TW201139563A - Curable resin composition and light emitting device - Google Patents

Curable resin composition and light emitting device Download PDF

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Publication number
TW201139563A
TW201139563A TW100111349A TW100111349A TW201139563A TW 201139563 A TW201139563 A TW 201139563A TW 100111349 A TW100111349 A TW 100111349A TW 100111349 A TW100111349 A TW 100111349A TW 201139563 A TW201139563 A TW 201139563A
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Taiwan
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resin composition
curable resin
light
group
mass
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TW100111349A
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Chinese (zh)
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Yukio Maeda
Urara Takayanagi
Jiro Takahashi
Noriyasu Shinohara
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Jsr Corp
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/56Materials, e.g. epoxy or silicone resin
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909Post-treatment of the connector or wire bonding area
    • H01L2224/8592Applying permanent coating, e.g. protective coating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Led Device Packages (AREA)

Abstract

Disclosed is a curable resin composition which has high refractive index, excellent transparency, excellent heat resistance and the like. Specifically disclosed is a curable resin composition which contains (A) a siloxane polymer that is obtained from a silane compound containing a compound represented by general formula (1): (R1)PSi(X)4-P (wherein R1 represents a polymerizable organic group having 2-12 carbon atoms; X represents a hydrolyzable group; and p represents an integer of 1-3), (B) metal oxide particles, and (C) an organic solvent. The curable resin composition contains 50-2,000 parts by mass of the component (B) per 100 parts by mass of the component (A). The curable resin composition is a material for a cured film (2) that covers a light emitting element (1).

Description

201139563 六、發明說明: 【發明所屬之技術領域】 本發明係關於硬化性樹脂組成物及使用其獲得 裝置。 【先前技術】 發光二極體(LED )等之發光裝置,爲了保護 極體(LED )元件等之發光元件或改變發色,通常 裝材被覆發光元件而構成。且,已知以高折射率材 發光元件可提高取出光效率。 過去,一般使用環氧樹脂作爲該封裝材之材料 ,包含藍光LED元件或紫外線LED元件作爲發光 LED在發光元件附近的環氧樹脂(封裝材)會因 LED元件發出之近紫外光或自紫外線LED元件發出 光而黃化,而有因發光元件之發熱而熱劣化之問題 ,於電燈等要求高亮度之用途,自藍光LED元件或 LED元件之發光量較多,容易引起黃化或熱劣化。 據此,作爲於要求高亮度之用途中,亦不會因 光或紫外光而造成黃化,且難以熱劣化之封裝材, 出例如由二甲基聚矽氧烷所成之矽酮樹脂所構成之 。然而,該封裝材之問題爲折射率低,難以有效地 自LED元件發出之光。 專利文獻1及2揭示含有具有鍵結於矽原子之烯 酮樹脂與具有Si-H鍵之有機氫聚矽氧烷之矽酮樹脂 之發光 發光二 係以封 料被覆 。然而 元件之 自藍光 之紫外 。尤其 紫外線 近紫外 已開發 封裝材 取出來 基之矽 組成物 201139563 。該矽酮樹脂組成物若利用氫矽烷基化反應而交聯則獲得 硬化物。然而,該硬化物有折射率低之問題。 [先前技術文獻] 專利文獻 專利文獻1 :特開2004- 1 86 1 68號公報 專利文獻2 :特開2004-22 1 3 08號公報 【發明內容】 [發明欲解決之課題] 本發明係爲解決上述之過去問題而完成者,其目的係 提供一種折射率高、透明性優異、以及耐熱性等亦優異之 硬化性樹脂組成物,以及發光效率優異之發光裝置。 [用以解決課題之手段] 本發明者等人爲達成上述目的而進行積極硏究,發現 若利用含有具有特定構造之矽氧烷系聚合物及氧化銷等金 屬氧化物粒子之硬化性樹脂組成物,則可獲得折射率高、 透明性及耐熱性亦優異,以及龜裂耐性優異之膜,因而完 成本發明。 亦即,本發明係提供以下之[1]〜[9]者。 Π]—種發光裝置之製造方法,其包含下列步驟: (a )以硬化性樹脂組成物被覆發光元件之步驟,該 硬化性樹脂組成物含有: (A)由含有以下述通式(1)表示之化合物之矽烷化 -6- 201139563 合物獲得之矽氧烷系聚合物: (R')pSi(X)4-p (1) [通式(1)中,R1爲碳數2〜12之聚合性有機基,X爲 水解性基,及P爲1〜3之整數], (B)金屬氧化物粒子,及 (C )有機溶劑, 且上述(B)成分之調配量相對於上述(a)成分1〇〇 質量份爲50〜2,000質量份,及(^)加熱上述發光元件之 步驟。 [2] 如前述[1]所述之發光裝置之製造方法,其在上述 (c )步驟之前包含(b )以紫外線照射上述硬化性樹脂組 成物之被覆之步驟。 [3] —種發光裝置’其包含發光元件及形成於該發光 元件之表面上之硬化性樹脂組成物之硬化物的硬化膜,該 硬化性樹脂組成物含有(A)由含有以下述通式(1)表示 之化合物之矽烷化合物獲得之矽氧烷系聚合物: (R1)pSi(X)4.p (1) [通式(1)中,R1爲碳數2〜12之聚合性有機基,X爲 水解性基,及p爲1〜3之整數],及 (B)金屬氧化物粒子,且上述(B)成分之調配量相 對於上述(A)成分100質量份爲50~2,000質量份。 [4 ] 一種硬化性樹脂組成物,其含有 (A)由含有以下述通式(1)表示之化合物之矽烷化 合物獲得之矽氧烷系聚合物, 201139563 (R1)pSi(X)4-P ⑴ [通式(1)中,R1爲碳數2〜〗2之聚合性有機基,x爲 水解性基,及p爲1〜3之整數], (B) 金屬氧化物粒子,及 (C) 有機溶劑,且上述(B)成分之調配量相對於上 述(A)成分100質量份爲50〜2,000質量份。 [5] 如前述[4]所述之硬化性樹脂組成物,其中上述矽 烷化合物進而含有以下述通式(2)表示之化合物, (R2)qSi(X)4-q (2) [通式(2 )中,R2爲碳數1〜1 2之非聚合性有機基,X 爲水解性基,及q爲〇〜3之整數]。 [6] 如前述[4]或[5]所述之硬化性樹脂組成物,其中 以上述通式(1)表示之化合物與以上述通式(2)表示之 化合物之合計量中以上述通式(1 )表示之化合物之調配 量之質量比例爲10〜1〇〇質量%。 [7] 如前述[4]〜[6]中任一項所述之硬化性樹脂組成物 ,其中上述(B)成分爲數平均一次粒徑爲1〜i00nm之微 粒子。 [8 ]如前述[4 ]〜[7 ]中任一項所述之硬化性樹脂組成物 ,其爲發光元件之被覆用。 [9] 一種硬化性樹脂組成物之製造方法,其特徵爲在 (C)有機溶劑中混合(A)由含有以下述通式(!)表示 之化合物之矽烷化合物獲得之矽氧烷系聚合物及(B)金 屬氧化物粒子,製造前述[4]〜[8]中任一項所述之硬化性樹 201139563 脂組成物, (R1)pSi(X)4-p (1) [通式(1)中,R1爲碳數2~12之聚合性有機基,X爲 水解性基,及p爲1〜3之整數]。 [發明效果] 本發明之硬化性樹脂組成物之折射率高,且透明性、 耐熱性、龜裂耐性及耐光性優異。 本發明之硬化性樹脂組成物適宜作爲用以在發光元件 表面上形成硬化膜之材料。 在發光元件之表面上形成本發明之硬化性樹脂組成物 的硬化物之硬化膜之發光裝置具有高的發光效率^ 【實施方式】 針對本發明所用之各成分加以詳細說明。 [(A)成分:特定之矽氧烷系聚合物] (A)成分之砂氧烷系聚合物係由含有以下述通式 )表示之化合物’與視需要調配之以下述通式(2)表示 之化合物之矽烷化合物所得, (R )pSi(X)4-p . (1) [通式(1)中’ R爲碳數2〜12之聚合性有機基,X爲 水解性基,及P爲1〜3之整數], (R )qSi(X)4.q (2)[Technical Field] The present invention relates to a curable resin composition and an apparatus for obtaining the same. [Prior Art] A light-emitting device such as a light-emitting diode (LED) is generally constructed by coating a light-emitting element in order to protect a light-emitting element such as a polar body (LED) element or to change color. Further, it is known that a high refractive index material light-emitting element can improve light extraction efficiency. In the past, epoxy resin was generally used as the material of the package material, and the blue LED element or the ultraviolet LED element was used as the light-emitting LED. The epoxy resin (package material) in the vicinity of the light-emitting element was caused by the near-ultraviolet light emitted from the LED element or from the ultraviolet LED. The element emits light and is yellow, and there is a problem of thermal deterioration due to heat generation of the light-emitting element. In applications requiring high brightness such as electric lamps, the amount of light emitted from the blue LED element or the LED element is large, and yellowing or thermal deterioration is likely to occur. Accordingly, as an encapsulating material which is not required to be yellowed by light or ultraviolet light and which is hard to be thermally deteriorated, for example, an fluorenone resin formed of dimethyl polyoxyalkylene is used in applications requiring high brightness. Constituting it. However, the problem with this package is that the refractive index is low and it is difficult to effectively emit light from the LED elements. Patent Documents 1 and 2 disclose that a luminescent light-emitting system comprising an oxime resin having an oxime resin bonded to a ruthenium atom and an organic hydrogen polyoxyalkylene having a Si-H bond is coated with a sealant. However, the component is from the ultraviolet of the blue light. In particular, UV near UV has been developed for packaging materials to be taken from the base of the composition 201139563. The fluorenone resin composition is crosslinked by hydroquinone alkylation reaction to obtain a cured product. However, the cured product has a problem of a low refractive index. [PRIOR ART DOCUMENT] Patent Document 1: JP-A-2004-1861, JP-A-2006-1995 The object of the present invention is to provide a curable resin composition having a high refractive index, excellent transparency, heat resistance, and the like, and a light-emitting device having excellent luminous efficiency. [Means for Solving the Problems] The inventors of the present invention conducted active research to achieve the above object, and found that a curable resin composition containing a metal oxide particle such as a siloxane-based polymer having a specific structure and an oxidation pin is used. Further, the present invention can be obtained by obtaining a film having a high refractive index, excellent transparency and heat resistance, and excellent crack resistance. That is, the present invention provides the following [1] to [9]. Π] A method of producing a light-emitting device, comprising the steps of: (a) coating a light-emitting element with a curable resin composition, the hardenable resin composition comprising: (A) containing the following general formula (1)矽alkylation of the compound -6-201139563 Hydrate-derived polymer: (R')pSi(X)4-p (1) [In the formula (1), R1 is a carbon number of 2 to 12 a polymerizable organic group, X is a hydrolyzable group, and P is an integer of 1 to 3, (B) a metal oxide particle, and (C) an organic solvent, and the amount of the component (B) is relative to the above ( a) a component of 50 parts by mass to 2,000 parts by mass, and (^) a step of heating the above-mentioned light-emitting element. [2] The method for producing a light-emitting device according to the above [1], comprising the step (b) of irradiating the curable resin composition with ultraviolet rays before the step (c). [3] A light-emitting device comprising: a light-emitting element; and a cured film of a cured product of a curable resin composition formed on a surface of the light-emitting element, wherein the curable resin composition contains (A) (1) A siloxane compound obtained by a decane compound of the compound: (R1) pSi(X)4.p (1) [In the formula (1), R1 is a polymerizable organic group having a carbon number of 2 to 12 a group, X is a hydrolyzable group, and p is an integer of 1 to 3, and (B) a metal oxide particle, and the amount of the component (B) is 50 to 2,000 based on 100 parts by mass of the component (A). Parts by mass. [4] A curable resin composition comprising (A) a fluorene-based polymer obtained from a decane compound containing a compound represented by the following formula (1), 201139563 (R1) pSi(X)4-P (1) [In the formula (1), R1 is a polymerizable organic group having 2 to 2 carbon atoms, x is a hydrolyzable group, and p is an integer of 1 to 3], (B) metal oxide particles, and (C) In the organic solvent, the amount of the component (B) is 50 to 2,000 parts by mass based on 100 parts by mass of the component (A). [5] The curable resin composition according to the above [4], wherein the decane compound further contains a compound represented by the following formula (2), (R2)qSi(X)4-q (2) [ In (2), R2 is a non-polymerizable organic group having 1 to 12 carbon atoms, X is a hydrolyzable group, and q is an integer of 〇3 