CN107186119B

CN107186119B - SOP type paster pin changes DIP pin device

Info

Publication number: CN107186119B
Application number: CN201610144200.3A
Authority: CN
Inventors: 王宝华; 李明磊; 冯爱成; 郭秋月; 秦亚杰
Original assignee: Nanjing Tech University
Current assignee: Nanjing Tech University
Priority date: 2016-03-14
Filing date: 2016-03-14
Publication date: 2020-01-24
Anticipated expiration: 2036-03-14
Also published as: CN107186119A

Abstract

The invention discloses a device for converting an SOP type patch pin into a DIP pin, which comprises a patch base, a supporting part, a pressing part and a pin converting part. The patch base is used for placing an SOP type patch; the pressing part is used for pressing the SOP type patch pins so that the pins of the patch device are kept in good contact with the pin conversion part; the supporting part is used for supporting the pressing part in the process of placing the SOP type patch on the patch base, a supporting part anti-sliding groove is formed in the patch base, and the supporting part can place the rectangular support therein to prevent sliding; the pin conversion part is embedded in the patch base, the upper part of the pin conversion part is connected with an SOP type patch pin, and the lower part of the pin conversion part is converted into a DIP pin after being bent. The invention can conveniently complete the conversion from the SOP type chip device to the DIP type device and enlarge the application range of the chip device.

Description

SOP type paster pin changes DIP pin device

Technical Field

The invention belongs to the technical field of electronic device packaging, and particularly relates to a device for converting a pin of an SOP type surface mounted device into a DIP pin.

Technical Field

SOP (Small Out-Line Package) is an abbreviation for Small outline Package. Due to its small package size, it is widely used in many applications where strict requirements are placed on the overall size of the circuit board. However, the following two problems are often encountered in actual circuit design: 1. in many cases, for example, when budget is tight, it is desirable to first verify the correctness of the circuit through the bread board, and the chip that can be inserted into the bread board is only a DIP package, but some types of chips only have SOP packages, which brings difficulty to debugging of the circuit on the bread board. 2. Once the chip device is welded on the circuit board, if the chip device fails, the whole circuit board is scrapped.

Disclosure of Invention

The invention aims to provide a device for converting an SOP type patch pin into a DIP pin, which is convenient for debugging an SOP type patch device on a bread board and enables the easily damaged patch device to be detachably connected with a circuit.

The technical solution for realizing the purpose of the invention is as follows: a device for converting an SOP type patch pin into a DIP pin comprises a patch base, a pressing part, a supporting part and a pin converting part; the pin conversion part is arranged in the middle of the patch base, the pressing parts are arranged on the upper surface of the patch base, the two pressing parts are symmetrically arranged relative to the pin conversion part, and each pressing part is correspondingly provided with a supporting part;

the patch base is used for placing an SOP type patch and fixing the pressing part; the pressing part is used for clamping the pins of the SOP type patch; the supporting part is fixed on the pressing part and used for expanding the pressing part; the pin conversion component penetrates through the upper surface and the lower surface of the chip base, the upper part of the pin conversion component is connected with the SOP type chip pin, and the lower part of the pin conversion component is bent and then converted into a DIP pin.

Furthermore, the width of the patch base is 4-5 times of the distance between two rows of pins of the SOP type patch, and the length of the patch base is 3-4 times of the length of the SOP type patch; the chip mounting base is provided with a chip positioning groove, a supporting part anti-slip groove, a pressing part embedded groove and a chip pin groove, the chip positioning groove is arranged in the middle of the upper surface of the chip mounting base, the depth of the chip positioning groove is half of the thickness of the SOP chip body, and the shape of the chip positioning groove is the same as that of the SOP chip body; two rows of patch pin grooves corresponding to the SOP type patch pins are arranged on two sides of the patch positioning groove, and the pins of the SOP type patch are arranged in the patch pin grooves; the outer sides of the two rows of patch lead grooves are respectively provided with a support part anti-slip groove which is used for fixing a support part; two opposite sides about the paster base respectively set up a sticising part embedded groove, these two sides are on a parallel with two rows of pins of SOP type paster, sticising the length of part embedded groove and be 1.2 ~ 1.5 times of SOP type paster body length.

