated grooves are disposed on the fourth plate surface.
9. The multi-window wire bonding fixture of claim 1, wherein the base further comprises a first screw pin, and the first plate and the second plate are fixedly connected by the first screw pin.
10. The multi-window wire bonding fixture of claim 1, wherein the cover plate further comprises a round hole ball stud, an elliptical hole ball stud and two second screw studs, the round hole ball stud and the elliptical hole ball stud penetrate through the third plate surface and the fourth plate surface to fix the cover plate on the wire bonding apparatus, and the third plate surface and the fourth plate surface are fixedly connected through the second screw studs.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921152534.0U CN210306152U (en) | 2019-07-22 | 2019-07-22 | Multi-window lead bonding clamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921152534.0U CN210306152U (en) | 2019-07-22 | 2019-07-22 | Multi-window lead bonding clamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210306152U true CN210306152U (en) | 2020-04-14 |
Family
ID=70124909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921152534.0U Active CN210306152U (en) | 2019-07-22 | 2019-07-22 | Multi-window lead bonding clamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210306152U (en) |
-
2019
- 2019-07-22 CN CN201921152534.0U patent/CN210306152U/en active Active
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