to 3). [6] The curable resin composition according to the above [4], wherein the compound represented by the above formula (1) and the compound represented by the above formula (2) are in the above-mentioned manner. The mass ratio of the compound represented by the formula (1) is 10 to 1% by mass. [7] The curable resin composition according to any one of the above [4], wherein the component (B) is a microparticle having a number average primary particle diameter of from 1 to 100 nm. [8] The curable resin composition according to any one of the above [4] to [7], which is used for coating a light-emitting element. [9] A method for producing a curable resin composition, characterized by mixing (A) a fluorene-based polymer obtained from a decane compound containing a compound represented by the following formula (!) in (C) an organic solvent; And (B) a metal oxide particle, the curable tree 201139563 lipid composition according to any one of the above [4] to [8], (R1) pSi(X)4-p (1) [formula ( In 1), R1 is a polymerizable organic group having 2 to 12 carbon atoms, X is a hydrolyzable group, and p is an integer of 1 to 3). [Effect of the Invention] The curable resin composition of the present invention has a high refractive index and is excellent in transparency, heat resistance, crack resistance, and light resistance. The curable resin composition of the present invention is suitably used as a material for forming a cured film on the surface of a light-emitting element. A light-emitting device in which a cured film of a cured product of the curable resin composition of the present invention is formed on the surface of a light-emitting element has high luminous efficiency. [Embodiment] Each component used in the present invention will be described in detail. [(A) component: specific alkoxycarbon-based polymer] The methane-alkyl polymer of the component (A) is prepared by containing a compound represented by the following formula () and optionally having the following formula (2) (R)pSi(X)4-p. (1) [In the formula (1), R is a polymerizable organic group having 2 to 12 carbon atoms, and X is a hydrolyzable group, and P is an integer from 1 to 3], (R )qSi(X)4.q (2)

[通式(2)中,R爲碳數卜丨]之非聚合性有機基,X 201139563 爲水解性基,及q爲0〜3之整數]。 通式(1 ) 、 ( 2 )中以X表示之水解性基通常係指可 在無觸媒且在過量水存在下,在室溫(25 °C)〜100 °C之溫 度範圍內加熱,使烷氧基水解生成矽烷醇基之基。再者, 水解性基可在水解後進一步縮合形成矽烷氧縮合物。 通式(1 )中附加字P爲1〜3之整數,較好爲1〜2之整數 〇 通式(2 )中附加字q爲0〜3之整數,較好爲0〜2之整數 〇 矽氧烷系聚合物若爲使至少兩個水解性矽烷化合物縮 合者即可。 矽氧烷系聚合物亦可殘留一部分未水解之水解性基。 且,矽氧烷系聚合物亦可爲一部分之矽烷醇基或水解性基 彼此縮合之部分縮合物。 通式(1 )、( 2 )中之水解性基X列舉爲氫原子、鹵 素原子、碳數1〜12之烷氧基、碳數卜12之鹵化烷氧基、碳 數2〜12之醯氧基、碳數2〜12之鹵化醯氧基等。碳數1~12之 烷氧基之較佳例列舉爲甲氧基、乙氧基等。碳數卜12之鹵 化烷氧基之較佳例列舉爲三氟甲氧基、三氯甲氧基、五氟 乙氧基、五氯乙氧基等。鹵素原子之較佳例列舉爲氟、氯 、溴、碘等。碳數2〜12之醯氧基之較佳例列舉爲乙醯氧基 、丙醯氧基、丁醯氧基等。碳數2〜12之鹵化醯氧基之較佳 例列舉爲三氟乙醯氧基、三氯乙醯氧基、五氟丙醯氧基、 五氯丙醯氧基 '七氟丁醯氧基、七氯丁醯氧基等。 -10- 201139563 通式(1 )中之聚合性有機基R1爲非水解性,較好爲 分子中具有自由基聚合性之官能基與陽離子聚合性之官能 基之任一者或二者之有機基。 又,所謂非水解性意指在使水解性基X水解之條件下 ,仍安定存在之性質。 自由基聚合性之官能基列舉爲具有碳原子數2〜1 0之烯 基、碳原子數2〜10之炔基等。陽離子聚合性官能基列舉爲 環氧乙烷(oxiranyl )、氧雜環丁烷等環氧基。藉由將該 種官能基導入於有機基R1中,倂用自由基聚合或陽離子聚 合,可使硬化性樹脂組成物更快速硬化。 通式(1)之化合物可列舉爲2-(甲基)丙烯醯氧基 乙基三甲氧基矽烷、2-(甲基)丙烯醯氧基乙基三乙氧基 矽烷、3-(甲基)丙烯醯氧基丙基三甲氧基矽烷、3-(甲 基)丙烯醯氧基丙基三乙氧基矽烷、3-(甲基)丙烯醯氧 基丙基甲基二甲氧基砍院、3-(甲基)丙稀醯氧基丙基三 異丙烯氧基矽烷 '乙烯基三甲氧基矽烷、3_縮水甘油氧基 丙基三甲氧基矽烷、3-縮水甘油氧基丙基甲基二乙氧基矽 烷、2-(3,4-環氧基環己基)乙基三甲氧基矽烷、[3-[(3-乙基-3-氧雜環丁烷基)甲氧基]丙基三甲氧基矽烷、3-( 3-甲基-3-氧雜環丁烷甲氧基)丙基三甲氧基矽烷、氧雜環 己基三甲氧基矽烷等。 通式(2 )中之聚合性有機基R2爲非水解性基,爲碳 數1〜12之非聚合性有機基。 有機基R2列舉爲碳數1〜12之烴基、碳數1〜12之鹵化烴 -11 - 201139563 基等。有機基R1可爲直鏈狀、分支狀、環狀或亦可爲該等 之組合。且,有機基R1亦可爲含有雜原子之構造。該等構 造單位可例示爲醚鍵、酯鍵、硫醚鍵等。 有機基R1中之碳數卜12之烴基就反應性及所得膜之龜 裂耐性之觀點而言,較好爲碳數1〜8之烴基,更好爲碳數 1〜4之烴基。具體而言,可列舉爲甲基、乙基、正丙基、 異丙基、正丁基、異丁基、第三丁基等脂肪族烴基、環丙 基、環丁基、環戊基、環己基等之脂環族烴基、苯基、甲 基苯基、乙基苯基、苄基等芳香族烴基,較好爲甲基、乙 基、正丙基、異丙基、第三丁基、苯基、甲基苯基,更好 爲甲基、乙基。 又,有機基R1中經鹵素原子取代之碳數1〜12之烴基列 舉爲氟化烴基、氯化烴基、溴化烴基,較好爲氟化烴基。 該烴基之碳數就反應性及所得膜之龜裂耐性之觀點而言, 較好爲1〜4。 具體而言可列舉爲氯甲基、二氯甲烷、三氯甲基、氟 甲基、二氟甲基、三氟甲基、2,2,2-三氟乙基、五氟乙基 、全氟正丙基、全氟異丙基、全氟正丁基、全氟異丁基、 全氟第三丁基,較好爲氟甲基、二氟甲基、三氟甲基、 2,2,2-三氟乙基、五氟乙基、全氟正丙基、全氟異丙基、 全氟第三丁基,更好爲氟甲基、二氟甲基、三氟甲基、 2,2,2-三氟乙基、五氟乙基。 說明以通式(2 )表示之水解性矽烷化合物之具體例 -12- 201139563 具有四個水解性基之矽烷化合物列舉爲四氯矽烷、四 胺基矽烷、四乙醯氧基矽烷、四甲氧基矽烷、四乙氧基矽 烷、四丁氧基矽烷、四苯氧基矽烷、四苄氧基矽烷、三甲 氧基矽烷、三乙氧基矽烷等。 具有三個水解性基之矽烷化合物列舉爲甲基三氯矽烷 、甲基三甲氧基矽烷、甲基三乙氧基矽烷、甲基三丁氧基 矽烷、乙基三甲氧基矽烷、乙基三異丙氧基矽烷、乙基三 丁氧基矽烷、丁基三甲氧基矽烷、五氟苯基三甲氧基矽烷 、苯基三甲氧基矽烷、d3-甲基三甲氧基矽烷、九氟丁基乙 基三甲氧基矽烷、三氟甲基三甲氧基矽烷等。 具有兩個水解性基之矽烷化合物列舉爲二甲基二氯矽 烷、二甲基二胺基矽烷、二甲基二乙醯氧基矽烷、二甲基 二甲氧基矽烷、二苯基二甲氧基矽烷、甲基苯基二甲氧基 矽烷、二丁基二甲氧基矽烷等。 具有一個水解性基之矽烷化合物列舉爲三甲基氯矽烷 、六甲基二矽氮烷、三甲基矽烷、三丁基矽烷、三甲基甲 氧基矽烷、三丁基乙氧基矽烷等。 針對(A )成分之矽氧烷系聚合物加以說明。該分子 量可使用四氫肤喃爲移動相,利用凝膠滲透層析儀(以下 簡稱爲GPC) ’以聚苯乙烯換算之重量平均分子量測定。 矽氧烷系聚合物之重量平均分子量較好爲5 00〜 100,000 ’ 更好爲 800~30,000 ’ 又更好爲 1,〇〇〇〜5,000。該 値未達5 0 0時’會有硬化膜形成時之龜裂耐性下降之傾向 。該値超過100,000時,會有(B)成分之金屬氧化物粒子 -13- 201139563 之分散性降低之傾向。 以通式(1)表示之化合物與以通式(2)表示之化合 物之合計量中’以通式(1)表示之化合物之調配量之質 量比例較好爲1 0〜1 〇〇質量%,更好爲2 0〜1 〇 〇質量%,最好 爲3 0〜1 0 0質量%,該比例未達1 0質量%會有龜裂耐性變差 之情況。 上述矽氧烷系聚合物通常係在觸媒存在下,使含有以 上述通式(1)表示之化合物,與視需要調配之以下述通 式(2 )表示之化合物之矽烷化合物經水解及縮合獲得。 獲得矽氧烷系聚合物時之觸媒較好爲由金屬螯合化合物、 酸性化合物、及鹼性化合物所選出之至少一種化合物,更 好爲酸性化合物。 (a)金屬螯合化合物 可作爲觸媒使用之金屬螯合化合物係以下述通式(3 )表示。 R15eM(OR16)f.e ......(3) (式中’ R15爲螯合劑,Μ爲金屬原子,Ri6表示烷基 或方基’ f表不金麗Μ之原子價,e表示1〜f之整數)。 其中’金屬Μ較好爲由ΙΠΒ族金屬(鋁、鎵、銦、鉬 )及IV Α族金屬(鈦、銷、給)選出之至少—種金屬,更 好爲鈦,鋁、锆。 以R15表示之蜜合劑可列舉爲CH3C〇CH2C〇c:H3、 CH3COCH2COOC2H5 等》 以R16表不之院基列舉爲甲基、乙基、正丙基、異丙 -14- 201139563 基、正丁基、異丁基、第三丁基,且作爲芳基可列舉爲苯 基、甲基苯基、乙基苯基、苄基等。 金屬螯合化合物之較佳具體例列舉爲(CH3 ( CH3 ) HCO) 4-t Ti ( CH3COCH2COCH3 ) , ' ( CH3 ( CH3 ) HCO ) 4-tTi ( CH3COCH2CO〇C2H5 ) , ' ( C4H9O ) 4-tTi-( CH3COCH2COCH3 ) t 、 ( C4H9O ) 4-tTi ( CH3COCH2COOC2H5 ) t ' ( C2H5 ( CH3 ) CO ) 4-tTi ( CH3COCH2COCH3 ) t ' ( C2H5 ( CH3 ) CO ) 4.tTi ( CH3COCH2COOC2H5 ) t ' ( CH3 ( CH3 ) HCO ) 4-tZr ( CH3COCH2COCH3 ) t ' ( CH3 ( CH3 ) HCO ) 4-tZr ( CH3COCH2COOC2H5 ) . ' ( C4H9O ) 4-tZr ( CH3COCH2COCH3 ) t 、 ( C4H9O ) 4-tZr ( CH3COCH2COOC2H5 ) t ' ( C2H5 ( CH3 ) CO ) 4-tZr ( CH3COCH2COCH3 ) t ' ( C2H5 ( CH3 ) CO ) 4-«Zr ( CH3COCH2COOC2H5 ) t ' ( CH3 ( CH3 ) HCO ) 3-tAl ( CH3COCH2COCH3 ) t ' ( CH3 ( CH3 ) HCO ) 3.,A1 ( CH3COCH2COOC2H5 ) « 、 ( C4H9O ) 3-tAl ( CH3COCH2COCH3 ) t ' ( C4H9O ) 3,,A1 ( CH3COCH2COOC2H5 ) t ' ( C2H5 ( CH3 ) CO ) 3-tAl ( CH3COCH2COCH3 ) t ' ( C2H5 ( CH3 ) CO ) 3-tAl ( CH3COCH2COOC2H5 ) t等。 金屬螯合化合物之量相對於前述矽烷化合物之合計量 100質量份(換算完全水解縮合物)’較好爲0·0001〇質 量份,更好爲0.001~5質量份。該量未達0.000 1質量份,會 -15- 201139563 有塗膜之塗佈性變差之情況,超過〗0質量份時,無法控制 聚合物成長’有引起凝膠化之情況。 在金屬蜜合化合物存在下使水解性矽烷化合物水解縮 合時’砂院化合物之合計量每1莫耳較好使用05〜20莫耳 之水’最好使用1〜10莫耳之水。水量未達〇.5莫耳時,水 解反應無法充分進行,有塗佈性及儲存安定性發生問題之 情況’超過20莫耳時,會有水解及縮合反應中聚合物析出 或發生凝膠化之情況。且’水較好間歇性或連續添加。 (b )酸性化合物 可作爲觸媒使用之酸性化合物可例示爲有機酸或無機 酸,較好爲有機酸。 有機酸可列舉爲例如乙酸、丙酸、丁酸、戊酸、己酸 、庚酸、辛酸、壬酸、癸酸、草酸、馬來酸、甲基丙二酸 、己二酸、癸二酸、沒食子酸、丁酸、苯六甲酸( Mellitic acid)、花生四烯酸、莽草酸(shikimicacid)、 乙基己酸、油酸、硬脂酸、亞油酸(linoleic acid)、 亞麻酸(linolenic acid)、水楊酸、苯甲酸、對-胺基苯 甲酸、對-甲苯磺酸、苯磺酸、單氯乙酸、二氯乙酸、Ξ 氯乙酸、三氟乙酸、甲酸、丙二酸、磺酸、苯二甲酸、富 馬酸、檸檬酸、酒石酸、馬來酸酐、富馬酸、衣康酸、號 珀酸、中康酸、檸康酸、蘋果酸、丙二酸、戊二酸之水解 物、馬來酸酐之水解物、苯二甲酸酐之水解物等。 無機酸可列舉爲例如鹽酸、硝酸、硫酸、氫氟酸、鱗 -16- 201139563 酸等。 其中’就水解縮合(水解及其後續之縮合)反應中之 聚合物析出或凝膠化之虞較少觀點而言較好爲有機酸,其 中’更好爲具有羧基之化合物。 具有羧機之化合物中,最好爲乙酸、草酸、馬來酸、 甲酸、丙二酸、苯二甲酸、富馬酸'衣康酸、琥珀酸、中 康酸、檸康酸、蘋果酸、丙二酸、戊二酸、馬來酸酐之水 解物等有機酸。 該等酸性化合物可單獨使用一種或組合兩種以上使用 〇 酸性化合物之量相對於矽烷化合物之合計量1 00質量 份(換算完全水解縮合物),較好爲〇. 〇 〇 〇 1〜1 〇質量份, 更好爲〇·〇〇1~5質量份。該量未達o.oool質量份時,會有塗 膜之塗佈性變差之情況,超過1 0質量份時,會有水解縮合 反應急速進行而引起凝膠化之情況。 在酸性化合物存在下使水解性矽烷化合物水解縮合時 ,矽烷化合物之合計量每1莫耳較好使用0.5〜20莫耳之水 ,最好使用1〜10莫耳之水。水量未達0.5莫耳時,水解反 應無法充分進行,會有塗佈性及儲存安定性發生問題之情 況,超過20莫耳時,會有水解縮合反應中之聚合物析出或 發生凝膠化之情況。且,水較好間歇性或連續添加。 (c )鹼性化合物 可作爲觸媒使用之鹼性化合物列舉爲例如甲醇胺、乙 -17- 201139563 醇胺、丙醇胺、丁醇胺、N-甲基甲醇胺、N-乙基甲醇 N-丙基甲醇胺、N-丁基甲醇胺、N-甲基乙醇胺、N-乙 醇胺、N-丙基乙醇胺、N,N-二甲基甲醇胺、Ν,Ν·二乙 醇胺、Ν,Ν-二丙基甲醇胺、Ν,Ν-二丁基甲醇胺、Ν-甲 甲醇胺、Ν-乙基二甲醇胺、Ν-丙基二甲醇胺、Ν-丁基 醇胺、Ν-(胺基甲基)甲醇胺、Ν-(胺基甲基)乙醇 Ν-(胺基甲基)丙醇胺、Ν-(胺基甲基)丁醇胺、甲 甲基胺、甲氧基乙基胺、甲氧基丙基胺、甲氧基丁基 Ν,Ν-二甲基胺、Ν,Ν-二乙基胺、Ν,Ν-二丙基胺、Ν,Ν-基胺、三甲基胺、三乙基胺、三丙基胺、三丁基胺、 化四甲基銨、氫氧化四乙基銨、氫氧化四丙基銨、氫 四丁基銨、四甲基乙二胺、四乙基乙二胺、四丙基乙 、氨、氫氧化鈉 '氫氧化鉀、氫氧化四甲基銨、氫氧 乙基銨、氫氧化四正丙基銨、氫氧化四正丁基銨、溴 甲基銨、氯化四甲基銨、溴化四乙基銨。 鹼性化合物之量相對於矽烷化合物中之水解性基 計量1莫耳,較好爲0.0000 1〜1〇莫耳,更好爲0.00005 耳。 [(Β )成分:金屬氧化物粒子] 本發明中使用具有高折射率之金屬氧化物以獲得 商折射率之硬化物。該等微粒子只要是在25。(:之 40〇nm之光之折射率較好爲丨55以上,更好爲丨6〇以 最好爲1 .70以上之微粒子則無特別限制,列舉爲例如 胺、 基乙 基甲 基二 二甲 胺、 氧基 胺、 二丁 氫氧 氧化 二胺 化四 化四 之合 〜5莫 具有 波長 上, 氧化 -18- 201139563 銷、氧化鈦、氧化鋅、氧化鉅、氧化銦、氧化給、氧化錫 、氧化鈮及該等之複合物等金屬氧化物粒子。其中,以氧 化鍩(Zr〇2)之微粒子較佳。 上述氧化鈦只要具有T i Ο 2構造者即無特別限制,列舉 爲例如銳鈦礦型、金紅石型、板鈦礦型。 該等金屬氧化物粒子可單獨使用一種,或組合兩種以 上使用。 (B)成分之金屬氧化物粒子之數平均一次粒徑較好 爲1〜lOOnm,更好爲3〜70nm,最好爲5〜50nm。金屬氧化物 粒子之數平均一次粒徑可利用例如透過型電子顯微鏡觀察 測定作爲數平均粒徑。粒子不爲球形時,以長軸與短軸之 平均作爲粒徑,長軸/短軸之比爲2以上時以短軸作爲粒徑 。數平均一次粒徑在上述範圍內時,可獲得透明性優異之 硬化物。 (B)成分之金屬氧化物粒子在與(A)成分及(C) 成分混合前,可爲粉體狀,亦可爲溶劑分散之溶膠。溶劑 係使用例如有機溶劑。有機溶劑列舉爲例如2-丁醇、甲醇 、甲基乙基酮、甲基異丁基酮、環己酮、N-甲基-2-吡咯 烷酮、丙二醇單甲基醚等。 (B )成分之調配量相對於(A )成分1 〇 〇質量份爲 50〜2,000質量份,較好爲100〜1,5 00質量份,更好爲 150〜1,000質量份。該量超過2,000質量份時,會有無法獲 得充分龜裂耐性之虞,該量未達5 0質量份時,硬化膜(組 成物之硬化物)之折射率降低,會有發光裝置之發光效率 -19- 201139563 降低之虞。 再者’ (B)成分爲溶劑分散之溶膠時,(B )成分之 調配量係指不含溶劑之質量。又,(b )成分爲溶劑分散 之溶膠時,作爲(B)成分之溶劑之有機溶劑量爲構成(C )成分之有機溶劑之調配量之一部分者。 [(C )成分:有機溶劑] 本發明可藉由調配有機溶劑而提高組成物之儲存安定 性,且可賦予適當之黏度。 有機溶劑列舉爲醚系有機溶劑、酯系有機溶劑、酮系 有機溶劑、烴系有機溶劑、醇系有機溶劑等。作爲有機溶 劑較好使用在大氣壓下(l,013hPa)之沸點爲50〜2 5(TC之 範圍內,可使各成分均勻分散之有機溶劑^ 該等有機溶劑列舉爲例如脂肪族烴系溶劑、芳香族烴 系溶劑、單醇系溶劑、多元醇系溶劑、酮系溶劑、醚系溶 劑、酯系溶劑、含氮系溶劑、含硫系溶劑等。該等有機溶 劑可單獨使用一種或組合兩種以上使用。 有機溶劑中,就更提高組成物之儲存安定性之觀點而 言,較好爲單醇系溶劑、多元醇系溶劑、及酮系溶劑。該 等溶劑之較佳化合物之例列舉爲丙二醇單甲基醚、乳酸乙 酯、甲基乙基酮、甲基異丁蕋酮、環己酮、甲基戊基酮、 甲醇、乙醇、2-丁醇等。該等較佳之化合物可單獨使用一 種或組合兩種以上使用。 本發明中,有機溶劑之種類較好考慮組成物之塗佈方 -20- 201139563 法進行選擇。例如,爲了容易獲得具有均勻厚度之硬化膜 (組成物之硬化物)而使用旋轉塗佈法時,有機溶劑較好 使用乙二醇單乙基醚、丙二醇單甲基醚等二醇醚類;乙基 溶纖素乙酸酯、丙二醇甲基醚乙酸酯、丙二醇乙基醚乙酸 酯等乙二醇烷基醚乙酸酯類;乳酸乙酯、2-羥基丙酸乙酯 等酯類;二乙二醇單甲基醚、二乙二醇二甲基醚、二乙二 醇乙基甲基醚等二乙二醇類;甲基乙基酮、甲基異丁基酮 、2_庚酮、環己酮、甲基戊基酮等酮類;γ_ 丁內酯等。 最佳之有機溶劑爲乙基溶纖素乙酸酯、丙二醇單甲基 醚、丙二醇甲基醚乙酸酯、乳酸乙酯、甲基乙基酮、甲基 異丁基酮、甲基戊基酮等。 (c)成分(有機溶劑)之調配量相對於該有機溶劑 除外之組成物之成分總量100質量份,較好爲50〜20,000質 量份,更好爲100〜1,000質量份。若在前述之較佳範圍內 ’則可提高組成物之儲存安定性,且賦予適當之黏度,可 容易地形成具有均勻厚度之高折射率硬化膜。 (c )成分之添加方法並無特別限制,例如可在製造 (Α)成分時添加’亦可在調製含有(β)成分之分散液時 添加,亦可在混合(A)成分與(Β )成分時添加。 [(D )成分:分散劑] 本發明之硬化性樹脂組成物可使用各種分散劑以提高 金屬氧化物粒子之分散性。 作爲分散劑可使用例如錦化合物。錫化合物之例列舉 -21 - 201139563 爲烷氧化鋁、鋁β-二酮酸酯錯合物等。具體而言可列舉爲 三乙氧基鋁、三(正丙氧基)鋁、三(異丙氧基)鋁、三 (正丁氧基)鋁、三(第二丁氧基)鋁等烷氧化合物,鋁 參(甲基乙醯乙酸酯)、鋁參(乙基乙醯乙酸酯)、參( 乙醯丙酮酸)鋁 '鋁單乙醯基丙酮酸酯雙(甲基乙酸酯) 、鋁單乙醯基丙酮酸酯雙(乙基乙酸酯)等之β -二酮酸酯 錯合物。 鋁化物之市售品可使用AIPD' PADM、AMD、ASBD 、乙氧化銘 ' ALCH ' ALCH-50F、ALCH-75、ALCH-TR、 ALCH-TR-20、鋁螯合物M、鋁螯合物D、鋁螯合物A(W )、表面處理劑 OL- 1 000、ALUGOMER、ALUGOMER 800AF、ALUGOMER 1000SF (以上爲川硏精密化學公司製 造)等。 分散劑可使用非離子型分散劑。藉由使用非離子型分 散劑’可提高分散性。