Furthermore, the compressing part comprises a U-shaped metal sheet and a rubber strip attached to the U-shaped metal sheet, three surfaces of the U-shaped metal sheet are integrally formed, the lengths of two parallel surfaces are different, the shorter surface is embedded into the embedding groove of the compressing part to fix the compressing part on the patch base, and the longer surface is positioned on the upper surface of the patch base; when the pressing part is clamped downwards, the rubber strip presses the pins of the SOP type patch placed on the patch base, and the shape of the outer surface of the rubber strip is coupled with the curved shape of the upper surface of the pins of the SOP type patch.

Further, the supporting part comprises a cylindrical through hole fixed on the pressing part and a rectangular support column penetrating through the cylindrical through hole, when the pressing part clamps the SOP type patch pin downwards, the cylindrical through hole is positioned right above the supporting part anti-slip groove, the rectangular support column is turned over to the pressing part, one edge of the rectangular support column penetrates through the cylindrical through hole to enable the rectangular support column to freely rotate around the cylindrical through hole, and when the opposite edge of the edge is placed in the supporting part anti-slip groove of the patch base, the pressing part is in an open state; the supporting parts are symmetrically distributed on the paster base.

Furthermore, the pin conversion part is made of copper, penetrates through the upper surface and the lower surface of the chip base, the upper part of the pin conversion part is exposed out of the chip pin groove, the bent shape of the upper part of the pin conversion part is coupled with the shape of the lower surface of the pin of the SOP type chip device, and the lower part of the pin conversion part is bent and converted into a DIP pin.

Compared with the prior art, the invention has the remarkable advantages that: (1) the SOP type pins are converted into DIP pins, so that the SOP type device can be conveniently debugged on a bread board; (2) the chip mounting device which is easy to damage is not directly welded on the PCB, when the chip is damaged, the damaged chip is taken down and replaced by a new chip, so that the whole circuit board is not scrapped, and resources are saved;

drawings

Fig. 1 is a schematic structural diagram of a device for converting a SOP patch pin into a DIP pin.

Fig. 2 is a schematic view of an apparatus for compressing the SOP type patch by the compressing member.

Fig. 3 is a schematic structural view of the patch base.

Fig. 4 is a schematic structural view of the pressing member.

Fig. 5 is a schematic structural view of the support member.

Fig. 6 is a schematic structural diagram of the pin converting part.

Fig. 7 is a schematic bottom structure diagram of a device for converting a SOP patch pin to a DIP pin.

Fig. 8 is a partially enlarged view of the chip pin groove, in which (a) is a partially enlarged view of (b), and (b) is a schematic view of the chip pin groove.

Fig. 9 is a schematic view of the coupling relationship between the pin converting part and the lower surface of the chip pin.

Fig. 10 is a schematic view showing the coupling relationship between the rubber strip of the pressing member and the upper surface of the patch pin.

DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION

The present invention will be described in further detail with reference to the accompanying drawings.

With reference to fig. 1-2, the SOP type chip pin to DIP pin apparatus of the present invention includes a chip base 1, a pressing part 2, a supporting part 3, and a pin converting part 4; the pin conversion part 4 is arranged in the middle of the patch base 1, the pressing parts 2 are arranged on the upper surface of the patch base 1, the two pressing parts 2 are symmetrically arranged relative to the pin conversion part 4, and each pressing part 2 is correspondingly provided with one supporting part 3;

the patch base 1 is used for placing an SOP type patch and fixing the pressing part 2; the pressing part 2 is used for clamping pins of the SOP type patch; the supporting part 3 is fixed on the pressing part 2 and is used for expanding the pressing part 2; the lead conversion member 4 penetrates the upper and lower surfaces of the chip base 1, the upper portion 41 of the lead conversion member is connected to the SOP type chip lead, and the lower portion 42 of the lead conversion member is bent to be converted into a DIP lead.

With reference to fig. 3, the width of the patch base 1 is 4-5 times of the distance between two rows of pins of the SOP patch, and the length of the patch base 1 is 3-4 times of the length of the SOP patch; the chip mounting base 1 is provided with a chip positioning groove 11, a supporting part anti-slip groove 12, a pressing part embedding groove 13 and a chip pin groove 14, the chip positioning groove 11 is arranged in the middle of the upper surface of the chip mounting base 1, the depth of the chip positioning groove 11 is half of the thickness of the SOP chip body, and the shape of the chip positioning groove 11 is the same as that of the SOP chip body; two rows of patch pin grooves 14 corresponding to the SOP type patch pins are arranged on two sides of the patch positioning groove 11, and the pins of the SOP type patch are arranged in the patch pin grooves 14; the outer sides of the two rows of patch pin grooves 14 are respectively provided with a supporting part anti-skidding groove 12, and the supporting part anti-skidding grooves 12 are used for fixing the supporting part 3; two opposite side faces of the left side face and the right side face of the patch base 1 are respectively provided with a pressing part embedded groove 13, the two side faces are parallel to two rows of pins of the SOP type patch, and the length of the pressing part embedded groove 13 is 1.2-1.5 times of the length of the SOP type patch body.

