TW201044950A - Structure and method for processing metal shell - Google Patents

Structure and method for processing metal shell Download PDF

Info

Publication number
TW201044950A
TW201044950A TW98119929A TW98119929A TW201044950A TW 201044950 A TW201044950 A TW 201044950A TW 98119929 A TW98119929 A TW 98119929A TW 98119929 A TW98119929 A TW 98119929A TW 201044950 A TW201044950 A TW 201044950A
Authority
TW
Taiwan
Prior art keywords
metal substrate
plastic layer
fixing groove
metal
hole
Prior art date
Application number
TW98119929A
Other languages
Chinese (zh)
Inventor
Mao-Lian Huang
Original Assignee
Mao-Lian Huang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mao-Lian Huang filed Critical Mao-Lian Huang
Priority to TW98119929A priority Critical patent/TW201044950A/en
Publication of TW201044950A publication Critical patent/TW201044950A/en

Links

Landscapes

  • Casings For Electric Apparatus (AREA)

Abstract

A structure and the associated method for processing a metal shell are disclosed. The metal shell processing structure includes a metal substrate, at least a fixed slot, at least a plastic layer, and at least a combination hole. The fixed slot is installed on the metal substrate, and the fixed slot penetrates into the metal substrate from the surface of the metal substrate. The plastic layer is installed on the metal substrate and connected to the fixed slot. The combination hole is installed on the plastic layer and extends into the plastic layer from the surface of the plastic layer. The plastic layer is directly connected to the fixed slot right after being formed by molding, and the plastic layer and the combination hole can be formed by molding at a time, effectively simplifying the process, and reducing money and time costs. This invention further provides a method for processing a metal shell.