本發明所使用之非離子型分散劑較 好爲具有聚氧乙烯烷基構造之磷酸酯系非離子型分散劑。 分散劑之調配量並無特別限制,但含有分散劑時,相 對於有機溶劑除外之組成物成分總量1 〇 〇質量%爲例如 0.1 ~ 2 0 質量 %。 [(E )成分:分散助劑] 本發明之硬化性樹脂組成物可進一步含有分散助劑以 提高分散性。分散助劑可適當使用由乙醯基丙酮、N,N_: 甲基乙醯基乙醯胺等之一種以上。 -22- 201139563 分散助劑之調配量並無特別限制,但含有分散助齊|j時 ,相對於有機溶劑除外之組成物成分總量1 00質量%爲例如 0.1〜10質量%。 [(F )成分:界面活性劑] 以旋轉塗佈將本發明之硬化性樹脂組成物塗佈於基材 等時,就獲得具有均勻厚度之塗膜之觀點而言,較好調配 界面活性劑。 本發明中使用之界面活性劑列舉爲矽酮系界面活性劑 、截系界面活性劑等。其中,以砂酮系界面活性劑較佳。 矽酮系界面活性劑之例可列舉爲例如SH28P A ( Tor ay Dow Corning公司製造,二甲基聚矽氧烷聚氧伸烷基共聚 物)、PEINTADO 19、54 ( Toray Dow Corning公司製造, 二甲基聚矽氧烷聚氧伸烷基共聚物)、FM0411 ( SILAPLANE,CHISSO公司製造)、SF 8428 ( Toray Dow Corning公司製造,二甲基聚矽氧烷聚氧伸烷基共聚物( 側鏈含有OH ) ) 、BYKUV3510 (日本BYK公司製造,二 甲基聚矽氧烷-聚氧伸烷基共聚物)、DC5 7 ( Toray Dow Corning公司製造,二甲基聚矽氧烷-聚氧伸烷基共聚物) 、DC190( Toray Dow Corning公司製造,二甲基聚石夕氧 烷-聚氧伸烷基共聚物)、SILAPLANE FM-4411、FM-442 1 、FM-4425、FM-771 1、FM-772 1、FM-7 72 5、FM-041 1、 FM-042 1、FM-042 5、FM-DA11、FM-DA21、FM-DA26、 FM071 1 、 FM072 1 、 FM-0725 、 TM-070 1 、 TM-070 1 T ( -23- 201139563 CHISSO 公司製造)、UV3500、UV3510、UV3 5 3 0 (曰本 BYK 公司製造)、BY1 6-004、SF8428 ( Toray DowIn the formula (2), R is a non-polymerizable organic group of carbon number, X 201139563 is a hydrolyzable group, and q is an integer of 0 to 3]. The hydrolyzable group represented by X in the general formulae (1) and (2) generally means that it can be heated at a temperature ranging from room temperature (25 ° C) to 100 ° C in the absence of a catalyst and in the presence of excess water. The alkoxy group is hydrolyzed to form a stanol group. Further, the hydrolyzable group may be further condensed after hydrolysis to form a decane oxygen condensate. The additional word P in the general formula (1) is an integer of 1 to 3, preferably an integer of 1 to 2, and the additional word q in the general formula (2) is an integer of 0 to 3, preferably 0 to 2 The polyoxyalkylene-based polymer may be one in which at least two hydrolyzable decane compounds are condensed. The a naphthenic polymer may also remain a part of the unhydrolyzed hydrolyzable group. Further, the siloxane-based polymer may be a partial condensate in which a part of the stanol group or the hydrolyzable group is condensed with each other. The hydrolyzable group X in the general formulae (1) and (2) is exemplified by a hydrogen atom, a halogen atom, an alkoxy group having 1 to 12 carbon atoms, a halogenated alkoxy group having a carbon number of 12, and a carbon number of 2 to 12. An oxy group, a halogenated fluorenyl group having 2 to 12 carbon atoms, and the like. Preferable examples of the alkoxy group having 1 to 12 carbon atoms are methoxy group, ethoxy group and the like. Preferred examples of the halogenated alkoxy group of the carbon number 12 are a trifluoromethoxy group, a trichloromethoxy group, a pentafluoroethoxy group, a pentachloroethoxy group and the like. Preferred examples of the halogen atom are fluorine, chlorine, bromine, iodine and the like. Preferred examples of the decyloxy group having 2 to 12 carbon atoms are ethoxycarbonyl, propyloxy, butanoxy and the like. Preferred examples of the halogenated oxy group having 2 to 12 carbon atoms are trifluoroacetoxy, trichloroacetoxy, pentafluoropropoxy, and pentachloropropoxycarbonyl heptafluorobutoxy , heptachlorobutoxy group and the like. -10- 201139563 The polymerizable organic group R1 in the formula (1) is non-hydrolyzable, and is preferably organic of either a radical polymerizable functional group and a cationically polymerizable functional group in the molecule. base. Further, the term "non-hydrolyzable" means a property which is still stable under the condition that the hydrolyzable group X is hydrolyzed. The functional group of the radical polymerizable property is exemplified by an alkenyl group having 2 to 10 carbon atoms and an alkynyl group having 2 to 10 carbon atoms. The cationically polymerizable functional group is exemplified by an epoxy group such as oxiranyl or oxetane. By introducing such a functional group into the organic group R1, the curable resin composition can be hardened more rapidly by radical polymerization or cationic polymerization. The compound of the formula (1) can be exemplified by 2-(meth)acryloxyethyltrimethoxydecane, 2-(methyl)propenyloxyethyltriethoxydecane, 3-(methyl Propylene methoxy propyl trimethoxy decane, 3-(methyl) propylene methoxy propyl triethoxy decane, 3-(methyl) propylene methoxy propyl methyl dimethoxy cleavage 3-(Methyl)allyloxypropyltriisopropoxy oxane 'vinyltrimethoxydecane, 3-glycidoxypropyltrimethoxydecane, 3-glycidoxypropyl A Diethoxy decane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxydecane, [3-[(3-ethyl-3-oxetanyl)methoxy] Propyltrimethoxydecane, 3-(3-methyl-3-oxetanylmethoxy)propyltrimethoxydecane, oxetanyltrimethoxydecane, and the like. The polymerizable organic group R2 in the formula (2) is a non-hydrolyzable group and is a non-polymerizable organic group having 1 to 12 carbon atoms. The organic group R2 is exemplified by a hydrocarbon group having 1 to 12 carbon atoms, a halogenated hydrocarbon having 1 to 12 carbon atoms, and a base such as 201139563. The organic group R1 may be linear, branched, cyclic or a combination thereof. Further, the organic group R1 may also be a structure containing a hetero atom. These structural units can be exemplified by an ether bond, an ester bond, a thioether bond or the like. The hydrocarbon group of the carbon number 12 in the organic group R1 is preferably a hydrocarbon group having 1 to 8 carbon atoms, more preferably a hydrocarbon group having 1 to 4 carbon atoms, from the viewpoint of reactivity and crack resistance of the obtained film. Specific examples thereof include aliphatic hydrocarbon groups such as methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl and t-butyl groups, cyclopropyl, cyclobutyl and cyclopentyl groups. An aromatic hydrocarbon group such as an alicyclic hydrocarbon group such as a cyclohexyl group, a phenyl group, a methylphenyl group, an ethylphenyl group or a benzyl group, preferably a methyl group, an ethyl group, a n-propyl group, an isopropyl group or a t-butyl group. Phenyl, methylphenyl, more preferably methyl or ethyl. Further, the hydrocarbon group having 1 to 12 carbon atoms which is substituted by a halogen atom in the organic group R1 is a fluorinated hydrocarbon group, a chlorinated hydrocarbon group or a brominated hydrocarbon group, and preferably a fluorinated hydrocarbon group. The carbon number of the hydrocarbon group is preferably from 1 to 4 from the viewpoint of reactivity and crack resistance of the obtained film. Specific examples thereof include chloromethyl, dichloromethane, trichloromethyl, fluoromethyl, difluoromethyl, trifluoromethyl, 2,2,2-trifluoroethyl, pentafluoroethyl, and all. Fluorylpropyl, perfluoroisopropyl, perfluoro-n-butyl, perfluoroisobutyl, perfluoro-tert-butyl, preferably fluoromethyl, difluoromethyl, trifluoromethyl, 2,2 , 2-trifluoroethyl, pentafluoroethyl, perfluoro-n-propyl, perfluoroisopropyl, perfluoro-t-butyl, more preferably fluoromethyl, difluoromethyl, trifluoromethyl, 2 , 2,2-trifluoroethyl, pentafluoroethyl. Specific examples of the hydrolyzable decane compound represented by the general formula (2) - 201139563 The decane compound having four hydrolyzable groups is exemplified by tetrachlorodecane, tetraaminodecane, tetraethoxydecane, tetramethoxy A decyl alkane, a tetraethoxy decane, a tetrabutoxy decane, a tetraphenoxy decane, a tetrabenzyloxy decane, a trimethoxy decane, a triethoxy decane, or the like. The decane compound having three hydrolyzable groups is exemplified by methyltrichlorodecane, methyltrimethoxydecane, methyltriethoxydecane, methyltributoxydecane, ethyltrimethoxydecane, ethyltri Isopropoxydecane, ethyltributoxydecane, butyltrimethoxydecane, pentafluorophenyltrimethoxydecane, phenyltrimethoxydecane, d3-methyltrimethoxydecane, nonafluorobutyl Ethyltrimethoxydecane, trifluoromethyltrimethoxydecane, and the like. The decane compound having two hydrolyzable groups is exemplified by dimethyldichlorodecane, dimethyldiaminodecane, dimethyldiethoxydecane, dimethyldimethoxydecane, diphenyldimethyl Oxydecane, methylphenyldimethoxydecane, dibutyldimethoxydecane, and the like. The decane compound having one hydrolyzable group is exemplified by trimethylchlorodecane, hexamethyldioxane, trimethyldecane, tributyldecane, trimethylmethoxydecane, tributylethoxysilane, and the like. . The naphthenic polymer of the component (A) will be described. The molecular weight can be measured by using a gel permeation chromatograph (hereinafter abbreviated as GPC) in terms of a weight average molecular weight in terms of polystyrene using a tetrahydrofuran as a mobile phase. The weight average molecular weight of the decane-based polymer is preferably from 50,000 to 100,000 Å, more preferably from 800 to 30,000 Å, still more preferably from 1, 〇〇〇 to 5,000. When the enthalpy is less than 50,000, the crack resistance at the time of formation of a cured film tends to decrease. When the cerium exceeds 100,000, the dispersibility of the metal oxide particles -13 to 201139563 of the component (B) tends to decrease. The mass ratio of the compound represented by the formula (1) to the compound represented by the formula (1) in the total amount of the compound represented by the formula (1) is preferably from 10 to 1% by mass. More preferably, it is 2 0 to 1 〇〇 mass%, preferably 3 0 to 1 0 0% by mass, and the ratio is less than 10% by mass, and crack resistance is deteriorated. The above-mentioned oxane-based polymer is usually hydrolyzed and condensed by a decane compound containing a compound represented by the above formula (1) and optionally a compound represented by the following formula (2) in the presence of a catalyst. obtain. The catalyst for obtaining the siloxane polymer is preferably at least one compound selected from the metal chelating compound, the acidic compound, and the basic compound, and more preferably an acidic compound. (a) Metal chelating compound The metal chelating compound which can be used as a catalyst is represented by the following general formula (3). R15eM(OR16)fe ......