With reference to fig. 4, the compressing member 2 includes a U-shaped metal sheet 22 and a rubber strip 21 attached to the U-shaped metal sheet 22, three surfaces of the U-shaped metal sheet 22 are integrally formed, two parallel surfaces have different lengths, the shorter surface is embedded into the compressing member embedding groove 13 to fix the compressing member 2 on the patch base 1, and the longer surface is located on the upper surface of the patch base 1; when the pressing part 2 is clamped downwards, the rubber strip 21 presses the pins of the SOP type patch placed on the patch base 1, and the shape of the outer surface of the rubber strip 21 is coupled with the curved shape of the upper surface of the pins of the SOP type patch.

Referring to fig. 5, the supporting member 3 includes a cylindrical through hole 32 fixed on the pressing member 2 and a rectangular pillar 31 penetrating through the cylindrical through hole 32, when the pressing member 2 clamps the SOP type patch pin downward, the cylindrical through hole 32 is located right above the supporting member anti-slip groove 12, the rectangular pillar 31 is turned over the pressing member 2, one side of the rectangular pillar 31 penetrates through the cylindrical through hole 32 to enable the rectangular pillar 31 to freely rotate around the cylindrical through hole 32, and when the opposite side of the side is placed in the supporting member anti-slip groove 12 of the patch base 1, the pressing member 2 is in an open state; the supporting parts 3 are symmetrically distributed on the patch base 1.

Referring to fig. 6, the lead frame 4 is made of copper, the lead frame 4 penetrates the upper and lower surfaces of the chip base 1, the upper portion 41 of the lead frame is exposed from the chip lead groove 14, the bent shape thereof is coupled to the shape of the lower surface of the lead of the SOP chip device, and the lower portion 42 of the lead frame is bent to be converted into a DIP lead.

The present invention will be described in further detail with reference to specific examples.

Example 1

Referring to the schematic structural diagram of fig. 1, the SOP type chip pin to DIP pin apparatus of the present embodiment includes a chip base 1, a pressing member 2, a supporting member 3, and a pin converting member 4.

After the pressing part 2 is opened, as shown in fig. 1, the rectangular support 31 of the supporting part is placed into the supporting part anti-slip groove 12 of the patch base, and the pressing part 2 can be kept in an opened state, at this time, the placement of the SOP type patch can be performed.

As shown in fig. 2, the chip device is placed in the chip positioning groove 11 of the chip base 1, and under the positioning of the chip positioning groove 11, the chip pins automatically fall into the chip pin grooves 14 of the chip base 1, so that the lower surfaces of the pins are aligned with and tightly coupled with the upper portion 41 of the pin transition part, the rectangular support 31 of the support part 3 is removed from the support part anti-slip groove 12 of the chip base 1, and the pressing part 2 can press the pins of the SOP chip downward under the action of its own elastic force. The pressing part 2 is pasted with a rubber strip 21, the rubber strip 21 can be coupled with the shape of the pins of the SOP patch, and each pin can be guaranteed to be pressed enough to be tightly connected with the upper part 41 of the pin conversion part. After the chip device is placed, the DIP pin below the chip base 1 is inserted into the circuit.