Description

201044950 六、發明說明: 【發明所屬之技術領域】 本發明有關於一種金屬外殼加工結構及方法,尤 指一種對金屬外殼加工,以將各種元件設置於金屬表 面上的金屬外殼加工結構及方法。 【先前技術】 隨著科技發達,產出各種電子產品及電子設備, 而金屬加工仍然普遍應用於此些產品及設備,包括外 部的殼體組裝及内部的機構設置,尤其内部機構往往 Ο 需要安裝許多功能性元件,需透過金屬加工將這些元 件穩固地設置於殼體内部。例如筆記型電腦,需將主 機板、硬碟、電源供應器等硬體安裝並固定於金屬機 殼内部。 如第一 A, B圖所示,習知的加工方法為:在一金 板^ a的表面約略鑿出一很淺的定位孔2 a,將 符合該定位孔2 a尺寸的組合柱3 a定位於該定 =孔2 a,並以電焊的方式將該組合柱3 a牢固地焊 ,於^位孔2 a上,此時焊塊5 3連接於該組合柱 f 部及該定位孔2 a外緣。以螺絲“將欲安裝 二70一件7 a組合於該組合柱3 a内的組合孔4 a (如弟一 Α,β圖所示),則完成安裝。 a’上料習知加工方法相當繁複,定位孔2 德,H必5非常精確,需個別*出每個定位孔2 a 要會-一巧疋位並焊接每個組合柱3 a,每個位置都 步ίίϊΐ;二口 Γΐί的元件愈多,重複的 出相當高的金Ϊ 本且失敗的機率較高,需付 【發明内容】 結構ίΪΪ之主要^的,在於提供—種金屬外殼加工 /,可以簡化金屬外殼加工,僅需簡單的流 3 i 201044950 程便可將各種元件設置於金屬表面上,以降低成本、 節省時間。 為了達成上述之目的,本發明提供一種金屬外殼 加工結構’包括:一金屬基板;至少一固定槽,該固 定槽設置於該金屬基板,該固定槽從該金屬基板表面 穿入該金屬基板;至少一塑膠層,該塑膠層設置於該 金屬基板上’並卡接於該固定槽;以及至少一組合 孔,戎組合孔設置於該塑膠層,該組合孔從該塑膠層 表面延伸進入該塑膠層内。 另外,本發明提供一種金屬外殼加工方法,1 驟包括: 〃 (一)提供一金屬基板; —(二)在該金屬基板欲加工的位置設置至少一固 定槽,^固定槽從該金屬基板表面穿入該金屬基板; (一)在δ亥金屬基板形成一底板及至少一侧板, 該側板位於該底板周緣;以及 ㈣在該金屬基板上設置至少—塑膠層,該塑 固定槽,並固定於該金屬基板上,及在 = 少一組合孔’該組合孔從該塑膠層表 面延伸進入该塑膠層内。 本發明之金屬外殼加工結構及方法,i中該 卡Ϊ於該固定槽’且該塑膠層及該組 ^馨士及知接組合柱’不但簡化了加卫過程,並可以 ί金錢及時間的成本,使金屬外殼加玉發揮最大效 為使能更進 容,抹夹間以π女扣匕瞭解本發明的特徵及技術内 所附;^僅接供it發明的詳細說明與附圖,然而 細共參考與說明用’並非用來對本發明加 201044950 【實施方式】201044950 VI. Description of the Invention: [Technical Field] The present invention relates to a metal casing processing structure and method, and more particularly to a metal casing processing structure and method for processing a metal casing to place various components on a metal surface. [Prior Art] With the development of technology, various electronic products and electronic devices are produced, and metal processing is still widely used in such products and equipment, including external housing assembly and internal mechanical settings, especially internal mechanisms often need to be installed. Many functional components need to be securely placed inside the housing through metal working. For example, a notebook computer needs to be mounted and fixed to the inside of a metal casing by a hard disk such as a main board, a hard disk, or a power supply. As shown in the first A, B, the conventional processing method is: a very shallow positioning hole 2 a is formed on the surface of a gold plate, and a combined column 3 a that conforms to the size of the positioning hole 2 a is formed. Positioned in the fixed hole 2 a, and the welded column 3 a is firmly welded to the hole 2 a, and the solder block 53 is connected to the combined column f and the positioning hole 2 a outer edge. With the screw "to install the two 70 pieces 7 a combined in the combined hole 3 a in the combined column 3 a (as shown in Figure 1, the figure shown in Figure 7), the installation is completed. Complex, positioning holes 2, H must be very precise, need to be individually * out of each positioning hole 2 a to be - a smart position and welding each combination column 3 a, each position is ί ϊΐ ϊΐ 二The more components, the higher the accuracy of the repeated gold, and the higher the probability of failure, the need to pay [invention] The main thing of the structure is to provide a kind of metal casing processing /, can simplify the processing of metal casing, only need The simple flow 3 i 201044950 process can set various components on the metal surface to reduce cost and save time. To achieve the above object, the present invention provides a metal casing processing structure 'including: a metal substrate; at least one fixing groove The fixing groove is disposed on the metal substrate, the fixing groove penetrates the metal substrate from the surface of the metal substrate; at least one plastic layer is disposed on the metal substrate and is engaged with the fixing groove; and at least one group The hole is formed in the plastic layer, and the combined hole extends from the surface of the plastic layer into the plastic layer. In addition, the present invention provides a metal casing processing method, and the first step comprises: 〃 (1) providing a metal substrate; (2) providing at least one fixing groove at a position to be processed of the metal substrate, wherein the fixing groove penetrates the metal substrate from the surface of the metal substrate; (1) forming a bottom plate and at least one side plate on the δ hai metal substrate, The side plate is located at a periphery of the bottom plate; and (4) providing at least a plastic layer on the metal substrate, the plastic fixing groove is fixed on the metal substrate, and the combination hole extends from the surface of the plastic layer In the plastic layer, the metal shell processing structure and method of the present invention, the card is clamped in the fixing groove 'and the plastic layer and the group of the 'Xinshi and the Zhizhu combination column' not only simplify the process of adding, but also ί money and time costs, the metal shell plus jade to maximize the effect to enable more capacity, between the wipes to understand the characteristics and technology of the present invention; ^ only for its invention Detailed description and drawings, however, are used in conjunction with the description and are not used to add the invention to 201044950.