(3) (wherein R15 is a chelating agent, Μ is a metal atom, Ri6 represents an alkyl group or a square group' f represents the valence of gold iridium, and e represents 1~ The integer of f). The metal ruthenium is preferably at least one metal selected from the group consisting of lanthanum metals (aluminum, gallium, indium, molybdenum) and IV lanthanum metals (titanium, pin, feed), more preferably titanium, aluminum or zirconium. The honey-binding agent represented by R15 may be exemplified by CH3C〇CH2C〇c:H3, CH3COCH2COOC2H5, etc., and the substituents represented by R16 are listed as methyl, ethyl, n-propyl, isopropyl-14-201139563, n-butyl. And an isobutyl group and a tributyl group, and examples of the aryl group include a phenyl group, a methylphenyl group, an ethylphenyl group, a benzyl group and the like. Preferred examples of the metal chelate compound are (CH3 (CH3) HCO) 4-t Ti (CH3COCH2COCH3), '(CH3(CH3) HCO) 4-tTi(CH3COCH2CO〇C2H5) , '(C4H9O) 4-tTi -( CH3COCH2COCH3 ) t , ( C4H9O ) 4-tTi ( CH3COCH2COOC2H5 ) t ' ( C2H5 ( CH3 ) CO ) 4-tTi ( CH3COCH2COCH3 ) t ' ( C2H5 ( CH3 ) CO ) 4.tTi ( CH3COCH2COOC2H5 ) t ' ( CH3 ( CH3 ) HCO ) 4-tZr ( CH3COCH2COCH3 ) t ' ( CH3 ( CH3 ) HCO ) 4-tZr ( CH3COCH2COOC2H5 ) . ' ( C4H9O ) 4-tZr ( CH3COCH2COCH3 ) t , ( C4H9O ) 4-tZr ( CH3COCH2COOC2H5 ) t ' ( C2H5 ( CH3 ) CO ) 4-tZr ( CH3COCH2COCH3 ) t ' ( C2H5 ( CH3 ) CO ) 4-«Zr ( CH3COCH2COOC2H5 ) t ' ( CH3 ( CH3 ) HCO ) 3-tAl ( CH3COCH2COCH3 ) t ' ( CH3 ( CH3 ) HCO ) 3., A1 ( CH3COCH2COOC2H5 ) « , ( C4H9O ) 3-tAl ( CH3COCH2COCH3 ) t ' ( C4H9O ) 3,, A1 ( CH3COCH2COOC2H5 ) t ' ( C2H5 ( CH3 ) CO ) 3-tAl ( CH3COCH2COCH3 ) t ' ( C2H5 (CH3) CO) 3-tAl (CH3COCH2COOC2H5) t and the like. The amount of the metal chelate compound is preferably from 0.001 to 10,000 parts by mass, more preferably from 0.001 to 5 parts by mass, per 100 parts by mass of the total amount of the decane compound (in terms of the fully hydrolyzed condensate). When the amount is less than 0.000 1 part by mass, the coating property of the coating film may be deteriorated when the coating amount is -15-201139563. When the amount exceeds 0 mass%, the growth of the polymer cannot be controlled, and gelation may occur. When the hydrolyzable decane compound is hydrolyzed and contracted in the presence of a metal honey compound, the total amount of the sand compound is preferably from 0 to 20 moles per 1 mole. It is preferred to use 1 to 10 moles of water. When the amount of water is less than 5%, the hydrolysis reaction cannot be sufficiently carried out, and there are problems in coating properties and storage stability. When it exceeds 20 m, the polymer precipitates or gels during hydrolysis and condensation. The situation. And the water is preferably added intermittently or continuously. (b) Acid compound The acidic compound which can be used as a catalyst can be exemplified by an organic acid or an inorganic acid, preferably an organic acid. The organic acid may, for example, be acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, heptanoic acid, caprylic acid, capric acid, capric acid, oxalic acid, maleic acid, methylmalonic acid, adipic acid, azelaic acid. , gallic acid, butyric acid, Mellitic acid, arachidonic acid, shikimic acid, ethylhexanoic acid, oleic acid, stearic acid, linoleic acid, linolenic acid (linolenic acid), salicylic acid, benzoic acid, p-aminobenzoic acid, p-toluenesulfonic acid, benzenesulfonic acid, monochloroacetic acid, dichloroacetic acid, hydrazine chloroacetic acid, trifluoroacetic acid, formic acid, malonic acid , sulfonic acid, phthalic acid, fumaric acid, citric acid, tartaric acid, maleic anhydride, fumaric acid, itaconic acid, morphic acid, mesaconic acid, citraconic acid, malic acid, malonic acid, glutaric acid Hydrolyzate of acid, hydrolyzate of maleic anhydride, hydrolyzate of phthalic anhydride, and the like. The inorganic acid may, for example, be hydrochloric acid, nitric acid, sulfuric acid, hydrofluoric acid, scale-16-201139563 acid or the like. Among them, an organic acid is preferred from the viewpoint of precipitation or gelation of the polymer in the hydrolysis condensation (hydrolysis and subsequent condensation) reaction, and among them, it is more preferably a compound having a carboxyl group. Among the compounds having a carboxyl group, acetic acid, oxalic acid, maleic acid, formic acid, malonic acid, phthalic acid, fumaric acid' itaconic acid, succinic acid, mesaconic acid, citraconic acid, malic acid, An organic acid such as malonic acid, glutaric acid or a hydrolyzate of maleic anhydride. These acidic compounds may be used singly or in combination of two or more kinds of the hydrazine acidic compound in an amount of 100 parts by mass based on the total amount of the decane compound (in terms of the fully hydrolyzed condensate), preferably 〇. 〇〇〇1~1 〇 The mass fraction is more preferably 1 to 5 parts by mass. When the amount is less than 0.1 part by mass, the coating property of the coating film may be deteriorated. When the amount is more than 10 parts by mass, the hydrolysis condensation reaction may rapidly proceed to cause gelation. When the hydrolyzable decane compound is hydrolyzed and condensed in the presence of an acidic compound, the total amount of the decane compound is preferably 0.5 to 20 moles of water per 1 mole, preferably 1 to 10 moles of water. When the amount of water is less than 0.5 mol, the hydrolysis reaction may not proceed sufficiently, and there may be problems in coatability and storage stability. When the amount exceeds 20 mol, the polymer in the hydrolysis condensation reaction may precipitate or gel. Happening. Moreover, the water is preferably added intermittently or continuously. (c) Basic compound The basic compound which can be used as a catalyst is exemplified by, for example, methanolamine, B-17-201139563 Alcoholamine, propanolamine, butanolamine, N-methylmethanolamine, N-ethylmethanol N -propylmethanolamine, N-butylmethanolamine, N-methylethanolamine, N-ethanolamine, N-propylethanolamine, N,N-dimethylmethanolamine, hydrazine, hydrazine-diethanolamine, hydrazine, hydrazine- Dipropylmethanolamine, hydrazine, hydrazine-dibutylmethanolamine, hydrazine-methylmethanolamine, hydrazine-ethyldimethanolamine, hydrazine-propyldimethylethanolamine, hydrazine-butylolamine, hydrazine-(amine group Methyl)methanolamine, Ν-(aminomethyl)ethanol hydrazine-(aminomethyl)propanolamine, Ν-(aminomethyl)butanolamine, methylmethylamine, methoxyethylamine , methoxypropylamine, methoxybutyl hydrazine, hydrazine-dimethylamine, hydrazine, hydrazine-diethylamine, hydrazine, hydrazine-dipropylamine, hydrazine, hydrazine-amine, trimethyl Amine, triethylamine, tripropylamine, tributylamine, tetramethylammonium chloride, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydrogen, tetramethylethylenediamine, Tetraethylethylenediamine, tetrapropylethyl, ammonia, sodium hydroxide 'potassium hydroxide, tetramethylammonium hydroxide, Hydrogen oxyethylammonium, tetra-n-propylammonium hydroxide, tetra-n-butylammonium hydroxide, bromomethylammonium, tetramethylammonium chloride, tetraethylammonium bromide. The amount of the basic compound is 1 mole based on the hydrolyzable group in the decane compound, preferably 0.0000 1 to 1 Torr, more preferably 0.00005 Å. [(Β) component: metal oxide particles] In the present invention, a metal oxide having a high refractive index is used to obtain a cured product of a refractive index. These microparticles are as long as 25. (The refractive index of the light of 40 〇 nm is preferably 丨55 or more, more preferably 丨6 〇, more preferably 1.70 or more of the fine particles, and is not particularly limited, for example, an amine, an ethyl methyl group Dimethylamine, oxyamine, dibutoxide, oxidative diamine, tetracycline, tetracycline, ~5, δ-18, 201139563 pin, titanium oxide, zinc oxide, oxidized giant, indium oxide, oxidation, Metal oxide particles such as tin oxide, cerium oxide, and the like, and fine particles of cerium oxide (Zr 〇 2) are preferred. The titanium oxide is not particularly limited as long as it has a structure of T i Ο 2, and is For example, an anatase type, a rutile type, a brookite type. The metal oxide particles may be used singly or in combination of two or more. (B) The metal oxide particles of the component have a good average primary particle diameter. It is 1 to 100 nm, more preferably 3 to 70 nm, and most preferably 5 to 50 nm. The number average primary particle diameter of the metal oxide particles can be measured as a number average particle diameter by, for example, transmission electron microscope observation. When the particles are not spherical, Taking the average of the long axis and the short axis as When the ratio of the particle diameter to the major axis/minor axis is 2 or more, the short axis is used as the particle diameter. When the number average primary particle diameter is within the above range, a cured product excellent in transparency can be obtained. (B) Metal oxide particles of the component Before mixing with the component (A) and the component (C), it may be in the form of a powder or a solvent-dispersed sol. For example, an organic solvent may be used as the solvent. The organic solvent is exemplified by, for example, 2-butanol, methanol, methyl b. Ketone, methyl isobutyl ketone, cyclohexanone, N-methyl-2-pyrrolidone, propylene glycol monomethyl ether, etc. The amount of the component (B) is 50 parts by mass relative to the (A) component. ~2,000 parts by mass, preferably 100 to 1,500 parts by mass, more preferably 150 to 1,000 parts by mass. When the amount exceeds 2,000 parts by mass, sufficient crack resistance cannot be obtained, and the amount is not When the amount is 50 parts by mass, the refractive index of the cured film (the cured product of the composition) is lowered, and the