Fig. 3 is a schematic structural diagram of a patch base 1, where the patch base 1 includes a patch positioning groove 11, the depth of the patch positioning groove 11 is half of the thickness of an SOP patch body (the part of an SOP patch where pins are removed is defined as the patch body), the shape of the groove is the same as the outline shape of an SOP chip body, and is located in the middle of the patch base 1, the width of the patch base 1 (the distance between the patch base and the parallel surfaces of the left and right rows of pins of the patch when the SOP patch is placed on the base) is 4-5 times the distance between the edges of the left and right rows of pins of the SOP patch, and the length of the patch base (the distance between the patch base and the vertical surfaces of the left and right rows of pins of the patch when the SOP patch is placed on the base) is 3-4 times the length of the SOP; paster lead grooves 14 corresponding to the number of SOP type paster leads are formed in the left side and the right side of the paster positioning groove 11, and the positions of the paster lead grooves 14 are positions where the SOP type paster leads are contacted when the SOP type paster is placed in the paster positioning groove. The outer side of the patch pin groove 14 is provided with a support part anti-skidding groove 12, the slotting position of the support part anti-skidding groove 12 is arranged between the patch pin groove 14 and the edge of the patch base 1, the direction is parallel to the patch base 1, the distance from the patch pin groove 14 is 1/3 of the distance from the patch pin groove 14 to the edge of the patch base, the length of the support part anti-skidding groove 12 is slightly larger than the width of the pressing part embedding groove 13 and is 1.2-1.5 times of the width of the pressing part embedding groove 13; the left surface and the right surface of the patch base 1 are respectively provided with a pressing part embedded groove 13, the depth of the groove is 1/3 of the width of the patch base, the width of the pressing part embedded groove 13 is slightly larger than the length of the SOP type patch body, and the length of the pressing part embedded groove is 1.2-1.5 times of the length of the SOP type patch body.

Fig. 4 is a schematic structural view of the pressing part 2, which comprises a U-shaped metal body 22, and a rubber pressing strip 21 attached thereon and having a length equal to the width of the U-shaped metal sheet; the width of the U-shaped metal sheet 22 (the direction parallel to the left and right surfaces of the base is defined as the width direction of the U-shaped metal sheet) is the same as the width of the pressing part embedding groove 13, and one surface is embedded into the pressing part embedding groove 13 (the surface is defined as a surface 1), so that the pressing part is fixed on the patch base 1. The surface (defined as surface 2) of the U-shaped metal sheet opposite to the surface 1 has a length which ensures that when the pressing part clamps downwards, the pressing part just can press the pins of the SOP type patch placed on the patch base; the length of the rubber strip 21 attached to the U-shaped metal sheet is equal to the width of the U-shaped metal sheet surface 2, the rubber strip is attached to the outer edge of the inner side of the U-shaped metal sheet surface 2, and the shape of the outer surface of the rubber strip 21 is coupled with the bending shape of the upper surface of the pin of the SOP patch. The pressing parts 2 are distributed on the paster base in a bilateral symmetry mode.

Fig. 5 is a schematic structural diagram of the supporting member 3, which includes a cylindrical through hole 32 fixed on the pressing member 2 and a rectangular pillar 31 passing through the cylindrical through hole 32, where the cylindrical through hole 32 is fixed on the pressing member 2 at a position where when the pressing member clamps the SOP type patch pin downward, the cylindrical through hole 32 is located right above the supporting member anti-slip groove 12, one side of the rectangular pillar 31 (which is defined as the rectangular pillar side 1) passes through the cylindrical through hole 32, so that the rectangular pillar 31 can rotate freely around the cylindrical through hole 32, and the opposite side of the rectangular pillar side 1 can be placed in the supporting member anti-slip groove 12 of the patch base 1, and when it is placed in the supporting member anti-slip groove 12, the pressing member 2 is in an open state. The supporting parts 3 are symmetrically distributed on the patch base.

Fig. 6 is a schematic view of the lead conversion member 4, which includes a lead conversion member upper portion 41 closely coupled to the lower surface of the SOP type chip lead and a DIP lead shaped lead conversion member lower portion 42; the lead conversion member 4 is made of copper, the lead conversion member 4 penetrates the chip base 1, the upper portion 41 of the lead conversion member is exposed from the chip lead groove 14, the bent shape of the upper portion is coupled with the shape of the lower surface of the lead of the SOP type chip device, and the lower portion 42 of the lead conversion member is bent and then converted into a DIP lead.

Fig. 7 is a schematic view of the device as seen from the bottom, in which reference numeral 1 denotes a chip base, and reference numeral 42 denotes a lead conversion member lower portion 42 in which a lead conversion member is converted into a DIP lead shape.

Fig. 8(a) to 8(b) are partially enlarged views of the chip lead groove 14.

Fig. 9 is a schematic view showing the coupling relationship between the pin conversion part 4 and the lower surface of the chip pin. Fig. 10 is a schematic view showing the coupling relationship between the rubber strip 21 of the pressing member 2 and the upper surface of the patch pin.