請參閱第三A, B,C圖、第四A, B, C圖、第五A, B,C 圖及第/、A,B,C圖’本發明提供一種金屬外殼加工結 構,該金屬外殼加工結構包括一金屬基板1、至少一 固定槽2、至少一塑膠層3及至少一組合孔4。該固 定槽2設置於該金屬基板1,該塑膠層3設置於該金 屬基板1上’且該塑膠層3卡接於該固定槽2,該組 合孔4設置於該塑膠層3。 WPlease refer to the third A, B, C, fourth A, B, C, fifth A, B, C and /, A, B, C drawings. The present invention provides a metal casing processing structure, the metal The outer casing processing structure comprises a metal substrate 1, at least one fixing groove 2, at least one plastic layer 3 and at least one combined hole 4. The fixing groove 2 is disposed on the metal substrate 1 , the plastic layer 3 is disposed on the metal substrate 1 and the plastic layer 3 is engaged with the fixing groove 2 , and the combining hole 4 is disposed on the plastic layer 3 . W

如第三A,B,C圖所示,該金屬基板i原本為平滑 之表面,以鑽床、車床、冲壓床、銑床或其他加工器 具在該金屬基板1欲加工的位置設置該固定槽2,該 固定槽2從該金屬基板1表面穿入該金屬基板1,以 剖面圖來看,該固定槽2與該金屬基板i表面呈斜 角,以提供卡接固定該塑膠層3的能力。如第四a,β, c 圖所示,依產品需要的外觀形狀,以冲壓成型的方 式,在该金屬基板1形成一底板1 1及至少一側板1 2,該侧板1 2位於該底板i i周緣,該底板i 1與 該側板1 2互相垂直,該底板丄丄及該側板1 2皆且 有該固定槽2。然後,如第五A,B,C圖所示,以模^ 成型的方式在該金屬基板1上設置該塑膠層3,及在 该塑膠層3設置該組合孔4,該組合孔4從該塑膠層 3表面延伸進入該塑膠層3内,該塑膠 且二 孔4是以模具成型為一體成型的結構。 ΰ 具有符合加工需求的形狀及構造,經 ί:ϊ ίΐ ί其他成型方式’將熔融態的塑膠材 =J於J金屬基板!之上,該塑膠材料填入該固定 待該塑膠材料固化後移除模具,該塑膠層3 於該金屬基板1上。藉由填入該固定槽2的塑 f材料’該塑膠層3成型後便形成至少—卡接部3 1、亥_層3藉由該卡接部3 i卡接於該底板工工 5 201044950 或遠側板1 2的固定槽2,並固定於該金屬基板丄 ^ ^由、於該塑膠層3及所有組合孔4可藉由模具直接 一次完成成型,而不需要個別鑿孔。 、八 任何元件皆可以輕易設置於該金屬外殼加工結 構,如主機板、硬碟、電源供應器等。如第六A, B,C 圖所不,以至少一組合裝置5,將至少一功能元件6 ,合於该組合孔4,使該功能元件6安裝於該金屬外 殼加工結構之上。該組合孔4可以模具成型為螺孔、 卡^或其他種類之組合孔,該組合裝置5可為螺絲、 卡筍或其他種類之組合裝置。 該金屬外殼加工結構可以依據該功能元件6的 配置及分布,部署該固定槽2、該塑膠層3、該組合 ,4的數量、形狀及位置。該固定槽2的數量愈多, ^塑膠層3固定於該金屬基板1上愈穩固;依據加工 器具的刀具形狀及加工方式,該固定槽2的平面形狀 除了為本實施例中的圓形外,亦可以為其他形狀,不 以此為限。另外,該組合孔4亦可另外以鑽孔的方式 形成,並不褐限於模具成型。 因此’請同時參閱第七圖,本發明提供一種金屬 外殼加工方法,其步驟包括: (一) 提供一金屬基板1。 (二) 如第三A, B,C圖所示’以加工器具在該金 屬基板1欲加工的位置設置至少一固定槽2,該固定 槽2從該金屬基板1表面穿入該金屬基板1 ,該固定 槽2與該金屬基板1表面呈斜角,以提供卡接固定的 能力。 (二)如第四A,B,C圖所示,依產品需要的外觀 形狀,對該金屬基板1進行冲壓成型,在該金屬基板 1形成一底板1 1及至少一側板1 2,該側板1 2位 於該底板1 1周緣,該底板1 1與該側板i 2互相垂 201044950 直’該底板1 1及該側板1 2皆具有該固定槽2。 (四)如第五A, B,C圖所示’以模具成型的方式 在該金屬基板1上設置至少一塑膠層3 ’及在該塑膠 層3設置至少一組合孔4,該組合孔4從該塑膠層3 表面延伸進入該塑膠層3内,該塑膠層3及該組|孔 4以模具成型為一體成型的結構,該塑膠層3卡接於 該固定槽2,並固定於該金屬基板1上,且該塑膠層 3及所有組合孔4可藉由模具一次完成成型,而不^ ❹ 〇 要個別鑿孔。該組合孔4可以模具成型為螺孔、卡孔 或其他種類之組合孔。 另外,該步驟(四)中,該組合孔4亦可另外以 鑽孔的方式形成,並不侷限於模具成型。 完成該金屬外殼加工方法後,如第六A,B,C圖所 不,以至少一組合裝置5,將該功能元件6組合於該 組合孔4 ’該組合裝置5可為螺絲、卡苟或其他種類 之組合裝置。 藉由上述内容以形成本發明之金屬外殼加工姓 法’其中該塑膠層3成型後便直接卡接於該固^ ^槽2,不需要以焊接的方式個別固 3及所有組合孔4可藉由模具一 =太不但簡化了加工過程,並可二J = 寻間的成本,使金屬外殼加工發揮最大效益。 J 述僅為本發明之較佳實施例皿非意欲侷 二專利保護範圍’故舉凡運用本發明說明書 ίϊίΓΐ所為的等效變化,均同理皆包含於本發明 的權利保護範圍内,合予陳明。 【圖式簡單說明】 ,一 Α圖為習知技術之俯視圖一。 巧一 β圖為習知技術之剖面圖一。 第二Α圖為習知技術之俯視圖二。 7 201044950 第二B 第三A 第三B 第三C 圖。 第四A 第四B 第四C 圖。 第五A 第五B 第五C 圖。 第六A 第六B 第六C 圖。 圖為習知技術之剖面圖二。 圖為本發明金屬外殼加工红 圖為第三A圖中A部份之之俯視圖一。 圖為第三Α目巾Α部份^么放大俯視圖。 77 <局部放大側視剖面 Ξ為本發明金屬外殼加工結構之俯視圖二。 圖為第四A圖中B部份之月、图一 圖為第四A圖"部以二大俯視圖。 177 <局部放大側視剖面 圖為本發明金屬外殼加工結。 圖為第五A圖中C部份之俯視圖一 圖為圖"部局部放大側視刻面 圖為本發明金屬外殼加卫結構。 圖為第六A圖巾D部份4部放大俯視圖。 圖為第六A圖中D部份之局部放大側視剖面As shown in the third A, B, and C diagrams, the metal substrate i is originally a smooth surface, and the fixing groove 2 is disposed at a position where the metal substrate 1 is to be processed by a drill press, a lathe, a press bed, a milling machine or other processing tools. The fixing groove 2 penetrates the metal substrate 1 from the surface of the metal substrate 1. The fixing groove 2 has an oblique angle with the surface of the metal substrate i in a sectional view to provide the ability to snap-fix