luminous efficiency of the light-emitting device is lowered by -19-201139563. Further, when the component (B) is a solvent-dispersed sol, The blending amount of the component (B) means the mass without solvent. Further, the component (b) is solvent dispersion. In the case of the sol, the amount of the organic solvent as the solvent of the component (B) is one of the components of the organic solvent constituting the component (C). [(C) component: organic solvent] The present invention can improve the composition by formulating an organic solvent. The organic solvent is exemplified by an ether-based organic solvent, an ester-based organic solvent, a ketone-based organic solvent, a hydrocarbon-based organic solvent, an alcohol-based organic solvent, etc. The organic solvent is preferably used as an organic solvent. The organic solvent which can uniformly disperse each component in the range of 50 to 25 (at a range of TC) at atmospheric pressure (l, 013 hPa) is exemplified by, for example, an aliphatic hydrocarbon solvent, an aromatic hydrocarbon solvent, and a single solvent. An alcohol solvent, a polyol solvent, a ketone solvent, an ether solvent, an ester solvent, a nitrogen-containing solvent, a sulfur-containing solvent, or the like. These organic solvents may be used alone or in combination of two or more. In the organic solvent, a monool solvent, a polyol solvent, and a ketone solvent are preferred from the viewpoint of further improving the storage stability of the composition. Examples of preferred compounds of such solvents are propylene glycol monomethyl ether, ethyl lactate, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, methyl amyl ketone, methanol, ethanol, 2- Butanol and the like. These preferred compounds may be used alone or in combination of two or more. In the present invention, the type of the organic solvent is preferably selected in consideration of the coating method of the composition -20-201139563. For example, in order to easily obtain a cured film having a uniform thickness (hardened product of a composition) and using a spin coating method, a glycol ether such as ethylene glycol monoethyl ether or propylene glycol monomethyl ether is preferably used as the organic solvent; Ethylene glycol alkyl ether acetate such as ethyl cellosolve acetate, propylene glycol methyl ether acetate or propylene glycol ethyl ether acetate; esters such as ethyl lactate and ethyl 2-hydroxypropionate; Diethylene glycol such as diethylene glycol monomethyl ether, diethylene glycol dimethyl ether, diethylene glycol ethyl methyl ether; methyl ethyl ketone, methyl isobutyl ketone, 2 g Ketones such as ketone, cyclohexanone and methyl amyl ketone; γ-butyrolactone and the like. The most preferred organic solvents are ethyl cellosolve acetate, propylene glycol monomethyl ether, propylene glycol methyl ether acetate, ethyl lactate, methyl ethyl ketone, methyl isobutyl ketone, methyl amyl. Ketones, etc. The compounding amount of the component (c) (organic solvent) is preferably from 50 to 20,000 parts by mass, more preferably from 100 to 1,000 parts by mass, per 100 parts by mass of the total of the components of the composition other than the organic solvent. If it is within the above preferred range, the storage stability of the composition can be improved, and the appropriate viscosity can be imparted, and a high refractive index cured film having a uniform thickness can be easily formed. The method of adding the component (c) is not particularly limited. For example, it may be added during the production of the (Α) component, or may be added during the preparation of the dispersion containing the (β) component, or may be mixed with the component (A) and (Β). Add when ingredients. [(D) component: dispersant] The curable resin composition of the present invention can use various dispersants to increase the dispersibility of the metal oxide particles. As the dispersant, for example, a bromine compound can be used. Examples of the tin compound -21 - 201139563 are alkane alumina, aluminum β-diketonate complex, and the like. Specifically, it may be an alkylene such as triethoxyaluminum, tri(n-propoxy)aluminum, tris(isopropoxy)aluminum, tri(n-butoxy)aluminum or tris(t-butoxy)aluminum. Oxygen compound, aluminum ginseng (methyl acetamidine acetate), aluminum ginseng (ethyl acetoacetate), ginseng (acetyl acetonate) aluminum 'aluminum monoethyl phthalate pyruvate bis (methyl acetate Ester), β-diketonate complex of aluminum monoethyl phthalate bis (ethyl acetate). Commercially available aluminide products can use AIPD' PADM, AMD, ASBD, ethoxylated 'ALCH' ALCH-50F, ALCH-75, ALCH-TR, ALCH-TR-20, aluminum chelate M, aluminum chelate D, aluminum chelate A (W), surface treatment agent OL-1 000, ALUGOMER, ALUGOMER 800AF, ALUGOMER 1000SF (above is manufactured by Chuanxiong Precision Chemical Co., Ltd.). A nonionic dispersant can be used as the dispersant. The dispersibility can be improved by using a nonionic dispersant. The nonionic dispersing agent used in the present invention is preferably a phosphate-based nonionic dispersing agent having a polyoxyethylene alkyl structure. The amount of the dispersing agent is not particularly limited. However, when the dispersing agent is contained, the total amount of the constituent components excluding the organic solvent is, for example, 0.1 to 20% by mass. [(E) component: dispersing aid] The curable resin composition of the present invention may further contain a dispersing aid to improve dispersibility. The dispersing aid may suitably be one or more selected from the group consisting of etidylacetone and N,N_:methylacetamidoacetamide. -22- 201139563 The amount of the dispersing aid is not particularly limited. However, when the dispersing aid is used, the total amount of the constituent components other than the organic solvent is, for example, 0.1 to 10% by mass. [(F) component: surfactant] When the curable resin composition of the present invention is applied to a substrate or the like by spin coating, it is preferable to prepare a surfactant in terms of obtaining a coating film having a uniform thickness. . The surfactant used in the present invention is exemplified by an anthrone-based surfactant, a cross-linking surfactant, and the like. Among them, a ketene-based surfactant is preferred. Examples of the anthrone-based surfactants include, for example, SH28P A (manufactured by Tor ay Dow Corning Co., Ltd., dimethyl polyoxyalkylene polyoxyalkylene copolymer), PEINTADO 19, 54 (manufactured by Toray Dow Corning Co., Ltd., Methyl polyoxyalkylene polyoxyalkylene copolymer), FM0411 (SILAPLANE, manufactured by CHISSO), SF 8428 (manufactured by Toray Dow Corning, dimethyl polyoxyalkylene polyoxyalkylene copolymer (side chain) Contains OH ) ), BYKUV3510 (manufactured by BYK, Japan, dimethyl polyoxyalkylene-polyoxyalkylene copolymer), DC5 7 (manufactured by Toray Dow Corning, dimethyl polyoxyalkylene-polyoxyalkylene) Base copolymer), DC190 (manufactured by Toray Dow Corning, dimethyl polyoxetane-polyoxyalkylene copolymer), SILAPLANE FM-4411, FM-442 1 , FM-4425, FM-771 1, FM-772 1, FM-7 72 5, FM-041 1, FM-042 1, FM-042 5, FM-DA11, FM-DA21, FM-DA26, FM071 1, FM072 1, FM-0725, TM- 070 1 , TM-070 1 T ( -23- 201139563 CHISSO company), UV3500, UV3510, UV3 5 3 0 (manufactured by BY本 BYK), BY1 6-004, SF8428 ( Toray Dow

Corning公司製造)、VPS-1001 (和光純藥製造)等。最 佳之例可歹!1 舉爲 SILAPLANE FM-771 1、FM-772 1、FM-7725、FM-0411、FM-042 1、FM-0425、FM0711、FM072 1 、FM-0725、VPS-1001等。另外,具有乙烯性不飽和基之 矽酮化合物之市售品可列舉爲例如Tego Rad2300、2200N (TEGO化學公司製造)等。 氟系界面活性劑列舉爲例如Megafac F-1 1 4、F4 1 0、 F411、F45 0、F493、F494、F443、F444、F445、F446、 F470 ' F471 、 F472SF 、 F474 、 F475 、 R30 、 F477 ' F478 、 F479、F480SF、F482、F48 3、F484、F486、F487、F172D 、F178K、F178RM、ESM-1、MCF3 5 0SF、BL20、R08、 R61、R90 ( DIC公司製造)。 (F )成分之調配比例相對於有機溶劑除外之組成物 成分總量100質量%,較好爲0~10質量%,更好爲0.1〜5質 量% ’最好爲0.5〜3質量%。該量超過10質量%時,會有組 成物之硬化物折射率降低之虞。 [(G )成分:脫水劑] 本發明之硬化性樹脂組成物亦可含有脫水劑。藉由添 加脫水劑’可促進組成物之輻射線硬化反應,同時更提高 組成物之儲存安定性。 本發明中使用之脫水劑定義爲利用化學反應將水轉換 -24- 201139563 成水以外之物質之化合物,或者藉由物理吸附或包接,將 水轉換成不影響輻射線硬化性及儲存安定性之化合物。藉 由含有脫水劑’可不損及組成物之耐光性或耐熱性,而提 高儲存安定性與輻射線硬化性之相反的二種特性。至於其 理由’認爲是利用脫水劑有效吸收自外部侵入之水,而提 高組成物之儲存安定性,另一方面於輻射線硬化反應的縮 合反應中’藉由脫水劑逐次吸收生成之水,而提高組成物 之輻射線硬化性。 _ [(Η )成分:聚合起始劑] 本發明之硬化性樹脂組成物亦可含有聚合起始劑。所 謂聚合起始劑係定義爲可藉由光照射或加熱發生使成分( Α)聚合之活性種(自由基或酸)之化合物。 此處所謂光照射意指例如紅外線、可見光、紫外線及 X射線、電子束、α射線、β射線、γ射線之電離輻射線之照 射。 可藉由光照射發生自由基之光自由基聚合起始劑列舉 爲例如苯乙酮、苯乙酮苄基縮酮、1-羥基環己基苯基酮、 2,2 -二甲氧基-2 -苯基苯乙酮、咕噸酮、蕗酮、苯甲醛、莽 、蒽醌、三苯基胺、咔唑、3-甲基苯乙酮、4-氯二苯甲酮 、4,4’-二甲氧基二苯甲酮、4,4’-二胺基二苯甲酮、米氏( Michael )酮、苯偶因丙基醚、苯偶因乙基醚、苄基二甲 基縮酮、1-(4-異丙基苯基)-2-羥基-2 -甲基丙-1-酮、2-羥基- l-{4-[4-(2-羥基-2-甲基-丙醯基)-苄基]-苯基卜2- -25- 201139563 甲基-丙-1-酮、2 -羥基-2-甲基-1-苯基丙-1-酮、噻噸酮、 二乙基噻噸酮、2 -異丙基噻噸酮、2 -氯噻噸酮、2 -甲基-1-[4-(甲硫基)苯基]_2·嗎啉基-丙-1-酮、2,4,6-三甲基苯甲 醯基二苯基氧化膦、雙(2,6-二甲氧基苯甲醯基)-2,4,4-三甲基戊基氧化膦等。其中就透明性、聚合速度、溶液安 定性之觀點而言較好使用1-羥基環己基苯基酮等。 市售品列舉爲例如Irgacure 127、184、369、3 79、 651 、 500 、 819 、 907 、 784 、 2959 、 CGI-1700 、 -1750 、-1850、CG24-61、Darocur 1116、1173 (以上爲汽巴特用 化學品公司製造);Lucirin TPO、LR8 893、LR8970 (以 上爲BASF公司製造);UBECRYL P36 ( UCB公司製造) 等。光自由基聚合起始劑可單獨使用一種,或組合兩種以 上使用。 硬化性樹脂組成物中,光自由基聚合起始劑之調配比 例以硬化性樹脂組成物之固成分總量作爲1 00質量%,較好 爲0.1~10質量%,更好爲0.2〜7質量%,又更好爲0.5〜5質量 %。上述調配比例未達〇. 1質ii %時,無法充分進行硬化, 而有無法獲得具有足夠信賴性之硬化物之情況。且,上述 調配比例超過1 〇質量。/。時,光聚合起始劑對於硬化物之長 期特性有帶來不良之影響之可能性。 另外,可利用光照射產生酸之光酸產生劑可列舉具有 以通式(4)表示之構造之鎰鹽(第一群化合物)’或具 有以通式(5)表示之構造之磺酸衍生物(第二群化合物 -26- 201139563 [R2aR3bR4〇R5dW]m + [MZm + n]m' (4) [通式(4)中’陽離子爲鑰離子’ w爲S、Se、Te、P 、As、Sb、Bi、Ο、I、Br、Cl 或-N = N,R2、R3、R4 及 R5 爲相同或不同之有機基,a、b、c及d分別爲〇〜3之整數, (a + b + c + d) -η爲W之價數等。另外,Μ爲構成鹵化物錯合 物[MXm + d之中心原子之金屬或類金屬化物’例如Β、Ρ、 As 、 Sb 、 Fe 、 Sn 、 Bi 、 Al 、 Ca 、 In 、 Ti 、 Zn 、 Sc 、 V 、 Cr 、Mn或Co。Z爲例如F、Cl、Br等鹵素原子或芳基,m爲鹵 化物錯合物離子之淨電荷,n爲M之原子價]。Made by Corning, VPS-1001 (made by Wako Pure Chemical Industries, etc.). The best example is awkward! 