In summary, the invention designs a device for converting the SOP patch pin into the DIP pin, so that the SOP patch pin can be converted into the DIP pin, and the SOP device can be conveniently debugged on the bread board. Some vulnerable patch type devices can be connected into the PCB through the conversion device, and once the vulnerable patch type devices are damaged, the damaged devices are taken out and replaced by new devices.

Claims

1. A device for converting an SOP type patch pin into a DIP pin is characterized by comprising a patch base (1), a pressing part (2), a supporting part (3) and a pin converting part (4); the pin conversion part (4) is arranged in the middle of the patch base (1), the pressing parts (2) are arranged on the upper surface of the patch base (1), the two pressing parts (2) are symmetrically arranged relative to the pin conversion part (4), and each pressing part (2) is correspondingly provided with one supporting part (3);

the patch base (1) is used for placing an SOP type patch and fixing the pressing part (2); the pressing part (2) is used for clamping pins of the SOP type patch; the supporting part (3) is fixed on the pressing part (2) and is used for expanding the pressing part (2); the pin conversion part (4) penetrates through the upper surface and the lower surface of the patch base (1), the upper part (41) of the pin conversion part is connected with an SOP type patch pin, and the lower part (42) of the pin conversion part is bent and then converted into a DIP pin;

the width of the patch base (1) is 4-5 times of the distance between two rows of pins of the SOP type patches, and the length of the patch base (1) is 3-4 times of the length of the SOP type patches; the patch base (1) is provided with a patch positioning groove (11), a support part anti-slip groove (12), a pressing part embedding groove (13) and a patch pin groove (14), the patch positioning groove (11) is arranged in the middle of the upper surface of the patch base (1), the depth of the patch positioning groove (11) is half of the thickness of the SOP type patch body, and the shape of the patch positioning groove (11) is the same as that of the SOP type patch body; two rows of patch pin grooves (14) corresponding to the SOP type patch pins are arranged on two sides of the patch positioning groove (11), and the pins of the SOP type patch are arranged in the patch pin grooves (14); the outer sides of the two rows of patch pin grooves (14) are respectively provided with a support part anti-skidding groove (12), and the support part anti-skidding grooves (12) are used for fixing the support part (3); two opposite side surfaces of the patch base (1) are respectively provided with a pressing part embedded groove (13), the two side surfaces are parallel to the two rows of pins of the SOP type patch, and the length of the pressing part embedded groove (13) is 1.2-1.5 times of the length of the SOP type patch body;

the pressing part (2) comprises a U-shaped metal sheet (22) and a rubber strip (21) attached to the U-shaped metal sheet (22), three faces of the U-shaped metal sheet (22) are integrally formed, the lengths of two parallel faces are different, the shorter face is embedded into the pressing part embedding groove (13) to enable the pressing part (2) to be fixed on the patch base (1), and the longer face is located on the upper surface of the patch base (1); when the pressing part (2) is clamped downwards, the rubber strip (21) presses the pins of the SOP type patch placed on the patch base (1), and the shape of the outer surface of the rubber strip (21) is coupled with the curved shape of the upper surface of the pins of the SOP type patch.

2. The SOP type chip pin to DIP pin device according to claim 1, wherein the supporting member (3) comprises a cylindrical through hole (32) fixed on the pressing member (2) and a rectangular pillar (31) passing through the cylindrical through hole (32), when the pressing member (2) clamps the SOP type chip pin downwards, the cylindrical through hole (32) is located right above the supporting member anti-slip groove (12), the rectangular pillar (31) is turned over onto the pressing member (2), one side of the rectangular pillar (31) passes through the cylindrical through hole (32) to enable the rectangular pillar (31) to freely rotate around the cylindrical through hole (32), and the opposite side of the side is placed in the supporting member anti-slip groove (12) of the chip base (1), so that the pressing member (2) is in an open state; the supporting parts (3) are distributed on the patch base (1) in a bilateral symmetry manner.

3. The SOP type chip lead DIP lead apparatus according to claim 1, wherein the lead conversion member (4) is made of copper, the lead conversion member (4) penetrates upper and lower surfaces of the chip base (1), an upper portion (41) of the lead conversion member is exposed from the chip lead groove (14), a curved shape thereof is coupled to a shape of a lower surface of the SOP type chip lead, and a lower portion (42) of the lead conversion member is curved and converted into the DIP lead.