the plastic layer 3. As shown in the fourth a, β, c diagram, according to the appearance shape required by the product, a bottom plate 11 and at least one side plate 1 2 are formed on the metal substrate 1 in a stamping manner, and the side plate 12 is located on the bottom plate. Ii, the bottom plate i 1 and the side plate 12 are perpendicular to each other, and the bottom plate and the side plate 12 have the fixing groove 2 . Then, as shown in FIG. 5A, B, and C, the plastic layer 3 is disposed on the metal substrate 1 in a molding manner, and the composite hole 4 is disposed in the plastic layer 3, and the combined hole 4 is The surface of the plastic layer 3 extends into the plastic layer 3, and the plastic and the two holes 4 are integrally formed by molding. ΰ With the shape and structure that meets the processing needs, ί:ϊ ΐίΐ ί other molding methods 'The molten plastic material = J on the J metal substrate! Above, the plastic material is filled in the fixing. After the plastic material is cured, the mold is removed, and the plastic layer 3 is on the metal substrate 1. By forming the plastic material f of the fixing groove 2, the plastic layer 3 is formed, and at least the engaging portion 3 1 and the layer 3 are engaged by the engaging portion 3 i to the bottom plate worker 5 201044950 Or the fixing groove 2 of the distal plate 12 is fixed to the metal substrate, and the plastic layer 3 and all the combined holes 4 can be directly formed by the mold at one time without requiring individual holes. VIII Any component can be easily placed in the metal casing processing structure, such as motherboard, hard disk, power supply and so on. As shown in Figs. 6A, B, and C, at least one functional component 6 is joined to the combined aperture 4 by at least one combination device 5, and the functional component 6 is mounted on the metal casing processing structure. The combination hole 4 can be molded into a screw hole, a card or a combination of other types, and the combination device 5 can be a screw, a bamboo shoot or a combination of other types. The metal casing processing structure can deploy the number, shape and position of the fixing groove 2, the plastic layer 3, the combination 4 according to the configuration and distribution of the functional element 6. The more the number of the fixing grooves 2 is, the more stable the plastic layer 3 is fixed on the metal substrate 1; the planar shape of the fixing groove 2 is not only the circular shape in the embodiment, but also according to the shape and processing method of the processing tool. It can also be other shapes, not limited to this. Further, the combination hole 4 may be additionally formed by drilling, and the browning is not limited to the molding of the mold. Therefore, please refer to the seventh figure at the same time, the present invention provides a metal casing processing method, the steps of which include: (1) providing a metal substrate 1. (2) As shown in FIG. 3A, B, and C, at least one fixing groove 2 is provided at a position to be processed by the processing tool, and the fixing groove 2 penetrates the metal substrate 1 from the surface of the metal substrate 1 The fixing groove 2 is at an oblique angle to the surface of the metal substrate 1 to provide the ability to be snap-fitted. (2) As shown in FIG. 4A, B, and C, the metal substrate 1 is