1 For SILAPLANE FM-771 1, FM-772 1, FM-7725, FM-0411, FM-042 1, FM-0425, FM0711, FM072 1, FM-0725, VPS-1001, etc. Further, commercially available products of an anthranone compound having an ethylenically unsaturated group may, for example, be Tego Rad 2300 or 2200 N (manufactured by TEGO Chemical Co., Ltd.). Fluorine-based surfactants are exemplified by, for example, Megafac F-1 1 4, F4 1 0, F411, F45 0, F493, F494, F443, F444, F445, F446, F470 'F471, F472SF, F474, F475, R30, F477' F478, F479, F480SF, F482, F48 3, F484, F486, F487, F172D, F178K, F178RM, ESM-1, MCF3 5 0SF, BL20, R08, R61, R90 (manufactured by DIC Corporation). The blending ratio of the component (F) is preferably from 0 to 10% by mass, more preferably from 0.1 to 5% by mass, and most preferably from 0.5 to 3% by mass, based on 100% by mass of the total of the components of the composition other than the organic solvent. When the amount exceeds 10% by mass, the refractive index of the cured product of the composition may decrease. [(G) component: dehydrating agent] The curable resin composition of the present invention may further contain a dehydrating agent. By adding a dehydrating agent', the radiation hardening reaction of the composition can be promoted while the storage stability of the composition is further improved. The dehydrating agent used in the present invention is defined as a compound which converts water into a substance other than water by using a chemical reaction, or by physical adsorption or inclusion, which converts water into radiation hardening property and storage stability. Compound. By containing a dehydrating agent, the two properties of storage stability and radiation hardenability are improved without impairing the light resistance or heat resistance of the composition. As for the reason, it is considered that the dehydrating agent effectively absorbs water invaded from the outside to improve the storage stability of the composition, and on the other hand, in the condensation reaction of the radiation hardening reaction, 'the water generated by the dehydrating agent is successively absorbed, The radiation hardenability of the composition is improved. _ [(Η) component: polymerization initiator] The curable resin composition of the present invention may further contain a polymerization initiator. The polymerization initiator is defined as a compound which can cause an active species (free radical or acid) which polymerizes a component (Α) by light irradiation or heating. The term "light irradiation" as used herein means irradiation of ionizing radiation such as infrared rays, visible light, ultraviolet rays, and X-rays, electron beams, alpha rays, beta rays, and gamma rays. The photoradical polymerization initiator which can generate radicals by light irradiation is exemplified by, for example, acetophenone, acetophenone benzyl ketal, 1-hydroxycyclohexyl phenyl ketone, 2,2-dimethoxy-2. -Phenylacetophenone, xanthone, anthrone, benzaldehyde, hydrazine, hydrazine, triphenylamine, carbazole, 3-methylacetophenone, 4-chlorobenzophenone, 4,4' -dimethoxybenzophenone, 4,4'-diaminobenzophenone, Michael's ketone, benzoin propyl ether, benzoin ethyl ether, benzyl dimethyl condensate Ketone, 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropan-1-one, 2-hydroxy-l-{4-[4-(2-hydroxy-2-methyl- Propionyl)-benzyl]-phenyl b-2--25- 201139563 methyl-propan-1-one, 2-hydroxy-2-methyl-1-phenylpropan-1-one, thioxanthone, Diethylthioxanthone, 2-isopropylthioxanthone, 2-chlorothioxanthone, 2-methyl-1-[4-(methylthio)phenyl]_2·morpholinyl-propan-1 -ketone, 2,4,6-trimethylbenzimidyldiphenylphosphine oxide, bis(2,6-dimethoxybenzylidene)-2,4,4-trimethylpentyl oxidation Phosphine and the like. Among them, 1-hydroxycyclohexyl phenyl ketone or the like is preferably used from the viewpoint of transparency, polymerization rate, and solution stability. Commercial products are listed, for example, as Irgacure 127, 184, 369, 3 79, 651, 500, 819, 907, 784, 2959, CGI-1700, -1750, -1850, CG24-61, Darocur 1116, 1173 (above Bart is manufactured by Chemical Company; Lucirin TPO, LR8 893, LR8970 (above is manufactured by BASF); UBECRYL P36 (manufactured by UCB). The photoradical polymerization initiator may be used singly or in combination of two or more. In the curable resin composition, the blending ratio of the photoradical polymerization initiator is 100% by mass, preferably 0.1 to 10% by mass, more preferably 0.2 to 7 by mass based on the total solid content of the curable resin composition. %, more preferably 0.5 to 5 mass%. When the above-mentioned blending ratio is less than 〇1. ii%, the hardening cannot be sufficiently performed, and there is a case where a cured product having sufficient reliability cannot be obtained. Moreover, the above ratio is more than 1 〇. /. At the time, the photopolymerization initiator has a possibility of adversely affecting the long-term characteristics of the cured product. In addition, the photoacid generator which generates an acid by light irradiation may, for example, be an onium salt (first group compound) having a structure represented by the formula (4) or a sulfonic acid derivative having a structure represented by the formula (5). (Second Group Compound-26-201139563 [R2aR3bR4〇R5dW]m + [MZm + n]m' (4) [In the general formula (4), 'cation is a key ion' w is S, Se, Te, P, As, Sb, Bi, Ο, I, Br, Cl or -N = N, R2, R3, R4 and R5 are the same or different organic groups, and a, b, c and d are integers of 〇~3, respectively ( a + b + c + d) - η is the valence of W, etc. Further, Μ is a metal or metalloid which constitutes a halide complex [the central atom of MXm + d] such as ruthenium, osmium, As, Sb, Fe, Sn, Bi, Al, Ca, In, Ti, Zn, Sc, V, Cr, Mn or Co. Z is a halogen atom or an aryl group such as F, Cl, Br, and m is a halide complex ion. Net charge, n is the atomic price of M].

Qs-[S( = 〇)2-R6], (5) [通式(5)中,Q爲一價或二價有機基,R6爲碳數 1〜12之一價有機基,附加字s爲〇或1,附加字t爲1或2]。 首先,第一群化合物之鑰鹽爲可藉由接受光而釋出酸 性活性物質之化合物。該等第一群化合物中,更有效之鑰 鹽爲芳香族鎗鹽,最好爲以下述通式(6)表示之二芳基 鎭鹽。 [R7-Ar 1 -I + -Ar2-R8] [Y ] (6) [通式(6 )中,R7及R8分別爲一價有機基,可相同亦 可不同,R7及R8之至少一方爲具有碳數4以上之烷基,Ar1 及Ar2分別爲芳香族基,可相同亦可不同,γ·爲一價陰離 子’係由週期表3族、5族之氟化陰離子或C104·、CF3-S03· 選出之陰離子]。 又’若例示第二群化合物之以’通式(5 )表示之磺酸 衍生物之例時’可列舉爲二颯類、二磺醯基重氮甲烷類、 -27- 201139563 二磺醯基甲烷類、磺醯基苯甲醯基甲烷類、醯亞胺磺酸酯 類、苯偶因磺酸酯類、1-氧基-2-羥基-3-丙醇之磺酸酯類 、鄰苯三酚三磺酸酯類、苄基磺酸酯類。且,以通式(5 )表示之磺酸衍生物中,更好爲醯亞胺磺酸酯類,再更好 爲醯亞胺磺酸酯中之三氟甲基磺酸酯衍生物。 針對光酸產生劑之添加量(含有比例)加以說明。光 酸產生劑之添加量並無特別限制,但以硬化性樹脂組成物 之固成分總量作爲1 00質量份,通常較好成爲1 5質量份以 內之値。該添加量超過15質量份時,會有所得硬化物之耐 候性或耐熱性下降之傾向。 [(I )成分:其他添加劑] 本發明之硬化性樹脂組成物在不損及本發明效果之範 圍內,可含有上述以外各種添加劑。該等添加劑列舉爲例 如上述成分以外之硬化性化合物、抗氧化劑、紫外線吸收 劑等。 [硬化性樹脂組成物之製造方法] 本發明之硬化性樹脂組成物可藉由混合上述成分(A )〜(C )、及視需要調配之其他任意成分而調製。通常, 可以特定比例,在(C )有機溶劑中混合成分(A )特定之 矽氧烷系聚合物與成分(B)金屬氧化物粒子及任意添加 之其他成分,藉此調製硬化性樹脂組成物。 -28- 201139563 [硬化膜] 本發明組成物之硬化物的硬化膜之折射率較好爲1 · 6 以上。該折射率在1.6以上時,發光裝置之發光效率變高 〇 硬化膜之膜厚並無特別限制,但依據發光元件之種類 可適宜設定在例如50nm〜ΙΟΟμηι之範圍內。 [用途] 本發明之硬化性樹脂組成物並無特別限制,可使用於 例如發光二極體、半導體雷射 '光二極體、光電晶體、電 致發光元件等發光元件、CCD、CMOS影像感應器等中使 用之光學構件、太陽能電池之抗反射膜等中,較好用於發 光一極體、半導體雷射、光二極體、光電晶體、電致發光 元件等發光元件中。 [發光裝置及其製造方法] 本發明之發光裝置並無特別限制,列舉爲例如發光二 極體 '半導體雷射、光二極體、光電晶體' 電致發光元件 、CCD、C-MOS、太陽能電池等。 本發明之發光裝置可藉由被覆本發明之硬化性樹脂組 成物並經硬化形成硬化膜,接著視需要以封裝材封裝而製 造。 被覆(塗佈)本發明之硬化性樹脂組成物之方法並無 特別限制,考慮發光裝置之形狀等’可自旋轉塗佈、浸漬 -29- 201139563 塗佈、含浸、噴墨等中適宜選擇。 硬化方法可使用習知方法。具體而言列舉爲在 3 0〜2 5 0°C下加熱1分鐘~24小時之方法。本發明之硬化性樹 脂組成物含有光酸產生劑時,較好在上述加熱步驟之前進 行光照射。此時之光照射較好以例如1〇〇〜5,000mJ/cm2之 能量照射紫外線。 圖1所示之發光裝置爲包含在發光元件1之表面上形成 由本發明之硬化性樹脂組成物所成之硬化膜2 ’且利用封 裝材5封裝之構造者。圖1中,符號3a、3b表示電極部,4a 、4b表示金屬細線,6表示絕緣基板。 發光裝置爲發光二極體時,可使用利用例如GaAs、 GaAlAs、A】GaInP、GaP、GaAsP、ZnSe、ZnS、GaN、 I nGaN等化合物製造之發光二極體元件。且,發光二極體 之發光色並無特別限制,列舉爲例如紅、綠、藍、黃、橙 、黃綠、白等。 實施例 以下,以實施例更具體說明本發明,但本發明並不受 該等實施例之任何限制。 [(A )成分之調製] [合成例1 ] 於附有攪拌機、回流管之燒瓶中添加縮水甘油氧基丙 基三甲氧基矽烷(47_52g)、四乙氧基矽烷(l〇.47g)、 -30- 201139563 丙二醇單甲基醚(27.49g)、及草酸(0.04g),經 ,將溶液溫度加熱至6 0 °C。接著’滴加蒸餾水(P ,滴加結束後,在80 °C下攪拌溶液2小時。接著, 進行濃縮,且將最終之固成分調整成3 0質量%,獲 )成分之丙二醇單甲基醚溶液。將其稱爲「A-Ι」。 另外,「A-2」〜「A-5」係使用東亞合成公司 [組成物之調製1] 將21.0g作爲(B)成分之氧化锆(數平均一次 15nm) 、29.7g(固成分8.9g)之「A-1」、以使有 之總重量成爲70g之丙二醇單甲基醚饋入容器中, 添加粒徑0.1mm之氧化锆珠粒(Nikkato公司製造) 利用珠粒硏磨,以15〇〇rpm攪拌10小時’使氧化鍩 子((B)成分)分散。 於所得氧化锆微粒子之分散液中添加二甲基 烷-聚氧伸烷基共聚物〇_1〇g ’獲得組成物「J-1」。Qs-[S( = 〇)2-R6], (5) [In the formula (5), Q is a monovalent or divalent organic group, and R6 is a one-valent organic group having a carbon number of 1 to 12, and an additional word s For 〇 or 1, the additional word t is 1 or 2]. First, the key salt of the first group of compounds is a compound which can release an acid active material by receiving light. Among the first group of compounds, a more effective key salt is an aromatic gun salt, and preferably a diaryl sulfonium salt represented by the following formula (6). [R7-Ar 1 -I + -Ar2-R8] [Y ] (6) [In the formula (6), R7 and R8 are each a monovalent organic group, which may be the same or different, and at least one of R7 and R8 is An alkyl group having a carbon number of 4 or more, and Ar1 and Ar2 are each an aromatic group, and may be the same or different, and γ· is a monovalent anion' is a fluorinated anion of Group 3 or Group 5 of the periodic table or C104·, CF3- S03 · Selected anion]. Further, 'when the second group of compounds is exemplified by the 'sulfonic acid derivative represented by the formula (5)', it can be exemplified as diterpenoids, disulfonyldiazomethanes, -27-201139563 disulfonyl group. Methane, sulfonyl benzhydryl methane, sulfhydrazine sulfonate, benzoin sulfonate, 1-oxy-2-hydroxy-3-propanol sulfonate, ortho-benzene Trisphenol trisulfonates, benzyl sulfonates. Further, among the sulfonic acid derivatives represented by the formula (5), more preferably an imine sulfonate, more preferably a trifluoromethanesulfonate derivative of the sulfhydrazine sulfonate. The addition amount (content ratio) of the photoacid generator will be described. The amount of the photo-acid generator to be added is not particularly limited. However, the total amount of the solid content of the curable resin composition is preferably 100 parts by mass, and usually it is preferably within 15 parts by mass. When the amount is more than 15 parts by mass, the weather resistance or heat resistance of the obtained cured product tends to decrease. [Component (I): Other Additives] The curable resin composition of the present invention may contain various additives other than the above insofar as the effects of the present invention are not impaired. These additives are exemplified by curable compounds other than the above components, antioxidants, ultraviolet absorbers, and the like. [Method for Producing Curable Resin Composition] The curable resin composition of the present invention can be prepared by mixing the above components (A) to (C) and optionally other optional components. In general, the component (A) specific azoxyalkylene polymer and the component (B) metal oxide particles and any other components added thereto may be mixed in a specific ratio in a (C) organic solvent, whereby the curable resin composition is prepared. . -28-201139563 [Cured film] The cured film of the cured product of the composition of the present invention preferably has a refractive index of preferably 1.6 or more. When the refractive index is 1.6 or more, the light-emitting efficiency of the light-emitting device is increased. 