press-formed according to the appearance shape required by the product, and a bottom plate 11 and at least one side plate 1 2 are formed on the metal substrate 1, the side plate 1 2 is located at the periphery of the bottom plate 11 , the bottom plate 1 1 and the side plate i 2 are perpendicular to each other 201044950. The bottom plate 1 1 and the side plate 12 have the fixing groove 2 . (4) As shown in FIG. 5A, B, and C, at least one plastic layer 3' is disposed on the metal substrate 1 by mold molding, and at least one combination hole 4 is disposed in the plastic layer 3, and the combined hole 4 is provided. Extending from the surface of the plastic layer 3 into the plastic layer 3, the plastic layer 3 and the set of holes 4 are integrally formed by molding, and the plastic layer 3 is stuck to the fixing groove 2 and fixed to the metal. On the substrate 1, and the plastic layer 3 and all the combined holes 4 can be formed by the mold at one time, instead of individually boring. The combination hole 4 can be molded into a screw hole, a card hole or a combination of other types. Further, in the step (4), the combined hole 4 may be additionally formed by drilling, and is not limited to mold forming. After the metal casing processing method is completed, as in the sixth embodiment A, B, and C, the functional component 6 is combined with the composite hole 4 by at least one combination device 5'. The assembly device 5 may be a screw, a cassette or Other types of combined devices. By the above content, the metal shell processing method of the present invention is formed, wherein the plastic layer 3 is directly bonded to the fixing groove 2 after molding, and it is not necessary to separately fix 3 and all the combined holes 4 by welding. By the mold one = too much not only simplifies the processing, but also the cost of the two J = seek, so that the metal casing processing to maximize the benefits. The description of the preferred embodiments of the present invention is not intended to limit the scope of the patents. All equivalent modifications are intended to be included in the scope of the present invention. Bright. [Simple diagram of the diagram], a diagram is a top view of the prior art. The Q-graph is a cross-sectional view of the prior art. The second diagram is a top view of the prior art. 7 201044950 Second B Third A Third B Third C picture. Fourth A, fourth B, fourth C picture. Fifth A Fifth B Fifth C diagram. Sixth A sixth sixth sixth C diagram. The figure shows a cross-sectional view of the prior art. The figure shows the processing of the metal casing of the present invention. The figure is a top view of the portion A of the third drawing. The picture shows the enlarged view of the third part of the frame. 77 <Partially enlarged side view Ξ is a top view of the metal casing processing structure of the present invention. The picture shows the month of Part B in Figure 4A, and the picture in Figure 1 is the fourth A picture. 177 <Partially enlarged side cross-sectional view The metal shell processing knot of the present invention. The figure is a top view of part C in the fifth drawing A. The figure is a partial enlarged side view of the drawing. The picture shows a magnified top view of the four parts of the D part of the sixth A towel. The figure shows a partial enlarged side view of the D part of Figure 6A.

七圖至為本發明金屬外殼加工 主要元件符號說明】 方法之流程圖 【本發明】 1 金屬基板 11 底板 1 2 側板 2 固定槽 3 塑膠層 3 1 卡接部 4 組合孔 5 組合裝 置 6 功能元件 【習知】 201044950 1 a 金屬基板 2 a 定位孔 3 a 組合柱 4 a 組合孔 5 a 焊塊 6 a 螺絲 7 a 功能元件Figure 7 is a flow chart of the main components of the metal casing processing of the present invention. [Technical method] 1 Metal substrate 11 Base plate 1 2 Side plate 2 Fixing groove 3 Plastic layer 3 1 Contact portion 4 Combination hole 5 Combination device 6 Functional element [Practical] 201044950 1 a Metal substrate 2 a Positioning hole 3 a Combination column 4 a Combination hole 5 a Solder block 6 a Screw 7 a Functional element

99

Claims (1)

201044950 七、申清專利範圍: 1、 一種金屬外殼加工結構,包括: 一金屬基板; 至少一固定槽,該固定槽設置於該金屬基板,該 固定槽從該金屬基板表面穿入該金屬基板; 至少—塑膠層,該塑膠層設置於該金屬基板上, 並卡接於該固定槽;以及 至少一組合孔,該組合孔設置於該塑膠層,該組 合孔從該塑膠層表面延伸進入該塑膠層内。 2、 如申請專利範圍第1項所述之金屬外殼加工 結構’其中以模具成型的方式在該金屬基板上設置該 塑膠層,該塑膠層及該組合孔以模具成型為一體成型 的結構。 3、 如申請專利範圍第1項所述之金屬外殼加工 結構’其中該組合孔以鑽孔的方式形成。 4、 如申請專利範圍第1項所述之金屬外殼加工 結構,其中該組合孔為螺孔或卡孔。 5、 如申請專利範圍第丄項所述之金屬外殼加工 結構’其中該固定槽與該金屬基板表面呈斜角。 6、 如申請專利範圍第1項所述之金屬外殼加工 結構,其中該金屬基板具有一底板及至少一側板,該 側板位於該底板周緣。 7、 如申請專利範圍第6項所述之金屬外殼加工 結構,其中該底板及該側板皆具有該固定槽。 8、 一種金屬外殼加工方法,其步驟包括: (一)提供一金屬基板; 10 201044950 (二)在該金屬基板欲加工的位置設置至少一固 定槽’該固定槽從該金屬基板表面穿入該金屬基板; (一)在该金屬基板形成一底板及至少一側板, 該側板位於該底板周緣;以及 (四)在該金屬基板上設置至少一塑膠層,該塑 膠層卡接於該固定槽,並固定於該金屬基板上,及在 違塑膠層设置至少一組合孔,該組合孔從該塑膠層表 面延伸進入該塑膠層内。 9、如申請專利範圍第8項所述之金屬外殼加工 方法,其中該步驟(二)的該固定槽與該金屬基板表 面呈斜角。 1 ◦、如申請專利範圍第8項所述之金屬外殼加 工方法中該步驟(三)的該底板及該侧板皆具有 該固定槽。 〇 屬基板上設置該塑膠層, 成型為一體成型的結構。 11、如申請專利範圍第8項所述之金屬外殼加 :方法’其中該步驟(四)以模具成型的方式在該金 該塑膠層及該組合孔以模具 丄2 '如申請專利範圍第8項所述之金屬外殼加 ::法,其中該步驟(四)的該組合孔以鑽孔的方式 形成。 工方法, 13、如申請專利範圍第8項所述之金屬外殼加201044950 VII, Shen Qing patent scope: 1, a metal casing processing structure, comprising: a metal substrate; at least one fixing groove, the fixing groove is disposed on the metal substrate, the fixing groove penetrates the metal substrate from the surface of the metal substrate; At least a plastic layer, the plastic layer is disposed on the metal substrate and is engaged with the fixing groove; and at least one combined hole, the combined hole is disposed on the plastic layer, and the combined hole extends from the surface of the plastic layer into the plastic Within the layer. 2. The metal casing processing structure according to claim 1, wherein the plastic layer is provided on the metal substrate by molding, and the plastic layer and the combined hole are integrally formed by molding. 3. The metal casing processing structure according to claim 1, wherein the combined hole is formed by drilling. 