膜 The film thickness of the cured film is not particularly limited, but may be suitably set within a range of, for example, 50 nm to ΙΟΟμηι depending on the type of the light-emitting element. [Application] The curable resin composition of the present invention is not particularly limited, and can be used for, for example, a light-emitting element such as a light-emitting diode, a semiconductor laser 'photodiode, a photoelectric crystal, an electroluminescence element, a CCD, or a CMOS image sensor. Among the optical members used in the film, the antireflection film of the solar cell, and the like, it is preferably used in a light-emitting element such as a light-emitting diode, a semiconductor laser, a photodiode, a photoelectric crystal, or an electroluminescence element. [Light-emitting device and method of manufacturing the same] The light-emitting device of the present invention is not particularly limited, and is exemplified by, for example, a light-emitting diode 'semiconductor laser, a photodiode, a photo-crystal' electroluminescence element, a CCD, a C-MOS, and a solar cell. Wait. The light-emitting device of the present invention can be produced by coating a curable resin composition of the present invention and curing it to form a cured film, followed by encapsulation in a package as needed. The method of coating (coating) the curable resin composition of the present invention is not particularly limited, and may be selected from spin coating, dipping -29-201139563 coating, impregnation, ink jetting, etc., in consideration of the shape of the light-emitting device. A conventional method can be used for the hardening method. Specifically, it is a method of heating at 30 to 250 ° C for 1 minute to 24 hours. When the curable resin composition of the present invention contains a photoacid generator, it is preferred to carry out light irradiation before the above heating step. The light irradiation at this time is preferably irradiated with ultraviolet rays at an energy of, for example, 1 〇〇 to 5,000 mJ/cm 2 . The light-emitting device shown in Fig. 1 is a structure in which a cured film 2' formed of a curable resin composition of the present invention is formed on the surface of a light-emitting element 1, and is packaged by a sealing material 5. In Fig. 1, reference numerals 3a and 3b denote electrode portions, 4a and 4b denote fine metal wires, and 6 denotes an insulating substrate. When the light-emitting device is a light-emitting diode, a light-emitting diode element manufactured using a compound such as GaAs, GaAlAs, A]GaInP, GaP, GaAsP, ZnSe, ZnS, GaN, or nnGaN can be used. Further, the luminescent color of the light-emitting diode is not particularly limited, and examples thereof include red, green, blue, yellow, orange, yellow-green, and white. EXAMPLES Hereinafter, the present invention will be specifically described by examples, but the present invention is not limited by the examples. [Preparation of component (A)] [Synthesis Example 1] Glycidoxypropyltrimethoxydecane (47-52 g) and tetraethoxysilane (l?.47 g) were added to a flask equipped with a stirrer and a reflux tube. -30- 201139563 Propylene glycol monomethyl ether (27.49g) and oxalic acid (0.04g) were heated to 60 °C. Then, 'distilled water (P, after the completion of the dropwise addition, the solution was stirred at 80 ° C for 2 hours. Then, concentrated, and the final solid content was adjusted to 30% by mass, obtained) was made of propylene glycol monomethyl ether. Solution. Call it "A-Ι". In addition, "A-2" to "A-5" are 21.0 g of zirconium oxide (number average 15 nm) and 29.7 g (solid content: 8.9 g) of (B) component using East Asia Synthesis Co., Ltd. [Preparation of composition 1]. "A-1", propylene glycol monomethyl ether having a total weight of 70 g was fed into a container, and zirconia beads having a particle diameter of 0.1 mm (manufactured by Nikkato Co., Ltd.) were added, and the beads were honed to 15 The mixture was stirred at rpm for 10 hours to disperse the oxidized scorpion (component (B)). The composition "J-1" was obtained by adding a dimethyl alkane-polyoxyalkylene copolymer 〇_1〇g ' to the dispersion of the obtained zirconia fine particles.

另外,除改變表1中所示之成分組成以外’餘〗 j般,調製組成物「卜2」、「】-3」、「J-6」、「JIn addition, the composition "b2", "]-3", "J-6", "J" were prepared in addition to the composition of the components shown in Table 1.

[組成物之調製2] 將15.91g作爲(B)成分之氧化鉻微粒子(數 次粒徑:15nn〇 、1.91g 之 PLADD ED-151 (化合物 氧乙烯烷基磷酸酯)、三(第二丁氧基)鋁2.2〇g 攪拌後 [•48g ) 減壓下 得(A 製造者 粒徑: 機溶劑 於其中 3 50g - 之微粒 聚矽氧 ® 「J-1 平均一 名=聚 、乙醯 -31 - 201139563 丙酮0.85g、2-丁醇2.30g、甲基乙基酮70.00g饋入容器中 ,於其中添加粒徑0.1mm之氧化锆珠粒(Nikkato公司製造 )3 5 0 g,利用珠粒硏磨,以1 5 0 0 rp m攪拌1 0小時,使氧化 锆之微粒子((B )成分)分散。 於所得氧化銷微粒子之分散液93.18g中添加6.73§之「 A_4」、二甲基聚矽氧烷-聚氧伸烷基共聚物O.lg,獲得組 成物「J-4」。 [組成物之調製3 ] 將15.9 1 g作爲(B )成分之氧化銷微粒子(數平均一 次粒徑:15nm) 、1.91g 之 PLADD ED-151、三(第二丁氧 基)鋁2.20g、乙醯丙酮0.85g、2-丁醇2.30g'甲基乙基酮 70.00g饋入容器中,於其中添加粒徑0.1mm之氧化锆珠粒 (Nikkato公司製造)350g,利用珠粒硏磨,以1500rpm攪 拌1 0小時,使氧化锆微粒子((B )成分)分散。 於所得氧化銷微粒子之分散液93.18g中添加5.73g2「 A-5」、1 .0g之作爲光聚合起始劑之Irgacure 1 84 ( BASF公 司製造)、二甲基聚矽氧烷-聚氧伸烷基共聚物〇.lg ’獲得 組成物「】-5」。 -32- 201139563 tl® 卜 23.90 6.00 70.00 0.10 100.00 VO ηΛ 29.90 70.00 0.10 100.00 in 5.73 15.91 2.30 70.00 1.91 2.20 0.85 0.10 1.00 100.00 6.73 15.91 2.30 70.00 1.91 2.20 0.85 0.10 100.00 rn 8.90 21.00 70.00 0.10 100.00 (N 8.90 21.00 70.00 0.10 100.00 8.90 21.00 70.00 0.10 100.00 單位:質量份 1 A-l (固成分) A-2 m &lt; A-4 &lt; 氧化锆 ί 1-甲氧基-2-丙醇 2-丁醇 甲基乙基酮 PLAAD ED-151 參.(第二丁氧基)鋁 乙醯丙酮 二甲基聚矽氧烷-聚氧伸烷基共聚物u z ο σ3 合計 成分 &lt; 0Q u Q ω pH X as-xo^^IE^ls^冏 M :寸-v 0(N-ISas-xoNBilt?«i1§^55M:rn-v o(N-Hsas-xo^^陌&lt;^1s&lt;ln55K:CN-v μομ§8 Ανοα ΛνΉΟΗ(las0v-NBtfi?«i1s&lt;infflM :,v -33- 201139563 針對前述各組成物「J-l」〜「J-7」,如下述進行評價 〇 〈組成物之特性評價〉 (1 )分散粒徑 針對所得組成物中之微粒子,以堀場製作所製造之動 態光散射式粒徑分布測定裝置測定於25 °C之體積平均粒徑 。體積平均粒徑未達50nm者作爲「〇」,50nm以上未達 100nm者爲「△_! ,100nm以上者爲「X」。結果示於表2。 〈硬化膜之製作〉 .組成物「J-1」〜「J-4」、「J-6」、「J-7」 將形成用組成物分配在直徑4英吋之熔融石英或矽基 板上,經旋轉塗佈使厚度成爲約1 μηι,在1 20°C加熱1分鐘 ,及在150°C加熱60分鐘,製作硬化膜。 •組成物「J-5」 將形成用組成物分配在直徑4英吋之熔融石英或矽基 板上,經旋轉塗佈使厚度成爲約1 μηι,在1 2 0 °C加熱1分鐘 。隨後,使用接觸遮罩分析儀,在大氣中以曝光量爲 2000mJ/cm2之方式照射紫外線,接著於150°C加熱60分鐘 ,製作硬化膜。 〈硬化膜之特性評價〉 針對如上述製作之硬化膜,測定下述特性並評價。結 -34- 201139563 果示於表2。 (2 )硬化性 以手指觸摸上述獲得之硬化膜表面,沒有發黏者判定 爲「〇」,有發黏者判定爲「X」。 (3 )龜裂耐性 以目視觀察上述獲得之硬化膜外觀,沒有龜裂者判定 爲「〇」,有龜裂者判定爲「X」。 (4 )透明性[Preparation of Composition 2] 15.91 g of chromium oxide fine particles as (B) component (several particle diameter: 15 nn 〇, 1.91 g of PLADD ED-151 (compound oxyethylene alkyl phosphate), three (second butyl)氧基)Aluminum 2.2〇g After stirring [•48g) Under reduced pressure (A manufacturer particle size: machine solvent in which 3 50g - particulate polyoxo® "J-1 average one = poly, acetonitrile - 31 - 201139563 0.55 g of acetone, 2.30 g of 2-butanol, and 70.00 g of methyl ethyl ketone were fed into a container, and 305 g of zirconia beads (manufactured by Nikkato Co., Ltd.) having a particle diameter of 0.1 mm was added thereto, and beads were used. After granulating, the mixture was stirred at 150 ° rpm for 10 hours to disperse the fine particles of zirconia (component (B)). Add 7.73 § "A_4", dimethyl to 93.18 g of the obtained dispersion of oxidized pin microparticles. The polyoxyalkylene-polyoxyalkylene copolymer O.lg was obtained to obtain the composition "J-4". [Preparation of the composition 3] 15.9 1 g was used as the oxidized pin fine particles of the component (B) Particle size: 15 nm), 1.91 g of PLADD ED-151, 3 (second butoxy) aluminum 2.20 g, acetamidine acetone 0.85 g, 2-butanol 2.30 g 'methyl ethyl ketone 70.00 g Into the vessel, 350 g of zirconia beads (manufactured by Nikkato Co., Ltd.) having a particle diameter of 0.1 mm was added thereto, and the mixture was stirred by a bead granule at 1500 rpm for 10 hours to disperse the zirconia fine particles (component (B)). To 93.18 g of the dispersion of the oxidized pin microparticles, 5.73 g of "A-5" and 1.0 g of Irgacure 1 84 (manufactured by BASF Corporation) as a photopolymerization initiator, dimethylpolyoxane-polyoxyalkylene was added. The base copolymer 〇.lg 'obtains the composition "]-5". -32- 201139563 tl® 卜 23.90 6.00 70.00 0.10 100.00 VO ηΛ 29.90 70.00 0.10 100.00 in 5.73 15.91 2.30 70.00 1.91 2.20 0.85 0.10 1.00 100.00 6.73 15.91 2.30 70.00 1.91 2.20 0.85 0.10 100.00 rn 8.90 21.00 70.00 0.10 100.00 (N 8.90 21.00 70.00 0.10 100.00 8.90 21.00 70.00 0.10 100.00 Unit: parts by mass 1 Al (solid content) A-2 m &lt; A-4 &lt; Zirconia ί 1-methoxy Base-2-propanol 2-butanol methyl ethyl ketone PLAAD ED-151 gin. (second butoxy) aluminum acetoacetone dimethyl polyoxy siloxane - polyoxyalkylene copolymer Uz ο σ3 Total composition &lt; 0Q u Q ω pH X as-xo^^IE^ls^冏M : inch-v 0(N-ISas-xoNBilt?«i1§^55M:rn-v o(N-Hsas -xo^^陌&lt;^1s&lt;ln55K:CN-v μομ§8 Ανοα ΛνΉΟΗ(las0v-NBtfi?