4. The metal casing processing structure according to claim 1, wherein the combination hole is a screw hole or a card hole. 5. The metal casing processing structure of claim </RTI> wherein the fixing groove is at an oblique angle to the surface of the metal substrate. 6. The metal casing processing structure of claim 1, wherein the metal substrate has a bottom plate and at least one side plate, the side plate being located at a periphery of the bottom plate. 7. The metal casing processing structure of claim 6, wherein the bottom plate and the side plate have the fixing groove. 8. A method of processing a metal casing, the steps comprising: (1) providing a metal substrate; 10 201044950 (2) providing at least one fixing groove at a position to be processed of the metal substrate, the fixing groove penetrating from the surface of the metal substrate a metal substrate; (1) forming a bottom plate and at least one side plate on the metal substrate, the side plate is located at a periphery of the bottom plate; and (4) providing at least one plastic layer on the metal substrate, the plastic layer being stuck to the fixing groove, And being fixed on the metal substrate, and at least one combination hole is disposed in the plastic-proof layer, and the combined hole extends from the surface of the plastic layer into the plastic layer. 9. The metal casing processing method according to claim 8, wherein the fixing groove of the step (2) is oblique to the surface of the metal substrate. In the metal casing processing method of claim 8, the bottom plate and the side plate of the step (3) have the fixing groove. The plastic layer is provided on the substrate of the substrate, and is formed into an integrally formed structure. 11. The method of claim 3, wherein the step (4) is in the form of a mold to mold the plastic layer and the combined hole by a mold ' 2 ' as claimed in claim 8 The metal casing described in the following is a method in which the combined hole of the step (4) is formed by drilling. Method, 13, as claimed in the scope of claim 8 1 4、如申請專利範n 工方法,其中該步驟(四) 功能元件組合於該組合孔。 11 201044950 1 5、如申請專利範圍第1 4項所述之金屬外殼 加工方法,其中該組合裝置為螺絲或卡筍。 C11 4, as in the patent application method, wherein the step (4) functional element is combined in the combined hole. The method for processing a metal casing as described in claim 14, wherein the combination device is a screw or a bamboo shoot. C1 1212
TW98119929A 2009-06-15 2009-06-15 Structure and method for processing metal shell TW201044950A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW98119929A TW201044950A (en) 2009-06-15 2009-06-15 Structure and method for processing metal shell