«i1s&lt;infflM :,v -33- 201139563 For each of the above-mentioned compositions "Jl"~"J-7" Evaluation was carried out as follows: (Evaluation of characteristics of the composition) (1) Dispersion particle size The volume average particle at 25 ° C was measured for the fine particles in the obtained composition by a dynamic light scattering type particle size distribution measuring apparatus manufactured by Horiba, Ltd. path. When the volume average particle diameter is less than 50 nm, it is "〇", and those of 50 nm or more and less than 100 nm are "△_!, and those of 100 nm or more are "X". The results are shown in Table 2. <Preparation of cured film> Compositions "J-1" to "J-4", "J-6", and "J-7" The composition for formation was distributed on a fused silica or tantalum substrate having a diameter of 4 inches. The thickness was set to about 1 μm by spin coating, heated at 1200 ° C for 1 minute, and heated at 150 ° C for 60 minutes to prepare a cured film. • Composition "J-5" The composition was placed on a fused silica or ruthenium substrate having a diameter of 4 inches, spin-coated to a thickness of about 1 μm, and heated at 120 ° C for 1 minute. Subsequently, ultraviolet rays were irradiated in the atmosphere at an exposure amount of 2000 mJ/cm 2 using a contact mask analyzer, followed by heating at 150 ° C for 60 minutes to prepare a cured film. <Evaluation of Characteristics of Cured Film> The following characteristics were measured and evaluated for the cured film produced as described above. Conclusion -34- 201139563 The results are shown in Table 2. (2) Sturability The surface of the cured film obtained as described above was touched with a finger, and it was judged as "〇" if it was not sticky, and "X" when it was sticky. (3) Crack resistance The appearance of the cured film obtained above was visually observed, and those without cracks were judged as "〇", and those having cracks were judged as "X". (4) Transparency

使用日本分光公司製造之分光光度計,分別測定上述 獲得之硬化膜(膜厚1μη〇之波長400nm之透過率(%)。 透過率爲90%以上時判定爲「〇」,未達90%時判定爲「X (5 )折射率 使用METORICON公司製造之稜鏡耦合器,測定在 23 °C、波長63 3 nm之折射率。折射率爲1 .6以上時判定爲「 〇」,未達1.6時判定爲「X」。 (6 )耐熱性 使用烘箱,使上述硬化膜在溫度2 00 °C進行處理60分 鐘。處理前後之硬化膜之透過率之降低(透過率減少之比 例)未達1 〇%時判定爲「〇」,超過1 〇%時判定爲「X」。 (7 )耐光性 使用朝日分光公司製造之光源系統(REX-1000),評 價上述獲得之硬化膜之耐光性。使用相同.光源進行10小時 之光照射(輻射照度1.5 W/cm2,截除波長405 nm以外之光 -35- 201139563 ,試驗溫度2 3 t:) ’以目視觀察試驗前後硬化膜之外觀’ 未變化者判定爲「〇」,稍變色者判定爲「△」’黃化者 判定爲「X」^ [表2] 實施例1 Η施例2 實施例3 實施例4 實施例5 比較例1 比較例2 組成物麵 J-1 J-2 J-3 J-4 J-5 J-6 J-7 評價 分散粒徑 〇 〇 〇 Δ Δ 〇 〇 硬化性 〇 〇 〇 〇 〇 〇 〇 龜裂耐性 〇 〇 〇 〇 〇 〇 〇 透明性 〇 〇 〇 〇 〇 〇 〇 折射率 〇 〇 〇 〇 〇 X X 耐熱性 〇 〇 〇 〇 〇 〇 〇 耐光性 〇 〇 〇 〇 〇 〇 〇 由表2可了解,本發明之組成物之硬化物具有優異之 透明性、高的折射率、高的耐熱性、以及高的耐光性,可 知可期待來自具備LED元件等發光元件之發光裝置之輻射 光之有效利用》 【圖式簡單說明】 圖1爲槪念式顯示本發明之發光裝置之一例之剖面圖 【主要元件符號說明】 1 :發光元件 -36- 201139563 2 :硬化膜 3 a :電極部 3 b :電極部 4 a :金屬細線 4 b :金屬細線 5 :封裝材 6 :絕緣基板The cured film obtained by the above-mentioned spectrophotometer manufactured by JASCO Corporation was used to measure the transmittance (%) of the film having a thickness of 1 μη〇 at a wavelength of 400 nm. When the transmittance was 90% or more, it was judged as "〇", and when it was less than 90%, It was judged that the X (5) refractive index was measured using a 稜鏡 coupler manufactured by METORICON Co., Ltd., and the refractive index at 63 ° C and a wavelength of 63 3 nm was measured. When the refractive index was 1.6 or more, it was judged as "〇", which was less than 1.6. (6) Heat resistance The oven was treated at a temperature of 200 ° C for 60 minutes using an oven. The decrease in the transmittance of the cured film before and after the treatment (the ratio of the decrease in transmittance) was less than 1 When 〇% is determined to be "〇", it is judged as "X" when it exceeds 1%. (7) Light resistance The light resistance of the cured film obtained above was evaluated using a light source system (REX-1000) manufactured by Asahi Laser Co., Ltd. The same light source was irradiated for 10 hours (irradiation illuminance 1.5 W/cm2, cut-off light other than 405 nm-35-201139563, test temperature 2 3 t:) 'visual observation of the appearance of the cured film before and after the test' unchanged It is judged as "〇", and it is judged by a slight discoloration. It is judged as "△" and the yellowing is judged as "X". [Table 2] Example 1 Example 2 Example 3 Example 4 Example 5 Comparative Example 1 Comparative Example 2 Composition surface J-1 J-2 J-3 J-4 J-5 J-6 J-7 Evaluation of dispersed particle size 〇〇〇Δ Δ 〇〇 hardenability 〇〇〇〇〇〇〇 crack resistance 〇〇〇〇〇〇〇 transparency 〇〇〇 〇〇〇〇Refractive index 〇〇〇〇〇 XX heat resistance 〇〇〇〇〇〇〇 light resistance 〇〇〇〇〇〇〇 It can be understood from Table 2 that the cured product of the composition of the present invention has excellent transparency, High refractive index, high heat resistance, and high light resistance, it is known that efficient use of radiation from a light-emitting device including a light-emitting element such as an LED element can be expected. [Simplified Schematic] FIG. 1 is a commemorative display. Sectional view of an example of a light-emitting device of the invention [Description of main components] 1 : Light-emitting element - 36 - 201139563 2 : Cured film 3 a : Electrode portion 3 b : Electrode portion 4 a : Metal thin wire 4 b : Metal thin wire 5 : Package Material 6: Insulating substrate

Claims (1)

201139563 七、申請專利範圍: 1. 一種發光裝置之製造方法,其包含下列步驟: (a )以硬化性樹脂組成物被覆發光元件之步驟,該 硬化性樹脂組成物含有: (A)由含有以下述通式(1)表示之化合物之矽烷化 合物獲得之矽氧烷系聚合物 (R1)pSi(X)4.p (1) [通式(1)中,R1爲碳數2〜12之聚合性有機基,X爲 水解性基,及P爲1~3之整數], (B )金屬氧化物粒子,及 (C)有機溶劑, r 且上述(B)成分之調配量相對於上述(A)成分1〇〇 質量份爲50〜2,000質量份,及 (c )加熱上述發光元件之步驟。 2. 如申請專利範圍第1項之發光裝置之製造方法,其 在上述(c )步驟之前包含(b )以紫外線照射上述硬化性 樹脂組成物之被覆之步驟。 3. 一種發光裝置,其包含發光元件及形成於該發光 元件之表面上之硬化性樹脂組成物之硬化物的硬化膜,該 硬化性樹脂組成物含有(A)由含有以下述通式(1)表示 之化合物之矽烷化合物獲得之矽氧烷系聚合物 (R 丨)pSi(X)4.p (1) [通式(1)中,R1爲碳數2〜12之聚合性有機基,X爲 水解性基,及P爲1〜3之整數],及 -38- 201139563 (B)金屬氧化物粒子’且上述(B)成分之調配量相 對於上述(A)成分100質量份爲5〇~2,000質量份° 4. 一種硬化性樹脂組成物’其含有 (A) 由含有以下述通式(1)表示之化合物之砂烷化 合物獲得之矽氧烷系聚合物, (R1)pSi(X)4-p ⑴ [通式(1)中,R1爲碳數之聚合性有機基’ X爲 水解性基,及P爲1~3之整數], (B) 金屬氧化物粒子,及 (C) 有機溶劑,且上述(B)成分之調配量相對於上 述(A)成分100質量份爲50〜2,000質量份。 5. 如申請專利範圍第4項之硬化性樹脂組成物,其中 上述矽烷化合物進而含有以下述通式(2)表示之化合物 j (R2)qSi(X)44 (2) [通式(2)中,R2爲碳數1〜I2之非聚合性有機基,X 爲水解性基,及q爲0〜3之整數]。 6. 如申請專利範圍第4或5項之硬化性樹脂組成物, 其中以上述通式(1)表示之化合物與以上述通式(2)表 示之化合物之合計量中之以上述通式(1)表示之化合物 之調配量之質量比例爲1〇~1〇〇質量%。 7·如申請專利範圍第4至6項中任—項之硬化性樹脂 組成物’其中上述(B)成分爲數平均一次粒徑爲 1〜100nm之微粒子。 -39- 201139563 8 _如申請專利範圍第4至7項中任一項之硬化性樹脂 組成物’其爲發光元件之被覆用。 9 · 一種硬化性樹脂組成物之製造方法,其特徵爲在 (C)有機溶劑中混合(a )由含有以下述通式(1 )表示 之化合物之矽烷化合物獲得之矽氧烷系聚合物及(B)金 屬氧化物粒子,製造如申請專利範圍第4至8項中任一項之 硬化性樹脂組成物, (R,)pSi(X)4-p (1) [通式(1)中’ R1爲碳數2〜12之聚合性有機基,X爲 水解性基,及p爲1〜3之整數]。 -40-201139563 VII. Patent application scope: 1. A method for manufacturing a light-emitting device, comprising the steps of: (a) coating a light-emitting element with a curable resin composition, wherein the curable resin composition contains: (A) containing the following The azide-based polymer (R1) obtained by the decane compound of the formula (1) is a polymer of (R1) pSi(X)4.p (1) [In the formula (1), R1 is a polymerization of carbon number 2 to 12 The organic group, X is a hydrolyzable group, and P is an integer of 1 to 3], (B) metal oxide particles, and (C) an organic solvent, r and the amount of the above component (B) is relative to the above (A) The component is used in an amount of 50 to 2,000 parts by mass, and (c) a step of heating the above-mentioned light-emitting element. 2. The method of producing a light-emitting device according to the first aspect of the invention, comprising the step (b) of irradiating the curable resin composition with ultraviolet rays before the step (c). 3. A light-emitting device comprising a light-emitting element and a cured film of a cured product of a curable resin composition formed on a surface of the light-emitting element, the curable resin composition containing (A) containing the following formula (1) a pyrithione-based polymer (R 丨) pSi(X)4.p (1) obtained by a decane compound of the compound (in the formula (1), R1 is a polymerizable organic group having a carbon number of 2 to 12, X is a hydrolyzable group, and P is an integer of 1 to 3, and -38-201139563 (B) metal oxide particles 'and the amount of the component (B) is 5 parts by mass based on 100 parts by mass of the component (A) 2,000~2,000 parts by mass. 4. A curable resin composition which contains (A) a fluorene-based polymer obtained from a squalane compound containing a compound represented by the following formula (1), (R1) pSi ( X) 4-p (1) [In the formula (1), R1 is a polymerizable organic group having a carbon number 'X is a hydrolyzable group, and P is an integer of 1 to 3', (B) metal oxide particles, and C) The organic solvent, and the amount of the component (B) is 50 to 2,000 parts by mass based on 100 parts by mass of the component (A). 5. The curable resin composition of claim 4, wherein the decane compound further contains a compound j (R2) qSi(X) 44 (2) represented by the following formula (2) [Formula (2) In the above, R2 is a non-polymerizable organic group having 1 to 12 carbon atoms, X is a hydrolyzable group, and q is an integer of 0 to 3). 6. The curable resin composition of claim 4, wherein the compound represented by the above formula (1) and the compound represented by the above formula (2) are in the above formula ( 1) The mass ratio of the compound to be expressed is 1 〇 to 1 〇〇 mass%. 7. The curable resin composition according to any one of claims 4 to 6, wherein the component (B) is a microparticle having an average number average primary particle diameter of from 1 to 100 nm. The sclerosing resin composition as described in any one of claims 4 to 7 is a coating for a light-emitting element. A method for producing a curable resin composition, characterized by mixing (a) a pyrithione-based polymer obtained from a decane compound containing a compound represented by the following formula (1) in (C) an organic solvent, and (B) a metal oxide particle, which is a curable resin composition according to any one of claims 4 to 8, (R,) pSi(X)4-p (1) [in the formula (1) 'R1 is a polymerizable organic group having 2 to 12 carbon atoms, X is a hydrolyzable group, and p is an integer of 1 to 3). -40-
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