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW98119929A TW201044950A (en) 2009-06-15 2009-06-15 Structure and method for processing metal shell

Publications (1)

Publication Number Publication Date
TW201044950A true TW201044950A (en) 2010-12-16

Family

ID=45001510

Family Applications (1)

Application Number Title Priority Date Filing Date
TW98119929A TW201044950A (en) 2009-06-15 2009-06-15 Structure and method for processing metal shell

Country Status (1)

Country Link
TW (1) TW201044950A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI555454B (en) * 2012-02-10 2016-10-21 宏達國際電子股份有限公司 Mobile device, component and method for forming component
CN108093580A (en) * 2017-11-23 2018-05-29 广东欧珀移动通信有限公司 Housing and preparation method thereof and mobile terminal

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI555454B (en) * 2012-02-10 2016-10-21 宏達國際電子股份有限公司 Mobile device, component and method for forming component
CN108093580A (en) * 2017-11-23 2018-05-29 广东欧珀移动通信有限公司 Housing and preparation method thereof and mobile terminal

Similar Documents

Publication Publication Date Title
US9649733B2 (en) Methods for securing features to housings
CN109388187A (en) For the shell with shell and the electronic equipment of internal base
JP5614458B2 (en) Housing and manufacturing method thereof
EP1740027A3 (en) Method for manufacturing an overmolded electronic assembly
TW201044950A (en) Structure and method for processing metal shell
JP5380242B2 (en) Manufacturing method of electronic component mounting substrate and electronic component mounting substrate
JP2009064870A (en) Mold package
JP2010038920A (en) Backplate and backplate-equipped socket apparatus
CN103008417B (en) The stamping manufacture method of electronic installation metal shell and housing
US20110248136A1 (en) Protruding positioning pedestal
US20110033657A1 (en) Metal shell manufacturing structure and method
JP6312527B2 (en) Electronic component mounting structure with heat sink
US11197383B2 (en) Housing, housing manufacturing method and mobile terminal
CN102647852A (en) High heat radiation printed circuit board and production method thereof
JP2011114304A5 (en)
US7416011B2 (en) Electronic assembly having a substrate laminated within a backplate cavity
TW201103659A (en) Locking structure of Mg-Li alloy board and manufacturing method thereof
CN104869783B (en) Heat dissipation module assembly structure and manufacturing method thereof
TWI441589B (en) A composite structure and its manufacturing method
CN104219592A (en) Shell structure with electroacoustic device, equipment with electroacoustic device and manufacturing method of shell structure
TWM453335U (en) Structure for processing metal shell
US9138840B2 (en) Method for manufacturing a heat sink
TW201215281A (en) Electronic device and the molding method for the metallic housing thereof
CN204145687U (en) Shell structure with electroacoustic device and equipment
CN104052215B (en) Metal motor base and manufacturing method thereof